CN105529260A - Adhesive tape adhering method and adhesive tape adhering device - Google Patents
Adhesive tape adhering method and adhesive tape adhering device Download PDFInfo
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- CN105529260A CN105529260A CN201510685128.0A CN201510685128A CN105529260A CN 105529260 A CN105529260 A CN 105529260A CN 201510685128 A CN201510685128 A CN 201510685128A CN 105529260 A CN105529260 A CN 105529260A
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- supporting member
- adhesive tape
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- wafer
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
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- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Textile Engineering (AREA)
Abstract
The invention provides an adhesive tape adhering method and an adhesive tape adhering device. Thus, an adhesive tape can be well adhered to a recessed region which is provided with a recessed and protruded substrate and the outer side of a protruding region of a protruding part is formed on the recessed region. An elastic first support component (34) is used for supporting a protruding region (36) on which a boss (37) is formed. The boss (37) is at least a boss formed on a substrate or a recess or boss on a wafer (W). An annular second support component (35) whose rigidity is higher than that of the first support component (34) is used for supporting a recessed region (38) of the periphery of the wafer (W). While a support plate (G) is pressed on a double-faced adhesive tape sheet (ta) which has been adhered to the wafer (W) supported by the first support component (34) and the second support component (35), the double-faced adhesive tape sheet (ta) is adhered to the wafer (W).
Description
Technical field
The present invention relates to for by adhesive tape joining in the adhesive tape joining method of the irregular substrate of tool such as semiconductor crystal wafer (following, be suitably called " wafer "), circuit substrate, LED-baseplate and adhesive tape joining apparatus.
Background technology
When substrate is such as semiconductor crystal wafer, overleaf before grinding by the adhesive tape joining of protection in circuit forming surface (with reference to patent documentation 1).
In addition, in order to tackle the requirement of high-density installation in recent years, there is wafer and maximizing and the tendency making the further thinning of wafer.In order to take into account protection and intensifier circuit forming surface, the support plates such as glass substrate are fitted in wafer (reference patent documentation 2) by double-faced adhesive tape.
Patent documentation 1: Japanese Unexamined Patent Publication 2010-272755 publication
Patent documentation 2: Japanese Unexamined Patent Publication 2005-88379 publication
Summary of the invention
the problem that invention will solve
For double-faced adhesive tape and boundary belt, in the method in the past of utilization by adhesive tape joining in wafer, create following problem: contaminant water, dust enter the interface between adhesive tape and wafer and makes circuit pollution and breakage when grinding.
The present invention makes, its main purpose is, provide a kind of adhesive tape precision can be pasted on well the adhesive tape joining method and adhesive tape joining apparatus that form irregular substrate in view of such situation.
for the scheme of dealing with problems
Therefore; inventor repeats the adhesive tape (boundary belt) of protection be pasted on the wafer of each different form and support plate fitted in the experiment of wafer of each different form by double-faced adhesive tape, and the reason producing the circuit pollution of wafer etc. of having concentrated on studies.Its result, inventor obtains following opinion.
When support plate being fitted in wafer by double-faced adhesive tape, be formed with projection at this wafer rear.Therefore, be formed projection convex domain and around the wafer periphery of this convex domain recessed region between create gap.When this wafer being placed in holding station and the support plate being attached to double-faced adhesive tape in advance being fitted in wafer, pressing force is adjusted to the degree of the projection breakage not making to contact with holding station.Thus, known: act on and not contact with holding station and the pressing force not being kept the recessed region that platform supports is less than the pressing force acting on convex domain, its result, double-faced adhesive tape is not sealed at recessed region.
Similarly, for the adhesive tape of protection being pasted on crystal column surface, known: to create identical problem because of the gap be formed with between the convex domain of circuit and the recessed region of periphery.
Therefore, in order to realize such object, the present invention adopts following structure.
