JP7146457B2 - Adhesive tape peeling method and adhesive tape peeling device - Google Patents

Description

The present invention relates to an adhesive tape peeling method and an adhesive tape peeling apparatus for peeling an adhesive tape, exemplified by a protective tape for circuit protection, attached to a semiconductor wafer (hereinafter referred to as a "wafer").

After the circuit pattern is formed on the surface of the wafer, an adhesive tape (protective tape) for circuit protection is attached to the circuit surface, and the back surface of the wafer is ground by a back grinding process. After the backgrinding process is completed, the protective tape is removed from the wafer, and the wafer is divided into a large number of chip parts by a dicing process. In this case, in order to prevent the chip components from scattering during the dicing process, a supporting adhesive tape (supporting tape) is attached over the ring frame and the rear surface of the wafer to integrate them before the dicing process.

An example of a conventional method for peeling off an adhesive tape such as a protective tape or a support tape from a wafer is as follows. That is, the wafer is sucked and held on the holding table with the surface to which the adhesive tape is attached facing upward. Next, an adhesive tape for peeling (peeling tape) is pasted on the adhesive tape while rolling the pasting roller. After that, the peeling tape is reversely peeled by a tapered plate-shaped edge member, so that the adhesive tape adhered to the peeling tape is integrally peeled off from the upper surface of the wafer (see, for example, Patent Document 1).

In this method, the entire lower surface of the wafer is brought into contact with the holding table and held by suction. On the other hand, when peeling off the adhesive tape attached to the non-circuit surface of the wafer with the circuit surface of the wafer facing downward, the adhesive tape is facing downward when peeling off the adhesive tape from the upper surface of the wafer. It is preferable to avoid physical contact of the holding table or the like with the circuit surface of the wafer.

Methods for holding the wafer while avoiding physical contact with the circuit surface of the wafer include the following methods. That is, the holding table has a wafer holding portion formed of an annular projection, and the wafer holding portion is brought into contact with the outer peripheral portion of the lower surface of the wafer to attract the wafer. In general, no circuit is formed on the outer circumference of the wafer. Therefore, by sucking and holding the outer circumference of the lower surface of the wafer through the wafer holder, the wafer can be stably held while suppressing the influence on the circuit (for example, See Patent Document 2).

JP-A-2002-124494 JP 2016-46437 A

However, the above conventional device has the following problems.

That is, in the conventional configuration, when the wafer is placed on the holding table having the annular protrusion, it may deviate from the intended position. In this case, there is a concern that the portion of the lower surface of the wafer where the circuit is formed may come into physical contact with the annular convex portion of the holding table unexpectedly, resulting in damage to the circuit. As described above, in the conventional configuration, it is difficult to reliably avoid physical contact with the lower surface of the wafer when peeling the adhesive tape from the upper surface of the wafer.

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances. It is a main object of the present invention to provide an adhesive tape peeling method and an adhesive tape peeling apparatus capable of peeling.

In order to achieve these objects, the present invention has the following configuration.
That is, an adhesive tape peeling method for peeling an adhesive tape attached to a work,
a transporting process of transporting the work to a peeling position;
a holding step of holding the work at the peeling position by bringing a holding member into contact with the peripheral edge portion of the work transported to the peeling position;
A peeling process of peeling the adhesive tape integrally with the peeling tape from the workpiece held at the peeling position by peeling the peeling tape while affixing the peeling tape to the adhesive tape by a peeling member and folding the peeling tape. When,
with
The peeling process is
By adsorbing the adhesive tape with an adsorption member when the release tape is attached to the adhesive tape, deformation of the workpiece due to the force generated when the release tape is attached is prevented.
It is characterized by
In order to achieve such an object, the present invention may take the following configuration.
That is, an adhesive tape peeling method for peeling an adhesive tape attached to a work,
a transporting process of transporting the work to a peeling position;
a holding step of holding the work at the peeling position by bringing a holding member into contact with the peripheral edge portion of the work transported to the peeling position;
A peeling process of peeling the adhesive tape integrally with the peeling tape from the workpiece held at the peeling position by peeling the peeling tape while affixing the peeling tape to the adhesive tape by a peeling member and folding the peeling tape. When,
with
The peeling process is
When the release tape is attached to the adhesive tape, a first gas supply mechanism blows gas onto the work to prevent deformation of the work caused by a force generated when the release tape is attached.
It is characterized by

(Function and Effect) According to this configuration, after the work is transported to the peeling position, the work is stably held at the peeling position by the holding member coming into contact with the periphery of the work. At this time, it is possible to avoid direct physical contact of the holding member and the like with the upper and lower surfaces of the workpiece. A release tape is attached to the adhesive tape attached to the work while the peripheral edge of the work is held by the holding member, and the adhesive tape and the release tape are separated together.

That is, the adhesive tape can be peeled off from the workpiece while the workpiece is stably held even if the holding member or the like does not contact the surface of the workpiece to which the adhesive tape is not attached. Therefore, it is possible to reliably avoid problems caused by the physical contact of the holding member and the like with the surface of the work when the adhesive tape is peeled off.

Further, in the above-described invention, each of the holding members in contact with the peripheral edge of the work applies a force to the work from the peripheral edge toward the center of the work. It is preferred that the workpiece be held.

(Action and Effect) According to this configuration, the work is held by each of the holding members exerting a force on the work from the peripheral portion toward the central portion of the work. In this case, the workpiece is held more stably by each of the forces acting toward the central portion of the workpiece. Therefore, even if the surface of the work does not come into physical contact with the surface of the work, it is possible to more reliably avoid displacement of the work during the process of peeling off the adhesive tape.

Further, in the invention described above, in the holding process, the work is held while controlling the magnitude of the force exerted by each of the holding members from the peripheral portion toward the center portion of the work to an appropriate magnitude. It is preferable to hold at the peeling position. In this case, each of the holding members is controlled so that the magnitude of the force acting from the peripheral portion toward the central portion of the work is appropriate. Therefore, it is possible to more reliably avoid the occurrence of defects in the process of holding the workpiece, such as deformation of the workpiece due to the action of excessive force and dropping of the workpiece due to insufficient acting force.

Further, in the above-described invention, it is preferable that the holding member has an elastic body, and in the holding process, the elastic body contacts the periphery of the work and is elastically deformed to hold the work.

(Function and Effect) According to this configuration, the work is held by the elastic body provided in the holding member contacting the peripheral portion of the work and being elastically deformed. At this time, since the elastic body is elastically deformed according to the shape of the peripheral edge of the work, the portion of the holding member that contacts the peripheral edge of the work becomes wider. Therefore, the holding member can hold the workpiece more stably.

Further, in the above-described invention, the holding member is configured to be able to move appropriately between a holding position in contact with the peripheral portion of the work and an avoidance position in which contact with the adhesive tape peeled off from the work can be avoided. Preferably, in the peeling process, the adhesive tape is peeled off from the workpiece while appropriately switching the positions of the plurality of holding members between the holding position and the avoidance position.

(Function and Effect) According to this configuration, the holding member can move between the holding position and the avoidance position as appropriate. At the holding position, the holding member contacts the periphery of the work, and at the avoiding position, the holding member can avoid contact with the adhesive tape peeled off from the work. Then, the adhesive tape is peeled off from the workpiece while switching the position of the holding member between the holding position and the avoiding position as appropriate.

That is, at the position where the adhesive tape is peeled off from the work, the holding member is moved to the avoidance position to avoid contact between the adhesive tape and the holding member, while the holding member at positions other than the position where the adhesive tape is peeled off from the work. can be moved into the holding position. Therefore, when the adhesive tape is peeled off from the work, while the work is stably held by the holding member that is moving to the holding position, a peeling error occurs due to contact between the adhesive tape peeled from the work and the holding member. can be reliably prevented.

Further, in the invention described above, the peeling process is caused by a force generated when the peeling tape is attached by adsorbing the adhesive tape with an adsorption member when the peeling tape is attached to the adhesive tape. It is preferable to prevent deformation of the workpiece.

(Function and Effect) According to this configuration, when the release tape is attached to the adhesive tape, the adhesive tape is adsorbed by the adsorption member. This adsorption prevents deformation of the workpiece due to the force generated when the peeling tape is attached. Therefore, it is possible to more reliably prevent the deterioration of the quality of the work and the occurrence of the peeling error of the adhesive tape.

Further, in the invention described above, the peeling process is caused by a force generated when the peeling tape is adhered by blowing gas onto the workpiece from the first gas supply mechanism when the peeling tape is adhered to the adhesive tape. It is preferable to prevent the deformation of the work that occurs.

(Function and Effect) According to this configuration, when the peeling tape is attached to the adhesive tape, the first gas supply mechanism blows the gas onto the work. By blowing the gas, it is possible to prevent deformation of the workpiece when the peeling tape is attached. Therefore, it is possible to more reliably avoid the deterioration of the quality of the work and the occurrence of the peeling error of the adhesive tape.

Further, in the invention described above, the peeling process is caused by a force generated when the adhesive tape is peeled off by sucking the work in a non-contact state by a suction mechanism when peeling the adhesive tape from the work. It is preferable to prevent the deformation of the work that occurs.

(Function and Effect) According to this configuration, when the adhesive tape is peeled from the work, the work is sucked in a non-contact state by the suction mechanism. The suction prevents deformation of the work caused by the force generated when the adhesive tape is peeled off from the work. Therefore, it is possible to more reliably prevent the deterioration of the quality of the work and the occurrence of the peeling error of the adhesive tape.

Further, in the invention described above, the peeling process is caused by a force generated when the adhesive tape is peeled off by blowing gas onto the work by the second gas supply mechanism when the adhesive tape is peeled off from the work. It is preferable to prevent deformation of the workpiece.

