JP5797863B1 - Joining member manufacturing apparatus and joining member manufacturing method - Google Patents

Abstract

To provide a joining member manufacturing apparatus and a joining member manufacturing method capable of avoiding displacement from a holder even if the surroundings of the holding member are decompressed. A joining member manufacturing apparatus 1 includes a first holding tool 10 that holds a first member D and a second holding that holds a second member E in a state where a back surface Db is in contact with a contact surface 11f. A tool 20, a sealable chamber 30, a decompression device 50, a moving device 40 that moves the first holding tool 10 and / or the second holding tool 20, and a control device 60 are provided. After the control device 60 sets the interval S between the resin G applied to the first bonding surface Df or the second bonding surface Ef and the bonding surface to which the resin G is not applied to a predetermined interval, The moving device 40 and the pressure reducing device 50 are controlled so that the pressure in the chamber 30 is reduced from a pressure exceeding a predetermined pressure to a pressure at the time of bonding. The predetermined interval is smaller than the increase in thickness at which the first member D expands when the pressure is reduced to the joining pressure without deformation being limited. [Selection] Figure 1

Description

  The present invention relates to a joining member manufacturing apparatus and a joining member manufacturing method, and more particularly to a joining member manufacturing apparatus and a joining member manufacturing method for bonding two members together in a reduced pressure environment.

  For example, in the process of manufacturing a liquid crystal panel, a liquid crystal substrate and a protective glass are bonded together with an adhesive. When these two members are bonded together via a resin such as an adhesive, each member is adsorbed and held in a vacuum environment so that bubbles are not mixed between the two members as much as possible. A close approach is performed (see, for example, Patent Document 1).

JP 2002-357841 A

  However, some members to be bonded together, such as a liquid crystal substrate, expand the internal space and bend the surface of the member when placed in a vacuum environment. If the surface of the member is curved, the holding by suction becomes insufficient, and the holding position may shift.

  In view of the above-described problems, an object of the present invention is to provide a joining member manufacturing apparatus and a joining member manufacturing method capable of avoiding displacement from the holder even when the periphery of the holding member is decompressed. .

  In order to achieve the above object, the joining member manufacturing apparatus according to the first aspect of the present invention has a predetermined lower ambient pressure than atmospheric pressure in a state where deformation is not limited, for example, as shown in FIGS. A second member having a first member D that starts to expand so that the back surface Db of the first joint surface Df protrudes and a second joint surface Ef that opposes the first joint surface Df. E is an apparatus for manufacturing the joining member C joined through the resin G; the contact face 11f is in contact with the back face Db of the first joint face Df, and the back face Db is in contact with the contact face 11f. A first holding tool 10 that holds the first member D in a state where the first member D is held; a second bonding surface with respect to the first bonding surface Df of the first member D held by the first holding tool 10 A second holder 20 that holds the second member E in a state where Ef faces each other; and a first holder 1 A sealable chamber 30 for accommodating the first member D held by the second member E and the second member E held by the second holder 20; a decompression device 50 for depressurizing the chamber 30; The first joint surface Df of the first member D held by the tool 10 and the second joint surface Ef of the second member E held by the second holder 20 relatively approach each other. The moving device 40 for moving at least one of the first holding tool 10 and the second holding tool 20 as described above; the first joint surface Df of the first member D held by the first holding tool 10 and the first The distance S between the resin G applied to one Ef of the second joint surfaces Ef of the second member E held by the second holder 20 and the joint surface Df to which the resin G is not applied is predetermined. After the interval is reached, the pressure in the chamber 30 is reduced from a pressure exceeding a predetermined pressure to a pressure at the time of bonding. A control device 60 for controlling the moving device 40 and the decompression device 50 so that the joining pressure is lower than a predetermined pressure, and the first member D and the second member E are connected via the resin G. A pressure suitable for joining; the predetermined interval is an increase in thickness by which the first member D expands when the pressure exceeding the predetermined pressure is reduced to the pressure at the time of joining in a state where deformation is not limited. Is also set to a small interval.

