JP2023008104A - Chuck table for suction-holding plate-like workpiece, processing device comprising chuck table, and processing method for plate-like workpiece using processing device - Google Patents

Abstract

To ensure that processed waste does not remain on a washed holding surface, in a processing device that holds a plate-like workpiece with warpage on the holding surface and grinds it with a grinding stone.SOLUTION: A chuck table 3 has a holding surface 342 for suction-holding an under surface of a plate-like workpiece 9 in which an outer periphery warps upward above its central portion. The chuck table 3 comprises: a plate-like plate sponge 35 having a plan view annular shape and an opening at the center; a sponge gripping part 36 for gripping an inner peripheral portion 354 of the plate sponge 35 below the holding surface 342 by making an opening center of the plate sponge 35 coincide with the center of the holding surface 342 and making an outer peripheral portion 357 of the plate sponge 35 project above the holding surface 342; and an annular sponge suction port 32 for sucking the under surface of the outer peripheral portion 357 of the plate sponge 35 which is disposed outside the outer periphery of the holding surface 342 and is projecting above the holding surface 342. The sponge suction port 32 sucks the under surface of the plate sponge 35 and pulls down the plate sponge 35 to a position of the holding surface 342 or lower.SELECTED DRAWING: Figure 2

Description

The present invention relates to a chuck table for sucking and holding a plate-like work, a processing apparatus provided with the chuck table, and a processing method for a plate-like work using the processing apparatus.

The grinding device grinds a plate-shaped work held by a holding surface of a chuck table with a grinding wheel. The plate-shaped work has, for example, a layer of resin formed in the center of the upper surface of the substrate, and has a protruding portion where the substrate protrudes outside the resin. is warped.

When sucking and holding such a plate-like work on the holding surface, the holding surface is sucked after the plate-like work is pressed against the holding surface by the conveying mechanism so that the holding surface follows the warped outer peripheral portion of the plate-like work. It communicates with a source to suck and hold the plate-shaped work.

As disclosed in Patent Document 1, for example, the chuck table has an annular sponge in contact with the outer peripheral portion of the lower surface of the plate-like workpiece to prevent vacuum leaks in the outer peripheral portion. After grinding the workpiece, the plate-shaped workpiece is separated from the holding surface, and then the holding surface is washed with a brush (sponge washing) or two-fluid washing.

JP 2018-207033 A

The upper part of the sponge protrudes above the holding surface of the chuck table that does not hold the plate-shaped work by suction. Therefore, when the holding surface is washed, the surroundings of the holding surface are surrounded by a sponge, and there is a problem that the processing wastes are hard to flow down from the holding surface and remain on the holding surface. If the processing waste remains on the holding surface, the processing waste will be caught between the lower surface of the plate-shaped work held by the holding surface and the holding surface, so that the resin ground from the plate-shaped work will not have a uniform thickness. There is a problem.

Therefore, in a processing apparatus that holds a warped plate-shaped work on a holding surface and grinds it with, for example, a grinding wheel, there is a problem to be solved to ensure that no processing waste remains on the cleaned holding surface.
In addition, there is a problem of disposing a chuck table whose holding surface is easy to wash in a processing apparatus.

The present invention for solving the above-mentioned problems is a chuck table having a holding surface for sucking and holding the lower surface of a plate-shaped work whose outer periphery is warped more than the central portion, the chuck table having an annular shape in plan view and having an opening in the center. an elastic plate member having a shape of a shape, and the center of the opening of the elastic plate member is aligned with the center of the holding surface, and the outer peripheral portion of the elastic plate member protrudes above the holding surface, and the inner peripheral portion of the elastic plate member is extended to the holding surface. An elastic plate member gripping portion that grips below the holding surface, and an annular elastic plate member that is arranged outside the outer periphery of the holding surface and projects above the holding surface to attract the lower surface of the outer peripheral portion of the elastic plate member. and a suction port, wherein the elastic plate member suction port suctions the lower surface of the elastic plate member to pull down the elastic plate member to a position below the holding surface.

Further, the present invention for solving the above-mentioned problems is a chuck table having a holding surface for sucking and holding a lower surface of a plate-shaped work having an outer periphery that is warped more than a central portion, the chuck table having an opening in the center and having an annular shape in a plan view. a plate-like elastic plate member, and the center of the opening of the elastic plate member is aligned with the center of the holding surface, and the inner peripheral portion of the elastic plate member protrudes above the holding surface; and the outer peripheral portion of the elastic plate member. an elastic plate member gripping portion that grips below the holding surface; and an elastic plate member suction port, the elastic plate member suction port sucking the lower surface of the elastic plate member to pull down the elastic plate member to a position below the holding surface.

Further, the present invention for solving the above-mentioned problems is a processing apparatus for processing a plate-shaped work by sucking and holding it on the holding surface of the chuck table, comprising: a cleaning mechanism for cleaning the holding surface; A holding surface suction path communicating with a first suction source, and an elastic plate member suction path communicating the elastic plate member suction port with a second suction source, the elastic plate member suction port connecting to the lower surface of the elastic plate member. is sucked to lower the elastic plate member to a position below the holding surface, and the cleaning mechanism cleans the holding surface.

Further, the present invention for solving the above problems is a method for processing a plate-like work using the above-described processing apparatus, wherein the holding surface is moved to the above-mentioned position without communicating the elastic plate member suction port with the second suction source. A holding step in which the holding surface communicates with a first suction source and holds the plate-shaped work by suction, a processing step in which the held plate-shaped work is processed after the holding step, and the processed plate-shaped work and an elastic plate for sucking and holding the elastic plate member by connecting the elastic plate member suction port to the second suction source before separating the plate-like work from the holding surface. After the member suction step and separating the plate-shaped work from the holding surface, the lower surface of the elastic plate member is sucked and held by the elastic plate member suction port, and the elastic plate member is positioned below the holding surface. and a cleaning step of cleaning the holding surface in the lowered state.

