KR20120087462A - Substrate bonding apparatus and substrate bonding method - Google Patents

Substrate bonding apparatus and substrate bonding method Download PDF

Info

Publication number
KR20120087462A
KR20120087462A KR1020110008657A KR20110008657A KR20120087462A KR 20120087462 A KR20120087462 A KR 20120087462A KR 1020110008657 A KR1020110008657 A KR 1020110008657A KR 20110008657 A KR20110008657 A KR 20110008657A KR 20120087462 A KR20120087462 A KR 20120087462A
Authority
KR
South Korea
Prior art keywords
substrate
surface plate
adsorption
chamber
chuck
Prior art date
Application number
KR1020110008657A
Other languages
Korean (ko)
Inventor
황재석
Original Assignee
엘아이지에이디피 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 엘아이지에이디피 주식회사 filed Critical 엘아이지에이디피 주식회사
Priority to KR1020110008657A priority Critical patent/KR20120087462A/en
Publication of KR20120087462A publication Critical patent/KR20120087462A/en

Links

Images

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1339—Gaskets; Spacers; Sealing of cells
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins

Abstract

Substrate bonding apparatus according to the invention the chamber; An upper surface plate installed inside the chamber and having an diaphragm that adheres the upper substrate to the upper adhesive chuck and expands to separate the upper substrate from the upper adhesive chuck; A lift pin installed inside the chamber to face the upper surface plate and adhere the lower substrate bonded to the upper substrate with a lower adhesive chuck, and have a lift pin to move up and down to seat and separate the lower substrate onto the lower adhesive chuck. Lower surface plate; A lift pin driver for raising and lowering the lift pins; According to the present invention having the above configuration, a plurality of adsorption grooves are formed on the lower surface plate to form a long length and adsorb the lower substrate seated on the lower surface plate in a flat form. Adsorbed from the portion to the outer portion, the substrate can be kept flat by adsorption, thereby preventing breakage of the substrate, and the yield is improved according to accurate bonding.

Description

Substrate bonding apparatus and substrate bonding method

The present invention relates to a substrate bonding apparatus and a substrate bonding method, and more particularly, to a substrate bonding apparatus and a substrate bonding method capable of holding and adsorbing a substrate flat.

The substrate bonding apparatus is a device for bonding two substrates for the manufacture of a flat panel display panel and is used for manufacturing various flat panel display panels such as LCD, PDP, OLED, and the like.

The substrate bonding apparatus includes a substrate chuck supporting the substrate in order to bond the substrate using the substrate bonding apparatus. There are several types of substrate chucks, the most commonly used being electrostatic chucks. The electrostatic chuck chucks the substrate using electrostatic power. Thus, the electrostatic chuck consumes power to generate constant power. Electrostatic chucks require power and are very difficult to manufacture and control. And the manufacturing cost of the electrostatic chuck is very expensive.

In addition, the electrostatic chuck has a problem due to the residual electrostatic force.

This problem is that when the new substrate is placed on the stage for the bonding process, the new substrate is not flattened by the residual electrostatic force of the electrostatic chuck to maintain the substrate in the previous process.

As a result, the substrate may be damaged and a problem may occur in that the process yield is lowered because the exact bonding process is not performed.

The present invention is to provide a substrate bonding apparatus and a substrate bonding method capable of flatly adsorbing a substrate.

Substrate bonding apparatus according to the invention the chamber; An upper surface plate installed inside the chamber and having an diaphragm that adheres the upper substrate to the upper adhesive chuck and expands to separate the upper substrate from the upper adhesive chuck; A lift pin installed inside the chamber to face the upper surface plate and adhere the lower substrate bonded to the upper substrate with a lower adhesive chuck, and have a lift pin to move up and down to seat and separate the lower substrate onto the lower adhesive chuck. Lower surface plate; A lift pin driver for raising and lowering the lift pins; It is formed in a long shape on the lower surface plate and includes a plurality of adsorption grooves for adsorption in a flat form the lower substrate seated on the lower surface plate.

The adsorption groove may be adsorbed from the center of the lower substrate to the outside, and the adsorption groove may be formed in a vertically or symmetrical form with respect to the lower substrate.

