KR20210122132A - Device sealing method, device sealing apparatus, and manufacturing method of semiconductor products - Google Patents

Abstract

A device sealing method, a device sealing apparatus, and a method of manufacturing semiconductor products are provided that can seal a device with high precision and facilitate the handling of a workpiece and a sealing material in a sealing process. The method includes the steps of: a first sealing process of covering an LED (11) with a sealing sheet (S) by accommodating a substrate (10) having the LED (11) and the sealing sheet (S) in a chamber (29) and allowing the sealing sheet (S) in a state in which the pressure of the internal space of the chamber (29) is reduced, to be in contact with the surface of the substrate (10) having the LED (11); and a second sealing process of sealing the LED (11) with the sealing sheet (S) by increasing the pressure of the internal space of the chamber (29) after the first sealing process.

Description

DEVICE SEALING METHOD, DEVICE SEALING APPARATUS, AND MANUFACTURING METHOD OF SEMICONDUCTOR PRODUCTS

The present invention relates to a device encapsulation method, device encapsulation apparatus, and semiconductor for encapsulating a semiconductor wafer (hereinafter, appropriately referred to as "wafer") or a device exemplified by a semiconductor chip or electronic component mounted on a workpiece eg a substrate. It relates to a method of manufacturing a product.

In the manufacturing process of electronic products using a BGA (Ball grid array) package as an example, a device such as a semiconductor chip mounted on the surface of a workpiece such as a wafer or a substrate is sealed with a sealing material such as a resin composition. A packaging process is performed. As an example of the conventional sealing method, the method of sealing a device by pouring liquid resin into the inside of the metal mold|die in which the workpiece|work in which the device is mounted is arrange|positioned, thermosetting resin, etc. are mentioned (for example, patent document 1) see).

Japanese Patent Laid-Open No. 2017-087551

However, the conventional apparatus has the following problems.

In the conventional sealing method using liquid resin, the flatness of the resin sealing the periphery of the device in the sealed state is low. The problem of reducing the precision of an electronic product arises because the said flatness is low. In order to avoid a decrease in the precision of the electronic product, a process of forming the surface of the packaged electronic product or the like is required, thereby reducing the manufacturing efficiency of the electronic product. Moreover, compared with resin in a solid state, the problem that handling in each process is difficult is also concerned about resin in a liquid state.

The present invention has been made in view of such circumstances, and provides a device sealing method, a device sealing apparatus, and a semiconductor product manufacturing method in which a device is sealed with high precision and handling of a workpiece and a sealing material in the sealing process is facilitated. Its main purpose is to provide

The present invention takes the following configuration in order to achieve the above object.

That is, in the device sealing method according to the present invention, a work on which a device is mounted and a sheet-shaped sealing material are accommodated in a chamber, and the sheet-shaped sealing material is brought into contact with the device mounting surface of the work in a state in which the internal space of the chamber is decompressed. a first sealing process of covering the device with the sheet-like sealing material by doing so, and a second sealing process of sealing the device with the sheet-like sealing material by increasing the pressure of the internal space of the chamber after the first sealing process; it is characterized by

(Operation/Effect) According to this structure, a device is sealed using the sheet-like sealing material previously made into the flat sheet shape. Therefore, in the state in which the sealing of the device is completed, the flatness of the sheet-like sealing material which sealed the device can be improved.

In addition, in the first sealing process, the inside of the lower space in which the work is disposed is decompressed inside the chamber. That is, since the peripheral space of the device mounted on the work is exhausted by reduced pressure, it is possible to prevent gas from entraining between the sheet-like sealing material and the device when the sheet-like sealing material covers the device. Accordingly, it is possible to avoid a decrease in the adhesion force due to entrainment of the gas.

Further, in the second sealing process, the device is sealed with a sheet-like sealing material by increasing the pressure in the internal space of the chamber. In this case, the pressing force can be uniformly applied over the entire sheet-shaped sealing material by pressing the internal space. Accordingly, it is possible to reliably avoid the occurrence of irregularities on the surface of the sheet-like sealing material due to the bias of the force acting on the sheet-like sealing material, so that the flatness of the sheet-like sealing material in a state in which the device is sealed can be improved more reliably.

In a 2nd sealing process, the atmospheric pressure of the internal space in a 2nd sealing process can be arbitrarily adjusted by pressurizing an internal space suitably. Therefore, since a sufficiently large pressing force can be applied to the sheet-like sealing material, the sheet-like sealing material can be reliably filled in the gaps between devices. Therefore, the device can be sealed with higher precision.

Further, in the above invention, in the first sealing step, it is preferable to make the sheet-shaped sealing material contact the device mounting surface of the work by deforming the sheet-like sealing material in a convex shape toward the device mounting surface of the work. .

(Operation/Effect) According to this configuration, since the sheet-like sealing material is deformed in a convex shape toward the device mounting surface of the work, the sheet-like sealing material can be brought into contact with the device mounting surface of the work so as to spread radially from one point. Therefore, when a sheet-like sealing material is made to contact a device, it can avoid entrapment of a bubble.

In addition, in the above-described invention, in the second sealing process, it is preferable to increase the pressure of the internal space of the chamber to a pressure equal to or higher than atmospheric pressure. In this case, a relatively large pressing force can be applied between the sheet-like sealing material and the device, so that the device can be more precisely sealed with the sheet-like sealing material.

Further, in the above invention, the sheet-like sealing material is held by a long conveyance sheet, the chamber has an upper housing and a lower housing, and the first sealing process is performed by the upper housing and the lower housing. Interposed between the inner space of the chamber by sandwiching the transport sheet, the lower space in which the workpiece with the device mounting surface facing upward, and the sheet-like sealing material held by the transport sheet is interposed. After the upper and lower space forming process of dividing the upper space into the upper space facing the lower space, the upper and lower space decompression process of decompressing the upper space and the lower space, and the upper and lower space decompression process, the pressure of the upper space is The sheet-like sealing material is deformed in a convex shape toward the device mounting surface by the differential pressure generated between the upper space and the lower space by making it higher than the pressure in the lower space, and the sheet-shaped sealing material is applied to the device mounting surface of the work. It is preferred to have a contact process for contacting.

(Operation/Effect) According to this configuration, in the first sealing process, the sheet-shaped sealing material is applied to the workpiece by using the differential pressure generated by depressurizing the upper space and the lower space and making the pressure in the upper space higher than the pressure in the lower space. Make contact with the device mounting surface. That is, since the sheet-like sealing material contacts the device in a state in which the lower space is evacuated by the reduced pressure, entrainment of air bubbles between the sheet-like sealing material and the device at the time of sealing can be more reliably avoided. In addition, since the differential pressure acts uniformly over the entire sheet-like sealing material, it is possible to avoid a situation in which damage to the workpiece or damage to the device occurs due to the bias of the applied force.

Further, in the above invention, the sheet-like sealing material is held by a long conveyance sheet, the chamber has an upper housing and a lower housing, and the first sealing process is performed by the upper housing and the lower housing. Interposed between the inner space of the chamber by sandwiching the transport sheet, the lower space in which the workpiece with the device mounting surface facing upward, and the sheet-like sealing material held by the transport sheet is interposed. The sheet-shaped sealing material by the differential pressure generated between the upper space and the lower space by depressurizing only the lower space among the upper space and the lower space by dividing the upper space into the upper space facing the lower space. It is preferable to have a pressure-reducing contact process in which the sheet-like sealing material is brought into contact with the device mounting surface of the work in a state in which the lower space is depressurized by deforming it into a convex shape toward the device mounting surface.

(Operation/Effect) According to this configuration, the sheet-like sealing material is brought into contact with the device mounting surface of the work by using the differential pressure generated by depressurizing only the lower space in the first sealing process. That is, since the sheet-like sealing material contacts the device in a state in which the lower space is evacuated by the reduced pressure, entrainment of air bubbles between the sheet-like sealing material and the device at the time of sealing can be more reliably avoided. In addition, since the differential pressure acts uniformly over the entire sheet-like sealing material, it is possible to avoid a situation in which damage to the workpiece or damage to the device occurs due to the bias of the applied force. Moreover, since only the lower space needs to be pressure-reduced, the structure which pressure-reduces the upper space becomes unnecessary. Accordingly, complexity and high cost of the device can be avoided.

Moreover, in the above-mentioned invention, it is preferable that the said sheet-like sealing material has a predetermined shape according to the device mounting surface of the said workpiece|work, and is hold|maintained by the said elongate conveyance sheet.

