WO2014021198A1

WO2014021198A1 - Substrate bonding apparatus and bonding method

Info

Publication number: WO2014021198A1
Application number: PCT/JP2013/070228
Authority: WO
Inventors: 寿西垣
Original assignee: 芝浦メカトロニクス株式会社
Priority date: 2012-07-30
Filing date: 2013-07-25
Publication date: 2014-02-06
Also published as: TW201408488A

Abstract

The aim of the present invention lies in providing pressure for bonding substrates using a very simple and inexpensive configuration. The substrate forming apparatus has a chamber (1) for housing substrates (S1, S2) to be bonded, a first supporting unit (2) for supporting the substrate (S1) inside the chamber (1), and a second supporting unit (3) for supporting the second substrate (S2) inside the chamber (1) so as to face the substrate (S1). The chamber (1) has a first space (11b) opposite the side on which the substrate (S1) is supported by the first supporting unit (2), and a second space (12b) in which the substrate (S1) and substrate (S2) face each other. The first supporting unit (2) separates the first space (11b) and the second space (12b) and holds the first substrate (S1), and an expandable portion (21) expands to increase the pressure inside the first space (11b) relative to the second space (12b), and press the substrate (S1) against the substrate (S2).

Description

Substrate pasting device and pasting method

The present invention relates to a substrate bonding apparatus and a bonding method for bonding a pair of substrates.

There are two methods for bonding a pair of substrates through an adhesive, a method of bonding in the air and a method of bonding in a vacuum.

When bonding in the air, air bubbles may remain on the bonding surface depending on the adhesive application pattern, bonding pressure, pressure application method, and the like. On the other hand, the bonding in a vacuum can be performed relatively easily with few bubbles since there is no gas in the surroundings in a sufficiently exhausted environment (see Patent Document 1).

Japanese Patent Laid-Open No. 11-53119

When a touch panel, a cover panel, or the like is laminated on an electro-optic element as in Patent Document 1, a pair of substrates to be bonded to each other are attached to each other so that there is no air bubble or a space remaining without being in close contact. It is necessary to energize. At this time, a pressing mechanism that fixes and holds one substrate and presses the other substrate so as to bias the substrate may be used.

In that case, it is necessary to provide the pressing mechanism in a vacuum bonding chamber in an airtight manner, which complicates and enlarges the apparatus and increases the manufacturing cost.

In recent years, it has also been proposed that gesture operations using a touch panel can be performed on the side surface. Therefore, it is necessary to configure the substrate body to be laminated so that both ends are curved or bent and are raised to form a concave shape and covered from the surface to the side surface.

As an example of manufacturing a concave laminated substrate body, first, both ends of a glass or resin substrate serving as a cover panel are curved or bent to form a concave shape. Next, a lamination process is performed so that the flexible touch panel sheet adheres along the concave surface of the cover panel. As a method of the lamination process, for example, the mounting surface of the substrate bonding apparatus is a convex surface that fits into the concave surface of the cover panel, and the touch panel sheet that has been previously coated with an adhesive is bent and held along the convex surface. . And it pushes into the concave surface of a cover panel, and joins both.

However, in the case of such a manufacturing method, when the touch panel sheet is pushed into the concave surface of the cover panel, the convex shape to be fitted does not match due to the variation in the shape of the curved or bent rising portions at both ends of the cover panel. If the panel and the touch panel sheet are not properly joined or a gap is formed, there is a possibility of causing a product defect.

In addition, when the shape of the rising part that is curved or bent differs depending on the product, it is necessary to prepare a convex-shaped member having a fitting surface that matches the shape, and the preparation and replacement work of the member occurs. There is also a possibility that productivity will be reduced.

The present invention has been proposed in order to solve the above-described problems of the prior art, and its main purpose is to provide a very simple and inexpensive configuration and to apply pressure for bonding to the substrates. It is providing the board | substrate bonding apparatus and the bonding method which can be given.

Another object of the present invention is to provide a substrate laminating apparatus and a laminating method capable of accurately laminating through an adhesive even when laminating substrates in a concave shape.

The present invention provides a chamber for accommodating a first substrate and a second substrate to be bonded together, a first support portion for supporting the first substrate in the chamber, and the first in the chamber. A second support portion that supports the second substrate at a position facing the substrate, and the chamber is opposite to the support side of the first substrate in the first support portion. Side first space and a second space in which the first substrate and the second substrate face each other, and the first support portion includes the first space and the second space. The first substrate is held by the first space, and the first substrate is stretched by being at a pressure higher than that of the second space, so that the first substrate becomes the second substrate. It has a stretchable part to be pressed.

The expansion / contraction part may be an elastic body whose adsorption force changes by energization, or the first support part may have an electrode part for energizing the expansion / contraction part.

The chamber has the first space, the first chamber in which the first support portion is provided, and the second chamber in which the second space is provided and the second support portion is provided. The expansion / contraction part may be sandwiched between portions closed by the first chamber and the second chamber.

The expansion / contraction part may be bag-shaped.

A first ventilation path for supplying and discharging gas to and from the first space; and a second ventilation path for supplying and discharging gas to and from the second space, the first ventilation path and the second At least one of the ventilation paths may be connected to a pressure adjusting unit that switches expansion and contraction of the expansion and contraction unit by adjusting the pressure of the first space or the second space.

The pressure adjusting unit may include a vacuum source.

The pressure adjusting unit may include a pressure source.

The image forming apparatus may include a temporary curing processing unit that temporarily cures the adhesive attached to at least one of the first substrate and the second substrate.

The first substrate is a concave substrate having a concave surface, the second substrate is a flexible thin substrate, and the bag-like stretchable portion is inflated following the concave surface of the concave substrate. In the process, before the stretchable part follows the concave surface, the stretchable part enters the concave space defined by the concave surface of the concave substrate together with the thin substrate, and in the process of further expanding the stretchable part, The thin substrate may be pushed and expanded along the concave surface by the stretchable portion.

The expansion / contraction portion may further include a center block, and the portions located on both sides of the center block may swell up along the concave surface portion of the side portion of the concave substrate.

The expansion / contraction portion further includes abutting means that abuts against the center of the first substrate, and spreads toward the first substrate after the abutting means abuts against the center of the first substrate. You may make it extend like this.

In addition, the bonding method by the above board | substrate bonding apparatuses is also 1 aspect of this invention.