Namely, a kind of adhesive tape joining method, it is by the adhesive tape joining method of adhesive tape joining in the irregular substrate of tool, it is characterized in that, utilize have flexible 1st supporting member to support described concavo-convex at least convex domain, utilize hardness higher than the hardness of described 1st supporting member and the 2nd supporting member of ring-type comes the recessed region of supporting substrates periphery, by adhesive tape joining in the substrate supported by described 1st supporting member and described 2nd supporting member.
Adopt described method, by adhesive tape joining in substrate time, when load acts on convex domain, the 1st supporting member generation strain.Meanwhile, along with the strain of the 1st supporting member, load also acts on recessed region.Because recessed region is supported by having the 2nd supporting member of hardness higher than the hardness of the 1st supporting member, therefore, it is possible to make the load acting on recessed region be more than the load acting on convex domain.Thus, adhesive tape can be made to be sealed at recessed region, preventing pollution water, dust can enter the interface between adhesive tape and substrate when carrying out grinding to the back side of substrate thus.
In addition, when the back side of substrate has projection, also adhesive tape can be pasted as follows.
Such as, the 1st supporting member as flexure strip is loaded and remains in holding station, 2nd supporting member with the height identical with the height of projection loaded and remains on the 1st supporting member, pasting adhesive tape by under the state of substrate-placing on the 2nd supporting member.
Or, 2nd supporting member is loaded and remains in holding station, the 1st supporting member as flexure strip is loaded and remains on the 2nd supporting member, adjust the thickness of the 1st supporting member and the 2nd supporting member, to make the pressing force acting on recessed region be more than the pressing force acting on convex domain when pasting adhesive tape on the 1st supporting member substrate-placing.
In addition, in order to realize such object, the present invention adopts following structure.
That is, an adhesive tape joining apparatus, its for by adhesive tape joining in the irregular substrate of tool, it is characterized in that, this adhesive tape joining apparatus comprises: the 1st supporting member, and it has elasticity, for support described concavo-convex at least convex domain; 2nd supporting member, its hardness higher than the hardness of the 1st supporting member, for supporting the recessed region of the periphery of described substrate; And labelling machine, its for by adhesive tape joining in being positioned in the substrate on the 1st supporting member and the 2nd supporting member.
Adopt this structure, when adhesive band, the 1st supporting member generation strain of a supporting convex domain.Because another recessed region is supported by having the 2nd supporting member of hardness higher than the hardness of the 1st supporting member, therefore, the load acting on recessed region can be made to be more than the load acting on convex domain.Thus, described method can preferably be implemented.
the effect of invention
Adopt adhesive tape joining method of the present invention and adhesive tape joining apparatus, adhesive tape can be made to be sealed at the recessed region of the irregular substrate of tool.
Accompanying drawing explanation
Fig. 1 is the integrally-built vertical view representing adhesive tape joining apparatus.
The front view of Tu2Shi adhesive tape joining mechanism.
Fig. 3 is the stereogram of cutting roller.
Fig. 4 is the front view of the schematic configuration representing barrier film mechanism for stripping.
Fig. 5 is the longitudinal section of support plate adhesion mechanism.
Fig. 6 is the exploded perspective view of the structure representing holding station.
Fig. 7 is longitudinal section when wafer being placed in holding station.
Fig. 8 is the schematic diagram of the sticking placement representing both-sided adhesive strap.
Fig. 9 is the schematic diagram of the sticking placement representing both-sided adhesive strap.
Figure 10 is the schematic diagram representing action support plate being fitted in wafer.
Figure 11 is the schematic diagram representing action support plate being fitted in wafer.
Figure 12 is the partial enlarged drawing representing the state being fitted with support plate.
Figure 13 is the front view of the structure of the holding station representing variation.
Figure 14 represents to utilize the holding station of variation to the schematic diagram of the action of support plate of fitting.
Figure 15 is the front view of the structure of the holding station representing variation.
Embodiment
Hereinafter, with reference to the accompanying drawings of embodiments of the invention.In addition, in the present embodiment, as shown in Figure 12 and Figure 13, the back side after the back side grinding of semiconductor crystal wafer (following, to be suitably called " wafer ") and surface are formed with the projected electrodes 37 such as soft soldering pellet, projection.Such as, the thickness of wafer W is less than 100 μm, and the spacing between the thickness of projected electrode 37 and projected electrode is 100 μm.