(Action and Effect) According to this configuration, when the adhesive tape is peeled off from the work, the gas is blown onto the work by the second gas supply mechanism. By blowing the gas, it is possible to prevent deformation of the work when the adhesive tape is peeled off from the work. Therefore, it is possible to more reliably avoid the deterioration of the quality of the work and the occurrence of the peeling error of the adhesive tape.

In order to achieve such an object, the present invention may take the following configuration.
That is, an adhesive tape peeling device for peeling an adhesive tape attached to a work,
a transport mechanism for transporting the work to a peeling position;
a holding member that holds the work at the peeling position by contacting the peripheral edge portion of the work conveyed to the peeling position;
A peeling mechanism that peels the adhesive tape integrally with the peeling tape from the workpiece held at the peeling position by peeling the peeling tape while affixing the peeling tape to the adhesive tape by a peeling member and folding the peeling tape. When,
an adsorption member that adsorbs the adhesive tape when the peeling tape is attached to the adhesive tape and prevents deformation of the workpiece due to a force generated when the peeling mechanism attaches the peeling tape;
It is characterized by comprising
In order to achieve such an object, the present invention may take the following configuration.
That is, an adhesive tape peeling device for peeling an adhesive tape attached to a work,
a transport mechanism for transporting the work to a peeling position;
a holding member that holds the work at the peeling position by contacting the peripheral edge portion of the work conveyed to the peeling position;
A peeling mechanism that peels the adhesive tape integrally with the peeling tape from the workpiece held at the peeling position by peeling the peeling tape while affixing the peeling tape to the adhesive tape by a peeling member and folding the peeling tape. When,
a first gas supply mechanism for blowing gas onto the workpiece when the peeling tape is attached to the adhesive tape to prevent deformation of the workpiece due to force generated when the peeling mechanism attaches the peeling tape; ,
It is characterized by comprising

(Function and Effect) According to this configuration, after the conveying mechanism conveys the work to the peeling position, the holding member comes into contact with the periphery of the work, thereby stably holding the work at the peeling position. At this time, it is possible to avoid direct physical contact of the holding member and the like with the upper and lower surfaces of the workpiece. Then, while the peripheral edge of the work is held by the holding member, the peeling mechanism attaches the peeling tape to the adhesive tape attached to the work, and peels the adhesive tape together with the peeling tape.

That is, the adhesive tape can be peeled off from the workpiece while the workpiece is stably held even if the holding member or the like does not contact the surface of the workpiece to which the adhesive tape is not attached. Therefore, it is possible to reliably avoid problems caused by the physical contact of the holding member and the like with the surface of the work when the adhesive tape is peeled off.

Further, in the above-described invention, a pressurizing mechanism for holding the work by exerting a force on the work from each of the holding members that are in contact with the periphery of the work from the periphery to the center of the work. is preferably provided.

(Action and Effect) According to this configuration, there is provided a pressurizing mechanism that applies a force from each of the holding members to the work from the peripheral portion toward the central portion of the work. In this case, the work is held more stably by each of the forces applied by the pressure mechanism toward the central portion of the work. Therefore, even if the surface of the work does not come into physical contact with the surface of the work, it is possible to more reliably avoid displacement of the work during the process of peeling off the adhesive tape.

Further, in the above-described invention, it is preferable that each of the holding members is provided with a control mechanism for controlling the magnitude of the force acting from the peripheral portion toward the central portion of the work to an appropriate magnitude. In this case, the control mechanism controls the force exerted by each of the holding members from the peripheral portion toward the central portion of the work so as to be an appropriate magnitude. Therefore, it is possible to more reliably avoid the occurrence of defects in the process of holding the workpiece, such as deformation of the workpiece due to the action of excessive force and dropping of the workpiece due to insufficient acting force.

Further, in the above-described invention, it is preferable that the holding member has an elastic body, and the elastic body is elastically deformed in contact with the peripheral edge portion of the work to hold the work.

(Function and Effect) According to this configuration, the work is held by the elastic body provided in the holding member contacting the peripheral portion of the work and being elastically deformed. At this time, since the elastic body is elastically deformed according to the shape of the peripheral edge of the work, the portion of the holding member that contacts the peripheral edge of the work becomes wider. Therefore, the holding member can hold the workpiece more stably.

Further, in the above-described invention, a driving mechanism is provided for appropriately moving the holding member between a holding position in which the holding member contacts the peripheral portion of the work and an avoidance position in which contact with the adhesive tape peeled off from the work can be avoided. Preferably, the peeling mechanism peels off the adhesive tape from the workpiece while the drive mechanism appropriately switches the positions of the plurality of holding members between the holding position and the avoidance position.

(Function and Effect) According to this configuration, the holding member can be moved between the holding position and the avoidance position by the driving mechanism. At the holding position, the holding member contacts the periphery of the work, and at the avoiding position, the holding member can avoid contact with the adhesive tape peeled off from the work. Then, the position of the holding member is switched between the holding position and the avoiding position by the drive mechanism, and the adhesive tape is peeled off from the workpiece.

That is, at the position where the adhesive tape is peeled off from the work, the holding member is moved to the avoidance position to avoid contact between the adhesive tape and the holding member, while the holding member at positions other than the position where the adhesive tape is peeled off from the work. can be moved into the holding position. Therefore, when the adhesive tape is peeled off from the work, while the work is stably held by the holding member that is moving to the holding position, a peeling error occurs due to contact between the adhesive tape peeled from the work and the holding member. can be reliably prevented.

Further, in the above-described invention, the adhesive tape is adsorbed when the peeling tape is attached to the adhesive tape, thereby preventing deformation of the workpiece due to a force generated when the peeling mechanism attaches the peeling tape. It is preferable to provide an adsorption member that

(Function and Effect) According to this configuration, when the release tape is attached to the adhesive tape, the adhesive tape is adsorbed by the adsorption member. This adsorption prevents deformation of the workpiece due to the force generated when the peeling tape is attached. Therefore, it is possible to more reliably prevent the deterioration of the quality of the work and the occurrence of the peeling error of the adhesive tape.

Further, in the above-described invention, when the peeling tape is attached to the adhesive tape, a gas is blown onto the work to prevent deformation of the work caused by a force generated when the peeling mechanism attaches the peeling tape. It is preferable to provide a first gas supply mechanism for performing.

(Function and Effect) According to this configuration, when the peeling tape is attached to the adhesive tape, the first gas supply mechanism blows the gas onto the work. By blowing the gas, it is possible to prevent deformation of the workpiece when the peeling tape is attached. Therefore, it is possible to more reliably avoid the deterioration of the quality of the work and the occurrence of the peeling error of the adhesive tape.

Further, in the above-described invention, when the adhesive tape is peeled from the work, the work is sucked in a non-contact state, and the peeling mechanism peels off the adhesive tape. It is preferable to have a suction mechanism that prevents deformation.

(Function and Effect) According to this configuration, when the adhesive tape is peeled from the work, the work is sucked in a non-contact state by the suction mechanism. The suction prevents deformation of the work caused by the force generated when the adhesive tape is peeled off from the work. Therefore, it is possible to more reliably prevent the deterioration of the quality of the work and the occurrence of the peeling error of the adhesive tape.

Further, in the above-described invention, when the adhesive tape is peeled off from the work, a gas is blown onto the work to prevent deformation of the work caused by a force generated when the peeling mechanism peels off the adhesive tape. It is preferable to have a second gas supply mechanism.

(Action and Effect) According to this configuration, when the adhesive tape is peeled off from the work, the gas is blown onto the work by the second gas supply mechanism. By blowing the gas, it is possible to prevent deformation of the work when the adhesive tape is peeled off from the work. Therefore, it is possible to more reliably avoid the deterioration of the quality of the work and the occurrence of the peeling error of the adhesive tape.

According to the adhesive tape peeling method and the adhesive tape peeling apparatus of the present invention, the wafer is stably held at the peeling position by holding the peripheral portion of the wafer with the holding member. Then, the adhesive tape attached to the wafer is peeled off while the wafer is held at the peeling position. Therefore, the adhesive tape attached to the other surface of the wafer can be preferably peeled off while reliably avoiding physical contact with the one surface of the wafer.

