KR101177090B1 - Bonding substrate manufacturing apparatus and bonding substrate manufacturing method - Google Patents

Abstract

A bonded substrate manufacturing apparatus of the present invention, the bonded substrate manufacturing apparatus for manufacturing a bonded substrate by bonding while positioning the upper substrate and the lower substrate, the base portion for supporting the lower substrate; A chamber member configured to be movable up and down and forming a bonding processing chamber together with the base portion; A support rod erected on the base portion; An upper pressurizing member capable of holding the upper substrate while being movable up and down independently from the chamber member along the support rod; and by moving the upper pressurizing member, the upper substrate and the lower substrate are joined inside the bonding processing chamber. .

Description

Bonding substrate manufacturing apparatus and bonding substrate manufacturing method

The present invention relates to a bonded substrate manufacturing apparatus and a bonded substrate manufacturing method.

This application claims priority based on Japanese Patent Application No. 2007-291946 for which it applied to Japan on November 9, 2007, and uses the content here.

Flat panel displays (FPD), such as a liquid crystal display and a plasma display, have the structure which bonded two board | substrates together. For example, in a liquid crystal display, an array substrate (TFT substrate) in which a plurality of TFTs (thin film transistors) are formed in a matrix form and a color filter substrate (CF substrate) in which a color filter, a light shielding film, etc. are formed are arranged to face each other at intervals of several μm. The liquid crystal is sealed between the two substrates, and at the same time, the two substrates are bonded to each other by a sealing member (adhesive) containing a photocurable resin. The two substrates are bonded in a vacuum environment in order to prevent mixing of impurity gas and the like.

As an apparatus which joins these 2 board | substrates, the board | substrate bonding apparatus of patent document 1 is known, for example. The substrate bonding apparatus of patent document 1 is a vacuum chamber comprised by an upper container and a lower container, the upper board conveyance jig for moving an upper board, the 1st support rod for moving an upper container up and down, and the base board on which the support bar is supported. And a second supporting rod for moving the upper substrate transport jig up and down.

In the substrate bonding apparatus, the first support bar is moved downward to contact the upper container and the lower container to form a vacuum chamber, and the second support bar is moved downward to face the upper substrate and the lower substrate at predetermined intervals. Lower the upper substrate transport jig so as to be disposed. Thereafter, the upper substrate and the lower substrate are aligned to join them.

Patent Document 1: Japanese Patent Application Laid-Open No. 2007-212572

In the bonded substrate manufacturing apparatus of patent document 1, after making the inside of a process chamber into a vacuum state, the upper board | substrate and the lower board are aligned, and these two board | substrates are bonded. However, if the upper substrate conveying jig is moved by moving the second supporting rod mounted on the base plate after the upper substrate and the lower substrate are aligned, there is a possibility that the position of the upper substrate and the lower substrate is relatively displaced. This is because a plurality of members are interposed between the base plate and the lower substrate so that the lower container on which the lower substrate is disposed and the base plate on which the second supporting rod is mounted move differently. As such, the relative position of the upper substrate and the lower substrate is shifted, resulting in a decrease in yield.

This invention is made | formed in view of the above-mentioned situation, and makes it a subject to provide the bonded substrate manufacturing apparatus and the bonded substrate manufacturing method which can improve the alignment accuracy of two board | substrates, and improve a yield.

MEANS TO SOLVE THE PROBLEM This invention employ | adopted the following means in order to solve the said subject and achieve this objective.

(1) A bonded substrate manufacturing apparatus of the present invention, comprising: a bonded substrate manufacturing apparatus for manufacturing a bonded substrate by bonding an upper substrate and a lower substrate while positioning the base substrate for supporting the lower substrate; A chamber member which is movable up and down and together with the base to form a bonding processing chamber; A support rod erected on the base portion; And an upper pressurizing member capable of holding the upper substrate while being able to move up and down independently of the chamber member along the supporting rod, and the upper pressurizing member moves so that the upper substrate and the lower substrate are joined inside the joining processing chamber. do.

According to the bonded substrate manufacturing apparatus described in (1), the upper pressing member holding the upper substrate is guided by a supporting rod standing on the base portion on which the lower substrate is placed, and moves up and down, so that it is interposed between the upper substrate and the lower substrate. The number of members to be made can be suppressed to the minimum. As a result, it is possible to prevent the relative position of the upper substrate and the lower substrate from shifting from the alignment of the upper substrate to the lower substrate until the bonding. As a result, the alignment accuracy of two board | substrates can be improved and a yield can be improved. In addition, since the upper pressing member and the chamber member can be moved up and down separately, the chamber member can be moved up and down at high speed, and the upper pressing member can make a small movement (up and down movement) at the time of bonding the substrate. . In other words, the alignment accuracy of the two substrates is improved and the production efficiency is improved.

(2) It is preferable that an adsorption pin for adsorbing the upper substrate is provided on the chamber member.

In the case of (2), the suction pin can be moved up and down in conjunction with the vertical movement of the chamber member. In addition, by moving the upper pressing member up and down independently from the chamber member, it is possible to exchange the upper substrate from the suction pin to the upper pressing member. Therefore, the up-and-down moving mechanism unique to the suction pin becomes unnecessary, and an increase in manufacturing cost can be suppressed.

(3) Preferably, a mounting table for placing the lower substrate on the base portion and a moving mechanism for moving the mounting table are provided.

In the case of (3), since the lower substrate is placed on the seating table, the lower substrate can be held stably, and the lower substrate and the upper substrate can be accurately aligned.

(4) a lower substrate adsorption device for moving the lower substrate while adsorbing a portion of the lower substrate to the base part, and the lower substrate adsorption device for the lower substrate when the lower substrate is moved by the lower substrate adsorption device; It is preferable that a lower substrate floating adsorption device capable of floating the unadsorbed portion and adsorbing the lower substrate adsorption device and the non-adsorbed portion of the lower substrate when the upper substrate and the lower substrate are bonded to each other is provided. .

In the case of (4) above, when the upper substrate and the lower substrate are aligned, the lower substrate can be raised from the base portion by the lower substrate floating adsorption device. Therefore, the lower substrate can be easily moved by the lower substrate adsorption device. When joining the upper substrate and the lower substrate, the lower substrate can be adsorbed to the base portion by the lower substrate floating adsorption device. Therefore, the position shift of the lower substrate can be prevented, and the upper substrate and the lower substrate can be bonded with high precision. In addition, since a table for placing the lower substrate is not required separately, the number of parts interposed between the base portion and the lower substrate can be reduced.

