TWI662651B - Support chuck and substrate treating apparatus - Google Patents

Abstract

The present invention provides a support jig and a substrate having the same. 理 设备。 Management equipment. The supporting jig supporting the substrate includes: a main body having an internal space; and an expandable member configured to divide the internal space in a thickness direction of the main body, and the expandable member is disposed in the main body so as to be injected into the spaced apart partitioned space by The gas moves the expandable member in the thickness direction of the main body; the moving member passes through one surface of the main body in the thickness direction of the main body and is disposed on the expandable member; and the adhesive member is disposed on the main body's outward moving member On the ends. It is possible to prevent the substrate from being twisted while the substrate is separated from the unit supporting the substrate.

Description

Support fixture and substrate processing equipment

The present invention relates to a support jig and a substrate processing apparatus, and more particularly, to a support jig capable of preventing twisting of a substrate when the substrate is separated from a unit supporting the substrate, and a substrate processing having the same. device.

Generally, a flat display device such as a liquid crystal display (LCD) and an organic light emitting device (OLED) are manufactured by bonding a pair of flat substrates to each other. For example, an upper substrate on which a plurality of thin film transistors are located, an organic light emitting layer, and an electrode are disposed to be bonded to a lower substrate serving as a capping layer to manufacture an OLED. Here, the device for combining the above substrates is realized in various shapes. For example, a "substrate bonding apparatus" is disclosed in Korean Patent Registration No. 10-1340614.

As disclosed in the above-mentioned patent registration publication, in general, a device for bonding substrates according to the prior art includes: a surface plate; an adhesive member coupled to the surface plate to support the substrate; and a ejector pin for The bonded parts separate the substrate.

Meanwhile, in the apparatus for bonding substrates according to the related art, a process for bonding substrates is performed, and then the ejector pins are protruded toward the substrate to detach and separate the substrate from the bonding member. Here, there are the following restrictions.

While the substrate is separated from the adhesive member, the ejector pin continuously contacts and presses the substrate. Therefore, while the substrate is separated from the adhesive member, a local load is applied to the substrate, and thus the substrate may be damaged. Also, although the ejector pins apply a force to the substrate to push the substrate from the adhesive member, the upper substrate and the lower substrate may be misaligned.

In addition, there are the following additional restrictions in a device according to the related art. In a device according to the prior art, a mechanical element for driving a plurality of ejector pins must be placed inside or outside the cavity, and the cavity must be penetrated to allow the above-mentioned element to be placed inside or outside thereof . Also, the elements for strengthening the structure of the penetrating chamber and the elements for sealing the penetrable processing area must be placed inside or outside the chamber. That is, the device according to the related art is implemented in a complicated structure to mechanically drive a plurality of ejector pins, and therefore it may be difficult to maintain a sealed state inside the chamber, and maintenance of the device may be difficult. [Prior Art Literature] [Patent Literature] (Patent Literature 1) KR10-1340614 B1

The present invention provides a support jig, a substrate processing apparatus, and a substrate processing method that can stably separate a substrate from a unit that supports the substrate.

The present invention also provides a support jig, a substrate processing apparatus, and a substrate processing method capable of preventing the substrate from being twisted while the substrate is separated from a unit supporting the substrate.

The present invention also provides a support jig, a substrate processing apparatus, and a substrate processing method capable of preventing the substrate from being damaged while the substrate is separated from a unit supporting the substrate.

The present invention also provides a support jig and a substrate processing apparatus, which can simplify the structure thereof.

According to an exemplary embodiment, a support jig supporting a substrate includes: a main body having an internal space; and an expandable member configured to divide the internal space in a thickness direction of the main body, the expandable member being disposed in the main body such that Gas is injected into the spaced apart space to move the expandable member in the thickness direction of the main body; a moving member that passes through one surface of the main body in the thickness direction of the main body and is placed on the expandable member; and an adhesive member It is placed on the end of the moving part outward from the main body.

The support jig may further include a shower head disposed in the main body such that gas is injected into at least one of the partition spaces in a thickness direction of the main body. And, the support jig may further include a buffer member disposed in at least one of the partition spaces and having one end portion connected to the expandable member. The through hole and the vacuum hole may be defined in one surface of the body, and the adhesive member is disposed in the through hole.

The bonding surface of the bonding member exposed to the outside of the main body may be disposed in a through hole or parallel to one surface of the main body by a gas selectively injected into the partition space.

The support jig may further include a sealing member disposed in the through hole such that a space between at least one of the upper end of the adhesive member and the moving member and the through hole is sealed.

The expandable member may include: an elastic film disposed in the main body to divide an internal space; and a reinforcing plate disposed on at least one surface of the elastic film such that the reinforcing plate moves in a thickness direction of the main body according to a shape change of the elastic film. .

The buffer member may include a guide member disposed in the main body toward the expandable member, and an elastic member disposed outside the guide member and having one end connected to the expandable member and the other end connected to the main body.

According to another exemplary embodiment, a substrate processing apparatus includes: a chamber having a substrate processing space; an upper support member disposed in the chamber; a lower support member disposed to face the upper support member; and A support jig, which is disposed on at least one of the upper support and the lower support, the support jig having a partition space separated from each other, wherein the support jig includes an adhesive member, and the adhesive member may be selectively injected by The gas into the divided space moves outward or inward in the support fixture.

The support jig may be provided in plurality, and the plurality of support jigs may be disposed in a plurality of regions defined on at least one of a bottom surface of the upper support and a top surface of the lower support.

The support jig may include: a main body having an internal space; and an expandable member configured to divide the internal space in a thickness direction of the main body, and the expandable member is disposed in the main body so that the expandable member passes The gas injected into the spaced apart space moves in the thickness direction of the main body; and a moving member which is disposed on the expandable member and has at least one portion inserted into the main body.

The support jig may include: a buffer member disposed in the main body toward the expandable member to contact and support the expandable member; and a tube configured to inject a gas into the partitioned space. In each one.

The through hole and the vacuum hole may define one surface of the main body, and the adhesive member may be coupled into an end portion of the moving member outward of the main body so that the adhesive member moves through the through hole.

The expandable member may include: an elastic film disposed on the main body such that an internal space is divided in a thickness direction of the main body; and a reinforcing plate disposed on at least one surface of the elastic film.

The buffer member may include a guide member disposed in at least one of the partition spaces facing the expandable member and having an end facing the expandable member spaced apart from the expandable member; and An elastic member is disposed outside the guide member, the elastic member has one end connected and supported on the main body and the other end connected and supported on the expandable member.

