JP2019212671A - Adhesive tape peeling method and adhesive tape peeling device - Google Patents

Abstract

To provide an adhesive tape peeling method and an adhesive tape peeling device capable of peeling an adhesive tape, stuck to the other surface of a wafer, suitably while preventing physical contact with one surface of the wafer reliably.SOLUTION: After a wafer W is transported above a movable stage 8, multiple holding members 9 provided in the movable stage 8 are brought into contact with a circumferential part Wb of the wafer W from the outside, and an adhesive tape T is peeled from a surface directing upward, while maintaining the contact state. The circumferential part Wb of the wafer W is held to be sandwiched from multiple directions, by contact of the holding members 9. Furthermore, since the holding members 9 are brought into contact from the side, an underside Wa of the wafer W is in a state not in contact with a member on the surface of the movable stage 8. Consequently, the wafer W is held stably while preventing physical contact with the underside Wa of the wafer W, and the adhesive tape T can be peeled from the top face of the wafer W accurately.SELECTED DRAWING: Figure 8

Description

  The present invention relates to a pressure-sensitive adhesive tape peeling method and a pressure-sensitive adhesive tape peeling apparatus for peeling a pressure-sensitive adhesive tape, which is affixed to a semiconductor wafer (hereinafter referred to as “wafer” as appropriate), for example, a protective tape for circuit protection.

  After the circuit pattern is formed on the front surface of the wafer, an adhesive tape (protective tape) for circuit protection is attached to the circuit surface, and the back surface of the wafer is ground by a back grinding process. When the back grinding process is completed, the protective tape is peeled off from the wafer, and the wafer is further divided into a large number of chip parts by a dicing process. In this case, in order to prevent the chip components from being scattered in the dicing process, a supporting adhesive tape (support tape) is attached to the ring frame and the back surface of the wafer and integrated before the dicing process.

  As a conventional method for peeling an adhesive tape such as a protective tape or a support tape from a wafer, the following method is carried out as an example. That is, the wafer is sucked and held on the holding table with the surface to which the adhesive tape is attached facing upward. Next, a peeling adhesive tape (peeling tape) is stuck on the adhesive tape while rolling the sticking roller. Thereafter, the peeling tape is reversed and peeled off with a tapered plate-like edge member, whereby the pressure-sensitive adhesive tape bonded to the peeling tape is integrally peeled off from the upper surface of the wafer (for example, see Patent Document 1).

  In this method, the entire lower surface of the wafer is brought into contact with and held by the holding table. On the other hand, when the adhesive tape attached to the non-circuit surface of the wafer is peeled with the circuit surface of the wafer facing down, the adhesive tape is facing downward when peeling the adhesive tape from the upper surface of the wafer. It is preferable to avoid a situation where the holding table or the like physically contacts the circuit surface of the wafer.

  Examples of a method for holding the wafer while avoiding physical contact with the circuit surface of the wafer include the following methods. That is, the holding table is provided with a wafer holding portion formed of an annular convex portion, and sucks the wafer holding portion against the outer peripheral portion of the lower surface of the wafer. Generally, since no circuit is formed on the outer peripheral portion of the wafer, the wafer can be stably held while suppressing the influence on the circuit by sucking and holding the outer peripheral portion of the lower surface of the wafer via the wafer holding portion (for example, (See Patent Document 2).

JP 2002-124494 A JP 2016-46437 A

  However, the conventional apparatus has the following problems.

  That is, when the wafer is placed on the holding table having the annular convex portion in the conventional configuration, the position may deviate from a predetermined position. In this case, there is a concern that the portion of the lower surface of the wafer where the circuit is formed physically contacts the annular convex portion of the holding table unexpectedly and the circuit is damaged. As described above, in the conventional configuration, when the adhesive tape is peeled from the upper surface of the wafer, it is difficult to reliably avoid physical contact with the lower surface of the wafer.

  The present invention has been made in view of such circumstances, and suitably peels off the adhesive tape attached to the other surface of the wafer while reliably avoiding physical contact with the one surface of the wafer. The main object is to provide a pressure-sensitive adhesive tape peeling method and pressure-sensitive adhesive tape peeling device.

In order to achieve such an object, the present invention has the following configuration.
That is, an adhesive tape peeling method for peeling the adhesive tape attached to the workpiece,
A transporting process for transporting the workpiece to a peeling position;
A holding process of holding the workpiece at the peeling position by the holding member coming into contact with the peripheral edge of the workpiece conveyed to the peeling position;
A peeling process in which the pressure-sensitive adhesive tape is peeled off integrally with the peeling tape from the workpiece held at the peeling position by peeling off the peeling tape while being attached to the pressure-sensitive adhesive tape by a peeling member and turning back. When,
It is characterized by providing.

  (Operation / Effect) According to this configuration, after the work is conveyed to the peeling position, the holding member comes into contact with the peripheral edge of the work, thereby holding the work in a stable state at the peeling position. At this time, it is possible to avoid the holding member and the like from being in direct physical contact with the upper and lower surfaces of the workpiece. And in the state which hold | maintained the peripheral part of the workpiece | work with the holding member, a peeling tape is affixed on the adhesive tape currently affixed on the workpiece | work, and an adhesive tape is integrated and peeled with a peeling tape.

  That is, even if the holding member or the like is not in contact with the surface of the workpiece to which the adhesive tape is not attached, the adhesive tape can be peeled from the workpiece while the workpiece is stably held. Therefore, when the adhesive tape is peeled off, it is possible to reliably avoid the occurrence of problems caused by the physical contact of the holding member with the work surface.

  Further, in the above-described invention, the holding process is performed by causing each of the holding members that are in contact with the peripheral portion of the work to exert a force on the work from the peripheral portion of the work toward the central portion. It is preferable that the workpiece is held.

  (Operation / Effect) According to this configuration, each of the holding members applies a force to the work from the peripheral part to the center of the work, thereby holding the work. In this case, the work is held more stably by each of the forces acting toward the center of the work. Therefore, even if physical contact is not performed on the surface of the work, it is possible to more reliably avoid the work being displaced in the process of peeling the adhesive tape.

  In the above-described invention, the holding process may be performed while controlling the magnitude of the force that each of the holding members acts from the peripheral part of the work toward the central part so as to have an appropriate magnitude. It is preferable to hold at the peeling position. In this case, each holding member is controlled so that the magnitude of the force applied from the peripheral part to the center part of the workpiece becomes an appropriate magnitude. Therefore, it is possible to more reliably avoid the occurrence of defects in the work holding process such as deformation of the work caused by excessive force or dropping of the work due to insufficient force.

  In the above-described invention, it is preferable that the holding member includes an elastic body, and the holding process holds the work by elastically deforming the elastic body in contact with a peripheral portion of the work.

  (Operation / Effect) According to this configuration, the work is held by the elastic body provided on the holding member contacting the peripheral edge of the work and elastically deforming. At this time, since the elastic body is elastically deformed in accordance with the shape of the peripheral portion of the workpiece, the portion that contacts the holding member and the peripheral portion of the workpiece becomes wider. Therefore, the holding member can hold the workpiece more stably.

  In the above-described invention, the holding member is configured to be appropriately movable between a holding position that contacts the peripheral edge of the work and an avoidance position that can avoid contact with the adhesive tape peeled from the work. In the peeling process, it is preferable that the pressure-sensitive adhesive tape is peeled from the work while appropriately switching the positions of the plurality of holding members between the holding position and the avoidance position.

  (Operation / Effect) According to this configuration, the holding member can appropriately move between the holding position and the avoidance position. In the holding position, the holding member comes into contact with the peripheral edge of the work, and in the avoidance position, the holding member can avoid contact with the adhesive tape peeled off from the work. Then, the adhesive tape is peeled from the work while appropriately switching the position of the holding member between the holding position and the avoidance position.

  That is, about the holding member other than the position where the adhesive tape is peeled from the workpiece while moving the holding member to the avoidance position at the position where the adhesive tape is peeled from the workpiece and avoiding the contact between the adhesive tape and the holding member Can be moved to the holding position. Therefore, when peeling the adhesive tape from the workpiece, the workpiece is stably held by the holding member moving to the holding position, and the peeling error occurs due to the contact between the adhesive tape peeled from the workpiece and the holding member. Can be reliably prevented.

  In the above-described invention, the peeling process is caused by a force generated when the release tape is attached by adsorbing the adhesive tape with an adsorbing member when the release tape is attached to the adhesive tape. It is preferable to prevent deformation of the workpiece.

  (Operation / Effect) According to this configuration, the adhesive tape is adsorbed by the adsorbing member when the release tape is attached to the adhesive tape. The adsorption prevents the workpiece from being deformed due to the force generated when the release tape is applied. Accordingly, it is possible to more reliably prevent the deterioration of the work quality and the occurrence of the peeling error of the adhesive tape.

  Further, in the above-described invention, the peeling process is caused by a force generated when the release tape is applied by blowing gas to the work by the first gas supply mechanism when the release tape is attached to the adhesive tape. It is preferable to prevent deformation of the workpiece.

  (Operation / Effect) According to this configuration, when the release tape is attached to the adhesive tape, gas is blown onto the workpiece by the first gas supply mechanism. By blowing the gas, the work can be prevented from being deformed when the release tape is applied. Accordingly, it is possible to more reliably avoid the deterioration of the work quality and the occurrence of the peeling error of the adhesive tape.

  In the above-described invention, the peeling process is caused by a force generated when the pressure-sensitive adhesive tape is peeled from the work by sucking the work in a non-contact state by a suction mechanism and peeling the pressure-sensitive adhesive tape. It is preferable to prevent deformation of the workpiece.

  (Operation / Effect) According to this configuration, when the adhesive tape is peeled from the work, the work is sucked in a non-contact state by the suction mechanism. The suction prevents the workpiece from being deformed due to the force generated when the adhesive tape is peeled from the workpiece. Accordingly, it is possible to more reliably prevent the deterioration of the work quality and the occurrence of the peeling error of the adhesive tape.

