TW201603182A - Support chuck and substrate treating apparatus - Google Patents

Abstract

Provided is a support chuck and a substrate treating apparatus having the same. The support chuck by which a substrate is supported includes a main body having an inner space, an expandable member configured to divide the inner space in a thickness direction of the main body, the expandable member being disposed in the main body so that the expandable member moves in the thickness direction of the main body by a gas injected into separated sectioned spaces, a moving member passing through one surface of the main body in the thickness direction of the main body and is disposed on the flexible member, and an adhesion member disposed on an end of the moving member outward the main body. While the substrate is separated from the unit that supports the substrate, a phenomenon in which the substrate is twisted may be prevented.

Description

Support fixture and substrate processing equipment

The present invention relates to a support jig and a substrate processing apparatus, and more particularly to a support jig capable of preventing the substrate from being twisted when the substrate is separated from the unit of the support substrate, and substrate processing having the support jig device.

Generally, a flat panel display device such as a liquid crystal display (LCD) and an organic light emitting device (OLED) are manufactured by bonding a pair of flat substrates to each other. For example, an upper substrate, an organic light emitting layer, and an electrode on which a plurality of thin film transistors are located are disposed to be bonded to a lower substrate serving as a capping layer to fabricate an OLED. Here, the means for bonding the above substrate is realized in various shapes. For example, a "substrate bonding device" is disclosed in Korean Patent Registration No. 10-1340614.

As disclosed in the above-mentioned patent registration publication, generally, an apparatus for bonding a substrate according to the prior art includes: a surface plate; an adhesive member coupled to the surface plate to support the substrate; and a die ejector for The bonding member separates the substrate.

Meanwhile, in the apparatus for bonding substrates according to the related art, a process for bonding substrates is performed, and then the mold ejector is protruded toward the substrate to detach and separate the substrates from the bonding members. Here, there are the following restrictions.

The ejector pin continuously contacts and presses the substrate while the substrate is separated from the bonding member. Therefore, while the substrate is separated from the bonding member, a partial load is applied to the substrate, and thus the substrate can be damaged. Also, although the ejector pin applies a force to the substrate to push the substrate from the bonding member, the upper substrate and the lower substrate may be misaligned.

Furthermore, the following additional limitations exist in devices according to the prior art. In a device according to the prior art, the mechanical element for driving the plurality of ejection rams must be placed inside or outside the chamber, and the chamber must be penetrating to allow the above-mentioned elements to be placed inside or outside . Also, the elements for reinforcing the structure penetrating the chamber and the elements for sealing the penetrable treatment area must be placed inside or outside the chamber. That is to say, the device according to the prior art is realized in a complicated structure to mechanically drive a plurality of ejection rams, and thus it may be difficult to maintain a sealed state inside the chamber, and maintenance of the device may be difficult. [Prior Art Document] [Patent Document] (Patent Document 1) KR10-1340614 B1

The present invention provides a support jig, a substrate processing apparatus, and a substrate processing method capable of stably separating a substrate from a unit supporting a substrate.

The present invention also provides a support jig, a substrate processing apparatus, and a substrate processing method capable of preventing the substrate from being twisted while the substrate is separated from the unit of the support substrate.

The present invention also provides a support jig, a substrate processing apparatus, and a substrate processing method capable of preventing the substrate from being damaged while the substrate is separated from the unit of the support substrate.

The present invention also provides a support jig and a substrate processing apparatus which can simplify the structure thereof.

According to an exemplary embodiment, a support jig of a support substrate includes: a main body having an inner space; and an expandable member configured to divide an inner space in a thickness direction of the main body, the expandable member being disposed in the main body such that Injecting gas into the spaced apart partition space moves the expandable member in a thickness direction of the body; moving the member through a surface of the body in a thickness direction of the body and disposed on the flexible member; and bonding the member It is placed on the end of the moving part of the body outward.

The support jig may further include a shower head disposed in the main body such that gas is injected into at least one of the partition spaces in the thickness direction of the main body. Also, the support jig may further include a cushioning member disposed in at least one of the partition spaces and having one end connected to the expandable member. The through hole and the vacuum hole may be defined in one surface of the body, and the bonding member is disposed in the through hole.

The bonding surface of the bonding member exposed to the outside of the body may be disposed in the through hole or parallel to one surface of the body by a gas selectively injected into the partition space.

The support jig may further include a sealing member disposed in the through hole such that a space between at least one of the upper ends of the adhesive member and the moving member and the through hole is sealed.

The expandable member may include: an elastic film disposed in the main body to divide the inner space; and a reinforcing member plate disposed on at least one surface of the elastic film such that the reinforcing plate moves in a thickness direction of the main body according to a shape change of the elastic film .

The cushioning member may include: a guiding member disposed in the body toward the expandable member; and an elastic member disposed outside the guiding member and having one end connected to the expandable member and the other end connected to the main body.

According to another exemplary embodiment, a substrate processing apparatus includes: a chamber having a substrate processing space; an upper support disposed in the chamber; a lower support disposed to face the upper support; a support jig disposed on at least one of an upper support member and a lower support member, the support jig having a partition space separated from each other, wherein the support jig includes an adhesive member, the adhesive member being selectively implantable The gas into the separation space moves outward or inward in the support fixture.

The support jig may be provided in plurality, and the plurality of support jigs may be disposed in a plurality of regions defined on at least one of a bottom surface of the upper support and a top surface of the lower support.

The support jig may include: a body having an inner space; an expandable member configured to divide the inner space in a thickness direction of the body, the expandable member being disposed in the body such that the expandable member passes The gas injected into the spaced apart partition spaces moves in the thickness direction of the body; and a moving member disposed on the expandable member and having at least one portion inserted into the body.

The support fixture may include a cushioning member disposed in the body toward the expandable member to contact and support the expandable member, and a tube configured to inject a gas into the separation space Every one.

The through hole and the vacuum hole may define one surface of the body, and the bonding member may be coupled into the end of the moving member outward of the body such that the bonding member moves through the through hole.

The expandable member may include: an elastic film disposed on the main body such that an inner space is divided in a thickness direction of the main body; and a reinforcing plate disposed on at least one surface of the elastic film.

The cushioning member may include: a guiding member disposed in at least one of the partition spaces facing the expandable member and having one end facing the expandable member spaced apart from the expandable member; An elastic member disposed outside the guiding member, the elastic member having one end connected and supported on the body and the other end connected and supported on the expandable member.

The substrate processing apparatus may further include a sealing member disposed on one end of the through hole thus including a space between the through hole and an outer circumferential surface of the bonding member.

