JP6131077B2 - Transfer peeling apparatus, transfer peeling method and pattern forming system - Google Patents

Description

  In this invention, after transferring one side of a blanket and one side of a plate-like object to a pattern formed on one of both sides, the blanket is peeled off from the plate-like object. The present invention relates to a peeling technology and a pattern forming system that forms a reverse pattern of a pattern provided on a plate on a substrate using the transfer peeling technology.

  As an invention for manufacturing an electronic component, for example, the invention described in Patent Document 1 has been conventionally known. In the invention described in Patent Document 1, the flat plate blanket is fixed to the upper surface of the lower stage, while the surface on which the pattern is formed faces downward, that is, the letterpress is sucked and fixed by the upper stage in the face-down state. Compressed gas is injected from an opening provided near the center of the stage, and a flat blanket is pushed out. In this way, the blanket is brought into pressure contact with the relief plate, and the relief pattern is transferred to the flat plate blanket to pattern the upper surface of the flat plate blanket. And the inversion pattern which reversed the pattern of the relief printing plate is formed on a flat plate blanket by peeling the flat plate blanket and relief relief which mutually contacted.

JP 2010-158799 A

  As described above, in Patent Document 1, the transfer process and the peeling process are continuously performed in the same apparatus, and a configuration for performing the transfer process is described. However, a specific configuration for performing the peeling process is not described. Further, since the transfer process and the peeling process are different from each other, the configuration and mechanism suitable for executing each with high accuracy are inevitably different. Therefore, when all of these configurations and mechanisms are installed in one apparatus, the apparatus configuration becomes complicated. In addition, considering the tact time and maintainability when mass-producing products, including this problem, the transfer unit that performs the transfer process in a single line and the release unit that performs the release process as a single line are lined up. Is desirable. In other words, after the relief printing plate and the blanket are brought into close contact with each other in the transfer unit, the relief printing pattern is transferred to the flat plate blanket, and then the adhesion body (= relief printing + blanket) is conveyed to the peeling unit. Therefore, separating the letterpress and the blanket is superior in mass productivity.

  However, in the case of forming a line, it is necessary to take out the adhesion body created by the transfer unit from the transfer unit and carry it into the peeling unit. Here, if an external force is applied to the relief printing plate or the blanket during the conveyance of the contact body, a positional shift occurs between them, and the product cannot be manufactured satisfactorily.

Furthermore, in the apparatus described in Patent Document 1, the plane size of the relief plate is smaller than the plane size of the blanket, and the pattern forming surface of the relief plate is in close contact with the center portion of the patterning surface of the blanket. For this reason, weight concentrates in the center part of a contact body, and the rigidity of the peripheral part of a blanket is falling conversely. Therefore, when the plane sizes of the relief printing plate and the blanket are different from each other in this way, it is desirable to adopt a conveyance mode adapted to that to prevent the adhesion body from being damaged during the conveyance. Such problems and demands include not only the case in which the relief plate and the blanket are brought into close contact with each other but then peeling them off to form a reversal pattern in which the relief plate pattern is reversed. The same applies to the case where a blanket reversal pattern is formed on the substrate by peeling them off after the substrate is brought into close contact.

  The present invention has been made in view of the above problems, and after the one surface of the blanket and one surface of the plate-like object are brought into close contact with each other, the two are separated to stabilize the pattern formed on one of the two surfaces on the other. Transfer patterning technology that can be transferred with high productivity, and pattern formation technology that forms a reversed pattern, which is a plate pattern reversed using the transfer peeling technology, on a substrate stably and with high productivity. With the goal.

A transfer peeling apparatus according to the present invention includes a first stage that is reciprocally provided between a transfer position and a peeling position while holding a blanket, and a stage movement that moves the first stage to position the transfer position and the peeling position. And a second stage for holding the plate-like object with one side of the plate-like object facing one side of the blanket held by the first stage positioned at the transfer position by the stage moving means, and positioning at the transfer position One side of the blanket and one side of the plate-like object are brought into close contact with each other by pressing the one side of the blanket held on the first stage and the one side of the plate-like object held on the second stage. A pressing means for transferring the pattern formed on one side to the other, and one side of the plate-like object in close contact with one side of the blanket It is characterized in that it comprises a peeling unit for peeling the plate-like object from the blanket to be held by the first stage which is positioned to move to the release position from the transfer position by or stage moving means.

  In the transfer peeling method according to the present invention, the plate-like object is held by the second stage while the one surface of the plate-like object faces the one surface of the blanket held by the first stage positioned at the transfer position. And one side of the blanket held on the first stage positioned at the transfer position and one side of the plate-like object held on the second stage are pressed against each other to be brought into close contact with each other. A step of transferring a pattern formed on one of the surfaces of the object to the other, and holding the blanket on the first stage and removing the first stage from the transfer position while keeping the plate-like object in close contact with the blanket. And moving the plate to position, and peeling the plate-like object from the blanket held by the first stage positioned at the peeling position. It is characterized in that it comprises a step.

  In the invention configured as described above, the transfer process for transferring the pattern by pressing the one surface of the blanket and the one surface of the plate-like object together to perform the transfer is performed at the transfer position, whereas the plate-like object is transferred from the blanket. The peeling process for peeling off is performed at a peeling position different from the transfer position. Therefore, the present invention is superior in mass productivity and maintainability compared to a transfer peeling invention (for example, the invention described in Patent Document 1) in which the transfer process and the peeling process are continuously performed at the same position. However, it is necessary to move the contact body between the blanket and the plate-like object from the transfer position to the peeling position by the transfer process, and it is most concerned that a positional deviation occurs between the blanket and the plate-like object when the contact body is transported. Is done. However, in the present invention, after the blanket is held on the first stage, the transfer process, the transfer process from the transfer position to the peeling position, and the peeling process are performed while the holding state is maintained, that is, the processes are performed. The blanket is held on the first stage at all times. Therefore, it is possible to effectively prevent the positional deviation between the blanket and the plate-like object even during the conveyance of the contact body.

  Here, the first stage may be configured to hold one side of the blanket, that is, the surface that is in close contact with the plate-like object facing upward. In this case, the second stage and the peeling means are the same as those of the first stage. What is necessary is just to arrange | position upwards. In this case, the contact body is transported by the first stage in a state where the blanket and the plate-like object are stacked on the first stage. In this way, the first stage is transported while supporting the contact body from below, so that the contact body can be transported more stably, and as a result, the occurrence of misalignment during the transport of the contact body is more effective. Can be prevented.

  Further, as described above, the configuration in which the first stage conveys while supporting the contact body from below is particularly beneficial when the planar size of the plate-like object is smaller than the planar size of the blanket. This is because, when the planar size of the plate-like object and the blanket has the above-described relationship, it is common to press the entire one surface of the plate-like object and the center portion of the one surface of the blanket against each other, This is because the weight and rigidity of the body are non-uniform in a plane, but the contacted body can be stably conveyed while overcoming such non-uniformity. That is, in such a case, the weight is concentrated on the central portion of the contact body, while the rigidity of the peripheral portion of the blanket is greatly reduced. However, since the first stage supports the blanket from below, not only the central part of the adhesion body but also the peripheral part of the blanket whose rigidity has been lowered can be firmly held, and the conveyance stability can be ensured. Can do.

  By the way, although the transfer peeling device may be used alone, it forms a pattern forming system in combination with a transport means for transporting a blanket or a plate-like object, and the pattern forming system makes it possible to attach to one side of the plate. A reverse pattern of the provided pattern may be formed on one surface of the substrate.

  According to a first aspect of the pattern forming system of the present invention, the transfer peeling device, the blanket carry-in device for transporting the blanket to the first stage positioned at the transfer position, and the second stage using the substrate and the plate as plate-like objects are provided. A plate-like object carrying device for conveying the plate and a plate-like object carrying device for carrying the plate and substrate peeled from the blanket by the peeling means from the peeling means, and the first stage positioned at the transfer position by the blanket carrying device. While holding the transported blanket, the second stage holds the plate transported by the plate-like object carrying-in device, and the pressing means brings the plate and the blanket into close contact with each other and transfers the pattern of the plate to one side of the blanket for patterning Then, the stage moving means is in the state where one side of the plate is in close contact with one side of the blanket. The stage is moved from the transfer position to the peeling position and positioned, the peeling means peels the plate from the blanket held at the peeling position, and a pattern inversion pattern is formed on one side of the blanket, The plate from which the plate-like object carrying device is peeled is conveyed from the peeling means, and the stage moving means moves the first stage from the peeling position to the transfer position while holding the blanket on which the reverse pattern is formed on the first stage. The second stage holds the substrate conveyed by the plate-like object carry-in device, and the pressing means transfers the blanket reversal pattern to one surface of the substrate by bringing the substrate and the blanket into close contact with each other. The stage moving means moves the first stage from the transfer position to the peeling position while keeping one surface of the substrate in close contact with the substrate. Positioning Te, the stripping means is characterized by forming a reverse pattern on one surface of the substrate by separating the substrate from the blanket to be held by the first stage which is positioned in the release position.

