CN101855060A - Bonding substrate manufacturing apparatus and bonding substrate manufacturing method - Google Patents
Bonding substrate manufacturing apparatus and bonding substrate manufacturing method Download PDFInfo
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- CN101855060A CN101855060A CN200880115485A CN200880115485A CN101855060A CN 101855060 A CN101855060 A CN 101855060A CN 200880115485 A CN200880115485 A CN 200880115485A CN 200880115485 A CN200880115485 A CN 200880115485A CN 101855060 A CN101855060 A CN 101855060A
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- infrabasal plate
- upper substrate
- pressure
- basal part
- plate
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
- B65G49/063—Transporting devices for sheet glass
- B65G49/064—Transporting devices for sheet glass in a horizontal position
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
- B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/18—Handling of layers or the laminate
- B32B38/1858—Handling of layers or the laminate using vacuum
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
- B65G2249/02—Controlled or contamination-free environments or clean space conditions
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
- B65G2249/04—Arrangements of vacuum systems or suction cups
- B65G2249/045—Details of suction cups suction cups
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Nonlinear Science (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Liquid Crystal (AREA)
- Optics & Photonics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Fluid Mechanics (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Joining Of Glass To Other Materials (AREA)
Abstract
Disclosed is a bonding substrate manufacturing apparatus for manufacturing a bonding substrate by bonding an upper substrate and a lower substrate while aligning the upper and the lower substrates with each other. The apparatus is provided with a base section for supporting the lower substrate, a chamber member which is vertically movable and forms a bonding process chamber with the base section, a supporting bar arranged upright on the base section, and an upper pressurizing member which can vertically move independently from the chamber member along the supporting bar and hold the upper substrate. The upper substrate and the lower substrate are bonded to each other inside the bonding process chamber by moving the upper pressurizing member.
Description
Technical field
The present invention relates to adhesive base plate manufacturing installation and adhesive base plate manufacture method.
The application is based on advocating priority in patent application 2007-291946 number of Japanese publication on November 09th, 2007, and quotes its content at this.
Background technology
Flat-panel monitor such as LCD and plasma scope (FPD) has the structure that two base plate bondings are formed.For example, LCD by array base palte (TFT substrate) that will be formed with a plurality of TFT (thin film transistor (TFT)) and the colored filter substrate (CF substrate) that is formed with colored filter and photomask etc. rectangularly to count relative configuration the in interval of μ m degree, between two substrates, enclose liquid crystal, and the two substrates utilization is contained mutual bonding manufacturing of seal member (bonding agent) of light-cured resin.In order to prevent sneaking into of foreign gas etc., under vacuum environment, carry out the bonding of these two substrates.
As the device of this bonding two substrates, the base plate bonding device of present known for example patent documentation 1.The base plate bonding device of patent documentation 1 comprises: the vacuum chamber that is made of upper container and lower container, the upper substrate conveyance anchor clamps that are used to upper substrate is moved, be used to first support stick that upper container is moved up and down, second support stick that supports the base of this support stick and be used to make upper substrate conveyance anchor clamps to move up and down.
In the aforesaid substrate bonder, the first support stick downward direction is moved, and upper container and lower container butt to be constituting vacuum chamber, and the second support stick downward direction is moved, so that upper substrate conveyance anchor clamps descend, make upper substrate dispose so that predetermined distance is relative with infrabasal plate.Then, carry out position alignment and the bonding upper substrate and the infrabasal plate of upper substrate and infrabasal plate.
Patent documentation 1: Japan Patent Publication Laid-Open 2007-212572 communique
The adhesive base plate manufacturing installation of above-mentioned patent documentation 1 after vacuumizing, carries out upper substrate and infrabasal plate position alignment in process chamber, and with these two base plate bondings.But, after carrying out upper substrate and infrabasal plate position alignment, when by second support stick that is provided on the base is moved so that upper substrate conveyance anchor clamps when moving, the position of upper substrate and infrabasal plate may relativity shift.This be because, have a plurality of parts between from the base to the infrabasal plate, therefore dispose the lower container of infrabasal plate and carry out different motions with the base that is equipped with second support stick.So, the relative position that has because of upper substrate and infrabasal plate produces skew, and causes the problem of decrease in yield.
Summary of the invention
In view of this, problem of the present invention is to provide a kind of position alignment precision of two substrates that can make to improve, and improves the adhesive base plate manufacturing installation and the adhesive base plate manufacture method of yield rate.
In order to solve above-mentioned problem and to achieve the above object, the present invention has adopted following scheme.
(1) adhesive base plate manufacturing installation of the present invention by upper substrate and infrabasal plate are carried out position alignment and the bonding adhesive base plate of making, comprising: the basal part that supports described infrabasal plate; Can move up and down, and form the chamber component of adhesion process chamber with described basal part; Setting is arranged on the support stick on the described basal part; With can be independent of described chamber component along this support stick and move up and down, and can keep the last pressure-producing part of described upper substrate, by moving the described pressure-producing part of going up, at bonding described upper substrate in the inside of described adhesion process chamber and described infrabasal plate.
Adhesive base plate manufacturing installation according to above-mentioned (1) record, the support stick guiding that is arranged on mounting and is had by setting owing to the last pressure-producing part that maintains upper substrate on the basal part of infrabasal plate moves up and down, and therefore the component count that is present between upper substrate and the infrabasal plate can be suppressed to Min..Thus, can prevent that from the position alignment of upper substrate and infrabasal plate the relative position of upper substrate and infrabasal plate produces skew to bonding.The position alignment precision of two substrates is improved, and improve yield rate.In addition, because last pressure-producing part and chamber component can move up and down respectively, therefore chamber component is moved up and down at high speed, and can make pressure-producing part when base plate bonding, carry out small motion (moving up and down).Just, improve the position alignment precision of two substrates, and enhance productivity.
(2) preferably, described chamber component is provided with the absorption bar that is used to adsorb described upper substrate.
Under the situation of above-mentioned (2), the absorption bar is moved up and down by the interlock that moves up and down with chamber component.In addition, move up and down, can send upper substrate to pressure-producing part from the absorption bar by making pressure-producing part be independent of chamber component.Therefore, do not need to adsorb bar reciprocating mechanism alone, can suppress the rising of manufacturing cost.
(3) preferably, described basal part is provided with the mounting table of the described infrabasal plate of mounting and the travel mechanism that this mounting table is moved.
Under the situation of above-mentioned (3),, therefore can stablize the maintenance infrabasal plate, carry out the position alignment of infrabasal plate and upper substrate accurately because infrabasal plate is positioned on the mounting table.