  When configured in this manner, in the chamber, the interval between the resin applied to one of the first bonding surface and the second bonding surface and the bonding surface to which the resin is not applied is set to a predetermined interval. Thereafter, when the inside of the chamber is reduced to the bonding pressure, the expansion of the first member can be suppressed, and the first member can be prevented from shifting from the first holder.

  Moreover, when the joining member manufacturing apparatus according to the second aspect of the present invention is shown, for example, with reference to FIG. 1, in the joining member manufacturing apparatus 1 according to the first aspect of the present invention, the control device 60 includes a chamber. After the pressure inside 30 is reduced to the bonding pressure, the second member E held by the second holder 20 is relatively pressed against the first member D held by the first holder 10. The moving device 40 is controlled to do so.

  If comprised in this way, when it becomes a joining member, it can prevent that a cavity remains in resin.

  Moreover, the joining member manufacturing apparatus which concerns on the 3rd aspect of this invention is the joining member manufacturing apparatus 1 which concerns on the said 2nd aspect of the said invention, for example, as shown in FIG. An interval adjuster 23 for adjusting an interval S between the resin G applied to one Ef of the first bonding surface Df and the second bonding surface Ef and the bonding surface Df to which the resin G is not applied; And a pressing device 25 that presses the second member E independently of the spacing adjuster 23 against the first member D held by the holder 10; An interval adjuster moving device 43 for bringing the adjuster 23 closer to the first holding tool 10 and a pressing machine moving device 45 for bringing the pressing machine 25 closer to the first holding tool 10 are configured.

  If comprised in this way, since a space | interval adjuster and a press machine operate | move independently, a predetermined space | interval can be adjusted with sufficient precision and the 2nd member can be fully pressed with respect to a 1st member.

  In order to achieve the above object, the manufacturing method of the joining member according to the fourth aspect of the present invention, for example, referring to FIG. 1 and FIG. A first member D that starts to expand so that the back surface Db of the first bonding surface Df protrudes when the pressure is lower than a predetermined pressure, and a second bonding surface Ef that opposes the first bonding surface Df. 2 is a method of manufacturing a joining member C (see, for example, FIG. 2A) joined with a resin G via a resin G; the first joining surface Df is sealed in the sealable chamber 30. In a state where the back surface Db is in contact with the contact surface 11f of the first holder 10, the first joint surface Df of the first member D held by the first holder 10 and the second of the second member E. The resin G applied to one of the bonding surfaces Ef and the bonding surface Df to which the resin G is not applied An approach placement step (S4) for approaching the gap S so as to become a predetermined spacing; and a pressure reduction step (S5) for reducing the pressure in the chamber 30 from a pressure exceeding a predetermined pressure to a pressure at the time of joining after the approach placement step (S4). The pressure at the time of bonding is lower than a predetermined pressure, and is a pressure suitable for bonding the first member D and the second member E through the resin G; The interval is set to be smaller than the increase in thickness at which the first member D expands when the pressure exceeding the predetermined pressure is reduced to the pressure at the time of joining in a state where deformation is not limited.

  When configured in this manner, in the chamber, the interval between the resin applied to one of the first bonding surface and the second bonding surface and the bonding surface to which the resin is not applied is set to a predetermined interval. In the subsequent depressurization step, when the inside of the chamber is depressurized to the bonding pressure, the expansion of the first member can be suppressed, and the first member can be prevented from shifting from the first holder.

  According to the present invention, in the chamber, since the interval between the resin applied to one of the first bonding surface and the second bonding surface and the bonding surface to which the resin is not applied is set to a predetermined interval, Thereafter, when the inside of the chamber is reduced to the bonding pressure, the expansion of the first member can be suppressed, and the first member can be prevented from shifting from the first holder.

It is a vertical sectional view showing a schematic structure of a joining member manufacturing device concerning an embodiment of the invention. (A) is a side view which illustrates the structure of a joining member, (B) is a side view which shows the deformed state of the 1st member which comprises a joining member. It is a flowchart explaining the manufacturing process of a joining member.

  Embodiments of the present invention will be described below with reference to the drawings. In the drawings, the same or similar members are denoted by the same or similar reference numerals, and redundant description is omitted.