A chuck table according to the present invention having a holding surface for sucking and holding the lower surface of a plate-shaped workpiece whose outer periphery is warped more than the central portion is composed of an elastic plate member that is annular in plan view and has an opening in the center, and a holding surface. an elastic plate member gripping part that aligns the center of the opening of the elastic plate member with the center of the elastic plate member, protrudes the outer peripheral portion of the elastic plate member above the holding surface, and grips the inner peripheral portion of the elastic plate member below the holding surface; and an annular elastic plate member suction port for sucking the lower surface of the outer peripheral portion of the elastic plate member that is arranged outside the outer periphery of the surface and protrudes above the holding surface. To suck and hold a warped plate-like work on the holding surface without vacuum leak by making it possible to lower the elastic plate member to a position below the holding surface by sucking the lower surface of the elastic plate member through the suction port of the elastic plate member. and a state in which no machining waste remains on the holding surface after washing the holding surface.

A chuck table according to the present invention having a holding surface for sucking and holding the lower surface of a plate-shaped workpiece whose outer periphery is warped more than the central portion is composed of an elastic plate member that is annular in plan view and has an opening in the center, and a holding surface. an elastic plate member gripping part that aligns the center of the opening of the elastic plate member with the center of the elastic plate member, protrudes the inner peripheral portion of the elastic plate member above the holding surface, and grips the outer peripheral portion of the elastic plate member below the holding surface; and an annular elastic plate member suction port for sucking the lower surface of the inner peripheral portion of the elastic plate member that is arranged outside the outer periphery of the surface and protrudes above the holding surface. The elastic plate member suction port sucks the lower surface of the elastic plate member, making it possible to pull the elastic plate member down to a position below the holding surface, thereby sucking and holding a warped plate-like work on the holding surface without vacuum leak. Also, after the holding surface is cleaned, no processing waste remains on the holding surface.

Further, the processing apparatus according to the present invention, which sucks and holds a plate-shaped work on the holding surface of the chuck table and processes it, includes a cleaning mechanism for cleaning the holding surface, and a holding surface suction path for communicating the holding surface with the first suction source. and an elastic plate member suction path connecting the elastic plate member suction port to the second suction source, the elastic plate member suction port suctions the lower surface of the elastic plate member to hold the elastic plate member. Since the cleaning mechanism can clean the holding surface in a state of being pulled down to a position below the surface, the holding surface can be left in a state where no machining waste remains after cleaning the holding surface.

Further, the method for processing a plate-like work according to the present invention using the processing apparatus is such that the elastic plate member suction port is not communicated with the second suction source, but the holding surface is communicated with the first suction source so that the holding surface is in contact with the plate-like work. a holding step of sucking and holding the plate-like work, a machining step of machining the held plate-like work after the holding step, a separating step of separating the machined plate-like work from the holding surface, and a separating step of separating the plate-like work from the holding surface An elastic plate member suction step in which the elastic plate member suction port is communicated with the second suction source to suction and hold the elastic plate member, and after the plate-like work is separated from the holding surface, the elastic plate member suction port is used to elastically a cleaning step of cleaning the holding surface in a state in which the lower surface of the plate member is held by suction and the elastic plate member is pulled down to a position below the holding surface, thereby vacuuming the warped plate-like workpiece onto the holding surface. Machining can be performed by sucking and holding without leakage, and the holding surface can be kept in a state in which no machining waste remains after the holding surface is washed.

It is a perspective view which shows an example of a grinding apparatus. 3 is a cross-sectional view showing a transfer unit, a plate-like work, and a chuck table of the first embodiment; FIG. FIG. 4 is a perspective view showing an example of a cleaning brush that constitutes the cleaning mechanism; FIG. 5 is a cross-sectional view illustrating a state in which a plate-like work is held by suction on the holding surface of the chuck table of Embodiment 1 in a holding step; FIG. 7 is a cross-sectional view illustrating a state in which the holding surface of the chuck table of Embodiment 1 is cleaned with a cleaning sponge in a cleaning step; FIG. 5 is a cross-sectional view for explaining a state in which the holding surface of the chuck table of Embodiment 1 is cleaned with a cleaning brush in a cleaning step; FIG. 8 is a cross-sectional view showing a transfer unit, a plate-shaped work, and a chuck table of Embodiment 2; FIG. 10 is a partial cross-sectional view showing another example of the elastic plate member gripping portion and the elastic plate member in the chuck table of the second embodiment; FIG. 11 is a cross-sectional view illustrating a state in which a plate-like work is held by suction on the holding surface of the chuck table of the second embodiment in a holding step; FIG. 10 is a cross-sectional view for explaining a state in which the holding surface of the chuck table of Embodiment 2 is cleaned with a cleaning brush in a cleaning step;

The processing apparatus shown in FIG. 1 is a grinding apparatus 1 that grinds a plate-like workpiece 9 sucked and held on a chuck table 3 (hereinafter referred to as the chuck table 3 of Embodiment 1) by a grinding unit 16. The front side (−Y direction side) on the apparatus base 10 of 1 is an attachment/detachment area in which the plate-like work 9 is attached to and detached from the chuck table 3, and the rear side (+Y direction side) on the apparatus base 10 is a grinding area. This is a processing area where the unit 16 grinds the plate-like workpiece 9 held on the chuck table 3 .
The processing apparatus according to the present invention is not limited to a processing apparatus in which the grinding unit 16 is uniaxial like the grinding apparatus 1, but includes a rough grinding unit and a finish grinding unit, and grinds a plate with a rotating turntable. A grinding device with two or more shafts, etc., which can position the workpiece 9 below the rough grinding unit or the finish grinding unit may be used.
The processing apparatus according to the present invention includes a polishing apparatus that polishes the plate-like work 9 with a polishing pad, a cutting apparatus that dices the plate-like work 9 with a cutting blade, or a turning tool that turns the plate-like work 9. It may be a device.