(4) preferably, described basal part is provided with: the infrabasal plate adsorbent equipment that adsorbs the part of described infrabasal plate and described infrabasal plate is moved; With when moving described infrabasal plate by this infrabasal plate adsorbent equipment, can make in the described infrabasal plate and do not floated by the position of described infrabasal plate adsorbent equipment absorption, and when bonding described upper substrate and described infrabasal plate, can adsorb in the described infrabasal plate and do not floated adsorbent equipment by the infrabasal plate at the position of described infrabasal plate adsorbent equipment absorption.
Under the situation of above-mentioned (4), when upper substrate and infrabasal plate are carried out position alignment, can utilize infrabasal plate to float adsorbent equipment infrabasal plate is floated from basal part.So, can infrabasal plate be moved by the infrabasal plate adsorbent equipment.And when bonding upper substrate and infrabasal plate, can float adsorbent equipment by infrabasal plate infrabasal plate is adsorbed on the basal part.So, can prevent the position skew of infrabasal plate, thus can bonding well upper substrate of precision and infrabasal plate.In addition, owing to need be used for the platform of mounting infrabasal plate no longer in addition, therefore can reduce the part number that is present between basal part and the infrabasal plate.
Further, when making infrabasal plate be adsorbed on the basal part, because infrabasal plate adsorbent equipment and infrabasal plate float adsorbent equipment and be not exposed in the adhesion process chamber, it is indoor to prevent that therefore particle that each device produces etc. from flowing into adhesion process.So, can guarantee the cleanliness factor that adhesion process is indoor.
(5) adhesive base plate manufacture method of the present invention, support infrabasal plate by basal part, by keeping upper substrate along the last pressure-producing part that the support stick of erectting setting from described basal part moves up and down, by can be independent of described on the inside of the adhesion process chamber that constitutes of the chamber component that moves up and down of pressure-producing part and described basal part, described infrabasal plate and described upper substrate are carried out position alignment and the bonding adhesive base plate of making, comprise: described chamber component is descended, and the process chamber that is formed the adhesion process chamber that accommodates described upper substrate and described infrabasal plate by described basal part and described chamber component forms operation; The described pressure-producing part of going up is descended, with the first upper substrate mobile process of described infrabasal plate of predetermined distance configured separate and described upper substrate; To the indoor decompression operation that reduces pressure of described adhesion process; The described pressure-producing part of going up is descended, dispose the second upper substrate mobile process of described infrabasal plate and described upper substrate with predetermined distance relatively; The mounting table of the described infrabasal plate of mounting is moved so that described infrabasal plate moves by the travel mechanism that is arranged on the described basal part, carry out the substrate position alignment process of the position alignment of described infrabasal plate and described upper substrate; With make the described pressure-producing part of going up descend the base plate bonding operation of bonding described infrabasal plate and described upper substrate.
According to the adhesive base plate manufacture method of above-mentioned (5) record, the support stick that the last pressure-producing part that maintains upper substrate is arranged on by setting on the basal part of the mounting table that is provided with the mounting infrabasal plate guides and moves up and down.Therefore, the component count that is present between upper substrate and the infrabasal plate can be suppressed to Min..Thus, can prevent that from the position alignment of upper substrate and infrabasal plate the position relation of upper substrate and infrabasal plate produces skew to bonding.So, the position alignment precision of two substrates is improved, thereby improve yield rate.
In addition, because last pressure-producing part and chamber component can move up and down respectively, therefore chamber component is moved up and down at high speed, and can make pressure-producing part when base plate bonding, carry out small motion (moving up and down).Just, improve the position alignment precision of two substrates, and enhance productivity.
In addition, under state, reduced pressure in the adhesion process chamber, therefore can under the bigger state of conductance (コ Application ダ Network タ Application ス), reduce pressure with predetermined distance configured separate infrabasal plate and upper substrate.Thus, can shorten decompression time.
Further, to adhesion process is indoor reduce pressure after, can carry out the position alignment of infrabasal plate and upper substrate by travel mechanism.So, carry out the position alignment of infrabasal plate and upper substrate after, do not need to make once more pressure-producing part to rise, can enhance productivity.
And, because infrabasal plate is positioned on the mounting table, therefore can stablize the maintenance infrabasal plate, carry out the position alignment of infrabasal plate and upper substrate accurately.
(6) adhesive base plate manufacture method of the present invention, support infrabasal plate by basal part, by keeping upper substrate along the last pressure-producing part that the support stick of erectting setting from described basal part moves up and down, by can be independent of described on the inside of the adhesion process chamber that constitutes of the chamber component that moves up and down of pressure-producing part and described basal part, described infrabasal plate and described upper substrate are carried out position alignment and the bonding adhesive base plate of making, comprise: described chamber component is descended, and the process chamber that is formed the adhesion process chamber that accommodates described upper substrate and described infrabasal plate by described basal part and described chamber component forms operation; By be arranged on infrabasal plate adsorbent equipment on the described basal part adsorb the part of described infrabasal plate and make described infrabasal plate from described base part from, and float adsorbent equipment and make the first infrabasal plate mobile process that is not floated in the described infrabasal plate by the position of described infrabasal plate adsorbent equipment absorption by being arranged on infrabasal plate on the described basal part; The described pressure-producing part of going up is descended, dispose the first upper substrate mobile process of described infrabasal plate and described upper substrate with predetermined distance relatively; By described infrabasal plate adsorbent equipment described infrabasal plate is moved, carry out the substrate position alignment process of the position alignment of described infrabasal plate and described upper substrate; The described pressure-producing part of going up is risen, with the second upper substrate mobile process of described infrabasal plate of predetermined distance configured separate and described upper substrate; Adsorb the part of described infrabasal plate and make described infrabasal plate and described basal part connects by described infrabasal plate adsorbent equipment, and float adsorbent equipment by described infrabasal plate and make in the described infrabasal plate not by the position of described infrabasal plate adsorbent equipment absorption and be adsorbed on the second infrabasal plate mobile process on the described basal part; To the indoor decompression operation that reduces pressure of described adhesion process; With make the described pressure-producing part of going up descend the base plate bonding operation of bonding described infrabasal plate and described upper substrate.
Adhesive base plate manufacture method according to above-mentioned (6) record, the support stick guiding that is arranged on mounting and is had by setting owing to the last pressure-producing part that maintains upper substrate on the basal part of infrabasal plate moves up and down, therefore, the component count that is present between upper substrate and the infrabasal plate can be suppressed to Min..Thus, can prevent that from the position alignment of upper substrate and infrabasal plate the position relation of upper substrate and infrabasal plate produces skew to bonding.
So, the position alignment precision of two substrates is improved, thereby improve yield rate.
In addition, pressure-producing part is risen and, reduced pressure in the adhesion process chamber, so can under the bigger state of conductance, reduce pressure with after predetermined distance configured separate infrabasal plate and the upper substrate.Thus, can shorten decompression time.