(Operation/Effect) According to this configuration, the sheet-like sealing material has a predetermined shape corresponding to the device mounting surface of the work in advance. Therefore, according to the position and shape of the device mounting surface of a workpiece|work, a sheet-like sealing material can seal a device suitably. Moreover, since the process of cutting|disconnecting a sheet-like sealing material into an appropriate predetermined shape becomes unnecessary, the process of sealing a device can be shortened.

Further, in the above invention, a sheet-shaped elastic body disposed inside the upper housing is provided, and in the upper and lower space forming process, the transport sheet is sandwiched by the upper housing and the lower housing. It is preferable that the said sheet-like elastic body is arrange|positioned and provided so that the said sheet-like elastic body may contact with the surface which does not hold the said sheet-like sealing material among the said conveyance sheet|seat by inserting. In this case, the sheet-shaped elastic body is deformed into a convex shape with a more uniform curvature over the whole by the differential pressure. Therefore, since the sheet-like sealing material is easily deformed according to the shape of the device mounting surface of the work, the filling properties of the sheet-like sealing material with respect to the gaps between devices can be improved. Therefore, the sealing of the device by the sheet-like sealing material can be performed more precisely.

Further, in the above-described invention, a heating process of heating the sheet-shaped sealing material by heating at least one of the lower space and the upper space is provided, wherein the first sealing process is performed in a state heated by the heating process. It is preferable to make the sheet-like sealing material contact the device mounting surface of the said workpiece|work.

(Action/Effect) According to this configuration, the sheet-like sealing material becomes softer by heating the sheet-like sealing material by the heating process. That is, since the sheet-like sealing material is liable to deform according to the shape of the device mounting surface of the work, the filling properties of the sheet-like sealing material with respect to the gaps between devices can be improved.

Further, in the above-described invention, the work is provided with one or two or more convex-shaped members on a surface opposite to the device mounting surface, and a holding member having a concave portion in the central portion is used to form the convex-shaped member. Preferably, the method further includes a holding process for holding the work in a state in which the .

(Operation/Effect) According to this structure, the holding member is provided with the recessed part in the center part. And the holding member holds the work in a state in which the convex-shaped member provided on the device non-mounting surface of the work is disposed inside the concave portion. In this case, a situation in which the convex member interferes with the surface of the holding member and the convex member is damaged can be avoided by the presence of the concave portion. That is, even if it is a workpiece|work provided with a convex-shaped member, a device can be suitably sealed without a workpiece|work being damaged.

The present invention may have the following configuration in order to achieve such an object.

That is, the device sealing apparatus according to the present invention accommodates a work on which a device is mounted and a sheet-shaped sealing material in a chamber, and in a state in which the internal space of the chamber is decompressed, the sheet-shaped sealing material is brought into contact with the device mounting surface of the work. a first sealing mechanism for covering the device with the sheet-like sealing material by

a second sealing mechanism for sealing the device with the sheet-like sealing material by increasing the pressure of the internal space of the chamber after the first sealing process;

It is characterized in that it is provided.

(Operation/Effect) According to this structure, a device is sealed using the sheet-like sealing material previously made into the flat sheet shape. Therefore, in the state in which the sealing of the device is completed, the flatness of the sheet-like sealing material which sealed the device can be improved.

Moreover, in the inside of a chamber, the inside of the lower space in which a workpiece|work is arrange|positioned as for a 1st sealing mechanism is pressure-reduced. That is, since the peripheral space of the device mounted on the work is exhausted by reduced pressure, it is possible to prevent gas from entraining between the sheet-like sealing material and the device when the sheet-like sealing material covers the device. Accordingly, it is possible to avoid a decrease in the adhesion force due to entrainment of the gas.

Further, the second sealing mechanism seals the device with the sheet-like sealing material by increasing the pressure in the internal space of the chamber. In this case, the pressing force can be uniformly applied over the entire sheet-shaped sealing material by pressing the internal space. Accordingly, it is possible to reliably avoid the occurrence of irregularities on the surface of the sheet-like sealing material due to the bias of the force acting on the sheet-like sealing material, so that the flatness of the sheet-like sealing material in a state in which the device is sealed can be improved more reliably.

The present invention may have the following configuration in order to achieve such an object.

That is, the semiconductor product manufacturing method according to the present invention is a semiconductor product manufacturing method for manufacturing a semiconductor product in which a device mounted on a work is sealed with a sheet-like sealing material,

A agent for covering the device with the sheet-like sealing material by accommodating a workpiece on which a device is mounted and a sheet-like sealing material in a chamber, and bringing the sheet-like sealing material into contact with the device mounting surface of the workpiece in a state in which the internal space of the chamber is depressurized. 1 sealing process;

a second sealing process of sealing the device with the sheet-shaped sealing material by increasing the pressure of the internal space of the chamber after the first sealing process;

It is characterized in that it is provided.

(Operation/Effect) According to this structure, the semiconductor product in the state in which the device mounted on the workpiece|work is sealed with the sheet-like sealing material can be manufactured suitably. That is, since a device is sealed using the sheet-like sealing material used as the sheet-like sheet|seat previously flattened in advance, the flatness of the sheet-like sealing material which sealed the device in a semiconductor product can be improved. In addition, since the inside of the chamber is evacuated by reduced pressure in the first sealing process, entrainment of gas between the device and the sheet-like sealing material can be prevented. And since a device is sealed by raising the pressure of the internal space of a chamber in a 2nd sealing process, a sheet-like sealing material can be reliably filled in the clearance gap between devices by high pressure. Therefore, it is possible to manufacture semiconductor products in which the device is sealed with higher precision.

According to the device sealing method, the device sealing apparatus, and the manufacturing method of a semiconductor product which concern on this invention, a device is sealed using the sheet-like sealing material previously made into the flat sheet shape. Therefore, in the state in which the sealing of the device is completed, the flatness of the sheet-like sealing material which sealed the device can be improved.

Moreover, in the 1st sealing process, the inside of the lower space in which a workpiece|work is arrange|positioned inside a chamber is pressure-reduced. That is, since the peripheral space of the device mounted on the work is exhausted by reduced pressure, it is possible to prevent gas from entraining between the sheet-like sealing material and the device when the sheet-like sealing material covers the device. Accordingly, it is possible to avoid a decrease in the adhesion force due to entrainment of the gas.

Further, in the second sealing process, the device is sealed with a sheet-like sealing material by increasing the pressure in the internal space of the chamber. In this case, the pressing force can be uniformly applied over the entire sheet-shaped sealing material by pressing the internal space. Accordingly, it is possible to reliably avoid the occurrence of irregularities on the surface of the sheet-like sealing material due to the bias of the force acting on the sheet-like sealing material, so that the flatness of the sheet-like sealing material in a state in which the device is sealed can be improved more reliably.

BRIEF DESCRIPTION OF THE DRAWINGS It is a figure which shows the structure of the sealing member which concerns on an Example.
(a) is a perspective view of the back surface side of a sealing member, (b) is a longitudinal sectional view of a sealing member.
Fig. 2 is a perspective view showing the configuration of a substrate and a ring frame according to an embodiment.
Fig. 3 is a plan view of the device sealing apparatus according to the embodiment.
4 is a front view of the device sealing apparatus according to the embodiment.
5 is a front view of the sealing unit according to the embodiment.
6 is a longitudinal cross-sectional view of the chamber according to the embodiment.
7 is a flowchart showing the operation of the device sealing apparatus according to the embodiment.
Fig. 8 is a diagram for explaining step S1 according to the embodiment.
Fig. 9 is a diagram for explaining step S2 according to the embodiment.
Fig. 10 is a diagram for explaining step S3 according to the embodiment.
11 is a diagram for explaining step S3 according to the embodiment.
12 is a diagram for explaining step S4 according to the embodiment.
Fig. 13 is a diagram for explaining step S4 according to the embodiment.
Fig. 14 is a diagram for explaining step S5 according to the embodiment.
It is a figure explaining the example of the structure which heats a sealing member.
Fig. 16 is a diagram for explaining step S6 according to the embodiment.
Fig. 17 is a diagram for explaining step S6 according to the embodiment.
Fig. 18 is a diagram for explaining step S7 according to the embodiment.
19 is a diagram for explaining the effect of the embodiment.
(a) is a longitudinal sectional view explaining the configuration when a gap is formed when sealing is performed by depressurizing the inside of the chamber, (b) is a longitudinal sectional view explaining a state in which the gap is filled by sealing the inside of the chamber by pressurizing the inside of the chamber It is also
It is a figure explaining the structure which concerns on a modified example.
(a) is a longitudinal sectional view showing the structure of the board|substrate which concerns on a modification, (b) is a longitudinal sectional view explaining the structure of the holding table which concerns on a modification.
It is a figure explaining the process of step S3 which concerns on a modification.
It is a figure explaining the process of step S4 which concerns on a modification.
It is a figure explaining the structure which concerns on a modified example.
(a) is a longitudinal sectional view showing the configuration of the sealing member according to the modified example, (b) is a diagram for explaining a problem that may occur in the sealing member according to the comparative example which does not have an elastic body, (c) is an elastic body It is a figure explaining the advantage in the comparative example which has.
It is a figure explaining the structure which concerns on a modified example.
(a) is a longitudinal sectional view showing the configuration of the sealing member according to the modification, (b) is a diagram showing the state of step S4 according to the modification, (c) is the state of step S5 according to the modification It is a drawing showing.
It is a figure explaining the structure which concerns on a modified example.
(a) is a longitudinal sectional view which shows the structure of the sealing member which concerns on a modification, (b) is a perspective view explaining the structure of the sheet cutting device with which a modification is equipped.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. Fig. 1(a) is a perspective view showing the back side of the sealing member P, and Fig. 1(b) is a longitudinal sectional view of the sealing member P. As shown in Figs. 2 : is a perspective view which shows the structure of the board|substrate 10 used as the object of sealing by the sealing member P, and the ring frame f.

