TW201816474A - Apparatus for vacuum bonding of bonded device - Google Patents

Abstract

A positional deviation between a first workpiece and a second workpiece due to a change in gas pressure and a change in temperature in a bonding space is prevented. A vacuum bonding apparatus is provided with: a first holding member having a first workpiece holding surface for a first workpiece; a second holding member facing the first workpiece holding surface across a bonding space and having a second workpiece holding surface for a second workpiece; a separation drive section that causes one or both of the first holding member and the second holding member to relatively move toward each other; a room pressure regulation section that discharges gas from the bonding space to an external space to regulate the bonding space from an ambient atmosphere to a depressurized atmosphere; and a control section that operates and controls the separation drive section and the room pressure regulation section. One or both of the first workpiece holding surface and the second workpiece holding surface have a plurality of convex parts formed to face and detachably contact non-bonding surfaces of one or both of the first workpiece and the second workpiece, and a plurality of concave groove parts formed adjacent to the plurality of convex parts to face the non-bonding surfaces. The plurality of convex parts and the plurality of concave groove parts are disposed in an arrangement that has isotropy in directions in which the plurality of convex parts and the plurality of concave groove parts intersect each other on the non-bonding surfaces throughout one or both of the first workpiece holding surface and the second workpiece holding surface. In a state in which the non-bonding surfaces are in contact with the plurality of convex parts, the plurality of concave groove parts serve as ventilation paths through which the bonding space and the external space communicate with each other. The control section performs control to cause gas to flow in a similar manner in each intersecting direction on the non-bonding surfaces through the ventilation paths when the bonding space is depressurized and opened to the ambient atmosphere by the room pressure regulation section.

Description

Vacuum bonding device for bonding devices

The present invention relates to a flat display (FPD), a sensor device or, for example, a touch panel FPD, such as a liquid crystal display (LCD), an organic light emitting diode (OLED), a plasma display (PDP), a flexible display, or the like , 3D (three-dimensional) displays, e-books such as liquid crystal module (LCM), flexible printed circuit (FPC) and other plate-shaped workpieces such as touch panel, cover glass, cover film or FPD Vacuum bonding device for bonding devices.

Conventionally, as a vacuum bonding device of this type of bonding device, there is a bonding substrate manufacturing device, that is, a vacuum plate is provided with a first substrate for holding a lower plate (bottom plate) and a second substrate for holding it. An upper flat plate (pressure plate), and a plurality of suction grooves are formed on the suction surfaces of the pressure plate and the bottom plate (for example, refer to Patent Document 1). The plurality of adsorption grooves are formed by cutting edges so as to extend in a predetermined direction to the end faces of the pressure plate and the bottom plate, and communicate with the space in the vacuum chamber. The convex portion formed between the plurality of adsorption grooves is formed with an adsorption pipe which is not in communication with the plurality of adsorption grooves, and the substrate is vacuum-adsorbed by the adsorption pipes. The pressing device controlled by the control device vacuum-exhausts the vacuum chamber to reduce the pressure. After the substrates are aligned, the substrates are pressed and bonded, and then the atmosphere is released in the vacuum chamber. [Advanced Technical Documents] [Patent Documents] Patent Document 1: Japanese Patent Publication No. 2006-178476