The substrate processing apparatus may further include a sealing member disposed on one end of the through hole and thus include a space between the through hole and an outer circumferential surface of the adhesive member.

The sealing member may include: a sealing film extending from an outer circumferential surface of the adhesive member toward an inner wall of one end of the through-hole; and a ring member disposed on the inner wall of one end of the through-hole so that the sealing film is hermetically sealed Placed on one end of the through hole.

According to yet another exemplary embodiment, a substrate processing method includes: preparing an upper substrate and a lower substrate; allowing the lower substrate to be supported by the lower support and the upper substrate to be supported by the upper support; and using the support jig of the upper support to lift the upper portion The substrate is fixed to the support jig; the distance between the upper support and the lower support is reduced to bond the upper substrate to the lower substrate; the upper substrate is released from the support jig; and the bonded substrate is separated from the upper support and the lower support.

The lower substrate may be vacuum-adsorbed to be supported by the lower support, and the upper substrate may be vacuum-adsorbed to be adhered to the upper support.

Fixing the upper substrate to the support jig may include: injecting gas into the upper partition space in the support jig; and allowing the adhesive member of the support jig to descend; and allowing the adhesive member to be adhered to the upper substrate.

Releasing the upper substrate from the support jig may include: injecting gas into the lower partition space in the support jig, allowing the bonded parts of the support jig to rise; and separating the bonded parts from the upper substrate.

While the gas is injected into the lower partitioned space in the support jig, the gas previously injected into the upper partitioned space in the support jig may be discharged. And, while the upper substrate is released from the supporting jig, the upper substrate may be attracted to be supported by the supporting jig.

In order to make the above features and advantages of the present invention more comprehensible, embodiments are hereinafter described in detail with reference to the accompanying drawings.

Hereinafter, specific embodiments will be described in detail with reference to the accompanying drawings. The invention may, however, be embodied in different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this invention will be thorough and complete, and these embodiments will fully convey the scope of the invention to those skilled in the art. In the drawings, the sizes of layers and regions are exaggerated for clarity of illustration. The same reference numbers refer to the same elements throughout.

FIG. 1 is a side view of a substrate processing apparatus according to an embodiment, and FIG. 2 is a side view of a support jig according to an embodiment. And, FIGS. 3 (a) and 3 (b) are partial views of a support jig according to a modified example, and FIGS. 4 to 8 are views illustrating a state in which a substrate processing apparatus is operated according to an embodiment. And, FIG. 9 is a flowchart illustrating a substrate processing method according to an embodiment.

A substrate processing apparatus according to an embodiment is a device for bonding an upper substrate to a lower substrate. As illustrated in FIGS. 1 to 8, the substrate processing apparatus includes: a chamber 100 having a substrate processing space; an upper supporter 200 which is disposed in the chamber 100 to support the upper substrate S1; and a lower supporter 300 which is disposed to Face the upper supporter 200 to support the lower substrate S2; and a support jig 600 that is disposed on at least one of the upper supporter 200 and the lower supporter 300 and has a partition space 610: a partition space 610a and a partition space 610b separated from each other.

Here, the gas-movable adhesive member 650 may be disposed in the support jig 600 inside or outside of the support jig 600 by being selectively injected into the partition spaces 610a and 610b isolated from each other. The support jig 600 can stably perform the adhesive fixing and separation of the substrate by using the adhesive member 650. That is, the adhesive member 650 may be moved within a through hole 622 which will be described later, and the through hole 622 is defined in the support surface of the support jig 600 while performing fixing or separation of the substrate. The adhesive member 650 may be disposed in the through hole 622 or exposed to a supporting surface of the supporting jig 600. Specifically, when gas is injected into one of the partitioned spaces, for example, into the upper partitioned space 610a, the adhesive member 650 may be moved outside the support jig 600 to adhere to the substrate supported by the support jig 600, for example, Bonded to the upper substrate S1. Alternatively, when the gas is injected into another partitioned space, for example, into the lower partitioned space 610b, the adhesive member 650 may be moved inside the support jig 600 and separated from the substrate, for example, separated from the upper substrate S1.

Although the support jig 600 according to the current embodiment is disposed on the upper supporter 200 to adhere and support the upper substrate S1, the support jig 600 is not particularly limited to this position. For example, the support jig 600 may be disposed on the lower support 300 or in each of the upper support 200 and the lower support 300.

For example, the upper substrate S1 may be a device substrate on which the OLED device is disposed, and the lower substrate S2 may be a capping substrate for capping and protecting the device substrate. The base of each of the upper substrate and the lower substrate may be formed of a transmissive material such as a glass panel. Of course, the embodiment is not limited to this, and each of the upper substrate and the lower substrate may be a substrate constituting a variety of devices and equipment. For example, each of the upper substrate and the lower substrate may be a liquid crystal device substrate constituting a liquid crystal display device.

For example, the chamber 100 includes an upper chamber 100a and a lower chamber 100b having a space in which a process for bonding the upper substrate S1 to the lower substrate S2 or a process for The process of separating the lower substrate S2 from the upper substrate S1. The upper chamber 100a may be detachably coupled to the lower chamber 100b. Separate lifting members (not shown) that lift the upper and lower chambers 100 a and 100 b accordingly are disposed in the chamber 100. The upper chamber 100 a or the lower chamber 100 b is lifted by using a lifting member to load the upper substrate S1 and the lower substrate S2 in the chamber 100 or unload the upper substrate S1 and the lower substrate S2 from the chamber 100. And, a separate pressure adjustment unit (not shown) for adjusting the internal pressure and a separate discharge unit (not shown) for discharging impurities are disposed in the chamber 100.

The upper supporter 200 is disposed at the upper side in the chamber 100 to support the upper substrate S1. The shape of the upper supporter 200 may be manufactured to correspond to the shape of the upper substrate S1. For example, when the upper substrate S1 is a glass panel having a rectangular plate shape, the upper supporter 200 may be manufactured to have a bottom surface having a rectangular plate shape.

The bottom surface of the upper supporter 200 may be divided into a plurality of regions. The support jig 600 according to the embodiment may be provided in a plurality and correspondingly disposed on a plurality of regions on the bottom surface of the upper support 200. Of course, the embodiment is not limited thereto, and, for example, the support jig 600 may be disposed on the lower support 300. Specifically, the support jig 600 may be correspondingly disposed on a plurality of regions defined on the top surface of the lower support 300 to be described later.

