JP2009010072A - Substrate-sticking device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate-sticking device having a high working efficiency and capable of preventing an engulfing of a bubble and coincidentally causing no crinkle or the like after the sticking. <P>SOLUTION: The substrate-sticking device comprises: a substrate holding part 30; a supporting-body-holding part 20 aligned to the substrate holding part 30 and provided to the substrate holding part 30 in a contacting-or-detaching capable manner with suction-holding a supporting body 50; a regulating means 23 of a direction of the contacting-or-detaching; a curvature forming body 33 provided to at least the substrate holding part 30; and a decompression chamber 10 housing the substrate holding part 30, the supporting-body-holding part 20, and the curvature forming body 33. The curvature forming body 33 causes curvature of a substrate 40 in convex shape in the decompression chamber 10 to cause curvature of at least the substrate 40 out of the substrate 40 and the supporting body 50, letting the supporting-body-holding part 20 approach to the substrate holding part 30, and sticking the substrate 40 to the supporting body 50 by depressing a central part of the supporting body 50 to a central part of the substrate 40. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a substrate sticking apparatus used when a thin substrate is stuck to another member.

  As semiconductor devices become thinner, silicon wafers are becoming thinner. When manufacturing semiconductor elements, various processes such as etching and through hole processing are performed on such a thin silicon wafer. In addition, in order to improve the production efficiency of semiconductor elements, large-sized silicon wafers have been used, making it difficult to handle the silicon wafer alone.

In recent years, in order to improve the handleability of a thin wafer, the thin wafer is sometimes attached to a reinforcing plate. When a thin wafer is attached to the reinforcing plate, the thin wafer coated with wax and the air chucked reinforcing plate face each other in the vacuum chamber and are separated from each other, and the thin wafer is heated. The wafer holding device (for example, Patent Document 1) for sticking the wafer to the reinforcing plate after the wax is made adhesive, or a pair of substrate holding portions made of a shape memory alloy is heated by a heater to deform the substrate holding portion. There is provided a pasting device (for example, Patent Document 2) and the like for pasting wiring substrates by pressing the substrates held in a curved state while facing each other.
Japanese Patent Publication No.8-1898 Japanese Patent Laid-Open No. 5-190406

In the pasting apparatus described in Patent Document 1, although a vacuum chamber is used, in order to bond flat surfaces together, there is a problem that air bubbles are trapped, and a horizontal direction parallel to the bonding surface at the time of pasting. When a force in the direction acts, there is a problem that wrinkles may occur after pasting.
On the other hand, in the sticking device described in Patent Document 2, since the objects to be attached are curved with respect to each other, it is possible to prevent entrainment of bubbles as much as possible. However, when the object to be attached is curved, the shape memory is used. Since it is necessary to heat the substrate holding part made of an alloy with a heater, and when the object to be attached is bent and after bonding, it takes time to release the object to be bent, There is a problem that work efficiency is low.

  Therefore, the present invention has an object to provide a substrate pasting apparatus that prevents air bubbles from being involved when a thin substrate is pasted to an object to be pasted, and that does not cause wrinkles after the pasting and has high work efficiency. .

  The present invention is a substrate sticking device used when attaching a substrate and a support that supports the substrate, the substrate holding portion formed so as to be able to hold the substrate by suction, and the substrate holding portion aligned with the substrate holding portion. And a support holding portion provided so as to be capable of moving toward and away from the substrate holding portion in a state where the support is sucked and held, and contact / separation direction regulating means for regulating the contact and separation direction of the support holding portion. A curved body formed of a diaphragm that is operated by fluid pressure and a pressure adjusting device that adjusts fluid pressure, and is provided in at least the substrate holder of the substrate holder and the support body holder, and the substrate A holding part, the supporting body holding part, and the curve forming body, and a decompression chamber provided so that the internal space can be decompressed. Of diaphragm By curving the central portion in a convex shape, at least the substrate of the substrate and the support is curved following the shape of the diaphragm, and the support holding portion is brought close to the substrate holding portion, The substrate sticking apparatus is characterized in that the substrate is attached to the support by pressing the center of the support against the center of the substrate.

