TWI835393B - Tape attaching device, resin molding system, tape attaching method, and method of manufacturing resin molded products - Google Patents

Tape attaching device, resin molding system, tape attaching method, and method of manufacturing resin molded products Download PDF

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TWI835393B
TWI835393B TW111142340A TW111142340A TWI835393B TW I835393 B TWI835393 B TW I835393B TW 111142340 A TW111142340 A TW 111142340A TW 111142340 A TW111142340 A TW 111142340A TW I835393 B TWI835393 B TW I835393B
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tape
elastic member
holding mechanism
platform
bending
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TW111142340A
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TW202337668A (en
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北一平
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日商Ｔｏｗａ股份有限公司
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Replacement Of Web Rolls (AREA)

Abstract

本發明的膠帶貼附裝置包括：膠帶保持機構（21）；彎曲機構（23），位於與膠帶保持機構（21）空出間隔的位置；以及移動機構，構成為可使膠帶保持機構（21）與彎曲機構（23）相互相對地移動。彎曲機構（23）包括彈性構件保持機構（22），所述彈性構件保持機構（22）構成為可保持彈性構件（32）的外周的至少一部分。彎曲機構（23）構成為，可使彈性構件保持機構22所保持的狀態的彈性構件（32）凸向膠帶保持機構（21）側而彎曲。The tape attaching device of the present invention includes: a tape holding mechanism (21); a bending mechanism (23) located at a distance from the tape holding mechanism (21); and a moving mechanism configured to enable the tape holding mechanism (21) to and the bending mechanism (23) move relative to each other. The bending mechanism (23) includes an elastic member holding mechanism (22) configured to hold at least a part of the outer circumference of the elastic member (32). The bending mechanism (23) is configured to bend the elastic member (32) held by the elastic member holding mechanism 22 by protruding toward the tape holding mechanism (21) side.

Description

膠帶貼附裝置、樹脂成形系統、膠帶貼附方法以及樹脂成形品的製造方法Tape attaching device, resin molding system, tape attaching method, and method of manufacturing resin molded products

本揭示是有關於一種膠帶貼附裝置、樹脂成形系統、膠帶貼附方法以及樹脂成形品的製造方法。The present disclosure relates to a tape attaching device, a resin molding system, a tape attaching method, and a manufacturing method of a resin molded product.

例如在專利文獻1的圖2A中記載有先前的膠帶貼附方法的一例。該方法中，首先，在承受台上以晶片的搭載面為下而設置引線框架。承受台僅在作為引線框架的外框的按壓部分支撐引線框架。接下來，以膠帶的接著面位於引線框架的與晶片的搭載面為相反側的背面的方式設置膠帶。For example, an example of a conventional tape attaching method is described in FIG. 2A of Patent Document 1. In this method, first, a lead frame is placed on a receiving table with the mounting surface of the wafer facing downward. The receiving table supports the lead frame only at the pressing portion which is the outer frame of the lead frame. Next, the tape is placed so that the adhesive surface of the tape is located on the back surface of the lead frame opposite to the chip mounting surface.

接下來，將橡膠製輥的圓筒側面設置於膠帶的背面（與接著面為相反側的面）上而將膠帶壓抵於引線框架的背面。接下來，使輥沿著膠帶的背面旋轉，藉此將膠帶的整體壓抵於引線框架，從而將膠帶貼附於引線框架。 [現有技術文獻] [專利文獻] Next, the cylindrical side surface of the rubber roller is placed on the back surface of the tape (the surface opposite to the bonding surface), and the tape is pressed against the back surface of the lead frame. Next, the roller is rotated along the back side of the tape, thereby pressing the entire tape against the lead frame, thereby attaching the tape to the lead frame. [Prior art documents] [Patent Document]

[專利文獻1]日本專利特開2012-238689號公報[Patent Document 1] Japanese Patent Application Laid-Open No. 2012-238689

[發明所欲解決之課題][Problem to be solved by the invention]

然而，專利文獻1中所記載的先前的膠帶貼附方法中存在以下課題。即，在因安裝及黏晶步驟中所承受的熱歷程或自重而導致在引線框架產生應變，輥無法按照引線框架的應變形狀而變形的情況下，有時輥無法將膠帶充分地壓抵於引線框架。 該情況下，有時在引線框架會產生膠帶的未接著部。 [解決課題之手段] However, the conventional tape attaching method described in Patent Document 1 has the following problems. That is, if the lead frame is strained due to the thermal history or its own weight during the mounting and die bonding steps, and the roller cannot deform according to the strained shape of the lead frame, the roller may not be able to fully press the tape against the lead frame. Leadframe. In this case, an unattached portion of the tape may occur in the lead frame. [Means to solve the problem]

根據本文所揭示的實施方式，可提供一種膠帶貼附裝置，包括：膠帶保持機構；彎曲機構，位於與膠帶保持機構空出間隔的位置；以及移動機構，構成為可使膠帶保持機構與彎曲機構相互相對地移動；且彎曲機構包括彈性構件保持機構，所述彈性構件保持機構構成為可保持彈性構件的外周的至少一部分，所述彎曲機構構成為可使彈性構件保持機構所保持的狀態的彈性構件凸向膠帶保持機構側而彎曲。According to the embodiments disclosed herein, a tape attaching device can be provided, including: a tape holding mechanism; a bending mechanism located at a distance from the tape holding mechanism; and a moving mechanism configured to enable the tape holding mechanism and the bending mechanism to move relative to each other; and the bending mechanism includes an elastic member retaining mechanism configured to retain at least a part of the outer circumference of the elastic member, and the bending mechanism is configured to be elastic in a state retained by the elastic member retaining mechanism. The member is convex and bent toward the tape holding mechanism side.

根據本文所揭示的實施方式，可提供一種包括所述膠帶貼附裝置的樹脂成形系統。According to embodiments disclosed herein, a resin molding system including the tape attaching device may be provided.

根據本文所揭示的實施方式，可提供一種膠帶貼附方法，其是使用膠帶貼附裝置，且包括如下步驟：使膠帶保持機構保持膠帶的步驟；在彎曲機構的平台設置彈性構件的步驟；使彎曲機構以凸向膠帶保持機構側的方式使彈性構件彎曲的步驟；使由膠帶保持機構所保持的膠帶與彈性構件的彎曲成凸狀的部位接觸的步驟；以及一邊消除彈性構件的彎曲，一邊擴大膠帶對於彈性構件的接觸面積的步驟。According to the embodiment disclosed herein, a tape application method can be provided, which uses a tape application device and includes the following steps: a step of holding the tape by a tape holding mechanism; a step of arranging an elastic member on the platform of the bending mechanism; The bending mechanism bends the elastic member so as to convex toward the tape holding mechanism side; the step of bringing the tape held by the tape holding mechanism into contact with a portion of the elastic member that is curved in a convex shape; and while eliminating the bending of the elastic member, A step to expand the contact area of the tape to the elastic member.

根據本文所揭示的實施方式，可提供一種樹脂成形品的製造方法，其包括樹脂成形步驟，所述樹脂成形步驟是對使用所述的膠帶貼附方法貼附了膠帶的彈性構件進行樹脂成形。 [發明的效果] According to the embodiments disclosed herein, there can be provided a method of manufacturing a resin molded article that includes a resin molding step of resin molding an elastic member to which a tape is attached using the tape attaching method. [Effects of the invention]

根據本文所揭示的實施方式，與專利文獻1中所記載的先前的膠帶貼附方法相比，能夠抑制產生膠帶對於彈性構件的未接著部。According to the embodiment disclosed herein, compared with the conventional tape attaching method described in Patent Document 1, it is possible to suppress the occurrence of non-adherent portions of the tape to the elastic member.