In addition, when the lower substrate is adsorbed to the base portion, the lower substrate adsorption device and the lower substrate floating adsorption device are not exposed to the bonding processing chamber, so that particles and the like generated in each device can be prevented from entering the bonding processing chamber. Therefore, the cleanliness in the joining process chamber can be secured.

(5) In the method of manufacturing a bonded substrate of the present invention, the lower substrate is supported by the base portion, and the upper substrate is held by the upper pressing member which is movable up and down along the support rod erected from the base portion, A bonded substrate manufacturing method for manufacturing a bonded substrate by bonding the lower substrate and the upper substrate while positioning the lower substrate and the upper substrate in an interior of a bonding processing chamber constituted by a chamber member movable up and down independently. A process chamber forming step of forming a bonding process chamber in which the upper substrate and the lower substrate are accommodated by a base part and the chamber member; A first upper substrate moving step of lowering the upper pressurizing member and disposing the lower substrate and the upper substrate by a predetermined distance; A decompression step of depressurizing the inside of the bonding processing chamber; A second upper substrate moving step of lowering the upper pressing member so as to face the lower substrate and the upper substrate at predetermined intervals; A substrate alignment step of moving the lower substrate by moving the seating table on which the lower substrate is placed by a moving mechanism provided in the base portion, thereby positioning the lower substrate and the upper substrate; And a substrate bonding process of bonding the lower substrate and the upper substrate by lowering the upper pressing member.

According to the bonded substrate manufacturing method described in (5) above, the upper pressing member on which the upper substrate is held is guided by a support rod standing on the base portion on which the seating table on which the lower substrate is placed is placed and moved up and down. Therefore, the number of members interposed between the upper substrate and the lower substrate can be minimized. As a result, the positional relationship between the upper substrate and the lower substrate can be prevented from shifting between the upper substrate and the lower substrate until the bonding is performed. Therefore, the yield accuracy can be improved by improving the alignment accuracy of two board | substrates.

In addition, since the upper pressing member and the chamber member can be moved up and down separately, the chamber member can be moved up and down at high speed, and the upper pressing member can make a small movement (up and down movement) at the time of bonding the substrate. . In other words, the alignment accuracy of the two substrates is improved and the production efficiency is improved.

In addition, since the bonding processing chamber is decompressed in a state where the lower substrate and the upper substrate are spaced apart by a predetermined distance, the conductance can be reduced in a state where the conductance is large. Thereby, the decompression time can be shortened.

After depressurizing the inside of the bonding processing chamber, the lower substrate and the upper substrate can be aligned by the moving mechanism. Therefore, after aligning the lower substrate and the upper substrate, there is no need to raise the upper pressurizing member again, thereby improving production efficiency.

Since the lower substrate is placed on the seating table, the lower substrate can be held stably, and the lower substrate and the upper substrate can be accurately aligned.

(6) In the method of manufacturing a bonded substrate of the present invention, the lower substrate is supported by the base portion, and the upper substrate is held by the upper pressing member which is movable up and down along the support rod erected from the base portion, A bonded substrate manufacturing method for manufacturing a bonded substrate by bonding the lower substrate and the upper substrate while positioning the lower substrate and the upper substrate in an interior of a bonding processing chamber constituted by a chamber member movable up and down independently. A process chamber forming step of forming a bonding process chamber in which the upper substrate and the lower substrate are accommodated by a base part and the chamber member; While separating the lower substrate from the base portion while absorbing a portion of the lower substrate by the lower substrate adsorption device provided in the base portion, the lower substrate of the lower substrate by the lower substrate floating adsorption apparatus installed in the base portion A first lower substrate moving step of floating the substrate adsorption device and the non-adsorbed portion; A first upper substrate moving step of lowering the upper pressurizing member so as to face the lower substrate and the upper substrate at predetermined intervals; A substrate alignment step of moving the lower substrate by the lower substrate adsorption device to perform alignment of the lower substrate and the upper substrate; A second upper substrate moving step of raising the upper pressing member to space the lower substrate and the upper substrate by a predetermined distance; The lower substrate is brought into contact with the base part while adsorbing a portion of the lower substrate by the lower substrate adsorption device and is not adsorbed with the lower substrate adsorption device of the lower substrate by the lower substrate floating adsorption device. A second lower substrate moving step of adsorbing the base to the base; A decompression step of depressurizing the inside of the bonding processing chamber; And a substrate bonding process of bonding the lower substrate and the upper substrate by lowering the upper pressing member.

According to the bonded substrate manufacturing method described in (6) above, since the upper pressing member holding the upper substrate is guided by a supporting rod standing on the base portion on which the lower substrate is placed, and moves up and down, it is interposed between the upper substrate and the lower substrate. The number of members to be made can be suppressed to the minimum. As a result, the positional relationship between the upper substrate and the lower substrate can be prevented from shifting between the upper substrate and the lower substrate until the bonding is performed.

Therefore, the yield accuracy can be improved by improving the alignment accuracy of two board | substrates.

In addition, since the bonding processing chamber is depressurized after raising the upper pressurizing member so that the lower substrate and the upper substrate are spaced apart by a predetermined distance, the conductance can be reduced in a state where the conductance is large. Thereby, the decompression time can be shortened.

When the upper substrate and the lower substrate are aligned, the lower substrate can be lifted from the base by the lower substrate floating adsorption device. Therefore, the lower substrate can be easily moved by the lower substrate adsorption device. When joining the upper substrate and the lower substrate, the lower substrate can be adsorbed to the base portion by the lower substrate floating adsorption device. Therefore, the position shift of the lower substrate can be prevented, and the upper substrate and the lower substrate can be bonded with high precision. In addition, since a table for placing the lower substrate is not required separately, the number of parts interposed between the base portion and the lower substrate can be reduced. In addition, when the lower substrate is adsorbed to the base portion, the lower substrate adsorption device and the lower substrate floating adsorption device are not exposed to the bonding processing chamber, so that particles and the like generated in each device can be prevented from entering the bonding processing chamber. Therefore, the upper substrate and the lower substrate can be bonded together while the cleanliness in the bonding processing chamber is secured.

According to the bonded substrate manufacturing apparatus described in (1), since both the chamber member and the upper pressurizing member are supported by the base portion, the member interposed between the upper substrate and the lower substrate is minimized.