The plate-like work 9 shown in FIGS. 1 and 2 has, for example, a rectangular substrate 90 made of PCB or the like, and IC chips are arranged at regular intervals in the central region of the upper surface of the substrate 90. are molded with resin 92 (for example, epoxy resin). Due to the shrinkage force of the molded resin 92 and the like, the plate-like workpiece 9 which is rectangular in plan view as a whole has a warp at the outer peripheral portion 905 . As shown in FIG. 2, the warpage at the outer peripheral portion 905 of the plate-like work 9 is, for example, such that it gradually increases from the central portion 904 toward the outer peripheral portion 905 of the lower surface 902 on which the plate-like work 9 is held by suction. It is warped. Then, the upper surface 920 of the resin 92 of the plate-shaped work 9 becomes the surface to be ground. Further, the outer peripheral portion 905 protruding from the resin 92 becomes a scrap material portion that will be mainly unnecessary later.
The plate-shaped work 9 is not limited to this example, and may be a circular silicon wafer or the like in plan view, or may be a work in which an IC chip is not molded with the resin 92 . A protective tape (not shown) may be attached to the lower surface 902 of the plate-like work 9 .

The chuck table 3 of Embodiment 1 shown in FIGS. 1 and 2 includes a porous portion 34 having a holding surface 342 with an area smaller than the area of the lower surface 902 of the plate-like workpiece 9, for example. A holding surface 342 that is the upper surface of the porous portion 34 is formed, for example, in a rectangular shape in a plan view so as to match the rectangular plate-like workpiece 9 . Note that the holding surface 342 may be formed in a circular shape in a plan view so as to match a circular plate-shaped work.

As shown in FIG. 1, the chuck table 3 includes, for example, a circular table frame 31 in a plan view. The porous portion 34 is arranged so as to be fitted in the portion. For example, the porous portion 34 is adhesively fixed to the bottom surface of the housing portion 311, and the top surface of the table frame 31 and the holding surface 342 are flush with each other.
It should be noted that the chuck table 3 may be provided with a suction portion having suction grooves formed on the upper surface instead of the porous portion 34 .

As shown in FIG. 2, suction grooves 313 are formed concentrically and radially around the center of the chuck table 3 on the bottom surface of the housing portion 311 . Further, an internal suction path 210 forming the holding surface suction path 21 is formed from the suction groove 313 to the lower surface of the table frame 31 and further from the lower surface to the rotation shaft (not shown). As shown in FIG. 2, the internal suction path 210 is connected to a first suction source such as a vacuum generator via an external suction pipe 214 that constitutes the holding surface suction path 21 via a rotary joint or the like (not shown). 29.
For example, the suction pipe 214 constituting the holding surface suction path 21 has a holding surface such as a solenoid valve that opens and closes the holding surface suction passage 21 to switch communication and non-communication between the first suction source 29 and the holding surface 342 . A suction valve 219 is provided.

The chuck table 3 according to the present invention has an annular plate-like plate sponge 35 having an opening 350 in the center, and an outer peripheral portion of the plate sponge 35 by aligning the center of the holding surface 342 with the center of the opening 350 of the plate sponge 35 . an elastic plate member gripping portion 36 (hereinafter referred to as a sponge gripping portion 36 in the present embodiment) that protrudes above the holding surface 342 and grips the inner peripheral portion 354 of the plate sponge 35 below the holding surface 342; An annular elastic plate member suction port 32 (hereinafter referred to as a sponge suction port in this embodiment) for sucking the lower surface of the outer peripheral portion 357 of the plate sponge 35 arranged outside the outer periphery of the holding surface 342 and protruding above the holding surface 342 32) and .

The sponge gripping portion 36 in the chuck table 3 of Embodiment 1 shown in FIG. It is provided with a formed sponge mounting groove 362 and a fixed clamp 364 having a rectangular annular shape in a plan view.

The sponge mounting groove 362 shown in FIG. 2 is formed, for example, by notching the upper surface of the table frame 31 in a rectangular annular shape in plan view. The side regions slope downward toward the clamping groove 360 .

The fixed clamp 364 shown in FIG. 2, which is formed in a quadrangular annular shape in a plan view, includes, for example, an annular tubular portion 369 that is inserted into the clamp fitting groove 360, and an upper end side of the annular tubular portion 369 that extends substantially outward from the chuck table 3. and a horizontally extending flange portion 368 . The inner peripheral portion 354 of the plate sponge 35 placed in the sponge placement groove 362 is positioned below the holding surface 342 by the lower surface of the flange portion 368 and the inclined area of the bottom of the sponge placement groove 362 . It can be gripped from both upper and lower sides at the position. The plate sponge 35 placed and held in the inclined area of the bottom of the sponge placement groove 362 is inclined so as to rise from the inside to the outside, and protrudes above the holding surface 302 . A predetermined gap 366 is formed between the lower surface of the outer peripheral portion 357 of the plate sponge 35 and the flat area of the bottom of the sponge placement groove 362 .
The fixed clamp 364 shown in FIG. 2 is bolted to the table frame 31, and its flat upper surface is flush with the holding surface 342 and the upper surface of the table frame 31, for example.

The plate sponge 35, which is an example of the elastic plate member shown in FIGS. 1 and 2 and formed in a quadrangular ring shape in plan view, is, for example, a single cell sponge such as urethane foam or silicon sponge. In addition, an open-cell sponge may be used. Also, the elastic plate member may be a rubber plate.
The thickness of the plate sponge 35 fixed by the fixing clamp 364 while being placed in the sponge placement groove 362 shown in FIG. In the natural state, the outer peripheral portion 357 of the plate sponge 35 is positioned higher than the holding surface 342 of the porous portion 34 and protrudes above the holding surface 342 . When the outer peripheral portion 357 of the plate sponge 35 is deformed so as to be accommodated in the gap 366 by applying an external force in the −Z direction, the upper surface 351 becomes flush with the holding surface 342 .

In this embodiment, the sponge suction port 32 opening in the flat area of the bottom of the sponge mounting groove 362 shown in FIG. Although it is a plurality of round holes formed at equal intervals in the axial direction, it is not limited to this, and may be a sponge suction port formed in a square annular shape.

An elastic plate member suction path 24 (hereinafter referred to as a sponge suction path 24 in this embodiment) is formed from the sponge suction port 32 shown in FIG. An internal suction path 240 is formed. The internal suction path 240 further communicates with a second suction source 26 such as a vacuum generator through an external suction pipe 244 that constitutes the sponge suction path 24 via a rotary joint or the like (not shown).
For example, the suction pipe 244 is provided with a sponge suction valve 247 such as a solenoid valve that opens and closes the sponge suction path 24 to switch between communication and non-communication between the second suction source 26 and the sponge suction port 32 .
The first suction source 29 and the second suction source 26 are one suction source, and by opening and closing the valve, for example, the suction force is not transmitted to the sponge suction path 24 and the suction force is not transmitted to the holding surface suction path 21 . may be switchable so that is transmitted.