The upper driving part is connected to the upper support 200 to lift the upper support 200. The upper driving part includes an upper driving shaft 410 that is connected to the upper support 200 and an upper power part (not shown) that applies power to the upper driving shaft 410. The upper driving shaft 410 passes through the upper chamber 100 a and is thus mounted on the top surface of the upper support 200. A separate sealing member (not shown) is disposed between the upper driving shaft 410 and the upper chamber 100a. And, the upper driving part may further include: a separate alignment unit (not shown) that moves the upper support 200 in the X, Y, or θ direction to align the position of the upper support 200; and a separate sensor (not shown) (Shown) for positioning the upper support 200, the sensor is, for example, a camera.

The lower supporter 300 may be disposed in the lower side of the chamber 100 to support the lower substrate S2. The shape of the lower support 300 may be manufactured corresponding to the shape of the lower substrate S1. For example, the lower support 300 may be manufactured as a bottom surface having a rectangular plate shape.

The lower driving part is connected to the lower support 300 to lift the lower support 300. The lower driving part includes a lower driving shaft 420 connected to the lower support 300 and a lower power part (not shown) for applying power to the lower driving shaft 420. The lower driving shaft 420 passes through the lower chamber 100 b and is thus mounted on the bottom surface of the lower support 300. A separate sealing member (not shown) is disposed between the lower driving shaft 420 and the lower chamber 100b. And, the lower driving part may further include a separate alignment unit (not shown) and a separate sensor (not shown) corresponding to the sensor of the upper driving part.

When the support 600 according to the embodiment is not disposed on the lower support 300, an adsorption part (not shown) may be disposed on the lower support 300 to fix the lower substrate S2. And, the suction part may be disposed on a top surface of the lower support 300. The suction part may have various compositions and structures that can fix the lower substrate S2, and for example, the suction part may include a vacuum jig, an electrostatic jig, and an adhesive jig.

The lifting member 500 is correspondingly disposed in the upper supporter 200 to assist in attaching the upper substrate S1 to the bottom surface of the upper supporter 200 or to separate the upper substrate S1 from the bottom surface of the upper supporter 200 and to be disposed in the lower supporter 300. Middle-assisted assists attaching or detaching the lower substrate S2 to the top surface of the lower support 300 or from the top surface of the lower support 300. To this end, the lifting member 500, for example, the ejector pin, may correspondingly pass through the upper support member 200 toward the upper substrate S1 and thus be disposed in the upper chamber 100a and pass through the lower support member 300 toward the lower substrate S2 and thus be disposed. In the lower chamber 100b.

Here, when the lifting member 500 is disposed in the upper supporter 200, the lifting member 500 may pass through the upper supporter 200 and a support jig disposed on the upper supporter 200 and thus be disposed in the upper chamber 100a. Also, the lifting member 500 disposed on the upper support 200 may be selected to be in a position such that the lifting member 500 does not interfere with the composition of the support jig 600.

And, a separate sealing member (not shown) may be disposed between the lifting member 500 and the support jig 600, which is disposed on the upper support 200.

The number of the lifting members 500 may correspond to the size of each of the upper substrate S1 and the lower substrate S2. There may be a plurality of lifting members 500, and the plurality of lifting members 500 may be disposed to be spaced apart from each other. And, the lifting member 500 is connected to a separate lifting member driving part (not shown) which lifts the lifting member 500 to move vertically.

A separate vacuum clamp (not shown) may be placed on the lifting member, which is placed on an upper support 200 (hereinafter referred to as an “upper lifting member”) of the lifting member 500. Specifically, a separate vacuum clamp may be placed on the end of the upper lifting member 500 facing the upper substrate S1 so that the upper substrate S1 contacted and supported by the upper lifting member when the upper lifting member is raised is vacuum-sucked and fixed to the upper lifting component.

Here, the separate vacuum jig located on the end of the lifting member 500 may be a bellows-type vacuum pad so that when the vacuum jig contacts the substrate, the vacuum jig is extended or contracted to eliminate impact due to contact with the vacuum jig and prevent the substrate from being damaged. A separate support pad (not shown) may be disposed on the lifting member, which is disposed on a lower support 300 (hereinafter referred to as a “lower lifting member”) of the lifting member 500. Specifically, a separate support pad having a predetermined area may be placed on an end portion of the lower lifting member facing the lower substrate S2. Multiple lower lifting members can be connected to the support pad. The lower lifting member can stably contact and support the lower substrate S through the support pad.

Hereinafter, the support jig 600 according to the current embodiment will be described. Here, in order to describe the embodiment, except that the upper substrate S1 and the lower substrate S2 must be distinguished, when it is unnecessary to specifically distinguish the upper substrate S1 and the lower substrate S2, the upper substrate S1 and the lower substrate S2 are collectively referred to as "substrates" .

The support jig 600 according to one embodiment is an element disposed in a substrate processing apparatus to support and fix a substrate. The support jig 600 includes: a main body 620 having an internal space and one surface 621 for supporting the substrate, for example, a support surface; and an expandable member 630 that divides the internal space of the main body 620 into a stack in Partition space 610 on each other: a partition space 610a and a partition space 610b, the expandable member 630 is disposed in the main body 620 to move in a thickness direction of the main body 620 by a gas selectively injected into the partitioned partition space 610 A moving part 640 that passes through one surface 621 of the main body 620, for example, a support surface on which the substrate is supported and is thus placed on the expandable part 630; and an adhesive part 650 that is placed on the exterior of the main body 620 On each of the moving parts 640.

The shape of the main body 620 may be manufactured corresponding to the shape of the upper support 200, for example, in the shape of a hexahedron. The main body 620 has a top surface that is the other surface facing one surface 621 of the bottom surface of the main body 620 disposed on the bottom surface of the upper support 200. The substrate is supported by one surface 621 of the main body 620. That is, one surface 621 of the main body 620 may serve as a support surface that supports the substrate. The pipe 680 through which the gas is transmitted may be disposed on one side of each of the top surface and the side surface of the body 620 to inject the gas into the body 620 or exhaust the gas injected into the body 620 to the outside.

The through-hole 622 penetrates one surface 621 of the support surface of the main body 620 as a support substrate. The number of through holes 622 corresponds to the number of moving parts 640 to be described later. The through holes 622 may be provided in plurality, and the plurality of through holes 622 are disposed to be spaced apart from each other. The moving member 640 has one end disposed in the through hole 622. And, an adhesive member 650 on one end of the moving member 640 is disposed in the through hole 622. The adhesive member 650 may be exposed to the outside of the main body 620 through the through hole 622.

