JP2016010922A - Peeling device, peeling method and pattern forming device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a technique by which a first plate-like body and a second plate-like body, closely bonded to each other through a processed layer, are preferably peeled off from each other.SOLUTION: The peeling device comprises: holding means that holds a first plate-like body; and first peeling means that has a first holding part which holds a second main face opposite to a first main face, bonded to the first plate-like body, of a second plate-like body and peels a held site of the second plate-like body held by he first holding part from the first plate-like body by separating the first holding part from the holding means, so as to progress peeling of the second plate-like body in a peeling-progressing direction, where the first holding part is displaced in the peeling-progressing direction according to the progress of the peeling of the second plate-like body.

Description

  The present invention relates to a peeling technique for peeling a first plate-like body and a second plate-like body that are in close contact with each other via a layer to be processed, and a first plate-like body or a second plate-like body using the peeling technique. The present invention relates to a pattern forming apparatus for forming a patterned layer to be processed.

  As an invention for manufacturing an electronic component using the above-described peeling technique, for example, an invention described in Patent Document 1 has been known. In the invention described in Patent Document 1, the pattern of the plate is transferred to the ink layer on the blanket by bringing a blanket having an ink layer into pressure contact with the plate, and thereby the ink patterned on the blanket. A layer (print pattern layer) is formed (first transfer step). After that, the blanket is brought into pressure contact with the substrate to transfer the pattern layer on the blanket to the substrate, whereby an ink pattern is formed on the substrate (second transfer step).

JP 2010-158799 A JP 2013-233757 A

  In the pattern forming technique described in Patent Document 1, a pattern layer is formed by patterning an ink layer by closely contacting a plate and a blanket through an ink layer. It is necessary to peel off. Further, the ink pattern layer is formed on the substrate by bringing the blanket and the substrate into close contact with each other via the pattern layer, but it is necessary to peel the blanket and the substrate that are in close contact with each other. In Patent Document 1, a specific configuration for peeling is not described, but for example, the peeling technique described in Patent Document 2 can be used.

  In Patent Document 2, the blanket is held by the suction plate in a substantially horizontal posture with the pattern layer facing upward, and the substrate is in close contact with the blanket via the pattern layer. The upper surface of the substrate is adsorbed by the lower ends of a plurality of adsorbers arranged in a predetermined arrangement direction, whereby the substrate is held in a substantially horizontal posture. Then, the suction tool moves from the suction tool located at one end in the arrangement direction to the suction tool located at the other end in the arrangement direction in a direction away from the blanket in the order of arrangement. Thereby, the peeling of the substrate from the blanket proceeds in a direction parallel to the arrangement direction, that is, in the peeling progress direction.

  By the way, in the peeling technique described in Patent Document 2, peeling is advanced while pulling up one end of the substrate to bend the substrate. Therefore, as will be described later with reference to the drawing (FIG. 10), when the above-described peeling technique is used, it is a natural process to pull up one end of the substrate after peeling in a shape close to an arc orbit. However, in the above-described peeling technique, the suction tool is pulled up vertically while adsorbing the substrate, so that the substrate is pulled to the side opposite to the peeling progress direction by the suction tool. As a result, a shearing force acts on the contact area before peeling, which may adversely affect the pattern. Such a problem is not specific to the case where the blanket and the substrate that are in close contact with each other via the pattern layer are peeled off, and the same problem is also caused when the plate and the blanket that are in close contact with each other via the ink layer are peeled off. May occur.

  The present invention has been made in view of the above-described problem, and is capable of satisfactorily peeling the first plate-like body and the second plate-like body which are in close contact with each other via the layer to be treated such as an ink layer or a pattern layer. It is an object of the present invention to provide a pattern forming apparatus capable of satisfactorily forming a processing target layer patterned on the first plate-like body or the second plate-like body using the technique and the peeling technique.

  A first aspect of the present invention is a peeling device for peeling a first plate-like body and a second plate-like body that are in close contact with each other via a layer to be processed, the holding means for holding the first plate-like body, A first holding part that holds the second main surface opposite to the first main surface that is in close contact with the first plate-like body of the second plate-like body, and the first holding part is separated from the holding means; And a first peeling means for peeling the portion to be held of the second plate-like body held by the first holding part from the first plate-like body to advance the peeling of the second plate-like body in the peeling progress direction. The first holding portion is characterized by being displaced in the peeling progress direction in accordance with the progress of peeling of the second plate-like body.

  According to a second aspect of the present invention, there is provided a peeling method for peeling the first plate-like body and the second plate-like body, which are in close contact with each other through the layer to be processed, and holding the first plate-like body by a holding means. And a second step of partially holding the second main surface opposite to the first main surface in close contact with the first plate-like body of the second plate-like body by the first holding portion, By separating the first holding portion that holds the second main surface from the holding means, the portion to be held of the second plate-like body that is held by the first holding portion is peeled off from the first plate-like body to form the second plate shape And a third step of moving the body in the peeling progress direction and displacing the first holding portion in the peeling progress direction in accordance with the progress of the peeling of the second plate-like body.

  Furthermore, in the third aspect of the present invention, after the first plate and the second plate are brought into close contact with each other through the layer to be processed, the second plate is peeled from the first plate. A pattern forming apparatus for forming a layer to be processed patterned on the first plate-like body or the second plate-like body, the holding means for holding the first plate-like body, and the first of the second plate-like bodies The first holding portion that holds the second main surface opposite to the first main surface that is in close contact with the plate-like body is provided, and the first holding portion that holds the second main surface is separated from the holding means. 1st peeling means which peels the to-be-held part of the 2nd plate-shaped object hold | maintained by 1 holding | maintenance part from a 1st plate-shaped object, and advances peeling of a 2nd plate-shaped body to the peeling advancing direction. It is a feature.

  According to the present invention, since the first holding portion is displaced in the peeling progress direction in accordance with the progress of the peeling of the second plate-like body, an extra external force acts on the second plate-like body during the peeling. It can prevent effectively, As a result, a 1st plate-shaped body and a 2nd plate-shaped body can be peeled favorably.

