CN110556328A - Adhesive tape peeling method and adhesive tape peeling apparatus - Google Patents

Adhesive tape peeling method and adhesive tape peeling apparatus Download PDF

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Publication number
CN110556328A
CN110556328A CN201910472744.6A CN201910472744A CN110556328A CN 110556328 A CN110556328 A CN 110556328A CN 201910472744 A CN201910472744 A CN 201910472744A CN 110556328 A CN110556328 A CN 110556328A
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CN
China
Prior art keywords
adhesive tape
peeling
wafer
workpiece
holding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201910472744.6A
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Chinese (zh)
Inventor
奥野长平
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ridong Precision Machine Co Ltd
Nitto Kogyo Co Ltd
Nitto Denko Corp
Original Assignee
Ridong Precision Machine Co Ltd
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ridong Precision Machine Co Ltd, Nitto Denko Corp filed Critical Ridong Precision Machine Co Ltd
Publication of CN110556328A publication Critical patent/CN110556328A/en
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
    • H01L2221/68386—Separation by peeling
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/35—Mechanical effects
    • H01L2924/351—Thermal stress
    • H01L2924/3512—Cracking
    • H01L2924/35121—Peeling or delaminating

Abstract

The invention provides an adhesive tape stripping method and an adhesive tape stripping device, which can reliably avoid physical contact with one surface of a wafer and can properly strip the adhesive tape adhered to the other surface of the wafer. After the wafer is conveyed to the upper side of the movable table, a plurality of holding members provided on the movable table are brought into contact with the peripheral edge portion of the wafer from the outside, and the adhesive tape is peeled from the upward surface while maintaining the contact state. The wafer is held by the contact of the holding members so that the peripheral edge portion of the wafer is sandwiched from a plurality of directions. Further, since the holding member is brought into contact from the side, the lower surface of the wafer is not brought into contact with a member such as the surface of the movable table. Therefore, the adhesive tape can be peeled from the upper surface of the wafer with high accuracy while stably holding the wafer while avoiding physical contact with the lower surface of the wafer.

Description

Adhesive tape peeling method and adhesive tape peeling apparatus
Technical Field
The present invention relates to an adhesive tape peeling method and an adhesive tape peeling apparatus for peeling an adhesive tape, such as a protective tape for circuit protection, which is bonded to a semiconductor wafer (hereinafter referred to as a "wafer" where appropriate).
Background
After the circuit pattern is formed on the front surface of the wafer, an adhesive tape (protective tape) for protecting the circuit is joined to the circuit surface, and the back surface of the wafer is polished by a back surface polishing step. When the back grinding process is completed, the protective tape is peeled off from the wafer, and the wafer is divided into a plurality of chip parts by a dicing process. In this case, in order to prevent the chip components from scattering in the dicing step, an adhesive tape for support (support tape) is attached to the back surface of the wafer and the ring frame so as to be integrated therewith before the dicing step.
As an example of a conventional method for separating an adhesive tape, such as a protective tape or a support tape, from a wafer, the following method is performed. That is, the wafer is sucked and held on the holding table with the surface to which the adhesive tape is attached facing upward. Then, while rolling the application roller, an adhesive tape for peeling (release tape) is applied to the adhesive tape. Then, the release tape is reversed and peeled off by a plate-shaped edge member having a tapered tip, and the adhesive tape adhered to the release tape is peeled off integrally from the upper surface of the wafer (see, for example, patent document 1).
In this method, the wafer is sucked and held with its entire lower surface in contact with the holding table. On the other hand, when the adhesive tape attached to the non-circuit surface of the wafer is peeled off with the circuit surface of the wafer facing downward, it is preferable to avoid the holding stage and the like from physically contacting the circuit surface of the wafer facing downward when the adhesive tape is peeled off from the upper surface of the wafer.
As a method for holding a wafer while avoiding physical contact with a circuit surface of the wafer, the following method can be cited. That is, the holding table has a wafer holding portion formed of an annular convex portion, and the wafer holding portion is brought into contact with and attracted to an outer peripheral portion of a lower surface of the wafer. Since a circuit is not formed in the outer peripheral portion of the wafer in general, the outer peripheral portion of the lower surface of the wafer is held by suction by the wafer holding portion, whereby the wafer can be stably held while suppressing an influence on the circuit (see, for example, patent document 2).
Patent document 1: japanese laid-open patent publication No. 2002-124494
Patent document 2: japanese patent laid-open publication No. 2016-46437
Disclosure of Invention
Problems to be solved by the invention
However, the conventional apparatus described above has the following problems.
That is, in the conventional structure, when a wafer is placed on a holding table having an annular convex portion, the wafer may be displaced from a predetermined position. In this case, a portion of the lower surface of the wafer on which the circuit is formed may unexpectedly come into physical contact with the annular projection of the holding stage, resulting in damage to the circuit. As described above, in the conventional structure, when the adhesive tape is peeled from the upper surface of the wafer, it is difficult to reliably avoid physical contact with the lower surface of the wafer.
The present invention has been made in view of the above circumstances, and a main object thereof is to provide an adhesive tape peeling method and an adhesive tape peeling apparatus capable of reliably avoiding physical contact with one surface of a wafer and appropriately peeling an adhesive tape adhered to the other surface of the wafer.
Means for solving the problems
To achieve the above object, the present invention has the following configuration.
That is, a method for peeling an adhesive tape adhered to a work,
The adhesive tape peeling method is characterized by comprising the following steps:
a conveying process in which the workpiece is conveyed to a peeling position;
A holding process of holding the work at the peeling position by a holding member being brought into contact with a peripheral edge portion of the work conveyed to the peeling position; and
And a peeling step of peeling a peeling tape while the peeling tape is attached to the adhesive tape by a peeling member and folded back, thereby peeling the adhesive tape and the peeling tape integrally from the work held at the peeling position.
According to this configuration, after the work is conveyed to the peeling position, the holding member comes into contact with the peripheral edge portion of the work, and the work is held in the peeling position in a stable state. In this case, the holding member and the like can be prevented from coming into direct physical contact with the upper and lower surfaces of the workpiece. Then, in a state where the peripheral edge portion of the workpiece is held by the holding member, the release tape is attached to the adhesive tape attached to the workpiece, and the adhesive tape and the release tape are integrally released.
That is, even if the holding member or the like does not contact the surface of the workpiece to which the adhesive tape is not attached, the adhesive tape can be peeled from the workpiece in a state where the workpiece is stably held. Therefore, when the adhesive tape is peeled, it is possible to reliably avoid the occurrence of a trouble caused by physical contact between the holding member and the surface of the workpiece.
in the above invention, it is preferable that each of the holding members which is in contact with the peripheral edge portion of the workpiece holds the workpiece by applying a force to the workpiece from the peripheral edge portion toward the central portion of the workpiece in the holding process.
according to this configuration, the workpiece is held by the respective holding members urging the workpiece from the peripheral edge portion toward the central portion of the workpiece. In this case, the workpiece is held more stably by the respective forces acting toward the central portion of the workpiece. Therefore, even if the adhesive tape does not physically contact the surface of the workpiece, the workpiece can be more reliably prevented from being displaced in the process of peeling the adhesive tape.
In the above invention, it is preferable that the holding member holds the work at the peeling position while controlling the magnitude of the force acting from the peripheral edge portion to the central portion of the work to an appropriate magnitude. In this case, the magnitude of the force acting from the peripheral edge portion toward the central portion of the workpiece by each of the holding members is controlled to be an appropriate magnitude. Therefore, it is possible to more reliably avoid troubles occurring during the holding of the workpiece, such as deformation of the workpiece due to excessive force application, dropping of the workpiece due to insufficient force application, and the like.
In the above invention, it is preferable that the holding member has an elastic body, and the work is held by the elastic body being elastically deformed by being brought into contact with a peripheral edge portion of the work in the holding process.
according to this configuration, the elastic body provided in the holding member is elastically deformed by being in contact with the peripheral edge portion of the workpiece, whereby the workpiece is held. At this time, the elastic body is elastically deformed in accordance with the shape of the peripheral edge portion of the workpiece, and thus the portion of the holding member that contacts the peripheral edge portion of the workpiece becomes larger. Thus, the holding member can hold the workpiece more stably.
In the above invention, it is preferable that the holding member is configured to be capable of being appropriately moved between a holding position in contact with a peripheral edge portion of the workpiece and an avoidance position capable of avoiding contact with the adhesive tape peeled from the workpiece, and the positions of the plurality of holding members are appropriately switched between the holding position and the avoidance position and the adhesive tape is peeled from the workpiece in the peeling process.
With this configuration, the holding member can be appropriately moved between the holding position and the avoidance position. The holding member is in contact with the peripheral edge portion of the workpiece at the holding position, and the holding member can avoid contact with the adhesive tape peeled from the workpiece at the avoidance position. Then, the position of the holding member is switched between the holding position and the avoiding position as appropriate, and the adhesive tape is peeled from the workpiece.
That is, the holding member can be moved to the avoidance position at the position where the adhesive tape is peeled from the workpiece, so that the holding member located at a position other than the position where the adhesive tape is peeled from the workpiece can be moved to the holding position while avoiding contact between the adhesive tape and the holding member. Therefore, when the adhesive tape is peeled from the workpiece, the workpiece can be stably held by the holding member moved to the holding position, and the occurrence of a peeling error due to contact between the adhesive tape peeled from the workpiece and the holding member can be reliably prevented.
In the above invention, it is preferable that the peeling process includes sucking the adhesive tape by a suction member when the peeling tape is attached to the adhesive tape, thereby preventing deformation of the work due to a force generated when the peeling tape is attached.
According to this configuration, when the release tape is attached to the adhesive tape, the adhesive tape is attracted by the attraction member. By this suction, the work is prevented from being deformed by a force generated when the release tape is attached. Therefore, the quality of the work can be more reliably prevented from being degraded and the occurrence of a peeling error of the adhesive tape can be more reliably prevented.
in the above invention, it is preferable that, in the peeling process, the first gas supply means blow gas to the workpiece when the peeling tape is attached to the adhesive tape, so that deformation of the workpiece due to a force generated when the peeling tape is attached is prevented.
