JP5630020B2 - Substrate overlay apparatus and overlay method - Google Patents

Description

  The present invention relates to a bonding apparatus and a bonding method.

Substrates to be bonded in the substrate bonding apparatus are held on opposite stages or directly or via a substrate holding member. (See Patent Document 1).
[Prior art documents]
[Patent Literature]
[Patent Document 1] JP 2009-059864 A

  When the substrate is bonded to the stage in the substrate bonding apparatus, the substrate or the substrate holding member may be temporarily sandwiched between the stage and the support member that supports the substrate or the substrate deformation member.

  Therefore, in order to solve the above-mentioned problem, as a first aspect of the present invention, a pair of stages for joining a pair of substrates held close to each other while facing each other, a plurality of support members for supporting the substrate, and a plurality of members A bonding apparatus is provided that includes a contact driving unit that drives a support member to cause the substrate to contact one of a pair of stages while holding the substrate on the stage while changing the tilt of the substrate.

  Further, as a second aspect of the present invention, the step of supporting the substrate by the plurality of support members, and driving the plurality of support members by the contact driving unit to change the inclination of the substrate, to one of the pair of stages. There is provided a bonding method comprising: bringing a substrate into contact with each other and holding the substrate on the stage; and bringing the pair of stages close to each other while facing each other and bonding the pair of individually held substrates.

  The above summary of the present invention does not enumerate all necessary features of the present invention. A sub-combination of these feature groups can also be an invention.

1 is a plan view of a bonding apparatus 100. FIG. It is the perspective view which looked down at the substrate holder 220. FIG. It is the perspective view which looked up at the substrate holder 220. FIG. 4 is a longitudinal sectional view of an aligner 160. FIG. It is a figure which shows operation | movement of the aligner 160. FIG. It is a figure which shows operation | movement of the aligner 160. FIG. It is a longitudinal cross-sectional view of the pressurizer 130. It is sectional drawing which shows the state transition of the board | substrate 210. FIG. It is sectional drawing which shows the state transition of the board | substrate 210. FIG. It is sectional drawing which shows the state transition of the board | substrate 210. FIG. It is sectional drawing which shows the state transition of the board | substrate 210. FIG. 4 is a longitudinal sectional view showing a structure of a mounting portion 310. FIG. FIG. 10 is a diagram illustrating an operation of the mounting unit 310. FIG. 10 is a diagram illustrating an operation of the mounting unit 310. FIG. 10 is a diagram illustrating an operation of the mounting unit 310. FIG. 10 is a diagram illustrating an operation of the mounting unit 310. FIG. 10 is a diagram illustrating an operation of the mounting unit 310. FIG. 10 is a diagram illustrating an operation of the mounting unit 310. FIG. 10 is a diagram illustrating an operation of the mounting unit 310. FIG. 10 is a diagram illustrating an operation of the mounting unit 310. FIG. 10 is a diagram illustrating an operation of the mounting unit 310.

  Hereinafter, the present invention will be described through embodiments of the invention. The following embodiments do not limit the invention according to the claims. Not all combinations of features described in the embodiments are essential for the solution of the invention.

  FIG. 1 is a plan view schematically showing the overall structure of a bonding apparatus 100 that manufactures a laminated substrate 212 by bonding a pair of substrates 210 together. The joining apparatus 100 includes a housing 110, a loader 120 accommodated in the housing 110, a pressurizing device 130, a holder stocker 140, a pre-aligner 150, a reversing device 152, and an aligner 160. A plurality of FOUPs (Front Opening Unified Pods) 201 are mounted on the outer surface of the housing 110.

  The FOUP 201 accommodates a plurality of substrates 210 and can be detached from the housing 110 individually. By using the FOUP 201, a plurality of substrates 210 can be loaded into the bonding apparatus 100 at once. Further, a plurality of laminated substrates 212 manufactured by bonding the substrates 210 can be collected in the FOUP 201 and carried out collectively.

  Note that the substrate 210 here may be a glass substrate or the like in addition to a semiconductor substrate such as a silicon single crystal substrate or a compound semiconductor substrate. Further, the substrate 210 used for bonding may include a plurality of elements. Further, one or both of the substrates 210 to be bonded may be the stacked substrate 212 that has already been stacked and bonded.

  The housing 110 hermetically surrounds the loader 120, the pressurizing device 130, the holder stocker 140, the pre-aligner 150, and the aligner 160. Thereby, the passage route of the substrate 210 in the bonding apparatus 100 is maintained in a clean environment. In some cases, the air in the housing 110 is replaced with a purge gas such as nitrogen. Further, the substrate 210 may be handled in a vacuum environment by exhausting the inside of the housing 110 or a part of the inside thereof.

