JPH0631500A - Hot press - Google Patents

Hot press

Info

Publication number
JPH0631500A
JPH0631500A JP19215892A JP19215892A JPH0631500A JP H0631500 A JPH0631500 A JP H0631500A JP 19215892 A JP19215892 A JP 19215892A JP 19215892 A JP19215892 A JP 19215892A JP H0631500 A JPH0631500 A JP H0631500A
Authority
JP
Japan
Prior art keywords
pressure
bolsters
heating
hot press
auxiliary
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP19215892A
Other languages
Japanese (ja)
Inventor
Akemi Miyashita
明己 宮下
Mutsumasa Fujii
睦正 藤井
Kazunori Tsujimura
一憲 辻村
Masayuki Kyoi
正之 京井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Hitachi Plant Technologies Ltd
Original Assignee
Hitachi Techno Engineering Co Ltd
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Techno Engineering Co Ltd, Hitachi Ltd filed Critical Hitachi Techno Engineering Co Ltd
Priority to JP19215892A priority Critical patent/JPH0631500A/en
Publication of JPH0631500A publication Critical patent/JPH0631500A/en
Pending legal-status Critical Current

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  • Control Of Presses (AREA)
  • Press Drives And Press Lines (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)

Abstract

PURPOSE:To highly precisely execute the multi-layer forming in the desirable pressure distribution by feeding back the variation of pressure distribution generated due to the deformation of a hot plate and a bolster to an auxiliary ram pressure. CONSTITUTION:A multi-layer substrate stock 39M is heated and pressurized with the surface pressure of 5-30kgf/cm<2> and the temperature of 170-250 deg.C under supplying the prescribed gas in the sealed space 31S. Bolsters 5, 7 and hot plates 13, 15, etc., of this state are deformed by receiving an external force of a pressurizing force 42, an adhering resin pressure reacting force 43, and a reacting force 44 of frame 2. Then, the varying amount is successively computed with a controller 30, the high pressure oil for requiring the absorption of deformation to the auxiliary ram 8, 9 inside a deformation absorbing mechanism composed of the bolsters 5, 7 and a buffer plate 11, and the most suitable surface pressure is applied on the multi-layer substrate stock 39M by applying the most suitable deformation to the buffer plate 11.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、多層基板の製造に用い
るホットプレスに係り、特に薄く、高密度、高品質の多
層基板の成形およびコストの低減に好適なホットプレス
に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a hot press used for manufacturing a multilayer substrate, and more particularly to a hot press suitable for forming a thin, high-density, high-quality multilayer substrate and reducing costs.

【0002】[0002]

【従来の技術】ホットプレスで制作される多層基板が高
密度化されるに従い、基板のそり、ねじれや層間ずれに
対する高度な性能が要求されるようになった。この要求
に応ずるものとして、特開平3−128195号公報に
紹介されているように、多層基板の素材を加熱する熱板
と該熱板を介して多層基板の素材を加圧するボルスタと
の間に断熱板を介在させて素材に熱を均一に加え、さら
にボルスタ間は密封手段で囲み、接着剤の軟化流動まで
は真空雰囲気とし、硬化段階では空気圧付加雰囲気とす
ることにより、接着時の圧力分布を均一化したものがあ
る。
2. Description of the Related Art As the density of multi-layer substrates manufactured by hot pressing has been increased, it has become necessary to have a high level of performance against warping, twisting and misalignment of the substrates. In order to meet this requirement, as disclosed in Japanese Patent Laid-Open No. 3-128195, between a hot plate that heats the material of the multilayer substrate and a bolster that presses the material of the multilayer substrate through the hot plate. Pressure distribution during bonding is achieved by applying heat evenly to the material through an insulating plate, enclosing the bolsters with a sealing means, creating a vacuum atmosphere until the adhesive softens and flows, and an air pressure added atmosphere during the curing stage. There is a uniform one.

【0003】また、基板接着時の圧力分布で、断熱板の
変形による基板板厚分布の凸化傾向を修正する手段とし
て、ボルスタ内に補助ラムを配置することにより断熱板
の凹量を吸収することが提案されている。
As a means for correcting the convexity of the substrate thickness distribution due to the deformation of the heat insulating plate due to the pressure distribution at the time of adhering the substrates, an auxiliary ram is arranged in the bolster to absorb the concave amount of the heat insulating plate. Is proposed.

【0004】例えば、特開昭62−23731号後方で
は、ボルスタ上の緩衝板で圧力分布を検知と、補助ラム
の油圧力を調整し、均厚接着することが紹介されてい
る。
For example, in the rear of Japanese Patent Laid-Open No. 62-23731, it is introduced that the pressure distribution is detected by a buffer plate on a bolster, the hydraulic pressure of the auxiliary ram is adjusted, and uniform bonding is performed.