Further, when upper substrate and infrabasal plate are carried out position alignment, float adsorbent equipment by infrabasal plate infrabasal plate is floated from basal part.So, can infrabasal plate be moved by the infrabasal plate adsorbent equipment.When upper substrate and infrabasal plate being carried out float adsorbent equipment by infrabasal plate infrabasal plate is adsorbed on the basal part when bonding.So, can prevent the position skew of infrabasal plate, thus can bonding well upper substrate of precision and infrabasal plate.In addition, owing to need be used for the platform of mounting infrabasal plate no longer in addition, therefore can reduce the part number that is present between basal part and the infrabasal plate.Further, when making infrabasal plate be adsorbed on the basal part, because infrabasal plate adsorbent equipment and infrabasal plate float adsorbent equipment and be not exposed in the adhesion process chamber, it is indoor to prevent that therefore particle that each device produces etc. from flowing into adhesion process.So, can be under the state of guaranteeing the cleanliness factor that adhesion process is indoor, bonding upper substrate and infrabasal plate.
The invention effect
According to the adhesive base plate manufacturing installation of above-mentioned (1) record, because chamber component and last pressure-producing part support by basal part, therefore the parts that are present between upper substrate and the infrabasal plate are suppressed to Min..
Thus, can prevent that from the position alignment of upper substrate and infrabasal plate the position relation of upper substrate and infrabasal plate produces skew to bonding.So, can improve the position alignment precision of two substrates, thereby improve yield rate.In addition, because last pressure-producing part and chamber component can move up and down respectively, therefore chamber component is moved up and down at high speed, and can make pressure-producing part when base plate bonding, carry out small motion (moving up and down).Just, can improve the position alignment precision of two substrates, and enhance productivity.
Description of drawings
Fig. 1 is the front skeleton diagram of the adhesive base plate manufacturing installation of first embodiment of the invention;
Fig. 2 is the cutaway view along the A-A line of Fig. 1;
Fig. 3 is that the key diagram (1) of making the process of adhesive base plate according to the adhesive base plate manufacturing installation of first embodiment is used in expression;
Fig. 4 is that the key diagram (2) of making the process of adhesive base plate according to the adhesive base plate manufacturing installation of first embodiment is used in expression;
Fig. 5 is that the key diagram (3) of making the process of adhesive base plate according to the adhesive base plate manufacturing installation of first embodiment is used in expression;
Fig. 6 is that the key diagram (4) of making the process of adhesive base plate according to the adhesive base plate manufacturing installation of first embodiment is used in expression;
Fig. 7 is that the key diagram (5) of making the process of adhesive base plate according to the adhesive base plate manufacturing installation of first embodiment is used in expression;
Fig. 8 is that the key diagram (6) of making the process of adhesive base plate according to the adhesive base plate manufacturing installation of first embodiment is used in expression;
Fig. 9 is that the key diagram (7) of making the process of adhesive base plate according to the adhesive base plate manufacturing installation of first embodiment is used in expression;
Figure 10 is that the key diagram (8) of making the process of adhesive base plate according to the adhesive base plate manufacturing installation of first embodiment is used in expression;
Figure 11 is the flow chart of expression manufacturing according to the process of the adhesive base plate of first embodiment;
Figure 12 is the front skeleton diagram of adhesive base plate manufacturing installation second embodiment of the invention;
Figure 13 is the cutaway view along the B-B line of Figure 12;
Figure 14 is the key diagram that expression use adhesive base plate manufacturing installation is second embodiment of the invention made the process of adhesive base plate;
Figure 15 is the flow chart that the process of adhesive base plate is second embodiment of the invention made in expression.
Symbol description
10,110 adhesive base plate manufacturing installations
11,111 basal parts
14 chamber components
Pressure-producing part on 15
16 second support sticks (support stick)
Room 17 (adhesion process chamber)
29 travel mechanisms
31 mounting tables
57 absorption bars
125 drive platform (infrabasal plate adsorbent equipment)
135 air cushions (infrabasal plate floats adsorbent equipment)
The W1 infrabasal plate
The W2 upper substrate
The W3 adhesive base plate
The specific embodiment
(first embodiment) (adhesive base plate manufacturing installation)
According to Fig. 1～Figure 11 the adhesive base plate manufacturing installation in first embodiment of the present invention is described.
Fig. 1 is the front skeleton diagram of adhesive base plate manufacturing installation, and Fig. 2 is the cutaway view along the A-A line of Fig. 1.As shown in Figure 1 and Figure 2, adhesive base plate manufacturing installation 10 comprises: the basal part 11 of mounting infrabasal plate W1; Setting is arranged on first support stick 13 on the basal part 11; Can move up and down and constitute the chamber component 14 of the part of chamber 17 along first support stick 13; Setting is arranged on second support stick 16 on the basal part 11; With can be independent of the last pressure-producing part 15 that chamber component 14 moved up and down and can keep upper substrate W2 along second support stick 16.
Be provided with on the top of XY θ guide 27 and travel mechanism 29 and be the mounting table 31 of rectangle in overlooking.Can mounting infrabasal plate W1 on the upper surface 32 of mounting table 31.By travel mechanism 29 is driven, mounting table 31 is moved along direction in the horizontal plane.Just, drive, infrabasal plate W1 is moved along direction in the horizontal plane by making travel mechanism 29.
XY θ guide 27 is roughly three-decker, comprising: be fixed on substrate fixed part 27a on the basal part 11, be fixed on the platform fixed part 27c on the mounting table 31 and be configured in substrate fixed part 27a and platform fixed part 27c between and the moving part 27b that can move along direction in the horizontal plane.
Travel mechanism 29 (29a, 29b) makes moving part 27b move to desired direction by the driving of actuator 33.Here, for example, can move along directions X (long side direction of mounting table 31) at the 29a of travel mechanism that makes the long side direction central authorities that are arranged on recess 25, and make the 29b of travel mechanism that is arranged on short side direction can be along under the mobile situation of Y direction (short side direction of mounting table 31), by controlling the amount of movement of each travel mechanism 29, thereby mounting table 31 is moved to desired direction.Just, want to make mounting table 31 when directions X moves, the 29a of travel mechanism is moved, and want to make mounting table 31 when the Y direction moves, the 29b of travel mechanism is moved get final product.In addition, move, can make mounting table 31 around its vertical axis rotation by making two 29a of travel mechanism and two 29b of travel mechanism.
