JPWO2009063906A1 - Bonded substrate manufacturing apparatus and bonded substrate manufacturing method - Google Patents

Abstract

A bonded substrate manufacturing apparatus for aligning and bonding an upper substrate and a lower substrate to manufacture a bonded substrate: a base portion that supports the lower substrate; and a first support that is erected from the base portion An upper pressure member that can move up and down along the first support rod and can hold the upper substrate; and an upper chamber member and a lower portion that can move up and down independently of the upper pressure member A bonding processing chamber including a chamber member, and the upper pressurizing member moves to allow the upper substrate and the lower substrate to be bonded inside the bonding processing chamber, and the upper chamber The apparatus for manufacturing a bonded substrate board, wherein the member and the lower chamber member are simultaneously movable in a contact direction or a separation direction.

Description

The present invention relates to a bonded substrate manufacturing apparatus and a bonded substrate manufacturing method.
This application claims priority on November 16, 2007 based on Japanese Patent Application No. 2007-297704 for which it applied to Japan, and uses the content here.

  A flat panel display (FPD) such as a liquid crystal display or a plasma display has a structure in which two substrates are bonded together. For example, in a liquid crystal display, an array substrate (TFT substrate) in which a plurality of TFTs (thin film transistors) are formed in a matrix and a color filter substrate (CF substrate) in which a color filter, a light-shielding film, and the like are formed are about several μm. The liquid crystal is sealed between the two substrates, and the two substrates are manufactured by being bonded to each other with a seal member (adhesive) containing a photocurable resin. Note that the two substrates are bonded together in a vacuum environment in order to prevent mixing of impure gas.

  As an apparatus for bonding such two substrates, for example, a substrate bonding apparatus of Patent Document 1 is known. The substrate laminating apparatus of Patent Document 1 includes a vacuum chamber composed of an upper container and a lower container, an upper substrate conveying jig for moving the upper substrate, and a first for moving the upper container up and down. A support bar, a base plate on which the support bar is supported, and a second support bar for moving the upper substrate transport jig up and down are provided.

In the above-described substrate bonding apparatus, the first support bar is moved downward, the upper container and the lower container are in contact with each other to form a vacuum chamber, and the second support bar is moved downward. Then, the upper substrate transport jig is lowered so that the substrate as the upper substrate is disposed to face the substrate at a predetermined interval. Thereafter, the upper substrate and the lower substrate are aligned and bonded together.
JP 2007-212572 A

  The above-mentioned bonded substrate manufacturing apparatus of Patent Document 1 evacuates the processing chamber, aligns the upper substrate and the lower substrate, and bonds these two substrates. However, if the upper substrate transport jig is moved by moving the second support rod provided on the base plate after the upper substrate and the lower substrate are aligned, the position of the upper substrate and the lower substrate May be shifted relatively. This is because a plurality of members are interposed between the base plate and the lower substrate, so that the lower container on which the lower substrate is disposed and the base plate on which the second support bar is provided move differently. It is. As described above, there is a problem in that the yield decreases due to the relative positions of the upper substrate and the lower substrate being shifted.

  The present invention has been made in view of the above circumstances, and provides a bonded substrate manufacturing apparatus and a bonded substrate manufacturing method that improve the alignment accuracy of two substrates and improve the yield.

(1) One aspect of the present invention employs the following configuration: a bonded substrate manufacturing apparatus that aligns an upper substrate and a lower substrate and manufactures the bonded substrate by bonding: the lower substrate A supporting base part; a first support bar standing from the base part; an upper pressure member that can move up and down along the first support bar and hold the upper substrate; A bonding process chamber including an upper chamber member and a lower chamber member that are movable up and down independently from the pressure member; and the upper pressure member moves to move the upper chamber member inside the bonding process chamber. An apparatus for manufacturing a bonded substrate, wherein the upper substrate and the lower substrate can be bonded together, and the upper chamber member and the lower chamber member are simultaneously movable in a direction in which they abut or separate from each other.

  According to the bonded substrate manufacturing apparatus, the upper pressurizing member holding the upper substrate moves up and down while being guided by the first support bar standing on the base portion on which the lower substrate is placed. For this reason, only a minimum of members are interposed between the upper substrate and the lower substrate. Thereby, it can prevent that the relative position of an upper board | substrate and a lower board | substrate shift | deviates between after aligning an upper board | substrate and a lower board | substrate, and bonding. Therefore, there is an effect of improving the yield by improving the alignment accuracy of the two substrates. In addition, since the upper pressurizing member and the upper chamber member and the lower chamber member can be individually moved up and down, the upper chamber member and the lower chamber member can simultaneously move up and down at high speed. Further, the upper pressurizing member can move minutely (up and down movement) when the substrates are bonded. In other words, the alignment accuracy of the two substrates can be improved and the production efficiency can be improved. In addition, since the upper chamber member and the lower chamber member can move simultaneously in the direction in which they abut or separate from each other, it is possible to cancel the force acting on the apparatus as both chamber members move, and the bonding The reliability of the substrate manufacturing apparatus can be improved. Furthermore, compared with the case where only one chamber member is moved, the opening / closing time of the bonding processing chamber can be shortened.

(2) The above-described bonded substrate manufacturing apparatus may be configured as follows: a drive shaft including a first screw portion and a second screw portion in different directions, and further including the upper chamber member and the The lower chamber member is screwed into the first screw portion and the second screw portion, respectively, and by rotating the drive shaft, the upper chamber member and the lower chamber member are simultaneously brought into contact with or separated from each other. It is movable.

  In this case, the upper chamber member and the lower chamber member can be moved with a simple configuration. That is, the increase in the number of parts of the apparatus can be suppressed, and the manufacturing cost of the bonded substrate manufacturing apparatus can be suppressed.

(3) The above-mentioned bonded substrate manufacturing apparatus may be configured as follows: the upper chamber member includes an adsorption pin for adsorbing the upper substrate.

  In this case, the suction pin can be moved up and down in conjunction with the vertical movement of the upper chamber member. Further, the upper substrate can be transferred from the suction pin to the upper pressure member by moving the upper pressure member up and down independently of the upper chamber member. This eliminates the need for an up-and-down movement mechanism unique to the suction pin, and is effective in suppressing an increase in manufacturing cost.

(4) The above-described bonded substrate manufacturing apparatus may be configured as follows: the base unit: (a) a mounting table for mounting the lower substrate; and (b) the mounting table described above. A substrate alignment mechanism including: a moving mechanism for moving the substrate.

  In this case, since the lower substrate is placed on the placement table, the lower substrate can be stably held, and there is an effect that the alignment between the lower substrate and the upper substrate can be performed with high accuracy.

(5) The bonded substrate manufacturing apparatus described above may be configured as follows: the base unit: (a) a lower substrate suction that sucks a first part of the lower substrate and moves the lower substrate; (B) The second part of the lower substrate is levitated when the lower substrate is moved by the lower substrate adsorption device, and the second part of the lower substrate is adsorbed when the upper substrate and the lower substrate are bonded. And a lower substrate floating adsorption device.