【0005】[0005]

【発明が解決しようとする課題】接着基板の圧力分布を
補助ラム近傍の緩衝板上で正確に検知すれば、最適圧力
分布にするための補助ラム圧の修正制御は可能である。
しかし多孔質な材料である断熱板を介した接着圧力であ
ることから、検出圧力に誤差が多いこと、又断熱板で断
熱しているといえども圧力検出部の温度は30〜80℃
位の範囲でばらつき、温度の影響による誤差も多い。
If the pressure distribution of the adhesive substrate is accurately detected on the buffer plate in the vicinity of the auxiliary ram, the correction control of the auxiliary ram pressure to obtain the optimum pressure distribution is possible.
However, since there is a large error in the detected pressure due to the adhesive pressure through the heat insulating plate which is a porous material, and the temperature of the pressure detecting portion is 30 to 80 ° C even though the heat insulating plate is used for heat insulation.
There are many errors due to temperature variations.

【0006】空気圧力付加方式で成形するような低圧成
形プロセスでは、熱板やボルスタの変形より生じる僅少
の圧力分布変動を正確に把握し、補助ラム油にフィード
バックしないと望ましい圧力分布での成形が困難であ
り、高精度の多層成形は出来ないという問題が見出され
た。
In the low-pressure molding process such as molding by the air pressure addition method, it is possible to accurately comprehend the slight pressure distribution fluctuation caused by the deformation of the hot plate or the bolster and feed it back to the auxiliary ram oil to achieve the desired pressure distribution. It has been found that it is difficult and high precision multi-layer molding cannot be performed.

【0007】それゆえ、本発明の目的は、圧力分布に影
響を与える、熱板、ボルスタ等の変形を推定して最適圧
力分布制御を行ない、ボイドレスで仕上り精度の高い高
密度の多層基板を成形することが可能なホットプレスを
提供することにある。
Therefore, the object of the present invention is to estimate the deformation of the hot plate, bolster, etc., which affects the pressure distribution, to perform the optimum pressure distribution control, and to form a high-density multilayer substrate with a high finish accuracy by voidlessness. It is to provide a hot press that can.

【0008】[0008]

【課題を解決するための手段】上記目的を達成する本発
明ホットプレスでは、複数の補助ラムに印加する流体圧
を制御する手段が、両ボルスタによる多層基板素材への
加圧力および密封空間の気圧に対する乗率を変更する手
段と、該手段から得られる乗率,両ボルスタによる多層
基板素材への加圧力および密封空間の気圧から各補助ラ
ムに印加する流体圧を算出する手段を備えたことを特徴
とする。
In the hot press of the present invention which achieves the above object, the means for controlling the fluid pressure applied to the plurality of auxiliary rams are constituted by the pressure applied to the multilayer substrate material by both bolsters and the air pressure in the sealed space. And a means for calculating the fluid pressure to be applied to each auxiliary ram from the multiplying factor obtained from the means, the pressure applied to the multilayer substrate material by both bolsters, and the air pressure in the sealed space. Characterize.

【0009】[0009]

【作用】上下に対抗して複数の環状補助ラムが配置され
た、上下ボルスタの対向面上に緩衝板を設け、該緩衝板
上に断熱板を介して、上下熱板を設け、該熱板上に多層
基板の素材を挿入し、上下ボルスタに設けられた筒体密
封手段で密封する。そして筒体内部を真空排気後、多層
基板素材を主ラムで加圧しながら、加熱手段により予熱
する。多層基板の予熱段階では筒体内を真空にするの
で、上下ボルスタは外圧1kgf/cm2 の均等圧力を
多層基板素材で受けて変形する。続く成形過程では筒体
内を空気などの気体で加圧しつつ主ラムにより多層基板
素材を加圧する。この場合、上下ボルスタは多層基板素
材と接しない部分で空気による均等内圧を受ける変形
と、多層基板素材が積載された熱板面で受ける主ラムに
よる加圧力での変形とが生じる。このとき真空度および
空気圧力から多層基板素材と接する熱板面の変形を推定
演算し、最適面圧分布を得るため各補助ラム圧を制御す
る。そのため多層基板の素材は予熱段階の減圧状態から
成形段階の加圧状態まで、最適面圧分布で加熱加圧でき
るので、ボイドがなく、また多層のそりやねじれがな
く、高い板厚精度で多層基板を成形することができる。
A buffer plate is provided on the opposing surfaces of the upper and lower bolsters in which a plurality of annular auxiliary rams are arranged so as to oppose each other, and the upper and lower heat plates are provided on the buffer plate via a heat insulating plate. The material of the multi-layer substrate is inserted on the top and sealed by the cylinder sealing means provided on the upper and lower bolsters. After evacuation of the inside of the cylinder, the multilayer substrate material is preheated by the heating means while being pressed by the main ram. Since the inside of the cylinder is evacuated at the preheating stage of the multilayer substrate, the upper and lower bolsters are deformed by the uniform pressure of 1 kgf / cm 2 of external pressure applied by the multilayer substrate material. In the subsequent forming process, the main ram presses the multilayer substrate material while pressurizing the inside of the cylinder with a gas such as air. In this case, the upper and lower bolsters are deformed by a uniform internal pressure due to air at a portion which is not in contact with the multilayer substrate material, and are deformed by a pressure applied by the main ram received on the hot plate surface on which the multilayer substrate material is loaded. At this time, the deformation of the hot plate surface in contact with the multilayer substrate material is estimated and calculated from the degree of vacuum and the air pressure, and each auxiliary ram pressure is controlled to obtain the optimum surface pressure distribution. Therefore, the material of the multilayer substrate can be heated and pressed with the optimum surface pressure distribution from the depressurized state in the preheating stage to the pressed state in the molding stage, so there are no voids, no warpage or twisting of the multilayer, and highly accurate multilayer thickness. The substrate can be molded.