以下，對實施方式進行說明。再者，用於說明實施方式的圖式中，相同的參照符號表示相同部分或相當部分。Hereinafter, embodiments will be described. In the drawings for describing the embodiments, the same reference numerals represent the same parts or corresponding parts.

＜樹脂成形系統＞ 圖1表示實施方式的樹脂成形系統的一例的功能方塊圖。圖1所示的樹脂成形系統1000包括：樹脂供給模組1001，可供給樹脂材料；膠帶貼附模組1002，可將膠帶貼附於彈性構件；樹脂成形模組1003，可藉由對彈性構件進行壓縮成形而製造樹脂成形品；供給收納模組1004，可供給成形前的彈性構件，並且可收納成形後的樹脂成形品；以及控制部1005。控制部1005構成為，可控制樹脂供給模組1001、膠帶貼附模組1002、樹脂成形模組1003、以及供給收納模組1004。 ＜Resin molding system＞ FIG. 1 is a functional block diagram showing an example of the resin molding system according to the embodiment. The resin molding system 1000 shown in Figure 1 includes: a resin supply module 1001, which can supply resin materials; a tape attachment module 1002, which can attach tape to elastic members; and a resin molding module 1003, which can attach elastic members to elastic members. Compression molding is performed to produce a resin molded product; a storage module 1004 is provided that can supply elastic members before molding and store the resin molded product after molding; and a control unit 1005 . The control unit 1005 is configured to control the resin supply module 1001, the tape application module 1002, the resin molding module 1003, and the supply and storage module 1004.

樹脂供給模組1001、膠帶貼附模組1002、樹脂成形模組1003、以及供給收納模組1004相互可裝卸並且亦可更換。The resin supply module 1001, the tape attaching module 1002, the resin molding module 1003, and the supply storage module 1004 are detachable and replaceable with each other.

樹脂供給模組1001包括樹脂材料供給裝置，所述樹脂材料供給裝置可對樹脂成形模組1003供給樹脂材料。The resin supply module 1001 includes a resin material supply device capable of supplying resin material to the resin molding module 1003 .

膠帶貼附模組1002包括實施方式的膠帶貼附裝置。關於實施方式的膠帶貼附裝置的詳情將在下文進行說明。The tape application module 1002 includes the tape application device of the embodiment. Details of the tape applying device of the embodiment will be described below.

樹脂成形模組1003包括實施方式的樹脂成形裝置。關於實施方式的樹脂成形裝置的詳情將在下文進行說明。樹脂成形模組1003設置有多個。The resin molding module 1003 includes the resin molding device of the embodiment. Details of the resin molding apparatus of the embodiment will be described below. A plurality of resin molding modules 1003 are provided.

供給收納模組1004包括：供給裝置，可供給樹脂成形前的彈性構件；以及收納裝置，可收納成形後的樹脂成形品。藉由實施方式的樹脂成形裝置進行樹脂成形所得的樹脂成形品收納在供給收納模組1004中。The supply and storage module 1004 includes a supply device that can supply elastic members before resin molding, and a storage device that can store resin molded products after molding. The resin molded product obtained by resin molding with the resin molding apparatus of the embodiment is stored in the supply storage module 1004 .

＜膠帶貼附裝置＞ 圖2中示出實施方式的膠帶貼附裝置的一例的示意性側視圖。如圖2所示，實施方式的膠帶貼附裝置包括：膠帶保持機構21；彎曲機構23，位於與膠帶保持機構21空出間隔的位置；以及移動機構（未圖示），構成為可使膠帶保持機構21與彎曲機構23相互相對地移動。彎曲機構23包括彈性構件保持機構22，所述彈性構件保持機構22可保持彈性構件（圖2中未圖示）的外周的至少一部分，且彎曲機構23構成為可使彈性構件保持機構22所保持的狀態的彈性構件凸向膠帶保持機構21側而彎曲。彎曲機構23更包括平台23b，所述平台23b構成為可設置彈性構件。膠帶貼附裝置更包括基座部24，所述基座部24位於平台23b的與膠帶保持機構21側相反的一側。 ＜Tape attachment device＞ FIG. 2 shows a schematic side view of an example of the tape application device according to the embodiment. As shown in FIG. 2 , the tape applying device of the embodiment includes: a tape holding mechanism 21; a bending mechanism 23 located at a distance from the tape holding mechanism 21; and a moving mechanism (not shown) configured to move the tape. The holding mechanism 21 and the bending mechanism 23 move relatively to each other. The bending mechanism 23 includes an elastic member holding mechanism 22 that can hold at least a part of the outer circumference of the elastic member (not shown in FIG. 2 ), and the bending mechanism 23 is configured to hold the elastic member holding mechanism 22 The elastic member in the state protrudes toward the tape holding mechanism 21 side and is bent. The bending mechanism 23 further includes a platform 23b, and the platform 23b is configured to be provided with an elastic member. The tape applying device further includes a base portion 24 located on the opposite side of the platform 23b to the tape holding mechanism 21 side.

膠帶保持機構21構成為可保持用以貼附於彈性構件的膠帶。膠帶保持機構21保持膠帶的方法並無特別限定，例如可構成為可藉由具備可吸附膠帶的吸附機構來保持膠帶。The tape holding mechanism 21 is configured to hold the tape attached to the elastic member. The method of holding the tape by the tape holding mechanism 21 is not particularly limited. For example, the tape holding mechanism 21 may be configured to hold the tape by having an adsorption mechanism capable of adsorbing the tape.

膠帶保持機構21可包括凹部21a，所述凹部21a構成為，可以膠帶保持機構21與彈性構件保持機構22不接觸的方式，收容彈性構件保持機構22的至少一部分。再者，本申請案的圖式中，記載了凹部21a全部收容在膠帶保持機構21的下表面內的結構，但亦可設為凹部21a的一部分自膠帶保持機構21的側面向外側開放的結構。The tape holding mechanism 21 may include a recess 21 a configured to accommodate at least a part of the elastic member holding mechanism 22 so that the tape holding mechanism 21 and the elastic member holding mechanism 22 do not come into contact. Furthermore, in the drawings of this application, the structure in which the recessed portion 21a is entirely accommodated in the lower surface of the tape holding mechanism 21 is described. However, a part of the recessed portion 21a may be configured to be open to the outside from the side surface of the tape holding mechanism 21. .

彎曲機構23更包括：第一連結軸23d，將膠帶保持機構21與基座部24連結；第一彈性構件23a，構成為包圍第一連結軸23d的外周且在膠帶保持機構21與平台23b之間可伸縮；第二連結軸23e，將平台23b與基座部24連結；第二彈性構件23c，構成為包圍第二連結軸23e的外周且在平台23b與基座部24之間可伸縮。在平台23b的中央設置有空腔232b。第一彈性構件23a的彈簧常數例如可小於第二彈性構件23c的彈簧常數。The bending mechanism 23 further includes: a first connecting shaft 23d, which connects the tape holding mechanism 21 and the base part 24; a first elastic member 23a, which is configured to surround the outer periphery of the first connecting shaft 23d and between the tape holding mechanism 21 and the platform 23b. the second connecting shaft 23e connects the platform 23b and the base part 24; the second elastic member 23c is configured to surround the outer periphery of the second connecting shaft 23e and is telescopic between the platform 23b and the base part 24. A cavity 232b is provided in the center of the platform 23b. The spring constant of the first elastic member 23a may be smaller than the spring constant of the second elastic member 23c, for example.