Figure 1 illustrates the vertical view of adhesive tape joining apparatus.
This adhesive tape joining apparatus supplies recoverer 1, the 1st substrate carrying mechanism 2, aligning guide 3, adhesive tape joining mechanism 4, barrier film mechanism for stripping 5 and support plate fit body 6 etc. by substrate and forms.Below, each structure is described in detail.
Two boxes C1, C2 are placed with at substrate supply recoverer 1.More wafers W inserts with flat-hand position multilayer and is contained in a box C1.Be fitted with strengthen support plate G wafer W and laminating before support plate G insert with flat-hand position multilayer and be contained in another box C2.Support plate G is formed by the glass substrate or stainless steel etc. of such as identical with the shape of wafer W shape.In addition, wafer W holds in the supine mode of circuit.
1st substrate carrying mechanism 2 comprises mechanical arm 7.This mechanical arm 7 is moved horizontally by movable table.Mechanical arm 7 itself is configured to movement of can retreating in the horizontal direction, and entirety can carry out rotating and being elevated.Further, the board holder in horseshoe-shaped vacuum adsorption type is provided with on the top of mechanical arm 7.
Aligning guide 3, while make wafer W and support plate G rotate under the state utilizing the sucker suction of retreating relative to holding surface to remain the back side of wafer W and support plate G, detects the alignment mark such as recess being formed at each periphery.Afterwards, the center that aligning guide 3 carries out wafer W and support plate G according to this testing result is aimed at.
As shown in Figure 2, adhesive tape joining mechanism 4 is made up of holding station 8, double-faced adhesive tape feed mechanism 9, cutting mechanism 10, dancer rools 11, not band recovering mechanism 12, barrier film mechanism for stripping 13, barrier film recovering mechanism 14 and labelling machine 15 etc.
Holding station 8 adsorbs for carrying out wafer rear the chuck table kept.This holding station 8 is configured to move along being layed in the guide rail received between the receiving position of wafer W and the paste position pasting both-sided adhesive strap ta described later from mechanical arm 7.In addition, the flexure strip with gas permeability is provided with on the surface of holding station 8.
Double-faced adhesive tape feed mechanism 9 comprises the spool being provided with the stock roll be rolled into by double-faced adhesive tape T.This double-faced adhesive tape feed mechanism 9 is configured to, while the tension force of regulation is put on the double-faced adhesive tape T from stock roll releasing while guided along the transport path of regulation by this double-faced adhesive tape T by dancer rools 11, and this double-faced adhesive tape T is supplied to barrier film mechanism for stripping 13 via cutting mechanism 10.In addition, barrier film S is attached on the surface of double-faced adhesive tape T and the back side.
Cutting mechanism about 10 is relatively equipped with synchronously driven cutting roller 16 and backing roll 17.As shown in Figure 3, cutting roller 16 sheet 19 being formed with cutting tool 18 is installed on driven roller 20 and forms.Cutting tool 18 is formed as double-faced adhesive tape T to be cut conglobate ring-type.
Backing roll 17 is metal driven rollers.In addition, at least one be configured in cutting roller 16 and backing roll 17 can utilize driving cylinder to be elevated.Thus, the setting can changing the gap of two rollers 16,17 according to the thickness of double-faced adhesive tape T is configured to.
Be with recovering mechanism 12 to be configured to, the barrier film S of the front of adjacent band conveying roller 33 by side overleaf cut away circular both-sided adhesive strap ta and the double-faced adhesive tape T ' do not wanted connected with barrier film S-phase peels off from barrier film S and batches in reclaiming spool 22.Thus, the barrier film S remaining both-sided adhesive strap ta is directed into barrier film mechanism for stripping 1.