According to this configuration, when the release tape is attached to the pressure-sensitive adhesive tape, the gas is blown to the workpiece by the 1 st gas supply mechanism. By blowing the gas, the workpiece can be prevented from being deformed when the release tape is stuck. Therefore, the quality of the work can be more reliably prevented from being degraded and the occurrence of a peeling error of the adhesive tape can be more reliably avoided.
In the above invention, it is preferable that the work is sucked in a non-contact state by a suction mechanism when the adhesive tape is peeled from the work in the peeling process, and deformation of the work due to a force generated when the adhesive tape is peeled is prevented.
According to this configuration, when the adhesive tape is peeled from the workpiece, the workpiece is sucked in a non-contact state by the suction mechanism. By this suction, the workpiece is prevented from being deformed by a force generated when the adhesive tape is peeled from the workpiece. Therefore, the quality of the work can be more reliably prevented from being degraded and the occurrence of a peeling error of the adhesive tape can be more reliably prevented.
Further, in the above-described invention, it is preferable that, in the peeling process, gas is blown to the workpiece by the 2 nd gas supply mechanism at the time of peeling the adhesive tape from the workpiece, so that deformation of the workpiece due to a force generated at the time of peeling the adhesive tape is prevented.
According to this configuration, when the adhesive tape is peeled from the workpiece, the 2 nd gas supply means blows gas to the workpiece. By blowing the gas, deformation of the workpiece when the adhesive tape is peeled from the workpiece can be prevented. Therefore, the quality of the work can be more reliably prevented from being degraded and the occurrence of a peeling error of the adhesive tape can be more reliably avoided.
In order to achieve the above object, the present invention may have the following configuration.
That is, an adhesive tape peeling apparatus for peeling an adhesive tape stuck to a work,
The adhesive tape stripping device is characterized by comprising:
a conveying mechanism that conveys the workpiece to a peeling position;
A holding member that holds the work at the peeling position by contacting a peripheral edge portion of the work conveyed to the peeling position; and
And a peeling mechanism configured to peel the release tape from the work held at the peeling position by peeling the release tape while the release tape is attached to the adhesive tape by a peeling member and folded back, thereby integrally peeling the adhesive tape and the release tape.
According to this configuration, after the conveying mechanism conveys the workpiece to the peeling position, the holding member is brought into contact with the peripheral edge portion of the workpiece, thereby holding the workpiece in the peeling position in a stable state. In this case, the holding member and the like can be prevented from coming into direct physical contact with the upper and lower surfaces of the workpiece. The peeling mechanism attaches a peeling tape to the adhesive tape attached to the work in a state where the peripheral edge portion of the work is held by the holding member, and integrally peels the adhesive tape and the peeling tape.
That is, even if the holding member or the like does not contact the surface of the workpiece to which the adhesive tape is not attached, the adhesive tape can be peeled from the workpiece in a state where the workpiece is stably held. Therefore, when the adhesive tape is peeled, the occurrence of a defect due to physical contact between the holding member and the surface of the workpiece can be reliably avoided.
In the above invention, it is preferable that the adhesive tape peeling apparatus includes a pressing mechanism for holding the work by urging the work from the peripheral edge portion toward the central portion of the work by the holding members in contact with the peripheral edge portion of the work.
According to this configuration, the pressing mechanism is provided, and the pressing mechanism presses the workpiece from the peripheral edge portion toward the central portion of the workpiece from the respective holding members. In this case, the workpiece is held more stably by the respective forces acting on the center portion of the workpiece by the pressing mechanism. Therefore, even if the adhesive tape does not physically contact the surface of the workpiece, the workpiece can be more reliably prevented from being displaced during the peeling of the adhesive tape.
In the above invention, it is preferable that the adhesive tape peeling apparatus includes a control means for controlling the magnitude of the force applied from the peripheral edge portion to the central portion of the workpiece by each of the holding members to an appropriate magnitude. In this case, the magnitude of the force acting from the peripheral edge portion toward the central portion of the workpiece by each of the holding members is controlled to be an appropriate magnitude by the control means. Therefore, it is possible to more reliably avoid the problem that occurs during the holding of the workpiece, such as the workpiece being deformed by the excessive force and the workpiece falling due to the insufficient force.
In the above invention, it is preferable that the holding member includes an elastic body that is in contact with a peripheral edge portion of the workpiece and elastically deforms to hold the workpiece.
With this configuration, the elastic body provided in the holding member is elastically deformed by being in contact with the peripheral edge portion of the workpiece, and the workpiece is held. At this time, the elastic body is elastically deformed in accordance with the shape of the peripheral edge portion of the workpiece, and therefore, the portion of the holding member that contacts the peripheral edge portion of the workpiece becomes larger. Thus, the holding member can hold the workpiece more stably.
In the above invention, it is preferable that the adhesive tape peeling device includes a driving mechanism that appropriately moves the holding member between a holding position where the holding member is in contact with the peripheral edge portion of the workpiece and a avoiding position where the holding member is prevented from being in contact with the adhesive tape peeled from the workpiece, the driving mechanism appropriately switches positions of the plurality of holding members between the holding position and the avoiding position, and the peeling mechanism peels the adhesive tape from the workpiece.
With this configuration, the holding member can be appropriately moved between the holding position and the avoidance position by the driving mechanism. The holding member is in contact with the peripheral edge of the workpiece at the holding position, and the holding member is prevented from being in contact with the adhesive tape peeled from the workpiece at the avoiding position. Then, the position of the holding member is switched between the holding position and the avoiding position by the driving mechanism as appropriate, and the adhesive tape is peeled from the workpiece.
That is, the holding member can be moved to the avoidance position at the position where the adhesive tape is peeled from the workpiece, so that the holding member located at a position other than the position where the adhesive tape is peeled from the workpiece can be moved to the holding position while avoiding contact between the adhesive tape and the holding member. Therefore, when the adhesive tape is peeled from the workpiece, the workpiece can be stably held by the holding member moved to the holding position, and the occurrence of a peeling error due to contact between the adhesive tape peeled from the workpiece and the holding member can be reliably prevented.
in the above invention, it is preferable that the adhesive tape peeling apparatus includes an adsorbing member that adsorbs the adhesive tape when the peeling tape is attached to the adhesive tape, and prevents deformation of the work due to a force generated when the peeling mechanism attaches the peeling tape.
According to this configuration, when the release tape is attached to the adhesive tape, the adhesive tape is attracted by the attraction member. By this suction, the work is prevented from being deformed by a force generated when the release tape is attached. Therefore, the quality of the work can be more reliably prevented from being degraded and the occurrence of a peeling error of the adhesive tape can be more reliably prevented.
in the above invention, it is preferable that the adhesive tape peeling apparatus includes a 1 st gas supply mechanism that blows a gas to the workpiece when the peeling tape is attached to the adhesive tape, so as to prevent deformation of the workpiece due to a force generated when the peeling mechanism attaches the peeling tape.
According to this configuration, when the release tape is attached to the pressure-sensitive adhesive tape, the gas is blown to the workpiece by the 1 st gas supply mechanism. By blowing the gas, deformation of the workpiece at the time of attaching the release tape can be prevented. Therefore, the quality of the work can be more reliably prevented from being degraded and the occurrence of a peeling error of the adhesive tape can be more reliably avoided.
In the above invention, it is preferable that the adhesive tape peeling apparatus includes a suction mechanism which sucks the workpiece in a non-contact state when the adhesive tape is peeled from the workpiece, and prevents deformation of the workpiece due to a force generated when the peeling mechanism peels the adhesive tape.
according to this configuration, when the adhesive tape is peeled from the workpiece, the workpiece is sucked in a non-contact state by the suction mechanism. By this suction, the workpiece is prevented from being deformed by a force generated when the adhesive tape is peeled from the workpiece. Therefore, the quality of the work can be more reliably prevented from being degraded and the occurrence of a peeling error of the adhesive tape can be more reliably prevented.
In the above invention, it is preferable that the adhesive tape peeling apparatus includes a 2 nd gas supply mechanism that blows a gas to the workpiece when the adhesive tape is peeled from the workpiece by the 2 nd gas supply mechanism, so as to prevent deformation of the workpiece due to a force generated when the peeling mechanism peels the adhesive tape.
According to this configuration, when the adhesive tape is peeled from the workpiece, the 2 nd gas supply means blows gas to the workpiece. By blowing the gas, deformation of the workpiece when the adhesive tape is peeled from the workpiece can be prevented. Therefore, the quality of the work can be more reliably prevented from being degraded and the occurrence of a peeling error of the adhesive tape can be more reliably avoided.
ADVANTAGEOUS EFFECTS OF INVENTION
According to the adhesive tape peeling method and the adhesive tape peeling apparatus of the present invention, the wafer can be held at the peeling position in a stable state by holding the peripheral edge portion of the wafer by the holding member. The adhesive tape attached to the wafer can be peeled off while the wafer is held at the peeling position. Therefore, the adhesive tape attached to the other surface of the wafer can be appropriately peeled while avoiding physical contact with the one surface of the wafer with certainty.
Drawings
Fig. 1 is a plan view showing a basic structure of an adhesive tape peeling apparatus of example 1.
Fig. 2 is a front view showing the basic structure of the holding mechanism and the peeling mechanism of embodiment 1.
fig. 3 is a plan view showing the basic structure of the holding mechanism and the peeling mechanism in example 1.
Fig. 4 is a diagram showing the structure of the holding mechanism of embodiment 1.
Fig. 4 (a) is a vertical sectional view showing a state in which the holding member moves to the avoidance position, fig. 4 (b) is a vertical sectional view showing a state in which the holding member moves to the holding position, and fig. 4 (c) is a plan view showing a positional relationship between the holding member moving to the avoidance position and the holding member moving to the holding position.
Fig. 5 is a plan view showing a position pattern of the holding member in example 1.