彈性構件保持機構22構成為可保持設置於平台23b上的彈性構件的外周的至少一部分。彈性構件保持機構22保持彈性構件的外周的至少一部分的方法並無特別限定，但在本實施方式中，彈性構件保持機構22例如包括與平台23b相對向的按壓部22a，且構成為，藉由按壓部22a將彈性構件的外周的至少一部分壓抵於平台23b，而可保持平台設置於23b上的彈性構件的外周的至少一部分。而且，彈性構件保持機構22例如亦可藉由固持彈性構件的外周的至少一部分的結構來保持彈性構件的外周的至少一部分。而且，彈性構件保持機構22亦可構成為，藉由以固定於膠帶貼附裝置的軸為中心進行旋轉，而可變更按壓部22a相對於平台23b的角度。The elastic member holding mechanism 22 is configured to hold at least a part of the outer circumference of the elastic member provided on the platform 23b. The method in which the elastic member holding mechanism 22 holds at least a part of the outer circumference of the elastic member is not particularly limited. However, in the present embodiment, the elastic member holding mechanism 22 includes, for example, a pressing portion 22a facing the platform 23b, and is configured by The pressing part 22a presses at least a part of the outer circumference of the elastic member against the platform 23b, and can maintain at least a part of the outer circumference of the elastic member with the platform disposed on 23b. Furthermore, the elastic member holding mechanism 22 may hold at least a part of the outer periphery of the elastic member, for example, by holding at least a part of the outer periphery of the elastic member. Furthermore, the elastic member holding mechanism 22 may be configured to change the angle of the pressing part 22a with respect to the platform 23b by rotating about an axis fixed to the tape application device.

基座部24構成為在膠帶貼附裝置中無法移動。藉此，基座部24將第一連結軸23d及第二連結軸23e固定於膠帶貼附裝置。因此，第一連結軸23d及第二連結軸23e亦構成為在膠帶貼附裝置中無法移動。The base portion 24 is configured to be immovable in the tape application device. Thereby, the base part 24 fixes the 1st connection shaft 23d and the 2nd connection shaft 23e to the tape application device. Therefore, the first connecting shaft 23d and the second connecting shaft 23e are also configured to be immovable in the tape applying device.

圖13中示出無膠帶保持機構且未載置彈性構件的狀態的實施方式的膠帶貼附裝置的一例的示意性俯視圖。圖13所示的例中，第一連結軸23d與包圍第一連結軸23d的外周的第一彈性構件23a的組件設置有4個組件，第二連結軸23e與包圍第二連結軸的外周的第二彈性構件23c的組件亦設置有4個組件。而且，圖13所示的例中，平台23b的空腔232b的平面形狀例如可設為與下述彈性構件的矩形的平面形狀對應的矩形。而且，基座部24位於平台23b的下方。FIG. 13 is a schematic plan view showing an example of the tape application device of the embodiment without a tape holding mechanism and without an elastic member placed thereon. In the example shown in FIG. 13 , the assembly of the first connecting shaft 23d and the first elastic member 23a surrounding the outer periphery of the first connecting shaft 23d is provided with four components, and the second connecting shaft 23e is composed of the first elastic member 23a surrounding the outer periphery of the second connecting shaft. The component of the second elastic member 23c is also provided with four components. Furthermore, in the example shown in FIG. 13 , the planar shape of the cavity 232b of the platform 23b may be, for example, a rectangular shape corresponding to the rectangular planar shape of the elastic member described below. Moreover, the base part 24 is located below the platform 23b.

＜膠帶貼附方法＞ 以下，參照圖3、圖4的（a）、圖4的（b）及圖5的（a）～圖5的（d）的示意性側視圖，對實施方式的膠帶貼附方法的一例進行說明。首先，如圖3所示，進行如下步驟：使膠帶保持機構21保持膠帶31的步驟；以及在彎曲機構23的平台23b設置彈性構件32的步驟。 ＜How to attach tape＞ Hereinafter, an example of the tape attaching method of the embodiment will be described with reference to the schematic side views of FIGS. 3, 4(a), 4(b), and 5(a) to 5(d). instruction. First, as shown in FIG. 3 , the following steps are performed: a step of holding the tape 31 by the tape holding mechanism 21 ; and a step of providing the elastic member 32 on the platform 23 b of the bending mechanism 23 .

使膠帶保持機構21保持膠帶31的步驟例如可藉由使膠帶保持機構21吸附膠帶31來進行。作為膠帶31，可無特別限定地使用可接著於彈性構件32的膠帶，例如可使用能夠抑制下述樹脂成形時產生樹脂洩漏及樹脂成形後產生樹脂毛邊的膠帶。The step of causing the tape holding mechanism 21 to hold the tape 31 can be performed, for example, by causing the tape holding mechanism 21 to absorb the tape 31 . The adhesive tape 31 may be an adhesive tape that can be adhered to the elastic member 32 without particular limitation. For example, an adhesive tape that can suppress resin leakage during resin molding and resin burr generation after resin molding described below can be used.

在彎曲機構23的平台23b設置彈性構件32的步驟例如可以如下方式來進行。首先，以彈性構件保持機構22的按壓部22a向膠帶貼附裝置的外側敞開的方式使按壓部22a旋轉。接下來，以彈性構件32的外周的至少一部分位於彈性構件保持機構22的按壓部22a與平台23b之間的方式在平台23b上載置彈性構件32，可藉此來進行。作為彈性構件32，可無特別限定地使用具有彈性的構件，例如可使用在其中一面固定有至少一個晶片的引線框架。作為彈性構件32的引線框架可以使晶片（未圖示）位於設置於平台23b的中央的空腔232b的方式，設置於平台23b上。The step of arranging the elastic member 32 on the platform 23b of the bending mechanism 23 can be performed in the following manner, for example. First, the pressing part 22a of the elastic member holding mechanism 22 is rotated so that the pressing part 22a may open to the outside of the tape application device. Next, the elastic member 32 can be placed on the platform 23b so that at least a part of the outer circumference of the elastic member 32 is located between the pressing portion 22a of the elastic member holding mechanism 22 and the platform 23b. As the elastic member 32, a member having elasticity can be used without particular limitation, and for example, a lead frame in which at least one wafer is fixed on one surface can be used. The lead frame as the elastic member 32 may be installed on the platform 23b so that the wafer (not shown) is located in the cavity 232b provided in the center of the platform 23b.

使膠帶保持機構21保持膠帶31的步驟、與在彎曲機構23的平台23b設置彈性構件32的步驟的順序並無特別限定。該些步驟中，第一彈性構件23a藉由配置於第一彈性構件23a的上方的構件的自重而收縮，但第二彈性構件23c未收縮。The order of the steps of holding the tape 31 by the tape holding mechanism 21 and the step of providing the elastic member 32 on the platform 23b of the bending mechanism 23 is not particularly limited. During these steps, the first elastic member 23a contracts due to the dead weight of the member disposed above the first elastic member 23a, but the second elastic member 23c does not contract.

