JP2023096605A - Tape sticking device, resin molding system, tape sticking method, and manufacturing method of resin molding - Google Patents

Tape sticking device, resin molding system, tape sticking method, and manufacturing method of resin molding Download PDF

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JP2023096605A
JP2023096605A JP2021212475A JP2021212475A JP2023096605A JP 2023096605 A JP2023096605 A JP 2023096605A JP 2021212475 A JP2021212475 A JP 2021212475A JP 2021212475 A JP2021212475 A JP 2021212475A JP 2023096605 A JP2023096605 A JP 2023096605A
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tape
elastic member
holding mechanism
stage
bending
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JP7240479B1 (en
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一平 北
Ippei Kita
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Towa Corp
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Towa Corp
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Priority to JP2021212475A priority Critical patent/JP7240479B1/en
Priority to PCT/JP2022/034772 priority patent/WO2023127207A1/en
Priority to CN202280080090.2A priority patent/CN118355478A/en
Priority to KR1020247018282A priority patent/KR20240091275A/en
Priority to TW111142340A priority patent/TWI835393B/en
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Publication of JP7240479B1 publication Critical patent/JP7240479B1/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67288—Monitoring of warpage, curvature, damage, defects or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Replacement Of Web Rolls (AREA)

Abstract

To suppress generation of a non-adhered part of a tape to an elastic member.SOLUTION: A tape sticking device comprises: a tape holding mechanism 21; a bending mechanism 23 which is positioned while being spaced apart from the tape holding mechanism 21; and a moving mechanism configured to move the tape holding mechanism 21 and the bending mechanism 23 relatively to each other. The bending mechanism 23 includes an elastic member holding mechanism 22 configured to hold at least a part of an outer periphery of an elastic member 32. The bending mechanism 23 is configured to bend the elastic member 32, which is being held by the elastic member holding mechanism 22, so as to project the elastic member closer to the tape holding mechanism 21.SELECTED DRAWING: Figure 2

Description

本開示は、テープ貼付装置、樹脂成形システム、テープ貼付方法、および樹脂成形品の製造方法に関する。 The present disclosure relates to a tape applying device, a resin molding system, a tape applying method, and a method for manufacturing a resin molded product.

たとえば特許文献１の図２Ａには、従来のテープ貼付方法の一例が記載されている。この方法においては、まず、受け台の上にチップの搭載面を下にしてリードフレームを設置する。受け台は、リードフレームの外枠である押え部分においてのみリードフレームを支持する。次に、リードフレームのチップの搭載面と反対側の裏面にテープの接着面が位置するようにテープを設置する。 For example, FIG. 2A of Patent Document 1 describes an example of a conventional tape sticking method. In this method, first, a lead frame is placed on a pedestal with the chip mounting surface facing downward. The cradle supports the lead frame only at the pressing portion, which is the outer frame of the lead frame. Next, the tape is placed so that the adhesive surface of the tape is positioned on the back surface of the lead frame opposite to the chip mounting surface.

次に、ゴム製のローラの円筒側面をテープの裏面（接着面と反対側の面）上に設置してテープをリードフレームの裏面に押し付ける。次に、ローラをテープの裏面に沿って回転させることによって、テープの全体をリードフレームに押し付け、リードフレームにテープを貼り付ける。 Next, the cylindrical side of a rubber roller is placed on the back side of the tape (the side opposite to the adhesive side) to press the tape against the back side of the lead frame. The entire tape is then pressed against the lead frame by rolling the roller along the back side of the tape to adhere the tape to the lead frame.

特開２０１２－２３８６８９号公報JP 2012-238689 A

しかしながら、特許文献１に記載の従来のテープ貼付方法においては、以下の課題があった。すなわち、マウントおよびボンディング工程で受けた熱履歴や自重によりリードフレームに歪みが発生し、ローラがリードフレームの歪み形状に沿って変形できない場合には、ローラがテープをリードフレームに十分に押し付けることができないことがあった。この場合にはリードフレームにテープの未接着部が発生することがあった。 However, the conventional tape sticking method described in Patent Document 1 has the following problems. In other words, if the lead frame is distorted due to the heat history received during the mounting and bonding processes and its own weight, and the roller cannot deform along the distorted shape of the lead frame, the roller will not be able to sufficiently press the tape against the lead frame. There were things I couldn't do. In this case, an unbonded portion of the tape may occur on the lead frame.

ここで開示された実施形態によれば、テープ保持機構と、テープ保持機構と間隔を空けて位置する撓機構と、テープ保持機構と撓機構とを互いに相対的に移動可能に構成されている移動機構と、を備え、撓機構は、弾性部材の外周の少なくとも一部を保持可能に構成されている弾性部材保持機構を備え、弾性部材保持機構に保持された状態の弾性部材をテープ保持機構側に凸に撓ませることが可能に構成されている、テープ貼付装置を提供することができる。 According to embodiments disclosed herein, a tape retaining mechanism, a flexing mechanism spaced from the tape retaining mechanism, and a movement configured to move the tape retaining mechanism and the flexing mechanism relative to each other. a mechanism, wherein the bending mechanism includes an elastic member holding mechanism configured to hold at least a part of the outer periphery of the elastic member, and the elastic member held by the elastic member holding mechanism is moved to the tape holding mechanism side; It is possible to provide a tape applying device that is configured to be able to bend convexly.

ここで開示された実施形態によれば、上記のテープ貼付装置を備えた樹脂成形システムを提供することができる。 According to the embodiments disclosed herein, it is possible to provide a resin molding system equipped with the above tape applying device.

ここで開示された実施形態によれば、テープ貼付装置を用いたテープ貼付方法であって、テープ保持機構がテープを保持する工程と、撓機構のステージに弾性部材を設置する工程と、撓機構がテープ保持機構側に凸となるように弾性部材を撓ませる工程と、テープ保持機構により保持されたテープを弾性部材の凸となるように撓んだ箇所に接触させる工程と、弾性部材の撓みを解消しながら弾性部材に対するテープの接触面積を拡大する工程と、を含む、テープ貼付方法を提供することができる。 According to the embodiments disclosed herein, there is provided a tape applying method using a tape applying apparatus, comprising: holding a tape by a tape holding mechanism; installing an elastic member on a stage of a bending mechanism; bending the elastic member so that the tape is convex toward the tape holding mechanism; bringing the tape held by the tape holding mechanism into contact with the convex bent portion of the elastic member; and increasing the contact area of the tape with respect to the elastic member while eliminating the above.

ここで開示された実施形態によれば、上記のテープ貼付方法を用いてテープが貼り付けられた弾性部材を樹脂成形する樹脂成形工程を含む、樹脂成形品の製造方法を提供することができる。 According to the embodiments disclosed herein, it is possible to provide a method of manufacturing a resin molded product, which includes a resin molding step of resin-molding the elastic member to which the tape is attached using the above-described tape attaching method.

ここで開示された実施形態によれば、特許文献１に記載の従来のテープ貼付方法と比べて弾性部材に対するテープの未接着部の発生を抑制することができる。 According to the embodiments disclosed herein, it is possible to suppress the occurrence of non-bonded portions of the tape to the elastic member, as compared with the conventional tape applying method described in Patent Document 1.

