JP2019106493A - Method for sticking adhesive tape to substrate and device for sticking adhesive tape to substrate - Google Patents

Abstract

To stick an adhesive tape to a substrate without leaving unnecessary deformation stress on the substrate leading to warp of the substrate and without forming air bubbles between the substrate and the adhesive tape.SOLUTION: An adhesive tape sticking device A1 includes a resilient pressing portion 15 having a pressing surface 150 inflated at a required curvature, a carrier 1 having chuck claws 130 and 130a that can be held in a state where a substrate 5 is curved and deformed along the expanded pressing surface 150, and a tape application table 2 having a flat work surface 20.SELECTED DRAWING: Figure 1

Description

  BACKGROUND OF THE INVENTION Field of the Invention The present invention relates to a method of applying an adhesive tape to a substrate and an apparatus for applying the adhesive tape to a substrate.

  For example, in recent years, the thickness of a substrate mounted with a semiconductor or the like, which is employed in the manufacture of a semiconductor package, is increasing. On the other hand, since the substrate is easily deformed even when a slight load is applied, it causes problems such as dropping off, particularly in the transportation of the substrate between the units in the resin sealing device.

  For this reason, the adhesive tape was attached to the back surface of the substrate, that is, the surface on which electronic components such as semiconductors are not mounted, thereby improving the strength (deformation resistance) of the substrate to solve the above problems, and resin sealing was performed. After that, the adhesive tape is peeled off to make a product.

  In addition, in affixing operation of the adhesive tape, the substrate is positioned at a predetermined position (arrangement in the material supply unit or the like) so that the adhesive force of the adhesive tape is not weakened or the surface is undulated. In order to prevent deterioration in accuracy, it is necessary to suppress the generation of air bubbles between the substrate and the adhesive tape.

  Among such devices, as an apparatus for sticking in such a manner that air bubbles do not occur between a thin substrate and an adhesive tape, there is, for example, one described in Patent Document 1. This bonding apparatus has a guide provided on a support plate attached to the upper chamber and a heater roller provided so as to be able to move up and down by a cylinder. Then, while heating the heating adhesive tape attached to the semiconductor wafer (hereinafter referred to as a substrate) under vacuum with the movement of the upper chamber after release to the atmosphere, the heater roller is pressed and rolled to place the heating adhesive tape on the substrate Adhere closely.

JP, 2009-246067, A

However, the conventional tape sticking apparatus has the following problems.
That is, in this apparatus, when the heating adhesive tape is brought into close contact with the substrate by rolling the heater roller, the heating adhesive tape is pressed against the substrate with a relatively strong pressing force.

  As a result, a relatively strong pressing force is applied to the substrate, and coupled with the heating of the heater roller, deformation stress that warps toward the attachment surface remains on the substrate even after the heating adhesive tape is attached. As a result, the substrate is warped.

  If the substrate warps in one direction, the same problem as described above, in which an obstacle such as easy detachment of the substrate occurs in the subsequent transport of the substrate, can not be solved.

  The present invention has been made in view of the above points, and prevents bubbles from being generated between the substrate and the adhesive tape without leaving unnecessary deformation stress on the substrate which leads to the warp of the substrate. It is an object of the present invention to provide a method for applying an adhesive tape to a substrate and an apparatus for applying an adhesive tape to a substrate, in which the adhesive tape can be attached to the substrate.

(1) In order to achieve the above object, according to the method of sticking an adhesive tape to a substrate of the present invention, the substrate is placed along the pressing surface of a resilient pressing portion having a pressing surface expanded with a required curvature. Between the step of curving and holding and holding, the step of disposing an adhesive tape in a flat state so that the adhesive surface faces the substrate between the flat work surface and the curved substrate, the pressing surface and the above After the work surface comes close to contact with the adhesive surface of the adhesive tape and the maximum bulging portion of the substrate expanded toward the work surface, the substrate is deformed to have a flat shape, and surface contact is made. And the step of sticking the pressure-sensitive adhesive tape to the substrate by sequentially expanding the contact surface of the substrate with the pressure-sensitive adhesive surface.

  According to the present invention, the substrate is curved and deformed along the pressing surface of the pressing portion having the elasticity forming the pressing surface having a predetermined curvature, thereby holding the substrate against the pressing surface. So that the part that leaves is not substantially generated. Also, at this time, the substrate is not curved to a strain (twist), but the stress of bending is distributed evenly and evenly in a balanced manner to exhibit a smooth curved shape.

  For example, when holding the substrate, when the pressing surface is pressed against the flat substrate, the pressing surface is deformed so as to resist the elastic force and to have a flat shape because the pressing portion has elasticity. In this state, when the end of the substrate is held and the pressing force is released, the pressing surface is restored to the original curved state by the elastic force of the pressing portion. Thus, the substrate is bent and held along the pressing surface.

  In addition, by arranging the adhesive tape flat between the flat work surface and the curved substrate so that the adhesive surface faces the substrate, the work surface and the required substrate can be obtained by bringing the work surface and the substrate close to each other. It becomes possible to hold the pressure-sensitive adhesive tape with the substrate expanded with curvature and to bring the substrate into contact with the pressure-sensitive adhesive surface of the pressure-sensitive adhesive tape. Furthermore, when the curved substrate is brought into contact with the adhesive surface of the flat adhesive tape, both contact states can be initiated from point contact or line contact.

