JPH0621220A - Wafer pasting apparatus - Google Patents

Abstract

PURPOSE:To perform a pasting operation in a state that air bubbles do not exist at all by a method wherein a pressing part by which a wafer and a ring are pasted is relatively actuated spirally from the center of the wafer toward the outer circumference of the wafer in a process wherein the wafer and the ring are pasted by using a tape. CONSTITUTION:An elastic plate 2 in which a space part connected to a vacuum source is formed is provided between a porous suction-face plate and a rear plate; a vacuum force is made to act on the space part; a wafer 1 is sucker to, and held on, the suction-face plate. Then, a tape 3 together with a ring 22 is set in such a way that its adhesive face is faced with the side of the wafer 1; after that, a gap part 13 between a stage 10 and the elastic plate 2 is pressurized by a pressurization fluid; the wafer 1 is deformed to a spherical shape so as to be upward convex; a pressing part 5 is moved downward and brought into contact with the tape 3. In this state, the stage 10 is turned by a motor 19; the pressing part 5 is moved to the outer circumferential direction by a recltlinear driving source 9. Thereby, the pressing part 5 is relatively moved spirally from the central part of the tape 3 and the tape 3 is pasted on the wafer 1.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a ring (a jig for handling) for preventing chips from scattering when separating a wafer into individual chips in a dicing device.
It can be used for a device for fixing a wafer by using a tape.

[0002]

2. Description of the Related Art As a conventional wafer sticking device using a tape of a wafer and a ring, the following three types of devices are used.

Vacuum suction is performed with the surface of the wafer facing downward, a ring is placed on the outer circumference of the ring, the tape is placed on top of it with the adhesive surface facing down, and a cylindrical roller is placed from the top of the ring. A device in which the surface is parallel to the wafer and the tape, the wafer, and the ring are pressed against each other for attachment. Vacuum suction with the wafer surface facing downward, placing the tape and ring on the top of the wafer with the tape already attached, and pressing the tape and wafer with a roller to attach them, or using a vacuum instead of the roller to attach .

[0004]

However, the above-mentioned prior art has the following problems. When sticking the wafer and the tape, sticking without air bubbles is an important quality control item in this process. If air bubbles are generated between the wafer and the tape, the chips in the air bubbles are scattered because they are not fixed to the tape during the dicing process for separating the wafer into chips. Therefore, the non-defective chip is lost, or the scattered chips collide with the grindstone of the dicing device and damage the grindstone. If the grindstone is processed in a damaged state, chipping may occur around the dicing groove, or the depth of the groove may become shallow, resulting in incomplete chip separation, resulting in a large number of defects. As a measure against this defect, an operator inspects the bonding surface after bonding the wafer, and if there is a bubble, the bubble is pushed out by making a small hole in the tape using a needle or the like.

The present invention solves the above problems. An object of the invention is to provide a wafer sticking device for sticking a wafer and a tape to each other without air bubbles.

[0006]

[Means for Solving the Problems] (1) In a step of attaching a wafer to a ring by using a tape, a pressing portion for attaching the wafer and the tape is relatively spirally arranged from the center of the wafer to the outer periphery of the wafer. It is characterized by working toward.

(2) It is characterized in that the wafer is fixed so as to have a spherical convex shape on the table for fixing the wafer.

(3) The adhesive tape used is characterized by having fine holes on the entire surface.

[0009]

EXAMPLES The present invention will be described in detail based on the following examples. First, the function of each unit will be described. FIG. 1 is a block diagram of the present invention. The wafer 1 is fixed to the elastic plate 2 by vacuum. FIG. 2 shows a sectional view of the elastic plate 2.

The elastic plate 2 is composed of a suction face plate 2a, a back face plate 2b and a spacer 2c. The space 2f is a space formed inside the elastic plate 2 and shielded from the outside by the suction face plate 2a, the back face plate 2b, and the spacer 2c. Vacuum inlet 2
d is connected by a pipe from an external vacuum source. Adsorption face plate 2
A has an adsorption port 2e for adsorbing the wafer 1. Adsorption of the wafer 1 is performed from an external vacuum source via the vacuum inlet 2d, the space 2f, and the adsorption port 2e. When the wafer 1 is desorbed, the suction force is lost by shutting off the path from the external vacuum source and returning it to atmospheric pressure or higher. The vacuum introduction path 21 is connected to the vacuum introduction port 2d of the elastic plate 2 and is connected to an external vacuum source by a pipe A25. The elastic plate 2 is fixed to the stage 10 with screws or the like by sandwiching the periphery with a fixing ring 11. When pressure is applied to the gap 13 between the stage 10 and the elastic plate 2 in this state, the wafer 1 is deformed into a spherical shape and an upward convex shape as shown in the figure.