According to the present invention, the first substrate is held, and the first space is expanded by being at a higher pressure than the second space, and an expansion / contraction portion is provided to press the first substrate against the second substrate. Thus, the substrate can be held with a very simple and inexpensive configuration, and a pressure for bonding can be applied to the substrates.

In addition, according to the present invention, even if there is an individual difference in the curved or bent shape on the side of the concave substrate, the expansion and contraction part swells in accordance with the concave surface so as to absorb the variation caused by the individual difference. There are no gaps or wrinkles in bonding with the thin substrate. Therefore, the thin substrate can be bonded to the concave substrate with high accuracy. Further, even if the curved or bent shape of the side portion is different or the curvature rate or the bent angle is different due to the difference in the type of the concave substrate, the stretchable portion swells in accordance with the various concave substrates. It is not necessary to prepare a convex-shaped member having a fitting surface matched to each concave substrate. For this reason, the labor of member preparation and replacement work can be saved, and the productivity is improved.

Sectional drawing which shows the board | substrate bonding apparatus of 1st Embodiment. Sectional drawing which shows the temporary hardening process part of 1st Embodiment. Sectional drawing which shows the time of standby of the 1st chamber of 1st Embodiment Sectional drawing which shows the time of the fall of the 1st chamber of 1st Embodiment Sectional drawing which shows the time of evacuation of 1st Embodiment Sectional drawing which shows the time of vent of the 1st space of 1st Embodiment Sectional drawing which shows the time of atmospheric release of 1st Embodiment Sectional drawing which shows the time of the raise of the 1st chamber of 1st Embodiment Sectional drawing which shows the time of standby of the 1st chamber of 2nd Embodiment Sectional drawing which shows the time of vent of the 1st space of 2nd Embodiment Schematic diagram showing various substrates after bonding Sectional drawing which shows the waiting time of the 1st chamber of 3rd Embodiment Sectional drawing which shows the time of vent of the 1st space of 3rd Embodiment Sectional drawing which shows the modification of 3rd Embodiment The block diagram of the board | substrate bonding apparatus which concerns on 4th Embodiment. The block diagram of the press mechanism with which the board | substrate bonding apparatus which concerns on 4th Embodiment is provided. The block diagram of the press mechanism with which the board | substrate bonding apparatus which concerns on 5th Embodiment is provided. The block diagram of the press mechanism with which the board | substrate bonding apparatus which concerns on 6th Embodiment is provided.

Embodiments of the present invention (hereinafter referred to as embodiments) will be specifically described with reference to the drawings.

[First Embodiment]
[Constitution]
As shown in FIG. 1, the present embodiment is a substrate bonding apparatus M that bonds a pair of substrates S <b> 1 and S <b> 2 via an adhesive R. For example, the substrate S1 is a touch panel of the display device, and the substrate S2 is a cover panel of the display device.

The substrate bonding apparatus M includes a chamber 1 and a first support part 2 and a second support part 3 provided therein. The chamber 1 is a container that can be evacuated. The chamber 1 has a first chamber 11 and a second chamber 12.

The first chamber 11 is a component that is disposed opposite to the second chamber 12 and moves toward and away from the second chamber 12 by moving by a driving mechanism (not shown). The movement of the first chamber 11 by this drive mechanism may be configured not only to move in the direction in which the first chamber 11 is in contact with and away from the second chamber 12 but also to perform operations such as horizontal movement and reversal.

In the first chamber 11, there is provided a first space 11b through which gas is supplied and discharged via the first ventilation path 11a. The pressure adjustment part 11c is connected to the 1st ventilation path 11a. The pressure adjusting unit 11c includes, for example, a vacuum source (such as a vacuum pump) connected to the first ventilation path 11a via a pipe. Furthermore, you may provide switching parts, such as a valve which switches a vacuum state and a vent. In the center of the first space 11b in the first chamber 11, a protrusion having a horizontal surface protruding toward the second chamber 12 is provided. The substrate is held by the first support portion 2 described below at the position where the protruding portion is provided.

In the first chamber 11, the first support portion 2 is provided at a position facing the second chamber 12. The first support unit 2 is a component that supports the substrate S1 on the first chamber 11 side. The first support part 2 includes an extendable part 21 and an electrode part 22.

The expansion / contraction part 21 is a film made of an elastic body that seals the side facing the second chamber 12 in the first space 11b. An adhesive force for holding the substrate S1 is provided at a position corresponding to the protruding portion in the elastic body. The adhesive part having the adhesive force may be the entire stretchable part 21 or only a part for holding a part of the substrate. For this adhesive part, for example, an adhesive material such as a silicon gel sheet or an ER (electrorheological fluid) fluid (including ER gel) whose adsorption force changes by energization can be used. Furthermore, the adhesive portion may not be provided in the stretchable portion 21, and the substrate S1 may be held by electrostatic force with the stretchable portion 21 sandwiched by an electrostatic chuck constituted by an electrode portion 22 described below. In addition, as the expansion-contraction part 21, it can also be set as synthetic rubber, such as natural rubber, a polybutadiene type | system | group, a nitrile type | system | group, a chloroprene type | system | group, a fiber, such as a polyurethane. Moreover, the fluid introduced for expansion / contraction of the expansion / contraction part 21 is not limited to air, but may be a single gas such as nitrogen or oxygen, a mixed gas, or a liquid.

The electrode portion 22 is a sheet-like energizing electrode disposed between the horizontal surface of the central projecting portion of the first space 11 b in the first chamber 11 and the stretchable portion 21. Although not shown, the electrode portion 22 is connected to a power source and a switch via a connection line. The electrode portion 22 can be an electrostatic chuck as described above, or can be a power source for ER fluid. Hereinafter, this embodiment will be described in the case where the ER fluid is used to hold the substrate S1.

The second chamber 12 is provided with a second space 12b through which gas is supplied and discharged via the second ventilation path 12a. A pressure adjustment unit 12c is connected to the second ventilation path 12a. The pressure adjusting unit 12c includes, for example, a vacuum source (such as a vacuum pump) connected to the second ventilation path 12a via a pipe. Furthermore, you may provide switching parts, such as a valve which switches a vacuum state and a vent.