1 is a plan view showing the basic configuration of an adhesive tape peeling device according to Example 1. FIG. 4 is a front view showing the basic configuration of a holding mechanism and a peeling mechanism according to Example 1. FIG. 4 is a plan view showing the basic configuration of a holding mechanism and a peeling mechanism according to Example 1. FIG. 4A and 4B are diagrams illustrating a configuration of a holding mechanism according to the first embodiment; FIG. (a) is a longitudinal sectional view showing a state in which the holding member is moved to the avoidance position; (b) is a longitudinal sectional view showing the state in which the holding member is moved to the holding position; FIG. 10 is a plan view showing the positional relationship between the holding member that has moved to the avoidance position and the holding member that has moved to the holding position; 5 is a plan view showing a position pattern of a holding member according to Example 1. FIG. (a) is a plan view showing a first pattern, (b) is a plan view showing a second pattern, (c) is a plan view showing a third pattern, and (d) is a plan view showing a third pattern. 4 is a plan view showing the pattern of No. 4. FIG. 4 is a front view showing the operation of the adhesive tape peeling device according to Example 1. FIG. (a) is a front view showing a state in which the transfer mechanism is moved to the wafer supply section, and (b) is a front view showing a state in which alignment pins of the wafer holding section are moved from their initial positions, and wafers held by the wafer holding section are moved. It is a front view which shows the state which is performing position alignment. 4A and 4B are diagrams showing the operation of the adhesive tape peeling device according to the first embodiment; FIG. (a) is a front view showing a state in which a wafer is transported to an aligner, and (b) is a front view showing a state in which the wafer is aligned using alignment pins. 4A and 4B are diagrams showing the operation of the adhesive tape peeling device according to the first embodiment; FIG. (a) is a longitudinal sectional view showing a state in which a wafer is transferred to a holding mechanism; (b) is a longitudinal sectional view showing a state in which a holding member is brought into contact with the peripheral portion of the wafer to hold the wafer; ) is a vertical cross-sectional view showing a state in which a holding member in contact with the wafer exerts a force from the peripheral portion toward the central portion on the wafer to hold the wafer more stably. 4A and 4B are diagrams showing the operation of the adhesive tape peeling device according to the first embodiment; FIG. (a) is a plan view showing an arrangement pattern of holding members in a state where the movable table is moved to the peeling start position, and (b) is a vertical cross-sectional view showing a state in which the peeling tape is attached to the adhesive tape. and (c) is a plan view showing the positional relationship between the holding member and the peeling unit when the peeling tape is attached to the adhesive tape. 4A and 4B are diagrams showing the operation of the adhesive tape peeling device according to the first embodiment; FIG. (a) is a vertical cross-sectional view showing a state in which the peeling unit separates the adhesive tape together with the peeling tape, and (b) shows the positional relationship of the holding member and the adhesive tape remaining on the wafer in the state of (a). FIG. 10 is a plan view showing a range in which 4A and 4B are diagrams showing the operation of the adhesive tape peeling device according to the first embodiment; FIG. (a) is a plan view showing the positional relationship of the holding member when the boundary line between the adhesive tape before peeling and the adhesive tape after peeling is in the vicinity of F1, and (b) is the adhesive tape before peeling. FIG. 4C is a plan view showing the positional relationship of the holding member when the boundary line with the adhesive tape after peeling is away from F1, and FIG. is a plan view showing the positional relationship of the holding member in the vicinity of , and (d) is the position of the holding member when the boundary line between the adhesive tape before peeling and the adhesive tape after peeling is away from F2 It is a top view which shows a relationship. 4A and 4B are diagrams showing the operation of the adhesive tape peeling device according to the first embodiment; FIG. (a) is a plan view showing the positional relationship of the holding member when the boundary line between the adhesive tape before peeling and the adhesive tape after peeling is in the vicinity of F3, and (b) is the adhesive tape before peeling. FIG. 4C is a plan view showing the positional relationship of the holding member when the boundary line with the adhesive tape after peeling is near the left end of the wafer, and FIG. It is a diagram. It is a figure which shows operation|movement of the adhesive tape peeling apparatus which concerns on Example 2. FIG. (a) is a plan view showing the positional relationship of the holding member in a state where the release tape is attached to the adhesive tape, and (b) is a boundary line between the adhesive tape before peeling and the adhesive tape after peeling near F1. (c) is a positional relationship of the holding member when the boundary line between the adhesive tape before peeling and the adhesive tape after peeling is in the vicinity of F2. and (d) is a plan view showing the positional relationship of the holding member when the boundary line between the adhesive tape before peeling and the adhesive tape after peeling is in the vicinity of F3. It is a figure which shows the structure of the holding member which concerns on a modification. (a) is a vertical cross-sectional view showing a state in which a holding member having a uniform thickness is arranged at a avoidance position, and (b) is a longitudinal sectional view showing a state in which the holding member having a uniform thickness is moved to the holding position FIG. 4C is a vertical cross-sectional view showing a state in which a wafer is held; (c) is a vertical cross-sectional view showing a state in which a holding member having a concave portion is arranged at an avoidance position; FIG. 10 is a vertical cross-sectional view showing a state in which the wafer is held by moving to a position; It is a figure which shows the structure of the holding member which concerns on a modification. (a) is a perspective view of the holding member, (b) is a vertical cross-sectional view showing the state where the holding member is arranged at the avoidance position, and (c) is an elastic body of the holding member that is attached to the peripheral edge of the wafer. FIG. 10D is a vertical cross-sectional view showing a state in which the wafer is in contact, and (d) is a vertical cross-sectional view showing a state in which the elastic body of the holding member is in contact with the peripheral edge portion of the wafer and is further elastically deformed. It is a figure explaining the adhesive tape peeling apparatus which concerns on a modification. (a) is a vertical cross-sectional view showing a state in which gas is blown onto the lower surface of a wafer through a gas flow path when the release tape is attached to the adhesive tape; FIG. 10 is a vertical cross-sectional view showing a state in which the lower surface of the wafer is sucked through the gas flow path when removing the wafer.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a plan view showing the basic configuration of an adhesive tape peeling device 1 according to Embodiment 1. FIG. In the figure showing the adhesive tape applying apparatus 1, illustration of supporting means for supporting various components and driving means for driving various components is omitted as appropriate.

The adhesive tape peeling apparatus 1 according to the first embodiment is a semiconductor wafer W (hereinafter simply referred to as "wafer W") having an adhesive tape T attached to its back surface as an example of a configuration for peeling an adhesive tape from a work. A configuration for peeling the adhesive tape T from the tape will be described. That is, in Example 1, the wafer W corresponds to the workpiece in the present invention. It is assumed that the surface of the wafer W has a circuit pattern formed thereon.

<Explanation of overall configuration>
As shown in FIG. 1, the adhesive tape peeling device 1 according to this embodiment includes a wafer supply section 2, a wafer recovery section 3, a wafer transfer mechanism 4, an aligner 5, a holding mechanism 6, and a peeling mechanism 7. As shown in FIG.

The wafer supply unit 2 is loaded with a cassette C1. In the cassette C1, the wafers W with the adhesive tapes T adhered to their back surfaces are inserted in multiple stages in a horizontal posture with their back surfaces facing upward. The wafer storage unit 3 is loaded with a cassette C2. In the cassette C2, the wafers W with the adhesive tape T peeled off from the back surface are inserted into the cassette C2 in a horizontal posture in multiple stages with the back surface facing upward.

A robot arm 4a provided in the wafer transfer mechanism 4 is configured to be horizontally movable forward and backward, and is configured to be capable of pivotal movement and vertical movement as a whole. A horseshoe-shaped wafer holder 4b is provided at the tip of the robot arm 4a. The wafer holder 4b is a Bernoulli chuck as a preferred example, and holds the back surface of the wafer W in a suspended manner without contact.

Specifically, as shown in FIG. 6, a plurality of gas supply pads 4c are provided on the lower surface of the wafer holder 4b. The gas supply pad 4c is communicated with a gas supply mechanism (not shown). A negative pressure region is formed between the wafer W and the wafer holding portion 4b by blowing gas from the wafer holding portion 4b onto the rear surface of the wafer W facing upward through the gas supply pad 4c, thereby holding the wafer. The portion 4b suspends and holds the back surface of the wafer W without contact.

Further, a plurality of positioning pins 4d are erected on a predetermined circumference on the lower surface of the wafer holding portion 4b. Each of the alignment pins 4d is configured to be reciprocally movable toward the center of the wafer holder 4b. The position of the positioning pin 4d on a predetermined circumference is adjusted so as to avoid interference with a holding member 9, which will be described later. An example of a position where the alignment pin 4d contacts the peripheral edge of the wafer W in plan view is indicated by a dotted line R in FIG.

The aligner 5 includes a horizontal stage 5a, gas supply pads 5b, and alignment pins 5c, and aligns the wafer W transferred from the wafer supply unit 2. As shown in FIG. The gas supply pad 5b is formed on the surface of the stage 5a and communicated with a gas supply mechanism (not shown). A negative pressure region is formed between the wafer W and the stage 5a by blowing gas through the gas supply pad 5b against the lower surface of the wafer transported to the aligner 5, and the wafer is floated by the Bernoulli effect. It is held on the stage 5a.

The alignment pins 5c are erected at equal intervals on a predetermined circumference of the stage 5a. Each alignment pin 5c is configured to be reciprocally movable from the outer peripheral portion of the stage 5a toward the central portion of the stage 5a. The wafer W held on the stage 5a in a floating state is aligned with the position indicated by the dotted line P1 by the alignment pins 5c.

The holding mechanism 6 has a movable stage 8 , a plurality of holding members 9 and a gas supply pad 10 . As shown in FIG. 2, the movable stage 8 is supported so as to be slidable in the left-right direction along rails 11 arranged horizontally in the left-right direction (x-direction). The movable stage 8 is screw driven by a screw shaft 15 driven forward and backward by a motor 13 . By sliding along the rail 11, the movable stage 8 moves between the initial position indicated by the solid line in FIG. 1 or 2 and the separation start position indicated by the dotted line in FIG. 1 or 2. configured to move back and forth.

The holding member 9 has a rod-like configuration in the first embodiment, and is erected on a predetermined circumference of the movable stage 8 . Since each of the holding members 9 contacts the peripheral portion Wb of the wafer W, the wafer W is stably held on the movable stage 8 without physical contact with the lower surface Wa. A detailed configuration of the holding member 9 will be described later.

The gas supply pad 10 is provided on the upper surface of the movable stage 8, as shown in FIG. The position at which each of the gas supply pads 10 is arranged is adjusted in advance so as to be below the wafer W transferred to the holding mechanism 6 . The gas supply pad 10 is connected to a gas supply device (not shown), and is configured to supply gas to the lower surface of the wafer W when the adhesive tape T is peeled from the wafer W together with the peeling tape Ts. A negative pressure region is formed between the wafer W and the gas supply pad 10 by the gas supply from the gas supply pad 10, and a downward force is generated on the wafer W by the Bernoulli effect.

The peeling mechanism 7 is arranged between the initial position of the movable stage 8 and the peeling start position of the movable stage 8, as shown in FIGS. The peeling mechanism 7 includes a tape supply section 17 , a tape recovery section 19 and a peeling unit 20 . The tape supply unit 17 feeds out the peeling tape Ts loaded on the original roll. The released peeling tape Ts is guided to the peeling unit 20 by a guide roll (not shown). The tape collecting section 19 winds and collects the peeling tape Ts fed from the peeling unit 20 .