Fig. 5 (a) is a plan view showing a 1 st mode, fig. 5 (b) is a plan view showing a 2 nd mode, fig. 5 (c) is a plan view showing a 3 rd mode, and fig. 5 (d) is a plan view showing a 4 th mode.
fig. 6 is a front view showing the operation of the adhesive tape peeling apparatus of example 1.
fig. 6 (a) is a front view showing a state in which the transport mechanism is moved to the wafer supply portion, and fig. 6 (b) is a front view showing a state in which the alignment pin of the wafer holding portion is moved from the initial position to align the wafer held by the wafer holding portion.
Fig. 7 is a diagram showing the operation of the adhesive tape peeling apparatus of example 1.
Fig. 7 (a) is a front view showing a state where the wafer is conveyed to the positioner, and fig. 7 (b) is a front view showing a state where the wafer is aligned by the alignment pins.
Fig. 8 is a diagram showing the operation of the adhesive tape peeling apparatus of example 1.
Fig. 8 (a) is a vertical cross-sectional view showing a state where the wafer is conveyed to the holding mechanism, fig. 8 (b) is a vertical cross-sectional view showing a state where the wafer is held by bringing the holding member into contact with the peripheral edge portion of the wafer, and fig. 8 (c) is a vertical cross-sectional view showing a state where a force from the peripheral edge portion toward the central portion acts on the wafer from the holding member in contact with the wafer, thereby holding the wafer more stably.
Fig. 9 is a diagram showing the operation of the adhesive tape peeling apparatus of example 1.
Fig. 9 (a) is a plan view showing an arrangement pattern of the holding member in a state where the movable table is moved to the peeling start position, fig. 9 (b) is a vertical sectional view showing a state where the peeling tape is attached to the adhesive tape, and fig. 9 (c) is a plan view showing a positional relationship between the holding member and the peeling unit in a state where the peeling tape is attached to the adhesive tape.
Fig. 10 is a diagram showing the operation of the adhesive tape peeling apparatus of example 1.
Fig. 10 (a) is a vertical sectional view showing a state where the peeling unit peels the adhesive tape and the peeling tape together, and fig. 10 (b) is a plan view showing a positional relationship of the holding member in the state of (a) and a range where the adhesive tape remains on the wafer.
Fig. 11 is a diagram showing the operation of the adhesive tape peeling apparatus of example 1.
Fig. 11 (a) is a plan view showing the positional relationship of the holding member when the boundary between the adhesive tape before peeling and the adhesive tape after peeling is located in the vicinity of F1, (b) of fig. 11 is a plan view showing the positional relationship of the holding member when the boundary between the adhesive tape before peeling and the adhesive tape after peeling is located away from F1, (c) of fig. 11 is a plan view showing the positional relationship of the holding member when the boundary between the adhesive tape before peeling and the adhesive tape after peeling is located in the vicinity of F2, and (d) of fig. 11 is a plan view showing the positional relationship of the holding member when the boundary between the adhesive tape before peeling and the adhesive tape after peeling is located away from F2.
Fig. 12 is a diagram showing the operation of the adhesive tape peeling apparatus of example 1.
Fig. 12 (a) is a plan view showing the positional relationship of the holding member when the boundary between the adhesive tape before peeling and the adhesive tape after peeling is located in the vicinity of F3, fig. 12 (b) is a plan view showing the positional relationship of the holding member when the boundary between the adhesive tape before peeling and the adhesive tape after peeling is located in the vicinity of the left end of the wafer, and fig. 12 (c) is a vertical sectional view showing a state where the adhesive tape is completely peeled from the wafer.
Fig. 13 is a diagram showing the operation of the adhesive tape peeling apparatus of example 2.
fig. 13 (a) is a plan view showing the positional relationship of the holding member in a state where the release tape is bonded to the adhesive tape, fig. 13 (b) is a plan view showing the positional relationship of the holding member in a case where the boundary between the adhesive tape before release and the adhesive tape after release is located in the vicinity of F1, fig. 13 (c) is a plan view showing the positional relationship of the holding member in a case where the boundary between the adhesive tape before release and the adhesive tape after release is located in the vicinity of F2, and fig. 13 (d) is a plan view showing the positional relationship of the holding member in a case where the boundary between the adhesive tape before release and the adhesive tape after release is located in the vicinity of F3.
Fig. 14 is a diagram showing a structure of a holding member according to a modification.
Fig. 14 (a) is a vertical cross-sectional view showing a state where the holding members having the same thickness are arranged at the avoidance position, fig. 14 (b) is a vertical cross-sectional view showing a state where the holding members having the same thickness are moved to the holding position and hold the wafer, fig. 14 (c) is a vertical cross-sectional view showing a state where the holding member having the recess is arranged at the avoidance position, and fig. 14 (d) is a vertical cross-sectional view showing a state where the holding member having the recess is moved to the holding position and holds the wafer.
fig. 15 is a diagram showing a structure of a holding member according to a modification.
fig. 15 (a) is a perspective view of the holding member, fig. 15 (b) is a vertical cross-sectional view showing a state in which the holding member is disposed at the avoidance position, fig. 15 (c) is a vertical cross-sectional view showing a state in which the elastic body of the holding member is in contact with the peripheral edge portion of the wafer, and fig. 15 (d) is a vertical cross-sectional view showing a state in which the elastic body of the holding member is in contact with the peripheral edge portion of the wafer and is elastically deformed.
Fig. 16 is a diagram illustrating a modified example of the adhesive tape peeling apparatus.
Fig. 16 (a) is a vertical sectional view showing a state in which gas is blown to the lower surface of the wafer through the gas flow path when the release tape is attached to the adhesive tape, and fig. 16 (b) is a vertical sectional view showing a state in which the lower surface of the wafer is sucked through the gas flow path when the adhesive tape and the release tape are integrally released.
Description of the reference numerals
1. An adhesive tape stripping device; 2. a wafer supply section; 3. a wafer recovery unit; 4. a conveying mechanism; 5. a positioner; 6. a holding mechanism; 7. a peeling mechanism; 8. a movable table; 9. a holding member; 10. a gas supply gasket; 17. a tape supply section; 19. a belt recovery unit; 20. a peeling unit; 29. a peeling member; 31. a guide roller; 40. a control unit; 41. a groove part; 43. a cylinder body; 45. a guide rail; t, an adhesive tape; w, a semiconductor wafer; wa, the lower surface of the wafer; wb, the peripheral edge of the wafer.
Detailed Description
[ example 1 ]
Embodiments of the present invention are described below with reference to the drawings. Fig. 1 is a plan view showing a basic structure of an adhesive tape peeling apparatus 1 of example 1. In the drawings showing the adhesive tape joining apparatus 1, the supporting member for supporting various structures, the driving member for driving various structures, and the like are appropriately omitted from the drawings.
In the adhesive tape peeling apparatus 1 of embodiment 1, a structure in which the adhesive tape T is peeled from the semiconductor wafer W having the adhesive tape T attached to the back surface thereof (hereinafter, simply referred to as "wafer W") is taken as an example of a structure in which the adhesive tape is peeled from the workpiece. That is, in example 1, the wafer W corresponds to the workpiece of the present invention. Further, a circuit pattern is formed on the surface of the wafer W.
< description of the overall Structure >
as shown in fig. 1, the adhesive tape peeling apparatus 1 of the present embodiment includes a wafer supply unit 2, a wafer recovery unit 3, a wafer conveyance mechanism 4, a positioner 5, a holding mechanism 6, and a peeling mechanism 7.
the wafer supply unit 2 is loaded with a cassette C1. The wafers W with the adhesive tape T adhered to the back surface thereof are inserted in a horizontal posture with the back surface facing upward and stored in the cassette C1 in multiple stages. The wafer storage 3 is loaded with a cassette C2. The wafers W with the adhesive tapes T peeled off from the back surface are inserted in multiple stages in a horizontal posture with the back surface facing upward and stored in the cassette C2.
The robot arm 4a provided in the wafer transfer mechanism 4 is configured to be horizontally movable forward and backward, and configured to be capable of moving up and down in addition to rotating as a whole. The front end of the robot arm 4a has a horseshoe-shaped wafer holding portion 4 b. Preferably, the wafer holding portion 4b is a bernoulli chuck, and holds the back surface of the wafer W in a non-contact manner in an overhanging manner.
Specifically, as shown in fig. 6, a plurality of gas supply pads 4c are provided on the lower surface of the wafer holding portion 4 b. The gas supply gasket 4c is connected to a gas supply mechanism, not shown. Gas is blown from the wafer holding portion 4b to the back surface of the upward wafer W through the gas supply pad 4c, so that a negative pressure region is formed between the wafer W and the wafer holding portion 4b, and the wafer holding portion 4b holds the back surface of the wafer W in a non-contact state in a suspended manner.
A plurality of alignment pins 4d are provided upright on a predetermined circumference of the lower surface of the wafer holding portion 4 b. Each alignment pin 4d is configured to be capable of reciprocating toward the center of the wafer holding portion 4 b. The alignment pins 4d are arranged at predetermined positions on the circumference so as to avoid interference with the holding member 9 described later. Fig. 3 shows an example of a position where the alignment pin 4d contacts the peripheral edge of the wafer W in a plan view by a broken line R.
The aligner 5 has a horizontal alignment table 5a, a gas supply pad 5b, and an alignment pin 5c, and aligns the wafer W conveyed from the wafer supply unit 2. The gas supply gasket 5b is formed on the surface of the alignment stage 5a, and is connected to a gas supply mechanism, not shown. The gas is blown to the lower surface of the wafer conveyed to the positioner 5 through the gas supply pad 5b, so that a negative pressure region is formed between the wafer W and the alignment stage 5a, and the wafer is floated and held on the alignment stage 5a by the bernoulli effect.
The alignment pins 5c are erected at equal intervals on a predetermined circumference of the alignment stage 5 a. Each alignment pin 5c is configured to be capable of reciprocating from the outer peripheral portion of the alignment stage 5a toward the central portion of the alignment stage 5 a. The wafer W held on the alignment stage 5a in a floating state is aligned by the alignment pins 5c at a position shown by a broken line P1.