  In the above-described invention, the peeling process is caused by a force generated when the pressure-sensitive adhesive tape is peeled off by blowing a gas to the work by a second gas supply mechanism when the pressure-sensitive adhesive tape is peeled off from the work. It is preferable to prevent deformation of the workpiece.

  (Operation / Effect) According to this configuration, when the adhesive tape is peeled from the work, the second gas supply mechanism blows gas onto the work. By blowing the gas, the workpiece can be prevented from being deformed when the adhesive tape is peeled from the workpiece. Accordingly, it is possible to more reliably avoid the deterioration of the work quality and the occurrence of the peeling error of the adhesive tape.

In order to achieve such an object, the present invention may take the following configurations.
That is, an adhesive tape peeling device for peeling an adhesive tape attached to a workpiece,
A transport mechanism for transporting the workpiece to a peeling position;
A holding member that holds the workpiece in the peeling position by contacting the peripheral edge of the workpiece conveyed to the peeling position;
A peeling mechanism that peels the pressure-sensitive adhesive tape integrally with the peeling tape from the workpiece held at the peeling position by peeling off the peeling tape while attaching the peeling tape to the pressure-sensitive adhesive tape by a peeling member. When,
It is characterized by providing.

  (Operation / Effect) According to this configuration, after the transport mechanism transports the workpiece to the peeling position, the holding member comes into contact with the peripheral edge of the workpiece, thereby holding the workpiece in a stable state at the peeling position. At this time, it is possible to avoid the holding member and the like from being in direct physical contact with the upper and lower surfaces of the workpiece. And the peeling mechanism affixes a peeling tape on the adhesive tape currently affixed on the workpiece | work in the state which hold | maintained the peripheral part of the workpiece | work with the holding member, and peels an adhesive tape integrally with a peeling tape.

  That is, even if the holding member or the like is not in contact with the surface of the workpiece to which the adhesive tape is not attached, the adhesive tape can be peeled from the workpiece while the workpiece is stably held. Therefore, when the adhesive tape is peeled off, it is possible to reliably avoid the occurrence of problems caused by the physical contact of the holding member with the work surface.

  In the above-described invention, a pressurizing mechanism that holds the work by applying a force from each of the holding members in contact with the peripheral part of the work to the work from the peripheral part of the work toward the central part. It is preferable to provide.

  (Operation / Effect) According to this configuration, the pressurizing mechanism is provided that applies a force from each of the holding members to the work from the peripheral part to the center part of the work. In this case, the work is held more stably by each of the forces that the pressure mechanism acts toward the center of the work. Therefore, even if physical contact is not performed on the surface of the work, it is possible to more reliably avoid the work being displaced in the process of peeling the adhesive tape.

  Moreover, in the above-described invention, it is preferable that the holding member includes a control mechanism for controlling the magnitude of the force applied from the peripheral edge portion to the central portion of the workpiece so as to have an appropriate magnitude. In this case, the control mechanism controls each of the holding members so that the magnitude of the force acting from the peripheral edge portion to the central portion of the workpiece becomes an appropriate size. Therefore, it is possible to more reliably avoid the occurrence of defects in the work holding process such as deformation of the work caused by excessive force or dropping of the work due to insufficient force.

  In the above-described invention, it is preferable that the holding member includes an elastic body, and the elastic body contacts the peripheral edge of the work and elastically deforms to hold the work.

  (Operation / Effect) According to this configuration, the work is held by the elastic body provided on the holding member contacting the peripheral edge of the work and elastically deforming. At this time, since the elastic body is elastically deformed in accordance with the shape of the peripheral portion of the workpiece, the portion that contacts the holding member and the peripheral portion of the workpiece becomes wider. Therefore, the holding member can hold the workpiece more stably.

  In the above-described invention, the holding member may include a driving mechanism that appropriately moves the holding position that contacts the peripheral edge of the work and the avoidance position that can avoid contact with the adhesive tape peeled off from the work. It is preferable that the peeling mechanism peels the adhesive tape from the workpiece while the drive mechanism appropriately switches the positions of the plurality of holding members between the holding position and the avoidance position.

  (Operation / Effect) According to this configuration, the holding member can appropriately move the holding position and the avoidance position by the driving mechanism. In the holding position, the holding member comes into contact with the peripheral edge of the work, and in the avoidance position, the holding member can avoid contact with the adhesive tape peeled off from the work. Then, the adhesive tape is peeled from the workpiece while the position of the holding member is appropriately switched between the holding position and the avoidance position by the drive mechanism.

  That is, about the holding member other than the position where the adhesive tape is peeled from the workpiece while moving the holding member to the avoidance position at the position where the adhesive tape is peeled from the workpiece and avoiding the contact between the adhesive tape and the holding member Can be moved to the holding position. Therefore, when peeling the adhesive tape from the workpiece, the workpiece is stably held by the holding member moving to the holding position, and the peeling error occurs due to the contact between the adhesive tape peeled from the workpiece and the holding member. Can be reliably prevented.

  Further, in the above-described invention, the adhesive tape is adsorbed when the release tape is attached to the adhesive tape, and deformation of the workpiece due to the force generated when the release mechanism attaches the release tape is prevented. It is preferable to include an adsorbing member.

  (Operation / Effect) According to this configuration, the adhesive tape is adsorbed by the adsorbing member when the release tape is attached to the adhesive tape. The adsorption prevents the workpiece from being deformed due to the force generated when the release tape is applied. Accordingly, it is possible to more reliably prevent the deterioration of the work quality and the occurrence of the peeling error of the adhesive tape.

  Further, in the above-described invention, when the release tape is attached to the adhesive tape, gas is blown onto the work, and the deformation of the work caused by the force generated when the release mechanism attaches the release tape is prevented. It is preferable to include a first gas supply mechanism.

  (Operation / Effect) According to this configuration, when the release tape is attached to the adhesive tape, gas is blown onto the workpiece by the first gas supply mechanism. By blowing the gas, the work can be prevented from being deformed when the release tape is applied. Accordingly, it is possible to more reliably avoid the deterioration of the work quality and the occurrence of the peeling error of the adhesive tape.

  Further, in the above-described invention, when the pressure-sensitive adhesive tape is peeled from the work, the work is sucked in a non-contact state, and the work is caused by a force generated when the peeling mechanism peels the pressure-sensitive adhesive tape. It is preferable to provide a suction mechanism that prevents deformation.

  (Operation / Effect) According to this configuration, when the adhesive tape is peeled from the work, the work is sucked in a non-contact state by the suction mechanism. The suction prevents the workpiece from being deformed due to the force generated when the adhesive tape is peeled from the workpiece. Accordingly, it is possible to more reliably prevent the deterioration of the work quality and the occurrence of the peeling error of the adhesive tape.

  Further, in the above-described invention, when the pressure-sensitive adhesive tape is peeled from the work, gas is blown onto the work, and the deformation of the work due to the force generated when the peeling mechanism peels the pressure-sensitive adhesive tape is prevented. A second gas supply mechanism is preferably provided.

  (Operation / Effect) According to this configuration, when the adhesive tape is peeled from the work, the second gas supply mechanism blows gas onto the work. By blowing the gas, the workpiece can be prevented from being deformed when the adhesive tape is peeled from the workpiece. Accordingly, it is possible to more reliably avoid the deterioration of the work quality and the occurrence of the peeling error of the adhesive tape.

  According to the pressure-sensitive adhesive tape peeling method and the pressure-sensitive adhesive tape peeling device of the present invention, the wafer is held in a stable state at the peeling position by holding the peripheral edge of the wafer with the holding member. Then, the adhesive tape attached to the wafer is peeled off while the wafer is held at the peeling position. Therefore, the adhesive tape attached to the other surface of the wafer can be suitably peeled while reliably avoiding physical contact with the one surface of the wafer.