Barrier film mechanism for stripping 13 comprises peeling member 23.Peeling member 23 has the flat horizontal surface that flatly can keep both-sided adhesive strap ta.In addition, the top of peeling member 23 is the tabulars with the tapering taper in top, to be turned back by barrier film S and while being guided to barrier film recovering mechanism 14 by barrier film S, peeled off by both-sided adhesive strap ta and forwards release utilizing this top.
Labelling machine 15 comprises Sticking roller 25.The top of the both-sided adhesive strap ta released from peeling member 23 presses and is pasted on the wafer W kept by holding station 8 by Sticking roller 25.
As shown in Figure 1, the 2nd substrate carrying mechanism 26 carries wafer W to adsorb the mode keeping being pasted with the surface of the wafer W of both-sided adhesive strap ta.That is, the 2nd substrate carrying mechanism 26 can along be layed in device frame rail moving movable table on comprise the adsorption plate 27 that can carry out being elevated.
As shown in Figure 4, barrier film mechanism for stripping 5 comprises band supply unit 30, holding station 31, stripper roll 32 and band recoverer 33.
The spool of band supply unit 30 is filled with the stock roll of the width release band PE less than the diameter of both-sided adhesive strap ta.The release band PE released from this band supply unit 30 is guided to stripper roll 32.
As shown in Figure 5, holding station 31 be contained in a pair upper cover 45A and lower cover 45B up and down of the chamber 45 forming support plate fit body 6 described later, in lower cover 45B.
In addition, as shown in Figure 6 and Figure 7, on the surface of holding station 31, the 1st supporting member 34 and the 2nd supporting member 35 is laminated with according to the order of the 1st supporting member 34 and the 2nd supporting member 35.1st supporting member 34 is made up of flexure strips such as silicon rubber.
As shown in Figure 6, the 2nd supporting member 35 is by cutting away the outer loop-shaped of convex domain 36 of circuit pattern of wafer W and the plate of the ring-type obtained is formed.As shown in Figure 7, the 2nd supporting member 35 is set to diameter and is greater than the diameter of wafer W and thickness is below the height of projection 37 (haunched member).That is, when the recessed region 38 not forming projection 37 of wafer rear periphery is connected to the 2nd supporting member 35, the top of projection 37 contacts with the 1st supporting member 34.In addition, the 2nd supporting member 35 is formed by the component of the hard such as such as PET (polyethyleneterephthalate: PETG).
1st supporting member 34 and the 2nd supporting member 35 are formed with multiple pin-and-hole 39a, 39b, erect the fulcrum post 40 being arranged at holding station 31 and be sticked in each pin-and-hole 39a, 39b.
In addition, as shown in Figure 1, lower cover 45B is configured to, and moves back and forth under the state accommodating holding station 31 along guide rail 41 between the stripping position and the below of upper cover 45A of barrier film.
Stripper roll 32 is formed in the mode can being undertaken being elevated by cylinder.That is, in holding station 31, release band PE is pasted on the barrier film S on the surface being attached to both-sided adhesive strap ta.
With recoverer 33 the release band PE being pasted with barrier film S is batched recovery with the mode that band supply unit 30 releases the peeling rate of the emitting rate of release band PE and barrier film S synchronous.
As shown in Figure 5, labelling machine 15 comprises chamber 45 and labelling machine 46 etc.
Chamber 45 is made up of upper and lower a pair upper cover 45A and lower cover 45B.
Upper cover 45A is located at lift drive mechanism 47.This lift drive mechanism 47 comprises: movable table 50, and it can be elevated along the track 49 of the longitudinally configuration at the back of longitudinal wall 48; Movable framework 51, it is supported on this movable table 50 can regulate the mode of height; And arm 52, it extends toward the front from this movable framework 51.Upper cover 45B is installed on the bolster 53 extended from the top ends of this arm 52 downwards.
Movable table 50 is by utilizing motor 58 to make leading screw 57 positive and reverse return then carrying out screwfeed lifting.In addition, the pressing plate 59 that can be elevated is built-in with in the inside of upper cover 45A.