As shown in FIG. 1, the chuck table 3 is surrounded by a cover 18 and is rotatable about a rotation axis whose axial direction is the Z-axis direction (vertical direction). A Y-axis movement mechanism (not shown) disposed below a bellows cover 180 that is connected and expands and contracts in the Y-axis direction enables reciprocating movement on the apparatus base 10 in the Y-axis direction. A Y-axis movement mechanism (not shown) is an electric slider made up of a ball screw or the like.

As shown in FIG. 1, a column 11 is erected in the processing area, and on the front surface of the column 11 on the -Y direction side, a vertical direction (Z A grinding feed unit 17 is provided for grinding and feeding in the axial direction. The grinding feed unit 17 includes a ball screw 170 whose axial direction is the Z-axis direction, a pair of guide rails 171 arranged parallel to the ball screw 170, and an elevating motor 172 connected to the upper end of the ball screw 170 and rotating the ball screw 170. and an elevating plate 173 whose inner nut is screwed onto the ball screw 170 and whose side portion is in slidable contact with the guide rail 171. When the elevating motor 172 rotates the ball screw 170, the elevating plate 173 is accordingly guided. Guided by the rail 171, it reciprocates in the Z-axis direction, and the grinding unit 16 fixed to the lifting plate 173 is fed for grinding in the Z-axis direction.

The grinding unit 16 that grinds the plate-like workpiece 9 held on the chuck table 3 includes a rotating shaft 160 whose axial direction is the Z-axis direction, a housing 161 that rotatably supports the rotating shaft 160, and a rotating shaft 160 that rotates. A driving motor 162, an annular mount 163 connected to the lower end of a rotating shaft 160, a grinding wheel 164 detachably attached to the lower surface of the mount 163, and a lifting plate of the grinding feed unit 17 supporting a housing 161. and a holder 165 fixed to 173 .

The grinding wheel 164 includes a wheel base 1641 and a plurality of substantially rectangular parallelepiped grinding wheels 1642 annularly arranged on the bottom surface of the wheel base 1641 . The grinding wheel 1642 is formed by bonding diamond abrasive grains or the like with, for example, a resin bond, a metal bond, or the like.

Inside the rotary shaft 160, a channel (not shown) that communicates with the grinding water supply source and serves as a path for the grinding water is provided through the rotary shaft 160 in the axial direction (Z-axis direction). The channel further passes through the mount 163 and is opened at the bottom surface of the wheel base 1641 so that the grinding water can be jetted toward the grinding wheel 1642 .

As shown in FIG. 1, for example, a plate-like workpiece 9 is carried onto a holding surface 342 of the chuck table 3, or a holding surface 342 is placed at a position beside the movement path of the chuck table 3 in the attachment/detachment area on the apparatus base 10. A transfer unit 4 for transferring the plate-shaped work 9 from 342 is arranged.

The conveying unit 4 includes a lifting mechanism 40 such as an electric cylinder or an air cylinder disposed on the device base 10 , and a lifting rod (not shown) of the lifting mechanism 40 whose rear end is attached to the upper end of the lifting rod (not shown). and a holding pad 44 attached to the lower surface of the tip of the arm portion 41 .

The holding pad 44, which can be raised and lowered in the Z-axis direction by the lifting mechanism 40 and can face the holding surface 342 of the chuck table 3 in the Z-axis direction by aligning the center thereof, has a suction pad 44 whose lower surface is made of a porous member or the like. The suction surface 443 communicates with a conveying suction source 449 such as a vacuum generator through a joint, a resin tube, or the like.

As shown in FIG. 1 , the grinding apparatus 1 includes a cleaning mechanism 5 that cleans the holding surface 342 of the chuck table 3 .
The cleaning mechanism 5 is arranged via an elevating unit 54 on the front surface (-Y direction side surface) of a portal column 109 arranged on the device base 10, for example, so as to straddle the movement path of the chuck table 3 in the X-axis direction. is set.

The lifting unit 54 is an electric cylinder (or a pneumatic cylinder) or the like attached to the portal column 109 .
The cleaning sponge 50 that constitutes the cleaning mechanism 5 shown in FIG. 1 is, for example, a roll sponge formed by forming a sponge having a predetermined thickness into a cylindrical shape. extending in length.

For the cleaning sponge 50, for example, a sponge made by foaming polyurethane, a PVA sponge, or a sponge made by kneading a foaming agent or the like into rubber is used. The outer peripheral surface of the cleaning sponge 50 serves as a cleaning surface that contacts and cleans the holding surface 342 of the chuck table 3 .

The cleaning sponge 50 is rotatably supported by, for example, a support unit 56 which is lifted and lowered by an elevating unit 54 . The support unit 56 includes, for example, a shaft 560 inserted into the cylinder of the cleaning sponge 50 and provided with a plurality of water supply holes on the outer surface thereof, and an arm 561 that rotatably supports the shaft 560 .

A channel is formed inside the shaft 560, and the channel communicates with each water supply hole. A shaft 560 housed in a substantially U-shaped portion of the arm 561 is supported by the arm 561 via, for example, bearings (not shown). One end of the channel communicates with a cleaning water supply source (not shown) through a joint (not shown) attached to the side surface of the arm 561, a resin tube, or the like. It should be noted that the cleaning mechanism 5 is not limited to the configuration in which the cleaning water is jetted outward from the inside of the cleaning sponge 50 as described above, and the cleaning sponge 50 and the holding surface 342 of the chuck table 3 are located near the cleaning sponge 50 . A cleaning nozzle capable of ejecting cleaning water toward the contact portion may be provided. Moreover, the shaft 560 that rotatably supports the cleaning sponge 50 may be driven to rotate by a motor (not shown).

