WO2010005246A3 - Substrate-conveying device - Google Patents

Substrate-conveying device Download PDF

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Publication number
WO2010005246A3
WO2010005246A3 PCT/KR2009/003759 KR2009003759W WO2010005246A3 WO 2010005246 A3 WO2010005246 A3 WO 2010005246A3 KR 2009003759 W KR2009003759 W KR 2009003759W WO 2010005246 A3 WO2010005246 A3 WO 2010005246A3
Authority
WO
WIPO (PCT)
Prior art keywords
substrate
conveyed
conveying device
workbench
conveying
Prior art date
Application number
PCT/KR2009/003759
Other languages
French (fr)
Korean (ko)
Other versions
WO2010005246A9 (en
WO2010005246A2 (en
Inventor
신동혁
Original Assignee
(주)인아텍
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by (주)인아텍 filed Critical (주)인아텍
Priority to JP2011517350A priority Critical patent/JP2011527823A/en
Priority to CN200980126390.4A priority patent/CN102113108B/en
Publication of WO2010005246A2 publication Critical patent/WO2010005246A2/en
Publication of WO2010005246A3 publication Critical patent/WO2010005246A3/en
Publication of WO2010005246A9 publication Critical patent/WO2010005246A9/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67748—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber horizontal transfer of a single workpiece
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67751—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber vertical transfer of a single workpiece
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance

Abstract

One problem associated with substrate-conveying devices is that, when a first substrate (1) has been placed on a supply lift (11) and is being conveyed from an upper workbench (10) to a lower workbench (20), a wait is imposed on a second substrate (2) which has finished undergoing an ultraviolet cleaning process on the upper workbench (10) as shown in Figure 2, and, consequently, productivity is reduced due to the delay in supplying other substrates through a supply and discharge part (15). The present invention comprises a substrate-conveying device in which a substrate supplied from an upper first position is conveyed to a height at a lower second position, and the substrate which has been conveyed to the second lower position is moved and discharged by means of a conveying rail; wherein the substrate-conveying device is constructed in such a way that first and second upper rotational supports and first and second lower rotational supports rotate in a state in which they are spaced apart from each other vertically.
PCT/KR2009/003759 2008-07-11 2009-07-09 Substrate-conveying device WO2010005246A2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2011517350A JP2011527823A (en) 2008-07-11 2009-07-09 Substrate transfer device
CN200980126390.4A CN102113108B (en) 2008-07-11 2009-07-09 Substrate-conveying device

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2008-0067805 2008-07-11
KR1020080067805A KR100885877B1 (en) 2008-07-11 2008-07-11 A base plate transfer method and apparatus

Publications (3)

Publication Number Publication Date
WO2010005246A2 WO2010005246A2 (en) 2010-01-14
WO2010005246A3 true WO2010005246A3 (en) 2010-04-29
WO2010005246A9 WO2010005246A9 (en) 2010-07-08

Family

ID=40682178

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2009/003759 WO2010005246A2 (en) 2008-07-11 2009-07-09 Substrate-conveying device

Country Status (5)

Country Link
JP (1) JP2011527823A (en)
KR (1) KR100885877B1 (en)
CN (1) CN102113108B (en)
TW (1) TWI370798B (en)
WO (1) WO2010005246A2 (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101069154B1 (en) 2009-05-28 2011-09-30 주식회사 케이씨텍 Apparatus for processing substrate
KR101078487B1 (en) 2009-09-17 2011-10-31 김재석 vacuum suction unit for pannel and vacuum suction with plural rubber pads
EP2522028B1 (en) 2010-01-08 2018-03-28 KLA-Tencor Corporation Dual tray carrier unit
US9435826B2 (en) 2012-05-08 2016-09-06 Kla-Tencor Corporation Variable spacing four-point probe pin device and method
CN104619619B (en) * 2012-09-10 2017-08-11 应用材料公司 The method of base plate transmission device and moving substrate
CN109160210A (en) * 2018-09-25 2019-01-08 中国建材国际工程集团有限公司 Plate storing/conveying system and its application method
CN112239069A (en) * 2019-07-19 2021-01-19 亚智科技股份有限公司 Forked substrate conveying device and method thereof
CN111848218B (en) * 2020-07-30 2022-11-08 固安浩瀚光电科技有限公司 Semiconductor ceramic soaking and drying integrated device and using method thereof
CN116946487A (en) * 2023-09-20 2023-10-27 长春市景来科技有限公司 Artificial intelligence commodity circulation parcel packing plant

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100617453B1 (en) * 2006-04-27 2006-09-01 주식회사 인아텍 A base plate transfer system
KR100617454B1 (en) * 2006-02-23 2006-09-05 주식회사 인아텍 A base plate transfer system and transfer method using it
JP2007035792A (en) * 2005-07-25 2007-02-08 Tokyo Electron Ltd Conveying apparatus for substrate
JP2007176631A (en) * 2005-12-27 2007-07-12 Tokyo Electron Ltd Substrate conveying system
KR100839570B1 (en) * 2007-12-31 2008-06-20 주식회사 인아텍 A base plate transfer method and apparatus

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2913354B2 (en) * 1993-02-26 1999-06-28 東京エレクトロン株式会社 Processing system
JP4476133B2 (en) * 2005-02-24 2010-06-09 東京エレクトロン株式会社 Processing system

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007035792A (en) * 2005-07-25 2007-02-08 Tokyo Electron Ltd Conveying apparatus for substrate
JP2007176631A (en) * 2005-12-27 2007-07-12 Tokyo Electron Ltd Substrate conveying system
KR100617454B1 (en) * 2006-02-23 2006-09-05 주식회사 인아텍 A base plate transfer system and transfer method using it
KR100617453B1 (en) * 2006-04-27 2006-09-01 주식회사 인아텍 A base plate transfer system
KR100839570B1 (en) * 2007-12-31 2008-06-20 주식회사 인아텍 A base plate transfer method and apparatus

Also Published As

Publication number Publication date
TW201006748A (en) 2010-02-16
CN102113108A (en) 2011-06-29
CN102113108B (en) 2013-07-10
WO2010005246A9 (en) 2010-07-08
JP2011527823A (en) 2011-11-04
KR100885877B1 (en) 2009-02-26
TWI370798B (en) 2012-08-21
WO2010005246A2 (en) 2010-01-14

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