  In the first aspect of the pattern forming system configured as described above, the transfer process and the peeling process are repeated while the first stage is moved alternately between the transfer position and the peeling position, and the same operation as the above-described transfer peeling apparatus is performed. The effect (high mass productivity and excellent maintainability) is exhibited. The blanket is always held on the first stage, and misalignment occurs between the blanket, the plate, and the substrate during the conveyance of the adhesion body between the blanket and the plate and the conveyance of the adhesion body between the blanket and the substrate. Can be effectively prevented. As a result, an inverted pattern obtained by inverting the pattern of the plate can be stably formed on the substrate with high productivity.

The second aspect of the pattern forming system according to the present invention is a first stage that is provided to be movable between a first transfer position, a first peeling position, a second transfer position, and a second peeling position while holding a blanket. And a stage moving means for moving the first stage to position the first transfer position, the first peeling position, the second transfer position, and the second peeling position, and a first moving position positioned at the first transfer position by the stage moving means. the second stage holding the blanket loading device, the plate while facing the one surface of the plate on one surface of the blanket which is held by the first stage which is positioned at the first transfer position by the stage moving means for conveying the blanket to the stage A plate carry-in device for conveying the plate to the second stage, and a blanket held by the first stage positioned at the first transfer position The first pressing means for transferring and patterning the pattern of the plate on one side of the blanket by pressing the one side and the one side of the plate held on the second stage and bringing them into close contact with each other, and the plate on the one side of the blanket The plate is peeled off from the blanket held on the first stage, which is moved from the first transfer position to the first peeling position by the stage moving means while the one surface is kept in close contact, and the pattern is formed on one surface of the blanket. The first peeling means for forming the reversal pattern and the blanket on which the reversal pattern is formed are held on the first stage that is moved and moved from the first peeling position to the second transfer position by the stage moving means. A third stage for holding the substrate while facing one side of the substrate to one side of the blanket, and a substrate on the third stage A substrate carry-in device for feeding, and one surface of the blanket which is held by the first stage which is positioned to the second transfer position, the blanket be adhered by pressing the one surface of the substrate held in the third stage together Positioned by moving from the second transfer position to the second peeling position by the second pressing means for transferring the reverse pattern to the one surface of the substrate and the stage moving means with the one surface of the substrate in close contact with the one surface of the blanket. And a second peeling means for peeling the substrate from the blanket held on the first stage to form a reverse pattern on one surface of the substrate.

  In the second aspect of the pattern forming system configured as described above, different processes are executed at the first transfer position, the first peeling position, the second transfer position, and the second peeling position. Similar effects (high mass productivity and excellent maintainability) are exhibited. Further, the blanket is always held on the first stage, while the adhesive body between the blanket and the plate is conveyed from the first transfer position to the first peeling position, and between the blanket and the substrate from the second transfer position. It is possible to effectively prevent the occurrence of misalignment between the blanket, the plate, and the substrate in any case during conveyance to the second peeling position. As a result, an inverted pattern obtained by inverting the pattern of the plate can be stably formed on the substrate with high productivity.

  Furthermore, a third aspect of the pattern forming system according to the present invention is configured to convey a blanket to the first transfer peeling device and the second transfer peeling device having the same configuration as the transfer peeling device, and to the first stage of the first transfer peeling device. Blanket carry-in device, plate carry-in device that conveys a plate as a plate-like object to the second stage of the first transfer peeling device, and substrate carry-in device that conveys a substrate as a plate-like object to the second stage of the second transfer peeling device And an intermediate conveying means for conveying the blanket from the first stage of the first transfer peeling apparatus to the first stage of the second transfer peeling apparatus. In the first transfer peeling apparatus, the first stage positioned at the transfer position is While holding the blanket conveyed by the blanket carry-in device, the second stage holds the plate carried by the plate carry-in device, and the pressing means is the plate and the block. The plate movement is transferred onto one side of the blanket for patterning, and the stage moving means moves the first stage from the transfer position to the peeling position while keeping one side of the plate in close contact with one side of the blanket. The plate is peeled from the blanket held on the first stage where the peeling means is positioned at the peeling position to form a pattern reversal pattern on one side of the blanket. A blanket having a reverse pattern formed thereon is transferred from the first stage of the first transfer peeling apparatus to the first stage of the second transfer peeling apparatus, and in the second transfer peeling apparatus, the second stage is transferred by the substrate carry-in apparatus. Hold the substrate to be pressed, and the pressing means brings the substrate and the blanket into close contact with each other so that the reverse pattern of the blanket is The stage moving means moves and positions the first stage from the transfer position to the peeling position while keeping one side of the substrate in close contact with one side of the blanket, and the peeling means is positioned at the peeling position. The substrate is peeled off from a blanket held on one stage to form a reverse pattern on one surface of the substrate.

  In the third aspect of the pattern forming system configured as described above, in both the first transfer peeling device and the second transfer peeling device having the same configuration as the transfer peeling device, the first stage is set to the transfer position and the peeling position. The transfer process and the peeling process are carried out while alternately moving, and the same effects (high mass productivity and excellent maintainability) as those of the transfer peeling apparatus described above are exhibited. Further, in the first transfer peeling device and the second transfer peeling device, the blanket is held on the first stage, and the blanket is being transferred during the transfer of the adhesive body between the blanket and the plate and the adhesive body between the blanket and the substrate. It is possible to effectively prevent misalignment between the plate and the plate and the substrate. As a result, an inverted pattern obtained by inverting the pattern of the plate can be stably formed on the substrate with high productivity.

  As described above, according to the present invention, since the first stage holding the blanket is moved between the transfer position and the peeling position, the transfer process at the transfer position and the peeling process at the peeling position are performed. The pattern formed on one of the one surface and the one surface of the plate-like object can be stably transferred to the other with high productivity.

1 is a perspective view showing a schematic configuration of a first embodiment of a pattern forming system according to the present invention. It is a block diagram which shows the structure of the pattern formation system of FIG. It is a figure which shows the structure of a transfer peeling apparatus. It is a figure which shows schematic structure of a lower stage and a pressing part. It is a schematic diagram which shows the transfer procedure by a pressing part. It is a figure which shows typically operation | movement of a peeling part. It is a figure which shows typically operation | movement of a peeling part. It is a flowchart which shows operation | movement of the pattern formation system of FIG. It is a perspective view which shows 2nd Embodiment of a pattern formation system. It is a flowchart which shows operation | movement of the pattern formation system shown in FIG. It is a perspective view which shows 3rd Embodiment of a pattern formation system. 12 is a flowchart showing an operation of the pattern forming system shown in FIG.

FIG. 1 is a perspective view showing a schematic configuration of a first embodiment of a pattern forming system equipped with an embodiment of a transfer peeling apparatus according to the present invention. FIG. 2 is a block diagram showing the configuration of the pattern forming system of FIG. The pattern forming system 1 includes a transfer peeling device 2, a blanket loading device 3 (FIG. 2) that loads the blanket BL into the transfer peeling device 2, and a plate / substrate loading device 4 that loads the plate PP and the substrate into the transfer peeling device 2. (FIG. 2), a plate / substrate unloading device 5 (FIG. 2) for unloading the used plate PP and the patterned substrate SB from the transfer peeling device 2, and a blanket unloading device 6 for unloading the used blanket BL. (FIG. 2) and a control device 7 (FIG. 2) for controlling the entire system. In order to uniformly indicate the direction in each figure, XYZ orthogonal coordinate axes are set as shown in the lower right of FIG. Here, the XY plane represents a horizontal plane and the Z axis represents a vertical axis. More specifically, the (+ Z) direction represents a vertically upward direction. Further, the blanket BL, the plate PP, and the substrate SB are conveyed along the Y-axis direction in the transfer peeling apparatus 2.

  FIG. 3 is a diagram showing the configuration of the transfer peeling apparatus. Here, after describing the overall outline of the transfer peeling apparatus 2 with reference to FIGS. 1 to 3, the detailed configuration and operation of each part will be described. In this transfer peeling apparatus 2, a lower stage portion 210 is provided on a base 200 so as to be movable in the Y direction. The lower stage portion 210 has a lower stage 211 that holds the blanket BL at the uppermost portion. The lower stage portion 210 moves in the Y direction in response to a driving force applied from the lower stage moving mechanism 230, and a transfer position P1 for performing a transfer process. It is positioned at the peeling position P2 where the peeling process is performed. For example, as shown by the solid line in FIG. 1, when the lower stage portion 210 is positioned at the transfer position P1, the blanket BL can be carried into the lower stage 211 of the lower stage portion 210 by the blanket carry-in device 3 (FIG. 2). The lower stage 211 sucks and holds the lower surface of the loaded blanket BL.

