CN108296935B - Chuck table and grinding device - Google Patents
Chuck table and grinding device Download PDFInfo
- Publication number
- CN108296935B CN108296935B CN201711442466.7A CN201711442466A CN108296935B CN 108296935 B CN108296935 B CN 108296935B CN 201711442466 A CN201711442466 A CN 201711442466A CN 108296935 B CN108296935 B CN 108296935B
- Authority
- CN
- China
- Prior art keywords
- plate
- shaped workpiece
- chuck table
- grinding
- unit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 82
- 230000002093 peripheral effect Effects 0.000 claims abstract description 39
- 238000000034 method Methods 0.000 claims description 4
- 239000000126 substance Substances 0.000 claims 1
- 238000004140 cleaning Methods 0.000 description 8
- 238000007599 discharging Methods 0.000 description 2
- 230000003028 elevating effect Effects 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B19/00—Single-purpose machines or devices for particular grinding operations not covered by any other main group
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/02—Frames; Beds; Carriages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Jigs For Machine Tools (AREA)
Abstract
Provided are a chuck table and a grinding device, which can suck and hold a warped plate-shaped workpiece on a holding surface of the chuck table. The chuck table (10) comprises: a porous plate (11) having a holding surface (11a) for attracting and holding a plate-shaped workpiece (W); and a frame (12) having a recess (120) for exposing the holding surface and accommodating the porous plate, the frame having: a suction hole (121) formed in the bottom surface (120a) of the recess (120) and capable of communicating with a suction source (17); and a water supply hole (124) formed by opening on the upper surface (123a) of the frame body and capable of communicating with the water supply source (19), therefore, the plate-shaped workpiece can be sucked and held by the holding surface while water is supplied from the water supply hole to seal the outer peripheral part (Wc) of the plate-shaped workpiece, even if the plate-shaped workpiece has warpage on the outer peripheral part, the suction force can be prevented from leaking between the holding surface of the chuck worktable and the outer peripheral part of the plate-shaped workpiece, and the plate-shaped workpiece can be reliably sucked and held by the chuck worktable.
Description
Technical Field
The present invention relates to a chuck table for suction-holding a plate-shaped workpiece and a grinding apparatus for grinding the plate-shaped workpiece sucked and held on the chuck table.
Background
A grinding device for grinding a workpiece such as a plate-shaped workpiece includes at least: a chuck table for sucking and holding a plate-like workpiece; a grinding unit for grinding the plate-shaped workpiece sucked and held by the chuck table; a temporary placing table for temporarily placing the plate-like workpiece; and a carrying-in unit that carries the plate-like workpiece from the temporary placing table to the chuck table (see, for example, patent document 1 below). Then, the plate-shaped workpiece is carried from the temporary placing table to the chuck table by the carrying-in unit, sucked and held on the holding surface of the chuck table, and thereafter, ground to a predetermined thickness by the grinding unit.
However, warpage may occur in the outer periphery of the plate-shaped workpiece (see, for example, patent document 2 below). Even when such a plate-shaped workpiece is carried into the chuck table, the outer peripheral portion is warped upward away from the holding surface of the chuck table, and therefore the plate-shaped workpiece cannot be sufficiently sucked and held by the holding surface. Therefore, for example, when the plate-shaped workpiece warped is carried into the chuck table by the carrying-in unit, the carrying-in unit presses the outer peripheral portion of the plate-shaped workpiece toward the holding surface to the holding surface, and the holding surface communicates with the suction source to suction and hold the plate-shaped workpiece on the holding surface. Further, for example, patent document 3 below proposes a method of sucking and holding a plate-like workpiece on a chuck table through an elastic pad. In this method, when the plate-shaped workpiece is sucked by the holding surface of the chuck table, the elastic pad contracts to sink the plate-shaped workpiece into the elastic pad, so that the warpage of the outer peripheral portion of the plate-shaped workpiece can be solved.
Patent document 1: japanese patent laid-open publication No. 2001-313326
Patent document 2: japanese patent laid-open publication No. 2006-261415
Patent document 3: japanese patent laid-open publication No. 2015-199153
However, even with the above-described method, the suction force may leak from a slight gap between the holding surface of the chuck table and the outer peripheral portion of the plate-shaped workpiece, and the outer peripheral portion of the plate-shaped workpiece may not be sucked and held by the holding surface. When the grinding unit starts grinding the plate-shaped workpiece while maintaining this state, the plate-shaped workpiece is displaced from the chuck table, and thus machining cannot be performed.
