JP2012054416A - Pressing device, lamination apparatus, lamination method, and method of manufacturing multilayer semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To solve a problem in which torque acts on an abutment plate to cause inclination thereof when an object is pressed.SOLUTION: The pressing device comprises: a stage which abuts on an object to be pressed; a drive section which includes a piston and a cylinder and generates a driving force for pressing the stage toward the object; and a guide shaft which is arranged in series between the piston and an abutment plate and connected with the stage, and guides the stage moving in the direction of the object and bends to allow the stage to incline following the object when the stage presses the object.

Description

  The present invention relates to a pressing device, a bonding device, a bonding method, and a method for manufacturing a laminated semiconductor device.

A pressing device for pressing an object such as a semiconductor substrate is known (see, for example, Patent Document 1). The pressing device presses the object with a contact plate driven by a guide shaft.
[Prior art documents]
[Patent Literature]
[Patent Document 1] Japanese Translation of PCT Publication No. 2009-542012

  However, in the pressing device, there is a problem in that the rotating force acts on the contact plate during pressing and the contact plate is inclined.

  In order to solve the above-described problem, the pressing device according to the first aspect of the present invention generates a contact plate that contacts an object to be pressed and a driving force that presses the contact plate toward the object. A drive unit that is connected to the contact plate, guides the contact plate to move in the direction of the object, and follows the object when the contact plate presses the object. And a guide shaft that bends to allow tilting.

  A bonding apparatus according to a second aspect of the present invention includes a temporary joining device that aligns the objects, a transport unit that transports the objects aligned by the temporary joining device, and the pressing device described above. And a pressure device that pressurizes and bonds the object conveyed by the conveying unit.

  The bonding method according to the third aspect of the present invention includes a step of aligning an object, a step of conveying the object, and abutting the conveyed object on a contact plate and pressing it by a driving unit. And a joining method comprising the steps of joining, wherein in the joining step, a guide shaft connected to the contact plate and guiding the contact plate moving in the direction of the object, It is allowed to bend and bend following the object.

  According to a fourth aspect of the present invention, there is provided a method for manufacturing a semiconductor device, comprising: aligning a pair of substrates; bringing the aligned substrates into contact with a contact plate; And a step of separating the pair of bonded substrates into a semiconductor device, wherein in the step of bonding, the contact plate is connected to the contact plate, The guide shaft that guides the movement of the pair of substrates in the direction of the pair of substrates is allowed to bend and bend following the pair of substrates.

  It should be noted that the above summary of the invention does not enumerate all the necessary features of the present invention. In addition, a sub-combination of these feature groups can also be an invention.

It is a whole block diagram of a bonding apparatus. It is a whole block diagram of the pressurization apparatus provided with the press apparatus by embodiment. It is a whole block diagram of the press apparatus by embodiment. It is the schematic explaining the position alignment of the board | substrate and board | substrate holder in a bonding process. It is the schematic explaining the position alignment of the board | substrate and board | substrate holder in a bonding process. It is the schematic explaining the position alignment of the board | substrate and board | substrate holder in a bonding process. It is the schematic explaining the position alignment of the board | substrate and board | substrate holder in a bonding process. It is the schematic of the press apparatus in the state which has a stage in the lowest position. It is the schematic of a press apparatus in the state which has a stage in the uppermost position. It is the figure which the board | substrate and the board | substrate holder were joined in the bonding process. In a pasting process, it is a schematic diagram of a press device in case the parallel of a fixed part and a subject cannot be maintained. It is the schematic of a press apparatus when a guide shaft bends in the state which has a stage in the uppermost position. It is the schematic of the press apparatus of the comparative example when a guide shaft bends in the state which has a stage in the uppermost position.

  Hereinafter, the present invention will be described through embodiments of the invention, but the following embodiments do not limit the invention according to the claims. In addition, not all the combinations of features described in the embodiments are essential for the solving means of the invention.

  FIG. 1 is an overall configuration diagram of a bonding apparatus. The bonding apparatus includes a normal temperature unit 102 and a high temperature unit 103 arranged inside a common housing 101.

  The room temperature unit 102 includes a plurality of substrate cassettes 111, 112, 113 that face the outside of the housing 101, and a control panel 115. The control panel 115 includes a control unit that controls the overall operation of the bonding apparatus 100. In addition, the control panel 115 has an operation unit that is operated by the user from the outside when the bonding apparatus 100 is turned on and various settings are made. Further, the control panel 115 may include a connection unit that connects another device provided to the bonding apparatus 100.