  First, with reference to FIG. 1, the joining member manufacturing apparatus 1 which concerns on embodiment of this invention is demonstrated. FIG. 1 is a vertical cross-sectional view showing a schematic configuration of a joining member manufacturing apparatus 1. The joining member manufacturing apparatus 1 includes a first holder (hereinafter referred to as “first holder 10”) that holds a first member (hereinafter referred to as “first member D”), and a second member (hereinafter referred to as “first member D”). A second holding tool (hereinafter referred to as “second holding tool 20”), a chamber 30, a moving device 40, a decompression device 50, and a control device 60. Here, prior to detailed description of the bonding member manufacturing apparatus 1, the configuration of the bonding member manufactured by the bonding member manufacturing apparatus 1 is illustrated.

  FIG. 2A is a side view illustrating the configuration of the joining member C. FIG. FIG. 2B is a side view showing the deformed state of the first member D. FIG. The joining member C is a component in which the first member D and the second member E are sandwiched between layers of adhesive G as a resin (adhesive layer GL). In the present embodiment, a description will be given assuming that the first member D is a liquid crystal module with a backlight formed in a plate shape, and the second member E is a cover glass that protects the liquid crystal. As for the 1st member D, the surface of the plate-shaped component containing a liquid crystal becomes the 1st joined surface Df joined to the 2nd member E via the adhesive agent G. In the first member D, the surface opposite to the first bonding surface Df is a first back surface Db. The first back surface Db side of the first member D is a component including a drive circuit that supplies an electric signal to the liquid crystal and a backlight (light source). In the present embodiment, both the first bonding surface Df and the first back surface Db are formed flat. In the first member D, a space (not shown) is formed between the liquid crystal on the first bonding surface Df side and the component on the first back surface Db side. Since the first member D is typically manufactured under atmospheric pressure, air is contained in a space formed inside. As the first member D is depressurized, the air enclosed inside expands due to the pressure difference between the inside and outside. When the internal air expands due to decompression, the first member D deforms so that the back surface Db having a lower strength than the liquid crystal protrudes, as shown in FIG. 2B, in an environment where deformation is not hindered. It will be. In a state in which the deformation of the first member D is not limited, when the periphery of the first member D is reduced to less than atmospheric pressure, the pressure at which the back surface Db starts to expand so as to protrude is referred to as a predetermined pressure. To do.

  The second member E is typically formed in a plate shape, and one surface serves as a second joint surface Ef joined to the first joint surface Df via the adhesive G. The second joint surface Ef is formed flat in the present embodiment. In this embodiment, when the adhesive G is applied to the first member D or the second member E, the adhesive G is in the form of a liquid having a predetermined viscosity having fluidity, and is cured by being irradiated with ultraviolet rays. It is an optical resin that exhibits adhesive properties, and is a form of resin. The adhesive layer GL is formed such that the adhesive G that has fluidity before bonding the first member D and the second member E loses fluidity due to an increase in viscosity. . The adhesive layer GL attaches the first member D and the second member E, and also serves as an intermediate layer that keeps the interval between the first member D and the second member E at an appropriate interval when cured. To do.

  Returning to FIG. 1 again, the description of the joining member manufacturing apparatus 1 will be continued. The first holder 10 is a device that typically holds the first member D, and includes a first stage 11. The first stage 11 has a contact surface 11f with which the first member D contacts. The contact surface 11f is scheduled to come into contact with the back surface Db of the first member D when the joining member C (see FIG. 2A) is manufactured. The contact surface 11f has a shape including the back surface Db (or the first bonding surface Df) and is formed in an area larger than the back surface Db. The contact surface 11f is formed flat so that the entire back surface Db contacts. In the present embodiment, the first stage 11 is arranged with the contact surface 11f facing vertically upward. A suction hole 12 for sucking and holding the placed first member D is formed in the contact surface 11f. The suction hole 12 passes through the first stage 11 and reaches the back side of the contact surface 11f. The suction holes 12 are formed so that a plurality of suction holes 12 appear on the contact surface 11f so that the first holder 10 can stably hold the first member D.