The bottom surface of the second space 12b in the second chamber 12 is the second support portion 3. The second support portion 3 is a component that supports the substrate S2 on the second chamber 12 side. In addition, as the 2nd support part 3, it is good also as a slip prevention of board | substrate S2 by providing the sheet-like elastic body etc. which have adsorption | suction power between the bottom face of 2nd space 12b, and board | substrate S2.

The second space 12b is sealed on the side facing the first chamber 11 when the first chamber 11 descends toward the second chamber 12 and contacts with the stretchable part 21 interposed therebetween. Note that the first chamber 11 and the second chamber 12 are not necessarily in contact with each other with the expansion / contraction part 21 interposed therebetween. Further, the stretchable part 21 does not have to be sandwiched between the first chamber 11 and the second chamber 12 and may be in a bag shape.

Furthermore, as shown in FIG. 2, the present embodiment includes a temporary curing processing unit 4 that temporarily cures the adhesive R applied to the substrate S1 before bonding. For example, when the adhesive R is an ultraviolet curable resin, the temporary curing processing unit 4 includes a light source that emits UV (ultraviolet) light.

[Action]
The bonding process according to the present embodiment as described above will be described. First, the electrode part 22 connected to the power source by switching the switch energizes the adhesive part provided in the stretchable part 21. As a result, the adhesive portion has an adsorption force and holds the substrate S1. Thereby, the 1st support part 2 supports board | substrate S1.

Note that an adhesive R is applied to the substrate S1. And the temporary hardening process part 4 performs a temporary hardening process with respect to the adhesive agent R of board | substrate S1. This temporary curing treatment may be before or after support by the first support portion 2. For example, when the adhesive R is an ultraviolet curable resin, as illustrated in FIG. 2, the light source of the temporary curing processing unit 4 irradiates the UV light to temporarily cure the adhesive R. Temporary curing refers to a cured state that is not completely achieved. This can be realized by irradiation with weak intensity or irradiation using oxygen inhibition in the atmosphere.

As described above, the first chamber 11 supporting the substrate S1 is moved to the second chamber 12 side by the drive mechanism as shown in FIG. Then, as shown in FIG. 4, the stretchable part 21 of the first chamber 11 is in close contact with the edge of the second chamber 12. Thereby, the expansion / contraction part 21 divides the first space 11 b of the first chamber 11 and the second space 12 b of the second chamber 12.

In this state, as shown in FIG. 5, the vacuum source connected to the first ventilation path 11a and the vacuum source connected to the second ventilation path 12a are operated, and the first space 11b and the second The space 12b is evacuated. In the present embodiment, both the first space 11b and the second space 12b are evacuated, but as shown in a fourth embodiment to be described later, one space, for example, the second space. Only 12b may be evacuated.

After evacuating until there is sufficiently less gas that may become bubbles on the bonding surface, the first space 11b is vented by the switching unit connected to the first ventilation path 11a. Then, as shown in FIG. 6, since the atmospheric pressure in the first space 11b is higher than that in the second space 12b, the stretchable part 21 expands to the substrate S2 side, and the adhesive R on the substrate S1 adheres. The finished surface is pressed against the substrate S2. That is, the stretchable part 21 constitutes a pressing mechanism that presses the substrate S1.

At this time, the stretchable part 21 is separated from the electrode part 22, but there is no problem in holding the substrate S1 because the stretchable part 21 is instantly stretched and a certain amount of adsorption force remains in the adhesive part.

Thereafter, the second space 12b is vented by the switching unit connected to the second ventilation path 12a. Then, since the second space 12b returns to the same atmospheric pressure as the first space 11b, the stretchable portion 21 is separated from the substrate S1, as shown in FIG. At this time, since the expansion / contraction part 21 is separated from the electrode part 22 and the attractive force of the expansion / contraction part 21 is reduced, it is easy to peel off from the substrate S1.

Further, as shown in FIG. 8, the first chamber 11 is raised to release the upper space of the second chamber 12. Then, the transfer device or the like transfers the bonded substrates S1 and S2 in the second chamber 12 to the next process. For example, the substrate S1 and the substrate S2 are transported to a main curing unit that irradiates ultraviolet rays in a vacuum.

[effect]
According to the present embodiment as described above, the stretchable portion 21 that holds the substrate S1 by suction is urged by atmospheric pressure, so that the substrate S1 is uniformly pressed against the substrate S2 in a vacuum without bubbles. be able to. As described above, the member that holds the substrate S1 and the member that press-bonds the substrate S1 to the substrate S2 are a common stretchable portion 21, and the stretchable portion 21 is merely an elastic film. For this reason, an apparatus can be comprised very simply and cheaply.

Further, since the first support portion 2 is provided in the first chamber 11 and moves together with the first chamber 11, a special drive mechanism is used to move the first support portion 2 that holds the substrate S1. It is not necessary to separately provide.

Further, by making the expansion / contraction portion 21 an elastic body whose adsorption force changes by energization, it is possible to give the adsorption force to the substrate S1 even in a vacuum, and to reliably release the substrate S1 after bonding. it can.

Further, by temporarily curing the adhesive R before bonding, it is possible to prevent the adhesive R from falling or unevenness from occurring. Furthermore, since the substrate S1 is pressed against the substrate S2 by utilizing the pressure difference between the vacuum and the atmospheric pressure, a strong pressure can be obtained in a short time. In addition, the first chamber 11 and the second chamber 12 are evacuated together with the second chamber 12 before being pressed using the pressure difference between the vacuum and the atmospheric pressure, so that bubbles are generated when the substrate S1 and the substrate S2 are bonded together. It is possible to prevent the substrate S1 and the substrate S2 from coming into contact before the gas to be exhausted sufficiently. However, even if such simultaneous evacuation is not performed, the remaining gas disappears because the substrates S1 and S2 that are in close contact with each other are continuously pressed at atmospheric pressure. Therefore, simultaneous exhaustion is not necessarily performed, and in this case, the entire bonding time can be shortened.

[Second Embodiment]
[Constitution]
The present embodiment is basically the same as the first embodiment described above. However, in the present embodiment, as shown in FIG. 9, the positional relationship between the first chamber 11 and the second chamber 12 is reversed. The second support part 3 in the second chamber 12 is provided with a holding part 3a for holding the substrate S2. For example, an electrostatic chuck is used as the holding portion 3a. Although not shown, the electrostatic chuck is connected to a power source and a switch via a connection line.