[Problems to be Solved by the Invention] The temperature in the vacuum chamber undergoes adiabatic expansion or adiabatic compression due to pressure changes during decompression or release in the atmosphere. Specifically, in a state where the pressure plate or the bottom plate is closely held and the substrate is held tightly, if the pressure is reduced by the vacuum exhaust in the vacuum chamber, the gas in the plurality of adsorption tanks communicating with the space in the vacuum chamber is completely insulated. Thermal expansion causes temperature drop. In contrast, when released in the atmosphere, the gas in the plurality of adsorption tanks communicating with the space in the vacuum chamber rises in temperature due to adiabatic compression. Temperature changes in the space, the pressure plate, and the bottom plate in the vacuum chamber are also transmitted to the substrate that is tightly held, so that the substrate expands and contracts in a direction that generates a temperature change. However, in Patent Document 1, as the plurality of adsorption tanks, the linear tanks which are mainly parallel are arranged in a stripe-shaped anisotropy extending in one direction. Therefore, when they are decompressed in a vacuum chamber or released in the atmosphere, The temperature change caused mainly occurs in the linear extension direction of each adsorption tank. With this, the substrate also expands and contracts mainly in the linear extension direction of each adsorption groove, resulting in a change in the overall shape of the substrate. In addition, due to design reasons, there may be a case where a plurality of suction grooves (straight grooves) are provided only on any one of the pressure plate or the bottom plate, and the straight extension direction of each suction groove provided on the pressure plate and the bottom plate. Different situation. In this case, the opposite substrates are shifted from each other. Even if the substrates are precisely aligned with each other under reduced pressure, local strain and positional shifts occur due to subsequent release in the atmosphere. . This expansion and contraction has the following problems, that is, if the display body of the liquid crystal panel and the organic EL panel which needs sub-micron level alignment is bonded to a large substrate with more than 1 meter on one side, as long as it is slightly changed, Will cause an impact. In addition, there is a problem that the liquid crystal (LC), the UV-curable optically transparent resin (OCR) solution and the alignment film used in the bonded device cannot withstand temperature changes in particular. Uneven temperature will adversely affect the physical properties of liquid crystal (LC), UV-curable optically transparent resin (OCR) liquid and alignment film, resulting in a decrease in yield. [Technical Mechanism for Solving Problems] In order to solve such a problem, the vacuum bonding apparatus of the bonding device of the present invention is characterized by including: a first holding member having a first workpiece holding surface of a first workpiece; and a second holding A second workpiece holding surface that faces the first workpiece holding surface across the bonding space and has a second workpiece; and a driving unit for contact and separation that causes either the first holding member or the second holding member One or both of them move relatively close to each other; a room pressure adjustment unit that discharges gas from the bonding space to an external space to adjust the bonding space from an atmospheric atmosphere to a reduced pressure atmosphere; and a control unit that drives the contact and separation And the chamber pressure adjustment unit for operation control. Either or both of the first work holding surface or the second work holding surface has a plurality of convex portions to communicate with the first work or the second work. One or both of them are formed so as to face each other in a detachable manner; and a plurality of groove portions to be adjacent to the plurality of convex portions beside the plurality of convex portions. The plurality of convex portions and the plurality of groove portions are formed so as to oppose each other or the entirety of the first workpiece holding surface or the second workpiece holding surface, and the plurality of convex portions and The plurality of groove portions are arranged in an isotropic arrangement in a direction intersecting the non-laminating surface. In a state where the non-laminating surface is in contact with the plurality of convex portions, the plurality of groove portions are A ventilation path that communicates the bonding space with the external space, and the control unit causes the gas to flow through the ventilation path when the bonding space is decompressed by the chamber pressure adjustment unit and released in the atmosphere. The directions in which the non-adhering surfaces intersect each other are controlled so as to flow in the same manner.

Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. As shown in FIGS. 1 and 2, the vacuum bonding apparatus A system of the bonding device W according to the embodiment of the present invention has a pair of workpieces W1 and W2 formed in a plate shape via a first holding member 1 and a second A bonding device manufacturing apparatus that holds and holds a pair of workpieces W1 and W2 by relatively closely moving the first holding member 1 and the second holding member 2. The pair of workpieces W1 and W2 after the completion of bonding are peeled from the first holding member 1 and the second holding member 2. As a specific example of this bonded device manufacturing apparatus, in the bonding space S, the first holding member 1 and the second holding member 2 are arranged to face each other, and the first holding member 1 and the second holding member 2 are respectively received in the atmosphere. The first workpiece W1 and the second workpiece W2 are conveyed to the bonding space S in the middle. Thereafter, either or both of the first holding member 1 and the second holding member 2 are relatively moved closer to each other in the facing direction in the decompressed bonding space S. After aligning in a direction intersecting the facing direction as necessary, the first work W1 and the second work W2 are bonded (adhered). Thereby, a bonded device W having a sealed space inside is manufactured. Next, after the first workpiece W1 of the bonding device W is peeled from the first holding member 1, the bonding space S is returned to atmospheric pressure, thereby generating a pressure difference from the internal pressure of the sealed space of the bonding device W. The pressure difference uniformly presses the bonding device W to a predetermined gap. After that, the completed bonding device W is peeled from the second holding member 2 and transported outside the bonding space S. In addition, as shown in FIGS. 1 (a) and 1 (b), the first work W1 and the second work W2 are generally arranged to face each other in the vertical direction. Hereinafter, the first work W1 on the upper side and the second work W1 on the lower side are arranged. The direction in which the workpiece W2 is bonded is referred to as the "Z direction". Hereinafter, the directions along the first workpiece W1 and the second workpiece W2 crossing the Z direction will be referred to as "XY directions". In detail, the vacuum bonding apparatus A of the bonding device W according to the embodiment of the present invention, as a main constituent element, includes: a first holding member 1 and a second holding member 2 which are arranged to face each other in the Z direction; Either or both of the first holding member 1 or the second holding member 2 are moved relatively close to each other in the Z direction by the driving portion 3; and the chamber pressure adjusting portion (not shown) discharges gas from the bonding space S To the external space (not shown) to adjust the bonding space S from the atmospheric atmosphere AP to the reduced-pressure atmosphere DP; and a control unit 4 for controlling the first holding member 1, the second holding member 2, and the driving unit for contact and separation 3 and the room pressure adjustment unit and other operation control. In addition, the second holding member 2 includes an alignment drive unit (not shown) that adjusts and moves either or both of the first holding member 1 or the second holding member 2 in the XY direction or the XYθ direction, and A peeling member (not shown) made of a jack pin or the like that peels the bonding device W from the second holding member 2 after the bonding is completed is preferred. The bonding device W is, for example, a thin plate-shaped structure including an FPD such as an LCD, a 3D (three-dimensional) display, an e-book, or an organic light emitting diode, and the like, including a module in which components are integrally assembled. The first workpiece W1 is composed of, for example, a glass touch panel, a cover glass, and the like, and is adhered so as to cover a second workpiece W2 composed of LCM, flexible printed circuit (FPC), and the like, thereby constituting FPD, OLED, and the like. In addition, on any one or both of the opposing surfaces of the first workpiece W1 and the second workpiece W2, the sealing material W3 is coated in a frame shape using a quantitative dispensing nozzle such as a dispenser, and the sealed space is surrounded by the sealing material W3. Filled with liquid crystal (LC), etc. As the sealing material W3, a light-curing adhesive such as an optically transparent resin (OCR) that is cured by absorbing light energy such as ultraviolet rays and polymerized and hardened and exhibits adhesiveness is used. Furthermore, as another example, a sealing space surrounded by the sealing material W3 can be filled with a substance other than liquid crystal (LC) or the sealing material W3 can be a thermosetting adhesive that is cured by polymerizing by absorption of thermal energy, and a two-liquid mixture. The hardening type adhesive is changed. The first holding member 1 is composed of a flat plate or the like formed as a rigid body such as a metal with a thickness that does not deform (deflection), and has a first surface facing the first workpiece W1 carried in the Z direction and coming into contact with it. A workpiece holding surface 1a. As a specific example of the first workpiece holding surface 1 a is the example shown in FIG. 1, the first workpiece holding surface 1 a is formed on the substantially smooth surface of the first holding member 1 at a portion or the entirety in contact with the first workpiece W1. The second holding member 2 is composed of a flat plate or the like formed as a rigid body such as a metal with a thickness that does not deform (deflection), and has a first surface facing the second workpiece W2 carried in the Z direction and coming into contact with it. Two workpiece holding surfaces 2a. When the specific example of the second workpiece holding surface 2a is the example shown in FIGS. 1 and 2, a second workpiece holding is formed on the substantially smooth surface of the second holding member 2 at a portion or the entire surface contacting the second workpiece W2. Face 2a. Moreover, although not shown as another example, the entire surface of the first holding member 1 can be changed as the first workpiece holding surface 1a or the entire surface of the second holding member 2 can be changed as the second workpiece holding surface 2a. Either the first workpiece holding surface 1a or the second workpiece holding surface 2a, or both the first workpiece holding surface 1a and the second workpiece holding surface 2a have a plurality of convex portions 11, 21 to communicate with the first workpiece W1. It is formed in such a manner that it can face the one or both of the second workpiece W2 so as to be detachable from the ground; and a plurality of groove portions 12 and 22 are formed adjacent to the convex portions 11 and 21. The plurality of convex portions 11, 21 and the plurality of groove portions 12, 22 are subjected to uneven