  In the present embodiment, the second holding tool 20 is provided above the first holding tool 10, and includes an interval adjuster 23 and a pressing machine 25. The interval adjuster 23 typically includes a suction pipe 24 that holds the second member E by suction. The suction pipe 24 is disposed so as to extend in the vertical direction. A plurality of suction pipes 24 are provided so that the second member E can be stably held. The pressing machine 25 is a device that presses the second member E toward the first member D held by the first holder 10. The pressing machine 25 includes a second stage 26 that presses the second member E and a support arm 27 that supports the second stage 26. The second stage 26 has a pressing surface 26 f that contacts the second member E. The pressing surface 26f includes a shape that includes the second bonding surface Ef, and is formed in a larger area than the second bonding surface Ef. The pressing surface 26f is formed so that the entire surface on the opposite side of the second joint surface Ef of the second member E is in contact, and is formed flat in the present embodiment. The second stage 26 is formed to a thickness that can ensure sufficient rigidity to press the second member E. The second stage 26 is formed with a through hole 26h through which the suction pipe 24 passes. The number of through holes 26h is the same as the number of suction pipes 24 installed. The through hole 26h penetrates the second stage 26 from the pressing surface 26f to the back surface thereof. The suction pipe 24 passing through the through hole 26h is configured to be slidable with respect to the second stage 26. The support arm 27 extends in the vertical direction in the present embodiment.

  The chamber 30 provides a decompressed space that is a suitable environment when the first member D and the second member E are joined. A first stage 11 and a second stage 26 are accommodated in the chamber 30. The chamber 30 was gripped by the first member D gripped by the robot hand (not shown) and the robot hand (not shown) while the first stage 11 and the second stage 26 were separated in the vertical direction. It is formed in a size that can accommodate the second member E. The chamber 30 is typically formed in a rectangular parallelepiped shape. The chamber 30 is provided with a shutter 31 capable of forming an opening through which the first member D and the second member E can be taken in and out. The shutter 31 is provided on the side surface of the chamber 30. The shutter 31 is opened and closed by an opening / closing device 31a. The chamber 30 is configured so that the internal space 30r is sealed when the shutter 31 is closed. The chamber 30 is formed with an exhaust hole 35 for discharging air existing in the space 30r. The exhaust hole 35 is typically formed on the side surface opposite to the shutter 31.

  A first stage 11 is installed at the bottom of the chamber 30. The bottom of the chamber 30 and / or the first stage 11 is provided with a lock mechanism (not shown) that can fix the first stage 11 to the bottom of the chamber 30. A suction hole 32 is formed on the bottom surface of the chamber 30 so as to communicate with the suction hole 12 of the first stage 11. A first suction device 19 is connected to the suction hole 32 via a tube 18 or the like, and the first member D placed on the contact surface 11 f of the first stage 11 is moved by the operation of the first suction device 19. The first stage 11 is configured to be attracted and held. In the upper part of the chamber 30, a pipe hole 34 through which the suction pipe 24 passes and an arm hole 37 through which the support arm 27 passes are formed. The same number of pipe holes 34 as the number of suction pipes 24 are formed. The same number of arm holes 37 as the support arms 27 are formed. The suction pipe 24 passing through the pipe hole 34 is configured to be slidable with respect to the chamber 30. A second suction device 29 is connected to the end of the suction pipe 24 outside the chamber 30 via a tube 28 or the like, and the second member E is connected to the suction pipe 24 by the operation of the second suction device 29. It is comprised so that it can adsorb | suck and hold | maintain. The support arm 27 penetrating the arm hole 37 is configured to be slidable with respect to the chamber 30. A seal structure is applied to the portion of the chamber hole 30 through which the suction pipe 24 penetrates and the portion of the arm hole 37 through which the support arm 27 penetrates, respectively, so that the airtightness of the space 30r can be maintained. .