In this case, when aligning the upper substrate and the lower substrate, the lower substrate can be lifted from the base portion by the lower substrate floating adsorption device. Therefore, the lower substrate can be easily moved by the lower substrate suction device. On the other hand, when the upper substrate and the lower substrate are bonded together, the lower substrate can be adsorbed to the base portion by the lower substrate floating adsorption device. Therefore, the positional deviation of the lower substrate can be prevented, and the upper substrate and the lower substrate can be bonded together with high accuracy. In addition, since a table for placing the lower substrate is not required separately, the number of components interposed between the base portion and the lower substrate can be reduced.
Furthermore, if the lower substrate is adsorbed to the base part, the lower substrate adsorbing device and the lower substrate floating adsorbing device are not exposed to the bonding processing chamber, so that particles generated from each device flow into the bonding processing chamber. Can be prevented. Therefore, there is an effect of ensuring the cleanliness in the bonding treatment chamber.

(6) The bonded substrate manufacturing apparatus described above may be configured as follows: the substrate alignment mechanism is disposed in the bonding processing chamber.

  In this case, interference with the substrate alignment mechanism can be prevented when the lower chamber member is moved up and down. Therefore, there is an effect that the bonding processing chamber can be reliably formed without complicating the apparatus configuration of the bonded substrate manufacturing apparatus.

(7) One aspect of the present invention employs the following method: a bonded substrate manufacturing method: a step of supporting a lower substrate by a base portion; and a first support rod erected from the base portion A step of holding the upper substrate by an upper pressurizing member that can move up and down along; and an upper chamber member and a lower chamber member that can move up and down independently from the upper pressurizing member are simultaneously moved in a direction in contact with each other. A process chamber forming step of forming a bonding process chamber in which the upper substrate and the lower substrate are accommodated; and lowering the upper pressure member to separate the lower substrate and the upper substrate by a first predetermined distance. A first upper substrate moving step for holding; a depressurizing step for depressurizing the inside of the bonding process chamber; and lowering the upper pressurizing member to separate the lower substrate and the upper substrate by a second predetermined distance. And holding the second upper substrate moving step; A substrate alignment step of aligning the lower substrate and the upper substrate by moving the lower substrate by moving a mounting table for mounting a plate by a moving mechanism provided in the base portion; And a substrate laminating step of laminating the upper pressurizing member to bond the lower substrate and the upper substrate together.

In this case, the upper pressing member holding the upper substrate moves up and down guided by the first support rod standing from the base portion where the mounting table on which the lower substrate is mounted is installed. There are minimal members between the upper substrate and the lower substrate. Thereby, it is possible to prevent the relative positions of the upper substrate and the lower substrate from shifting after the upper substrate and the lower substrate are aligned and bonded. Therefore, it is possible to improve the alignment accuracy of the two substrates and improve the yield. In addition, since the upper pressure member and the upper chamber member and the lower chamber member can be individually moved up and down, the upper chamber member and the lower chamber member can be moved up and down at high speed, and the upper pressure member is bonded to the substrate. Sometimes a minute movement (up and down movement) can be made. That is, there are effects that the alignment accuracy of the two substrates can be improved and the production efficiency can be improved. Further, since the upper chamber member and the lower chamber member can move simultaneously in the direction in which they abut or separate from each other, the force acting on the apparatus as both chamber members move can be offset, and the bonded substrate manufacturing apparatus Reliability can be improved. Furthermore, compared with the case where only one chamber member is moved, the opening / closing time of the bonding processing chamber can be shortened.
In addition, since the bonding processing chamber is depressurized in a state where the lower substrate and the upper substrate are spaced apart from each other by a predetermined distance, the depressurization can be performed with a large conductance. Thereby, there exists an effect which can shorten pressure reduction time.
Further, after the pressure in the bonding process chamber is reduced, the lower substrate and the upper substrate can be aligned by the moving mechanism. Therefore, it is not necessary to raise the upper pressurizing member again after aligning the lower substrate and the upper substrate, and the production efficiency can be improved.
And since the lower board | substrate is mounted in the mounting table, the lower board | substrate can be hold | maintained stably and it has the effect that position alignment with a lower board | substrate and an upper board | substrate can be performed with high precision.

(8) One aspect of the present invention employs the following method: a bonded substrate manufacturing method: a step of supporting a lower substrate by a base portion; and a first support rod erected from the base portion A step of holding the upper substrate by an upper pressurizing member that can move up and down along; and an upper chamber member and a lower chamber member that can move up and down independently from the upper pressurizing member are simultaneously moved in a direction in contact with each other. A process chamber forming step of forming a bonding process chamber in which the upper substrate and the lower substrate are accommodated; and a lower substrate suction device installed in the base portion adsorbs a first part of the lower substrate, A first lower substrate moving step of separating the substrate from the base portion, and levitating the second portion of the lower substrate by a lower substrate floating adsorption device installed in the base portion; lowering the upper pressure member; The lower substrate and the upper base A first upper substrate moving step for holding the first and second substrates spaced apart at a first predetermined distance; substrate alignment for moving the lower substrate by the lower substrate suction device and aligning the lower substrate and the upper substrate; A second upper substrate moving step of raising the upper pressure member and holding the lower substrate and the upper substrate apart from each other by a second predetermined distance; and A second lower substrate moving step of adsorbing a part, bringing the lower substrate into contact with the base, and adsorbing the second portion of the lower substrate by the lower substrate floating adsorption device; A pressure-reducing step, and a substrate bonding step of lowering the upper pressure member and bonding the lower substrate and the upper substrate together.

In this case, the upper pressing member holding the upper substrate moves up and down while being guided by the first support rod standing from the base portion on which the lower substrate is placed. There are only minimal members in between. Thereby, it is possible to prevent the relative positions of the upper substrate and the lower substrate from shifting after the upper substrate and the lower substrate are aligned and bonded. Therefore, it is possible to improve the alignment accuracy of the two substrates and improve the yield. In addition, since the upper pressure member and the upper chamber member and the lower chamber member can be individually moved up and down, the upper chamber member and the lower chamber member can be moved up and down at high speed, and the upper pressure member is bonded to the substrate. Sometimes a minute movement (up and down movement) can be made. That is, there are effects that the alignment accuracy of the two substrates can be improved and the production efficiency can be improved. In addition, since the upper chamber member and the lower chamber member can move simultaneously in the direction in which they abut or separate from each other, it is possible to cancel the force acting on the apparatus as both chamber members move, and the bonding The reliability of the substrate manufacturing apparatus can be improved. Furthermore, compared with the case where only one chamber member is moved, the opening / closing time of the bonding processing chamber can be shortened.
Further, since the bonding process chamber is depressurized after the upper pressurizing member is raised and the lower substrate and the upper substrate are spaced apart from each other by a predetermined distance, the depressurization can be performed with a large conductance. Thereby, there exists an effect which can shorten pressure reduction time.
Further, when aligning the upper substrate and the lower substrate, the lower substrate can be levitated from the base portion by the lower substrate levitating suction device. Therefore, the lower substrate can be easily moved by the lower substrate suction device. On the other hand, when the upper substrate and the lower substrate are bonded together, the lower substrate can be adsorbed to the base portion by the lower substrate floating adsorption device. Therefore, the positional deviation of the lower substrate can be prevented, and the upper substrate and the lower substrate can be bonded together with high accuracy. In addition, since a table for placing the lower substrate is not required separately, the number of components interposed between the base portion and the lower substrate can be reduced. Furthermore, if the lower substrate is adsorbed to the base part, the lower substrate adsorbing device and the lower substrate floating adsorbing device are not exposed to the bonding processing chamber, so that particles generated from each device flow into the bonding processing chamber. Can be prevented. Therefore, there is an effect that the upper substrate and the lower substrate can be bonded together in a state where the cleanliness in the bonding processing chamber is ensured.