  The substrate cassettes 111, 112, and 113 accommodate the substrate 93 bonded in the bonding apparatus or the substrate 93 bonded in the bonding apparatus 100. The substrate cassettes 111, 112, and 113 are detachably attached to the housing 101. As a result, a plurality of substrates 93 can be loaded into the bonding apparatus 100 at once. In the bonding apparatus 100, the bonded substrates 93 can be collected at once.

  The substrate 93 loaded in the bonding apparatus 100 may be a single silicon wafer, compound semiconductor wafer, glass substrate, or the like, in which elements, circuits, terminals, and the like are formed. In addition, the loaded substrate 93 may be a laminated substrate that is already formed by laminating a plurality of wafers.

  The room-temperature unit 102 includes a pre-aligner 120, a substrate holder rack 121, a substrate removal unit 122, a pair of robot arms 123 and a robot arm 124, which are examples of a transport unit, and a temporary joint. Device 125. The pre-aligner 120 temporarily positions the substrates 93 so that each substrate 93 is loaded in a narrow adjustment range of the temporary bonding device 125 because it is highly accurate when loading the substrate into the temporary bonding device 125. Match. Thereby, positioning of the board | substrate 93 in the temporary joining apparatus 125 is completed rapidly and reliably.

  The substrate holder rack 121 accommodates a plurality of substrate holders 94 and makes them stand by. The substrate 93 is held by the substrate holder 94 by electrostatic adsorption.

  The substrate removing unit 122 takes out the substrate 93 that is sandwiched and joined by the substrate holder 94 from the substrate holder 94 that is carried out from a pressurizing apparatus described later. The substrate 93 taken out from the substrate holder 94 is returned to and stored in one of the substrate cassettes 111, 112, 113 by the robot arms 124, 123 and the moving station. The substrate holder 94 from which the substrate 93 has been taken out is returned to the substrate holder rack 121 and stands by.

  Of the pair of robot arms 123 and 124, the robot arm 123 disposed on the side closer to the substrate cassettes 111, 112, and 113 moves the substrate 93 between the substrate cassettes 111, 112, 113, the pre-aligner 120, and the temporary bonding apparatus 125. Transport. The robot arm 123 also has a function of turning over one of the substrates 93 to be joined. Thus, the surfaces on which the circuits, elements, terminals and the like are formed can be opposed to each other on the substrate.

  On the other hand, the robot arm 124 disposed on the side far from the substrate cassettes 111, 112, and 113 conveys the substrate 93 and the substrate holder 94 between the temporary bonding apparatus 125, the substrate holder rack 121, the substrate removal unit 122, and the air lock 162. To do. The robot arm 124 is also responsible for loading and unloading the substrate holder 94 of the substrate holder rack 121.

  The temporary joining device 125 includes a frame 150, a fixed stage 151, a moving stage 152, and a pair of shutters 153 and a shutter 154. The fixed stage 151 holds the substrate 93 and the substrate holder 94 so that the substrate 93 is on the lower side. The moving stage 152 holds the substrate 93 and the substrate holder 94 so that the substrate 93 is on the upper side. The moving stage 152 is configured to be movable with respect to the fixed stage 151. Accordingly, the temporary bonding apparatus 125 aligns the substrate 93 and the substrate holder 94 held by the moving stage 152 with respect to the substrate 93 and the substrate holder 94 held by the fixed stage 151. The pair of shutters 153 and 154 open and close the openings of the frame 150 into which the robot arms 123 and 124 are inserted, respectively. The area surrounded by the frame 150 and the shutters 153 and 154 is communicated with an air conditioner or the like and is temperature-controlled. Thereby, the alignment accuracy of the substrate 93 is improved.

  The high temperature unit 103 includes a heat insulating wall 161, an air lock 162, a robot arm 163 that is an example of a transfer unit, and a plurality of pressure devices 164. The heat insulating wall 161 surrounds the high temperature part 103, maintains a high internal temperature of the high temperature part 103, and blocks heat radiation to the outside of the high temperature part 103. Thereby, the influence which the heat | fever of the high temperature part 103 has on the normal temperature part 102 can be suppressed.

  The robot arm 163 conveys the substrate 93 and the substrate holder 94 aligned by the temporary bonding device 125 between any one of the pressurization devices 164 and the air lock 162. The air lock 162 includes a shutter 165 and a shutter 166 that open and close alternately on the normal temperature part 102 side and the high temperature part 103 side.

