KR20210015672A - Method for attaching sheet member and apparatus for attaching sheet member - Google Patents

Abstract

Provided are a sheet material pasting method and a sheet material pasting device that can efficiently paste a sheet material, such as an adhesive tape, to a workpiece having an annular convex part, and at the same time can prevent the sheet material from being peeled off from the workpiece. In a configuration in which an adhesive tape (DT) is pasted to a wafer (W) having an annular convex portion (Ka), the adhesive tape (DT) is brought into contact with a press table (63) having a predetermined shape according to an inner shape of the annular convex portion (Ka), and the adhesive tape (DT) is deformed to the predetermined shape. While maintaining the deformed state of the adhesive tape (DT), the press table (63) is moved closer to the wafer (W), and the adhesive tape (DT) is pasted over the inside of the annular convex portion (Ka) of the wafer (W).

Description

A sheet material sticking method and a sheet material sticking device TECHNICAL FIELD [METHOD FOR ATTACHING SHEET MEMBER AND APPARATUS FOR ATTACHING SHEET MEMBER}

The present invention relates to a sheet material attaching method and a sheet material attaching apparatus used to attach a sheet material using an adhesive tape as an example to a semiconductor wafer (hereinafter, appropriately referred to as ``wafer'') or a substrate as an example. will be.

After the circuit pattern is formed on the surface of the wafer, the back surface of the wafer is ground by a backgrinding process, and the wafer is divided into a plurality of chip parts by a dicing process. In the back grinding step, only the central portion is ground while leaving the outer periphery of the back surface of the wafer, and an annular convex portion is sometimes formed on the outer periphery of the back surface of the wafer so as to surround the back grind region.

In this case, even when the central portion of the wafer is thinned, it is reinforced by the annular convex portion, so that deformation or the like can be avoided during handling. After the backgrinding process, a wafer having an annular convex portion is placed in the center of the ring frame, and a supporting adhesive tape (dicing tape) is affixed over the ring frame and the back surface of the wafer. A mount frame is produced by affixing a dicing tape, and is provided in a dicing step.

As an example of a method of attaching an adhesive tape to a wafer in which a step difference is formed by an annular convex portion, the following is proposed. That is, the adhesive tape is put in the joint portion of the chamber consisting of a pair of upper and lower housings. Then, the pressure difference is generated in the two spaces partitioned by the adhesive tape, and the adhesive tape is concave and curved while heating to attach the adhesive tape to the back surface of the wafer. Further, after the pressure difference and heating in the chamber have been eliminated, a treatment of re-attaching the adhesive tape to the back surface of the wafer while reheating the adhesive tape is performed (refer to Patent Document 1).

Japanese Patent Publication No. 2016-122763

However, the conventional device has the following problems.

That is, in the conventional configuration, the adhesive tape can be brought into close contact with the inner corner of the annular convex portion by performing the affixing treatment twice. However, as time elapses after attaching the adhesive tape, there is a concern that a space is formed in the inner corner by peeling the adhesive tape from the inner corner toward the center of the wafer.

In addition, compared to a configuration in which the affixing treatment is performed only once, in the conventional configuration in which the affixing treatment is performed twice, the space generated in the inner corner is reduced, and a certain improvement in the adhesion accuracy is observed. However, in recent years, higher affixing accuracy is required, and it is difficult to meet the demand in the conventional configuration.

Further, in the conventional configuration, since it is necessary to perform the affixing process twice, the time required to complete the entire affixing process is prolonged, and there is also a concern that the apparatus is enlarged by a table or the like required for each affixing process. Therefore, it is difficult to improve the processing efficiency in the conventional configuration.

The present invention has been made in view of such circumstances, and a sheet material attaching method and sheet material capable of effectively attaching a sheet material such as an adhesive tape to a work having an annular convex portion, and suppressing peeling of the sheet material from the work Its main purpose is to provide a sticking device.

In order to achieve this object, the present invention adopts the following configuration.

That is, it is a sheet material affixing method in which the sheet material is affixed to the annular convex portion forming surface of a work having an annular convex portion on the outer periphery of one side,

A deformation process of deforming the sheet material into a predetermined shape according to the inner shape of the annular convex portion,

Attaching the sheet material in a state deformed to the predetermined shape by the deformation process to the work

It is characterized by having.

(Action/Effect) According to this configuration, in the case of affixing the sheet material to the annular convex portion forming surface of the work having the annular convex portion, deformation of the sheet material to a predetermined shape corresponding to the inner shape of the annular convex portion. Conduct the process in advance. Then, the sheet material is affixed to the work while maintaining the state in which the sheet material is deformed into the predetermined shape.

That is, in the configuration of the present invention, at the time of starting the affixing process, the sheet material has already been deformed into a predetermined shape corresponding to the shape of the inner side of the annular convex portion. Therefore, compared with the conventional configuration in which the sheet member is deformed while being attached to the work, in the configuration of the present invention, the tension acting on the sheet member in the portion corresponding to the inner corner portion of the annular convex portion can be greatly reduced. As a result, it is possible to prevent a situation in which the sheet material affixed to the work is peeled off from the inner corner of the annular convex portion over time, so that the sheet material can be more accurately adhered to the work.

In addition, unlike the conventional configuration, in the configuration of the present invention, it is not necessary to perform the affixing step multiple times, and the step of eliminating heating is also unnecessary. Therefore, the time required for a series of sticking steps can be greatly shortened, and the sticking efficiency can be improved.

In addition, in the above-described invention, in the deformation process, it is preferable to deform the sheet member into the predetermined shape so that an approximately uniform tension acts over the entire sheet member.

(Action/Effect) According to this configuration, by deforming the sheet material into a predetermined shape so that an approximately uniform tension acts over the entire sheet material, the tension acting on the portion of the sheet material that is attached to the annular convex portion is relatively large. It can be reduced. Accordingly, it is possible to more reliably prevent the sheet material affixed to the work from peeling off from the inner corner of the annular convex portion.

In addition, in the above-described invention, in the deformation process, it is preferable that the sheet member is brought into contact with the convex member to deform the sheet member into the predetermined shape.

(Action/Effect) According to this configuration, the sheet member is brought into contact with the convex member to deform the sheet member into a predetermined shape. By bringing into contact with the convex member having a predetermined firmness, the sheet material can be deformed with higher precision along the shape of the convex member. Further, by holding the sheet member in a state in which it is brought into contact with the convex member, it becomes easy to hold the sheet member in a predetermined shape. Therefore, it is possible to realize simply and reliably reducing the tension acting on the sheet material in the portion corresponding to the inner corner portion of the annular convex portion.

In addition, in the above-described invention, in the deformation process, it is preferable to contact the sheet material and the convex member in a non-adhesive state.

(Action/Effect) According to this configuration, since the sheet material is deformed into a predetermined shape by contacting the sheet material and the convex member in a non-adhesive state in the deformation process, when affixing the sheet material to the work in the bonding process, The adhesive force generated between the sheet material and the convex member can be avoided from being disturbed. For this reason, it is possible to reliably prevent a situation in which an attaching error to the work occurs in at least a part of the sheet material.

In addition, in the above-described invention, in the deformation process, it is preferable to depressurize the space between the sheet member and the convex member.

(Action/Effect) According to this configuration, in the deformation process, the space between the sheet member and the convex member is depressurized, so that the sheet member is brought into a state in which the sheet member is in close contact with the convex member. Accordingly, it is possible to more accurately deform the sheet material into a predetermined shape along the outer shape of the convex member.

In addition, in the above-described invention, the convex member has a depression, and in the attaching process, the sheet material deformed along the depression is separated from the depression, so that the tension acting on the sheet member is reduced. It is preferable to affix the sheet material to the work while reducing.

(Action/Effect) According to this configuration, since the convex member is formed with a depression, the sheet material is deformed into a shape including the depression during the deformation process. In the attaching process, the sheet material deformed along the depression is separated from the depression, thereby reducing the tension acting on the sheet member, and the sheet member is affixed to the work. In other words, it is possible to reduce the amount of tension that is substantially uniformly acting across the sheet material during the deformation process, and thus it becomes possible to further reduce the tension acting on the sheet material in the portion corresponding to the inner corner of the annular convex portion. .

In addition, in the above-described invention, the sheet material is sandwiched between the upper chamber and the lower chamber, and the lower space in which the work is disposed with the annular convex part forming surface upward, and the sheet material is interposed therebetween. A chamber forming process of forming a chamber partitioned into an upper space facing the lower space,

A proximity process of relatively approaching the sheet material in a state deformed into the predetermined shape by the deformation process

Equipped,

In the affixing process, the sheet material deformed into the predetermined shape is relatively close to the work, and the pressure difference formed between the upper space and the lower space in the chamber partitioned by the sheet material It is preferable to affix the sheet material to the annular convex part forming surface of the work.