It is a top view which shows the basic composition of the adhesive tape peeling apparatus which concerns on Example 1. FIG. It is a front view which shows the basic composition of the holding mechanism and peeling mechanism which concern on Example 1. FIG. 3 is a plan view showing a basic configuration of a holding mechanism and a peeling mechanism according to Embodiment 1. FIG. 3 is a diagram illustrating a configuration of a holding mechanism according to Embodiment 1. FIG. (A) is a longitudinal cross-sectional view which shows the state which the holding member has moved to the avoidance position, (b) is a longitudinal cross-sectional view which shows the state in which the holding member has moved to the holding position, (c) It is a top view which shows the positional relationship of the holding member which has moved to the avoidance position, and the holding member which has moved to the holding position. 6 is a plan view showing a position pattern of a holding member according to Embodiment 1. FIG. (A) is a plan view showing a first pattern, (b) is a plan view showing a second pattern, (c) is a plan view showing a third pattern, and (d) is a first view. It is a top view which shows the pattern of 4. FIG. It is a front view which shows operation | movement of the adhesive tape peeling apparatus which concerns on Example 1. FIG. (A) is a front view which shows the state which has moved the conveyance mechanism to the wafer supply part, (b) has moved the alignment pin of a wafer holding part from the initial position, and of the wafer hold | maintained at the wafer holding part It is a front view which shows the state which is aligning. It is a figure which shows operation | movement of the adhesive tape peeling apparatus which concerns on Example 1. FIG. (A) is a front view which shows the state which conveyed the wafer to the aligner, (b) is a front view which shows the state which aligns a wafer with an alignment pin. It is a figure which shows operation | movement of the adhesive tape peeling apparatus which concerns on Example 1. FIG. (A) is a longitudinal cross-sectional view which shows the state which conveyed the wafer to the holding mechanism, (b) is a longitudinal cross-sectional view which shows the state which makes a holding member contact the peripheral part of a wafer, and hold | maintains a wafer, (c ) Is a longitudinal sectional view showing a state in which a force from the peripheral part toward the central part is applied to the wafer from the holding member in contact with the wafer to hold the wafer more stably. It is a figure which shows operation | movement of the adhesive tape peeling apparatus which concerns on Example 1. FIG. (A) is a top view which shows the arrangement pattern of a holding member in the state which the movable table has moved to the peeling start position, (b) is a longitudinal cross-sectional view which shows the state which affixes a peeling tape on an adhesive tape. (C) is a top view which shows the positional relationship of a holding member and the peeling unit in the state which affixes a peeling tape on an adhesive tape. It is a figure which shows operation | movement of the adhesive tape peeling apparatus which concerns on Example 1. FIG. (A) is a longitudinal cross-sectional view which shows the state in which a peeling unit peels an adhesive tape integrally with a peeling tape, (b) is the positional relationship of a holding member in the state of (a), and an adhesive tape remains on a wafer. FIG. It is a figure which shows operation | movement of the adhesive tape peeling apparatus which concerns on Example 1. FIG. (A) is a top view which shows the positional relationship of a holding member in case the boundary line of the adhesive tape before peeling and the adhesive tape after peeling exists in the vicinity of F1, (b) is the adhesive tape before peeling and It is a top view which shows the positional relationship of a holding member when the boundary line with the adhesive tape after peeling leaves | separates from F1, (c) is the boundary line of the adhesive tape before peeling and the adhesive tape after peeling F2 It is a top view which shows the positional relationship of a holding member in the case where it exists in the vicinity of (2), (d) is the position of the holding member when the boundary line of the adhesive tape before peeling and the adhesive tape after peeling leaves | separates from F2. It is a top view which shows a relationship. It is a figure which shows operation | movement of the adhesive tape peeling apparatus which concerns on Example 1. FIG. (A) is a top view which shows the positional relationship of a holding member in case the boundary line of the adhesive tape before peeling and the adhesive tape after peeling exists in the vicinity of F3, (b) is the adhesive tape before peeling, and It is a top view which shows the positional relationship of a holding member in case the boundary line with the adhesive tape after peeling exists in the left end vicinity of a wafer, (c) is a longitudinal cross-section which shows the state from which the adhesive tape was peeled completely from the wafer FIG. It is a figure which shows operation | movement of the adhesive tape peeling apparatus which concerns on Example 2. FIG. (A) is a top view which shows the positional relationship of a holding member in the state which affixes a peeling tape on an adhesive tape, (b) is a boundary line of the adhesive tape before peeling and the adhesive tape after peeling near F1 FIG. 6C is a plan view showing the positional relationship of the holding member when the boundary line between the pressure-sensitive adhesive tape before peeling and the pressure-sensitive adhesive tape after peeling is in the vicinity of F2. (D) is a top view which shows the positional relationship of a holding member in case the boundary line of the adhesive tape before peeling and the adhesive tape after peeling exists in the vicinity of F3. It is a figure which shows the structure of the holding member which concerns on a modification. (A) is a longitudinal cross-sectional view which shows the state by which the holding member of uniform thickness is arrange | positioned in the avoidance position, (b) is a holding member having uniform thickness moved to the holding position. It is a longitudinal cross-sectional view which shows the state which hold | maintains a wafer, (c) is a longitudinal cross-sectional view which shows the state by which the holding member provided with a recessed part is arrange | positioned in an avoidance position, (d) is held by the holding member provided with a recessed part It is a longitudinal cross-sectional view which shows the state which moves to a position and hold | maintains a wafer. It is a figure which shows the structure of the holding member which concerns on a modification. (A) is a perspective view of a holding member, (b) is a longitudinal sectional view showing a state in which the holding member is arranged at an avoidance position, and (c) is an elastic body of the holding member at the peripheral portion of the wafer. It is a longitudinal cross-sectional view which shows the state which contact | abutted, (d) is a longitudinal cross-sectional view which shows the state which the elastic body of a holding member contact | abuts to the peripheral part of a wafer, and is further elastically deforming. It is a figure explaining the adhesive tape peeling apparatus which concerns on a modification. (A) is a longitudinal cross-sectional view which shows the state which sprays gas on the lower surface of a wafer via a gas flow path, when affixing a peeling tape on an adhesive tape, (b) is peeling an adhesive tape integrally with a peeling tape. It is a longitudinal cross-sectional view which shows the state which attracts | sucks the lower surface of a wafer through a gas flow path when doing.

  Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a plan view showing a basic configuration of an adhesive tape peeling apparatus 1 according to the first embodiment. In the figure showing the pressure-sensitive adhesive tape pasting device 1, illustrations of the supporting means for supporting various components and the driving means for driving the various components are omitted as appropriate.

  The adhesive tape peeling apparatus 1 according to the first embodiment is a semiconductor wafer W (hereinafter simply referred to as “wafer W”) having an adhesive tape T attached to the back surface as an example of a configuration for peeling the adhesive tape from a workpiece. The structure which peels the said adhesive tape T from will be mentioned and demonstrated. That is, in Example 1, the wafer W corresponds to the workpiece in the present invention. It is assumed that a circuit pattern is formed on the surface of the wafer W.

<Description of overall configuration>
As shown in FIG. 1, the adhesive tape peeling apparatus 1 according to this embodiment includes a wafer supply unit 2, a wafer collection unit 3, a wafer transfer mechanism 4, an aligner 5, a holding mechanism 6, and a peeling mechanism 7.

  The wafer supply unit 2 is loaded with a cassette C1. In the cassette C1, a wafer W with the adhesive tape T attached to the back surface is inserted and stored in a multilevel horizontal posture with the back surface facing upward. The wafer storage unit 3 is loaded with a cassette C2. In the cassette C2, the wafer W with the adhesive tape T peeled from the back surface is inserted and stored in a multi-level horizontal posture with the back surface facing upward.

  The robot arm 4a provided in the wafer transfer mechanism 4 is configured to be able to move forward and backward horizontally, and is configured to be capable of turning and moving up and down as a whole. At the tip of the robot arm 4a, a horseshoe-shaped wafer holding part 4b is provided. The wafer holding portion 4b is a Bernoulli chuck as a preferred example, and suspends and holds the back surface of the wafer W in a non-contact manner.

  Specifically, as shown in FIG. 6, a plurality of gas supply pads 4c are provided on the lower surface of the wafer holding portion 4b. The gas supply pad 4c is connected in communication with a gas supply mechanism (not shown). Gas is blown from the wafer holding portion 4b to the back surface of the wafer W facing upward via the gas supply pad 4c, thereby forming a negative pressure region between the wafer W and the wafer holding portion 4b. The part 4b suspends and holds the back surface of the wafer W in a non-contact manner.

A plurality of alignment pins 4d are erected on a predetermined circumference on the lower surface of the wafer holder 4b. Each of the alignment pins 4d is configured to be able to reciprocate toward the center of the wafer holder 4b. The positioning position of the alignment pin 4d on a predetermined circumference is adjusted so that interference with a holding member 9 described later can be avoided. Note that an example of a position where the alignment pin 4d contacts the peripheral edge of the wafer W in plan view is indicated by a dotted line R in FIG.

  The aligner 5 includes a horizontal stage 5 a, a gas supply pad 5 b, and alignment pins 5 c, and aligns the wafer W transferred from the wafer supply unit 2. The gas supply pad 5b is formed on the surface of the stage 5a, and is connected to a gas supply mechanism (not shown). By blowing gas onto the lower surface of the wafer transferred to the aligner 5 via the gas supply pad 5b, a negative pressure region is formed between the wafer W and the stage 5a, and the wafer is floated by the Bernoulli effect. Hold on stage 5a.

  The alignment pins 5c are erected at regular intervals on a predetermined circumference in the stage 5a. Each alignment pin 5c is configured to be able to reciprocate from the outer periphery of the stage 5a toward the center of the stage 5a. The wafer W held on the stage 5a in a floating state is aligned at the position indicated by the dotted line P1 by the alignment pins 5c.

  The holding mechanism 6 includes a movable stage 8, a plurality of holding members 9, and a gas supply pad 10. As shown in FIG. 2, the movable stage 8 is supported so as to be slidable in the left-right direction along a rail 11 that is horizontally arranged in the left-right direction (x direction). The movable stage 8 is screw-driven by a screw shaft 15 that is normally and reversely driven by a motor 13. By sliding along the rail 11, the movable stage 8 moves between an initial position indicated by a solid line in FIG. 1 or 2 and a peeling start position indicated by a dotted line in FIG. 1 or FIG. It is configured to reciprocate.

  The holding member 9 has a rod-like configuration in the first embodiment, and is erected on a predetermined circumference of the movable stage 8. Each of the holding members 9 comes into contact with the peripheral edge Wb of the wafer W, so that the wafer W is stably held on the movable stage 8 without physical contact with the lower surface Wa. A detailed configuration of the holding member 9 will be described later.

  As shown in FIG. 1, the gas supply pad 10 is provided on the upper surface of the movable stage 8. The position where each of the gas supply pads 10 is disposed is adjusted in advance so as to be below the wafer W transferred to the holding mechanism 6. The gas supply pad 10 is connected to a gas supply device (not shown), and is configured to supply gas to the lower surface of the wafer W when the adhesive tape T is peeled from the wafer W together with the peeling tape Ts. By supplying the gas from the gas supply pad 10, a negative pressure region is formed between the wafer W and the gas supply pad 10, and a downward force on the wafer W is generated by the Bernoulli effect.

  As shown in FIGS. 1 and 2, the peeling mechanism 7 is disposed between the initial position of the movable stage 8 and the peeling start position of the movable stage 8. The peeling mechanism 7 includes a tape supply unit 17, a tape recovery unit 19, and a peeling unit 20. The tape supply unit 17 feeds the peeling tape Ts loaded in the original fabric roll. The fed peeling tape Ts is guided to the peeling unit 20 by a guide roll (not shown). The tape collecting unit 19 winds up and collects the peeling tape Ts sent from the peeling unit 20.