Disclosure of Invention
The present invention has been made in view of the above circumstances, and an object thereof is to provide a chuck table and a grinding apparatus capable of sucking and holding a warped plate-shaped workpiece on a holding surface of the chuck table.
The present invention is a chuck table for sucking and holding a plate-shaped workpiece, the chuck table comprising: a porous plate having a holding surface for sucking and holding a plate-shaped workpiece; and a frame body having a concave portion for exposing the holding surface and accommodating the porous plate, the frame body having: a suction hole formed in the bottom surface of the recess and capable of communicating with a suction source; and a water supply hole formed by opening an upper surface of the frame body and capable of communicating with a water supply source, wherein the upper surface of the frame body surrounds the porous plate received in the recess.
Further, the present invention is a grinding apparatus including: a holding unit for rotatably mounting the chuck table; a grinding unit having a grinding wheel for grinding the plate-shaped workpiece sucked and held by the chuck table; and a carrying-in unit that carries the plate-shaped workpiece into the chuck table, wherein when the plate-shaped workpiece is carried into the chuck table by the carrying-in unit and is sucked and held by the chuck table, water is supplied from the water supply hole to the upper surface of the frame to seal an outer peripheral portion of the plate-shaped workpiece, and the chuck table, on which the plate-shaped workpiece is sucked and held, is rotated to grind the plate-shaped workpiece by the grinding unit.
The chuck table of the present invention comprises: a porous plate having a holding surface for sucking and holding a plate-shaped workpiece; and a frame body having a concave portion for exposing the holding surface and accommodating the porous plate, the frame body having: a suction hole formed in the bottom surface of the recess and capable of communicating with a suction source; and a water supply hole formed by opening on the upper surface of the frame body and capable of communicating with a water supply source, wherein the upper surface of the frame body surrounds the porous plate accommodated in the recess, so that water can be supplied from the water supply hole to seal the outer periphery of the plate-shaped workpiece, and the plate-shaped workpiece can be sucked and held by the holding surface.
Further, the grinding apparatus of the present invention includes: a holding unit for rotatably mounting the chuck table; a grinding unit having a grinding wheel for grinding the plate-shaped workpiece sucked and held by the chuck table; and a carrying-in unit that carries the plate-shaped workpiece into the chuck table, wherein when the plate-shaped workpiece is carried into the chuck table by the carrying-in unit and is sucked and held by the chuck table, water is supplied from the water supply hole to the upper surface of the frame to seal an outer peripheral portion of the plate-shaped workpiece, and the chuck table, on which the plate-shaped workpiece is sucked and held, is rotated to grind the plate-shaped workpiece by the grinding unit. Therefore, the plate-shaped workpiece can be prevented from being displaced from the chuck table during grinding, and the plate-shaped workpiece can be reliably sucked and held by the holding surface of the chuck table to be ground.
Drawings
Fig. 1 is a perspective view showing a structure of an example of a grinding apparatus.
Fig. 2 is a sectional view showing the structure of the chuck table, the holding unit, and the carrying-in unit.
Fig. 3 is an exploded perspective view showing the structure of the chuck table.
Fig. 4 is a perspective view showing the structure of the chuck table.
Fig. 5 (a) and (b) are cross-sectional views showing a state where the plate-like workpiece temporarily placed on the temporary placement table is received by the carry-in unit.
Fig. 6 (a) and (b) are cross-sectional views showing a state where a plate-shaped workpiece is delivered to the chuck table by the carry-in unit.
Fig. 7 is a cross-sectional view showing a state in which a plate-shaped workpiece held by suction on a chuck table is ground while water is sealed at an outer peripheral portion of the plate-shaped workpiece.
Description of the reference symbols
1: a grinding device: 2: a device base station: 3a, 3 b: a stage; 4a, 4 b: a cartridge; 5: a carrying-in and carrying-out unit; 6: temporarily placing a workbench; 7: a cleaning unit; 8: a turntable; 9. 9 a: a carry-in unit; 90: a carrying pad; 91: an arm portion; 92: a shaft portion; 93: an electric motor; 94: an attraction source; 10: a chuck table; 11: a perforated plate; 11 a: a holding surface; 12: a frame body; 120: a recess; 120 a: a bottom surface; 121: a suction hole; 122: an attraction groove; 123: a convex portion; 123 a: an upper surface; 124: a water supply hole; 13: a holding unit; 130: a base; 14: a rotation unit; 15: a rotary joint; 16: an aspiration path; 17: an attraction source; 17 a: a suction valve; 18: a waterway; 19: a water supply source; 19 a: a water supply valve; 20A, 20B: a grinding unit; 21: a main shaft; 22: an electric motor; 23: a spindle housing; 24: a support; 25: a mounting seat; 26a, 26 b: grinding the grinding wheel; 27a, 27 b: grinding the grinding tool; 28. 29: a column; 30A, 30B: a grinding feed unit; 31: a ball screw; 32: an electric motor; 33: a guide rail; 34: a lifting plate; 40: a thickness measuring unit; 41: a first measuring instrument; 41: a second measuring instrument; 100: an aqueous layer.