As a result, the positional relationship between the upper substrate and the lower substrate can be prevented from shifting between the upper substrate and the lower substrate until the bonding is performed. Therefore, the alignment accuracy of two board | substrates can be improved and a yield can be improved. In addition, since the upper pressing member and the chamber member can be moved up and down separately, the chamber member can be moved up and down at high speed, and the upper pressing member can make a small movement (up and down movement) at the time of bonding the substrate. . In other words, the alignment accuracy of the two substrates is improved and the production efficiency can be improved.

1 is a schematic front view of a bonded substrate manufacturing apparatus according to a first embodiment of the present invention.
2 is a cross-sectional view taken along line AA of FIG. 1.
3 is an explanatory diagram (1) showing a process of manufacturing a bonded substrate using the bonded substrate manufacturing apparatus according to the embodiment.
4 is an explanatory diagram (2) showing a process of manufacturing a bonded substrate using the bonded substrate manufacturing apparatus according to the embodiment.
5 is an explanatory diagram (3) showing a process of manufacturing a bonded substrate using the bonded substrate manufacturing apparatus according to the embodiment.
6 is an explanatory diagram (4) illustrating a process of manufacturing a bonded substrate using the bonded substrate manufacturing apparatus according to the embodiment.
7 is an explanatory diagram (5) illustrating a process of manufacturing a bonded substrate using the bonded substrate manufacturing apparatus according to the embodiment.
8 is an explanatory diagram (6) showing a process of manufacturing a bonded substrate using the bonded substrate manufacturing apparatus according to the embodiment.
9 is an explanatory diagram (7) illustrating a process of manufacturing a bonded substrate using the bonded substrate manufacturing apparatus according to the embodiment.
10 is an explanatory diagram 8 illustrating a process of manufacturing a bonded substrate using the bonded substrate manufacturing apparatus according to the embodiment.
11 is a flowchart illustrating a process of manufacturing a bonded substrate according to the embodiment.
It is a front schematic diagram of the bonding substrate manufacturing apparatus which concerns on 2nd Embodiment of this invention.
FIG. 13 is a cross-sectional view taken along line BB of FIG. 12.
It is explanatory drawing which shows the process of manufacturing a bonded substrate using the bonded substrate manufacturing apparatus which concerns on 2nd Embodiment of this invention.
It is a flowchart which shows the process of manufacturing the bonded substrate which concerns on 2nd Embodiment of this invention.

(1st Embodiment) (Joining board manufacturing apparatus)

The bonded substrate manufacturing apparatus according to the first embodiment of the present invention will be described based on FIGS. 1 to 11.

1 is a front schematic view of a bonded substrate manufacturing apparatus, and FIG. 2 is a cross-sectional view taken along the line A-A of FIG. 1. As shown in FIG. 1 and FIG. 2, the bonded substrate manufacturing apparatus 10 includes a base part 11 on which the lower substrate W1 is placed, a first support rod 13 standing on the base part 11, and a first support rod. A chamber member 14 along the second support rod 16 and the second support rod 16 erected on the base portion 11, the chamber member 14 constituting a part of the chamber 17 while being movable up and down along the 13. It includes an upper pressurizing member 15 capable of holding the upper substrate W2 while being able to move up and down independently from 14).

The base part 11 has rigidity and is formed in substantially rectangular parallelepiped shape. The base portion 11 is provided with legs 22 at four corners of the lower surface 21 and lies on the floor surface. On the other hand, the upper surface 23 of the base portion 11 is formed into a rectangle in plan view. The upper surface 23 is formed with a recess 25 that is larger than the lower substrate W1 in plan view. In the substantially central portion and four corners of the concave portion 25, an XYθ guide 27 which is movable in an orthogonal biaxial horizontal direction and a horizontal rotation direction (hereinafter referred to as a horizontal plane direction) is provided. The movement mechanism 29 in which the actuator 33 is provided in the XYθ guide having the same structure as the XYθ guide 27 is disposed at approximately the center of the XYθ guides 27 arranged at the circumference of the recess 25. . That is, five XYθ guides 27 and four moving mechanisms 29 are arranged in the recess 25. The surface 28 of the XYθ guide 27 and the surface 30 of the moving mechanism 29 are arranged to be coplanar.

At the top of the XYθ guide 27 and the moving mechanism 29, a rectangular seating table 31 is provided in plan view. The lower substrate W1 can be placed on the upper surface 32 of the seating table 31. By driving the moving mechanism 29, the mounting table 31 can be moved in the horizontal plane inward direction. That is, by driving the moving mechanism 29, the lower substrate W1 can be moved in the horizontal direction.

The XYθ guide 27 has a substantially three-layer structure, which includes a base fixing portion 27a fixed to the base portion 11, a table fixing portion 27c fixed to the seating table 31, a base fixing portion 27a, and a table. It is comprised between the fixed part 27c and the moving part 27b which can move to a horizontal surface inner direction.

The moving mechanisms 29 (29a, 29b) move in the desired direction by the moving part 27b by the actuator 33 being driven. Here, for example, the moving mechanism 29a provided in the center of the long side direction of the recessed part 25 is movable along the X direction (long side direction of the seating table 31), and the moving mechanism 29b provided in the short side direction, for example. ) Can be moved along the Y direction (short side direction of the seating table 31), the seating table 31 can be moved to a desired direction by controlling the movement amount of each moving mechanism 29. That is, when the mounting table 31 is to be moved along the X direction, the moving mechanism 29a is moved, and when the mounting table 31 is to be moved along the Y direction, the moving mechanism 29b is moved. Just do it. In addition, by moving the two moving mechanisms 29a and the two moving mechanisms 29b, the seating table 31 can be rotated around its vertical axis.

A plurality of lift pins 45 are provided at positions corresponding to the lower substrate W1 of the upper surface 32 of the seating table 31. The lift pin 45 is normally disposed below the upper surface 32 of the seating table 31. In addition, when the lower substrate W1 is exchanged from the other apparatus not shown to the bonded substrate manufacturing apparatus 10, the lift pin 45 may be raised to receive the lower substrate W1 from the robot arm (not shown). After receiving the lower substrate W1, the lift pin 45 is lowered to allow the lower substrate W1 to be seated on the upper surface 32 of the seating table 31. In addition, when the bonding substrate W3 is exchanged to another device after the bonding processing of the substrates W1 and W2 is completed, the lift pin 45 is raised to form the bonding substrate W3 on the upper surface 32 of the seating table 31. )). The robot arm is inserted in the gap to convey the bonded substrate W3.