  In the present embodiment, the moving device 40 is a device that moves the second holder 20, and includes a distance adjuster moving device 43 and a pressing machine moving device 45. The interval adjuster moving device 43 is a device that reciprocates the interval adjuster 23 in a direction approaching and separating from the first stage 11. In this embodiment, the interval adjuster moving device 43 is configured to reciprocate the interval adjuster 23 (suction pipe 24) in the vertical direction. The interval adjuster moving device 43 is typically a robot-driven moving device that moves the interval adjuster 23 by a robot. The pressing machine moving device 45 is a device that reciprocates the pressing machine 25 in a direction approaching and separating from the first stage 11. In this embodiment, the pressing machine moving device 45 is configured to reciprocate the pressing machine 25 (second stage 26 and support arm 27) in the vertical direction. The pressing machine moving device 45 typically has a mechanism for reciprocating the pressing machine 25 in the vertical direction by air pressure. The reciprocating movement of the interval adjuster 23 by the interval adjusting machine moving device 43 and the reciprocating movement of the pressing machine 25 by the pressing machine moving device 45 are configured to be performed independently.

  The decompression device 50 is a device that reduces the pressure in the sealed chamber 30, and includes a vacuum pipe 51 and a vacuum pump 52. The vacuum pipe 51 forms a flow path for guiding the air in the chamber 30 to the outside of the chamber 30, and one end is connected to the exhaust hole 35 formed in the chamber 30. The vacuum pump 52 is disposed in the vacuum pipe 51 and is configured to discharge the air in the chamber 30 to the outside of the chamber 30 through the vacuum pipe 51. The vacuum pump 52 has the capability of reducing the pressure in the chamber 30 to a pressure suitable for bonding the first member D and the second member E via the adhesive G (pressure at the time of bonding). doing. The joining pressure is a negative pressure.

  The control device 60 is a device that controls the operation of the joining member manufacturing apparatus 1. The control device 60 is connected to a robot hand (not shown) that holds the first member D and a robot hand (not shown) that holds the second member E by a signal cable, and the first member D and the second member. E is configured so as to be able to transport E into and out of the chamber 30. The control device 60 is connected to the first suction device 19 communicating with the suction hole 12 of the first stage 11 and the second suction device 29 communicating with the suction pipe 24 via signal cables, respectively, and the lower member D and the upper member It is comprised so that the presence or absence of the vacuum suction of the member E can be controlled, respectively. The control device 60 is connected to an opening / closing device 31a for opening / closing the shutter 31 of the chamber 30 through a signal cable, and is configured to control the opening / closing of the shutter 31. Further, the control device 60 is connected to the interval adjuster moving device 43 and the press machine moving device 45 through signal cables, respectively, and is configured to be able to move the interval adjuster 23 and the press machine 25, respectively. Yes. The control device 60 is connected to the vacuum pump 52 with a signal cable, and is configured to control the start and stop of the vacuum pump 52.

  With continued reference to FIG. 3, the method for manufacturing the joining member according to the embodiment of the present invention will be described. FIG. 3 is a flowchart for explaining a manufacturing process of the joining member C (see FIG. 2A). The manufacturing method of the joining member C demonstrated below shall be performed with the joining member manufacturing apparatus 1 demonstrated so far. That is, the following description also serves as an explanation of the operation of the joining member manufacturing apparatus 1. In addition, manufacture of the joining member C can also be performed by methods other than operating the joining member manufacturing apparatus 1. In the following description of the manufacturing method of the joining member, when referring to the detailed configuration of the joining member manufacturing apparatus 1 and the joining member C, reference will be made to FIGS. 1 and 2 as appropriate.

  When starting the manufacture of the joining member C, the control device 60 opens the shutter 31 of the chamber 30, and the first member D held by the robot hand (not shown) and the second member held by the robot hand (not shown). The member E is carried into the chamber 30 (S1). In the present embodiment, the first member D is carried into the chamber 30 with the first joint surface Df facing upward, the second member E is placed above the first member D, and the second joint surface Ef is lowered. Into the chamber. In the present embodiment, a predetermined amount of adhesive G is applied to the second joint surface Ef before the second member E is carried into the chamber 30. The predetermined amount of the adhesive G is an amount of the adhesive G that allows the adhesive layer GL to have an appropriate thickness when the first member D and the second member E are joined via the adhesive G. In the present embodiment, the thickness of the adhesive G applied to the second bonding surface Ef is approximately 50 μm to 300 μm. In the present embodiment, since the second joint surface Ef to which the adhesive G is applied is directed downward, the adhesive G having a viscosity that does not sag is used.