It is a perspective view which shows one Embodiment of the peeling apparatus concerning this invention. It is a perspective view which shows the main structures of the peeling apparatus shown in FIG. It is an arrow view of a 2nd adsorption | suction unit. It is a side view which shows the structure of an initial stage peeling unit, and the positional relationship of each part. It is a block diagram which shows the electrical structure of the peeling apparatus shown in FIG. It is a flowchart which shows a peeling process. It is a figure which shows the positional relationship of each part in each step in process. It is a figure which shows the positional relationship of each part in each step in process. It is a figure which shows the positional relationship of each part in each step in process. It is a figure for demonstrating the advantage of the peeling process in this embodiment.

  FIG. 1 is a perspective view showing an embodiment of a peeling apparatus according to the present invention. In order to uniformly indicate the direction in each figure, XYZ orthogonal coordinate axes are set as shown in the lower right of FIG. Here, the XY plane represents a horizontal plane and the Z axis represents a vertical axis. More specifically, the (+ Z) direction represents a vertically upward direction.

  This peeling apparatus 1 is an apparatus for peeling two plate-like bodies carried in with the main surfaces in close contact with each other. For example, it is used in a part of a pattern forming process for forming a predetermined pattern on the surface of a substrate such as a glass substrate or a semiconductor substrate. More specifically, in this pattern forming process, a pattern forming material is uniformly applied to a blanket surface as a carrier that temporarily carries a pattern to be transferred to a substrate that is a transfer target (application step). In addition, the coating layer is patterned by pressing a plate whose surface is processed according to the pattern shape against the coating layer on the blanket (patterning step), and a pattern layer is formed on the blanket. Further, the blanket thus formed with the pattern layer is brought into close contact with the substrate, whereby the pattern layer is finally transferred from the blanket to the substrate (transfer process), and the pattern layer is formed on the substrate.

  At this time, the apparatus can be suitably applied for the purpose of separating the plate and the blanket that are in close contact in the patterning step, or the substrate and the blanket that is in close contact in the transfer step. Of course, it may be used for both of these, and may be used for other purposes. For example, the present invention can also be applied to a peeling process when transferring a thin film carried on a carrier to a substrate.

  This peeling apparatus 1 has a structure in which a stage block 3 and an upper suction block 5 are respectively fixed on a main frame 11 attached to a housing. In FIG. 1, the housing is not shown to show the internal structure of the apparatus. In addition to these blocks, the peeling apparatus 1 includes a control unit 70 (FIG. 5) described later.

  The stage block 3 has a stage 30 for placing a close contact body (hereinafter referred to as “work”) in which a plate or a substrate and a blanket are in close contact, and the stage 30 is a flat surface whose upper surface is substantially horizontal. The horizontal stage part 31 which became and the taper stage part 32 where the upper surface became a plane which has the inclination of several degrees (for example, about 2 degree | times) with respect to a horizontal surface are provided. An initial peeling unit 33 is provided on the taper stage portion 32 side of the stage 30, that is, in the vicinity of the end on the (−Y) side. A roller unit 34 is provided so as to straddle the horizontal stage portion 31.

  On the other hand, the upper suction block 5 is erected from the main frame 11 and has a support frame 50 provided so as to cover the upper part of the stage block 3, a first suction unit 51 attached to the support frame 50, and a second An adsorption unit 52, a third adsorption unit 53, and a fourth adsorption unit 54 are provided. These adsorption units 51 to 54 are arranged in order in the (+ Y) direction.

  FIG. 2 is a perspective view showing a main configuration of the peeling apparatus shown in FIG. More specifically, FIG. 2 shows the structure of the stage 30, the roller unit 34, and the second suction unit 52 among the components of the peeling apparatus 1. The stage 30 includes a horizontal stage portion 31 whose upper surface 310 is a substantially horizontal surface and a tapered stage portion 32 whose upper surface 320 is a tapered surface. The upper surface 310 of the horizontal stage unit 31 has a plane size that is slightly larger than the plane size of the workpiece to be placed.

  The taper stage unit 32 is provided in close contact with the (−Y) side end of the horizontal stage unit 31, and the upper surface 320 thereof is the same height as the upper surface 310 of the horizontal stage unit 31 at the portion in contact with the horizontal stage unit 31. While located at (Z-direction position), it is retracted downward, that is, in the (−Z) direction, as it moves away from the horizontal stage portion 31 in the (−Y) direction. Therefore, in the entire stage 30, the horizontal surface of the upper surface 310 of the horizontal stage portion 31 and the tapered surface of the upper surface 320 of the tapered stage portion 32 are continuous, and the ridge line portion E to which they are connected has a linear shape extending in the X direction. ing.

  In addition, lattice-shaped grooves are formed on the upper surface 310 of the horizontal stage portion 31. More specifically, a grid-like groove 311 is provided at the center of the upper surface 310 of the horizontal stage portion 31 and one of the rectangles on the tapered stage portion 32 side is surrounded so as to surround the region where the groove 311 is formed. A groove 312 is provided on the peripheral edge of the upper surface 310 of the horizontal stage portion 31 so as to have a substantially U shape excluding the side. These grooves 311 and 312 are connected to a negative pressure supply unit 704 (FIG. 5), which will be described later, via a control valve. By supplying negative pressure, the workpiece placed on the stage 30 is sucked and held. It functions as an adsorption groove. The two types of grooves 311 and 312 are not connected on the stage, and are connected to the negative pressure supply unit 704 via independent control valves. Therefore, in addition to adsorption using both grooves, Adsorption using only grooves is also possible.

  A roller unit 34 is provided so as to straddle the stage 30 configured in this manner. Specifically, a pair of guide rails 351 and 352 extend in the Y direction along both ends in the X direction of the horizontal stage portion 31, and these guide rails 351 and 352 are fixed to the main frame 11. ing. A roller unit 34 is slidably attached to the guide rails 351 and 352.

  The roller unit 34 includes sliders 341 and 342 slidably engaged with the guide rails 351 and 352, respectively, and extends in the X direction across the upper part of the stage 30 so as to connect the sliders 341 and 342. The lower angle 343 is provided. An upper angle 345 is attached to the lower angle 343 via an appropriate lifting mechanism 344 so as to be movable up and down. A columnar peeling roller 340 extending in the X direction is attached to the upper angle 345 in a freely rotatable manner.