The adsorption groove is formed longest in the diagonal portion of the lower substrate, the lower surface plate is formed in the suction hole is connected to the adsorption groove vertically penetrating the lower surface to provide the suction force to the adsorption groove Can be.

In the substrate bonding method according to the present invention, the upper substrate may be attached to the upper adhesive chuck installed on the upper surface plate, and the lower substrate may be seated on the lower surface surface and adsorbed outward from the center of the lower substrate to adhere to the lower adhesion chuck.

The lower surface plate may be adsorbed through an adsorption groove having a length form from the center to the outer side, and the lower surface plate may provide adsorption force to the absorption groove through a suction hole connected to the absorption groove by vertically penetrating the lower surface plate. have.

When the substrate is seated, the substrate bonding apparatus and the substrate bonding method according to the present invention can keep the substrate flat by adsorbing as it spreads from the center portion to the outer portion, thereby preventing breakage of the substrate, and improving the yield according to the exact bonding. There is.

1 and 2 are views showing the configuration of the substrate bonding apparatus according to the present embodiment.
3 is a perspective view of a lower surface plate constituting the substrate bonding apparatus according to the present embodiment.
4 is a cross-sectional view taken along line II ′ of FIG. 2.
5 and 6 are views showing a state in which the substrate is adsorbed on the lower surface plate of the substrate bonding apparatus according to the present embodiment.
7 is a flowchart illustrating an operating state of the substrate bonding apparatus according to the present embodiment.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the embodiment disclosed below, the substrate bonding apparatus will be described as an example. However, embodiments of the present invention can be used in not only substrate bonding apparatuses, but also etching apparatuses, deposition apparatuses, and various other apparatuses for substrate processing.

As shown in FIG. 1 and FIG. 2, the substrate bonding apparatus according to the present embodiment includes a chamber. The chamber includes an upper chamber 100 and a lower chamber 200 on which the upper substrate S1 and the lower substrate S2 are seated. The lower chamber 200 is fixed to the base (unsigned), and the upper chamber 100 is lifted up and down by the chamber lifting unit 300 formed of a universal joint or a ball screw.

An upper surface plate 110 is installed in the upper chamber 100, and an upper adhesion chuck 120 is attached to the upper surface plate 110 to adhere the upper substrate S1. A plurality of upper adhesion chuck 120 is installed distributed in the upper surface plate (110). When the upper substrate S1 and the lower substrate S2 are bonded to the central portion of the upper adhesion chuck 120, the diaphragm expands by air to separate the upper substrate S1 toward the lower substrate S2. 112 is provided. An adhesive member (not shown) is provided around the diaphragm 112. The adhesive member 114 is commonly used for the upper adhesive chuck 120 and the lower adhesive chuck 212 to be described later. The adhesive member 114 includes an organopolysiloxane (10 to 75 parts by weight), an organohydrogenpolysiloxane (5 to 30 parts by weight), an addition reaction catalyst, and the like containing an alkenyl group bonded to a small amount of silicon atoms. It is manufactured by hardening addition reaction hardening type silicone rubber composition which has a main component. In addition, the adhesive member 114 may be directly formed by compression molding, injection molding, injection molding, punching or the like.

In addition, a sealing film (not shown) may be coated on another surface of the adhesive member 114 other than the surface to which the upper substrate S1 is attached. This sealing film is composed of Liquid Silicone Rubber (LSR), Room-Temperature-Vulcanizing (RTV) Elastomers (HCR), High Consistency Silicone Rubber (HCR), Silicone Modified Organic Compound (SMO) ) Elastomeric Emulsion (SMO) Elastomeric Emulsion and other components that can perform a sealing function can be formed.

A lower surface plate 210 is installed in the lower chamber 200, and a lower adhesion chuck 212 for chucking the lower substrate S2 is installed in the lower surface plate 210. The lower adhesion chuck 212 installed on the lower surface plate 210 is for seating and holding the lower substrate S2, which is described as an adhesive chuck in this embodiment, but an electrostatic chuck that chucks the substrate with electrostatic force is applied. , ESC).