【0010】[0010]

【実施例】以下本発明ホットプレスを一実施例を示す図
1に基づいて説明する。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The hot press of the present invention will be described below with reference to FIG. 1 showing an embodiment.

【0011】図1において、フロア1に設置されたフレ
ーム2の中央に主油圧シリンダ3が設置され、ピストン
4に取り付けられた下ボルスタ5は、フレームに固定さ
れた複数のガイドレール6に案内されて昇降される。下
ボルスタ5と対面するフレーム2の上部位置には上ボル
スタ7が配置される。下ボルスタ5の上面には環状の補
助ラム8A,9A,10Aが埋設(象眼)され、その上
部には周辺を下ボルスタに支持された緩衝板11Aと、
断熱板12Aを介して下熱板13が周辺支持で取り付け
られ、周辺には筒体受けリング14が取り付けられてい
る。同様に上ボルスタ7には環状の補助ラム8B,9
B,10B,が埋設(象眼)され、周辺を上ボルスタに
支持された緩衝板11Bと断熱板12Bを介して上熱板
15が周辺支持で取り付けられ、周辺には筒体ガイド1
6が取り付けられている。
In FIG. 1, a main hydraulic cylinder 3 is installed in the center of a frame 2 installed on a floor 1, and a lower bolster 5 mounted on a piston 4 is guided by a plurality of guide rails 6 fixed to the frame. Be lifted up and down. An upper bolster 7 is arranged at an upper position of the frame 2 facing the lower bolster 5. Annular auxiliary rams 8A, 9A, 10A are embedded (inlaid) on the upper surface of the lower bolster 5, and a buffer plate 11A whose periphery is supported by the lower bolster is provided above the auxiliary rams 8A, 9A, 10A.
The lower heating plate 13 is attached by peripheral support via the heat insulating plate 12A, and the cylindrical body receiving ring 14 is attached to the periphery. Similarly, the upper bolster 7 has annular auxiliary rams 8B, 9
B and 10B are embedded (inlaid), and an upper heating plate 15 is attached by peripheral support via a buffer plate 11B and a heat insulating plate 12B whose periphery is supported by an upper bolster.
6 is attached.

【0012】下熱板13と上熱板15は、図4に示すよ
うに、内部に蒸気などの熱媒体通路40を有し、熱媒体
は加熱冷却手段を構成する加熱冷却源17から、熱媒体
供給ホース18を通して各熱板13、15に供給され熱
媒体通路40を通過して熱媒体戻しホース19を通して
加熱冷却源17に戻る。
As shown in FIG. 4, the lower heating plate 13 and the upper heating plate 15 have a heat medium passage 40 such as steam therein, and the heat medium is heated by a heating / cooling source 17 which constitutes heating / cooling means. The heating plates 13 and 15 are supplied through the medium supply hose 18, pass through the heating medium passage 40, and return to the heating / cooling source 17 through the heating medium return hose 19.

【0013】油圧シリンダ3には、油圧源20から油圧
配管21と22を通して油圧が供給される。油圧配管2
1は油圧シリンダ3のヘッド側ポート3aと接続され、
油圧配管22はパイロットチェック機構23を通して油
圧シリンダ3のロード側ポート3bに接続される。
Hydraulic pressure is supplied to the hydraulic cylinder 3 from a hydraulic source 20 through hydraulic pipes 21 and 22. Hydraulic piping 2
1 is connected to the head side port 3a of the hydraulic cylinder 3,
The hydraulic pipe 22 is connected to the load side port 3b of the hydraulic cylinder 3 through a pilot check mechanism 23.

【0014】上下ボルスタ5、7の補助ラム8A,9
A,10A,8B,9B,10Bには、油圧源20から
油圧配管24A,25A,26A,24B,25B,2
6Bを通し各々圧力調整弁27A,28A,29A,2
7B,28B,29Bを経由して上下ボルスター5、7
の圧力ポートに油圧が供給され、各々の圧力調整弁27
A,28A,29A,27B,28B,29B、には入
力装置30aを備えた制御盤30から指令圧が伝送され
る。
Auxiliary rams 8A, 9 of the upper and lower bolsters 5, 7
A, 10A, 8B, 9B and 10B are connected to the hydraulic pipes 24A, 25A, 26A, 24B, 25B and 2 from the hydraulic source 20.
6B through pressure adjusting valves 27A, 28A, 29A, 2 respectively
Upper and lower bolsters 5, 7 via 7B, 28B, 29B
Hydraulic pressure is supplied to the pressure ports of the
A command pressure is transmitted from A, 28A, 29A, 27B, 28B, 29B from a control panel 30 equipped with an input device 30a.