The sealing member may include: a sealing film extending from an outer circumferential surface of the bonding member toward an inner wall of one end of the through hole; and a ring member disposed on an inner wall of one end of the through hole such that the sealing film is hermetically sealed Placed on one end of the through hole.

According to still another exemplary embodiment, a substrate processing method includes: preparing an upper substrate and a lower substrate; allowing the lower substrate to be supported by the lower support and the upper substrate being supported by the upper support; and the upper portion by using the support fixture of the upper support The substrate is fixed to the support jig; the distance between the upper support and the lower support is reduced to bond the upper substrate to the lower substrate; the upper substrate is released from the support jig; and the bonded substrate is separated from the upper support and the lower support.

The lower substrate may be vacuum adsorbed to be supported by the lower support, and the upper substrate may be vacuum adsorbed to adhere to the upper support.

Fixing the upper substrate to the support jig may include: injecting gas into the upper partition space in the support jig; and allowing the adhesive member of the support jig to descend; and allowing the adhesive member to be adhered to the upper substrate.

Release of the upper substrate from the support jig may include: injecting gas into the lower partition space in the support jig, allowing the adhesive member of the support jig to rise; and separating the adhesive member from the upper substrate.

While the gas is injected into the lower partition space in the support jig, the gas previously injected into the upper partition space in the support jig can be discharged. Also, while the upper substrate is released from the support jig, the upper substrate can be adsorbed to be supported by the support jig.

The above described features and advantages of the invention will be apparent from the following description.

Hereinafter, specific embodiments will be described in detail with reference to the accompanying drawings. However, the invention may be embodied in different forms and should not be construed as being limited to the embodiments set forth herein. Rather, the embodiments are provided so that this disclosure will be thorough and complete, and the scope of the invention will be fully conveyed by those skilled in the art. In the drawings, the dimensions of layers and regions are exaggerated for clarity of illustration. The same reference numbers refer to the same elements throughout.

1 is a side view of a substrate processing apparatus according to an embodiment, and FIG. 2 is a side view of a support jig according to an embodiment. 3(a) and 3(b) are partial views of a supporting jig according to a modified example, and FIGS. 4 to 8 are views illustrating a state in which the substrate processing apparatus operates according to one embodiment. Also, FIG. 9 is a flow chart showing a substrate processing method according to an embodiment.

A substrate processing apparatus according to an embodiment is a device for bonding an upper substrate to a lower substrate. As illustrated in FIGS. 1 to 8, the substrate processing apparatus includes a chamber 100 having a substrate processing space, an upper support 200 disposed in the chamber 100 to support the upper substrate S1, and a lower support 300 disposed therein The upper support 200 is faced to support the lower substrate S2; and the support jig 600 is disposed on at least one of the upper support 200 and the lower support 300 and has a partition space 610: a partition space 610a and a partition space 610b separated from each other.

Here, the gas movable adhesive member 650 which is selectively injected into the partition spaces 610a and 610b which are isolated from each other in the inside or the outside of the support jig 600 may be disposed in the support jig 600. The support jig 600 can stably perform the adhesive fixing and separation of the substrate by using the bonding member 650. That is, the adhesive member 650 can be moved within the through hole 622 which will be described later, which is defined in the support surface of the support jig 600 while performing fixation or separation of the substrate. The adhesive member 650 may be disposed in the through hole 622 or exposed to a support surface of the support jig 600. Specifically, when a gas is injected into one of the partition spaces, for example, into the upper partition space 610a, the adhesive member 650 may be moved outside the support jig 600 to be bonded to the substrate supported by the support jig 600, for example, Bonded to the upper substrate S1. Alternatively, when gas is injected into another partition space, for example, into the lower partition space 610b, the adhesive member 650 may move inside the support jig 600 and be separated from the substrate, for example, separated from the upper substrate S1.

Although the support jig 600 according to the current embodiment is disposed on the upper support 200 to adhesively support the upper substrate S1, the support jig 600 is not particularly limited to this position. For example, the support fixture 600 can be disposed on the lower support 300 or in each of the upper support 200 and the lower support 300.

For example, the upper substrate S1 may be a device substrate on which the OLED device is disposed, and the lower substrate S2 may be a capped substrate for capping and protecting the device substrate. The substrate of each of the upper substrate and the lower substrate may be formed of a transmissive material such as a glass panel. Of course, the embodiment is not limited thereto, and each of the upper substrate and the lower substrate may be a substrate constituting a plurality of devices and devices. For example, each of the upper substrate and the lower substrate may be a liquid crystal device substrate constituting a liquid crystal display device.

For example, the chamber 100 includes an upper chamber 100a and a lower chamber 100b having a space in which a process for bonding the upper substrate S1 to the lower substrate S2 is performed or used for The process in which the lower substrate S2 separates the upper substrate S1. The upper chamber 100a can be detachably coupled to the lower chamber 100b. A separate lifting member (not shown) that raises the upper chamber 100a and the lower chamber 100b, respectively, is disposed in the chamber 100. The upper chamber 100a or the lower chamber 100b is lifted by using the lifting member to load the upper substrate S1 and the lower substrate S2 in the chamber 100 or unload the upper substrate S1 and the lower substrate S2 from the chamber 100. Also, a separate pressure regulating unit (not shown) for adjusting the internal pressure and a separate discharge unit (not shown) for discharging the impurities are disposed in the chamber 100.

The upper support 200 is disposed at an upper side in the chamber 100 to support the upper substrate S1. The shape of the upper support 200 may be made to correspond to the shape of the upper substrate S1. For example, when the upper substrate S1 is a glass panel having a rectangular plate shape, the upper support 200 may be fabricated as a bottom surface having a rectangular plate shape.

The bottom surface of the upper support 200 may be divided into a plurality of regions. The support jig 600 according to the embodiment may be provided in plurality and correspondingly disposed on a plurality of regions on the bottom surface of the upper support 200. Of course, the embodiment is not limited thereto, and for example, the support jig 600 may be disposed on the lower support 300. Specifically, the support jig 600 may be correspondingly disposed on a plurality of regions defined on the top surface of the lower support 300 which will be described later.

The upper drive component is coupled to the upper support 200 to lift the upper support 200. The upper drive component includes an upper drive shaft 410 coupled to the upper support 200 and an upper power component (not shown) that applies power to the upper drive shaft 410. The upper drive shaft 410 passes through the upper chamber 100a and is thus mounted on the top surface of the upper support 200. A separate sealing member (not shown) is disposed between the upper drive shaft 410 and the upper chamber 100a. Also, the upper drive component may further comprise: a separate alignment unit (not shown) that moves the upper support 200 in the X, Y or θ direction to align the position of the upper support 200; and a separate sensor (not Shown) for positioning the upper support 200, such as a camera.