(Action/Effect) According to this configuration, the sheet member in a state deformed into a predetermined shape by a deforming process is brought relatively close to the work by a proximity process. Then, in a relatively close state, the sheet material is affixed to the annular convex portion forming surface of the work by a differential pressure formed between the upper space and the lower space in the chamber partitioned by the sheet material. In this case, since the sheet material can be affixed to the work while the chamber is in a reduced pressure state, it is possible to avoid air bubbles from being rolled up between the sheet material and the work.

Further, in the configuration in which the chamber is used in this way, it is also possible to affix the sheet material to the work by generating a differential pressure in a state in which the sheet material is closely opposed to the work. In this case, since the entire sheet material is brought into contact with the work at approximately the same timing, a situation in which air bubbles are rolled in and a situation in which a part of the sheet material adheres to the work before other parts causes wrinkles is a factor that deteriorates the adhesion accuracy. It is possible to more reliably prevent the occurrence of the situation.

In order to achieve this object, the present invention may adopt the following configuration.

That is, it is a sheet material affixing device for attaching the sheet material to the annular convex portion forming surface of a work having an annular convex portion on the outer periphery of one side,

A deformation mechanism for deforming the sheet material into a predetermined shape corresponding to the inner shape of the annular convex portion;

An affixing mechanism for attaching the sheet member in a state deformed to the predetermined shape by the deformation mechanism to the work

It is characterized by having.

(Action/Effect) According to this configuration, in the case of affixing the sheet material to the annular convex portion forming surface of the work having the annular convex portion, the sheet has a predetermined shape according to the inner shape of the annular convex portion by the deformation mechanism. Deform the ash in advance. Then, the sheet material is affixed to the work while maintaining the state in which the sheet material is deformed into the predetermined shape. Therefore, the method can be suitably carried out.

Further, in the above-described invention, it is preferable that the deformation mechanism deforms the sheet member into the predetermined shape so that an approximately uniform tension acts over the entire sheet member.

(Action/Effect) According to this configuration, by deforming the sheet material into a predetermined shape so that an approximately uniform tension acts over the entire sheet material, the tension acting on the portion of the sheet material that is attached to the annular convex portion is relatively large. It can be reduced. Accordingly, it is possible to more reliably prevent a situation in which the sheet material attached to the work is peeled off from the inner corner portion of the annular convex portion.

Further, in the above-described invention, it is preferable that the deformation mechanism causes the sheet member to come into contact with the convex member to deform the sheet member into the predetermined shape.

(Action/Effect) According to this configuration, the deformation mechanism is provided with a convex member and causes the sheet member to come into contact with the convex member to deform the sheet member into a predetermined shape. By bringing into contact with the convex member having a predetermined firmness, the sheet material can be deformed with higher precision along the shape of the convex member. Further, by holding the sheet member in a state in which it is brought into contact with the convex member, it becomes easy to hold the sheet member in a predetermined shape. Therefore, it is possible to realize simply and reliably reducing the tension acting on the sheet material in the portion corresponding to the inner corner portion of the annular convex portion.

Further, in the above-described invention, it is preferable that the deformation mechanism makes the sheet member and the convex member contact in a non-adhesive state.

(Action/Effect) According to this configuration, since the sheet member is deformed into a predetermined shape by contacting the sheet member and the convex member in a non-adhesive state, when affixing the sheet member to the work, the sheet member and the convex member are The resulting adhesion can be avoided from being disturbed. For this reason, it is possible to reliably prevent a situation in which an attaching error to the work occurs in at least a part of the sheet material.

In addition, in the above-described invention, it is preferable that the deformation mechanism depressurizes the space between the sheet member and the convex member.

(Action/Effect) According to this configuration, since the space between the sheet member and the convex member is depressurized, the sheet member is brought into a state in which the sheet member is in close contact with the convex member. Accordingly, it is possible to more accurately deform the sheet material into a predetermined shape along the outer shape of the convex member.

In addition, in the above-described invention, the convex member has a depression, and the affixing mechanism separates the sheet member deformed along the depression from the depression, thereby reducing the tension acting on the sheet member. It is preferable to affix the sheet material to the work while reducing.

(Action/Effect) According to this configuration, since the convex member is formed with a depression, the sheet material is deformed into a shape including the depression during the deformation process. Then, by separating the sheet material deformed along the recessed portion from the recessed portion, the sheet material is affixed to the work while reducing the tension acting on the sheet material. That is, since the magnitude itself of the tension acting substantially uniformly across the sheet member can be reduced, it becomes possible to further reduce the tension acting on the sheet member in a portion corresponding to the inner corner portion of the annular convex portion.

In addition, in the above-described invention, the sheet material is sandwiched between the upper chamber and the lower chamber, and the lower space in which the work is disposed with the annular convex part forming surface upward, and the sheet material is interposed therebetween. A chamber formed by dividing into an upper space opposite to the lower space,

A proximity mechanism for relatively bringing the sheet member deformed into the predetermined shape by the deformation mechanism to the work.

Equipped,

The affixing mechanism, in a state in which the sheet material deformed into the predetermined shape is relatively close to the work, by a differential pressure formed between the upper space and the lower space in the chamber partitioned by the sheet material. It is preferable to affix the sheet material to the annular convex part forming surface of the work.

(Action/Effect) According to this configuration, the sheet member in a state deformed into a predetermined shape by a deformation mechanism is relatively brought close to the work by a proximity mechanism. Then, in a relatively close state, the sheet material is affixed to the annular convex portion forming surface of the work by a differential pressure formed between the upper space and the lower space in the chamber partitioned by the sheet material. In this case, since the sheet material can be affixed to the work while the chamber is in a reduced pressure state, it is possible to avoid air bubbles from being rolled up between the sheet material and the work.

According to the sheet material attaching method and the sheet material attaching apparatus according to the present invention, the sheet material affixed to the annular convex portion forming surface of a work in which the annular convex portion is formed on the outer periphery of one side is peeled from the inner corner portion of the annular convex portion. Can be suppressed.

1 is a diagram showing a configuration of a semiconductor wafer according to a first embodiment. (a) is a partially broken perspective view of the semiconductor wafer, (b) is a perspective view of the back side of the semiconductor wafer, and (c) is a partial longitudinal sectional view of the semiconductor wafer.
2 is a cross-sectional view showing a configuration of a sheet material according to Example 1. FIG.
3 is a plan view showing a configuration of a sheet material attaching device according to Example 1. FIG.
4 is a front view showing a configuration of a sheet material attaching device according to Example 1. FIG.
5 is a front view showing a main part of the wafer transfer mechanism according to the first embodiment.
6 is a plan view showing a main part of the wafer transfer mechanism according to the first embodiment.
7 is a front view of the wafer transfer device according to the first embodiment.
8 is a plan view of a wafer transfer device according to Example 1. FIG.
9 is a front view of a frame conveying device according to the first embodiment.
10 is a front view of an attaching unit according to Example 1. FIG.
11 is a partial cross-sectional view showing a schematic configuration of a tape affixing portion according to Example 1. FIG.
12 is a longitudinal sectional view of a chamber according to Example 1. FIG.
13 is a plan view of a tape cutting mechanism according to Example 1. FIG.
14 is a flowchart showing the operation of the sheet material attaching device according to the embodiment. (a) is a flowchart of the operation according to the first embodiment, and (b) is a flowchart of the operation according to the second embodiment.
15 is a perspective view of a mount frame according to the first embodiment.
16 is a diagram for explaining step S1 according to the first embodiment.
17 is a diagram for explaining step S2 according to the first embodiment.
18 is a diagram illustrating step S2 according to the first embodiment.
19 is a diagram for explaining step S3 according to the first embodiment.
20 is a diagram for explaining step S4 according to the first embodiment.
21 is a diagram for explaining step S4 according to the first embodiment.
22 is a diagram for explaining step S5 according to the first embodiment.
23 is a diagram for explaining step S5 according to the first embodiment.
24 is a diagram for explaining a problem of the conventional example. (a) is a diagram in a state in which an adhesive tape is affixed to the central portion of the back surface of the wafer, and (b) is a diagram in a state in which the adhesive tape is affixed to an inner corner portion of the annular convex portion.
Fig. 25 is a longitudinal sectional view showing a main part of the tape affixing portion according to the second embodiment.
26 is a diagram for explaining step S1 according to the second embodiment.
27 is a diagram for explaining step S2 according to the second embodiment.
28 is a diagram for explaining step S2 according to the second embodiment.
29 is a diagram for explaining step S3 according to the second embodiment.
30 is a diagram for explaining step S4 according to the second embodiment.
31 is a diagram illustrating a step of deforming an adhesive tape in a modified example.
32 is a diagram for describing a configuration of a press table according to a modification. (a) is a longitudinal sectional view of the press table, (b) is a longitudinal sectional view showing the length of the wafer affixing surface and the length of the adhesive tape in cross section, and (c) shows the state before the adhesive tape is affixed to the wafer. Is a longitudinal sectional view showing a state after attaching the adhesive tape to the wafer, (e) is a longitudinal sectional view showing a press table partially having a tapered portion, and (f) is a It is a longitudinal sectional view showing a modified example of the shape, and (g) is a longitudinal sectional view showing a press table provided with a recessed part in a base part.
33 is a diagram illustrating a configuration of a work according to a modification. (a) is a longitudinal sectional view showing a work in which the surface to be pasted of the sheet material is a curved surface, (b) is a longitudinal sectional view showing a work in which the inner corner of the annular convex portion has a curved surface, and (c) is on the inside of the annular convex portion It is a longitudinal sectional view showing a work in which a plurality of steps are formed.