Detailed Description
The grinding apparatus 1 shown in fig. 1 includes an apparatus base 2 extending in the Y-axis direction, and stages 3a and 3b are arranged adjacently on the-Y direction side of the apparatus base 2. A cassette 4a for housing the plate-shaped workpiece before grinding is placed on the stage 3a, and a cassette 4b for housing the plate-shaped workpiece after grinding is placed on the stage 3 b. A carrying-in/out unit 5 is disposed at a position facing the cassette 4a and the cassette 4b, and the carrying-in/out unit 5 carries out carrying-out of the plate-shaped workpiece from the cassette 4a and carrying-in of the plate-shaped workpiece into the cassette 4 b. In the movable range of the carrying-in/out unit 5, disposed are: a temporary placing table 6 for temporarily placing the plate-like workpiece; and a cleaning unit 7 for cleaning and removing the grinding chips adhering to the plate-shaped workpiece after grinding.
A rotatable turntable 8 is disposed in the center of the apparatus base 2. The turntable 8 is provided with, for example, three holding units 13, and the chuck table 10 for suction-holding the plate-like workpiece is rotatably attached to these holding units 13. The turntable 8 is rotated to revolve the holding unit 13, and the holding unit 13 is moved between a mounting and demounting region P1 where the plate-shaped workpiece is mounted and demounted to and from the chuck table 10 and a grinding region P2 where the plate-shaped workpiece is rough ground and finish ground.
A column 28 extending in the Z-axis direction is provided upright on the end of the apparatus base 2 on the + Y direction side. A grinding unit 20A is disposed on the front side of the column 28 via a grinding feed unit 30A. The grinding unit 20A includes: a main shaft 21 having an axial center in the Z-axis direction; a motor 22 connected to one end of the main shaft 21; a spindle housing 23 that rotatably surrounds and supports the spindle 21; a holder 24 that holds the spindle case 23; a grinding wheel 26a detachably mounted on the lower end of the main shaft 21 via a mounting base 25; and a grinding wheel 27a for rough grinding, which is bonded to the lower part of the grinding wheel 26a in an annular shape. The grinding wheel 26a can be rotated at a predetermined rotational speed by rotating the spindle 21 by driving the motor 22.
The grinding feed unit 30A has: a ball screw 31 extending in the Z-axis direction; a motor 32 connected to one end of the ball screw 31; a pair of guide rails 33 disposed on the column 28 and extending parallel to the ball screw 31; and a lift plate 34 having one surface coupled to the support 24. The pair of guide rails 33 are in sliding contact with the other surface of the elevating plate 34, and the ball screw 31 is screwed to a nut formed at the center of the elevating plate 34. The grinding unit 20A can be ground and fed in the Z-axis direction along the pair of guide rails 33 together with the lifting plate 34 by rotating the ball screw 31 by the motor 32.
A column 29 is provided upright at an end of the apparatus base 2 on the + Y direction side with a predetermined interval from the column 28. A grinding unit 20B is disposed on the front side of the column 29 via a grinding feed unit 30B. The grinding unit 20B includes: a grinding wheel 26b detachably mounted on the lower end of the main shaft 21 via a mounting base 25; and a grinding wheel 27b for finish grinding which is fixed to a lower part of the grinding wheel 26b in a ring shape, and has the same configuration as the grinding unit 20A except for these. In the grinding unit 20B, the main shaft 21 is rotated by driving the motor 22, and the grinding wheel 26B can be rotated at a predetermined rotation speed.
The grinding feed unit 30B is also the same in structure as the grinding feed unit 30A. That is, the grinding and feeding unit 30B includes: a ball screw 31; a motor 32 connected to one end of the ball screw 31; a pair of guide rails 33 disposed on the column 29 and extending parallel to the ball screw 31; the lifting plate 34 is coupled to the holder 24 on one surface thereof, and the grinding unit 20B can be ground and fed in the Z-axis direction along the pair of guide rails 33 together with the lifting plate 34 by rotating the ball screw 31 by the motor 32.