接下來，如圖4的（a）所示，進行如下步驟：使彎曲機構23以凸向膠帶保持機構21側的方式使彈性構件32彎曲的步驟。該步驟例如可藉由下述方式進行，即，以按壓部22按壓彈性構件32的外周的至少一部分的方式使按壓部22向膠帶貼附裝置的內側旋轉等，藉此使彈性構件32的外周的至少一部分相對於膠帶保持機構21向與膠帶保持機構21側相反的一側相對地移動。該步驟中，第一彈性構件23a保持藉由配置於第一彈性構件23a的上方的構件的自重而收縮的狀態不變，但第二彈性構件23c未收縮。再者，彈性構件32的彎曲例如可藉由調節按壓部22的旋轉程度等而進行調節。Next, as shown in FIG. 4( a ), a step of bending the elastic member 32 so that the bending mechanism 23 projects toward the tape holding mechanism 21 side is performed. This step can be performed, for example, by rotating the pressing part 22 inward of the tape application device such that the pressing part 22 presses at least a part of the outer circumference of the elastic member 32 , thereby causing the outer circumference of the elastic member 32 to rotate. At least a part of the tape holding mechanism 21 moves relatively to the side opposite to the tape holding mechanism 21 side. In this step, the first elastic member 23a remains in a state of contracting due to the dead weight of the member disposed above the first elastic member 23a, but the second elastic member 23c does not contract. Furthermore, the bending of the elastic member 32 can be adjusted, for example, by adjusting the degree of rotation of the pressing portion 22 .

此時，如圖4的（b）所示，彈性構件32的外周的至少一部分被彈性構件保持機構22的按壓部22a壓抵於平台23b的凹處230b側，未被按壓部22a壓抵的彈性構件32的部位與較平台23b的外周更靠內側的面231b接觸。平台23b的凹處230b構成為，相對於較平台23b的外周更靠內側的面231b向基座部24側凹陷。再者，圖4的（b）、下述圖5的（b）及圖5的（d）中，參照符號230b圖示凹處230b的下表面。At this time, as shown in FIG. 4( b ), at least a part of the outer circumference of the elastic member 32 is pressed against the recess 230 b side of the platform 23 b by the pressing part 22 a of the elastic member holding mechanism 22 , and the part that is not pressed by the pressing part 22 a The portion of the elastic member 32 is in contact with the surface 231b located inward of the outer periphery of the platform 23b. The recess 230b of the platform 23b is recessed toward the base part 24 side with respect to the surface 231b which is inward from the outer periphery of the platform 23b. In addition, in FIG. 4(b), FIG. 5(b) and FIG. 5(d) described below, reference numeral 230b illustrates the lower surface of the recess 230b.

接下來，如圖5的（a）所示，進行如下步驟：使由膠帶保持機構21所保持的膠帶31與彈性構件32的彎曲成凸狀的部位接觸的步驟。該步驟例如可藉由下述方式進行，即，使未圖示的移動機構使膠帶保持機構21向平台23b移動。該步驟中，要接觸膠帶31的部位可為彈性構件32的凸狀的頂點，但無需為凸狀的頂點，而可為彈性構件32的彎曲成凸狀的任意部位。該步驟中，例如，如圖5的（b）所示，彈性構件32的外周的至少一部分為被彈性構件保持機構22的按壓部22a按壓在平台23b的外周的凹處230b的狀態。該步驟中，隨著膠帶保持機構21的移動，第一彈性構件23a會自所述使彈性構件32彎曲的步驟中的狀態進一步收縮，第二彈性構件23c會因配置於第二彈性構件23c的上方的構件的自重及隨著膠帶保持機構21的移動而收縮的第一彈性構件23a的力而開始收縮。再者，該步驟中，彈性構件保持機構22維持於相對於基座部24相對靜止的狀態。Next, as shown in FIG. 5( a ), a step of bringing the tape 31 held by the tape holding mechanism 21 into contact with the convexly curved portion of the elastic member 32 is performed. This step can be performed, for example, by causing a moving mechanism (not shown) to move the tape holding mechanism 21 toward the platform 23b. In this step, the portion to be contacted with the tape 31 may be a convex vertex of the elastic member 32, but it does not need to be a convex vertex, and may be any portion of the elastic member 32 that is bent into a convex shape. In this step, for example, as shown in FIG. 5( b ), at least part of the outer circumference of the elastic member 32 is pressed against the recess 230 b of the outer circumference of the platform 23 b by the pressing part 22 a of the elastic member holding mechanism 22 . In this step, as the tape holding mechanism 21 moves, the first elastic member 23a will further shrink from the state in the step of bending the elastic member 32, and the second elastic member 23c will be disposed on the second elastic member 23c. The upper member starts to shrink due to its own weight and the force of the first elastic member 23 a that shrinks as the tape holding mechanism 21 moves. Furthermore, in this step, the elastic member holding mechanism 22 is maintained in a relatively stationary state relative to the base portion 24 .

接下來，進行如下步驟：一邊消除彈性構件32的凸狀的彎曲，一邊擴大膠帶31對於彈性構件32的接觸面積。該步驟例如可藉由下述方式進行，即，使未圖示的移動機構使膠帶保持機構21自使由膠帶保持機構21所保持的膠帶31與彈性構件32的彎曲成凸狀的部位接觸的狀態向平台23b進一步移動。該步驟中，隨著膠帶保持機構21的移動，第一彈性構件23a自所述接觸步驟中的狀態進一步逐步收縮，並且第二彈性構件23c亦藉由配置於第二彈性構件23c的上方的構件的自重及隨著膠帶保持機構21的移動而收縮的第一彈性構件23a的力而自所述接觸步驟中的狀態進一步逐步收縮。再者，該步驟中，彈性構件保持機構22亦維持於相對於基座部24相對靜止的狀態。Next, a step is performed to expand the contact area of the tape 31 with respect to the elastic member 32 while eliminating the convex bend of the elastic member 32 . This step can be performed, for example, by causing a moving mechanism (not shown) to cause the tape holding mechanism 21 to contact the tape 31 held by the tape holding mechanism 21 with a portion of the elastic member 32 that is curved in a convex shape. The state moves further towards platform 23b. In this step, as the tape holding mechanism 21 moves, the first elastic member 23a further gradually shrinks from the state in the contact step, and the second elastic member 23c also passes through the member arranged above the second elastic member 23c. The self-weight of the tape holding mechanism 21 and the force of the first elastic member 23 a that shrinks as the tape holding mechanism 21 moves, further gradually shrink from the state in the contact step. Furthermore, in this step, the elastic member holding mechanism 22 is also maintained in a relatively stationary state relative to the base portion 24 .