  Another invention is a substrate sticking device used when sticking a substrate and a support that supports the substrate, a support holding portion formed so that the support can be sucked and held, and the support holding A substrate holding portion that is positioned so as to be in contact with and separated from the support holding portion while holding the substrate by suction, and a contact / separation movement that regulates the contact / separation direction of the substrate holding portion. A curve forming body comprising a direction regulating means, a diaphragm that is provided in at least the substrate holding portion of the substrate holding portion and the support holding portion, and that is operated by a fluid pressure and a pressure adjusting device that adjusts the fluid pressure; A pressure reducing chamber that accommodates the substrate holding part, the support holding part, and the curve forming body, and that is provided so that the internal space can be depressurized. The device is the diamond By curving the central portion of the ram in a convex shape, at least the substrate of the substrate and the support is curved following the shape of the diaphragm, and the substrate holding portion is brought close to the support holding portion. A substrate pasting apparatus for pasting the substrate onto the support by pressing the center of the substrate against the center of the support.

  Further, the contact / separation direction restricting means is a leaf spring that connects the support holding part and the decompression chamber. By adopting the above configuration, the contact / separation movement restricting means can be configured with a simple configuration.

  Further, the contact / separation direction restricting means is a leaf spring that connects the substrate holding part and the decompression chamber. Thereby, a board | substrate and a support body can be correctly affixed on each adsorption | suction part.

The suction surface of the substrate holding part and the support holding part is provided with a suction position indicating part at a position corresponding to the size of the substrate and the support.
The substrate holding part, the support holding part, the diaphragm, and the decompression chamber are each made of a transparent material.
By these, since the sticking state of the board | substrate and support body in a sticking apparatus can be confirmed, adjustment of the pressing force at the time of pressing a board | substrate and a support body can be performed easily.

  According to the substrate sticking apparatus according to the present invention, when a thin substrate is stuck on a support, air bubbles are prevented from being caught, and wrinkles are not generated after being stuck. Further, the work efficiency of attaching the substrate to the support can be greatly improved as compared with the conventional case.

  Hereinafter, an embodiment of a substrate pasting device concerning the present invention is described based on a drawing.

(First embodiment)
FIG. 1 is an explanatory diagram illustrating a schematic configuration of a substrate pasting apparatus according to the present embodiment. 2 and 3 are assembly configuration diagrams of the substrate holder. FIG. 4 is a cross-sectional view showing the assembled state of the substrate holder.
The substrate pasting apparatus 100 according to the present embodiment is a silicon wafer that is a substrate in which a GaAs substrate 50 that is a flat support body is curved in a convex shape toward the GaAs substrate 50 in a decompression chamber 10. The GaAs substrate 50 and the silicon wafer 40 are pasted together by pressing to 40.
In this embodiment, the thicknesses of the silicon wafer 40 and the GaAs substrate 50 are 300 μm or less and 400 μm or more, respectively.

As shown in FIG. 1, the decompression chamber 10 is formed in a rectangular parallelepiped shape by a material that is transparent to at least visible light, such as a transparent acrylic plate or a transparent PVC plate. The decompression chamber 10 is configured by assembling the upper half portion 11 and the lower half portion 12 with a locking tool 14. A sealing member 13 is disposed on the joint surface with the upper half portion 11 in the lower half portion 12.
The upper half 11 is provided with a rod through hole 16 and an air tube through hole 17, and the lower half 12 is provided with an air tube through hole 17. The rod through hole 16 is connected to a support holding unit 20 described later, and a rod 21 for vertically moving the support holding unit 20 in the height direction in the decompression chamber 10 is inserted. An air tube T communicating with the vacuum pumps 15A, 15B, 15C is inserted into the air tube through-hole 17. The rod through hole 16 and the air tube through hole 17 are advantageously provided with sealing materials 16S and 17S that do not hinder the movement of the rod 21 and the air tube T.