  The loader 120 includes a fork 122, a fall prevention claw 124, and a folding arm 126. One end of the folding arm 126 is rotatably supported with respect to the housing 110. The other end of the folding arm 126 supports the fork 122 and the fall prevention claw 124 so as to be rotatable about a vertical axis and a horizontal axis.

  The fork 122 sucks and holds the mounted substrate 210 or substrate holder 220. Thereby, the loader 120 can move the substrate 210 or the substrate holder 220 held by the fork 122 to an arbitrary position by combining the bending of the folding arm 126 and the rotation of the fork 122.

  The fall prevention claw 124 is inserted below the fork 122 when the fork 122 is inverted and holds the substrate 210 or the substrate holder 220 on the lower side. As a result, the substrate 210 or the substrate holder 220 is prevented from falling to the floor in the housing 110. When the fork 122 does not reverse, the fall prevention claw 124 retracts to a position where it does not interfere with the substrate 210 and the substrate holder 220 on the fork 122.

  Such a loader 120 can transport the substrate 210 and the substrate holder 220 from the FOUP 201 to the pre-aligner 150, from the pre-aligner 150 to the aligner 160, and from the aligner 160 to the pressure device 130. Furthermore, the loader 120 conveys the laminated substrate 212 formed by bonding the substrates 210 to the FOUP 201.

  The holder stocker 140 accommodates and waits for the substrate holder 220 that holds the substrate 210. The substrate holders 220 are taken out one by one by the loader 120, and each holds the substrates 210 one by one. The substrate holder 220 holding the substrate 210 is handled integrally with the substrate 210 inside the bonding apparatus 100. Thereby, the thin and fragile substrate 210 is protected, and the handling of the substrate 210 inside the bonding apparatus 100 is facilitated. However, the laminated substrate 212 can be manufactured by directly operating the substrate 210 without using the substrate holder 220.

  The substrate holder 220 is separated from the multilayer substrate 212 and returned to the holder stocker 140 when the multilayer substrate 212 is unloaded from the bonding apparatus 100. Thereby, the substrate holder 220 is not taken out of the bonding apparatus 100 at least during the period when the bonding apparatus 100 is operating.

  The pre-aligner 150 has an alignment mechanism in which processing speed is more important than alignment accuracy. For example, the pre-aligner 150 adjusts the variation in the mounting position of the substrate 210 or the substrate holder 220 with respect to the loader 120 so as to be within a predetermined range. Thereby, the time required for alignment in the aligner 160 described later can be shortened. Depending on the bonding apparatus 100, the pre-aligner 150 may perform an operation of aligning and holding the substrate 210 with respect to the substrate holder 220.

  The pre-aligner 150 may include a rotation correction unit that aligns the crystal orientation direction of the substrate 210 with a certain direction with respect to the loader 120. Thereby, the adjustment amount in the aligner 160 described later is reduced, and the work time in the aligner 160 is shortened.

  In the reversing device 152, the substrate holder 220 holding the substrate 210 is reversed and mounted on the loader. Thereby, the loader 120 can hold the substrate holder 220 on the upper stage 190 having the suction plate 192 on the lower surface as described later.

  The aligner 160 superposes the pair of substrates 210 held by the substrate holder 220 after aligning each other. The alignment accuracy required for the aligner 160 is high. For example, when aligning a semiconductor substrate on which an element is formed, submicron level accuracy is required. The structure and operation of the aligner 160 will be described later.

  The pressurizing device 130 pressurizes the pair of substrates 210 that are aligned and overlapped in the aligner 160 to bond the substrates 210 to each other. As a result, the substrate 210 becomes a laminated substrate 212 that is permanently laminated. The structure and operation of the pressure device 130 will be described later.

  FIG. 2 is a perspective view of the substrate holder 220 as viewed from obliquely above. The substrate holder 220 has a holding surface 222, a flange portion 224, and a through hole 226.

  The substrate holder 220 is formed in a disc shape as a whole and has a flat holding surface 222 for holding the substrate 210 at the center. The flange portion 224 is disposed adjacent to the holding surface 222 and around the holding surface 222. A step 223 is formed between the holding surface 222 and the flange portion 224, and the holding surface 222 slightly protrudes with respect to the flange portion 224.

  Three or more through-holes 226 are provided in the flange portion 224 so as to avoid the holding surface 222 since a later-described lift pin is inserted. A groove 221 that makes a round around the substrate holder 220 is formed on the side peripheral surface of the flange portion 224. The use of the groove 221 will be described later.

  FIG. 3 is a perspective view of the substrate holder 220 as viewed from below. A through hole 226 and a power supply contact 228 are disposed on the lower surface of the substrate holder 220. The groove 221 disposed on the side peripheral surface of the flange portion 224 is also visible from this viewpoint.