  The pressing surface and the work surface move close to each other, and after the maximum bulging portion of the substrate expanded toward the work surface is brought into contact with the adhesive surface of the adhesive tape, the substrate is deformed to a flat shape to make surface contact By shifting the contact surface of the substrate with the adhesive surface sequentially, the adhesive tape can be attached to the substrate. Thus, the adhesive tape can be attached to the substrate without leaving unnecessary deformation stress on the substrate leading to the warp of the substrate and without generating air bubbles between the substrate and the adhesive tape.

  That is, after bringing the maximum bulging portion of the substrate bulging toward the work surface into contact with the adhesive surface of the adhesive tape, the substrate is deformed toward a flat shape, and transition to surface contact is made sequentially with the adhesive surface. By widening the contact surface of the substrate, the maximum bulging portion of the substrate and the adhesive surface of the adhesive tape start from point contact or line contact, and come into close contact while spreading the contact surface from the inside to the outside. As a result, the air between the substrate and the adhesive tape is sequentially displaced from the inside to the outside and finally escapes outward, so that the generation of air bubbles can be suppressed. Moreover, since the stress acting on the substrate at this time is a stress in the direction in which the substrate approaches the original flat shape, no new strong stress acts, and unnecessary deformation stress leading to the warp of the substrate is applied to the substrate. It can be suppressed to be left.

(2) In order to achieve the above object, according to the method of attaching an adhesive tape to a substrate of the present invention, the substrate is curved and deformed along the pressing surface of the pressing portion forming the pressing surface expanded with a required curvature. A step of disposing a pressure-sensitive adhesive tape in a flat state so that the pressure-sensitive adhesive surface faces the substrate between the flat work surface having elasticity and the curved substrate, the pressing surface, and The work surface moves toward the work surface, and the maximum bulging portion of the substrate expanded toward the work surface is brought into contact with the adhesive surface of the adhesive tape, and then the work surface is directed to a curved shape having a required curvature. And a step of attaching the pressure-sensitive adhesive tape to the substrate by deforming, shifting to surface contact and sequentially expanding the contact surface of the substrate with the pressure-sensitive adhesive surface.

  According to the present invention, the substrate is bent and held along the pressing surface of the pressing portion forming the pressing surface expanded with a required curvature, and thereby the substrate is separated from the pressing surface by a portion So that it does not occur substantially. Further, at this time, the substrate is not curved to a strain, but the stress of bending is distributed evenly and in a balanced manner and curved, so that it exhibits a smooth curved shape.

  Further, by arranging the adhesive tape in a flat state so that the adhesive surface faces the substrate between the flat work surface having elasticity and the curved substrate, the work surface and the substrate can be brought close to each other. It is possible to hold the pressure-sensitive adhesive tape between the substrate expanded with a required curvature and to make the substrate abut on the pressure-sensitive adhesive surface of the pressure-sensitive adhesive tape. Furthermore, when the curved substrate is brought into contact with the adhesive surface of the flat adhesive tape, both contact states can be initiated from point contact or line contact.

  After the pressing surface and the work surface move close to each other and the maximum bulging portion of the substrate swelled toward the work surface is brought into contact with the adhesive surface of the adhesive tape, the work surface is deformed to a curved shape with a required curvature. The adhesive tape can be attached to the substrate by sequentially shifting the contact surface of the substrate with the adhesive surface by shifting to surface contact and sequentially. Thus, the adhesive tape can be attached to the substrate without leaving unnecessary deformation stress on the substrate leading to the warp of the substrate and without generating air bubbles between the substrate and the adhesive tape.

  That is, after bringing the maximum bulging portion of the substrate bulging toward the work surface into contact with the adhesive surface of the adhesive tape, the work surface is deformed so as to have a curved shape with a required curvature while maintaining the curved shape of the substrate. By shifting to surface contact and sequentially expanding the contact surface of the substrate with the adhesive surface, the maximum bulging portion of the substrate and the adhesive surface of the adhesive tape start from point contact or line contact, and the adhesive tape is with the work surface By making contact while spreading the contact surface from the inside to the outside while being deformed, air between the substrate and the adhesive tape is sequentially swept from the inside to the outside and finally escapes outward, so that air bubbles are generated. Can be suppressed. Further, at this time, a strong stress does not particularly act on the substrate maintaining the curved shape, and it is possible to suppress the unnecessary deformation stress which leads to the warp of the substrate from remaining on the substrate.

(3) In the method for attaching an adhesive tape to a substrate according to the present invention, the pressing surface, which is a flat surface, is deformed at the required curvature to bend the pressing surface as a step prior to the step of bending and holding the substrate. It may be configured to include a process.

  In this case, for example, the shape, material, elasticity or flexibility of the target substrate is different by fixing the pressing surface which is a flat surface by deforming the pressing portion and bending it with a required curvature. Even if the curved shape at the curvature can not cope with the application according to the purpose, by appropriately adjusting the curvature of the pressing surface, the appropriate curvature of the substrate necessary for the adhesion of the adhesive tape can be found and the curvature It becomes possible to set the degree.