In addition, an exhaust port 47 is formed in the bottom face 26 of the recess 25. The exhaust port 47 is connected to the exhaust pipe 48 passing through the base portion 11. The exhaust pipe 48 is connected to the vacuum pump 49 attached to the lower surface 21 of the base portion 11.

The first support bar 13 is erected on the upper surface 23 of the base 11 on the outer side of the recess 25. The first support bar 13 is erected at four corners of the base portion 11. The 1st support rod 13 is rotatable by the instruction | indication from the drive source 66 attached to the base part 11. As shown in FIG. Moreover, the male screw 85 is formed in the 1st support rod 13. As shown in FIG.

The chamber member 14 is attached to the 1st support rod 13. The chamber member 14 is formed in a rectangle of substantially the same size as the base portion 11 in plan view. In the plan view, at four corners of the chamber member 14, female threads 86 are formed in which the first supporting rods 13 are screwed in positions corresponding to the first supporting rods 13. That is, the first support bar 13 rotates, and the chamber member 14 can be moved up and down. A guide rod (not shown) may be provided in addition to the first support rod 13 to move the chamber member 14 horizontally while ensuring the chamber member 14 in a horizontal state.

The peripheral part of the lower surface of the chamber member 14 is formed with the wall part 51 extended vertically over the whole circumference, and the bottom surface 52 of the wall part 51 and the upper surface 23 of the base part 11 It is comprised so that contact is possible. Thereby, the chamber 17 can be comprised by the base part 11 and the chamber member 14. As shown in FIG. The bottom surface 52 of the chamber member 14 is provided with a seal over the whole circumference.

On the ceiling 53 of the chamber member 14, an upper substrate adsorption mechanism 55 for adsorbing the upper substrate W2 is provided. The upper substrate adsorption mechanism 55 includes a main body 56 attached to the ceiling 53 and a suction pin 57 extending downward from the main body 56 vertically. An opening 58 is formed at the tip of the suction pin 57, and the opening 58 is connected to a through hole 59 formed in the suction pin 57. The through hole 59 is connected to the through hole 61 formed in the main body 56. And the through-hole 61 is connected to the piping 62, the piping 62 is led out of the apparatus, and the exhaust pump 63 is provided in the front-end | tip of the piping 62. As shown in FIG. In this manner, the exhaust pump 63 can be driven to suck the upper substrate W2 onto the suction pins 57. The valve 64 is provided in the middle of the pipe 62, and the exhaust air volume can be adjusted.

That is, when the upper substrate W2 is exchanged with the bonded substrate manufacturing apparatus 10 by another apparatus not shown, the exhaust pump 63 is driven to move the upper substrate W2 from the robot arm (not shown) by the suction pin 57. ) Can be received. By continuing the exhaust, the upper substrate W2 can be held by the suction pin 57.

The lower substrate W1 is located at a position corresponding to an arbitrary position (preferably near the periphery of the upper substrate W2) of the ceiling 53 of the chamber member 14, in which the upper substrate W2 is held. ), The imaging section 81 of the camera 80 to be used when performing alignment with. The camera arranging unit 82, which is a through hole penetrating the chamber member 14, is connected to the photographing unit 81. That is, the camera 80 is set in the camera placement unit 82, and the alignment marks M1 and M2 of the lower substrate W1 and the upper substrate W2 are photographed by the camera 80 through the photographing unit 81. The misalignment of the alignment marks M1 and M2 can be detected. The through hole, notch, etc. which are not shown are formed in the position corresponding to the imaging part 81 of the upper press member 15, and the lower board | substrate W1 and the upper board W2 can be imaged. Moreover, the control part which is not shown in figure which instruct | indicates the movement amount of the moving mechanism 29 in the horizontal surface direction is provided with respect to the moving mechanism 29 based on the image | photographed with the camera 80. As shown in FIG.

In the plan view, the second support bar 16 is erected on the outside of the seating table 31 at the bottom face 26 of the recess 25. The second support rod 16 is erected at four corners of the recess 25.

The upper support member 15 is attached to the second support rod 16. The upper pressing member 15 is formed in a rectangle which is slightly smaller than the concave portion 25 in plan view. At four corners of the upper pressing member 15, a through hole 71 through which the second supporting rod 16 can be inserted is formed at a position corresponding to the second supporting rod 16. Below the through hole 71, the guide guide 83 is arrange | positioned so that the upper press member 15 may move up and down in the vertical direction along the 2nd support rod 16. As shown in FIG.

The lower surface of the upper pressing member 15 is a holding surface 75 holding the upper substrate W2.

In the position where the upper substrate W2 of the holding surface 75 is held, a plurality of electrostatic chuck portions 77 are provided. The surface of the electrostatic chuck portion 77 is disposed to be flush with the holding surface 75. Further, a through hole 78 through which the suction pin 57 can be inserted is formed in a portion where the electrostatic chuck portion 77 of the holding surface 75 is not disposed.

Moreover, the upper surface 91 of the upper pressurizing member 15 is provided with a plurality of drive mechanisms 92 for moving the upper pressurizing member 15 up and down. The drive mechanism 92 includes a shaft portion 93 whose length is adjustable and a control unit not shown. The shaft portion 93 includes a fixed shaft 94 connected to the upper pressing member 15 and a movable shaft 95 connected to the fixed shaft 94 and adjusting the length of the shaft portion 93. The movable shaft 95 is configured to be accommodated inside the fixed shaft 94, and the length of the shaft portion 93 can be adjusted by moving the movable shaft 95 in the vertical direction with respect to the fixed shaft 94. That is, by moving the movable shaft 95 in the vertical direction with respect to the fixed shaft 94, it is possible to move the upper substrate W2 up and down. In the chamber member 14, a through hole 98 for inserting the drive mechanism 92 is appropriately formed. Moreover, in order to ensure the airtightness of the chamber 17, the seal 99 is interposed between the fixed shaft 94 and the through-hole 98 of the chamber member 14, and is attached.

Above the drive mechanism 92 and above the chamber member 14, a pressurizing mechanism 96 composed of an actuator is provided, for example. The pressurizing mechanism 96 is connected with the movable shaft 95.

When the lower substrate W1 and the upper substrate W2 are joined by the pressurizing mechanism 96, it can be adjusted to join these substrates W1 and W2 with an appropriate load. The load applied to the substrates W1 and W2 by the pressing mechanism 96 can be detected by the load cell 90.