The sealing member P which concerns on a present Example is equipped with the sealing sheet S and the sheet|seat T for conveyance, as shown to Fig.1 (a). The sealing sheet S is cut|disconnected previously in the predetermined shape according to the shape of the board|substrate 10. As shown in FIG. In the present Example, the sealing sheet S shall be cut|disconnected in the substantially rectangular shape beforehand. Here, the substantially rectangular shape means a shape in which each corner of the rectangle is rounded as shown in FIG. 1A . In addition, in this Example, the magnitude|size of the sealing sheet S is larger than the board|substrate 10, and it is set so that it may become smaller than the inner diameter of the lower housing 29A mentioned later.

The sheet|seat T for conveyance is elongate shape, and the sealing sheet S is affixed and hold|maintained by the sheet|seat T for conveyance at predetermined pitch. The sealing sheet S corresponds to the sheet-like sealing material in this invention.

The sheet T for conveyance is equipped with the structure in which the non-adhesive base material Ta and the adhesive material Tb which have adhesiveness were laminated|stacked, as shown in FIG.1(b). Polyolefin, polyethylene, etc. are mentioned as an example of the material which comprises base material Ta. An acrylic acid ester copolymer etc. are mentioned as an example of the material which comprises the adhesive material Tb.

The sealing sheet S is equipped with the structure in which the non-adhesive base material Sa and the sealing material Sb which have adhesiveness were laminated|stacked, as shown to FIG.1(b). The sheet|seat T for conveyance holds the sealing sheet S by affixing the base material Sa to the adhesive material Tb of the sheet|seat T for conveyance. Polyolefin, polyethylene, etc. are mentioned as an example of the material which comprises base material Sa. Although the shape of sealing sheet S is a substantially rectangular shape in a present Example, it can change suitably according to the shape of the board|substrate 10. As shown in FIG.

A separator S (not shown) is attached to the sealing material Sb, and the adhesive surface of the sealing material Sb is exposed when the separator S is peeled off. In this embodiment, it is assumed that OCA (Optical Clear Adhesive) which is an optically transparent adhesive material is used as a material constituting the sealing material Sb.

As shown in FIG. 2 , a plurality of LEDs 11 and TFTs (not shown) are mounted in parallel in a two-dimensional matrix on the central portion of the surface of the substrate 10 . That is, the surface of the board|substrate 10 is in the state in which the unevenness|corrugation was formed by the LED11. The LED 11 is connected to the substrate 10 via TFTs, bumps (not shown), or the like. Examples of the substrate 10 include a glass substrate, an organic substrate, a circuit substrate, and a silicon wafer. In the present embodiment, the substrate 10 has a substantially rectangular shape, but the shape of the substrate 10 may be appropriately changed to any shape exemplified by a rectangular shape, a circular shape, a polygonal shape, or the like. The substrate 10 corresponds to the work in the present invention. The LED 11 corresponds to the device in the present invention.

The ring frame f has a size and shape surrounding the substrate 10 . The device sealing apparatus 1 which concerns on an Example seals the LED11 mounted on the board|substrate 10 with the sealing sheet S, and the sealing body which the board|substrate 10 and the ring frame f are integrated with the sealing member P. make MF.

<Description of the overall configuration>

Here, the whole structure of the device sealing apparatus 1 which concerns on an Example is demonstrated. Fig. 3 is a plan view showing the basic configuration of the device sealing apparatus 1 according to the embodiment. The device sealing apparatus 1 has a structure provided with the horizontally long rectangular part 1a and the protrusion part 1b. The protrusion part 1b is connected at the center part of the rectangular part 1a, and has a structure which protrudes upward. In addition, in the following description, the longitudinal direction of the rectangular part 1a is called a left-right direction (x direction), and the horizontal direction (y direction) orthogonal to this is called a front-back direction.

On the right side of the rectangular part 1a, the board|substrate conveyance mechanism 3 is arrange|positioned and provided. At a position in the lower right vicinity of the rectangular portion 1a, two containers 5 containing the substrate 10 are placed in parallel. At the left end of the rectangular part 1a, a sealing body recovery part 6 for recovering a sealing body MF, which will be described later, is arranged.

The aligner 7, the holding table 9, and the frame supply part 12 are arrange|positioned in order from the right side of the upper side of the rectangular part 1a. The sealing unit 13 which seals each of the LED11 mounted on the board|substrate 10 with the sealing sheet S is arrange|positioned in the protrusion part 1b.

As shown in FIG. 4, the board|substrate conveyance mechanism 3 is the board|substrate conveyance apparatus 16 supported so that left-right reciprocation is possible on the right side of the guide rail 15 installed horizontally on the upper part of the rectangular part 2a. is provided. Further, on the left side of the guide rail 15, a frame conveying device 17 supported so as to be movable left and right is provided.

The substrate transport apparatus 16 is configured to be able to transport the substrate 10 taken out from either side of the container 5 to the left and right and back and forth. The board|substrate conveyance apparatus 16 is equipped with the left-right movable base 18 and the front-back movable movable table 19. As shown in FIG.

The left-right movable base 18 is comprised so that it may reciprocate in the left-right direction along the guide rail 15. As shown in FIG. The front-back movable base 19 is comprised so that it may reciprocate in the front-back direction along the guide rail 20 with which the left-right movable base 18 was equipped.

Moreover, the holding unit 21 which holds the board|substrate 10 is equipped in the lower part of the back-and-forth movable base 19. As shown in FIG. The holding unit 21 is configured to be reciprocally movable in the vertical direction (z direction) along the elevating rail 22 extending in the longitudinal direction. In addition, the holding unit 21 is rotatable around the axis of the z direction by a rotation shaft (not shown).

The lower part of the holding unit 21 is equipped with a horseshoe-shaped holding arm 23 . A plurality of slightly protruding suction pads are provided on the holding surface of the holding arm 23 to adsorb and hold the substrate 10 via the suction pad. In addition, the holding arm 23 is communicated with the compressed air device through a flow path formed therein and a connection flow path connected at the base end side of the flow path.

By using the above movable structure, the substrate 10 adsorbed and held can be moved back and forth, left and right, and pivotally around the z-direction axis by the holding arm 23 .

The frame conveying apparatus 17 includes a left-right movable base 24 , a forward/backward movable movable table 25 , a flexible link mechanism 26 connected to the lower portion of the horizontally movable movable table 24 , and a flexible link mechanism 26 . ) is provided with a suction plate 27 and the like equipped at the lower end. The adsorption plate 27 adsorbs and holds the substrate 10 . A plurality of suction pads 28 for adsorbing and holding the ring frame f are arranged around the suction plate 27 . Therefore, the frame conveying apparatus 21 can adsorb|suck and hold the ring frame f or sealing body MF loaded and held by the holding table 9, and can convey up/down and front-back, right and left. The suction pad 28 is slide-adjustable in the horizontal direction corresponding to the size of the ring frame f.

The holding table 9 is a metal chuck table having the same shape or larger size as the substrate 10 as shown in FIGS. 5 and 6, and a vacuum device 31 and a pressurizing device ( 32) and is connected to each other. The operation of the vacuum device 31 and the pressurization device 32 is controlled by the control unit 33 .