  When the upper angle 345 is lowered downward, that is, in the (−Z) direction by the lifting mechanism 344, the lower surface of the peeling roller 340 comes into contact with the upper surface of the work placed on the stage 30. On the other hand, in a state where the upper angle 345 is positioned upward, that is, in a position in the (+ Z) direction by the lifting mechanism 344, the peeling roller 340 is separated from the upper surface of the workpiece. A backup roller 346 for suppressing the bending of the peeling roller 340 is rotatably attached to the upper angle 345, and a rib for preventing the upper angle 345 itself from being bent is appropriately provided. The peeling roller 340 and the backup roller 346 do not have a drive source, and these rotate freely.

  The roller unit 34 is movable in the Y direction by a motor 353 attached to the main frame 11. More specifically, the lower angle 343 is connected to, for example, a ball screw mechanism 354 as a conversion mechanism that converts the rotational motion of the motor 353 into linear motion. When the motor 353 rotates, the lower angle 343 is guided to the guide rails 351, 351. The roller unit 34 moves in the Y direction by moving along the 352 in the Y direction. The movable range of the peeling roller 340 according to the movement of the roller unit 34 is as follows: (−Y) direction to the vicinity of the (−Y) side end portion of the horizontal stage portion 31, (+ Y) direction of the horizontal stage portion 31 ( The position is set to the outside of the (+ Y) side end, that is, the position further advanced to the (+ Y) side.

  Next, the configuration of the second adsorption unit 52 will be described. The first to fourth adsorption units 51 to 54 all have the same structure, and here, the structure of the second adsorption unit 52 will be described as a representative. The second suction unit 52 includes a beam member 521 that extends in the X direction and is fixed to the support frame 50. The beam member 521 has a pair of vertical downwards, that is, a (−Z) direction. The column members 522 and 523 are attached at different positions in the X direction. A plate member 524 is attached to the column members 522 and 523 via a guide rail that is hidden in the drawing so as to be lifted and lowered. The plate member 524 is lifted and lowered by a lifting mechanism 525 including a motor and a conversion mechanism (for example, a ball screw mechanism). Driven.

  A support mechanism 528 and a return mechanism 529 are provided below the plate member 524. Among these, the support mechanism 528 is a mechanism that supports the rod-shaped pad support member 526 extending in the X direction so as to be freely displaceable within a certain displaceable range (hereinafter referred to as “displaceable range”) in the Y direction. That is, in the present embodiment, the Y direction corresponds to the “displacement direction” of the present invention. On the other hand, the return mechanism 529 drives the pad support member 526 in the (−Y) direction to hold the suction pad 527 attached to the pad support member 526 (reference numeral P52 in FIGS. 7 to 9 described later). It is a mechanism to return to. Hereinafter, the configuration of the support mechanism 528 and the return mechanism 529 will be described with reference to FIGS. 2 and 3.

  3 is an arrow view of the second adsorption unit, FIG. 3 (a) is an arrow view taken along line AA in FIG. 2, and FIG. 3 (b) is an arrow view taken along line BB in FIG. is there. In addition, the code | symbol 5251 in the figure has shown the ball screw which is one component of the raising / lowering mechanism 525. FIG.

  In the support mechanism 528, three sets of guide support members 5282 having guide rails 5281 extending on the lower surface in the Y direction are attached to the lower portion of the plate member 524 at equal intervals in the X direction. In addition, a slider 5283 is slidably attached in the Y direction for each guide rail 5281, and a plate-like plate member 5284 extending in the X direction so as to connect these three sliders 5283 to each other is provided on the lower surface of each slider 5283. It is attached. Further, a pad support member 526 is attached to the lower surface of the plate member 5284, and a plurality of suction pads 527 are arranged on the lower surface of the pad support member 526 at equal intervals in the X direction. Thus, in this embodiment, the plurality of suction pads 527 are connected to the plate member 524 via the support mechanism 528. 2 shows a state in which the second suction unit 52 is moved upward from the actual position. However, when the plate member 524 is moved downward by the lifting mechanism 525, the suction pad 527 is moved to the horizontal stage portion. It is possible to descend to a position very close to the upper surface 310 of 31, and in contact with the upper surface of the workpiece when the workpiece is placed on the stage 30. A negative pressure from a negative pressure supply unit 704 described later is applied to each suction pad 527, and the upper surface of the workpiece is sucked and held. Further, by providing the support mechanism 528, the plurality of suction pads 527 are moved in the (+ Y) direction in conjunction with the peeling operation as will be described later, and (−Y) by the return mechanism 529 described next. It is moved in the direction and returned to the original position, that is, the holding start position. In this embodiment, three sets of guide rails 5281, guide support members 5282 and sliders 5283 are provided to achieve stable movement of the suction pads 527, but the number of these sets is not limited to “3”. Two sets or four or more sets may be provided.

  The return mechanism 529 has two sets of drive units 5291. Each driving portion 5291 has a locking member 5292 erected upward from the (−Y) direction side end portion of the plate member 5284 between the guide support members 5282, and the piston tip is locked by the locking member 5292. And an air cylinder 5293. The valve control unit 703 (FIG. 5) controls the opening and closing of a control valve (not shown) connected to each port of the air cylinder 5293, so that the piston can be freely expanded and contracted and the piston can be switched forward and backward. It has become. Therefore, in a state where the piston of the air cylinder 5293 is freely expanded and contracted, the pad support member 526 and the plurality of suction pads 527 can be integrally moved in the (+ Y) direction in conjunction with the peeling operation, while the air cylinder 5293 is moved. By actuating, the pad support member 526 and the plurality of suction pads 527 can be moved integrally in the (−Y) direction. In the first suction unit 51 among the first to fourth suction units 51 to 54, unlike the other suction units 52 to 54, the plate member corresponding to the plate member 524 is different from the column member as shown in FIG. Therefore, the air cylinder can be operated reversely to the air cylinder 5293 of the second suction unit 52 to move the plurality of suction pads in the (−Y) direction. . In this embodiment, the return mechanism 529 is configured by two sets of drive units 5291, but the number of drive units is not limited to "2" and is arbitrary.

  FIG. 4 is a side view showing the structure of the initial peeling unit and the positional relationship of each part. First, the structure of the initial peeling unit 33 will be described with reference to FIGS. 1 and 4. The initial peeling unit 33 has a bar-shaped pressing member 331 extending in the X direction above the taper stage portion 32, and the pressing member 331 is supported by a support arm 332. The support arm 332 is attached to the column member 334 via a guide rail 333 extending in the vertical direction, and the support arm 332 moves up and down with respect to the column member 334 by the operation of the lifting mechanism 335. The column member 334 is supported by a base portion 336 attached to the main frame 11, but the position adjustment mechanism 337 can adjust the position in the Y direction of the column member 334 on the base portion 336 within a predetermined range. .