  Next, the configuration of the peeling unit 20 will be described. As shown in FIG. 2, a support frame 22 made of an aluminum drawing material or the like is fixed across a pair of left and right vertical frames 21 erected on the apparatus base. A box-shaped base 23 is connected to the left and right central portion of the support frame 22. Further, a lifting platform 25 supported so as to be slidable up and down is lifted and lowered by a ball shaft connected and driven by a motor 26 via a pair of left and right vertical rails 24 provided on the base 23. The peeling unit 20 is equipped on the lifting platform 25.

  The lifting platform 25 is configured in a hollow frame shape penetrating vertically. The peeling unit 20 is provided at the inner lower portion of the side plate 27 provided on the left and right sides of the lifting platform 25. A support frame 28 is fixed across the side plates 27.

  A peeling member 29 is attached to the center of the support frame 28. The peeling member 29 has a plate shape shorter than the diameter of the wafer W, and is formed in a tapered shape that tapers toward the tip. The peeling member 29 is fixed in an obliquely inclined posture.

  In the peeling unit 20, a supply guide roller 31 is pivotally supported behind the side plate 27 so as to freely rotate. A plurality of collection guide rollers 32, nip rollers 33, and tension rollers 34 are disposed above the peeling unit 20.

  The collection guide roller 32 is pivotally supported so as to be freely rotatable. The tension roller 34 is provided on the support arm 35 so as to be freely rotatable, and is provided so as to be swingable via the support arm 35. Therefore, the tension roller 34 gives an appropriate tension to the peeling tape Ts wound around the guide.

  The collection guide roller 32 and the tension roller 34 are configured as wide rollers having a length larger than the diameter of the wafer W, and the outer peripheral surfaces thereof are hard-to-bond surfaces coated with fluororesin. The supply guide roller 31 is configured to be a narrow roller that is longer than the width of the peeling tape Ts and shorter than the diameter of the wafer W.

  The peeling mechanism 7 further includes an adsorption member 37. A pair of adsorbing members 37 are provided on the left and right sides of the peeling member 29, that is, on the near side and the far side of the peeling member 29 as viewed from the entire adhesive tape peeling device 1. The suction member 37 is a plate-like member as an example, and is configured to be movable up and down independently of the lifting platform 25. The adsorbing member 37 is connected in communication with a vacuum device (not shown), and is configured to adsorb the adhesive tape T from the surface side when the peeling unit 20 affixes the peeling tape Ts to the adhesive tape T.

  When the peeling member 29 presses and attaches the peeling tape Ts to the surface of the adhesive tape T, a downward force J1 acts on the wafer W, while the adsorption member 37 adsorbs the surface of the adhesive tape T. An upward force J2 acts on the wafer W. Therefore, by applying a force J2 opposite to the force J1 by the adsorption of the adsorption member 37, the deformation of the wafer W due to the force J1 acting on the wafer W when the release tape Ts is attached to the adhesive tape T is prevented. it can.

  The adhesive tape peeling apparatus 1 further includes a control unit 40 and an input unit 50. The control unit 40 includes a CPU (Central Processing Unit) and the like, and comprehensively controls various operations of the adhesive tape peeling device 1. Examples of various operations include a telescopic operation of a cylinder 43 described later, a horizontal movement of the movable table 8, and an operation of the wafer transfer device 4.

  Examples of the input unit 50 include a console panel and a keyboard. An operator can input various instructions using the input unit 50. The instruction content input to the input unit 50 is transmitted to the control unit 40, and the control unit 40 can perform various overall controls according to the instruction.

<Configuration of holding mechanism>
Here, the configuration of the holding mechanism 6 will be described in detail. In the first embodiment, ten holding members 9 are erected on the movable stage 8 of the holding mechanism 6. As shown in FIG. 2 and FIG. 4A and the like, wedge-shaped grooves 41 are formed on the side surfaces of the respective holding members 9. The groove portion 41 is formed on the side of the holding member 9 close to the central portion of the movable stage 8, and each of the holding members 9 contacts the peripheral edge portion Wb of the wafer W in the groove portion 41. As long as the wafer W can be stably held via the peripheral edge of the wafer W, the number and arrangement of the holding members 9 may be appropriately changed. Examples of the constituent material of the holding member 9 include a material having a certain hardness such as metal or plastic.

  As shown in FIG. 3 and the like, the holding member 9 is configured to be able to move horizontally on the movable stage 8 along a trajectory from the outer periphery of the movable stage 8 toward the center of the movable stage 8. That is, each holding member 9 is configured to be able to reciprocate between an avoidance position indicated by a solid line in FIG. 3 and a holding position indicated by a dotted line in FIG. In other words, each of the holding members 9 moves horizontally along a radial locus centered on the central portion 8x of the movable stage 8.

  The holding position of the holding member 9 is determined so that the wafer W conveyed to the holding mechanism 6 and the holding member 9 come into contact with each other and the holding member 9 can hold the wafer W. On the other hand, the avoidance position of the holding member 9 is a position away from the wafer W transferred to the holding mechanism 6, and the contact between the adhesive tape T peeled off from the wafer W and the holding member 9 as will be described later. Alternatively, the position is determined to be a position where contact between the peeling mechanism 7 and the holding member 9 can be avoided.

  A configuration in which each of the holding members 9 moves between the holding position and the avoidance position will be described. As shown in FIGS. 4A and 4B, a separate cylinder 43 is connected to each of the holding members 9. As shown in FIG. 4C, each of the cylinders 43 is arranged so as to expand and contract along a radial locus centering on the central portion 8x of the movable stage 8.

  The holding member 9 moves horizontally along the rail 45 by the expansion and contraction operation of the cylinder 43 connected to the holding member 9. By the horizontal movement, the holding member 9 is appropriately switched to a state where it is arranged at the avoidance position as shown in FIG. 4A or a state where it is arranged at the holding position as shown in FIG. It is done. The expansion / contraction operation of each cylinder 43 is appropriately controlled by the control unit 40. For convenience of description, the cylinder 43 and the rail 45 in the movable table 8 are not shown in the drawings except for the drawings in FIG. 4 and the drawings in FIG.

  When the holding member 9 moves to the holding position while the wafer W is being transferred to the holding mechanism 6, the peripheral edge Wb of the wafer W comes into contact with the groove 41 of the holding member 9. When at least three or more holding members 9 are moved to the holding position, the peripheral edge portion Wb of the wafer W comes into contact with the groove portion 41 of the holding member 9, and the lower surface Wa of the wafer W is not subjected to physical contact, so that the wafer W It is stably held on the movable stage 8. As an example, FIG. 4C shows a state in which three holding members 9 indicated by halftone dots are moved to the holding position among the ten holding members 9. In this case, the wafer W transferred to the position indicated by P <b> 2 is held in a state of being sandwiched by the three holding members 9.

  In the present invention, the peripheral edge portion Wb of the wafer W is a portion including the upper end to the lower end of the side surface of the wafer W. In the first embodiment, as shown in FIG. 4B, the holding member 9 holds the wafer W from the side by contacting the upper and lower ends of the side surface of the wafer W via the groove 41.

  In the first embodiment, as a preferred configuration, the control unit 40 further moves the holding member 9 to the center of the movable table 8 while the holding member 9 is moved to the holding position and is in contact with the peripheral edge of the wafer W. Thus, the operation of the cylinder 43 is controlled. By this operation control, a force J3 is applied from the holding member 9 to the wafer W in the direction from the peripheral edge Wb of the wafer W to the center Wx of the wafer W. By applying the force J3 from each of the holding members 9 moving to the holding position toward the center of the wafer W, it is possible to more reliably avoid the situation in which the wafer W drops away from the holding member 9.

  The magnitude of the force J3 changes according to the distance that the cylinder 43 extends and contracts. The control unit 40 controls the expansion / contraction distance of the cylinder 43 to appropriately adjust the magnitude of the force J3 according to various conditions such as the thickness, size, and material of the wafer W. By appropriately adjusting the magnitude of the force J3, when the holding member 9 holds the wafer W, an excessively large force J3 acts on the wafer W from the holding member 9, and the wafer W is deformed. Can be prevented.

  Next, a mechanism for performing control for switching the position of the holding member 9 will be described. In the first embodiment, the ten holding members 9 are divided into two groups, and are configured to be controlled to switch from the holding position to the avoidance position for each group. That is, as shown in FIG. 5A, the holding member 9 is divided into four holding members 9p belonging to the first group and six holding members 9s belonging to the second group. In each figure after Fig.5 (a), the holding member 9p is shown with the oblique line, and the holding member 9s is shown with white, and these are distinguished.

  The expansion / contraction operation of the four cylinders 43 connected to each of the holding members 9p is controlled synchronously by the control unit 40. The expansion / contraction operation of the six cylinders 43 connected to each of the holding members 9s is controlled synchronously by the control unit 40. The control of the cylinder 43 connected to the holding member 9p and the control of the cylinder 43 connected to the holding member 9s are independently performed by the control unit 40. By performing the synchronous control independently for the two groups, the arrangement of the holding members 9 on the movable stage 8 can be divided into four patterns.

  In the first pattern, as shown in FIG. 5A, both the holding members 9p and 9s move to the avoidance position. In the second pattern, as shown in FIG. 5B, the holding members 9p and 9s both move to the holding position, and the wafer W is held by the holding members 9p and 9s.

  In the third pattern, as shown in FIG. 5C, each of the holding members 9p moves to the holding position, while each of the holding members 9s moves to the avoidance position. In the third pattern, the wafer W is held by the holding member 9p. In the fourth pattern, as shown in FIG. 5D, each of the holding members 9s moves to the holding position, while each of the holding members 9p moves to the avoidance position. In the fourth pattern, the wafer W is held by the holding member 9s.