5, the holding table 9 is accommodated in the lower housing 29A constituting the chamber 29, and is connected to one end of the rod 35 penetrating the lower housing 29A. have. The other end of the rod 35 is driven and connected to an actuator 37 provided with a motor or the like. Therefore, the holding table 9 is movable up and down inside the chamber 29 .

The lower housing 29A includes a frame holding portion 38 that surrounds the lower housing 29A from the outside. The frame holding portion 38 is configured such that, when the ring frame f is mounted, the upper surface of the ring frame f and the cylindrical top of the lower housing 29A are on the same plane. Moreover, it is preferable that the mold release process is given to the cylindrical top of 29 A of lower housing|casings.

Moreover, as shown in FIG. 3, the holding table 9 is comprised so that reciprocation between an initial position and a sealing position is possible along the rail 40 laid in the front-back direction. The initial position is inside the rectangular part 1a, and in FIG. 3, the holding table 9 is a position shown by the solid line. In the set position, the substrate 10 and the ring frame f are mounted on the holding table 9 .

The sealing position is inside the protrusion 1b, and is a position where the holding table 9 is indicated by a dotted line in FIG. 3 . By moving the holding table 9 to the sealing position, it becomes possible to perform the sealing process using the sealing member P with respect to the board|substrate 10 mounted on the holding table 9. As shown in FIG.

The frame supply unit 12 accommodates a drawer-type cassette in which a predetermined number of ring frames f are stacked and accommodated.

The sealing unit 13 is comprised by the sheet|seat supply part 71, the separator collection|recovery part 72, the device sealing part 73, the sheet|seat collection|recovery part 74, etc. as shown in FIG. The sheet supply unit 71 supplies the sealing member P to the sealing position from a supply bobbin loaded with a fabric roll in which a sealing member PS having a separator (a sealing member P provided by adding a separator S) is wound. ) to peel off the separator S.

The separator collection part 72 is equipped with the collection|recovery bobbin which winds up the separator S peeled from the sealing member P. This recovery bobbin is controlled to rotate in a forward and reverse direction by a motor.

The device sealing part 73 is comprised by the chamber 29, the device sealing mechanism 81, the sheet|seat cutting mechanism 82, etc.

The chamber 29 is constituted by a lower housing 29A and an upper housing 29B. 29 A of lower housings are arrange|positioned so that the holding table 9 may be enclosed, and it reciprocates between the initial position and the sealing position together with the holding table 9 in the front-back direction. The upper housing 29B is arranged on the protrusion 1b, and is configured to be able to move up and down.

As shown in FIG. 6 , the lower housing 29A and the upper housing 29B are connected in communication with each of the vacuum device 31 and the pressurizing device 32 via a flow path 101 . In addition, a solenoid valve 103 is provided in the flow path 101 on the side of the upper housing 11B. Moreover, the flow path 109 provided with the solenoid valves 105 and 107 for atmospheric release is connected in communication with both housings 11A and 11B, respectively.

Moreover, the flow path 111 provided with the solenoid valve 110 which adjusts the internal pressure once pressure-reduced by leakage is communicated with the upper housing 29B. In addition, the opening/closing operation of these solenoid valves 103, 105, 107, 110, the operation|movement of the vacuum device 31, and the operation|movement of the pressurization device 32 are performed by the control part 33. As shown in FIG.

That is, the vacuum device 31 is comprised so that the pressure of the air pressure of the space on the side of the lower housing 29 side and the air pressure of the space on the side of the upper housing side can be pressure-reduced independently. And the pressurizing device 32 is comprised so that the air pressure of the space on the side of the lower housing 29 side and the air pressure of the space on the side of the upper housing side can be pressurized and adjusted independently.

The device sealing mechanism 81 includes a movable table 84 , a sticking roller 85 , a nip roller 86 , and the like. The movable table 84 moves horizontally left and right along the guide rails 88 erected in the left and right directions. The sticking roller 85 is axially supported by the bracket connected to the front-end|tip of the cylinder with which the movable table 84 was equipped. The nip roller 86 is disposed on the sheet collecting unit 74 side, and includes a transfer roller 89 driven by a motor and a pinch roller 90 raised and lowered by a cylinder.

The sheet cutting mechanism 82 is arranged and provided on a lifting drive 91 for raising and lowering the upper housing 29B, a support shaft 92 extending in the z direction, and a support shaft 92 rotating around the support shaft 92 . A boss portion 93 is provided. The boss portion 93 includes a plurality of support arms 94 extending in the radial direction. At the tip of the at least one support arm 94, a disk-shaped cutter 95 for cutting the conveyance sheet T of the sealing member P along the ring frame f is arranged so as to be vertically movable. At the tip of the other support arm 94, a pressing roller 96 is arranged so as to be movable up and down.

The sheet collection|recovery part 74 is equipped with the collection|recovery bobbin which winds up the unnecessary conveyance sheet|seat T peeled after cutting. This recovery bobbin is controlled to rotate in a forward and reverse direction by a motor (not shown).

As shown in FIG. 4, the sealing body collection|recovery part 6 is equipped with the cassette 41 which loads and collect|recovers the sealing body MF. The cassette 41 is provided with a vertical rail 45 connected and fixed to the device frame 43 , and a lifting platform 49 that is screwed and raised by a motor 47 along the vertical rail 45 . Therefore, the sealing body collection|recovery part 6 is comprised so that the sealing body MF may be mounted on the hoisting table 49, and pitch conveyance may descend|fall.

The device sealing mechanism 81 has a heating mechanism 120 inside the upper housing 29B as shown in FIG. 6 or the like. The heating mechanism 120 includes a cylinder 121 and a heating member 123 . The cylinder 121 is connected to the upper portion of the heating member 123 , and the heating member 123 may move up and down in the chamber 29 by the operation of the cylinder 121 . In addition, as long as the heating member 123 can warm the sealing member P, it may not be a structure which can raise/lower a movement.

The heating member 123 has a disk shape as a whole, and has a shape slightly larger than the sealing sheet S. In the inside of the heating member 123, the heater 125 which heats the sheet|seat T for conveyance and the sealing sheet S is embedded. The temperature of the heating by the heater 125 is adjusted so that it may become the temperature at which the sheet|seat T for conveyance and the sealing sheet S become soft. As an example of the temperature of the said heating, about 50 degreeC - 70 degreeC is mentioned.

<Overview of Basic Operation>

Here, the basic operation of the device sealing apparatus according to the embodiment will be described. 7 : is a flowchart explaining a series of processes of sealing the LED11 mounted on the board|substrate 10 with the sealing sheet S using the device sealing apparatus 1. As shown in FIG.

Step S1 (workpiece supply)

When the sealing command is issued, the ring frame f is conveyed from the frame supply unit 12 to the frame holding unit 38 of the lower housing 29A, and the substrate 10 is moved from the container 5 to the holding table 9 . is returned

That is, the frame conveying apparatus 17 absorbs the ring frame f from the frame supply part 12 and moves and mounts it on the frame holding|maintenance part 38. As shown in FIG. When the frame conveying device 17 releases the suction of the ring frame f and rises, the ring frame f is aligned. The alignment is performed, for example, by synchronously moving a plurality of support pins erected so as to surround the frame holder 38 in the central direction. The ring frame f waits until the board|substrate 10 is conveyed in the state set in the frame holding|maintenance part 38. As shown in FIG.

While the frame conveying apparatus 17 conveys the ring frame f, the board|substrate conveying apparatus 16 inserts the holding arm 23 between the board|substrates 10 comrades accommodated in multiple stages. The holding arm 23 adsorbs, holds, and carries out the portion on the surface of the substrate 10 on which the LED 11 is not mounted (the portion on the periphery side), and conveys it to the aligner 7 . The aligner 7 adsorbs the center of the back surface of the substrate 10 by the suction pad protruding from the center thereof. At the same time, the substrate transfer device 16 cancels the adsorption of the substrate 10 and retracts upward. The aligner 7 holds and rotates the substrate 10 with a suction pad to align the position based on the notch or the like.

When the alignment is completed, the suction pad on which the substrate 10 is adsorbed is protruded from the surface of the aligner 7 . The substrate transfer device 16 moves to the position to adsorb and hold the substrate 10 from the surface side. The suction pad releases the suction and descends.

The substrate transfer apparatus 16 moves above the holding table 9 and loads the substrate 10 on the holding table 9 with the front side on which the LED 11 is mounted facing upward. When the holding table 9 adsorbs and holds the substrate 10 and the frame holding portion 38 adsorbs and holds the ring frame f, the lower housing 29A moves from the initial position along the rail 40 to the device sealing mechanism. It moves to the sealing position on the (81) side. A state in which the substrate 10 is fed to the holding table 9 and moved to the sealed position is shown in FIG. 8 .