【0015】上ボルスタの側面に取り付けられた筒体ガ
イド16の外周には、筒体31が下ボルスタ5に設けら
れた昇降手段32により昇降可能に設けられ、筒体31
が下降した位置で内部に密封空間31Sを形成可能とす
るため、上部密封手段33と下部密封手段34とがそれ
ぞれ筒体ガイド16と筒体受けリング14に設けられて
いる。密封空間31Sは排気手段により排気通路36を
介して内部の大気を排気して減圧状態となり、ガス供給
手段37によりガス配管38を介してガス加圧状態とな
る。
A cylindrical body 31 is provided on the outer periphery of a cylindrical body guide 16 attached to the side surface of the upper bolster so that it can be raised and lowered by an elevating means 32 provided in the lower bolster 5.
In order to be able to form the sealed space 31S inside the lower position, the upper sealing means 33 and the lower sealing means 34 are provided on the cylindrical body guide 16 and the cylindrical body receiving ring 14, respectively. The sealed space 31S is depressurized by exhausting the atmosphere inside through the exhaust passage 36 by the exhaust means, and brought into a gas pressurized state by the gas supply means 37 through the gas pipe 38.

【0016】図2は、筒体31が上昇位置で停止してい
る状態を示し、この状態のとき各熱板13、15の間に
多層基板39の素材39Mを挿入する。
FIG. 2 shows a state in which the cylindrical body 31 is stopped at the raised position, and in this state, the material 39M of the multilayer substrate 39 is inserted between the heat plates 13 and 15.

【0017】図3は、筒体内部を排気後、油圧源20の
圧油により、ピストン4、補助ラム8A,9A,10
A、下ボルスタ5、緩衝板11A、断熱板12A、下熱
板13を介して、多層基板の素材39Mを所定の加圧力
で加圧しながら、加熱冷却源17より、プロセス条件に
合致した加熱冷却操作が行われる状態を示し、この状態
のとき接着作業が行われる。
In FIG. 3, after exhausting the inside of the cylinder, the piston 4 and the auxiliary rams 8A, 9A, 10 are driven by the pressure oil from the hydraulic pressure source 20.
Through the A, the lower bolster 5, the buffer plate 11A, the heat insulating plate 12A, and the lower heating plate 13, while heating the material 39M of the multilayer substrate with a predetermined pressing force, the heating / cooling source 17 heats and cools according to the process conditions. The state where the operation is performed is shown, and in this state, the bonding work is performed.

【0018】次に本発明のホットプレスの動作を説明す
る。
Next, the operation of the hot press of the present invention will be described.

【0019】図2に示すように筒体31を昇降手段32
で上昇位置まで上昇させ、上熱板15と下熱板13の間
に多層基板素材39Mを挿入し、ついで昇降手段32に
下降指令を与え、図1に示すように筒体31を下降させ
る。
As shown in FIG. 2, the cylinder 31 is moved up and down by means 32.
The multi-layer substrate material 39M is inserted between the upper heating plate 15 and the lower heating plate 13 with the, and then the lowering means 32 is given a lowering command to lower the tubular body 31 as shown in FIG.

【0020】次に真空排気中に負圧で下ボルスタ5が上
昇しないように、シリンダ3の3bポートより、油圧源
20から油圧配管22を介し、高圧油を供給し、上部密
封手段33と下部密封手段34とにより、筒体31の内
部に密封空間31Sを形成する。つづいて排気手段35
により、密封空間31Sの大気を排気し、5〜50To
rrの減圧状態とする。所定の真空が得られたら、シリ
ンダ3の3bポートの高圧油を排出し、シリンダ3の3
aポートより、油圧源20から油圧配管21を介し、圧
油を供給し、下ボルスタを上昇させ、多層基板素材39
Mに上熱板15と下熱板13から均一な伝熱が行われる
ように予備加圧として、面圧約1〜5kgf/cm2
付与し、上下熱板13,15により約130℃の予備加
熱を与える。
Next, in order to prevent the lower bolster 5 from rising due to a negative pressure during vacuum exhaustion, high pressure oil is supplied from the hydraulic pressure source 20 through the hydraulic pipe 22 from the 3b port of the cylinder 3, and the upper sealing means 33 and the lower portion. With the sealing means 34, a sealed space 31S is formed inside the cylindrical body 31. Exhaust means 35
The air in the sealed space 31S is exhausted by 5 to 50 To
The reduced pressure state of rr is set. When a predetermined vacuum is obtained, the high pressure oil at the 3b port of the cylinder 3 is discharged, and the 3
Pressure oil is supplied from the hydraulic pressure source 20 through the hydraulic pipe 21 from the port a to raise the lower bolster, and the multilayer substrate material 39
A surface pressure of about 1 to 5 kgf / cm 2 is applied to M as a pre-pressurization so that heat is uniformly transferred from the upper heating plate 15 and the lower heating plate 13. Give heating.