  When the first member D and the second member E are carried into the chamber 30, the control device 60 uses the first back surface Db of the first member D held by the robot hand (not shown) as the contact surface 11 f of the first stage 11. Then, the first suction device 19 is operated. As a result, the first member D is sucked and held by the first holder 10. When the first member D is sucked and held by the first holder 10, the control device 60 retracts the robot hand (not shown) out of the chamber 30. The control device 60 makes the second suction machine 29 after the surface opposite to the second joint surface Ef of the second member E held by the robot hand (not shown) contacts the tip of the suction pipe 24. Is activated. As a result, the second member E is attracted and held by the interval adjuster 23. When the second member E is attracted and held by the interval adjuster 23, the control device 60 retracts the robot hand (not shown) out of the chamber 30.

  When the robot hand (not shown) is retracted out of the chamber 30, the first member D sucked and held by the first holder 10 and the second member E sucked and held by the distance adjuster 23 are first bonded. The surface Df and the adhesive G applied to the second bonding surface Ef are arranged to face each other with a relatively large distance (opposing arrangement step: S2). Here, the relatively large distance between the first bonding surface Df and the adhesive G applied to the second bonding surface Ef means that the robot hand (not shown) can enter and exit smoothly. In this state, if the inside of the chamber 30 becomes negative pressure and expands so that the first back surface Db of the first member D protrudes, the curvature of the first back surface Db is such that the first back surface Db is separated from the suction hole 12. Is a state where the allowable distance is open.

  When the first member D and the second member E are arranged to face each other, the control device 60 closes the shutter 31 and seals the inside of the chamber 30 (S3). Next, the control device 60 activates the interval adjuster moving device 43, and the first joint surface Df of the first member D adsorbed and held by the first holder 10 and the first adsorbed and held by the interval adjuster 23. The second member E is moved closer to the first member D so that the gap between the second member E and the adhesive G applied to the second bonding surface Ef becomes a predetermined distance (approach arrangement step: S4). Here, the predetermined interval is set so that the first back surface Db of the first member D protrudes with the pressure in the chamber 30 being joined in a state where the deformation of the first member D is not restricted (there is no object that prevents the deformation). The distance is smaller than the increase in thickness due to the expansion of the first member D when the first member D expands. Moreover, the pressure at the time of joining is a negative pressure (pressure lower than atmospheric pressure), and is a pressure suitable for joining the first member D and the second member E via the adhesive G. Is a pressure that can avoid the presence of cavities exceeding the allowable range in the adhesive layer GL when the bonding member C is used. In the present embodiment, the predetermined interval is approximately 0.1 mm to 0.5 mm. Further, when the outer periphery of the area where the adhesive G is applied is lowered (the outer periphery may be lowered due to the viscosity of the adhesive G), the first joint surface Df and the portion inside the outer periphery where the adhesive G is not lowered. Is a predetermined interval. When the first stage 11 is not fixed to the bottom of the chamber 30, the lock mechanism (not shown) is locked and fixed before the approach placement step (S4) is completed.

  When the first member and the second member E are arranged close to each other, the control device 60 operates the vacuum pump 52 to reduce the pressure in the chamber 30 (decompression step: S5). The control device 60 operates the vacuum pump 52 with the goal of reducing the pressure in the chamber 30 to the bonding pressure. When the pressure in the chamber 30 is decreased to a predetermined pressure, the first member D starts to expand so that the first back surface Db protrudes. Since the predetermined pressure is usually higher than the bonding pressure, the inside of the chamber 30 is continuously depressurized. When the pressure in the chamber 30 is lowered below a predetermined pressure, the first member D has a greater amount of protrusion of the first back surface Db. However, in this embodiment, since the distance between the first bonding surface Df and the adhesive G applied to the second bonding surface Ef is set to a predetermined interval in the approach placement step (S4), the first back surface Db Even if the first member D tries to increase the thickness of the first member D, the first member D comes into contact with the second member E, and further expansion of the first member D is prevented. Thereby, it can be avoided that the first back surface Db is curved and the first back surface Db is separated from the suction hole 12 due to the expansion of the space inside the first member D, and the first member D is held by suction. It can be avoided that the first holding tool 10 is displaced. In this way, the pressure at the time of joining in the chamber 30 is maintained without shifting the holding position of the first member D sucked and held by the first holder 10 and the second member E sucked and held by the interval adjuster 23. Can be lowered.