A carrying-in unit 9 for carrying the plate-like workpiece temporarily placed on the temporary placement table 6 before grinding to the chuck table 10 positioned in the mounting/demounting region P1 is disposed in the vicinity of the temporary placement table 6. Further, a carrying-in unit 9a that carries the ground plate-like workpiece sucked and held on the chuck table 10 positioned in the attachment/detachment region P1 into the cleaning unit 7 is disposed in the vicinity of the cleaning unit 7.
As shown in fig. 2, the carry-in units 9 and 9a include: a conveying pad 90 having a suction surface 90a for sucking and holding the plate-like work; an arm 91 having one end connected to the conveyance pad 90; a shaft portion 92 connected to the other end of the arm portion 91 and rotatable and liftable; and a motor 93 connected to the shaft portion 92. The conveyance pad 90 is connected to a suction source 94, and the plate-shaped workpiece can be sucked and held by applying a suction force of the suction source 94 to the suction surface 90 a. In the carry-in unit 9, the shaft portion 92 is rotated by driving of the motor 93, and the arm portion 91 can be rotated in the horizontal direction, so that the conveyance pad 90 can be moved between the temporary placement table 6 shown in fig. 1 and the chuck table 10 positioned in the loading and unloading area P1. In the carry-in unit 9a, when the shaft portion 92 is rotated by driving the motor 93, the arm portion 91 can be rotated in the horizontal direction, and the conveyance pad 90 can be moved between the chuck table 10 positioned in the loading and unloading area P1 and the cleaning unit 7. In the carry-in units 9 and 9a, when the shaft portion 92 is lifted, the arm portion 91 is lifted in the vertical direction (Z-axis direction), and the conveyance pad 90 can be lifted.
As shown in fig. 2, the chuck table 10 includes: a porous plate 11 having a holding surface 11a for holding a plate-like workpiece by suction; and a frame 12 having a recess 120 for exposing the holding surface 11a and accommodating the porous plate 11. The housing 12 is attached to a base 130 constituting the holding unit 13. A rotary joint 15 is connected to the lower end of the base 130. A suction path 16 as a path of suction force is formed in the housing 12 and the rotary joint 15, and a suction source 17 is connected to the suction path 16 via a suction valve 17 a. A water passage 18 as a water passage is formed in the housing 12 and the rotary joint 15, and a water supply source 19 is connected to the water passage 18 via a water supply valve 19 a. A rotation unit 14 for rotating the chuck table 10 mounted on the base 130 is connected to the rotary joint 15.
Fig. 3 shows a state before the porous plate 11 is housed in the frame 12. The porous plate 11 is formed in a disk shape, for example, and is made of a porous member such as porous ceramic. The holding surface 11a of the perforated plate 11 shown in the present embodiment is formed in a shape similar to a plate-like workpiece and has substantially the same area as the plate-like workpiece. An annular projection 123 is formed on the frame 12, and the area inside the projection 123 is a recess 120 formed according to the shape of the porous plate 11. That is, the inner diameter of the concave portion 120 of the frame 12 is formed to be slightly larger than the outer diameter of the porous plate 11, so that the porous plate 11 can be fitted into the concave portion 120.
The bottom surface 120a of the concave portion 120 is formed as a flat surface in order to horizontally fix the lower surface 11b of the porous plate 11. A suction hole 121 as shown in fig. 2 is formed in the center of the bottom surface 120a of the concave portion 120, and can communicate with the suction source 17 through the suction passage 16. Further, a suction groove 122 is formed in the bottom surface 120a of the recess 120 at a position lower than the bottom surface 120 a. A negative pressure is generated in the suction groove 122 through the suction holes 121, and a suction force is transmitted to the porous plate 11 fitted in the concave portion 120, thereby exerting a suction effect on the holding surface 11 a. In the illustrated example, only one suction hole 121 is formed in the center of the bottom surface 120a of the recess 120, but the number and positions of the suction holes 121 are not limited. Therefore, the number of the suction holes 121 may be increased to two or more and formed at desired positions on the bottom surface 120a, respectively.
As shown in fig. 2, upper surface 123a of convex portion 123 of frame 12 is set to the same height position as holding surface 11a when porous plate 11 is fitted in concave portion 120, and serves as a reference surface. During grinding of the plate-like workpiece, the second gauge 42 is in contact with the upper surface 123a to measure the height of the chuck table 10.