  A workpiece WK as an object to be peeled is placed on a stage 30 constituted by the horizontal stage portion 31 and the taper stage portion 32. The workpiece in the patterning step described above is an adhesion body in which a plate and a blanket are in close contact via a thin film (processed layer) of a pattern forming material. On the other hand, the workpiece in the transfer process is an adhesion body in which the substrate and the blanket are in close contact via a patterned layer (layer to be processed). In the following, the peeling operation of the peeling apparatus 1 in the case where the contact body between the substrate SB and the blanket BL in the transfer process is the workpiece WK will be described. Can be done.

  In the work WK, it is assumed that the blanket BL has a larger planar size than the substrate SB. The substrate SB is in close contact with the substantially central portion of the blanket BL. The work WK is placed on the stage 30 with the blanket BL down and the substrate SB up. At this time, as shown in FIG. 4, the (−Y) side end portion of the substrate SB in the workpiece WK is substantially above the ridge line portion E at the boundary between the horizontal stage portion 31 and the taper stage portion 32, more specifically, the ridge line portion. The workpiece WK is placed on the stage 30 so that the position is slightly shifted to the (−Y) side from E. Accordingly, the blanket BL outside the substrate SB in the (−Y) direction is disposed so as to protrude onto the taper stage portion 32, and a gap is generated between the lower surface of the blanket BL and the upper surface 320 of the taper stage portion 32. . An angle θ formed by the lower surface of the blanket BL and the upper surface 320 of the taper stage portion 32 is about the same number of degrees (2 degrees in this embodiment) as the taper angle of the taper stage portion 32.

  The horizontal stage portion 31 is provided with suction grooves 311 and 312 to hold the lower surface of the blanket BL by suction. Among them, the suction groove 311 sucks the lower surface of the blanket BL that hits the lower part of the substrate SB, while the suction groove 312 sucks the lower surface of the blanket BL outside the substrate SB. The suction grooves 311 and 312 can independently turn on and off the suction, and the two types of suction grooves 311 and 312 can be used together to strongly suck the blanket BL. On the other hand, by performing suction using only the outer suction groove 312 and not performing suction on the central portion of the blanket BL where the pattern is effectively formed, a pattern resulting from the deflection of the blanket BL due to suction. Can prevent damage. As described above, by independently controlling the negative pressure supply to the suction groove 311 at the center and the suction groove 312 at the peripheral edge, it is possible to switch the suction holding mode of the blanket BL according to the purpose. Yes.

  Thus, the first to fourth suction units 51 to 54 and the peeling roller 340 of the roller unit 34 are arranged above the work WK sucked and held on the stage 30. As described above, the plurality of suction pads 527 are arranged below the second suction unit 52 in the X direction. More specifically, the suction pad 527 is integrally formed of a material having flexibility and elasticity, such as rubber or silicon resin, and the lower surface thereof contacts the upper surface of the work WK (more specifically, the upper surface of the substrate SB). It has an adsorbing part 527a that comes into contact with it and adsorbs and holds it, and a bellows part 527b that has elasticity in the vertical direction (Z direction). The suction pads provided in the other suction units 51, 53, and 54 have the same structure, but in the following, reference numerals 516, 536, and 546 are assigned to the pad support members provided in these suction units 51, 53, and 54, respectively. In addition, the suction pads are distinguished from each other by being given reference numerals 517, 537, and 547, respectively.

  The first suction unit 51 is provided above the (−Y) side end of the horizontal stage portion 31, and the suction pad 517 positioned at the holding start position P51 is lowered to the (−Y) side end of the substrate SB. Adsorb and hold the upper surface of the part. On the other hand, the fourth suction unit 54 is provided above the (+ Y) side end portion of the substrate SB placed on the stage 30, and the suction pad 547 positioned at the holding start position P54 descends to bring the substrate SB. The upper surface of the (+ Y) side end of is sucked and held. The second suction unit 52 and the third suction unit 53 are appropriately distributed between them, and for example, the suction pads 517 to 547 can be arranged at substantially equal intervals in the Y direction. Between these adsorption units 51 to 54, movement in the vertical direction and on / off of adsorption can be performed independently of each other. Note that a portion of the upper surface of the substrate SB that is sucked and held by the suction pads 517, 527, 537, and 547 corresponds to the “held portion” of the present invention.

  The peeling roller 340 moves in the vertical direction to move toward and away from the substrate SB, and moves in the Y direction to move horizontally along the substrate SB. In the state where the peeling roller 340 is lowered, it moves horizontally while abutting on the upper surface of the substrate SB and rolling. The position of the peeling roller 340 when moved to the most (−Y) side is a position closest to the (+ Y) side of the suction pad 517 of the first suction unit 51. In order to enable the arrangement in such a proximity position, the first suction unit 51 has the same structure as the second suction unit 52 shown in FIG. The fourth suction units 52 to 54 are attached to the support frame 50 in the opposite direction.

  The initial peeling unit 33 has its Y-direction position adjusted so that the pressing member 331 is positioned above the blanket BL protruding above the taper stage portion 32. Then, when the support arm 332 is lowered, the lower end of the pressing member 331 is lowered and presses the upper surface of the blanket BL. At this time, the tip of the pressing member 331 is formed of an elastic member so that the pressing member 331 does not damage the blanket BL.

  In the work WK in which the substrate SB and the blanket BL are in close contact, the blanket BL has a larger planar size than the substrate SB. Therefore, the entire surface of the substrate SB faces the blanket BL, while the blanket BL has a central portion facing the substrate SB, but the peripheral portion is a blank portion that does not face the substrate SB. Yes. An effective area that functions as a device by effectively transferring the pattern is set in a central portion of the surface area of the substrate SB except the peripheral edge. Therefore, the purpose of the peeling apparatus 1 is to peel off the substrate SB and the blanket BL without damaging the pattern transferred from the blanket BL to the effective area of the substrate SB.