The movable shaft 95 may be configured to be housed in the pressurizing mechanism 96 and may be adjusted in length. In addition, a universal joint (material shaft joint) may be made at 90, and only the force in the vertical direction may be applied to the upper pressing member 15, and the upper pressing member 15 may be guided only to the second supporting rod 16. The load cell 90 may be mounted inside the pressing mechanism 96 or may be mounted between the shaft portion 93 and the upper pressing member 15.

(Action)

Next, the procedure of manufacturing a bonded substrate using the bonded substrate manufacturing apparatus 10 is demonstrated using FIGS. 3-11. 3-10 is explanatory drawing which shows the process of manufacturing a bonded substrate using the bonded substrate manufacturing apparatus, and FIG. 11 is a flowchart which shows the process of manufacturing a bonded substrate.

Each step number described later corresponds to the step number of FIG.

First, as shown in FIG. 3, the upper pressurizing member 15 of the bonded substrate manufacturing apparatus 10 is hold | maintained in the state located in the uppermost state by the pressurizing mechanism 96. As shown in FIG.

In step S1, the lower substrate W1 is carried in by the robot arm in this state. A specific loading method of the lower substrate W1 is shown after step S2.

In step S2, the lower substrate W1 conveyed to the robot arm (not shown) is disposed above the seating table 31. Here, the lift pin 45 is raised to lift the lower substrate W1 from the robot arm.

In step S3, the robot arm is evacuated from within the bonded substrate manufacturing apparatus 10.

In step S4, the lift pin 45 is lowered and the lower substrate W1 is placed on the upper surface 32 of the seating table 31.

In step S5, the upper substrate W2 carried by the robot arm (not shown) is disposed below the holding surface 75 of the upper pressing member 15.

In step S6, the suction pin 57 is lowered to suck the upper substrate W2. In lowering the suction pin 57, the chamber member 14 is lowered while the upper pressing member 15 is held at the uppermost level.

In step S7, the robot arm is withdrawn from inside the chamber 17.

In step S8, the upper pressing member 15 is lowered.

In step S9, the electrostatic chuck portion 77 of the upper pressurizing member 15 is functioned to adsorb the upper substrate W2 to the holding surface 75. 4 is an explanatory diagram when up to step S9 described above is completed.

The process of carrying in the lower board | substrate W1 of step S1-S4, and the process of carrying in the upper board W2 of step S5-S9 may be any of them first. However, there is a possibility that the upper substrate W2 may fall from the suction pin 57. Therefore, by carrying in the upper substrate W2 first, it is possible to prevent the influence of the falling of the upper substrate W2 on the lower substrate W1. In particular, in the case of manufacturing the liquid crystal panel, since the liquid crystal is coated on the upper surface of the lower substrate W1, it is preferable to carry in the upper substrate W2 first.

Next, in step S10, the chamber member 14 is lowered toward the base portion 11 (lower substrate W1) as shown in FIG. Since the female screw 86 at the four corners of the chamber member 14 is screwed to the male screw 85 of the first supporting rod 13, the chamber member 14 is lowered while maintaining the horizontal state. Then, the chamber member 14 is lowered until the bottom surface 52 of the wall portion 51 and the upper surface 23 of the base portion 11 come into contact with each other. Thereby, the chamber 17 sealed by the base part 11 and the chamber member 14 is comprised (process chamber formation process).

In step S11, the upper pressing member 15 is lowered toward the base portion 11 (lower substrate W1) at substantially the same time as step S10 (first upper substrate moving step). At this time, by moving the movable shaft 95 of the drive mechanism 92 to protrude from the fixed shaft 94, the length of the shaft portion 93 becomes long, and the upper pressing member 15 descends. At this time, since the second supporting rods 16 are inserted into the guide guides 83 at the four corners of the upper pressing member 15, the upper pressing member 15 is lowered while maintaining the horizontal state.

The speed of the vertical movement of the chamber member 14 is set to be higher than the speed of the vertical movement of the upper press member 15. Therefore, when lowering the chamber member 14 and the upper pressurizing member 15, the position of the upper pressurizing member 15 at the time of conveyance of the board | substrate is set so that the chamber member 14 and the upper pressurizing member 15 may not interfere. It is preferable to arrange | position in the position as close as possible to the base part 11 side in the range which does not affect the entrance and exit of this.

In step S12, as shown in FIG. 6, when the chamber 17 is constructed, the inside of the chamber 17 is made into a vacuum state. Specifically, the vacuum pump 49 is operated to exhaust the inside of the chamber 17 from the exhaust port 47 (decompression step). The chamber 17 is then kept in a vacuum state (about 0.4 Pa or less). As in the present embodiment, if the vacuum is made in a state where the distance between the lower substrate W1 and the upper substrate W2 is sufficiently secured, the conductance can be increased, and the time for making the vacuum state can be shortened. The air between the substrates W1 and W2 can be reliably exhausted.

In step S13, as shown in FIG. 7, after completing the vacuuming of the inside of the chamber 17, the upper pressurizing member 15 is lowered again between the lower substrate W1 and the upper substrate W2. At predetermined intervals (a few hundred μm) (second upper substrate moving step).

In step S14, as shown in FIG. 8, the camera 80 is operated to focus on the alignment marks M1 and M2 of the lower substrate W1 and the upper substrate W2 in sequence and photograph them. Then, the lower substrate W1 is moved in the horizontal plane inward direction such that the alignment marks M1 and M2 coincide with each other (substrate positioning step). At this time, the moving mechanism 29 is driven based on the amount of misalignment of the alignment marks M1 and M2 to move the seating table 31 to move the lower substrate W1 to an appropriate position.

In step S15, after the alignment of the lower substrate W1 and the upper substrate W2 is completed, the upper pressing member 15 is further lowered.

In step S16, as shown in Fig. 9, the lower substrate W1 and the upper substrate W2 are bonded (substrate bonding step). At this time, a downward force is applied to the upper pressing member 15 by the pressing mechanism 96 to press the two substrates W1 and W2. Here, the load which acts on the two board | substrates W1 and W2 by the load cell 90 is detected, and it adjusts so that a board | substrate may be joined by a suitable load.

In step S17, as shown in FIG. 10, when the bonding of the lower substrate W1 and the upper substrate W2 is completed, the chamber member 14 and the upper pressurizing member 15 are raised. At this time, the bonding board | substrate W3 is arrange | positioned on the base part 11 (mounting table 31). That is, the function of the electrostatic chuck 77 of the upper pressing member 15 is released to separate the upper substrate W2 from the upper pressing member 15.