A plurality of water supply holes 124 that can communicate with the water supply source 19 through the water passage 18 are formed in the upper surface 123a of the convex portion 123. The water supply hole 124 opens on the upper surface 123a of the projection 123, and can discharge water upward of the upper surface 123 a. As shown in fig. 3, the water supply holes 124 shown in the present embodiment are formed in a plurality at predetermined intervals at positions along the outer side of the outer periphery of the perforated plate 11, and are annular as a whole. In the illustrated example, the water supply hole 124 has a circular opening, but may be formed as a series of annular openings.
When the porous plate 11 is housed in the frame 12, for example, an adhesive material is applied to the bottom surface 120a of the concave portion 120, and then the porous plate 11 is fitted into the concave portion 120, so that the lower surface 11b of the porous plate 11 is adhesively fixed to the bottom surface 120 a. As a result, as shown in fig. 4, the chuck table 10 in which the porous plate 11 and the frame 12 are integrated is formed. The plurality of water supply holes 124 are positioned in a manner to surround the outer circumference of the perforated plate 11. When the plate-shaped workpiece is sucked and held by the holding surface 11a of the chuck table 10 configured as described above, the outer peripheral portion of the plate-shaped workpiece is surrounded by the plurality of water supply holes 124. In this state, by discharging water from the plurality of water supply holes 124, a water layer can be formed outside the outer peripheral portion of the plate-shaped workpiece, the outer peripheral portion of the plate-shaped workpiece is sealed with water by the water layer, and the plate-shaped workpiece is sucked and held on the holding surface 11 a. As described above, in the chuck table 10 of the present invention, even if the outer peripheral portion of the plate-shaped workpiece to be held by the chuck table 10 is warped, the outer peripheral portion of the plate-shaped workpiece is sealed by the water layer, so that the suction force can be prevented from leaking from between the outer peripheral portion and the holding surface 11a, and the plate-shaped workpiece can be reliably sucked and held by the holding surface 11 a.
Next, an operation example of the grinding apparatus 1 will be described. The plate-shaped workpiece W shown in fig. 5 (a) is an example of a circular plate-shaped workpiece, and a plurality of cassettes 4a shown in fig. 1 are housed therein. First, the carrying-in and carrying-out unit 5 takes out one plate-like workpiece W before grinding from the cassette 4a, and temporarily places the plate-like workpiece W on the temporary placement table 6 as shown in fig. 5 (a). Here, the outer peripheral portion Wc of the plate-shaped workpiece W is warped upward away from the upper surface of the temporary placement table 6, for example, due to the influence of heat generated when the device chip is sealed with the sealing resin. As shown in fig. 5 (b), the carry-in unit 9 lowers the conveying pad 90 together with the arm 91, brings the suction surface 90a of the conveying pad 90 into contact with the upper surface of the plate-shaped workpiece W temporarily placed in a state of being warped on the temporary placement table 6, and presses downward by the conveying pad 90. The carry-in unit 9 causes the suction force of the suction source 94 to act on the suction surface 90a to suction and hold the plate-shaped workpiece W. Thus, the carry-in unit 9 receives the plate-like workpiece W.
The carry-in unit 9 raises the transport pad 90 together with the arm portion 91, and drives the motor 93 to rotate the shaft portion 92 in the arrow a direction as shown in fig. 6 (a), thereby rotating the arm portion 91 in the horizontal direction and moving the transport pad 90 to the upper side of the chuck table 10. Next, the carry-in unit 9 lowers the transfer pad 90 together with the arm 91, and places the plate-like workpiece W on the holding surface 11a of the chuck table 10.
As shown in fig. 6 (b), the suction valve 17a disposed in the suction passage 16 is opened, the suction source 17 communicates with the suction passage 16, and the holding surface 11a of the chuck table 10 performs a suction action, thereby sucking and holding the plate-like workpiece W by the holding surface 11 a. The carry-in unit 9 releases the suction force of the suction surface 90a and raises the conveyance pad 90 together with the arm 91. Before the conveyance pad 90 is separated from the plate-like workpiece W, the water supply valve 19a disposed in the water passage 18 is opened, and supply of a predetermined amount of water from the water supply source 19 to the water passage 18 is started, and the water is ejected upward from the water supply hole 124. The water is continuously discharged from the water supply hole 124 to form the water layer 100 surrounding the outer peripheral portion Wc of the plate-shaped workpiece W, and the outer peripheral portion Wc of the plate-shaped workpiece W is water-sealed by the water layer 100. Then, the transfer pad 90 is retracted from the plate-like workpiece W. In this way, the plate-like workpiece W is delivered from the carry-in unit 9 to the chuck table 10.