  The workpiece WK is placed on the stage 30 so that the entire effective area of the substrate SB is positioned on the upper surface 310 of the horizontal stage unit 31. On the other hand, on the outside of the effective area, the (−Y) side end of the substrate SB is slightly protruded to the (−Y) side from the ridge line portion E at the boundary between the horizontal stage portion 31 and the taper stage portion 32. Positioned.

  FIG. 5 is a block diagram showing the electrical configuration of the peeling apparatus. Each part of the apparatus is controlled by a control unit 70. The control unit 70 supplies the CPU 701 that controls the operation of the entire apparatus, a motor control unit 702 that controls motors provided in each unit, a valve control unit 703 that controls valves provided in each unit, and each unit. A negative pressure supply unit 704 that generates a negative pressure and a user interface (UI) unit 705 for accepting an operation input from the user and notifying the user of the state of the apparatus are provided. In addition, when the negative pressure supplied from the outside, such as factory power, can be used, the control unit 70 may not include the negative pressure supply unit.

  The motor control unit 702 drives and controls a motor group such as a motor 353 and elevating mechanisms 335 and 344 provided in the stage block 3 and an elevating mechanism 525 provided in each adsorption unit 51 to 54 of the upper adsorption block 5. The valve control unit 703 is provided on a piping path connected to the suction grooves 311 and 312 provided in the horizontal stage unit 31 from the negative pressure supply unit 704, and individually supplies a predetermined negative pressure to these suction grooves. The valve group V3 and the negative pressure supply unit 704 are provided on a piping path connected to the suction pads 517 to 547 to supply a predetermined negative pressure to each of the suction pads 517 to 547, or to connect the suction pads 517 to 547 to ( The valve group V5 for switching the operation of the air cylinder 5293 displaced in the -Y) direction is controlled.

  Next, the peeling operation by the peeling apparatus 1 configured as described above will be described with reference to FIGS. FIG. 6 is a flowchart showing the peeling process. FIG. 7 to FIG. 9 are diagrams showing the positional relationship of each part at each stage during processing, and schematically show the progress of processing. 7 to FIG. 9, alternate long and short dash lines P51 to P54 indicate the holding start positions of the suction pads 517 to 547, respectively. This peeling process is performed by the CPU 701 executing a processing program stored in advance to control each unit.

  First, when the workpiece WK is loaded at the above position on the stage 30 by an operator or an external transfer robot (step S101), the apparatus is initialized and each part of the apparatus is set to a predetermined initial state (step S102). . In the initial state, the work WK is sucked and held by one or both of the suction grooves 311 and 312, and the suction member 331 of the initial peeling unit 33, the peeling roller 340 of the roller unit 34, and the first to fourth suction units 51 to 54 are sucked. All of the pads 517 to 547 are separated from the work WK and are positioned at the holding start position closest to the (−Y) side in the displaceable range. Further, the peeling roller 340 is at a position closest to the (−Y) side in the movable range.

  From this state, the first suction unit 51 and the peeling roller 340 are lowered and brought into contact with the upper surface of the workpiece WK (step S103). At this time, as shown in FIG. 7A, the suction pad 517 of the first suction unit 51 is located at the holding start position P51 in the Y direction, and the upper surface part of the (−Y) side end of the substrate SB, that is, the held part. The separation roller 340 comes into contact with the upper surface of the substrate SB at a position adjacent to the (+ Y) side. In FIG. 7A, the downward arrow attached in the vicinity of the pressing member 331 means that the pressing member 331 moves in the direction of the arrow in the subsequent process from the state shown in the drawing. The same applies to the following drawings.

  By performing step S103, the first suction unit 51 sucks and holds the (−Y) side end of the substrate SB, while the peeling roller 340 is adjacent to the (+ Y) side of the suction region by the first suction unit 51. Abuts on the substrate SB. The contact area with which the peeling roller 340 contacts is outside the effective area, that is, a position closer to the (−Y) side from the effective area. Therefore, the inside of the effective area is not subjected to either the suction by the first suction unit 51 or the pressing by the peeling roller 340.

  Returning to FIG. 6, next, the initial peeling unit 33 is operated, the pressing member 331 is lowered, and the end of the blanket BL is pressed (step S104). The end portion of the blanket BL protrudes above the taper stage portion 32, and there is a gap between the lower surface thereof and the upper surface 320 of the taper stage portion 32. Therefore, as shown in FIG. 7B, the pressing member 331 presses the end of the blanket BL downward, so that the end of the blanket BL bends downward along the tapered surface of the taper stage portion 32. As a result, the end of the substrate SB sucked and held by the first suction unit 51 and the blanket BL are separated from each other and peeling is started. The pressing member 331 is formed in a rod shape extending in the X direction, and the length in the X direction is set longer than that of the blanket BL. Therefore, the contact region where the pressing member 331 contacts the blanket BL extends linearly from the (−X) side end of the blanket BL to the (+ X) side end. By doing so, the blanket BL can be bent into a columnar shape, and the boundary line between the peeling region where the substrate SB and the blanket BL have already peeled and the unpeeled region that has not yet peeled (hereinafter referred to as “peeling boundary”). Line)) can be made straight.

  Subsequently, the valve controller 703 controls opening and closing of the valve connected to the air cylinder of the first suction unit 51 so that the piston can freely expand and contract, that is, the pad support member 516 and the suction pad 517 are integrated. Thus, the first suction unit 51 starts to be lifted in this state. In synchronization with this, the peeling roller 340 is moved in the (+ Y) direction (step S105). Specifically, the movement of the peeling roller 340 is started at the timing when the peeling boundary line that moves in the (+ Y) direction reaches the position immediately below the peeling roller 340 due to the rising of the first suction unit 51. As a result, the contact area with which the peeling roller 340 contacts moves in the (+ Y) direction. Thereafter, the first suction unit 51 moves upward, that is, in the (+ Z) direction, and the peeling roller 340 moves at a constant speed in the (+ Y) direction.

  As shown in FIG. 7C, when the first suction unit 51 that holds the end of the substrate SB is raised, the substrate SB is pulled up, and the separation from the blanket BL proceeds in the (+ Y) direction. Since the peeling roller 340 is in contact, the peeling does not proceed beyond the contact area by the peeling roller 340. Further, by moving the peeling roller 340 in the (+ Y) direction at a constant speed while being in contact with the substrate SB, the progressing speed of the peeling can be kept constant. That is, the separation boundary line is a straight line along the roller extending direction, that is, the X direction, and further proceeds in the (+ Y) direction at a constant speed. Thereby, the damage of the pattern resulting from the stress concentration by the fluctuation | variation of the advancing speed of peeling can be prevented reliably.