[Example 1]

Hereinafter, Embodiment 1 of the present invention will be described with reference to the drawings. In the sheet material attaching apparatus R1 according to Example 1, the support adhesive tape DT (dicing tape) is used as a sheet material, and the semiconductor wafer W (hereinafter, `` Wafer (W)") and a ring frame (f) are used. That is, in the sheet material attaching apparatus R1 according to Example 1, the mount frame MF is produced by attaching the adhesive tape DT over the wafer W and the ring frame f.

The wafer W has been subjected to a back-grinding process while a circuit protection protective tape PT is affixed to the surface on which the circuit pattern is formed, as shown in FIGS. 1A to 1C. The back surface of the wafer W is ground (backgrind) leaving about 3 mm of the outer peripheral portion in the radial direction. That is, the flat concave portion (He) is formed on the back surface, and the shape of the annular convex portion (Ka) remaining along the outer periphery is used. For example, it is processed so that the depth d of the flat concave portion He is several hundred µm, and the wafer thickness J in the grinding region is several tens of µm to hundreds of µm. Accordingly, the annular convex portion Ka formed on the outer periphery of the rear surface functions as an annular rib that increases the rigidity of the wafer W, and suppresses the warpage deformation of the wafer W in handling or other processing steps.

As shown in Fig. 2, the adhesive tape DT used in the present embodiment has an elongated structure in which a non-adhesive substrate Ta and an adhesive material Tb having adhesiveness are laminated. A separator S is attached to the adhesive material Tb. That is, the separator S is attached to the adhesive surface of the protective tape PT, and the adhesive surface of the adhesive tape DT is exposed by peeling the separator S from the adhesive tape DT.

Examples of materials constituting the base material (Ta) include polyolefin, polyethylene, ethylene-vinylacetic acid copolymer, polyester, polyimide, polyurethane, vinyl chloride, polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate, poly Vinylidene chloride, polyethylene methacrylic acid copolymer, polypropylene, methacrylic acid terephthalate, polyamideimide, polyurethane elastomer, and the like. Further, a combination of a plurality of the above-described materials may be used as the substrate Ta. In addition, the base material Ta may be a single layer or a structure in which a plurality of layers are laminated. As the elastic modulus of the substrate Ta, a preferable example is 10 MPa or more and 10 GPa or less. It is preferable that the base material (Ta) is biaxially oriented. As the elongation rate of the substrate Ta, a preferred example is 10% to 1000%. When the elongation is within the range, it is possible to avoid the situation that an error occurs in the process of picking up the adhesive tape DT due to an excessively high elongation.

The adhesive material Tb has a function of maintaining a state in which the adhesive tape DT is adhered to the wafer W and the ring frame f, and a function of preventing scattering of chip parts in a subsequent dicing process. It is desirable to be made of a material that can be secured. Examples of the material constituting the adhesive material (Tb) include an acrylic acid ester copolymer. As a modulus of elasticity of the adhesive material (Tb), 1 KPa or more and 100 MPa or less are mentioned as a preferable example.

In addition, it is preferable to appropriately select a material for the adhesive material (Tb) that is cured by irradiation of energy rays using ultraviolet rays or addition of thermal energy. In this case, by applying energy rays or thermal energy, it becomes easy to peel the adhesive tape DT from the wafer W. As an example of the separator S, an elongated paper material, plastic, etc. are mentioned. Further, instead of the adhesive material (Tb), an adhesive material or an adhesive agent may be used.

<Description of the entire configuration>

3 is a plan view showing a basic configuration of a sheet material attaching device R1 according to Example 1. FIG. The attaching device R1 has a configuration including a horizontally elongated rectangular portion A and a protruding portion B. The protruding portion B has a configuration that is connected to the central portion of the rectangular portion A and protrudes upward. In the following description, the longitudinal direction of the rectangular portion A is referred to as the left-right direction (y direction), and the horizontal direction (x direction) orthogonal thereto is referred to as the lower side and the upper side.

The wafer transfer mechanism 1 is disposed on the right side of the rectangular portion A. Two containers 2 accommodating the wafers W are stacked in parallel in the lower right vicinity of the rectangular portion A. At the left end of the rectangular portion A, a frame recovery unit 3 for recovering the mount frame MF shown in Fig. 15 after mounting of the wafer W is completed is disposed.

From the upper right side of the rectangular portion A, the aligner 4, the holding table 5, and the frame supply portion 6 are arranged in this order. The protrusion B is a bonding unit 10 that affixes the adhesive tape DT for support (dicing tape) to the ring frame f, and affixes the adhesive tape DT to the wafer W. Has been.

In the wafer transfer mechanism 1, as shown in Fig. 4, a wafer transfer device 15 supported so as to be reciprocated left and right on the right side of a guide rail 14 installed horizontally on the upper portion of the rectangular portion A. Wow, a frame conveying device 16 supported so as to be movable left and right is provided on the left side of the guide rail 14.

The wafer transfer device 15 is configured to transfer the wafer W taken out from either side of the container 2 left and right and back and forth, and to reverse the posture of the wafer W.

As shown in FIGS. 5 and 7, the wafer transfer device 15 is equipped with a movable left and right movable table 18 capable of moving left and right along the guide rail 14. A front and rear movable platform 20 is equipped so as to be movable back and forth along the guide rail 19 provided on the left and right movable platform 18. Further, a holding unit 21 that holds the wafer W under the front-rear moving movable table 20 is equipped so as to be able to move up and down.

5 and 6, a drive pulley 23 driven forward and reverse rotation by a motor 22 is axially supported in the vicinity of the right end of the guide rail 14, and at the center side of the guide rail 14 The idling pulley 24 is axially supported. To the belt 25 wound over the driving pulley 23 and the idling pulley 24, the slide engaging portion 18a of the left and right movable table 18 is connected, and left and right by the forward and reverse rotation of the belt 25. The movable table 18 is moved left and right.

As shown in Fig. 8, a drive pulley 27 driven forward and reverse rotation by a motor 26 is shaft-supported in the vicinity of the upper end of the left and right movable table 18, and near the lower end of the left and right movable platform 18 The idling pulley 28 is supported on the shaft. To the belt 29 wound over these driving pulleys 27 and idling pulleys 28, a slide engaging portion 20a of the front and rear moving movable table 20 is connected, and the belt 29 is rotated forward and backward. The movable table 20 is moved back and forth.

As shown in FIG. 7, the holding unit 21 is a motor along the inverted L-shaped support frame 30 connected to the lower part of the front and rear moving movable table 20, and the vertical frame portion of the support frame 30 ( 31) to the lifting platform 32, which is screwed up and down by means of the lifting platform 32, the pivot shaft 33, which is pivotally supported around the longitudinal support shaft p through the pivot shaft 33 A rotating motor wound and interlocked by a belt 35, a holding arm 38 supported by a shaft capable of reverse rotation around a horizontal support shaft q through a rotation shaft 37 at the bottom of the rotation table 34, and rotation It is composed of a reversing motor 40 and the like that are wound around the shaft 37 through a belt 39 and interlocked.

The holding arm 38 has a horseshoe shape. A plurality of suction pads 41 slightly protruding are provided on the holding surface of the holding arm 38. In addition, the holding arm 38 is connected in communication with the pressure pneumatic apparatus through a flow path formed therein and a connection flow path connected at the base end side of the flow path.

By using the above-described movable structure, the wafer W held by suction is moved back and forth, left and right, and pivoted around the longitudinal support axis p by the holding arm 38, and horizontally shown in FIG. 7 The wafer W can be reversed front and back by reversing rotation around the direction support axis q.

As shown in FIG. 9, the frame conveyance device 16 includes a vertical frame 44 connected to a lower portion of the front and rear moving movable table 43, and an elevating frame supported so as to slide up and down along the vertical frame 44 ( 45), a stretching link mechanism 46 for vertically moving the elevating frame 45, a motor 47 for driving the stretching link mechanism 46 forward and backward, a wafer W mounted at the lower end of the elevating frame 45 And a plurality of adsorption pads 49 disposed around the adsorption plate 48 to adsorb the adsorption plate 48 for adsorbing the ring frame f. Accordingly, the frame conveying device 16 can adsorb and hold the ring frame f and the mount frame MF stacked and held on the holding table 5, and can be moved up and down and front and rear, left and right. The suction pad 49 is slidable in a horizontal direction corresponding to the size of the ring frame f.