  In the first embodiment, when the adhesive tape T is peeled from the wafer W, the above four patterns are appropriately switched with respect to the arrangement pattern of the holding members 9. By appropriately switching the position of the holding member 9 between the avoidance position and the holding position, the wafer W can be stably held by contact from the side of the wafer W, and can be held with the adhesive tape T peeled from the wafer W. The situation where the member 9 interferes can be avoided.

<Outline of adhesive tape peeling process>
Here, a series of basic operations will be described in the process of peeling the adhesive tape T from the wafer W using the adhesive tape peeling apparatus 1. In starting the process of peeling the adhesive tape, the movable stage 8 of the holding mechanism 6 is moved to the initial position shown in FIG. 1, and the holding members 9 on the movable stage 8 are avoided as shown in FIG. Moved to position.

  When a command to start the peeling operation is issued, first, the robot arm 4a of the transfer mechanism 4 is actuated to move toward the cassette C1 of the wafer supply unit 2. As shown in FIG. 6A, the wafer holding portion 4b provided at the tip of the robot arm 4a is inserted into the gap between the wafers W stored in the cassette C1. Gas is blown against the wafer W from each of the gas supply pads 4c provided on the lower surface of the wafer holder 4b, and the wafer holder 4b holds the wafer W in a non-contact manner by the Bernoulli effect.

  Further, as shown in FIG. 6B, the alignment pin 4d arranged at the initial position indicated by the dotted line moves toward the center of the wafer holding unit 4b. Due to the movement of the alignment pin 4d, the side surface of the wafer W and the alignment pin 4d come into contact with each other. By this contact, the wafer W held in a non-contact manner on the wafer holding portion 4b is aligned. That is, the alignment pins 4d prevent the wafer W from moving in the horizontal direction with respect to the holding surface of the wafer holding unit 4b.

  After the wafer holding unit 4b holds the wafer W in a non-contact manner and the wafer W is aligned by the alignment pins 4d, the transfer mechanism 4 transfers the wafer W to the aligner 5 to align the wafer W. Do. That is, as shown in FIG. 7A, the wafer holding unit 4b moves the wafer W above the stage 5a. At this time, gas is blown from the gas supply pad 5b provided on the stage 5a toward the lower surface of the wafer W, and the wafer W floats on the stage 5a due to the Bernoulli effect.

  Thereafter, the operation of the gas supply pad 4c is stopped, and the alignment pins 4d are moved from the central part of the wafer holding part 4b toward the outer peripheral part to return to the initial position. Then, the wafer holding unit 4b is retracted from the aligner 5, and the wafer W is aligned by the alignment pins 5c. As shown in FIG. 7B, each of the alignment pins 5c moves in a direction from the outer peripheral portion of the stage 5a toward the center 5x of the stage 5a.

  Due to the movement of the alignment pin 5c, the side surface of the wafer W and the side surface of the alignment pin 5c come into contact with each other, and the wafer W is displaced so as to be pushed toward the center 5x of the stage 5a. As a result, the position of the wafer W is aligned so that the center Wx of the wafer W and the center 5x of the stage 5a coincide in plan view. The position of the wafer W aligned by the aligner 5 is indicated by reference numeral P1 in FIG.

  After the alignment of the wafer W is performed, a process of holding the wafer W on the holding mechanism 6 is performed. The robot arm 4a moves again to the aligner 5, and the wafer W is held in a non-contact manner by the wafer holder 4b. That is, the gas supply pad 4c is actuated and gas is blown onto the wafer W to generate a Bernoulli effect, and the alignment pins 4d move from the initial position toward the center of the wafer holding unit 4b. The wafer W is aligned in contact with the side surface. Then, the wafer W is transferred from the aligner 5 to the holding mechanism 6. That is, as shown in FIG. 8A, the wafer W is transported above the movable stage 8 by the wafer holder 4b. At this time, the position where the wafer W is transferred is a position indicated by a reference symbol P2 in FIG.

  Then, the robot arm 4a is lowered as appropriate to adjust the height of the wafer W to the height of the groove 41 provided in the holding member 9. At this time, the position of the holding member 9 is a first pattern as shown in FIG. That is, all the holding members 9 have moved to the avoidance position.

  After adjusting the height of the wafer W to the height of the groove 41, the control unit 40 controls the expansion and contraction of each cylinder 43, and moves each of the holding members 9 from the avoidance position to the holding position. Under the control of the control unit 40, the position of each holding member 9 is changed from the first pattern to the second pattern as shown in FIG. 5B.

  That is, as shown in FIG. 8B, each of the holding members 9 moves to the holding position, and each groove portion 41 comes into contact with the peripheral edge portion Wb of the wafer W. The wafer W is held by the holding member 9 by the contact.

  At this time, since the physical contact with the peripheral edge portion Wb of the wafer is performed, the wafer W is placed on the movable stage 8 in a state where there is no physical contact with the circuit surface Wa of the wafer W facing downward. It can be held stably. In Example 1, the region surrounded by the holding member 9 corresponds to the peeling position in the present invention.

  In order to prevent the wafer W from being displaced in the horizontal direction in the wafer holder 4b, the alignment pins 4d are in contact with the peripheral edge Wb of the wafer W. However, the position where the positioning pin 4d is disposed and the holding position of the holding member 9 are adjusted in advance so as to be different positions on the circumference of the peripheral edge Wb. Therefore, it is possible to suppress the holding member 9 that has moved to the holding position from interfering with the alignment pins 4d, so that it is possible to avoid an error in the process of holding the wafer W by the holding member 9. For convenience of description, the description of the alignment pin 4d is omitted in each drawing of FIG.

  In the first embodiment, in order to hold the wafer W more stably, the control unit 40 further controls the cylinder 43 to contract toward the center Wx of the wafer. With this control, as shown in FIG. 8C, a force J3 acts on the wafer W from each of the holding members 9 moving to the holding position.

  Since each of the forces J3 is a force in a direction from the peripheral edge Wb of the wafer W toward the center Wx, the peripheral edge Wb of the wafer W is separated from the groove 41 of the holding member 9 by the action of the force J3. Can be prevented from falling. Therefore, by applying the force J3 from the holding member 9, the wafer W can be held more stably even when there is no physical contact with the circuit surface Wa that faces downward.

  After the holding member 9 holds the peripheral edge portion Wb of the wafer W, the operation of the gas supply pad 4c in the wafer holding portion 4b is stopped to release the holding of the wafer W by the transfer mechanism 4, and the robot arm 4a is moved from the holding mechanism 6. Evacuate.

  After the robot arm 4a is retracted from the holding mechanism 6, a process of peeling the adhesive tape T is started. First, the control unit 40 controls the rotation of the motor 13 to move the movable stage 8 from the initial position to the peeling start position (see FIGS. 1 and 2).

  After the movable stage 8 moves to the peeling start position, the movable table 8 is moved from the peeling start position to the initial position. A step of attaching the peeling tape Ts to the surface of the adhesive tape T by the peeling unit 20 while moving the movable table 8 to the initial position, and a step of peeling the adhesive tape T from the wafer W integrally with the peeling tape Ts. Is done.

  Here, the peeling tape Ts is attached to the right end portion of the adhesive tape T in the drawing. Therefore, when all the holding members 9 are moved to the holding position, the holding member 9s surrounded by the dotted line M1 in FIG. 9A of the holding members 9 hinders the peeling tape applying operation by the peeling unit 20.

   Therefore, before performing the operation of attaching the release tape Ts to the adhesive tape T, the holding member 9s of the holding member 9 is moved to the avoidance position. That is, the control unit 40 controls the six cylinders 43 connected to the holding member 9s among the holding members 9, and switches the position of the holding member 9s from the holding position to the avoidance position.

  By switching the position of the holding member 9s, the position pattern of the holding member 9 changes from the second pattern shown in FIG. 5B to the third pattern shown in FIG. 5C. In this case, the wafer W is stably held by the four holding members 9p. Since the holding member 9s surrounded by the dotted line M1 moves away from the wafer W and moves to the avoidance position, it is possible to avoid a situation in which an error occurs in the peeling process due to interference between the peeling unit 20 and the holding member 9s.

  After the holding member 9 s is retracted to the avoidance position, the release tape Ts is fed out and supplied from the tape supply unit 17, and the release tape Ts is attached to the adhesive tape T using the release unit 20. That is, as shown in FIG. 9B, the motor 26 is operated by the control unit 40 and the peeling unit 20 is lowered to a predetermined height. For convenience of explanation, the holding member 9p holding the wafer W is not shown in FIG. 9B.

  Then, the peeling tape Ts wound around the peeling member 29 is pressed and attached to the right end portion of the adhesive tape T on the wafer W. A downward force J <b> 1 acts on the wafer W by pressing when the release tape Ts is applied.

  Therefore, in order to prevent the deformation of the wafer W due to the force J1, the adhesive tape T and the wafer W are adsorbed by the adsorbing member 37 in synchronization with the operation of attaching the peeling tape Ts to the adhesive tape T. That is, as shown in FIG. 9B, the suction member 37 is lowered to a predetermined height independently of the lowering of the peeling member 29.

  Then, a vacuum device (not shown) is operated, and the suction member 37 sucks the adhesive tape T and the wafer W at the predetermined height. Due to the suction, an upward force J2 acts on the wafer W. The influence of the downward force J1 on the wafer W is reduced by the upward force J2. Therefore, by performing suction by the suction member 37, it is possible to avoid a situation where the wafer is deformed by the force J1. At this time, the positional relationship among the adsorbing member 37, the peeling member 29, the peeling tape Ts, etc. in plan view is as shown in FIG.