  Further, the suction pad 517 is lifted vertically upward (+ Z) together with the pad support member 516 while the substrate SB is sucked, but the suction pad 517 and the pad support member 516 can be integrally displaced in the Y direction. . For this reason, it is prevented that the suction pad 517 is displaced in the peeling progress direction (+ Y) as the peeling progresses, and the shearing force acts on the contact area before peeling, that is, in the vicinity of the peeling boundary line. This point will be described in detail later with reference to FIG.

  Subsequently, the value of the internal control parameter N for the following processing is set to 2 (step S106). Then, the process waits for the peeling roller 340 to pass through the Nth suction position (step S107). The Nth suction position is a position directly below the Nth suction unit (N = 1 to 4) on the upper surface of the substrate SB, and is a position where the Nth suction unit receives the suction.

  Since N = 2 here, the process waits until the peeling roller 340 passes the second suction position, that is, the holding start position P52. When peeling roller 340 passes through the second suction position (YES in step S107), lowering of second suction unit 52 is started, and substrate SB is held by suction pad 527 of second suction unit 52 at holding start position P52 in the Y direction. Capture (step S108).

  As shown in FIG. 7D, since the peeling roller 340 has already passed, the substrate SB is peeled off from the blanket BL at the position immediately below the second suction unit 52 positioned at the holding start position P52. It is in a state that has been raised. By approaching the substrate SB while applying a negative pressure to the suction pad 527 made of an elastic member having elasticity, the substrate SB is captured when the lower surface of the suction pad 527 comes into contact with the upper surface of the substrate SB. Adsorption can be held. After the suction pad 527 is lowered to a predetermined position, the substrate SB pulled up may be waited. In any case, it is possible to prevent suction failure by providing the suction pad with flexibility.

  After the suction of the substrate SB is started, the movement of the second suction unit 52 is turned up (step S109). At this time, similarly to the first suction unit 51, the valve control unit 703 allows the piston of the air cylinder 5293 (FIG. 3) of the second suction unit 52 to freely expand and contract, that is, the suction pad 527 is in the Y direction. Switch to a freely displaceable state. As a result, also in the second suction unit 52, the suction pad 527 and the pad support member 526 are integrally displaced in the peeling progress direction (+ Y) as the peeling progresses, and a shearing force acts near the peeling boundary line. Can be prevented.

  Further, as shown in FIG. 8A, the main part of pulling up the substrate SB for peeling is handed over from the first suction unit 51 to the second suction unit 52 while the peeling speed is still controlled by the peeling roller 340. It is. Further, the substrate SB after separation is switched from holding by only the first suction unit 51 to holding by the first suction unit 51 and the second suction unit 52, and the number of holding points increases. In addition, when each adsorption | suction unit 51-54 raises, the relative position in the Z direction between each adsorption | suction unit 51-54 is maintained so that the attitude | position of the board | substrate SB after peeling becomes a substantially plane.

  Subsequently, 1 is added to the value of the control parameter N (step S111), and the process is a loop process that returns to step S107 until the parameter N becomes 4. Accordingly, in the next loop, when the peeling roller 340 passes the holding start position P53, the lowering of the third suction unit 53 is started, and as shown in FIG. Shifts from the second suction unit 52 to the third suction unit 53. When the substrate SB is pulled up by the third suction unit 53 as described above, the piston of the air cylinder of the third suction unit 53 is freely expanded and contracted by the valve control unit 703 as in the first suction unit 51 and the second suction unit 52. The movable state, that is, the suction pad 537 and the pad support member 536 are switched to a state in which they can be integrally displaced in the Y direction. Thereby, also in the 3rd adsorption | suction unit 53, it can prevent that the suction pad 537 is displaced to a peeling advancing direction (+ Y) with peeling progress, and a shearing force acts on the vicinity of a peeling boundary line.

  Further, in the next loop, the fourth suction unit 54 descends after the separation roller 340 passes the holding start position P54 and pulls up the substrate SB. At this time, however, the suction pad 547 is switched to a state that can be displaced in the Y direction. As the peeling progresses, the suction pad 547 is displaced in the peeling progress direction (+ Y), and a shearing force acts near the peeling boundary line.

  In this embodiment, since the number of suction units is “4”, the upper limit value of N in step S110 is set to “4”. However, by changing the upper limit value N, the suction unit It is possible to cope with the case where the number of is different from the above.

  Thus, by pulling up the substrate SB by the fourth suction unit 54, the entire substrate SB is pulled away from the blanket BL as shown in FIG. 8C. Therefore, after raising the fourth suction unit 54 (YES in step S110), the peeling roller 340 is moved to the (+ Y) side from the stage 30 to stop the movement (step S112). And as shown in FIG.8 (d), after raising all the adsorption | suction units 51-54 to the same height, it stops (step S113). Further, the pressing member 331 of the initial peeling unit 33 is separated from the blanket BL and moved to a retracted position above the upper surface of the blanket BL and at the (−Y) side end of the (−Y) side end of the blanket BL (step S114). ).

  Further, after the execution of step S114, the valve control unit 703 controls the opening and closing of the valves connected to the air cylinders of the suction units 51 to 54 to operate the air cylinders to suck and hold the substrate SB, 527, 537, and 547 are forcibly displaced in the (−Y) direction together with the pad support members 516, 526, 536, and 546, respectively. As a result, the suction pads 517, 527, 537, and 547 are simultaneously returned to the holding start positions P51, P52, P53, and P54, respectively, and the substrate SB that has received the pattern transfer also has the initial workpiece WK carried into the peeling apparatus 1. Positioned. Here, after the pressing member 331 is moved to the retracted position (step S114), the suction pads 517, 527, 537 and 547 and the substrate SB are displaced in the (−Y) direction side (step S115). The order of both is not limited to this, and the order may be reversed or performed in parallel.

  Thereafter, the suction holding of the blanket BL by the suction groove is released, and the separated substrate SB and the blanket BL are carried out of the apparatus (step S116), thereby completing the peeling process.