The lower support 300 may be disposed in a lower side of the chamber 100 to support the lower substrate S2. The shape of the lower support 300 may be manufactured corresponding to the shape of the lower substrate S1. For example, the lower support 300 can be fabricated as a bottom surface having a rectangular plate shape.

The lower drive part is coupled to the lower support 300 to lift the lower support 300. The lower drive component includes a lower drive shaft 420 coupled to the lower support 300 and a lower power component (not shown) for applying power to the lower drive shaft 420. The lower drive shaft 420 passes through the lower chamber 100b and is thus mounted on the bottom surface of the lower support 300. A separate sealing member (not shown) is disposed between the lower drive shaft 420 and the lower chamber 100b. Also, the lower drive component can further include a separate alignment unit (not shown) and a separate sensor (not shown) corresponding to the sensor of the upper drive component.

When the support 600 according to the embodiment is not disposed on the lower support 300, an adsorption member (not shown) may be disposed on the lower support 300 to fix the lower substrate S2. Also, the absorbing member may be disposed on the top surface of the lower support member 300. The absorbing member may have various compositions and structures capable of fixing the lower substrate S2, and for example, the absorbing member may include a vacuum jig, an electrostatic jig, and an adhesive jig.

The lifting member 500 is correspondingly disposed in the upper support 200 to assist in attaching the upper substrate S1 to the bottom surface of the upper support 200 or separating the upper substrate S1 from the bottom surface of the upper support 200 and disposed on the lower support 300 The assistance is to attach the lower substrate S2 to the top surface of the lower support 300 or to separate the lower substrate S2 from the top surface of the lower support 300. To this end, the lifting member 500, for example, the ejector pin, can be correspondingly passed through the upper support 200 towards the upper substrate S1 and thus in the upper chamber 100a and through the lower support 300 towards the lower substrate S2 and thus placed In the lower chamber 100b.

Here, when the lifting member 500 is disposed in the upper support 200, the lifting member 500 may pass through the upper support 200 and the support jig disposed on the upper support 200 and thus be disposed in the upper chamber 100a. Also, the lifting member 500 disposed on the upper support member 200 may be selected to be in a position such that the lifting member 500 does not interfere with the composition of the support jig 600.

Also, a separate sealing member (not shown) may be disposed between the lifting member 500 and the support jig 600, and the lifting member 500 is disposed on the upper support member 200.

The number of the lifting members 500 may correspond to the size of each of the upper substrate S1 and the lower substrate S2. There may be a plurality of lifting members 500, and the plurality of lifting members 500 may be disposed to be spaced apart from each other. Also, the lifting member 500 is coupled to a separate lifting member driving part (not shown) that lifts the lifting member 500 to move vertically.

A separate vacuum clamp (not shown) may be disposed on the lifting member, which is disposed on the upper support 200 of the lifting member 500 (hereinafter referred to as "upper lifting member"). Specifically, a separate vacuum jig may be disposed on an end portion of the upper lifting member 500 facing the upper substrate S1 such that the upper substrate S1 supported by the upper lifting member contact when the upper lifting member is raised is vacuum-adsorbed and fixed to the upper portion. component.

Here, the separate vacuum jig located on the end of the lifting member 500 may be a bellows type vacuum pad such that the vacuum jig extends or contracts when the vacuum jig contacts the substrate to eliminate the impact due to contact with the vacuum jig and prevent the substrate from being damaged. A separate support pad (not shown) may be disposed on the lifting member, which is disposed on the lower support 300 of the lifting member 500 (hereinafter referred to as a "lower lifting member"). Specifically, a separate support pad having a predetermined area may be disposed on an end of the lower lift member facing the lower substrate S2. A plurality of lower lifting members can be coupled to the support pads. The lower lifting member can stably contact the supporting lower substrate S through the support pad.

Hereinafter, the support jig 600 according to the current embodiment will be described. Here, in order to describe the embodiment, the upper substrate S1 and the lower substrate S2 are collectively referred to as "substrate" when it is not necessary to specifically distinguish the upper substrate S1 from the lower substrate S2 except for the case where the upper substrate S1 and the lower substrate S2 must be distinguished. .

The support jig 600 according to one embodiment is an element disposed in the substrate processing apparatus to support and fix the substrate. The support jig 600 includes a main body 620 having an inner space and one surface 621 for supporting the substrate, for example, a support surface, and an expandable member 630 that divides the inner space of the main body 620 to be stacked in the thickness direction of the main body 620 Separation spaces 610 on each other: a partition space 610a and a partition space 610b, the expandable member 630 being disposed in the body 620 to move in the thickness direction of the body 620 by gas selectively injected into the spaced partition spaces 610 a moving member 640 that passes through a surface 621 of the body 620, such as a support surface, the substrate is supported by the surface and thus disposed on the expandable member 630; and an adhesive member 650 disposed toward the exterior of the body 620 Each of the moving parts 640 is on the end.

The shape of the body 620 may be made corresponding to the shape of the upper support 200, for example, in a hexahedral shape. The body 620 has a top surface that is the other surface facing one surface 621 of the bottom surface of the body 620 disposed on the bottom surface of the upper support 200. The substrate is supported by one surface 621 of the body 620. That is, one surface 621 of the body 620 can serve as a support surface for the support substrate. A tube 680 through which gas is transported may be disposed on one side of each of the top surface and the side surface of the body 620 to inject a gas into the body 620 or discharge the gas injected into the body 620 to the outside.

The through hole 622 passes through one surface 621 which is a support surface of the body 620 which is a support substrate. The number of through holes 622 corresponds to the number of moving parts 640 which will be described later. The through holes 622 may be provided in plurality, and the plurality of through holes 622 are disposed to be spaced apart from each other. The moving member 640 has one end disposed in the through hole 622. Also, an adhesive member 650 located on one end of the moving member 640 is disposed in the through hole 622. The bonding member 650 may be exposed to the outside of the body 620 through the through hole 622.

Also, a plurality of vacuum holes 623 may be defined at a position spaced apart from the through holes 622 in one surface 621 of the body 620. Specifically, the plurality of vacuum holes 623 are spaced apart from each other in one surface 621 of the body 620. For example, a separate vacuum conditioning unit (not shown), such as a vacuum pump, is coupled to each vacuum aperture 623. The vacuum hole 623 can be adjusted to a vacuum adsorption substrate by a vacuum adjustment unit in a vacuum, whereby the auxiliary substrate is fixed to the support surface of the support jig 600. As illustrated in FIG. 2, the through hole 622 can be defined as being spaced apart from the vacuum hole 623 by a predetermined distance.