  According to the present invention, since the upper pressing member is supported from the base portion, only a minimum number of members are interposed between the upper substrate and the lower substrate. Thereby, it is possible to prevent the relative positions of the upper substrate and the lower substrate from shifting after the upper substrate and the lower substrate are aligned and bonded. Therefore, it is possible to improve the alignment accuracy of the two substrates and improve the yield. Further, since the upper pressurizing member and the upper chamber member and the lower chamber member can be individually moved up and down, the upper chamber member and the lower chamber member can be simultaneously moved up and down at a high speed. It is possible to make a minute movement (up and down movement) when laminating. That is, there are effects that the alignment accuracy of the two substrates can be improved and the production efficiency can be improved. In addition, since the upper chamber member and the lower chamber member can move simultaneously in the direction in which they abut or separate from each other, it is possible to cancel the force acting on the apparatus as both chamber members move, and the bonding The reliability of the substrate manufacturing apparatus can be improved. Furthermore, compared with the case where only one chamber member is moved, there is an effect that the opening / closing time of the bonding processing chamber can be shortened.

FIG. 1 is a schematic front view of a bonded substrate manufacturing apparatus according to the first embodiment of the present invention. 2 is a cross-sectional view taken along line AA in FIG. FIG. 3: is explanatory drawing (1) which shows the process in which a bonded substrate is manufactured using the bonded substrate manufacturing apparatus concerning the embodiment. FIG. 4 is explanatory drawing (2) which shows the process in which a bonded substrate is manufactured using the bonded substrate manufacturing apparatus concerning the embodiment. FIG. 5: is explanatory drawing (3) which shows the process in which a bonded substrate is manufactured using the bonded substrate manufacturing apparatus concerning the embodiment. FIG. 6: is explanatory drawing (4) which shows the process in which a bonded substrate is manufactured using the bonded substrate manufacturing apparatus concerning the embodiment. FIG. 7: is explanatory drawing (5) which shows the process in which a bonded substrate is manufactured using the bonded substrate manufacturing apparatus concerning the embodiment. FIG. 8: is explanatory drawing (6) which shows the process of manufacturing a bonded substrate using the bonded substrate manufacturing apparatus concerning the embodiment. FIG. 9: is explanatory drawing (7) which shows the process in which a bonded substrate is manufactured using the bonded substrate manufacturing apparatus concerning the embodiment. FIG. 10: is explanatory drawing (8) which shows the process in which a bonded substrate is manufactured using the bonded substrate manufacturing apparatus concerning the embodiment. FIG. 11 is a flowchart showing a process of manufacturing the bonded substrate according to the embodiment. FIG. 12 is a schematic front view of the bonded substrate manufacturing apparatus according to the second embodiment of the present invention. 13 is a cross-sectional view taken along line BB in FIG. FIG. 14 is a flowchart showing a process of manufacturing the bonded substrate according to the embodiment.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10,110 Bonded substrate manufacturing apparatus 11,111 Base part 14 Upper chamber member 15 Upper pressurizing member 16 First support rod 17 Chamber (bonding processing chamber)
18 Lower chamber member 20, 120 Substrate alignment mechanism 29 Movement mechanism 31 Placement table 57 Suction pin 65 Drive shaft 85 Male screw (screw)
125 Drive stand (lower substrate adsorption device)
135 Air pad (lower substrate floating adsorption device)
W1 Lower substrate W2 Upper substrate W3 Bonded substrate

(First embodiment) (Laminated substrate manufacturing apparatus)
The bonded substrate manufacturing apparatus according to the first embodiment of the present invention will be described with reference to FIGS.
FIG. 1 is a schematic front view of a bonded substrate manufacturing apparatus, and FIG. 2 is a cross-sectional view taken along line AA of FIG. As shown in FIGS. 1 and 2, the bonded substrate board manufacturing apparatus 10 includes: a common gantry 12 that supports the entire apparatus; a base portion 11 that is disposed on the common gantry 12; and a second support that is provided on the common gantry 12. An upper chamber member 14 and a lower chamber member 18 movable up and down along the second support rod 13; a first support rod 16 erected from the base portion 11; an upper chamber member 14 and a lower chamber member And an upper pressurizing member 15 that can move up and down along the first support bar 16 independently of the first support bar 16 and can hold the upper substrate W2.

  The base part 11 has rigidity and is formed in a substantially rectangular parallelepiped shape. The base portion 11 is provided with legs 22 at the four corners of the lower surface 21 and is placed on the common frame 12. On the other hand, the upper surface 23 of the base portion 11 is rectangular in plan view. XYθ guides 27 that are movable in the orthogonal biaxial horizontal direction and the horizontal rotation direction (hereinafter referred to as the horizontal plane direction) are provided at substantially the center and four corners of the upper surface 23 in plan view. A moving mechanism 29 in which an actuator 33 is provided on an XYθ guide having the same structure as that of the XYθ guide 27 is disposed at a substantially central portion between the XYθ guides 27 at the peripheral edge portion of the upper surface 23. That is, five XYθ guides 27 and four moving mechanisms 29 are arranged on the upper surface 23 of the base portion 11. The surface 28 of the XYθ guide 27 and the surface 30 of the moving mechanism 29 are arranged so as to be flush with each other.

  A rectangular placement table 31 is provided above the XYθ guide 27 and the moving mechanism 29 in plan view. A lower substrate W1 can be placed on the upper surface 32 of the placement table 31. By driving the moving mechanism 29, the mounting table 31 can be moved in the horizontal plane direction. That is, the moving mechanism 29 and the mounting table 31 constitute the substrate alignment mechanism 20 for moving the lower substrate W1 in the horizontal plane direction.

  The XYθ guide 27 has a substantially three-layer structure, and includes a base fixing portion 27a fixed to the base portion 11, a table fixing portion 27c fixed to the mounting table 31, and a base fixing portion 27a and a table fixing portion 27c. And a moving part 27b that is disposed between and movable in a horizontal plane direction.

  The moving unit 27b of the moving mechanism 29 moves in a desired direction when the actuator 33 is driven. Here, for example, the moving mechanism 29a provided at the center in the long side direction of the upper surface 23 is movable along the X direction (the long side direction of the mounting table 31), and the moving mechanism 29b provided in the short side direction. May be movable along the Y direction (the short side direction of the mounting table 31). In this case, the placement table 31 can be moved in a desired direction by controlling the movement amount of each movement mechanism 29. That is, when the placement table 31 is to be moved along the X direction, the moving mechanism 29a is moved, and when the placement table 31 is to be moved along the Y direction, the moving mechanism 29b is moved. . Further, by moving the two moving mechanisms 29a and the two moving mechanisms 29b, the mounting table 31 can be rotated around its vertical axis.

  A plurality of lift pins 45 are provided on the upper surface 32 of the mounting table 31 at positions corresponding to the lower substrate W1. The lift pins 45 are normally disposed below the upper surface 32 of the mounting table 31. When the lower substrate W1 is delivered from another device (not shown) to the bonded substrate manufacturing apparatus 10, the lift pins 45 are raised to receive the lower substrate W1 from a robot arm (not shown). Then, after receiving the lower substrate W <b> 1, the lower pins W <b> 1 are placed on the upper surface 32 of the placement table 31 by lowering the lift pins 45. Further, after the bonding process of the substrates W1 and W2 is completed, when the bonded substrate W3 is delivered to another apparatus, the lift pins 45 are lifted to separate the bonded substrate W3 from the upper surface 32 of the mounting table 31. Let The bonded substrate W3 can be transported by inserting a robot arm into the gap.