  The suction units 51 to 54 have the same height by holding the substrate SB after separation and the blanket BL in parallel so that the hand for dispensing hand inserted by an external robot or operator can be accessed. This is to facilitate the delivery of the blanket BL and the substrate SB. Further, for the same purpose, the suction pads 517, 527, 537, and 547 are integrally returned to the holding start positions P51 to P54 together with the pad support members 516, 526, 536, and 546 after peeling.

  As described above, in this embodiment, a support mechanism is provided for each of the first to fourth suction units 51 to 54, and the suction pads 517, 527, 537, and 547 are respectively connected to the pad support members 516, 526, 536, 546 and 546 can be integrally displaced in the Y direction. For this reason, for the reason described in detail below, the shearing force is prevented from acting in the vicinity of the separation boundary line, and the pattern layer carried on the blanket BL is well transferred to the lower surface of the substrate SB, and is applied to the lower surface. A pattern can be formed.

  FIG. 10 is a diagram for explaining the advantage of the peeling process in the present embodiment. Here, the function and effect will be described by focusing on the suction pad 517 positioned closest to the (−Y) direction, but the same applies to the other suction pads 527 to 547.

  When performing the peeling process using the suction pad 517, the suction pad 517 positioned at the holding start position P51 is lowered to suck the upper surface of the substrate SB as shown in FIG. Thereafter, the suction pad 517 is lifted vertically upward (+ Z) while the substrate SB is sucked, and the substrate SB is peeled off. In this case, with the peeling boundary as a bending fulcrum, the region R51 of the substrate SB closer to the suction pad 517 than the bending fulcrum is bent as shown in FIG. Here, if it is assumed that no extraneous external force is applied to the substrate SB, the held portion HP that is sucked and held by the suction pad 517 in the region R51 draws an arc-shaped trajectory, and the pulling amount by the suction pad 517 is increased. The to-be-held part HP shifts to the peeling boundary side by the distance according to the.

  The suction pad 517 is made of an elastic member having elasticity. For this reason, as shown in FIG. 10B, for example, when the pull-up amount is relatively small, even if the suction pad 517 is lifted vertically upward (+ Z), the pull-up amount by the suction pad 517 increases. By deforming, it is possible to shift the held portion HP in the peeling boundary side, that is, in the peeling progress direction (+ Y), and to prevent an excessive external force from acting on the substrate SB.

  However, even if the deformation limit of the suction pad 517 is exceeded, if the suction pad 517 is moved vertically upward (+ Z) as it is, as shown in FIG. This shift cannot be absorbed by the suction pad 517, and the region R51 of the substrate SB is pulled up while the shift is regulated, and the tensile stress F acts on the substrate SB. As a result, a shearing force acts on the peeling boundary, and thereby pattern collapse occurs, and pattern formation on the substrate SB may not be performed satisfactorily.

  In contrast, in the present embodiment, as described above, the suction pad 517 and the pad support member 516 are integrally configured to be freely displaceable in the direction Y parallel to the peeling progress direction (+ Y), and the external force acting on the substrate SB is applied. Accordingly, it follows the Y direction. For this reason, it is possible to reliably prevent the suction pad 517 from being displaced in the peeling progress direction (+ Y) as the peeling progresses and the tensile stress F acting on the substrate SB. For this reason, it is possible to perform the peeling process while reliably preventing the application of a shearing force to the peeling boundary, and it is possible to satisfactorily form the pattern.

  As described above, in this embodiment, the blanket BL corresponds to the “first plate-like body” of the present invention and the substrate SB of the present invention is the “second plate-shaped body” of the workpiece WK as the separation target. Is equivalent to. The (+ Y) direction corresponds to the “peeling direction” of the present invention, and the Y direction corresponds to the “displacement direction” of the present invention. The lower surface and the upper surface of the substrate SB correspond to the “first main surface” and the “second main surface” of the present invention, respectively.

  In this embodiment, the stage 30 functions as the “holding means” of the present invention. Moreover, in this embodiment, all the adsorption units 51-54 are functioning as "the 1st peeling means" of this invention. The suction pads 517, 527, 537, and 547 correspond to an example of the “first holding portion” in the present invention. Further, the plate member 524 and the lifting mechanism 525 provided in the suction unit 52, and the plate members and the lifting mechanisms of the other suction units 51, 53, and 54 function as the “drive mechanism” of the present invention.

  The present invention is not limited to the above-described embodiment, and various modifications other than those described above can be made without departing from the spirit of the present invention. For example, in the above-described embodiment, the support mechanism and the return mechanism are provided for all the adsorption units 51 to 54, but the above-described adsorption unit having a small shift amount of the held portion HP, for example, the most peeling progress direction (+ Y) side The suction unit 54 located in the position may not be provided with a support mechanism and a return mechanism. In this case, the suction unit 54 functions as the “second peeling means” of the present invention, and the suction pad of the suction unit 54 is provided. Reference numeral 547 corresponds to an example of the “second holding portion” of the present invention.

  Moreover, in the said embodiment, although this invention is applied to the peeling apparatus 1 which performs a peeling process, controlling a peeling boundary line by using the peeling roller 340, the application object of this invention is limited to this Instead, the present invention can also be applied to a peeling apparatus that performs a peeling process without using the peeling roller 340.

  In the embodiment described above, four suction units are arranged on the substrate SB and sequentially suck the substrates SB. However, the number of suction units is not limited to this and is arbitrary. If the substrate is large, the number of suction units may be increased, and if the substrate is small, it may be decreased.

  Moreover, although the board | substrate and the blanket are hold | maintained by vacuum suction in the said embodiment, the aspect of holding | maintenance is not limited to this. For example, it may be held by electrostatic or magnetic holding force.

  Moreover, in the said embodiment, although the return mechanism is comprised with the air cylinder, you may comprise a return mechanism with another actuator, for example, a linear motor.

  Further, in the above embodiment, the blanket BL is protruded and held on the taper stage portion 32, and the blanket BL is bent by the pressing member 331 to create a trigger for peeling. However, this is not an essential requirement. For example, the peeling may be started only by pulling up the first suction unit. In this case, it is not necessary to provide a taper on the stage.