The holding table 5 is a metal chuck table having a size equal to or larger than the shape of the wafer W, as shown in Figs. 10 to 12, and the external vacuum device 95 and the flow path 94 It is connected through communication. In addition, the holding table 5 is equipped with a plurality of support pins 50. In the first embodiment, the holding table 5 is provided with an annular protrusion 5a on the outer periphery, and is hollow as a whole. The protrusion 5a is configured at a position substantially coincident with the arrangement of the annular convex portion Ka of the wafer W in plan view, and the protrusion 5a supports the annular convex portion Ka of the wafer W. , The holding table 5 can hold the wafer W without contacting the thin flat recessed portion He.

The pins 50 are disposed on a predetermined circumference of the holding table 5 at equal intervals. That is, the pin 50 is configured to be able to move up and down from the holding surface of the holding table 5 by an actuator such as a cylinder. Further, the tip of the pin 50 is made of an insulating material or is covered with an insulating material.

The holding table 5 has a heater 107 embedded therein. The heater 107 is disposed inside the protrusion 5a as an example, and is annular in plan view. That is, the heater 107 is configured to heat the inner corner portion Hf of the annular convex portion Ka of the entire wafer W and the adhesive tape DT of the portion affixed to the inner corner portion Hf. .

Further, the holding table 5 is housed in a lower housing 11A constituting a chamber 11 to be described later, and is connected to one end of a rod 64 passing through the lower housing 11A. The other end of the rod 64 is driven and connected to an actuator 65 provided with a motor or the like. Therefore, the holding table 5 can be moved up and down inside the chamber 11.

The lower housing 11A includes a frame holding portion 51 that surrounds the lower housing 11A from the outside. The frame holding portion 51 is configured so that when the ring frame f is mounted, the ring frame f and the cylindrical top portion G of the lower housing 11A become flat.

In addition, as shown in FIG. 3, the holding table 5 is a position where the wafer W of the rectangular part A is set by a drive mechanism (not shown) and the attaching unit 10 of the protrusion part B It is configured to be able to reciprocate along the rail 58 provided between the affixing positions of the.

The frame supply unit 6 houses a pull-out cassette in which a predetermined number of ring frames f are stacked and accommodated.

As shown in FIG. 10, the attaching unit 10 is constituted by a tape supplying unit 71, a separator collecting unit 72, a tape attaching unit 73, a tape collecting unit 74, and the like. Hereinafter, each configuration will be described in detail.

The tape supply unit 71 is a separator S by a peeling roller 75 in the process of supplying the adhesive tape DT to the attachment position from a supply bobbin loaded with a roll of fabric on which the support adhesive tape DT is wound. It is configured to peel. Further, the supply bobbin is interlocked with the electromagnetic brake, and an appropriate rotational resistance is applied. Therefore, feeding of excess tape from the supply bobbin is prevented.

Further, the tape supply unit 71 is configured to swing the swing arm 77 connected to the cylinder 76 to push the adhesive tape DT downward with the dancer roller 78 at the tip to impart tension.

The separator recovery unit 72 is provided with a recovery bobbin for winding up the separator S peeled from the adhesive tape DT. This recovery bobbin is controlled to rotate in a forward and reverse direction by a motor.

The tape affixing portion 73 is constituted by a chamber 11, a tape affixing mechanism 81, a tape cutting mechanism 82, and the like. In addition, the tape attaching mechanism 81 corresponds to the attaching mechanism of the present invention, and the tape cutting mechanism 82 corresponds to a cutting mechanism.

The chamber 11 is composed of a lower housing 11A that reciprocates the rectangular portion A and the tape affixing portion 73, and an upper housing 11B configured to be elevating and descending from the protruding portion B. Both housings 11A and 11B have an inner diameter smaller than the width of the adhesive tape DT. Further, the upper portion G of the cylinder of the lower housing 11A is rounded and subjected to a release treatment such as fluorine processing.

The upper housing 11B is provided in the elevating drive mechanism 84 as shown in FIG. 11. The lifting drive mechanism 84 includes a lifting platform 87 movable along a rail 86 arranged in the longitudinal direction on the rear surface of the vertical wall 85, and a movable frame supported by the lifting platform 87 in a height adjustable manner ( 88), and an arm 89 extending from the movable frame 88 toward the front. The upper housing 11B is attached to the support shaft 90 extending downward from the distal end of the arm 89.

The lifting platform 87 is configured to be raised and lowered by screw feed by rotating the screw shaft 91 forward and backward by the motor 92.

Both housings 11A and 11B are connected in communication with the vacuum device 95 via a flow path 94 as shown in FIG. 12. Further, a solenoid valve 96 is provided in the flow path 94 on the upper housing 11B side. Further, flow paths 99 provided with solenoid valves 97 and 98 for air opening are connected in communication with both housings 11A and 11B, respectively. Further, to the upper housing 11B, a flow path 101 provided with a solenoid valve 100 for adjusting the internal pressure once reduced by leakage is connected in communication. In addition, the operation of opening and closing of the solenoid valves 96, 97, 98, 100 and the operation of the vacuum device 95 are performed by the control unit 102.

The tape attaching mechanism 81 has a tape deformation mechanism 59 inside the upper housing 11B, as shown in Fig. 11 and the like. The tape deformation mechanism 59 is provided with a cylinder 61 and a press table 63. The cylinder 61 is connected to the upper part of the press table 63, and the press table 63 can be moved up and down inside the chamber 11 by the operation of the cylinder 61.

The press table 63 has a flat base portion 63a and a convex portion 63b, and is a convex member as a whole. The convex portion 63b is provided in the center of the lower surface of the base portion 63a. The outer shape of the convex portion 63b is configured in a predetermined shape according to the shape of the inner side of the annular convex portion Ka of the wafer W.

In Example 1, the outer shape of the convex portion 63b is slightly smaller than the shape of the inner side of the annular convex portion Ka. Therefore, by bringing the adhesive tape DT into contact with the press table 63, the adhesive tape DT has the shape of the inner side of the annular convex portion Ka (in other words, the shape of the region affixed to the wafer W). It is transformed into approximately the same shape as In addition, as long as the adhesive tape DT can be deformed into a predetermined shape corresponding to the inner shape of the annular convex portion Ka, the configuration of the press table 63 can be appropriately changed. As an example, the base part 63a may be omitted, and it may be a cylindrical member as a whole.

A heater 64 is embedded in the convex portion 63b. As an example, the heater 64 is buried near the bottom surface of the outer peripheral part of the convex part 63b, and is annular in plan view. That is, the heater 64 is configured to heat the inner corner portion Hf of the annular convex portion Ka and the adhesive tape DT of the portion affixed to the inner corner portion Hf of the entire wafer W. .

Examples of the material constituting the press table 63 include metals such as aluminum or stainless steel, and resins such as fluororesin, MC nylon, and PPS. Further, the press table 63 may be subjected to surface treatment. Examples of the surface treatment include fluororesin coating, electric field fluororesin plating, and electroless nickel fluororesin plating.

The press table 63 may be made of an elastic body such as rubber, urethane, or elastomer. When the press table 63 is an elastic body, when the press table 63 contacts the wafer W through the adhesive tape DT, the press table 63 elastically deforms according to the shape of the back surface of the wafer W. do. Therefore, the adhesive tape DT can be suitably adhered to the wafer W, and damage to the adhesive tape DT or the wafer W can be reliably prevented.

Returning to Fig. 10, the tape attaching mechanism 81 is a guide rail 105 installed on a pair of left and right support frames 104 that are erected on the apparatus base 103 with the holding table 5 therebetween, and guide On the side of the movable table 106 which moves horizontally left and right along the rail 105, the attaching roller 109 axially supported by the bracket connected to the front end of the cylinder provided in the movable table 106, and the tape recovery part 72 It consists of the arranged nip roller (110).

The movable table 106 is a belt wound around a drive pulley 111 for forward and reverse rotation axially supported by a drive device fixedly arranged on the device base 103 and an idling pulley 112 axially supported on the support frame 104 side ( It is driven and transmitted by 113), and is configured to move horizontally left and right along the guide rail 105.

The nip roller 110 is constituted by a transfer roller 114 driven by a motor and a pinch roller 115 that is raised and lowered by a cylinder.

The tape cutting mechanism 82 is disposed in an elevating drive mechanism 84 that raises and lowers the upper housing 11B, as shown in FIG. 11. That is, a boss portion 117 that rotates around the support shaft 90 through the bearing 116 is provided. As shown in Fig. 13, the boss portion 117 is provided with four support arms 118 to 121 extending in the radial direction at the center.

At the tip of one support arm 118, a cutter bracket 123 that horizontally supports the disk-shaped cutter 122 is mounted so as to be movable vertically, and a pressing roller at the tip of the other support arms 119 to 121 124 is mounted so as to be able to move up and down through the swing arm 125.

The upper part of the boss part 117 has a connection part 126, and the connection part 126 is connected to the rotation shaft of the motor 127 provided in the arm 89 and driving.