The cleaning mechanism 5 may include a cleaning brush 57 shown in FIG. 3 instead of the cleaning sponge 50 shown in FIG. The cleaning brush 57 is made of, for example, elastic resin fibers (for example, nylon) that are formed into straight hairs and densely packed. ing. The upper surface of the brush plate 573 is connected to the lower end of the rod of the lifting unit 54 shown in FIG. For example, in the center of the brush plate 573, one or a plurality of water jets 578 are formed in the gaps between the bristles, and the water jets 578 are provided with a cleaning water supply source (not shown). They are communicated through a resin tube, a joint, or the like.

For example, the cleaning brush 57 may be vertically movable in the Z-axis direction by the elevating unit 54 shown in FIG. 1, and may rotate about a rotation axis whose axial direction is the Z-axis direction. Also, the diameter of the cleaning brush 57 is, for example, at least larger than the length from the center of the holding surface 342 of the chuck table 3 shown in FIG.
For example, the cleaning mechanism 5 may be configured to perform stone cleaning using a cleaning whetstone instead of the cleaning brush 57 . Alternatively, two-fluid cleaning that jets two fluids of water and air may be used.

The operation of the grinding apparatus 1 shown in FIG. 1 when grinding the plate-like workpiece 9 held on the chuck table 3 of the first embodiment will be described below. Also, each step of the method for processing the plate-like workpiece 9 using the grinding device 1 will be described.

(1) Holding Step First, the sponge suction port 32 shown in FIG. A holding step of sucking and holding is performed.
Specifically, first, as shown in FIG. 2 , the plate-like work 9 is aligned with the suction surface 443 of the holding pad 44 of the transport unit 4 , and the upper surface 920 of the resin 92 is held by the suction surface 443 . Suction and retention.
The upper surface 920 of the resin 92 may be sucked and held by the suction surface 443 in a state in which the shape of the holding pad 44 and the shape of the plate-like work 9 are substantially matched.

Also, the chuck table 3 shown in FIG. 1 is moved in the Y-axis direction by a Y-axis moving mechanism (not shown), and positioned directly below the holding pad 44 of the transport unit 4 in the attachment/detachment area, for example. Further, the chuck table 3 is rotated by a predetermined angle, and the shape of the plate-like work 9 sucked and held by the holding pad 44 substantially matches the shape of the holding surface 342 of the chuck table 3 . 2 is transmitted to the holding surface 342 of the chuck table 3 through the holding surface suction path 21. As shown in FIG.

Further, as shown in FIG. 4, the lifting mechanism 40 lowers the holding pad 44 at a predetermined speed. The lower surface 902 of the plate-like work 9 sucked and held by the holding pad 44 contacts the holding surface 342 of the chuck table 3 . In addition, when the outer peripheral portion 905 of the plate-like work 9 having a warped element comes into contact with the outer peripheral portion 357 projecting above the holding surface 342 of the plate sponge 35, the lower surface 902 of the plate-like work 9 and the plate sponge 35 are bent. A space formed by the outer peripheral portion (protruding portion) 357 and the holding surface 342 of the chuck table 3 is a closed space, and there is no vacuum leak from the space.

Next, by opening the holding surface suction valve 219 and connecting the holding surface 342 to the first suction source 29, this space is communicated with the first suction source 29, and the holding surface 342 sucks and holds the plate-like workpiece 9. . Further, the upper end of the protruding outer peripheral portion 357 of the plate sponge 35 is flush with the holding surface 342, and as shown in FIG. Further, the outer peripheral portion 357 of the plate sponge 35 deformed by being pushed downward by the outer peripheral portion 905 of the plate-like work 9 enters the sponge mounting groove 362 so as to fill the gap 366 (see FIG. 2), and the outer peripheral portion 357 is substantially flush with the upper surface of the fixed clamp 364, the upper surface of the table frame 31, and the holding surface 342. Note that the portion (the portion not molded with the resin 92) protruding outside from the holding surface 342 of the substrate 90, which is the outer peripheral portion 905 of the plate-shaped work 9, is an unnecessary offcut portion that does not become a product. The ring-shaped plate sponge 35 is preferably configured so as to come into contact directly below the outer periphery of the resin 92 so as to follow the holding surface 342 so that the resin 92 does not come into contact with the holding surface 342 . The area covered with the resin 92 of the substrate 90 that will be the product chip continues to be properly sucked and held by the holding surface 342 .

As shown in FIG. 4, the plate-like workpiece 9 is sucked and held by the chuck table 3 without causing any vacuum leak, with the outer peripheral portion 905 having no warp, and the holding process is completed.

(2) Machining Process After the holding pad 44 is separated from the plate-like work 9 sucked and held by the chuck table 3, the chuck table 3 sucking and holding the plate-like work 9 is moved from the attachment/detachment area by a Y-axis movement mechanism (not shown). It moves in the +Y direction to below the grinding unit 16 shown in FIG. 1 within the processing area. Then, the center of rotation of the grinding wheel 1642 of the grinding unit 16 is horizontally displaced from the center of rotation of the plate-like work 9 by a predetermined distance, and the rotation locus of the grinding wheel 1642 is positioned so as to pass through the center of rotation of the plate-like work 9. be done.

Next, the motor 162 shown in FIG. 1 rotates the rotating shaft 160 at a predetermined rotational speed, and the grinding wheel 164 also rotates accordingly. Then, the grinding unit 16 is sent in the -Z direction by the grinding feed unit 17, and the rotating grinding wheel 1642 is brought into contact with the upper surface 920 of the resin 92 of the plate-like workpiece 9, thereby performing grinding. During grinding, the chuck table 3 rotates at a predetermined rotational speed and the plate-like work 9 held on the holding surface 342 also rotates, so that the grinding wheel 1642 moves over the entire upper surface 920 of the resin 92 of the plate-like work 9. Grinding is performed. Grinding water passing through a flow path (not shown) is supplied to the contact portion between the grinding wheel 1642 and the plate-like work 9 to cool and wash the contact portion. After the resin 92 of the plate-like work 9 has been ground to a desired thickness, the grinding unit 16 is lifted upward by the grinding feed unit 17, and the grinding wheel 1642 is separated from the plate-like work 9, thus completing the grinding. . Grinding also eliminates the warpage of the outer peripheral portion 905 of the plate-like workpiece 9 .