  The lift pins 45 are moved up and down by lifting and lowering the lift pin support 36 connected to the lower end of the lift pins 45. At this time, all the lift pins 45 move up and down simultaneously. The lift pin support part 36 is comprised by the plate-shaped member. A drive mechanism 38 that moves up and down is provided on the lower surface 37 of the lift pin support portion 36. The drive mechanism 38 is supported and fixed to the common mount 12. The drive mechanism 38 passes through the base portion 11 and the lower chamber member 18 and is fixed to the common mount 12. A seal member (not shown) is provided between the through hole 39 of the lower chamber member 18 and the drive mechanism 38 in order to ensure airtightness. A bellows 40 is provided around the drive mechanism 38 located outside the lower chamber member 18.

  An exhaust hole 47 is formed in the bottom surface 19 of the lower chamber member 18. The exhaust hole 47 is connected to the exhaust pipe 48. The exhaust pipe 48 is connected to a vacuum pump 49 provided outside the apparatus.

  A second support bar 13 is erected on the common frame 12. The second support bars 13 are erected in the vicinity of the four corners of the common mount 12. An upper chamber member 14 and a lower chamber member 18 are attached to the second support rod 13. In addition, a drive shaft 65 is erected at an intermediate portion between the two second support rods 13 arranged along the short side direction of the common mount 12. The drive shaft 65 includes a drive source 66 composed of a motor or the like attached to the common mount 12 and two shaft portions 67 on one side rotating according to instructions from the drive source 66. That is, the common gantry 12 is provided with four second support bars 13 and four drive shafts 65. In FIG. 1, for convenience of explanation, the second support rod 13 is shown on the left side, and the drive shaft 65 is shown on the right side.

For example, the shaft portion 67 of the drive shaft 65 is configured to rotate in response to an instruction from the drive source 66. Further, the shaft portion 67 of the drive shaft 65 is formed with left and right screws 85 having male screws having different shapes at the upper and lower portions. An upper chamber member 14 and a lower chamber member 18 are attached to the shaft portion 67. Each of the upper chamber member 14 and the lower chamber member 18 is screwed into male screws of upper and lower portions of the left and right screws 85.
That is, when the shaft portion 67 of the drive shaft 65 rotates in either the left or right direction, the internal thread 86 formed on the upper chamber member 14 and the lower chamber member 18 causes the upper chamber member 14 and the lower chamber member 18 to contact each other. Move in a direction or move away from each other. Moreover, both the chamber members 14 and 18 move so that it may become a surface object with respect to a contact surface. That is, the moving speeds of both chamber members 14 and 18 are equal in size and opposite in direction.

  The upper chamber member 14 is formed in a rectangular shape having substantially the same size as the lower chamber member 18 in plan view. In plan view, a through hole 69 through which the second support bar 13 is inserted is formed at a position corresponding to the second support bar 13 on the periphery of the upper chamber member 14. Further, a wall portion 51 extending vertically downward is formed over the entire periphery of the peripheral portion of the lower surface of the upper chamber member 14.

  Similarly to the upper chamber member 14, the lower chamber member 18 has a through hole 69 through which the second support rod 13 is inserted at a position corresponding to the second support rod 13 on the periphery in plan view. Further, a wall portion 42 extending vertically upward is formed over the entire periphery of the peripheral portion of the upper surface of the lower chamber member 18.

  The bottom surface 52 of the wall portion 51 of the upper chamber member 14 and the top surface 43 of the wall portion 42 of the lower chamber member 18 can contact each other. Thereby, the upper chamber member 14 and the lower chamber member 18 may constitute the chamber 17. A seal (not shown) is provided on the bottom surface 52 of the wall portion 51 of the upper chamber member 14 and / or the top surface 43 of the wall portion 42 of the lower chamber member 18.

  An upper substrate suction mechanism 55 for sucking the upper substrate W2 is provided on the ceiling 53 of the upper chamber member 14. The upper substrate suction mechanism 55 includes a support portion 56 attached to the ceiling 53 and suction pins 57 extending from the support portion 56 vertically downward. An opening 58 is formed at the tip of the suction pin 57. The opening 58 is connected to a through hole (not shown) formed in the suction pin 57. The through hole is further connected to a pipe (not shown). An exhaust pump is provided at the tip of the pipe. In this way, the upper substrate W2 can be sucked to the suction pins 57 by driving the exhaust pump. In addition, a valve is provided in the middle of the piping, and the exhaust air volume can be adjusted.

  That is, when the upper substrate W2 is delivered from another device (not shown) to the bonded substrate manufacturing apparatus 10, the suction pin 57 can receive the upper substrate W2 from a robot arm (not shown) by driving the exhaust pump. The upper substrate W2 can be held on the suction pins 57 by continuing the exhaust.

  On the ceiling 53 of the upper chamber member 14, a position corresponding to an arbitrary position (preferably near the peripheral edge of the upper substrate W2) on the held upper substrate W2 is used when positioning with the lower substrate W1. An imaging unit 81 of the camera 80 is formed. A camera placement portion 82 that is a through-hole penetrating the upper chamber member 14 is connected to the imaging portion 81. That is, when the camera 80 is arranged in the camera arrangement unit 82, the camera 80 can photograph the alignment marks M1 and M2 of the lower substrate W1 and the upper substrate W2 through the photographing unit 81. Thereby, the shift | offset | difference of alignment mark M1, M2 is detectable. A through hole 84 is formed at a position corresponding to the imaging unit 81 in the upper pressure member 15. Through the through hole 84, the lower substrate W1 and the upper substrate W2 can be photographed. In addition, a control unit (not shown) is provided for instructing the moving mechanism 29 the amount of movement in the horizontal plane based on the result captured by the camera 80. A plurality of cameras 80 may be provided (two in this embodiment). By providing a plurality of cameras 80, the substrates W1 and W2 can be aligned with high accuracy.

Next, the first support bar 16 is erected outside the position of the mounting table 31 in the base portion 11. The first support rods 16 are erected at the four corners of the base portion 11.
An upper pressure member 15 is attached to the first support rod 16. The upper pressure member 15 is formed in a substantially same rectangle as the base portion 11 in plan view. In a plan view, through holes 71 into which the first support rod 16 can be inserted are formed at positions corresponding to the first support rods 16 at the four corners of the upper pressure member 15. Below the through hole 71, a guide guide 83 is arranged so that the upper pressure member 15 moves up and down in the vertical direction along the first support rod 16.

  Further, a holding surface 75 that holds the upper substrate W <b> 2 is formed on the lower surface of the upper pressure member 15. A plurality of electrostatic chuck portions 77 are provided at positions where the upper substrate W <b> 2 is held on the holding surface 75. The surface of the electrostatic chuck portion 77 is flush with the holding surface 75. In addition, a through hole 78 through which the suction pin 57 can be inserted is formed in a portion of the holding surface 75 where the electrostatic chuck portion 77 is not disposed.

  Further, a plurality of drive mechanisms 92 for moving the upper pressure member 15 up and down are provided on the upper surface 91 of the upper pressure member 15. The drive mechanism 92 includes a shaft portion 93 whose length can be expanded and contracted, and a control unit (not shown). The shaft portion 93 includes a fixed shaft 94 connected to the upper pressure member 15 and a movable shaft 95 that is connected to the fixed shaft 94 and adjusts the length of the shaft portion 93. The movable shaft 95 can be stored inside the fixed shaft 94. Since the movable shaft 95 is movable in the vertical direction with respect to the fixed shaft 94, the length of the shaft portion 93 can be adjusted. With this configuration, the upper substrate W2 can be moved up and down. The upper chamber member 14 is appropriately formed with a through hole 98 through which the drive mechanism 92 is inserted. Further, a seal 99 is provided between the fixed shaft 94 and the through hole 98 of the upper chamber member 14 in order to ensure the airtightness of the chamber 17.