In the upper surface 32 of mounting table 31, the position corresponding with infrabasal plate W1 is provided with a plurality of push rods 45 that hoist.The push rod 45 that hoists is configured in the below of the upper surface 32 of mounting table 31 usually.In addition, when from other devices (not shown) when adhesive base plate manufacturing installation 10 transmits infrabasal plate W1, the push rod 45 that hoists rises and can receive infrabasal plate W1 from mechanical arm (not shown).After receiving infrabasal plate W1, descend by making the push rod 45 that hoists, thereby infrabasal plate W1 can be positioned on the upper surface 32 of mounting table 31.In addition, after the adhesion process of substrate W1, W2 is finished, hoist that push rod 45 rises so that adhesive base plate W3 separates from the upper surface 32 of mounting table 31 when adhesive base plate W3 being sent to other whens device, making.Mechanical arm is inserted with conveyance adhesive base plate W3 in the crack betwixt.
In addition, on the bottom surface 26 of recess 25, be formed with exhaust outlet 47.Exhaust outlet 47 connects with the blast pipe 48 that connects basal part 11.Blast pipe 48 connects with vavuum pump 49 on the lower surface 21 that is assemblied in basal part 11.
On the upper surface 23 in the outside of the recess 25 of basal part 11, erect and be provided with first support stick 13.First support stick 13 is erect and is arranged on four angles of basal part 11.First support stick 13 can be by rotating from the indication that is assemblied in the drive source 66 on the basal part 11.In addition, on first support stick 13, be formed with external screw thread 85.
On first support stick 13, chamber component 14 is installed.Chamber component 14 forms the rectangle that is with basal part 11 same size in overlooking.In overlooking, on the position corresponding to first support stick 13 on four angles of chamber component 14, be formed with internal thread 86 with first support stick, 13 threaded engagement.Just, by rotating first support stick 13, chamber component 14 is moved up and down.Except first support stick 13, can also be provided in addition chamber component 14 is remained under the level, make its guide bar that moves up and down more reliably (not shown).
Be formed with below vertical on the full week of the edge part of the lower surface of chamber component 14 and extend the wall portion 51 that is provided with, the bottom surface 52 of wall portion 51 can butt with the upper surface 23 of basal part 11.Thus, can constitute chamber 17 by basal part 11 and chamber component 14.The bottom surface 52 of chamber component 14 full week be provided with seal.
The inner top 53 of chamber component 14 is provided with the upper substrate adsorbing mechanism 55 that is used to adsorb upper substrate W2.Upper substrate adsorbing mechanism 55 comprises main part 56 that is assemblied on the inner top 53 and the absorption bar 57 that extends setting from main part 56 to vertical below.Front end at absorption bar 57 is formed with opening 58, and opening 58 through hole 59 interior with being formed on absorption bar 57 is connected.Through hole 59 further be formed on main part 56 in through hole 61 be connected.And through hole 61 connects with pipeline 62, and pipeline 62 is directed to outside the device, is provided with exhaust pump 63 at the leading section of pipeline 62.So, upper substrate W2 can be adsorbed on the absorption bar 57 by driving exhaust pump 63.Pipeline 62 be provided with valve 64 midway, can regulate the exhaust air quantity.
Just, when from other devices (not shown) when adhesive base plate manufacturing installation 10 transmits upper substrate W2, drive by making exhaust pump 63, absorption bar 57 can receive upper substrate W2 from mechanical arm (not shown).And, by proceeding exhaust, upper substrate W2 can be remained on the absorption bar 57.
Further, on the inner top 53 of chamber component 14, be formed with the shoot part 81 of employed camera 80 when the position alignment of carrying out with infrabasal plate W1 near the optional position that is kept with upper substrate W2 (being preferably the edge part of upper substrate W2) corresponding position.Shoot part 81 is connected with camera configuration portion 82 as the through hole that connects chamber component 14.Just, place camera 80 in camera configuration portion 82, alignment mark M1, the M2 by 81 couples of infrabasal plate W1 of shoot part and upper substrate W2 takes by camera 80, can detect the skew of alignment mark M1, M2.On the position corresponding of last pressure-producing part 15, be formed with (not shown) such as through hole or breach, thereby can take infrabasal plate W1 and upper substrate W2 with shoot part 81.In addition, be provided with control part (not shown), the result who is used for taking according to camera 80 indicates the amount of movement of direction in the horizontal planes to travel mechanism 29.
In overlooking, the outside of the mounting table 31 in the bottom surface 26 of recess 25 is erect and is provided with second support stick 16.Second support stick 16 is erect and is arranged on four angles of recess 25.
On second support stick 16, pressure-producing part 15 is installed.Last pressure-producing part 15 forms the rectangle that is slightly less than recess 25 in overlooking.On the position corresponding on four angles of last pressure-producing part 15, be formed with second support stick 16 and can insert logical through hole 71 with second support stick 16.Below through hole 71, dispose guiding guide 83, vertically move up and down along second support stick 16 so that go up pressure-producing part 15.
The lower surface of last pressure-producing part 15 is for keeping the maintenance face 75 of upper substrate W2.
The position of maintenance upper substrate W2 in the maintenance face 75 is provided with a plurality of electrostatic chuck portion 77.The surface of electrostatic chuck portion 77 is configured to and maintenance face 75 same planes.In addition, be formed with the through hole 78 that to insert logical absorption bar 57 on the position that does not dispose electrostatic chuck portion 77 in maintenance face 75.
Further, the upper surface 91 of last pressure-producing part 15 is provided with a plurality of driving mechanisms 92 that pressure-producing part 15 is moved up and down of being used to.Driving mechanism 92 comprises axial region 93 and the control part (not shown) that length can be regulated.Axial region 93 comprises fixed axis 94 that is connected on the pressure-producing part 15 and the movable axis 95 that is connected and regulates the length of axial region 93 with fixed axis 94.Movable axis 95 is constituted as the inside that can be accommodated in fixed axis 94, and movable axis 95 is movable on above-below direction with respect to fixed axis 94, the length that can regulate axial region 93 thus.Just, movable on above-below direction by movable axis 95 with respect to fixed axis 94, thus upper substrate W2 is moved up and down.On chamber component 14, be formed with aptly and be used to make driving mechanism 92 to insert logical through hole 98.In addition, in order to ensure the air-tightness of chamber 17, between the through hole 98 of fixed axis 94 and chamber component 14, seal 99 is installed.
On the top of driving mechanism 92 and above chamber component 14, be provided with the pressing mechanism 96 that constitutes by for example actuator.Pressing mechanism 96 is connected with movable axis 95.
When bonding infrabasal plate W1 and upper substrate W2, utilize pressing mechanism 96 can regulate and come bonding upper and lower base plate W1, W2 with suitable load.The load that is acted on substrate W1, W2 by pressing mechanism 96 can detect by force cell 90.
(effect)
Next, according to Fig. 3～Figure 11 the order of using adhesive base plate manufacturing installation 10 to make adhesive base plate is described.Fig. 3～Figure 10 is that expression uses the adhesive base plate manufacturing installation to make the key diagram of the process of adhesive base plate, and Figure 11 is the flow chart that the process of adhesive base plate is made in expression.
