JP2011151073A5

JP2011151073A5 -

Info

Publication number: JP2011151073A5
Application number: JP2010009286A
Authority: JP
Filing date: 2010-01-19
Publication date: 2013-03-28
Anticipated expiration: 2030-01-19

Claims

A substrate stacking apparatus for stacking a first semiconductor substrate and a second semiconductor substrate,
A first stage for holding the first semiconductor substrate;
A second stage that holds the second semiconductor substrate and moves relative to the first stage to superimpose the second semiconductor substrate on the first semiconductor substrate;
A transport section for carrying the first semiconductor substrate and the second semiconductor substrate between the first stage and the second stage, respectively;
A support portion that supports the first semiconductor substrate that is carried in, and is displaceable to hold the first semiconductor substrate on the first stage;
With
The first semiconductor substrate is held on the first stage so that an impact when the first semiconductor substrate contacts the first stage due to the displacement of the support portion is suppressed. Alignment device.

2. The substrate overlaying apparatus according to claim 1, wherein the support unit changes an inclination of the second semiconductor substrate so that the first semiconductor substrate is parallel to the first stage.

The transport unit carries the first semiconductor substrate and the second semiconductor substrate into the support unit,
The support portion includes a plurality of support members disposed so as to protrude from the holding surface of the second stage, and the inclination of the first semiconductor substrate is changed by changing a protrusion amount of each of the plurality of support members. The substrate superimposing apparatus according to claim 2.

The substrate stacking apparatus according to claim 3, wherein the plurality of support members have their protrusion amounts individually changed by individually provided driving units.

The substrate overlaying apparatus according to claim 4, wherein each of the plurality of support members is positioned with respect to the second stage via a fluid bearing.

The support portion includes a plurality of support members that are integrally protruded from the holding surface of the second stage, and are integrally driven at a position deviating from the center of gravity of the entire support portion. The board | substrate superimposition apparatus of Claim 1 or Claim 2 provided with these.

The substrate superposition according to claim 6, wherein each of the plurality of support members is positioned with respect to the second stage through a fluid bearing having a wider bearing gap as being arranged farther from the driving unit. apparatus.

A load detection unit for detecting a load when the first semiconductor substrate contacts the first stage;
8. The substrate overlaying device according to claim 2, wherein the support unit changes an inclination of the first semiconductor substrate based on detection by the load detection unit. 9.

A tilt drive unit for changing the tilt of the second stage;
8. The substrate overlaying device according to claim 2, wherein the support portion changes an inclination of the first semiconductor substrate by changing an inclination together with the second stage. 9.

A detector for detecting a relative inclination of the first stage and the second stage;
The substrate stacking apparatus according to claim 9, wherein the tilt driving unit changes the tilt of the second stage based on a detection result of the detection unit.

In the case where the first stage holds the first semiconductor substrate and the second stage holds the second semiconductor substrate, the first semiconductor substrate and the second semiconductor substrate are overlapped with each other. Bringing the second stage closer to the first stage;
When the support portion supports the first semiconductor substrate, the support portion is displaced toward the first stage together with the second stage to hold the first semiconductor substrate on the first stage. The board | substrate superimposition apparatus as described in any one of Claim 1 to 10 further provided with a drive part.

The support portion supports the first semiconductor substrate by supporting a substrate holder that holds the first semiconductor substrate, and holds the first semiconductor substrate by holding the substrate holder on the first stage. The substrate superposition apparatus according to claim 1, wherein the substrate superposition apparatus is held on the first stage.

The substrate stacking apparatus according to claim 12, wherein the support portion is displaced so that the substrate holder is parallel to the first stage.

A method of superimposing a first semiconductor substrate and a second semiconductor substrate on each other,
A first loading step of loading the first semiconductor substrate between a first stage for holding the first semiconductor substrate and a second stage for holding the second semiconductor substrate;
A first holding step of holding the first semiconductor substrate on the first stage while suppressing an impact of the first semiconductor substrate contacting the first stage;
A second loading step of loading the second semiconductor substrate into the second stage;
A second holding step of holding the second semiconductor substrate on the second stage;
A superposition method including a superposition step of superposing the first semiconductor substrate and the second semiconductor substrate on each other by bringing the first stage and the second stage close to each other.

In the first holding step, before the first semiconductor substrate is brought into contact with the first stage, the inclination of the first semiconductor substrate is changed to make the first semiconductor substrate parallel to the first stage. The method according to claim 14, comprising steps.

In the first holding step, the first semiconductor substrate is supported by a plurality of support members arranged to protrude from the holding surface of the second stage, and the amount of protrusion of each of the plurality of support members is changed to change the first support step. The overlaying method according to claim 15, further comprising changing the tilt of the first semiconductor substrate.

The overlapping method according to claim 16, wherein the first holding step includes a step of individually displacing the plurality of support members.