  Inside the decompression chamber 10, a support holding unit 20 that sucks and holds a GaAs substrate 50 as a support and a silicon wafer 40 as a substrate are sucked and held, and the sucked silicon wafer 40 is supported as a GaAs substrate 50 as a support. And a substrate holding portion 30 that is curved in a convex shape toward the surface. The support holding unit 20 and the substrate holding unit 30 are disposed in the decompression chamber 10 in a state where they are positioned in the plane direction, and the rod 21 is protruded into the decompression chamber 10 to thereby support the support holding unit 20. Can be moved toward and away from the substrate holder 30.

One end of a rod 21 is connected to the support holding unit 20, and the other end of the rod 21 is located outside the decompression chamber 10 via the rod through hole 16. Connected to the other end of the rod 21 is a servo motor 22 for moving the support holder 20 to and from the substrate holder 30. The rod 21 in this embodiment has a hollow structure, and an air tube T communicating with the vacuum pump 15 </ b> B and the suction portion 24 of the support holding portion 20 is inserted into the rod 21.
The support holder 20 is also formed of a transparent material such as a transparent acrylic plate or a transparent PVC plate.

  Since the support body holding part 20 is moved toward and away from the substrate holding part 30 in a state of being positioned in the plane direction (XY direction), the contact and separation movement regulation for regulating the contact and separation movement direction is performed. A plate spring 23 as means is provided. The leaf spring 23 connects one end portions of the two plates and is formed in a substantially U shape. The free ends of the leaf springs 23 are connected to the inner wall surface of the decompression chamber 10 (upper half portion 11) and the support holder 20 respectively. By using such a leaf spring 23, the support holding unit 20 can be moved only in the Z direction (height direction) while restricting movement in the plane direction (XY direction) in the decompression chamber 10. it can.

The support holding unit 20 holds the GaAs substrate 50 by suction using an air chuck of the suction unit 24. The air tube T connected to the support holder 20 is inserted into the rod 21, appears from the outside of the decompression chamber 10 to the outside of the rod 21, and is connected to the vacuum pump 15B.
The suction part 24 of the support holding part 20 is provided with a suction position indicating part 25 indicating the position where the GaAs substrate 50 should be sucked by air in accordance with the size of the GaAs substrate 50.

  The substrate holding unit 30 includes an adsorbing unit 32 that adsorbs the silicon wafer 40 by air, a curve forming body 33 for curving the silicon wafer 40 adsorbed and held by the adsorbing unit 32 toward the GaAs substrate 50, and And a base 38 to be placed. The substrate holding unit 30 is also formed of a material transparent to at least visible light, such as a transparent acrylic plate or a transparent PVC plate, and the suction unit 32 has a silicon wafer 40 according to the dimensions of the silicon wafer 40. A suction position indicating unit 32Z that indicates a position where the air should be sucked by air is provided.

The base 38 is fixed to the lower box 12.
The base 38 is formed with a first air flow path 39 </ b> A communicating with the suction part 32 and a second air flow path 39 </ b> B communicating with the curve forming body 33, and the first air flow path 39 </ b> A is formed on the support holding part 20. It is connected to the vacuum pump 15B to which the suction part 24 is connected. The second air flow path 39B is connected to the vacuum pump 15C and the pressure adjusting device 36. On the upper surface of the base 38, there are sealing members 37 for hermetically separating the first air flow path 39A and the second air flow path 39B and the substrate holding part 30 and the outside of the substrate holding part 30, respectively. It is arranged twice. One end portion of the first air flow path 39A communicates between the sealing members 37, 37 arranged in a double manner. The second air flow path 39B extends from the side surface of the base 38 to the central portion of the base 38, and then bends in the vertical direction to communicate with the upper surface of the diaphragm base 35.

As shown in FIGS. 2 to 4, the suction portion 32 and the curve forming body 33 are placed on the upper surface of the base 38.
As shown in FIG. 2, suction holes 32 </ b> A are formed on the upper surface side of the suction part 32 with a required interval. The suction holes 32 </ b> A are arranged radially from the central portion of the upper surface of the suction portion 32 toward the outer peripheral edge of the suction portion 32. The suction part 32 is fixed to the base 38 with screws or the like (not shown). Further, the suction portion 32 has a suction position support portion 32Z indicating a suction position corresponding to the diameter size of the silicon wafer 40 to be sucked, like the suction position instruction portion 25 in the support holding portion 20, and the support body 40 to be sucked. It is arrange | positioned in the position according to the magnitude | size.
Further, as shown in FIG. 3, a groove 32B formed in the inner wall surface on the curved portion forming body 33 side to a depth of about 0.5 mm is formed in the suction portion 32 while bridging each suction hole 32A. It is formed radially toward the outer periphery.