As shown in FIG. 10, the tape recovery part 74 is provided with the recovery bobbin which winds up unnecessary adhesive tape DT peeled after cutting. This recovery bobbin is controlled to rotate in a forward and reverse direction by a motor (not shown).

In the frame recovery unit 3, as shown in Fig. 4, a cassette 130 is disposed to collect and load the mount frame MF. The cassette 130 is provided with a vertical rail 132 connected and fixed to the apparatus frame 131 and a lifting platform 134 which is screwed up and down by a motor 133 along the vertical rail 132. Accordingly, the frame recovery unit 3 is configured to load the mount frame MF on the hoisting table 134 and lower the pitch feed.

<Overview of operation>

Here, the basic operation of the sheet material sticking apparatus R1 according to the first embodiment will be described. FIG. 14A is a flowchart illustrating a step of attaching the adhesive tape DT to the wafer W using the sheet material attaching device R1.

Step S1 (Supply of work)

When the affixing command is issued, the transfer of the ring frame f from the frame supply part 6 to the frame holding part 51 of the lower housing 11A and transfer of the wafer W from the container 2 to the holding table 5 The conveyance is executed simultaneously.

Further, the heater 64 and the heater 107 are operated at an appropriate timing, so that the holding table 5 and the press table 63 are heated. By operating the heater 64 and the heater 107 in advance, the wafer W in the inner corner Hf is heated by the holding table 5 and the press table 63 heated in a subsequent process. ) And the adhesive tape DT are heated.

One frame conveyance device 16 adsorbs the ring frame f from the frame supply part 6 and moves and mounts it on the frame holding part 51. When the frame holding part 51 releases adsorption and rises, the ring frame f is aligned with the support pin. That is, the ring frame f waits until the wafer W is conveyed in the state set in the frame holding part 51.

The other transfer device 15 inserts the holding arm 38 between the wafers W stored in multiple stages, and is sucked and held from the circuit formation surface of the wafer W through the protective tape PT. It is taken out and conveyed to the aligner 4.

The aligner 4 adsorbs the center of the wafer W by the adsorption pad protruding from the center thereof. At the same time, the transfer device 15 releases the adsorption of the wafer W and is retracted upward. The aligner 4 performs position alignment based on a notch or the like while holding and rotating the wafer W with a suction pad.

When the alignment is complete, the suction pad on which the wafer W is adsorbed is protruded from the surface of the aligner 4. The transfer device 15 moves to that position, and the wafer W is adsorbed and held from the surface side. The adsorption pad releases adsorption and descends.

The conveyance device 15 moves on the holding table 5 and transfers the wafer W to the support pins 50 protruding from the holding table 5 with the surface having the protective tape facing downward. Deliver. When the pin 50 receives the wafer W, it descends.

When the holding table 5 and the frame holding part 51 adsorb the wafer W, and the frame holding part 51 adsorbs and holds the ring frame f, the lower housing 11A holds the rail 58 Accordingly, it moves to the tape attaching mechanism 82 side.

Step S2 (formation of chamber)

As shown in Fig. 16, when the lower housing 11A reaches the tape attaching position of the tape attaching mechanism 82, the attaching roller 109 descends, and as shown in Fig. 17, on the adhesive tape DT. The adhesive tape DT is affixed over the top of the ring frame f and the lower housing 11A while rolling. In conjunction with the movement of the affixing roller 109, a predetermined amount of the adhesive tape DT is peeled from the separator S from the tape supply unit 71 and is fed out.

When the bonding of the adhesive tape DT to the ring frame f is completed, as shown in Fig. 18, the upper housing 11B is lowered. With this lowering, the adhesive tape DT with the adhesive surface exposed between the outer circumference of the wafer W and the inner diameter of the ring frame f is sandwiched between the upper housing 11B and the lower housing 11A. Thus, the chamber 11 is configured.

At this time, while the adhesive tape DT functions as a sealing material, the chamber 11 is divided into two spaces by the adhesive tape DT. That is, it is divided into a lower space H1 on the side of the lower housing 11B and an upper space H2 on the side of the upper housing 11B with the adhesive tape DT interposed therebetween. The wafer W located in the lower housing 11A is closely opposed to the adhesive tape DT with a predetermined clearance.

Step S3 (deformation of sheet material)

After forming the chamber 11, a process of deforming the adhesive tape DT into a predetermined shape according to the shape of the inner side of the annular convex portion Ka of the wafer W is started. The control unit 102 operates the vacuum device 95 with the solenoid valves 97, 98, and 100 shown in FIG. 12 closed to reduce the atmospheric pressure in the lower space H1 and the atmospheric pressure in the upper space H2. Reduce pressure. At this time, the opening degree of the solenoid valve 96 is adjusted so that the lower space H1 and the upper space H2 are depressurized at the same speed.

When the lower space H1 and the upper space H2 are reduced to a predetermined atmospheric pressure, the control unit 102 closes the solenoid valve 96 and stops the operation of the vacuum device 95. In addition, the control unit 102 adjusts the opening degrees of the solenoid valves 96, 97, 98, and 100 so that the air pressure of the lower space H1 is higher than the atmospheric pressure of the upper space H2.

When the atmospheric pressure of the lower space H1 becomes higher than the atmospheric pressure of the upper space H2, as shown in FIG. 19, a differential pressure Fa is generated between the two spaces. Then, by the differential pressure Fa, the adhesive tape DT is deformed so as to move away from the wafer W, and abuts against the convex portion 63b of the press table 63 through the layer of the non-adhesive base material Ta. The adhesive tape DT is further pressed upward by the differential pressure Fa, and is deformed into a shape along the outer shape of the convex portion 63. That is, the adhesive tape DT is deformed in advance into a shape substantially the same as the shape of the inner side of the annular convex portion Ka.

Step S4 (Adhesion of sheet material)

After the adhesive tape DT is deformed, a step of attaching the deformed adhesive tape DT to the wafer W is started. First, the holding table 5 and the press table 63 are made relatively close. In Example 1, as shown in Fig. 20, the holding table 5 is raised to a height at which the upper surface of the annular convex portion Ka and the upper surface of the ring frame f become flat, and the press table 63 Descend. Then, the holding table 5 and the press table 63 are stopped while the adhesive tape DT in the deformed state and the back surface of the wafer W are in close proximity. At this time, the distance between the adhesive tape DT and the back surface of the wafer W is, for example, about 50 µm to 500 µm.

After the adhesive tape DT and the wafer W are brought close, the adhesive tape DT is affixed to the wafer W by differential pressure. That is, the control unit 102 operates the vacuum device 95 to reduce the pressure in the lower space H1 and the atmospheric pressure in the upper space H2. At this time, the solenoid valve 96 is opened so that the lower space H1 and the upper space H2 are depressurized at the same speed while maintaining a state in which the air pressure of the lower space H1 is higher than that of the upper space H2. Adjust the degree.

When the air pressure in the lower space H1 is reduced to a predetermined atmospheric pressure, the control unit 102 closes the solenoid valve 96 and stops the operation of the vacuum device 95. Further, the control unit 102 gradually increases the upper space H2 to a predetermined atmospheric pressure while adjusting the opening degree of the solenoid valve 100 to leak, and makes it higher than the atmospheric pressure of the lower space H1.

When the atmospheric pressure of the upper space H2 becomes higher than the atmospheric pressure of the lower space H1, as shown in FIG. 21, a differential pressure Fb is generated between the two spaces. Then, the adhesive tape DT is separated from the press table 63 by the differential pressure Fb while maintaining the deformed state, and is affixed to the back surface of the wafer W. That is, the adhesive tape DT is affixed over the entire back surface of the wafer W in a state in which the overall tension is substantially uniform. At this time, the air between the wafer W and the adhesive tape DT, including the inner corners Kf of the annular convex portion Ka, is discharged, and the adhesive tape DT is removed from the wafer ( Adhered to W).

At this time, a portion of the holding table 5 and the press table 63 close to the inner corner Kf is heated in advance by the heater 107 and the heater 64. Therefore, the adhesive tape DT at the portion affixed to the inner corner portion Kf is heated by the residual heat of the holding table 5 and the press table 63. As a result, the adhesive material of the adhesive tape DT at the portion affixed to the inner corner portion Hf becomes soft and is easily deformed. Therefore, the adhesive tape DT of the portion attached to the inner corner Hf can be brought into close contact with the wafer W, while the adhesive tape DT attached to the center of the rear surface of the wafer W does not extend. , Wrinkles, etc. can be prevented from occurring.

When the atmospheric pressure of the upper space H2 reaches a preset atmospheric pressure, the control unit 102 adjusts the opening degree of the electromagnetic valve 98 to make the atmospheric pressure of the lower space H1 equal to the atmospheric pressure of the upper space H2. do. Thereafter, as shown in Fig. 23, the control unit 102 raises the upper housing 11B to open the inside of the upper housing 11B to the atmosphere, and completely opens the solenoid valve 98 to the lower housing. The (11A) side is also open to the atmosphere.