  In synchronization with the completion of the operation of attaching the release tape Ts to the adhesive tape T, the suction by the suction member 37 is released. The movable table 8 further moves to the right in the drawing toward the initial position. At this time, the adhesive tape T is peeled off from the back surface of the wafer W integrally with the peeling tape Ts while the peeling tape 29 is folded back by the peeling member 29 (FIG. 10A). The peeling tape Ts to which the adhesive tape T peeled from the wafer W is attached is wound and collected by the tape collecting unit 19. In FIG. 10A, the description of the holding member 9 holding the wafer W is omitted for convenience of explanation.

  By peeling the adhesive tape T from the back surface of the wafer W facing upward, when the adhesive tape T is peeled off, an upward force J4 acts on the wafer W. Therefore, in order to prevent the deformation of the wafer W due to the force J4, the gas supply pad 10 supplies gas in synchronism with the operation of peeling the adhesive tape T. That is, as shown in FIG. 10A, gas is blown toward the lower surface of the wafer W from the gas supply pad 10 provided on the surface of the movable stage 8.

  When the gas is blown, a negative pressure region is generated between the movable stage 8 and the lower surface of the wafer W, and a downward force J5 is generated on the wafer W due to the Bernoulli effect. The effect of the upward force J4 on the wafer W is reduced by the downward force J5. Therefore, the situation where the wafer is deformed by the force J4 can be avoided by blowing the gas using the gas supply pad 10.

  As the adhesive tape T is peeled off from the wafer W, the boundary line N between the adhesive tape T attached to the wafer W and the adhesive tape T peeled off from the wafer W moves from the right end of the wafer W to the left. (FIG. 10B). By separating the boundary line N from the right end of the wafer W, a situation in which the separation member 20 or the adhesive tape T interferes even when the holding member 9s surrounded by the reference numeral M1 moves to the holding position is avoided.

  Therefore, when the boundary line N is at the position from the right end of the wafer W to the reference numeral F1, the control unit 40 controls the cylinder 43 connected to the holding member 9s and moves each of the holding members 9s to the holding position. Let By this control, the position pattern of the holding member 9 is changed from the third pattern to the second pattern, and the wafer W is held by the holding members 9p and 9s (FIG. 10B).

  The adhesive tape T is further peeled from the wafer W by the peeling unit 20, and the boundary line N approaches the position indicated by reference numeral F1 in FIG. At this time, if the holding member 9p surrounded by the dotted line M2 is disposed at the holding position, a peeling error occurs due to the adhesive tape T peeled off from the wafer W coming into contact with the holding member 9p. There is concern about the situation.

  Therefore, when the boundary line N approaches the position of the reference numeral F1, the control unit 40 controls the expansion / contraction operation of the cylinder 43 connected to the holding member 9p, and moves each of the holding members 9p from the holding position to the avoidance position. Let By this control, the position pattern of the holding member 9 is changed from the second pattern to the fourth pattern as shown in FIG. By switching the position of the holding member 9p to the avoidance position, it is possible to reliably avoid a situation in which a peeling error of the adhesive tape T occurs even when the boundary line N passes the position F1 (FIG. 11A). At this time, the wafer W is held by the holding member 9s.

  As the movable table 8 is further moved toward the initial position and the adhesive tape T is peeled off, the boundary line N further moves to the left. When the boundary line N passes the position F1, the control unit 40 controls the cylinder 43 to move each of the holding members 9p from the avoidance position to the holding position. As a result, the position pattern of the holding member 9 is changed to the first pattern, and the wafer W is held by the holding members 9p and 9s (FIG. 11B).

  Further, the peeling process of the adhesive tape T proceeds and the boundary line N approaches the position F2. At this time, if the two holding members 9s surrounded by the dotted line M3 are moved to the holding position, the operation of the holding members 9s peeling the adhesive tape T is hindered. When the boundary line N approaches the position F2, the control unit 40 controls the cylinder 43 to move each of the holding members 9s to the avoidance position, and the adhesive tape T peeled off from the wafer W interferes with the holding member 9s. To avoid the situation. At this time, the position pattern of the holding member 9 is the third pattern, and the wafer W is stably held by the peripheral edge of the wafer W coming into contact with the groove portions 41 of the four holding members 9p (FIG. 11 (c)).

  The movable table 8 is further moved toward the initial position to advance the peeling process. When the boundary line N advances leftward and passes the position F2, the holding member 9s is moved again from the avoidance position to the holding position. That is, the position pattern of the holding member 9 is changed from the third pattern to the first pattern, and the peripheral edge Wb of the wafer W comes into contact with each of the groove 41 of the holding member 9p and the groove 41 of the holding member 9s. Then, the wafer W is held in a state where the circuit surface Wa is not in contact (FIG. 11D).

  When the peeling process of the adhesive tape T further proceeds, the boundary line N approaches the position F3 from the position F2. At this time, if the two holding members 9p surrounded by the dotted line M4 are moved to the holding position, the holding member 9p hinders the operation of peeling the adhesive tape T. Therefore, the control unit 40 controls the cylinder 43 to switch the position of the holding member 9p from the holding position to the avoidance position, and changes the position pattern of the holding member 9 to the fourth pattern (FIG. 12A). When the boundary line N passes the position F3, the control unit 40 moves the holding member 9p to the holding position, and changes the position pattern of the holding member 9 to the first pattern.

  When the boundary line N approaches the left end of the wafer W, the operation of peeling the adhesive tape T by the two holding members 9s surrounded by the dotted line M5 is hindered. Therefore, the control unit 40 switches the position of the holding member 9s from the holding position to the avoidance position, and changes the position pattern of the holding member 9 to the third pattern (FIG. 12B). By further proceeding with the peeling process, the adhesive tape T is completely peeled from the back surface of the wafer W facing upward (FIG. 12C). Then, the movable table 8 returns to the initial position. When the adhesive tape T is completely peeled from the wafer W, the operation of the gas supply pad 10 is stopped.

  When the peeling of the adhesive tape T is completed and the movable table 8 returns to the initial position, the robot arm 4a of the transport mechanism 4 is moved to the holding mechanism 6. Then, the wafer W from which the adhesive tape T has been peeled is held in a non-contact manner by the wafer holding portion 4b which is a Bernoulli chuck. Thereafter, the transport mechanism 4 transports the wafer W from the holding mechanism 6 to the wafer recovery unit 3, and inserts and stores the wafer W in the cassette C2.

  As described above, a single operation using the pressure-sensitive adhesive tape peeling apparatus 1 according to the first embodiment is completed, and thereafter, the same operation is repeated until the predetermined number of sheets is reached.

  In the pressure-sensitive adhesive tape peeling apparatus 1 according to the first embodiment, the holding member is brought into contact with the peripheral edge of the wafer W that is conveyed in a non-contact manner to the peeling mechanism, thereby holding the wafer W. Then, with the holding member holding the peripheral portion of the wafer W, the release tape Ts is attached to the adhesive tape T attached to the upper surface of the wafer, and the adhesive tape T is integrated with the release tape Ts to attach the adhesive tape T to the wafer W. Peel from.

  At this time, the peripheral part of the wafer W, that is, the range from the upper end to the lower end of the side surface, is subjected to physical contact by the holding member. In other words, the lower surface of the wafer W does not receive physical contact, and the wafer W is stably held. For this reason, even when it is inappropriate for a member such as a holding table to physically contact the lower surface of the wafer W, such as when the lower surface of the wafer W is a circuit surface, a defect occurs in the wafer W. The wafer W can be stably held without any trouble. Therefore, the adhesive tape T can be accurately peeled from the upper surface of the wafer W.

  In the conventional apparatus, since the holding table needs to support at least a part of the lower surface of the wafer, a problem that the holding table comes into contact with an unintended portion of the lower surface of the wafer occurs due to the positional deviation of the wafer. On the other hand, in the configuration according to the first embodiment, a member that contacts the lower surface of the wafer, such as a holding table, is omitted. Therefore, even when the wafer is misaligned when the wafer is transferred to the peeling device, it is possible to reliably eliminate the situation where the lower surface of the wafer is subjected to physical contact.

  In the first embodiment, the holding member 9 is divided into two groups of a holding member 9p and a holding member 9s, and control is performed to appropriately displace between the avoidance position and the holding position for each group. That is, each position of the holding member 9p belonging to the first group is switched between the avoidance position and the holding position by the control unit 40 in a synchronous manner.

  Then, independent of the position control of the holding member 9p, the position control of the holding member 9s belonging to the second group is collectively performed. That is, independent of the synchronous control of the holding member 9p, the position of each holding member 9s is switched synchronously between the avoidance position and the holding position. In this case, even if it is the structure provided with many holding members 9, the position control of the holding member 9 can be limited to two lines, Therefore The calculation of the position control by the control part 40 can be simplified.

  Next, a second embodiment of the present invention will be described. In addition, only the same code | symbol is attached | subjected about the same structure as the adhesive tape sticking apparatus which concerns on Example 1, and the control method of the holding member 9 which is a different component is explained in full detail.

  In the first embodiment, the plurality of holding members 9 are divided into two groups, that is, the holding member 9p and the holding member 9s, and the position control is performed for each of the holding members 9p in a lump, and each of the holding members 9s is held. Independent of 9p, the position control is performed collectively. On the other hand, in the second embodiment, each of the holding members 9 is configured to perform position control independently.

  Here, a control method for switching the position of the holding member 9 when the pressure-sensitive adhesive tape T is peeled from the wafer W in the pressure-sensitive adhesive tape peeling step according to the second embodiment will be described. In the second embodiment, the number of the holding members 9 is 10 as in the first embodiment, and each holding member 9 is distinguished by being denoted by reference numerals 9a to 9j as shown in FIG.

  After the alignment is performed by the aligner 5 and the wafer W is transferred to the holding mechanism 6, the control unit 40 moves each of the holding members 9a to 9j from the avoidance position to the holding position. By moving to the holding position, the wafer peripheral edge Wb comes into contact with the groove 41 provided in each of the holding members 9a to 9j, and the wafer W is held from the side. That is, as in the first embodiment, the wafer W can be stably held on the movable stage 8 while avoiding physical contact with the lower surface of the wafer W.