  When the substrate 93 and the substrate holder 94 are carried into the high temperature unit 103 from the normal temperature unit 102, the shutter 165 on the normal temperature unit 102 side is first opened, and the robot arm 163 carries the substrate 93 and the substrate holder 94 into the air lock 162. . Next, the shutter 165 on the normal temperature part 102 side is closed, and the shutter 166 on the high temperature part 103 side is opened.

  Subsequently, the robot arm 163 unloads the substrate 93 and the substrate holder 94 from the air lock 162 and inserts them into any of the pressurization devices 164. The pressurizing device 164 pressurizes and bonds the substrate 93 carried into the pressurizing device 164 while being sandwiched between the substrate holders 94. Thereby, the board | substrate 93 is joined permanently. The structure and operation of the pressure device 164 will be described with reference to another drawing.

  When the substrate 93 and the substrate holder 94 are carried out from the high temperature unit 103 to the normal temperature unit 102, the above series of operations are executed in reverse order. Through a series of these operations, the substrate 93 and the substrate holder 94 can be carried into or out of the high temperature unit 103 without leaking the internal atmosphere of the high temperature unit 103 to the normal temperature unit 102.

  FIG. 2 is an overall configuration diagram of a pressure device provided with a pressing device according to the embodiment.

  The pressurizing device 164 is installed in a pressurizing chamber adjusted to a vacuum environment as described above. When installed on the ceiling side, the pressure device 164 includes a fixing portion 167 and the pressing device 1 installed on the floor surface side.

  The fixing part 167 has a heat module. Thereby, the lower surface of the fixing portion 167 heats the object 92 that is pressed by the pressing device 1. Thereby, the target object 92 is bonded and bonded by heating and pressing. An example of the object 92 is a pair of substrates 93 and a pair of substrate holders 94 aligned by the temporary joining device 125.

  The pressing device 1 includes a stage 15 that is an example of a contact portion, a heating unit 17, and an elevating unit 2. The stage 15 is disposed on the uppermost surface of the pressing device 1 and holds the object 92. The stage 15 is formed in a disk shape. The heating unit 17 is disposed between the stage 15 and the lifting unit 2. The heating unit 17 heats the object 92 via the stage 15.

  The elevating unit 2 moves the stage 15 holding the object 92 in the vertical direction. As a result, the pressing device 1 presses the object 92 against the fixing portion 167.

  Next, the details of the pressing device 1 will be described with reference to the drawings with the elevating unit 2 as the center. FIG. 3 is an overall configuration diagram of the pressing device according to the embodiment.

  As shown in FIG. 3, the elevating unit 2 of the pressing device 1 according to the present embodiment includes a main EV unit 3 and a sub EV unit 4 disposed below the main EV unit 3.

  The main EV unit 3 includes a main cylinder 11, a main piston 12, a bellows 13, and a main valve 14.

  The main cylinder 11 is disposed at a substantially central portion of the pressing device 1 in the vertical direction. The main cylinder 11 is formed in a substantially cylindrical shape whose central axis extends in the vertical direction. The main cylinder 11 is closed at the bottom.

  The main piston 12 is formed in a substantially cylindrical shape whose central axis extends in the vertical direction. The upper surface of the main piston 12 is closed. A heating unit 17 is disposed on the main piston 12. The diameter of the outer periphery of the lower part of the main piston 12 is smaller than the diameter of the inner periphery of the main cylinder 11. The main piston 12 is inserted into the hollow portion of the main cylinder 11 from above. Thereby, a main room 16 capable of storing fluid is formed between the main piston 12 and the main cylinder 11. The main piston 12 is installed such that it can move relative to the main cylinder 11. As a result, when the amount of fluid in the main room 16 changes, the main piston 12 moves relative to the main cylinder 11.

  The bellows 13 connects the upper inner peripheral surface of the main cylinder 11 and the lower outer peripheral surface of the main piston 12. Thereby, the main room 16 is sealed.

  The main valve 14 controls supply and discharge of fluid in the main room 16. Therefore, the main piston 12 moves relative to the main cylinder 11 in the vertical direction by opening and closing the main valve 14.

  The sub EV unit 4 includes a drive unit 21, a guide shaft 22, and a support unit 23.