  As illustrated, each of the through holes 226 penetrates to the back surface of the substrate holder 220. The power supply contact 228 forms a common surface with the lower surface of the substrate holder 220 and is connected to an internal electrode embedded in the substrate holder 220. Thus, the substrate 210 can be electrostatically adsorbed and held on the holding surface 222 by applying a voltage to the internal electrode via the power supply contact 228.

  A plurality of internal electrodes may be provided on one substrate holder 220, and a plurality of power supply contacts 228 may also be provided corresponding to the internal electrodes. The substrate holder 220 is integrally formed of a highly rigid material such as ceramics or metal, but is insulated from at least the power supply contact 228.

  FIG. 4 is a schematic longitudinal sectional view showing the structure and operation of the aligner 160 alone. The aligner 160 includes a frame body 162, a drive unit 180, a lower stage 170, and an upper stage 190 disposed inside the frame body 162.

  The frame body 162 includes a bottom plate 161 and a top plate 165 that are horizontal and parallel to each other, and a plurality of support columns 163 that couple the bottom plate 161 and the top plate 165. The bottom plate 161, the support column 163, and the top plate 165 are each formed of a highly rigid material, and the frame body 162 is not deformed even when a reaction force due to the operation of the aligner 160 is applied.

  A driving unit 180 and a lower stage 170 mounted on the driving unit 180 are placed on the upper surface of the bottom plate 161. The driving unit 180 includes an X direction driving unit 182, a Y direction driving unit 184, a Z direction driving unit 186, and a plurality of vertical actuators 188 that are sequentially stacked on the bottom plate 161.

  The X direction driving unit 182 is guided by the guide rail 181 on the bottom plate 161 and moves the lower stage 170 in the X direction indicated by an arrow in the drawing. The Y direction driving unit 184 moves the lower stage 170 in the Y direction indicated by an arrow in the drawing on the X direction driving unit 182. The Z direction drive unit 186 moves the entire lower stage 170 up and down on the Y direction drive unit 184 in the Z direction indicated by an arrow in the drawing.

  The vertical actuator 188 individually raises and lowers the vicinity of the edge of the lower stage 170 that is swingably supported by the spherical seat 174 to swing the lower stage 170. Accordingly, the substrate 210 and the substrate holder 220 mounted on the lower stage 170 can be swung to change the inclination with respect to the horizontal plane. Further, by combining the functions of the driving unit 180 and the spherical seat 174, the lower stage 170 has six degrees of freedom with respect to the bottom plate 161.

  As described above, the lower stage 170 is supported by the spherical seat 174 so as to be swingable, and is mounted with the microscope 171, the suction plate 172, and the reflecting mirror 173. As shown by a dotted line in the drawing, the microscope 171 has a visual field above and can observe an object positioned above.

  The suction plate 172 sucks and holds the substrate holder 220 mounted on the upper surface when coupled to a decompression source (not shown). When the coupling to the reduced pressure source is broken, the suction plate 172 opens the substrate holder 220 that has been held.

  The reflecting mirror 173 is used when the position of the lower stage 170 is detected by reflecting light generated by an interferometer (not shown). Further, the lower stage 170 includes lift pins 312 that assist in loading and unloading of the substrate 210 and the substrate holder 220. The lift pins 312 will be described later.

  On the lower surface of the top plate 165, the upper stage 190 is suspended downward by a hanger 194. A plurality of load cells 196 that detect pressure applied to the upper stage 190 when the upper stage 190 is pushed up from below are arranged between the upper surface of the upper stage 190 and the top plate 165.

  Although a pair of load cells 196 are illustrated in the drawing, the load cells 196 are arranged at equal intervals on a circle coaxial with the upper stage 190, for example. As a result, when non-uniform pressure is applied to the upper stage 190, it can be detected.

  A suction plate 192 is disposed on the lower surface of the upper stage 190. The suction plate 192 sucks and holds the substrate holder 220 in contact with the lower surface when coupled to a decompression source (not shown). When the connection to the reduced pressure source is broken, the suction plate 192 opens the substrate holder 220 that has been held.

  At the stage where alignment of the substrate is started in the aligner 160, the substrate 210 is held by the substrate holder 220 sucked by the suction plates 172 and 192, respectively. The substrate 210 and the substrate holder 220 are loaded on the lower stage 170 and the upper stage 190 in a state where the lower stage 170 and the upper stage 190 are shifted from each other and are not opposed to each other.

  FIG. 5 is a diagram for explaining the subsequent operation of the aligner 160. First, the X direction driving unit 182 and the Y direction driving unit 184 are operated so that the pair of substrates 210 held on the lower stage 170 and the upper stage 190 are substantially opposed to each other. In this state, for example, the vertical actuator 188 is individually operated while observing from the side with a camera or the like (not shown), and the opposing surfaces of the pair of substrates 210 held by the lower stage 170 and the upper stage 190 are mutually connected. Parallel.