The holding mechanism 6 includes a movable table 8, a plurality of holding members 9, and a gas supply pad 10. As shown in fig. 2, the movable table 8 is supported to be slidable in the left-right direction along a guide rail 11 horizontally provided in the left-right direction (x direction). The movable table 8 is driven for screw feed by a screw 15, and the screw 15 is driven for forward and backward by a motor 13. By sliding along the guide rail 11, the movable table 8 is configured to reciprocate between an initial position shown by a solid line in fig. 1 or 2 and a peeling start position shown by a broken line in fig. 1 or 2.
The holding member 9 has a rod-like structure in embodiment 1, and is provided upright on a predetermined circumference of the movable table 8. Further, the holding members 9 are in contact with the peripheral edge Wb of the wafer W, so that the wafer W can be stably held on the movable table 8 without being in physical contact with the lower surface Wa of the wafer W. The structure of the holding member 9 will be described in detail later.
As shown in fig. 1, a gas supply pad 10 is provided on the upper surface of the movable table 8. The positions at which the gas supply pads 10 are arranged are adjusted in advance so as to be below the wafer W conveyed to the holding mechanism 6. The gas supply pad 10 is connected to a gas supply device, not shown, and is configured to supply gas to the lower surface of the wafer W when the adhesive tape T is peeled off from the wafer W together with the peeling tape Ts. A negative pressure region is formed between the wafer W and the gas supply pad 10 by the gas supply from the gas supply pad 10, and a force directed downward with respect to the wafer W is generated by the bernoulli effect.
As shown in fig. 1 and 2, the peeling mechanism 7 is disposed between the initial position of the movable table 8 and the peeling start position of the movable table 8. The peeling mechanism 7 includes a tape supply unit 17, a tape collection unit 19, and a peeling unit 20. The tape supply unit 17 discharges the release tape Ts loaded on the adhesive tape roll. The discharged peeling tape Ts is guided to the peeling unit 20 by a guide roller not shown. The tape collecting section 19 winds and collects the peeling tape Ts output from the peeling unit 20.
Next, the structure of the peeling unit 20 will be described. As shown in fig. 2, a support frame 22 made of aluminum drawn material or the like is fixed to a pair of left and right vertical frames 21 provided on the device base stand. A box-shaped base 23 is connected to the left and right center portions of the support frame 22. Further, an elevating table 25 supported so as to be capable of sliding up and down by a pair of left and right vertical guide rails 24 provided on the base 23 is elevated and lowered by a ball shaft driven and coupled by a motor 26. The peeling unit 20 is attached to the lift table 25.
The elevating platform 25 is formed in a hollow frame shape penetrating vertically. The peeling unit 20 is provided at the lower inner portion of the left and right side plates 27 provided on the lift table 25. A support frame 28 is fixed across the both side plates 27.
A peeling member 29 is attached to the center of the support frame 28. The peeling member 29 has a plate shape shorter than the diameter of the wafer W, and is formed in a tapered shape whose tip is tapered toward the tip. The peeling member 29 is fixed in a posture inclined obliquely downward.
The peeling unit 20 pivotally supports a supply guide roller 31 at the rear of the side plate 27 so that the supply guide roller 31 can rotate freely. Further, a plurality of guide rollers 32 for recovery, nip rollers 33, and tension rollers 34 are provided above the peeling unit 20.
The recovery guide roller 32 is pivotally supported. The tension roller 34 is rotatably provided on a support arm 35, and is provided so as to be swingable via the support arm 35. Thus, the tension roller 34 applies an appropriate tension to the release belt Ts guided to be wound.
The recovery guide roller 32 and the tension roller 34 are configured as wide rollers having a length larger than the diameter of the wafer W, and the outer peripheral surfaces thereof are hard-to-adhere surfaces coated with a fluorine resin. The supply guide roller 31 is configured as a narrow roller that is longer than the width of the peeling belt Ts and shorter than the diameter of the wafer W.
the peeling mechanism 7 also has an adsorption member 37. The suction members 37 are provided in a pair on the left and right sides of the peeling member 29, that is, on the front side and the back side of the peeling member 29 when viewed from the entire adhesive tape peeling apparatus 1. The suction member 37 is a plate-shaped member, and is configured to move up and down independently of the up-down table 25. The suction member 37 is connected to a vacuum device, not shown, and is configured to suck the adhesive tape T from the front side when the peeling unit 20 attaches the peeling tape Ts to the adhesive tape T.
When the peeling member 29 presses the peeling tape Ts against the surface of the adhesive tape T to attach the tape T, a downward force J1 acts on the wafer W, while an upward force J2 acts on the wafer W when the surface of the adhesive tape T is attracted by the attraction member 37. Therefore, by applying the force J2 in the direction opposite to the direction of the force J1 by the suction of the suction member 37, the wafer W can be prevented from being deformed by the force J1 applied to the wafer W when the release tape Ts is attached to the adhesive tape T.
The adhesive tape separating apparatus 1 further includes a control unit 40 and an input unit 50. The control unit 40 includes a CPU (central processing unit) and the like, and collectively controls various operations of the adhesive tape peeling apparatus 1. Examples of the various operations include expansion and contraction operations of the cylinder 43, horizontal movement of the movable table 8, and operations of the wafer transfer apparatus 4, which will be described later.
Examples of the input unit 50 include a controller panel and a keyboard, and the operator can input various instructions using the input unit 50. The content of the instruction input to the input unit 50 is transmitted to the control unit 40, and the control unit 40 can perform various kinds of unified control in accordance with the instruction.
< Structure of holding mechanism >
Here, the structure of the holding mechanism 6 will be described in detail. In embodiment 1, 10 holding members 9 are provided upright on the movable table 8 of the holding mechanism 6. As shown in fig. 2, 4 (a), and the like, a wedge-shaped groove 41 is formed in a side surface of each holding member 9. The groove portions 41 are formed on the side of the holding members 9 closer to the central portion of the movable table 8, and each holding member 9 contacts the peripheral edge Wb of the wafer W at the groove portion 41. The number and arrangement of the holding members 9 may be appropriately changed as long as the wafer W can be stably held by the peripheral edge portion of the wafer W. As a constituent material of the holding member 9, a material having a certain hardness such as metal or plastic can be cited.
As shown in fig. 3 and the like, the holding member 9 is configured to be horizontally movable on the movable table 8 along a trajectory from the outer peripheral portion of the movable table 8 toward the central portion of the movable table 8. That is, each holding member 9 is configured to be capable of reciprocating between an avoidance position shown by a solid line in fig. 3 and a holding position shown by a broken line in fig. 3. In other words, each holding member 9 moves horizontally along a radial trajectory around the center of the movable table 8.
The holding position of the holding member 9 is defined as a position at which the wafer W conveyed to the holding mechanism 6 can be held by the holding member 9 while being in contact with the holding member 9. On the other hand, the avoiding position of the holding member 9 is a position away from the position outside the wafer W conveyed to the holding mechanism 6, and is defined as a position where contact between the adhesive tape T peeled from the wafer W and the holding member 9, and contact between the peeling mechanism 7 and the holding member 9, which will be described later, can be avoided.
The structure in which the respective holding members 9 move between the holding position and the avoidance position will be described. As shown in fig. 4 (a) and 4 (b), the independent cylinders 43 are connected to the respective holding members 9. As shown in fig. 4 (c), each cylinder 43 is arranged to perform an expansion and contraction operation along a radial trajectory around the center of the movable table 8.
the holding member 9 is horizontally moved along the guide rail 45 by the telescopic action of the cylinder 43 connected to the holding member 9. By this horizontal movement, the holding member 9 is appropriately switched between a state of being disposed at the avoidance position as shown in fig. 4 (a) and a state of being disposed at the holding position as shown in fig. 4 (b). The expansion and contraction operations of the respective cylinders 43 are appropriately controlled by the control unit 40. For convenience of explanation, the cylinder 43 and the guide rail 45 of the movable table 8 are not shown in the drawings other than the drawings of fig. 4 and fig. 8.
When the holding member 9 is moved to the holding position in a state where the wafer W is conveyed to the holding mechanism 6, the peripheral edge Wb of the wafer W comes into contact with the groove 41 of the holding member 9. When at least 3 or more holding members 9 are moved to the holding position, the peripheral edge Wb of the wafer W comes into contact with the groove 41 of the holding member 9, and the lower surface Wa of the wafer W is not physically contacted, so that the wafer W is stably held on the movable table 8. As an example, fig. 4 (c) shows a state in which 3 holding members 9 shown in dotted lines among 10 holding members 9 are moved to the holding position. In this case, the wafer W conveyed to the position indicated by P2 is held in a state of being held by the 3 holding members 9.
In the present invention, the peripheral portion Wb of the wafer W includes a portion from the upper end to the lower end of the side surface of the wafer W. In example 1, as shown in fig. 4 (b), the holding member 9 contacts the upper end and the lower end of the side surface of the wafer W via the groove 41, thereby holding the wafer W from the side.
In embodiment 1, as a preferable configuration, the controller 40 controls the operation of the cylinder 43 so that the holding member 9 is further moved toward the center of the movable table 8 in a state where the holding member 9 is moved to the holding position and is brought into contact with the peripheral edge of the wafer W. By this operation control, the force J3 is applied from the holding member 9 to the wafer W in the direction from the peripheral edge Wb of the wafer W toward the center Wx of the wafer W. By applying the force J3 from each holding member 9 moving to the holding position toward the center of the wafer W, it is possible to more reliably avoid the wafer W from falling off the holding member 9.