And, a plurality of vacuum holes 623 may be defined in one surface 621 of the main body 620 at a position spaced apart from the through hole 622. Specifically, the plurality of vacuum holes 623 are spaced apart from each other in one surface 621 of the main body 620. For example, a separate vacuum regulating unit (not shown), such as a vacuum pump, is connected to each vacuum hole 623. The vacuum hole 623 can be adjusted to a vacuum suction substrate by a vacuum adjustment unit in a vacuum, thereby fixing the auxiliary substrate to the support surface of the support jig 600. As illustrated in FIG. 2, the through hole 622 may be defined as being spaced a predetermined distance from the vacuum hole 623.

The body 620 may be manufactured integrally or separately. In the current embodiment, a separate type of body 620 is illustrated. That is, the main body 620 includes an upper body 620a and a lower body 620b. The upper body 620a may be detachably coupled to the lower body 620b.

The expandable member 630 is an element disposed in the main body 620 to drive the moving member 640 and an adhesive member 650 disposed on the moving member 640. The expandable member 630 may include an elastic film 631 disposed in the main body 620 such that the internal space of the main body 620 is divided into partition spaces 610: a partition space 610a and a partition space 610b, which are stacked on each other in the thickness direction of the body 620. Also, the expandable member 630 may include a reinforcing plate 632 disposed on one surface of the elastic film 631 to move in a thickness direction of the main body 620 according to a shape change of the elastic film 631.

The elastic film 631 may be a thin film having elasticity, for example, a diaphragm. The elastic film 631 may be formed of natural rubber, synthetic rubber, metal plate, and engineering plastic. For example, the elastic film 631 may have an edge disposed in the body 620 between the coupling surfaces of the upper body 620a and the lower body 620b. Here, a separate sealing unit (not shown) may be disposed on each contact surface between the elastic film 631 and the upper body 620a and between the elastic film 631 and the lower body 620b.

The internal space of the main body 620 may be divided into an upper partition space 610 a and a lower partition space 610 b by the elastic film 631. Specifically, the elastic film 631 may be disposed in the main body 620 in a horizontal direction to divide an internal space of the main body 620 in a direction parallel to the support surface. The elastic film 631 may be expanded by an inert gas sprayed thereon. When the sprayed inert gas is discharged to the outside, the elastic film 631 may contract again to return to its original position. That is, the spaced-apart partitioned space 610: the partitioned space 610a and the partitioned space 610b are isolated from each other by the elastic film 631 and thus are not connected to each other. Therefore, the gas may not flow from the upper partition space 610a to the lower partition space 610b and vice versa. That is, when gas is injected into the upper partition space 610a, the elastic film 631 may expand downward, and when gas is injected into the lower partition space 610b, the elastic film 631 may expand upward.

The reinforcing plate 632 is disposed on at least one surface of the elastic film 631 such that the moving member 640 is stably disposed to be supported by the expandable member 630, and the elastic film 631 is controlled in expansion and contraction in the thickness direction of the main body 620. That is, the reinforcing plate 632 may be disposed on a bottom surface or an upper surface of the elastic film 631. Alternatively, a reinforcing plate 632 may be disposed on each of the upper and lower surfaces of the elastic film 631.

Since the reinforcing plate 632 is disposed on the elastic film 631, when the elastic film 631 expands and contracts, a part of the expandable member 630, that is, the reinforcing plate 632 can move while maintaining a parallel state with respect to the supporting surface of the main body 620. Therefore, the reinforcing plate 632 may have a predetermined strength so that the reinforcing plate 632 does not bend and deform in the direction in which the elastic film 631 expands or contracts when the elastic film 631 expands or contracts. The shape of the reinforcing plate 632 may be manufactured to correspond to the shape of the main body 620, for example, a rectangular plate shape. With the reinforcing plate 632, the elastic film 631 can be controlled to change its direction in a target direction (for example, in the thickness direction of the main body 620). Also, the moving members 640 can be moved in the main body 620 while being held at the same height as each other in the thickness direction of the main body 620 by the reinforcing plate 632.

The reinforcing plate 632 may have a lower limit of the area such that a required number of moving parts 640 are supported by the reinforcing plate 632. Also, the reinforcing plate 632 may have an upper limit of the area such that an edge of the reinforcing plate 632 is spaced apart from the main body 620 by a predetermined distance. Therefore, the elastic film 631 may have a predetermined region capable of receiving its expansion and contraction due to injection and discharge of gas. That is, the reinforcing plate 632 may move in the thickness direction of the main body 620 as the area of the elastic film 631 disposed between the edge of the reinforcing plate 632 and the main body 620 expands or contracts, that is, the reinforcing plate 632 and Area not placed on it.

The moving part 640 may pass through one surface 621 of the lower body 620 b, for example, a support surface in the thickness direction of the body 620 and is thus placed on the expandable part 630. Here, the moving member 640 may be stably supported by the reinforcing plate 632. At least a part of the moving member 640, specifically one end of the moving member 640 facing the outside of the main body 620 is inserted into a through hole 622 defined in one surface 621 of the main body 620.

The number of the moving parts 640 is provided in plurality according to the size of the substrate. The plurality of moving parts 640 are disposed to be spaced apart from each other. The moving part 640 may be divided into an upper moving part 640a and a lower moving part 640b, which are disposed on the upper part of the expandable part 630, that is, in the upper partition space 610a, the lower moving part 640b is disposed In the lower part of the expandable member 630, that is, in the lower partition space 610b. The lower moving part 640b may have a length such that one end of one surface 621 of the main body 620 facing the moving part 640 is disposed in the through hole 622 of the main body 620. The upper moving part 640a may have a length such that the other end of the moving part 640 is spaced a predetermined distance from a shower head 660 to be described later. Here, the distance between the other end of the moving member 640 and the shower head 660 may accommodate a change of the expandable member 630 when the expandable member 630 rises and expands. That is, the distance between the other end of the moving member 640 and the shower head 660 represents the stroke distance of the adhesive member 650, for example, the distance between the upper limit position of the adhesive member 650 and the lower limit position of the adhesive member 650. The upper moving part 640a may serve as a stopper when the moving part 640 is raised.

Since the moving part 640 is disposed on the expandable part 630 to move according to the movement of the expandable part 630, the moving part 640 may be coupled to the expandable part 630 as follows. The protrusion 641 is disposed on the outer circumferential surface of the upper end of the lower moving member 640b, and the washer 642 is disposed on the outer circumferential surface of the upper end of the upper moving member 640a to correspond to the protrusion 641. Each of the protrusion 641 and the washer 642 contacts the expandable member 630. The bolt 643 passes through the protrusion 641 and the washer 642 to allow the moving member 640 to be fixed to the expandable member 630. Here, the gasket 642 may fix the moving part 640 to the expandable part 630 and seal the expandable part 630 penetrated by the moving part 640.