In step S18, the lift pin 45 of the base portion 11 is raised to raise the bonding substrate W3 from the upper surface 23.

In step S19, the robot arm is inserted into the gap between the bonded substrate W3 and the upper surface 23 of the base portion 11 to exchange the bonded substrate W3 from the lift pin 45 to the robot arm. And the robot arm conveys the bonding board | substrate W3 to the other apparatus which is not shown in figure, and a process is completed.

According to the present embodiment, the bonded substrate W3 is manufactured by bonding the upper substrate W2 and the lower substrate W1 while positioning them. The bonded substrate manufacturing apparatus 10 used for this manufacture is the base part 11 which supports the lower board | substrate W1, and the chamber member comprised so that up-and-down movement is possible, and forming the chamber 17 with the base part 11. FIG. 14, the upper pressing member capable of holding the upper substrate W2 while being able to move up and down independently from the chamber member 14 along the second supporting rod 16 and the second supporting rod 16, which are mounted on the base portion 11; And an upper substrate W2 and a lower substrate W1 in the chamber 17 by moving the upper pressurizing member 15.

Therefore, the upper press member 15 holding the upper substrate W2 is guided to the second support rod 16 which is erected on the base portion 11 on which the lower substrate W1 is placed and moves up and down. Therefore, the number of members interposed between the upper substrate W2 and the lower substrate W1 can be minimized. Thereby, the relative position of the upper board W2 and the lower board W1 can be prevented from shifting between the upper board W2 and the lower board W1 until the bonding is performed. Therefore, the alignment accuracy of the two board | substrates W1 and W2 improves and a yield improves. In addition, since the upper pressing member 15 and the chamber member 14 can be moved up and down separately, the chamber member 14 can be moved up and down at a high speed, and the upper pressing member 15 is the substrate W1, W2. ) Can be used to make small movements (up and down movements). In other words, the alignment accuracy of the two substrates W1 and W2 is improved, and the production efficiency is improved.

Moreover, in the bonded substrate manufacturing apparatus 10 which concerns on this embodiment, since the adsorption | suction pin 57 was made to adsorb | suck the upper board | substrate W2 to the chamber member 14, it moved to the vertical movement of the chamber member 14, and so on. The suction pin 57 can be moved up and down in association.

In addition, by moving the upper pressing member 15 up and down independently from the chamber member 14, the upper substrate W2 can be exchanged from the suction pin 57 to the upper pressing member 15. Therefore, the up-and-down movement mechanism unique to the suction pins 57 becomes unnecessary, and an increase in manufacturing cost can be suppressed.

Moreover, since the seating table 31 which mounts the lower board | substrate W1 and the moving mechanism 29 which moves the seating table 31 are provided in the base part 11, the lower board | substrate W1 is hold | maintained stably. It can support, and the lower substrate W1 and the upper substrate W2 can be aligned with high accuracy.

(Second Embodiment)

Next, the bonded substrate manufacturing apparatus which concerns on 2nd Embodiment of this invention is demonstrated based on FIGS. 12-15. In this embodiment, since the seating means of 1st Embodiment and the lower board | substrate W1 differ only, and is substantially the same about another structure, the same code | symbol is attached | subjected to the same location and detailed description is abbreviate | omitted.

12 is a front schematic view of the bonded substrate manufacturing apparatus, and FIG. 13 is a cross-sectional view taken along line B-B in FIG. 12. As illustrated in FIGS. 12 and 13, the upper surface 123 of the base 111 may be formed in a rectangular shape in plan view, and the lower substrate W1 may be placed thereon. In the planar view of the upper surface 123, a driving stage 125 is provided at the center to move the lower substrate W1 in the vertical direction, the perpendicular biaxial horizontal direction, and the horizontal rotation direction (hereinafter, referred to as the horizontal plane direction). have.

The drive table 125 is disposed in the recess 124 formed on the upper surface 123 of the base portion 111. The drive stand 125 is formed in a substantially circular shape in plan view, and a cavity 128 is formed in the drive stand 125. A plurality of air holes 127 are formed in the ceiling surface of the cavity 128. In addition, the cavity 128 is connected to the exhaust pipe 129 provided below. The exhaust pipe 129 extends from the lower surface 121 through the base 111 and is connected to an exhaust pump (not shown). That is, when the exhaust pump is operated while the lower substrate W1 is placed on the driving unit 125, the lower substrate W1 may be in close contact with the driving unit 125 via the air hole 127. The valve 130 is provided in the middle of the exhaust pipe 129, and the displacement can be adjusted.

Below the drive stand 125, a first moving mechanism 131 for moving the drive stand 125 in the horizontal direction is provided. Below the 1st moving mechanism 131, the 2nd moving mechanism 132 for moving the drive stand 125 to an up-down direction is provided. The driving method of the first moving mechanism 131 and the second moving mechanism 132 is not particularly limited. In the present embodiment, the drive table 125 is movable in the horizontal plane inward direction using the actuator mechanism as the first moving mechanism 131, and this member is used using the wedge-shaped member as the second moving mechanism 132. By moving the driving stage 125 can be moved in the vertical direction.

In the region where the lower substrate W1 of the upper surface 123 of the base portion 111 is placed, a plurality of air pads 135 (14 in this embodiment) are provided. The air pad 135 is disposed in the recess 136 formed on the upper surface 123 of the base 111.

The air pad 135 is formed in a substantially circular shape in plan view, and a cavity 139 is formed inside the air pad 135. A plurality of air holes 138 are formed in the ceiling surface of the cavity 139. In addition, the cavity 139 is connected to the supply / exhaust pipe 140 provided below. The supply / exhaust pipe 140 extends from the lower surface 121 through the base 111 and is connected to a supply / exhaust pump (not shown). When the lower substrate W1 is supplied in a state where the lower substrate W1 is placed on the base 111, air may be ejected from the air hole 138 toward the lower substrate W1 to float the lower substrate W1. . On the other hand, when the lower substrate W1 is exhausted in a state placed on the base portion 111, the lower substrate W1 may be in close contact with the base portion 111 through the air hole 138. In the middle of the supply / exhaust pipe 140, a valve 141 for adjusting the supply / exhaust amount is provided. Normally, the surface 126 of the drive table 125 and the surface 137 of the air pad 135 are coplanar.