Next, the turntable 8 shown in fig. 1 is rotated, and the chuck table 10 that suctions and holds the plate-like workpiece W is moved to a position below the grinding unit 20A. As shown in fig. 7, the chuck table 10 is rotated in, for example, the arrow a direction by the rotating unit 14, the grinding unit 20A rotates the spindle 21 to rotate the grinding whetstone 27a in the arrow a direction at a predetermined rotation speed, and the grinding unit 20A is lowered in, for example, the-Z direction by the grinding feed unit 30A shown in fig. 1, and rough grinding is performed while pressing the entire upper surface of the plate-shaped workpiece W with the grinding whetstone 27 a.
In the rough grinding, water is continuously supplied from the water supply source 19 to the water passage 18, and water is discharged from the water supply hole 124, so that the outer peripheral portion Wc of the plate-like workpiece W is always sealed by the water layer 100. Therefore, even if a slight gap is generated between the holding surface 11a and the outer peripheral portion Wc due to the warpage of the outer peripheral portion Wc, the suction force can be prevented from leaking from the holding surface 11a by the water layer 100. In this way, the entire upper surface of the plate-shaped workpiece W is rough-ground to a predetermined thickness by the rotating grinding whetstone 27a while the outer peripheral portion Wc of the plate-shaped workpiece W is water-sealed by the water layer 100. In rough grinding of the plate-shaped workpiece W, the thickness of the plate-shaped workpiece W is always measured by the thickness measuring unit 40 shown in fig. 1, and the rough grinding is finished when a predetermined thickness is reached.
As described above, the outer peripheral portion Wc can be sealed until the rough grinding of the plate-shaped workpiece W is completed, but since the warpage of the outer peripheral portion Wc disappears when the plate-shaped workpiece W is thinned to a certain extent, in this case, the supply of water from the water supply source 19 to the water passage 18 can be stopped. That is, in the rough grinding, the plate-shaped workpiece W may be sucked and held by the chuck table 10 while the outer peripheral portion Wc is sealed with water until the warpage of the outer peripheral portion Wc of the plate-shaped workpiece W disappears.
After the rough grinding is completed, the turntable 8 shown in fig. 1 is further rotated, and the chuck table 10 that suctions and holds the plate-like workpiece W after the rough grinding is moved to a position below the grinding unit 20B. The finish grinding is performed by the same operation as the rough grinding. That is, the chuck table 10 is rotated, and the grinding unit 20B rotates the spindle 21 to rotate the grinding whetstone 27B at a predetermined rotation speed. The grinding unit 20B is lowered in, for example, the-Z direction by the grinding feed unit 30B, and finish grinding is performed while pressing the entire upper surface of the plate-shaped workpiece W with the grinding whetstone 27B. When the warping of the outer peripheral portion Wc of the plate-shaped workpiece W does not disappear during the finish grinding, the plate-shaped workpiece W may be sucked and held by the holding surface 11a while the water is discharged from the water supply holes 124 and the outer peripheral portion Wc of the plate-shaped workpiece W is constantly sealed by the water layer 100, as in the rough grinding. In the finish grinding, the thickness of the plate-like workpiece W is always measured by the thickness measuring unit 40, and the finish grinding is ended when a predetermined finish thickness is reached.
After finish grinding is completed, the turntable 8 is rotated to position the chuck table 10 in the mounting/demounting region P1, and the plate-like workpiece W after grinding is carried from the chuck table 10 to the cleaning unit 7 by the carrying-in unit 9 a. After the plate-shaped workpiece W is cleaned by the cleaning unit 7, the plate-shaped workpiece W is stored in the cassette 4b by the carry-in and carry-out unit 5.
As described above, the grinding apparatus 1 of the present invention includes: a holding unit 13 to which the chuck table 10 is rotatably attached; grinding units 20A, 20B that grind the plate-like workpiece W held by suction on the chuck table 10; in the grinding device 1, after the plate-shaped workpiece W is carried into the chuck table 10 by the carry-in unit 9 and the plate-shaped workpiece W is sucked and held by the chuck table 10, water is supplied from the water supply hole 124 to the upper surface 123a of the frame 12 to form the water layer 100, the outer peripheral portion Wc of the plate-shaped workpiece W is sealed with the water layer 100, and the chuck table 10 is rotated to grind the plate-shaped workpiece W by the grinding units 20A and 20B, so that even in the plate-shaped workpiece W in which the outer peripheral portion Wc is warped, the suction force can be prevented from leaking between the holding surface 11a of the chuck table 10 and the outer peripheral portion Wc of the plate-shaped workpiece W. Therefore, the plate-shaped workpiece W can be prevented from being displaced from the chuck table 10 during grinding, and the plate-shaped workpiece W can be reliably sucked and held by the holding surface 11a of the chuck table 10 to be ground.