The adhesive member 650 is a member for fixing a substrate by using an adhesive force. The adhesive member 650 may be formed of a material having the following characteristics, wherein once the adhesive member is adhered to the substrate and then separated from the substrate, the adhesive member is disposed on one end of the moving member 640 without actually leaving an adhesive trace. For example, the adhesive member 650 may be an adhesive sheet formed of a silicon-based, acrylic-based, or fluorine-based material.

The adhesive member 650 is disposed on one end of the moving member 640 so that the adhesive member 650 can be moved through the through hole 622. Therefore, the adhesive member 650 is exposed to the outside of the main body 620 through the through hole 622 of the main body 620. The adhesive member 650 is exposed to one surface 621 of the main body 620, and for example, the support surface may have a circular shape. The adhesive member 650 may be coupled to the end of the moving member 640 by a bolt (not shown) or adhered to the end of the moving member 640 by an adhesive. The adhesive member 650 is disposed on one end of the moving member 640 to move within the through hole 622 of the main body 620 by the lifting of the moving member 640. Specifically, the adhesive member 650 has an adhesive surface 651 disposed parallel to the support surface in the through hole 622 of the main body 620 to be adhered to the substrate or spaced from the support surface in the through hole 622 and is selectively injected into The gas in the partition space 610 is removed from the substrate.

The support jig 600 according to the embodiment may further include a shower head 660 disposed in the main body 620 such that gas is injected into the partition space 610 in the thickness direction of the main body 620: at least one of the partition space 610a and the partition space 610b. Specifically, the shower head 660 is disposed in the upper body 620a such that gas is injected into the upper partition space 610a in the thickness direction of the body 620. The shower head 660 is connected to an upper pipe 681 disposed on one side of the upper body 620a.

The shower head 660 may include a bottom plate, for example, a perforated plate having a plurality of spray holes 661 defined in a thickness direction of the main body 620, and a side wall surrounding an edge of the bottom plate on an upper portion of the bottom plate. Each of the side walls has an upper portion hermetically placed on the upper portion in the upper body 620a. The bottom plate of the shower head 660 may be disposed at a predetermined distance from an upper portion in the upper body 620a. The bottom plate has an area corresponding to the size of the reinforcing plate 632.

Through the shower head 660, the gas can be uniformly sprayed onto the upper partition space 610a and the reinforcing plate 632. Therefore, a uniform force may be applied to the expandable member 630 to allow the expandable member 630 to rise or fall while maintaining a level state. Of course, the shower head 660 may be disposed in the lower body 620b so that gas is injected into the lower partition space 610b. Alternatively, the shower head 660 may be disposed on the main body 620.

The support jig 600 according to an embodiment may further include a buffer member 670 disposed in at least one of the partition spaces 610 in the main body 620 and each of them has one end connected to the expandable member 630 so as to be expandable The member 630 moves in the body 620 in the thickness direction of the body 620 while maintaining a uniform height.

That is, each of the buffer members 670 is disposed in the main body 620 toward the expandable member 630. The buffer member 670 has a part of an element that contacts the expandable member 630 to elastically support the expandable member 630. The expandable member 630 can endure the pressure of the sprayed gas that is deflected mainly by the buffer member 670 disposed mainly thereon and smoothly rising at a required speed in the thickness direction of the main body 620. Therefore, an unexpected driving of the expandable member 630 and an adhesion sliding phenomenon between the expandable member 630 and the moving member, that is, a vibration phenomenon can be prevented.

In the current embodiment, although the buffer member 670 is disposed on the lower body 620b under the expandable member 630, that is, in the lower partition space 610b, the embodiment is not limited thereto. For example, the buffer member 670 may be disposed on the upper body 620a above the expandable member 630, that is, in the upper partition space 610a. And, the buffer member 670 may be disposed on each of the upper body 620a and the lower body 620b above and below the expandable member 630 and thus on each of the upper partition space 610a and the lower partition space 610b. Hereinafter, although the technical characteristics of the buffer member 670 are described based on the buffer member 670 disposed on the lower body 620b, the embodiment can be equally applied to a case where the buffer member 670 is disposed on the upper body 620a.

The buffer member 670 may include: a guide member 671 disposed in the main body 620 toward the expandable member 630; and an elastic member 672 disposed outside the guide member 671 and having one end connected and supported by the main body 620 and an expandable member 630 connects and supports the other end. Here, the guide member 671 may have a length such that one end of the guide member 671 facing the expandable member 630 is spaced from the expandable member 630. Specifically, the guide member 671 has a length such that when the expandable member 630 moves toward the guide member 671, one end of the guide member 671 contacts the expandable member 630, and on the other hand, one end of the guide member 671 is spaced from the expandable member 630 open.

The elastic member 672, for example, an elastic spring, is fixed to or contacts the expandable member 630 and the main body 620 at both ends thereof, respectively. The elastic member 672 may support the expandable member 630 and the main body 620 by using an elastic force. The buffer members 670 may be provided in a plurality and thus disposed at a plurality of positions on the lower body 620b. Here, the plurality of buffer members 670 may be disposed to be spaced apart from each other at a predetermined distance in the horizontal direction. Therefore, when the expandable member 630 moves in the thickness direction of the main body 620, the buffer member 670 may elastically support the reinforcing plate 632 such that the reinforcing plate 632 is parallel to one surface 621 of the lower body 620b, for example, a supporting surface.

The tube 680 includes an upper tube 681 and a lower tube 682. The upper pipe 681 may be disposed on one of a top surface and a side surface of the upper body 620a. The lower pipe 682 may be disposed on a side surface of the lower body 620b. The tube 680 may extend outward from the chamber 100 and thus be connected to a gas supply regulating unit (not shown) disposed outside the chamber 100. Here, a separate sealing unit (not shown) may be disposed between the tube 680 and the chamber 100. Here, the sealing unit may be various sealing units suitable for sealing, for example, a rubber package, a gasket, and a hermetic seal.

The gas supply adjustment unit may inject a gas into an internal space of the main body 620 and exhaust the gas from the main body 620. Here, when the gas is injected into the upper partition space 610a, the gas supply adjustment unit may exhaust the gas from the lower partition space 610b. And, when the gas is injected into the lower partition space 610b, the gas supply adjustment unit may exhaust the gas from the upper partition space 610a. That is, the gas supply adjustment unit may selectively inject gas into the upper partition space 610a and the lower partition space 610b or exhaust gas from the upper partition space 610a and the lower partition space 610b. The injection and discharge of the gas may be performed instead. Therefore, the gas supply regulating unit may be provided in plural and thus connected to the upper pipe 681 and the lower pipe 682 accordingly.