(Action)

Next, a part of the procedure of manufacturing a bonded substrate using the bonded substrate manufacturing apparatus 110 is demonstrated based on FIG. 15 is a flowchart illustrating a process of manufacturing a bonded substrate.

In step S1, the lower substrate W1 is carried in by the robot arm. The specific loading method of the lower substrate W1 is shown after step S2.

In step S2, the lower substrate W1 transferred to the robot arm (not shown) is disposed above the base portion 111. Here, the lift pin 145 is raised to lift the lower substrate W1 from the robot arm.

In step S3, the robot arm is evacuated from within the bonded substrate manufacturing apparatus 10.

In step S4, the lift pin 145 is lowered to place the lower substrate W1 on the upper surface 123 of the base portion 111. At this time, by exhausting from the exhaust pipe 129, the lower substrate W1 is attracted to the drive table 125.

Since steps S5 to S9 are substantially the same as in the first embodiment, description thereof is omitted.

The process of carrying in the lower board | substrate W1 of step S1-S4, and the process of carrying in the upper board W2 of step S5-S9 may be any of them first.

In step S10, the chamber member 14 is lowered toward the base portion 111 (lower substrate W1). Since the female screw 86 at the four corners of the chamber member 14 is screwed to the male screw 85 of the first supporting rod 13, the chamber member 14 is lowered while maintaining the horizontal state. Then, the chamber member 14 is lowered until the bottom surface 52 of the wall portion 51 and the top surface 123 of the base portion 111 come into contact with each other. That is, the chamber 17 sealed by the base part 111 and the chamber member 14 is comprised (process chamber formation process).

In step S11, the lower substrate W1 is raised (first lower substrate moving step). Specifically, the driving unit 125 is moved upward by operating the second moving mechanism 132 provided in the base 111. At the same time, air is supplied to the air pad 135, and the air is blown out from the air hole 138 toward the lower substrate W1. Then, the lower substrate W1 is lifted substantially at the center portion by the drive table 125, and the circumference of the lower substrate W1 is raised by the action of the air pad 135. In this way, the lower substrate W1 is kept in a horizontal state. At this time, the lower substrate W1 is raised from the upper surface 123 by several tens of micrometers.

In step S12, as shown in FIG. 14, the upper pressing member 15 is lowered toward the base portion 111 (lower substrate W1) at substantially the same time as step S11 (first upper substrate moving step). At this time, by moving the movable shaft 95 of the drive mechanism 92 to protrude from the fixed shaft 94, the length of the shaft portion 93 becomes long, and the upper pressing member 15 descends. The guide guides 83 at the four corners of the upper pressing member 15 are lowered while maintaining the horizontal state because the second supporting rods 16 are inserted therethrough.

In step S13, the camera 80 is operated to focus on the alignment marks M1 and M2 of the lower substrate W1 and the upper substrate W2 in order to photograph. Then, the lower substrate W1 is moved in the horizontal plane inward direction so that the alignment marks M1 and M2 coincide with each other (substrate alignment process). At this time, the driving base 125 is moved in the horizontal direction in the horizontal plane based on the amount of misalignment of the alignment marks M1 and M2 to move the lower substrate W1 to an appropriate position.

In step S14, when the alignment of the lower substrate W1 and the upper substrate W2 is completed, the driving stage 125 of the lower substrate W1 is lowered, and the air supply of the air pad 135 is stopped to stop the lower substrate. (W1) is lowered to the upper surface 123 of the base 111. Then, the air is discharged from the pad 135 to adsorb the lower substrate W1 to the upper surface 123 so that the position is not shifted (second lower substrate moving step). Thereafter, the upper pressing member 15 is slightly moved upward (second upper substrate moving step). In this manner, the distance between the lower substrate W1 and the upper substrate W2 is made longer than when the alignment is performed. This is to shorten the time for increasing the conductance to make the vacuum state in the chamber 17 to be performed in the vacuum state, and to reliably exhaust the air between the substrates W1 and W2.

In step S15, the chamber 17 is vacuumed (decompression step).

In step S16, after completing the vacuum in the chamber 17 is completed, the upper pressing member 15 is lowered again.

In step S17, the lower substrate W1 and the upper substrate W2 are bonded (substrate bonding step).

At this time, the two substrates W1 and W2 are pressed by the pressing mechanism 96. Here, the load which acts on the two board | substrates W1 and W2 by the load cell 90 is detected, and it adjusts so that a board | substrate may be joined by a suitable load.

In step S18, when the bonding of the lower substrate W1 and the upper substrate W2 is completed, the chamber member 14 and the upper pressurizing member 15 are raised. At this time, the bonding substrate W3 is placed on the base 111 (mounting table 131). That is, the function of the electrostatic chuck 77 of the upper pressing member 15 is released to separate the upper substrate W2 from the upper pressing member 15.

In step S19, the lift pin 145 of the base 111 is raised to raise the bonding substrate W3 from the upper surface 123.

In step S20, the robot arm is inserted into the gap between the bonded substrate W3 and the upper surface 123 of the base portion 111 to exchange the bonded substrate W3 from the lift pins 145 to the robot arm.

And the robot arm conveys the bonding board | substrate W3 to the other apparatus which is not shown in figure, and a process is completed.

Even if comprised in this way, the alignment precision of the two board | substrates W1 and W2 like 1st Embodiment can improve, and a yield can be improved.

In the present embodiment, the driving unit 125 moves the lower substrate W1 while absorbing a part of the lower substrate W1 to the base portion 111; When the lower substrate W1 is moved by the driving unit 125, the remaining portion of the lower substrate W1 (the portion where the lower substrate W1 is not adsorbed to the driving unit 125) is floated and the upper substrate ( And an air pad 135 capable of absorbing the remaining portion of the lower substrate W1 at the time of joining the W2) and the lower substrate W1.

For this reason, when joining the upper board W2 and the lower board W1, the lower board W1 can be adsorb | sucked to the base part 111 by the drive stand 125. As shown in FIG. Therefore, the position shift of the lower substrate W1 can be prevented, and the upper substrate W2 and the lower substrate W1 can be bonded with high precision. In addition, since a table for placing the lower substrate W1 is not required separately, the number of parts interposed between the base 111 and the lower substrate W1 can be reduced. In addition, when the lower substrate W1 is attracted to the base portion 111, the drive table 125 and the air pad 135 are not exposed to the chamber 17, so that particles and the like generated in each device are not exposed to the chamber 17. ) Can be prevented from entering. Therefore, the cleanliness in the chamber 17 can be ensured.