(4) The method of sticking an adhesive tape to a substrate according to the present invention may be configured to perform an operation in which the pressing surface and the working surface approach each other by moving the pressing surface with respect to the working surface at a fixed position.

  In this case, it is not necessary to move the work surface in the affixing operation of the adhesive tape by moving the press surface with respect to the work surface in the fixed position. For example, in an accessory device such as an adhesive tape supply device It is not necessary to provide a special mechanism for supplying the adhesive tape without trouble to the working surface to be moved, which can contribute to simplification or downsizing of the apparatus.

(5) In the method of sticking an adhesive tape to a substrate according to the present invention, the adhesive tape may be fixed to the work surface, and the fixing may be performed by suction.

  In this case, the pressure-sensitive adhesive tape is fixed to the work surface, and the fixing is performed by suction, so that the occurrence of a deviation, wrinkles, etc. of the pressure-sensitive adhesive tape accompanying the work of sticking the pressure-sensitive adhesive tape can be suppressed. Moreover, in adsorption | suction, adjustment of adsorption | suction force is easy, and it is possible to fix to a work surface, without damaging an adhesive tape by setting to appropriate suction | attraction force.

(6) In order to achieve the above object, the adhesive tape sticking apparatus to a substrate according to the present invention comprises a resilient pressing portion having a pressing surface inflated at a required curvature, or a pressing force inflated at a required curvature. A carrier having a pressing portion having elasticity capable of forming a surface, and a holding means capable of holding the substrate in a state of being curved and deformed along the bulging pressing surface, and a flat work surface on which an adhesive tape is disposed And a tape application table capable of relative advancing and retreating operations with the carrier, with the working surface facing the pressing surface expanding toward the working surface.

  According to the present invention, an elastic pressing portion having a pressing surface expanded with a required curvature, or an elastic pressing portion capable of forming a pressing surface expanded with a required curvature, and a pressing surface obtained by expanding a substrate By including a carrier having a holding means capable of holding a curvedly deformed state along the line, it is possible to move to a predetermined place while holding a substrate before mounting a semiconductor, for example, by the carrier is there.

  Then, the carrier has a pressing portion having an elasticity and a pressing surface formed with a predetermined curvature, whereby the substrate is held along the pressing surface, thereby curving at a curvature matching the curvature of the pressing surface. It can be done. Further, since the pressing portion has elasticity, when the substrate is held, the pressing surface is pressed against the flat substrate to be deformed toward the flat shape, and in this state, the pressing force is released to bend the pressing surface to the original curvature. When restored to the state, the substrate is bent and held along the pressing surface.

  In addition, by having a pressing portion having elasticity capable of forming a pressing surface expanded with a required curvature, for example, the shape, material, elasticity or flexibility of the target substrate is different, and a fixed curvature is obtained. In the curved shape, even if it is not possible to cope with the application according to the purpose, it is possible to find the proper curvature of the substrate by appropriately adjusting the curvature of the pressing surface to form the pressing portion.

  Furthermore, by having the holding means capable of holding the substrate in a state of being curved and deformed along the expanded pressing surface, there is substantially no part between the substrate and the pressing surface. It can be kept along. Further, at this time, the substrate is not curved to a strain, but the stress of bending is distributed evenly and in a balanced manner and curved, so that it exhibits a smooth curved shape.

  In addition, it has a flat work surface on which the adhesive tape is disposed, and the work surface is opposed to the pressing surface which expands toward the work surface, and provided with a tape application table capable of relative movement with the carrier. Thus, the work surface of the tape application table and the pressing surface can be brought close, and the substrate along the pressing surface can be brought into contact with the adhesive tape disposed in the vicinity of the work surface.

  As a result, the air between the substrate and the adhesive tape is sequentially displaced from the inside to the outside and finally escapes outward, so that the generation of air bubbles can be suppressed. Moreover, since the stress acting on the substrate at this time is a stress in the direction in which the substrate approaches the original flat shape, no new strong stress acts, and unnecessary deformation stress leading to the warp of the substrate is applied to the substrate. It can be suppressed to be left.

(7) In order to achieve the above-mentioned object, the sticking device of the adhesive tape to the substrate of the present invention forms a pressing portion in which a pressing surface inflated with a required curvature is formed or a pressing surface inflated with a required curvature. A carrier having holding means capable of holding the pressable portion and the substrate in a state of being curved and deformed along the expanded press surface, and a flat work surface having elasticity for disposing an adhesive tape, And a tape application table capable of relative movement with the carrier with the work surface opposed to the pressing surface expanding toward the work surface.

  According to the present invention, a pressing portion having a pressing surface expanded with a required curvature, or a pressing portion capable of forming a pressing surface expanded with a required curvature, and a curved deformation along a pressing surface with a substrate being expanded By providing a carrier having holding means that can be held in a held state, it is possible to move to a predetermined position while holding the substrate before mounting a semiconductor, for example, by the carrier.

  Then, the carrier has the pressing portion in which the pressing surface which is expanded with the required curvature is formed, whereby the substrate is held along the pressing surface so that the substrate is curved with a curvature matching the curvature of the pressing surface. it can.