【0021】この時、図5に示すように、大気圧力4
1、シリンダによる加圧力42、接着樹脂反力43、フ
レーム反力44の外力により多層基板素材39Mは加圧
されるため均一加圧が出来ない。そこで、この変形量を
逐次制御盤30で演算し、ボルスタ5、7と緩衝板11
で形成する変形吸収機構内の補助ラム8、9、10に変
形吸収に必要な高圧油を供給し、緩衝板11に最適な変
形を与えることにより、多層基板素材39Mに最適な面
圧を付加する。
At this time, as shown in FIG.
1. Since the multilayer substrate material 39M is pressed by the external force of 1, the pressing force 42 by the cylinder, the adhesive resin reaction force 43, and the frame reaction force 44, uniform pressing cannot be performed. Therefore, this deformation amount is sequentially calculated by the control panel 30, and the bolsters 5 and 7 and the buffer plate 11 are calculated.
By supplying the high-pressure oil required for deformation absorption to the auxiliary rams 8, 9, and 10 in the deformation absorption mechanism formed by, the buffer plate 11 is deformed optimally, thereby applying the optimum surface pressure to the multilayer substrate material 39M. To do.

【0022】接着樹脂を予熱で軟化させ、減圧状態を完
了させた後、多層基板素材39Mを5〜30kgf/c
2 の面圧で加圧を行う。加圧の開始とほぼ同時に、ガ
ス供給手段37から所定のガス(ドライ空気や窒素ガス
などの不活性ガス)を密封空間31S内に供給し、ガス
加圧を行う。圧力は3〜10kgf/cm2 、時間は3
0〜60分である。さらに加圧に引き続き接着樹脂の安
定化のために170℃〜250℃の加熱を行う。この状
態でのボルスタ、熱板等は図6に示す空気加圧47、シ
リンダによる加圧力42、接着樹脂圧力反力43、フレ
ーム反力44の外力を受けた変形となり、この変形吸収
も前述したと同様熱変形と合成した値を制御盤30で演
算し、ボルスタ5、7と緩衝板11で形成する変形吸収
機構内補助ラム8、9、10に変形吸収に必要な高圧油
を供給し、緩衝板11に必要な変形を与え、多層基板素
材39Mに最適な面圧を付加する。
After the adhesive resin is softened by preheating and the depressurized state is completed, the multilayer substrate material 39M is 5 to 30 kgf / c.
Pressurization is performed with a surface pressure of m 2 . Almost at the same time when the pressurization is started, a predetermined gas (an inert gas such as dry air or nitrogen gas) is supplied from the gas supply means 37 into the sealed space 31S to pressurize the gas. Pressure is 3 to 10 kgf / cm 2 , time is 3
0 to 60 minutes. After pressurization, heating at 170 ° C. to 250 ° C. is performed to stabilize the adhesive resin. In this state, the bolster, hot plate, etc. are deformed by the external force of the air pressurization 47, the pressing force 42 by the cylinder, the adhesive resin pressure reaction force 43, and the frame reaction force 44 shown in FIG. 6, and this deformation absorption is also described above. Similarly to the above, the control board 30 calculates the combined value of thermal deformation, and supplies the high pressure oil necessary for deformation absorption to the auxiliary rams 8, 9 and 10 in the deformation absorption mechanism formed by the bolsters 5 and 7 and the buffer plate 11, The cushion plate 11 is deformed as necessary to apply an optimum surface pressure to the multilayer substrate material 39M.

【0023】多層基板素材39Mに最適な面圧を付加す
るために制御盤30で実行される演算について説明す
る。
The calculation executed by the control panel 30 for applying the optimum surface pressure to the multilayer substrate material 39M will be described.

【0024】演算は次式によって行われる。The calculation is performed by the following equation.

【0025】 P1=APo−DPa P2=BPo−EPa P3=CPo−FPa ここで、P1〜P3は補助ラム8,9,10に供給する
高圧油の油圧、Poは多層基板素材39Mの接着面圧、
Paは密封空間31Sの気圧で減圧下では負の値、加圧
下では正の値をとる。A〜Fは制御盤30付属の入力装
置30aから操作者が入力する修正係数(乗率)であ
る。制御盤30は接着面圧Po、密封空間31Sの気圧
Paをそれぞれ油圧源20、排気手段35、ガス供給手
段37から得る。
P1 = APo-DPa P2 = BPo-EPa P3 = CPo-FPa Here, P1 to P3 are hydraulic pressures of the high-pressure oil supplied to the auxiliary rams 8, 9 and 10, and Po is the adhesive surface pressure of the multilayer substrate material 39M. ,
Pa has a negative value under reduced pressure and a positive value under increased pressure at the atmospheric pressure of the sealed space 31S. A to F are correction coefficients (multiplication factors) input by the operator from the input device 30a attached to the control panel 30. The control panel 30 obtains the adhesive surface pressure Po and the atmospheric pressure Pa of the sealed space 31S from the hydraulic pressure source 20, the exhaust means 35, and the gas supply means 37, respectively.

【0026】各修正係数(乗率)A〜Fの具体的数値は
以下の通りである。
The concrete numerical values of the respective correction coefficients (multiplication factors) A to F are as follows.