Step S5 (cutting of sheet material)

Further, while the adhesive tape DT is affixed to the wafer W in the chamber 11, the tape cutting mechanism 82 is operated. At this time, as shown in Figs. 21 and 22, while the cutter 122 cuts the adhesive tape DT affixed to the ring frame f into the shape of the ring frame f, the pressing roller 124 Follows the cutter 122 and presses the tape cut portion on the ring frame f while rolling. That is, when the upper housing 11B descends and constitutes the chamber 11 by the lower housing 11A, as shown in Fig. 21, the cutter 122 and the pressing roller 124 of the tape cutting mechanism 82 ) Has also reached the cutting action position.

When the upper housing 11B is raised, the sticking of the adhesive tape DT to the wafer W and the cutting of the adhesive tape DT have been completed, so the pinch roller 115 is raised to nip the adhesive tape DT. Release. Thereafter, the nip roller 115 is moved to wind up the cut-off unnecessary adhesive tape DT toward the tape recovery unit 74 and recover, and a predetermined amount of the adhesive tape DT is removed from the tape supply unit 71. To feed.

Step S6 (recovery of work)

When the peeling of the adhesive tape DT is completed and the nip roller 115 and the affixing roller 109 return to their initial positions, as shown in Fig. 23, the ring frame f and the adhesive tape DT on the back surface. While holding the mount frame MF to which is adhered, the lower housing 11A moves to the carrying out position on the side of the rectangular part A.

The mount frame MF which has reached the carrying out position is conveyed to the frame collecting unit 3 by the frame conveying device 16.

As described above, the one-step operation of mounting the wafer W on the ring frame f through the adhesive tape DT is ended. Thereafter, the above process is repeated until the mount frame MF reaches a predetermined number.

<Effects by the configuration of Example 1>

According to the apparatus according to the first embodiment, a sheet material using the adhesive tape DT as an example can be adhered to the wafer W having the annular convex portion with high precision. Here, the effect of the configuration of the first embodiment will be described while comparing with the conventional configuration.

In a conventional affixing apparatus, differential pressure Fc is generated in the state where the adhesive tape DT is flat, and the adhesive tape DT is affixed to the wafer W. In this case, as shown in Fig. 24A, the adhesive tape DT is affixed to the central portion M1 of the wafer W. Then, as shown in Fig. 24B, while concave and curved, it is radially affixed toward the outer circumference from the central portion M1 of the wafer W, and finally, the inner corner Kf of the annular convex portion Ka. The adhesive tape DT is affixed on.

When the adhesive tape DT is affixed to the wafer W having the annular convex portion using such a conventional attaching device, there is a problem that the adhesive tape DT is particularly peeled off at the inner corner of the annular convex portion over time. I am concerned. As a result of repeated intensive examination on this problem, the following knowledge was obtained.

That is, in the conventional affixing apparatus, as the affixing process by differential pressure proceeds, the portion of the adhesive tape DT that can be concave and curved gradually narrows. That is, as shown in Fig. 24A, when the adhesive tape DT is affixed to the central portion M1, the portion of the adhesive tape DT that can be concave and curved is wide. Therefore, the adhesive tape DT can be affixed to the central portion M1 by slightly elongating the adhesive tape DT by applying a relatively small tension P1, so the elongation rate of the portion of the adhesive tape DT that is affixed to the central portion M1 Is relatively low, and the accumulated tensile stress is also weak.

On the other hand, at the time when the sticking process is advanced and the adhesive tape DT is affixed to the inner corner Kf of the annular convex portion, as shown in FIG. 24B, the adhesive tape ( DT) is affixed. Therefore, since the portion of the adhesive tape DT that can be concave and curved is very narrow, it is necessary to apply a relatively large tension P2 to greatly elongate the adhesive tape DT. Accordingly, the elongation rate of the portion of the adhesive tape DT adhered to the inner corner portion Kf of the annular convex portion is relatively high, and as a result, the accumulated tensile stress is also strong.

That is, in the apparatus for attaching the adhesive tape DT according to the conventional configuration, the tension acting on the adhesive tape DT is non-uniform, and the elongation rate of the adhesive tape DT varies greatly depending on the portion to be affixed to the wafer W. New knowledge was obtained. In other words, the elongation rate of the portion of the adhesive tape DT that is affixed to the wafer W that is affixed to the inner corner Kf is particularly large, so if time passes after the adhesive tape DT is affixed to the wafer W , It is considered that a problem that the adhesive tape DT peels again from the portion of the inner corner portion Kf due to the accumulated strong tensile stress occurs.

On the other hand, in the sheet material attaching apparatus R1 according to Example 1, the adhesive tape DT is previously deformed according to the shape of the affixed portion of the wafer W, and the adhesive tape DT is maintained in the state of being deformed. Is affixed to the wafer W. That is, as shown in Fig. 19, the adhesive tape DT is brought into contact with the press table 63 having a shape along the inside of the annular convex portion Ka of the wafer W as the affixed portion, and the adhesive tape ( DT) is transformed into an approximately uniform tension.

In addition, since the adhesive tape DT is attached to the wafer W while maintaining the deformed state with an approximately uniform tension, the tensile stress accumulated in the adhesive tape DT at the portion attached to the inner corner Kf of the annular convex portion Becomes smaller. Therefore, the occurrence of a situation that the adhesive tape DT is peeled off from the inner corner portion Kf is prevented, and the adhesive tape DT is closely adhered to the wafer W having the annular convex portion Ka. It becomes possible.

[Example 2]

Next, Example 2 of the present invention will be described. In Example 1, the configuration of attaching the adhesive tape DT to the wafer W under reduced pressure using the chamber 11 was described as an example. In Example 2, a configuration in which the chamber 11 is omitted and the adhesive tape DT is affixed to the wafer W under atmospheric pressure will be described as an example. In addition, for the same configuration as the sheet material sticking apparatus R1 according to the first embodiment, the same number is given, and the tape sticking portion 73, which is another configuration part, will be described in detail.

The tape affixing portion 73 according to Example 1 is provided with a chamber 11 and a press table 63, while the tape affixing portion 73A according to Example 2 is a chamber 11 and a vacuum device 95 While is omitted, a press table 66, a pressing member 67, and a vacuum device 68 are provided as shown in FIGS. 25A and 25B. The press table 66 includes a flat base portion 66a, a convex portion 66b, an O-ring 66c, and a suction hole 66d.

The convex portion 66b is provided on the lower surface of the central portion of the base portion 66a. Like the convex portion 63b, the convex portion 66b has a predetermined shape corresponding to the inner shape of the annular convex portion Ka of the wafer W. Therefore, by bringing the adhesive tape DT into contact with the press table 66, the adhesive tape DT has the shape of the inner side of the annular convex portion Ka (in other words, the shape of the region affixed to the wafer W). It is transformed into approximately the same shape as

The O-ring 66c is an annular packing having a circular cross section (O shape), and is disposed on the lower surface of the outer peripheral portion of the base portion 66a. The thickness of the O-ring 66c is configured to be smaller than the height of the convex portion 66b. A space between the press table 66 and the adhesive tape DT in the side circumference of the convex portion 66b by the pressing member 67 described later abutting the O-ring 66c through the adhesive tape DT. It is configured to be in this sealed state. A plurality of suction holes 66d are formed on a lower surface of the base portion 66a and a side surface of the convex portion 66b inside the O-ring 66c. The suction hole 66d is connected to the vacuum device 68 through a flow path formed inside the press table 66.

The pressing member 67 is disposed below the O-ring 66c, and has an annular shape similar to that of the O-ring 66c in plan view. The pressing member 67 can be moved up and down by a drive mechanism (not shown), and is configured so that it can come into contact with the O-ring 66c by rising. The vacuum device 68 is configured to depressurize the space between the press table 66 and the adhesive tape DT formed by abutting the O-ring 66c and the pressing member 67. The operation of the vacuum device 68 is controlled by the control unit 102.

Further, the tape affixing portion 73A does not have the chamber 11, but has a frame holding portion 51A for mounting the ring frame f. The frame holding part 51A is arrange|positioned at the position surrounding the holding table 5 from the outside.

<Summary of operation according to Example 2>

Here, the operation of the sheet material attaching apparatus R2 according to the second embodiment will be described. 14B is a flowchart illustrating a step of affixing the adhesive tape DT to the wafer W using the sheet material attaching device R2. Here, the description of the common points between the process according to the first embodiment and the process according to the second embodiment is simplified, and the differences are mainly described.

Step S1 (Supply of work)

When an affixing command is issued, the heater 64 and the heater 107 are operated. Then, the ring frame f is transported from the frame supply unit 6 to the frame holding unit 51, and the wafer W is transported from the container 2 to the holding table 5. When the holding table 5 adsorbs the wafer W, and the frame holder 51 adsorbs and holds the ring frame f, the holding table 5 follows the rail 58 and the tape attaching mechanism 82 Move to) side. The tape affixing part 73A after moving the holding table 5 is as shown in FIG.