Each number of steps described later is corresponding with the number of steps of Figure 11.
At first, as shown in Figure 3, the last pressure-producing part 15 of adhesive base plate manufacturing installation 10 is held in place under the state of uppermost position by pressure-producing part 96.
Among the step S1, under this state, move into infrabasal plate W1 by mechanical arm.The method of specifically moving into of infrabasal plate W1 illustrates after step S2.
Among the step S2, will be configured in the top of mounting table 31 by the infrabasal plate W1 that mechanical arm (not shown) conveyance comes.At this, the push rod 45 that hoists is risen so that infrabasal plate W1 floats from mechanical arm.
Among the step S3, mechanical arm is withdrawed from adhesive base plate manufacturing installation 10.
Among the step S4, the push rod 45 that hoists is descended so that infrabasal plate W1 is positioned on the upper surface 32 of mounting table 31.
Among the step S5, will be configured in the below of the maintenance face 75 of pressure-producing part 15 by the upper substrate W2 that mechanical arm (not shown) conveyance comes.
Among the step S6, absorption bar 57 is descended and absorption upper substrate W2.For absorption bar 57 is descended,, chamber component 14 is descended going up under the state that pressure-producing part 15 remains on uppermost position.
Among the step S7, mechanical arm is withdrawed from chamber 17.
Among the step S8, pressure-producing part 15 is descended.
Among the step S9, the electrostatic chuck portion 77 performance functions that make pressure-producing part 15 are to be adsorbed in upper substrate W2 on the maintenance face 75.Fig. 4 is the key diagram when finishing to above-mentioned step S9.
Which formerly carries out all can the operation of moving into infrabasal plate W1 of step S1～S4 and the operation of moving into upper substrate W2 of step S5～S9.But upper substrate W2 has the danger that falls from absorption bar 57.Therefore, by formerly carrying out moving into of upper substrate W2, can prevent to feed through to infrabasal plate W1 because of upper substrate W2 falls the influence that is caused.Particularly, when making liquid crystal panel,, therefore preferably formerly carry out moving into of upper substrate W2 owing to be coated with liquid crystal at the upper surface of infrabasal plate W1.
Next, among the step S10, as shown in Figure 5,14 basad 11 of chamber components (infrabasal plate W1) are descended.External screw thread 85 threaded engagement of the internal thread 86 at four angles of chamber component 14 and first support stick 13, so chamber component 14 descends under the situation that keeps level.So, chamber component 14 is descended connects up to the bottom surface 52 of wall portion 51 and the upper surface 23 of basal part 11.Thus, constitute the chamber 17 (process chamber forms operation) of close encapsulation by basal part 11 and chamber component 14.
Among the step S11, with step S10 roughly simultaneously, make 15 basad 11 of pressure-producing parts (infrabasal plate W1) declines (the first upper substrate mobile process).At this moment, the movable axis 95 by starting driving mechanism 92 is with outstanding from fixed axis 94, and the length of axial region 93 is elongated, last pressure-producing part 15 declines.At this moment, inserted logically by second support stick 16 at the guiding guide 83 at four angles of last pressure-producing part 15, therefore go up pressure-producing part 15 and under the situation that keeps level, descend.
The speed that moves up and down of chamber component 14 is set to faster than the speed that moves up and down of last pressure-producing part 15.So, the position of the last pressure-producing part 15 during preferably with substrate transferring is configured near on the position of basal part 11 sides as much as possible in taking-up that does not influence substrate and the scope of putting into, and makes that chamber component 14 does not interfere with last pressure-producing part 15 when chamber component 14 and last pressure-producing part 15 are descended.
Among the step S12, as shown in Figure 6, constitute after the chamber 17, vacuumizing in the chamber 17.Particularly, start vavuum pump 49, carry out exhaust (decompression operation) by 17 inside, 47 pairs of chambers of steam vent.So, will remain vacuum state (about 0.4Pa is following) in the chamber 17.Shown in present embodiment, when vacuumizing under the state of the distance of fully guaranteeing infrabasal plate W1 and upper substrate W2, can increase conductance, thereby can shorten the time that vacuumizes, and can discharge air between substrate W1, the W2 reliably.
Among the step S13, as shown in Figure 7, after vacuumizing in chamber 17 finished, pressure-producing part 15 is descended, make between infrabasal plate W1 and the upper substrate W2 to be the interval (degree of hundreds of μ m) (the second upper substrate mobile process) of regulation.
Among the step S14, as shown in Figure 8, start camera 80, alignment mark M1, the M2 of infrabasal plate W1 and upper substrate W2 focused successively and take.Then, move infrabasal plate W1, feasible alignment mark M1, M2 unanimity (substrate position alignment process) separately along direction in the horizontal plane.At this moment, according to the side-play amount of alignment mark M1, M2, travel mechanism 29 is driven so that mounting table 31 moves, and make infrabasal plate W1 move to the appropriate location.
Among the step S15, after the position alignment of infrabasal plate W1 and upper substrate W2 is finished, pressure-producing part 15 is further descended.
Among the step S16, as shown in Figure 9, bonding infrabasal plate W1 and upper substrate W2 (base plate bonding operation).At this moment, make downward masterpiece be used for pressure-producing part 15, two substrates W1, W2 are pressurizeed by pressing mechanism 96.At this, come the load of detection effect on two substrates W1, W2 by force cell 90, come adhesive base plate thereby adjust with suitable load.
Among the step S17, as shown in figure 10, after bonding the finishing of infrabasal plate W1 and upper substrate W2, chamber component 14 and last pressure-producing part 15 are risen.At this moment, adhesive base plate W3 is configured on the basal part 11 (mounting table 31).Just, the function of the electrostatic chuck portion 77 of pressure-producing part 15 in the releasing is so that upper substrate W2 separates from last pressure-producing part 15.
Among the step S18, the push rod 45 that hoists of basal part 11 is risen, so that adhesive base plate W3 rises from upper surface 23.
Among the step S19, in the gap of the upper surface 23 of adhesive base plate W3 and basal part 11, insert mechanical arm, and send adhesive base plate W3 to mechanical arm from the push rod 45 that hoists.So mechanical arm arrives other devices (not shown) with adhesive base plate W3 conveyance, thereby finishes dealing with.
According to present embodiment, upper substrate W2 and infrabasal plate W1 are carried out position alignment and the bonding adhesive base plate W3 that makes.This is made employed adhesive base plate manufacturing installation 10 and comprises: the basal part 11 that supports infrabasal plate W1; Be constituted as and move up and down, and form the chamber component 14 of chamber 17 with basal part 11; Setting is arranged on second support stick 16 on the basal part 11; With can be independent of chamber component 14 along second support stick 16 and move up and down, and can keep the last pressure-producing part 15 of upper substrate W2, go up pressure-producing part 15, bonding upper substrate W2 in 17 inside and infrabasal plate W1 by moving in the chamber.