  Next, the X direction driving unit 182 and the Y direction driving unit 184 are operated to observe the alignment mark of the substrate 210 held on the upper stage 190 in the visual field of the microscope 171. Thereby, the position of the substrate 210 can be detected. Since the relative position of the substrate 210 mounted on the lower stage 170 with respect to the microscope 171 is known, the relative positional deviation between the pair of substrates 210 can be known by observation with the microscope 171.

  FIG. 6 is a diagram illustrating the next operation of the aligner 160. As described above, the pair of substrates 210 that are parallel to each other and have no horizontal misalignment raise the lower stage 170 by the Z-direction drive unit 186 that has a larger driving force and stroke than the vertical actuator 188. Thus, one of them can be brought into contact with the other and temporarily joined.

  In the pair of temporarily bonded substrates 210, a plurality of pads formed on each surface of the substrate 210 are coupled to each other, and an integrated circuit is formed through both of the pair of substrates 210. When the pair of substrates 210 are brought into contact with each other for temporary bonding, it is preferable to monitor the detection value of the load cell 196 and manage the substrate 210 so that an excessive load or a local load is not applied to the substrate 210. .

  FIG. 7 is a schematic longitudinal sectional view of the pressurizing device 130. The pressurizing device 130 includes a surface plate 138 and a heating plate 136 that are sequentially stacked from the bottom of the housing 132, and an indented portion 134 and a heating plate 136 that are suspended from the ceiling surface of the housing 132. Each of the heating plates 136 includes a heater. An inlet 131 is provided on one of the side surfaces of the housing 132.

  The substrate 210 that has already been aligned and superimposed is carried into the pressure device 130 together with the substrate holder 220 and the substrate holder 220. The loaded substrate 210 and the substrate holder 220 are placed on the upper surface of the heating plate 136 of the surface plate 138.

  The pressurizing device 130 raises the temperature of the heating plate 136 and lowers the indented portion 134 to push down the upper heating plate 136. As a result, the substrate 210, the substrate holder 220, and the substrate holder 220 sandwiched between the heating plates 136 are heated and pressurized, and the substrate 210 is permanently bonded.

  Although not shown, a cooling unit that cools the substrate 210 after heating and pressurization may be provided in the pressurizer 130. Thereby, even if it does not reach room temperature, the board | substrate 210 cooled to some extent can be carried out and it can return to FOUP201 rapidly.

  When the heating temperature by the heating plate 136 is high, the surface of the substrate 210 may react scientifically with the atmosphere. Therefore, when the substrate 210 is heated and pressurized, the inside of the housing 132 is preferably evacuated to a vacuum environment. Therefore, an openable / closable shutter that closes the loading port 131 in an airtight manner may be provided. Further, the heating plate 136 may be omitted and the mirror-polished substrate 210 may be bonded at room temperature.

  8, 9, 10 and 11 are diagrams showing the transition of the state of the substrate 210 in the bonding apparatus 100. FIG. Hereinafter, the operation of the bonding apparatus 100 will be described with reference to these drawings.

  The substrate 210 to be bonded is loaded into the bonding apparatus 100 while being accommodated in the FOUP 201. In the bonding apparatus 100, the loader 120 places the substrate holder 220 carried out from the holder stocker 140 on the pre-aligner 150.

  In the pre-aligner 150, the mounting position of the substrate holder 220 with respect to the loader 120 is first adjusted. Subsequently, the loader 120 places the substrate holder 220 at a position determined in the pre-aligner 150. By these procedures, the substrate holder 220 in the pre-aligner 150 is positioned with relatively high accuracy.

  Next, the loader 120 carries the substrates 210 carried out one by one from the FOUP 201 into the pre-aligner 150. In the pre-aligner 150, the substrate 210 is also mounted on the substrate holder 220 mounted in the pre-aligner 150 after adjusting the mounting position with respect to the loader 120. Thereby, the loader 120 can position the substrate 210 with respect to the substrate holder 220 with relatively high accuracy.

  Thus, the substrate 210 is positioned with a relatively high accuracy with respect to the substrate holder 220, and the substrate holder 220 is positioned with a relatively high accuracy with respect to the loader 120. Therefore, the loader 120 can similarly load the substrate 210 and the substrate holder 220 on the aligner 160 with relatively high positional accuracy.

  The substrate 210 placed on the substrate holder 220 is held by the substrate holder 220 by electrostatic adsorption or the like, and the substrate 210 and the substrate holder 220 are handled integrally in the following steps. In the bonding apparatus 100, since the substrate 210 is loaded on the upper stage 190 and the lower stage 170, at least two substrate holders 220 holding the substrate 210 are prepared.

  As shown in FIG. 8, the substrate 210 and the substrate holder 220 loaded in the aligner 160 are arranged to face each other. That is, at least one of the two sets of substrates 210 and substrate holders carried into the aligner 160 is loaded in an inverted state with respect to the other. In this state, the pair of substrates are aligned with each other with high accuracy.