  As shown in FIG. 4, the adsorbing part 32 has a U-shaped cross-section and accommodates the curve forming body 33 in a space formed by the adsorbing part 32 and the base 38. The curve forming body 33 includes a diaphragm 34 and a diaphragm base 35. The curve forming body 33 is adjusted by adjusting the fluid pressure (air pressure) introduced into the curve forming body 33 by the pressure adjusting device 36 that adjusts the fluid pressure. Curve. The diaphragm base 35 is fixed to the base 38 with screws or the like (not shown).

  As is apparent from FIG. 4, a concave groove 35 </ b> A that extends radially from the central portion of the diaphragm base 35 toward the outer peripheral edge is formed on the upper surface of the diaphragm base 35. The position of the end portion of the recessed groove 35A is on the inner side of the screwing portions of the diaphragm 34 and diaphragm base 35. A communication hole 35B communicating with the second air flow path 39B of the base 38 is formed in the central portion of the concave groove 35A. The diaphragm 34 is stretched on the diaphragm base 35 so as to cover the concave groove 35A. The diaphragm 34 is attached to the diaphragm base 35 by screwing it along the outer periphery of the diaphragm 34 at regular intervals.

  As shown in FIG. 1, the pressure adjusting device 36 includes a pressure sensor 36A and a control unit 36B that controls the operation of the vacuum pump 15C. The pressure sensor 36A detects the fluid pressure (air pressure) in the space formed by the diaphragm 34 and the concave groove 35A, and the control means 36B controls the output of the vacuum pump 15C based on the measurement data from the pressure sensor 36A. As a result, the air pressure in the space formed by the diaphragm 34 and the groove 35A is made higher than the air pressure in the internal space of the decompression chamber 10. Thereby, the center part of the diaphragm 34 can be curved in the shape which protruded toward the upper side (supporting body holding | maintenance part 20 side).

  As described above, the groove 32B formed to a depth of about 0.5 mm on the diaphragm side surface of the suction part 32 bridges the suction holes 32A toward the outer peripheral edge of the suction part 32. Since it is formed radially, even if the upper surface of the diaphragm 34 and the suction surface of the suction portion 32 are in close contact, the suction hole 32A communicates with the vacuum pump 15B via the groove 32B and the first air flow path 39A, and silicon The air chuck of the wafer 40 can be maintained. Since the gap between the diaphragm 34 and the suction portion 32 is very small, the suction surface of the suction portion 32 is also deformed following the deformed shape of the diaphragm 34. That is, the silicon wafer 40 sucked and held by air suction from the suction holes 32 </ b> A is also in a state where the central portion is curved in a convex shape toward the support holder 20.

Next, a method for attaching a thin substrate and a substrate support using the substrate attaching apparatus 100 according to the present embodiment will be described. 5-7 is a front view which shows the bonding state of a silicon wafer and a GaAS substrate.
First, the upper half part 11 and the lower half part 12 of the decompression chamber 10 are disassembled, and the GaAs substrate 50 is adsorbed to the support holding part 20 in which air suction by the vacuum pump 15B is made effective according to the adsorption position instruction part 25. Thereafter, an adhesive or a double-sided tape is applied to the exposed surface of the GaAs substrate 50. Further, after the silicon wafer 40 is positioned and sucked to the suction position instruction part 32Z of the substrate holding part 30, the decompression chamber 10 is assembled by combining the upper half part 11 and the lower half part 12 by the locking tool 14. After assembling the decompression chamber 10, the internal space of the decompression chamber 10 is decompressed by a vacuum pump 15A that is a decompression device. In the present embodiment, the pressure is reduced so that the internal space of the decompression chamber 10 has a pressure of 65 KPa lower than the atmospheric pressure (about 101 KPa), and is given to the suction parts 24 and 32 of the support holding part 20 and the substrate holding part 30, respectively. The pressure difference between the air suction pressure and the atmospheric pressure is set to 70 KPa or more.