  Further, by having a pressing portion capable of forming a pressing surface expanded with a required curvature, for example, the shape, material, elasticity or flexibility of the target substrate is different, and in the curved shape with a fixed curvature, Even if it is not possible to cope with the purpose of adhering, by appropriately adjusting the curvature of the pressing surface to form the pressing portion, it is possible to find the appropriate curvature of the substrate.

  Furthermore, by having the holding means capable of holding the substrate in a state of being curved and deformed along the expanded pressing surface, there is substantially no part between the substrate and the pressing surface. It can be kept along. Further, at this time, the substrate is not curved to a strain, but the stress of bending is distributed evenly and in a balanced manner and curved, so that it exhibits a smooth curved shape.

  Also, by providing a tape application table that has a flat work surface with elasticity and allows the work surface to move relative to the carrier with the work surface facing the pressing surface that bulges toward the work surface. The work surface of the tape application table and the pressing surface can be brought close, and the substrate along the pressing surface can be brought into contact with the adhesive tape disposed in the vicinity of the working surface.

  As a result, the air between the substrate and the adhesive tape is sequentially displaced from the inside to the outside and finally escapes outward, so that the generation of air bubbles can be suppressed. Moreover, since the stress acting on the substrate at this time is a stress in the direction in which the substrate approaches the original flat shape, no new strong stress acts, and unnecessary deformation stress leading to the warp of the substrate is applied to the substrate. It can be suppressed to be left.

(8) The pressure-sensitive adhesive tape sticking apparatus to a substrate according to the present invention may be configured to include a curve adjusting unit that deforms the pressing portion and curves the pressing surface with a required curvature.

  In this case, for example, the shape, material, elasticity, flexibility, or the like of the target substrate is different by deforming the pressing portion and curving it with a required curvature, and the curved shape with the fixed curvature has the purpose. It is possible to find the appropriate curvature of the substrate necessary for affixing the adhesive tape and set the degree of curvature by appropriately adjusting the curvature of the pressing surface, even if there is a problem that it can not cope with pasting along Become.

(9) The pressure-sensitive adhesive tape-adhering apparatus to a substrate according to the present invention may have a configuration in which the pressing surface expanded with a predetermined curvature is a side surface of a cylinder and a partially curved surface.

  In this case, after bringing the maximum bulging portion of the substrate bulging toward the work surface into line contact with the adhesive surface of the adhesive tape, the pressing surface or the work surface is deformed to have a desired shape, and By shifting to contact and sequentially expanding the contact surface of the substrate with the adhesive surface, it is possible to closely contact while spreading the contact surface from the inside to the outside.

(10) In the adhesive tape sticking apparatus according to the present invention, relative movement between the carrier and the tape sticking base is performed by moving the carrier relative to the tape sticking base in a fixed position. It may be a configuration to be

  In this case, the relative movement between the carrier and the tape application table is performed by moving the carrier with respect to the tape application table in a fixed position, whereby the adhesive tape application work is performed using the tape application table. There is no need to move the work surface. Therefore, it is not necessary to provide a special mechanism for supplying the adhesive tape to the working surface, for example, in an accessory device such as an adhesive tape supply device, which contributes to simplification or downsizing of the device. can do.

(11) The adhesive tape sticking apparatus to a substrate according to the present invention may be configured so that the adhesive tape is fixed to the work surface, and includes a suction unit for fixing the adhesive tape.

  In this case, the pressure-sensitive adhesive tape is fixed to the work surface, and the fixing is performed by suction, so that the occurrence of a deviation, wrinkles, etc. of the pressure-sensitive adhesive tape accompanying the work of sticking the pressure-sensitive adhesive tape can be suppressed. Moreover, in adsorption | suction, adjustment of adsorption | suction force is easy, and it is possible to fix to a work surface, without damaging an adhesive tape by setting to appropriate suction | attraction force.

  According to the present invention, the adhesive tape can be attached to the substrate without leaving unnecessary deformation stress on the substrate leading to the warp of the substrate and without forming air bubbles between the substrate and the adhesive tape. It is possible to provide a method for applying an adhesive tape to a substrate and an apparatus for applying an adhesive tape to a substrate.

BRIEF DESCRIPTION OF THE DRAWINGS It is a schematic front view explanatory drawing which shows 1st Embodiment of the adhesive tape sticking apparatus which concerns on this invention. The structure of the carrier of an adhesive tape sticking apparatus is shown, (a) is planar view explanatory drawing, (b) is bottom surface explanatory drawing. It is plane view explanatory drawing which shows the structure of a tape sticking apparatus provided with an adhesive tape sticking apparatus. The process of sticking an adhesive tape on a board | substrate is shown, (a) is explanatory drawing of the waiting | standby state of a carrier, (b) is explanatory drawing of the preparation state of a carrier. The process of sticking an adhesive tape on a board | substrate is shown, (a) is explanatory drawing of the state which the carrier descend | fell to the predetermined position, (b) is explanatory drawing of the state clamped by the chuck nail | claw. The process of sticking an adhesive tape on a board | substrate is shown, (a) is explanatory drawing of a state which a carrier hold | maintained a board | substrate and raised to the predetermined position, The state which moved the carrier above the adhesive tape sticking work bench FIG. The process of sticking an adhesive tape to a board | substrate is shown, (a) is an explanatory view of the state which began to stick an adhesive tape to a board | substrate on a pressure-sensitive adhesive tape pasting table by lowering a carrier. It is explanatory drawing of the state which was made to finish the sticking operation | work of an adhesive tape. While showing the 2nd Embodiment of the adhesive tape sticking apparatus which concerns on this invention, the process of sticking an adhesive tape on a board | substrate is shown, (a) makes a carrier descend, An adhesive tape is stuck on a substrate on an adhesive tape sticking work stand. (B) is an explanatory view of a state in which the adhesive tape sticking operation is finished by further lowering the carrier. It is front view explanatory drawing which shows the modification of the carrier which comprises the adhesive tape sticking apparatus which concerns on this invention.