Step S2 (supply of sealing sheet)

When supply of the workpiece|work by the board|substrate conveyance apparatus 16 etc. is performed, the sealing unit 13 will supply the sealing sheet S. That is, a predetermined amount of the sealing member P is fed out from the sheet supply unit 71 while peeling the separator S. The sealing member P, which is generally elongated, is guided above the sealing position along a predetermined conveyance path. At this time, as shown in FIG. 9, positioning is performed so that sealing sheet S hold|maintained by the sheet|seat T for conveyance may be located above the board|substrate 10 mounted on the holding table 9. As shown in FIG.

Step S3 (formation of chamber)

When the work and sealing sheet S are supplied, the sticking roller 85 descends as shown in FIG. 10 . And as shown in FIG. 11, the sheet|seat T for conveyance is affixed over the ring frame f and the top of 29 A of lower housings, rolling over the sheet|seat T top for conveyance. In association with the movement of the sticking roller 85 , a predetermined amount of the sealing member P is fed out from the sheet supply 71 while peeling the separator S.

When the sheet T for conveyance is affixed to the ring frame f, while returning the sticking roller 85 to an initial stage, the upper housing 29B is lowered. As the upper housing 29B is lowered, as shown in Fig. 11, the transfer sheet T of the portion affixed to the top of the lower housing 29A is sandwiched by the upper housing 29B and the lower housing 29A. A chamber 29 is configured by being supported.

At this time, while the sheet|seat T for conveyance functions as a sealing material among the sealing members P, the chamber 29 is divided|segmented into two spaces by the sheet|seat T for conveyance. That is, it is divided|segmented into the lower space H1 by the side of the lower housing 29A, and the upper space H2 by the side of the upper housing 29B across the sheet|seat T for conveyance. Each of the board|substrate 10 and LED11 located in the lower housing 29A has a predetermined clearance with the sealing sheet S, and is closely facing.

Step S4 (first sealing process)

After forming the chamber 29, the first sealing process is started. First, the control part 33 operates the vacuum device 31 in the state in which the solenoid valves 105, 107, and 110 shown in FIG. 6 are closed, and reduces the atmospheric pressure in the lower space H1 and the atmospheric pressure in the upper space H2 to predetermined values. do. As an example of a predetermined value, 10 Pa - 100 Pa are mentioned. At this time, the opening degree of the solenoid valve 103 is adjusted so that the lower space H1 and the upper space H2 may pressure-reduce at the same speed.

When the atmospheric pressure in the lower space H1 and the upper space H2 is reduced to a predetermined value, the control unit 33 closes the solenoid valve 103 and stops the operation of the vacuum device 31 . And the control part 33 adjusts each opening degree of the solenoid valves 103, 105, 107, 110 so that the atmospheric pressure of the upper space H2 may become higher than the atmospheric pressure of the lower space H1, and it leaks. When the atmospheric pressure side of the upper space H2 becomes higher than the atmospheric pressure of the lower space H1, as shown in FIG. 12, the differential pressure Fa generate|occur|produces between both spaces. When the differential pressure Fa is generated, the pressure-sensitive adhesive member P is drawn from the central portion to the lower housing 29A side and is deformed into a convex shape.

In the present embodiment, while the solenoid valves 103 and 107 connected to the lower space H1 are closed, the opening degree of the solenoid valve 110 connected to the upper space H2 is adjusted and leaked, and finally, the solenoid valve is completely opened. control as much as possible. By this adjustment, the atmospheric pressure in the upper space H2 gradually rises from the predetermined value and returns to atmospheric pressure while maintaining the state in which the atmospheric pressure in the lower space H1 is reduced to a predetermined value, thereby generating a differential pressure Fa.

After generating the differential pressure Fa, the actuator 37 is driven to raise the holding table 9 as shown in Fig. 13 . The sealing sheet S is in contact with the surface of the substrate 10 radially from the central portion toward the outer periphery in the evacuated lower space H1 due to the deformation of the adhesive member P due to the differential pressure Fa and the rise of the holding table 9 . do it By the said contact, each of the LED11 mounted on the board|substrate 10 is covered with the sealing sheet S.

When the LED11 is covered with the sealing sheet S, the control part 33 will make the solenoid valves 103, 105, 107, 110 fully open, and will open the upper space H2 and the lower space H1 to the atmosphere. The first sealing process is completed by the opening to the atmosphere. Thus, in a 1st sealing process, operation to cover LED11 with sealing sheet S by making sealing sheet S contact the surface of the board|substrate 10 in the state which pressure-reduced the internal space of the chamber 29 is performed.

Moreover, it is preferable to heat the upper space H2 using the heating mechanism 120 in advance before starting step S4. That is, the controller 33 operates the heater 125 to heat the heating device 123 to a predetermined temperature. When the heating device 123 is heated, the upper space H2 is heated by the heat conduction effect, and the sheet T for conveyance and the sealing sheet S are heated further.

Since the sheet|seat T for conveyance and the sealing sheet S become soft by heating, the deformability by differential pressure Fa improves. That is, when covering LED11 with sealing sheet S, the followability|trackability of the sealing member P with respect to the upper surface of the board|substrate 10 and LED11 can further be improved. Moreover, as shown in FIG. 15, the heating member 123 may be descend|falling so that it may contact|abut the sheet|seat T for conveyance, and you may heat the sealing member P directly by the warming member 123. As shown in FIG.

Step S5 (second sealing process)

After forming the chamber 29, the second sealing process is started. First, the control unit 33 controls the actuator 37 to lower the holding table 9 to the initial position. Next, the control part 33 operates the pressurization device 32 in the state which closed the solenoid valves 105, 107, 110 shown in FIG. 6, and supplies gas to the lower space H1 and the upper space H2, The lower space Pressurize H1 and upper space H2 to a specific value. 0.3 Mpa - 0.5 Mpa are mentioned as an example of a specific value. When the pressurization device 32 pressurizes, the air pressure of the lower space H1 and the air pressure of the upper space H2 both become higher than atmospheric pressure.

By pressing of the upper space H2, as shown in FIG. 14, the pressing force V1 acts toward the sealing sheet S from the upper space H2. Moreover, since the whole upper space H2 is pressed, the pressing force V1 acts uniformly over the whole sealing sheet S. Moreover, the pressing force V2 acts uniformly toward the back surface of the board|substrate 10 from the lower space H1 by pressurizing the whole lower space H1. That is, the sealing material Sb of the sealing sheet S is filled in the clearance gap between LED11 comrades by the action|action of the pressing force V1 and the pressing force V2. As a result, while the board|substrate 10 and sealing sheet S are closely_contact|adhered further, LED11 is sealed by sealing sheet S.

After the pressing force is applied between the sealing sheet S and the LED 11 for a predetermined period of time in a state where the lower space H1 and the upper space H2 are pressurized to an atmospheric pressure higher than atmospheric pressure, the control unit 33 stops the pressing device 32 . And the control part 33 makes the solenoid valves 103, 105, 107, 110 fully open, and makes the lower space H1 and the upper space H2 open to the atmosphere. The control unit 33 raises the upper housing 29B to open the chamber 29 , and raises the holding table 9 to hold the back surface of the substrate 10 on the substrate holding surface of the holding table 9 . bring it into contact with

Step S6 (cutting the sheet)

Moreover, in the chamber 29, while performing the process related to step S4 and step S5, the sheet|seat cutting mechanism 82 is operated, and the sealing member P is cut|disconnected. At this time, as shown in FIG. 16, the cutter 95 cut|disconnects the sealing member P (specifically, the sheet|seat T for conveyance) affixed to the ring frame f in the shape of the ring frame f, and the pressure roller 96 It follows the cutter 95 and presses it while rolling the sheet|seat cutting site|part on the ring frame f.

Since the sealing of the LED11 by the sealing sheet S and the cutting|disconnection of the sealing member P are completed at the time of raising the upper housing 29B, the pinch roller 90 is raised and the nip of the sheet|seat T for conveyance is cancelled|released. Then, as shown in FIG. 17, while moving the nip roller 86 and winding up and collecting the unnecessary conveyance sheet T after cutting toward the sheet collection part 74, it is removed from the sheet supply part 71. A fixed amount of sealing member P is fed out. By each process up to step S6, the sealing body MF in which the ring frame f and the board|substrate 10 were integrated through the sealing member P is formed.