For example, grinding chips and the like adhere to the holding surface 342 of the chuck table 3 by continuously performing the above-described grinding process on a plurality of plate-shaped works 9 one by one. Therefore, in order to clean the holding surface 342, after finishing the grinding of one plate-like work 9, at an appropriate timing before grinding the next new plate-like work 9, a sponge as described below is used. From a suction process to a washing process is implemented.

(3) Sponge suction step (elastic plate member suction step)
After the grinding of a certain plate-like work 9 is finished, for example, the chuck table 3 sucking and holding the plate-like work 9 after grinding is moved in the -Y direction by a Y-axis movement mechanism (not shown), as shown in FIG. Before the plate-like workpiece 9 is separated from the holding surface 342 positioned directly below the holding pad 44 of the transfer unit 4, the sponge suction port 32 shown in FIG. A step of sucking and holding a sponge is performed.

The sponge suction valve 247 shown in FIG. 5 is opened, and the suction force generated by the operation of the second suction source 26 is transmitted to the sponge suction port 32 through the sponge suction path 24 . Then, the lower surface of the outer peripheral portion 357 of the plate sponge 35 that has entered the sponge mounting groove 362 so as to fill the gap 366 with the plate-like workpiece 9 sucked and held by the holding surface 342 is sucked by the sponge suction port 32 . retained.

(4) Separation process The chuck table 3 sucking and holding the plate-like workpiece 9 after grinding is moved in the -Y direction by a Y-axis movement mechanism (not shown) to directly below the holding pad 44 of the transfer unit 4 shown in FIG. Positioned in 5 is blocked from being transmitted to the holding surface 342 by closing the holding surface suction valve 219, and the plate suction-held by the holding pad 44 The shaped work 9 is carried out from the holding surface 342 . The outer peripheral portion 357 of the plate sponge 35 from which the plate-shaped work 9 is separated is maintained in a state of being inserted into the sponge mounting groove 362 so as to fill the gap 366 by the suction force transmitted to the sponge suction port 32, and the plate sponge is kept in a state of filling the gap 366. The state in which the upper surface of 35 is lowered to a position below the holding surface 342 (in this embodiment, flush with the holding surface 342) is maintained.

(5) Washing Step After separating the plate-like workpiece 9 from the holding surface 342 of the chuck table 3 , the sponge suction port 32 sucks and holds the lower surface of the outer peripheral portion 357 of the plate sponge 35 to remove the plate sponge 35 from the holding surface 342 . A cleaning process for cleaning the holding surface 342 is performed in a state of being pulled down to the following positions.

A case of using, for example, the cleaning sponge 50 shown in FIGS. 1 and 5 in the cleaning process will be described.
For example, while the chuck table 3 shown in FIG. 1 is moved in the +Y direction, the lifting unit 54 moves the arm 561 to a predetermined height where the lower outer peripheral surface of the cleaning sponge 50 contacts the holding surface 342 as shown in FIG. - Lower in the Z direction. Also, the cleaning water is supplied from the inside of the cleaning sponge 50 to the outer peripheral surface of the cleaning sponge 50 , or the cleaning water is sprayed/supplied from a cleaning nozzle (not shown) toward the contact portion between the cleaning sponge 50 and the holding surface 342 . As the chuck table 3 moves in the +Y direction under the cleaning sponge 50 while the holding surface 342 is in contact with the cleaning sponge 50 , the cleaning sponge 50 rotates due to the frictional force between the cleaning sponge 50 and the holding surface 342 . , the entire holding surface 342 is washed with washing water. Alternatively, a motor (not shown) rotates shaft 560 shown in FIG.

In the holding step described above, the plate sponge 35, whose outer peripheral portion 357 protrudes above the holding surface 342 to complete suction holding of the plate-like workpiece 9, moves to a position below the holding surface 342 in the cleaning step. Since the outer peripheral portion 357 is pulled down, the holding surface 342 is not surrounded by the plate sponge 35, and the washing water containing the grinding dust removed from the holding surface 342 properly flows down from the holding surface 342. Therefore, it is possible to prevent grinding dust from remaining on the holding surface 342 . The cleaning water containing the grinding dust that flows down from the chuck table 3 flows into the water case inside the device base 10 through a drainage port (not shown) provided on the side of the bellows cover 180 shown in FIG.
Moreover, the plate sponge 35 is not damaged by the cleaning sponge 50.例文帳に追加

The holding surface 342 is washed with the washing sponge 50 and washing water. For example, by moving in the +Y direction until the chuck table 3 passes under the washing sponge 50, the washing of the holding surface 342 by the washing sponge 50 is completed. complete. The holding surface 342 may be further cleaned by the cleaning sponge 50 by reciprocating the chuck table 3 in the Y-axis direction.

A case of using, for example, the cleaning brush 57 shown in FIGS. 3 and 6 in the cleaning process will be described.
For example, the chuck table 3 on which the sponge suction process has been performed is moved in the Y-axis direction, and the cleaning brush 57 is moved from the center of the chuck table 3 to one side of the table frame 31 as shown in FIG. After the chuck table 3 and the cleaning brush 57 are aligned so as to cover each other, the chuck table 3 stops moving in the Y-axis direction immediately below the cleaning brush 57 .

Next, the elevating unit 54 shown in FIG. 1 lowers the cleaning brush 57 to a predetermined height where it contacts the holding surface 342 . In addition, cleaning water is supplied from inside the cleaning brush 57 to the contact portion with the holding surface 342, or cleaning water is sprayed/supplied from a cleaning nozzle (not shown) toward the contact portion between the cleaning brush 57 and the holding surface 342. . While the holding surface 342 is in contact with the cleaning brush 57, the chuck table 3 rotates at a predetermined rotation speed, and the cleaning brush 57 rotates at a predetermined rotation speed, so that the cleaning brush 57 is held together with the cleaning water. The entire surface 342 is washed.

In the cleaning step, since the outer peripheral portion 357 of the plate sponge 35 is pulled down to a position below the holding surface 342 , the surroundings of the holding surface 342 are not surrounded by the plate sponge 35 and the grinding removed from the holding surface 342 . Since the washing water containing scraps appropriately flows down from above the holding surface 342 , grinding scraps are prevented from remaining on the holding surface 342 . Then, the holding surface 342 is washed with the washing brush 57 and washing water for a predetermined time, and the washing of the holding surface 342 by the washing brush 57 is completed.