  When the inside of the chamber 30 decreases to the bonding pressure, the control device 60 operates the pressing machine moving device 45 and presses the second member E toward the first member D by the pressing machine 25 (pressing step: S6). . The pressing machine 25 presses the entire back surface of the second joining surface Ef of the second member E with the pressing surface 26f. By pressing the second member E coated with the adhesive G toward the first member D by the pressing machine 25 in a state where the pressure inside the chamber 30 is reduced to the bonding pressure, the pressure is mixed in the adhesive G. Crush the cavities. The gas component contained in the adhesive G is almost eliminated under vacuum (pressure state during bonding). Even if gas remains in the cavity after the gas escapes, the absolute amount is very small because it is in a vacuum. Therefore, after crushing the cavity, a cavity of a size that may cause a problem does not regenerate under normal pressure. In the present embodiment, the pressing machine moving device 45 presses the second member E toward the first member D with a force of approximately 50 kPa to 300 kPa, but may be pressed at 1 MPa or more. . When the pressing step (S6) is completed, the first member D and the second member E are joined members C joined via the adhesive layer GL having a predetermined thickness (S7). When the joining member C is completed, the control device 60 increases the pressure in the chamber 30 to the same level as the pressure outside the chamber 30, opens the shutter 31, and removes the joining member C from the chamber 30 by a robot hand (not shown). Then, the manufacture of the joining member C is completed.

  As described above, according to the bonding member manufacturing apparatus 1 and the bonding member manufacturing method according to the present embodiment, the first bonding surface Df and the second bonding surface Ef are applied in the sealed chamber 30. After the first member D and the second member are brought close to each other so that the distance between the adhesive G and the adhesive G becomes a predetermined distance, the inside of the chamber 30 is reduced to the pressure at the time of joining, so that the expansion of the first member D is suppressed It is possible to prevent the first back surface Db from being curved as the first member D is detached from the first holder 10. Further, since the expansion of the first member D is suppressed in the process of reducing the pressure in the chamber 30 to the bonding pressure, it is possible to suppress adverse effects on the products (the first member D and the bonding member C).

  In the above description, the first member D is the liquid crystal module. However, the first member D may be a member other than the liquid crystal module, whose back surface expands when the pressure is reduced. In addition, although the second member E is a cover glass, it may be a member suitable for bonding to the first member D other than the cover glass.

  In the above description, the first bonding surface Df and the first back surface Db of the first member D are both formed flat, but either one or both may be formed in a convex shape or a concave shape. Good. When the first bonding surface Df is not flat, the second bonding surface Ef is formed so as to correspond to the first bonding surface Df (so as to be appropriately bonded through the adhesive G). When Db is not flat, the contact surface 11f is formed so as to correspond to the first back surface Db.

  In the above description, the second holding tool 20 adjusts the distance between the second member E and the first member D, and the pressing device 25 presses the second member E toward the first member D. However, the functions of the interval adjuster 23 and the pressing device 25 are integrated to attract and hold the second member E in one stage, to adjust the interval with respect to the first member D, and to the first member D. It may be configured so that all pressing can be performed.

  In the above description, the configurations for holding the members of the first holding tool 10 and the second holding tool 20 are both configured to adsorb and hold the surfaces of the members. It may be a chuck structure that grips the outer peripheral edge. However, when the surface of the member is held by suction, the member can be held without applying a special device even when the size (outer peripheral length, area, shape) of the member changes, and the pressing step (S6). It is preferable because it can be easily pressed.

  In the above description, the moving device 40 is a device that moves the second holding tool 20. However, the moving device 40 may be a device that moves the first holding tool instead of the second holding tool 20, or the second holding tool 20. It is good also as an apparatus which moves both the holder 20 and the 1st holder 10. FIG.