Next, the configuration of the peeling unit 20 will be described. As shown in FIG. 2, a support frame 22 made of drawn aluminum or the like is fixed across a pair of left and right vertical frames 21 erected on the apparatus base. A box-shaped base 23 is connected to the left and right central portions of the support frame 22 . Further, a lift table 25 supported slidably up and down via a pair of left and right vertical rails 24 provided on the base 23 is lifted and lowered by a ball shaft connected and driven by a motor 26 . The peeling unit 20 is mounted on a lift table 25 .

The lift table 25 is configured in the shape of a hollow frame penetrating vertically. The peeling unit 20 is provided in the inner lower part of the side plate 27 provided on the left and right sides of the lift table 25 . A support frame 28 is fixed across the side plates 27 .

A peeling member 29 is attached to the center of the support frame 28 . The peeling member 29 has a plate shape shorter than the diameter of the wafer W and is tapered toward the tip. The peeling member 29 is fixed in an obliquely downward inclined posture.

Further, in the peeling unit 20, a supply guide roller 31 is rotatably supported behind the side plate 27. As shown in FIG. A plurality of guide rollers 32, nip rollers 33, and tension rollers 34 are arranged above the peeling unit 20. As shown in FIG.

The collecting guide roller 32 is pivotally supported so that it can freely rotate. The tension roller 34 is rotatably mounted on a support arm 35 and arranged swingably through the support arm 35 . Therefore, the tension roller 34 applies appropriate tension to the peeling tape Ts that has been guided and wound.

The recovery guide roller 32 and tension roller 34 are configured as wide rollers having a length larger than the diameter of the wafer W, and the outer peripheral surface thereof is coated with fluorine resin to form a difficult-to-adhere surface. The guide roller 31 for supply is configured to be a narrow roller longer than the width of the peeling tape Ts and shorter than the diameter of the wafer W. As shown in FIG.

The peeling mechanism 7 further includes an adsorption member 37 . A pair of adsorption members 37 are provided on the left and right sides of the peeling member 29 , that is, on the front side and the back side of the peeling member 29 when viewed from the entire adhesive tape peeling apparatus 1 . The adsorption member 37 is, for example, a plate-shaped member, and is configured to be movable up and down independently of the lift table 25 . The adsorption member 37 is connected to a vacuum device (not shown), and is configured to adsorb the adhesive tape T from the surface side when the peeling unit 20 sticks the peeling tape Ts to the adhesive tape T.

When the peeling member 29 presses and attaches the peeling tape Ts to the surface of the adhesive tape T, a downward force J1 acts on the wafer W, while the adsorption member 37 adsorbs the surface of the adhesive tape T, thereby , an upward force J2 acts on the wafer W. FIG. Therefore, by applying a force J2 in the opposite direction to the force J1 by means of the adsorption of the adsorption member 37, deformation of the wafer W due to the force J1 acting on the wafer W when the peeling tape Ts is attached to the adhesive tape T is prevented. can.

The adhesive tape peeling device 1 further includes a control section 40 and an input section 50 . The control unit 40 includes a CPU (Central Processing Unit) and the like, and controls various operations of the adhesive tape peeling device 1 in an integrated manner. Examples of various operations include expansion and contraction operations of the cylinder 43, horizontal movement of the movable table 8, and operations of the wafer transfer device 4, which will be described later.

Examples of the input unit 50 include a console panel and a keyboard, and the operator can use the input unit 50 to input various instructions. Instructions input to the input unit 50 are transmitted to the control unit 40, and the control unit 40 can perform various integrated controls according to the instructions.

<Configuration of holding mechanism>
Here, the configuration of the holding mechanism 6 will be described in detail. In Example 1, ten holding members 9 are erected on the movable stage 8 of the holding mechanism 6 . As shown in FIGS. 2 and 4A, a wedge-shaped groove 41 is formed in the side surface of each holding member 9. As shown in FIG. The groove portion 41 is formed in the holding member 9 on the side closer to the central portion of the movable stage 8 , and each of the holding members 9 contacts the peripheral edge portion Wb of the wafer W in the groove portion 41 . As long as the wafer W can be stably held via the peripheral portion of the wafer W, the number and arrangement of the holding members 9 may be changed as appropriate. As a constituent material of the holding member 9, a material having a certain degree of hardness, such as metal or plastic, can be used.

As shown in FIG. 3 and the like, the holding member 9 is configured to be horizontally movable on the movable stage 8 along a locus from the outer peripheral portion of the movable stage 8 toward the central portion of the movable stage 8 . That is, each of the holding members 9 is configured to be able to reciprocate between the avoidance position indicated by the solid line in FIG. 3 and the holding position indicated by the dotted line in FIG. In other words, each of the holding members 9 horizontally moves along a radial trajectory centered on the central portion 8x of the movable stage 8 .

The holding position of the holding member 9 is determined so that the wafer W conveyed to the holding mechanism 6 and the holding member 9 come into contact with each other so that the holding member 9 can hold the wafer W. FIG. On the other hand, the avoidance position of the holding member 9 is a position away from the wafer W conveyed to the holding mechanism 6, and the contact between the adhesive tape T peeled from the wafer W and the holding member 9 as described later. Alternatively, it is determined to be a position where contact between the peeling mechanism 7 and the holding member 9 can be avoided.

A configuration in which each of the holding members 9 moves between the holding position and the avoidance position will be described. As shown in FIGS. 4( a ) and 4 ( b ), separate cylinders 43 are connected to each of the holding members 9 . As shown in FIG. 4(c), each cylinder 43 is arranged to expand and contract along a radial trajectory centered on the central portion 8x of the movable stage 8. As shown in FIG.

The extension and contraction of the cylinder 43 connected to the holding member 9 causes the holding member 9 to move horizontally along the rails 45 . By this horizontal movement, the holding member 9 is appropriately switched to the avoidance position as shown in FIG. 4(a) or the holding position as shown in FIG. 4(b). be done. The expansion/contraction operation of each cylinder 43 is appropriately controlled by the control unit 40 . For convenience of explanation, the description of the cylinder 43 and the rail 45 in the movable table 8 is omitted in the drawings other than the drawings of FIG. 4 and the drawings of FIG.

When the holding member 9 moves to the holding position while the wafer W is being transferred to the holding mechanism 6 , the peripheral edge portion Wb of the wafer W comes into contact with the groove portion 41 of the holding member 9 . By moving at least three holding members 9 to the holding positions, the peripheral edge portion Wb of the wafer W comes into contact with the groove portion 41 of the holding member 9, and the lower surface Wa of the wafer W does not come into physical contact with the wafer W. It is held stably on the movable stage 8 . As an example, FIG. 4(c) shows a state in which three of the ten holding members 9, indicated by halftone dots, are moving to the holding position. In this case, the wafer W transported to the position indicated by P2 is held in such a state that it is sandwiched between the three holding members 9 .

In the present invention, the peripheral portion Wb of the wafer W is defined as a portion including the upper end to the lower end of the side surface of the wafer W. As shown in FIG. In the first embodiment, as shown in FIG. 4B, the holding member 9 holds the wafer W from the sides by contacting the upper and lower ends of the side surfaces of the wafer W through the grooves 41 .

In the first embodiment, as a preferred configuration, the controller 40 moves the holding member 9 further to the center of the movable table 8 while the holding member 9 is moved to the holding position and is in contact with the peripheral edge of the wafer W. The operation of the cylinder 43 is controlled as follows. By this operation control, a force J3 is applied from the holding member 9 to the wafer W in the direction from the peripheral edge portion Wb of the wafer W toward the central portion Wx of the wafer W. As shown in FIG. By applying the force J3 toward the center of the wafer W from each of the holding members 9 moving to the holding position, it is possible to more reliably prevent the wafer W from separating from the holding member 9 and falling.

The magnitude of the force J3 changes according to the distance that the cylinder 43 expands and contracts. The controller 40 appropriately adjusts the magnitude of the force J3 according to various conditions such as the thickness, size, and material of the wafer W by controlling the expansion/contraction distance of the cylinder 43 . By appropriately adjusting the magnitude of the force J3, when the holding member 9 holds the wafer W, an excessive force J3 acts on the wafer W from the holding member 9, causing the wafer W to deform. can be prevented.

Next, a mechanism for performing control for switching the position of the holding member 9 will be described. In Example 1, ten holding members 9 are divided into two groups, and are configured to be controlled to switch from the holding position to the avoidance position for each group. That is, as shown in FIG. 5A, the holding members 9 are divided into four holding members 9p belonging to the first group and six holding members 9s belonging to the second group. In each figure after FIG. 5A, the holding member 9p is shaded and the holding member 9s is shaded to distinguish between them.

The expansion and contraction operations of the four cylinders 43 connected to each of the holding members 9p are synchronously controlled by the control section 40. As shown in FIG. The expansion and contraction operations of the six cylinders 43 connected to each of the holding members 9s are synchronously controlled by the control section 40. As shown in FIG. Control of the cylinder 43 connected to the holding member 9p and control of the cylinder 43 connected to the holding member 9s are performed independently by the control unit 40. FIG. By independently performing the synchronous control for the two groups, the arrangement of the holding members 9 on the movable stage 8 can be divided into four patterns.

In the first pattern, both the holding members 9p and 9s move to the avoidance position as shown in FIG. 5(a). In the second pattern, as shown in FIG. 5B, both the holding members 9p and 9s are moved to the holding position, and the wafer W is held by the holding members 9p and 9s.

In the third pattern, as shown in FIG. 5(c), each of the holding members 9p moves to the holding position, while each of the holding members 9s moves to the avoidance position. In the third pattern, the wafer W is held by the holding member 9p. In the fourth pattern, as shown in FIG. 5(d), each of the holding members 9s moves to the holding position, while each of the holding members 9p moves to the avoidance position. In the fourth pattern, the wafer W is held by the holding member 9s.