[Action]
The bonding process of the present embodiment as described above is basically the same as that of the first embodiment. In particular, in the present embodiment, the substrate S2 is held by the holding portion 3a of the second support portion 3. For example, the substrate S2 is adsorbed by an electrostatic chuck to which a voltage is applied.

Then, as shown in FIG. 10, the first space 11b is vented from the state where the first space 11b and the second space 12b are evacuated. Thereby, the expansion / contraction part 21 expand | extends and the surface by which the adhesive agent R of the board | substrate S1 was apply | coated is crimped | bonded to the board | substrate S2.

Thereafter, by venting the second space 12b, there is no pressure difference between the second space 12b and the first space 11b, and the stretchable part 21 is separated from the substrate S1. The substrate S1 is supported by the second support unit 3 together with the substrate S2 held by the holding unit 3a.

[effect]
According to the present embodiment, even when the substrate S1 is pressed and bonded from below the substrate S2, the same effect as the first embodiment can be obtained. Since the substrate S1 is held by the expansion / contraction part 21, even when the substrate S1 is pushed upward, misalignment or the like can be prevented.

Note that even when the substrate S3 having a curved portion or a bent portion is used instead of the substrate S2, the substrate S1 can be uniformly bonded to the entire inner surface of the substrate S3 as in the second embodiment. .

[Third to Sixth Embodiments]
Next, third to sixth embodiments of the substrate bonding apparatus according to the present invention will be described in detail with reference to the drawings.

(substrate)
The laminated substrate bonded together by the substrate bonding apparatus of this invention is demonstrated previously. FIG. 11 is a schematic diagram showing various substrates after bonding. The board | substrate bonding apparatus 100 of this invention bonds the thin board | substrate 121 along the concave surface 120a of the concave board | substrate 120 using the adhesive agent R. FIG.

The thin substrate 121 is a touch panel, a decorative film, or various films such as an organic EL display and a liquid crystal display, and the concave substrate 120 is a protective panel made of glass or acrylic for protecting the thin substrate 121. For example, for the purpose of protecting the thin substrate 121, the entire surface of the thin substrate 121 is adhered to the concave substrate 120 with the adhesive R so that the entire surface of the thin substrate 121 is covered with the concave substrate 120.

The thin substrate 121 is a flexible thin substrate. In order to affix to the concave surface 120a of the concave substrate 120, it is sufficient if there is sufficient flexibility to allow bending deformation along the concave surface 120a.

Further, the concave substrate 120 is a substrate having a concave surface 120a formed with at least the side part 120b rising from a curved part or a bent part. That is, the concave substrate 120 has a concave surface 120a formed on the substrate surface by bending or bending. The central region other than the side part 120b of the concave substrate 120 may be flat or may be continuously curved with the side part 120b. Further, the concave substrate 120 may be warped as a whole, and the back surface may be a shape unrelated to the concave surface 120a, for example, a flat surface. Moreover, a pair of opposing side parts 120b may stand up, or two sets of side parts 120b that face each other so as to surround the center from four sides may stand up.

Specifically, the concave substrate 120 has a substantially tile shape as shown in FIG. 11 (a), and has a substantially U-shape in which the side portion 120b rises at a right angle, as shown in FIG. 11 (b). In addition, as shown in (c), the side portion 120b includes a substantially U-shape that rises from the curved portion.

Hereinafter, when the side part 120b is simply referred to, the side part 120b is raised to form the concave surface 120a. A space surrounded by a plane including both ends of the side portion 120b and the concave surface 120a is referred to as a concave space 120c defined by the concave surface 120a.

The adhesive R is not particularly limited as long as it accepts and cures external energy. For example, a thermosetting resin, a photocurable resin, a radiation curable resin, and other various resins that are cured by receiving electromagnetic waves. Or a resin that hardens upon drying.

(Third embodiment)
(Constitution)
This embodiment is basically the same configuration as the first embodiment. However, in the present embodiment, as shown in FIG. 12, the substrate to be bonded has a concave portion 120a in which the side portion 120b has a curved portion or a bent portion and the concave surface 120a is formed as described above. It is. The concave substrate 120 is supported by the second support portion 3 of the second chamber 12. The substrate bonded to the concave substrate 120 is the thin substrate 121 described above.

(Function)
The bonding process of the present embodiment as described above is basically the same as that of the first embodiment. In particular, in the present embodiment, as shown in FIG. 13, when the stretchable part 21 presses the substrate S1 onto the concave substrate 120, the stretchable part has a shape that fits the curved or bent part of the side edge of the concave substrate 120. 21 is deformed. For this reason, the thin substrate 121 is bonded along the curved portion or the bent portion of the side edge portion from the flat surface of the inner bottom portion of the concave substrate 120.

(effect)
According to the present embodiment, the thin substrate 121 is pressed against the concave substrate 120 by the expansion / contraction part 21 that is not a mere flat plate-shaped pressing member but an elastic film, so that the expansion / contraction part 21 depends on the object to be bonded. Deform. For this reason, even if it is the concave substrate 120 in which a curved part or a bending part exists, the thin board | substrate 121 can be uniformly bonded together to the whole inner surface.

(Modification)
As a modification of the above-described embodiment, as shown in FIG. 14, it is also possible to adopt a configuration in which a fluid introduction hole 104b is formed in the center immediately above the telescopic portion 21 as in the embodiment described later. . The fluid introduction hole 104b is a hole that penetrates the first chamber 11 and the electrode portion 22 and communicates with the first space 11b. A pipe 104c communicating with the atmosphere is connected to the fluid introduction hole 104b, and an open / close valve 104d is provided in the pipe 104c. The fluid introduction hole 104b and the tube 104c correspond to the first ventilation path 11a. By comprising in this way, air | atmosphere can be introduce | transduced more directly so that the expansion-contraction part 21 may swell to the concave substrate 120 side. Further, by introducing the atmosphere to the center of the stretchable part 21, it is possible to apply pressure so as to push the thin substrate 121 from the center to the side part 120b. For this reason, each part of the thin substrate 121 adheres to an incorrect portion of the concave substrate 120, and the thin substrate 121 is wrinkled, or there is a non-adhered portion between the thin substrate 121 and the concave substrate 120. It can suppress more reliably that it generate | occur | produces, and can manufacture a bonding thing with high quality.