The magnitude of the force J3 changes according to the distance by which the cylinder 43 extends and contracts. The controller 40 controls the expansion/contraction distance of the cylinder 43 to appropriately adjust the magnitude of the force J3 according to various conditions such as the thickness, size, and material of the wafer W. By appropriately adjusting the magnitude of the force J3, it is possible to prevent the wafer W from being deformed by the excessive force J3 acting on the wafer W from the holding member 9 when the wafer W is held by the holding member 9.
next, a mechanism for performing control for switching the position of the holding member 9 will be described. In example 1, 10 holding members 9 are divided into 2 groups, and each group is controlled to be switched from the holding position to the avoidance position. That is, as shown in fig. 5 (a), the holding members 9 are divided into 4 holding members 9p belonging to the 1 st group and 6 holding members 9s belonging to the 2 nd group. In each of fig. 5 (a) and subsequent figures, the holding member 9p is shown diagonally, and the holding member 9s is shown in a blank manner, so as to distinguish them from each other.
The expansion and contraction operations of the 4 cylinders 43 connected to the respective holding members 9p are synchronously controlled by the control section 40. The expansion and contraction operations of the 6 cylinders 43 connected to the respective holding members 9s are synchronously controlled by the control section 40. Further, the control of the cylinder 43 connected to the holding member 9p and the control of the cylinder 43 connected to the holding member 9s are independently performed by the control section 40. By independently performing this synchronization control for 2 groups, the arrangement of the holding members 9 on the movable table 8 is divided into 4 patterns.
in the 1 st mode, as shown in fig. 5 (a), both the holding members 9p and 9s are moved to the avoidance position. In the 2 nd mode, as shown in fig. 5 (b), the holding members 9p and 9s are both moved to the holding position, and the wafer W is held by the holding members 9p and 9 s.
In the 3 rd mode, as shown in fig. 5 (c), the holding members 9p are moved to the holding position, while the holding members 9s are moved to the avoidance position. In the 3 rd mode, the wafer W is held by the holding member 9 p. In the 4 th mode, as shown in fig. 5 (d), the holding members 9s are moved to the holding position, while the holding members 9p are moved to the avoidance position. In the 4 th mode, the wafer W is held by the holding member 9 s.
In embodiment 1, when the adhesive tape T is peeled from the wafer W, the above-described 4 modes are appropriately switched with respect to the arrangement mode of the holding member 9. By appropriately switching the position of the holding member 9 between the avoidance position and the holding position, the wafer W can be stably held by contact from the side of the wafer W, and interference between the adhesive tape T peeled off from the wafer W and the holding member 9 can be avoided.
< brief description of adhesive tape Release step >
Here, a series of basic operations will be described for the step of peeling the adhesive tape T from the wafer W by using the adhesive tape peeling apparatus 1. When the step of peeling off the adhesive tape is started, the movable stand 8 of the holding mechanism 6 moves to the initial position shown in fig. 1, and the holding members 9 on the movable stand 8 move to the avoidance position as shown in fig. 1.
When a command to start the peeling operation is issued, first, the robot arm 4a of the conveyance mechanism 4 operates and moves to the cassette C1 of the wafer supply unit 2. Then, as shown in fig. 6 (a), the wafer holding portion 4b provided at the tip of the robot arm 4a is inserted into the gap between the wafers W stored in the cassette C1. The wafers W are blown from the gas supply pads 4c provided on the lower surfaces of the wafer holding portions 4b, and the wafer holding portions 4b hold the wafers W in a non-contact manner by the bernoulli effect.
As shown in fig. 6 (b), the alignment pin 4d disposed at the initial position shown by the broken line moves toward the center of the wafer holding portion 4 b. By the movement of the alignment pins 4d, the side surfaces of the wafer W are brought into contact with the alignment pins 4 d. By this contact, the wafer W held in the wafer holding portion 4b is aligned in a non-contact manner. That is, the wafer W is restrained from moving horizontally with respect to the holding surface of the wafer holding portion 4b by the alignment pins 4 d.
After the wafer holding portion 4b holds the wafer W in a non-contact state and aligns the wafer W by the alignment pins 4d, the transfer mechanism 4 transfers the wafer W to the positioner 5 and aligns the wafer W. That is, as shown in fig. 7 (a), the wafer holding portion 4b moves the wafer W above the alignment stage 5 a. At this time, gas is blown from the gas supply pad 5b provided on the alignment stage 5a toward the lower surface of the wafer W, and the wafer W floats on the alignment stage 5a by the bernoulli effect.
Then, the operation of the gas supply pad 4c is stopped, and the alignment pin 4d is moved from the center portion of the wafer holding portion 4b toward the outer peripheral portion and returned to the initial position. Then, the wafer holding portion 4b is retracted from the positioner 5, and the wafer W is aligned by the alignment pins 5 c. As shown in fig. 7 (b), each alignment pin 5c moves from the outer peripheral portion of the alignment stage 5a in a direction toward the center 5x of the alignment stage 5 a.
By the movement of the alignment pins 5c, the side surfaces of the wafer W and the alignment pins 5c come into contact with each other, and the wafer W is displaced so as to be pushed toward the center 5x of the alignment stage 5 a. As a result, the position of the wafer W is aligned so that the center Wx of the wafer W and the center 5x of the alignment stage 5a coincide with each other in a plan view. The position of the wafer W aligned by the aligner 5 is shown in fig. 1 with reference numeral P1.
after the alignment of the wafer W, a step of holding the wafer W on the holding mechanism 6 is performed. The robot arm 4a moves to the positioner 5 again, and the wafer W is held by the wafer holding portion 4b in a non-contact manner. That is, the gas supply pad 4c is operated to blow gas to the wafer W to generate the bernoulli effect, and the alignment pin 4d moves from the initial position toward the center of the wafer holding portion 4b and contacts the side surface of the wafer W to align the wafer W. Then, the wafer W is conveyed from the positioner 5 to the holding mechanism 6. That is, as shown in fig. 8 (a), the wafer W is conveyed upward of the movable table 8 by the wafer holding portion 4 b. At this time, the transport position of the wafer W is a position shown by reference numeral P2 in fig. 1.
Then, the robot arm 4a is appropriately lowered so that the height of the wafer W matches the height of the groove 41 provided in the holding member 9. At this time, the position of the holding member 9 is set to the 1 st mode as shown in fig. 5 (a). That is, the holding members 9 are all moved to the avoidance position.
After the height of the wafer W is matched with the height of the groove 41, the controller 40 controls the expansion and contraction operations of the cylinders 43 to move the holding members 9 from the avoidance position to the holding position. The position of each holding member 9 is changed from the 1 st mode to the 2 nd mode shown in fig. 5 (b) by the control of the control section 40.
That is, as shown in fig. 8 (b), the holding members 9 move to the holding positions, and the groove portions 41 come into meshing contact with the peripheral edge Wb of the wafer W. By this contact, the wafer W is held by the holding member 9.
In this case, since the wafer W is in physical contact with the peripheral edge Wb of the wafer, the wafer W can be stably held on the movable stage 8 without being in physical contact with the circuit surface Wa of the wafer W facing downward. In example 1, the region surrounded by the holding member 9 corresponds to the peeling position of the present invention.
The wafer holding portion 4b is in a state where the alignment pins 4d are in contact with the peripheral edge portion Wb of the wafer W in order to prevent displacement of the wafer W in the horizontal direction. However, the arrangement position of the alignment pins 4d and the holding position of the holding member 9 are adjusted in advance so as to be different positions on the circumference of the peripheral portion Wb. Therefore, the holding member 9 moved to the holding position can be prevented from interfering with the alignment pins 4d, and therefore, it is possible to avoid an error in the process of holding the wafer W by the holding member 9. Note that, for convenience of explanation, the alignment pins 4d are not shown in each of fig. 8.
In example 1, in order to hold the wafer W more stably, the control unit 40 further controls the cylinder 43 to contract toward the center Wx of the wafer. By this control, as shown in fig. 8 (c), the wafer W is urged by the respective holding members 9 moved to the holding positions with J3.
Since each force J3 is a force directed from the peripheral edge Wb of the wafer W toward the center Wx, the force J3 acts to prevent the peripheral edge Wb of the wafer W from separating from the groove 41 of the holding member 9 and the wafer W from dropping. Therefore, the wafer W can be held more stably by the urging force J3 from the holding member 9 even in a state where the wafer W is not in physical contact with the downward facing circuit surface Wa.
After the holding member 9 holds the peripheral edge Wb of the wafer W, the operation of the gas supply pad 4c of the wafer holding portion 4b is stopped, the holding of the wafer W by the transport mechanism 4 is released, and the robot arm 4a is retracted from the holding mechanism 6.
After the robot arm 4a is retracted from the holding mechanism 6, the step of peeling the adhesive tape T is started. First, the control unit 40 controls the rotation of the motor 13, thereby moving the movable stage 8 from the initial position to the peeling start position (see fig. 1 and 2).
After the movable stage 8 is moved to the peeling start position, the movable stage 8 is moved from the peeling start position to the initial position. While the movable table 8 is moved to the initial position, the peeling unit 20 performs a step of attaching the peeling tape Ts to the surface of the adhesive tape T and a step of peeling the adhesive tape T from the wafer W integrally with the peeling tape Ts.
Here, the release tape Ts is attached to the right end portion of the adhesive tape T in the drawing. Therefore, when all the holding members 9 are moved to the holding position, the holding member 9s surrounded by the broken line M1 in fig. 9 (a) of the holding members 9 interferes with the peeling tape attaching operation by the peeling unit 20.
therefore, the holding member 9s of the holding member 9 is moved to the avoidance position before the operation of attaching the release tape Ts to the adhesive tape T is performed. That is, the control unit 40 controls the 6 cylinders 43 connected to the holding member 9s of the holding member 9 to switch the position of the holding member 9s from the holding position to the avoidance position.
By switching the position of the holding member 9s, the position pattern of the holding member 9 changes from the 2 nd pattern shown in fig. 5 (b) to the 3 rd pattern shown in fig. 5 (c). In this case, the wafer W is stably held by the 4 holding members 9 p. Further, since the holding member 9s surrounded by the broken line M1 is moved to the avoidance position apart from the wafer W, it is possible to avoid the peeling unit 20 and the holding member 9s from interfering with each other and causing an error in the peeling process.