So, maintain the last pressure-producing part 15 of upper substrate W2, be arranged on mounting and have second support stick, 16 guiding on the basal part 11 of infrabasal plate W1 by setting and move up and down.Therefore, the component count that is present between upper substrate W2 and the infrabasal plate W1 is suppressed to Min..Thus, can prevent that from the position alignment of upper substrate W2 and infrabasal plate W1 the relative position of upper substrate W2 and infrabasal plate W1 produces skew to bonding.So, can improve the position alignment precision of two substrate W1, W2, thereby improve yield rate.In addition, because last pressure-producing part 15 and chamber component 14 can move up and down respectively, therefore chamber component 14 is moved up and down at high speed, and can make pressure-producing part 15 carry out small motion (moving up and down) at substrate W1, when W2 is bonding.Just, improve the position alignment precision of two substrate W1, W2, and enhance productivity.
In addition, in the adhesive base plate manufacturing installation 10 according to present embodiment,, absorption bar 57 is moved up and down with the moving up and down interlock of chamber component 14 because chamber component 14 is provided with the absorption bar 57 that is used to make upper substrate W2 absorption.
In addition, move up and down, can send upper substrate W2 to pressure-producing part 15 from absorption bar 57 by making pressure-producing part 15 be independent of chamber component 14.Therefore, do not need to adsorb bar 57 reciprocating mechanism alone, can suppress the rising of manufacturing cost.
Further,, therefore can stablize maintenance infrabasal plate W1, thereby carry out the position alignment of infrabasal plate W1 and upper substrate W2 accurately because basal part 11 is provided with the mounting table 31 of mounting infrabasal plate W1 and the travel mechanism 29 that mounting table 31 is moved.
(second embodiment)
Next, according to Figure 12～Figure 15 the adhesive base plate manufacturing installation in second embodiment of the present invention is described.Because the present embodiment only mounting mode with the infrabasal plate W1 of first embodiment is different, other structures are roughly the same, therefore to same area mark same-sign and detailed.
Figure 12 is the front skeleton diagram of adhesive base plate manufacturing installation, and Figure 13 is the cutaway view along the B-B line of Figure 12.As shown in Figure 12 and Figure 13, the upper surface 123 of basal part 111 forms in overlooking and is rectangle, but mounting infrabasal plate W1.Substantial middle portion is provided with and drives platform 125 in the overlooking of upper surface 123, this drivings platform 125 can make infrabasal plate W1 along the vertical direction, quadrature two axle horizontal directions and horizontal rotatio direction (hereinafter referred to as direction in the horizontal plane) be mobile.
Driving platform 125 is configured in the recess 124 on the upper surface 123 that is formed at basal part 111.Driving platform 125 is circular in forming and overlooking, and is formed with cavity 128 in the inside that drives platform 125.On the end face in cavity 128, be formed with a plurality of passages 127.In addition, cavity 128 links with the blast pipe 129 that is provided with thereunder.Blast pipe 129 connects basal part 111 and extends from lower surface 121, and links with exhaust pump (not shown).Just, be positioned under the state that drives on the platform 125, when starting exhaust pump, via passage 127 infrabasal plate W1 be adjacent to and driving on the platform 125 at infrabasal plate W1.Blast pipe 129 be provided with valve 130 midway, can adjust capacity.
Mounting on the upper surface 123 of basal part 111 has in the zone of infrabasal plate W1 and is provided with a plurality of air cushions (エ ア one パ Star De) 135 (in the present embodiment being 14).Air cushion 135 is configured in the recess 136 on the upper surface 123 that is formed at basal part 111.
(effect)
Next, according to Figure 15 a part of using adhesive base plate manufacturing installation 110 to make the order of adhesive base plate is described.Figure 15 is the flow chart that the process of adhesive base plate is made in expression.
Among the step S1, move into infrabasal plate W1 by mechanical arm.The method of specifically moving into of infrabasal plate W1 illustrates after step S2.
Among the step S2, will be configured in the top of basal part 111 by the infrabasal plate W1 that mechanical arm (not shown) conveyance comes.At this, the push rod 145 that hoists is risen so that infrabasal plate W1 floats from mechanical arm.
Among the step S3, mechanical arm is withdrawed from adhesive base plate manufacturing installation 10.
Among the step S4, the push rod 145 that hoists is descended so that infrabasal plate W1 is positioned on the upper surface 123 of basal part 111.At this moment, by carrying out exhaust,, infrabasal plate W1 drives on the platform 125 thereby being adsorbed on from blast pipe 129.
From step S5 to step S9 and first embodiment roughly the same, therefore omit explanation.
Which formerly carries out all can the operation of moving into infrabasal plate W1 of step S1～S4 and the operation of moving into upper substrate W2 of step S5～S9.
Among the step S10,14 basad 111 of chamber components (infrabasal plate W1) are descended.Because the internal thread 86 at four angles of chamber component 14 and external screw thread 85 threaded engagement of first support stick 13, so chamber component 14 descends under the situation that keeps level.So, chamber component 14 is descended connects up to the bottom surface 52 of wall portion 51 and the upper surface 123 of basal part 111.Just, constitute the chamber 17 (process chamber forms operation) of close encapsulation by basal part 111 and chamber component 14.
Among the step S11, make infrabasal plate W1 rising (the first infrabasal plate mobile process).Particularly, start second travel mechanism 132 that is arranged on the basal part 111, be moved upward so that drive platform 125.Roughly side by side, to air cushion 135 air inlets, thereby air is sprayed to infrabasal plate W1 from passage 138.Like this, by driving platform 125 the substantial middle portion of infrabasal plate W1 is lifted, further, the effect by air cushion 135 is floated the edge part of infrabasal plate W1.So, infrabasal plate W1 is remained level.At this moment, infrabasal plate W1 floats the degree of tens of μ m from upper surface 123.
Among the step S12, as shown in figure 14, with step S11 roughly simultaneously, make 15 basad 111 of pressure-producing parts (infrabasal plate W1) declines (the first upper substrate mobile process).At this moment, the movable axis 95 by starting driving mechanism 92 is with outstanding from fixed axis 94, and the length of axial region 93 is elongated, thereby makes pressure-producing part 15 declines.Owing in the guiding guide 83 at four angles of last pressure-producing part 15, insert and be connected with second support stick 16, so will go up under the situation that pressure-producing part 15 remains on level and descend.
Among the step S13, start camera 80, alignment mark M1, the M2 of infrabasal plate W1 and upper substrate W2 focused successively and take.Then, infrabasal plate W1 is moved along direction in the horizontal plane, feasible alignment mark M1, M2 unanimity (substrate position alignment process) separately.At this moment, according to the side-play amount of alignment mark M1, M2, driving platform 125 is moved, along direction in the horizontal plane so that infrabasal plate W1 moves to the appropriate location.