The embodiment of the present invention will be described in more detail with reference to FIGS. 1 to 3.
The adhesive tape sticking apparatus A1 according to the present invention shown in FIG. 1 is adopted in the tape sticking apparatus 9 shown in FIG. Moreover, the tape sticking apparatus 9 comprises the process in front of the resin sealing apparatus (the whole illustration is abbreviate | omitted) which manufactures a semiconductor package.

  The tape bonding apparatus 9 has a unit base 90 having a square shape in plan view. At a base end of one of the unit bases 90 (left in FIG. 3), a substrate supply unit 91 for supplying the substrate 5 before mounting the semiconductor is disposed. In addition, a substrate storage portion 92 for storing a substrate 5 to which an adhesive tape 6 to be described later is attached is disposed at the other (the right in FIG. 3) proximal end of the unit base 90.

  In the vicinity of the substrate supply unit 91 (upward in FIG. 3), a substrate holding unit 93 for holding the substrate 5 by the carrier 1 described later and a tape sticking unit 94 for sticking the adhesive tape 6 to the substrate 5 are juxtaposed . The substrate holding unit 93 has a square substrate mounting table 930 whose upper surface is flat.

  Further, in the tape sticking section 94, a tape feeder 60 for supplying the adhesive tape 6 to the tape sticking table 2 is installed. In addition, a substrate drawing mechanism 95 for moving the substrate 5 to the substrate holding unit 93 is provided on the side of the substrate holding unit 93 opposite to the substrate holding unit 93 (rightward in FIG. 3).

  In the vicinity (upper side in FIG. 3) of the substrate storage portion 92, a substrate transfer portion 96 for mounting and transferring the substrate 5 to which the adhesive tape 6 is attached is provided. A substrate storage mechanism 97 for storing the substrate 5 to which the adhesive tape 6 is attached is provided in the substrate storage portion 92 on the opposite side of the substrate transfer portion 96 (right side in FIG. 3) to the substrate extraction mechanism 95. There is.

  Further, the carrier 1 is disposed on the unit base 90 so as to be movable between the substrate holding unit 93, the tape sticking unit 94 and the substrate transfer unit 96. In addition, the carrier 1 can also carry out an operation of transporting the substrate 5 to which the adhesive tape 6 is attached to the next process such as a resin sealing unit.

  The carrier 1 is provided with an adhesive tape sticking device A1 for sticking the adhesive tape 6 to the back surface of the strip-like substrate 5 together with a tape sticking base 2 (shown in FIG. 1 and FIG. Configure.

  Adhesive tape sticking apparatus A1 is provided with the carrier 1 and the tape sticking stand 2 as mentioned above. The carrier 1 has a substantially square frame 10 as shown in FIG. Guide shafts 11 and 11 a are fixed between the two longitudinal frames 100 in parallel with the short frame 101 at two locations near the longitudinal ends of the frame 10. Two sliders 12 and 12a are slidably fitted in the guide shafts 11 and 11a, respectively.

  The sliders 12 and 12 a fitted in the guide shafts 11 and 11 a are located one by one on both sides of the center frame 102 of the frame 10. The chuck mounting bars 13 and 13a are fixed to the slider 12 of the guide shaft 11 and the slider 12a of the guide shaft 11a on both sides of the center frame 102, respectively.

  The chuck mounting bars 13 and 13a have a line symmetrical shape, and chuck claws 130 and 130a are provided at four positions at equal intervals in the longitudinal direction at the outer edge of each. Each chuck claw 130, 130 a has an inward protruding hooking portion 131, 131 a, and the hooking portion 131, 131 a can be hooked and held on the edge of the substrate 5.

  A pressure plate 14 is fixed to the frame 10 at a lower position (downward in FIG. 1) of the chuck mounting bars 13 and 13a. The pressing plate 14 is formed to have substantially the same length as the longitudinal direction of the frame 10, and the length in the short direction is the hooking portions 131, 131a of the chuck claws 130, 130a facing each other in the left-right direction in FIG. The length between them is set to substantially the same length.

  The lower surface 140 of the pressing plate 14 is formed like a side surface of a cylinder (or cylinder) and a partially curved surface so as to expand toward the tape application table 2 with a required curvature (see FIG. 1). On the lower surface 140, a pressing portion 15 formed of an elastic body is fixed substantially over the entire surface. The pressing portion 15 has the same thickness as a whole, and is fixed along the lower surface 140 so that the lower surface, that is, the pressing surface 150 also forms a curved surface similar to the lower surface 140.