実施形態の樹脂成形システムの一例の機能ブロック図である。1 is a functional block diagram of an example of a resin molding system according to an embodiment; FIG. 実施形態のテープ貼付装置の一例の模式的側面図である。BRIEF DESCRIPTION OF THE DRAWINGS It is a schematic side view of an example of the tape sticking apparatus of embodiment. 実施形態のテープ貼付方法の一例について図解する模式的側面図である。It is a schematic side view illustrating an example of the tape sticking method of embodiment. （ａ）および（ｂ）は、実施形態のテープ貼付方法の一例を図解する模式的側面図である。(a) And (b) is a schematic side view illustrating an example of the tape sticking method of embodiment. （ａ）～（ｄ）は、実施形態のテープ貼付方法の一例を図解する模式的側面図である。(a) to (d) are schematic side views illustrating an example of the tape application method of the embodiment. 実施形態のテープ貼付装置の他の一例の模式的側面図である。It is a schematic side view of another example of the tape applying device of the embodiment. 実施形態の樹脂成形装置の一例の模式的断面図である。1 is a schematic cross-sectional view of an example of a resin molding apparatus according to an embodiment; FIG. 実施形態の樹脂成形品の製造方法の一例を図解する模式的断面図である。It is a typical sectional view illustrating an example of a manufacturing method of a resin cast of an embodiment. 実施形態の樹脂成形品の製造方法の一例を図解する模式的断面図である。It is a typical sectional view illustrating an example of a manufacturing method of a resin cast of an embodiment. 実施形態の樹脂成形品の製造方法の一例を図解する模式的断面図である。It is a typical sectional view illustrating an example of a manufacturing method of a resin cast of an embodiment. 実施形態の樹脂成形品の製造方法の一例を図解する模式的断面図である。It is a typical sectional view illustrating an example of a manufacturing method of a resin cast of an embodiment. 実施形態の樹脂成形品の一例の模式的断面図である。1 is a schematic cross-sectional view of an example of a resin molded product of an embodiment; FIG. テープ保持機構がなく、弾性部材が載置されていない状態の実施形態のテープ貼付装置の一例の模式的平面図である。FIG. 3 is a schematic plan view of an example of the tape applying device of the embodiment in which there is no tape holding mechanism and no elastic member is placed.

以下、実施形態について説明する。なお、実施形態の説明に用いられる図面において、同一の参照符号は、同一部分または相当部分を表わすものとする。 Embodiments will be described below. In the drawings used for describing the embodiments, the same reference numerals denote the same or corresponding parts.

＜樹脂成形システム＞
図１は、実施形態の樹脂成形システムの一例の機能ブロック図を示す。図１に示される樹脂成形システム１０００は、樹脂材料を供給することが可能な樹脂供給モジュール１００１と、弾性部材にテープを貼り付けることが可能なテープ貼付モジュール１００２と、弾性部材を圧縮成形することによって樹脂成形品を製造することが可能な樹脂成形モジュール１００３と、成形前の弾性部材を供給可能であるとともに成形後の樹脂成形品を収納可能な供給収納モジュール１００４と、制御部１００５とを備えている。制御部１００５は、樹脂供給モジュール１００１と、テープ貼付モジュール１００２と、樹脂成形モジュール１００３と、供給収納モジュール１００４とを制御可能に構成されている。 <Resin molding system>
FIG. 1 shows a functional block diagram of an example of a resin molding system according to an embodiment. A resin molding system 1000 shown in FIG. 1 includes a resin supply module 1001 capable of supplying a resin material, a tape applying module 1002 capable of applying tape to an elastic member, and a resin molding module 1002 capable of applying a tape to an elastic member. a resin molding module 1003 capable of manufacturing a resin molded product by means of a method; a supply/storage module 1004 capable of supplying an elastic member before molding and storing a resin molded product after molding; ing. The control unit 1005 is configured to be able to control the resin supply module 1001 , the tape application module 1002 , the resin molding module 1003 and the supply/storage module 1004 .

樹脂供給モジュール１００１と、テープ貼付モジュール１００２と、樹脂成形モジュール１００３と、供給収納モジュール１００４とは、互いに着脱可能であるとともに交換可能でもある。 The resin supply module 1001, the tape application module 1002, the resin molding module 1003, and the supply/storage module 1004 are detachable and replaceable.

樹脂供給モジュール１００１は、樹脂成形モジュール１００３に樹脂材料を供給可能な樹脂材料供給装置を備えている。 The resin supply module 1001 has a resin material supply device capable of supplying the resin material to the resin molding module 1003 .

テープ貼付モジュール１００２は、実施形態のテープ貼付装置を備えている。実施形態のテープ貼付装置の詳細については後述する。 The tape application module 1002 includes the tape application device of the embodiment. The details of the tape applying device of the embodiment will be described later.

樹脂成形モジュール１００３は、実施形態の樹脂成形装置を備えている。実施形態の樹脂成形装置の詳細については後述する。樹脂成形モジュール１００３は複数設けられていてもよい。 The resin molding module 1003 includes the resin molding device of the embodiment. Details of the resin molding apparatus of the embodiment will be described later. A plurality of resin molding modules 1003 may be provided.

供給収納モジュール１００４は、樹脂成形される前の弾性部材を供給可能な供給装置と、成形後の樹脂成形品を収納可能な収納装置とを備えている。実施形態の樹脂成形装置によって樹脂成形された樹脂成形品は、供給収納モジュール１００４に収納される。 The supply/storage module 1004 includes a supply device capable of supplying elastic members before being resin-molded, and a storage device capable of storing resin-molded products after molding. A resin molded product resin-molded by the resin molding apparatus of the embodiment is stored in the supply storage module 1004 .

＜テープ貼付装置＞
図２に、実施形態のテープ貼付装置の一例の模式的側面図を示す。図２に示すように実施形態のテープ貼付装置は、テープ保持機構２１と、テープ保持機構２１と間隔を空けて位置する撓機構２３と、テープ保持機構２１と撓機構２３とを互いに相対的に移動可能に構成されている移動機構（図示せず）とを備えている。撓機構２３は、弾性部材（図２においては図示せず）の外周の少なくとも一部を保持可能に構成されている弾性部材保持機構２２を備えており、弾性部材保持機構２２に保持された状態の弾性部材をテープ保持機構２１の側に凸に撓ませることが可能に構成されている。撓機構２３は、弾性部材を設置可能に構成されているステージ２３ｂをさらに備えている。テープ貼付装置は、ステージ２３ｂのテープ保持機構２１の側と反対側に位置するベース部２４をさらに備えている。 <Tape Applicator>
FIG. 2 shows a schematic side view of an example of the tape applying device of the embodiment. As shown in FIG. 2, the tape applying apparatus of the embodiment has a tape holding mechanism 21, a bending mechanism 23 positioned at a distance from the tape holding mechanism 21, and the tape holding mechanism 21 and bending mechanism 23 arranged relative to each other. and a moving mechanism (not shown) configured to be movable. The bending mechanism 23 includes an elastic member holding mechanism 22 configured to hold at least part of the outer circumference of an elastic member (not shown in FIG. 2), and is held by the elastic member holding mechanism 22. elastic member can be bent convexly toward the tape holding mechanism 21 side. The bending mechanism 23 further includes a stage 23b on which an elastic member can be installed. The tape application device further includes a base portion 24 located on the opposite side of the stage 23b to the tape holding mechanism 21 side.