The lower surface plate 210 is provided with a plurality of lift pins 162 to penetrate through the lower surface plate 210 and the lower adhesion chuck 212. The lift pin 162 rises to the bottom surface of the lower substrate S2 to support the lower substrate S2 when the lower substrate S2 mounted on the lower adhesion chuck 212 is carried in, and then descends to lower the lower adhesion. The lower substrate S2 is seated on the chuck 212. And after the upper substrate (S1) and the lower substrate (S2) is bonded to serve to raise the panel to take out the bonded panel to the outside. The plurality of lift pins 162 are disposed to support the lower substrate S2, and are lifted by the lift pin driver 290 by grouping the pins 172. The lower part of the lift pin 162 is provided with a bellows 167 for guiding the lifting of the lift pin 162 and at the same time maintaining the vacuum in the chambers 100 and 200. As described above, the lift pin 162 may be lifted and lifted by the pin driver 290, and the lift pin 162 is relatively lifted by lifting the lower surface plate 210 while the lift pin 162 is fixed. It can also be produced in the form of lifting and receiving the lower substrate (S2).

In addition, the lower surface plate 210 is formed in a long shape from the central portion to the outer portion is formed with an adsorption groove 228 for planarizing the lower substrate (S2) that is seated on the lower surface plate (210). Adsorption proceeds from the central portion to the outer portion through the adsorption groove 228 to planarize.

As shown in the drawing, the suction groove 228 is formed around the lower adhesion chuck 212 of the lower surface plate 210, and there is also a portion in which only the suction groove 228 is formed. The suction groove 228 may be formed in a vertically and horizontally symmetrical shape with respect to the central portion of the lower substrate S2 or the lower surface plate 210 to stably flatten the lower substrate S2.

The length of the suction groove 228 may be formed to have the longest diagonal portion with respect to the lower substrate S2 having a general rectangular shape.

The suction groove 228 is formed with a suction hole 232 connected to the suction groove 228 vertically through the lower surface 210 so that the suction force is provided. Adsorption hole 232 is formed in the suction groove 228 portion closest to the edge portion of the lower surface plate 210 on the basis of the drawing shown in the suction portion from the central portion of the lower surface plate 210 to act sequentially to the outer portion Let it go

In addition, a camera (not shown) may be installed in the upper chamber 100 to photograph the alignment marks displayed on the upper substrate S1 and the lower substrate S2 so as to check whether the substrates are positioned at the exact bonding points. have. The camera photographs the alignment marks formed on the upper substrate S1 and the lower substrate S2 through the photographing holes passing through the upper chamber 100. In this case, an illumination device (not shown) may be installed below the lower chamber 200 so that the camera can photograph the alignment mark to provide illumination to the camera.

The space between the upper chamber 100 and the lower chamber 200 forms a process space. In addition, a high vacuum molecular pump (Turbo Molecular Pump, TMP) and a dry pump (Dry pump) may be connected to the chambers 100 and 200 to implement the inside of the process space in a vacuum atmosphere.

In addition, a lower surface alignment device 230 connected to the lower surface 210 is installed at an outer lower portion of the lower chamber 200. Lower surface alignment device 230 may be a UVW stage. In addition, a lift driver 240 for driving the lower surface sorter 230 and the lower surface 210 up and down is installed below the lower surface sorter 230. The lift driver 240 may be a linear motor or a hydraulic actuator.

On the other hand, the substrate bonding apparatus of this embodiment is provided with an adhesive chuck air supply unit 400 for supplying air to the upper adhesion chuck 120. And a control unit 500 for controlling the operation of the adhesive chuck air supply unit 400 and the lifting drive unit 240 is provided. The controller 500 may control the overall operation of the substrate bonding apparatus.

Hereinafter, a description will be given of a substrate bonding method according to this embodiment of the configuration described above.

7 is a flowchart illustrating an operating state of the substrate bonding apparatus according to the present embodiment.