Among the step S14, after the position alignment of infrabasal plate W1 and upper substrate W2 is finished, the driving platform 125 of infrabasal plate W1 is descended and stop air inlet, thereby infrabasal plate W1 is dropped on the upper surface 123 of basal part 111 air cushion 135.So, carry out exhaust from air cushion 135, so that infrabasal plate W1 is adsorbed on the upper surface 123, make it can not be offset (the second infrabasal plate mobile process) by occurrence positions.Then, make pressure-producing part 15 be moved upward some (the second upper substrate mobile process).Compare elongated when so, the distance that makes infrabasal plate W1 and upper substrate W2 is with position alignment.This be for after when carrying out vacuumizing in the chamber 17, increase conductance, shorten the pumpdown time, and discharge the air between substrate W1, W2 reliably.
Among the step S15, carry out vacuumize (the decompression operation) in the chamber 17.
Among the step S16, after vacuumizing in chamber 17 finished, pressure-producing part 15 is descended.
Among the step S17, bonding infrabasal plate W1 and upper substrate W2 (base plate bonding operation).
At this moment, pressurize by pressing mechanism 96 couples of two substrates W1, W2.At this, come the load of detection effect on two substrates W1, W2 by force cell 90, come adhesive base plate thereby adjust with suitable load.
Among the step S18, after bonding the finishing of infrabasal plate W1 and upper substrate W2, chamber component 14 and last pressure-producing part 15 are risen.At this moment, adhesive base plate W3 is configured on the basal part 111 (mounting table 131).Just, the function of the electrostatic chuck portion 77 of pressure-producing part 15 in the releasing is so that upper substrate W2 separates from last pressure-producing part 15.
Among the step S19, the push rod 145 that hoists of basal part 111 is risen, so that adhesive base plate W3 rises from upper surface 123.
Among the step S20, in the gap of the upper surface 123 of adhesive base plate W3 and basal part 111, insert mechanical arm, and send adhesive base plate W3 to mechanical arm from the push rod 145 that hoists.
So mechanical arm arrives other devices (not shown) with adhesive base plate W3 conveyance, thereby finishes dealing with.
By formation like this, same with first embodiment, also can improve the position alignment precision of two substrate W1, W2, and improve yield rate.
In the present embodiment, the part of absorption infrabasal plate W1 and the driving platform 125 that infrabasal plate W1 is moved are set on basal part 111; With float when utilize driving the remainder (infrabasal plate W1 is not driven the part of platform 125 absorption) that makes infrabasal plate W1 when platform 125 moves infrabasal plate W1, and when upper substrate W2 and infrabasal plate W1 bonding, can adsorb the air cushion 135 of the remainder of infrabasal plate W1.
Therefore, when bonding upper substrate W2 and infrabasal plate W1, can infrabasal plate W1 be adsorbed on the basal part 111 by driving platform 125.So, can prevent the position skew of infrabasal plate W1, thus can bonding well upper substrate W2 of precision and infrabasal plate W1.In addition, owing to need be used for the platform of mounting infrabasal plate W1 no longer in addition, therefore can reduce the part number that is present between basal part 111 and the infrabasal plate W1.Further, when making infrabasal plate W1 be adsorbed on the basal part 111, owing to drive platform 125 and air cushion 135 can not be exposed in the chamber 17, can prevent that therefore particle that each device produces etc. from flowing in the chamber 17.So, can guarantee the cleanliness factor in the chamber 17.
Technical scope of the present invention is not limited to above-mentioned embodiment, in the scope that does not break away from purport of the present invention, comprises above-mentioned embodiment is applied various changes.That is, concrete shape of being enumerated in the embodiment and structure etc. only are an example, the change that can suit.
For example, though in the present embodiment, travelling carriage is only constituted and can move by along continuous straight runs, can also move along the vertical direction yet also can constitute.
In addition, in the present embodiment, the moving up and down of last pressure-producing part also can be constituted as and the moving up and down similarly of chamber component, forms screw thread on second support stick, thereby by making the rotation of second support stick that pressure-producing part is moved up and down.
Utilize possibility on the industry
The present invention can provide a kind of position alignment precision of two substrates that makes to improve, and improves adhesive base plate manufacturing installation and the adhesive base plate manufacture method of yield rate.
Claims (6)
1. an adhesive base plate manufacturing installation by upper substrate and infrabasal plate are carried out position alignment and the bonding adhesive base plate of making, is characterized in that, comprising:
Support the basal part of described infrabasal plate;
Can move up and down, and form the chamber component of adhesion process chamber with described basal part;
Setting is arranged on the support stick on the described basal part; With
Can be independent of described chamber component along this support stick and move up and down, and can keep the last pressure-producing part of described upper substrate,
By moving the described pressure-producing part of going up, at bonding described upper substrate in the inside of described adhesion process chamber and described infrabasal plate.
2. adhesive base plate manufacturing installation according to claim 1 is characterized in that, described chamber component is provided with the absorption bar that is used to adsorb described upper substrate.
3. adhesive base plate manufacturing installation according to claim 1 is characterized in that, described basal part is provided with the mounting table of the described infrabasal plate of mounting and the travel mechanism that this mounting table is moved.
4. adhesive base plate manufacturing installation according to claim 1 is characterized in that, described basal part is provided with: the infrabasal plate adsorbent equipment that adsorbs the part of described infrabasal plate and described infrabasal plate is moved; With when moving described infrabasal plate by this infrabasal plate adsorbent equipment, can make in the described infrabasal plate and do not floated by the position of described infrabasal plate adsorbent equipment absorption, and when bonding described upper substrate and described infrabasal plate, can adsorb in the described infrabasal plate and do not floated adsorbent equipment by the infrabasal plate at the position of described infrabasal plate adsorbent equipment absorption.
5. adhesive base plate manufacture method, support infrabasal plate by basal part, by keeping upper substrate along the last pressure-producing part that the support stick of erectting setting from described basal part moves up and down, by can be independent of described on the inside of the adhesion process chamber that constitutes of the chamber component that moves up and down of pressure-producing part and described basal part, described infrabasal plate and described upper substrate are carried out position alignment and the bonding adhesive base plate of making, it is characterized in that, comprising:
Described chamber component is descended, and the process chamber that is formed the adhesion process chamber that accommodates described upper substrate and described infrabasal plate by described basal part and described chamber component forms operation;
The described pressure-producing part of going up is descended, with the first upper substrate mobile process of described infrabasal plate of predetermined distance configured separate and described upper substrate;
To the indoor decompression operation that reduces pressure of described adhesion process;
The described pressure-producing part of going up is descended, dispose the second upper substrate mobile process of described infrabasal plate and described upper substrate with predetermined distance relatively;
The mounting table of the described infrabasal plate of mounting is moved so that described infrabasal plate moves by the travel mechanism that is arranged on the described basal part, carry out the substrate position alignment process of the position alignment of described infrabasal plate and described upper substrate; With
Make the described pressure-producing part of going up descend the base plate bonding operation of bonding described infrabasal plate and described upper substrate.