After the holding member 9s is retracted to the avoidance position, the release tape Ts is fed out from the tape feeding portion 17 and is adhered to the adhesive tape T by using the peeling unit 20. That is, as shown in fig. 9 (b), the motor 26 is operated by the control unit 40 to lower the peeling unit 20 to a predetermined height. For convenience of explanation, the holding member 9p for holding the wafer W is not shown in fig. 9 (b).
The release tape Ts wound around the release member 29 is pressed against the right end of the adhesive tape T on the wafer W and is bonded thereto. When the peeling tape Ts is stuck, a downward force J1 acts on the wafer W by being pressed.
Therefore, in order to prevent the deformation of the wafer W due to the force J1, the suction member 37 sucks the adhesive tape T and the wafer W in synchronization with the operation of attaching the release tape Ts to the adhesive tape T. That is, as shown in fig. 9 (b), the adsorption member 37 is lowered to a predetermined height independently of the lowering of the peeling member 29.
then, a vacuum apparatus, not shown, is operated, and the suction member 37 sucks the adhesive tape T and the wafer W at the predetermined height position. By this suction, an upward force J2 acts on the wafer W. The effect of the downward force J1 on the wafer W is reduced by the upward force J2. Therefore, by performing suction by the suction member 37, the wafer can be prevented from being deformed by the force J1. In this case, the positional relationship of the suction member 37, the peeling member 29, the peeling belt Ts, and the like in a plan view is as shown in fig. 9 (c).
The suction of the suction member 37 is released in synchronization with the completion of the operation of sticking the release tape Ts to the adhesive tape T. Then, the movable stand 8 is further moved to the initial position, i.e., to the right in the drawing. At this time, the adhesive tape T is peeled from the back surface of the wafer W integrally with the release tape Ts by the peeling member 29 while folding back the release tape Ts (fig. 10 (a)). The release tape Ts to which the adhesive tape T released from the wafer W is attached is wound and collected by the tape collection unit 19. In fig. 10 (a), the holding member 9 for holding the wafer W is not shown for convenience of explanation.
When the adhesive tape T is peeled from the back surface of the wafer W facing upward, an upward force J4 acts on the wafer W when the adhesive tape T is peeled. Therefore, in order to prevent the wafer W from being deformed by the force J4, the gas is supplied from the gas supply pad 10 in synchronization with the operation of peeling the adhesive tape T. That is, as shown in fig. 10 (a), gas is blown from a gas supply pad 10 provided on the surface of the movable table 8 toward the lower surface of the wafer W.
by blowing the gas, a negative pressure region is generated between the movable table 8 and the lower surface of the wafer W, and a downward force J5 is generated with respect to the wafer W by the bernoulli effect. The downward force J5 is used to reduce the effect of the upward force J4 on the wafer W. Therefore, by blowing gas using the gas supply pad 10, the wafer can be prevented from being deformed by the force J4.
As the adhesive tape T is peeled from the wafer W, the boundary N between the adhesive tape T attached to the wafer W and the adhesive tape T peeled from the wafer W moves in the left direction from the right end of the wafer W (fig. 10 (b)). By separating the boundary line N from the right end of the wafer W, even if the holding member 9s surrounded by the reference numeral M1 moves to the holding position, it is possible to avoid interference with the peeling unit 20 and the adhesive tape T.
Therefore, when the boundary N is located from the right end of the wafer W to the position indicated by the reference character F1, the control unit 40 controls the cylinder 43 connected to the holding members 9s to move the holding members 9s to the holding positions. By this control, the position mode of the holding member 9 is changed from the 3 rd mode to the 2 nd mode, and the wafer W is held by the holding members 9p and 9s ((b) of fig. 10).
The adhesive tape T is further peeled from the wafer W by the peeling unit 20, and the boundary N is located closer to the position indicated by reference numeral F1 in fig. 9 (a). At this time, when the holding member 9p surrounded by the broken line M2 is disposed at the holding position, there is a possibility that a peeling error may occur due to a contact between the adhesive tape T peeled from the wafer W and the holding member 9 p.
Therefore, when the boundary line N is close to the position indicated by reference numeral F1, the control unit 40 controls the expansion and contraction operation of the cylinder 43 connected to the holding member 9p to move each holding member 9p from the holding position to the avoidance position. By this control, the position mode of the holding member 9 is changed from the 2 nd mode to the 4 th mode shown in fig. 5 (d). By switching the position of the holding member 9p to the avoidance position, even if the boundary N passes through the position F1, the occurrence of a peeling error of the adhesive tape T can be reliably avoided (fig. 11 (a)). At this time, the wafer W is held by the holding member 9 s.
as the movable table 8 is further moved to the initial position to peel off the adhesive tape T, the boundary N is further moved leftward. When the boundary N passes through the position F1, the control unit 40 controls the cylinder 43 to move the holding members 9p from the avoiding position to the holding position. As a result, the position mode of the holding member 9 is changed to the 2 nd mode, and the wafer W is held by the holding members 9p and 9s ((b) of fig. 11).
Then, the peeling process of the adhesive tape T proceeds and the boundary N approaches the position F2. At this time, when the 2 holding members 9s surrounded by the broken line M3 move to the holding position, the holding members 9s interfere with the operation of peeling the adhesive tape T. Therefore, when the boundary N is close to the position F2, the control unit 40 controls the cylinder 43 to move the holding members 9s to the avoidance position, thereby avoiding the adhesive tape T peeled off from the wafer W from interfering with the holding members 9 s. At this time, the position mode of the holding members 9 is set to the 3 rd mode, and the peripheral edge portions of the wafer W are in contact with the groove portions 41 of the 4 holding members 9p, whereby the wafer W is stably held ((c) of fig. 11).
The movable table 8 is further moved to the initial position to perform the peeling process. When the boundary line N travels leftward and passes through the position F2, the holding member 9s is again moved from the avoidance position to the holding position. That is, the position pattern of the holding member 9 is changed from the 3 rd pattern to the 2 nd pattern, and the peripheral edge Wb of the wafer W is brought into contact with the groove 41 of the holding member 9p and the groove 41 of the holding member 9s, respectively, so that the wafer W is held without being brought into contact with the circuit surface Wa ((d) of fig. 11).
Also, when the peeling process of the adhesive tape T proceeds, the boundary line N approaches the position F3 from the position F2. At this time, when the 2 holding members 9p surrounded by the broken line M4 move to the holding position, the holding members 9p interfere with the operation of peeling the adhesive tape T. Therefore, the control unit 40 controls the cylinder 43 to switch the position of the holding member 9p from the holding position to the avoidance position, and changes the position mode of the holding member 9 to the 4 th mode ((a) of fig. 12). When the boundary N passes through the position F3, the control unit 40 moves the holding member 9p to the holding position, and changes the position mode of the holding member 9 to the 2 nd mode.
When the boundary N is close to the left end of the wafer W, the 2 holding members 9s surrounded by the broken line M5 interfere with the operation of peeling the adhesive tape T. Therefore, the control unit 40 switches the position of the holding member 9s from the holding position to the avoidance position, and changes the position mode of the holding member 9 to the 3 rd mode ((b) of fig. 12). Then, by performing the peeling process, the adhesive tape T is completely peeled from the back surface of the wafer W facing upward (fig. 12 (c)). Then, the movable table 8 returns to the initial position. When the adhesive tape T is completely peeled off from the wafer W, the operation of the gas supply pad 10 is stopped.
When the peeling of the adhesive tape T is completed and the movable table 8 returns to the initial position, the robot arm 4a of the conveyance mechanism 4 is moved toward the holding mechanism 6. The wafer W from which the adhesive tape T is peeled is held in a non-contact state by the wafer holding portion 4b serving as a bernoulli chuck. Then, the transport mechanism 4 transports the wafer W from the holding mechanism 6 to the wafer collecting unit 3, and inserts and stores the wafer W in the cassette C2.
One cycle of operation using the adhesive tape peeling apparatus 1 of example 1 was completed as described above, and the same operation was repeated until the predetermined number of sheets was reached.
In the adhesive tape peeling apparatus 1 of example 1, the holding member is brought into contact with the peripheral edge portion of the wafer W conveyed to the peeling mechanism in a non-contact state, thereby holding the wafer W. Then, in a state where the holding member holds the peripheral edge portion of the wafer W, a release tape Ts is attached to the adhesive tape T attached to the upper surface of the wafer, and the adhesive tape T and the release tape Ts are peeled off from the wafer W integrally.
At this time, the wafer W is physically contacted by the holding member from the upper end to the lower end of the side surface, which is the peripheral edge portion of the wafer W. In other words, the wafer W can be stably held without physical contact with the lower surface of the wafer W. Therefore, even when a member such as a holding table is not properly in physical contact with the lower surface of the wafer W in the case where the lower surface of the wafer W is a circuit surface, a defect does not occur in the wafer W, and the wafer W can be stably held. Therefore, the adhesive tape T can be peeled off from the upper surface of the wafer W with high accuracy.
In the conventional apparatus, the holding table is required to support at least a part of the lower surface of the wafer, and therefore, the holding table may contact an unexpected part of the lower surface of the wafer due to the displacement of the wafer. On the other hand, in the structure of example 1, a member in contact with the lower surface of the wafer, which is exemplified by the holding stage, is omitted. Therefore, even when the wafer is misaligned when the wafer is transferred to the peeling device, the lower surface of the wafer can be reliably prevented from being physically contacted.
In example 1, the holding members 9 are divided into 2 groups of the holding members 9p and 9s, and control is performed to appropriately displace the holding members between the avoidance position and the holding position for each group. That is, the position of each holding member 9p belonging to the 1 st group is synchronously switched between the avoidance position and the holding position by the control unit 40.
The position control of the holding member 9s belonging to the group 2 is performed in a unified manner, independently of the position control of the holding member 9 p. That is, independently of the synchronization control of the holding member 9p, the positions of the holding members 9s are synchronously switched between the avoidance position and the holding position. In this case, even in the configuration having the plurality of holding members 9, the position control of the holding members 9 can be limited to two lines, and therefore, the calculation of the position control by the control unit 40 can be simplified.