And, for example, the gas supply adjustment unit may include a gas supply source (not shown) that injects the gas at a predetermined pressure and a discharge pump (not shown) that discharges the injected gas. A control valve (not shown) for controlling the movement of the gas may be respectively disposed between the gas supply source and the exhaust pump and between the exhaust pump and the pipe 680.

As illustrated in FIGS. 3 (a) and 3 (b), the support jig 600 according to a modified example may further include a sealing member 690 disposed in one end of the through hole 622: a sealing member 691, a sealing member 692, and a seal The component 693 is such that the space between the outer circumferential surface of the adhesive member 650 or the outer circumferential surface of one end of the moving member 640 and the inner wall of the through hole 622 of the main body 620 is sealed.

To this end, one end of the through hole 622 may have an inner diameter larger than that of the remaining area or the center area of the through hole 622, and thus a space into which the sealing member 690 is disposed may be defined. For example, the sealing member 690 may include: a sealing film 691 that extends from an outer circumferential surface of the adhesive member 650 toward an inner wall of one end of the through hole 622; and a ring member 692 that is disposed on the inner wall of one end of the through hole 622 The sealing film 691 is hermetically placed on one end of the through hole 622.

For example, the sealing film 691 may be formed of the same material as the elastic film 631. The sealing film 691 may be a film disposed on an outer circumferential surface of the adhesive member 650 or may be a film separated from the adhesive member 650. When the sealing film 691 is separately provided, the sealing film 691 may be adhered to an outer peripheral surface of the adhesive member 650 or an outer peripheral surface of one end of the moving member 640 by an adhesive and thus sealed.

The ring member 692 is a component that allows the sealing film 691 to be placed on the inner wall of the through hole 622. When the adhesive member 650 moves, the ring member may support the sealing film 691 to maintain a sealed state between the sealing film 691 and one end of the through hole 622. The ring member 692 may be coupled to one end of the through hole 622 by a bolt 693 or adhered to one end of the through hole 622 by an adhesive.

Also, the sealing member 690 may be disposed on one end toward the outside of the main body 620 of the through hole 622 and thus exposed to the outside of the main body 620. Also, the sealing member 690 may be disposed in the other end of the through-hole 622 defined as having an inner diameter larger than the center of the through-hole and thus in the main body 620.

FIG. 9 is a flowchart illustrating a substrate processing method according to an embodiment. Hereinafter, a substrate processing method according to an embodiment will be described with reference to FIGS. 1 to 9. Here, the repeated description of the substrate processing apparatus according to the embodiment will be omitted or simply described.

The substrate processing method is a method of performing the bonding of substrates by using the above-mentioned substrate processing apparatus. The substrate processing method includes providing an upper substrate S1 and a lower substrate S2, allowing the lower substrate S2 to be supported by the lower support 300 and the upper substrate S1 to be supported by the upper support 200, and fixing the upper substrate S1 to the upper substrate S1 by using a support jig 600 of the upper support 200. Support jig 600, reducing the distance between the upper support 200 and the lower support 300 to closely attach the upper substrate S1 to the lower substrate S2, releasing the upper substrate S1 from the support jig 600, and supporting from the upper support 200 and the lower The piece 300 separates the bonded substrate.

Here, fixing the upper substrate S1 to the support jig 600 includes injecting a gas into the upper partition space in the support jig 600, allowing the adhesive members of the support jig 600 to descend, and allowing the adhesive members to be adhered to the upper substrate. In addition, the release of the upper substrate S1 from the support jig includes injecting gas into the lower partition space in the support jig, allowing the adhesive members of the support jig 600 to rise and separate the adhesive members from the upper substrate.

First, in operation S100, a substrate is prepared. For example, the upper substrate S1 is disposed under the upper supporter 200, and the lower substrate S2 is disposed on the lower supporter 300 by using a robot arm (not shown). Here, a bonding member (not shown) may be placed on the top surface of the lower substrate along the edge of the lower substrate, for example.

Then, as illustrated in FIGS. 4 and 5, in operation S210, the lower substrate S2 is placed and supported on the top surface of the lower support 300. In operation S220, the upper substrate S1 is supported by the support jig 600 of the upper supporter 200 in a vacuum suction manner. During the process in which the upper substrate S1 is attracted to and supported by the support jig 600 of the upper support 200, for example, the lifting member 500 is lowered to contact the upper substrate S1, and the upper substrate S1 is lifted by the lifting member In a state where 500 is supported in a vacuum suction manner, the lifting member 500 is raised to allow the top surface of the upper substrate S1 to contact the support surface of the support jig 600. Subsequently, the upper substrate S1 is attracted to and supported by the support surface by generating a vacuum in the vacuum hole 623.

Subsequently, in operation S310, the control valve of the gas supply source connected to the upper partition space 610a is opened to allow inert gas, for example, nitrogen, to be injected from the gas supply source into the upper partition space 610a of the support jig 600. Here, the gas may be uniformly sprayed into the upper partition space 610a through the shower head 660. As the gas is injected, the elastic film 631 expands. Here, the elastic film 631 may be controlled in the expansion direction by the shower head 660 and the reinforcing plate 632 in the thickness direction of the main body 620. In operation S320, the moving part 640 and the adhesive part 650 disposed on the expandable part 630 may be lowered by the lowering of the expandable part 630. Here, the buffer member 670 contracts in a direction in which the expandable member 630 moves and applies a predetermined elastic force to the expandable member 630. According to the elastic force, the expandable member 630 can be stably moved.

When the expandable member 630 contacts the guide member 671, the movement of the expandable member 630 stops. That is, the guide member 671 may function as a stopper. In the process, in operation S330, the adhesive surface 651 of the adhesive member 650 is pressed to move toward the substrate and is thus attached to the top surface of the substrate, and thus the adhesive member 650 is fixed to the substrate through the adhesive surface 651.

Here, before the inert gas is supplied into the upper partition space 610a, that is, when the expandable member 630 is disposed in its initial position, the adhesive surface of the adhesive member 650 may be disposed in parallel with the support surface of the lower body 620b or It is arranged to protrude toward the substrate at a predetermined distance. The position of the adhesive member 650 can be easily selected as an ideal position by adjusting the length of the elastic member 672 disposed in the buffer member 670 so that the expandable member 630 in the initial state is elastically supported.