Body 620 can be manufactured integrally or separately. In the current embodiment, a separate type of body 620 is illustrated. That is, the body 620 includes an upper body 620a and a lower body 620b. The upper body 620a can be detachably coupled to the lower body 620b.

The expandable member 630 is an element disposed in the body 620 to drive the moving member 640 and the bonding member 650 disposed on the moving member 640. The expandable member 630 may include an elastic film 631 disposed in the body 620 such that the internal space of the body 620 is divided into a partition space 610: a partition space 610a and a partition space 610b, which are stacked on each other in the thickness direction of the body 620. Also, the expandable member 630 may include a reinforcing plate 632 disposed on one surface of the elastic film 631 to move in the thickness direction of the body 620 according to the shape change of the elastic film 631.

The elastic film 631 may be a film having elasticity, for example, a separator. The elastic film 631 may be formed of natural rubber, synthetic rubber, metal sheets, and engineering plastics. For example, the elastic film 631 may have an edge disposed in the body 620 between the coupling surfaces of the upper body 620a and the lower body 620b. Here, a separate sealing unit (not shown) may be disposed between each of the contact surfaces between the elastic film 631 and the upper body 620a and between the elastic film 631 and the lower body 620b.

The inner space of the body 620 may be divided into an upper partition space 610a and a lower partition space 610b by the elastic film 631. Specifically, the elastic film 631 may be disposed in the main body 620 in the horizontal direction to divide the inner space of the main body 620 in a direction parallel to the support surface. The elastic film 631 can be expanded by an inert gas sprayed thereon. When the injected inert gas is discharged to the outside, the elastic film 631 can be contracted again to return to its original position. That is, the spaced apart partition spaces 610: the partition spaces 610a and the partition spaces 610b are isolated from each other by the elastic film 631 and thus do not communicate with each other. Therefore, the gas may not flow from the upper partition space 610a to the lower partition space 610b and vice versa. That is, when the gas is injected into the upper partition space 610a, the elastic film 631 can be expanded downward, and when the gas is injected into the lower partition space 610b, the elastic film 631 can be expanded upward.

The reinforcing plate 632 is disposed on at least one surface of the elastic film 631 such that the moving member 640 is stably disposed to be supported by the expandable member 630, and the elastic film 631 is controlled in expansion and contraction in the thickness direction of the body 620. That is, the reinforcing plate 632 may be disposed on the bottom surface or the upper surface of the elastic film 631. Alternatively, the reinforcing plate 632 may be disposed on each of the upper surface and the lower surface of the elastic film 631.

Since the reinforcing plate 632 is disposed on the elastic film 631, when the elastic film 631 expands and contracts, a portion of the expandable member 630, that is, the reinforcing plate 632 can move while maintaining a parallel state with respect to the support surface of the body 620. Therefore, the reinforcing plate 632 may have a predetermined strength such that the reinforcing plate 632 does not bend and deform in a direction in which the elastic film 631 expands or contracts when the elastic film 631 expands or contracts. The shape of the reinforcing plate 632 may be made to correspond to the shape of the body 620, for example, a rectangular plate shape. By the reinforcing plate 632, the elastic film 631 can be controlled to change its direction in the target direction (for example, in the thickness direction of the body 620). Also, the moving members 640 can be moved in the main body 620 while being held by the reinforcing plate 632 at the same height in the thickness direction of the main body 620.

The reinforcing plate 632 may have a lower limit of the area such that the required number of moving parts 640 are supported by the reinforcing plate 632. Also, the reinforcing plate 632 may have an upper limit of the area such that the edge of the reinforcing plate 632 is spaced apart from the body 620 by a predetermined distance. Therefore, the elastic film 631 can have a predetermined region capable of accepting its expansion and contraction due to injection and discharge of gas. That is, the reinforcing plate 632 can be moved in the thickness direction of the main body 620 with the expansion or contraction of the region of the elastic film 631 disposed between the edge of the reinforcing plate 632 and the main body 620, that is, the reinforcing plate 632 The area not placed on it.

The moving member 640 may pass through one surface 621 of the lower body 620b, for example, a support surface in the thickness direction of the body 620 and thus on the expandable member 630. Here, the moving member 640 may be stably supported by the reinforcing plate 632. At least a portion of the moving member 640, specifically, one end of the moving member 640 toward the outside of the body 620 is inserted into a through hole 622 defined in one surface 621 of the body 620.

The number of moving parts 640 is provided in plurality according to the size of the substrate. The plurality of moving parts 640 are disposed to be spaced apart from each other. The moving member 640 may be divided into an upper moving member 640a and a lower moving member 640b, which are disposed on an upper portion of the expandable member 630, that is, in the upper partitioning space 610a, the lower moving member 640b is disposed In the lower portion of the expandable member 630, that is to say in the lower partition space 610b. The lower moving part 640b may have a length such that one end of one surface 621 of the body 620 facing the moving part 640 is disposed in the through hole 622 of the body 620. The upper moving part 640a may have a length such that the other end of the moving part 640 is spaced apart from the shower head 660 which will be described later by a predetermined distance. Here, the distance between the other end of the moving member 640 and the showerhead 660 can accommodate a change in the expandable member 630 as the expandable member 630 ascends and expands. That is, the distance between the other end of the moving member 640 and the shower head 660 indicates the stroke distance of the bonding member 650, for example, the distance between the upper limit position of the bonding member 650 and the lower limit position of the bonding member 650. The upper moving member 640a can serve as a stopper when the moving member 640 ascends.

Since the moving part 640 is disposed on the expandable part 630 to move according to the movement of the expandable part 630, the moving part 640 can be coupled to the expandable part 630 as follows. The protrusion 641 is disposed on the outer circumferential surface of the upper end of the lower moving member 640b, and the washer 642 is disposed on the outer circumferential surface of the upper end of the upper moving member 640a to correspond to the protrusion 641. Each of the protrusion 641 and the washer 642 contacts the expandable member 630. The bolt 643 passes through the protrusion 641 and the washer 642 to allow the moving part 640 to be fixed to the expandable part 630. Here, the washer 642 can secure the moving member 640 to the expandable member 630 and seal the expandable member 630 that is penetrated by the moving member 640.