  A pressurizing mechanism 96 including an actuator, for example, is provided above the upper chamber member 14 above the drive mechanism 92. The pressurizing mechanism 96 is connected to the movable shaft 95. The pressure mechanism 96 can adjust the pressure applied to the upper pressure member so that an appropriate load can be applied when the lower substrate W1 and the upper substrate W2 are bonded to each other. The magnitude of the load applied to the substrates W1, W2 by the pressurizing mechanism 96 can be detected by a load cell.

  The movable shaft 95 is configured to be housed in the pressurizing mechanism 96 and may be adjustable in length. Further, a universal joint 90 (universal shaft joint) may be provided on the shaft portion 93. In this case, only the vertical force is applied to the upper pressure member 15. Further, the upper pressure member 15 is mainly guided by the second support rod 16. The load cell may be disposed adjacent to the universal joint 90, may be attached to the inside of the pressurizing mechanism 96, or may be attached between the shaft portion 93 and the upper pressurizing member 15.

(Function)
Next, a procedure for manufacturing a bonded substrate using the bonded substrate manufacturing apparatus 10 will be described with reference to FIGS. 3-10 is explanatory drawing which shows the process of manufacturing a bonded substrate using a bonded substrate manufacturing apparatus, and FIG. 11 is a flowchart which shows the process of manufacturing a bonded substrate.
Note that each step number described in the description below corresponds to the step number in FIG.
First, as shown in FIG. 3, the bonded substrate manufacturing apparatus 10 is held in a state in which the upper pressing member 15 is positioned at the uppermost position by the pressing mechanism 96. Further, the upper chamber member 14 and the lower chamber member 18 are held in a separated state.

In step S1, the lower substrate W1 is carried in by the robot arm in this state. A specific method for carrying in the lower substrate W1 will be described after step S2.
In step S <b> 2, the lower substrate W <b> 1 that has been transported by a robot arm (not shown) is placed above the placement table 31. Here, the lift pins 45 are raised to float the lower substrate W1 from the robot arm.

In step S <b> 3, the robot arm is retracted from the bonded substrate manufacturing apparatus 10.
In step S <b> 4, the lift pins 45 are lowered to place the lower substrate W <b> 1 on the upper surface 32 of the placement table 31.

In step S <b> 5, the upper substrate W <b> 2 that has been transported by a robot arm (not shown) is disposed below the holding surface 75 of the upper pressure member 15.
In step S6, the suction pin 57 is lowered to suck the upper substrate W2. In order to lower the suction pin 57, the upper shaft member 14 is lowered by driving the drive shaft 65 while holding the upper pressure member 15 at the uppermost position.
In step S <b> 7, the robot arm is retracted from the chamber 17.

In step S8, the upper pressure member 15 is lowered.
In step S <b> 9, the upper chuck member 77 of the upper pressurizing member 15 is caused to function to attract the upper substrate W <b> 2 to the holding surface 75. FIG. 4 is an explanatory diagram when the process up to step S9 is completed.
Note that either the step of carrying in the lower substrate W1 of steps S1 to S4 or the step of carrying in the upper substrate W2 of steps S5 to S9 may be performed first. However, since the upper substrate W2 may fall from the suction pins 57 at the time of loading, the upper substrate W2 can be prevented from being affected by the drop of the upper substrate W2 by first loading the upper substrate W2. In particular, when manufacturing a liquid crystal panel, it is desirable to carry in the upper substrate W2 first because the liquid crystal is applied to the upper surface of the lower substrate W1.

  Next, in step S10, as shown in FIG. 5, the drive shaft 65 is driven to lower the upper chamber member 14 toward the base portion 11 (lower substrate W1). At the same time, the lower chamber member 18 is raised toward the upper pressure member 15 (upper substrate W2).

The female screws 86 formed at the four corners of the upper chamber member 14 and the lower chamber member 18 are screwed into the left and right screws 85 of the shaft portion 67. For this reason, the upper chamber member 14 and the lower chamber member 18 are lowered and raised while maintaining the horizontal state. Then, the upper chamber member 14 and the lower chamber member 18 are moved until the bottom surface 52 of the wall portion 51 of the upper chamber member 14 and the top surface 43 of the wall portion 42 of the lower chamber member 18 come into contact with each other. That is, the upper chamber member 14 and the lower chamber member 18 form a hermetically sealed chamber 17 (processing chamber forming step).
As described above, the upper chamber member 14 and the lower chamber member 18 can be moved simultaneously in a direction in which they abut or separate from each other. For this reason, it is possible to cancel the force acting on the apparatus as the chamber members 14 and 18 move. Therefore, the durability of the bonded substrate manufacturing apparatus 10 including the shaft portion 67 can be improved. Furthermore, the opening / closing time of the chamber 17 can be shortened compared with the case where only one chamber member is moved.

  In step S11, substantially simultaneously with step S10, the upper pressing member 15 is lowered toward the base portion 11 (lower substrate W1) (first upper substrate moving step). At this time, the movable shaft 95 of the drive mechanism 92 moves so as to protrude from the fixed shaft 94. For this reason, the length of the axial part 93 becomes long and the upper pressurizing member 15 descends. The first support rod 16 is inserted through the guide guides 83 at the four corners of the upper pressure member 15. For this reason, the upper pressurizing member 15 descends while maintaining the horizontal state.

  The vertical movement speed of the upper chamber member 14 and the lower chamber member 18 is higher than the vertical movement speed of the upper pressure member 15. Therefore, when the upper chamber member 14 and the upper pressure member 15 are moved, the position of the upper pressure member 15 does not affect the loading / unloading of the substrate so that the upper chamber member 14 and the upper pressure member 15 do not interfere with each other. It is desirable to arrange it at a position as close to the base portion 11 as possible without any range.

  In step S12, the chamber 17 is evacuated as shown in FIG. Specifically, the vacuum pump 49 is operated, and the inside of the chamber 17 is exhausted from the exhaust hole 47 (decompression step). Then, the inside of the chamber 17 is kept in a vacuum state (about 0.4 Pa or less). If evacuation is performed in a state where the distance between the lower substrate W1 and the upper substrate W2 is sufficiently secured as in the present embodiment, conductance can be increased, the evacuation time can be shortened, and the space between the substrates W1 and W2 can be reduced. Air can be exhausted reliably.

In step S13, as shown in FIG. 7, after the evacuation in the chamber 17 is completed, the upper pressure member 15 is lowered again, and a predetermined interval (several hundred μm) is formed between the lower substrate W1 and the upper substrate W2. (Second upper substrate moving step).
In step S14, as shown in FIG. 8, the camera 80 is operated to photograph images with the sequential focus on the alignment marks M1 and M2 on the lower substrate W1 and the upper substrate W2. Then, the lower substrate W1 is moved in the horizontal plane direction so that the alignment marks M1 and M2 coincide with each other (substrate alignment step). At this time, based on the amount of misalignment between the alignment marks M1 and M2, the moving mechanism 29 is moved to move the lower substrate W1 to an appropriate position.