When the substrate is adhered to the adhesive member 650, the control valve connected to the upper partition space 610a is closed to block gas injection into the upper partition space 610a. Here, the gas injected into the upper partition space 610a may be maintained or discharged from the upper partition space 610a through the upper pipe 681. When the gas is discharged, the expandable member 630 returns to its original position through the buffer member 670, and the operation of pressing the substrate by the bonding surface of the bonding member 650 stops, and then the bonding surface returns to its initial position.

Although the predetermined area of the substrate is deformed by the pressure of the adhesive member 650 in the process to allow the substrate to adhere, when the operation of pressing the substrate by the adhesive surface of the adhesive member 650 stops, the deformation of the substrate can be released, and therefore the substrate can be returned to Its initial shape.

Subsequently, when the substrate is completely adhered to the bonding member 650, the chamber 100 is sealed, and is at a normal atmospheric pressure during the substrate placement on each of the supports (that is, during the substrate loading process). The internal atmospheric pressure of the chamber 100 may be changed to a vacuum pressure. Here, the vacuum generated in the vacuum hole 623 of the support jig 600 is broken to release the vacuum suction between the vacuum hole 623 and the upper substrate S1, however, since the upper substrate S1 is adhered to and supported by the adhesive member 650 Therefore, the upper substrate S1 can be maintained in a fixed state.

That is, when the bonding member 650 is completely fixed to the upper substrate S1, even if the vacuum state of the vacuum hole 623 of the support jig 600 is destroyed by the control of the internal atmospheric pressure of the chamber 100, the upper substrate S1 can be bonded by the bonding member 650 The force is fixedly supported by the adhesive member 650.

In operation S400, the upper substrate S1 and the lower substrate S2 are aligned. The inside of the chamber 100 is maintained in a vacuum state.

Subsequently, the distance between the upper substrate and the lower substrate is reduced by using at least one of the upper supporter 200 and the lower supporter 300. As illustrated in FIG. 5, for example, in operation S500, the lower support 300 is raised to allow the upper substrate S1 to be tightly attached to the lower substrate S2. Of course, at the same time, the upper supporter 200 may be lowered to allow the upper substrate S1 to be closely attached to the lower substrate S2.

When the upper substrate S1 is completely tightly attached to the lower substrate S2, as illustrated in FIG. 7, in operation S610, the control valve of the gas supply source connected to the lower partition space 610b of the support jig 600 is opened to inject from the gas supply source An inert gas, for example, nitrogen gas, enters the lower partition space 610b of the support jig 600. Here, the gas previously injected into the upper partition space 610a in the support jig 600 is discharged through the upper pipe 681. In this process, the gas injected into each of the lower partition space 610b and the upper partition space 610a may adjust the injection rate and pressure at a desired ratio to allow the expandable member 630 to rise smoothly.

The elastic film 631 that is expanded downward by the injection of gas may be contracted to the initial position and then expanded upward again in some cases. Specifically, the elastic film 631 can be further expanded toward the shower head 660 so that the reinforcing member 632 rises until the upper end of the moving member 640 contacts the shower head 660. Of course, at this time, the expansion of the elastic film 631 is controlled by the reinforcing plate 632 in the thickness direction of the main body 620. In operation S620, as the expandable member 630 is raised, the moving member 640 and the adhesive member 650 disposed on the expandable member 630 are lowered.

Here, the buffer member 670 may apply a predetermined elastic force to the expandable member 630 while elastically recovering in the moving direction of the expandable member 630, and thus the expandable member 630 may be stably moved by the elastic force. When the upper end of the moving member 640 contacts the shower head 660, the movement of the expandable member 630 stops. That is, the upper end of the moving member 640, for example, the upper moving member 640a may serve as a stopper.

In the above process, in operation S630, the adhesive surface of the adhesive member 650 moves away from the substrate and is thus released from the top surface of the upper substrate S1, and thus the adhesive member 650 is separated from the upper substrate S1. The upper substrate S1 separated from the support jig 600 is placed and supported on the lower substrate S2. When the adhesive member 650 is released from the upper substrate S1, the control valve connected to the lower partition space 610b is closed to terminate the injection of the gas. And then, the gas supplied into the lower partition space 610b may be discharged through the lower pipe 682. Therefore, the adhesive member 650 can return to its initial position.

As described above, while the adhesive member 650 is moved into the support jig 600 and released from the upper substrate S1, a state in which the support surface of the support jig 600 contacts to be supported by the upper substrate S1 is maintained, and thus compared with the related art The substrates can be stably spaced at the same time, and the occurrence of twisting in the alignment substrate can be prevented.

In the current embodiment, the sealing member 690 may be disposed on one end of the through hole 622 or may not be disposed on one end of the through hole 622. When the sealing member 690 is not disposed on one end of the through hole 622, at least a part of the gas injected into the lower partition space 610b may be sprayed between the through hole 622 and the adhesive member 650. Therefore, the gas injected into the lower partition space 610b may serve as a purge gas for assisting the separation of the upper substrate S1 from the support jig 600 while the upper substrate S1 is separated from the support jig 600.

Subsequently, as illustrated in FIG. 8, in operation S700, the upper support is raised. Here, while the upper support 200 is rising, or before or after the upper support 200 is rising, the gas injected into the lower partition space 610b may be discharged to release the pressure applied to the internal elements of the support jig 600, thereby The states of the internal elements of the support jig 600 are changed to their initial states.

Subsequently, the lifting member 500 disposed on the lower support 300 rises to separate the substrate from the lower support 300, and the substrate is moved to the spaced-apart curing unit (not shown). And then, in operation S800, light, for example, ultraviolet rays are irradiated onto a bonding member, such as a sealant, by using a curing device to cure the sealant to complete the bonding of the substrates.

According to the embodiment, it is possible to provide an expandable member that is driven while maintaining a parallel state with respect to a substrate in a support jig by selectively injecting a gas into an isolated partition space in the support jig.

Here, the expandable member may be stably driven by a buffer member elastically supporting the expandable member. Since the adhesive member is moved inwardly or outwardly in the supporting jig by using an expandable member, the adhesive member can be moved while maintaining the same height with each other, and the supporting jig can evenly bond the adhesive member to the substrate or uniformly remove the adhesive member from the substrate. Separation.

According to the prior art, a separate element contacting the substrate is used to push the substrate from the support jig, thereby separating the substrate from the support jig. Therefore, the substrate is damaged or twisted due to the force applied to the substrate from a separate component.