In the chuck table 10 shown in the above embodiment, the holding surface 11a of the porous plate 11 has substantially the same area as the plate-shaped workpiece W, but the area of the holding surface 11a of the chuck table 10 may be, for example, slightly smaller than the area of the plate-shaped workpiece W. The holding surface 11a of the chuck table 10 may have an area slightly larger than that of the plate-like workpiece W. In this case, according to the present invention, since the outer peripheral portion Wc of the plate-shaped workpiece W can be sealed by discharging water from the plurality of water supply holes 124, the suction force can be prevented from leaking between the holding surface 11a of the chuck table 10 and the outer peripheral portion Wc of the plate-shaped workpiece W, and the plate-shaped workpiece can be reliably sucked and held by the holding surface 11 a.
Claims (2)
1. A chuck table for sucking and holding a plate-like work,
the chuck table has:
a porous plate having a holding surface for sucking and holding a plate-shaped workpiece; and
a frame having a concave portion for exposing the holding surface and accommodating the porous plate,
the frame body has:
a suction hole formed in the bottom surface of the recess and capable of communicating with a suction source; and
a water supply hole that is opened in an upper surface of the frame body surrounding the porous plate housed in the concave portion and is formed at a position outside an outer peripheral surface of an outer peripheral portion of the plate-shaped workpiece when the chuck table suctions and holds the plate-shaped workpiece, and that is capable of communicating with a water supply source,
when the chuck table sucks and holds the plate-shaped workpiece to process the plate-shaped workpiece, water is continuously discharged from the water supply holes to form a water layer surrounding the outer peripheral portion of the plate-shaped workpiece, and the outer peripheral portion of the plate-shaped workpiece is constantly sealed with water by the water layer.
2. A grinding apparatus having:
a holding unit to which the chuck table of claim 1 is rotatably mounted;
a grinding unit having a grinding wheel for grinding the plate-shaped workpiece sucked and held by the chuck table; and
a carrying-in unit for carrying the plate-like workpiece into the chuck table,
wherein the content of the first and second substances,
when the plate-shaped workpiece is carried into the chuck table by the carrying-in unit and is sucked and held by the chuck table, water is supplied from the water supply hole to the upper surface of the frame to seal the outer periphery of the plate-shaped workpiece, and the chuck table, on which the plate-shaped workpiece is sucked and held, is rotated in a state where water is continuously supplied from the water supply hole to seal the water, and the plate-shaped workpiece is ground by the grinding unit.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017002553A JP6920063B2 (en) | 2017-01-11 | 2017-01-11 | How to hold a plate-shaped work |
| JP2017-002553 | 2017-01-11 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108296935A CN108296935A (en) | 2018-07-20 |
| CN108296935B true CN108296935B (en) | 2021-12-07 |
Family
ID=62867513
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711442466.7A Active CN108296935B (en) | 2017-01-11 | 2017-12-27 | Chuck table and grinding device |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6920063B2 (en) |
| KR (1) | KR102310075B1 (en) |
| CN (1) | CN108296935B (en) |
| TW (1) | TWI758364B (en) |
Families Citing this family (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111113205A (en) * | 2019-12-25 | 2020-05-08 | 昆山昌利达精密机械有限公司 | Polishing platform for hardware fitting machining |
| US11652080B2 (en) * | 2021-05-27 | 2023-05-16 | Intel Corporation | Thermal compression bonder nozzle with vacuum relief features |
| CN113770913B (en) * | 2021-10-28 | 2022-11-04 | 华海清科股份有限公司 | Sucking disc revolving stage and system of processing |