【0027】 A=1.8〜2.5 B=0.8〜1.2 C=0.5〜0.8 D=3.5〜4.5 E=1.8〜2.5 F=1.2〜1.7 上記実施例の加熱、加圧条件において、A=2、B=
1、C=0.75、D=4、E=2、そして、F=1.
5を操作者が入力したところ、ボイドがなく、ねじれ、
そり、しわのない、仕上がり精度の高い高密度の多層基
板39を製造できた。
A = 1.8 to 2.5 B = 0.8 to 1.2 C = 0.5 to 0.8 D = 3.5 to 4.5 E = 1.8 to 2.5 F = 1.2 to 1.7 Under the heating and pressurizing conditions of the above example, A = 2 and B =
1, C = 0.75, D = 4, E = 2, and F = 1.
When the operator inputs 5, there is no void and it twists,
It was possible to manufacture a high-density multi-layer substrate 39 with high finish accuracy without warpage and wrinkles.

【0028】この各修正係数(乗率)A〜Fは多層基板
39の寸法や加熱、加圧条件などが変更される場合に適
宜入力装置30aから修正を加えることで、所望の多層
基板39を製造できる。
Each of the correction factors (multipliers) A to F is adjusted by the input device 30a when the dimensions, heating, pressurizing conditions, etc. of the multilayer substrate 39 are changed, so that the desired multilayer substrate 39 can be obtained. Can be manufactured.

【0029】必要な加熱が終了後各熱板13、15に、
加熱冷却源17から冷却媒体を供給して冷却して、多層
基板39も冷却し、各熱板13、15の加圧も完了す
る。
After the required heating is completed, each heating plate 13, 15 is
The cooling medium is supplied from the heating / cooling source 17 to cool the multilayer substrate 39, and the pressurization of the hot plates 13 and 15 is completed.

【0030】上記では、予備加熱と同時に補助ラムで補
正をかけているが、予備加圧による変形が少ない場合
は、本加圧から補正をかけてもかまわない。
In the above, the correction is performed by the auxiliary ram at the same time as the preliminary heating. However, if the deformation due to the preliminary pressing is small, the correction may be performed from the main pressing.

【0031】[0031]

【発明の効果】以上説明したように、本発明ホットプレ
スによれば、逐次外力による多層基板素材加圧部の変形
状態を推定把握し、最適状況で多層基板素材を加圧する
ので、ボイドがなくなりねじれ、そり、しわのない、仕
上がり精度の高い高密度の多層基板を能率良く生産する
ことができる。
As described above, according to the hot press of the present invention, the deformation state of the multi-layer substrate material pressing portion due to the external force is successively estimated and grasped, and the multi-layer substrate material is pressed under the optimum condition, so that the void is eliminated. It is possible to efficiently produce a high-density multi-layer substrate with high finishing accuracy without twisting, warping, and wrinkles.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の一実施例に係る密封状態におけるホッ
トプレスを示す断面図。
FIG. 1 is a sectional view showing a hot press in a sealed state according to an embodiment of the present invention.

【図2】図1に示すホットプレスで筒体が開放した状態
を示す断面図。
FIG. 2 is a cross-sectional view showing a state where the tubular body is opened by the hot press shown in FIG.

【図3】図1に示すホットプレスの加圧状態を示す断面
図。
3 is a cross-sectional view showing a pressed state of the hot press shown in FIG.

【図4】図1のX−X切断線に沿う熱板の要部断面図。FIG. 4 is a cross-sectional view of essential parts of the hot plate taken along the line XX of FIG.

【図5】図1に示すホットプレスの主要部材が外力で変
形する状況を示す模形図。
FIG. 5 is a schematic diagram showing a situation where a main member of the hot press shown in FIG. 1 is deformed by an external force.

【図6】図1に示すホットプレスの主要部材が内圧で変
形する状況を示す模形図。
FIG. 6 is a schematic diagram showing a situation where a main member of the hot press shown in FIG. 1 is deformed by internal pressure.

【符号の説明】[Explanation of symbols]

2…フレーム、3…主油圧シリンダ、4…ピストン、5
…下ボルスター、7…上ボルスタ、8,9,10…補助
ラム、11…緩衝板、12…断熱板、13…下熱板、1
5…上熱板、17…加熱冷却源、20…油圧源、27,
28,29…圧力調整弁、30…制御盤、30a…入力
装置、31…筒体、31S…密封空間、35…排気手
段、37…ガス供給手段、39…多層基板、39M=多
層基板素材。
2 ... Frame, 3 ... Main hydraulic cylinder, 4 ... Piston, 5
... Lower bolster, 7 ... Upper bolster, 8, 9, 10 ... Auxiliary ram, 11 ... Buffer plate, 12 ... Insulating plate, 13 ... Lower heating plate, 1
5 ... Upper heating plate, 17 ... Heating / cooling source, 20 ... Hydraulic pressure source, 27,
28, 29 ... Pressure control valve, 30 ... Control panel, 30a ... Input device, 31 ... Cylindrical body, 31S ... Sealed space, 35 ... Exhaust means, 37 ... Gas supply means, 39 ... Multilayer substrate, 39M = Multilayer substrate material.