(Fourth embodiment)
The board | substrate bonding apparatus 100 which concerns on this embodiment is demonstrated with reference to drawings. FIG. 15 is a configuration diagram of the substrate bonding apparatus 100 according to the present embodiment. FIG. 16 is a configuration diagram of a pressing mechanism 104 (pressing unit) included in the substrate bonding apparatus 100 according to the present embodiment.

(Constitution)
As shown in FIG. 15, in the substrate bonding apparatus 100, the holding unit 103 and the pressing mechanism 104 (pressing unit) are opposed to each other in the vacuum chamber 109 by a certain distance. The outside of the pressing mechanism 104 inside the vacuum chamber 109 corresponds to the second space 12b described above, and a second ventilation path 12a connected to a vacuum source is provided. The holding unit 103 holds the concave substrate 120 by an electrostatic chuck, a mechanical chuck, a vacuum chuck, an adhesive chuck, or other various chuck mechanisms. The pressing mechanism 104 pushes and spreads the thin substrate 121 along the concave surface 120a while bending and deforming the thin substrate 121 following the concave surface 120a of the concave substrate 120.

As shown in FIG. 16, the pressing mechanism 104 is a bag body 104 a as the above-described stretchable part 21. The bag body 104a is, for example, larger than the concave space 120c, but has a shape following the concave space 120c. However, there is no particular limitation on the shape of the bag body 104a as long as it can be expanded larger than the concave space 120c at the maximum. The inside of the bag body 104a corresponds to the first space 11b. Further, it is preferable that the upper portion of the bag body 104 a has an adhesive force for holding the thin substrate 121. For example, the adhesive portion having the adhesive force may be formed by forming a sheet of an adhesive material as a part of the bag body 104a, such as the ER fluid, or by attaching the sheet to the surface of the bag body 104a. Good.

A fluid introduction hole 104b is formed at the bottom of the bag body 104a. The fluid introduction hole 104b is connected to a pipe 104c that communicates with the atmosphere, and an open / close valve 104d is provided in the pipe 104c. The fluid introduction hole 104b and the pipe 104c correspond to the first ventilation path 11a. The bag body 104a reaches the concave surface 120a of the concave substrate 120 in the process of swelling, and further elastically deforms following the concave surface 120a while applying pressure to the concave surface 120a by continuing to expand.

The bag 104a having elastic force is made of, for example, natural rubber, polybutadiene-based, nitrile-based, synthetic rubber such as chloroprene-based, or fibers such as polyurethane. The fluid introduced into the bag body 104a is not limited to air, but may be a single gas such as nitrogen or oxygen, a mixed gas, or a liquid.

Due to the reduction, the bag body 104a entrains the thin substrate 121 without coming into contact with the concave surface 120a and enters the concave space 120c, and the expansion causes the thin substrate 121 to follow the concave surface 120a from the substrate center toward the outside. The thin substrate 121 is brought into close contact with the concave substrate 120 via the adhesive R by bending.

(Function)
In this board | substrate bonding apparatus 100, as shown to (a) of FIG. 16, the bag body 104a is initially inflated to such an extent that it does not reach the concave board | substrate 120. FIG. Due to this swelling, a surface that is flat enough to mount the thin substrate 121 is present on the surface facing the concave substrate 120. This flat surface may be the adhesive portion as described above. The thin substrate 121 is placed on this flat surface. When this surface is an adhesive portion, the thin substrate 121 is held by the adhesive force. On the other hand, the concave substrate 120 is held by the holding portion 103 with the concave surface 120a facing the bag body 104a.

At this time, the concave substrate 120 and the thin substrate 121 face each other in the vacuum chamber 109. The concave substrate 120 is installed so that the concave surface 120 a faces the thin substrate 121. The adhesive R is applied to the concave substrate 120, the thin substrate 121, or both opposing surfaces.

When the on-off valve 104d is opened with the concave substrate 120 and the thin substrate 121 installed, as shown in FIG. 16B, the inside of the bag body 104a and the atmosphere pass through the tube 104c and the fluid introduction hole 104b. Communicate. Air flows into the bag 104a into the bag 104a communicating with the atmosphere. The inside of the vacuum chamber 109 is evacuated through the second ventilation path 12a. For this reason, the bag body 104 a starts to expand toward the concave surface 120 a of the concave substrate 120. At this time, the thin substrate 121 positioned between the bag body 104a and the concave substrate 120 is pushed up toward the concave substrate 120 as the bag body 104a expands.

Then, the thin substrate 121 is pushed into the concave space 120c defined by the concave surface 120a of the concave substrate 120 together with the swelling of the bag body 104a. In the process of expansion in which the bag body 104a reaches the central region of the concave substrate 120, the inflow amount of air is adjusted so that the overall shape and size of the bag body 104a is smaller than the concave space 120c of the concave substrate 120. Keep it. By this adjustment, the thin substrate 121 and the side portion 120b of the concave substrate 120 are not in surface contact. Since there is no surface contact, the thin substrate 121 is not pushed in while grinding the side portion 120b of the concave substrate 120 with the surface.

When the inflow of air into the bag body 104a is continued, the bag body 104a expands following the concave surface 120a of the concave substrate 120 while being elastically deformed, as shown in FIG. At this time, the thin substrate 121 is pressed against the concave surface 120a of the concave substrate 120 from the central region toward the end along with the swelling following the concave surface 120a of the bag body 104a. Since the bag body 104a is elastically deformed, the bag body 104a is deformed into an outer shape that matches the surface shape of the side portion 120b on which the concave substrate 120 rises. Therefore, the thin substrate 121 and the concave substrate 120 are in close contact with each other without any gap. In addition, since the contact is made in order from the center toward the end, there is no space between the concave substrate 120 and the thin substrate 121.

(effect)
As described above, the pressing mechanism 104 included in the substrate bonding apparatus 100 according to the present embodiment includes the bag body 104a that expands following the concave surface 120a of the concave substrate 120 due to the inflow of fluid. In the process of inflating the bag body 104a, before the bag body 104a follows the concave surface 120a, the bag body 104a is inserted into the concave surface 120c defined by the concave surface 120a of the concave substrate 120 together with the thin substrate 121. Further, in the process of inflating the bag body 104a, the thin substrate 121 is pushed and expanded by the bag body 104a following the concave surface 120a.