  The drive unit 21 includes a cylinder 25, a piston 26, and a fluid introduction unit 27. Although illustration is omitted, three sets of driving units 21 are provided around the central axis of the stage 15. The three sets of driving units 21 are arranged at 120 ° intervals in the circumferential direction.

  The cylinder 25 is fixed to the lower surface of the main cylinder 11. The cylinder 25 is formed in a cylindrical shape whose bottom surface is closed. The cylinder 25 is formed in a hollow shape so that fluid can be stored therein. The hollow portion of the cylinder 25 includes an upper subroom 31 on the upper side of the piston 26 and a lower subroom 32 on the lower side of the piston 26. The upper surface of the cylinder 25 is closed except for the shaft hole 33 through which the guide shaft 22 is inserted.

  The piston 26 is formed in a disc shape. The outer diameter of the piston 26 is substantially the same as the inner diameter of the cylinder 25. The piston 26 is fitted in the cylinder 25 so as to be movable in the vertical direction with respect to the cylinder 25.

  The fluid introduction unit 27 includes an upper valve 35, an upper fluid pipe 36, a lower valve 37, and a lower fluid pipe 38. The upper valve 35 controls the supply of the fluid supplied via the upper fluid pipe 36 to the upper subroom 31 of the cylinder 25 and also controls the discharge of the fluid from the upper subroom 31. The lower valve 37 controls the supply of the fluid supplied through the lower fluid pipe 38 to the lower subroom 32 of the cylinder 25 and the discharge of the fluid from the lower subroom 32.

  As a result, the drive unit 21 controls the lower valve 37 to supply a fluid to the lower subroom 32, thereby generating a driving force that presses the stage 15 toward the object 92. In addition, the drive unit 21 controls the upper valve 35 to supply a fluid to the upper subroom 31, thereby generating a driving force for detaching the stage 15 from the object 92.

  The guide shaft 22 indirectly connects the upper surface of the piston 26 and the lower surface of the stage 15 in series via the heating unit 17. The guide shaft 22 is slidably inserted into a guide hole 39 of the support portion 23 described later. Thereby, the guide shaft 22 guides the connected stage 15 to move in the direction of the object 92. Further, the guide shaft 22 bends to allow the stage 15 to tilt along the object 92 when the stage 15 presses the object.

  The support portion 23 is formed in a cylindrical shape extending in the vertical direction so that the guide shaft 22 can be inserted. A guide hole 39 is formed in the central portion of the support portion 23 along the length direction. Thereby, the support part 23 guides the guide shaft 22 to an up-down direction. The support portion 23 is fixed to the main cylinder 11. Here, the vertical position of the support portion 23 is preferably as close to the cylinder 25 as possible. Thereby, the support part 23 supports the side near the stage 15 in the guide shaft 22 when the stage 15 is separated from the object 92. Moreover, the support part 23 supports the side far from the stage 15 in the guide shaft 22, when the stage 15 is in contact with the object 92.

  In other words, when the guide shaft 22 moves upward and presses the object 92, the lower portion of the guide shaft 22 is supported by the support portion 23. As a result, when the guide shaft 22 is bent, the curvature of the guide shaft 22 is smaller than when the support portion supports the upper portion of the guide shaft.

  Next, operation | movement of the press apparatus 1 by this embodiment mentioned above is demonstrated. 4, 5, 6, and 7 are schematic views for explaining the alignment of the substrate and the substrate holder in the bonding step. FIG. 8 is a schematic view of the pressing device in a state where the stage is at the lowest position in the bonding step. FIG. 9 is a schematic view of the pressing device in a state where the stage is at the uppermost position in the bonding step. FIG. 10 is a diagram in which the substrate and the substrate holder are joined in the bonding step. FIG. 11 is a schematic diagram of the pressing device in the case where the fixing unit and the object are not kept parallel in the bonding step. FIG. 12 is a schematic view of the pressing device when the guide shaft is bent in a state where the stage is at the uppermost position in the bonding step. FIG. 13 is a schematic diagram of a pressing device of a comparative example when the guide shaft is bent in a state where the stage is at the uppermost position in the bonding step.

  First, the robot arm 123 carries the substrate 93 housed in any of the substrate cassettes 111, 112, 113 into the pre-aligner 120. The robot arm 124 transports the substrate holder 94 of the substrate holder rack 121 onto the moving stage 152. Thereafter, as shown in FIG. 4, the robot arm 123 transports and places the substrate 93 on the pre-aligner 120 onto the substrate holder 94 on the moving stage 152. As a result, the substrate holder 94 electrostatically attracts the substrate 93 to become the object 92. Next, the robot arm 123 turns the object 92 over and then conveys it to the fixed stage 151.