Step S2 (deformation of sheet material)

After the holding table 5 is moved, the adhesive tape DT is deformed into a predetermined shape corresponding to the inner shape of the annular convex portion Ka of the wafer W. That is, by raising the pressing member 67, the adhesive tape DT rises together with the pressing member 67, and abuts against the convex portion 66b of the press table 66 through the non-adhesive substrate Ta. By the contact, the adhesive tape DT is deformed according to the shape of the convex portion 66b.

Thereafter, by further raising the pressing member 67, as shown in Fig. 27, the pressing member 67 abuts the O-ring 66c via the adhesive tape DT. When the pressing member 67 abuts on the O-ring 66c, a closed space H3 is formed between the O-ring 66c and the adhesive tape DT at the side circumference of the convex portion 66b.

After the enclosed space H3 is formed, the control unit 102 operates the vacuum device 68 as shown in FIG. 28. By the operation of the vacuum device 68, the air inside the sealed space H3 is discharged through the suction hole 66d, and the sealed space H3 is crushed. As a result, the adhesive tape DT is deformed so as to be in close contact along the outer shape of the press table 66 in a state in which the tension is substantially uniform. That is, the adhesive tape DT is deformed in advance into a shape substantially the same as the shape of the inner side of the annular convex portion Ka.

In the second embodiment, since the suction hole 68d is not formed on the bottom surface of the convex portion 66b, the flatness of the bottom surface of the convex portion 66b can be improved. The pressure-sensitive adhesive tape DT at a portion that is deformed by contacting the bottom surface of the convex portion 66b is affixed to the flat concave portion He of the wafer W in a subsequent step. That is, by increasing the flatness on the bottom surface of the convex portion 66b, the flatness of the adhesive tape DT at the portion affixed to the flat concave portion He is improved. The thin flat concave portion He is a portion that is easily affected by the flatness of the adhesive tape DT to be adhered. Therefore, the adhesion precision of the adhesive tape DT in the flat recessed part He can be improved.

Step S3 (Adhesion of sheet material)

After the adhesive tape DT is deformed, a step of attaching the deformed adhesive tape DT to the wafer W is started. First, the holding table 5 is raised to a predetermined position where the upper surface of the annular convex portion Ka is higher than the upper surface of the ring frame f. After raising the holding table 5, as shown in Fig. 29, the press table 66 is lowered together with the pressing member 67, and the adhesive tape DT and the back surface of the wafer W in a deformed state Contact. The adhesive tape DT is affixed to the wafer W by this contact.

After the adhesive tape DT is affixed to the wafer W, the control unit 102 stops the operation of the vacuum device 68. When the vacuum device 68 is stopped, the adsorption holding force of the press table 66 to the adhesive tape DT is reduced. Since the adhesive tape DT was in contact with the press table 66 through the non-adhesive surface, the adhesive tape DT is separated from the press table 66 by the stop of the vacuum device 68, and the wafer W Will be in close contact with. After that, the press table 66 is raised and separated from the holding table 5.

Step S4 (Manufacturing of Mount Frame)

After the adhesive tape DT is affixed to the wafer W, the mounting frame MF is manufactured by affixing the adhesive tape DT to the ring frame f. That is, the holding table 5 is lowered to a predetermined position where the upper surface of the annular convex portion Ka is slightly lower than the upper surface of the ring frame f.

After lowering the holding table 5, the affixing roller 109 descends, and as shown in FIG. 30, the adhesive tape DT is applied to the ring frame f while rolling over the adhesive tape DT. Attach it. By the rolling movement of the sticking roller 109, the wafer W and the ring frame f are connected through an adhesive tape DT to form a mount frame MF. Further, in association with the movement of the sticking roller 109, the adhesive tape DT of a predetermined amount is peeled from the separator S from the tape supply unit 71 and is fed out.

Step S5 (cutting of sheet material)

After the adhesive tape DT is affixed to the ring frame f, the tape cutting mechanism 82 is operated. That is, the cutter 122 cuts the adhesive tape DT affixed to the ring frame f into the shape of the ring frame f, and the pressing roller 124 follows the cutter 122 to follow the ring frame ( f) Press the upper tape cutting area while rolling. Thereafter, the nip roller 115 is moved to wind up the cut-off unnecessary adhesive tape DT toward the tape recovery unit 74 and recover, and a predetermined amount of the adhesive tape DT is removed from the tape supply unit 71. To feed.

Step S6 (recovery of work)

When peeling of the adhesive tape DT is completed and the nip roller 115 and the affixing roller 109 return to their initial positions, the ring frame f and the mount frame MF on which the adhesive tape DT is adhered to the rear surface While holding ), the holding table 5 moves to the carrying out position on the rectangular part A side.

The mount frame MF which has reached the carrying out position is conveyed to the frame collecting unit 3 by the frame conveying device 16. As described above, the one-step operation of mounting the wafer W on the ring frame f through the adhesive tape DT is ended, and the above processing is repeated until the mounting frame MF reaches a predetermined number.

According to the apparatus according to Example 2, as in Example 1, the adhesive tape DT was previously deformed according to the shape of the affixed portion of the wafer W, and the adhesive tape DT was transferred to the wafer while maintaining the deformed state. Attach to (W). That is, since the adhesive tape DT is attached to the wafer W in the state of being deformed with an approximately uniform tension, the tension of the adhesive tape DT at the portion attached to the inner corner Kf of the annular convex portion Ka Is reduced. As a result, the adhesive tape DT of this part can adhere to the inner corner part Kf of the wafer W with high precision even if time elapses.

In addition, embodiment disclosed this time is an illustration in all points, and is not restrictive. The scope of the present invention is disclosed by the claims rather than the description of the above-described embodiments, and includes the meaning of the claims and the equivalents, and all changes (modifications) within the scope. As an example, the present invention can be modified as follows.

(1) In step S3 according to Example 1, the configuration of deforming the adhesive tape DT by the differential pressure Fa was illustrated, but the method of deforming the adhesive tape DT is not limited to the configuration generating the differential pressure Fa. . As another example of the method of deforming the adhesive tape DT, as shown in Fig. 31, after the chamber 11 is formed, the press table 63 is lowered to press the adhesive tape DT from above to press the adhesive tape DT. DT) is deformed according to the shape of the press table 63.

In the case of this modification, the pressure-sensitive adhesive tape DT is deformed by lowering the press table 63 to a predetermined position, and then the press table 63 is further lowered to bring the adhesive tape DT closer to the wafer W. , Attach. Similarly, in Example 2, the press table 66 deformed the adhesive tape DT by adsorbing the adhesive tape DT through the suction hole 66d, but is not limited thereto, and the press table 63 is lowered. Then, the adhesive tape DT may be deformed by pressing the adhesive tape DT from above.

(2) In each embodiment, the convex portion 63b of the press table 63 has a cylindrical shape having a uniform diameter from the upper surface to the bottom surface, but the shape of the convex portion 63b is appropriately deformed. do. As an example, the convex portion 63b has a configuration in which the tip is tapered from the bottom to the top, as shown in Fig. 32A.

When the pressure-sensitive adhesive tape DT is deformed using the press table 63 according to this modification, as shown in Fig. 32(a), it is compared with the length L1 as viewed from the cross section of the affixed surface of the wafer W. Thus, the length L2 of the adhesive tape DT at the portion abutting the affixed surface of the wafer W becomes longer. Specifically, the length L1 is the length from one end (C1) to the other end (C2) of the affixed surface of the wafer W in cross section. And if the portion of the adhesive tape DT that faces one end (C1) and the portion of the adhesive tape DT that faces close to the other end (C2) is D2, the length from D1 to D2 is equivalent to the length L2. do.

By configuring the press table 63 so that the length L2 is longer than the length L1, the excess portion Tm for reducing the tension of the adhesive tape DT can be formed when the adhesive tape DT is affixed to the wafer W. I can. In other words, the convex portion 63b is tapered, so that the depression portion Vc is formed in the press table 63. Then, the excess portion Tm is formed in the adhesive tape DT by making the adhesive tape DT follow the depression. The surplus portion Tm corresponds to, as an example, the adhesive tape DT at a portion surrounded by a dotted line in Fig. 32C.

The effect of reducing the tension of the adhesive tape DT by the excess portion Tm will be described using Figs. 32C and 32D. 32(c) and 32(d) are enlarged views of the left end in FIG. 32(b). Fig. 32(c) is a diagram showing a state in which the press table 63 with the adhesive tape DT abuts is brought close to the wafer W, and Fig. 32(d) is the adhesive tape DT Is a diagram showing a state in which is separated from the press table 63 and affixed to the wafer W.

As shown in Fig. 32C, the length of the excess portion Tm is longer than the height of the annular convex portion Ka of the wafer W. Therefore, when the adhesive tape DT is separated from the press table 63 and affixed to the wafer W, the adhesive tape DT in the excess portion Tm is separated from the depression Vc, thereby There is room for a short reduction in whether or not (Tm).