  After the decompression process of the internal space of the decompression chamber 10 is completed, the pressure sensor 36A and the control means 36B provided in the pressure adjusting device 36 are in the space formed by the diaphragm 34 and the concave groove 35A of the diaphragm base 35. The output of the vacuum pump 15 </ b> C is adjusted so that the pressure is about 30 to 40 KPa lower than the atmospheric pressure. By doing so, the diaphragm 34 is in a positive pressure state with respect to the internal space of the decompression chamber 10 and the suction pressures of the suction portions 24 and 32, and the central portion of the diaphragm 34 protrudes toward the support holding portion 20. Curve to state. As the diaphragm 34 is deformed, the suction portion 32 and the silicon wafer 40 sucked and held by the suction portion 32 are bent convexly toward the GaAs substrate 50 (FIG. 5).

  After the silicon wafer 40 is bent in a convex shape toward the support holding unit 20 (GaAs substrate 50) by the curved forming body 33, the rod 21 is projected toward the substrate holding unit 30 by the servo motor 22 and held flat. The formed GaAs substrate 50 is pressed against the top portion of the convexly curved silicon wafer 40 (FIG. 6). After that, the servo motor 22 gradually pushes out the rod 21, and affixes the GaAs substrate 50 and the silicon wafer 40 while gradually pressing the silicon wafer 40 so as to become flat (FIG. 7). By pressing the GaAs substrate 50 against the silicon wafer 40 in this manner, the GaAs substrate 50 is gradually bonded from the central portion of the silicon wafer 40 toward the outer peripheral edge portion of the silicon wafer 40.

In this way, by pressing the GaAs substrate 50 against the curved silicon wafer 40 in the decompressed space in the decompression chamber 10, bubbles can be mixed when the silicon wafer 40 is attached to the GaAs substrate 50. Can be prevented. Further, the GaAs substrate 50 is pressed toward the silicon wafer 40 in a state where the lateral displacement is restricted, so that no wrinkle is generated after the bonding.
When the bonding of the silicon wafer 40 and the GaAs substrate 50 is completed, the suction of the support portions 20 or the suction portions 24 and 32 of the substrate holding portion 30 is released, and the atmospheric pressure in the decompression chamber 10 is restored to the atmospheric pressure. After the decompression chamber 10 is disassembled, the work in which the silicon wafer 40 is bonded to the GaAs substrate 50 is taken out.

  As described above, since the decompression chamber 10, the support holding unit 20, and the substrate holding unit 30 are formed of a material that is at least transparent to visible light, the bonding is performed while checking the bonding state of the silicon wafer 40 and the GaAs substrate 50. Can be attached. This is advantageous because the operation of attaching the silicon wafer 40 and the GaAs substrate 50 can be performed while adjusting the operating speed of the servo motor 22 and the degree of bending of the silicon wafer 40.

(Second Embodiment)
FIG. 8 is a schematic configuration diagram of a substrate pasting apparatus according to the second embodiment. In the first embodiment, in a state where the silicon wafer 40 that is a thin substrate is curved, the GaAs substrate 50 that is a flat support is brought close to the top of the silicon wafer 40 and pressed, and the silicon wafer 40 is pressed against the GaAs substrate 50. Although the form which affixes the wafer 40 was demonstrated, in this embodiment, the GaAS substrate 50 is simply hold | maintained flat and the form which makes the curved silicon wafer 40 approach the GaAs substrate 50 is demonstrated. In the present embodiment, detailed description is omitted by using the same numbers for members having the same configuration as in the previous embodiment.

  In this embodiment, since the substrate holding unit 30 approaches the support holding unit 20, a leaf spring 23 that is a contact / separation movement restricting unit is attached to the substrate holding unit 30 and the decompression case 10. The rod 21 and the servo motor 22 are also attached to the base 38 of the substrate holder 30. The support body holding part 20 is fixed to the upper half part 11 or the lower half part 12.