  Similarly, the robot arm 124 transports the substrate holder 94 onto the moving stage 152, and the robot arm 123 transports the substrate 93 onto the substrate holder 94 placed on the moving stage 152. As a result, the substrate holder 94 on the moving stage 152 electrostatically attracts the substrate 93.

  Next, as shown in FIG. 5, the moving stage 152 is moved based on the position information of an alignment mark (not shown). Thereby, the substrate 93 and the substrate holder 94 held on the moving stage 152 and the substrate 93 and the substrate holder 94 held on the moving stage 152 are aligned so as to face each other.

  Next, as shown in FIG. 6, the moving stage 152 is moved upward to bring the substrate 93 and the substrate 93 into surface contact.

  Next, as shown in FIG. 7, a plurality of stoppers 99 are fitted into the groove 98 formed on the side surface of the substrate holder 94 and the groove 98 formed on the side surface of the substrate holder 94. Thereby, the object 92 including a pair of substrates 93 and a pair of substrate holders 94 that are aligned and fixed to each other is completed.

  Next, the robot arm 124 conveys the object 92 to the air lock 162 with the shutter 165 opened. Thereafter, the shutter 165 is closed and the shutter 166 is opened. Next, the robot arm 163 conveys the object 92 to one of the pressure devices 164.

  As shown in FIG. 8, it is assumed that the main piston 12 having the stage 15 is disposed at the lowest position in a state where the object 92 is conveyed. In this state, the fluid in the lower subroom 32 of the sub EV unit 4 is discharged. On the other hand, the upper subroom 31 is supplied with the maximum amount of fluid. Thereby, the piston 26 of the sub EV part 4 is arrange | positioned in the lowest position.

  Next, the main valve 14 and the lower valve 37 are controlled to supply fluid to the main room 16 and the lower subroom 32. Here, when the main piston 12 having the stage 15 is moved upward at a low speed or when the pressing force is increased, the main valve 14 is mainly controlled to supply the fluid to the main room 16. preferable. On the other hand, when moving the main piston 12 at a high speed or reducing the pressing force, it is preferable to mainly control the lower valve 37 to supply fluid to the lower subroom 32. Further, the upper valve 35 is controlled to discharge the fluid in the upper subroom 31. Thereby, as shown in FIG. 9, the main piston 12 moves upward together with the stage 15. The piston 26 moves upward together with the guide shaft 22 that slides inside the support portion 23. As a result, the object 92 in contact with the stage 15 is pressed against the lower surface of the fixed portion 167 by the drive unit 21 of the main EV unit 3 or the sub EV unit 4. By maintaining the horizontal state of the stage 15, the object 92 and the lower surface of the fixing portion 167 come into contact with each other in a parallel state, and the pressing force acts evenly in the surface.

  Thereafter, the object 92 is heated by the heating unit 17 and the fixing unit 167. As a result, the pair of substrates 93 are heated and pressed by the pressurizing device 164 so that they are joined together. Thereafter, the object 92 is conveyed to the substrate removing unit 122, and the substrate holder 94 and the substrate holder 94 are detached from the substrate 93 and the substrate 93 as shown in FIG. Thereafter, the bonded substrate 93 and substrate 93 are separated into semiconductor devices, and the semiconductor device manufacturing process is completed.

  Here, after the alignment step shown in FIG. 8, as shown in FIG. 11, when the object 92 is pressed in a non-parallel state with respect to the fixed part 167, only one end of the object 92 is fixed to the fixed part 167. Abut. For this reason, a rotational force is generated in the stage 15. Thereby, as shown in FIG. 12, a force in the bending direction acts on the guide shaft 22, so that the guide shaft 22 bends. In other words, when the stage 15 presses the object 92, the guide shaft 22 bends and tilts following the object 92. In the present embodiment, as the upper end portion of the guide shaft 22 moves upward, the length exposed from the support portion 23 provided in the vicinity of the cylinder 25 increases. Thus, since the length of the guide shaft 22 exposed from the support portion 23 is large, even when the guide shaft 22 is bent, the curvature of the guide shaft 22 is small. On the other hand, as shown in FIG. 13, unlike the present embodiment, in the case of the pressing device 51 in which the support portion 53 is disposed at a position away from the cylinder 25, when the guide shaft 52 is bent, the curvature of the guide shaft 52 is Become very large. Thereafter, the three sets of driving units 21 are controlled so as to reduce the deflection of the guide shaft 52 and the stage 15 is returned to the horizontal state as shown in FIG. 8 so that the in-plane pressing force becomes uniform. Then, the object 92 is pressed.