In step S15, after the alignment between the lower substrate W1 and the upper substrate W2 is completed, the upper pressing member 15 is further lowered.
In step S16, as shown in FIG. 9, the lower substrate W1 and the upper substrate W2 are bonded together (substrate bonding step). At this time, the pressing mechanism 96 applies a downward force to the upper pressing member 15 to pressurize both the substrates W1 and W2. Here, the load acting on both the substrates W1 and W2 is detected by the load cell, and adjustment is performed so that the substrates are bonded together with an appropriate load.

  In step S17, as shown in FIG. 10, when the bonding of the lower substrate W1 and the upper substrate W2 is completed, the upper chamber member 14 and the upper pressure member 15 are raised. At this time, the bonded substrate W3 is arranged on the base portion 11 (mounting table 31). That is, the function of the electrostatic chuck portion 77 of the upper pressing member 15 is released, and the upper substrate W2 is separated from the upper pressing member 15.

In step S <b> 18, the lift pins 45 of the base portion 11 are raised to raise the bonded substrate W <b> 3 from the upper surface 23.
In step S19, the robot arm is inserted into the gap between the bonded substrate W3 and the upper surface 23 of the base portion 11, and the bonded substrate W3 is delivered from the lift pins 45 to the robot arm. And a robot arm conveys the bonding board | substrate W3 to another apparatus which is not shown in figure, and a process is completed.

  According to this embodiment, the bonded substrate manufacturing apparatus 10 that manufactures the bonded substrate W3 by bonding the upper substrate W2 and the lower substrate W1 while aligning them: the base unit 11 that supports the lower substrate W1; A first support bar 16 erected from the portion 11; it can be moved up and down independently of the upper chamber member 14 and the lower chamber member 18 along the first support bar 16, and can hold the upper substrate W2. An upper pressure member 15; and an upper chamber member 14 and a lower chamber member 18 which are movable up and down independently of the upper pressure member 15 and constitute the chamber 17. By moving the upper pressing member 15, the upper substrate W <b> 2 and the lower substrate W <b> 1 can be bonded inside the chamber 17. The bonded substrate manufacturing apparatus 10 includes a second support bar 13 that supports the upper chamber member 14 and the lower chamber member 18. The upper chamber member 14 and the lower chamber member 18 are simultaneously movable in a direction in which they abut or separate from each other.

Therefore, the upper pressing member 15 holding the upper substrate W2 moves up and down while being guided by the first support rod 16 standing from the base portion 11 on which the lower substrate W1 is placed. For this reason, only a minimum number of members are interposed between the upper substrate W2 and the lower substrate W1. Accordingly, it is possible to prevent the relative positions of the upper substrate W2 and the lower substrate W1 from being shifted between the time when the upper substrate W2 and the lower substrate W1 are aligned and the time when they are bonded. Therefore, the alignment accuracy of the two substrates W1 and W2 can be improved, and the yield can be improved. Further, the upper pressurizing member 15 and the upper chamber member 14 and the lower chamber member 18 can be individually moved up and down. For this reason, the upper chamber member 14 and the lower chamber member 18 can be simultaneously moved up and down at high speed. The upper pressing member 15 can be moved minutely (moved up and down) when the substrates W1 and W2 are bonded.
That is, the alignment accuracy of the two substrates W1 and W2 can be improved and the production efficiency can be improved.

Moreover, the bonded substrate manufacturing apparatus 10 includes a drive shaft 65 in which left and right screws 85 having different directions are formed. The upper chamber member 14 and the lower chamber member 18 are respectively screwed into left and right screws 85 formed in the drive shaft 65 in different directions. By rotating the drive shaft 65, the upper chamber member 14 and the lower chamber member 18 can move simultaneously in a direction in which they abut or separate from each other.
Therefore, the upper chamber member 14 and the lower chamber member 18 can be moved with a simple configuration. That is, an increase in the number of parts of the apparatus can be suppressed, and the manufacturing cost of the bonded substrate manufacturing apparatus 10 can be suppressed.

  The upper chamber member 14 is provided with suction pins 57 for sucking the upper substrate W2. Therefore, the upper substrate W2 can be moved up and down with the upper chamber member 14 at high speed until the upper substrate W2 is held by the upper pressure member 15. Thereafter, the upper substrate W2 can be finely moved (moved up and down) by the upper pressing member 15. Therefore, production efficiency can be improved.

  Further, the base unit 11 is provided with a substrate alignment mechanism 20 including a mounting table 31 for mounting the lower substrate W1 and a moving mechanism 29 for moving the mounting table 31. Therefore, the lower substrate W1 can be stably held, and the alignment between the lower substrate W1 and the upper substrate W2 can be performed with high accuracy.

  The substrate alignment mechanism 20 was disposed in the chamber 17. For this reason, interference with the substrate alignment mechanism 20 can be prevented when the lower chamber member 18 is moved up and down. Therefore, the chamber 17 can be reliably formed without complicating the apparatus configuration of the bonded substrate manufacturing apparatus 10.

(Second embodiment)
Next, the bonded substrate manufacturing apparatus which concerns on 2nd embodiment of this invention is demonstrated based on FIGS. The present embodiment is different from the first embodiment only in the means for placing the lower substrate W1, and the other components are substantially the same. Therefore, the same portions are denoted by the same reference numerals and detailed description thereof is omitted. To do.
FIG. 12 is a schematic front view of the bonded substrate manufacturing apparatus, and FIG. 13 is a cross-sectional view taken along line BB in FIG. As shown in FIGS. 12 and 13, the upper surface 123 of the base 111 is formed in a rectangular shape in plan view, and the lower substrate W1 can be placed thereon. A driving base 125 capable of moving the lower substrate W1 in the vertical direction, the orthogonal biaxial horizontal direction, and the horizontal rotation direction (hereinafter referred to as a horizontal plane direction) is provided at a substantially central portion of the upper surface 123 in plan view.

  The drive base 125 is disposed in a recess 124 formed on the upper surface 123 of the base portion 111. The drive base 125 is substantially circular in plan view. A cavity 128 is formed inside the drive base 125. A plurality of air holes 127 are formed at the upper end of the cavity 128. The cavity 128 is connected to an exhaust pipe 129 provided therebelow. The exhaust pipe 129 extends from the lower surface 121 through the base portion 111 and is connected to an exhaust pump (not shown). That is, when the exhaust pump is moved in a state where the lower substrate W1 is placed on the drive base 125, the lower substrate W1 can be brought into close contact with the drive base 125 through the air holes 127. A valve 130 is provided in the middle of the exhaust pipe 129 so that the exhaust amount can be adjusted.

  A first moving mechanism 131 for moving the drive base 125 in the horizontal plane is provided below the drive base 125. Below the first moving mechanism 131, a second moving mechanism 132 for moving the drive base 125 in the vertical direction is provided. The driving method of the first moving mechanism 131 and the second moving mechanism 132 is not particularly limited. In the present embodiment, the first moving mechanism 131 is moved in the horizontal plane using an actuator mechanism, and the second moving mechanism 132 has a wedge. The drive base 125 is moved in the vertical direction by moving the shaped member.