  Also in this embodiment, bubbles are mixed when the silicon wafer 40 is bonded to the GaAs substrate 50 by pressing the GaAs substrate 50 against the curved silicon wafer 40 in the decompressed space in the decompression chamber 10. Can be prevented as much as possible. Further, since the silicon wafer 40 is pressed toward the GaAS substrate 50 in a state in which the displacement in the lateral direction is restricted, wrinkles do not occur after pasting.

(Third embodiment)
FIG. 9 is a schematic configuration diagram of a substrate pasting apparatus according to the third embodiment. In the first embodiment and the second embodiment, a description is given of a form in which only one of the silicon wafer 40 as a substrate or the GaAs substrate 50 as a support is curved in a convex shape toward the object to be attached. However, in this embodiment, both the board | substrate 41 and the support body 51 of a board | substrate are set as the form curved to convex shape toward a sticking object, respectively. That is, the support holding unit 20 in the first embodiment and the second embodiment is characterized by having the same configuration as the substrate holding unit 30.

In FIG. 9, the member numbers in the substrate holding unit 30 are applied as they are to the components of the substrate holding unit 30 applied to the support holding unit 20.
In the case of this embodiment, the support body holding part 20 is provided so as to be movable toward and away from the substrate holding part 30. The configuration necessary for the contact / separation movement of the support holding unit 20 can employ the same configuration as that of the first and second embodiments.

  In the present embodiment, both the substrate 41 and the substrate support 51 are curved in a convex shape toward the object to be adhered in the decompressed space in the decompression chamber 10, so that they are attached to each other. In doing so, it is possible to more suitably prevent bubbles from being mixed. In addition, since the substrate support 51 is pressed toward the substrate 41 in a state in which the lateral displacement is restricted, no wrinkles are generated after pasting.

Although the invention of the present application has been described above based on the embodiment, the substrate sticking device 100 according to the invention of the present application is not limited to the configuration in the embodiment described above, and various modifications can be made without changing the gist of the invention. Of course, even if it is performed, it may belong to the technical scope of the present invention. For example, in the above embodiments, the silicon wafer 40 having a thickness of 300 μm or less is used as the substrate and the GaAs substrate 50 having a thickness of 400 μm or more is used as the support. Of course, it is not limited to the combination of the silicon wafer 40 and the GaAs substrate 50 described.
For example, as a substrate, a thin silicon wafer, a thin GaAs wafer, a film, a tape, a thin printed circuit board, a lead frame, a metal film, etc. can be considered. On the other hand, as a substrate support, a silicon thick wafer, glass, a metal plate, or the like can be considered. For these, it is sufficient that the substrate has a thickness that makes handling difficult, and a substrate support that has a thickness that can improve the handling properties of the substrate that has been difficult to handle. The plate thickness is not limited. Further, the present invention is not intended only for handling a thin substrate, and the present invention can be applied when a thin substrate is attached to another material.

Further, in the above embodiment, each of the decompression chamber 10, the support holding unit 20, and the substrate holding unit 30 is formed of a material transparent to at least visible light such as a transparent acrylic plate or a transparent PVC plate. Only the decompression chamber 10 is formed of a material transparent to at least visible light, and the support holding unit 20 and the substrate holding unit 30 are not necessarily formed of the above transparent material.
In short, it is only necessary to have a configuration in which the attachment state of the substrate and the support in the decompression chamber 10 can be confirmed.

  Furthermore, in the embodiment described above, the servo motor 22 is employed as a power source for moving the support holding unit 20 and / or the substrate holding unit 30 in contact with and away from each other, but a power source other than the servo motor is used. Of course, the rod 21 can be operated by human power without using a power source. According to this embodiment, it is possible to finely adjust the pressure on the substrate and the support while visually observing, and it is advantageous because the substrate sticking device 100 can be provided at a low cost.