[ example 2 ]
Next, embodiment 2 of the present invention will be explained. The same components as those of the adhesive tape joining apparatus of example 1 are denoted by the same reference numerals, and a method of controlling the holding member 9, which is a different component, will be described in detail.
In embodiment 1, the plurality of holding members 9 are divided into 2 groups, i.e., the holding members 9p and the holding members 9s, and position control is collectively performed for each holding member 9p, and position control is collectively performed for each holding member 9s independently of the holding member 9 p. On the other hand, in example 2, the position control is performed independently for each holding member 9.
Here, in the adhesive tape peeling step of example 2, a control method for switching the position of the holding member 9 when the adhesive tape T is peeled from the wafer W will be described. In example 2, the number of holding members 9 is 10 as in example 1, and as shown in fig. 13 (a) and the like, the respective holding members 9 are distinguished by reference numerals 9a to 9 j.
After the wafer W is aligned by the aligner 5 and conveyed to the holding mechanism 6, the controller 40 moves the holding members 9a to 9j from the avoiding position to the holding position. By moving to the holding position, the wafer peripheral portion Wb comes into contact with the groove portions 41 provided in the holding members 9a to 9j, and the wafer W is held from the side. That is, as in example 1, the wafer W can be stably held on the movable table 8 while avoiding physical contact with the lower surface of the wafer W.
After the wafer W is held by the holding members 9, the movable table 8 is moved from the initial position to the peeling start position. Then, the movable table 8 is moved from the peeling start position to the initial position, and the adhesive tape T is peeled from the wafer W.
First, as in example 1, when the movable table 8 is moved to a position where the right end portion of the wafer W is located below the peeling member 29, the peeling unit 20 is lowered, and the peeling tape Ts is pressed against the right end of the adhesive tape T and is bonded thereto. At this time, when the holding members 9c and 9d are arranged at the holding positions, the holding members 9c and 9d interfere with the peeling unit 20, thereby inhibiting the operation of attaching the peeling tape Ts.
therefore, the control unit 40 controls the cylinder 43 to switch the positions of the holding members 9c and 9d from the holding positions to the avoidance positions, thereby avoiding interference with the peeling unit 20 ((a) of fig. 13). After the holding members 9c and 9d are moved to the avoidance position, the release tape Ts is attached to the right end portion of the adhesive tape T, and the adhesive tape T is peeled from the right end portion integrally with the release tape Ts. At this time, since the holding members 9c and 9d move to the avoidance position, the peeled adhesive tape T can be prevented from coming into contact with the holding members 9c and 9d and causing a peeling error.
By further moving the movable table 8 to the initial position and folding back the release tape Ts by the release member 29, the adhesive tape T is released from the wafer W integrally with the release tape Ts. As the peeling of the adhesive tape T progresses, the boundary N between the adhesive tape T after the peeling and the adhesive tape T before the peeling moves leftward from the right end portion of the wafer W.
When the boundary line N is separated from the right end of the wafer W and approaches the position F1, the control unit 40 moves the holding members 9c and 9d from the avoidance position to the holding position and moves the holding members 9b and 9e from the holding position to the avoidance position ((b) of fig. 13). By retracting the holding members 9b and 9e to the avoidance position, it is possible to prevent an error in peeling the adhesive tape T due to a failure such as contact between the adhesive tape T and the holding member 9 at the position F1.
When the separation step is performed and the boundary N moves from the position F1 to the position F2, the controller 40 moves the holding members 9b and 9e from the avoidance position to the holding position and moves the holding members 9a and 9F from the holding position to the avoidance position ((c) of fig. 13). When the boundary N moves away from the position F2 and approaches the position F3, the controller 40 moves the holding members 9a and 9F from the avoidance position to the holding position, and also moves the holding members 9g and 9j from the holding position to the avoidance position ((d) of fig. 13).
Finally, when the boundary N is separated from the position F3 and approaches the left end portion of the wafer W, the control unit 40 moves the holding members 9g and 9j from the avoiding position to the holding position, and also moves the holding members 9h and 9i from the holding position to the avoiding position. In a state where the holding members 9h and 9i are moved from the holding position to the avoiding position, the adhesive tape T is completely peeled off from the upper surface of the wafer W (see fig. 12 c). In example 2, a series of operations for peeling the adhesive tape T are common to example 1, except for a control method for switching the position of each holding member 9 between the holding position and the avoidance position.
in the configuration of embodiment 2, each of the holding members 9 is configured to be independently switchable between the holding position and the avoidance position. Then, the holding member 9 located closer to the position of the boundary line N, that is, the position where the operation of peeling the adhesive tape T from the wafer W is performed, is selectively displaced to the avoidance position, and the holding member 9 located at the holding position farther from the boundary line N is moved to the holding position.
In this case, by moving the holding member 9 whose holding position is closer to the boundary N to the avoidance position, it is possible to reliably avoid the occurrence of a peeling error due to contact between the adhesive tape T peeled from the wafer W and the holding member 9. Then, the holding member 9, which separates the boundary N and the holding position, is moved to the holding position to hold the peripheral edge Wb of the wafer W. Therefore, more holding members 9 are in contact with the peripheral edge Wb of the wafer W, and therefore the wafer W can be held more stably.
The present invention is not limited to the above embodiment, and can be modified as follows.
(1) In each embodiment, the holding member 9 is not limited to the structure having the groove portion 41. That is, the shape of the holding member 9 may be changed as appropriate as long as the wafer W can be stably held by contact with the peripheral edge Wb of the wafer. As an example, as shown in fig. 14 (a), the holding member 9 may be a rod having a uniform thickness.
In this case, when the holding member 9 moves from the avoidance position to the holding position, the flat side surface of the holding member 9 is pressed in the center direction while being in contact with the wafer peripheral edge Wb as shown in fig. 14 (b). Further, since the force J3 in the direction toward the center Wx of the wafer acts on the wafer W, the lower surface Wa of the wafer W can be stably held in a non-contact state.
As shown in fig. 14 (c), the holding member 9 may have a concave portion 42 having a shape corresponding to the peripheral portion Wb of the wafer W instead of the groove portion 41. The peripheral edge Wb of the wafer W abuts against the concave portion 42 of the holding member 9 at least at 3 points, and the wafer W is held so as to be laterally clamped. When the holding member 9 holds the wafer W, as shown in fig. 14 (d), the peripheral edge Wb of the wafer W is fitted in the recess 42 of the holding member 9.
Therefore, similarly to the case where the holding member 9 has the groove 41, even if a vertical force acts on the wafer W, the peripheral edge Wb of the wafer W can be prevented from being detached from the recess 42 and the wafer W can be prevented from dropping. Therefore, the holding force of the holding member 9 for holding the wafer W can be further increased.
(2) In each of the embodiments and modifications, the holding member 9 may have an elastic body. That is, as shown in fig. 15 (a), the holding member 9 has an elastic body 47 at least in a portion that contacts the peripheral edge Wb of the wafer W. Examples of the material constituting the elastic body 47 include an elastic body such as rubber. In this modification, the entire holding member 9 may be made of an elastic body.
When the wafer W is held by the holding member 9 of modification (2), the expansion and contraction operations of the cylinder 43 are controlled to move the holding member 9 from the avoidance position to the holding position along the guide rail 45, as in the respective embodiments. When the position of the holding member 9 is the avoidance position, the holding member 9 is separated from the peripheral portion Wb of the wafer (fig. 15 (b)). In example 2, the holding position of the holding member 9 may be defined at a position D1 at which the holding member 9 contacts the wafer W. However, it is more preferable that the position D2 slightly inside the position D1 be defined as the holding position.
When the holding member 9 moves from the avoidance position D0 to the holding position D2, the elastic body 47 provided in the holding member 9 comes into contact with the peripheral edge Wb of the wafer ((c) of fig. 15), and the elastic body 47 elastically deforms in accordance with the shape of the peripheral edge Wb of the wafer ((D) of fig. 15).
The elastic body 47 elastically deforms and contacts the peripheral edge Wb of the wafer, so that the holding member 9 contacts the wafer W along the entire peripheral edge Wb regardless of the shape of the peripheral edge Wb of the wafer. That is, the contact area between the peripheral edge portion Wb of the wafer W and the holding member 9 becomes larger, and therefore, the wafer W can be held more stably while avoiding physical contact with the lower surface Wa of the wafer.
Further, when the holding member 9 moving to the holding position D2 is pressed against the wafer W and the elastic body 47 is elastically deformed, the holding member 9 urges the J3 in the direction from the peripheral edge portion Wb toward the central portion Wx with respect to the wafer W. The wafer W can be more reliably prevented from dropping off the holding member 9 by the urging force J3. Therefore, by defining the holding position at the position D2, the wafer W can be held more stably than when defining the holding position at the position D1.
(3) In each of the embodiments and the modifications, the suction member 37 and the gas supply pad 10 are provided as a structure for reducing the influence of the force J1 applied to the wafer W when the peeling tape Ts is attached and the force J4 applied to the wafer W when the adhesive tape T is peeled from the wafer W together with the peeling tape Ts, but the invention is not limited thereto. That is, the adsorption member 37 and the gas supply gasket 10 may be omitted, and the adsorption member 37 and the gas supply gasket 10 may be replaced by other structures as long as the influence of the forces J1 and J4 is reduced.
As an example of a structure that is a substitute for the adsorption member 37 and the gas supply gasket 10, the holding mechanism 6 of modification (3) has a gas flow path 49 as shown in fig. 16 (a). The gas flow paths 49 are buried in the movable stage 8 and join at the lower part of the movable stage 8. The gas flow path 49 is connected to a gas supply device 53 via an electromagnetic valve 51. The gas flow path 49 is connected to the suction device 57 via the solenoid valve 55. With such a configuration, the gas flow path 49 supplies or sucks gas through a plurality of holes provided on the surface of the movable table 8.
in the configuration of the modification (3), when the separation tape Ts is attached, the control unit 40 operates the gas supply device 53, opens the solenoid valve 51, and blows the gas V toward the lower surface of the wafer W through the gas flow path 49. Since the gas V blows toward the lower surface Wa of the wafer W, the wafer W is pressed upward by the gas V, and therefore, an upward force J6 is generated with respect to the wafer W. As a result, the influence of the downward force J1 applied to the wafer W when the peeling tape Ts is attached is reduced by the upward force J6.