圖5的（c）示出了膠帶31對於彈性構件32的貼附完成的狀態。如圖5的（c）所示，在膠帶31對於彈性構件32的貼附完成的階段中，以膠帶保持機構21與彈性構件保持機構22不接觸的方式，彈性構件保持機構22的按壓部22a收容在膠帶保持機構21的凹部21a內。而且，如圖5的（d）所示，彈性構件32的外周的至少一部分與彈性構件保持機構22的按壓部22a及平台23b的外周的凹處230b均不接觸。此時，膠帶31貼附後的彈性構件32由平台23b的外周的內側的面231b所支撐。(c) of FIG. 5 shows a state in which the adhesive tape 31 has been adhered to the elastic member 32 . As shown in (c) of FIG. 5 , in the stage where the attachment of the tape 31 to the elastic member 32 is completed, the pressing portion 22 a of the elastic member holding mechanism 22 does not come into contact with the tape holding mechanism 21 and the elastic member holding mechanism 22 . It is accommodated in the recess 21a of the tape holding mechanism 21. Furthermore, as shown in (d) of FIG. 5 , at least a part of the outer circumference of the elastic member 32 does not contact the pressing portion 22 a of the elastic member holding mechanism 22 or the recess 230 b of the outer circumference of the platform 23 b. At this time, the elastic member 32 to which the tape 31 is attached is supported by the inner surface 231b of the outer periphery of the platform 23b.

然後，膠帶保持機構21及平台23b恢復至圖3的位置。然後，自彈性構件保持機構22取出膠帶31貼附後的彈性構件32。Then, the tape holding mechanism 21 and the platform 23b return to the positions of FIG. 3 . Then, the elastic member 32 to which the tape 31 has been attached is taken out from the elastic member holding mechanism 22 .

實施方式的膠帶貼附裝置及膠帶貼附方法的一例是藉由下述方式逐步貼附膠帶31，即，使彈性構件32彎曲成凸狀，使膠帶31接觸於彈性構件32的彎曲成凸狀的部位，一邊消除彈性構件32的凸狀的彎曲，一邊擴大膠帶31對於彈性構件32的接觸面積。因此，在實施方式的膠帶貼附裝置及膠帶貼附方法的一例中，由於可一邊使膠帶31與彈性構件32之間的空氣逃逸，一邊將膠帶31逐步貼附於彈性構件32，故而能夠抑制膠帶31與彈性構件32之間產生氣泡，並且亦能夠抑制所貼附的膠帶31產生皺褶。因此，實施方式的膠帶貼附裝置及膠帶貼附方法的一例與所述的專利文獻1中所記載的方法相比，能夠抑制產生膠帶31對於彈性構件32的未接著部。An example of the tape application device and the tape application method of the embodiment is to gradually apply the tape 31 by bending the elastic member 32 into a convex shape, and making the tape 31 contact the elastic member 32 and bend it into a convex shape. The contact area of the adhesive tape 31 with respect to the elastic member 32 is expanded while eliminating the convex bend of the elastic member 32 . Therefore, in an example of the tape application device and the tape application method of the embodiment, the tape 31 can be gradually adhered to the elastic member 32 while allowing the air between the tape 31 and the elastic member 32 to escape. Therefore, it is possible to suppress Air bubbles are generated between the adhesive tape 31 and the elastic member 32, and wrinkles in the attached adhesive tape 31 can also be suppressed. Therefore, the tape application device and the tape application method according to the embodiment can suppress the occurrence of non-adherent portions between the tape 31 and the elastic member 32 compared with the method described in the above-mentioned Patent Document 1.

而且，在實施方式的膠帶貼附裝置及膠帶貼附方法的一例中，由於可僅保持彈性構件32的外周的至少一部分而貼附膠帶31，故而即便在彈性構件32的與膠帶31的貼附面相反的一側存在例如晶片固定區域等不可與其他構件接觸的區域的情況下，亦能夠將膠帶31貼附於彈性構件32。Furthermore, in an example of the tape application device and the tape application method of the embodiment, since the tape 31 can be attached while holding only at least part of the outer circumference of the elastic member 32, even if the elastic member 32 is attached to the tape 31, Even when there is an area on the opposite side that cannot come into contact with other members, such as a chip fixing area, the adhesive tape 31 can be attached to the elastic member 32 .

而且，在實施方式的膠帶貼附裝置及膠帶貼附方法的一例中，由於凸向與彈性構件32因自重而彎曲側（例如引線框架的晶片的固定側）相反的一側彎曲而貼附膠帶31，故而能夠將膠帶31貼附於彈性構件32，而不用考慮彈性構件32因自重所致的彎曲。Furthermore, in an example of the tape applying device and the tape applying method of the embodiment, the tape is applied by bending the protrusion toward the side opposite to the side where the elastic member 32 bends due to its own weight (for example, the fixed side of the chip of the lead frame). 31, so the adhesive tape 31 can be attached to the elastic member 32 without considering the bending of the elastic member 32 due to its own weight.

而且，在實施方式的膠帶貼附裝置及膠帶貼附方法的一例中，第一彈性構件23a及第二彈性構件23c以所述方式收縮，藉此能夠抑制彈性構件32的凸狀的彎曲時及膠帶31向彈性構件32的貼附時彈性構件32的急遽變形。因此，能夠將膠帶31貼附於彈性構件32，而不對彈性構件32施加負擔。Furthermore, in an example of the tape application device and the tape application method of the embodiment, the first elastic member 23a and the second elastic member 23c are contracted in the above-described manner, thereby suppressing the convex bending of the elastic member 32 and the When the adhesive tape 31 is attached to the elastic member 32, the elastic member 32 deforms suddenly. Therefore, the adhesive tape 31 can be attached to the elastic member 32 without placing a load on the elastic member 32 .

再者，所述實施方式中，作為實施方式的膠帶貼附裝置的一例，對將膠帶保持機構21配置於上側並且將彎曲機構23配置於下側的結構進行了說明，但作為實施方式的膠帶貼附裝置的另一例，例如，如圖6的示意性側視圖所示，亦可設為將彎曲機構23配置於上側並且將膠帶保持機構21配置於下側的結構。Furthermore, in the embodiment, as an example of the tape application device of the embodiment, a structure in which the tape holding mechanism 21 is arranged on the upper side and the bending mechanism 23 is arranged on the lower side has been described. However, as the tape of the embodiment, As another example of the attachment device, for example, as shown in the schematic side view of FIG. 6 , the bending mechanism 23 may be arranged on the upper side and the tape holding mechanism 21 may be arranged on the lower side.

＜樹脂成形裝置＞ 圖7中示出實施方式的樹脂成形裝置的一例的示意性剖視圖。圖7所示的實施方式的樹脂成形裝置1包括壓縮成形模具10。壓縮成形模具10包括：第一模具110；以及第二模具120，與第一模具110相對向且配置於較第一模具110更靠上方。 ＜Resin molding equipment＞ FIG. 7 shows a schematic cross-sectional view of an example of the resin molding apparatus according to the embodiment. The resin molding apparatus 1 of the embodiment shown in FIG. 7 includes a compression molding die 10 . The compression molding mold 10 includes a first mold 110 and a second mold 120 that is opposite to the first mold 110 and is arranged above the first mold 110 .

第一模具110包括側面構件111、及底面構件112。側面構件111是以包圍底面構件112的周圍的方式配置。The first mold 110 includes side members 111 and a bottom member 112 . The side member 111 is arranged to surround the bottom member 112 .

底面構件112包括：上表面112a，可配置樹脂材料；以及滑動面112b，自上表面112a的周緣向下方延伸。底面構件112的滑動面112b構成為，與側面構件111的內周面111a接觸，且可相對於側面構件111的內周面111a滑動。The bottom surface member 112 includes: an upper surface 112a on which a resin material can be disposed; and a sliding surface 112b extending downward from the periphery of the upper surface 112a. The sliding surface 112b of the bottom surface member 112 is in contact with the inner peripheral surface 111a of the side member 111 and is configured to be slidable relative to the inner peripheral surface 111a of the side member 111.