───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.5 識別記号 庁内整理番号 FI 技術表示箇所 B30B 15/22 B 7819−4E (72)発明者 藤井 睦正 茨城県土浦市神立東二丁目28番4号 日立 テクノエンジニアリング 株式会社土浦事 業所内 (72)発明者 辻村 一憲 神奈川県秦野市堀山下1番地 株式会社日 立製作所神奈川工場内 (72)発明者 京井 正之 神奈川県横浜市戸塚区吉田町292番地 株 式会社日立製作所生産技術研究所内─────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. 5 Identification number Reference number within the agency FI technical display location B30B 15/22 B 7819-4E (72) Inventor Musumasa Fujii 28, Shinto Higashi 2-chome, Tsuchiura City, Ibaraki Prefecture No. 4 Hitachi Techno Engineering Co., Ltd. Tsuchiura Works (72) Inventor Kazunori Tsujimura No. 1 Horiyamashita, Hinoyama, Hadano, Kanagawa Pref. 292, Machi Incorporated company Hitachi, Ltd.

Claims (4)

【特許請求の範囲】[Claims] 【請求項1】 相対的に移動可能に対向配置された1対
のボルスタ、上記両ボルスタのそれぞれの対向面部に環
状に象眼配置された複数の補助ラム、上記両ボルスタの
それぞれの対向面間に配置された1対の熱板、上記両ボ
ルスタ間に配置される筒体、上記両ボルスタおよび筒体
で形成される内部空間をその外部空間に対して密封する
手段、上記内部空間の気圧を制御する手段、上記複数の
補助ラムに印加する流体圧を制御する手段を備え、上記
両熱板間に複数の基板と接着剤からなる多層基板素材を
設置して上記内部空間の気圧を制御しつつ加熱加圧して
多層基板を得るホットプレスにおいて、 上記複数の補助ラムに印加する流体圧を制御する手段
は、上記両ボルスタによる上記多層基板素材への加圧力
および上記内部空間の気圧に対する乗率を変更する手段
と、該手段から得られる乗率,上記両ボルスタによる上
記多層基板素材への加圧力および上記内部空間の気圧か
ら各補助ラムに印加する流体圧を算出する手段を備えた
ことを特徴とするホットプレス。
1. A pair of bolsters that are relatively movably opposed to each other, a plurality of auxiliary rams that are annularly arranged in the respective opposed surface portions of the both bolsters, and between the opposed surfaces of the both bolsters. A pair of arranged heat plates, a cylinder body arranged between the both bolsters, a means for sealing the inner space formed by the both bolsters and the cylinder body with respect to the outer space, and controlling the atmospheric pressure of the inner space. And a means for controlling the fluid pressure applied to the plurality of auxiliary rams, and a multi-layer substrate material composed of a plurality of substrates and an adhesive is installed between the both heating plates to control the air pressure in the internal space. In hot pressing to obtain a multilayer substrate by heating and pressurizing, the means for controlling the fluid pressure applied to the plurality of auxiliary rams is controlled by the pressure applied to the multilayer substrate material by the bolsters and the atmospheric pressure of the internal space. A means for changing the rate, and a means for calculating the fluid pressure to be applied to each auxiliary ram from the multiplication factor obtained from the means, the pressure applied to the multilayer substrate material by the bolsters, and the atmospheric pressure in the internal space. A hot press characterized by.
【請求項2】 請求項1記載のホットプレスにおいて、
乗率を変更する手段は人手による入力に基づいて乗率を
変更するものであることを特徴とするホットプレス。
2. The hot press according to claim 1,
The hot press is characterized in that the means for changing the multiplying factor is for changing the multiplying factor based on manual input.
【請求項3】 請求項1記載のホットプレスにおいて、
各補助ラムに印加する流体圧を算出する手段は上記両ボ
ルスタによる上記多層基板素材への加圧力および上記内
部空間の気圧と各補助ラムに対応した乗率から得られる
差圧を各補助ラムに印加する流体圧として算出するもの
であることを特徴とするホットプレス。
3. The hot press according to claim 1, wherein
The means for calculating the fluid pressure applied to each auxiliary ram is the pressure applied to the multi-layer substrate material by the bolsters, the pressure in the internal space, and the differential pressure obtained from the multiplication factor corresponding to each auxiliary ram. A hot press which is calculated as an applied fluid pressure.
【請求項4】 上下に対抗して配置された複数の環状補
助ラムと緩衝板が被接着物の加圧方向へ移動可能に嵌挿
された上下ボルスタと、上記各ボルスタにそれぞれ断熱
板を介して、設けられる上下の熱板と、上記各ボルス
タ、各断熱材および各熱板間を密封する手段と、上下の
ボルスタの少なくとも一方を他方に対して移動させる手
段と、上記各熱板を加熱又は冷却させる手段と、上記密
封手段で形成される空間内を真空又は高圧にする手段と
を備え、複数の基板と接着剤とからなる多層基板の素材
を位置合わせして上記各熱板の間に挿入し、上記移動手
段と加熱又は冷却手段とによって上記素材を減圧又は高
圧状態下で加熱加圧して多層基板を生産するホットプレ
スにおいて、 密封手段によりボルスタ内外の圧力差から生じるボルス
タ上下面の変形修正量を演算する手段、該手段で得た修
正量から各補助ラムの圧力を求め多層基板の素材に印加
する加圧力を最適にする手段を設けたことを特徴とする
ホットプレス。
4. An upper and lower bolster in which a plurality of annular auxiliary rams arranged in opposition to each other and a buffer plate are movably inserted in a pressurizing direction of an object to be adhered, and heat insulating plates are respectively provided to the respective bolsters. The upper and lower hot plates, the means for sealing the bolsters, the heat insulating materials, and the hot plates, the means for moving at least one of the upper and lower bolsters with respect to the other, and the heating plates for heating. Or a means for cooling and a means for applying a vacuum or a high pressure to the space formed by the sealing means, aligning the materials of the multi-layer substrate consisting of a plurality of substrates and an adhesive and inserting them between the respective heat plates. However, in a hot press for producing a multilayer substrate by heating and pressurizing the material under reduced pressure or high pressure by the moving means and heating or cooling means, the bolster up and down caused by the pressure difference inside and outside the bolster by the sealing means. Deformation means for calculating a correction amount, hot pressing, characterized in that a means for optimizing the pressure applied to the multi-layer substrate material obtains the pressure of the auxiliary ram from correction amount obtained by said means.
JP19215892A 1992-07-20 1992-07-20 Hot press Pending JPH0631500A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19215892A JPH0631500A (en) 1992-07-20 1992-07-20 Hot press