In Example 1, when the adhesive tape T is peeled off from the wafer W, the arrangement pattern of the holding member 9 is appropriately switched between the above four patterns. By appropriately switching the position of the holding member 9 between the avoidance position and the holding position, the wafer W is stably held by contacting the wafer W from the side thereof, and the adhesive tape T peeled from the wafer W and the holding member 9 are held. A situation where the member 9 interferes can be avoided.

<Overview of adhesive tape peeling process>
Here, a series of basic operations for the process of peeling off the adhesive tape T from the wafer W using the adhesive tape peeling device 1 will be described. At the start of the adhesive tape peeling process, the movable stage 8 of the holding mechanism 6 has moved to the initial position shown in FIG. is moving to position.

When a command to start the peeling operation is issued, first, the robot arm 4a of the transfer mechanism 4 is operated and moves toward the cassette C1 of the wafer supply section 2. As shown in FIG. Then, as shown in FIG. 6A, the wafer holder 4b provided at the tip of the robot arm 4a is inserted into the gap between the wafers W stored in the cassette C1. Gas is blown against the wafer W from each of the gas supply pads 4c provided on the lower surface of the wafer holding part 4b, and the wafer holding part 4b holds the wafer W in a non-contact manner by the Bernoulli effect.

Further, as shown in FIG. 6(b), the alignment pin 4d, which is placed at the initial position indicated by the dotted line, moves toward the central portion of the wafer holder 4b. The movement of the alignment pins 4d brings the side surface of the wafer W into contact with the alignment pins 4d. By this contact, the wafer W held by the wafer holder 4b in a non-contact manner is aligned. That is, the alignment pins 4d suppress the horizontal movement of the wafer W with respect to the holding surface of the wafer holding portion 4b.

After the wafer holder 4b holds the wafer W in a non-contact manner and the wafer W is aligned by the alignment pins 4d, the transport mechanism 4 transports the wafer W to the aligner 5 to align the wafer W. conduct. That is, as shown in FIG. 7A, the wafer holder 4b moves the wafer W above the stage 5a. At this time, gas is blown toward the lower surface of the wafer W from the gas supply pad 5b provided on the stage 5a, and the wafer W floats on the stage 5a due to the Bernoulli effect.

After that, the operation of the gas supply pad 4c is stopped, and the positioning pin 4d is moved from the central portion toward the outer peripheral portion of the wafer holding portion 4b to return to the initial position. Then, the wafer holder 4b is retracted from the aligner 5, and the wafer W is aligned by the alignment pins 5c. As shown in FIG. 7B, each positioning pin 5c moves in a direction from the outer periphery of the stage 5a toward the center 5x of the stage 5a.

Due to the movement of the alignment pins 5c, the side surfaces of the wafer W come into contact with the side surfaces of the alignment pins 5c, and the wafer W is displaced so as to be pushed toward the center 5x of the stage 5a. As a result, the position of the wafer W is aligned so that the center Wx of the wafer W and the center 5x of the stage 5a match in plan view. The position of the wafer W aligned by the aligner 5 is indicated by P1 in FIG.

After the wafer W is aligned, a step of holding the wafer W on the holding mechanism 6 is performed. The robot arm 4a moves to the aligner 5 again, and the wafer W is held by the wafer holder 4b in a non-contact manner. That is, the gas supply pad 4c is actuated to blow the gas against the wafer W to generate the Bernoulli effect, and the alignment pins 4d move from the initial position toward the center of the wafer holder 4b, thereby The wafer W is aligned by contacting the side surface of the . The wafer W is transferred from the aligner 5 to the holding mechanism 6 . That is, as shown in FIG. 8A, the wafer W is transferred above the movable stage 8 by the wafer holder 4b. The position to which the wafer W is transferred at this time is the position indicated by the symbol P2 in FIG.

Then, the robot arm 4a descends appropriately to match the height of the wafer W with the height of the groove 41 provided in the holding member 9. Then, as shown in FIG. At this time, the position of the holding member 9 is in the first pattern as shown in FIG. 5(a). That is, all of the holding members 9 have moved to the avoidance position.

After adjusting the height of the wafer W to the height of the groove 41, the controller 40 controls the expansion and contraction of each cylinder 43 to move each of the holding members 9 from the avoidance position to the holding position. Under the control of the controller 40, the positions of the holding members 9 are changed from the first pattern to the second pattern as shown in FIG. 5(b).

That is, as shown in FIG. 8B, each of the holding members 9 moves to the holding position, and each groove portion 41 comes into contact with the peripheral edge portion Wb of the wafer W so as to engage therewith. The wafer W is held by the holding member 9 by this contact.

At this time, since the peripheral edge portion Wb of the wafer is in physical contact, the wafer W is placed on the movable stage 8 without physical contact with the circuit surface Wa of the wafer W facing downward. can be kept stable. In Example 1, the area surrounded by the holding member 9 corresponds to the peeling position in the present invention.

In addition, in order to prevent the positional displacement of the wafer W in the horizontal direction in the wafer holding portion 4b, the peripheral portion Wb of the wafer W is in contact with the alignment pin 4d. However, the arrangement position of the positioning pin 4d and the holding position of the holding member 9 are adjusted in advance so that they are different positions on the circumference of the peripheral portion Wb. Therefore, since the holding member 9 moved to the holding position can be prevented from interfering with the alignment pin 4d, it is possible to avoid an error in the holding process of the wafer W by the holding member 9. FIG. For convenience of explanation, the alignment pin 4d is omitted in each figure of FIG.

In the first embodiment, in order to hold the wafer W more stably, the controller 40 controls the cylinder 43 to contract toward the center Wx of the wafer. By this control, as shown in FIG. 8(c), force J3 acts on wafer W from each of holding members 9 moving to the holding position.

Each of the forces J3 is a force in the direction from the peripheral edge portion Wb of the wafer W toward the center Wx. can be prevented from falling. Therefore, by applying the force J3 from the holding member 9, the wafer W can be held more stably even if there is no physical contact with the downward facing circuit surface Wa.

After the holding member 9 holds the peripheral portion Wb of the wafer W, the operation of the gas supply pad 4c in the wafer holding portion 4b is stopped to release the holding of the wafer W by the transfer mechanism 4, and the robot arm 4a is removed from the holding mechanism 6. evacuate.

After the robot arm 4a is retracted from the holding mechanism 6, the process of peeling off the adhesive tape T is started. First, the control unit 40 controls the rotation of the motor 13 to move the movable stage 8 from the initial position to the separation start position (see FIGS. 1 and 2).

After the movable stage 8 moves to the separation start position, the movable table 8 is moved from the separation start position to the initial position. While moving the movable table 8 to the initial position, a step of attaching the peeling tape Ts to the surface of the adhesive tape T by the peeling unit 20, and a step of peeling the adhesive tape T from the wafer W together with the peeling tape Ts. is done.

Here, the peeling tape Ts is attached to the right end portion of the adhesive tape T in the figure. Therefore, when all of the holding members 9 are moved to the holding position, the holding member 9s surrounded by the dotted line M1 in FIG.

Therefore, before performing the operation of attaching the peeling tape Ts to the adhesive tape T, the holding member 9s of the holding members 9 is moved to the avoidance position. That is, the control unit 40 controls the six cylinders 43 connected to the holding member 9s among the holding members 9, and switches the position of the holding member 9s from the holding position to the avoiding position.

By switching the position of the holding member 9s, the position pattern of the holding member 9 changes from the second pattern shown in FIG. 5(b) to the third pattern shown in FIG. 5(c). In this case, the wafer W is stably held by four holding members 9p. Since the holding member 9s surrounded by the dotted line M1 is separated from the wafer W and moved to the avoidance position, it is possible to avoid the situation where the peeling unit 20 and the holding member 9s interfere with each other and cause an error in the peeling process.

After the holding member 9 s is retracted to the avoidance position, the peeling tape Ts is fed out from the tape supply section 17 , and the peeling tape Ts is attached to the adhesive tape T using the peeling unit 20 . That is, as shown in FIG. 9B, the motor 26 is operated by the controller 40 to lower the peeling unit 20 to a predetermined height. For convenience of explanation, the illustration of the holding member 9p holding the wafer W is omitted in FIG. 9(b).

Then, the peeling tape Ts wound around the peeling member 29 is pressed and attached to the right end of the adhesive tape T on the wafer W. As shown in FIG. A downward force J1 acts on the wafer W by pressing when the peeling tape Ts is attached.

Therefore, in order to prevent the wafer W from being deformed by the force J1, the adhesive tape T and the wafer W are adsorbed by the adsorption member 37 synchronously with the operation of attaching the peeling tape Ts to the adhesive tape T. FIG. That is, as shown in FIG. 9B, the adsorption member 37 descends to a predetermined height independently of the descent of the peeling member 29 .

Then, a vacuum device (not shown) is operated, and the adsorption member 37 adsorbs the adhesive tape T and the wafer W at the predetermined height. An upward force J2 acts on the wafer W due to the suction. The influence of the downward force J1 on the wafer W is reduced by the upward force J2. Therefore, by performing the adsorption by the adsorption member 37, it is possible to avoid the situation in which the wafer is deformed by the force J1. At this time, the positional relationship of the adsorption member 37, the peeling member 29, the peeling tape Ts, etc. in plan view is as shown in FIG. 9(c).

In synchronism with the completion of the operation of attaching the peeling tape Ts to the adhesive tape T, the adsorption by the adsorption member 37 is released. Then, the movable table 8 moves further to the right in the drawing toward the initial position. At this time, the peeling tape Ts is folded back by the peeling member 29, and the adhesive tape T is peeled off from the back surface of the wafer W integrally with the peeling tape Ts (FIG. 10(a)). The peeling tape Ts to which the adhesive tape T peeled from the wafer W is attached is wound up and collected by the tape collecting section 19 . In addition, in FIG. 10A, the illustration of the holding member 9 holding the wafer W is omitted for convenience of explanation.