On the other hand, according to the embodiment, while the adhesive member moves the support jig inward to separate the substrate from the support jig, the substrate can be maintained in a state where the substrate contacts the support surface of the support jig, and therefore the substrate can be separated without being damaged , And can also prevent the substrate from twisting.

And, since the support jig allows gas to be selectively injected into the isolated partition space therein to drive the bonded parts, that is, the components that drive the bonded parts are placed in the support jig, the support jig and the substrate processing apparatus having the support jig can be Structurally simplified.

Therefore, the stability of various substrate processing processes, such as the substrate bonding process, can be improved, and the manufactured substrate can also be improved in quality.

Although the substrate bonding process and equipment have been described with reference to specific embodiments, they are not limited thereto. Accordingly, those skilled in the art will readily understand that various modifications and changes may be made thereto without departing from the spirit and scope of the invention as defined by the appended claims.

100‧‧‧ chamber

100a‧‧‧upper chamber

100b‧‧‧lower chamber

200‧‧‧ Upper support

300‧‧‧lower support

410‧‧‧Upper drive shaft

420‧‧‧Lower drive shaft

500‧‧‧Lifting parts

600‧‧‧Support fixture

610‧‧‧ divided space

610a‧‧‧ Upper partition

610b‧‧‧ lower partition

620‧‧‧Subject

620a‧‧‧upper body

620b‧‧‧lower body

621‧‧‧ one surface

622‧‧‧through hole

623‧‧‧Vacuum hole

630‧‧‧Expandable parts

631‧‧‧elastic film

632‧‧‧Reinforcing board

640‧‧‧moving parts

640a‧‧‧Upper moving parts

640b‧‧‧Lower moving parts

641‧‧‧ raised

642‧‧‧washer

643‧‧‧Bolt

650‧‧‧Adhesive parts

651‧‧‧ Adhesive surface

660‧‧‧ sprinkler

661‧‧‧ spray hole

670‧‧‧ cushioning parts

671‧‧‧Guide parts

672‧‧‧elastic parts

680‧‧‧tube

681‧‧‧upper tube

682‧‧‧lower tube

690‧‧‧sealing parts

691‧‧‧sealing film

692‧‧‧Ring parts

693‧‧‧ bolt

S1‧‧‧upper base

S2‧‧‧Lower base plate

S100 ~ S800‧‧‧ Operation

FIG. 1 is a side view of a substrate processing apparatus according to an embodiment. Figure 2 is a side view of a support jig according to one embodiment. 3 (a) and 3 (b) are partial views of a support jig according to a modified example. 4 to 8 are views illustrating a state in which the substrate processing apparatus is operated according to an embodiment. FIG. 9 is a flowchart illustrating a substrate processing method according to an embodiment.

Claims (13)

A support jig for supporting a substrate, the support jig comprising: a main body having an internal space; and an expandable member configured to divide the internal space in a thickness direction of the main body, and the expandable member is disposed at the The main body is caused to move the expandable member in the thickness direction of the main body by a gas injected into the spaced apart space; a moving member passes through the main body in the thickness direction of the main body. One surface of the main body and disposed on the expandable member; an adhesive member disposed on an end of the moving member outward from the main body; and a shower head disposed in the main body such that gas Injected into at least one of the partitioned spaces in the thickness direction of the body. The support jig according to item 1 of the scope of patent application, further comprising a buffer member disposed in at least one of the partition spaces and having one end portion connected to the expandable member. The support jig according to item 1 of the scope of patent application, wherein a through hole and a vacuum hole are defined in one surface of the main body, and the adhesive member is disposed in the through hole. The support jig according to item 3 of the scope of patent application, wherein the bonding surface of the bonding member exposed to the outside of the main body is placed in the through hole by a gas selectively injected into the partition space or Parallel to the one surface of the body. The support jig according to item 3 of the scope of patent application, further comprising the sealing member disposed in the through hole such that at least one of an upper end of the bonding member and the moving member and the through hole Is sealed. The support jig according to item 1 of the scope of patent application, wherein the expandable member includes: an elastic membrane disposed in the main body to divide the internal space; and a reinforcing plate disposed in the elastic membrane. The at least one surface is caused to move the reinforcing member plate in the thickness direction of the main body according to a shape change of the elastic film. The support jig according to item 2 of the patent application scope, wherein the buffer member includes: a guide member disposed in the main body toward the expandable member; and an elastic member disposed outside the guide member And it has one end connected to the expandable member and the other end connected to the main body. A substrate processing apparatus includes: a chamber having a substrate processing space; an upper support member disposed in the chamber; a lower support member disposed to face the upper support member; and a support jig disposed at On at least one of the upper support member and the lower support member, the support jig has a partition space separated from each other, wherein the support jig includes: a main body having an internal space; and an expandable member which is configured In order to divide the internal space in the thickness direction of the main body, the expandable member is disposed in the main body such that the expandable member is placed in a space of the main body by gas injected into the spaced apart space. Moving in the thickness direction; a moving member that passes through one surface of the body in the thickness direction of the body and is placed on the expandable member; an adhesive member that can be selectively passed through The gas injected into the partition space moves outward or inward in the support jig; and a shower head is disposed in the main body so that A gas is injected into at least one of the partition spaces in the thickness direction of the body, wherein a through hole and a vacuum hole are defined in one surface of the body, and the adhesive member is coupled to the body In the end of the moving member outward, the adhesive member is moved through the through hole. The substrate processing apparatus according to item 8 of the scope of patent application, wherein the support jig is provided as a plurality, and the plurality of support jigs are disposed on a bottom surface of the upper support and the lower support that are defined. In multiple areas on at least one of the top surfaces. The substrate processing apparatus according to item 8 of the scope of patent application, wherein the support jig includes: a buffer member disposed in the body toward the expandable member to contact and support the expandable member; and a tube, It is configured to inject a gas into at least one of the compartments, wherein the showerhead is connected to the tube. The substrate processing apparatus according to item 8 of the scope of patent application, wherein the expandable member includes: an elastic film disposed in the main body so that the internal space is divided in the thickness direction of the main body; And a reinforcing plate disposed on at least one surface of the elastic film. The substrate processing apparatus according to claim 10, wherein the buffer member includes a guide member disposed in at least one of the partitioned spaces facing the expandable member and having a connection with the expandable member. A spaced-apart end facing the expandable member; and an elastic member disposed outside the guide member, the elastic member having an end connected and supported on the main body and connected and supported on the expandable member The other end on the expansion unit. The substrate processing apparatus according to item 8 of the scope of patent application, further comprising a sealing member disposed on one end of the through hole and thus includes a space between the through hole and an outer circumferential surface of the adhesive member.