  It is preferable that the material of the pressing portion 15 be uniform and have uniform elasticity as a whole, and in the present embodiment, it is a hard sponge, but it is not limited to this. Moreover, although the shape of the pressing surface 150 of the pressing part 15 is a curved surface shape similar to the lower surface 140 in the present embodiment, it may be a spherical surface and a partially curved surface. Also in this case, an action substantially equivalent to the action of the embodiment described later is exhibited.

  The hooks 131 and 131a in the closed state of the respective chuck claws 130 and 130a are positioned close to the outside of the pressing surface 150, and the height thereof is substantially the same as the corner of the outer edge of the pressing surface 150. It is the height (see Figure 1). Further, two pins 16 are provided upright at the center of the frame 10 in the longitudinal direction on the upper surface of the pressing plate 14 so as to sandwich the center frame 102.

  Each pin 16 is held by a movable portion (not shown) of the chuck claw drive unit 17 installed on the frame 10. As a result, the chuck claw driving unit 17 can perform expansion and contraction movement of the chuck claws 130 and 130a opposite to each other in the left and right direction within a predetermined range. Further, the carrier 1 is attached to the transition body main body 19 via the attachment member 18 and can move together with the transition body main body 19.

  As described above, the tape application table 2 is located at the required fixed position of the tape application unit 94, and is made of a rigid metal. In the tape application table 2, the rectangular upper surface is a flat work surface 20. As described above, the adhesive tape 6 having a necessary length is supplied to the work surface 20 from the tape supply device 60. Moreover, the tape sticking stand 2 is equipped with the adsorption mechanism (illustration omitted) which adsorb | sucks the adhesive tape 6 to the working surface 20 using negative pressure.

(Action)
The operation of the adhesive tape sticking apparatus A1 according to the present embodiment provided in the tape sticking apparatus 9 will be described with reference to FIG. 1 to FIG. 3 and FIG. 4 to FIG. In FIGS. 4 to 7 (the same applies to FIG. 8 described later), the frame 10 of the carrier 1 is not shown.

(1) The substrate 5 supplied from the substrate supply unit 91 is drawn out by the substrate drawing mechanism 95 and placed on the upper surface of the substrate mounting table 930 of the substrate holding unit 93.
(2) The carrier 1 is moved above the substrate mounting table 930 (see FIG. 4A). Then, the distance between the chuck claws 130 and 130a facing each other in the left-right direction is expanded in the arrow direction by the chuck claw drive unit 17 (see FIG. 4B).

(3) The carrier 1 is lowered in the direction of the arrow to bring the pressing surface 150 of the pressing portion 15 into contact with the substrate 5 on the substrate mounting table 930, and the carrier 1 is further lowered. Since the pressing portion 15 has elasticity, the pressing surface 150 is deformed so as to resist a resilient force toward a flat shape. Then, when the hook portions 131 and 131a of the chuck claws 130 and 130a are lowered to a position lower than the edge of the substrate 5, the chuck claws 130 and 130a are stopped (see FIG. 5A).

(4) The distance between the chuck claws 130 and 130a facing each other in the left-right direction is narrowed in the arrow direction by the chuck claw drive unit 17 and held from the bottom of the substrate 5 (see FIG. 5B).

(5) When the carrier 1 is raised and the substrate 5 held by the chuck claws 130 and 130a is lifted, the pressing force on the pressing unit 5 is released. Thereby, the pressing surface 150 is restored to the original curved state by the elastic force of the pressing portion 15. As a result, the substrate 5 is bent and deformed along the pressing surface 150 while resisting the restoring force of its own elasticity, and is held by a repulsive force or the like which tends to return to its original flat shape (FIG. a) see).

(6) The adhesive tape 6 is supplied from the tape feeder 60 onto the work surface 20 of the tape application table 2. At the same time, the adhesive tape 6 is adsorbed to the work surface 20 by the adsorption mechanism and fixed in a flat state (see FIG. 6B). In particular, in a state before the substrate 5 comes into contact with the adhesive tape 6, the adhesive tape 6 does not necessarily have to be adsorbed and may float from the work surface 20. In this case, the pressure-sensitive adhesive tape 6 is pushed by the substrate 5 in contact and moved to the tape application table 2 to be adsorbed.

(7) The carrier 1 is lowered to bring the maximum bulging portion 50 of the substrate 5 expanded toward the work surface 20 into contact with the adhesive surface (reference numeral omitted) which is a surface opposite to the substrate 5 of the adhesive tape 6. Thereby, the largest bulging part 50 of the board | substrate 5 and the adhesive surface of the adhesive tape 6 make a line contact (refer Fig.7 (a)). In the present embodiment, the tape application table 2 is at the fixed position, and the carrier 1 moves so as to approach the tape application table 2. Conversely, the tape application table 2 is moved toward the carrier 1 at the fixed position. May be configured to move.

(8) The carrier 1 is further lowered to deform the substrate 5 to a flat shape. As a result, the contact surface moves from line contact to surface contact and adheres while sequentially spreading the contact surface from the inside to the outside. As a result, the air between the substrate 5 and the adhesive tape 6 is sequentially expelled from the inside to the outside and finally escapes outward, so that generation of air bubbles between the substrate 5 and the adhesive tape 6 can be suppressed. In addition, if the curved surface shape of a board | substrate is partial spherical shape as mentioned above, it will start from a point contact instead of a line contact.