As described above, the chuck table 3 according to the first embodiment of the present invention having the holding surface 342 for sucking and holding the lower surface 902 of the plate-like workpiece 9 whose outer circumference is warped more than the central portion 904 has the opening 350 in the center. The plate sponge 35 (elastic plate member 35) which is annular in plan view and has a plate shape, and the center of the opening 350 of the plate sponge 35 is aligned with the center of the holding surface 342, and the outer peripheral portion 357 of the plate sponge 35 is positioned above the holding surface 342. A sponge gripping portion 36 (elastic plate member gripping portion 36) that grips an inner peripheral portion 354 of the projecting plate sponge 35 below the holding surface 342, and a sponge gripping portion 36 (elastic plate member gripping portion 36) that is arranged outside the outer periphery of the holding surface 342 and protrudes above the holding surface 342. and an annular sponge suction port 32 (elastic plate member suction port 32) for sucking the lower surface of the outer peripheral portion 357 of the plate sponge 35, the sponge suction port 32 sucks the lower surface of the plate sponge 35. , the plate sponge 35 can be pulled down to a position below the holding surface 342, and the holding surface 342 sucks and holds the warped plate-like workpiece 9 without vacuum leak for grinding, and the holding surface 342 is washed. It is possible to achieve a state in which no processing waste remains on the holding surface 342 after the processing.

Further, the grinding apparatus 1 according to the present invention, which sucks and holds the plate-like workpiece 9 on the holding surface 342 of the chuck table 3 and processes it, has a cleaning mechanism 5 for cleaning the holding surface 342 and the holding surface 342 as a first suction source. 29, and the sponge suction path 24, which connects the sponge suction port 32 to the second suction source 26, the sponge suction port 32 is located at the outer peripheral portion 357 of the plate sponge 35. The cleaning mechanism 5 can clean the holding surface 342 in a state where the plate sponge 35 is pulled down to a position below the holding surface 342 by sucking the lower surface. A state can be achieved in which no processing waste remains. Also, the cleaning mechanism 5 does not damage the plate sponge 35 .

Further, in the method for processing the plate-like workpiece 9 according to the present invention using the grinding apparatus 1, the sponge suction port 32 is not communicated with the second suction source 26, but the holding surface 342 is communicated with the first suction source 29. a holding step of sucking and holding the plate-like work 9; after the holding step, a machining step of processing the plate-like work 9 sucked and held by the chuck table 3; a sponge suction step of connecting the sponge suction port 32 to the second suction source 26 to suction and hold the plate sponge 35 before separating the plate-like workpiece 9 from the holding surface 342; After separating the workpiece 9, the lower surface of the outer peripheral portion 357 of the plate sponge 35 is sucked and held by the sponge suction port 32, and the holding surface 342 is washed while the plate sponge 35 is lowered to a position below the holding surface 342. The washing step makes it possible to suck and hold the warped plate-like workpiece 9 on the holding surface 342 without causing vacuum leaks. It is possible to make it a state where there is no remaining. Furthermore, the plate sponge 35 is not damaged by, for example, the cleaning brush 57 or the cleaning sponge 50 during cleaning of the holding surface 342 .

It goes without saying that the chuck table and grinding apparatus according to the present invention are not limited to the above embodiments, and may be implemented in various forms within the scope of the technical idea. Also, each step in the method for processing a plate-shaped work according to the present invention can be changed as appropriate within the range in which the effects of the present invention can be exhibited.

For example, the grinding apparatus 1 shown in FIG. 1 may have a chuck table 39 shown in FIG. 7 instead of the chuck table 3 of the first embodiment. The chuck table 39 is hereinafter referred to as the chuck table of the second embodiment.
The chuck table 39 has an annular plate-like plate sponge 35 having an opening 350 in the center and holds an inner peripheral portion 354 of the plate sponge 35 by aligning the center of the opening 350 of the plate sponge 35 with the center of the holding surface 342 . An elastic plate member gripping portion 33 (hereinafter referred to as a sponge gripping portion 33 in this embodiment) that protrudes above the surface 342 and grips the outer peripheral portion 357 of the plate sponge 35 below the holding surface 342 , and the holding surface 342 . An annular elastic plate member suction port 32 (hereinafter referred to as a sponge suction port 32 in this embodiment) for sucking the lower surface of the inner peripheral portion 354 of the plate sponge 35 arranged outside the outer periphery and protruding above the holding surface 342. ), and

The sponge gripper 33, which is the difference between the chuck table 39 of the second embodiment and the chuck table 3 of the first embodiment shown in FIG. Description is omitted.

The sponge gripping portion 33 includes, for example, a sponge mounting groove 332 formed near the periphery of the housing portion 311 on the upper surface of the table frame 31, a clamp fitting groove 335 formed around the outer periphery of the sponge mounting groove 332, A fixing clamp 338 having a rectangular annular shape in a plan view is provided.

The sponge mounting groove 332 is formed, for example, by notching the upper surface of the table frame 31 in a rectangular annular shape in a plan view. It slopes down toward the clamp fitting groove 335 located on its outer side. The above-described sponge suction port 32 is opened in a flat area on the inner peripheral side of the groove bottom of the sponge mounting groove 332 .

The fixing clamp 338 formed in a square annular shape in plan view includes, for example, an annular tubular portion 339 that is inserted into the clamp fitting groove 335 and extends substantially horizontally from the upper end side of the annular tubular portion 339 toward the center of the chuck table 39 . and a raised flange portion 337 . The outer peripheral portion 357 of the plate sponge 35 placed in the sponge placement groove 332 is positioned below the holding surface 342 by the lower surface of the flange portion 337 and the inclined area of the bottom of the sponge placement groove 332 . can be gripped from both the upper and lower sides. Further, the plate sponge 35 placed on the inclined area of the bottom of the sponge placement groove 332 is inclined so as to become lower from the inside to the outside, and protrudes above the holding surface 302 . A predetermined gap 334 is formed between the lower surface of the peripheral portion 354 and the flat area of the bottom of the sponge placement groove 332 .
The fixed clamp 338 is bolted to the table frame 31 and its flat upper surface is flush with the holding surface 342, for example.