  Next, as shown in FIG. 9, the pair of aligned substrates 210 are laminated together by an aligner 160. At this time, the aligner 160 presses the pair of substrates 210 against each other to temporarily bond them.

  Therefore, as shown in FIG. 10, the clip 230 is fitted in the groove 221 of the substrate holder 220, and the aligned state is stored. Thus, the pair of substrates 210 and the pair of substrate holders in which the alignment by the aligner 160 is stored are unloaded from the aligner 160 by the loader 120 and loaded into the pressurizing device 130.

  The pressure device 130 presses one pair of substrate holders 220 sandwiching the pair of temporarily bonded substrates 210 toward the other, thereby strongly pressing and bonding the pair of substrates 210 permanently. Note that the pressurizing device 130 may include a heating device to pressurize the substrate 210 while heating it.

  The pair of bonded substrates 210 is separated from the substrate holder 220 and is collected in the FOUP 201 as the laminated substrate 212. Further, the substrate holder 220 is returned to the holder stocker 140 and stands by.

  FIG. 12 is a longitudinal sectional view showing the structure of the mounting portion 310 disposed on the lower stage 170. The mounting part 310 includes a lift pin 312, a connecting member 314, a vertical driving part 316 and a bracket 318. In the following drawings, elements common to the aligner 160 shown in FIGS. 4 to 6 are denoted by the same reference numerals, and redundant description is omitted.

  A plurality of lift pins 312 are arranged around the suction plate 172 through the lower stage 170 in the vertical direction. Each of the lift pins 312 has an upper end protruding upward from the upper surface of the lower stage 170.

  The lower ends of the lift pins 312 are connected to each other by a connecting member 314 below the lower stage 170. As a result, the plurality of lift pins 312 can be moved up and down integrally with respect to the lower stage 170. The lift pin 312 is positioned from the lower stage 170 via the fluid bearing 176. As a result, the lift pins 312 smoothly move up and down with respect to the lower stage 170.

  The lifting and lowering of the lift pin 312 is driven by a vertical drive unit 316 that supports the connecting member 314 from below. The vertical driving unit 316 is coupled to the lower surface of the lower stage 170 via the bracket 318. Therefore, when the lower stage 170 is moved, lifted or swung by the driving unit 180, the lift pin 312 is moved, lifted or swung together with the lower stage 170.

  Further, when the vertical driving unit 316 expands and contracts, the lift pin 312 moves up and down with respect to the lower stage 170. This means that the lift pin 312 has a translational degree of freedom 1 relative to the lower stage 170.

  Although a pair of lift pins 312 is illustrated in the figure, for example, three lift pins 312 are arranged on a circle coaxial with the lower stage 170 at equal intervals. As a result, the substrate holder 220 can be supported by the lift pins 312 as will be described later.

  The spherical seat 174 that supports the lower stage 170 from below is supported from below by the weight canceling portion 183. The weight canceling portion 183 is a lower stage assembly in which the lower stage 170 and members supported by the lower stage 170, that is, the microscope 171, the suction plate 172, the reflecting mirror 173, the spherical seat 174, the mounting portion 310, and the like are integrated. In order to counteract the weight, a driving force that contradicts gravity is generated. As a result, the gravity of the lower stage assembly is apparently canceled out, so that the drive unit 180 can precisely control the position of the lower stage 170 without being affected by inertia.

  Since the weight canceling portion 183 is disposed near the center of gravity of the lower stage 170 assembly, it is often disposed near the center of the lower stage 170. For this reason, the connecting member 314 that connects the lift pins 312 has an annular or fork-like shape, avoiding the weight canceling portion 183 located at the center.

  Further, for the same reason, the vertical driving unit 316 transmits the driving force for ascending or descending to the lift pin 312 and the connecting member 314 at a position off the center of gravity. For this reason, the lift pin 312 is slightly subjected to a force deviating from the direction of gravity. Therefore, it is preferable that the bearing gap of the fluid bearing 176 that positions each of the lift pins 312 with respect to the lower stage 170 is wider as the lift pin 312 is farther from the vertical drive unit 316. As a result, even if a driving force deviating from the direction of gravity acts, the lift pin 312 moves up and down smoothly.

  FIG. 12 shows the structure of the mounting part 310 as well as the first stage of its operation. In the state shown in the drawing, the lower stage 170 is moved to a position deviated from the lower side of the upper stage 190 by the drive unit 180. Thereby, the upper part of the lower stage 170 is widely open. The vertical driving unit 316 is in the most shortened state, and the upper end of the lift pin 312 is lowered to a position lower than the upper surface of the suction plate 172.