It is explanatory drawing which shows schematic structure of the board | substrate sticking apparatus in 1st Embodiment. It is an assembly block diagram of a board | substrate holding part. It is an assembly block diagram of a board | substrate holding part. It is sectional drawing which shows the assembly state of a board | substrate holding part. It is a front view which shows the bonding state of a silicon wafer and a GaAS board | substrate. It is a front view which shows the bonding state of a silicon wafer and a GaAS board | substrate. It is a front view which shows the bonding state of a silicon wafer and a GaAS board | substrate. It is explanatory drawing which shows schematic structure of the board | substrate sticking apparatus in 2nd Embodiment. It is explanatory drawing which shows schematic structure of the board | substrate sticking apparatus in 3rd Embodiment.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Pressure reduction chamber 11 Upper half part 12 Lower half part 13 Seal member 14 Locking tool 15A, 15B, 15C Vacuum pump 16 Rod through-hole 17 Air tube through-hole 20 Support body holding part 21 Rod 22 Servo motor 23 Plate spring 24 Suction part 25 Suction position instruction part 30 Substrate holding part 32 Suction part 32A Suction hole 32B Groove 32Z Suction position instruction part 33 Curve forming body 34 Diaphragm 35 Diaphragm base 35A Concave groove 35B Communication hole 36 Pressure adjusting device 37 Seal member 38 Base 40 Silicon wafer 41 Substrate 50 GaAs substrate 51 Substrate support 100 Substrate pasting apparatus T Air tube

Claims (6)

A substrate pasting apparatus used when pasting a substrate and a support that supports the substrate,
A substrate holding part formed so that the substrate can be sucked and held;
A support holding part that is aligned with the substrate holding part and is provided so as to be movable toward and away from the substrate holding part while adsorbing and holding the support;
Contact / separation direction regulating means for regulating the contact / separation direction of the support holding part;
A curved body formed by a diaphragm that is operated by fluid pressure and a pressure adjusting device that adjusts fluid pressure, provided in at least the substrate holder of the substrate holder and the support holder;
A pressure reducing chamber that accommodates the substrate holding part, the support holding part, and the curve forming body, and is provided so that the internal space can be depressurized;
Depressurizing the decompression chamber;
By curving the central portion of the diaphragm in a convex shape by the pressure adjusting device, at least the substrate of the substrate and the support is curved following the shape of the diaphragm,
The substrate sticking apparatus, wherein the substrate holding device is attached to the support by bringing the support holding portion closer to the substrate holding portion and pressing the central portion of the support against the central portion of the substrate. A substrate pasting apparatus used when pasting a substrate and a support that supports the substrate,
A support holding part formed so as to be capable of adsorbing and holding the support; and
A substrate holding portion that is aligned with the support holding portion and is provided so as to be movable toward and away from the support holding portion in a state where the substrate is sucked and held;
Contact / separation direction regulating means for regulating the contact / separation direction of the substrate holder;
A curved body formed by a diaphragm that is operated by fluid pressure and a pressure adjusting device that adjusts fluid pressure, provided in at least the substrate holder of the substrate holder and the support holder;
A pressure reducing chamber that accommodates the substrate holding part, the support holding part, and the curve forming body, and is provided so that the internal space can be depressurized;
Depressurizing the decompression chamber;
By curving the central portion of the diaphragm in a convex shape by the pressure adjusting device, at least the substrate of the substrate and the support is curved following the shape of the diaphragm,
A substrate pasting apparatus for pasting the substrate on the support by bringing the substrate holding part closer to the support holding part and pressing the central part of the substrate against the central part of the support.   The substrate pasting apparatus according to claim 1, wherein the contact / separation direction regulating means is a leaf spring that connects the support holding unit and the decompression chamber.   3. The substrate pasting apparatus according to claim 2, wherein the contact / separation direction regulating means is a leaf spring that connects the substrate holding part and the decompression chamber.   5. The suction position indicating portion is provided at a position corresponding to the size of the substrate and the support on the suction surfaces of the substrate holding portion and the support holding portion. The board | substrate sticking apparatus as described in any one of them.   6. The substrate pasting apparatus according to claim 1, wherein the substrate holding unit, the support holding unit, the diaphragm, and the decompression chamber are each formed of a transparent material.