When the unnecessary conveyance sheet|seat T is wound up and collect|recovered, the nip roller 86 and the sticking roller 85 will return to an initial position. And in the state holding the sealing body MF, the holding table 9 moves from a sealing position to an initial position.

Step S7 (recovery of sealing body)

When the holding table 9 returns to the initial position, as shown in FIG. 18 , the suction pad 28 provided in the frame transport device 17 adsorbs and holds the sealing body MF and is removed from the lower housing 29A. Remove the seal MF. The frame conveying apparatus 17 which adsorbed and held the sealing body MF conveys the sealing body MF to the sealing body collection|recovery part 6 . The conveyed sealing body MF is loaded and accommodated in the cassette 41 .

As mentioned above, the operation|movement of a sequence of sealing the LED11 mounted on the board|substrate 10 with the sealing sheet S is complete|finished. Thereafter, the above process is repeated until the sealing body MF reaches a predetermined number. Thus, the sealing body MF in the state which sealing sheet S closely sealed LED11 is manufactured by the device sealing apparatus 1 . Sealing body MF in the state which sealing sheet S closely sealed LED11 by a 2nd sealing process corresponds to the semiconductor device in this invention.

In addition, although the case where the ring frame f is used is illustrated in an Example, the manufacturing process of the sealing body MF which is a semiconductor device is not limited to the case where the ring frame f is used. That is, by performing each process related to step S1 - S7, sealing sheet S is closely-sealed with respect to the LED11 mounted on the board|substrate 10, and the sealing body MF in which sealing sheet S and the board|substrate 10 were integrated. manufactured.

<Effect by the configuration of the embodiment>

According to the apparatus according to the embodiment, the LED 11 mounted on the substrate 10 is sealed with the sealing sheet S by adjusting the atmospheric pressure inside the chamber 29 . In the conventional sealing method in which the liquid sealing material is filled around the device and then the sealing material is cured, the flatness on the surface of the sealing material decreases due to causes such as mixing of air bubbles in the resin in an uncured state.

On the other hand, the structure of this invention WHEREIN: Each of the base material Sa and sealing material Sb with which sealing sheet S is equipped is made into the sheet shape flat previously. Therefore, in the state in which sealing by sealing sheet S was completed, the flatness in the surface of sealing sheet S can be improved. Further, since sealing is performed by adjusting the atmospheric pressure inside the chamber 29 in a state in which the substrate 10 and the sealing sheet S are arranged and provided inside the chamber 29, the differential pressure Fa or the pressing force over the entire sealing sheet S V1 and compression force V2 act uniformly. Therefore, since it originates in the unevenness of the force which acts on sealing sheet S, and it can avoid reliably that unevenness|corrugation generate|occur|produces on the surface of sealing sheet S, the flatness of sealing sheet S can be improved more reliably.

In the first sealing process according to the present invention, inside the chamber 29 , the inside of the lower space H1 in which the substrate 10 is disposed is decompressed. That is, since the peripheral space of the LED11 mounted on the board|substrate 10 is exhausted by pressure reduction, when the sealing sheet S contacts the LED11 and covers the LED11, it is between sealing sheet S and LED11. It is possible to prevent gas from being entrained. Accordingly, it is possible to avoid a decrease in the adhesion force due to entrainment of the gas.

Moreover, in the 2nd sealing process which concerns on this invention, sealing material Sb of sealing sheet S is filled in the clearance gap of LED11 with high precision by pressurizing the atmospheric pressure of the lower side space H1 and upper side space H2 so that it may become larger than atmospheric pressure.

When the differential pressure Fa is generated by depressurizing the inside of the chamber using a vacuum device, the magnitude of the differential pressure Fa generated by the decompression from the atmospheric pressure is lower than atmospheric pressure. That is, when pressing sealing sheet S by LED11 using differential pressure Fa, an upper limit exists in the magnitude|size of the force which presses LED11 with sealing sheet S. Therefore, in the state in which the sealing material Sb of the sealing sheet S covered the LED11 by the differential pressure Fa by pressure_reduction|reduced_pressure, as shown to Fig.19 (a), the sealing material Sb completely fills the periodic space of the LED11. This is not possible, and the gap portion J may be generated.

On the other hand, in this invention, the upper space H1 and the lower space H2 in the chamber 29 are pressurized so that it may become atmospheric pressure larger than atmospheric pressure using the pressurization apparatus 32. As shown in FIG. That is, in a 2nd sealing process, the pressing force V1, V2 larger than differential pressure Fa can act on sealing sheet S and LED11. Therefore, as shown in Fig. 19(b), the sealing material Sb in an uncured state is further compressed and deformed by the action of the pressing forces V1 and V2 to reliably fill the gap portion J. Therefore, by performing the 2nd sealing process, the LED11 can be sealed more accurately.

Also, in the second sealing process, the magnitudes of the pressing forces V1 and V2 can be adjusted to arbitrary values by appropriately controlling the pressing device 32 . Therefore, even when sealing conditions exemplified by the constituent material of the sealing material Sb or the size and structure of the LED 11 are changed, the LED 11 can be reliably sealed by appropriately adjusting the magnitudes of the pressing forces V1 and V2. Moreover, since the pressing forces V1 and V2 of appropriate magnitude act uniformly over the entire sealing sheet S, it is possible to avoid damage to the substrate 10 or the LED 11 due to the excessive application of the pressing force or the bias of the pressing force.

In addition, in the conventional device sealing method using a mold and a liquid sealing material, it is necessary to prepare different molds depending on the size or material of the workpiece and the device, and therefore, the effort and cost required for manufacturing the device sealing device is large.

On the other hand, in the device sealing method according to the present invention, since the device can be sealed without using a mold, the time and cost required for manufacturing the device sealing apparatus 1 can be greatly reduced. Moreover, even when various conditions of a workpiece|work or a device are changed, it can respond to the change of a workpiece|work etc. by changing the shape etc. of sealing sheet S. Therefore, the device sealing apparatus according to various conditions can be set quickly and easily.

In addition, embodiment disclosed this time is an illustration in every point, and is not restrictive. The scope of the present invention is indicated by the claims rather than the description of the above-described embodiments, and all changes (modifications) within the meaning and scope equivalent to the claims are included. For example, the present invention may be modified as follows.

(1) As the work according to the embodiment, the LED 11 is mounted on the front side and a substrate 10 with a flat back side has been used for explanation. However, the back side of the work is not limited to a flat configuration. That is, you may use the board|substrate 131 provided with the convex-shaped member 130 on the back side as shown in FIG.20(a) as a workpiece|work. The convex-shaped member 130 may be, for example, a constituent material of the substrate 131 in addition to electronic components such as LEDs. That is, it is assumed that the substrate 131 having irregularities on the back side includes a configuration in which irregularities are formed on the back surface of the substrate 131 itself.

When sealing the LED 11 mounted on the front side with the sealing sheet S with respect to the board|substrate 131 provided with the convex member 130 on the back surface side, the device sealing apparatus 1 is equipped with the holding table 9 ) instead, the holding table 135 shown in FIG. 20B is provided.

The holding table 135 has an annular protrusion 137 on its outer periphery and a recess 139 on its center. That is, the holding table 135 is hollow as a whole. The recessed part 139 is comprised in the position which includes the area|region where the convex-shaped member 130 is arrange|positioned in the board|substrate 131 in planar view. The projection 137 supports a portion of the back surface of the substrate 131 where the convex member 130 is not provided, so that the holding table 135 does not come into contact with the convex member 130 and the substrate 131 is not provided. ) can be held.

21 : has shown the state in which the holding table 135 is supporting the board|substrate 131 in the structure in which the lower housing 29A is equipped with the holding table 135. As shown in FIG. This state corresponds to the process of forming the chamber 29 in step S3. Since each process of sealing the LED11 on the board|substrate 10 with the sealing sheet S in the structure provided with the holding table 135 is the same as that of the embodiment already demonstrated, detailed description is abbreviate|omitted.

(2) In step S4 according to the embodiment, after the atmospheric pressures in the lower space H1 and the upper space H2 are reduced to a predetermined value, the atmospheric pressure in the upper space H2 is returned to atmospheric pressure to generate a differential pressure Fa, but in step S4 Adjustment of the atmospheric pressure of the is not limited thereto. That is, after reducing the atmospheric pressure in the lower space H1 and the upper space H2 to a predetermined value, the opening degree of the solenoid valve 105 may be appropriately adjusted to leak while maintaining the atmospheric pressure in the lower space H1 at the predetermined value.