processing such as cutting processing, blasting processing such as sand blasting, etching processing, and polishing processing to the first workpiece holding surface 1a and the second workpiece holding surface 2a. Or mold forming to form. The plurality of convex portions 11, 21 protrude along the first workpiece holding surface 1a and the second workpiece holding surface 2a at predetermined intervals, and are formed into separate island shapes, and have a plurality of smooth surfaces 11a, 21a. The top surfaces of the plurality of convex portions 11, 21 protruding from the plurality of groove portions 12, 22 are a plurality of smooth surfaces 11a, 21a, respectively, and the non-adhering surface W11 of the first workpiece W1 and the non-adhering surface W11 of the second workpiece W2. The bonding surface W21 is formed in parallel and is in contact with the non-bonding surfaces W11 and W21. The plurality of groove portions 12, 22 are recessed along the first workpiece holding surface 1a and the second workpiece holding surface 2a at predetermined intervals between the plurality of convex portions 11, 21, and are formed throughout the first workpiece holding surface 1a and The second workpiece holding surface 2a has a continuous length and a continuous concave shape. Regarding the shape of each of the groove portions 12, 22, a straight line is preferable. The plurality of convex portions 11, 21 and the plurality of groove portions 12, 22 extend through the entirety of the first workpiece holding surface 1a and the second workpiece holding surface 2a, the plurality of convex portions 11, 21, and the plurality of groove portions 12, 22 is arranged in an arrangement having isotropy in a direction along the intersection of the non-adhesive surfaces W11 and W21. The plurality of groove portions 12 and 22 are in a state where the non-adhered surface W11 of the first workpiece W1 and the non-adhered surfaces W11 and W21 of the second workpiece W2 are in contact with the first workpiece holding surface 1a and the second workpiece holding surface 2a. Ventilation paths are formed to connect the bonding space S and the external space, respectively. Examples of the shape of each of the convex portions 11 and 21 include a prism, a truncated pyramid, a cylinder, and a truncated cone. Each of the smooth surfaces 11a and 21a preferably has a surface having a smoothness of approximately 10 μm or less uniformly by grinding, polishing, or the like. Thereby, the first workpiece W1 and the second workpiece W2 are bonded in the Z direction in a state where the in-plane is uniform, so that high-precision bonding that requires sub-micron accuracy can be performed. Regarding the size of each of the smooth surfaces 11 a and 21 a, it is preferable to reduce (narrow) the contact area with the first workpiece W1 and the second workpiece W2 and arrange a plurality of them. In particular, it is preferable to set the total contact area of all the smooth surfaces 11a and 21a to approximately 50% or less of the surface area of the first work W1 and the second work W2. Thereby, static electricity generated at the interface between the plurality of smooth surfaces 11a and 21a and the non-adhesive surface W11 of the first workpiece W1 and the non-adhesive surface W21 of the second workpiece W2 is suppressed. Therefore, it is possible to reduce the influence on the physical properties of liquid crystals (LC), UV-curable optically transparent resins (OCR), and alignment films that cannot withstand static electricity caused by peeling galvanization and triboelectric charging. In addition, if the size of each of the convex portions 11 and 21 is 20 mm or more, the gap between the smooth surface 11a and the first workpiece W1 and the air entering the gap between the smooth surface 21a and the second workpiece W2 follow the bonding space. S depressurizes and swells and sharply increases, and a plate offset between the first work W1 and the second work W2 may occur. Therefore, it is preferable to set one side thereof to approximately 20 mm or less. Regarding the width of each groove portion 12 and 22, if the thickness of the first work W1 and the second work W2 reaches 10 times or more, the temperature change of the bonding space S during decompression or release in the atmosphere becomes locally large. Since unevenness may occur in a display such as a liquid crystal, it is preferable to set it within approximately 10 times (approximately 1 mm). However, as the materials of the first holding member 1 and the second holding member 2, not only are precision machining easy (excellent workability), but also lightness (excellent workability) and the cost is low, metal materials such as aluminum are generally used. On the other hand, as the material of the first work W1 and the second work W2 constituting the substrate of the LCD, OLED, or the like, glass, silicon, or the like, which is harder than metal materials such as aluminum, is generally used. Therefore, if the first workpiece holding surface 1a of the first holding member 1 and the second workpiece holding surface 2a of the second holding member 2 contact the first workpiece W1 and the second workpiece W2 and are repeatedly loaded and unloaded, each time the contact is made, The generated friction causes the soft first workpiece holding surface 1a and the second workpiece holding surface 2a to wear gradually. Therefore, in addition to preventing such abrasion, in order to simultaneously improve the peelability of the first work W1 and the second work W2, antistatic issues, etc., a non-adhesive coating process is performed on the plurality of smooth surfaces 11a, 21a, and the surface is roughened. Chemical treatment is preferred. As a result, the first workpiece W1 and the second workpiece W2 are less likely to undergo changes over time such as wear due to repeated contact with the first workpiece holding surface 1a and the second workpiece holding surface 2a. The areas of the smooth surfaces 11a, 21a in contact with the workpiece W2 are small, so their influence is small. Therefore, semi-permanent high-precision bonding can be performed stably. As an example of the arrangement of the plurality of convex portions 11 and 21 is shown in FIGS. 1 and 2, both the first workpiece holding surface 1 a and the second workpiece holding surface 2 a are subjected to uneven processing such as cutting processing, The mold is formed so that a plurality of convex portions 11 and 21 protruding in a substantially rectangular prism shape are arranged at equal intervals in the X direction and the Y direction. As an example of the arrangement of the plurality of groove portions 12 and 22 is shown in FIG. 1 and FIG. 2, the plurality of groove portions 12 and 22 are formed at respective crossing angles between the plurality of convex portions 11 and 21. It is a 90-degree grid (square grid). In a state where the first workpiece W1 and the second workpiece W2 are in surface contact with the plurality of smooth surfaces 11a, 21a, the two end portions (the two end portions in the X direction and Both ends in the Y direction) are configured so as