  Moreover, in the said embodiment, although this invention is applied about the peeling apparatus 1 which specializedly performs the peeling process with respect to the workpiece | work WK loaded by the operator or an external conveyance robot etc., the application object of this invention is peeling. It is not limited to a dedicated machine. For example, as described in Patent Document 1, the present invention can also be applied to an apparatus that performs a transfer process and a peeling process in the same apparatus, and an apparatus that performs a patterning process and a peeling process. That is, after the first plate and the second plate are brought into close contact with each other through the layer to be processed, the second plate is peeled off from the first plate and the first plate or the first plate The present invention can also be applied to a pattern forming apparatus in general that forms a layer to be processed patterned into a two-plate body.

  Furthermore, the present invention is not limited to the above-described pattern formation or pattern transfer or other pattern formation, and the present invention is used for various purposes to satisfactorily peel off two plate-like bodies that are in close contact with each other through a layer to be processed. It can be suitably applied.

DESCRIPTION OF SYMBOLS 1 ... Stripping apparatus 32 ... Tapered stage part 51-54 ... Adsorption unit (peeling means)
517, 527, 537, 547 ... Suction pad (holding part)
524 ... Plate member (drive mechanism)
525 ... Elevating mechanism (drive mechanism)
527a ... Adsorption part 528 ... Support mechanism 529 ... Return mechanism 5292 ... Air cylinder (return mechanism)
BL ... Blanket (first plate)
HP ... Holded part P51-P54 ... Holding start position SB ... Substrate (second plate)

Claims (13)

A peeling device for peeling the first plate and the second plate that are in close contact with each other via the layer to be processed,
Holding means for holding the first plate-like body;
A first holding part that holds the second main surface opposite to the first main surface that is in close contact with the first plate-like body of the second plate-like body, the first holding part being the holding means; The part to be held of the second plate-like body held by the first holding part is peeled from the first plate-like body by being separated from the first plate-like body, and the peeling of the second plate-like body is advanced in the peeling progress direction. First peeling means,
The peeling device according to claim 1, wherein the first holding part is displaced in the peeling progress direction according to the progress of peeling of the second plate-like body. It is a peeling apparatus of Claim 1, Comprising:
The first peeling means supports the first holding part so as to be displaceable in a displacement direction parallel to the peeling advance direction, and drives the support mechanism to cause the first holding part to be the holding means. A peeling device having a drive mechanism that moves toward and away from the device. The peeling apparatus according to claim 2,
The support mechanism causes the first holding portion that holds the held portion to follow the peeling progress direction in accordance with the stress applied to the second plate-like body as the peeling of the second plate-like body progresses. Peeling device. It is a peeling apparatus of Claim 3, Comprising:
The first holding portion starts holding the second plate-like body in a state where the first holding portion is positioned at a holding start position facing the held portion of the second plate-like body before peeling.
The first peeling means includes a return mechanism for returning the first holding portion moved in the peeling progress direction to the holding start position after the entire second plate-like body is peeled from the first plate-like body. Furthermore, a peeling apparatus having. The peeling apparatus according to any one of claims 1 to 3,
A peeling apparatus in which a plurality of the first peeling means are arranged in the peeling progress direction, and the timing at which the first holding part is separated from the holding means is different for each first peeling means. It is a peeling apparatus of Claim 5, Comprising:
Each of the plurality of first holding portions starts holding the second plate-like body in a state where it is positioned at a holding start position facing the held portion of the second plate-like body before peeling.
Each of the plurality of first peeling means moves the first holding portion moved in the peeling progress direction to the holding start position after the entire second plate-like body is peeled from the first plate-like body. Peeling device to return. It is a peeling apparatus of Claim 6, Comprising:
The plurality of first peeling means is a peeling device that simultaneously performs an operation of returning the first holding unit to the holding start position. The peeling apparatus according to any one of claims 1 to 3,
The second plate having a second holding portion for holding the second main surface of the second plate-like body, and being held by the second holding portion by separating the second holding portion from the holding means. A second peeling means for peeling the held portion of the plate-like body from the first plate-like body and causing the peeling of the second plate-like body to proceed in the peeling progress direction;
A peeling apparatus in which one or a plurality of the first peeling means are arranged in the peeling progress direction, and the second peeling means is arranged in the peeling progress direction rather than the first peeling means. A peeling method for peeling a first plate-like body and a second plate-like body, which are in close contact with each other via a layer to be treated,
A first step of holding the first plate-like body by holding means;
A second step of partially holding the second main surface opposite to the first main surface in close contact with the first plate-like body of the second plate-like body by the first holding portion;
The held portion of the second plate-like body held by the first holding portion is separated from the first plate-like body by separating the first holding portion that holds the second main surface from the holding means. And a third step of causing the peeling of the second plate-shaped body in the peeling progress direction and displacing the first holding portion in the peeling progress direction in accordance with the progress of peeling of the second plate-like body. The peeling method characterized by the above-mentioned. It is the peeling method of Claim 9, Comprising:
The second step is performed using the plurality of first holding units arranged in the peeling progress direction,
The peeling method, wherein the third step is performed at different timings for separating the first holding unit from the holding unit. It is the peeling method of Claim 10, Comprising:
After peeling the second plate-like body from the first plate-like body, the method further includes a fourth step of moving the plurality of first holding portions to the opposite side of the peeling progress direction and returning to the position before the displacement. Peeling method. It is the peeling method of Claim 9, Comprising:
The second step is performed using one or a plurality of the first holding parts arranged in the peeling progress direction and a second holding part arranged in the peeling progress direction rather than the first holding part. ,
In the third step, the portion to be held of the second plate-like body held by the second holding portion is separated from the holding means by separating the second holding portion holding the second main surface from the holding means. Separation from one holding plate is performed by separating the second plate from the holding means for each of the first holding unit and the second holding unit. Peeling method. After the first plate and the second plate are brought into close contact with each other through the layer to be processed, the second plate is peeled off from the first plate and the first plate or A pattern forming apparatus for forming the layer to be processed patterned on the second plate-like body,
Holding means for holding the first plate-like body;
The first holding unit that holds the second main surface opposite to the first main surface that is in close contact with the first plate-like body of the second plate-like body, and holds the second main surface. By separating the first holding portion from the holding means, the portion to be held of the second plate-like body held by the first holding portion is peeled off from the first plate-like body, and the second plate-like body is separated. And a first peeling means for causing the peeling to proceed in the peeling progress direction.

Images