  Further, since the stress acting on the substrate 5 at this time is a stress in the direction in which the substrate approaches the original flat shape, no new strong stress acts, and unnecessary deformation stress leading to the warp of the substrate Can be suppressed (see FIG. 7 (b)). As a result, it is possible to suppress the occurrence of warpage in one surface direction on the substrate 5 after the adhesive tape 6 is attached.

  A second embodiment of the adhesive tape sticking apparatus will be described with reference to FIG. The parts other than the parts different from the adhesive tape sticking apparatus A1 described below have substantially the same structure, are indicated by the same reference numerals in FIG. 8 and the description of the structure is omitted.

  Unlike the pressure-sensitive adhesive tape sticking apparatus A1, in the pressure-sensitive adhesive tape sticking apparatus A2, the pressing portion 14a of the carrier 1a has rigidity, and the pressing surface 140a is not substantially deformed. In addition, the tape application unit 2a has elasticity, and the working surface 20a is elastically deformed. Furthermore, the tape application part 2a which has the working surface 20a has required thickness, and is being fixed to the flat-shaped base plate 21 which has rigidity.

  According to the adhesive tape sticking apparatus A2, after the adhesive tape 6 is adsorbed and fixed to the working surface 20a of the tape sticking part 2a (corresponding to the above-mentioned working stroke (6)), the carrier 1a is lowered and directed to the working surface 20a The largest bulging portion 50a of the substrate 5 which has swelled is brought into contact with the adhesive surface (reference numeral omitted) which is a surface opposite to the substrate 5 of the adhesive tape 6. As a result, the maximum bulging portion 50a of the substrate 5 and the adhesive surface of the adhesive tape 6 are in line contact with each other (see FIG. 8A).

  Further, the carrier 1a is lowered and the pressing surface 140a is pressed against the work surface 20a, and the work surface 20a is deformed so as to move to a curved shape having a required curvature while maintaining the curved shape of the substrate 5 as it is. As a result, the contact surface moves from line contact to surface contact and adheres while sequentially spreading the contact surface from the inside to the outside. As a result, the air between the substrate 5 and the adhesive tape 6 is sequentially expelled from the inside to the outside and finally escapes outward, so that generation of air bubbles between the substrate 5 and the adhesive tape 6 can be suppressed.

  Further, at this time, the substrate 5 is only curved along the pressing surface 140 a within the range of elastic deformation, and no new stress is generated with the work of sticking the adhesive tape 6 to the substrate 5. Unnecessary deformation stress leading to the warpage of the substrate 5 can be suppressed from remaining at 5 (see FIG. 8B). As a result, it is possible to suppress the occurrence of warpage in one surface direction on the substrate 5 after the adhesive tape 6 is attached.

  With reference to FIG. 9, the modification of the carrier which comprises an adhesive tape sticking apparatus is demonstrated. The parts other than the part different from the carrier 1 described below have substantially the same structure and are indicated by the same reference numerals in FIG. The description is omitted.

  The carrier 1 b is different from the carrier 1 in that the carrier 1 b includes a bending adjustment mechanism 109 capable of adjusting the curvature of the curved surface of the pressing surface 150 b of the resilient pressing portion 15 b.

  The bending adjustment mechanism 109 has a pressing plate 14b, and a metal bending adjustment plate 151 having a required flexibility is attached below the pressing plate 14b. The curved adjusting plate 151 has a space 108 between the pressing plate 14 b and the other end of the pressing plate 14 b.

  On the lower surface of the bending adjustment plate 151, a pressing portion 15b having the same thickness as the whole is fixed. The pressing portion 15 b is formed of an elastic body, and the lower surface is a pressing surface 150 b. In addition, a screw rod 105 is fixed and erected on the upper surface of the bending adjustment plate 151 via the fixture 107.

  The screw rod 105 is rotatably passed through an axial hole 104 of a bearing 103 provided on the pressing plate 14b. A disc-shaped adjusting tool 106 is rotatably provided on the bearing 103 by screwing a central threaded hole (not shown in the figure) to the threaded rod 105.

  According to this curve adjusting mechanism 109, by rotating the adjusting tool 106 in the forward and reverse directions, the screw rod 105 is moved up and down to move the central portion of the curve adjusting plate 151 up and down to make the curve adjusting plate 151 flat. It can also be curved. Further, along with the deformation of the bending adjustment plate 151, the pressing portion 15b attached to the bending adjustment plate 151 is also deformed, and the curvature of the pressing surface 150b at the time of bending becomes substantially the same as the curvature of the adjusting plate 151. In addition, it can also be set as the structure which performs raising / lowering operation of the screw rod 105 by the drive device which has a motor etc.

  Further, as a pre-process of the step of bending and holding the substrate 5, the pressing portion 15b is deformed and bent with a required curvature, for example, the shape, material, elasticity or flexibility of the target substrate 5 becomes. A substrate necessary for attaching the adhesive tape 6 by appropriately adjusting the curvature of the pressing surface 150b, even if the curved shape with different and fixed curvatures can not cope with the application according to the purpose. It becomes possible to find the proper curvature of 5 and set the degree of curvature.