Adhesive tape joining apparatus of the present invention is formed as described above.Illustrating with reference to Fig. 8 ~ Figure 12 uses this adhesive tape joining apparatus double-faced adhesive tape T to be pasted on wafer W and support plate G to be fitted in a series of action of wafer W by both-sided adhesive strap ta.
First, initial setting up is carried out.Such as, the 1st supporting member 34 and the 2nd supporting member 35 are placed in holding station 31.After completing initial setting, make device work.
Between the wafer W top of mechanical arm 7 being inserted into box C1, from the back side, absorption keeps wafer W and is exported by wafer W.On the sucker that the holding surface that wafer W is handed off to autoregistration mechanism 3 by mechanical arm 7 is given prominence to.Aligning guide 3 basis under the state utilizing sucker suction wafer W is formed at the alignment marks such as the recess of this wafer W and obtains center and carry out contraposition.After completing contraposition, wafer W is also positioned in holding station 8 by the wafer W again utilizing mechanical arm 7 to adsorb to have been held up from adsorption plane by sucker.
Holding station 8 moves to the paste position of adhesive tape joining mechanism 4 under the state of absorption maintenance wafer W.
While the starting working of device, adhesive tape joining mechanism 4 also interlock.This adhesive tape joining mechanism 4 releases and supplies banded double-faced adhesive tape T.In on two sides with the double-faced adhesive tape T of barrier film S by the process between the cutting roller 16 of cutting mechanism 10 and backing roll 17, upper this double-faced adhesive tape T of the barrier film S of side is the double-sided adhesive sheet ta of circle by cutting roller 16 hemisect rotated by driving overleaf.
The complete double-faced adhesive tape T of hemisect via dancer rools 11 by not being with recoverer 12 to carry.In this process, be with recoverer 12 to utilize conveying roller 21 to be peeled off by the double-faced adhesive tape T ' do not wanted after cutting away both-sided adhesive strap ta and batched by the double-faced adhesive tape T ' do not wanted to reclaim in recovery spool 22.
The barrier film S remaining the rear side of both-sided adhesive strap ta is carried by barrier film mechanism for stripping 13.When both-sided adhesive strap ta arrives stripping position, barrier film mechanism for stripping 13 makes the transporting velocity of holding station 8 and double-faced adhesive tape T move synchronously to the throughput direction of double-faced adhesive tape T.
Now, when releasing the both-sided adhesive strap ta that self-isolation film S strips down from the top of peeling member 23, as shown in Figure 8 and Figure 9, make Sticking roller 25, towards the end decline of the wafer W in the holding station 8 that paste position is standby, both-sided adhesive strap ta is pasted on wafer W.Afterwards, by making holding station 8 synchronously move with the transporting velocity of double-faced adhesive tape T, thus the both-sided adhesive strap ta that Sticking roller 25 is stripped with identical speed at self-isolation film S rolls.Thus, both-sided adhesive strap ta is pasted on whole of wafer W by Sticking roller 25.In this moment, both-sided adhesive strap ta is not sealed at the recessed region of wafer W.
After completing stickup both-sided adhesive strap ta, holding station 8 moves to the delivery position of the 2nd substrate carrying mechanism 26.2nd substrate carrying mechanism 26 adsorbs the surface the holding station 31 be placed in by wafer W by barrier film mechanism for stripping 5 side that keep wafer W.
Now, the convex domain 36 of the projection 37 of wafer W is supported by the 1st supporting member 34, and the recessed region 38 of wafer W is supported by the 2nd supporting member 35.
After being loaded by wafer W and be held in holding station 31, stripper roll 32 drops to the end side of both-sided adhesive strap ta and pastes release band PE.Afterwards, as shown in Figure 4, while making stripping table 31 movement, synchronously carry supply unit 30 with translational speed supply release band PE, and utilize band recoverer 33 to batch recovery by with the barrier film S that release band PE becomes to be integrated.
Completing after both-sided adhesive strap ta peels off barrier film S, holding station 31 is moved to the below of upper cover 45A.