Referring to FIG. 7, in a state where the upper chamber 100 and the lower chamber 200 are spaced apart from each other, the robot (not shown) may move the upper substrate S1 into a space between the upper chamber 100 and the lower chamber 200. ), The vacuum suction pin 193 installed on the upper surface plate 110 is lowered, and the upper substrate S1 is vacuum-adsorbed and then raised, and the upper substrate is adhered to the adhesive chuck 120 installed on the upper surface plate 110. (S100)

Next, when the lower substrate S2 is carried in by the robot, the lift pin 162 is raised to support the lower substrate S2, and the robot exits to the outside while supporting the lower substrate S2. Thereafter, the lift pin 162 is lowered to seat the lower substrate S2 on the lower surface plate 210.

At this time, the vacuum pump (not shown) operates to attract the suction force to the suction groove 228 through the suction hole 232 to which the pipe 279 is connected. As shown in FIGS. 5 and 6, the lower substrate S2 positioned in the adsorption groove 228 is sequentially adsorbed from the center portion to the outer portion by the adsorption force, thereby flattening.

The lower substrate S2, which is planarized by the adsorption force at the center portion, becomes planarized and adheres to the lower adhesion chuck 212.

Thereafter, the upper chamber 100 is lowered by the chamber elevating unit 300 to be in close contact with the lower chamber 200, thereby forming a process space. When the process space is formed, a vacuum state is formed in the process space by the dry pump and the high vacuum molecular pump.

Subsequently, the upper surface plate 210 descends to align the upper substrate S1 and the lower substrate S2 step by step. When the alignment of the upper substrate S1 and the lower substrate S2 is completed, the diaphragm 112 of the upper adhesive chuck 120 supporting the upper substrate S1 is expanded, so that the upper substrate S1 is lower substrate ( S2) is separated to the side and bonded. (S300)

At the same time or after a predetermined time, the control unit 500 operates the lifting driving unit 240 to lower the lower surface plate 210 at a low speed. At this time, the lower speed of the lower surface plate 210 is 0.05 ~ 0.5mm / sec.

After the above process is completed, the upper chamber 100 and the lower chamber 200 is spaced apart, the lift pin 162 of the lower chamber 200 is raised. And the bonding process is completed by carrying out the process of carrying out the panel that the robot is brought in from outside.

The above embodiment of the present invention should not be construed as limiting the technical idea of the present invention. The scope of protection of the present invention is limited only by the matters described in the claims, and those skilled in the art will be able to modify the technical idea of the present invention in various forms. Accordingly, such improvements and modifications will fall within the scope of the present invention as long as they are obvious to those skilled in the art.

100 ... upper chamber 200 ... lower chamber
110 ... top plate 210 ... bottom plate
120 Top adhesive 228 Adsorption groove
240 ... lift drive 400 ... stick air supply
500 ... control unit

Claims (8)

chamber;
An upper surface plate installed inside the chamber and having an diaphragm that adheres the upper substrate to the upper adhesive chuck and expands to separate the upper substrate from the upper adhesive chuck;
A lower surface plate installed in the chamber to face the upper surface plate, the lower substrate bonded to the upper substrate with a lower adhesive chuck, and a lower surface plate having lift pins for seating and separating the lower substrate on the lower adhesive chuck;
A lift pin driver for raising and lowering the lift pins;
And a plurality of adsorption grooves formed in the lower surface plate to have a long length to adsorb the lower substrate seated on the lower surface plate in a flat form.
The apparatus of claim 1, wherein the adsorption groove is adsorbed from the center of the lower substrate to the outside.
The substrate bonding apparatus of claim 1, wherein the adsorption groove is formed to be vertically symmetric with respect to the lower substrate.
The substrate bonding apparatus of claim 1, wherein the adsorption groove is formed longest in the diagonal portion of the lower substrate.
The substrate according to any one of claims 1 to 4, wherein the lower surface plate is provided with an adsorption hole vertically penetrating the lower surface plate to be connected to the adsorption groove to provide adsorption force to the adsorption groove. Cementing device.
Attach the upper substrate to the upper adhesive chuck installed on the upper surface plate,
Substrate bonding method characterized in that the lower substrate is seated on the lower surface plate and adsorbed outward from the center of the lower substrate to adhere to the lower adhesion chuck.
7. The method of claim 6, wherein the lower surface plate is adsorbed through an adsorption groove having a long length from the center to the outside.
The substrate bonding method of claim 7, wherein the lower surface plate vertically penetrates the lower surface plate to provide an adsorption force to the adsorption groove through an adsorption hole connected to the adsorption groove.
KR1020110008657A 2011-01-28 2011-01-28 Substrate bonding apparatus and substrate bonding method KR20120087462A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1020110008657A KR20120087462A (en) 2011-01-28 2011-01-28 Substrate bonding apparatus and substrate bonding method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020110008657A KR20120087462A (en) 2011-01-28 2011-01-28 Substrate bonding apparatus and substrate bonding method