When the adhesive tape DT is brought into contact with the press table 63 to deform the adhesive tape DT, tension is generated substantially uniformly with respect to the adhesive tape DT. However, by making the excess portion Tm, the excess portion Tm tries to return to its original length when the adhesive tape DT is separated from the press table 63, thereby reducing the tension and reducing the adhesive tape DT. ) Can be affixed to the wafer W. Therefore, since the tension accumulated in the adhesive tape DT attached to the wafer W can be further reduced, the adhesive tape DT more reliably prevents the adhesive tape DT from peeling off from the wafer W over time. can do.

Further, the shape of the press table 63 for forming the excess portion Tm by making the length L2 longer than the length L1 is not limited to the tapered shape. As an example, a part of the convex portion 63b may be tapered as shown in FIG. 32(e), and a hemispherical concave portion on the side surface of the convex portion 63b as shown in FIG. 32(f) It may be formed as a depression (Vc).

In addition, the concave portion Vc is not limited to the configuration provided in the convex portion 63b, and may be provided in the base portion 63a as shown in FIG. 32G. Specifically, when the adhesive tape DT is affixed to the wafer W by providing a depression Vc inside the base portion 63a than the portion facing the annular convex portion Ka, the adhesive tape DT Can reduce the tension of. In addition, the shape of the depression Vc can be appropriately changed, such as a V-shape and a U-shape. Further, it is not limited to the press table 63 according to the first embodiment, and the above-described modified example can also be applied to the press table 66 according to the second embodiment.

(3) In each of the embodiments, as an example of the sheet material for affixing to the wafer W, the adhesive tape DT for support has been described as an example, but the sheet material is not limited thereto, and the adhesive tape for circuit protection ( An adhesive tape used for other uses, such as a protective tape), may be used. In the present invention, as the sheet material, a sheet, tape, film, etc., which has an adhesive material having adhesive force or an adhesive material having adhesive force, can be applied.

In addition, the structure of the sheet material is not limited to the structure in which the adhesive material Tb is laminated on one side of the substrate Ta shown in FIG. 3, and a laminated structure of an adhesive material and a substrate may be used. Further, in addition to a single-layer structure of an adhesive material or an adhesive material without a substrate, a structure including an adhesive material or an adhesive material on both surfaces of the substrate Ta may be mentioned as a suitable example. When the adhesive material is provided on both sides, a non-adhesive separator (S) is provided on the outside of each adhesive material layer, and the adhesive tape (DT) is brought into contact with the press table 63 or 66 through the non-adhesive separator (S). It is desirable to do. It is preferable that the said non-adhesive separator (S) has elasticity. By having elasticity, the separator S can be suitably deformed along the outer shape of the press table 63 when it comes into contact with the press table 63.

(4) In each of the examples, a circular wafer W is illustrated in plan view as a work to be affixed to the sheet material, but the shape and material of the work are not limited thereto. In the configuration according to the present embodiment, various semiconductor members, such as a substrate, a panel, and a wafer, can be applied as a work. Further, as the shape of the work, in addition to a circular shape, a rectangular shape, a polygonal shape, a substantially circular shape, etc. may be used.

(5) In each of the embodiments, at least one of the heater 64 and the heater 107 may be omitted. In addition, the heater 64 and the heater 107 are not limited to the annular configuration, and may be flat as an example. That is, it may be a configuration that heats the entire wafer W or the adhesive tape DT. The positions where the heater 64 and the heater 107 are disposed can be appropriately changed as long as the wafer W or the protective tape PT is heated.

(6) In each of the Examples, a wafer W with a flat bottom surface inside the annular convex portion was described as an example using a so-called TAIKO (registered trademark) wafer as an example, but the shape of the wafer W is It is not limited to this. That is, as shown in FIG. 33A, the wafer W in which the inside of the annular convex portion Ka of the wafer W is curved may be used as a work. Further, as shown in Fig. 33B, the inner corner portion Kf of the annular convex portion Ka may be rounded. In addition, it is not limited to the configuration in which the inner corner part Kf is at a right angle as viewed in a longitudinal section, and may be an obtuse angle as an example. Further, as shown in Fig. 33C, a plurality of steps may be formed inside the annular convex portion Ka.

(7) In each of the examples, a configuration in which an annular convex portion is formed on the back surface of the wafer W, and the adhesive tape DT is affixed to the back surface is illustrated, but is not limited thereto. With respect to a work having an annular convex portion on at least one surface, the configuration can be appropriately changed as long as it is a configuration in which a sheet material such as an adhesive tape DT is attached to the formation surface of the annular convex portion. As an example, the wafer W having the annular convex portion formed on the surface side may be used as a work, and the sheet material may be affixed to the surface of the wafer W. In addition, it is not limited to a configuration in which a wafer (W) having circuits formed on the surface is used as a work, and a wafer (W) having circuits formed on the back surface may be used. You may do it.

1: sheet material attaching device
5: holding table
6: frame supply
10: attaching unit
11: chamber
61: cylinder
63: press table
63a: base portion
63b: convex portion
64: heater
67: pressing member
68: vacuum device
81: tape attaching mechanism
82: tape cutting mechanism
95: vacuum device
102: control unit
W: semiconductor wafer
f: ring frame
DT: Adhesive tape
PT: protection tape
Ka: annular convex
Vc: depression

Claims (14)

It is a sheet material affixing method in which a sheet material is affixed to the annular convex part forming surface of a work having an annular convex part on the outer periphery of one side,
A deformation process of deforming the sheet material into a predetermined shape according to the inner shape of the annular convex portion,
Attaching the sheet material in a state deformed to the predetermined shape by the deformation process to the work
A method for attaching a sheet material, characterized in that it comprises. The method of claim 1,
In the deformation process, the sheet material is transformed into the predetermined shape so that an approximately uniform tension is applied over the entire sheet material.
A method of attaching a sheet material, characterized in that. The method of claim 1,
In the deformation process, the sheet material is transformed into the predetermined shape by bringing the sheet material into contact with the convex member.
A method of attaching a sheet material, characterized in that. The method of claim 3,
The deformation process, in contact with the sheet material and the convex member in a non-adhesive state
A method of attaching a sheet material, characterized in that. The method of claim 3,
The deformation process is to decompress the space between the sheet material and the convex member
A method of attaching a sheet material, characterized in that. The method of claim 3,
A depression is formed in the convex member,
In the attaching process, by separating the sheet material deformed along the recessed part from the recessed part, the sheet material is adhered to the work while reducing the tension acting on the sheet material.
A method of attaching a sheet material, characterized in that. The method according to any one of claims 1 to 6,
Inserting the sheet material between the upper chamber and the lower chamber, the lower space in which the work is disposed with the annular convex portion forming surface upward, and the upper space facing the lower space through the sheet material A chamber formation process for forming a partitioned chamber,
A proximity process of relatively approaching the sheet material in a state deformed into the predetermined shape by the deformation process
Equipped,
In the affixing process, the sheet material deformed into the predetermined shape is relatively close to the work, and the pressure difference formed between the upper space and the lower space in the chamber partitioned by the sheet material Attaching the sheet material to the annular convex portion forming surface of the work
A method of attaching a sheet material, characterized in that. It is a sheet material affixing device for attaching a sheet material to the annular convex portion forming surface of a work having an annular convex portion on the outer periphery of one side,
A deformation mechanism for deforming the sheet material into a predetermined shape corresponding to the inner shape of the annular convex portion;
An attaching mechanism for attaching the sheet material in a state deformed to the predetermined shape by the deformation mechanism to the work.
A sheet material attaching device, characterized in that it comprises. The method of claim 8,
The deformation mechanism deforms the sheet member into the predetermined shape so that an approximately uniform tension acts over the entire sheet member.
A sheet material attaching device, characterized in that. The method of claim 8,
The deformation mechanism causes the sheet member to come into contact with the convex member to deform the sheet member into the predetermined shape.
A sheet material attaching device, characterized in that. The method of claim 10,
The deformation mechanism makes the sheet member and the convex member contact in a non-adhesive state.
A sheet material attaching device, characterized in that. The method of claim 10,
The deformation mechanism decompresses the space between the sheet member and the convex member
A sheet material attaching device, characterized in that. The method of claim 10,
The convex member has a depression,
The attaching mechanism attaches the sheet material to the work while reducing tension acting on the sheet material by separating the sheet material deformed along the recessed portion from the recessed portion.
A sheet material attaching device, characterized in that. The method according to any one of claims 8 to 13,
Inserting the sheet material between the upper chamber and the lower chamber, the lower space in which the work is disposed with the annular convex portion forming surface upward, and the upper space facing the lower space through the sheet material A chamber formed by partitioning,
A proximity mechanism for relatively approaching the sheet member in a state deformed into the predetermined shape by the deformation mechanism to the work.
Equipped,
The affixing mechanism, in a state in which the sheet material deformed into the predetermined shape is relatively close to the work, by a differential pressure formed between the upper space and the lower space in the chamber partitioned by the sheet material. Attaching the sheet material to the annular convex portion forming surface of the work
A sheet material attaching device, characterized in that.

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