  An upper stage 240 is disposed in the (+ Z) direction of the lower stage 210 positioned at the transfer position P1. The upper stage 240 has an upper stage 241 at the bottom. When the plate / substrate loading device 4 (FIG. 2) accesses the upper stage 241 and loads the plate PP and the substrate SB in a so-called face-down state, the upper stage 241 that receives the plate PP and the substrate SB adsorbs the plate PP and the substrate SB. Hold. As a result, the lower surface of the plate PP and the substrate SB and the upper surface of the blanket BL face each other.

  The transfer peeling apparatus 2 has a pressing portion 250, and presses the plate PP (or the substrate SB) and the blanket BL in an opposed state to each other so as to adhere to each other. For example, when the plate PP is held on the upper stage 241, a coating layer (not shown) in which a pattern (not shown) provided on the lower surface of the plate PP at the transfer position P1 is applied to the upper surface of the blanket BL. And patterning the coating layer to form a pattern layer. When the blanket BL thus patterned is held by the lower stage 211 and the substrate SB is held by the upper stage 241, the pattern layer formed on the upper surface of the blanket BL is transferred to the lower surface of the substrate SB. Is done. As described above, at the transfer position P1, the plate PP, the substrate SB, and the blanket BL are formed with a close contact body, and the transfer process is performed.

  The lower stage 211 adsorbs and holds the blanket BL while adhering the plate PP (or substrate SB) to the upper surface of the blanket BL by the transfer process, that is, adsorbs and holds the adhering body. Then, after releasing the holding of the plate PP (or the substrate SB) by the upper stage 241, when the lower stage moving mechanism 230 starts moving the lower stage unit 210 in the (+ Y) direction, the lower stage 211 moves the lower surface of the adhesion body. That is, it moves while continuing the suction holding of the lower surface of the blanket BL. Then, when the lower stage unit 210 reaches the peeling position P2, the stage movement is stopped.

In the (+ Z) direction of the lower stage part 210 thus positioned at the peeling position P2, a peeling part 260 is arranged as shown in FIG. The peeling unit 260 includes a plurality of suction pads 261 and rollers 262, and uses these to peel the blanket BL and the plate PP (or the substrate SB). The plate PP (or substrate SB) separated upward from the blanket BL is temporarily held by the suction pad 261, and then transferred to the plate / substrate unloading device 5 (FIG. 2) that has accessed the peeling unit 260. And carried out of the peeling unit 260. On the other hand, the blanket BL remains adsorbed and held on the lower stage 211 after the peeling process, but a different operation is executed depending on whether or not the next transfer peeling process needs to be performed. That is, when the plate PP is peeled from the blanket BL by the peeling process, the pattern layer patterned by the plate PP by the peeling remains in the blanket BL. In this case, the pattern layer is further subjected to the transfer peeling process. Needs to be transferred to the lower surface of the substrate SB. Accordingly, the lower stage moving mechanism 230 moves the lower stage portion 210 in the (−Y) direction while attracting and holding the blanket BL having the pattern layer, and is returned to the transfer position P1. On the other hand, when the substrate SB is peeled from the blanket BL by the peeling process, the pattern layer of the blanket BL is transferred onto the lower surface of the substrate SB by the peeling. In this case, the blanket carry-out device 6 (FIG. 2) accesses the lower stage part 210 positioned at the peeling position P2 and carries out the used blanket BL. Further, when the blanket BL is removed in this manner, the lower stage moving mechanism 230 moves the lower stage portion 210 in the (−Y) direction in the empty state (a state in which the blanket BL is not held), and is returned to the transfer position P1.

  Next, the configuration and operation of the upper stage unit 240 will be described with reference to FIGS. As described above, the upper stage unit 240 is disposed in the (+ Z) direction of the lower stage unit 210 positioned at the transfer position P1. In the upper stage unit 240, the upper stage 241 is provided so as to be movable up and down in the vertical direction Z. By operating the stage lifting motor 242 (FIG. 2) in accordance with an operation command from the motor control unit 73 of the control device 7. The upper stage 241 moves up and down, and the height position of the upper stage 241 in the vertical direction Z can be arbitrarily adjusted.

  Although not shown, suction mechanisms such as a plurality of suction holes and suction grooves are provided on the lower surface of the stage 241. In addition, one end of the pipe is connected to each opening of the adsorption mechanism, and the other end of the pipe is connected to a negative pressure supply unit (not shown) via an adsorption valve 243 (FIG. 2). Therefore, when the valve controller 74 of the control device 7 opens the suction valve 253 in response to the plate PP and the substrate SB being loaded into the upper stage 240 by the plate / substrate loading device 4 (FIG. 2), the plate The PP and the substrate SB are attracted and held on the lower surface of the upper stage 241. On the other hand, after the transfer process is completed as described above, the valve control unit 74 of the control device 7 closes the suction valve 253 to stop the negative pressure supply, and opens each opening of the suction mechanism to the atmosphere, whereby the upper stage 241 The holding of the plate PP and the substrate SB can be released.

  Next, the configuration and operation of the lower stage unit 210, the lower stage moving mechanism 230, and the pressing unit 250 will be described with reference to FIGS. FIG. 4 is a diagram showing a schematic configuration of the lower stage and the pressing unit. FIG. 5 is a schematic diagram showing a transfer procedure by the pressing unit. In the transfer peeling apparatus 2, as shown in FIG. 1, two guide rails 231 extending in the Y direction are fixedly disposed in parallel on the upper surface of the base 200 with a predetermined distance in the X direction. Two sliders 232 are slidably mounted in the Y direction along these guide rails 231. And the lower stage part 210 is attached on these sliders 232. Thereby, the lower stage part 210 is movable in the Y direction. Further, a known lower stage driving unit 233 (FIG. 2) such as a stepping motor, a linear motor, and a ball screw is connected to the lower stage unit 210, and the lower stage driving unit 233 is operated by the control device 7. The lower stage unit 210 moves and is accurately positioned at the transfer position P1 and the peeling position P2. As described above, in this embodiment, the guide rail 231, the slider 232, and the lower stage driving unit 233 constitute an example of the “stage moving unit” of the present invention.

  In addition to the lower stage 211 described above, the lower stage unit 210 includes a rectangular base plate 212, an alignment stage 213, an intermediate plate 214, a column member 215, and a lift pin mechanism 216. In the lower stage portion 210, the base plate 212 is fixed to the slider 232 so as to be supported by the two sliders 232 from below, and is movable in the Y direction together with the slider 232.

  An alignment stage 213 is provided on the upper surface of the base plate 212. The alignment stage 213 includes a stage base 213a fixed on the base plate 212 and a stage top 213b disposed vertically above the stage base 213a (+ Z). Both the stage base 213a and the stage top 213b have a rectangular shape, and there are three degrees of freedom in the rotational direction, the X direction, and the Y direction with the rotational axis extending in the vertical direction Z as the rotational center. A support mechanism 213c such as a cross roller bearing is disposed in the vicinity of each corner of the stage top 213b. A ball screw mechanism (not shown) is provided for each support mechanism 213c, and a lower stage drive motor 217 (FIG. 2) is attached to each ball screw mechanism. Then, by actuating each lower stage drive motor 217 in accordance with an operation command from the motor control unit 73 of the control device 7, the stage top 213b is moved in the horizontal plane, and the vertical axis is rotated around the center of rotation. The lower stage 211 of the stage unit 210 can be positioned.

  A rectangular intermediate plate 214 is fixed on the alignment stage 213. Further, a column member 215 is erected at (+ Z) from the upper surface corner portion of the intermediate plate 214, and each top portion supports the lower stage 211.

The lower stage 211 is made of, for example, a metal plate such as an aluminum alloy, has a rectangular shape in plan view from above, and can hold the blanket BL by its upper surface 211a. In addition, a lift pin mechanism 216 is provided to transfer the blanket BL between the upper surface 211a of the lower stage 211 and the blanket carry-in device 3 (FIG. 2) and the blanket carry-out device 6 (FIG. 2). In the lift pin mechanism 216, a lift plate 216a is provided between the lower stage 211 and the intermediate plate 214 so as to be movable up and down. A plurality of lift pins 216b are erected vertically upward (+ Z) from the upper surface of the lift plate 216a. On the other hand, a pin elevating cylinder 216c (FIG. 2) is connected to the lower surface of the lift plate 216a. And the valve control part 74 of the control apparatus 7 switches the opening and closing of the valve connected to the pin raising / lowering cylinder 216c, thereby operating the pin raising / lowering cylinder 216c to raise and lower the lift plate 216a. As a result, all the lift pins 216b move back and forth with respect to the upper surface 211a of the lower stage 211, that is, the suction surface. For example, when the lift pin 216b protrudes from the upper surface 211a of the lower stage 211 in the (+ Z) direction, the blanket BL is placed on the top of the lift pin 216b by the blanket carry-in device 3 (FIG. 2) and the blanket carry-out device 6 (FIG. 2). It becomes possible. Then, following the placement of the blanket BL, the lift pin 216b moves backward in the (−Z) direction from the upper surface 211a of the lower stage 211, whereby the blanket BL is transferred to the upper surface 211a of the lower stage 211.