樹脂成形裝置1更包括：上部固定盤121、下部固定盤122、以及可動盤115。在上部固定盤121與下部固定盤122之間，多個支柱部116沿鉛直方向延伸。多個支柱部116的各自的一端固定於上部固定盤121，另一端固定於下部固定盤122。而且，在側面構件111與可動盤115之間設置有彈性體114。The resin molding device 1 further includes an upper fixed plate 121 , a lower fixed plate 122 , and a movable plate 115 . Between the upper fixed plate 121 and the lower fixed plate 122, a plurality of support portions 116 extend in the vertical direction. Each of the plurality of support portions 116 has one end fixed to the upper fixed plate 121 and the other end fixed to the lower fixed plate 122 . Furthermore, an elastic body 114 is provided between the side member 111 and the movable disk 115 .

樹脂成形裝置1在下部固定盤122中的多個支柱部116之間更包括第一驅動機構117。第一驅動機構117構成為可使可動盤115向上方及下方移動。上部固定盤121及下部固定盤122構成為被固定而無法移動。因此，可動盤115可相對於上部固定盤121及下部固定盤122相對地移動。而且，第一驅動機構117構成為，經由可動盤115，使側面構件111及底面構件112可向上方及下方移動，即可升降。The resin molding device 1 further includes a first driving mechanism 117 between the plurality of support portions 116 in the lower fixed plate 122 . The first drive mechanism 117 is configured to move the movable disk 115 upward and downward. The upper fixed plate 121 and the lower fixed plate 122 are fixed and cannot move. Therefore, the movable plate 115 can move relatively relative to the upper fixed plate 121 and the lower fixed plate 122 . Furthermore, the first drive mechanism 117 is configured to move the side member 111 and the bottom member 112 upward and downward via the movable disk 115, that is, to move up and down.

樹脂成形裝置1在可動盤115的內部更包括第二驅動機構118。第二驅動機構118構成為，使底面構件112可向上方及下方移動，即可升降。藉此，底面構件112可相對於側面構件111相對地移動。The resin molding device 1 further includes a second driving mechanism 118 inside the movable plate 115 . The second drive mechanism 118 is configured to move the bottom member 112 upward and downward, that is, to move up and down. Thereby, the bottom member 112 can move relatively relative to the side member 111 .

＜樹脂成形品的製造方法＞ 以下，參照圖8～圖12的示意性剖視圖，對實施方式的樹脂成形品的製造方法的一例進行說明。首先，如圖8所示，進行在第二模具120設置成形對象物201的步驟，並且進行供給樹脂材料202的步驟。作為成形對象物201，使用藉由所述實施方式的膠帶貼附裝置及膠帶貼附方法的一例貼附了膠帶31的彈性構件32。 ＜Manufacturing method of resin molded products＞ Hereinafter, an example of the manufacturing method of the resin molded article according to the embodiment will be described with reference to the schematic cross-sectional views of FIGS. 8 to 12 . First, as shown in FIG. 8 , a step of setting the molding object 201 in the second mold 120 is performed, and a step of supplying the resin material 202 is performed. As the molding object 201, the elastic member 32 to which the tape 31 is attached is used as an example of the tape application device and the tape application method of the embodiment.

在第二模具120設置成形對象物201的步驟例如可藉由下述方式進行，即，以貼附有膠帶31側的彈性構件32的面成為第二模具120側的方式，在第二模具120設置成形對象物201。The step of arranging the molding object 201 in the second mold 120 can be performed, for example, by placing the second mold 120 on the second mold 120 so that the surface of the elastic member 32 on which the tape 31 is attached becomes the second mold 120 side. The molding object 201 is set.

供給樹脂材料202的步驟例如可藉由下述方式進行，即，對由側面構件111的內周面111a及底面構件112的上表面112a所構成的腔室內供給樹脂材料202。The step of supplying the resin material 202 can be performed, for example, by supplying the resin material 202 into the chamber formed by the inner peripheral surface 111 a of the side member 111 and the upper surface 112 a of the bottom surface member 112 .

再者，在第二模具120設置成形對象物201的步驟、與供給樹脂材料202的步驟的順序並無特別限定。In addition, the order of the step of setting the molding object 201 in the second mold 120 and the step of supplying the resin material 202 is not particularly limited.

接下來，如圖9所示，進行使第一模具110向第二模具120側移動的步驟。使第一模具110向第二模具120側移動的步驟例如可藉由下述方式進行，即，藉由第一驅動機構117，使可動盤115向第二模具120的方向移動。Next, as shown in FIG. 9 , a step of moving the first mold 110 toward the second mold 120 is performed. The step of moving the first mold 110 toward the second mold 120 can be performed, for example, by using the first driving mechanism 117 to move the movable plate 115 toward the second mold 120 .

接下來，進行使用樹脂材料202對成形對象物201進行樹脂成形的步驟。使用樹脂材料202對成形對象物201進行樹脂成形的步驟例如可以如下方式進行。Next, a step of resin molding the molding object 201 using the resin material 202 is performed. The step of resin molding the molding object 201 using the resin material 202 can be performed, for example, as follows.

首先，如圖10所示，藉由對樹脂材料202進行加熱使所述樹脂材料202熔融而製成熔融樹脂202a，並且藉由第二驅動機構118推壓底面構件112的上表面112a。此時，一邊使底面構件112的滑動面112b相對於側面構件111的內周面111a滑動，一邊使底面構件112相對於側面構件111相對地向上方移動。First, as shown in FIG. 10 , the resin material 202 is heated to melt the resin material 202 to form a molten resin 202 a , and the upper surface 112 a of the bottom surface member 112 is pressed by the second driving mechanism 118 . At this time, the bottom member 112 is moved upward relative to the side member 111 while sliding the sliding surface 112b of the bottom member 112 relative to the inner peripheral surface 111a of the side member 111.

接下來，如圖11所示，在推壓底面構件112的上表面112a的狀態下進一步進行熔融樹脂202a的加熱使所述熔融樹脂202a硬化而製成硬化樹脂202b。Next, as shown in FIG. 11 , the molten resin 202a is further heated while the upper surface 112a of the bottom member 112 is pressed, so that the molten resin 202a is cured to form a cured resin 202b.

然後，例如，如圖12的示意性剖視圖所示，藉由自壓縮成形模具10中取出樹脂成形後的成形對象物201，可獲得樹脂成形品301，所述樹脂成形品301是貼附有膠帶的彈性構件上所固定的晶片由硬化樹脂202b密封而成。Then, for example, as shown in the schematic cross-sectional view of FIG. 12 , by taking out the resin-molded molding object 201 from the compression mold 10 , a resin molded product 301 to which the tape is attached can be obtained. The wafer fixed on the elastic member is sealed with hardened resin 202b.