The bonding member 650 is a member for fixing the substrate by using an adhesive force. The adhesive member 650 may be formed of a material having a feature in which once the adhesive member is bonded to the substrate and then separated from the substrate, the adhesive member is placed on one end of the moving member 640 without actually leaving a bonding track. For example, the adhesive component 650 can be an adhesive sheet formed from a ruthenium based, acrylic based or fluorine based material.

The adhesive member 650 is disposed on one end of the moving member 640 such that the adhesive member 650 can move through the through hole 622. Therefore, the bonding member 650 is exposed to the outside of the body 620 through the through hole 622 of the body 620. The adhesive member 650 is exposed to one surface 621 of the body 620, for example, the support surface may have a circular shape. The adhesive member 650 may be coupled to the end of the moving member 640 by a bolt (not shown) or to the end of the moving member 640 by an adhesive. The adhesive member 650 is disposed on one end of the moving member 640 to move within the through hole 622 of the body 620 by lifting of the moving member 640. Specifically, the adhesive member 650 has an adhesive surface 651 disposed parallel to the support surface in the through hole 622 of the body 620 to be bonded to the substrate or disposed to be spaced apart from the support surface in the through hole 622 and selectively implanted into the substrate The gas in the separation space 610 is detached from the substrate.

The support jig 600 according to the embodiment may further include a shower head 660 disposed in the main body 620 such that gas is injected into the partition space 610 in the thickness direction of the main body 620: at least one of the partition space 610a and the partition space 610b. Specifically, the shower head 660 is disposed in the upper body 620a such that gas is injected into the upper partition space 610a in the thickness direction of the body 620. The showerhead 660 is coupled to an upper tube 681 disposed on one side of the upper body 620a.

The shower head 660 may include a bottom plate, for example, a perforated plate having a plurality of spray holes 661 defined in a thickness direction of the body 620, and a side wall surrounding an edge of the bottom plate on the upper portion of the bottom plate. Each of the side walls has an upper portion that is hermetically disposed on an upper portion of the upper body 620a. The bottom plate of the showerhead 660 can be disposed to be spaced apart from the upper portion of the upper body 620a by a predetermined distance. The bottom plate has an area corresponding to the size of the reinforcing plate 632.

By the shower head 660, the gas can be uniformly sprayed to the upper partition space 610a and the reinforcing plate 632. Thus, a uniform force can be applied to the expandable member 630 to allow the expandable member 630 to rise or fall while maintaining a level state. Of course, the shower head 660 may be disposed in the lower body 620b such that gas is injected into the lower partition space 610b. Alternatively, the showerhead 660 can be disposed on the body 620.

The support jig 600 according to an embodiment may further include a cushioning member 670 disposed in at least one of the partition spaces 610 in the main body 620 and each of which has one end connected to the expandable member 630 such that it is expandable The member 630 moves in the body 620 in the thickness direction of the body 620 while maintaining a uniform height.

That is, each of the cushioning members 670 is disposed in the body 620 toward the expandable member 630. The cushioning member 670 has a portion that contacts the expandable member 630 to elastically support the expandable member 630. The expandable member 630 can withstand the pressure of the gas that is deflected by the cushioning member 670 that is mainly placed thereon and that is smoothly raised at a desired speed in the thickness direction of the body 620. Therefore, it is possible to prevent an unexpected driving of the expandable member 630 and an adhesion slip phenomenon between the expandable member 630 and the moving member, that is, a vibration phenomenon.

In the present embodiment, although the cushioning member 670 is disposed on the lower body 620b below the expandable member 630, that is, in the lower partition space 610b, the embodiment is not limited thereto. For example, the cushioning member 670 can be disposed on the upper body 620a above the expandable member 630, that is, in the upper partition space 610a. Also, a cushioning member 670 may be disposed on each of the upper body 620a and the lower body 620b above and below the expandable member 630 and thus disposed on each of the upper partition space 610a and the lower partition space 610b. Hereinafter, although the technical features of the cushioning member 670 are described based on the cushioning member 670 disposed on the lower body 620b, the embodiment can be equally applied to the case where the cushioning member 670 is disposed on the upper body 620a.

The cushioning member 670 may include: a guiding member 671 disposed in the body 620 toward the expandable member 630; and an elastic member 672 disposed outside the guiding member 671 and having one end connected and supported by the body 620 and the expandable member The other end of the 630 connection and support. Here, the guiding member 671 may have a length such that one end of the guiding member 671 facing the expandable member 630 is spaced apart from the expandable member 630. Specifically, the guiding member 671 has a length such that when the expandable member 630 moves toward the guiding member 671, one end of the guiding member 671 contacts the expandable member 630, and on the other hand, one end of the guiding member 671 is spaced from the expandable member 630. open.

The elastic member 672, for example, an elastic spring, has its both ends fixedly fixed to or in contact with the expandable member 630 and the body 620, respectively. The elastic member 672 can support the expandable member 630 and the body 620 by using an elastic force. The cushioning member 670 may be provided in plurality and thus at a plurality of locations on the lower body 620b. Here, the plurality of cushioning members 670 may be disposed to be spaced apart from each other by a predetermined distance in the horizontal direction. Therefore, when the expandable member 630 is moved in the thickness direction of the body 620, the cushioning member 670 can elastically support the reinforcing plate 632 such that the reinforcing plate 632 is parallel to one surface 621 of the lower body 620b, for example, a support surface.

Tube 680 includes an upper tube 681 and a lower tube 682. The upper tube 681 may be disposed on one of a top surface and a side surface of the upper body 620a. The lower tube 682 may be disposed on a side surface of the lower body 620b. The tube 680 can extend outwardly from the chamber 100 and thus be connected to a gas supply conditioning unit (not shown) disposed external to the chamber 100. Here, a separate sealing unit (not shown) may be disposed between the tube 680 and the chamber 100. Here, the sealing unit may be a variety of sealing units suitable for sealing, such as rubber packages, gaskets, and hermetic seals.

The gas supply adjusting unit may inject a gas into the inner space of the body 620 and exhaust the gas from the body 620. Here, when the gas is injected into the upper partition space 610a, the gas supply adjusting unit may exhaust the gas from the lower partition space 610b. And, when the gas is injected into the lower partition space 610b, the gas supply adjusting unit may discharge the gas from the upper partition space 610a. That is, the gas supply adjusting unit may selectively inject the gas into the upper partition space 610a and the lower partition space 610b or discharge the gas from the upper partition space 610a and the lower partition space 610b. The injection and discharge of gas can be performed instead. Therefore, the gas supply adjusting unit can be provided in plurality and thus connected to the upper tube 681 and the lower tube 682, respectively.