In addition, during pasting both-sided adhesive strap ta to wafer W, utilize mechanical arm 7 to export support plate G from box C2, and utilize aligning guide 3 couples of support plate G to aim at.The support plate G aimed at is adsorbed by mechanical arm 7 and keeps and be handed off on the pressing plate 59 that is provided in upper cover 45A.Pressing plate 59 is standby under the state of absorption maintenance support plate G, until wafer W is transferred.
After holding station 31 arrives the below of upper cover 45, as shown in Figure 10, upper cover 45A is made to decline and make upper cover 45A dock with lower cover 45B and form chamber 45.
After by the inner pressure relief of chamber 45 to the air pressure specified, as shown in figure 11, pressing plate 59 is made to decline and support plate G is pasted on both-sided adhesive strap ta.Now, because the height of the 2nd supporting member 35 is a little less than the height of projection 37, therefore, the top of projection 37 presses on the 1st supporting member 34.But when reaching the load of regulation, as shown in figure 12, the decline of pressing plate 59 is subject to the restriction of the 2nd supporting member 35 in the recessed region 38 of supporting wafer W, and the load that projection 37 applies is absorbed by the strain of the 1st supporting member 34.Thus, the load acting on recessed region 38 is more than the load acting on convex domain 36.In other words, the load p 1 acting on convex domain 36 and the load acting on recessed region 38 meet the relation of P1≤P2.
After support plate G is pressed on both-sided adhesive strap ta by the cost stipulated time, make to turn back to atmospheric pressure in chamber 45 and make upper cover 45A and pressing plate 59 increase and chamber 45 is opened wide.
Make the top of mechanical arm 7 overturn and make adsorption plane down, absorption keeps support plate G and is contained in box C2.
Above, complete a series of process, repeat described process, until complete the process of regulation sheet number.
Adopt described embodiment device, under the state in a concave region 38, support plate G is fitted in wafer W, therefore, it is possible to make both-sided adhesive strap ta be sealed at the recessed region 38 of wafer W at the 2nd supporting member 35 utilizing hardness higher than the hardness of the 1st supporting member 34 of the convex domain 36 for supporting wafer W.Thus, preventing pollution water, dust bonding interface between both-sided adhesive strap ta and wafer W can be entered.
In addition, the present invention can also implement with following such form.
(1) in the described embodiment, also can be configured to, as shown in figure 13, after the 2nd supporting member 35 is positioned in holding station 31, the 1st supporting member 34 is positioned on the 2nd supporting member 35.In this case, the thickness of the 1st supporting member 34 and the 2nd supporting member 35 is suitably set, so that the load p 1 making to act on convex domain 36 and the load that acts on recessed region 38 meet the relation of P1≤P2 according to the relation between the height of projection 37 and the modulus of elasticity of the 1st supporting member 34.According to this relation, as shown in figure 14, the 1st supporting member 34 strain is while be pressed into carrying out in the part of excising according to projection 37 of the 2nd supporting member 35.Thus, the excessive pressing acting on projection 37 is absorbed.Because the 2nd supporting member 35 is difficult to strain occurs, therefore, pressing plate 59 is greater than to the load that the recessed region 38 of being supported by the 2nd supporting member 35 applies the load that pressing plate 59 pairs of convex domains 36 apply.Thus, double-faced adhesive tape T precision can be made to be sealed at recessed region 38 well.
(2) in the described embodiment, support plate G also can be internal diameter cut fall circle circular.
(3) in the described embodiment, also can bury heater underground in the pressing plate 59 for pressing support plate G, heating support plate G and being fitted in wafer W.
(4) in the described embodiment, also can bury heater underground in the pressing plate 59 for pressing support plate G, heating support plate G and being fitted in wafer W.
(5) in the described embodiment, be illustrated for the wafer W of circle, but the present invention also can be applied to the substrate of the quadrangle being formed with LED with two-dimensional array shape.In this case, as long as be configured to the ring-type of being excised along the outer ring of convex domain by the 2nd supporting member being used for supporting the recessed region of the periphery not forming LED.