In this case, the atmospheric pressure in the upper space H2 rises from a predetermined value and is controlled to be a specific value lower than the atmospheric pressure, and the differential pressure Fa is generated by the control. After the LED 11 is covered with the sealing sheet S by the differential pressure Fa, the control unit 33 completely opens the solenoid valves 103, 105, 107, and 110 to open the upper space H2 and the lower space H1 to the atmosphere. The first sealing process is completed by the opening to the atmosphere.

In a configuration in which the differential pressure Fa is generated by returning the atmospheric pressure in the upper space H2 to atmospheric pressure as in the embodiment, since the differential pressure Fa can be made larger, the process of deforming the sealing member P to cover the LED 11 with the sealing sheet S is further performed. can be completed quickly. On the other hand, in the configuration in which the differential pressure Fa is generated by adjusting the atmospheric pressure in the upper space H2 to a specific value higher than the atmospheric pressure in the lower space H1 and lower than the atmospheric pressure as in the modified example according to (2), the deformation rate of the sealing member P is suppressed to be low. do. Therefore, since the situation that sealing sheet S covers LED11 too early can be avoided while exhaust|emission of the lower side space H1 is not completed, it can prevent that a void generate|occur|produces between sealing sheet S and LED11.

(3) In step S5 according to the embodiment, the pressurizing device 32 pressurized the inside of both the lower space H1 and the upper space H2, but it is not limited thereto. That is, the pressurizing device 32 may pressurize only the upper space H2 until it becomes an atmospheric pressure higher than atmospheric pressure, and may seal the LED11 more precisely by the pressing force V1.

As a further modification of the configuration of pressurizing only the upper space H2, the LED 11 is formed by pressurizing the inside of the upper space H2 to an atmospheric pressure higher than atmospheric pressure while maintaining the pressure-reduced state inside the lower space H1 to an atmospheric pressure lower than atmospheric pressure. The structure to be sealed may be sufficient. In this configuration, after performing the first sealing process by the differential pressure Fa in step S4, the solenoid valve 105 connected to the upper space H2 is opened while maintaining the state in which the atmospheric pressure in the lower space H1 is reduced to a predetermined value. Only the upper space H2 is released to the atmosphere. And in step S5, the inside of the upper space H2 is pressurized by operating the pressurization device 32, and it is made higher than atmospheric pressure.

In the said modification, in step S5, the inside of the upper space H2 is pressed in the state which raised the holding table 9 and made the holding table 9 abut against the back surface of the board|substrate 10. As shown in FIG. By pressurizing the upper space H2 while holding the substrate 10 by the holding table 9 to generate a pressing force V1, the pressing force V1 is applied to the sealing sheet S and the substrate even when the lower space H1 is in a state in which the pressure is lowered than atmospheric pressure. (10) can be applied evenly over the entire surface.

(4) In step S4 according to the embodiment, the sealing sheet P is deformed into a convex shape by generating a differential pressure Fa inside the chamber 29 using the vacuum device 31, and is brought into contact with the LED 11; The method of deforming the sealing sheet P into a convex shape is not limited to the structure which generate|occur|produces the differential pressure|voltage Fa. That is, as shown in FIG. 22, the structure provided with the pressing member 141 inside the upper housing 29B may be sufficient.

The pressing member 141 has a convex shape (as an example, a hemispherical shape) on the bottom surface, and is arrange|positioned so that it may be located above the sealing sheet S, and is provided. Therefore, by lowering the pressing member 141, the bottom surface of the convex pressing member 141 presses the sealing sheet S, and the sealing sheet S is deformed into a convex shape and can contact the LED. In this case, the configuration of the vacuum device 31 or the like necessary for generating the differential pressure Fa can be omitted. Moreover, the structure etc. which press the sealing sheet P from upper direction using a roller etc. are mentioned as another structure which deform|transforms sealing sheet P into convex shape.

(5) In the embodiment, as shown in Fig. 23(a) , the chamber 29 may include a sheet-shaped elastic body Ds. The elastic body Ds is arranged inside the upper housing 29B, and is configured so as to be in contact with the inner diameter of the upper housing 29B. Further, it is configured such that the lower surface of the elastic body Ds and the cylindrical bottom of the upper housing 29B are on the same plane. Therefore, when the lower housing 29A and the upper housing 29B sandwich the conveyance sheet T and form the chamber 29, the elastic body Ds will come into contact with the conveyance sheet T. Specifically, in the sheet|seat T for conveyance, elastic body Ds abuts on the opposite side to the surface holding the sealing sheet S (in the figure, the upper surface side). By arranging and providing the elastic body Ds so as to be in contact with the inner diameter of the lower housing 29A, the elastic body Ds is not inserted when the chamber 29 is formed, so that the sealing property of the chamber 29 is reduced by the elastic body Ds. can be prevented Examples of the material constituting the elastic body Ds include rubber, elastomer, or gel-like polymeric material.

When the sealing member P is provided with the elastic body Ds, when deforming the sealing member P to a convex shape in step S4, the bending rate of the sealing member P can be made more uniform. As an example, when the sealing sheet S is comprised from the comparatively hard material, as shown in FIG.23(b), the bending rate of the sealing member P becomes non-uniform|heterogenous.

That is, in the area|region P1 by which the sealing sheet S is hold|maintained by the sheet|seat T for conveyance among the sealing members P, since the hard sealing sheet S exists, the bending rate of the sealing member P by differential pressure Fa is small. On the other hand, in the area|region P2 by which the sealing sheet S is not hold|maintained by the sheet|seat T for conveyance among the sealing members P, the bending rate of the sealing member P by differential pressure Fa is comparatively large. That is, when the region P2 is easily deformed by the differential pressure Fa, the bending rate of the sealing member P in the region P1 is further reduced. As a result, since the sealing sheet S becomes difficult to deform|transform, the filling property of the sealing material Sb with respect to the uneven|corrugated part (mounting area|region of the LED11) of the board|substrate 10 falls.

On the other hand, when the elastic body Ds is provided, the entire elastic body Ds is uniformly deformed into a convex shape by the differential pressure Fa as shown in FIG. 23(c) . Therefore, the bending rate of the sealing member P in the area|region P1 improves. That is, since the sealing sheet S becomes easy to deform according to the shape of the upper surface in the LED11 mounting region of the board|substrate 10, the filling property of the sealing material Sb with respect to the uneven|corrugated part of the board|substrate 10 can be improved. . Therefore, sealing of LED11 by sealing sheet S can be performed more precisely.

(6) In the embodiment, the heating mechanism 120 is arranged and provided on the upper space H2 side of the chamber 29 to heat the upper space H2, but it is not limited thereto. That is, the heating mechanism 120 may be configured to heat the lower space H1. As an example, the structure which arranges and provides the heater 125 inside the holding table 9, and heats the sheet|seat T for conveyance and the sealing sheet S by the heater 125 heating the lower space H1 is mentioned. Further, the heating mechanism 120 may be configured to heat both the upper space H1 and the lower space H2.

(7) In the Example, although the LED11 was mentioned as an example and demonstrated as the device used as the object of sealing by the sealing sheet S, it is not limited to this. As another example of the device, a semiconductor element, an electronic component, etc. are mentioned in addition to the optical element which takes the LED 11 as an example.

(8) In an Example, after sealing LED11 with the sealing sheet S, you may perform the process of hardening the sealing material Sb of the sealing sheet S. Although the process of hardening the sealing material Sb can be changed suitably according to the material of the sealing material Sb, hardening by heat processing, hardening by ultraviolet treatment, etc. are mentioned as an example.

(9) In the Example, although OCA is used as the sealing material Sb, it is not limited to this. That is, the sealing material Sb may use an optically opaque material other than an optically transparent material, and may use a colorless or colored material.

(10) In the embodiment, the sealing member P was described by taking as an example a configuration including the elongate conveyance sheet T and the predetermined shape sealing sheet S, but the sealing member P is limited to the configuration provided with the conveying sheet T it doesn't happen As an example, the sealing member P may be comprised by the elongate sealing sheet S as shown to Fig.24 (a). The structure of step S3 in the case of sealing LED11 using elongate sealing sheet S is shown in FIG.24(b). That is, the lower housing 29A and the upper housing 29B form the chamber 29 by sandwiching the sealing sheet S.

And by deforming elongate sealing sheet S into convex shape in step S4, as shown in FIG.24(b), LED11 is made to cover with sealing sheet S. Moreover, as shown to FIG.24(c), sealing sheet S seals LED11 by pressurizing the atmospheric|air pressure of the upper side space H2 to atmospheric pressure or more at least in step S5.