Also, for example, the gas supply adjusting unit may include a gas supply source (not shown) that injects a gas at a predetermined pressure and a discharge pump (not shown) that discharges the injected gas. A control valve (not shown) for controlling the movement of the gas may be disposed between the gas supply source and the discharge pump and between the discharge pump and the tube 680, respectively.

As illustrated in FIGS. 3(a) and 3(b), the support jig 600 according to a modified example may further include a sealing member 690 disposed in one end of the through hole 622: a sealing member 691, a sealing member 692, and a seal The member 693 is such that the outer circumferential surface of the adhesive member 650 or the outer circumferential surface of one end of the moving member 640 and the inner wall of the through hole 622 of the main body 620 are sealed.

To this end, one end of the through hole 622 may have an inner diameter larger than a remaining area or a central area of the through hole 622, and thus may define a space into which the sealing member 690 is disposed. For example, the sealing member 690 may include a sealing film 691 extending from an outer circumferential surface of the bonding member 650 toward an inner wall of one end of the through hole 622, and a ring member 692 disposed at an inner wall of one end of the through hole 622 The sealing film 691 is hermetically disposed on one end of the through hole 622.

For example, the sealing film 691 may be formed of the same material as the elastic film 631. The sealing film 691 may be a film disposed on the outer circumferential surface of the bonding member 650 or may be a film separate from the bonding member 650. When the sealing film 691 is separately provided, the sealing film 691 may be adhered to the outer circumferential surface of the adhesive member 650 or the outer circumferential surface of one end of the moving member 640 by an adhesive and thus sealed.

The ring member 692 is an assembly that allows the sealing film 691 to be placed on the inner wall of the through hole 622. When the adhesive member 650 is moved, the ring member may support the sealing film 691 to maintain a sealed state between the sealing film 691 and one end of the through hole 622. The ring member 692 can be coupled to one end of the through hole 622 by a bolt 693 or bonded to one end of the through hole 622 by an adhesive.

Also, the sealing member 690 may be disposed on one end toward the outside of the body 620 of the through hole 622 and thus exposed outside the body 620. Also, the sealing member 690 may be disposed in the other end of the through hole 622 defined as having an inner diameter larger than the inner diameter of the through hole and thus disposed in the body 620.

FIG. 9 is a flow chart showing a substrate processing method according to an embodiment. Hereinafter, a substrate processing method according to an embodiment will be described with reference to FIGS. 1 through 9. Here, a repetitive description of the substrate processing apparatus according to the embodiment will be omitted or simply described.

The substrate processing method is a method of performing bonding of substrates by using the above substrate processing apparatus. The substrate processing method includes providing an upper substrate S1 and a lower substrate S2, allowing the lower substrate S2 to be supported by the lower support 300 and the upper substrate S1 being supported by the upper support 200, and fixing the upper substrate S1 to the upper substrate S1 by using the support jig 600 of the upper support 200 The support jig 600 reduces the distance between the upper support 200 and the lower support 300 to closely attach the upper substrate S1 to the lower substrate S2, release the upper substrate S1 from the support jig 600, and support from the upper support 200 and the lower support The piece 300 separates the bonded substrate.

Here, fixing the upper substrate S1 to the support jig 600 includes injecting gas into the upper partition space in the support jig 600, allowing the adhesive member of the support jig 600 to be lowered, and allowing the adhesive member to be adhered to the upper substrate. Also, the release of the upper substrate S1 from the support jig includes injecting gas into the lower partition space in the support jig, allowing the adhesive member of the support jig 600 to rise and separate the adhesive member from the upper substrate.

First, in operation S100, a substrate is prepared. For example, the upper substrate S1 is disposed under the upper support 200, and is disposed on the lower support 300 by using a lower arm S2 of a mechanical arm (not shown). Here, a bonding member (not shown), for example, may be disposed on a top surface of the lower substrate along an edge of the lower substrate.

Then, as illustrated in FIGS. 4 and 5, the lower substrate S2 is placed and supported on the top surface of the lower support 300 in operation S210. In operation S220, the upper substrate S1 is supported by the support jig 600 of the upper support 200 in a vacuum suction manner. In the process in which the upper substrate S1 is adsorbed onto the support jig 600 of the upper support 200 and supported by the support jig 600 of the upper support 200, for example, the lifting member 500 is lowered to contact the upper substrate S1, and the upper substrate S1 is lifted by the lifting member In a state in which the 500 is supported by vacuum suction, the lifting member 500 is raised to allow the top surface of the upper substrate S1 to contact the support surface of the support jig 600. Subsequently, the upper substrate S1 is adsorbed onto the support surface by the vacuum generated in the vacuum hole 623 and supported by the support surface.

Subsequently, in operation S310, the control valve of the gas supply source connected to the upper partition space 610a is opened to allow an inert gas, for example, nitrogen gas, to be injected from the gas supply source into the upper partition space 610a of the support jig 600. Here, the gas can be uniformly sprayed into the upper partition space 610a through the shower head 660. The elastic film 631 expands as the gas is injected. Here, the elastic film 631 may be controlled in the extending direction by the shower head 660 and the reinforcing plate 632 in the thickness direction of the main body 620. In operation S320, the moving member 640 and the bonding member 650 disposed on the expandable member 630 may be lowered by the lowering of the expandable member 630. Here, the cushioning member 670 contracts in the direction in which the expandable member 630 moves and applies a predetermined elastic force to the expandable member 630. According to the elastic force, the expandable member 630 can be stably moved.

When the expandable member 630 contacts the guide member 671, the movement of the expandable member 630 is stopped. That is, the guiding member 671 can function as a stopper. In the process, in operation S330, the bonding surface 651 of the bonding member 650 is pressed to move toward the substrate and thus the pressing is attached to the top surface of the substrate, and thus the bonding member 650 is fixed to the substrate by the bonding surface 651.

Here, before the inert gas is supplied into the upper partition space 610a, that is, when the expandable member 630 is placed in its initial position, the adhesive surface of the adhesive member 650 may be disposed in parallel with the support surface of the lower body 620b or It is placed to protrude toward the substrate at a predetermined distance. The position of the adhesive member 650 can be easily selected as an ideal position by adjusting the length of the elastic member 672 disposed in the cushioning member 670 such that the expandable member 630 in the initial state is elastically supported.

When the substrate is bonded to the bonding member 650, the control valve connected to the upper partitioning space 610a is closed to block the injection of gas into the upper partitioning space 610a. Here, the gas injected into the upper partition space 610a may be maintained or discharged from the upper partition space 610a through the upper tube 681. When the gas is discharged, the expandable member 630 is returned to its original position by the cushioning member 670, and the operation of pressing the bonding surface of the bonding member 650 to the substrate is stopped, and then the bonding surface is returned to its original position.