Next, a plurality of air pads 135 (14 in this embodiment) are provided on the upper surface 123 of the base portion 111 at positions corresponding to the planar size of the lower substrate W1. The air pad 135 is disposed in a recess 136 formed on the upper surface 123 of the base portion 111.
The air pad 135 is substantially circular in plan view. A cavity 139 is formed inside the air pad 135. A plurality of air holes 138 are formed at the upper end of the cavity 139. The cavity 139 is connected to an air supply / exhaust pipe 140 provided therebelow. The supply / exhaust pipe 140 extends from the lower surface 121 through the base portion 111 and is connected to a supply / exhaust pump (not shown). That is, when the air is supplied in a state where the lower substrate W1 is placed on the base portion 111, air is ejected from the air holes 138 toward the lower substrate W1, and the lower substrate W1 can be floated. On the other hand, if the exhaust is performed while the lower substrate W1 is placed on the base portion 111, the lower substrate W1 can be brought into close contact with the base portion 111 through the air holes 138. Therefore, the drive base 125 and the air pad 135 are configured as the substrate alignment mechanism 120 for moving the lower substrate W1 in the horizontal plane direction. In addition, a valve 141 is provided in the middle of the air supply / exhaust pipe 140, whereby the supply / exhaust amount can be adjusted. Further, the surface 126 of the drive base 125 and the surface 137 of the air pad 135 are flush with each other at normal times.

(Function)
Next, a part of a procedure for manufacturing a bonded substrate using the bonded substrate manufacturing apparatus 110 will be described with reference to FIG. FIG. 14 is a flowchart showing a process of manufacturing a bonded substrate.
In step S1, the lower substrate W1 is carried in by the robot arm. A specific method for carrying in the lower substrate W1 will be described after step S2.
In step S <b> 2, the lower substrate W <b> 1 transported by a robot arm (not shown) is disposed above the base unit 111. Here, the lift pins 145 are raised to lift the lower substrate W1 from the robot arm.

In step S <b> 3, the robot arm is retracted from the bonded substrate manufacturing apparatus 10.
In step S <b> 4, the lift pins 145 are lowered to place the lower substrate W <b> 1 on the upper surface 123 of the base portion 111. At this time, the lower substrate W <b> 1 is adsorbed to the drive base 125 by exhausting from the exhaust pipe 129.

Steps S5 to S9 are substantially the same as those in the first embodiment, and thus description thereof is omitted.
Note that either the step of carrying in the lower substrate W1 of steps S1 to S4 or the step of carrying in the upper substrate W2 of steps S5 to S9 may be performed first.
In step S10, as shown in FIG. 5, the drive shaft 65 is driven to lower the upper chamber member 14 toward the base portion 11 (lower substrate W1), and the lower chamber member 18 is moved to the upper pressure member 15 ( Raise toward the upper substrate W2).
Since the female screws 86 formed at the four corners of the upper chamber member 14 and the lower chamber member 18 are screwed into the left and right screws 85 of the shaft portion 67, the upper chamber member 14 and the lower chamber member 18 are in a horizontal state. Move down and up while holding. Then, the upper chamber member 14 and the lower chamber member 18 are moved until the bottom surface 52 of the wall portion 51 of the upper chamber member 14 and the top surface 43 of the wall portion 42 of the lower chamber member 18 come into contact with each other. That is, the upper chamber member 14 and the lower chamber member 18 form a hermetically sealed chamber 17 (processing chamber forming step).
In this way, the upper chamber member 14 and the lower chamber member 18 can move simultaneously in the direction in which they abut or separate from each other, so that the force acting on the apparatus as both chamber members 14 and 18 move is canceled out. Can do. Therefore, the durability of the bonded substrate manufacturing apparatus 10 including the shaft portion 67 can be improved. Furthermore, the opening / closing time of the chamber 17 can be shortened compared with the case where only one chamber member is moved.

  In step S11, the lower substrate W1 is raised (first lower substrate moving step). Specifically, the second moving mechanism 132 provided on the base portion 111 is moved to move the drive base 125 upward. At substantially the same time, air is supplied to the air pad 135, and air is ejected from the air hole 138 toward the lower substrate W1. Then, the lower substrate W <b> 1 is lifted substantially at the center by the drive base 125, and the peripheral portion of the lower substrate W <b> 1 floats due to the action of the air pad 135. In this way, the lower substrate W1 is held in a horizontal state. At this time, the lower substrate W1 is levitated from the upper surface 123 by about several tens of μm.

  In step S12, substantially simultaneously with step S11, the upper pressing member 15 is lowered toward the base portion 111 (lower substrate W1) (first upper substrate moving step). At this time, the movable shaft 95 of the drive mechanism 92 moves so as to protrude from the fixed shaft 94, so that the length of the shaft portion 93 is increased and the upper pressurizing member 15 is lowered. Since the first support rod 16 is inserted into the guide guides 83 at the four corners of the upper pressure member 15, the upper pressure member 15 is lowered while maintaining the horizontal state.

  In step S13, the camera 80 is actuated so that the alignment marks M1 and M2 on the lower substrate W1 and the upper substrate W2 are sequentially focused and photographed. Then, the lower substrate W1 is moved in the horizontal plane direction so that the alignment marks M1 and M2 coincide with each other (substrate alignment step). At this time, based on the amount of misalignment between the alignment marks M1 and M2, the drive base 125 is moved in the horizontal plane direction to move the lower substrate W1 to an appropriate position.

In step S14, when the alignment between the lower substrate W1 and the upper substrate W2 is completed, the drive base 125 of the lower substrate W1 is lowered. At the same time, the supply of air to the air pad 135 is stopped, and the lower substrate W1 is lowered to the upper surface 123 of the base portion 111. Then, air is exhausted from the air pad 135 and the lower substrate W1 is adsorbed to the upper surface 123. Thus, the lower substrate W1 is fixed so as not to be displaced (second lower substrate moving step). Thereafter, the upper pressure member 15 is moved slightly upward (second upper substrate moving step). In this way, the distance between the lower substrate W1 and the upper substrate W2 is made longer than that during alignment. This is for increasing the conductance and shortening the evacuation time and evacuating the air between the substrates W1 and W2 during the subsequent evacuation of the chamber 17.
In step S15, the inside of the chamber 17 is evacuated (decompression step).

In step S16, after the evacuation in the chamber 17 is completed, the upper pressure member 15 is lowered again.
In step S17, the lower substrate W1 and the upper substrate W2 are bonded together (substrate bonding step).
At this time, the substrates W1 and W2 are pressurized by the pressurizing mechanism 96. Here, the load cell detects the load acting on both the substrates W1, W2, and adjusts so that the substrates are bonded together with an appropriate load.

  In step S18, when the bonding of the lower substrate W1 and the upper substrate W2 is completed, the upper chamber member 14 and the upper pressure member 15 are raised. At this time, the bonded substrate W3 is disposed on the base 111. That is, the function of the electrostatic chuck portion 77 of the upper pressing member 15 is released, and the upper substrate W2 is separated from the upper pressing member 15.

In step S19, the lift pins 145 of the base portion 111 are raised, and the bonded substrate W3 is raised from the upper surface 123.
In step S20, the robot arm is inserted into the gap between the bonded substrate W3 and the upper surface 123 of the base portion 111, and the bonded substrate W3 is delivered from the lift pins 145 to the robot arm.
And a robot arm conveys the bonding board | substrate W3 to another apparatus which is not shown in figure, and a process is completed. Even if comprised in this way, the position alignment precision of the two board | substrates W1 and W2 can be improved similarly to 1st embodiment, and a yield can be improved.

  Further, according to the present embodiment, the drive base 125 that moves the lower substrate W1 while attracting a part of the lower substrate W1 to the base portion 111, and the remaining portion of the lower substrate W1 when the lower substrate W1 is moved by the drive base 125 , And an air pad 135 capable of adsorbing the remaining portion of the lower substrate W1 when the upper substrate W2 and the lower substrate W1 are bonded to each other.