By peeling the adhesive tape T from the back surface of the wafer W facing upward, an upward force J4 acts on the wafer W when the adhesive tape T is peeled off. Therefore, in order to prevent deformation of the wafer W due to the force J4, the gas is supplied by the gas supply pad 10 synchronously with the operation of peeling off the adhesive tape T. FIG. That is, as shown in FIG. 10A, gas is blown toward the lower surface of the wafer W from the gas supply pad 10 provided on the surface of the movable stage 8 .

A negative pressure region is generated between the movable stage 8 and the lower surface of the wafer W by blowing the gas, and a downward force J5 is generated on the wafer W due to the Bernoulli effect. The influence of the upward force J4 on the wafer W is reduced by the downward force J5. Therefore, by blowing the gas using the gas supply pad 10, the deformation of the wafer due to the force J4 can be avoided.

As the adhesive tape T is separated from the wafer W, the boundary line N between the adhesive tape T attached to the wafer W and the adhesive tape T separated from the wafer W moves from the right end of the wafer W to the left. (Fig. 10(b)). By separating the boundary line N from the right end of the wafer W, it is possible to avoid interference with the peeling unit 20 and the adhesive tape T even when the holding member 9s surrounded by the symbol M1 moves to the holding position.

Therefore, when the boundary line N is positioned from the right end of the wafer W to the symbol F1, the controller 40 controls the cylinders 43 connected to the holding members 9s to move each of the holding members 9s to the holding position. Let By this control, the position pattern of the holding member 9 is changed from the third pattern to the second pattern, and the wafer W is held by the holding members 9p and 9s (FIG. 10(b)).

The peeling unit 20 further peels off the adhesive tape T from the wafer W, and the boundary line N approaches the position indicated by reference numeral F1 in FIG. 9(a). At this time, if the holding member 9p surrounded by the dotted line M2 is arranged at the holding position, a peeling error occurs due to the adhesive tape T peeled from the wafer W coming into contact with the holding member 9p. The situation is of concern.

Therefore, when the boundary line N approaches the position of reference numeral F1, the control unit 40 controls the expansion and contraction of the cylinders 43 connected to the holding members 9p to move each of the holding members 9p from the holding position to the avoidance position. Let By this control, the position pattern of the holding member 9 is changed from the second pattern to the fourth pattern as shown in FIG. 5(d). By switching the position of the holding member 9p to the avoidance position, it is possible to reliably avoid the occurrence of a peeling error of the adhesive tape T even when the boundary line N passes the position F1 (FIG. 11(a)). At this time, the wafer W is held by the holding member 9s.

As the movable table 8 is further moved toward the initial position and the adhesive tape T is peeled off, the boundary line N moves further to the left. When the boundary line N passes through the position F1, the controller 40 controls the cylinder 43 to move each of the holding members 9p from the avoidance position to the holding position. As a result, the position pattern of the holding member 9 is changed to the first pattern, and the wafer W is held by the holding members 9p and 9s (FIG. 11(b)).

Further, the peeling process of the adhesive tape T progresses, and the boundary line N approaches the position F2. At this time, if the two holding members 9s surrounded by the dotted line M3 are moved to the holding position, the holding members 9s hinder the peeling operation of the adhesive tape T. FIG. Then, when the boundary line N approaches the position F2, the control unit 40 controls the cylinder 43 to move each of the holding members 9s to the avoidance position, and the adhesive tape T peeled off from the wafer W interferes with the holding member 9s. avoid the situation. At this time, the position pattern of the holding member 9 is the third pattern, and the wafer W is stably held by the peripheral edge of the wafer W coming into contact with the grooves 41 of the four holding members 9p (Fig. 11(c)).

The movable table 8 is further moved toward the initial position to advance the peeling process. When the boundary line N advances leftward and passes the position F2, the holding member 9s is again moved from the avoidance position to the holding position. That is, the position pattern of the holding member 9 is changed from the third pattern to the first pattern, and the peripheral edge portion Wb of the wafer W comes into contact with each of the groove portions 41 of the holding member 9p and the groove portion 41 of the holding member 9s. , hold the wafer W in a non-contact state with the circuit surface Wa (FIG. 11(d)).

Further, as the peeling process of the adhesive tape T progresses, the boundary line N approaches the position F3 from the position F2. At this time, if the two holding members 9p surrounded by the dotted line M4 are moved to the holding position, the holding members 9p interfere with the operation of peeling the adhesive tape T off. Therefore, the control unit 40 controls the cylinder 43 to switch the position of the holding member 9p from the holding position to the avoidance position, thereby changing the position pattern of the holding member 9 to the fourth pattern (FIG. 12(a)). When the boundary line N passes through the position F3, the controller 40 moves the holding member 9p to the holding position and changes the positional pattern of the holding member 9 to the first pattern.

When the boundary line N approaches the left end of the wafer W, the two holding members 9s surrounded by the dotted line M5 interfere with the peeling operation of the adhesive tape T. As shown in FIG. Therefore, the control unit 40 switches the position of the holding member 9s from the holding position to the avoidance position, and changes the position pattern of the holding member 9 to the third pattern (FIG. 12(b)). By further advancing the peeling process, the adhesive tape T is completely peeled off from the back surface of the wafer W facing upward (FIG. 12(c)). The movable table 8 then returns to its initial position. When the adhesive tape T is completely peeled off from the wafer W, the operation of the gas supply pad 10 is stopped.

When the peeling of the adhesive tape T is completed and the movable table 8 returns to the initial position, the robot arm 4 a of the transport mechanism 4 is moved to the holding mechanism 6 . Then, the wafer W from which the adhesive tape T has been peeled off is held in a non-contact manner by the wafer holding part 4b, which is a Bernoulli chuck. After that, the transport mechanism 4 transports the wafer W from the holding mechanism 6 to the wafer recovering section 3, and inserts the wafer W into the cassette C2 for storage.

A round of operations using the adhesive tape peeling apparatus 1 according to the first embodiment is completed as described above, and the same operations are repeated until the predetermined number of sheets is reached.

In the adhesive tape peeling apparatus 1 according to the first embodiment, the wafer W is held by the holding member coming into contact with the periphery of the wafer W conveyed to the peeling mechanism in a non-contact manner. Then, in a state where the holding member holds the peripheral portion of the wafer W, the peeling tape Ts is attached to the adhesive tape T attached to the upper surface of the wafer, and the adhesive tape T is attached to the wafer W by being integrated with the peeling tape Ts. peel from.

At this time, the peripheral portion of the wafer W, that is, the range from the upper end to the lower end of the side surface is physically contacted by the holding member. In other words, the wafer W is stably held without the lower surface of the wafer W being physically contacted. Therefore, even if it is inappropriate for a member such as a holding table to come into physical contact with the lower surface of the wafer W, such as when the lower surface of the wafer W is a circuit surface, the wafer W may be damaged. The wafer W can be stably held without Therefore, the adhesive tape T can be peeled off from the upper surface of the wafer W with high accuracy.

In the conventional apparatus, since it is necessary for the holding table to support at least part of the lower surface of the wafer, there has been a problem that the holding table contacts an unintended portion of the lower surface of the wafer due to positional deviation of the wafer. On the other hand, in the configuration according to the first embodiment, a member, such as a holding table, which contacts the lower surface of the wafer is omitted. Therefore, even if the position of the wafer is displaced when the wafer is transported to the peeling device, it is possible to reliably prevent the lower surface of the wafer from coming into physical contact.

Further, in the first embodiment, the holding members 9 are divided into two groups of the holding members 9p and the holding members 9s, and each group is appropriately displaced between the avoidance position and the holding position. That is, the position of each of the holding members 9p belonging to the first group is synchronously switched between the avoidance position and the holding position by the control section 40. FIG.

Independently of the position control of the holding members 9p, the position control of the holding members 9s belonging to the second group is collectively performed. That is, independently of the synchronous control of the holding members 9p, the position of each of the holding members 9s is synchronously switched between the avoidance position and the holding position. In this case, even if a large number of holding members 9 are provided, the position control of the holding members 9 can be limited to two lines, so the computation of the position control by the control section 40 can be simplified.

Next, Example 2 of the present invention will be described. The same reference numerals are given to the same components as those of the adhesive tape applying apparatus according to the first embodiment, and the method of controlling the holding member 9, which is a different component, will be described in detail.

In the first embodiment, the plurality of holding members 9 are divided into two groups, that is, the holding members 9p and the holding members 9s. Position control is collectively performed independently of 9p. On the other hand, in Example 2, each holding member 9 is configured to be position-controlled independently.

Here, a control method for switching the position of the holding member 9 when peeling the adhesive tape T from the wafer W in the adhesive tape peeling process according to the second embodiment will be described. In Example 2, the number of holding members 9 is 10 as in Example 1, and the respective holding members 9 are identified by reference numerals 9a to 9j as shown in FIG. 13(a) and the like.

After the wafer W is aligned by the aligner 5 and transferred to the holding mechanism 6, the controller 40 moves each of the holding members 9a to 9j from the avoidance position to the holding position. By moving to the holding position, the wafer peripheral edge portion Wb comes into contact with the grooves 41 provided in each of the holding members 9a to 9j, and the wafer W is held from the side. That is, the wafer W can be stably held on the movable stage 8 while avoiding physical contact with the lower surface of the wafer W as in the first embodiment.

After the wafer W is held by each of the holding members 9, the movable stage 8 is moved from the initial position to the separation start position. Then, the operation of peeling off the adhesive tape T from the wafer W is performed while moving the movable stage 8 from the peeling start position to the initial position.