to communicate with the bonding space S, respectively. Moreover, although not shown as another arrangement example, the shape of the plurality of convex portions 11 and 21 may be changed to a substantially circular shape, a substantially regular polygon, or a shape similar to these, instead of a substantially square shape or a plurality of shapes. The crossing angle of the groove portions 12 and 22 is changed to a cross angle other than 90 degrees instead of the orthogonality of approximately 90 degrees, and the radial shape of three or more groove portions 12 and 22 crossing at one point. In addition, the arrangement direction of the convex portions 11 and 21 and the extending direction of the groove portions 12 and 22 can be changed to a direction inclined with respect to the X direction or the Y direction, or a plurality of convex portions 11, 21 and The arrangement example of the plurality of recessed portions 12 and 22 is changed to a honeycomb shape (honeycomb shape) or a shape similar to these, instead of the checkered shape. In addition, the shape of each of the convex portions 11 and 21 can be changed to a pyramid frustum by a blasting process such as sand blasting, or can be changed to a circular cylinder or a frustum by mold forming. The bonding space S is formed inside a vacuum device (not shown) including a vacuum chamber and the like, and a gas is ejected (vacuum exhaust, evacuation) from the bonding space S by the operation of a vacuum pump (not shown). Thereby, the bonding space S is comprised so that it may pressure-adjust and adjust from the atmospheric atmosphere AP to the decompression atmosphere DP of predetermined vacuum degree. The vacuum device is configured such that the whole or a part of the first work W1 and the second work W2 can be opened and closed freely in order to enter and exit the bonding space S. A conveying mechanism (not shown) for the first workpiece W1 and the second workpiece W2 constituted by a conveying robot is provided throughout the bonding space S in the vacuum device and the external space of the vacuum device. Specifically, when the bonding space S is the atmospheric atmosphere AP, the first workpiece W1 and the second workpiece W2 are carried into the bonding space S by the transport mechanism, respectively. After the bonding space S becomes a reduced-pressure atmosphere DP with a predetermined vacuum degree, bonding of the first workpiece W1 and the second workpiece W2 is performed, and the bonding device W that has finished bonding is carried out to the external space of the vacuum device. The first holding member 1 disposed above includes a holding chuck 13 for detachably suspending the first work W1 on the upper side. When a specific example of the holding chuck 13 is the example shown in FIG. 1 and FIG. 2, by using an adhesive chuck adhered to the first workpiece W1, the bonding space S becomes a reduced-pressure atmosphere DP with a predetermined vacuum degree. The first workpiece W1 is not dropped. The adhesive chuck that becomes the holding chuck 13 has a lifting portion 13a provided to be freely reciprocated in the Z direction by being cut through a through hole 1b of the first holding member 1; an adhesive portion 13b is provided at the front end of the lifting portion 13a It is disposed so as to face the first workpiece W1 in the Z direction; an adhesive follower 13c is provided at the base end of the lifting portion 13a; and an adhesive drive portion 13d is connected to the adhesive follower 13c. The lifting portion 13a and the adhesive portion 13b are arranged in a plurality of arrays in a manner dispersed in the XY direction. The number and interval of the lifting portion 13a and the adhesive portion 13b depend on the size, thickness, material, and weight of the first workpiece W1. The adhesion driving portion 13d is composed of an actuator or the like capable of reciprocating in the Z direction. The control portion 4 described later, as shown by the solid line in FIG. 1, causes the adhesion portion 13b and the first portion to be brought into the bonding space S. The non-adhering surface W11 of a workpiece W1 is brought into contact and held in an adhesively controlled manner. After the first workpiece W1 and the second workpiece W2 are bonded, as shown by the solid line in FIG. 2, the first workpiece holding surface 1 a of the first holding member 1 is in contact with the non-adhesive surface W11 of the first workpiece W1. In this state, the adhesive portion 13b is separated from the non-adhering surface W11 of the first workpiece W1 in the Z direction to perform operation control. As another example, although not shown, an electrostatic chuck may be used in place of the adhesive chuck, or an adhesive chuck and an electrostatic chuck may be used in combination, or an auxiliary chuck may be combined in combination. It is preferable that the second work holding surface 2a of the second holding member 2 disposed below has the positioning portion 23 of the second work W2 on the lower side. The positioning part 23 of the second workpiece W2 does not need to be disposed on the entirety of the second workpiece W2, and only by arranging the adsorption mechanism and the adhesive mechanism and the like at a portion facing the outer edge portion of the second workpiece W2, etc. The second workpiece holding surface 2a is temporarily fixed in such a manner that it can be detached freely and cannot be moved. When the specific example of the positioning portion 23 as the second workpiece W2 is the example shown in FIGS. 1 and 2, the smooth surfaces 21 a of the convex portions 21 arranged at the four corners of the second workpiece holding surface 2 a serve as an adsorption mechanism. One or a plurality of suction holes 23a having a diameter of 1 mm or less are cut out. The suction hole 23a is in communication with a suction source (not shown) formed by a vacuum pump or the like. This suction source is controlled so as to be sucked from the suction hole 23a from when the second workpiece W2 carried into the bonding space S is received by the control unit 4 to be described later to when bonding. Moreover, although not shown as another example, the arrangement and number of the suction holes 23a can be changed to an arrangement and number other than the illustrated example. In addition, instead of the suction mechanism (suction hole 23a), the adhesion surface may be provided on the predetermined smooth surface 21a so as to protrude slightly toward the second workpiece W2 than the other smooth surface 21a. In addition, it is also possible to temporarily fix the second workpiece W2 by the locking gears which are unevenly fitted to the four corners of the second workpiece W2, or by any of a plurality of smooth surfaces 21a formed on the second workpiece holding surface 2a. One rough surface temporarily fixes the second workpiece W2 and changes it. The contact and separation driving unit 3 includes an actuator or the like that reciprocates either or both of the first holding member 1 or the second holding member 2 in the Z direction, and is controlled by a control unit 4 to be