(6) when wafer rear be smooth and only there is the situation of convex domain from the teeth outwards, overleaf not there is the convex domains such as projection, also can form as follows.
Such as, as shown in figure 15, utilize the component of the hard such as the Porous of metal or pottery to form the outer peripheral portion 70 for supporting the rear side in recessed region 38 of holding station 31A, by having the elastomer 71 of gas permeability in the part that will carry out abutting to support the rear side of convex domain 36.In addition, peripheral members 70 is equivalent to the 2nd supporting member of the present invention, and elastomer 71 is equivalent to the 1st supporting member of the present invention.
Adopt this structure, when load acts on convex domain 36, there is strain and alleviate load in elastomer 71.Because the outer peripheral portion 70 in concave region 38 strain does not occur, therefore, the load acting on recessed region 38 is more than the load acting on convex domain 36.Thus, the effect identical with described structure can be obtained.
description of reference numerals
4, adhesive tape joining mechanism; 6, mechanical arm 7; 8, holding station; 15, labelling machine; 25, Sticking roller; 31, holding station; 34, the 1st supporting member; 35, the 2nd supporting member; 36, convex domain; 37, projection; 38, recessed region; 45, chamber; 59, pressing plate; W, semiconductor crystal wafer; T, double-faced adhesive tape; Ta, both-sided adhesive strap.
Claims (7)
1. an adhesive tape joining method, it is by the adhesive tape joining method of adhesive tape joining in the irregular substrate of tool, it is characterized in that,
Utilize have flexible 1st supporting member to support described concavo-convex at least convex domain,
Utilize hardness higher than the hardness of described 1st supporting member and the 2nd supporting member of ring-type comes the recessed region of supporting substrates periphery,
By adhesive tape joining in the substrate supported by described 1st supporting member and described 2nd supporting member.
2. adhesive tape joining method according to claim 1, is characterized in that,
At the back side of described substrate, there is projection,
Described 1st supporting member as flexure strip is loaded and remains in holding station,
2nd supporting member with the height identical with the height of projection is loaded and remains on described 1st supporting member,
Adhesive tape is being pasted by under the state of substrate-placing on described 2nd supporting member.
3. adhesive tape joining method according to claim 1, is characterized in that,
At the back side of described substrate, there is projection,
Described 2nd supporting member is loaded and remains in holding station,
The 1st supporting member as flexure strip is loaded and remains on the 2nd supporting member,
Adjust the thickness of the 1st supporting member and the 2nd supporting member, to make the pressing force acting on recessed region be more than the pressing force acting on convex domain when pasting adhesive tape on described 1st supporting member substrate-placing.
4. an adhesive tape joining apparatus, its for by adhesive tape joining in the irregular substrate of tool, it is characterized in that,
This adhesive tape joining apparatus comprises:
1st supporting member, it has elasticity, for support described concavo-convex at least convex domain;
2nd supporting member, its hardness higher than the hardness of the 1st supporting member, for supporting the recessed region of the periphery of described substrate; And
Labelling machine, its for by adhesive tape joining in being positioned in the substrate on the 1st supporting member and the 2nd supporting member.
5. adhesive tape joining apparatus according to claim 4, is characterized in that,
Described 1st supporting member is flexure strip,
This adhesive tape joining apparatus comprises the holding station for being equipped with described 1st supporting member and described 2nd supporting member in stacked mode.
6. adhesive tape joining apparatus according to claim 5, is characterized in that,
This adhesive tape joining apparatus is configured to,
1st supporting member is positioned in described holding station,
2nd supporting member of the height identical with the height of projection of protuberance as the back side being formed at substrate is loaded and remains on described 1st supporting member.