テープ保持機構２１は、弾性部材に貼り付けるためのテープを保持可能に構成されている。テープ保持機構２１がテープを保持する方法は特に限定されないが、たとえば、テープを吸着可能な吸着機構を備えることによりテープを保持可能に構成することができる。 The tape holding mechanism 21 is configured to hold a tape to be attached to the elastic member. The method by which the tape holding mechanism 21 holds the tape is not particularly limited. For example, the tape can be held by providing a suction mechanism capable of sucking the tape.

テープ保持機構２１は、テープ保持機構２１と弾性部材保持機構２２とが接触しないように、弾性部材保持機構２２の少なくとも一部を収容可能に構成されている凹部２１ａを備えることができる。なお、本願の図面においては、凹部２１ａのすべてがテープ保持機構２１の下面内に収容されている構成について記載されているが、凹部２１ａの一部がテープ保持機構２１の側面から外側に開放されている構成とされてもよい。 The tape holding mechanism 21 can include a recess 21a configured to accommodate at least a portion of the elastic member holding mechanism 22 so that the tape holding mechanism 21 and the elastic member holding mechanism 22 do not come into contact with each other. In the drawings of the present application, the configuration in which the recess 21a is entirely accommodated in the lower surface of the tape holding mechanism 21 is described, but a part of the recess 21a is opened outward from the side surface of the tape holding mechanism 21. It may be configured to be

撓機構２３は、テープ保持機構２１とベース部２４とを連結する第１連結軸２３ｄと、第１連結軸２３ｄの外周を取り囲みテープ保持機構２１とステージ２３ｂとの間で伸縮可能に構成されている第１弾性部材２３ａと、ステージ２３ｂとベース部２４とを連結する第２連結軸２３ｅと、第２連結軸２３ｅの外周を取り囲みステージ２３ｂとベース部２４との間で伸縮可能に構成されている第２弾性部材２３ｃとをさらに備えている。ステージ２３ｂの中央には空洞２３２ｂが設けられている。第１弾性部材２３ａのばね定数は、たとえば、第２弾性部材２３ｃのばね定数よりも小さくすることができる。 The flexing mechanism 23 surrounds the outer periphery of the first connecting shaft 23d that connects the tape holding mechanism 21 and the base portion 24, and can extend and contract between the tape holding mechanism 21 and the stage 23b. a second connecting shaft 23e connecting the stage 23b and the base portion 24; and a second elastic member 23c. A cavity 232b is provided in the center of the stage 23b. The spring constant of the first elastic member 23a can be made smaller than the spring constant of the second elastic member 23c, for example.

弾性部材保持機構２２は、ステージ２３ｂ上に設置される弾性部材の外周の少なくとも一部を保持可能に構成されている。弾性部材保持機構２２が弾性部材の外周の少なくとも一部を保持する方法は特に限定されないが、本実施形態において、弾性部材保持機構２２は、たとえば、ステージ２３ｂと向かい合う押さえ部２２ａを備えており、押さえ部２２ａが弾性部材の外周の少なくとも一部をステージ２３ｂに押さえ付けることによって、ステージ２３ｂ上に設置される弾性部材の外周の少なくとも一部を保持可能に構成されている。弾性部材保持機構２２は、また、たとえば、弾性部材の外周の少なくとも一部を把持する構成により弾性部材の外周の少なくとも一部を保持してもよい。また、弾性部材保持機構２２は、テープ貼付装置に固定されている軸を中心として回転することにより、ステージ２３ｂに対する押さえ部２２ａの角度を変更可能に構成されていてもよい。 The elastic member holding mechanism 22 is configured to be able to hold at least part of the outer circumference of the elastic member installed on the stage 23b. The method by which the elastic member holding mechanism 22 holds at least a part of the outer periphery of the elastic member is not particularly limited, but in the present embodiment, the elastic member holding mechanism 22 includes, for example, a pressing portion 22a facing the stage 23b, At least part of the outer circumference of the elastic member placed on the stage 23b can be held by the pressing part 22a pressing at least part of the outer circumference of the elastic member against the stage 23b. The elastic member holding mechanism 22 may also hold at least part of the outer circumference of the elastic member, for example, by gripping at least part of the outer circumference of the elastic member. Further, the elastic member holding mechanism 22 may be configured to change the angle of the pressing portion 22a with respect to the stage 23b by rotating around a shaft fixed to the tape applying device.

ベース部２４は、テープ貼付装置において移動不能に構成されている。これにより、ベース部２４は、第１連結軸２３ｄおよび第２連結軸２３ｅをテープ貼付装置に固定している。したがって、第１連結軸２３ｄおよび第２連結軸２３ｅも、テープ貼付装置において移動不能に構成されている。 The base portion 24 is configured to be immovable in the tape application device. Thereby, the base portion 24 fixes the first connecting shaft 23d and the second connecting shaft 23e to the tape application device. Therefore, the first connecting shaft 23d and the second connecting shaft 23e are also immovable in the tape sticking device.

図１３に、テープ保持機構がなく、弾性部材が載置されていない状態の実施形態のテープ貼付装置の一例の模式的な平面図を示す。図１３に示す例においては、第１連結軸２３ｄとその外周を取り囲む第１弾性部材２３ａとのセットが４セット設けられており、第２連結軸２３ｅとその外周を取り囲む第２弾性部材２３ｃとのセットも４セット設けられている。また、図１３に示す例において、ステージ２３ｂの空洞２３２ｂの平面形状は、たとえば、後述する弾性部材の矩形の平面形状に対応する矩形とすることができる。また、ステージ２３ｂの下方にはベース部２４が位置している。 FIG. 13 shows a schematic plan view of an example of the tape application device of the embodiment in which there is no tape holding mechanism and no elastic member is placed. In the example shown in FIG. 13, four sets of the first connecting shaft 23d and the first elastic member 23a surrounding the outer circumference are provided, and the second connecting shaft 23e and the second elastic member 23c surrounding the outer circumference are provided. 4 sets are also provided. Further, in the example shown in FIG. 13, the planar shape of the cavity 232b of the stage 23b can be, for example, a rectangle corresponding to the rectangular planar shape of the elastic member described later. A base portion 24 is positioned below the stage 23b.

＜テープ貼付方法＞
以下、図３、図４（ａ）、図４（ｂ）および図５（ａ）～図５（ｄ）の模式的側面図を参照して、実施形態のテープ貼付方法の一例について説明する。まず、図３に示すように、テープ保持機構２１がテープ３１を保持する工程と、撓機構２３のステージ２３ｂに弾性部材３２を設置する工程とを行う。 <Tape application method>
An example of the tape applying method of the embodiment will be described below with reference to schematic side views of FIGS. 3, 4(a), 4(b) and 5(a) to 5(d). First, as shown in FIG. 3, a step of holding the tape 31 by the tape holding mechanism 21 and a step of setting the elastic member 32 on the stage 23b of the bending mechanism 23 are performed.