在實施方式的樹脂成形品的製造方法的一例中，在膠帶對於彈性構件的未接著部的產生得到抑制的狀態下，能夠實現固定於彈性構件的與膠帶的貼附側相反的一側的晶片的樹脂密封。因此，在實施方式的樹脂成形品的製造方法的一例中，與所述的專利文獻1中所記載的先前的膠帶貼附方法相比，可抑制樹脂成形時自膠帶31產生樹脂洩漏及樹脂成形後產生樹脂毛邊而製造樹脂成形品。In an example of the method for manufacturing a resin molded article according to the embodiment, it is possible to fix the wafer on the side of the elastic member opposite to the side where the tape is attached while suppressing the occurrence of non-adhesion portions of the tape to the elastic member. resin seal. Therefore, in an example of the method for manufacturing a resin molded article according to the embodiment, compared with the conventional tape attaching method described in Patent Document 1, the occurrence of resin leakage from the tape 31 during resin molding and the occurrence of resin molding can be suppressed. Resin burrs are then produced to produce resin molded products.

再者，如上所述，作為實施方式的樹脂成形品的製造方法的一例，對藉由壓縮成形來製造樹脂成形品的情況進行了說明，但例如亦可藉由轉移成形等其他樹脂成形方法來製造樹脂成形品。Furthermore, as mentioned above, as an example of the manufacturing method of the resin molded product in the embodiment, the case where the resin molded product is manufactured by compression molding has been described, but it may also be manufactured by other resin molding methods such as transfer molding. Manufacture of resin molded products.

應考慮此次揭示的實施方式在所有方面均為例示且並無限制性。本發明的範圍由申請專利範圍所示而非所述說明，且意圖包含與申請專利範圍均等的含義及範圍內的所有變更。 [工業上的可利用性] It should be considered that the embodiments disclosed this time are illustrative and not restrictive in all respects. The scope of the present invention is shown by the claimed scope rather than described above, and is intended to include all changes within the meaning and scope that are equivalent to the claimed scope. [Industrial applicability]

根據本文所揭示的實施方式，可提供一種膠帶貼附裝置、樹脂成形系統、膠帶貼附方法以及樹脂成形品的製造方法。According to the embodiments disclosed herein, a tape attaching device, a resin molding system, a tape attaching method, and a manufacturing method of a resin molded article can be provided.

1:樹脂成形裝置 10:壓縮成形模具 21:膠帶保持機構 21a:凹部 22:彈性構件保持機構 22a:按壓部 23:彎曲機構 23a:第一彈性構件 23b:平台 23c:第二彈性構件 23d:第一連結軸 23e:第二連結軸 24:基座部 31:膠帶 32:彈性構件 110:第一模具 111:側面構件 111a:內周面 112:底面構件 112a:上表面 112b:滑動面 114:彈性體 115:可動盤 116:支柱部 117:第一驅動機構 118:第二驅動機構 120:第二模具 121:上部固定盤 122:下部固定盤 201:成形對象物 202:樹脂材料 202a:熔融樹脂 202b:硬化樹脂 230b:凹處 231b:面 232b:空腔 301:樹脂成形品 1000:樹脂成形系統 1001:樹脂供給模組 1002:膠帶貼附模組 1003:樹脂成形模組 1004:供給收納模組 1005:控制部 1:Resin molding device 10: Compression forming mold 21: Tape holding mechanism 21a: concave part 22: Elastic member holding mechanism 22a: Compression part 23:Bending mechanism 23a: First elastic member 23b:Platform 23c: Second elastic member 23d:First connecting axis 23e:Second connecting axis 24: Base part 31:Tape 32: Elastic component 110:First mold 111:Side member 111a: Inner peripheral surface 112: Bottom component 112a: Upper surface 112b: Sliding surface 114:Elastomer 115: Movable plate 116:Pillar Department 117:First drive mechanism 118: Second drive mechanism 120: Second mold 121: Upper fixed plate 122:Lower fixed plate 201: Formed object 202:Resin material 202a: Molten resin 202b: Hardened resin 230b: recess 231b: noodles 232b:Cavity 301:Resin molded products 1000:Resin molding system 1001: Resin supply module 1002: Tape attachment module 1003:Resin molding module 1004: Supply storage module 1005:Control Department

圖1是實施方式的樹脂成形系統的一例的功能方塊圖。 圖2是實施方式的膠帶貼附裝置的一例的示意性側視圖。 圖3是對實施方式的膠帶貼附方法的一例進行圖解的示意性側視圖。 圖4的（a）及圖4的（b）是對實施方式的膠帶貼附方法的一例進行圖解的示意性側視圖。 圖5的（a）～圖5的（d）是對實施方式的膠帶貼附方法的一例進行圖解的示意性側視圖。 圖6是實施方式的膠帶貼附裝置的另一例的示意性側視圖。 圖7是實施方式的樹脂成形裝置的一例的示意性剖視圖。 圖8是對實施方式的樹脂成形品的製造方法的一例進行圖解的示意性剖視圖。 圖9是對實施方式的樹脂成形品的製造方法的一例進行圖解的示意性剖視圖。 圖10是對實施方式的樹脂成形品的製造方法的一例進行圖解的示意性剖視圖。 圖11是對實施方式的樹脂成形品的製造方法的一例進行圖解的示意性剖視圖。 圖12是實施方式的樹脂成形品的一例的示意性剖視圖。 圖13是無膠帶保持機構且未載置彈性構件的狀態的實施方式的膠帶貼附裝置的一例的示意性俯視圖。 FIG. 1 is a functional block diagram of an example of the resin molding system according to the embodiment. FIG. 2 is a schematic side view of an example of the tape application device according to the embodiment. FIG. 3 is a schematic side view illustrating an example of the tape attaching method according to the embodiment. 4(a) and 4(b) are schematic side views illustrating an example of the tape attaching method according to the embodiment. 5(a) to 5(d) are schematic side views illustrating an example of the tape attaching method according to the embodiment. Fig. 6 is a schematic side view of another example of the tape application device according to the embodiment. 7 is a schematic cross-sectional view of an example of the resin molding apparatus according to the embodiment. 8 is a schematic cross-sectional view illustrating an example of a method for manufacturing a resin molded article according to the embodiment. 9 is a schematic cross-sectional view illustrating an example of a method for manufacturing a resin molded article according to the embodiment. FIG. 10 is a schematic cross-sectional view illustrating an example of a method for manufacturing a resin molded article according to the embodiment. FIG. 11 is a schematic cross-sectional view illustrating an example of a method for manufacturing a resin molded article according to the embodiment. FIG. 12 is a schematic cross-sectional view of an example of a resin molded product according to the embodiment. 13 is a schematic plan view of an example of the tape application device of the embodiment without a tape holding mechanism and without an elastic member placed thereon.