  The substrate holder 220 mounted on the fork 122 of the loader 120 is carried into the aligner 160 in the above state. The substrate holder 220 holds the substrate 210. This substrate holder 220 is inverted by the reversing device 152 and holds the substrate 210 on the lower surface. The loader 120 conveys such a substrate holder 220 to above the suction plate 172.

  In the drawing, the fork 122 supports the substrate holder 220 at intervals smaller than the diameter of the substrate 210 for the purpose of simplifying drawing. However, a bonding element is mounted on the surface of the substrate 210. Therefore, the fork 122 preferably supports the substrate holder 220 at the flange portion 224.

  FIG. 13 is a diagram illustrating the next operation of the mounting unit 310. As shown in the figure, when the vertical driving unit 316 extends, the lift pins 312 rise and come into contact with the substrate holder 220 from below. When the lift pins 312 are further raised, the substrate holder 220 is separated from the fork 122 and supported by the lift pins 312.

  FIG. 14 is a diagram illustrating the next operation of the mounting unit 310. Since the substrate 210 is supported by the lift pins 312, the role of the fork 122 in loading the substrate holder 220 is once terminated. Therefore, the fork 122 moves out of the aligner 160, and the lift pins 312 exclusively support the substrate holder 220. The lift pin 312 also supports the substrate holder 220 at the flange portion 224.

  Further, since the fork 122 has been retracted, the lift pins 312 that support the substrate holder 220 can be moved laterally in the drawing. Therefore, the X-direction drive unit 182 is operated to move the substrate holder 220 below the suction plate 192 of the upper stage 190.

  Further, by operating the vertical actuator 188 of the drive unit 180 with the substrate holder 220 positioned below the upper stage 190, the substrate holder 220 can be made parallel to the lower surface of the suction plate 192 of the upper stage 190. . That is, the lift pin 312 moves, moves up and down, or swings integrally with the lower stage 170 having 6 degrees of freedom, so that the lift pin 312 can be moved or swung using the drive unit 180. Thereby, when the substrate holder 220 contacts the suction plate 192 as described later, it is possible to prevent a large impact or pressure from being generated locally.

  FIG. 15 is a diagram illustrating the next operation of the mounting unit 310. The substrate holder 220 can be brought into contact with the suction plate 192 by further extending the vertical driving unit 316 while the substrate holder 220 is positioned below the suction plate 192. Furthermore, the substrate holder 220 can be held on the suction plate 192 by coupling the suction plate 192 to a reduced pressure source. Thus, the substrate holder 220 is held on the upper stage 190.

  If the lower surface of the suction plate 192 and the upper surface of the substrate holder 220 are not parallel, the substrate holder 220 may not be satisfactorily sucked even if the suction plate 192 is coupled to a reduced pressure source. However, when the substrate holder 220 and the suction plate 192 that are not parallel to each other contact each other, different pressures are detected in the plurality of load cells 196.

  When the load cell 196 detects a different pressure, the vertical actuator 188 is operated based on the detection result before the suction plate 192 sucks the substrate holder 220, and the substrate holder 220 supported by the lift pins 312 is moved together with the lower stage 170. By swinging, the suction plate 192 and the substrate holder 220 can be made parallel. Thereby, the suction plate 192 can reliably suck the substrate holder 220.

  FIG. 16 is a diagram illustrating the next operation of the mounting unit 310. When the substrate holder 220 is sucked by the suction plate 192 of the upper stage 190, the vertical driving unit 316 is shortened and the lift pins 312 are lowered. As a result, the substrate holder 220 remains on the upper stage 190, and the lower stage 170 can move horizontally. Therefore, the drive unit 180 can be operated to return the lower stage 170 to the initial position where the upper part is opened again.

  FIG. 17 is a diagram illustrating the next operation of the mounting unit 310. The loader 120 loads the substrate holder 220 mounted on the fork 122 again onto the lower stage 170 that has returned to the initial position. The substrate holder 220 to be carried is carried above the lower stage 170 while holding the substrate 210 on the upper surface so as to be mounted on the suction plate 172 of the lower stage 170.

  FIG. 18 is a diagram illustrating the next operation of the mounting unit 310. The lift pins 312 are brought into contact with the substrate holder 220 inserted by the loader 120 from below by extending the vertical drive unit 316. As a result, the substrate holder 220 is lifted from the fork 122, and the loader 120 is released from the substrate holder 220.

  FIG. 19 is a diagram illustrating the next operation of the mounting unit 310. The fork 122 of the loader 120 released from the support of the substrate holder 220 is retracted from between the substrate holder 220 and the suction plate 172. As a result, the substrate holder 220 is supported by the lift pins 312 immediately above the suction plate 172.

  FIG. 20 is a diagram illustrating the next operation of the mounting unit 310. Here, the lift pin 312 is lowered by shortening the vertical driving unit 316. As a result, the substrate holder 220 is also lowered and eventually comes into contact with the upper surface of the suction plate 172. Here, the substrate holder 220 is held on the lower stage 170 by coupling the suction plate 172 to a reduced pressure source. The lift pins 312 are further lowered and separated from the lower surface of the substrate holder 220.