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR1020130049971A Division KR20130054307A (en) 2013-05-03 2013-05-03 Substrate bonding apparatus and substrate bonding method

Publications (1)

Publication Number Publication Date
KR20120087462A true KR20120087462A (en) 2012-08-07

Family

ID=46873007

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020110008657A KR20120087462A (en) 2011-01-28 2011-01-28 Substrate bonding apparatus and substrate bonding method

Country Status (1)

Country Link
KR (1) KR20120087462A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101403850B1 (en) * 2012-11-19 2014-06-03 주식회사 야스 System for holding large scale substrate
KR101403840B1 (en) * 2012-11-19 2014-06-03 주식회사 야스 Mixed type large scale area substrate holding unit
KR101457044B1 (en) * 2012-12-27 2014-10-31 엘아이지에이디피 주식회사 Apparatus and method for attaching substrates

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101403850B1 (en) * 2012-11-19 2014-06-03 주식회사 야스 System for holding large scale substrate
KR101403840B1 (en) * 2012-11-19 2014-06-03 주식회사 야스 Mixed type large scale area substrate holding unit
KR101457044B1 (en) * 2012-12-27 2014-10-31 엘아이지에이디피 주식회사 Apparatus and method for attaching substrates

Similar Documents

Publication Publication Date Title
TWI462665B (en) Adhesive chuck and substrate bonding apparatus
JP4955070B2 (en) Bonded substrate manufacturing apparatus and bonded substrate manufacturing method
KR101383282B1 (en) Substrate bonding apparatus
KR20100085366A (en) Substrate holder unit and subtrate assembling appartus having the same
KR101261491B1 (en) Substrate bonding apparatus and substrate bonding method
KR102175509B1 (en) Apparatus and Method of Bonding Flexible Display and Curved Cover Element
JP5061515B2 (en) Wafer bonding apparatus and wafer bonding method
KR101349329B1 (en) Sealing System and method of Organic Light Emitting Diode
KR20120134368A (en) Substrate chucking and de-chucking apparatus
KR20120087462A (en) Substrate bonding apparatus and substrate bonding method
KR100574433B1 (en) Apparatus for bonding substrates and method for bonding substrates
KR20130054307A (en) Substrate bonding apparatus and substrate bonding method
KR101408644B1 (en) Compensation device for stage flatness ratio of connation coalescence board
KR101288864B1 (en) Substrate bonding apparatus
TWI662651B (en) Support chuck and substrate treating apparatus
KR101340614B1 (en) Substrate bonding apparatus
JP4286562B2 (en) Substrate bonding equipment
KR101456693B1 (en) Apparatus for attaching substrates
KR101268397B1 (en) Substrate bonding apparatus and substrate bonding method
CN1445588A (en) Working platform structure of binding machine and its control method
KR20220112539A (en) Apparatus for processing substrate and method of processing substrate
KR101278703B1 (en) Apparatus for sticking force measuring instrument of Substrate bonding and method for thereof
KR101261489B1 (en) Substrate bonding apparatus
KR101356624B1 (en) Substrate bonding apparatus
JP4642350B2 (en) Substrate laminating apparatus and laminating method

Legal Events

Date Code Title Description
A201 Request for examination
E902 Notification of reason for refusal
AMND Amendment
E601 Decision to refuse application
AMND Amendment
E801 Decision on dismissal of amendment
A107 Divisional application of patent