described later. . As an example of the control of the contact-separation driving unit 3 by the control unit 4, as shown by the solid line in FIG. 1 (a), when the first work W1 and the second work W2 carried into the bonding space S are delivered, contact occurs. The driving unit 3 for separation causes either the first holding member 1 or the second holding member 2 to be separated from each other in the Z direction and moved relative to each other or to cause both the first holding member 1 and the second holding member 2 to be in the Z direction. Relatively separate movement. After that, as shown by a two-dot chain line in FIG. 1 (a) and a solid line in FIG. 1 (b), the contact-separation driving unit 3 causes either the first holding member 1 or the second holding member 2 to face the other edge. The Z direction moves closer or both the first holding member 1 and the second holding member 2 move closer to each other in the Z direction. Thereby, the first workpiece W1 and the second workpiece W2 are overlapped in the Z direction with the sealing material W3 sandwiched therebetween, and are further pressed to be bonded as necessary. As a specific example of the contact-separation driving section 3 as shown in FIG. 1, only the first holding member 1 is connected to the contact-separating driving section 3 so that the first holding member 1 faces the second holding member 2 and follows. The Z direction moves relatively close. As another example, although not shown, it is also possible to connect the second holding member 2 and the contact-separation driving portion 3 to move the second holding member 2 toward the first holding member 1 relatively in the Z direction or The first holding member 1 and the second holding member 2 are connected to the contact-separation driving unit 3, respectively, and the first holding member 1 and the second holding member 2 are moved relatively close to each other in the Z direction at the same time to be changed. The control section 4 is electrically connected to the driving section 13d for holding the chuck 13, the suction source for the suction hole 23a, the driving section 3 for contact and separation, the chamber pressure adjusting section, the alignment driving section, and the driving section of the peeling member. Controller. In addition, the controller is also electrically connected to a conveyance mechanism of the first work W1 and the second work W2, and an opening / closing drive unit (not shown) that opens or closes the whole or a part of the vacuum device. The controller that becomes the control unit 4 performs the operation control in turn in accordance with a program previously set in the control circuit (not shown) at a preset timing. Specifically, as shown by the solid line in FIG. 1A, the control unit 4 causes the first workpiece W1 carried into the bonding space S of the atmospheric AP by the transport mechanism to be held by the adhesive portion 13 b holding the chuck 13. The first work holding surface 1a of the first holding member 1 is controlled so as to be actuated. The second workpiece W2 carried into the bonding space S by the conveying mechanism is placed on the second workpiece holding surface 2a of the second holding member 2 and temporarily fixed to be impossible by the suction hole 23a of the positioning portion 23 as necessary. Movement is controlled by movement. Next, when the bonding space S is decompressed by the room pressure adjustment unit, the gas in the ventilation path is directed to the non-bonding surface W11, by a ventilation path formed by a plurality of groove portions 12, 22. The crosswise XY direction or XYθ direction in W21 are controlled in such a manner that they flow in the same way. After that, the bonding space S is switched to the reduced-pressure atmosphere DP by the room pressure adjustment unit, as shown by a two-dot chain line in FIG. 1 (a) and a solid line in FIG. 1 (b) to hold the chuck 13. The driving unit for adhesion 13d and the driving unit 3 for contact and separation control the movement of the first holding member 1 and the adhesive portion 13b relatively to the second holding member 2 in the Z direction. Thereby, the first workpiece W1 and the second workpiece W2 overlap with each other in the Z direction with the sealing material W3 interposed therebetween. At approximately the same time, either the first holding member 1 or the second holding member 2 is adjusted and moved in the XY direction or the XYθ direction with respect to the other by the alignment drive portion, thereby performing the first work W1 and the second work W1 and the second work. Relative positioning (alignment) of the workpiece W2. After the alignment is completed, the operation control is performed so that the first work W1 and the second work W2 are bonded to each other by the contact and separation drive unit 3. In addition, after the first work W1 and the second work W2 are bonded, as shown by a solid line in FIG. 1 (b), the first work holding surface 1 a and the first work holding surface 1 of the first holding member 1 are held by the contact and separation driving unit 3. A state in which the non-adhering surface W11 of the first workpiece W1 is in contact. Next, as shown by a one-dot chain line in FIG. 1 (b), the operation is controlled such that the adhesive portion 13 b is moved away from the first workpiece W1 by the adhesive driving portion 13 d holding the chuck 13 to peel it away. After that, as shown by a two-dot chain line in FIG. 1 (b), the first holding member 1 and the adhesive portion 13 b are separated and moved relative to the second holding member 2 in the Z direction by the contact and separation driving portion 3 and recovered, The initial state controls the operation. At this time, the bonding space S is released to the atmosphere by the room pressure adjustment unit. When released in this atmosphere, it is also the same as that during decompression, so that the gas in the ventilation path passes through the non-adhered surfaces W11, W21 in the XY direction or through an air passage formed by a plurality of groove portions 12, 22, or The XYθ directions are controlled so as to flow in the same manner. Due to the release in the atmosphere, a pressure difference occurs with the internal pressure of the sealed space of the bonded bonding device W, and the bonding device W is uniformly pressurized to a predetermined gap by the pressure difference. Subsequently, the bonding device W is peeled from the second holding member 2 by a peeling member, and the operation control is performed so as to be carried out from the bonding space S by a transport mechanism. According to the vacuum bonding apparatus A of the bonding device W according to the embodiment of the present invention, the first workpiece W1 and the second workpiece W2 and the first workpiece holding surface 1a formed on the first holding member 1 are placed in an atmospheric atmosphere AP. The entirety of the plurality of convex portions 11 and 21 in contact with the entirety of the second workpiece holding surface 2a of the second holding member 2 are held in a removable