First, as in the first embodiment, when the movable stage 8 moves to a position where the right end portion of the wafer W is below the peeling member 29, the peeling unit 20 is lowered so that the peeling tape Ts presses the right end of the adhesive tape T. can be pasted. At this time, if the holding members 9c and 9d are arranged at the holding position, the holding members 9c and 9d interfere with the peeling unit 20, thereby hindering the operation of attaching the peeling tape Ts.

Therefore, the control unit 40 controls the cylinder 43 to switch the positions of the holding members 9c and 9d from the holding position to the avoidance position to avoid interference with the peeling unit 20 (FIG. 13(a)). After the holding members 9c and 9d are moved to the avoidance position, the peeling tape Ts is attached to the right end portion of the adhesive tape T, and the adhesive tape T is peeled off together with the peeling tape Ts from the right end portion. At this time, since the holding members 9c and 9d are moved to the avoidance position, it is possible to prevent the peeling error caused by contact between the peeling adhesive tape T and the holding members 9c and 9d.

The adhesive tape T is peeled off from the wafer W together with the peeling tape Ts by folding back the peeling tape Ts with the peeling member 29 while moving the movable table 8 further toward the initial position. As the peeling of the adhesive tape T progresses, the boundary line N between the peeled adhesive tape T and the adhesive tape T before peeling moves from the right end portion of the wafer W to the left.

When boundary line N moves away from the right end of wafer W and approaches position F1, controller 40 moves holding members 9b and 9e from the holding position to the avoiding position while moving holding members 9c and 9d from the avoiding position to the holding position. and move (FIG. 13(b)). By retracting the holding members 9b and 9e to the avoidance position, it is possible to prevent the peeling error of the adhesive tape T from occurring due to the contact between the adhesive tape T and the holding member 9 at the position F1.

As the peeling process progresses and the boundary line N approaches from the position F1 to the position F2, the controller 40 moves the holding members 9b and 9e from the avoidance position to the holding position, while moving the holding members 9a and 9f from the holding position. Move to the avoidance position (Fig. 13(c)). Further, when the boundary line N moves away from the position F2 and approaches the position F3, the control unit 40 moves the holding members 9g and 9j from the holding position to the avoidance position while moving the holding members 9a and 9f from the avoidance position to the holding position. (Fig. 13(d)).

Finally, when boundary line N moves away from position F3 and approaches the left end portion of wafer W, controller 40 moves holding members 9h and 9i to the holding position while moving holding members 9g and 9j from the avoidance position to the holding position. to the avoidance position. Then, the adhesive tape T is completely removed from the upper surface of the wafer W while the holding members 9h and 9i are moved from the holding position to the avoiding position (see FIG. 12(c)). A series of operations for peeling off the adhesive tape T in Example 2 is common to Example 1 except for the control method for switching the position of each holding member 9 between the holding position and the avoiding position.

In the configuration according to the second embodiment, each of the holding members 9 is configured to be independently switchable between the holding position and the avoidance position. Then, the holding member 9 near the position of the boundary line N, that is, the position where the operation of peeling the adhesive tape T from the wafer W is executed is selectively displaced to the avoidance position, and the holding position is separated from the boundary line N. The holding member 9 is moved to the holding position.

In this case, by moving the holding member 9 whose holding position is close to the boundary line N to the avoidance position, the occurrence of a peeling error due to the contact between the adhesive tape T peeled from the wafer W and the holding member 9 can be prevented. You can definitely avoid it. All of the holding members 9 separated from the boundary line N and the holding position move to the holding position to hold the peripheral portion Wb of the wafer W. FIG. Therefore, since more holding members 9 are in contact with the peripheral edge portion Wb of the wafer W, the wafer W can be held more stably.

The present invention is not limited to the above embodiments, and can be modified as follows.

(1) In each embodiment, the holding member 9 is not limited to the configuration including the groove portion 41 . That is, the shape of the holding member 9 may be appropriately changed as long as the wafer W can be stably held by contacting the peripheral edge portion Wb of the wafer. As an example, as shown in FIG. 14(a), the holding member 9 may be rod-shaped with a uniform thickness.

In this case, as the holding member 9 moves from the avoidance position to the holding position, the flat side surface of the holding member 9 comes into contact with the wafer peripheral edge Wb and presses it toward the center as shown in FIG. 14(b). be done. Since the force J3 directed toward the central portion Wx of the wafer acts on the wafer W, the wafer W is stably held without contact with the lower surface Wa.

Further, as shown in FIG. 14(c), the holding member 9 may have a concave portion 42 having a shape corresponding to the peripheral edge portion Wb of the wafer W instead of the groove portion 41. As shown in FIG. The peripheral edge portion Wb of the wafer W abuts against the concave portion 42 of the holding member 9 at at least three locations, so that the wafer W is held so as to be sandwiched from the sides. When the holding member 9 holds the wafer W, the peripheral edge Wb of the wafer W is fitted in the recess 42 of the holding member 9 as shown in FIG. 14(d).

Therefore, as in the case where the holding member 9 has the groove portion 41, even if a vertical force is applied to the wafer W, the peripheral edge portion Wb of the wafer W is separated from the concave portion 42 and the wafer W falls. can be prevented. Therefore, the force for holding the wafer W by the holding member 9 can be further improved.

(2) In each of the embodiments and modifications, the holding member 9 may be provided with an elastic body. That is, as shown in FIG. 15(a), the holding member 9 has an elastic body 47 at least at a portion that contacts the peripheral edge portion Wb of the wafer W. As shown in FIG. An example of a material forming the elastic body 47 is an elastomer such as rubber. In addition, in the said modification, the whole holding member 9 may be comprised by the elastic body.

When the holding member 9 according to the modified example (2) holds the wafer W, the expansion and contraction of the cylinder 43 is controlled in the same manner as in each embodiment, and the holding member 9 is moved along the rails 45 from the avoidance position to the holding position. move. When the position of the holding member 9 is the avoidance position, the holding member 9 is separated from the peripheral edge Wb of the wafer (FIG. 15(b)). Further, in the second embodiment, the holding position of the holding member 9 may be set to the position D1 where the holding member 9 is in contact with the wafer W. FIG. However, it is more preferable to set the position D2, which is slightly inside the position D1, as the holding position.

When the holding member 9 moves from the avoidance position D0 toward the holding position D2, the elastic body 47 provided on the holding member 9 contacts the peripheral edge Wb of the wafer (FIG. 15(c)), and furthermore, the peripheral edge of the wafer The elastic body 47 is elastically deformed according to the shape of Wb (FIG. 15(d)).

As the elastic body 47 contacts the peripheral edge portion Wb of the wafer while elastically deforming, the holding member 9 contacts the wafer W over the entire peripheral edge portion Wb regardless of the shape of the peripheral edge portion Wb of the wafer. That is, since the contact area between the peripheral edge portion Wb of the wafer W and the holding member 9 becomes wider, the wafer W can be held more stably while avoiding physical contact with the lower surface Wa of the wafer.

Further, when the holding member 9 moving to the holding position D2 is pressed against the wafer W and the elastic body 47 is elastically deformed, the holding member 9 moves toward the wafer W from the peripheral portion Wb toward the central portion Wx. A force J3 acts. The action of the force J3 can more reliably prevent the wafer W from separating from the holding member 9 and falling. Therefore, by setting the holding position to the position D2, the wafer W can be held more stably than when the holding position is set to the position D1.

(3) In each of the examples and modifications, the force J1 acting on the wafer W when the peeling tape Ts is attached, and the force acting on the wafer W when the adhesive tape T is peeled from the wafer W together with the peeling tape Ts. As a configuration for reducing the influence of J4, the adsorption member 37 and the gas supply pad 10 are provided, but the configuration is not limited to this. That is, the adsorption member 37 and the gas supply pad 10 may be omitted, or alternative structures for the adsorption member 37 and the gas supply pad 10 may be provided as long as the effects of the forces J1 and J4 are reduced.

As an example of a configuration alternative to the adsorption member 37 and the gas supply pad 10, the holding mechanism 6 according to Modification (3) has a gas flow path 49 as shown in FIG. 16(a). The gas flow path 49 is embedded in the movable stage 8 and collected under the movable stage 8 . The gas flow path 49 is communicated with a gas supply device 53 via an electromagnetic valve 51 . Also, the gas flow path 49 is communicated with a suction device 57 via an electromagnetic valve 55 . With such a configuration, the gas flow path 49 supplies or sucks gas through a plurality of holes provided on the surface of the movable stage 8 .

In the configuration according to the modification (3), when the peeling tape Ts is applied, the control unit 40 operates the gas supply device 53 and opens the electromagnetic valve 51 to supply the gas V to the wafer W through the gas flow path 49. spray it on the underside of the As the gas V is blown onto the lower surface Wa of the wafer W, the wafer W is pushed up by the gas V, so an upward force J6 is generated on the wafer W. FIG. As a result, the upward force J6 reduces the influence of the downward force J1 acting on the wafer W when the peeling tape Ts is attached.

On the other hand, when peeling the adhesive tape T together with the peeling tape Ts from the wafer W, as shown in FIG. The lower surface of the wafer W is sucked through. By sucking the wafer W from below, the wafer W is pulled downward where the hole 52 is provided, so that a downward force J7 acts on the wafer W. As shown in FIG. As a result, the influence of the upward force J4 acting on the wafer W when the adhesive tape T is peeled off from the wafer W is reduced by the downward force J7. In this manner, even with the configuration in which the gas is supplied and sucked through the gas flow path 51, deformation of the wafer W caused by the force J1 or the force J4 can be avoided.