(11) In the embodiment, the holding table 9 is moved up and down at a predetermined timing to seal the LED 11 , but the raising/lowering movement of the holding table 9 may be appropriately changed. As an example, the pressing process concerning step S5 is not limited to the structure performed after lowering|falling the holding table 9, You may perform a press process, maintaining a raised state.

(12) In the embodiment, the frame holding portion 38 is disposed outside the lower housing 29A, but the frame holding portion 38 may be provided inside the lower housing 29A. In this case, the process after step S4 is performed in the state which accommodated each of the ring frame f and the board|substrate 10 inside the chamber 29. As shown in FIG.

(13) In the Example, although the sealing sheet S with which the sealing member P is equipped may be previously shape|molded so that it may become a predetermined shape according to the shape of the LED11 mounting surface of the board|substrate 10, it is not limited to this. That is, the sheet|seat supply part 71 may load the sealing member P by which the elongate sealing sheet S was mounted in the elongate conveyance sheet|seat T. The structure of the sealing member P in which the elongate sealing sheet S is attached to the elongate conveyance sheet|seat T, and is provided is as showing to Fig.25 (a). In this case, the device sealing apparatus 1 is equipped with the sheet|seat cutting apparatus 201 upstream of the chamber 29, and the sheet|seat cutting apparatus 201 shape|molds the elongate sealing sheet S into a predetermined shape.

The structure of the sheet cutting device 201 is as shown in FIG.25(b). The sheet cutting device 201 includes a support table 203 , a cutter 205 , and a sealing sheet recovery unit 207 . The support table 203 is arrange|positioned so that the elongate sealing member P fed out along the direction L from the sheet|seat supply part 71 and supplied may be received horizontally. The cutter 205 is arrange|positioned and provided above the support table 203, and is movable up and down by the movable table (not shown). As an example of the cutter 205, a substantially rectangular Thompson blade is used.

When the cutter 205 descend|falls, the layer of the sealing sheet S among the sealing members P is cut out in substantially rectangular shape. The configuration in which the cutter 205 cuts the sealing sheet S is not limited thereto, and as another example, the knife-shaped cutter 205 is moved along a substantially rectangular orbit to cut out the sealing sheet S into a substantially rectangular shape. configuration, and the like.

The sealing sheet collection|recovery part 207 collect|recovers unnecessary sealing sheet Sn left around the sealing sheet S cut|disconnected in the substantially rectangular shape. Sealing sheet Sn which is an unnecessary part peels from the sheet|seat T for conveyance just behind the conveyance roller 208. The peeled sealing sheet Sn is guided to the recovery bobbin 210 by the guide roller 209 . The collection bobbin 201 winds up and collect|recovers sealing sheet Sn peeled from the sheet|seat T for conveyance. Therefore, as for the sealing member P by the sheet|seat cutting device 201, the sealing sheet S shape|molded into the substantially rectangle by the cutter 205 will be left in the sheet|seat T for conveyance. The sealing sheet S cut into a substantially rectangular shape is guided to the chamber 29 together with the conveyance sheet T.

1: Device sealing device
3: Substrate transport mechanism
5: Courage
6: sealing body recovery part
7: Aligner
8: Holding table
9: Frame feed
10: substrate (workpiece)
11: LED (device)
13: sealing unit
16: substrate transfer device
17: frame conveying device
23: holding arm
27: adsorption plate
28: suction pad
31: vacuum device
32: pressurization device
33: control unit
38: frame holding part
71: sheet supply unit
72: separator recovery unit
73: device seal
74: sheet recovery unit
81: device sealing mechanism
82: sheet cutting mechanism
85: sticking roller
86: nip roller
95: cutter
f: ring frame
T: return sheet
S: sealing sheet
P: sealing member
MF: seal
Ta: material
Tb: adhesive
Sa: material
Sb: sealing material

Claims (11)

A agent for covering the device with the sheet-like sealing material by accommodating a workpiece on which a device is mounted and a sheet-like sealing material in a chamber, and bringing the sheet-like sealing material into contact with the device mounting surface of the workpiece in a state in which the internal space of the chamber is depressurized. 1 sealing process;
a second sealing process of sealing the device with the sheet-like sealing material by increasing the pressure of the internal space of the chamber after the first sealing process;
A device sealing method comprising: According to claim 1,
In the first sealing step, the sheet-like sealing material is brought into contact with the device mounting surface of the work by deforming the sheet-like sealing material into a convex shape toward the device mounting surface of the work.
Device sealing method, characterized in that. According to claim 1,
In the second sealing process, increasing the pressure of the internal space of the chamber to a pressure equal to or higher than atmospheric pressure
Device sealing method, characterized in that. 3. The method of claim 2,
The sheet-like sealing material is held by a long conveyance sheet,
The chamber has an upper housing and a lower housing,
The first sealing process is
The inner space of the chamber by sandwiching the transport sheet by the upper housing and the lower housing, the lower space in which the workpiece is placed with the device mounting surface facing upward; an upper and lower space forming process of dividing the upper space opposite to the lower space by interposing the held sheet-shaped sealing material;
an upper and lower space decompression process of decompressing the upper space and the lower space;
After the upper and lower space decompression process, the pressure in the upper space is made higher than the pressure in the lower space, and the sheet-like sealing material is deformed into a convex shape toward the device mounting surface by the differential pressure generated between the upper space and the lower space. and bringing the sheet-shaped sealing material into contact with the device mounting surface of the work.
Device sealing method, characterized in that. 3. The method of claim 2,
The sheet-like sealing material is held by a long conveyance sheet,
The chamber has an upper housing and a lower housing,
The first sealing process is
The inner space of the chamber by sandwiching the transport sheet by the upper housing and the lower housing, the lower space in which the workpiece is placed with the device mounting surface facing upward; an upper and lower space forming process of dividing the upper space opposite to the lower space by interposing the held sheet-shaped sealing material;
By depressurizing only the lower space of the upper space and the lower space, the sheet-like sealing material is deformed into a convex shape toward the device mounting surface by the differential pressure generated between the upper space and the lower space, and the lower space is depressurized. and a pressure-sensitive contact process in which the sheet-shaped sealing material is brought into contact with the device mounting surface of the work in a state of being present.
Device sealing method, characterized in that. 6. The method according to claim 4 or 5,
The sheet-like sealing material has a predetermined shape corresponding to the device mounting surface of the work and is held by the elongated conveyance sheet.
Device sealing method, characterized in that. 6. The method according to claim 4 or 5,
and a sheet-shaped elastic body disposed inside the upper housing;
In the step of forming the upper and lower space, the transport sheet is sandwiched by the upper housing and the lower housing, so that the sheet-like elastic body is placed on a surface of the transport sheet that does not hold the sheet-like sealing material. The sheet-shaped elastic body is arranged so that the
Device sealing method, characterized in that. 6. The method according to claim 4 or 5,
a heating process of heating the sheet-shaped sealing material by heating at least one of the lower space and the upper space;
In the first sealing step, the sheet-shaped sealing material heated by the warming step is brought into contact with the device mounting surface of the work.
Device sealing method, characterized in that. 6. The method according to any one of claims 1 to 5,
The work is provided with one or two or more convex-shaped members on the surface opposite to the shopping device mounting surface,
Further comprising a holding step of holding the work by using a holding member having a concave portion in the central portion, in a state in which the convex-shaped member is disposed inside the concave portion,
After the work is held by the holding member, the first sealing process is performed.
Device sealing method, characterized in that. A agent for covering the device with the sheet-like sealing material by accommodating a workpiece on which a device is mounted and a sheet-like sealing material in a chamber, and bringing the sheet-like sealing material into contact with the device mounting surface of the workpiece in a state in which the internal space of the chamber is depressurized. 1 sealing mechanism;
a second sealing mechanism for sealing the device with the sheet-like sealing material by increasing the pressure of the internal space of the chamber after the first sealing process;
Device sealing apparatus characterized in that it is provided. A semiconductor product manufacturing method for manufacturing a semiconductor product in a state in which a device mounted on a work is sealed with a sheet-like sealing material,
A agent for covering the device with the sheet-like sealing material by accommodating a workpiece on which a device is mounted and a sheet-like sealing material in a chamber, and bringing the sheet-like sealing material into contact with the device mounting surface of the workpiece in a state in which the internal space of the chamber is depressurized. 1 sealing process;
a second sealing process of sealing the device with the sheet-like sealing material by increasing the pressure of the internal space of the chamber after the first sealing process;
A method for manufacturing a semiconductor product comprising:

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