  After the wafer W is held by each of the holding members 9, the movable stage 8 is moved from the initial position to the peeling start position. Then, an operation of peeling the adhesive tape T from the wafer W is performed while moving the movable stage 8 from the peeling start position to the initial position.

  First, as in Example 1, when the movable stage 8 moves to a position where the right end portion of the wafer W is below the peeling member 29, the peeling unit 20 is lowered and the peeling tape Ts is pressed against the right end of the adhesive tape T. Pasted. At this time, if the holding members 9c and 9d are arranged at the holding position, the holding members 9c and 9d interfere with the peeling unit 20, and thus the operation of applying the peeling tape Ts is hindered.

  Therefore, the control unit 40 controls the cylinder 43 to switch the positions of the holding members 9c and 9d from the holding position to the avoidance position, thereby avoiding interference with the peeling unit 20 (FIG. 13 (a)). After the holding members 9c and 9d are moved to the avoidance position, the release tape Ts is attached to the right end portion of the adhesive tape T, and the adhesive tape T is peeled off from the right end portion as a unit with the release tape Ts. At this time, since the holding members 9c and 9d are moved to the avoidance position, it is possible to prevent the peeling tape from coming into contact with the holding members 9c and 9d and causing a peeling error.

  While the movable table 8 is moved further toward the initial position, the peeling tape Ts is folded back by the peeling member 29, whereby the adhesive tape T is peeled from the wafer W integrally with the peeling tape Ts. As peeling of the adhesive tape T proceeds, the boundary line N between the peeled adhesive tape T and the peeled adhesive tape T moves from the right end portion of the wafer W to the left.

  When the boundary line N moves away from the right end of the wafer W and approaches the position F1, the control unit 40 moves the holding members 9c and 9d from the avoidance position to the hold position, and moves the holding members 9b and 9e from the hold position to the avoidance position. (Fig. 13B). By retracting the holding members 9b and 9e to the avoidance position, it is possible to prevent a peeling error of the adhesive tape T from occurring due to a problem such as the adhesive tape T and the holding member 9 contacting at the position F1.

  When the separation process proceeds and the boundary line N approaches the position F2 from the position F1, the control unit 40 moves the holding members 9b and 9e from the avoidance position to the holding position, while moving the holding members 9a and 9f from the holding position. It moves to an avoidance position (FIG.13 (c)). When the boundary line N further moves away from the position F2 and approaches the position F3, the control unit 40 moves the holding members 9a and 9f from the avoidance position to the holding position, and moves the holding members 9g and 9j from the holding position to the avoidance position. (Fig. 13 (d)).

  Finally, when the boundary line N moves away from the position F3 and approaches the left end portion of the wafer W, the control unit 40 moves the holding members 9g and 9j from the avoidance position to the holding position, while holding the holding members 9h and 9i. To the avoidance position. Then, with the holding members 9h and 9i moved from the holding position to the avoidance position, the adhesive tape T is completely peeled from the upper surface of the wafer W (see FIG. 12C). Note that a series of operations for peeling the adhesive tape T in the second embodiment is common to the first embodiment except for a control method of switching each position of the holding member 9 between the holding position and the avoidance position.

  In the configuration according to the second embodiment, each of the holding members 9 is configured to be independently switchable between a holding position and an avoidance position. Then, the holding member 9 close to the position of the boundary line N, that is, the position where the operation of peeling the adhesive tape T from the wafer W is performed is selectively displaced to the avoidance position, and the holding position is separated from the boundary line N. The holding member 9 is moved to the holding position.

  In this case, by moving the holding member 9 whose holding position is close to the boundary line N to the avoidance position, a peeling error due to the contact between the adhesive tape T peeled from the wafer W and the holding member 9 is generated. It can be avoided reliably. All the holding members 9 whose boundary line N and the holding position are separated move to the holding position and hold the peripheral edge Wb of the wafer W. Accordingly, since more holding members 9 come into contact with the peripheral edge portion Wb of the wafer W, the wafer W can be held more stably.

  The present invention is not limited to the above embodiment, and can be modified as follows.

  (1) In each embodiment, the holding member 9 is not limited to the configuration including the groove portion 41. That is, as long as the wafer W can be stably held by contacting the peripheral edge Wb of the wafer, the shape of the holding member 9 may be changed as appropriate. As an example, the holding member 9 may be a bar having a uniform thickness as shown in FIG.

  In this case, when the holding member 9 moves from the avoidance position to the holding position, as shown in FIG. 14B, the flat side surface of the holding member 9 contacts the wafer peripheral edge Wb and presses it toward the center. It is done. Since the force J3 in the direction toward the center portion Wx of the wafer acts on the wafer W, the wafer W is stably held with the lower surface Wa being in non-contact.

  Further, as shown in FIG. 14C, the holding member 9 may include a concave portion 42 having a shape corresponding to the peripheral edge portion Wb of the wafer W, instead of the groove portion 41. The wafer W is held so as to be sandwiched from the side by contacting the peripheral edge Wb of the wafer W with the recess 42 of the holding member 9 in at least three places. Further, when the holding member 9 holds the wafer W, the peripheral edge Wb of the wafer W is fitted in the concave portion 42 of the holding member 9 as shown in FIG.

  Therefore, as in the case where the holding member 9 includes the groove portion 41, even when a vertical force is applied to the wafer W, the peripheral portion Wb of the wafer W is detached from the recess 42 and the wafer W falls. Can be prevented. Therefore, the holding force of the wafer W by the holding member 9 can be further improved.

  (2) In each of the embodiments and modifications, the holding member 9 may include an elastic body. That is, as shown in FIG. 15A, the holding member 9 includes an elastic body 47 at least in a portion that contacts the peripheral edge Wb of the wafer W. Examples of the material constituting the elastic body 47 include elastomers such as rubber. In the modification, the entire holding member 9 may be formed of an elastic body.

  When holding the wafer W by the holding member 9 according to the modification (2), the expansion / contraction operation of the cylinder 43 is controlled in the same manner as each embodiment, and the holding member 9 is moved along the rail 45 from the avoidance position to the holding position. Move. When the position of the holding member 9 is the avoidance position, the holding member 9 is separated from the peripheral edge portion Wb of the wafer (FIG. 15B). In the second embodiment, the holding position of the holding member 9 may be set to a position D1 where the holding member 9 is in contact with the wafer W. However, it is more preferable to set the position D2 slightly inside the position D1 as the holding position.

  When the holding member 9 moves from the avoidance position D0 toward the holding position D2, the elastic body 47 provided on the holding member 9 comes into contact with the peripheral edge portion Wb of the wafer (FIG. 15C), and further the peripheral edge portion of the wafer. The elastic body 47 is elastically deformed according to the shape of Wb (FIG. 15D).

  When the elastic body 47 comes into contact with the peripheral edge Wb of the wafer while being elastically deformed, the holding member 9 comes into contact with the wafer W over the entire peripheral edge Wb regardless of the shape of the peripheral edge Wb of the wafer. That is, since the contact area between the peripheral edge Wb of the wafer W and the holding member 9 becomes wider, the wafer W can be held more stably while avoiding physical contact with the lower surface Wa of the wafer.

  Further, the holding member 9 moving to the holding position D2 is pressed against the wafer W and the elastic body 47 is elastically deformed, so that the holding member 9 moves toward the center Wx from the peripheral edge Wb to the wafer W. Force J3 acts. The action of the force J3 can more reliably avoid the situation in which the wafer W drops away from the holding member 9. Therefore, by setting the holding position at the position D2, the wafer W can be held more stably than when the holding position is set at the position D1.

  (3) In each of the examples and the modifications, the force J1 that acts on the wafer W when the release tape Ts is applied, and the force that acts on the wafer W when the adhesive tape T is peeled from the wafer W together with the release tape Ts. As a configuration for reducing the influence of J4, the suction member 37 and the gas supply pad 10 are provided, but the configuration is not limited thereto. That is, the adsorbing member 37 and the gas supply pad 10 may be omitted, or a configuration that substitutes for the adsorbing member 37 and the gas supply pad 10 may be provided as long as the influence of the forces J1 and J4 is reduced.

  As an example of a configuration that is an alternative to the adsorbing member 37 and the gas supply pad 10, the holding mechanism 6 according to the modification (3) includes a gas flow path 49 as shown in FIG. The gas flow path 49 is embedded in the movable stage 8 and is gathered at the lower part of the movable stage 8. The gas flow path 49 is connected to the gas supply device 53 through the electromagnetic valve 51. The gas flow path 49 is connected to a suction device 57 through an electromagnetic valve 55. By providing such a configuration, the gas flow path 49 supplies or sucks gas through a plurality of holes provided on the surface of the movable stage 8.

  In the configuration according to the modification (3), when attaching the peeling tape Ts, the control unit 40 operates the gas supply device 53 and opens the electromagnetic valve 51, and the gas V is transferred to the wafer W via the gas flow path 49. Spray on the bottom surface. By blowing the gas V onto the lower surface Wa of the wafer W, the wafer W is pushed up by the gas V, so that an upward force J6 is generated with respect to the wafer W. As a result, the influence of the downward force J1 acting on the wafer W when the release tape Ts is applied is reduced by the upward force J6.

  On the other hand, when peeling the adhesive tape T together with the peeling tape Ts from the wafer W, as shown in FIG. 16B, the control unit 40 activates the suction device 57 and opens the electromagnetic valve 55 to open the gas flow path 49. The lower surface of the wafer W is sucked through. By attracting the wafer W from below, the wafer W is drawn downward where the holes 52 are provided, and therefore a downward force J7 acts on the wafer W. As a result, the influence of the upward force J4 acting on the wafer W when the adhesive tape T is peeled from the wafer W is reduced by the downward force J7. As described above, even with the configuration in which the gas is supplied and sucked through the gas channel 51, the deformation of the wafer W due to the force J1 or the force J4 can be avoided.