  FIG. 21 is a diagram illustrating the next operation of the mounting unit 310. The lower stage 170 holding the substrate holder 220 is conveyed to the drive unit 180 to the lower side of the upper stage 190. As a result, as shown in FIG. 5, the pair of substrates 210 facing each other in the aligner 160 is held by the lower stage 170 and the upper stage 190. Therefore, as already described, alignment and bonding of the pair of substrates 210 can be performed.

  In the above embodiment, the vertical drive unit 316 that moves the lift pin 312 back and forth with respect to the lower stage 170 is provided. However, the same function can be realized by a structure in which the lift pin 312 is fixed to the lower stage 170 while the suction plate 172 is moved up and down with respect to the lower stage 170. In this embodiment, the substrate holder 220 supported by the lift pins 312 can be brought into contact with the upper stage using the Z-direction drive unit 186.

  Further, in the above embodiment, the substrate holder 220 on which the substrate 210 is previously mounted is mounted on the lower stage 170 or the upper stage 190. However, the individual substrate holder 220 and the substrate 210 may be sequentially mounted on the lower stage 170 and the upper stage 190. However, in that case, a lift pin for a substrate for operating the substrate 210 can be provided separately from the substrate holder 220.

  Further, in the above embodiment, the substrate holder 220 and the substrate 210 are first held on the upper stage 190. However, the substrate holder 220 may be mounted on the lower stage 170 first. However, in that case, the lift pin protrudes through the substrate holder 220 on the lower stage 170. Therefore, initially, the substrate holder 220 is mounted on the lower stage 170, then the upper stage 190 holds the substrate holder 220 and the substrate 210, and finally the substrate holder 220 on the lower stage 170 holds the substrate 210. Become.

  Further, in the above example, the plurality of lift pins 312 are connected to each other by the connecting member 314 and are integrally moved up and down by the single vertical driving unit 316. However, the structure for driving the plurality of lift pins 312 is not limited to this. For example, a plurality of lift pins 312 that can be lifted and lowered independently of each other may be provided with a vertical drive unit, and the lift pins 312 may be lifted and lowered individually.

  In the bonding apparatus 100 having such a structure, when the lower stage 170 is moved, moved up and down, or rocked, the X direction driving unit 182, the Y direction driving unit 184, the Z direction driving unit 186, the vertical actuator 188, and the like are driven. Synchronously, each of the plurality of lift pins 312 can be driven by the vertical drive unit. In addition, when the lift pins 312 are in contact with the substrate holder 220, the contact timings of the plurality of lift pins 312 may be shifted from each other, causing temporary contact. In such a case, the contact timing of the plurality of lift pins 312 can be individually corrected to prevent one-side contact.

  Furthermore, in the above example, the substrate 210 carried into the bonding apparatus 100 is first held by the substrate holder 220, and thereafter, the substrate 210 and the substrate holder 220 are integrally handled. However, part or all of the handling of the substrate 210 in the bonding apparatus 100 may be configured to handle the substrate 210 directly without the substrate holder 220.

  As mentioned above, although this invention was demonstrated using embodiment, the technical scope of this invention is not limited to the range as described in the said embodiment. It will be apparent to those skilled in the art that various modifications or improvements can be added to the above-described embodiment. It is apparent from the scope of the claims that the embodiments added with such changes or improvements can be included in the technical scope of the present invention.

  The execution order of the procedures, steps, stages, etc. in the operation and method of the apparatus shown in the claims, the specification, and the drawings is clearly indicated as “before”, “prior”, etc. Alternatively, it can be realized in any order except when the output of the previous stage is used in the subsequent stage. Even if “first”, “next”, and the like are used for convenience in the claims, the description, and the drawings, it does not necessarily mean that execution in this order is essential.

DESCRIPTION OF SYMBOLS 100 Joining device, 110, 132 Case, 120 Loader, 122 Fork, 124 Fall prevention claw, 126 Folding arm, 130 Pressurizing device, 131 Loading port, 134 Pressing lower part, 136 Heating plate, 138 Surface plate, 140 Holder stocker, 150 pre-aligner, 152 reversing device, 160 aligner, 161 bottom plate, 162 frame, 163 column, 165 top plate, 170 lower stage, 171 microscope, 172, 192 suction plate, 173 reflector, 174 spherical seat, 180 drive unit, 181 Guide rail, 182 X direction drive unit, 183 Weight cancellation unit, 184 Y direction drive unit, 186 Z direction drive unit, 188 vertical actuator, 190 upper stage, 194 hanger, 196 load cell, 201 FOUP, 210 substrate, 12 laminated substrate, 220 substrate holder, 221 groove, 222 holding surface, 223 step, 224 flange portion, 226 through hole, 228 contact for power feeding, 230 clip, 310 mounting portion, 312 lift pin, 314 connecting member, 316 vertical drive portion, 318 Bracket