manner. In this contact state, the plurality of recessed portions 12 and 22 serve as air passages connecting the bonding space S and the external space, and the gas in each recessed portion 12 and 22 can flow. Thereby, when the bonding space S is decompressed by the room pressure adjustment unit and released in the atmosphere, the gas flows through the ventilation path formed by the plurality of groove portions 12, 22 along the non-bonding surface W11, The directions crossed by W21 are approximately the same. Therefore, even if the pressure in the bonding space S is reduced repeatedly, the gas in each recessed portion 12 and 22 decreases in temperature due to adiabatic expansion, and the gas in each recessed portion 12 and 22 passes with release in the atmosphere. The adiabatic compression causes the temperature to rise, and the expansion and contraction changes on the first workpiece W1 and the second workpiece W2 are also approximately the same along the intersection direction of the non-adhesion surfaces W11 and W21. Therefore, even in the case where a plurality of convex portions 11 and 21 and a plurality of groove portions 12 and 22 are arranged only on either of the first work holding surface 1a or the second work holding surface 2a, the plurality of convex portions are arranged. In the case where the first and second groove holding portions 1a and 2a are arranged in different arrangements at 11, 21 and the plurality of groove portions 12, 22, it is possible to prevent the pressure change and temperature from the bonding space S. The position of the first workpiece W1 and the second workpiece W2 is shifted due to the change. As a result, compared with the conventional case where a plurality of adsorption grooves are arranged in a linear groove mainly parallel to each other and have a stripe-shaped anisotropy extending in one direction, the pressure is not reduced in the bonding space S or in the conventional case. The expansion and contraction of the first work W1 and the second work W2 when released in the atmosphere changes the overall shape of the first work W1 and the second work W2, and the first work W1 and the second work W2 can be accurately aligned while fit. In addition, by setting the width of each of the recessed portions 12 and 22 to approximately 10 times the thickness of the first work W1 and the second work W2, it is possible to reduce the liquid crystal (LC) and UV curability against temperature changes. The optical properties of the liquid transparent resin (OCR) and the alignment film. Therefore, it is possible to manufacture without reducing the yield of the high-precision bonded device W that requires sub-micron accuracy. In particular, it is preferable that the plurality of groove portions 12 and 22 are formed in a grid pattern that is continuous in a straight line. In this case, one or both of the first work holding surface 1a or the second work holding surface 2a is subjected to a concave-convex process such as a cutting process and a jet process, thereby forming the plurality of groove portions 12, 22 flatly and accurately. Therefore, the groove portions 12 and 22 with high accuracy can be manufactured with a simple structure. As a result, the processability of the recessed portions 12 and 22 is excellent, the cost is reduced, and the high-precision bonding device W can be manufactured. In addition, the first holding member 1 and the second holding member 2 are arranged so as to face each other in the up-down direction, and the second work holding surface 2a of the lower second holding member 2 has the positioning portion 23 of the second work W2 on the lower side as Better. In this case, even if an unexpected gas flow occurs before the bonding space S is bonded to the first workpiece W1, the positioning of the second workpiece W2 by the positioning portion 23 will not cause the position to shift relative to the second workpiece holding surface 2a. Therefore, it is possible to prevent the positional deviation of the second workpiece W2 from being accidentally bonded to the first workpiece W1 with high accuracy. As a result, as compared with the conventional method in which the substrate is strongly held by the suction tube of the bottom plate and held immovably, a strong vacuum suction is not required. Therefore, the quality of the bonded device W can be improved without excessively applying a load to the bonding device W. The overall structure can be simplified accordingly, and the cost can be further reduced. In addition, when the pressure of the bonding space S is reduced by the room pressure adjustment unit, the control unit 4 sets the non-bonding surface W11 and the second workpiece W2 of the first workpiece W1 facing the plurality of groove portions 12 and 22. The non-bonding surface W21 and the bonding surfaces W12 and W22 on the opposite side of the non-bonding surface W21 are controlled such that the gas flows at approximately the same flow rate. In this case, even if the bonding space S is decompressed by vacuum evacuation, the vacuum evacuation is performed at approximately the same flow rate on the non-bonding surfaces W11 and W21 and the bonding surfaces W12 and W22, and does not occur here. There is a significant pressure difference between the two. This eliminates the need for strong vacuum suction of the non-adhesive surface W11 of the first workpiece W1 and the non-adhesive surface W21 of the second workpiece W2, so that the entirety of the first workpiece W1 and the second workpiece W2 cannot be moved, and therefore, the first workpiece W1 and the second workpiece W2 cannot move. W1 and the second work W2 generate unevenness and strain due to the differential pressure. At the same time, as the bonding space S is decompressed, the portions of the first and second workpieces W1 and W2 facing the recessed portions 12 and 22 having a small heat capacity are liable to decrease in temperature due to adiabatic expansion. However, the portion with a smaller heat capacity is in contact with the smooth surfaces 11a and 21a and is adjacent to the portion with a larger heat capacity. Therefore, the non-bonding surface W11 of the first workpiece W1 and the non-bonding surface W21 of the second workpiece W2 are in contact with the bonding surface. The temperature balance of the joints W12 and W22 changes without causing a significant temperature difference between the two. Therefore, it is possible to prevent the first workpiece W1 and the second workpiece W2 from being shifted from the positions of the first workpiece holding surface 1a and the second workpiece holding surface 2a with a simple structure, and to prevent the first workpiece W1 and the second workpiece W2 from being displaced. The occurrence of temperature unevenness. In addition, in the embodiment shown above, as the holding chuck 13 of the first work W1 which can be detachably suspended from the upper side, an adhesive chuck adhered to the first work W1 is used, but it is not limited to this, and may be Use an electrostatic chuck instead of an adhesive chuck or a combination of an adhesive chuck and an electrostatic chuck.