According to this pressing mechanism 104, since the bag body 104a swells in accordance with the shape of the concave surface 120a, even if there is an individual difference in the side part 120b of the concave substrate 120 in the curved or bent shape, the bag body 104a has its individual difference. Can be absorbed, and there is no gap or wrinkle in the bonding with the thin substrate 121. Therefore, the thin substrate can be bonded to the concave substrate with high accuracy.

Further, even if the curved or bent shape of the side portion 120b is different due to the difference in the type of the concave substrate 120, or the curvature rate and the bending angle are different, the bag body 104a is attached to the various concave substrates 120. Since it swells together, it is not necessary to prepare a convex member having a fitting surface matched to each concave substrate 120. For this reason, the labor of member preparation and replacement work can be saved, and the productivity is improved.

Furthermore, when the thin substrate 121 is pushed into the concave space 120c of the concave substrate 120, the thin substrate 121 and the side portion 120b of the concave substrate 120 do not come into surface contact. For this reason, erroneous portions are bonded to each other, and generation of wrinkles of the thin substrate 121 and generation of a non-contact portion between the thin substrate 121 and the concave substrate 120 can be suppressed. Further, since the thin substrate 121 is not pushed in while the side portion 120b of the concave substrate 120 is being polished by the surface, the outflow of the adhesive R is prevented, the adhesive force is decreased, the design property is decreased, and the adhesive is bonded. A short circuit or the like via the agent R can be prevented.

Further, since the bag body 104a swells along the concave surface 120a of the concave substrate 120, a non-contact portion is not generated, and the thin substrate 121 can be adhered to the concave substrate 120 in the entire region. Therefore, even when the thin substrate 121 is bonded to the concave substrate 120, a high-quality bonded product can be manufactured.

(Fifth embodiment)
FIG. 17 is a configuration diagram of the pressing mechanism 104 included in the substrate bonding apparatus 100 according to the present embodiment. The same components as those in the fourth embodiment are denoted by the same reference numerals, and detailed description thereof is omitted.

(Constitution)
As shown in FIG. 17, the pressing mechanism 104 includes an abutting portion 104e inside the bag body 104a. The abutting portion 104 e is a flat plate that is long along the central axis of the concave substrate 120. The central axis of the concave substrate 120 is an axis along the rising side part 120b.

The abutting portion 104e is fixed to driving means (not shown). The driving means is an actuator that linearly moves the fixed object, and the abutting portion 104 e advances and retracts toward the central axis of the concave substrate 120 held by the holding portion 103. The tip of the abutting portion 104e is rounded so as not to break through the bag body 104a. That is, the abutting portion 104e advances toward the concave substrate 120 with the bag body 104a.

(Function)
In this board | substrate bonding apparatus 100, as shown to (a) of FIG. 17, before the air inflow to the bag body 104a, the abutting part 104e is advanced toward the concave substrate 120, and the abutting part 104e is made into a concave board | substrate. It strikes against the central area of 120. Then, the bag body 104a reaches the central region of the concave substrate 120 in advance by being drawn by the abutting portion 104e. That is, the thin substrate 121 is also first pressed against the central region of the concave substrate 120.

When the on-off valve 104d is opened with the abutting portion 104e being in contact, as shown in FIG. 17B, the bag body 104a bulges along the concave surface 120a of the concave substrate 120 while elastically deforming. Go. At this time, the thin substrate 121 is pressed against the concave surface 120a of the concave substrate 120 toward the end from the central region that has been previously abutted, along with the swelling following the concave surface 120a of the bag body 104a.

(effect)
As described above, the pressing mechanism 104 included in the substrate bonding apparatus 100 according to the present embodiment further includes the abutting portion 104 e that stands up inside the bag body 104 a and is abutted against the center of the concave surface 120 a of the concave substrate 120. Then, after the abutting portion 104e is abutted against the concave surface 120a of the concave substrate 120, the bag body 104a is expanded so as to expand toward the side portion 120b of the concave substrate 120.

For example, the fluid is inserted toward a portion corresponding to the center of the concave surface 120a of the bag body 104a, or the portion corresponding to the center of the concave surface 120a of the bag body 104a is softened or thinned without making the film forming the bag body 104a uniform. Thus, the bag body 104a can be inflated so as to expand from the central region toward the side portion 120b. However, by providing the abutting portion 104e, the thin substrate 121 can be easily expanded from the center to the side portion 120b without adopting complicated fluid control or complicated bag structure.

Therefore, each part of the thin substrate 121 adheres to an incorrect portion of the concave substrate 120, and the thin substrate 121 is wrinkled or a non-adhered portion is generated between the thin substrate 121 and the concave substrate 120. It can suppress more reliably and can manufacture a bonding thing with high quality.

(Sixth embodiment)
(Constitution)
The board | substrate bonding apparatus 100 which concerns on this embodiment is demonstrated with reference to drawings. FIG. 18 is a configuration diagram of the pressing mechanism 104 included in the substrate bonding apparatus 100 according to the present embodiment. The same components as those in the fourth and fifth embodiments are denoted by the same reference numerals, and detailed description thereof is omitted.

As shown in FIG. 18, the pressing mechanism 104 according to the present embodiment further includes a center block 104f, and has bag bodies 104a on both sides thereof. The bag body 104a is, for example, larger than the space area defined by the concave surface 120a and one side surface of the central block 104f, but has a shape following the space area. However, there is no particular limitation on the shape of the bag body 104a as long as it can be expanded larger than the space area at the maximum.

The central block 104f presses the central region of the thin substrate 121 against the central region of the concave substrate 120. That is, the center block 104f is a substantially rectangular parallelepiped having an upper surface that follows the surface shape of the central region of the concave surface 120a. If the central region of the concave surface 120a is curved, the upper surface of the substantially rectangular parallelepiped is raised. If the central region of the concave surface 120a is flat, the upper surface is flat. The central block 104f does not move in the direction of the side portion 120b of the covered concave substrate 120.

On the other hand, the bag body 104a expands the thin substrate 121 along the concave surface 120a of the concave substrate 120, and causes the side portion of the thin substrate 121 to closely contact the rising side portion 120b of the concave substrate 120 without a gap. Therefore, each of the bag bodies 104a is formed with a fluid introduction hole 104b and communicates with the atmosphere through a pipe 104c that is opened and closed by an on-off valve 104d. The pipe 104c passes through the center block 104f and branches toward each bag 104a.