  The terms and expressions used in the present specification and claims are for descriptive purposes only and are not limiting in any way, and the features and characteristics described in the present specification and claims There is no intention to exclude terms or expressions that are equivalent to some. Further, it goes without saying that various modifications are possible within the scope of the technical idea of the present invention.

A1 Adhesive tape sticking apparatus 1 Carrier 10 Frame 100 Longitudinal frame 101 Short frame 11, 11a Guide shaft 12, 12a Slider 102 Center frame 13, 13a Chuck attachment bar 130, 130a Chuck claw 131, 131 Hooking part 14 Holding plate 140 Lower surface 15 Pressing portion 150 Pressing surface 16 Pin 17 Chuck claw driving portion 18 Mounting member 19 Transition body main body 2 Tape sticking base 20 Working surface 5 Substrate 50 Maximum swelling portion 6 Adhesive tape 60 Tape feeding machine 9 Tape sticking device 90 Unit base 91 Substrate Supply unit 92 substrate storage unit 93 substrate holding unit 930 substrate mounting table 94 tape attaching unit 95 substrate drawing out mechanism 96 substrate transition unit 97 substrate accommodating mechanism A2 adhesive tape attaching device 1a carrier 14a pressing portion 140a pressing surface 2a tape attaching portion 20a working surface 21 board 50a maximum Large bulging portion 1b Carrier 15b Pressing portion 150b Pressing surface 14b Holding plate 109 Curved adjustment mechanism 151 Curved adjustment plate 103 Bearing 104 Shaft hole 105 Threaded rod 106 Adjustment tool 107 Attachment 108 Space

Claims (11)

Holding the substrate in a curved shape so as to be along the pressing surface of the resilient pressing portion having a pressing surface expanded with a required curvature;
Between the flat work surface and the curved substrate, disposing an adhesive tape in a flat state so that the adhesive surface faces the substrate;
After the pressing surface and the working surface move close to each other and the maximum bulging portion of the substrate expanded toward the working surface is brought into contact with the adhesive surface of the adhesive tape, the substrate is moved toward a flat shape Affixing the adhesive tape to the substrate by deforming, shifting to surface contact, and sequentially expanding the contact surface of the substrate with the adhesive surface, and attaching the adhesive tape to the substrate. Holding the substrate in a curved shape so as to be along the pressing surface of the pressing portion forming the pressing surface expanded with a required curvature;
Disposing an adhesive tape in a flat state so that the adhesive surface faces the substrate, between a flat work surface having elasticity and the curved substrate;
After the pressing surface and the working surface move close to each other and the maximum bulging portion of the substrate expanded toward the working surface is brought into contact with the adhesive surface of the adhesive tape, the working surface is curved to a required curvature. And a step of attaching the adhesive tape to the substrate by deforming to a shape, shifting to surface contact, and sequentially expanding the contact surface of the substrate with the adhesive surface. How to apply The pressure-sensitive adhesive tape to a substrate according to claim 1 or 2, further comprising the step of deforming the pressing portion so as to bend the pressing surface with a required curvature as a pre-process of the step of bending and holding the substrate. Sticking method. The method for attaching an adhesive tape to a substrate according to any one of claims 1 to 3, wherein the operation of bringing the pressing surface and the working surface close to each other is performed by moving the pressing surface with respect to the working surface at a fixed position. The method for attaching an adhesive tape to a substrate according to claim 1, wherein the adhesive tape is fixed to the work surface, and the fixing is performed by suction. An elastic pressing portion having a pressing surface expanded with a required curvature, or an elastic pressing portion capable of forming a pressing surface expanded with a required curvature, and a substrate being curved along the expanded pressing surface A carrier having holding means capable of holding in a deformed state;
A tape application table having a flat work surface on which an adhesive tape is disposed, the work surface facing the press surface expanding toward the work surface, and capable of relative movement with the carrier An adhesive tape sticking device to a substrate. A pressing portion having a pressing surface expanded with a required curvature, or a pressing portion capable of forming a pressing surface expanded with a required curvature, and holding the substrate in a state of being curved and deformed along the expanded pressing surface A carrier with possible holding means;
A tape having an elastic flat work surface on which an adhesive tape is disposed, the work surface being opposed to the pressing surface expanding toward the work surface, and capable of relative movement with the carrier. An adhesive tape sticking device to a substrate comprising a sticking table. The sticking apparatus of the adhesive tape with respect to the board | substrate of Claim 6 or 7 provided with the curve adjustment means which deform | transforms the said press part and curves the said press surface with a required curvature. The sticking device of the adhesive tape to the substrate according to claim 6, 7, or 8, wherein the pressing surface expanded with a predetermined curvature is a side surface of a cylinder and a partial curved shape. The adhesion to the substrate according to claim 6, 7, 8 or 9, wherein relative movement between the carrier and the tape application table is performed by moving the carrier with respect to the tape application table in a fixed position. Tape sticking device. The sticking apparatus of the adhesive tape with respect to the board | substrate of Claim 6, 7, 8, 9 or 10 provided with the adsorption | suction means to which the said adhesive tape is fixed to the said working surface, and performs the fixation.

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