6. adhesive base plate manufacture method, support infrabasal plate by basal part, by keeping upper substrate along the last pressure-producing part that the support stick of erectting setting from described basal part moves up and down, by can be independent of described on the inside of the adhesion process chamber that constitutes of the chamber component that moves up and down of pressure-producing part and described basal part, described infrabasal plate and described upper substrate are carried out position alignment and the bonding adhesive base plate of making, it is characterized in that, comprising:
Described chamber component is descended, and the process chamber that is formed the adhesion process chamber that accommodates described upper substrate and described infrabasal plate by described basal part and described chamber component forms operation;
By be arranged on infrabasal plate adsorbent equipment on the described basal part adsorb the part of described infrabasal plate and make described infrabasal plate from described base part from, and float adsorbent equipment and make the first infrabasal plate mobile process that is not floated in the described infrabasal plate by the position of described infrabasal plate adsorbent equipment absorption by being arranged on infrabasal plate on the described basal part;
The described pressure-producing part of going up is descended, dispose the first upper substrate mobile process of described infrabasal plate and described upper substrate with predetermined distance relatively;
By described infrabasal plate adsorbent equipment described infrabasal plate is moved, carry out the substrate position alignment process of the position alignment of described infrabasal plate and described upper substrate;
The described pressure-producing part of going up is risen, with the second upper substrate mobile process of described infrabasal plate of predetermined distance configured separate and described upper substrate;
Adsorb the part of described infrabasal plate and make described infrabasal plate and described basal part connects by described infrabasal plate adsorbent equipment, and float adsorbent equipment by described infrabasal plate and make in the described infrabasal plate not by the position of described infrabasal plate adsorbent equipment absorption and be adsorbed on the second infrabasal plate mobile process on the described basal part;
To the indoor decompression operation that reduces pressure of described adhesion process; With
Make the described pressure-producing part of going up descend the base plate bonding operation of bonding described infrabasal plate and described upper substrate.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007-291946 | 2007-11-09 | ||
| JP2007291946 | 2007-11-09 | ||
| PCT/JP2008/070190 WO2009060890A1 (en) | 2007-11-09 | 2008-11-06 | Bonding substrate manufacturing apparatus and bonding substrate manufacturing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101855060A true CN101855060A (en) | 2010-10-06 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN200880115485A Pending CN101855060A (en) | 2007-11-09 | 2008-11-06 | Bonding substrate manufacturing apparatus and bonding substrate manufacturing method |
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| Country | Link |
|---|---|
| JP (1) | JP4955070B2 (en) |
| KR (1) | KR101177090B1 (en) |
| CN (1) | CN101855060A (en) |
| TW (1) | TW200944873A (en) |
| WO (1) | WO2009060890A1 (en) |
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| CN103926731A (en) * | 2014-04-01 | 2014-07-16 | 深圳市华星光电技术有限公司 | Clamping device and clamping method thereof |
| CN114505817A (en) * | 2022-03-11 | 2022-05-17 | 深圳市凯威达电子有限公司 | Production of intelligence illumination driver chip is with grafting device that can pinpoint |
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| TWI534938B (en) * | 2010-02-25 | 2016-05-21 | 尼康股份有限公司 | Substrate separation device, manufacturing method of semiconductor device, load lock device, substrate bonding device and substrate separation method |
| JP5183659B2 (en) * | 2010-03-23 | 2013-04-17 | 東京エレクトロン株式会社 | Substrate processing apparatus, substrate processing method, program, and computer storage medium |
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| JP6468462B2 (en) * | 2015-02-23 | 2019-02-13 | Ａｇｃ株式会社 | Laminate peeling apparatus, peeling method, and electronic device manufacturing method |
| JP6799988B2 (en) * | 2016-10-07 | 2020-12-16 | 東京応化工業株式会社 | Sticking device |
| JP6696025B1 (en) * | 2019-04-22 | 2020-05-20 | 信越エンジニアリング株式会社 | Laminating apparatus for laminating device, laminating method and laminating device |
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| JPH0631500A (en) * | 1992-07-20 | 1994-02-08 | Hitachi Ltd | Hot press |
-
2008
- 2008-11-06 JP JP2009540076A patent/JP4955070B2/en not_active Expired - Fee Related
- 2008-11-06 KR KR1020107006857A patent/KR101177090B1/en active IP Right Grant
- 2008-11-06 CN CN200880115485A patent/CN101855060A/en active Pending
- 2008-11-06 WO PCT/JP2008/070190 patent/WO2009060890A1/en active Application Filing
- 2008-11-07 TW TW97143221A patent/TW200944873A/en unknown
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1504795A (en) * | 2002-11-15 | 2004-06-16 | Lg.������Lcd��ʽ���� | Device and method for fabricating liquid-crystal display device |
| KR20060108120A (en) * | 2005-04-12 | 2006-10-17 | 주식회사 에이디피엔지니어링 | Substrates alignment apparatus |
| JP2007212572A (en) * | 2006-02-07 | 2007-08-23 | Ulvac Japan Ltd | Method and device for manufacturing laminated substrate |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103730389A (en) * | 2012-10-16 | 2014-04-16 | 全球标准技术有限公司 | Substrate bonding apparatus and substrate bonding method |
| CN103926731A (en) * | 2014-04-01 | 2014-07-16 | 深圳市华星光电技术有限公司 | Clamping device and clamping method thereof |
| CN103926731B (en) * | 2014-04-01 | 2017-01-04 | 深圳市华星光电技术有限公司 | Clamping device and clamping method thereof |
| CN114505817A (en) * | 2022-03-11 | 2022-05-17 | 深圳市凯威达电子有限公司 | Production of intelligence illumination driver chip is with grafting device that can pinpoint |
| CN114505817B (en) * | 2022-03-11 | 2024-04-19 | 深圳市凯威达电子有限公司 | Intelligent lighting drive chip production is with grafting device that can pinpoint |
Also Published As
| Publication number | Publication date |
|---|---|
| JP4955070B2 (en) | 2012-06-20 |
| JPWO2009060890A1 (en) | 2011-03-24 |
| TW200944873A (en) | 2009-11-01 |
| WO2009060890A1 (en) | 2009-05-14 |
| KR20100049674A (en) | 2010-05-12 |
| KR101177090B1 (en) | 2012-08-24 |
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