In this pressing mechanism 104, by reducing the bag body 104a on both sides, the thin substrate 121 is rolled into the concave space 120c without coming into contact with the concave surface 120a, and the bag body 104a on both sides expands to make it thin. The thin substrate 121 is bent and deformed so as to follow the concave surface 120a from the substrate center toward the outside, and the thin substrate 121 is brought into close contact with the concave substrate 120 via the adhesive R.

(Function)
First, as shown in FIG. 18A, the substrate bonding apparatus 100 is deflated without allowing air to flow into the bag body 104a. Then, the concave substrate 120 is installed in the holding portion 103, and the thin substrate 121 is placed on the upper surfaces of the central block 104f and the bag bodies 104a on both sides.

Next, as a second step, as shown in FIG. 18B, the holding portion 103 and the pressing mechanism 104 are relatively moved closer to each other. When the pressing mechanism 104 enters the concave space 120c, the thin substrate 121 is also pressed into the concave space 120c. At this time, since the bag body 104a is deflated, the pressing mechanism 104 is smaller than the concave space 120c. Therefore, the thin substrate 121 and the side portion 120b of the concave substrate 120 are not in surface contact. Since there is no surface contact, the thin substrate 121 is not pushed in while grinding the side portion 120b of the concave substrate 120 with the surface.

The relative approach of the holding unit 103 and the contraction body is continued until the central region of the thin substrate 121 is pressed against the central region of the concave substrate 120. For example, the pressing can be detected by installing a torque sensor or the like on the actuator.

As a third step, as shown in FIG. 18C, the bag body 104a is inflated by opening the on-off valve 104d. When the inflow of air into the bag body 104a is continued, the bag body 104a expands following the concave surface 120a of the concave substrate 120 while being elastically deformed, as shown in FIG. At this time, the thin substrate 121 is pressed against the concave surface 120a of the concave substrate 120 from the central region toward the end along with the swelling following the concave surface 120a of the bag body 104a. Since the bag body 104a has elastic deformation, the bag body 104a is deformed into an outer shape that matches the surface shape of the side part 120b on which the concave substrate 120 rises.

Therefore, the thin substrate 121 and the concave substrate 120 are in close contact with each other without any gap. In addition, since the central block 104f first presses the thin substrate 121, and then the bags 104a on both sides swell, the thin substrate 121 comes into close contact with the concave substrate 120 in order from the center to the end. There is no space between the thin substrate 121.

(effect)
As described above, in the present embodiment, the pressing mechanism 104 further includes the center block 104f that does not move in the direction of the side portion 120b where the concave surface 120a rises, and the bag body 104a is provided on both sides of the center block 104f. It is located and swells to the part of the concave surface 120a which the side part 120b of the concave substrate 120 has.

Also by this pressing mechanism 104, the thin substrate 121 can be easily expanded from the center toward the side without adopting complicated fluid control and complicated bag structure.

(Modification)
In the present embodiment, the bag body 104a is arranged on both sides of the center block 104f, but another bag body 104a may be arranged instead of the center block 104f, not necessarily the center block 104f. Good. That is, three or more bags 104a may be arranged. By first introducing the gas into the central bag body 104a, the central region of the thin substrate 121 is first pressed against the central region of the concave substrate 120 like the abutting portion 104e of the second embodiment, and then both A gas is introduced into the side bag body 104a to push the thin substrate 121 outward. Thereby, the same operation effect as a 5th embodiment and a 6th embodiment can be acquired. In each of the above embodiments, not only the vacuum chamber 109 but also the bag body 104a may be evacuated before bonding. At the time of bonding, by opening the on-off valve 104d while maintaining the vacuum in the vacuum chamber 109, the atmosphere can flow into the bag body 104a and can be inflated as described above for bonding. Note that the mounting surface may be formed with a thickness or material that does not contract so that a flat surface is secured to the extent that the thin substrate 121 can be mounted even when the bag body 104a is evacuated.

[Other Embodiments]
The present invention is not limited to the embodiment as described above. For example, the following forms are also included in the present invention.
(1) The expansion / contraction part should just have the adhesive force which hold | maintains a board | substrate, and the elasticity which presses a board | substrate to the opposing board | substrate, and is not limited to ER fluid. Further, instead of the electrostatic chuck of the above-described embodiment, an ER fluid and an electrode unit whose adsorption force is changed by energization can be used.

(2) The first ventilation path and the second ventilation path may be independently provided with a vacuum source and a switching part as pressure adjusting parts, or the configuration is simplified by using a common vacuum source and switching part. May be used. In the case of common use, the switching unit is configured to switch one of the vents of the first ventilation path and the second ventilation path, or both vents.

(3) The type of resin used for the adhesive is not limited to the ultraviolet curable resin. Any type of resin such as a resin curable by other electromagnetic waves or a thermosetting resin can be applied. In this case, depending on the type of resin, it is conceivable to apply various curing methods such as electromagnetic wave irradiation, temperature change (heating, cooling), and air blowing. Therefore, the treatment for pre-curing the adhesive also varies depending on the resin. Note that the temporary curing of the adhesive is not necessarily performed.

(4) The substrates may be bonded in a vacuum or in the air. That is, it is not always necessary to use a vacuum as long as a pressure difference can be generated between the first space and the second space. For example, instead of a vacuum source such as a vacuum pump, pressurization may be performed using a pressurization pump. That is, the present invention can be configured by using a vacuum source (such as a vacuum pump) or a pressurizing source (such as a pressure pump) as the pressure adjusting unit. By increasing the pressure in the first space 11b by a pressure source (pressure pump) connected to the ventilation path 11a, the expansion / contraction part 21 is expanded toward the substrate S2, and the adhesive R of the substrate S1 is removed. The attached surface can be pressed against the substrate S2. A pressure source may be connected to the first ventilation path 11a, and a vacuum source may be connected to the second ventilation path 12a. As mentioned above, it is not limited to the atmosphere.

For example, each embodiment has been described on the assumption that the concave substrate 120 and the thin substrate 121 are bonded in a vacuum, but the present invention is not limited to this, and the bonding may be performed in atmospheric pressure. Even under atmospheric pressure, if the gas is introduced into the bag body 104a so that the bag body 104a expands from the central portion to the outer periphery, the gas hardly remains in the bag body 104a.