  As described above, in the pressing device 1 according to the present embodiment, the guide shaft 22 bends, so that it is possible to flexibly cope with the inclination of the stage 15. In the pressing device 1, since the support portion 23 is disposed in the vicinity of the cylinder 25, even when the guide shaft 22 is bent, the curvature of the guide shaft 22 can be reduced.

  As mentioned above, although this invention was demonstrated using embodiment, the technical scope of this invention is not limited to the range as described in the said embodiment. It will be apparent to those skilled in the art that various modifications or improvements can be added to the above-described embodiment. It is apparent from the scope of the claims that the embodiments added with such changes or improvements can be included in the technical scope of the present invention.

  The order of execution of each process such as operations, procedures, steps, and stages in the apparatus, system, program, and method shown in the claims, the description, and the drawings is particularly “before” or “prior to”. It should be noted that the output can be realized in any order unless the output of the previous process is used in the subsequent process. Regarding the operation flow in the claims, the description, and the drawings, even if it is described using “first”, “next”, etc. for convenience, it means that it is essential to carry out in this order. It is not a thing.

DESCRIPTION OF SYMBOLS 1 Pressing device 2 Lifting part 3 Main EV part 4 Sub EV part 11 Main cylinder 12 Main piston 13 Bellows 14 Main valve 15 Stage 16 Main room 17 Heating part 21 Drive part 22 Guide shaft 23 Support part 25 Cylinder 26 Piston 27 Fluid introduction part 31 Upper subroom 32 Lower subroom 33 Shaft hole 35 Upper valve 36 Upper fluid pipe 37 Lower valve 38 Lower fluid pipe 39 Guide hole 51 Pressing device 52 Guide shaft 53 Support portion 92 Object 93 Substrate 94 Substrate holder 98 Groove 99 Stopper 100 Affixed Alignment apparatus 101 Case 102 Normal temperature part 103 High temperature part 111 Substrate cassette 112 Substrate cassette 113 Substrate cassette 115 Control panel 120 Pre-aligner 121 Substrate holder rack 122 Substrate removal unit 123 Robot arm 124 Robot Arm 125 Temporary joining device 150 Frame 151 Fixed stage 152 Moving stage 153 Shutter 154 Shutter 161 Heat insulation wall 162 Air lock 163 Robot arm 164 Pressurizing device 165 Shutter 166 Shutter 167 Fixed portion

Claims (6)

A contact plate that contacts an object to be pressed;
A drive unit for generating a drive force for pressing the contact plate toward the object;
It is connected to the contact plate, guides the contact plate to move in the direction of the object, and tilts following the object when the contact plate presses the object. A pressing device comprising a guide shaft that bends to allow.   The pressing device according to claim 1, wherein the drive unit is a set of a piston and a cylinder, and the guide shaft is arranged in series between the piston and the contact plate. A support portion for slidably supporting the guide shaft;
The support portion supports a side of the guide shaft that is close to the contact plate when the contact plate is separated from the object, and the contact plate is in contact with the object. The pressing device according to claim 1, wherein a side of the guide shaft that is far from the contact plate is supported. A temporary joining device for aligning the object;
A transport unit for transporting the object aligned by the temporary joining device;
A laminating apparatus comprising: the pressing apparatus according to claim 1, and a pressurizing apparatus that pressurizes and bonds the object conveyed by the conveying unit. Aligning a pair of objects;
A step of bringing the pair of aligned objects into contact with a contact plate and pressing them by a driving unit to join the pair of objects,
In the joining step,
Bonding that allows the guide shaft connected to the contact plate and guiding the contact plate to move in the direction of the pair of objects to be inclined and bent following the pair of objects. Method. Aligning a pair of substrates;
Bringing the aligned pair of substrates into contact with a contact plate and pressing and joining them with a drive unit; and
A method of manufacturing a laminated semiconductor device comprising the step of separating the pair of bonded substrates into a semiconductor device,
In the joining step,
A laminated semiconductor device that is coupled to the contact plate and that allows the guide shaft that guides the contact plate to move in the direction of the pair of substrates is allowed to bend and bend following the pair of substrates. Production method.