FIG. 3 is a sectional view of the stage 10. The pressurization of the gap 13 is performed by being connected to an external pressure source via a pressure introducing path 12 formed in the stage 10 and a pipe B20 connected to the pressure introducing path 12. The stage 10 is supported by the bearing portion 14. A pulley A1 is provided below the bearing portion 14.
6 is fixed to the stage 10. A motor 19 for rotating the stage 10 is fixed to the apparatus by a fixing plate 18. A pulley B17 is fixed to the shaft end of the motor 19. The pulley A16 and the pulley B17 are rotationally connected by the belt 15. The tape 3 and the ring 22 are placed on the stage 10. The adhesive surface of the tape 3 faces downward. That is, it is placed so as to be attached to the back surface of the wafer 1. The tape 3 has innumerable small holes 4. The pressing portion 5 is fixed to the slide portion 24 via the shaft 6. The slide portion 24 moves along the rail 23. The shaft 6 has a structure that can be moved vertically with respect to the slide portion 24 by a spring 7. That is, the pressing portion 5
The spring 7 can be used to control the pressing force of. The slide portion 24 is connected to the linear drive source 9 by the connecting shaft 8.

Now, the flow of a series of operations in the sticking apparatus of the present invention will be described. The wafer 1 is placed on the elastic plate 2 and is vacuum-sucked by the suction face plate 2a. On the other hand, tape 3 is ring 2
The adhesive surface is set with the wafer 2 on the wafer 1 side. Next, the gap 13 of the stage 10 is pressed to warp the wafer 1 into a spherical convex shape. In this state, the pressing portion 5 contacts the tape 3. Then, the stage 10 is rotated by the motor 19. After the rotation of the stage 10, the pressing unit 5 is moved from the central portion of the wafer 1 to the outer peripheral portion of the wafer 1 by the linear drive source 9. At this time, the relative locus between the wafer 1 and the tape 3 and the pressing portion 5 has a spiral shape. After the pressing portion 5 moves to the outer peripheral portion of the wafer 1, the pressing portion 5 returns to the central portion of the wafer 1 with a reverse trajectory, and the attachment is completed. Due to the spiral locus between the wafer 1 and the pressing portion 5 and the spherical convex fixing of the wafer 1, which are the features of the present invention, the attachment of the tape 3 from the central portion of the wafer 1 starts toward the outer peripheral portion. By proceeding, bubbles are less likely to be generated between the wafer 1 and the tape 3. That is, the gas between the wafer 1 and the tape 3 is always discharged so as to be pushed out toward the outside of the attachment. A change in the distance between the convex warp of the wafer 1 and the pressing portion 5 can be absorbed by previously displacing the pressing portion 5 upward by the spring 7. Even if air bubbles are generated between the wafer 1 and the tape 3, the pressing portion 5 attaches the wafer 1 and the tape 3 to each other by the numerous small holes 4 formed in the tape 3 used in the present invention. It is pushed out through this hole 4. Further, by the operation of the pressing portion returning from the outer peripheral portion of the wafer 1 to the center of the wafer 1 again, even the slight air bubbles remaining between the wafer 1 and the tape 3 can be completely pushed out by the hole 4.

[0013]

According to the wafer sticking apparatus of the present invention, in the step of sticking a wafer to a tape, the wafer can be stuck without any bubbles. As a result, there is no need for the operator to confirm the presence or absence of air bubbles and remove the air bubbles after the application.
Further, in the dicing operation for chip separation, chip fly due to bubbles is eliminated, the grindstone is not damaged, and the chip separation process can be stably performed in terms of quality. Due to these effects, work efficiency and yield can be greatly improved.

[Brief description of drawings]

FIG. 1 is a configuration diagram of the present invention.

FIG. 2 is a sectional view of an elastic plate of the present invention.

FIG. 3 is a cross-sectional view of the stage of the present invention.

[Explanation of symbols]

 1 wafer 2 elastic plate 2a suction face plate 2b back plate 2c spacer 2d vacuum inlet 2e suction port 2f space 3 tape 4 hole 5 pressing part 6 axis 7 spring 8 connecting shaft 9 linear drive source 10 stage 11 fixing ring 12 pressure introduction path 13 Gap 14 Bearing 15 Belt 16 Pulley A 17 Pulley B 18 Fixing plate 19 Motor 20 Piping B 21 Vacuum introduction path 22 Ring 23 Rail 24 Slide section 25 Piping A

Claims (3)

[Claims] 1. A step of attaching a wafer and a ring using a tape, wherein a pressing portion for attaching the wafer and the tape is moved relative to the wafer center in a spiral shape toward the outer periphery of the wafer. Characteristic wafer sticking device. 2. A wafer sticking device, wherein a wafer is fixed so that the wafer has a spherical convex shape on a table for fixing the wafer. 3. The wafer sticking device according to claim 1, wherein the tape has fine holes all over its surface.