Further, not only air introduction into the bag body 104a by decompression such as vacuum, but also gas may be introduced into the bag body 104a with a pump such as a compressor. Even in this case, the bonding may be performed in vacuum or in atmospheric pressure.
When the ER fluid is used as the adsorbing member in the bag body, the electrode portion can be incorporated in the bag body. An electrode connected to a power source may be provided on the bag body and connected to the ER fluid, and when the bag body contracts, electrical conduction between the ER fluid and the power source may be ensured to obtain an adsorption force. A part of this electrode may be a flexible wiring that expands and contracts with the bag. Further, immediately after the bag body swells and the substrates are bonded together, the electrode may be provided with a contact that opens and closes according to the expansion and contraction of the bag body so that the electrical continuity is cut off and the attractive force is reduced.

(5) The substrate to be bonded is typically a cover panel, a touch panel and a liquid crystal module or an organic EL module, a display panel constituting the module, a backlight, or the like. However, the size, shape, material, etc. are not limited as long as they can be a pair of objects to be attached. For example, the present invention can be applied to various members constituting a display device, a semiconductor wafer, an optical disc, and the like. It is free to attach the adhesive to which substrate, and it is applicable not only when the adhesive is attached to one of the substrates but also when the adhesive is attached to both. Furthermore, the present invention can also be applied to the case where one substrate is pressure-bonded to the other substrate without using an adhesive. This pressure bonding includes keeping the substrates that are in close contact with each other at atmospheric pressure.

(6) The above embodiments are not intended to limit the scope of the invention. These embodiments can be variously omitted, replaced, changed, and combined within the scope of the gist of the invention, and are included in the invention described in the scope of claims and the equivalents thereof.

M ... Substrate bonding apparatus R ... Adhesives S1, S2, S3 ... Substrate 1 ... Chamber 2 ... First support part 3 ... Second support part 4 ... Temporary curing treatment part 11 ... First chamber 11a ... First

1st space

11c, 12c ... Pressure adjustment part 12 ... 2nd chamber 12a ... 2nd ventilation path 12b ... 2nd space 21 ... Expansion-contraction part 22 ... Electrode part 100 ... Board | substrate bonding apparatus 120 ... concave substrate 120a ... concave surface 120b ... side portion 120c ... concave surface space 121 ... thin substrate 103 ... holding part 104 ... pressing mechanism 104a ... bag body 104b ... fluid introduction hole 104c ... pipe 104d ... on-off valve 104e ... abutting part 104f ... central block 109 ... vacuum chamber

Claims

A chamber for accommodating a first substrate and a second substrate to be bonded;
A first support for supporting the first substrate in the chamber;
A second support for supporting the second substrate at a position facing the first substrate in the chamber;
Have
In the chamber,
A first space on a side opposite to a support side of the first substrate in the first support portion;
A second space in which the first substrate and the second substrate face each other;
Is provided,
The first support section separates the first space and the second space, holds the first substrate, and the first space has a higher pressure than the second space. The bonding apparatus is characterized by having an expansion / contraction portion that stretches and presses the first substrate against the second substrate.
The stretchable part is an elastic body whose entire or part is changed in adsorption force by energization,
The said 1st support part has an electrode part which supplies with electricity to the said expansion-contraction part, The board | substrate bonding apparatus of Claim 1 characterized by the above-mentioned.
The chamber is
A first chamber having the first space and provided with the first support;
A second chamber having the second space and provided with the second support;
Divided into
The board | substrate bonding apparatus of Claim 1 with which the said expansion-contraction part is pinched | interposed by the part obstruct | occluded by the said 1st chamber and the said 2nd chamber.
The pasting apparatus according to claim 1, wherein the stretchable part has a bag shape.
A first ventilation path for supplying and discharging gas to the first space; and a second ventilation path for supplying and discharging gas to the second space;
Connected to at least one of the first ventilation path and the second ventilation path is a pressure adjustment section that switches expansion and contraction of the expansion / contraction section by adjusting the pressure of the first space or the second space. The board | substrate bonding apparatus of Claim 1 characterized by the above-mentioned.
The substrate bonding apparatus according to claim 5, wherein the pressure adjusting unit includes a vacuum source.
The substrate bonding apparatus according to claim 5, wherein the pressure adjusting unit includes a pressure source.
The substrate bonding apparatus according to claim 1, further comprising a temporary curing treatment unit that temporarily cures the adhesive attached to at least one of the first substrate and the second substrate.
An expansion / contraction section that divides the chamber into a first space and a second space holds the first substrate in the second space,
Supporting the second substrate at a position facing the first substrate in the second space;
The board | substrate bonding method characterized by extending the said expansion-contraction part by the pressure difference with the said 2nd space in the said 1st space, and pressing a said 1st board | substrate against a 2nd board | substrate.
The first substrate is a concave substrate having a concave surface;
The second substrate is a flexible thin substrate,
The stretchable part is a bag-like bag body,
Injecting a fluid into the first space inside the bag body and inflating the bag body following the concave surface of the concave substrate;
In the step of inflating the bag body, before the bag body follows the concave surface, the bag body is inserted into the concave space defined by the concave surface of the concave substrate together with the thin substrate to further inflate the bag body. In the process, the step of expanding the thin substrate by following the concave surface with the bag,
The board | substrate bonding method of Claim 9 characterized by the above-mentioned.
The first substrate is a concave substrate having a concave surface;
The second substrate is a flexible thin substrate,
In the process of inflating the bag-shaped expansion / contraction part following the concave surface of the concave substrate, before the expansion / contraction part follows the concave surface, the concave surface of the concave substrate is defined together with the thin substrate. In the process of further entering the concave space, and further expanding the expansion and contraction portion, the expansion and contraction portion to push and expand the thin substrate following the concave surface,
The board | substrate bonding apparatus of Claim 4 characterized by these.
The stretchable part is
A central block,
The portions located on both sides of the central block swell up along the concave portions of the side portions of the concave substrate;
The board | substrate bonding apparatus of Claim 11 characterized by these.
The stretchable part is
And abutting means that abuts against the center of the first substrate;
Extending the abutting means against the center of the first substrate and then extending so as to expand toward the first substrate;
The board | substrate bonding apparatus of Claim 1 characterized by these.