| CN115302644B (en) * | 2022-10-11 | 2023-01-31 | 南京宏泰晶智能装备科技有限公司 | Vertical punching device for monocrystalline silicon wafer |
| CN115383389B (en) * | 2022-10-28 | 2023-03-17 | 镇江华舟电器有限公司 | Cubical switchboard curb plate welded fastening device |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6094842U (en) * | 1983-12-05 | 1985-06-28 | 九州日本電気株式会社 | Grinding equipment for semiconductor substrates |
| JPH10135316A (en) * | 1996-10-28 | 1998-05-22 | Sony Corp | Vacuum chucking method for thin substrate and vacuum chuck table apparatus therefor |
| JP4417525B2 (en) | 2000-04-28 | 2010-02-17 | 株式会社ディスコ | Grinding equipment |
| US6475067B1 (en) * | 2001-12-11 | 2002-11-05 | Budget Maintenance Concrete Services, Inc. | Dry method of concrete floor restoration |
| JP4732736B2 (en) * | 2004-11-08 | 2011-07-27 | 株式会社岡本工作機械製作所 | Device wafer vacuum chuck system and method for polishing back surface of device wafer using the same |
| JP2006261415A (en) | 2005-03-17 | 2006-09-28 | Denso Corp | Manufacturing method for semiconductor device |
| JP5406676B2 (en) * | 2009-11-10 | 2014-02-05 | 株式会社ディスコ | Wafer processing equipment |
| JP5944724B2 (en) * | 2012-04-12 | 2016-07-05 | 株式会社ディスコ | Chuck table |
| JP5999972B2 (en) * | 2012-05-10 | 2016-09-28 | 株式会社ディスコ | Holding table |
| JP6132547B2 (en) * | 2012-12-25 | 2017-05-24 | 株式会社ディスコ | Negative pressure generator |
| JP2015199153A (en) | 2014-04-07 | 2015-11-12 | 株式会社ディスコ | Holding table, and grinding method and cutting method using the same |
| JP6312554B2 (en) * | 2014-08-13 | 2018-04-18 | 株式会社ディスコ | Processing method of package substrate |
| JP2016047561A (en) * | 2014-08-27 | 2016-04-07 | 株式会社ディスコ | Grinding device |
| JP2016078147A (en) * | 2014-10-14 | 2016-05-16 | 株式会社ディスコ | Grinding device |
-
2017
- 2017-01-11 JP JP2017002553A patent/JP6920063B2/en active Active
- 2017-12-04 TW TW106142369A patent/TWI758364B/en active
- 2017-12-27 CN CN201711442466.7A patent/CN108296935B/en active Active
-
2018
- 2018-01-03 KR KR1020180000614A patent/KR102310075B1/en active IP Right Grant
Also Published As
| Publication number | Publication date |
|---|---|
| TW201829118A (en) | 2018-08-16 |
| JP2018111159A (en) | 2018-07-19 |
| KR102310075B1 (en) | 2021-10-06 |
| CN108296935A (en) | 2018-07-20 |
| TWI758364B (en) | 2022-03-21 |
| JP6920063B2 (en) | 2021-08-18 |
| KR20180082957A (en) | 2018-07-19 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN108296935B (en) | Chuck table and grinding device | |
| JP4740886B2 (en) | Substrate adsorption method | |
| JP5137747B2 (en) | Work holding mechanism | |
| JP6495054B2 (en) | Package substrate grinding method | |
| KR20180036557A (en) | Machining apparatus | |
| CN110856908A (en) | Polishing pad | |
| JP2018086693A (en) | Grinding device | |
| JP6879807B2 (en) | Processing equipment | |
| CN111805417A (en) | Feeding and blanking device for wafer grinding production and wafer batch taking and placing method | |
| JP5989501B2 (en) | Transport method | |
| JP4119170B2 (en) | Chuck table | |
| JP6472666B2 (en) | Holding method for plate workpiece | |
| CN112276792A (en) | Wafer conveying mechanism and grinding device | |
| JP6685857B2 (en) | Processing equipment | |
| CN110867398B (en) | Chuck table and wafer processing method | |
| JP2017019055A (en) | Chuck table and processing device equipped with chuck table | |
| TW202021724A (en) | Cutting device to save space and reduce the equipment costs when the processing requires a cutting device and an ultraviolet irradiation device | |
| JP7455463B2 (en) | cutting equipment | |
| JP7126751B2 (en) | Workpiece grinding method | |
| JP2023008104A (en) | Chuck table for suction-holding plate-like workpiece, processing device comprising chuck table, and processing method for plate-like workpiece using processing device | |
| JP2023082836A (en) | Method for grinding work-piece | |
| JP5335593B2 (en) | Chuck table of grinding machine | |
| CN116913845A (en) | Conveying pad | |
| JP2022029691A (en) | Cleaning mechanism and processing device | |
| JP2023061565A (en) | Wafer grinding method and grinding apparatus |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |