JP4955070B2 - Bonded substrate manufacturing apparatus and bonded substrate manufacturing method - Google Patents

Description

The present invention relates to a bonded substrate manufacturing apparatus and a bonded substrate manufacturing method.
This application claims priority on November 09, 2007 based on Japanese Patent Application No. 2007-291946 for which it applied to Japan, and uses the content here.

  A flat panel display (FPD) such as a liquid crystal display or a plasma display has a structure in which two substrates are bonded together. For example, in a liquid crystal display, an array substrate (TFT substrate) in which a plurality of TFTs (thin film transistors) are formed in a matrix and a color filter substrate (CF substrate) in which a color filter, a light-shielding film, and the like are formed are about several μm. The liquid crystal is sealed between the two substrates, and the two substrates are manufactured by being bonded to each other with a seal member (adhesive) containing a photocurable resin. The two substrates are bonded together in a vacuum environment in order to prevent mixing of impure gas.

  As an apparatus for bonding such two substrates, for example, a substrate bonding apparatus disclosed in Patent Document 1 is known. The substrate laminating apparatus of Patent Document 1 includes a vacuum chamber composed of an upper container and a lower container, an upper substrate conveying jig for moving the upper substrate, and a first for moving the upper container up and down. A support bar, a base plate on which the support bar is supported, and a second support bar for moving the upper substrate transport jig up and down are provided.

In the above-mentioned substrate laminating apparatus, the first support bar is moved downward, the upper container and the lower container are brought into contact with each other to form a vacuum chamber, and the second support bar is moved downward. Then, the upper substrate transport jig is lowered so that the upper substrate and the lower substrate are arranged to face each other at a predetermined interval. Thereafter, the upper substrate and the lower substrate are aligned and bonded together.
JP 2007-212572 A

  The above-mentioned bonded substrate manufacturing apparatus of Patent Document 1 evacuates the processing chamber, aligns the upper substrate and the lower substrate, and bonds these two substrates. However, if the upper substrate transport jig is moved by moving the second support rod provided on the base plate after the upper substrate and the lower substrate are aligned, the position of the upper substrate and the lower substrate May be shifted relatively. This is because a plurality of members are interposed between the base plate and the lower substrate, so that the lower container on which the lower substrate is disposed and the base plate on which the second support rod is provided behave differently. Because. As described above, there is a problem in that the yield decreases due to the relative positions of the upper substrate and the lower substrate being shifted.

  The present invention has been made in view of the above circumstances, and provides a bonded substrate manufacturing apparatus and a bonded substrate manufacturing method capable of improving the alignment accuracy of two substrates and improving the yield. Is an issue.

The present invention employs the following means in order to solve the above problems and achieve the object.
(1) The bonded substrate manufacturing apparatus of the present invention is a bonded substrate manufacturing apparatus that manufactures a bonded substrate by aligning an upper substrate and a lower substrate, and supports the lower substrate. When; vertically movable and chamber member and to form a combined processing chamber bonded with said base portion; vertical movement independently of the chamber member along said support rod; support rod and erected on the base portion An upper pressure member capable of holding the upper substrate ; and a drive mechanism provided on the upper surface of the upper pressure member for moving the upper pressure member up and down. By moving the pressure member, the upper substrate and the lower substrate are bonded together in the bonding processing chamber.

  According to the bonded substrate manufacturing apparatus described in (1) above, the upper pressure member on which the upper substrate is held is guided by the support rod standing on the base portion on which the lower substrate is placed, and is moved up and down. Since it moves, the number of members interposed between the upper substrate and the lower substrate can be minimized. Thereby, it is possible to prevent the relative positions of the upper substrate and the lower substrate from shifting after the upper substrate and the lower substrate are aligned and bonded. As a result, the alignment accuracy of the two substrates can be improved and the yield can be improved. In addition, since the upper pressure member and the chamber member can be moved up and down individually, the chamber member can be moved up and down at high speed, and the upper pressure member can be moved minutely (up and down movement) when the substrates are bonded together. . That is, the alignment accuracy of the two substrates is improved and the production efficiency is improved.

(2) It is preferable that an adsorption pin for adsorbing the upper substrate is provided on the chamber member.

  In the case of (2) above, the suction pin can be moved up and down in conjunction with the vertical movement of the chamber member. Further, the upper substrate can be transferred from the suction pin to the upper pressure member by moving the upper pressure member up and down independently of the chamber member. Therefore, an up-and-down movement mechanism unique to the suction pin is not required, and an increase in manufacturing cost can be suppressed.

(3) to said base portion, and a mounting table for mounting the lower substrate, and a moving mechanism for moving the mount table, that are provided preferably.

  In the case of (3), since the lower substrate is placed on the placement table, the lower substrate can be stably held, and the alignment between the lower substrate and the upper substrate can be performed with high accuracy.

(4) to said base portion, a lower substrate adsorption device for moving the lower substrate while adsorbing a portion of the lower substrate, upon movement of the lower substrate by the lower substrate adsorption device, the lower substrate of the lower substrate The lower substrate levitation that can float the portion that is not attracted to the adsorption device and can adsorb the portion that is not adsorbed to the lower substrate adsorption device of the lower substrate when the upper substrate and the lower substrate are bonded together And an adsorbing device.
(5) The bonded substrate manufacturing apparatus of the present invention is a bonded substrate manufacturing apparatus that manufactures a bonded substrate by aligning an upper substrate and a lower substrate, and supports the lower substrate. A chamber member that can move up and down and forms a laminating process chamber together with the base portion; a support bar erected on the base portion; and a vertical movement independently of the chamber member along the support rod And an upper pressure member capable of holding the upper substrate; and the upper pressure member moves to bond the upper substrate and the lower substrate inside the bonding process chamber. A lower substrate adsorption device that moves the lower substrate while adsorbing a part of the lower substrate to the base portion, and the lower substrate adsorption device of the lower substrate when the lower substrate is moved by the lower substrate adsorption device And parts not adsorbed A lower substrate floating adsorption device capable of adsorbing the lower substrate adsorption device and the non-adsorption portion of the lower substrate at the time of bonding the upper substrate and the lower substrate is provided. .

In the case of (4) above, when aligning the upper substrate and the lower substrate, the lower substrate can be levitated from the base portion by the lower substrate levitating suction device. Therefore, the lower substrate can be easily moved by the lower substrate suction device. When the upper substrate and the lower substrate are bonded together, the lower substrate can be attracted to the base portion by the lower substrate floating adsorption device. Therefore, the position shift of the lower substrate can be prevented, and the upper substrate and the lower substrate can be bonded together with high accuracy. In addition, since a table for placing the lower substrate is not required separately, the number of components interposed between the base portion and the lower substrate can be reduced.
Furthermore, if the lower substrate is adsorbed to the base part, the lower substrate adsorbing device and the lower substrate floating adsorbing device are not exposed to the bonding processing chamber, so that particles generated from each device flow into the bonding processing chamber. Can be prevented. Therefore, the cleanliness in the bonding treatment chamber can be ensured.

( 6 ) The bonded substrate manufacturing method of the present invention supports the lower substrate by the base portion, and holds the upper substrate by an upper pressure member that can move up and down along a support bar erected from the base portion. The lower substrate and the upper substrate are aligned and bonded together inside a bonding processing chamber constituted by a chamber member that can move up and down independently of the upper pressure member and the base portion. A bonded substrate manufacturing method for manufacturing a substrate, wherein the chamber member is lowered to form a bonded processing chamber in which the upper substrate and the lower substrate are accommodated by the base portion and the chamber member. A forming step; a first upper substrate moving step in which the upper pressurizing member is lowered and the lower substrate and the upper substrate are spaced apart by a predetermined distance; a depressurizing step for depressurizing the bonding process chamber; Lower the upper pressure member A second upper substrate moving step in which the lower substrate and the upper substrate are opposed to each other at a predetermined interval; and a mounting table on which the lower substrate is mounted is moved by a moving mechanism provided in the base portion. A substrate alignment step of moving the lower substrate to align the lower substrate and the upper substrate; and a plurality of driving mechanisms provided on the upper surface of the upper pressure member to move the upper pressure member A substrate laminating step of lowering and laminating the lower substrate and the upper substrate.

According to the bonded substrate manufacturing method described in ( 6 ) above, the upper pressure member holding the upper substrate is erected on the base portion where the mounting table on which the lower substrate is mounted is installed. Moves up and down as guided by the support bar. Therefore, the number of members interposed between the upper substrate and the lower substrate can be minimized. Accordingly, it is possible to prevent the positional relationship between the upper substrate and the lower substrate from being shifted after the upper substrate and the lower substrate are aligned and bonded. Therefore, the alignment accuracy of the two substrates can be improved and the yield can be improved. Further, since the upper pressurizing member and the chamber member can be moved up and down individually, the chamber member can be moved up and down at high speed, and the upper pressurizing member can be moved minutely (up and down movement) when the substrates are bonded. That is, the alignment accuracy of the two substrates is improved and the production efficiency is improved.
Further, since the bonding processing chamber is depressurized in a state where the lower substrate and the upper substrate are spaced apart from each other by a predetermined distance, the depressurization can be performed with a large conductance. Thereby, the decompression time can be shortened.
Further, after the pressure in the bonding process chamber is reduced, the lower substrate and the upper substrate can be aligned by the moving mechanism. Therefore, after aligning the lower substrate and the upper substrate, it is not necessary to raise the upper pressure member again, and the production efficiency can be improved.
And since the lower board | substrate is mounted in the mounting table, a lower board | substrate can be hold | maintained stably and position alignment with a lower board | substrate and an upper board | substrate can be performed with high precision.

( 7 ) The bonded substrate manufacturing method of the present invention supports the lower substrate by the base portion, and holds the upper substrate by an upper pressure member that can move up and down along a support bar erected from the base portion. The lower substrate and the upper substrate are aligned and bonded together inside a bonding processing chamber constituted by a chamber member that can move up and down independently of the upper pressure member and the base portion. A bonded substrate manufacturing method for manufacturing a substrate, wherein the chamber member is lowered to form a bonded processing chamber in which the upper substrate and the lower substrate are accommodated by the base portion and the chamber member. A chamber forming step; the lower substrate is separated from the base portion while adsorbing a part of the lower substrate by the lower substrate adsorption device installed in the base portion, and the lower substrate floating adsorption installed in the base portion Dress A first lower substrate moving step of levitating a portion of the lower substrate that is not adsorbed with the lower substrate suction device; and lowering the upper pressurizing member to keep the lower substrate and the upper substrate at a predetermined interval A first upper substrate moving step disposed opposite to each other; a substrate alignment step of moving the lower substrate by the lower substrate suction device to align the lower substrate with the upper substrate; and A second upper substrate moving step in which the lower substrate and the upper substrate are spaced apart from each other by a predetermined distance; and the lower substrate is attached to the base portion while adsorbing a part of the lower substrate by the lower substrate adsorption device. A second lower substrate moving step in which the lower substrate floating adsorption device causes the lower substrate adsorption device to adsorb a portion of the lower substrate that is not adsorbed to the base; A depressurizing step, And a substrate laminating step of laminating the upper pressurizing member to bond the lower substrate and the upper substrate together.

According to the method for manufacturing a bonded substrate described in ( 7 ) above, the upper pressure member holding the upper substrate is guided by the support bar standing on the base portion on which the lower substrate is placed, Since it moves, the number of members interposed between the upper substrate and the lower substrate can be minimized. Accordingly, it is possible to prevent the positional relationship between the upper substrate and the lower substrate from being shifted between the time when the upper substrate and the lower substrate are aligned and the time when they are bonded.
Therefore, the alignment accuracy of the two substrates can be improved and the yield can be improved.
In addition, since the bonding process chamber is depressurized after the upper pressurizing member is raised and the lower substrate and the upper substrate are separated from each other by a predetermined distance, the depressurization can be performed with a large conductance. Thereby, the decompression time can be shortened.
Furthermore, when aligning the upper substrate and the lower substrate, the lower substrate can be lifted from the base portion by the lower substrate floating suction device. Therefore, the lower substrate can be easily moved by the lower substrate suction device. When the upper substrate and the lower substrate are bonded together, the lower substrate can be adsorbed to the base portion by the lower substrate floating adsorption device. Therefore, the position shift of the lower substrate can be prevented, and the upper substrate and the lower substrate can be bonded together with high accuracy. In addition, since a table for placing the lower substrate is not required separately, the number of components interposed between the base portion and the lower substrate can be reduced. Furthermore, if the lower substrate is adsorbed to the base part, the lower substrate adsorbing device and the lower substrate floating adsorbing device are not exposed to the bonding processing chamber, so that particles generated from each device flow into the bonding processing chamber. Can be prevented. Therefore, the upper substrate and the lower substrate can be bonded together while ensuring the cleanliness in the bonding processing chamber.

According to the bonded substrate manufacturing apparatus described in (1) above, since the chamber member and the upper pressure member are both supported by the base portion, the number of members interposed between the upper substrate and the lower substrate is minimal. Is suppressed.
Accordingly, it is possible to prevent the positional relationship between the upper substrate and the lower substrate from being shifted between the time when the upper substrate and the lower substrate are aligned and the time when they are bonded. Therefore, the alignment accuracy of the two substrates is improved, and the yield can be improved. In addition, since the upper pressure member and the chamber member can be moved up and down individually, the chamber member can be moved up and down at a high speed, and the upper pressure member can move minutely (up and down movement) when the substrates are bonded. It is done. That is, the alignment accuracy of the two substrates can be improved and the production efficiency can be improved.

FIG. 1 is a schematic front view of a bonded substrate manufacturing apparatus according to the first embodiment of the present invention. 2 is a cross-sectional view taken along line AA in FIG. FIG. 3: is explanatory drawing (1) which shows the process in which a bonded substrate is manufactured using the bonded substrate manufacturing apparatus concerning the embodiment. FIG. 4 is explanatory drawing (2) which shows the process in which a bonded substrate is manufactured using the bonded substrate manufacturing apparatus concerning the embodiment. FIG. 5: is explanatory drawing (3) which shows the process in which a bonded substrate is manufactured using the bonded substrate manufacturing apparatus concerning the embodiment. FIG. 6: is explanatory drawing (4) which shows the process in which a bonded substrate is manufactured using the bonded substrate manufacturing apparatus concerning the embodiment. FIG. 7: is explanatory drawing (5) which shows the process in which a bonded substrate is manufactured using the bonded substrate manufacturing apparatus concerning the embodiment. FIG. 8: is explanatory drawing (6) which shows the process of manufacturing a bonded substrate using the bonded substrate manufacturing apparatus concerning the embodiment. FIG. 9: is explanatory drawing (7) which shows the process in which a bonded substrate is manufactured using the bonded substrate manufacturing apparatus concerning the embodiment. FIG. 10: is explanatory drawing (8) which shows the process in which a bonded substrate is manufactured using the bonded substrate manufacturing apparatus concerning the embodiment. FIG. 11 is a flowchart showing a process of manufacturing the bonded substrate according to the embodiment. FIG. 12 is a schematic front view of the bonded substrate manufacturing apparatus according to the second embodiment of the present invention. 13 is a cross-sectional view taken along line BB in FIG. FIG. 14 is an explanatory diagram showing a process of manufacturing a bonded substrate using the bonded substrate manufacturing apparatus according to the second embodiment of the present invention. FIG. 15 is a flowchart showing a process of manufacturing a bonded substrate according to the second embodiment of the present invention.

Explanation of symbols

10, 110 Bonded substrate manufacturing apparatus 11, 111 Base portion 14 Chamber member 15 Upper pressure member 16 Second support bar (support bar)
17 Chamber (bonding processing room)
29 moving mechanism 31 mounting table 57 suction pin 125 drive base (lower substrate suction device)
135 Air pad (lower substrate floating adsorption device)
W1 Lower substrate W2 Upper substrate W3 Bonded substrate

(First embodiment) (Laminated substrate manufacturing apparatus)
The bonded substrate manufacturing apparatus according to the first embodiment of the present invention will be described with reference to FIGS.
FIG. 1 is a schematic front view of a bonded substrate manufacturing apparatus, and FIG. 2 is a cross-sectional view taken along line AA of FIG. As shown in FIGS. 1 and 2, the bonded substrate manufacturing apparatus 10 includes a base portion 11 on which the lower substrate W <b> 1 is placed, a first support rod 13 erected on the base portion 11, and a first support rod 13. The chamber member 14 that can move up and down along the line and that constitutes a part of the chamber 17, the second support bar 16 that is erected on the base 11, and the chamber member 14 along the second support bar 16 And an upper pressurizing member 15 that can move up and down independently and can hold the upper substrate W2.

  The base part 11 has rigidity and is formed in a substantially rectangular parallelepiped shape. The base part 11 is provided with legs 22 at the four corners of the lower surface 21 and is placed on the floor surface. On the other hand, the upper surface 23 of the base portion 11 is formed in a rectangular shape in plan view. A recess 25 larger than the lower substrate W <b> 1 is formed on the upper surface 23 in plan view. XYθ guides 27 that are movable in two orthogonal horizontal directions and in a horizontal rotation direction (hereinafter referred to as a horizontal plane direction) are provided at approximately the center and four corners of the recess 25. A moving mechanism 29 in which an actuator 33 is provided on an XYθ guide having the same structure as that of the XYθ guide 27 is disposed at a substantially central portion between the XYθ guides 27 disposed on the peripheral edge of the recess 25. That is, five XYθ guides 27 and four moving mechanisms 29 are arranged in the recess 25. The surface 28 of the XYθ guide 27 and the surface 30 of the moving mechanism 29 are arranged to be flush with each other.

  On the top of the XYθ guide 27 and the moving mechanism 29, a rectangular mounting table 31 is provided in plan view. On the upper surface 32 of the mounting table 31, the lower substrate W1 can be mounted. By driving the moving mechanism 29, the mounting table 31 can be moved in the horizontal plane direction. That is, by driving the moving mechanism 29, the lower substrate W1 can be moved in the horizontal plane direction.

  The XYθ guide 27 has a substantially three-layer structure, and includes a base fixing portion 27a fixed to the base portion 11, a table fixing portion 27c fixed to the mounting table 31, and a base fixing portion 27a and a table fixing portion 27c. And a moving part 27b which is arranged between them and is movable in the horizontal plane direction.

  In the moving mechanism 29 (29a, 29b), when the actuator 33 is driven, the moving unit 27b moves in a desired direction. Here, for example, the moving mechanism 29a provided at the center in the long side direction of the recess 25 can be moved along the X direction (the long side direction of the mounting table 31), and the moving mechanism 29b provided in the short side direction. Can be moved along the Y direction (the short side direction of the mounting table 31), the mounting table 31 can be moved in a desired direction by controlling the movement amount of each moving mechanism 29. That is, when the placement table 31 is to be moved along the X direction, the moving mechanism 29a is moved, and when the placement table 31 is to be moved along the Y direction, the moving mechanism 29b is moved. . Further, by moving the two moving mechanisms 29a and the two moving mechanisms 29b, the mounting table 31 can be rotated around its vertical axis.

  A plurality of lift pins 45 are provided at positions on the upper surface 32 of the mounting table 31 corresponding to the lower substrate W1. The lift pins 45 are normally disposed below the upper surface 32 of the mounting table 31. Further, when the lower substrate W1 is delivered from another apparatus (not shown) to the bonded substrate manufacturing apparatus 10, the lift pins 45 are raised and the lower substrate W1 can be received from a robot arm (not shown). The lower substrate W1 can be placed on the upper surface 32 of the placement table 31 by lowering the lift pins 45 after receiving the lower substrate W1. Further, after the bonding process of the substrates W1 and W2 is completed, when the bonded substrate W3 is delivered to another apparatus, the lift pins 45 are lifted to separate the bonded substrate W3 from the upper surface 32 of the mounting table 31. Let A robot arm is inserted into the gap to transfer the bonded substrate W3.

  An exhaust port 47 is formed in the bottom surface 26 of the recess 25. The exhaust port 47 is connected to an exhaust pipe 48 that penetrates the base portion 11. The exhaust pipe 48 is connected to a vacuum pump 49 attached to the lower surface 21 of the base portion 11.

  A first support bar 13 is erected on the upper surface 23 of the base portion 11 outside the recess 25. The first support bars 13 are erected at the four corners of the base portion 11. The first support bar 13 can be rotated by an instruction from a drive source 66 attached to the base portion 11. The first support rod 13 is formed with a male screw 85.

  A chamber member 14 is attached to the first support bar 13. The chamber member 14 is formed in a rectangular shape having substantially the same size as the base portion 11 in plan view. In plan view, female screws 86 into which the first support bar 13 is screwed are formed at four corners of the chamber member 14 at positions corresponding to the first support bar 13. That is, the chamber member 14 can be moved up and down as the first support bar 13 rotates. A guide rod (not shown) may be provided in addition to the first support rod 13 to move the chamber member 14 up and down more reliably while keeping the chamber member 14 in a horizontal state.

  At the peripheral edge of the lower surface of the chamber member 14, a wall portion 51 extending vertically downward is formed over the entire circumference so that the bottom surface 52 of the wall portion 51 can come into contact with the upper surface 23 of the base portion 11. It is configured. Thereby, the chamber 17 can be constituted by the base portion 11 and the chamber member 14. The bottom surface 52 of the chamber member 14 is provided with a seal over the entire circumference.

  An upper substrate adsorption mechanism 55 for adsorbing the upper substrate W2 is provided on the ceiling 53 of the chamber member 14. The upper substrate suction mechanism 55 includes a main body portion 56 attached to the ceiling 53 and suction pins 57 extending from the main body portion 56 vertically downward. An opening 58 is formed at the tip of the suction pin 57, and the opening 58 is connected to a through hole 59 formed in the suction pin 57. The through hole 59 is further connected to a through hole 61 formed in the main body portion 56. The through hole 61 is connected to a pipe 62, the pipe 62 is led out of the apparatus, and an exhaust pump 63 is provided at the tip of the pipe 62. By doing so, the exhaust pump 63 can be driven to attract the upper substrate W2 to the suction pins 57. A valve 64 is provided in the middle of the pipe 62 to adjust the exhaust air volume.

  That is, when the upper substrate W2 is delivered from another device (not shown) to the bonded substrate manufacturing apparatus 10, the suction pump 57 can receive the upper substrate W2 from the robot arm (not shown) by driving the exhaust pump 63. . The upper substrate W2 can be held on the suction pins 57 by continuing the exhaust.

  Further, the position of the ceiling 53 of the chamber member 14 corresponding to an arbitrary position (preferably near the peripheral edge of the upper substrate W2) where the upper substrate W2 is held is used when alignment with the lower substrate W1 is performed. An imaging unit 81 of the camera 80 is formed. A camera placement portion 82 that is a through-hole penetrating the chamber member 14 is connected to the imaging portion 81. In other words, the camera 80 is set in the camera placement unit 82, and the camera 80 can photograph the alignment marks M1 and M2 between the lower substrate W1 and the upper substrate W2 through the photographing unit 81, thereby detecting the displacement of the alignment marks M1 and M2. A through hole, a notch, or the like (not shown) is formed at a position corresponding to the imaging unit 81 of the upper pressing member 15 so that the lower substrate W1 and the upper substrate W2 can be imaged. In addition, a control unit (not shown) is provided for instructing the moving mechanism 29 the amount of movement in the horizontal plane based on the result captured by the camera 80.

In plan view, the second support bar 16 is erected outside the mounting table 31 on the bottom surface 26 of the recess 25. The second support rods 16 are erected at the four corners of the recess 25.
An upper pressure member 15 is attached to the second support bar 16. The upper pressing member 15 is formed in a rectangular shape slightly smaller than the recess 25 in plan view. At the four corners of the upper pressure member 15, through holes 71 through which the second support bar 16 can be inserted are formed at positions corresponding to the second support bar 16. A guide guide 83 is disposed below the through hole 71 so that the upper pressure member 15 moves up and down along the second support rod 16 in the vertical direction.

The lower surface of the upper pressure member 15 is a holding surface 75 that holds the upper substrate W2.
A plurality of electrostatic chuck portions 77 are provided at positions where the upper substrate W2 of the holding surface 75 is held. The surface of the electrostatic chuck portion 77 is disposed so as to be flush with the holding surface 75. In addition, a through hole 78 through which the suction pin 57 can be inserted is formed at a portion of the holding surface 75 where the electrostatic chuck portion 77 is not disposed.

  Further, a plurality of drive mechanisms 92 for moving the upper pressure member 15 up and down are provided on the upper surface 91 of the upper pressure member 15. The drive mechanism 92 includes a shaft portion 93 whose length can be adjusted, and a control unit (not shown). The shaft portion 93 includes a fixed shaft 94 connected to the upper pressure member 15 and a movable shaft 95 that is connected to the fixed shaft 94 and adjusts the length of the shaft portion 93. The movable shaft 95 is configured to be housed inside the fixed shaft 94, and the length of the shaft portion 93 can be adjusted by moving the movable shaft 95 in the vertical direction with respect to the fixed shaft 94. That is, when the movable shaft 95 moves in the vertical direction with respect to the fixed shaft 94, the upper substrate W2 can be moved up and down. A through hole 98 for inserting the drive mechanism 92 is appropriately formed in the chamber member 14. In order to ensure the airtightness of the chamber 17, a seal 99 is interposed between the fixed shaft 94 and the through hole 98 of the chamber member 14.

A pressurizing mechanism 96 made of, for example, an actuator is provided above the drive mechanism 92 and above the chamber member 14. The pressurizing mechanism 96 is connected to the movable shaft 95.
When the lower substrate W1 and the upper substrate W2 are bonded together, the pressurizing mechanism 96 can be adjusted so that the substrates W1 and W2 are bonded together with an appropriate load. The load applied to the substrates W1 and W2 by the pressurizing mechanism 96 can be detected by the load cell 90.

  The movable shaft 95 may be housed inside the pressurizing mechanism 96 and may be adjustable in length. Further, a universal joint (universal shaft joint) is provided at the reference numeral 90 so that only the vertical force is applied to the upper pressure member 15 so that the upper pressure member 15 is guided only by the second support rod 16. Good. The load cell 90 may be attached to the inside of the pressurizing mechanism 96 or may be attached between the shaft portion 93 and the upper pressurizing member 15.

(Function)
Next, a procedure for manufacturing a bonded substrate using the bonded substrate manufacturing apparatus 10 will be described with reference to FIGS. 3-10 is explanatory drawing which shows the process of manufacturing a bonded substrate using a bonded substrate manufacturing apparatus, FIG. 11 is a flowchart which shows the process of manufacturing a bonded substrate.
Each step number described later corresponds to the step number in FIG.
First, as shown in FIG. 3, the upper pressing member 15 of the bonded substrate manufacturing apparatus 10 is held in a state of being positioned at the uppermost position by the pressing mechanism 96.

In step S1, in this state, the lower substrate W1 is carried in by the robot arm. A specific method for carrying in the lower substrate W1 will be described after step S2.
In step S <b> 2, the lower substrate W <b> 1 that has been transported by a robot arm (not shown) is placed above the placement table 31. Here, the lift pins 45 are raised to float the lower substrate W1 from the robot arm.

In step S <b> 3, the robot arm is retracted from the bonded substrate manufacturing apparatus 10.
In step S <b> 4, the lift pins 45 are lowered to place the lower substrate W <b> 1 on the upper surface 32 of the placement table 31.

In step S <b> 5, the upper substrate W <b> 2 that has been transported by a robot arm (not shown) is disposed below the holding surface 75 of the upper pressure member 15.
In step S6, the suction pin 57 is lowered to suck the upper substrate W2. In order to lower the suction pin 57, the chamber member 14 is lowered while the upper pressure member 15 is held at the uppermost position.
In step S <b> 7, the robot arm is retracted from the chamber 17.

In step S8, the upper pressure member 15 is lowered.
In step S <b> 9, the electrostatic chuck 77 of the upper pressure member 15 is caused to function so that the upper substrate W <b> 2 is attracted to the holding surface 75. FIG. 4 is an explanatory diagram when the process up to step S9 is completed.
Either the step of carrying in the lower substrate W1 of steps S1 to S4 or the step of carrying in the upper substrate W2 of steps S5 to S9 may be performed first. However, the upper substrate W2 may fall from the suction pins 57. Therefore, by carrying in the upper substrate W2 first, it is possible to prevent the lower substrate W1 from being affected by the drop of the upper substrate W2. In particular, when manufacturing a liquid crystal panel, it is desirable to carry in the upper substrate W2 first because the liquid crystal is applied to the upper surface of the lower substrate W1.

  Next, in step S10, as shown in FIG. 5, the chamber member 14 is lowered toward the base portion 11 (lower substrate W1). Since the female screws 86 at the four corners of the chamber member 14 are screwed into the male screws 85 of the first support rod 13, the chamber member 14 descends while maintaining the horizontal state. Then, the chamber member 14 is lowered until the bottom surface 52 of the wall portion 51 and the top surface 23 of the base portion 11 come into contact with each other. As a result, the chamber 17 hermetically sealed with the base portion 11 and the chamber member 14 is formed (processing chamber forming step).

  In step S11, substantially simultaneously with step S10, the upper pressing member 15 is lowered toward the base portion 11 (lower substrate W1) (first upper substrate moving step). At this time, the movable shaft 95 of the drive mechanism 92 moves so as to protrude from the fixed shaft 94, so that the length of the shaft portion 93 is increased and the upper pressurizing member 15 is lowered. At this time, since the second support rods 16 are inserted into the guide guides 83 at the four corners of the upper pressure member 15, the upper pressure member 15 is lowered while maintaining the horizontal state.

  The speed of the vertical movement of the chamber member 14 is set to be higher than the speed of the vertical movement of the upper pressure member 15. Therefore, when lowering the chamber member 14 and the upper pressurizing member 15, the position of the upper pressurizing member 15 at the time of transporting the substrate is set so that the substrate is taken in and out so that the chamber member 14 and the upper pressurizing member 15 do not interfere with each other. It is desirable to arrange it at a position as close to the base portion 11 as possible within a range that does not affect the above.

  In step S12, as shown in FIG. 6, when the chamber 17 is configured, the chamber 17 is evacuated. Specifically, the vacuum pump 49 is operated, and the inside of the chamber 17 is exhausted from the exhaust port 47 (decompression step). Then, the inside of the chamber 17 is kept in a vacuum state (about 0.4 Pa or less). When evacuation is performed with a sufficient distance between the lower substrate W1 and the upper substrate W2 as in this embodiment, conductance can be increased, the evacuation time can be shortened, and the air between the substrates W1 and W2 can be reduced. Can be exhausted reliably.

In step S13, as shown in FIG. 7, after the evacuation in the chamber 17 is completed, the upper pressure member 15 is lowered again, and a predetermined interval (several hundred μm) is formed between the lower substrate W1 and the upper substrate W2. (Second upper substrate moving step).
In step S14, as shown in FIG. 8, the camera 80 is operated, and the alignment marks M1 and M2 between the lower substrate W1 and the upper substrate W2 are sequentially focused and photographed. Then, the lower substrate W1 is moved in the horizontal plane direction so that the alignment marks M1 and M2 coincide with each other (substrate alignment step). At this time, based on the shift amount of the alignment marks M1, M2, the moving mechanism 29 is driven to move the mounting table 31, and the lower substrate W1 is moved to an appropriate position.

In step S15, after the alignment between the lower substrate W1 and the upper substrate W2 is completed, the upper pressing member 15 is further lowered.
In step S16, as shown in FIG. 9, the lower substrate W1 and the upper substrate W2 are bonded together (substrate bonding step). At this time, the pressing mechanism 96 applies a downward force to the upper pressing member 15 to pressurize both the substrates W1 and W2. Here, the load cell 90 detects the load acting on both the substrates W1 and W2, and adjusts the substrates to be bonded together with an appropriate load.

  In step S17, as shown in FIG. 10, when the bonding of the lower substrate W1 and the upper substrate W2 is completed, the chamber member 14 and the upper pressure member 15 are raised. At this time, the bonded substrate W3 is arranged on the base portion 11 (mounting table 31). That is, the function of the electrostatic chuck portion 77 of the upper pressing member 15 is released, and the upper substrate W2 is separated from the upper pressing member 15.

In step S <b> 18, the lift pins 45 of the base portion 11 are raised to raise the bonded substrate W <b> 3 from the upper surface 23.
In step S19, the robot arm is inserted into the gap between the bonded substrate W3 and the upper surface 23 of the base portion 11, and the bonded substrate W3 is delivered from the lift pins 45 to the robot arm. And a robot arm conveys the bonding board | substrate W3 to another apparatus which is not shown in figure, and a process is completed.

  According to the present embodiment, the upper substrate W2 and the lower substrate W1 are bonded while being aligned to manufacture the bonded substrate W3. The bonded substrate manufacturing apparatus 10 used for this manufacture includes a base portion 11 that supports a lower substrate W1, a chamber member 14 that is configured to move up and down and forms a chamber 17 together with the base portion 11, and a base portion 11. A second support bar 16 provided, and an upper pressurizing member 15 that can move up and down independently of the chamber member 14 along the second support bar 16 and can hold the upper substrate W2. As the pressure member 15 moves, the upper substrate W2 and the lower substrate W1 are bonded together in the chamber 17.

  Therefore, the upper pressurizing member 15 holding the upper substrate W2 moves up and down while being guided by the second support rod 16 standing on the base portion 11 on which the lower substrate W1 is placed. Therefore, the number of members interposed between the upper substrate W2 and the lower substrate W1 is minimized. Accordingly, it is possible to prevent the relative position between the upper substrate W2 and the lower substrate W1 from being shifted between the time when the upper substrate W2 and the lower substrate W1 are aligned and the time when they are bonded. Therefore, the alignment accuracy of the two substrates W1 and W2 is improved, and the yield is improved. Further, since the upper pressurizing member 15 and the chamber member 14 can be individually moved up and down, the chamber member 14 is moved up and down at a high speed, and the upper pressurizing member 15 moves minutely when the substrates W1 and W2 are bonded together ( Up and down). That is, the alignment accuracy of the two substrates W1 and W2 is improved and the production efficiency is improved.

In the bonded substrate manufacturing apparatus 10 according to the present embodiment, since the suction pin 57 for sucking the upper substrate W2 is provided in the chamber member 14, the suction pin 57 is moved up and down in conjunction with the vertical movement of the chamber member 14. Moved.
Further, the upper substrate W2 can be transferred from the suction pin 57 to the upper pressure member 15 by moving the upper pressure member 15 up and down independently of the chamber member 14. Therefore, an up-and-down movement mechanism unique to the suction pin 57 becomes unnecessary, and an increase in manufacturing cost can be suppressed.

  Furthermore, since the mounting table 31 for mounting the lower substrate W1 and the moving mechanism 29 for moving the mounting table 31 are provided on the base portion 11, the lower substrate W1 can be stably held, and the lower substrate W1 and the upper substrate Alignment with W2 can be performed with high accuracy.

(Second embodiment)
Next, the bonded substrate manufacturing apparatus which concerns on 2nd embodiment of this invention is demonstrated based on FIGS. In the present embodiment, only the mounting means for the lower substrate W1 is different from that of the first embodiment, and the other configurations are substantially the same. Therefore, the same portions are denoted by the same reference numerals and detailed description thereof is omitted.
12 is a schematic front view of the bonded substrate manufacturing apparatus, and FIG. 13 is a cross-sectional view taken along the line BB in FIG. As shown in FIGS. 12 and 13, the upper surface 123 of the base 111 is formed in a rectangular shape in plan view, and the lower substrate W1 can be placed thereon. A driving base 125 that can move the lower substrate W1 in the vertical direction, the orthogonal biaxial horizontal direction, and the horizontal rotation direction (hereinafter referred to as a horizontal plane direction) is provided at a substantially central portion of the upper surface 123 in plan view.

  The drive base 125 is disposed in a recess 124 formed on the upper surface 123 of the base portion 111. The drive base 125 is formed in a substantially circular shape in plan view, and a cavity 128 is formed inside the drive base 125. A plurality of air holes 127 are formed in the ceiling surface of the cavity 128. The cavity 128 is connected to an exhaust pipe 129 provided below the cavity 128. The exhaust pipe 129 extends from the lower surface 121 through the base portion 111 and is connected to an exhaust pump (not shown). That is, when the exhaust pump is moved in a state where the lower substrate W1 is placed on the drive base 125, the lower substrate W1 can be brought into close contact with the drive base 125 through the air holes 127. A valve 130 is provided in the middle of the exhaust pipe 129 so that the exhaust amount can be adjusted.

  A first moving mechanism 131 for moving the drive base 125 in the horizontal plane is provided below the drive base 125. Below the first moving mechanism 131, a second moving mechanism 132 for moving the drive base 125 in the vertical direction is provided. The driving method of the first moving mechanism 131 and the second moving mechanism 132 is not particularly limited. In the present embodiment, an actuator mechanism is used as the first moving mechanism 131, the driving base 125 is movable in a horizontal plane direction, a wedge-shaped member is used as the second moving mechanism 132, and the driving base 125 is moved by moving this member. Can be moved vertically.

A plurality (14 in the present embodiment) of air pads 135 are provided in the area on the upper surface 123 of the base portion 111 where the lower substrate W1 is placed. The air pad 135 is disposed in a recess 136 formed on the upper surface 123 of the base portion 111.
The air pad 135 is formed in a substantially circular shape in plan view, and a cavity 139 is formed inside the air pad 135. A plurality of air holes 138 are formed in the ceiling surface of the cavity 139. The cavity 139 is connected to a supply / exhaust pipe 140 provided therebelow. The air supply / exhaust pipe 140 extends from the lower surface 121 through the base portion 111 and is connected to an air supply / exhaust pump (not shown). When air is supplied in a state where the lower substrate W1 is placed on the base portion 111, air is ejected from the air holes 138 toward the lower substrate W1, and the lower substrate W1 is floated. On the other hand, if the lower substrate W1 is exhausted in a state where it is placed on the base portion 111, the lower substrate W1 can be brought into close contact with the base portion 111 via the air holes 138. A valve 141 for adjusting the supply / exhaust amount is provided in the middle of the supply / exhaust pipe 140. Under normal conditions, the surface 126 of the drive base 125 and the surface 137 of the air pad 135 are flush with each other.

(Function)
Next, a part of a procedure for manufacturing a bonded substrate using the bonded substrate manufacturing apparatus 110 will be described with reference to FIG. FIG. 15 is a flowchart showing a process of manufacturing a bonded substrate.
In step S1, the lower substrate W1 is carried in by the robot arm. A specific method for carrying in the lower substrate W1 will be described after step S2.
In step S <b> 2, the lower substrate W <b> 1 transported by a robot arm (not shown) is disposed above the base unit 111. Here, the lift pins 145 are raised to lift the lower substrate W1 from the robot arm.

In step S <b> 3, the robot arm is retracted from the bonded substrate manufacturing apparatus 10.
In step S <b> 4, the lift pins 145 are lowered to place the lower substrate W <b> 1 on the upper surface 123 of the base portion 111. At this time, the lower substrate W <b> 1 is adsorbed to the drive base 125 by exhausting from the exhaust pipe 129.

Steps S5 to S9 are substantially the same as those in the first embodiment, and thus description thereof is omitted.
Either the step of carrying in the lower substrate W1 of steps S1 to S4 or the step of carrying in the upper substrate W2 of steps S5 to S9 may be performed first.
In step S10, the chamber member 14 is lowered toward the base portion 111 (lower substrate W1). Since the female screws 86 at the four corners of the chamber member 14 are screwed into the male screws 85 of the first support rod 13, the chamber member 14 descends while maintaining the horizontal state. Then, the chamber member 14 is lowered until the bottom surface 52 of the wall portion 51 and the top surface 123 of the base portion 111 contact each other. That is, the base 17 and the chamber member 14 form a hermetically sealed chamber 17 (processing chamber forming step).

  In step S11, the lower substrate W1 is raised (first lower substrate moving step). Specifically, the second moving mechanism 132 provided on the base portion 111 is moved to move the drive base 125 upward. At substantially the same time, air is supplied to the air pad 135, and air is ejected from the air hole 138 toward the lower substrate W1. Then, the lower substrate W <b> 1 is lifted substantially at the center by the drive base 125, and the peripheral portion of the lower substrate W <b> 1 floats due to the action of the air pad 135. In this way, the lower substrate W1 is held in a horizontal state. At this time, the lower substrate W1 is levitated from the upper surface 123 by about several tens of μm.

  In step S12, as shown in FIG. 14, substantially simultaneously with step S11, the upper pressurizing member 15 is lowered toward the base portion 111 (lower substrate W1) (first upper substrate moving step). At this time, the movable shaft 95 of the drive mechanism 92 moves so as to protrude from the fixed shaft 94, so that the length of the shaft portion 93 is increased and the upper pressurizing member 15 is lowered. Since the second support rod 16 is inserted, the guide guides 83 at the four corners of the upper pressure member 15 are lowered while maintaining the horizontal state.

  In step S13, the camera 80 is actuated so that the alignment marks M1 and M2 on the lower substrate W1 and the upper substrate W2 are sequentially focused and photographed. Then, the lower substrate W1 is moved in the horizontal plane direction so that the alignment marks M1 and M2 coincide with each other (substrate alignment step). At this time, based on the shift amount of the alignment marks M1 and M2, the drive base 125 is moved in the horizontal plane direction, and the lower substrate W1 is moved to an appropriate position.

In step S14, when the alignment between the lower substrate W1 and the upper substrate W2 is completed, the drive base 125 of the lower substrate W1 is lowered and the supply of the air pad 135 is stopped, and the lower substrate W1 is moved to the base portion 111. Lower to upper surface 123. Then, the air pad 135 is evacuated to attract the lower substrate W1 to the upper surface 123 so that the position is not shifted (second lower substrate moving step). Thereafter, the upper pressure member 15 is moved slightly upward (second upper substrate moving step). In this way, the distance between the lower substrate W1 and the upper substrate W2 is made longer than that during alignment. This is for increasing the conductance and shortening the evacuation time and evacuating the air between the substrates W1 and W2 during the subsequent evacuation of the chamber 17.
In step S15, the inside of the chamber 17 is evacuated (decompression step).

In step S16, after the evacuation in the chamber 17 is completed, the upper pressure member 15 is lowered again.
In step S17, the lower substrate W1 and the upper substrate W2 are bonded together (substrate bonding step).
At this time, the substrates W1 and W2 are pressurized by the pressurizing mechanism 96. Here, the load cell 90 detects the load acting on both the substrates W1 and W2, and adjusts the substrates to be bonded together with an appropriate load.

  In step S18, when the bonding of the lower substrate W1 and the upper substrate W2 is completed, the chamber member 14 and the upper pressure member 15 are raised. At this time, the bonded substrate W3 is disposed on the base 111 (mounting table 131). That is, the function of the electrostatic chuck portion 77 of the upper pressing member 15 is released, and the upper substrate W2 is separated from the upper pressing member 15.

In step S19, the lift pins 145 of the base portion 111 are raised, and the bonded substrate W3 is raised from the upper surface 123.
In step S20, the robot arm is inserted into the gap between the bonded substrate W3 and the upper surface 123 of the base portion 111, and the bonded substrate W3 is delivered from the lift pins 145 to the robot arm.
And a robot arm conveys the bonding board | substrate W3 to another apparatus which is not shown in figure, and a process is completed.
Even if comprised in this way, the alignment accuracy of the two board | substrates W1 and W2 improves like 1st embodiment, and it can improve a yield.

  In the present embodiment, a drive base 125 that moves the lower substrate W1 while adsorbing a part of the lower substrate W1 to the base portion 111; and the remaining portion of the lower substrate W1 (lower substrate W1 when the lower substrate W1 is moved by the drive base 125 And an air pad 135 capable of adsorbing the remaining portion of the lower substrate W1 when the upper substrate W2 and the lower substrate W1 are bonded to each other. .

  Therefore, when the upper substrate W2 and the lower substrate W1 are bonded together, the lower substrate W1 can be attracted to the base 111 by the drive base 125. Therefore, the position shift of the lower substrate W1 can be prevented, and the upper substrate W2 and the lower substrate W1 can be bonded together with high accuracy. In addition, since a table for placing the lower substrate W1 is not required separately, the number of components interposed between the base portion 111 and the lower substrate W1 can be reduced. Further, when the lower substrate W1 is adsorbed to the base portion 111, the driving base 125 and the air pad 135 are not exposed to the chamber 17, so that particles generated from each device can be prevented from flowing into the chamber 17. Therefore, the cleanliness in the chamber 17 can be ensured.

The technical scope of the present invention is not limited to the above-described embodiment, and includes various modifications made to the above-described embodiment without departing from the spirit of the present invention. That is, the specific shapes, configurations, and the like given in the embodiment are merely examples, and can be changed as appropriate.
For example, in the present embodiment, the moving stage is configured to be movable only in the horizontal direction, but may be configured to be movable in the vertical direction.
Further, in this embodiment, the vertical movement of the upper pressurizing member is similar to the vertical movement of the chamber member, and a screw is formed on the second support rod, and the upper pressurization member is moved up and down by rotating the second support rod. You may comprise so that it can do.

  A bonded substrate manufacturing apparatus and a bonded substrate manufacturing method capable of improving the alignment accuracy of two substrates and improving the yield can be provided.

Claims (7)

A bonded substrate manufacturing apparatus that manufactures a bonded substrate by bonding the upper substrate and the lower substrate together,
A base portion supporting the lower substrate;
A chamber member that is vertically movable and forms a bonding treatment chamber together with the base portion;
A support bar erected on the base part;
And vertically movable independently of the chamber member along said support rod, on a pressure member capable of holding said substrate;
A plurality of drive mechanisms provided on the upper surface of the upper pressure member for moving the upper pressure member up and down;
With
The bonded substrate manufacturing apparatus, wherein the upper substrate and the lower substrate are bonded to each other inside the bonding processing chamber by moving the upper pressing member.   The bonded substrate manufacturing apparatus according to claim 1, wherein an adsorption pin for adsorbing the upper substrate is provided on the chamber member. In the base part,
A mounting table for mounting the lower substrate;
A moving mechanism for moving the mount table,
The bonded substrate manufacturing apparatus according to claim 1, wherein: In the base part,
A lower substrate adsorption device that moves the lower substrate while adsorbing a part of the lower substrate;
When the lower substrate is moved by the lower substrate suction device, a portion of the lower substrate that is not sucked with the lower substrate suction device is levitated, and when the upper substrate and the lower substrate are bonded, the lower substrate A lower substrate levitation adsorption device capable of adsorbing a lower substrate adsorption device and a portion not adsorbed;
The bonded substrate manufacturing apparatus according to claim 1, wherein: A bonded substrate manufacturing apparatus that manufactures a bonded substrate by bonding the upper substrate and the lower substrate together,
A base portion supporting the lower substrate;
A chamber member that is vertically movable and forms a bonding treatment chamber together with the base portion;
A support bar erected on the base part;
An upper pressurizing member capable of moving up and down independently of the chamber member along the support rod and capable of holding the upper substrate;
With
By moving the upper pressure member, the upper substrate and the lower substrate are bonded together inside the bonding processing chamber,
In the base part,
A lower substrate adsorption device that moves the lower substrate while adsorbing a part of the lower substrate;
When the lower substrate is moved by the lower substrate suction device, a portion of the lower substrate that is not sucked with the lower substrate suction device is levitated, and when the upper substrate and the lower substrate are bonded, the lower substrate A lower substrate levitation adsorption device capable of adsorbing a lower substrate adsorption device and a portion not adsorbed;
An apparatus for manufacturing a bonded substrate board, comprising: The lower substrate is supported by the base portion, the upper substrate is held by the upper pressure member that can be moved up and down along the support rod erected from the base portion, and can be moved up and down independently of the upper pressure member. A bonded substrate manufacturing method for manufacturing a bonded substrate by aligning the lower substrate and the upper substrate while aligning the lower substrate and the upper substrate inside a bonding processing chamber constituted by a chamber member and the base part,
A process chamber forming step of lowering the chamber member to form a bonding process chamber in which the upper substrate and the lower substrate are accommodated by the base portion and the chamber member;
A first upper substrate moving step of lowering the upper pressure member and disposing the lower substrate and the upper substrate by a predetermined distance;
A depressurization step of depressurizing the inside of the bonding treatment chamber;
A second upper substrate moving step of lowering the upper pressure member and disposing the lower substrate and the upper substrate opposite to each other at a predetermined interval;
A substrate alignment step of aligning the lower substrate with the upper substrate by moving the lower substrate by moving a mounting table for mounting the lower substrate by a moving mechanism provided in the base portion. When;
A substrate bonding step of lowering the upper pressure member using a plurality of drive mechanisms provided on the upper surface of the upper pressure member , and bonding the lower substrate and the upper substrate;
A method for producing a bonded substrate, comprising: The lower substrate is supported by the base portion, the upper substrate is held by the upper pressure member that can be moved up and down along the support rod erected from the base portion, and can be moved up and down independently of the upper pressure member. In a bonded substrate manufacturing method for manufacturing a bonded substrate by aligning the lower substrate and the upper substrate while aligning the lower substrate and the upper substrate in a bonding processing chamber constituted by a chamber member and the base part. ,
A process chamber forming step of lowering the chamber member to form a bonding process chamber in which the upper substrate and the lower substrate are accommodated by the base portion and the chamber member;
The lower substrate is separated from the base portion while adsorbing a part of the lower substrate by the lower substrate adsorption device installed in the base portion, and the lower substrate floating adsorption device installed in the base portion A first lower substrate moving step of levitating a portion of the substrate that is not adsorbed with the lower substrate adsorbing device;
A first upper substrate moving step of lowering the upper pressure member and disposing the lower substrate and the upper substrate opposite to each other at a predetermined interval;
A substrate alignment step of aligning the lower substrate and the upper substrate by moving the lower substrate by the lower substrate suction device;
A second upper substrate moving step in which the upper pressurizing member is raised and the lower substrate and the upper substrate are spaced apart from each other by a predetermined distance;
The lower substrate is brought into contact with the base portion while adsorbing a part of the lower substrate by the lower substrate adsorption device, and is adsorbed to the lower substrate adsorption device of the lower substrate by the lower substrate floating adsorption device. A second lower substrate moving step of adsorbing a non-existing portion to the base;
A depressurizing step of depressurizing the bonding treatment chamber;
A substrate laminating step of lowering the upper pressure member and laminating the lower substrate and the upper substrate;
A method for producing a bonded substrate, comprising:

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