7. adhesive tape joining apparatus according to claim 5, is characterized in that,
This adhesive tape joining apparatus is configured to,
2nd supporting member is positioned in described holding station,
By substrate-placing on described 1st supporting member,
The thickness of the 1st supporting member and the 2nd supporting member is adjusted, makes the pressing force acting on described recessed region be more than the pressing force acting on convex domain.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014-214643 | 2014-10-21 | ||
| JP2014214643A JP2016082166A (en) | 2014-10-21 | 2014-10-21 | Adhesive tape joining method and adhesive tape joining device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105529260A true CN105529260A (en) | 2016-04-27 |
Family
ID=55771407
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510685128.0A Pending CN105529260A (en) | 2014-10-21 | 2015-10-20 | Adhesive tape adhering method and adhesive tape adhering device |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2016082166A (en) |
| KR (1) | KR20160046732A (en) |
| CN (1) | CN105529260A (en) |
| TW (1) | TW201622042A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109119372A (en) * | 2017-06-26 | 2019-01-01 | 日本特殊陶业株式会社 | Substrate holding structure |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021033384A1 (en) * | 2019-08-20 | 2021-02-25 | 西川 吉秀 | Method for manufacturing half-cut finished double-sided tape and device for adhering half-cut finished double-sided tape |
| WO2021235035A1 (en) * | 2020-05-22 | 2021-11-25 | 吉秀 西川 | Sticking device |
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| JP2000040898A (en) * | 1998-05-27 | 2000-02-08 | Lucent Technol Inc | Method for distributing chip with solder bump on front surface using tape for carrying chip |
| US7575955B2 (en) * | 2004-01-06 | 2009-08-18 | Ismat Corporation | Method for making electronic packages |
| JP2009188010A (en) * | 2008-02-04 | 2009-08-20 | Lintec Corp | Support for use of fragile member, and treatment method of the fragile member |
| JP2010272755A (en) * | 2009-05-22 | 2010-12-02 | Nitto Denko Corp | Method and apparatus of sticking protective tape |
| CN102097294A (en) * | 2009-11-20 | 2011-06-15 | 日东电工株式会社 | Adhesive tape joining apparatus and adhesive tape joining method |
| JP2013038175A (en) * | 2011-08-05 | 2013-02-21 | Hitachi Chem Co Ltd | Manufacturing method of semiconductor device, film glue, and adhesive sheet |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005088379A (en) | 2003-09-17 | 2005-04-07 | Dainippon Printing Co Ltd | Delivery form |
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2014
- 2014-10-21 JP JP2014214643A patent/JP2016082166A/en active Pending
-
2015
- 2015-10-15 TW TW104133799A patent/TW201622042A/en unknown
- 2015-10-16 KR KR1020150144461A patent/KR20160046732A/en unknown
- 2015-10-20 CN CN201510685128.0A patent/CN105529260A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000040898A (en) * | 1998-05-27 | 2000-02-08 | Lucent Technol Inc | Method for distributing chip with solder bump on front surface using tape for carrying chip |
| US7575955B2 (en) * | 2004-01-06 | 2009-08-18 | Ismat Corporation | Method for making electronic packages |
| JP2009188010A (en) * | 2008-02-04 | 2009-08-20 | Lintec Corp | Support for use of fragile member, and treatment method of the fragile member |
| JP2010272755A (en) * | 2009-05-22 | 2010-12-02 | Nitto Denko Corp | Method and apparatus of sticking protective tape |
| CN102097294A (en) * | 2009-11-20 | 2011-06-15 | 日东电工株式会社 | Adhesive tape joining apparatus and adhesive tape joining method |
| JP2013038175A (en) * | 2011-08-05 | 2013-02-21 | Hitachi Chem Co Ltd | Manufacturing method of semiconductor device, film glue, and adhesive sheet |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109119372A (en) * | 2017-06-26 | 2019-01-01 | 日本特殊陶业株式会社 | Substrate holding structure |
| CN109119372B (en) * | 2017-06-26 | 2023-04-25 | 日本特殊陶业株式会社 | Substrate holding member |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2016082166A (en) | 2016-05-16 |
| KR20160046732A (en) | 2016-04-29 |
| TW201622042A (en) | 2016-06-16 |
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