  In the above description, the adhesive G is applied to the second joint surface Ef of the second member E before joining the first member D and the second member E, but not applied to the second joint surface Ef. Alternatively, it may be applied to the first joint surface Df of the first member D.

DESCRIPTION OF SYMBOLS 1 Joining member manufacturing apparatus 10 1st holding tool 11f Contact surface 20 2nd holding tool 23 Space | interval adjuster 25 Press machine 30 Chamber 40 Moving apparatus 43 Spacing apparatus moving apparatus 45 Pressing machine moving apparatus 50 Decompression apparatus 60 Control apparatus C Joining member D 1st member Db 1st back surface Df 1st joining surface E 2nd member Ef 2nd joining surface G Adhesive S space | interval

Claims (4)

A first member that starts to expand so that the back surface of the first joint surface protrudes when the surrounding pressure becomes a predetermined pressure lower than atmospheric pressure in a state where the deformation is not limited, and the first member faces the first joint surface. A second member having a second joining surface to be produced is an apparatus for producing a joined member joined via a resin;
A first holder that has a contact surface that contacts the back surface of the first bonding surface, and holds the first member in a state where the back surface is in contact with the contact surface;
A second holding tool for holding the second member in a state where the second bonding surface is opposed to the first bonding surface of the first member held by the first holding tool. When;
A sealable chamber for accommodating the first member held by the first holder and the second member held by the second holder;
A decompression device for decompressing the interior of the chamber;
The first joint surface of the first member held by the first holder and the second joint surface of the second member held by the second holder are relative to each other. A moving device that moves at least one of the first holder and the second holder so as to approach each other;
It is applied to one of the first joint surface of the first member held by the first holder and the second joint surface of the second member held by the second holder. In addition, after the interval between the resin and the bonding surface to which the resin is not applied is set to a predetermined interval, the chamber is depressurized from a pressure exceeding the predetermined pressure to a bonding pressure. A moving device and a control device for controlling the pressure reducing device;
The joining pressure is lower than the predetermined pressure, and is a pressure suitable for joining the first member and the second member via the resin;
The predetermined interval is set to be smaller than an increase in thickness at which the first member expands when the pressure exceeding the predetermined pressure is reduced to the pressure at the time of joining in a state where deformation is not limited. ;
Joining member manufacturing equipment. The controller controls the second member held by the second holder to the first member held by the first holder after reducing the pressure in the chamber to the joining pressure. Controlling the moving device to relatively press the members of
The joining member manufacturing apparatus according to claim 1. An interval adjuster for adjusting the interval between the resin applied to one of the first bonding surface and the second bonding surface and the bonding surface to which the resin is not applied. And a pressing machine that presses the second member against the first member held by the first holding tool independently of the spacing adjuster;
The moving device includes an interval adjuster moving device that brings the distance adjuster closer to the first holding tool, and a pressing machine moving device that brings the pressing machine closer to the first holding tool;
The joining member manufacturing apparatus according to claim 2. A first member that starts to expand so that the back surface of the first joint surface protrudes when the surrounding pressure becomes a predetermined pressure lower than atmospheric pressure in a state where the deformation is not limited, and the first member faces the first joint surface. A second member having a second joining surface to be produced is a method for producing a joined member joined via a resin;
In the sealable chamber, the first member of the first member held by the first holder in a state where the back surface of the first joint surface is in contact with the contact surface of the first holder. An approach arrangement in which the distance between the resin applied to one of the bonding surface and the second bonding surface of the second member and the bonding surface to which the resin is not applied is close to a predetermined distance. Process and;
A pressure reducing step for reducing the pressure in the chamber from a pressure exceeding the predetermined pressure to a pressure at the time of joining after the approaching arrangement step;
The joining pressure is lower than the predetermined pressure, and is a pressure suitable for joining the first member and the second member via the resin;
The predetermined interval is set to be smaller than an increase in thickness at which the first member expands when the pressure exceeding the predetermined pressure is reduced to the pressure at the time of joining in a state where deformation is not limited. ;
A method for manufacturing a joining member.

Images