21:膠帶保持機構 21: Tape holding mechanism

21a:凹部 21a: concave part

22:彈性構件保持機構 22: Elastic member holding mechanism

22a:按壓部 22a: Compression part

23:彎曲機構 23:Bending mechanism

23a:第一彈性構件 23a: First elastic member

23b:平台 23b:Platform

23c:第二彈性構件 23c: Second elastic member

23d:第一連結軸 23d:First connecting axis

23e:第二連結軸 23e:Second connecting axis

24:基底部 24: Basal part

Claims (12)

一種膠帶貼附裝置，包括：膠帶保持機構；彎曲機構，位於與所述膠帶保持機構空出間隔的位置；以及移動機構，構成為能夠使所述膠帶保持機構與所述彎曲機構相互相對地移動，所述彎曲機構包括彈性構件保持機構，所述彈性構件保持機構構成為能夠保持彈性構件的外周的至少一部分，且所述彎曲機構構成為能夠使所述彈性構件保持機構所保持的狀態的所述彈性構件凸向所述膠帶保持機構側而彎曲，所述彎曲機構包括平台，所述平台能夠設置所述彈性構件，所述膠帶貼附裝置更包括基座部，所述基座部位於所述平台的與所述膠帶保持機構側相反的一側，其中所述彎曲機構包括：第一連結軸，將所述膠帶保持機構與所述基座部連結；第一彈性構件，構成為包圍所述第一連結軸的周圍並且在所述膠帶保持機構與所述平台之間能夠伸縮；第二連結軸，將所述平台與所述基座部連結；以及第二彈性構件，構成為包圍所述第二連結軸的周圍並且在所述平台與所述基座部之間能夠伸縮。 A tape attaching device includes: a tape holding mechanism; a bending mechanism located at a distance from the tape holding mechanism; and a moving mechanism configured to enable the tape holding mechanism and the bending mechanism to move relative to each other. , the bending mechanism includes an elastic member holding mechanism configured to hold at least a part of the outer circumference of the elastic member, and the bending mechanism is configured to hold all the states held by the elastic member holding mechanism. The elastic member is convex and bent toward the side of the tape holding mechanism. The bending mechanism includes a platform, and the platform is capable of disposing the elastic member. The tape attaching device further includes a base portion, and the base portion is located at the The side of the platform opposite to the tape holding mechanism side, wherein the bending mechanism includes: a first connecting shaft connecting the tape holding mechanism and the base part; a first elastic member configured to surround the tape holding mechanism. around the first connecting shaft and between the tape holding mechanism and the platform, it is telescopic; a second connecting shaft connects the platform and the base; and a second elastic member is configured to surround the around the second connecting shaft and between the platform and the base part, which is telescopic. 如請求項1所述的膠帶貼附裝置，其中所述平台在所述平台的外周包括凹處。 The tape application device of claim 1, wherein the platform includes a recess on the outer periphery of the platform. 如請求項1所述的膠帶貼附裝置，其中所述基座部 構成為無法移動。 The tape attaching device according to claim 1, wherein the base portion It is constructed so that it cannot be moved. 如請求項1所述的膠帶貼附裝置，其中所述第一彈性構件的彈簧常數小於所述第二彈性構件的彈簧常數。 The tape attachment device of claim 1, wherein the spring constant of the first elastic member is smaller than the spring constant of the second elastic member. 如請求項1所述的膠帶貼附裝置，其中所述彎曲機構構成為，使所述彈性構件的外周的至少一部分相對於所述膠帶保持機構向與所述膠帶保持機構側相反的一側相對地移動，藉此能夠使所述彈性構件彎曲成凸狀。 The tape attaching device according to claim 1, wherein the bending mechanism is configured to cause at least a part of the outer circumference of the elastic member to face a side opposite to the tape holding mechanism side with respect to the tape holding mechanism. By moving, the elastic member can be bent into a convex shape. 如請求項1所述的膠帶貼附裝置，其構成為能夠調節所述彈性構件的彎曲。 The tape applying device according to claim 1, which is configured to be able to adjust the bending of the elastic member. 如請求項1所述的膠帶貼附裝置，其中所述膠帶保持機構包括凹部，所述凹部構成為，能夠以所述膠帶保持機構與所述彈性構件保持機構不接觸的方式收容所述彈性構件保持機構的至少一部分。 The tape attaching device according to claim 1, wherein the tape holding mechanism includes a recess configured to accommodate the elastic member in such a manner that the tape holding mechanism does not come into contact with the elastic member holding mechanism. Keep at least part of the institution. 如請求項1至請求項7中任一項所述的膠帶貼附裝置，其中所述彈性構件包含引線框架。 The tape attachment device according to any one of claims 1 to 7, wherein the elastic member includes a lead frame. 一種樹脂成形系統，包括如請求項1至請求項8中任一項所述的膠帶貼附裝置。 A resin molding system including the tape attaching device according to any one of claims 1 to 8. 一種膠帶貼附方法，是使用膠帶貼附裝置的膠帶貼附方法，且包括如下步驟：使膠帶保持機構保持膠帶的步驟；在彎曲機構的平台設置彈性構件的步驟；使所述彎曲機構以凸向所述膠帶保持機構側的方式使所述彈 性構件彎曲的步驟；使由所述膠帶保持機構所保持的所述膠帶與所述彈性構件的彎曲成凸狀的部位接觸的步驟；以及一邊消除所述彈性構件的彎曲，一邊擴大所述膠帶對於所述彈性構件的接觸面積的步驟；所述膠帶貼附裝置包括基座部，所述基座部位於所述平台的與所述膠帶保持機構相反的一側，所述彎曲機構更包括：第一彈性構件，構成為在所述膠帶保持機構與所述平台之間能夠伸縮；以及第二彈性構件，構成為在所述平台與所述基座部之間能夠伸縮，所述接觸步驟包括使所述第一彈性構件收縮的步驟。 A tape attaching method is a tape attaching method using a tape attaching device, and includes the following steps: a step of holding a tape by a tape holding mechanism; a step of setting an elastic member on a platform of a bending mechanism; making the bending mechanism convexly The elastic is moved toward the side of the tape holding mechanism. the step of bending the elastic member; the step of bringing the tape held by the tape holding mechanism into contact with a portion of the elastic member that is bent into a convex shape; and expanding the tape while eliminating the bending of the elastic member For the step of contacting the elastic member; the tape attachment device includes a base portion located on the opposite side of the platform to the tape holding mechanism, and the bending mechanism further includes: A first elastic member is configured to be stretchable between the tape holding mechanism and the platform; and a second elastic member is configured to be stretchable between the platform and the base part, and the contacting step includes The step of shrinking the first elastic member. 如請求項10所述的膠帶貼附方法，其中擴大所述膠帶的接觸面積的步驟包括使所述第一彈性構件及所述第二彈性構件兩者收縮的步驟。 The adhesive tape attaching method according to claim 10, wherein the step of expanding the contact area of the adhesive tape includes the step of shrinking both the first elastic member and the second elastic member. 一種樹脂成形品的製造方法，包括樹脂成形步驟，所述樹脂成形步驟是對使用如請求項10或請求項11所述的膠帶貼附方法貼附了所述膠帶的所述彈性構件進行樹脂成形。 A method of manufacturing a resin molded product, including a resin molding step of resin molding the elastic member to which the tape is attached using the tape attaching method according to claim 10 or 11 .
TW111142340A 2021-12-27 2022-11-07 Tape attaching device, resin molding system, tape attaching method, and method of manufacturing resin molded products TWI835393B (en)

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JP2006196605A (en) * 2005-01-12 2006-07-27 Seiko Epson Corp Device for attaching tape to substrate
JP2019106493A (en) * 2017-12-13 2019-06-27 第一精工株式会社 Method for sticking adhesive tape to substrate and device for sticking adhesive tape to substrate

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JP4614626B2 (en) 2003-02-05 2011-01-19 東京エレクトロン株式会社 Manufacturing method of thin semiconductor chip
JP2012238689A (en) 2011-05-11 2012-12-06 Renesas Electronics Corp Adhesion device and method of manufacturing semiconductor device

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JP2006196605A (en) * 2005-01-12 2006-07-27 Seiko Epson Corp Device for attaching tape to substrate
JP2019106493A (en) * 2017-12-13 2019-06-27 第一精工株式会社 Method for sticking adhesive tape to substrate and device for sticking adhesive tape to substrate

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