Although the predetermined region of the substrate is deformed by the pressurization of the bonding member 650 in the process to allow the substrate to be bonded, when the operation of pressing the bonding surface of the bonding member 650 to the substrate is stopped, the deformation of the substrate can be released, and thus the substrate can be returned to Its initial shape.

Subsequently, when the substrate is completely bonded to the bonding member 650, the chamber 100 is sealed, and during the process of placing the substrate on each of the supports (ie, during loading of the substrate) at atmospheric pressure The internal atmospheric pressure of the chamber 100 can be changed to a vacuum pressure. Here, the vacuum generated in the vacuum hole 623 of the support jig 600 is broken to release the vacuum suction between the vacuum hole 623 and the upper substrate S1, however, since the upper substrate S1 is bonded to the bonding member 650 and supported by the bonding member 650 Therefore, the upper substrate S1 can be maintained in a fixed state.

That is, when the bonding member 650 is completely fixed to the upper substrate S1, even if the vacuum state of the vacuum hole 623 of the supporting jig 600 is broken by the control of the internal atmospheric pressure of the chamber 100, the upper substrate S1 can be bonded by the bonding member 650. The force is fixedly supported by the adhesive member 650.

In operation S400, the upper substrate S1 and the lower substrate S2 are aligned. Also, the interior of the chamber 100 is maintained in a vacuum state.

Subsequently, the distance between the upper substrate and the lower substrate is reduced by using at least one of the upper support 200 and the lower support 300. As illustrated in FIG. 5, for example, in operation S500, the lower support 300 is raised to allow the upper substrate S1 to be closely attached to the lower substrate S2. Of course, at the same time, the upper support 200 may be lowered to allow the upper substrate S1 to be closely attached to the lower substrate S2.

When the upper substrate S1 is completely tightly attached to the lower substrate S2, as illustrated in FIG. 7, in operation S610, the control valve of the gas supply source connected to the lower partition space 610b of the support jig 600 is opened to be injected from the gas supply source. An inert gas, for example, nitrogen, is introduced into the lower partition space 610b of the support jig 600. Here, the gas previously injected into the upper partition space 610a in the support jig 600 is discharged through the upper pipe 681. In this process, the gas injected into each of the lower partition space 610b and the upper partition space 610a can adjust the injection rate and pressure in a desired ratio to allow the expandable member 630 to rise smoothly.

The elastic film 631 which is expanded downward by the injection of the gas can be contracted to the initial position and then expanded upward again in some cases. Specifically, the elastic film 631 may be further expanded toward the shower head 660 such that the reinforcing member 632 rises until the upper end of the moving member 640 contacts the shower head 660. Of course, at this time, the expansion of the elastic film 631 is controlled by the reinforcing plate 632 in the thickness direction of the main body 620. In operation S620, as the expandable member 630 ascends, the moving member 640 and the adhesive member 650 disposed on the expandable member 630 are lowered.

Here, the cushioning member 670 can apply a predetermined elastic force to the expandable member 630 while elastically recovering in the moving direction of the expandable member 630, and thus the expandable member 630 can be stably moved by the elastic force. When the upper end of the moving member 640 contacts the shower head 660, the movement of the expandable member 630 is stopped. That is, the upper end of the moving member 640, for example, the upper moving member 640a can function as a stopper.

In the above process, in operation S630, the bonding surface of the bonding member 650 moves away from the substrate and thus is released from the top surface of the upper substrate S1, and thus the bonding member 650 is separated from the upper substrate S1. The upper substrate S1 separated from the support jig 600 is placed and supported on the lower substrate S2. When the bonding member 650 is released from the upper substrate S1, the control valve connected to the lower partition space 610b is closed to terminate the injection of gas. And then, the gas supplied into the lower partition space 610b can be discharged through the lower pipe 682. Therefore, the adhesive member 650 can be returned to its original position.

As described above, while the bonding member 650 is moved into the support jig 600 and released from the upper substrate S1, the support surface contact of the support jig 600 is maintained to be supported by the upper substrate S1, and thus compared with the prior art The substrate can be stably spaced apart and the occurrence of wringing in the alignment substrate can be prevented.

In the current embodiment, the sealing member 690 may be disposed on one end of the through hole 622 or may not be disposed on one end of the through hole 622. When the sealing member 690 is not disposed on one end of the through hole 622, at least a portion of the gas injected into the lower partition space 610b may be sprayed between the through hole 622 and the bonding member 650. Therefore, the gas injected into the lower partition space 610b can serve as a purge gas for assisting the separation of the upper substrate S1 from the support jig 600 while the upper substrate S1 is separated from the support jig 600.

Subsequently, as illustrated in FIG. 8, in operation S700, the upper support rises. Here, while the upper support 200 is raised, or before or after the upper support 200 is raised, the gas injected into the lower partition space 610b may be discharged to release the pressure applied to the internal components of the support jig 600, thereby The state of the internal components of the support jig 600 is changed to their initial state.

Subsequently, the lifting member 500 placed on the lower support 300 is raised to separate the substrate from the lower support 300, and the substrate is moved to a spaced apart curing device (not shown). And then, in operation S800, light, for example, ultraviolet rays are irradiated onto the bonding member, for example, a sealant, by using a curing device to cure the sealant to complete the bonding of the substrates.

According to the embodiment, it is possible to provide an expandable member that is driven while maintaining a parallel state with respect to the substrate in the support jig by selectively injecting gas into the isolated partition space in the support jig.

Here, the expandable member may be stably driven by the cushioning member that elastically supports the expandable member. Since the adhesive member is moved inward or outward in the support jig by using the expandable member, the adhesive members can be moved while maintaining the same height as each other, and the support jig can uniformly bond the adhesive member to the substrate or uniformly bond the adhesive member from the substrate. Separation.

According to the prior art, a separate component of the contact substrate is used to push the substrate from the support fixture, thereby separating the substrate from the support fixture. Therefore, the substrate is damaged or twisted due to the force applied to the substrate from the separate components.

On the other hand, according to the embodiment, while the bonding member moves the supporting jig inward to separate the substrate from the supporting jig, the substrate can be maintained in a state where the substrate contacts the supporting surface of the supporting jig, and thus the substrate can be separated without being damaged And it can also prevent the substrate from being twisted.

And, since the support jig allows gas to be selectively injected into the isolated partition space therein to drive the adhesive member, that is, the member that drives the adhesive member is disposed in the support jig, the support jig and the substrate processing apparatus having the support jig may It is simplified in structure.

