WO2009063906A1 - Bonding substrate manufacturing apparatus and bonding substrate manufacturing method - Google Patents

Bonding substrate manufacturing apparatus and bonding substrate manufacturing method Download PDF

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Publication number
WO2009063906A1
WO2009063906A1 PCT/JP2008/070589 JP2008070589W WO2009063906A1 WO 2009063906 A1 WO2009063906 A1 WO 2009063906A1 JP 2008070589 W JP2008070589 W JP 2008070589W WO 2009063906 A1 WO2009063906 A1 WO 2009063906A1
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
substrate manufacturing
bonding substrate
bonding
chamber
Prior art date
Application number
PCT/JP2008/070589
Other languages
French (fr)
Japanese (ja)
Inventor
Seiichi Sato
Mitsuru Yahagi
Hirofumi Minami
Kazuhiro Musha
Junpei Yuyama
Masao Murata
Takahiro Miyata
Kyuzo Nakamura
Original Assignee
Ulvac, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ulvac, Inc. filed Critical Ulvac, Inc.
Priority to KR1020107008156A priority Critical patent/KR101192683B1/en
Priority to CN200880107159.6A priority patent/CN101801645B/en
Priority to JP2009541155A priority patent/JP4955071B2/en
Publication of WO2009063906A1 publication Critical patent/WO2009063906A1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/063—Transporting devices for sheet glass
    • B65G49/064—Transporting devices for sheet glass in a horizontal position
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • B32B37/1018—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure using only vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/18—Handling of layers or the laminate
    • B32B38/1825—Handling of layers or the laminate characterised by the control or constructional features of devices for tensioning, stretching or registration
    • B32B38/1833—Positioning, e.g. registration or centering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/18—Handling of layers or the laminate
    • B32B2038/1891—Using a robot for handling the layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
    • B32B2457/202—LCD, i.e. liquid crystal displays
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/02—Controlled or contamination-free environments or clean space conditions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
    • B65G2249/04—Arrangements of vacuum systems or suction cups
    • B65G2249/045—Details of suction cups suction cups

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Liquid Crystal (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Fluid Mechanics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)

Abstract

Disclosed is a bonding substrate manufacturing apparatus for manufacturing a bonding substrate by aligning and bonding an upper substrate and a lower substrate with each other. The apparatus is provided with a base section for supporting the lower substrate; a first supporting bar arranged upright from the base section; an upper pressurizing member which can vertically move along the first supporting bar and hold the upper substrate; and a bonding process chamber which includes an upper chamber member and a lower chamber member which can vertically move independently from the upper pressurizing member. The upper substrate and the lower substrate can be bonded with each other inside the bonding process chamber by moving the upper pressurizing member. The upper chamber member and the lower chamber member can move at the same time in a direction where the members abut to each other or in a direction where the members are separated from each other.
PCT/JP2008/070589 2007-11-16 2008-11-12 Bonding substrate manufacturing apparatus and bonding substrate manufacturing method WO2009063906A1 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
KR1020107008156A KR101192683B1 (en) 2007-11-16 2008-11-12 Bonding substrate manufacturing apparatus and bonding substrate manufacturing method
CN200880107159.6A CN101801645B (en) 2007-11-16 2008-11-12 Bonding substrate manufacturing apparatus and bonding substrate manufacturing method
JP2009541155A JP4955071B2 (en) 2007-11-16 2008-11-12 Bonded substrate manufacturing apparatus and bonded substrate manufacturing method

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2007297704 2007-11-16
JP2007-297704 2007-11-16

Publications (1)

Publication Number Publication Date
WO2009063906A1 true WO2009063906A1 (en) 2009-05-22

Family

ID=40638755

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/070589 WO2009063906A1 (en) 2007-11-16 2008-11-12 Bonding substrate manufacturing apparatus and bonding substrate manufacturing method

Country Status (5)

Country Link
JP (1) JP4955071B2 (en)
KR (1) KR101192683B1 (en)
CN (1) CN101801645B (en)
TW (1) TW200941616A (en)
WO (1) WO2009063906A1 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2432011A1 (en) * 2010-09-15 2012-03-21 Uwe Beier Device for treating and/or processing substrates
JP2013163592A (en) * 2012-02-10 2013-08-22 Mm Tech Co Ltd Humidification processing device
CN110036465A (en) * 2016-11-30 2019-07-19 龙云株式会社 Laminating apparatus
WO2022210857A1 (en) * 2021-03-31 2022-10-06 ボンドテック株式会社 Bonding device, bonding system, and bonding method
WO2024009770A1 (en) * 2022-07-04 2024-01-11 日本メクトロン株式会社 Workpiece provisional bonding device

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5961366B2 (en) * 2011-11-28 2016-08-02 東芝機械株式会社 Work setting device and work setting method
JP5852864B2 (en) * 2011-11-28 2016-02-03 東芝機械株式会社 Work holding body, work setting device, and work setting method
JP5798020B2 (en) * 2011-12-01 2015-10-21 東芝機械株式会社 Work setting device and work setting method
KR101380978B1 (en) * 2011-12-09 2014-04-02 주식회사 탑 엔지니어링 Bonding apparatus
CN104128413B (en) * 2014-08-04 2019-04-05 广德竹昌电子科技有限公司 A kind of heat pressing utensil
TWI699582B (en) * 2015-07-01 2020-07-21 日商信越工程股份有限公司 Manufacturing device and manufacturing method of bonded device
KR102307294B1 (en) * 2017-07-21 2021-09-30 주식회사 엘지화학 Integrated press and vision inspection of cylindrical cell assembly

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0631500A (en) * 1992-07-20 1994-02-08 Hitachi Ltd Hot press
JP2007212572A (en) * 2006-02-07 2007-08-23 Ulvac Japan Ltd Method and device for manufacturing laminated substrate

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0631500A (en) * 1992-07-20 1994-02-08 Hitachi Ltd Hot press
JP2007212572A (en) * 2006-02-07 2007-08-23 Ulvac Japan Ltd Method and device for manufacturing laminated substrate

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2432011A1 (en) * 2010-09-15 2012-03-21 Uwe Beier Device for treating and/or processing substrates
JP2013163592A (en) * 2012-02-10 2013-08-22 Mm Tech Co Ltd Humidification processing device
CN110036465A (en) * 2016-11-30 2019-07-19 龙云株式会社 Laminating apparatus
WO2022210857A1 (en) * 2021-03-31 2022-10-06 ボンドテック株式会社 Bonding device, bonding system, and bonding method
JP7156753B1 (en) * 2021-03-31 2022-10-19 ボンドテック株式会社 Joining device, joining system and joining method
WO2024009770A1 (en) * 2022-07-04 2024-01-11 日本メクトロン株式会社 Workpiece provisional bonding device

Also Published As

Publication number Publication date
CN101801645B (en) 2013-04-10
KR101192683B1 (en) 2012-10-19
JP4955071B2 (en) 2012-06-20
CN101801645A (en) 2010-08-11
KR20100077165A (en) 2010-07-07
TW200941616A (en) 2009-10-01
JPWO2009063906A1 (en) 2011-03-31

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