  Quartz windows (not shown) for imaging the alignment mark are provided in areas near the corners of the lower stage 211, respectively. Further, the upper surface 211a of the lower stage 211 is provided with a groove 211b so as to surround the quartz window, and in the inner region surrounded by the groove 211b, a plurality of grooves 211c extending in the left-right direction X are provided in the direction Y except for the quartz window. Are provided at regular intervals.

  In this specification, in order to distinguish each opening according to the formation position of the adsorption grooves (slit grooves) 211b and 211c, as shown in FIG. 5, it is formed at the center position of the blanket holding surface 211a of the lower stage 211. The opening of the slit groove 211c arranged in the forward direction (+ Y) from the opening P (0) is defined as “opening P (+1)”, “opening P (+2)”, and “opening P (0)”. Further, the openings of the slit grooves 211c arranged in the rearward direction (−Y) from the opening P (0) are referred to as “opening P (−1)”, “opening P (−2)”,. Then, using these, the transfer operation will be described in detail with reference to FIG.

The arrow line in FIG. 5 indicates the pressure state supplied to the opening of each slit groove 211c, that is,
Upward solid line ... Positive pressure supply Downward arrow solid line ... Negative pressure supply Dotted line without arrow ... Indicates supply stop. Further, the symbol OFA indicates an area where the slit groove 211c is provided in the blanket holding surface 211a, and the symbols EPA and NPA indicate “effective pattern area” and “non-pattern area” of the blanket BL, respectively.

  Immediately before the start of this transfer operation, the blanket BL is adsorbed on the entire blanket holding surface 211a of the lower stage 211. That is, the valve control unit 74 of the control device 7 closes all the valves 251 and opens all the valves 253 to supply a negative pressure to each opening. Then, the valve control unit 74 closes the valve 253 connected to the opening P (0) at the center of the upper surface and opens the valve 251 to supply positive pressure from the opening P (0), thereby starting the transfer operation. . By this positive pressure supply, pressurized air enters between the central portion of the blanket BL and the blanket holding surface 211a to form a pressurized space SP, whereby the central portion of the blanket BL rises, and the plate PP (or the substrate SB). It contacts the lower surface PPa (or SBa). On the other hand, the openings P (+1), P (+2), ..., P (-1), P (-2), ... located on the (+ Y) edge side and the (-Y) edge side of the opening P (0) are: In either case, a negative pressure is supplied to hold the blanket BL by suction.

  Next, the valve controller 74 of the control device 7 opens the valve 253 from the open state while closing the valve 251 connected to the opening P (+1) adjacent to the opening P (0) among the second openings at the present time. Switching to the closed state stops the supply of negative pressure to the opening P (+1). Then, in the vicinity of the opening P (+1), the force for holding the blanket BL against the applied pressure in the pressurizing space SP is gradually weakened. Accordingly, the gas component in the pressurizing space SP flows between the vertical upper portion of the opening P (+1) of the blanket BL and the blanket holding surface 211a, and the blanket portion is lifted from the blanket holding surface 211a. The plate PP (or substrate SB) is brought into contact with the lower surface PPa (or SBa). In this way, the area of the blanket BL that abuts the plate PP (or the substrate SB), that is, the abutting area CA, is suppressed from the central portion to the (+ Y) end while suppressing the pressure in the pressurizing space SP from abruptly changing. Widened gently and stably on the edge side. Therefore, it is possible to reliably prevent residual bubbles from entering between the plate PP (or the substrate SB) and the blanket BL during the widening.

  When the widening of the contact area CA toward the (+ Y) edge side is completed in this way, the step of widening the contact area CA toward the (−Y) edge side is performed next. That is, the valve control unit 74 of the control device 7 opens the valve 253 from the open state while closing the valve 251 connected to the opening P (−1) adjacent to the opening P (0) among the second openings at the present time. Switching to the closed state stops the supply of negative pressure to the opening P (-1). Then, in the vicinity of the opening P (−1), the force for holding the blanket BL against the applied pressure in the pressurizing space SP becomes gradually weaker in the vicinity of the opening area CA (−Y) as in the widening process of the contact area CA toward the (+ Y) edge side. The contact area CA is gently and stably widened from the central portion to the (−Y) edge side while suppressing a sudden change in the pressure in the pressure space SP (FIG. 5A). Therefore, it is possible to reliably prevent residual bubbles from entering between the substrate SB and the blanket BL during this widening.

  Moreover, by performing the said widening process, pressurization space SP spreads and there exists a possibility that the pressurizing force (or pressing force) which presses blanket BL against plate PP (or board | substrate SB) may fall. Therefore, after executing the widening process a certain number of times, the valve control unit 74 of the control device 7 opens the valve 251 connected to the openings P (+1) and P (−1) from which the negative pressure supply is stopped from the closed state to the open state. The positive pressure supply to each opening P (+1) and P (-1) is started. By this positive pressure supply addition step, a new positive pressure supply is added by the amount of the pressurizing space SP, and the pressing force (or pressing force) pressing the blanket BL against the substrate SB can be stabilized.

  In the present embodiment, by repeating the above-described widening step and positive pressure supply addition step, all the openings P (0), P (+1), P (−1),. + M), P (−m), P (+ n), P (−n), and supplies positive pressure to the openings P (0), P (+1), P (−1),. At the same time, the pressure supply to the remaining openings P (+ m), P (−m), P (+ n), P (−n), etc. is stopped, and it faces the central portion of the blanket BL, that is, the opening forming area OFA. The blanket part is floated on the plate PP (or the substrate SB). As a result, the blanket BL is brought into good contact with the plate PP (or the substrate SB) and the plate PP (or the substrate SB) and the blanket BL are brought into close contact with each other ((b) in the figure).

  During the transfer operation, a negative pressure is always supplied to the opening 211b so that the peripheral edge of the blanket BL, more specifically, the outer edge of the opening formation area OFA is in close contact with the lower stage 211. It is possible to stabilize the transfer operation. When the transfer operation is completed, the positive pressure supply is stopped and the negative pressure is supplied to all the openings ((c) in the figure). At this time, the suction holding of the plate PP (or the substrate SB) by the upper stage is released. Accordingly, the lower surface of the blanket BL is adsorbed by the lower stage 211 while the plate PP (or the substrate SB) is in close contact with the upper surface of the blanket BL, and the preparation for movement to the peeling position P2 is completed.

  Next, the configuration and operation of the peeling unit 260 will be described with reference to FIGS. 2, 3, 6, and 7. The peeling portion 260 is disposed above the lower stage portion 210 (see the one-dot chain line in FIG. 3) positioned at the peeling position P2. In the peeling unit 260, the four suction pad rows 261a to 261d are located above the adhesion body (= laminated body of the blanket BL, the plate PP, and the substrate SB) on which the lower stage 211 is suction-held. Are arranged in the Y direction at regular intervals. In FIG. 3, only the (+ X) side suction pads 261 of the suction pad rows 261a to 261d are shown, but a plurality of suction pads 261 are arranged in the X direction in each of the suction pad rows 261a to 261d. Further, a pad lifting cylinder 263 (FIG. 2) and a suction valve 264 (FIG. 2) are provided for each of the suction pad rows 261a to 261d. For example, in the suction pad row 261a, the pad lifting cylinder 263 connected thereto is driven, so that the plurality of suction pads 261 constituting the suction pad row 261a move up and down at the same time, and the tips of the suction pads 261 are on the lower stage 211. Are brought into contact with and separated from the upper surface (the upper surface of the plate PP and the substrate SB). In addition, one suction valve 264 is connected to a plurality of suction pads 261 constituting the suction pad row 261a, and the suction operation and suction stop operation by the suction pad 261 are switched by opening / closing control of the suction valve 264. The same applies to the other suction pad rows 261b to 261d.

  Further, a roller 262 that is rotatably held by a roller support mechanism (not shown) is disposed to extend in the X direction. The roller 262 is moved up and down in the vertical direction Z by the roller lifting cylinder 265, and thereby comes into contact with and separates from the upper surface (the upper surface of the plate PP and the substrate SB) of the adhesion body on the lower stage 211. The roller 262 is moved in the Y direction by a roller horizontal drive motor 266. However, a rotation drive source is not connected to the roller 262, and the roller 262 rotates in a driven manner when moving in the Y direction while contacting the upper surface of the contact body.

  6 and 7 are diagrams schematically showing the operation of the peeling portion. When the transfer process is completed, the lower stage unit 210 moves to the peeling position P2 while adsorbing and holding the adhesion body of the blanket BL and the plate PP (substrate SB), and is positioned below the peeling unit 260 configured as described above. Is done. Before the start of peeling and after the completion of peeling, as shown in FIG. 3, the suction pad rows 261 a to 261 d and the roller 262 are retreated to a position sufficiently away from the contact body on the lower stage 211.

  When the peeling process is started, as shown in FIG. 6A, the suction pad row 261a located closest to the (+ Y) side is lowered and the tip of the suction pad 261 constituting the suction pad row 261a is moved. It contacts the upper surface of the plate PP. Then, a negative pressure is supplied to the suction pad 261 to hold the plate PP by suction. At the same time, the roller 262 moves in the (+ Y) direction and is positioned in the vicinity of the (−Y) side of the suction pad row 261a and then descends to contact the upper surface of the plate PP on the (−Y) side of the suction pad 261. Make contact. The blanket BL is held by suction on the lower stage 211 following the transfer process and the transport process, as shown in FIG.

  Next, only the suction pad row 261a is raised while the roller 262 is in contact with the upper surface of the plate PP. At the initial rising stage, as shown in FIG. 6B, the (+ Y) side end of the plate PP is peeled from the blanket BL in the range from the (+ Y) side end surface of the plate PP to the roller contact position. Then, in synchronization with the suction pad row 261a further rising, the roller 262 moves in the opposite direction to the peeled area, that is, in the (−Y) direction, with the roller 262 being in contact with the upper surface of the plate PP. The ascending speed of the suction pad 261 and the moving speed of the roller 262 are both constant speeds.

  As shown in FIG. 7A, as the suction pad 261 rises, the end of the plate PP sucked by the suction pad 261 is further lifted, and peeling from the blanket BL proceeds. That is, the peeling boundary line proceeds in the (−Y) direction. However, the advancing of the peeling boundary line is limited to the contact position with the roller 262 by bringing the roller 262 into contact with the upper surface of the plate PP. Further, since the roller 262 extends in the X direction, the peeling boundary line is also a straight line extending in the X direction. In this embodiment, a high suction holding force is obtained by using a suction pad row 261a in which a plurality of suction pads 261 are arranged in the X direction. Further, the plate PP is reliably lifted by adsorbing it as close as possible to the end of the plate PP.

  Then, as shown in FIG. 7B, when the roller 262 passes below the suction pad row 261b, the suction pad row 261b descends and the tip of the suction pad 261 constituting the suction pad row 261b is separated from the separation boundary line. Contact the peeled area in the vicinity. Then, after the plate PP is sucked and held by supplying negative pressure to these suction pads 261, the suction pad row 261b rises in synchronization with the movement of the roller 262. As a result, the peeled area further expands in the (−Y) direction. In addition, if the suction pad row 261a that has started to rise first rises to the initial retracted position, it stops at that position.

  Further, although not shown in the drawing, every time the roller 262 passes below the suction pad rows 261c and 261d, the lowering and the suction and rise of the plate PP are executed in the same manner as the suction pad row 261b. As a result, as shown in FIG. 7C, the entire plate PP can be peeled from the blanket BL, and the peeled plate PP is sucked and held above the blanket BL by the suction pad rows 261a to 261d. The When the roller 262 passes the upper surface of the plate PP, the roller 262 rises to the retracted position and stops.

  Next, the operation of the pattern forming system configured as described above will be described with reference to FIGS. FIG. 8 is a flowchart showing the operation of the pattern forming system of FIG. In the initial state of the pattern forming system, the lower stage portion 210 is positioned at the transfer position P1. Further, the lift pin 216b protrudes from the upper surface 211a of the lower stage 211 in the (+ Z) direction and can accept the blanket BL. When the plate / substrate carrying device 4 carries the plate PP from the (−Y) side of the transfer peeling device 2 to the upper stage unit 240, the plate PP is sucked and held on the lower surface of the upper stage 241 (step S101). Here, immediately before the plate PP is sucked and held on the lower surface of the upper stage 241, the plate PP held by the hand (not shown) of the plate / substrate carry-in device 4 may be pre-aligned. Alignment can be suitably performed. The same applies to a blanket BL described below and a substrate SB described later.

  Further, after the plate PP is carried in (step S101), when the blanket carry-in device 3 carries the blanket BL from the (+ X) side of the transfer peeling device 2 into the lower stage unit 210, it moves in the (+ Z) direction from the upper surface 211a of the lower stage 211. The blanket BL is placed on the top of the protruding lift pin 216b. Then, the lift pins 216b retreat in the (−Z) direction from the upper surface 211a of the lower stage 211, transfer the blanket BL to the upper surface 211a of the lower stage 211, and the lower stage 211 sucks and holds (step S102). In the present embodiment, the plate / substrate carry-in device 4 and the blanket carry-in device 3 are arranged on the (−Y) side and the (+ X) side of the transfer peeling device 2, respectively, and the plate PP is moved from the (−Y) side. Although the blanket BL is carried in from the (+ X) side, the loading direction of the plate PP (substrate SB) and the blanket BL is not limited to this. For example, the plate PP and the substrate SB may be loaded from the (+ X) direction side or the (−X) direction side, and the blanket BL may be loaded from the (−X) direction side or the (−Y) direction side. Good. In this embodiment, the plate PP and the blanket BL are carried into the transfer peeling apparatus 2 in the order, but these may be performed simultaneously or the order may be changed.

  The lower stage part 210 positioned at the transfer position P1 by the above steps S101 and S102 holds the blanket BL with the upper surface of the blanket BL facing upward, while the upper stage part 240 is preliminarily provided on both sides of the plate PP. The plate PP is held in a state where the surface on which the pattern is provided is directed downward, that is, toward the upper surface of the blanket BL, that is, a so-called face-down state. Then, the stage elevating motor 242 is actuated to lower the upper stage 241 downward (−Z) to move the plate PP to the vicinity of the blanket BL, and the interval between the plate PP and the blanket BL in the vertical direction Z, that is, the gap amount. Adjust accurately.

  Subsequently, as described above, the pressurizing valve 251 and the suction valve 253 operate to partially supply air between the lower stage 211 and the blanket BL, so that the blanket BL is partially held on the upper stage 241. Pressed against the plate PP. As a result, the central portion of the blanket BL is in close contact with the plate PP, and a pattern formed in advance on the lower surface of the plate PP comes into contact with the coating layer previously applied on the upper surface of the blanket BL, thereby patterning the coating layer and printing the plate PP. A pattern layer is formed by inverting the above pattern (step S103: first transfer process).

  After the first transfer process is performed in this manner, the adsorption of the plate PP by the upper stage 241 is released, and the stage elevating motor 242 is operated to raise the upper stage 241 in the upward direction (+ Z), so that the contact body (= plate It is retreated upward from the laminate of PP and blanket BL). At the same time, the valve 251 and 253 are switched between open and closed in a timely manner, and a negative pressure is applied to the blanket BL to draw it toward the lower stage 211 side. Thus, when the entire lower surface of the blanket BL, that is, the entire contact body is sucked and held by the lower stage 211, the lower stage driving unit 233 is operated to move the lower stage unit 210 from the transfer position P1 in the (+ Y) direction. As shown by the dashed line 1, the film is positioned at the peeling position P2 (step S104).

  At the peeling position P2, the lower stage 210 has the lower surface of the adhesive body (the lower surface of the blanket BL) with the upper surface of the adhesive body, that is, the upper surface of the plate PP (the surface on which no pattern is provided) facing the peeling portion 260. keeping. Then, while the lower stage unit 210 holds the blanket BL by suction, the peeling unit 260 peels the plate PP from the blanket BL by raising and lowering the suction pad and rotating the roller as described above. The peeled used plate PP is transferred to the plate / substrate unloading device 5 (FIG. 2) arranged on the (+ Y) side of the transfer peeling device 2 and is transferred from the peeling portion 260 to the outside of the transfer peeling device 2, for example, It is carried out to the plate cleaning apparatus (step S105). Accordingly, in the lower stage portion 210, only the blanket BL having the pattern layer formed on the upper surface is sucked and held on the blanket holding surface 211a of the lower stage 211.

  In the next step S106, similarly to the plate PP, the substrate SB is carried into the upper stage unit 240 and sucked and held on the upper stage 241. Further, after the execution of step S106 or in parallel with the execution, the lower stage driving unit 233 is operated to move the lower stage unit 210 in the (−Y) direction from the peeling position P2, and as shown by the solid line in FIG. Position to P1 (step S107). Then, similarly to the first transfer process (step S103), the upper surface (pattern layer) of the blanket BL and the lower surface of the substrate SB are brought into close contact with each other, and the pattern layer is transferred onto the lower surface of the substrate SB (step S108: first). 2 transfer processing).

  After this second transfer process, step S109 similar to step S104 is executed. That is, the suction holding of the substrate SB by the upper stage 241 is released, and the stage elevating motor 242 is operated to raise the upper stage 241 upward (+ Z), so that the adhesion body (= laminate of the substrate SB and the blanket BL). ) From above. At the same time, the valve 251 and 253 are switched between open and closed at a suitable time, negative pressure is applied to the blanket BL, and the blanket BL is pulled toward the lower stage 211 to attract the entire lower surface of the blanket BL, that is, the entire contact body to the lower stage 211. Hold. Subsequently, the lower stage driving unit 233 is operated to move the lower stage unit 210 again from the transfer position P1 in the (+ Y) direction, and is positioned at the peeling position P2 as indicated by the broken line in FIG.

Then, Step S110 similar to Step S105 is executed, and the substrate SB is peeled from the blanket BL while the lower stage unit 210 holds the blanket BL by suction. The peeled substrate SB is transferred to the plate / substrate unloading device 5 (FIG. 2) arranged on the (+ Y) side of the transfer peeling device 2 and is carried out from the peeling unit 260 to the next substrate processing apparatus. . When the pattern formation on the substrate SB is completed, since the blanket BL remaining on the lower stage portion 210 is used, it is carried out by the blanket carry-out device 6 to the outside of the transfer peeling device 2, for example, a blanket cleaning device ( Step S111). That is, the suction and holding of the blanket BL by the lower stage 211 is released, and the lift pin 216b protrudes in the (+ Z) direction from the upper surface 211a of the lower stage 211 to push the blanket BL upward from the lower stage 211. Then, the blanket carry-out device 6 disposed on the (+ X) side of the lower stage portion 210 positioned at the peeling position P2 receives and carries out the blanket BL supported by the top of the lift pin 216b.

  When a series of pattern forming operations is completed in this manner, in order to execute the next pattern formation, the lower stage driving unit 233 is operated to move the lower stage unit 210 again from the peeling position P2 in the (−Y) direction to transfer the position. Position to P1 (step S112).

  As described above, according to the first embodiment, the upper surface of the blanket BL and the lower surface of the plate-like object (the plate PP and the substrate SB) in a state where the lower stage portion 210 that holds the blanket BL by suction is positioned at the transfer position P1. The patterns are transferred by pressing them together. Then, the lower stage unit 210 is positioned by moving from the transfer position P1 to the peeling position P2 while adsorbing and holding the blanket BL following the transfer process and keeping the lower surface of the plate-like object in close contact with the upper surface of the blanket BL. Then, the plate-like object is peeled from the blanket BL by the peeling portion 260. Thus, the transfer process (steps S103 and S108) and the peeling process (steps S105 and S109) are performed at different positions, and the transfer and peeling invention in which the transfer process and the peeling process are continuously performed at the same position ( For example, it is superior in mass productivity and maintainability compared to the invention described in Patent Document 1.

  In the present embodiment, the blanket BL is sucked and held on the lower stage 211 of the lower stage unit 210, and then the first transfer process (step S103) is performed while the holding state is maintained, and the transfer from the transfer position P1 to the peeling position P2 is performed. Processing (step S104), first peeling process (step S105), transport process from the peeling position P2 to the transfer position P1 (step S107), second transfer process (step S108), transport from the transfer position P1 to the peeling position P2. Processing (step S109) and second peeling processing (step S110) are performed. As described above, since the blanket BL is always sucked and held by the lower stage 211 during the pattern forming process, the blanket BL and the substrate SB are also transported during the conveyance of the adhesion body between the blanket BL and the plate PP. It is possible to effectively prevent the positional deviation between the blanket BL and the plate-like object (the plate PP and the substrate SB) even during the conveyance of the close contact body. Therefore, the pattern can be stably transferred with high productivity in both of the transfer peeling process performed between the blanket BL and the plate PP and the transfer peeling process performed between the blanket BL and the plate PP. . And since the said transfer peeling apparatus 2 is incorporated in the pattern formation system, the reversal pattern which reversed the pattern of plate PP can be formed in the board | substrate SB stably and with high productivity. Further, once the blanket BL is pre-aligned before suction holding by the lower stage 211, it is not necessary to perform the pre-alignment until the pattern formation is completed.

  Further, in the present embodiment, the lower stage 211 supports the entire lower surface of the blanket BL from below and brings the plate-like object (plate PP and substrate SB) into close contact with the blanket BL and transports it from the transfer position P1 to the peeling position P2. Therefore, the contact body can be transported more stably, and as a result, it is possible to more effectively prevent the occurrence of displacement during the transport of the contact body. Furthermore, in this embodiment, the planar size of the plate-like object (the plate PP and the substrate SB) is smaller than the planar size of the blanket BL, and the entire lower surface of the plate-like object is pressed against and closely contacts the upper surface central portion of the blanket BL. . For this reason, while the weight is concentrated on the central portion of the contact body, the rigidity of the peripheral portion of the blanket BL is greatly reduced, but the lower stage 211 supports the entire lower surface of the blanket BL from below, so that the weight In addition, the adhesion body can be stably conveyed without being affected by the nonuniformity of rigidity. Such effects are the same in the second and third embodiments described below.

  FIG. 9 is a perspective view showing a schematic configuration of the second embodiment of the pattern forming system. FIG. 10 is a flowchart showing the operation of the pattern forming system shown in FIG. In the first embodiment, the first transfer process (step S103) and the second transfer process (step S108) are performed at the same transfer position P1, and the first peel process (step S105) and the second peel process (step S110). ) At the same peeling position P2. In contrast, in the second embodiment, as shown in FIG. 9, the first transfer process (step S203), the first peeling process (step S205), the second transfer process (step S208), and the second peeling process (step S210) is performed at different positions P11, P12, P21, and P22. Along with this, the carry-out position of the used plate PP, the carry-in position of the substrate SB, and the carry-out position of the used blanket BL are changed. Since other configurations and operations are basically the same as those of the first embodiment, the same components are denoted by the same reference numerals and description thereof is omitted.

  In the second embodiment, the guide rail 231 is extended to about twice that of the first embodiment, and the lower stage portion 210 has a first transfer position P11, a first peeling position P12, a second transfer position P21, and a second peeling position. It is movable to P22. An upper stage unit 2401 dedicated to the first transfer process is disposed above the lower stage unit 210 positioned at the first transfer position P11, and the plate PP is carried into the upper stage unit 2401 on the (−Y) side. A plate loading device is arranged, and a blanket loading device (not shown) is arranged on the (+ X) side. In addition, a peeling part 2601 dedicated to the first peeling process is disposed above the lower stage part 210 positioned at the first peeling position P12, and a plate carry-out device is disposed on the (+ X) side. Further, an upper stage portion 2402 for second transfer processing is disposed above the lower stage portion 210 positioned at the second transfer position P21, and a substrate carry-in device is disposed on the (+ X) side. Further, a peeling part 2602 dedicated to the second peeling process is arranged above the lower stage part 210 positioned at the second peeling position P22, a substrate carry-out device is arranged on the (+ Y) side, and the (+ X) side A blanket carry-out device is arranged in the door. In FIG. 9, the illustration of the carry-in device and the carry-out device is omitted, and only the movements of the plate PP, the substrate SB, and the blanket BL are illustrated by arrows. The upper stage portions 2401 and 2402 both have the same configuration as the upper stage portion 240 of the first embodiment, and the peeling portions 2601 and 2602 both have the same configuration as the peeling portion 260 of the first embodiment.

  In the pattern forming system according to the second embodiment configured as described above, the plate PP is sucked and held on the upper stage 241 of the first upper stage unit 2401 (step S201). Then, the blanket BL is sucked and held on the lower stage 211 of the lower stage portion 210 positioned at the first transfer position P11 (step S202), and the patterning process (first transfer process) on the upper surface of the blanket BL by the pattern of the plate PP is performed. It is executed (step S203).

  Subsequently, after the adsorption holding of the plate PP by the upper stage 241 is released, the lower stage unit 210 moves from the first transfer position P11 in the (+ Y) direction and is positioned at the first peeling position P12 (step S204). ). Then, the plate PP is peeled off from the blanket BL, and the peeled used plate PP is carried out by the plate carrying-out device (step S205).

  In the next step S206, the substrate SB is sucked and held on the upper stage 241 of the second upper stage part 2402. Further, after the execution of step S206 or in parallel with the execution, the lower stage portion 210 moves from the first peeling position P12 in the (+ Y) direction and is positioned at the second transfer position P21 (step S207). Then, the second transfer process is executed (step S208).

After the second transfer process, similarly to step S204, after the upper stage 241 of the second upper stage unit 2402 is released from the suction holding of the substrate SB, the lower stage unit 210 moves from the second transfer position P21 in the (+ Y) direction. And is positioned at the second peeling position P22 (step S209). Then, by executing step S210 similar to step S205, the substrate SB is peeled from the blanket BL by the second peeling portion 2601, and the peeled substrate SB is transferred from the second peeling portion 2601 to the next by the substrate carry-out device. It is carried out to the substrate processing apparatus. Further, the blanket BL remaining on the lower stage unit 210 is carried out by the blanket carrying-out device (step S211). Thereafter, in order to execute the next pattern formation, the lower stage portion 210 moves in the (−Y) direction from the second peeling position P22 and is positioned at the first transfer position P1 (step S212).

  As described above, in the second embodiment, after the blanket BL is sucked and held on the lower stage 211 of the lower stage portion 210, the first transfer position P11, the first peeling position P12, and the second transfer position are maintained while the holding state is continued. The first transfer process, the first peel process, the second transfer process, and the second peel process are performed at the position P21 and the second peel position P22, respectively. Therefore, similarly to the first embodiment, an inverted pattern obtained by inverting the pattern of the plate PP can be stably formed on the substrate SB with high productivity.

  FIG. 11 is a perspective view showing a schematic configuration of the third embodiment of the pattern forming system. FIG. 12 is a flowchart showing the operation of the pattern forming system shown in FIG. In the first embodiment, a pattern forming system 1 is configured by using one transfer peeling apparatus 2. That is, while the blanket BL is sucked and held by one lower stage portion 210, the first transfer process (step S103) and the second transfer process (step S108) are the same, reciprocating between the transfer position P1 and the peeling position P2. And the first peeling process (step S105) and the second peeling process (step S110) are performed at the same peeling position P2. In contrast, in the third embodiment, as shown in FIG. 11, the pattern forming system 1 is configured using two transfer peeling devices 21 and 22, and two lower stage portions 2101 are provided on the base 200. 2102 are provided. That is, the (−Y) side lower stage portion 2101 can be moved to the first transfer position P11 and the first peeling position P21 by the lower stage moving mechanism 2301 provided at the (−Y) side portion of the base 200. ing. On the other hand, the lower stage portion 2102 on the (+ Y) side can be moved to the second transfer position P21 and the second peeling position P22 by the lower stage moving mechanism 2302 provided on the (+ Y) side portion of the base 200. .

  Corresponding to the provision of the two transfer positions P11 and P21, the two upper stage portions 2401 and 2402 are arranged similarly to the second embodiment, and the two peeling positions P12 and P22 are provided. Correspondingly, two peeling portions 2601 and 2602 are arranged as in the second embodiment. Specifically, an upper stage portion 2401 dedicated to the first transfer process is disposed above the first lower stage portion 2101 positioned at the first transfer position P11, and the plate PP is placed on the upper stage portion on the (−Y) side. A plate loading device for loading into 2401 is arranged, and a blanket loading device is arranged on the (+ X) side. In addition, a peeling part 2601 dedicated to the first peeling process is arranged above the lower stage part 2101 positioned at the first peeling position P12, and a plate carry-out device is arranged on the (+ X) side. Further, an upper stage portion 2402 for second transfer processing is disposed above the lower stage portion 2102 positioned at the second transfer position P21, and a substrate carry-in device is disposed on the (+ X) side. Further, a peeling part 2602 dedicated to the second peeling process is arranged above the lower stage part 2102 positioned at the second peeling position P22, a substrate carry-out device is arranged on the (+ Y) side, and the (+ X) side A blanket carry-out device is arranged in the door. In FIG. 11, illustration of the carry-in device and the carry-out device is omitted, and only the movements of the plate PP, the substrate SB, and the blanket BL are illustrated by arrows. The upper stage portions 2401 and 2402 both have the same configuration as the upper stage portion 240 of the first embodiment, and the peeling portions 2601 and 2602 both have the same configuration as the peeling portion 260 of the first embodiment.

  Further, the intermediate transfer device 8 is arranged between the lower stage portions 2101 and 2102 described above. The intermediate transfer device 8 has a hand 81 for holding the blanket BL, and can receive the blanket BL patterned by the plate PP from the first lower stage portion 2101 positioned at the first peeling position P12 by the hand 81. It has become. Further, the hand 81 can transfer the received blanket BL to the second lower stage portion 2102 positioned at the second transfer position P21. The configurations of the lower stage portions 2101 and 2102 are the same as those of the lower stage portion 210 of the first embodiment.

  In the pattern forming system according to the third embodiment configured as described above, the plate PP is sucked and held on the upper stage 241 of the first upper stage portion 2401 (step S301). Then, the blanket BL is sucked and held on the lower stage 211 of the first lower stage portion 2101 positioned at the first transfer position P11 (step S302), and the patterning process (first transfer process) of the upper surface of the blanket BL by the pattern of the plate PP ) Is executed (step S303).

  Subsequently, after the upper plate 241 is released from the adsorption holding of the plate PP, the first lower stage portion 2101 moves from the first transfer position P11 in the (+ Y) direction and is positioned at the first peeling position P12 ( Step S304). Then, the plate PP is peeled off from the blanket BL, and the used plate PP that has been peeled off is carried out by the plate carrying-out device (step S305). As a result, only the blanket BL on which the pattern layer patterned by the plate PP is adsorbed and held on the lower stage 211 of the first lower stage portion 2101.

  In the next step S306, the blanket BL on the first lower stage portion 2101 is transferred to the lower stage 211 of the second lower stage portion 2102 positioned at the second transfer position P21 by the intermediate transfer device 8, and is sucked and held. The Since the removal of the blanket BL from the first lower stage unit 2101 is completed when the transfer operation is completed, the first lower stage unit 2101 moves in the (−Y) direction in preparation for the next first transfer process. It moves and is positioned at the first transfer position P11 (step S307).

  In parallel with this, after the substrate SB is sucked and held on the upper stage 241 of the second upper stage portion 2402 (step S308), the second transfer process is executed (step S309).

After the second transfer process, similarly to step S304, after the suction holding of the substrate SB by the upper stage 241 of the second upper stage part 2402 is released, the second lower stage part 2102 moves from the second transfer position P21 to (+ Y ) And moved to the second peeling position P22 (step S310). Then, by executing step S311 similar to step S305, the substrate SB is peeled from the blanket BL by the second peeling portion 2601, and the peeled substrate SB is transferred from the second peeling portion 2601 to the next by the substrate carry-out device. It is carried out to the substrate processing apparatus. Further, the blanket BL remaining on the second lower stage portion 2102 is carried out by the blanket carrying-out device (step S312). After that, in order to receive the blanket BL on which the pattern layer is formed again, the second lower stage portion 2102 moves in the (−Y) direction from the second peeling position P22 until the next step S306 is executed. 2 is positioned at the transfer position P21 (step S313).

  As described above, in the third embodiment, in both the first lower stage portion 2101 and the second lower stage portion 2102, after the blanket BL is sucked and held on the lower stage 211, the transfer process is performed while the holding state is continued. And peeling treatment. Therefore, similarly to the first embodiment, an inverted pattern obtained by inverting the pattern of the plate PP can be stably formed on the substrate SB with high productivity.

  Thus, in the first embodiment, the lower stage 211 and the upper stage 241 correspond to examples of the “first stage” and the “second stage” of the present invention, respectively. In the second embodiment and the third embodiment, the lower stage 211, the upper stage 241 of the (−Y) side upper stage part 2401, and the upper stage 241 of the (+ Y) side upper stage part 2402, respectively, This corresponds to an example of “1 stage”, “second stage”, and “third stage”. In the first embodiment, the plate / substrate carry-in device 4 (FIG. 2) and the plate / substrate carry-out device 5 (FIG. 2) are respectively the “plate-like object carry-in device” and “plate-like object carry-out device” of the present invention. It corresponds to an example.

  The present invention is not limited to the above-described embodiment, and various modifications can be made to the above-described one without departing from the spirit of the present invention. For example, in the above embodiment, a plate-like object such as the plate PP or the substrate SB is sucked and held by the upper stage 241, but the holding mode of the object is not limited to this.

  In the above embodiment, the plane size of the plate PP and the substrate SB is the same, but it is not essential that the plate-like object has a single outer size, and the present invention can also be applied to cases where they are different from each other. It is.

  In the above embodiment, the pressurized air is supplied between the central portion of the blanket BL and the blanket holding surface 211a to lift the central portion of the blanket BL and press it against the plate PP or the substrate SB. The aspect is not limited to this, and may be pressed from the plate-like object (plate PP or substrate SB) side, for example.

  In the present invention, after transferring one side of a blanket and one side of a plate-like object and transferring a pattern formed on one of the two sides to the other, the blanket and the plate-like object are peeled off. The present invention can be suitably applied to all peeling techniques.

DESCRIPTION OF SYMBOLS 1 ... Pattern formation system 2, 21, 22 ... Transfer peeling apparatus 3 ... Blanket carrying-in apparatus 4 ... Plate / board | substrate carrying-in apparatus (plate-shaped object carrying-in apparatus)
5. Plate / substrate unloading device (plate-like object unloading device)
6 ... Blanket unloading device 7 ... Control device 8 ... Intermediate transfer device 210, 2101, 2102 ... Lower stage 211 ... Lower stage 211a ... Blanket holding surface 230, 2301, 2302 ... Lower stage moving mechanism 240, 2401, 4022 ... Upper stage Part 241 ... Upper stage 260, 2601, 2602 ... Peeling part BL ... Blanket P1, P11, P21 ... Transfer position P2, P12, P22 ... Peeling position PP ... Plate (plate-like object)
SB ... Substrate (plate-like object)

Claims (9)

A first stage that is reciprocally provided between a transfer position and a peeling position while holding a blanket;
Stage moving means for moving the first stage and positioning it at the transfer position and the peeling position;
A second stage for holding the plate-like object while facing one side of the plate-like object to one side of the blanket held by the first stage positioned at the transfer position by the stage moving means;
One side of the blanket is pressed against and closely contacted one side of the blanket held on the first stage positioned at the transfer position and one side of the plate-like object held on the second stage. A pressing means for transferring a pattern formed on one of the direction and one side of the plate-like object to the other;
From the blanket held on the first stage positioned by moving from the transfer position to the peeling position by the stage moving means while keeping one surface of the plate-like object in close contact with one surface of the blanket A transfer peeling apparatus comprising: peeling means for peeling the plate-like object. The transfer peeling apparatus according to claim 1,
The first stage holds one side of the blanket facing upward,
The second stage is disposed above the first stage positioned at the transfer position;
The peeling means is a transfer peeling apparatus disposed above the first stage positioned at the peeling position. The transfer peeling apparatus according to claim 2,
The plane size of the plate-like object is smaller than the plane size of the blanket,
The first stage sucks and holds the entire other surface of the blanket,
The pressing means is a transfer peeling device that presses the entire one surface of the plate-shaped object and the central portion of the one surface of the blanket together to make contact. Holding the plate-like object by the second stage while facing one side of the plate-like object to one side of the blanket held by the first stage positioned at the transfer position;
One side of the blanket is pressed against and closely contacted one side of the blanket held on the first stage positioned at the transfer position and one side of the plate-like object held on the second stage. Transferring the pattern formed on one of the surface and one side of the plate-like object to the other;
Holding the blanket on the first stage and moving the first stage from the transfer position to the peeling position while positioning the plate-like object in close contact with the blanket;
And a step of peeling the plate-like object from the blanket held on the first stage positioned at the peeling position. A pattern forming system for forming a reverse pattern of a pattern provided on one side of a plate on one side of a substrate,
The transfer peeling apparatus according to any one of claims 1 to 3,
A blanket carry-in device for conveying the blanket to the first stage positioned at the transfer position;
A plate-like object carry-in device for conveying a substrate and a plate as the plate-like object to the second stage;
A plate-like object carrying-out device for conveying the plate and the substrate peeled from the blanket by the peeling means from the peeling means;
The first stage positioned at the transfer position holds the blanket conveyed by the blanket carry-in device, and the second stage holds the plate conveyed by the plate-like object carry-in device,
The pressing means closely contacts the plate and the blanket, and transfers the pattern of the plate to one side of the blanket for patterning,
The stage moving means moves and positions the first stage from the transfer position to the peeling position while keeping one side of the plate in close contact with one side of the blanket,
The reversal pattern of the pattern is formed on one surface of the blanket by peeling the plate from the blanket held on the first stage where the peeling means is positioned at the peeling position;
Transporting the plate from which the plate-like object carrying-out device has been peeled from the peeling means,
The stage moving means moves and positions the first stage from the peeling position to the transfer position while the blanket on which the reverse pattern is formed is held on the first stage,
The second stage holds the substrate conveyed by the plate-like object carry-in device,
The pressing means transfers the reverse pattern of the blanket to one surface of the substrate by bringing the substrate and the blanket into close contact with each other,
The stage moving means moves and positions the first stage from the transfer position to the peeling position while keeping one side of the substrate in close contact with one side of the blanket,
The pattern forming system, wherein the peeling means peels the substrate from the blanket held on the first stage positioned at the peeling position to form the reverse pattern on one surface of the substrate. A pattern forming system for forming a reverse pattern of a pattern provided on one side of a plate on one side of a substrate,
A first stage provided movably between a first transfer position, a first peeling position, a second transfer position, and a second peeling position while holding a blanket;
Stage moving means for moving the first stage to position the first transfer position, the first peeling position, the second transfer position, and the second peeling position;
A blanket loading device for conveying the blanket to the first stage which is positioned to the first transfer position by the stage moving means,
A second stage for holding the plate while facing one surface of the plate to one surface of the blanket held by the first stage positioned at the first transfer position by the stage moving means;
A plate carry-in device for transporting the plate to the second stage;
The plate pattern is formed by pressing one surface of the blanket held on the first stage, which is positioned at the first transfer position, and one surface of the plate held on the second stage so as to be brought into close contact with each other. A first pressing means for transferring and patterning on one side of the blanket;
The first stage held by the first stage positioned by moving from the first transfer position to the first peeling position by the stage moving means while the one side of the plate is in close contact with one side of the blanket. A first peeling means for peeling the plate from a blanket to form a reverse pattern of the pattern on one side of the blanket;
One of the blankets held on the first stage which is moved and positioned from the first peeling position to the second transfer position by the stage moving means while holding the blanket on which the reverse pattern is formed. A third stage for holding the substrate while facing one side of the substrate in the direction;
A substrate carry-in device for transporting the substrate to the third stage;
The one side of the blanket held on the first stage positioned at the second transfer position and the one side of the substrate held on the third stage are pressed against each other so as to be in close contact with each other. A second pressing means for transferring a reverse pattern to one surface of the substrate;
The first stage held by the first stage positioned by moving from the second transfer position to the second peeling position by the stage moving means while keeping one side of the substrate in close contact with one side of the blanket. A pattern forming system comprising: a second peeling unit that peels the substrate from a blanket to form the reverse pattern on one surface of the substrate. The pattern forming system according to claim 6,
The first stage holds one side of the blanket facing upward,
The second stage is disposed above the first stage positioned at the first transfer position;
The first peeling means is disposed above the first stage positioned at the first peeling position;
The third stage is disposed above the first stage positioned at the second transfer position;
The pattern forming system, wherein the second peeling means is disposed above the first stage positioned at the second peeling position. The pattern forming system according to claim 7,
The plane size of the plate and the substrate are both smaller than the plane size of the blanket,
The first stage sucks and holds the entire other surface of the blanket,
The first pressing means presses the entire one surface of the plate and the central portion of the one surface of the blanket together to make close contact with each other,
The second pressing means is a pattern forming system in which the entire one surface of the substrate and the central portion of the one surface of the blanket are pressed against each other. A pattern forming system for forming a reverse pattern of a pattern provided on one side of a plate on one side of a substrate,
A first transfer peeling device and a second transfer peeling device having the same configuration as the transfer peeling device according to any one of claims 1 to 3;
A blanket carry-in device for conveying the blanket to the first stage of the first transfer peeling device;
A plate carry-in device for conveying a plate as the plate-like object to the second stage of the first transfer peeling device;
A substrate carry-in device for transporting the substrate as the plate-like object to the second stage of the second transfer peeling device;
Intermediate transport means for transporting a blanket from the first stage of the first transfer peeling device to the first stage of the second transfer peeling device;
In the first transfer peeling apparatus,
The first stage positioned at the transfer position holds the blanket conveyed by the blanket carry-in device, and the second stage holds the plate conveyed by the plate carry-in device,
The pressing means closely contacts the plate and the blanket, and transfers the pattern of the plate to one side of the blanket for patterning,
The stage moving means moves and positions the first stage from the transfer position to the peeling position while keeping one side of the plate in close contact with one side of the blanket,
The reversal pattern of the pattern is formed on one surface of the blanket by peeling the plate from the blanket held on the first stage where the peeling means is positioned at the peeling position;
The intermediate conveying means conveys the blanket having the reverse pattern formed on one side thereof from the first stage of the first transfer peeling device to the first stage of the second transfer peeling device,
In the second transfer peeling apparatus,
The second stage holds the substrate conveyed by the substrate carry-in device,
The pressing means transfers the reverse pattern of the blanket to one surface of the substrate by bringing the substrate and the blanket into close contact with each other,
The stage moving means moves and positions the first stage from the transfer position to the peeling position while keeping one side of the substrate in close contact with one side of the blanket,
The pattern forming system, wherein the peeling means peels the substrate from the blanket held on the first stage positioned at the peeling position to form the reverse pattern on one surface of the substrate.

Images