Therefore, various substrate processing processes, for example, stability of the substrate bonding process can be improved, and the manufactured substrate can also be improved in quality.

Although the substrate bonding process and apparatus have been described with reference to the specific embodiments, they are not limited thereto. It will be apparent to those skilled in the art that various modifications and changes can be made without departing from the spirit and scope of the invention as defined by the appended claims.

100‧‧‧ chamber
100a‧‧‧ upper chamber
100b‧‧‧lower chamber
200‧‧‧Upper support
300‧‧‧lower support
410‧‧‧Upper drive shaft
420‧‧‧Lower drive shaft
500‧‧‧lifting parts
600‧‧‧Support fixture
610‧‧‧Separation space
610a‧‧‧ upper compartment
610b‧‧‧lower separation space
620‧‧‧ Subject
620a‧‧‧ upper body
620b‧‧‧Lower subject
621‧‧‧ a surface
622‧‧‧through hole
623‧‧‧vacuum hole
630‧‧‧Extensible parts
631‧‧‧elastic film
632‧‧‧ Strengthening board
640‧‧‧moving parts
640a‧‧‧Upper moving parts
640b‧‧‧low moving parts
641‧‧‧ Protrusion
642‧‧‧Washers
643‧‧‧Bolts
650‧‧‧Adhesive parts
651‧‧‧ bonded surface
660‧‧‧Sprinkler
661‧‧‧Spray hole
670‧‧‧buffer parts
671‧‧‧Guide parts
672‧‧‧Flexible parts
680‧‧‧ tube
681‧‧‧ upper tube
682‧‧‧lower tube
690‧‧‧ Sealing parts
691‧‧‧ sealing film
692‧‧‧ ring parts
693‧‧‧ bolts
S1‧‧‧ upper substrate
S2‧‧‧lower substrate
S100~S800‧‧‧ operation

1 is a side view of a substrate processing apparatus in accordance with one embodiment. 2 is a side view of a support fixture in accordance with one embodiment. 3(a) and 3(b) are partial views of a support jig according to a modified example. 4 to 8 are views illustrating a state in which a substrate processing apparatus operates according to an embodiment. FIG. 9 is a flow chart showing a substrate processing method according to an embodiment.

100‧‧‧ chamber

100a‧‧‧ upper chamber

100b‧‧‧lower chamber

200‧‧‧Upper support

300‧‧‧lower support

410‧‧‧Upper drive shaft

420‧‧‧Lower drive shaft

500‧‧‧lifting parts

600‧‧‧Support fixture

630‧‧‧Extensible parts

631‧‧‧elastic film

632‧‧‧ Strengthening board

640‧‧‧moving parts

650‧‧‧Adhesive parts

670‧‧‧buffer parts

680‧‧‧ tube

681‧‧‧ upper tube

682‧‧‧lower tube

S1‧‧‧ upper substrate

S2‧‧‧lower substrate

Claims (16)

A support jig supporting a substrate, the support jig comprising: a main body having an inner space; an expandable member configured to divide the inner space in a thickness direction of the main body, the expandable member being disposed at the The body is configured to move the expandable member in the thickness direction of the body by gas injected into the spaced apart partition spaces; a moving member that passes through the thickness direction of the body One surface of the body and disposed on the flexible member; and an adhesive member disposed on an end of the moving member outward of the body. The support jig according to claim 1, further comprising a shower head disposed in the main body such that gas is injected into at least one of the partition spaces in the thickness direction of the main body. The support jig according to claim 1, further comprising a cushioning member disposed in at least one of the partition spaces and having one end connected to the expandable member. The support jig according to claim 1, wherein the through hole and the vacuum hole are defined in one surface of the main body, and the adhesive member is disposed in the through hole. The support jig according to claim 4, wherein an adhesive surface of the adhesive member exposed to the outside of the main body is disposed in the through hole by a gas selectively injected into the separation space or Parallel to the one surface of the body. The support jig according to claim 4, further comprising the sealing member disposed in the through hole such that a space between at least one of the upper end of the adhesive member and the moving member and the through hole It is sealed. The support jig according to claim 1, wherein the expandable member comprises: an elastic film disposed in the main body to divide the inner space; and a reinforcing plate disposed on the elastic film The at least one surface causes the reinforcement member to move in the thickness direction of the body in accordance with a shape change of the elastic film. The support jig according to claim 3, wherein the cushioning member comprises: a guiding member disposed in the main body toward the expandable member; and an elastic member disposed outside the guiding member And having one end connected to the expandable member and the other end connected to the main body. A substrate processing apparatus comprising: a chamber having a substrate processing space; an upper support disposed in the chamber; a lower support disposed to face the upper support; and a support fixture disposed in the On at least one of the upper support member and the lower support member, the support jig has a partition space separated from each other, wherein the support jig includes an adhesive member, and the adhesive member can be selectively injected into the The gas in the separation space moves outward or inward in the support fixture. The substrate processing apparatus of claim 9, wherein the support jig is provided in plurality, and the plurality of support jigs are disposed on a bottom surface defined by the upper support and the lower support In a plurality of regions on at least one of the top surfaces. The substrate processing apparatus of claim 9, wherein the support jig includes: a main body having an inner space; and an expandable member configured to divide the inner space in a thickness direction of the main body, The expandable member is disposed in the body such that the expandable member moves in the thickness direction of the body by gas injected into the spaced apart partition spaces; and a moving member disposed in the The expandable member has and has at least one portion that is inserted into the body. The substrate processing apparatus of claim 11, wherein the support jig includes: a cushioning member disposed in the main body toward the expandable member to contact and support the expandable member; and a tube, It is configured to inject a gas into each of the separation spaces. The substrate processing apparatus of claim 11, wherein the through hole and the vacuum hole are defined in one surface of the body, and the bonding member is coupled to an end of the moving member that is outward of the body The adhesive member is moved through the through hole. The substrate processing apparatus of claim 11, wherein the expandable member comprises: an elastic film disposed in the main body such that the inner space is divided in the thickness direction of the main body; And a reinforcing plate disposed on at least one surface of the elastic film. The substrate processing apparatus of claim 12, wherein the buffer member comprises: a guiding member disposed in at least one of the separation spaces facing the expandable member and having the expandable a portion of the member that is spaced apart toward the expandable member; and an elastic member that is disposed outside the guide member, the elastic member having one end connected and supported on the body and connected and supported at the The other end of the expansion unit. The substrate processing apparatus according to claim 13, wherein the sealing member further disposed on one end of the through hole thus includes a space between the through hole and an outer circumferential surface of the bonding member.