テープ保持機構２１がテープ３１を保持する工程は、たとえば、テープ保持機構２１がテープ３１を吸着することにより行うことができる。テープ３１としては、弾性部材３２に接着可能であるテープを特に限定なく用いることができるが、たとえば、後述する樹脂成形時の樹脂漏れの発生および樹脂成形後の樹脂バリの発生を抑制することが可能なテープを用いることができる。 The step of holding the tape 31 by the tape holding mechanism 21 can be performed, for example, by the tape holding mechanism 21 sucking the tape 31 . As the tape 31, a tape that can be adhered to the elastic member 32 can be used without particular limitation. Any available tape can be used.

撓機構２３のステージ２３ｂに弾性部材３２を設置する工程は、たとえば、以下のように行うことができる。まず、弾性部材保持機構２２の押さえ部２２ａがテープ貼付装置の外側に開くように押さえ部２２ａを回転させる。次に、弾性部材３２の外周の少なくとも一部が弾性部材保持機構２２の押さえ部２２ａとステージ２３ｂとの間に位置するようにステージ２３ｂ上に弾性部材３２を載置することにより行うことができる。弾性部材３２としては、弾性を有する部材を特に限定なく用いることができるが、たとえば、一方の面に少なくとも１つのチップが固定されたリードフレームを用いることができる。弾性部材３２としてのリードフレームは、ステージ２３ｂの中央に設けられた空洞２３２ｂにチップ（図示せず）が位置するように、ステージ２３ｂ上に設置することができる。 The step of installing the elastic member 32 on the stage 23b of the bending mechanism 23 can be performed, for example, as follows. First, the pressing portion 22a of the elastic member holding mechanism 22 is rotated so that the pressing portion 22a opens to the outside of the tape applying device. Next, it can be performed by placing the elastic member 32 on the stage 23b so that at least a part of the outer circumference of the elastic member 32 is positioned between the pressing portion 22a of the elastic member holding mechanism 22 and the stage 23b. . As the elastic member 32, a member having elasticity can be used without particular limitation. For example, a lead frame having at least one chip fixed to one surface can be used. A lead frame as the elastic member 32 can be installed on the stage 23b so that a chip (not shown) is located in a cavity 232b provided in the center of the stage 23b.

テープ保持機構２１がテープ３１を保持する工程と、撓機構２３のステージ２３ｂに弾性部材３２を設置する工程との順序は特に限定されない。これらの工程においては、第１弾性部材２３ａはその上方に配置された部材の自重により収縮しているが、第２弾性部材２３ｃは収縮していない。 The order of the step of holding the tape 31 by the tape holding mechanism 21 and the step of installing the elastic member 32 on the stage 23b of the bending mechanism 23 is not particularly limited. In these steps, the first elastic member 23a is contracted by the weight of the member placed thereabove, but the second elastic member 23c is not contracted.

次に、図４（ａ）に示すように、撓機構２３がテープ保持機構２１側に凸となるように弾性部材３２を撓ませる工程を行う。この工程は、たとえば、押さえ部２２が弾性部材３２の外周の少なくとも一部を押さえるように押さえ部２２をテープ貼付装置の内側に回転させること等により弾性部材３２の外周の少なくとも一部をテープ保持機構２１に対してテープ保持機構２１の側と反対側に相対的に移動させることにより行うことができる。この工程においては、第１弾性部材２３ａはその上方に配置された部材の自重により収縮している状態のままであるが、第２弾性部材２３ｃは収縮していない。なお、弾性部材３２の撓みは、たとえば、押さえ部２２の回転の程度を調節すること等によって調節することが可能である。 Next, as shown in FIG. 4A, a step of bending the elastic member 32 is performed so that the bending mechanism 23 protrudes toward the tape holding mechanism 21 side. In this step, at least a portion of the outer periphery of the elastic member 32 is held by tape by, for example, rotating the pressing portion 22 toward the inside of the tape application device so that the pressing portion 22 presses at least a portion of the outer periphery of the elastic member 32 . This can be done by moving the mechanism 21 relative to the side opposite to the side of the tape holding mechanism 21 . In this step, the first elastic member 23a remains contracted due to the weight of the member placed thereabove, but the second elastic member 23c is not contracted. The bending of the elastic member 32 can be adjusted by adjusting the degree of rotation of the pressing portion 22, for example.

このとき、図４（ｂ）に示すように、弾性部材３２の外周の少なくとも一部は弾性部材保持機構２２の押さえ部２２ａによってステージ２３ｂの窪み２３０ｂの側に押さえ付けられており、押さえ部２２ａによって押さえ付けられていない弾性部材３２の箇所がステージ２３ｂの外周よりも内側の面２３１ｂに接触している。ステージ２３ｂの窪み２３０ｂは、ステージ２３ｂの外周よりも内側の面２３１ｂに対してベース部２４側に窪むようにして構成されている。なお、図４（ｂ）、後述の図５（ｂ）および図５（ｄ）において、参照符号２３０ｂは、窪み２３０ｂの下面を図示している。 At this time, as shown in FIG. 4B, at least part of the outer periphery of the elastic member 32 is pressed against the depression 230b side of the stage 23b by the pressing portion 22a of the elastic member holding mechanism 22, and the pressing portion 22a is pressed. A portion of the elastic member 32 that is not pressed by is in contact with the surface 231b inside the outer periphery of the stage 23b. The recess 230b of the stage 23b is recessed toward the base portion 24 with respect to the surface 231b inside the outer circumference of the stage 23b. In addition, in FIG. 4(b) and FIGS. 5(b) and 5(d) which will be described later, reference numeral 230b indicates the lower surface of the recess 230b.

次に、図５（ａ）に示すように、テープ保持機構２１により保持されたテープ３１を弾性部材３２の凸に撓んだ箇所に接触させる工程を行う。この工程は、たとえば、図示しない移動機構が、ステージ２３ｂに向かってテープ保持機構２１を移動させることによって行うことができる。この工程において、テープ３１を接触させる箇所は弾性部材３２の凸の頂点であってもよいが、凸の頂点である必要はなく、弾性部材３２の凸に撓んでいる箇所のいずれかであればよい。この工程においても、弾性部材３２の外周の少なくとも一部は、たとえば、図５（ｂ）に示すように、弾性部材保持機構２２の押さえ部２２ａによってステージ２３ｂの外周の窪み２３０ｂに押さえられたままである。この工程においては、テープ保持機構２１の移動に伴って、第１弾性部材２３ａは上記の弾性部材３２を撓ませる工程における状態からさらに収縮し、第２弾性部材２３ｃはその上方に配置された部材の自重およびテープ保持機構２１の移動に伴って収縮した第１弾性部材２３ａの力により収縮を開始する。なお、この工程において、弾性部材保持機構２２は、ベース部２４に対して相対的に静止した状態で維持される。 Next, as shown in FIG. 5A, the step of bringing the tape 31 held by the tape holding mechanism 21 into contact with the convexly bent portion of the elastic member 32 is performed. This step can be performed, for example, by moving the tape holding mechanism 21 toward the stage 23b by a moving mechanism (not shown). In this step, the point where the tape 31 is brought into contact may be the convex vertex of the elastic member 32, but it does not have to be the convex vertex. good. In this step as well, at least a part of the outer periphery of the elastic member 32 is kept pressed against the depression 230b on the outer periphery of the stage 23b by the pressing portion 22a of the elastic member holding mechanism 22, as shown in FIG. 5B, for example. be. In this step, as the tape holding mechanism 21 moves, the first elastic member 23a contracts further from the state in the step of bending the elastic member 32 described above, and the second elastic member 23c expands to the member disposed thereabove. and the force of the first elastic member 23a that contracts with the movement of the tape holding mechanism 21, contraction starts. In this step, the elastic member holding mechanism 22 is kept stationary relative to the base portion 24 .