Claims (16)

A substrate stacking apparatus for stacking a first semiconductor substrate and a second semiconductor substrate,
A first stage for holding the first semiconductor substrate;
A second stage that holds the second semiconductor substrate and moves relative to the first stage to superimpose the second semiconductor substrate on the first semiconductor substrate;
A transport section for carrying the first semiconductor substrate and the second semiconductor substrate between the first stage and the second stage, respectively;
A support portion that supports the first semiconductor substrate that is carried in, and is displaceable to hold the first semiconductor substrate on the first stage;
With
When the inclination of the first semiconductor substrate is changed so that the first semiconductor substrate is parallel to the first stage, and the first semiconductor substrate contacts the first stage due to the displacement of the support portion The substrate overlaying apparatus, wherein the first semiconductor substrate is held on the first stage so that an impact is suppressed. The transport unit carries the first semiconductor substrate and the second semiconductor substrate into the support unit,
The support portion includes a plurality of support members disposed so as to protrude from the holding surface of the second stage, and the inclination of the first semiconductor substrate is changed by changing a protrusion amount of each of the plurality of support members. The substrate superimposing apparatus according to claim 1 . The substrate stacking apparatus according to claim 2 , wherein the plurality of support members have their protrusion amounts individually changed by individually provided driving units. 4. The substrate overlaying device according to claim 3 , wherein each of the plurality of support members is positioned with respect to the second stage via a fluid bearing.   The support portion includes a plurality of support members that are integrally protruded from the holding surface of the second stage, and are integrally driven at a position deviating from the center of gravity of the entire support portion. The board | substrate superimposition apparatus of Claim 1 provided with these. 6. The substrate overlay according to claim 5 , wherein each of the plurality of support members is positioned with respect to the second stage via a fluid bearing having a wider bearing gap as the support member is arranged farther from the driving unit. apparatus. A load detection unit for detecting a load when the first semiconductor substrate contacts the first stage;
7. The substrate overlaying device according to claim 1 , wherein the support unit changes an inclination of the first semiconductor substrate based on detection by the load detection unit. A tilt drive unit for changing the tilt of the second stage;
7. The substrate overlaying device according to claim 1 , wherein the support portion changes an inclination of the first semiconductor substrate by changing an inclination together with the second stage. 8. A detector for detecting a relative inclination of the first stage and the second stage;
The substrate stacking apparatus according to claim 8 , wherein the tilt driving unit changes the tilt of the second stage based on a detection result of the detection unit. In the case where the first stage holds the first semiconductor substrate and the second stage holds the second semiconductor substrate, the first semiconductor substrate and the second semiconductor substrate are overlapped with each other. Bringing the second stage closer to the first stage;
When the support portion supports the first semiconductor substrate, the support portion is displaced toward the first stage together with the second stage to hold the first semiconductor substrate on the first stage. The board | substrate superimposition apparatus as described in any one of Claim 1 to 9 further provided with a drive part. The support portion supports the first semiconductor substrate by supporting a substrate holder that holds the first semiconductor substrate, and holds the first semiconductor substrate by holding the substrate holder on the first stage. The substrate superposition apparatus according to claim 1, wherein the substrate superposition apparatus is held on the first stage. The substrate stacking apparatus according to claim 11 , wherein the support portion is displaced so that the substrate holder is parallel to the first stage. A method of superimposing a first semiconductor substrate and a second semiconductor substrate on each other,
A first loading step of loading the first semiconductor substrate between a first stage for holding the first semiconductor substrate and a second stage for holding the second semiconductor substrate;
A first holding step of holding the first semiconductor substrate on the first stage while suppressing an impact of the first semiconductor substrate contacting the first stage;
A second loading step of loading the second semiconductor substrate into the second stage;
A second holding step of holding the second semiconductor substrate on the second stage;
A superposition method including a superposition step of superposing the first semiconductor substrate and the second semiconductor substrate on each other by bringing the first stage and the second stage close to each other. In the first holding step, before the first semiconductor substrate is brought into contact with the first stage, the inclination of the first semiconductor substrate is changed to make the first semiconductor substrate parallel to the first stage. The overlay method according to claim 13 , comprising steps. In the first holding step, the first semiconductor substrate is supported by a plurality of support members arranged to protrude from the holding surface of the second stage, and the amount of protrusion of each of the plurality of support members is changed to change the first support step. The overlaying method according to claim 14 , further comprising changing the tilt of the first semiconductor substrate. The overlay method according to claim 15 , wherein the first holding step includes a step of individually displacing the plurality of support members.

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