  (4) In each of the examples and modifications, the adhesive tape T is peeled off in a state where the circuit surface facing downward is in a non-contact state with the back surface to which the adhesive tape T is attached facing upward. Although illustrated, it is not restricted to this. The present invention can be appropriately used for a configuration in which the adhesive tape T attached to the other surface of the wafer W is peeled off while reliably avoiding physical contact with the one surface of the wafer W.

  An example of a configuration that requires the adhesive tape to be peeled from the other surface while making one surface non-contact includes the following cases. After the circuit pattern is formed on the front surface of the wafer W, an adhesive tape for circuit protection is attached to the front surface, and a back grind process is performed on the back surface of the wafer W to reduce the thickness. After the wafer W is thinned, various processes such as a coating process may be performed on the back surface of the wafer W while peeling off the protective adhesive tape from the surface.

  In this case, if the holding table or the like is in contact with the back surface of the wafer when the adhesive tape is peeled off from the front surface of the wafer, there is a problem with subsequent coating processing due to dust or polishing debris on the holding table. There are concerns about the occurrence. Therefore, by applying the configuration of the present invention, the holding member 9 is brought into contact with the peripheral edge Wb of the wafer W while the back surface of the wafer W is faced downward, and the surface of the wafer W facing upward is protected. The adhesive tape can be peeled off. As a result, since the wafer W can be stably held without making physical contact with the back surface of the wafer W, the adhesive tape can be peeled from the surface of the wafer W with high accuracy, and the occurrence of problems in the subsequent back surface processing can be prevented. .

  (5) In each of the embodiments and the modified examples, the apparatus for peeling the adhesive tape T attached to the workpiece is exemplified using the wafer W as a workpiece, but the workpiece is not limited to the wafer W. In addition to the wafer W made of various materials such as gallium and arsenic compounds or silicon, various articles such as a ring frame, a glass substrate, a ceramic substrate, and an organic material substrate such as an FPC can be used as the work. .

  (6) In each of the examples and the modifications, the configuration in which the position of the peeling mechanism 7 is fixed and the adhesive mechanism T is peeled from the wafer W by moving the holding mechanism 6 horizontally in the x direction is illustrated. The configuration is not limited to moving the holding mechanism 6. As long as the holding mechanism 6 is moved relative to the peeling mechanism 7, the holding mechanism 6 may be fixed and the peeling mechanism 7 may move horizontally, or both may move. Good.

  (7) In each of the embodiments and the modified examples, the wafer holding unit 4b has exemplified the configuration using the Bernoulli chuck, but is not limited thereto. In particular, when the wafer W to which the adhesive tape T is attached is transferred to the holding mechanism 6, the wafer holder 4 b may be transferred with the surface of the adhesive tape T being sucked and held.

DESCRIPTION OF SYMBOLS 1 ... Adhesive tape peeling apparatus 2 ... Wafer supply part 3 ... Wafer collection | recovery part 4 ... Transfer mechanism 5 ... Aligner 6 ... Holding mechanism 7 ... Peeling mechanism 8 ... Movable stage 9 ... Holding member 10 ... Gas supply pad 17 ... Tape supply part 19 DESCRIPTION OF SYMBOLS ... Tape collection part 20 ... Peeling unit 29 ... Peeling member 31 ... Guide roller 40 ... Control part 41 ... Groove part 43 ... Cylinder 45 ... Rail T ... Adhesive tape W ... Semiconductor wafer Wa ... Wafer lower surface Wb ... Wafer peripheral part

Claims (18)

An adhesive tape peeling method for peeling an adhesive tape attached to a workpiece,
A transporting process for transporting the workpiece to a peeling position;
A holding process of holding the workpiece at the peeling position by the holding member coming into contact with the peripheral edge of the workpiece conveyed to the peeling position;
A peeling process in which the pressure-sensitive adhesive tape is peeled off integrally with the peeling tape from the workpiece held at the peeling position by peeling off the peeling tape while being attached to the pressure-sensitive adhesive tape by a peeling member and turning back. When,
A pressure-sensitive adhesive tape peeling method comprising: The pressure-sensitive adhesive tape peeling method according to claim 1,
The holding process includes
The pressure-sensitive adhesive tape is characterized in that each of the holding members in contact with the peripheral edge of the work applies a force to the work from the peripheral edge to the center of the work. Peeling method. The pressure-sensitive adhesive tape peeling method according to claim 2,
The holding process includes
The pressure-sensitive adhesive is characterized in that the holding member is held at the peeling position while controlling the magnitude of the force that each of the holding members acts from the peripheral edge portion toward the central portion of the workpiece so as to have an appropriate magnitude. Tape peeling method. It is the adhesive tape peeling method in any one of Claim 1 thru | or 3, Comprising:
The holding member includes an elastic body,
The holding process includes
The pressure-sensitive adhesive tape peeling method, wherein the elastic body is held in contact with a peripheral portion of the work and elastically deformed to hold the work. It is the adhesive tape peeling method in any one of Claim 1 thru | or 4, Comprising:
The holding member is
The holding position that contacts the peripheral edge of the workpiece and the avoidance position that can avoid contact with the adhesive tape peeled from the workpiece are configured to be appropriately movable,
The peeling process includes
The pressure-sensitive adhesive tape peeling method, wherein the pressure-sensitive adhesive tape is peeled off from the workpiece while appropriately switching the positions of the plurality of holding members between the holding position and the avoidance position. It is the adhesive tape peeling method in any one of Claim 1 thru | or 5, Comprising:
The peeling process includes
When adhering the release tape to the adhesive tape, the adhesive tape is adsorbed by an adsorbing member to prevent deformation of the workpiece due to force generated when the release tape is applied. Adhesive tape peeling method. It is the adhesive tape peeling method in any one of Claim 1 thru | or 6, Comprising:
The peeling process includes
When the release tape is affixed to the adhesive tape, gas is blown onto the work by a first gas supply mechanism to prevent deformation of the work due to a force generated when the release tape is affixed. How to remove the adhesive tape. It is the adhesive tape peeling method in any one of Claim 1 thru | or 7, Comprising:
The peeling process includes
When the adhesive tape is peeled from the workpiece, the workpiece is sucked in a non-contact state by a suction mechanism, and deformation of the workpiece due to a force generated when the adhesive tape is peeled is prevented. How to remove the adhesive tape. It is the adhesive tape peeling method in any one of Claims 1 thru | or 8, Comprising:
The peeling process includes
When the pressure-sensitive adhesive tape is peeled from the work, gas is blown onto the work by a second gas supply mechanism to prevent deformation of the work due to force generated when the pressure-sensitive adhesive tape is peeled off. Adhesive tape peeling method. An adhesive tape peeling device for peeling an adhesive tape attached to a workpiece,
A transport mechanism for transporting the workpiece to a peeling position;
A holding member that holds the workpiece in the peeling position by contacting the peripheral edge of the workpiece conveyed to the peeling position;
A peeling mechanism that peels the adhesive tape integrally with the peeling tape from the work held at the peeling position by peeling the peeling tape while attaching the peeling tape to the pressure-sensitive adhesive tape by a peeling member. When,
An adhesive tape peeling device comprising: The pressure-sensitive adhesive tape peeling device according to claim 10,
A pressing mechanism for holding the work by applying a force from each of the holding members in contact with the peripheral part of the work to the central part from the peripheral part of the work to the work is provided. Adhesive tape peeling device. It is an adhesive tape peeling apparatus of Claim 11, Comprising:
A pressure-sensitive adhesive tape peeling device comprising: a control mechanism that controls the magnitude of the force that each of the holding members acts from the peripheral edge to the center of the workpiece. It is an adhesive tape peeling apparatus in any one of Claims 10 thru | or 12, Comprising:
The holding member includes an elastic body,
The pressure-sensitive adhesive tape peeling apparatus, wherein the elastic body holds the work by elastically deforming by contacting a peripheral edge of the work. It is an adhesive tape peeling apparatus in any one of Claims 10 thru | or 13, Comprising:
A driving mechanism that appropriately moves the holding member in contact with the peripheral edge of the work and an avoidance position that can avoid contact with the adhesive tape peeled from the work;
The pressure-sensitive adhesive tape peeling device, wherein the peeling mechanism peels the pressure-sensitive adhesive tape from the workpiece while the drive mechanism appropriately switches the positions of the plurality of holding members between the holding position and the avoidance position. The pressure-sensitive adhesive tape peeling device according to any one of claims 10 to 14,
An adsorbing member that adsorbs the adhesive tape when the peeling tape is affixed to the adhesive tape, and prevents deformation of the workpiece due to the force generated when the peeling mechanism affixes the peeling tape. Features an adhesive tape peeling device. The pressure-sensitive adhesive tape peeling device according to any one of claims 10 to 15,
A first gas supply mechanism that blows gas to the work when the release tape is attached to the adhesive tape, and prevents deformation of the work caused by a force generated when the release mechanism attaches the release tape; A pressure-sensitive adhesive tape peeling device comprising: The pressure-sensitive adhesive tape peeling device according to any one of claims 10 to 16,
A suction mechanism that sucks the workpiece in a non-contact state when peeling the adhesive tape from the workpiece, and prevents deformation of the workpiece due to a force generated when the peeling mechanism peels the adhesive tape; A pressure-sensitive adhesive tape peeling device comprising: The pressure-sensitive adhesive tape peeling device according to any one of claims 10 to 17,
A second gas supply mechanism is provided that blows gas to the work when the adhesive tape is peeled from the work, and prevents deformation of the work caused by the force generated when the peeling mechanism peels the adhesive tape. An adhesive tape peeling apparatus characterized by the above.

Images