次に、弾性部材３２の凸の撓みを解消しながら弾性部材３２に対するテープ３１の接触面積を拡大する工程を行う。この工程は、たとえば、図示しない移動機構が、テープ保持機構２１により保持されたテープ３１を弾性部材３２の凸に撓んだ箇所に接触させた状態からステージ２３ｂに向かってテープ保持機構２１をさらに移動させることによって行うことができる。この工程においては、テープ保持機構２１の移動に伴って、第１弾性部材２３ａは上記の接触させる工程における状態からさらに収縮していくとともに、第２弾性部材２３ｃもその上方に配置された部材の自重およびテープ保持機構２１の移動に伴って収縮した第１弾性部材２３ａの力により上記の接触させる工程における状態からさらに収縮していく。なお、この工程においても、弾性部材保持機構２２は、ベース部２４に対して相対的に静止した状態で維持される。 Next, a step of expanding the contact area of the tape 31 with the elastic member 32 while canceling the convex bending of the elastic member 32 is performed. In this process, for example, a moving mechanism (not shown) moves the tape holding mechanism 21 further toward the stage 23b from a state in which the tape 31 held by the tape holding mechanism 21 is in contact with the convexly bent portion of the elastic member 32. This can be done by moving In this step, as the tape holding mechanism 21 is moved, the first elastic member 23a is further contracted from the state in the contacting step, and the second elastic member 23c is also moved from the member disposed above. Due to its own weight and the force of the first elastic member 23a that has contracted with the movement of the tape holding mechanism 21, the tape further contracts from the contacting step. Also in this step, the elastic member holding mechanism 22 is maintained in a relatively stationary state with respect to the base portion 24 .

図５（ｃ）は、弾性部材３２に対するテープ３１の貼り付けが完了した状態を示している。図５（ｃ）に示すように、弾性部材３２に対するテープ３１の貼り付けが完了した段階では、テープ保持機構２１と弾性部材保持機構２２とが接触しないように、弾性部材保持機構２２の押さえ部２２ａはテープ保持機構２１の凹部２１ａ内に収容されている。また、図５（ｄ）に示すように、弾性部材３２の外周の少なくとも一部は、弾性部材保持機構２２の押さえ部２２ａおよびステージ２３ｂの外周の窪み２３０ｂのいずれにも接していない。このとき、テープ３１の貼り付け後の弾性部材３２は、ステージ２３ｂの外周の内側の面２３１ｂに支持されることになる。 FIG. 5(c) shows a state in which the tape 31 has been completely attached to the elastic member 32. FIG. As shown in FIG. 5(c), when the tape 31 has been attached to the elastic member 32, the holding portion of the elastic member holding mechanism 22 is held so that the tape holding mechanism 21 and the elastic member holding mechanism 22 do not come into contact with each other. 22a is accommodated in the recess 21a of the tape holding mechanism 21. As shown in FIG. Further, as shown in FIG. 5D, at least part of the outer circumference of the elastic member 32 is in contact with neither the holding portion 22a of the elastic member holding mechanism 22 nor the depression 230b on the outer circumference of the stage 23b. At this time, the elastic member 32 to which the tape 31 has been attached is supported by the inner surface 231b of the outer periphery of the stage 23b.

その後、テープ保持機構２１およびステージ２３ｂが図３の位置に戻される。その後、弾性部材保持機構２２からテープ３１の貼り付け後の弾性部材３２が取り出される。 After that, the tape holding mechanism 21 and the stage 23b are returned to the positions shown in FIG. After that, the elastic member 32 to which the tape 31 has been attached is removed from the elastic member holding mechanism 22 .

実施形態のテープ貼付装置およびテープ貼付方法の一例は、弾性部材３２を凸に撓ませて、弾性部材３２の凸に撓ませた箇所にテープ３１を接触させて、弾性部材３２の凸の撓みを解消しながら弾性部材３２に対するテープ３１の接触面積を拡大することによってテープ３１を貼り付けていく。そのため、実施形態のテープ貼付装置およびテープ貼付方法の一例においては、テープ３１と弾性部材３２との間の空気を逃がしながらテープ３１を弾性部材３２に貼り付けていくことができることから、テープ３１と弾性部材３２との間の気泡の発生を抑制することができるとともに、貼り付けられたテープ３１のシワの発生も抑制することができる。したがって、実施形態のテープ貼付装置およびテープ貼付方法の一例は、上述の特許文献１に記載の方法と比べて、弾性部材３２に対するテープ３１の未接着部の発生を抑制することができる。 An example of the tape applying apparatus and tape applying method of the embodiment is to bend the elastic member 32 in a convex shape, bring the tape 31 into contact with the convexly bent portion of the elastic member 32, and bend the elastic member 32 in a convex shape. The tape 31 is stuck by enlarging the contact area of the tape 31 with respect to the elastic member 32 while resolving it. Therefore, in the example of the tape applying apparatus and the tape applying method of the embodiment, the tape 31 can be adhered to the elastic member 32 while the air between the tape 31 and the elastic member 32 is released. It is possible to suppress the generation of air bubbles between the elastic member 32 and the generation of wrinkles in the attached tape 31 . Therefore, the example of the tape sticking device and tape sticking method of the embodiment can suppress the occurrence of non-adhered portions of the tape 31 to the elastic member 32 compared to the method described in Patent Document 1 described above.

また、実施形態のテープ貼付装置およびテープ貼付方法の一例においては、弾性部材３２の外周の少なくとも一部のみを保持してテープ３１の貼り付けが可能となるため、弾性部材３２のテープ３１の貼り付け面と反対側にたとえばチップ固定領域等の他の部材と接触不可な領域がある場合でも、弾性部材３２へのテープ３１の貼り付けが可能となる。 In addition, in the example of the tape applying device and the tape applying method of the embodiment, since the tape 31 can be applied while holding only at least a part of the outer periphery of the elastic member 32, the tape 31 applied to the elastic member 32 cannot be applied. The tape 31 can be attached to the elastic member 32 even if there is an area, such as a chip fixing area, that cannot contact other members on the opposite side of the attachment surface.

また、実施形態のテープ貼付装置およびテープ貼付方法の一例においては、自重により弾性部材３２が撓む側（たとえばリードフレームのチップの固定側）と反対側に凸に撓ませてテープ３１を貼り付けるため、弾性部材３２の自重による撓みを考慮することなく、弾性部材３２にテープ３１を貼り付けることが可能となる。 Further, in one example of the tape applying apparatus and the tape applying method of the embodiment, the tape 31 is applied by bending the elastic member 32 convexly to the side opposite to the side where the elastic member 32 bends due to its own weight (for example, the chip fixing side of the lead frame). Therefore, the tape 31 can be attached to the elastic member 32 without considering the deflection of the elastic member 32 due to its own weight.

また、実施形態のテープ貼付装置およびテープ貼付方法の一例においては、第１弾性部材２３ａおよび第２弾性部材２３ｃが上述のように収縮することによって、弾性部材３２の凸の撓ませ時および弾性部材３２へのテープ３１の貼り付け時における弾性部材３２の急激な変形を抑制することができる。そのため、弾性部材３２に負担をかけることなく、弾性部材３２にテープ３１を貼り付けることが可能となる。 In addition, in one example of the tape applying device and the tape applying method of the embodiment, the contraction of the first elastic member 23a and the second elastic member 23c as described above causes the elastic member 32 to bend in a convex shape and the elastic member Rapid deformation of the elastic member 32 can be suppressed when the tape 31 is attached to the elastic member 32 . Therefore, the tape 31 can be attached to the elastic member 32 without imposing a burden on the elastic member 32 .

なお、上述の実施形態においては、実施形態のテープ貼付装置の一例として、テープ保持機構２１を上側に配置するとともに撓機構２３を下側に配置した構成について説明したが、実施形態のテープ貼付装置の他の一例として、たとえば、図６の模式的側面図に示すように、撓機構２３を上側に配置するとともにテープ保持機構２１を下側に配置した構成としてもよい。 In the above-described embodiment, as an example of the tape applying device of the embodiment, the tape holding mechanism 21 is arranged on the upper side and the bending mechanism 23 is arranged on the lower side. As another example, for example, as shown in the schematic side view of FIG. 6, a configuration in which the bending mechanism 23 is arranged on the upper side and the tape holding mechanism 21 is arranged on the lower side may be employed.

＜樹脂成形装置＞
図７に、実施形態の樹脂成形装置の一例の模式的断面図を示す。図７に示す実施形態の樹脂成形装置１は、圧縮成形型１０を備えている。圧縮成形型１０は第１型１１０と、第１型１１０に向かい合って第１型１１０よりも上方に配置された第２型１２０とを備えている。 <Resin molding equipment>
FIG. 7 shows a schematic cross-sectional view of an example of the resin molding apparatus of the embodiment. A resin molding apparatus 1 of the embodiment shown in FIG. 7 includes a compression mold 10 . The compression molding die 10 includes a first die 110 and a second die 120 arranged above the first die 110 so as to face the first die 110 .

第１型１１０は、側面部材１１１と、底面部材１１２とを備えている。側面部材１１１は、底面部材１１２の周囲を取り囲むように配置されている。 The first mold 110 has a side member 111 and a bottom member 112 . The side member 111 is arranged to surround the bottom member 112 .

底面部材１１２は、樹脂材料を配置可能な上面１１２ａと、上面１１２ａの周縁から下方に延在する摺動面１１２ｂとを備えている。底面部材１１２の摺動面１１２ｂは、側面部材１１１の内周面１１１ａと接しており、側面部材１１１の内周面１１１ａに対して摺動可能に構成されている。 The bottom member 112 includes an upper surface 112a on which a resin material can be placed, and a sliding surface 112b extending downward from the periphery of the upper surface 112a. The sliding surface 112 b of the bottom member 112 is in contact with the inner peripheral surface 111 a of the side member 111 and is configured to be slidable on the inner peripheral surface 111 a of the side member 111 .

樹脂成形装置１は、上部固定盤１２１と、下部固定盤１２２と、可動盤１１５とをさらに備えている。上部固定盤１２１と下部固定盤１２２との間には、複数の支柱部１１６が鉛直方向に延在している。複数の支柱部１１６のそれぞれの一端が上部固定盤１２１に固定され、他端が下部固定盤１２２に固定されている。また、側面部材１１１と可動盤１１５との間には、弾性体１１４が設けられている。 The resin molding apparatus 1 further includes an upper stationary platen 121 , a lower stationary platen 122 and a movable platen 115 . A plurality of struts 116 extend vertically between the upper stationary platen 121 and the lower stationary platen 122 . One end of each of the plurality of pillars 116 is fixed to the upper stationary platen 121 and the other end is fixed to the lower stationary platen 122 . An elastic body 114 is provided between the side member 111 and the movable platen 115 .

樹脂成形装置１は、下部固定盤１２２における複数の支柱部１１６の間に、第１駆動機構１１７をさらに備えている。第１駆動機構１１７は、可動盤１１５を、上方および下方に移動可能に構成されている。上部固定盤１２１および下部固定盤１２２は固定されて移動不能に構成されている。そのため、可動盤１１５は、上部固定盤１２１および下部固定盤１２２に対して相対的に移動可能である。また、第１駆動機構１１７は、可動盤１１５を介して、側面部材１１１および底面部材１１２を、上方および下方に移動可能、すなわち昇降可能に構成されている。 The resin molding apparatus 1 further includes a first driving mechanism 117 between the plurality of supporting columns 116 on the lower stationary platen 122 . The first drive mechanism 117 is configured to move the movable platen 115 upward and downward. The upper stationary platen 121 and the lower stationary platen 122 are fixed and immovable. Therefore, the movable platen 115 is relatively movable with respect to the upper fixed platen 121 and the lower fixed platen 122 . In addition, the first drive mechanism 117 is configured to be able to move the side member 111 and the bottom member 112 upward and downward, that is, move up and down via the movable platen 115 .

樹脂成形装置１は、可動盤１１５の内部に、第２駆動機構１１８をさらに備えている。第２駆動機構１１８は、底面部材１１２を、上方および下方に移動可能、すなわち昇降可能に構成されている。これにより、底面部材１１２は、側面部材１１１に対して相対的に移動可能である。 The resin molding apparatus 1 further includes a second drive mechanism 118 inside the movable platen 115 . The second drive mechanism 118 is configured to be able to move the bottom member 112 upward and downward, that is, to be able to move up and down. Thereby, the bottom member 112 is relatively movable with respect to the side member 111 .

＜樹脂成形品の製造方法＞
以下、図８～図１２の模式的断面図を参照して、実施形態の樹脂成形品の製造方法の一例について説明する。まず、図８に示すように、第２型１２０に成形対象物２０１を設置する工程を行うとともに、樹脂材料２０２を供給する工程を行う。成形対象物２０１としては、上述の実施形態のテープ貼付装置およびテープ貼付方法の一例によってテープ３１が貼り付けられた弾性部材３２が用いられる。 <Method for manufacturing resin molded product>
An example of a method for manufacturing a resin molded product according to the embodiment will be described below with reference to schematic cross-sectional views of FIGS. First, as shown in FIG. 8, a step of placing the molding object 201 in the second mold 120 and a step of supplying the resin material 202 are performed. As the molding object 201, an elastic member 32 to which a tape 31 is attached by an example of the tape attaching apparatus and tape attaching method of the above embodiment is used.

第２型１２０に成形対象物２０１を設置する工程は、たとえば、テープ３１が貼り付けられた側の弾性部材３２の面が第２型１２０側となるように、第２型１２０に成形対象物２０１を設置することにより行うことができる。 In the step of setting the molding object 201 on the second mold 120, for example, the molding object is placed on the second mold 120 so that the surface of the elastic member 32 on the side to which the tape 31 is attached faces the second mold 120. 201 can be installed.

樹脂材料２０２を供給する工程は、たとえば、側面部材１１１の内周面１１１ａおよび底面部材１１２の上面１１２ａで構成されたキャビティ内に樹脂材料２０２を供給することにより行なうことができる。 The step of supplying resin material 202 can be performed, for example, by supplying resin material 202 into a cavity formed by inner peripheral surface 111 a of side surface member 111 and upper surface 112 a of bottom surface member 112 .

なお、第２型１２０に成形対象物２０１を設置する工程と、樹脂材料２０２を供給する工程との順序は特に限定されない。 The order of the step of placing the molding object 201 on the second mold 120 and the step of supplying the resin material 202 is not particularly limited.

次に、図９に示すように、第２型１２０側に第１型１１０を移動させる工程を行なう。第２型１２０側に第１型１１０を移動させる工程は、たとえば、第１駆動機構１１７によって、可動盤１１５を第２型１２０の方向に移動させることにより行うことができる。 Next, as shown in FIG. 9, a step of moving the first die 110 to the second die 120 side is performed. The step of moving the first die 110 to the second die 120 side can be performed by, for example, moving the movable platen 115 in the direction of the second die 120 by the first drive mechanism 117 .

次に、樹脂材料２０２を用いて成形対象物２０１を樹脂成形する工程を行なう。樹脂材料２０２を用いて成形対象物２０１を樹脂成形する工程は、たとえば、以下のように行うことができる。 Next, a step of resin-molding the molding object 201 using the resin material 202 is performed. The step of resin-molding the molding object 201 using the resin material 202 can be performed, for example, as follows.

まず、図１０に示すように、樹脂材料２０２を加熱することにより溶融して溶融樹脂２０２ａにするとともに、第２駆動機構１１８によって底面部材１１２の上面１１２ａを押し上げる。このとき、底面部材１１２の摺動面１１２ｂが側面部材１１１の内周面１１１ａに対して摺動しながら、底面部材１１２が側面部材１１１に対して相対的に上方に移動する。 First, as shown in FIG. 10, the resin material 202 is heated and melted to form a molten resin 202a, and the upper surface 112a of the bottom member 112 is pushed up by the second drive mechanism 118. As shown in FIG. At this time, the bottom member 112 moves upward relative to the side member 111 while the sliding surface 112 b of the bottom member 112 slides on the inner peripheral surface 111 a of the side member 111 .

次に、図１１に示すように、底面部材１１２の上面１１２ａを押し上げた状態で溶融樹脂２０２ａの加熱をさらに進めて硬化させ、硬化樹脂２０２ｂとする。 Next, as shown in FIG. 11, while the upper surface 112a of the bottom member 112 is being pushed up, the molten resin 202a is further heated and cured to form a cured resin 202b.

その後、たとえば図１２の模式的断面図に示されるように、圧縮成形型１０から樹脂成形後の成形対象物２０１を取り出すことによって、テープが貼り付けられた弾性部材に固定されたチップが硬化樹脂２０２ｂで封止された樹脂成形品３０１を得ることができる。 After that, as shown in the schematic cross-sectional view of FIG. 12, for example, by taking out the molded object 201 after resin molding from the compression molding die 10, the chip fixed to the elastic member to which the tape is attached is removed from the hardened resin. A resin molded product 301 sealed at 202b can be obtained.

実施形態の樹脂成形品の製造方法の一例においては、弾性部材に対するテープの未接着部の発生が抑制された状態で、弾性部材のテープの貼り付け側と反対側に固定されたチップの樹脂封止が可能となる。そのため、実施形態の樹脂成形品の製造方法の一例においては、上述の特許文献１に記載の従来のテープ貼付方法と比べて、樹脂成形時におけるテープ３１からの樹脂漏れの発生および樹脂成形後の樹脂バリの発生を抑制して樹脂成形品を製造することができる。 In one example of the method for manufacturing a resin molded product according to the embodiment, the chip fixed to the elastic member on the side opposite to the side to which the tape is attached is resin-sealed in a state in which the generation of unbonded portions of the tape on the elastic member is suppressed. can be stopped. Therefore, in one example of the method for manufacturing a resin molded product of the embodiment, compared with the conventional tape attaching method described in Patent Document 1, resin leakage from the tape 31 during resin molding and after resin molding A resin molded product can be produced while suppressing the occurrence of resin burrs.

なお、上記においては、実施形態の樹脂成形品の製造方法の一例として圧縮成形により樹脂成形品の製造を行う場合について説明したが、たとえば、トランスファー成形等の他の樹脂成形方法により樹脂成形品の製造を行ってもよい。 In the above description, as an example of the method for manufacturing a resin molded product according to the embodiment, a case where a resin molded product is manufactured by compression molding has been described. manufacturing may be carried out.

今回開示された実施形態はすべての点で例示であって制限的なものではないと考えられるべきである。本発明の範囲は上記した説明ではなくて特許請求の範囲によって示され、特許請求の範囲と均等の意味および範囲内でのすべての変更が含まれることが意図される。 It should be considered that the embodiments disclosed this time are illustrative in all respects and not restrictive. The scope of the present invention is indicated by the scope of the claims rather than the above description, and is intended to include all modifications within the scope and meaning of equivalents of the scope of the claims.

ここで開示された実施形態によれば、テープ貼付装置、樹脂成形システム、テープ貼付方法、および樹脂成形品の製造方法を提供することができる。 According to the embodiments disclosed herein, it is possible to provide a tape applying device, a resin molding system, a tape applying method, and a method for manufacturing a resin molded product.

１ 樹脂成形装置、１０ 圧縮成形型、２１ テープ保持機構、２１ａ 凹部、２２ 弾性部材保持機構、２２ａ 押さえ部、２３ 撓機構、２３ａ 第１弾性部材、２３ｂ ステージ、２３ｃ 第２弾性部材、２３ｄ 第１連結軸、２３ｅ 第２連結軸、２４ ベース部、３１ テープ、３２ 弾性部材、１１０ 第１型、１１１ 側面部材、１１１ａ 内周面、１１２ 底面部材、１１２ａ 上面、１１２ｂ 摺動面、１１４ 弾性体、１１５ 可動盤、１１６ 支柱部、１１７ 第１駆動機構、１１８ 第２駆動機構、１２０ 第２型、１２１ 上部固定盤、１２２ 下部固定盤、２０１ 成形対象物、２０２ 樹脂材料、２０２ａ 溶融樹脂、２０２ｂ 硬化樹脂、２３０ｂ 窪み、２３１ｂ 面、２３２ｂ 空洞、３０１ 樹脂成形品、１０００ 樹脂成形システム、１００１ 樹脂供給モジュール、１００２ テープ貼付モジュール、１００３ 樹脂成形モジュール、１００４ 供給収納モジュール、１００５ 制御部。 Reference Signs List 1 resin molding apparatus 10 compression mold 21 tape holding mechanism 21a recess 22 elastic member holding mechanism 22a pressing portion 23 bending mechanism 23a first elastic member 23b stage 23c second elastic member 23d first connecting shaft 23e second connecting shaft 24 base portion 31 tape 32 elastic member 110 first mold 111 side member 111a inner peripheral surface 112 bottom member 112a upper surface 112b sliding surface 114 elastic body; 115 Movable platen 116 Post part 117 First drive mechanism 118 Second drive mechanism 120 Second mold 121 Upper fixed platen 122 Lower fixed platen 201 Molding object 202 Resin material 202a Molten resin 202b Curing Resin, 230b recess, 231b surface, 232b cavity, 301 resin molded product, 1000 resin molding system, 1001 resin supply module, 1002 tape application module, 1003 resin molding module, 1004 supply and storage module, 1005 control unit.

Claims (15)

テープ保持機構と、
前記テープ保持機構と間隔を空けて位置する撓機構と、
前記テープ保持機構と前記撓機構とを互いに相対的に移動可能に構成されている移動機構と、を備え、
前記撓機構は、弾性部材の外周の少なくとも一部を保持可能に構成されている弾性部材保持機構を備え、前記弾性部材保持機構に保持された状態の前記弾性部材を前記テープ保持機構の側に凸に撓ませることが可能に構成されている、テープ貼付装置。 a tape holding mechanism;
a bending mechanism spaced from the tape holding mechanism;
a moving mechanism configured to move the tape holding mechanism and the bending mechanism relative to each other;
The bending mechanism includes an elastic member holding mechanism capable of holding at least a part of the outer periphery of the elastic member, and the elastic member held by the elastic member holding mechanism is moved toward the tape holding mechanism. A tape applying device configured to be bent convexly. 前記撓機構は、前記弾性部材を設置可能なステージを備え、
前記ステージは、前記ステージの外周に窪みを備える、請求項１に記載のテープ貼付装置。 The bending mechanism includes a stage on which the elastic member can be installed,
2. The tape applying device according to claim 1, wherein said stage has a depression on the outer circumference of said stage. 前記ステージの前記テープ保持機構の側と反対側に位置するベース部をさらに備える、請求項２に記載のテープ貼付装置。 3. The tape applying device according to claim 2, further comprising a base located on the opposite side of the stage from the tape holding mechanism. 前記ベース部は、移動不能に構成されている、請求項３に記載のテープ貼付装置。 4. The tape applying device according to claim 3, wherein said base portion is configured to be immovable. 前記撓機構は、前記テープ保持機構と前記ベース部とを連結する第１連結軸と、前記第１連結軸の周囲を取り囲むとともに前記テープ保持機構と前記ステージとの間で伸縮可能に構成されている第１弾性部材と、前記ステージと前記ベース部とを連結する第２連結軸と、前記第２連結軸の周囲を取り囲むとともに前記ステージと前記ベース部との間で伸縮可能に構成されている第２弾性部材とを備える、請求項３または請求項４に記載のテープ貼付装置。 The bending mechanism includes a first connecting shaft that connects the tape holding mechanism and the base portion, and the bending mechanism surrounds the first connecting shaft and can extend and contract between the tape holding mechanism and the stage. a second connecting shaft that connects the stage and the base portion; and a first elastic member that surrounds the second connecting shaft and can extend and contract between the stage and the base portion. 5. The tape application device according to claim 3, further comprising a second elastic member. 前記第１弾性部材のばね定数は、前記第２弾性部材のばね定数よりも小さい、請求項５に記載のテープ貼付装置。 6. The tape applying device according to claim 5, wherein the spring constant of said first elastic member is smaller than the spring constant of said second elastic member. 前記撓機構は、前記弾性部材の外周の少なくとも一部を前記テープ保持機構に対して前記テープ保持機構の側と反対側に相対的に移動させることにより、前記弾性部材を凸に撓ませることが可能に構成されている、請求項１から請求項６のいずれか１項に記載のテープ貼付装置。 The bending mechanism can convexly bend the elastic member by moving at least part of the outer circumference of the elastic member relative to the tape holding mechanism in a direction opposite to the tape holding mechanism. 7. A tape application device according to any one of claims 1 to 6, which is configured to be able to. 前記弾性部材の撓みを調節可能に構成されている、請求項１から請求項７のいずれか１項に記載のテープ貼付装置。 8. The tape applying device according to any one of claims 1 to 7, wherein the bending of said elastic member is adjustable. 前記テープ保持機構は、前記テープ保持機構と前記弾性部材保持機構とが接触しないように前記弾性部材保持機構の少なくとも一部を収容可能に構成されている凹部を備える、請求項１から請求項８のいずれか１項に記載のテープ貼付装置。 9. The tape holding mechanism has a recess configured to accommodate at least part of the elastic member holding mechanism so that the tape holding mechanism and the elastic member holding mechanism do not contact each other. The tape applying device according to any one of Claims 1 to 3. 前記弾性部材は、リードフレームを含む、請求項１から請求項９のいずれか１項に記載のテープ貼付装置。 10. The tape applying device according to any one of claims 1 to 9, wherein said elastic member comprises a lead frame. 請求項１から請求項１０のいずれか１項に記載のテープ貼付装置を備えた、樹脂成形システム。 A resin molding system comprising the tape applying device according to any one of claims 1 to 10. テープ貼付装置を用いたテープ貼付方法であって、
テープ保持機構がテープを保持する工程と、
撓機構のステージに弾性部材を設置する工程と、
前記撓機構が前記テープ保持機構側に凸となるように前記弾性部材を撓ませる工程と、
前記テープ保持機構により保持された前記テープを前記弾性部材の凸となるように撓んだ箇所に接触させる工程と、
前記弾性部材の撓みを解消しながら前記弾性部材に対する前記テープの接触面積を拡大する工程と、を含む、テープ貼付方法。 A tape applying method using a tape applying device,
holding the tape by the tape holding mechanism;
installing an elastic member on the stage of the bending mechanism;
bending the elastic member so that the bending mechanism protrudes toward the tape holding mechanism;
a step of bringing the tape held by the tape holding mechanism into contact with a portion of the elastic member that is bent to form a projection;
and increasing a contact area of the tape with respect to the elastic member while canceling bending of the elastic member. 前記テープ貼付装置は前記ステージの前記テープ保持機構と反対側に位置するベース部を備え、
前記撓機構は、前記テープ保持機構と前記ステージとの間で伸縮可能に構成されている第１弾性部材と、前記ステージと前記ベース部との間で伸縮可能に構成されている第２弾性部材とをさらに備え、
前記接触させる工程は、前記第１弾性部材が収縮する工程を含む、請求項１２に記載のテープ貼付方法。 The tape applying device comprises a base located on the opposite side of the stage from the tape holding mechanism,
The bending mechanism includes a first elastic member that is extendable between the tape holding mechanism and the stage, and a second elastic member that is extendable between the stage and the base. and
13. The tape applying method according to claim 12, wherein said contacting step includes a step of contracting said first elastic member. 前記テープの接触面積を拡大する工程は、前記第１弾性部材および前記第２弾性部材の両方が収縮する工程を含む、請求項１３に記載のテープ貼付方法。 14. The tape application method according to claim 13, wherein the step of enlarging the contact area of the tape includes the step of contracting both the first elastic member and the second elastic member. 請求項１２から請求項１４のいずれか１項に記載のテープ貼付方法を用いて前記テープが貼り付けられた前記弾性部材を樹脂成形する樹脂成形工程を含む、樹脂成形品の製造方法。
15. A method of manufacturing a resin molded product, comprising a resin molding step of resin-molding the elastic member to which the tape is attached using the tape attaching method according to any one of claims 12 to 14.
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