On the other hand, when the adhesive tape T is peeled off from the wafer W together with the peeling tape Ts, as shown in fig. 16 (b), the control unit 40 operates the suction device 57, opens the solenoid valve 55, and sucks the lower surface of the wafer W through the gas flow path 49. Since the wafer W is sucked from below to the lower side where the hole 52 is provided, a downward force J7 acts on the wafer W. As a result, the influence of the upward force J4 acting on the wafer W when the adhesive tape T is peeled from the wafer W is reduced by the downward force J7. In this way, even with the configuration in which the supply and suction of the gas are performed through the gas flow path 51, the deformation of the wafer W due to the force J1 or the force J4 can be avoided.
(4) In each of the embodiments and the modifications, the adhesive tape T is peeled off in a non-contact state with the circuit surface facing downward in a state where the back surface to which the adhesive tape T is attached faces upward. The present invention can be suitably applied to a structure in which the adhesive tape T attached to one surface of the wafer W is peeled off while reliably avoiding physical contact with the other surface of the wafer W.
As an example of a structure in which the adhesive tape is required to be in a non-contact state with one surface and to be peeled from the other surface, the following is given. After the circuit pattern is formed on the front surface of the wafer W, an adhesive tape for circuit protection is attached to the front surface, and then a back surface polishing process is performed on the back surface of the wafer W to make the wafer W thin. After thinning the wafer W, the protective adhesive tape may be peeled from the front surface and subjected to various treatments such as a coating treatment on the back surface of the wafer W.
In this case, if the holding table or the like comes into contact with the back surface of the wafer when the adhesive tape is peeled from the surface of the wafer, there is a possibility that a trouble may occur in a subsequent coating process or the like due to dust, abrasive dust, or the like on the holding table. Therefore, by applying the structure of the present invention, the protective adhesive tape can be peeled from the surface of the wafer W facing upward while the holding member 9 is brought into contact with the peripheral portion Wb of the wafer W with the back surface of the wafer W facing downward. As a result, since the wafer W can be stably held without being in physical contact with the back surface of the wafer W, the adhesive tape can be peeled off from the front surface of the wafer W with high accuracy, and occurrence of a defect in the back surface treatment after that can be prevented.
(5) In each of the embodiments and the modifications, the apparatus in which the wafer W is used as a workpiece and the adhesive tape T attached to the workpiece is peeled off is exemplified, but the workpiece is not limited to the wafer W. As the structure used as the workpiece, various articles such as a ring frame, a glass substrate, a ceramic substrate, and an organic material substrate exemplified by FPC can be cited in addition to the wafer W formed of various materials such as gallium and arsenic compounds or silicon.
(6) In each of the embodiments and the modifications, the structure in which the peeling mechanism 7 is fixed in position and the holding mechanism 6 is horizontally moved in the x direction to peel the adhesive tape T from the wafer W is exemplified, but the structure is not limited to the structure in which the holding mechanism 6 is moved. As long as the holding mechanism 6 is moved relative to the peeling mechanism 7, the holding mechanism 6 may be fixed and the peeling mechanism 7 may be moved horizontally, or both may be moved.
(7) in each of the embodiments and the modifications, the structure in which the bernoulli chuck is used as the wafer holding portion 4b is exemplified, but the invention is not limited thereto. In particular, when the wafer W to which the adhesive tape T is attached is conveyed to the holding mechanism 6, the wafer holding portion 4b may be conveyed in a state where the surface of the adhesive tape T is sucked and held.

Claims (18)

1. A method for peeling an adhesive tape adhered to a workpiece, the method comprising:
A conveying process in which the workpiece is conveyed to a peeling position;
A holding process of holding the work at the peeling position by a holding member being brought into contact with a peripheral edge portion of the work conveyed to the peeling position; and
And a peeling step of peeling a peeling tape while the peeling tape is attached to the adhesive tape by a peeling member and folded back, thereby peeling the adhesive tape and the peeling tape integrally from the work held at the peeling position.
2. The adhesive tape peeling method according to claim 1,
In the course of the said holding process,
Each of the holding members, which is in contact with the peripheral edge portion of the workpiece, holds the workpiece by urging the workpiece from the peripheral edge portion toward the central portion of the workpiece.
3. the adhesive tape peeling method according to claim 2,
In the course of the said holding process,
The magnitude of the force acting from the peripheral edge portion toward the central portion of the workpiece by each of the holding members is controlled to be an appropriate magnitude, and the workpiece is held at the peeling position.
4. The adhesive tape peeling method according to any one of claims 1 to 3,
The holding member is provided with an elastic body,
In the course of the said holding process,
the elastic body is elastically deformed by contact with a peripheral edge portion of the workpiece, thereby holding the workpiece.
5. The adhesive tape peeling method according to any one of claims 1 to 3,
The holding member is constituted so that the holding member is constituted,
Can be moved appropriately between a holding position in contact with the peripheral edge portion of the work and an avoiding position in which contact with the adhesive tape peeled from the work can be avoided,
in the course of the said stripping process,
the positions of the plurality of holding members are switched to the holding position and the avoidance position as appropriate, and the adhesive tape is peeled from the workpiece.
6. The adhesive tape peeling method according to any one of claims 1 to 3,
In the course of the said stripping process,
When the release tape is attached to the adhesive tape, the adhesive tape is adsorbed by an adsorbing member, thereby preventing deformation of the work due to a force generated when the release tape is attached.
7. The adhesive tape peeling method according to any one of claims 1 to 3,
In the course of the said stripping process,
When the release tape is bonded to the adhesive tape, a gas is blown to the workpiece by a 1 st gas supply mechanism, thereby preventing deformation of the workpiece due to a force generated when the release tape is bonded.
8. the adhesive tape peeling method according to any one of claims 1 to 3,
In the course of the said stripping process,
When the adhesive tape is peeled from the workpiece, the workpiece is sucked in a non-contact state by a suction mechanism, and deformation of the workpiece due to a force generated when the adhesive tape is peeled is prevented.
9. The adhesive tape peeling method according to any one of claims 1 to 3,
In the course of the said stripping process,
Blowing gas to the workpiece by a 2 nd gas supply mechanism when the adhesive tape is peeled from the workpiece prevents deformation of the workpiece due to a force generated when the adhesive tape is peeled.
10. an adhesive tape peeling apparatus for peeling an adhesive tape stuck to a workpiece, the adhesive tape peeling apparatus comprising:
A conveying mechanism that conveys the workpiece to a peeling position;
a holding member that holds the work at the peeling position by contacting a peripheral edge portion of the work conveyed to the peeling position; and
and a peeling mechanism configured to peel the release tape from the work held at the peeling position by peeling the release tape while the release tape is attached to the adhesive tape by a peeling member and folded back, thereby integrally peeling the adhesive tape and the release tape.
11. The adhesive tape peeling apparatus according to claim 10,
The adhesive tape peeling device includes a pressing mechanism that presses the work from the respective holding members in contact with the peripheral edge portion of the work toward the central portion of the work, thereby holding the work.
12. The adhesive tape peeling apparatus according to claim 11,
The adhesive tape peeling device includes a control mechanism for controlling the magnitude of the force applied from the peripheral edge portion of the workpiece to the central portion of the workpiece to an appropriate magnitude.
13. The adhesive tape peeling apparatus according to any one of claims 10 to 12,
the holding member is provided with an elastic body,
The elastic body is in contact with a peripheral edge portion of the workpiece and elastically deformed, thereby holding the workpiece.
14. the adhesive tape peeling apparatus according to any one of claims 10 to 12,
The adhesive tape peeling device has a drive mechanism for moving the holding member between a holding position in contact with the peripheral edge of the workpiece and an avoiding position capable of avoiding contact with the adhesive tape peeled from the workpiece,
The drive mechanism appropriately switches the positions of the plurality of holding members to the holding position and the avoidance position, and the peeling mechanism peels the adhesive tape from the workpiece.
15. The adhesive tape peeling apparatus according to any one of claims 10 to 12,
the adhesive tape peeling device includes an adsorbing member that adsorbs the adhesive tape when the peeling tape is attached to the adhesive tape, and prevents deformation of the work due to a force generated when the peeling mechanism attaches the peeling tape.
16. The adhesive tape peeling apparatus according to any one of claims 10 to 12,
The adhesive tape peeling device is provided with a 1 st gas supply mechanism, wherein the 1 st gas supply mechanism blows gas to the workpiece when the peeling tape is adhered to the adhesive tape, so that the workpiece is prevented from being deformed due to the force generated when the peeling mechanism adheres the peeling tape.
17. The adhesive tape peeling apparatus according to any one of claims 10 to 12,
The adhesive tape peeling device has a suction mechanism that sucks the workpiece in a non-contact state when the adhesive tape is peeled from the workpiece, and prevents deformation of the workpiece due to a force generated when the peeling mechanism peels the adhesive tape.
18. The adhesive tape peeling apparatus according to any one of claims 10 to 12,
The adhesive tape peeling apparatus has a 2 nd gas supply mechanism that blows gas to the workpiece when the adhesive tape is peeled from the workpiece by the 2 nd gas supply mechanism, and prevents deformation of the workpiece due to a force generated when the peeling mechanism peels the adhesive tape.
CN201910472744.6A 2018-05-31 2019-05-31 Adhesive tape peeling method and adhesive tape peeling apparatus Pending CN110556328A (en)

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JP4502547B2 (en) 2000-08-07 2010-07-14 日東電工株式会社 Method and apparatus for removing protective tape of semiconductor wafer
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Application publication date: 20191210