The technical scope of the present invention is not limited to the above-described embodiments, and includes various modifications to the above-described embodiments without departing from the spirit of the present invention. That is, the specific shape, structure, etc. which were illustrated in embodiment are only examples, and can be changed suitably.

For example, in this embodiment, although the movement stage was comprised so that it may move only in a horizontal direction, you may comprise so that it may move also in an up-down direction.

In addition, in this embodiment, the up-and-down movement of an upper press member may be comprised so that an upper press member may be moved up and down by forming a screw in a 2nd support rod and rotating a 2nd support rod like the up-and-down movement of a chamber member.

The bonded substrate manufacturing apparatus and the bonded substrate manufacturing method which can improve the alignment accuracy of two board | substrates and improve a yield can be provided.

10, 110 bonded substrate manufacturing apparatus
11, 111 base
14 chamber member
15 Pressurizing element
16 Second Support Rod (Support Rod)
17 chambers (junction processing chamber)
29 moving mechanism
31 seating table
57 suction pin
125 drive table (lower board adsorption system)
135 Air Pad (Lower Substrate Floating Suction Unit)
W1 lower board
W2 upper board
W3 junction board

Claims (7)

A bonded substrate manufacturing apparatus for manufacturing a bonded substrate by bonding the upper substrate and the lower substrate while positioning,
A base part supporting the lower substrate;
A chamber member which is movable up and down and together with the base to form a bonding processing chamber;
A suction pin installed at the chamber member and vertically moved in association with a vertical movement of the chamber member to suck the upper substrate;
A support rod erected on the base portion;
An upper pressing member capable of holding the upper substrate while being movable up and down independently from the chamber member along the support rod; And
A plurality of driving mechanisms installed on an upper surface of the upper pressing member and configured to vertically move the upper pressing member.
And the upper substrate and the lower substrate are bonded to each other inside the bonding processing chamber by moving the upper pressing member. delete The method of claim 1,
In the base portion,
A seating table on which the lower substrate is placed;
A joining substrate manufacturing apparatus, wherein a moving mechanism for moving the seating table is provided. The method of claim 1,
In the base portion,
A lower substrate adsorption device for moving the lower substrate while absorbing a portion of the lower substrate;
When the lower substrate is moved by the lower substrate adsorption device, the lower substrate adsorption device and the unadsorbed portion of the lower substrate are floated, and when the upper substrate and the lower substrate are joined, the lower portion of the lower substrate is raised. A bonded substrate manufacturing apparatus, comprising: a lower substrate floating adsorption apparatus capable of adsorbing a substrate adsorption apparatus and a portion not adsorbed. The upper substrate is supported by the base portion, the upper substrate is held by the upper pressing member movable up and down along the support rod erected from the base portion, and an adsorption pin is installed to suck the upper substrate. A bonded substrate manufacturing method for manufacturing a bonded substrate by bonding the lower substrate and the upper substrate to each other while positioning the lower substrate and the upper substrate in an interior of a bonding processing chamber constituted by a chamber member movable up and down independently and the base portion.
A process chamber forming step of lowering the chamber member and simultaneously lowering the upper substrate adsorbed on the suction pin to form a bonding processing chamber in which the upper substrate and the lower substrate are accommodated by the base portion and the chamber member;
A first upper substrate moving step of lowering the upper pressurizing member and disposing the lower substrate and the upper substrate by a predetermined distance;
A decompression step of depressurizing the inside of the bonding processing chamber;
A second upper substrate moving step of lowering the upper pressing member so as to face the lower substrate and the upper substrate at predetermined intervals;
A substrate alignment step of moving the lower substrate by positioning the seating table on which the lower substrate is placed by a moving mechanism provided in the base to align the lower substrate with the upper substrate; And
And a substrate joining step of joining the lower substrate and the upper substrate by lowering the upper pressurizing member by a plurality of drive mechanisms installed on the upper surface of the upper pressurizing member. The lower substrate is supported by the base portion, the upper substrate is held by the upper pressing member movable up and down along the support rod erected from the base portion, and the chamber member and the base portion are movable up and down independently from the upper pressing member. A bonded substrate manufacturing method for manufacturing a bonded substrate by bonding the lower substrate and the upper substrate while positioning the inside of the bonding processing chamber constituted by
A process chamber forming step of lowering the chamber member to form a bonding process chamber in which the upper substrate and the lower substrate are accommodated by the base portion and the chamber member;
While separating the lower substrate from the base portion while absorbing a portion of the lower substrate by the lower substrate adsorption device provided in the base portion, the lower substrate of the lower substrate by the lower substrate floating adsorption apparatus installed in the base portion A first lower substrate moving step of floating the substrate adsorption device and the non-adsorbed portion;
A first upper substrate moving step of lowering the upper pressurizing member so as to face the lower substrate and the upper substrate at predetermined intervals;
A substrate alignment step of moving the lower substrate by the lower substrate adsorption device to perform alignment of the lower substrate and the upper substrate;
A second upper substrate moving step of raising the upper pressing member to space the lower substrate and the upper substrate by a predetermined distance;
The lower substrate is brought into contact with the base part while adsorbing a portion of the lower substrate by the lower substrate adsorption device and is not adsorbed with the lower substrate adsorption device of the lower substrate by the lower substrate floating adsorption device. A second lower substrate moving step of adsorbing the base to the base;
A decompression step of depressurizing the inside of the bonding processing chamber; And
And joining the lower substrate and the upper substrate by lowering the upper pressurizing member. A bonded substrate manufacturing apparatus for manufacturing a bonded substrate by bonding the upper substrate and the lower substrate while positioning,
A base part supporting the lower substrate;
A chamber member which is movable up and down and together with the base to form a bonding processing chamber;
A support rod erected on the base portion; And
And an upper pressurizing member capable of holding the upper substrate while being able to move up and down independently from the chamber member along the support rod.
By moving the upper pressing member, the upper substrate and the lower substrate are bonded to the inside of the bonding processing chamber,
In the base portion,
A lower substrate adsorption device for moving the lower substrate while absorbing a portion of the lower substrate;
When the lower substrate is moved by the lower substrate adsorption device, the lower substrate adsorption device and the unadsorbed portion of the lower substrate are floated, and when the upper substrate and the lower substrate are joined, the lower portion of the lower substrate is raised. A bonded substrate manufacturing apparatus, comprising: a lower substrate floating adsorption apparatus capable of adsorbing a substrate adsorption apparatus and a portion not adsorbed.

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