(4) In each of the embodiments and modifications, the configuration is such that the adhesive tape T is peeled off while the back surface to which the adhesive tape T is attached faces upward and the circuit surface facing downward is in a non-contact state. Although exemplified, it is not limited to this. The present invention can be appropriately applied to a configuration for peeling off the adhesive tape T attached to the other surface of the wafer W while reliably avoiding physical contact with one surface of the wafer W. FIG.

An example of a configuration in which it is required to peel off the adhesive tape from the other surface while keeping one surface non-contact is as follows. After the circuit pattern is formed on the front surface of the wafer W, an adhesive tape for circuit protection is attached to the front surface, and the rear surface of the wafer W is subjected to a back grinding process to make it thinner. After thinning the wafer W, the back surface of the wafer W may be subjected to various treatments such as coating while peeling off the protective adhesive tape from the front surface.

In this case, if the holding table or the like is in contact with the back surface of the wafer when the adhesive tape is peeled off from the front surface of the wafer, the dust and polishing debris on the holding table may cause problems in subsequent coating processes. It is feared that it will occur. Therefore, by applying the configuration of the present invention, the holding member 9 is brought into contact with the peripheral edge portion Wb of the wafer W with the rear surface of the wafer W facing downward, and the holding member 9 is used to protect the upper surface of the wafer W, which is facing upward. of adhesive tape can be peeled off. As a result, the wafer W can be stably held without physical contact with the back surface of the wafer W, so that the adhesive tape can be peeled off from the front surface of the wafer W with high precision, and problems can be prevented in subsequent back surface processing. .

(5) In each of the embodiments and modified examples, the wafer W is used as a work and the adhesive tape T attached to the work is peeled off, but the work is not limited to the wafer W. Examples of structures used as workpieces include wafers W made of various materials such as gallium and arsenic compounds or silicon, as well as various articles such as ring frames, glass substrates, ceramic substrates, and organic material substrates such as FPC. .

(6) In each of the embodiments and modifications, the position of the peeling mechanism 7 is fixed, and the holding mechanism 6 horizontally moves in the x direction to peel off the adhesive tape T from the wafer W. The configuration is not limited to moving the holding mechanism 6 . As long as the holding mechanism 6 is moved relative to the peeling mechanism 7, the holding mechanism 6 may be fixed and the peeling mechanism 7 may move horizontally, or both may move. good.

(7) In each of the embodiments and modified examples, the wafer holder 4b has a configuration using a Bernoulli chuck, but it is not limited to this. In particular, when the wafer W to which the adhesive tape T is attached is transported to the holding mechanism 6, the wafer holding part 4b may transport the wafer W while holding the surface of the adhesive tape T by suction.

DESCRIPTION OF SYMBOLS 1... Adhesive tape peeling apparatus 2... Wafer supply part 3... Wafer recovery part 4... Transport mechanism 5... Aligner 6... Holding mechanism 7... Peeling mechanism 8... Movable stage 9... Holding member 10... Gas supply pad 17... Tape supply part 19 ... tape collecting unit 20 ... peeling unit 29 ... peeling member 31 ... guide roller 40 ... control section 41 ... groove 43 ... cylinder 45 ... rail T ... adhesive tape W ... semiconductor wafer Wa ... lower surface of wafer Wb ... peripheral edge of wafer

Claims (18)

An adhesive tape peeling method for peeling an adhesive tape attached to a work,
a transporting process of transporting the work to a peeling position;
a holding step of holding the work at the peeling position by bringing a holding member into contact with the peripheral edge portion of the work transported to the peeling position;
A peeling process of peeling the adhesive tape integrally with the peeling tape from the workpiece held at the peeling position by peeling the peeling tape while affixing the peeling tape to the adhesive tape by a peeling member and folding the peeling tape. When,
with
The peeling process is
By adsorbing the adhesive tape with an adsorption member when the release tape is attached to the adhesive tape, deformation of the workpiece due to the force generated when the release tape is attached is prevented.
An adhesive tape peeling method characterized by: An adhesive tape peeling method for peeling an adhesive tape attached to a work,
a transporting process of transporting the work to a peeling position;
a holding step of holding the work at the peeling position by bringing a holding member into contact with the peripheral edge portion of the work transported to the peeling position;
A peeling process of peeling the adhesive tape integrally with the peeling tape from the workpiece held at the peeling position by peeling the peeling tape while affixing the peeling tape to the adhesive tape by a peeling member and folding the peeling tape. When,
with
The peeling process is
When the release tape is attached to the adhesive tape, a first gas supply mechanism blows gas onto the work to prevent deformation of the work caused by a force generated when the release tape is attached.
An adhesive tape peeling method characterized by: The adhesive tape peeling method according to claim 2,
The peeling process is
By adsorbing the adhesive tape with an adsorption member when the release tape is attached to the adhesive tape, deformation of the workpiece due to the force generated when the release tape is attached is prevented.
An adhesive tape peeling method characterized by: The adhesive tape peeling method according to any one of claims 1 to 3 ,
The holding step includes:
The adhesive tape is characterized in that each of the holding members in contact with the peripheral edge of the work applies a force to the work from the peripheral edge toward the center of the work, thereby holding the work. Exfoliation method. The adhesive tape peeling method according to claim 4 ,
The holding step includes:
The work is held at the peeling position while each of the holding members controls the magnitude of the force acting from the peripheral portion of the work toward the central portion of the work so as to be an appropriate magnitude. Tape stripping method. The adhesive tape peeling method according to any one of claims 1 to 5 ,
The holding member has an elastic body,
The holding step includes:
A pressure-sensitive adhesive tape peeling method, wherein the elastic body holds the work by elastically deforming in contact with the peripheral edge of the work. The adhesive tape peeling method according to any one of claims 1 to 6 ,
The holding member is
A holding position that contacts the peripheral edge of the work and an avoidance position that can avoid contact with the adhesive tape peeled off from the work can be moved as appropriate,
The peeling process is
An adhesive tape peeling method, wherein the adhesive tape is peeled off from the work while the positions of the plurality of holding members are appropriately switched between the holding position and the avoiding position. The adhesive tape peeling method according to any one of claims 1 to 7,
The peeling process is
When the adhesive tape is peeled from the work, a suction mechanism sucks the work in a non-contact state to prevent deformation of the work caused by a force generated when the adhesive tape is peeled off. Adhesive tape peeling method. The adhesive tape peeling method according to any one of claims 1 to 8,
The peeling process is
A second gas supply mechanism blows gas onto the work when the adhesive tape is peeled off from the work, thereby preventing deformation of the work caused by a force generated when the adhesive tape is peeled off. Adhesive tape peeling method. An adhesive tape peeling device for peeling an adhesive tape attached to a work,
a transport mechanism for transporting the work to a peeling position;
a holding member that holds the work at the peeling position by contacting the peripheral edge portion of the work conveyed to the peeling position;
A peeling mechanism that peels the adhesive tape integrally with the peeling tape from the workpiece held at the peeling position by peeling the peeling tape while affixing the peeling tape to the adhesive tape by a peeling member and folding the peeling tape. When,
an adsorption member that adsorbs the adhesive tape when the peeling tape is attached to the adhesive tape and prevents deformation of the workpiece due to a force generated when the peeling mechanism attaches the peeling tape;
An adhesive tape peeling device comprising: An adhesive tape peeling device for peeling an adhesive tape attached to a work,
a transport mechanism for transporting the work to a peeling position;
a holding member that holds the work at the peeling position by contacting the peripheral edge portion of the work conveyed to the peeling position;
A peeling mechanism that peels the adhesive tape integrally with the peeling tape from the workpiece held at the peeling position by peeling the peeling tape while affixing the peeling tape to the adhesive tape by a peeling member and folding the peeling tape. When,
a first gas supply mechanism for blowing gas onto the workpiece when the peeling tape is attached to the adhesive tape to prevent deformation of the workpiece due to force generated when the peeling mechanism attaches the peeling tape; ,
An adhesive tape peeling device comprising: The adhesive tape peeling device according to claim 11,
An adsorption member that adsorbs the adhesive tape when the peeling tape is attached to the adhesive tape and prevents deformation of the workpiece due to a force generated when the peeling mechanism attaches the peeling tape.
An adhesive tape peeling device characterized by: The adhesive tape peeling device according to any one of claims 10 to 12 ,
A pressurizing mechanism for holding the work by applying a force from each of the holding members that are in contact with the peripheral edge of the work to the work from the peripheral edge toward the center of the work. Adhesive tape peeling device. The adhesive tape peeling device according to claim 13 ,
An adhesive tape peeling device, comprising: a control mechanism for controlling the magnitude of force applied to each of the holding members from the peripheral portion toward the central portion of the work to an appropriate magnitude. The adhesive tape peeling device according to any one of claims 10 to 14 ,
The holding member has an elastic body,
An adhesive tape peeling device, wherein the elastic body holds the work by contacting the periphery of the work and being elastically deformed. The adhesive tape peeling device according to any one of claims 10 to 15 ,
A driving mechanism for appropriately moving the holding member between a holding position in contact with the peripheral edge of the work and an avoidance position in which contact with the adhesive tape peeled off from the work can be avoided,
The adhesive tape peeling device, wherein the peeling mechanism peels the adhesive tape from the workpiece while the driving mechanism switches the positions of the plurality of holding members between the holding position and the avoiding position as appropriate. The adhesive tape peeling device according to any one of claims 10 to 16,
a suction mechanism that sucks the work in a non-contact state when the adhesive tape is peeled from the work, and prevents deformation of the work caused by a force generated when the peeling mechanism peels the adhesive tape; An adhesive tape peeling device, comprising: The adhesive tape peeling device according to any one of claims 10 to 17,
a second gas supply mechanism for blowing gas onto the work when the adhesive tape is peeled off from the work to prevent deformation of the work caused by a force generated when the peeling mechanism peels the adhesive tape; An adhesive tape peeling device characterized by:

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