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19215892A JPH0631500A (en) 1992-07-20 1992-07-20 Hot press

Publications (1)

Publication Number Publication Date
JPH0631500A true JPH0631500A (en) 1994-02-08

Family

ID=16286664

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19215892A Pending JPH0631500A (en) 1992-07-20 1992-07-20 Hot press

Country Status (1)

Country Link
JP (1) JPH0631500A (en)

Cited By (8)

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WO2009060890A1 (en) * 2007-11-09 2009-05-14 Ulvac, Inc. Bonding substrate manufacturing apparatus and bonding substrate manufacturing method
WO2009060861A1 (en) * 2007-11-08 2009-05-14 Ulvac, Inc. Bonding substrate manufacturing apparatus and bonding substrate manufacturing method
WO2009063906A1 (en) * 2007-11-16 2009-05-22 Ulvac, Inc. Bonding substrate manufacturing apparatus and bonding substrate manufacturing method
JP2010115699A (en) * 2008-11-14 2010-05-27 Kobe Steel Ltd Pressure molding apparatus
CN103518256A (en) * 2011-09-05 2014-01-15 米卡多科技株式会社 Vacuum thermal bonding device and vacuum thermal bonding method
CN103847096A (en) * 2012-11-29 2014-06-11 米卡多机器贩卖株式会社 Vacuum heating pressure sealing molding apparatus and method thereof
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Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009060855A1 (en) * 2007-11-08 2009-05-14 Ulvac, Inc. Bonding substrate manufacturing apparatus and bonding substrate manufacturing method
WO2009060861A1 (en) * 2007-11-08 2009-05-14 Ulvac, Inc. Bonding substrate manufacturing apparatus and bonding substrate manufacturing method
JP4839407B2 (en) * 2007-11-08 2011-12-21 株式会社アルバック Bonded substrate manufacturing apparatus and bonded substrate manufacturing method
JP4955069B2 (en) * 2007-11-08 2012-06-20 株式会社アルバック Bonded substrate manufacturing apparatus and bonded substrate manufacturing method
WO2009060890A1 (en) * 2007-11-09 2009-05-14 Ulvac, Inc. Bonding substrate manufacturing apparatus and bonding substrate manufacturing method
JP4955070B2 (en) * 2007-11-09 2012-06-20 株式会社アルバック Bonded substrate manufacturing apparatus and bonded substrate manufacturing method
WO2009063906A1 (en) * 2007-11-16 2009-05-22 Ulvac, Inc. Bonding substrate manufacturing apparatus and bonding substrate manufacturing method
JP4955071B2 (en) * 2007-11-16 2012-06-20 株式会社アルバック Bonded substrate manufacturing apparatus and bonded substrate manufacturing method
JP2010115699A (en) * 2008-11-14 2010-05-27 Kobe Steel Ltd Pressure molding apparatus
CN103518256A (en) * 2011-09-05 2014-01-15 米卡多科技株式会社 Vacuum thermal bonding device and vacuum thermal bonding method
KR101421822B1 (en) * 2011-11-28 2014-07-22 도시바 기카이 가부시키가이샤 Work setting apparatus and method thereof
CN103847096A (en) * 2012-11-29 2014-06-11 米卡多机器贩卖株式会社 Vacuum heating pressure sealing molding apparatus and method thereof

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