1‧‧‧first holding member

1a‧‧‧First workpiece holding surface

1b‧‧‧through hole

2‧‧‧Second holding member

2a‧‧‧Second workpiece holding surface

3‧‧‧ Contact and separation drive unit

4‧‧‧Control Department

11‧‧‧ convex

11a‧‧‧ smooth surface

12‧‧‧ groove

13‧‧‧Keep Chuck

13a‧‧‧Lift

13b‧‧‧ Adhesive

13c‧‧‧Adhesive follower

13d‧‧‧ Adhesive drive unit

21‧‧‧ convex

21a‧‧‧Second workpiece holding surface

22‧‧‧ groove

23‧‧‧Positioning Department

23a‧‧‧Adsorption mechanism (adsorption hole)

A‧‧‧ Vacuum bonding device for bonding devices

AP‧‧‧ Atmosphere

DP‧‧‧ Decompression atmosphere

S‧‧‧ Fitting Space

W‧‧‧ Laminated Device

W1‧‧‧First Workpiece

W2‧‧‧Second workpiece

W3‧‧‧sealing material

W11‧‧‧Non-fitting surface

W12‧‧‧Mating surface

W21‧‧‧Non-fitting surface

W22‧‧‧ Fitting surface

FIG. 1 is an explanatory diagram showing the overall structure of a vacuum bonding device of a bonding device according to an embodiment of the present invention, FIG. 1 (a) is a front view of a longitudinal section before bonding, and FIG. 1 (b) is a view after bonding Vertical section front view. FIG. 2 is a cross-sectional plan view taken along line (2)-(2) of FIG. 1. FIG.

Claims (4)

A vacuum bonding device for a bonding device, comprising: a first holding member having a first workpiece holding surface of a first workpiece; and a second holding member separated from the first workpiece holding surface by a bonding space. And a second workpiece holding surface that is opposite and has a second workpiece; a contact / separation drive unit that moves one or both of the first holding member or the second holding member relatively close to each other; An adjustment unit that discharges gas from the bonding space to an external space and adjusts the bonding space from an atmospheric atmosphere to a reduced pressure atmosphere; and a control unit that operates the contact and separation driving unit and the room pressure adjustment unit Control; either or both of the first workpiece holding surface or the second workpiece holding surface has: a plurality of convex portions, which are in accordance with one or both of the first workpiece or the second workpiece The non-adhesive face is formed in a manner of being able to contact with each other freely; and a plurality of groove portions are formed near the plurality of convex portions in a manner to face the non-adhesive face; The plurality of convex portions and the plurality of groove portions are arranged on either or the entirety of the first workpiece holding surface or the second workpiece holding surface or both of them, and are arranged in the plurality of convex portions and the plurality of concave portions. The groove portions have an isotropic arrangement in the crossing direction of the non-adhesive surface. In a state where the non-adhesive surface is in contact with the plurality of convex portions, the plurality of groove portions are for connecting the bonding space with The external space communicates with the air passages separately, and the control unit is configured to cause the gas to pass through the air passage to the non-adhesive space through the air passage when the pressure of the bonding space is reduced by the room pressure adjustment unit and when the atmosphere is released. The crossing directions of the joints are controlled so that they flow in the same way. For example, the vacuum bonding apparatus for a bonding device according to claim 1, wherein each of the plurality of groove portions is formed in a linear continuous grid pattern. The vacuum bonding device of the bonding device according to claim 1 or 2, wherein the first holding member and the second holding member are arranged to face each other in an up-down direction, and the second of the second holding member below The work holding surface has a positioning portion for the second work described above. The vacuum bonding device of the bonding device according to claim 3, wherein the positioning portion is an adsorption mechanism or an adhesion mechanism provided on the second workpiece holding surface at least one of the plurality of convex portions.