  Since it comprised in this way, when aligning an upper board | substrate and a lower board | substrate, a lower board | substrate can be levitated from a base part with the lower board | substrate levitation adsorption apparatus (air pad 135). Therefore, the lower substrate can be easily moved by the lower substrate suction device (drive base 125). On the other hand, when the upper substrate W <b> 2 and the lower substrate W <b> 1 are bonded together, the lower substrate W <b> 1 can be adsorbed to the base portion 111 by the drive base 125. Therefore, the position shift of the lower substrate W1 can be prevented, and the upper substrate W2 and the lower substrate W1 can be bonded together with high accuracy. In addition, since a table for placing the lower substrate W1 is not required separately, the number of components interposed between the base portion 111 and the lower substrate W1 can be reduced. Further, when the lower substrate W1 is attracted to the base portion 111, the drive base 125 and the air pad 135 are not exposed to the chamber 17, so that particles generated from each device can be prevented from flowing into the chamber 17. Therefore, the cleanliness in the chamber 17 can be ensured.

It should be noted that the technical scope of the present invention is not limited to the above-described embodiment, and includes those in which various modifications are made to the above-described embodiment without departing from the spirit of the present invention. That is, the specific shapes, configurations, and the like given in the embodiment are merely examples, and can be changed as appropriate.
For example, in the present embodiment, the moving mechanism is configured to be movable only in the horizontal direction, but may be configured to be movable in the vertical direction.
In the present embodiment, similarly to the upper chamber member, a screw is formed on the first support rod of the upper pressure member, and the upper pressure member can be moved up and down by rotating the first support rod. May be.
Further, in the present embodiment, the case where the upper chamber member and the lower chamber member are configured to move up and down along the drive shaft has been described. However, the upper chamber member and the lower chamber member are configured to be movable in opposite directions by a moving mechanism such as an actuator. Also good.

  ADVANTAGE OF THE INVENTION According to this invention, it can prevent that the relative positional relationship of an upper board | substrate and a lower board | substrate shift | deviates between after aligning an upper board | substrate and a lower board | substrate, and bonding. Therefore, there is an effect of improving the alignment accuracy of the two substrates and improving the yield. Further, the upper chamber member and the lower chamber member can be moved up and down at high speed simultaneously. Further, the upper pressurizing member can be moved minutely (vertically moved) when the substrates are bonded. That is, it is possible to improve the alignment accuracy of the two substrates and to improve the production efficiency. Moreover, it becomes possible to cancel the force which acts on an apparatus with the movement of both chamber members, and it can improve the reliability of a bonded substrate manufacturing apparatus. Furthermore, compared with the case where only one chamber member is moved, the opening / closing time of the bonding processing chamber can be shortened.

Claims (8)

A bonded substrate manufacturing apparatus for aligning and bonding an upper substrate and a lower substrate to produce a bonded substrate:
A base portion supporting the lower substrate;
A first support rod erected from the base portion;
An upper pressurizing member that is movable up and down along the first support rod and capable of holding the upper substrate;
A laminating process chamber including an upper chamber member and a lower chamber member that are movable up and down independently of the upper pressure member;
By moving the upper pressing member, it is possible to bond the upper substrate and the lower substrate inside the bonding processing chamber,
The bonded substrate manufacturing apparatus, wherein the upper chamber member and the lower chamber member are simultaneously movable in a contact direction or a separation direction. It is a bonded substrate manufacturing apparatus of Claim 1, Comprising:
A drive shaft including a first screw portion and a second screw portion of different orientations;
The upper chamber member and the lower chamber member are respectively screwed into the first screw portion and the second screw portion,
By rotating the drive shaft, the upper chamber member and the lower chamber member can be simultaneously moved in a direction in which they abut or separate from each other. The bonded substrate manufacturing apparatus according to claim 1 or 2,
The bonded substrate manufacturing apparatus, wherein the upper chamber member includes a suction pin for sucking the upper substrate. It is the bonded substrate manufacturing apparatus in any one of Claims 1-3,
The base is:
(A) a mounting table for mounting the lower substrate;
(B) a moving mechanism for moving the mounting table;
An apparatus for manufacturing a bonded substrate, comprising: a substrate alignment mechanism including: It is the bonded substrate manufacturing apparatus in any one of Claims 1-3,
The base is:
(A) a lower substrate suction device that sucks the first portion of the lower substrate and moves the lower substrate;
(B) The second part of the lower substrate is levitated when the lower substrate is moved by the lower substrate adsorption device, and the second part of the lower substrate is adsorbed when the upper substrate and the lower substrate are bonded together. A substrate floating adsorption device;
An apparatus for manufacturing a bonded substrate, comprising: a substrate alignment mechanism including: It is a bonded substrate manufacturing apparatus of Claim 4 or 5,
The bonded substrate manufacturing apparatus, wherein the substrate alignment mechanism is arranged in the bonded processing chamber. A method for producing a bonded substrate comprising:
Supporting the lower substrate by the base portion;
A step of holding the upper substrate by an upper pressurizing member that can move up and down along a first support rod provided upright from the base portion;
An upper chamber member and a lower chamber member that can be moved up and down independently from the upper pressurizing member are simultaneously moved in the abutting direction to form a bonding processing chamber in which the upper substrate and the lower substrate are accommodated. A processing chamber forming step;
A first upper substrate moving step of lowering the upper pressure member and holding the lower substrate and the upper substrate spaced apart by a first predetermined distance;
A depressurization step of depressurizing the inside of the bonding treatment chamber;
A second upper substrate moving step of lowering the upper pressure member and holding the lower substrate and the upper substrate spaced apart by a second predetermined distance;
A substrate alignment step of aligning the lower substrate with the upper substrate by moving the lower substrate by moving a mounting table for mounting the lower substrate by a moving mechanism provided in the base portion. When;
And a substrate laminating step of laminating the upper pressurizing member to bond the lower substrate and the upper substrate together. A method for producing a bonded substrate comprising:
Supporting the lower substrate by the base portion;
A step of holding the upper substrate by an upper pressurizing member that can move up and down along a first support rod provided upright from the base portion;
An upper chamber member and a lower chamber member that can be moved up and down independently from the upper pressurizing member are simultaneously moved in the abutting direction to form a bonding processing chamber in which the upper substrate and the lower substrate are accommodated. A processing chamber forming step;
A lower substrate adsorption device installed in the base unit adsorbs a first part of the lower substrate, separates the lower substrate from the base unit, and a lower substrate floating adsorption device installed in the base unit A first lower substrate moving step of levitating the second part of the substrate;
A first upper substrate moving step of lowering the upper pressure member and holding the lower substrate and the upper substrate spaced apart by a first predetermined distance;
A substrate alignment step of aligning the lower substrate and the upper substrate by moving the lower substrate by the lower substrate suction device;
A second upper substrate moving step of raising the upper pressure member and holding the lower substrate and the upper substrate spaced apart by a second predetermined distance;
Second lower substrate movement for sucking a part of the lower substrate by the lower substrate suction device, bringing the lower substrate into contact with the base portion, and sucking the second portion of the lower substrate by the lower substrate floating suction device Process and;
A depressurization step of depressurizing the inside of the bonding treatment chamber;
And a substrate laminating step of laminating the upper pressurizing member to bond the lower substrate and the upper substrate together.

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