In the chuck table 39 of the second embodiment, the sponge gripper 33 is not limited to the example shown in FIG.
For example, the sponge mounting groove 375 that constitutes the sponge gripping portion 37 of another example shown in FIG. there is The sponge suction path 24 communicates with the sponge suction port 32 . A region located next to the deepest region of the bottom is a groove bottom projecting portion 3755 that protrudes upward in a one-step rectangular annular convex shape so as to be the highest region of the groove bottom. A region on the outer peripheral side of the groove bottom projecting portion 3755 is a flat surface that is one step lower than the groove bottom projecting portion 3755 .

As shown in FIG. 8, the plate sponge 35 placed in the sponge placement groove 375 and gripped by the fixing clamp 338 is in a natural state in which no external force is applied to the plate sponge 35 from the plate-shaped work 9. The inner peripheral portion 354 of the plate sponge 35 is positioned higher than the holding surface 342 (see FIG. 7) of the porous portion 34 and protrudes above the holding surface 342 . A predetermined gap is formed between the lower surface of the inner peripheral portion 354 projecting above the holding surface 302 and the deepest area of the bottom of the sponge mounting groove 375 . Furthermore, a clearance gap 3758 is provided between the bottom surface of the plate sponge 35 and the ridgeline portion (corner portion) between the groove bottom protrusion 3755 of the sponge placement groove 375 and the region on the outer peripheral side of the groove bottom protrusion 3755 . is formed. The expelling gap 3758 is a gap for facilitating expelling of contamination such as processing waste to the sponge suction port 32 side.

The operation of the grinding apparatus 1 shown in FIG. 1 when grinding the plate-like workpiece 9 held on the chuck table 39 of the second embodiment shown in FIG. 7 will be described below. Also, each step of the method for processing the plate-like workpiece 9 using the grinding device 1 will be described.

(1) Holding Step First, the plate-like work 9 shown in FIG. The upper surface 920 of the resin 92 is held by suction.
Moreover, as shown in FIG. 7, the chuck table 39 is positioned directly below the holding pad 44 . The chuck table 39 is rotated by a predetermined angle so that the shape of the plate-like workpiece 9 sucked and held by the holding pad 44 and the shape of the holding surface 342 of the chuck table 39 substantially match each other. The suction force is transmitted to the holding surface 342 of the chuck table 39 through the holding surface suction path 21 .

As shown in FIG. 9 , the central portion 904 of the lower surface 902 of the plate-like workpiece 9 sucked and held by the descending holding pad 44 contacts the holding surface 342 of the chuck table 39 . In addition, the outer peripheral portion 905 of the lower surface 902 of the descending plate-shaped work 9 having the warped upward element comes into contact with the inner peripheral portion 354 that protrudes above the holding surface 342 of the plate sponge 35 , so that the plate-shaped work 9 A space formed by the lower surface 902 of the plate sponge 35, the inner peripheral portion 354 of the plate sponge 35, and the holding surface 342 of the chuck table 39 is a closed space, and there is no vacuum leak from the space. Next, by opening the holding surface suction valve 219 and connecting the holding surface 342 to the first suction source 29, this space is communicated with the first suction source 29, and the holding surface 342 sucks and holds the plate-like workpiece 9. . Further, the upper end of the projecting inner peripheral portion 354 of the plate sponge 35 is flush with the holding surface 342, and as shown in FIG. Further, the inner peripheral portion 354 of the plate sponge 35 deformed by being pushed downward by the outer peripheral portion 905 of the plate-like work 9 enters the sponge mounting groove 332 so as to fill the gap 334 (see FIG. 7), and the inner peripheral portion The upper surface of 354 is substantially flush with holding surface 342 .
Note that the portion (the portion not molded with the resin 92) protruding outside from the holding surface 342 of the substrate 90, which is the outer peripheral portion 905 of the plate-like work 9, becomes an unnecessary edge material portion that does not become a product. The ring-shaped plate sponge 35 is preferably configured so as to come into contact directly below the outer periphery of the resin 92 so as to follow the holding surface 342 so that the resin 92 does not come into contact with the holding surface 342 . The area covered with the resin 92 of the substrate 90 that will be the product chip continues to be properly sucked and held by the holding surface 342 .

(2) Machining Process As shown in FIG. 9, the plate-like work 9 is sucked and held by the chuck table 39 without vacuum leak in a state in which the warping of the outer peripheral portion 905 is eliminated, and then the plate-like work 9 is sucked and held. The chuck table 39 is moved in the +Y direction from the attachment/detachment area to below the grinding unit 16 shown in FIG. 1 within the machining area by a Y-axis movement mechanism (not shown). Since the processing of the plate-like workpiece 9 in the processing step is the same as the case of using the chuck table 3 of the first embodiment, the following description is omitted.

(3) Sponge suction step (elastic plate member suction step)
After the grinding of the plate-like work 9 is completed, for example, the chuck table 39 sucking and holding the plate-like work 9 after the grinding process moves in the -Y direction, and directly below the holding pad 44 of the transfer unit 4 shown in FIG. 10 is connected to the second suction source 26 to suck and hold the plate sponge 35 at a stage before the plate-shaped work 9 is separated from the holding surface 342 . . That is, the sponge suction valve 247 shown in FIG. 10 is opened, and the suction force generated by the second suction source 26 is transmitted through the sponge suction path 24 to the sponge suction port 32 . The lower surface of the inner peripheral portion 354 in a state in which the plate-like workpiece 9 sucked and held by the holding surface 342 enters the sponge mounting groove 332 of the plate sponge 35 so as to fill the gap 334 (see FIG. 7) is It is sucked and held by the sponge suction port 32 .

(4) Separation Step The separation step of separating the machined plate-shaped workpiece 9 from the holding surface 342 of the chuck table 39 is also the same as the case where the chuck table 3 of the first embodiment is used, so the following description is omitted. .
After the transmission of the suction force from the first suction source 29 to the holding surface 342 is interrupted, the plate-like work 9 sucked and held by the holding pad 44 is carried out from the holding surface 342, and then the plate-like work 9 is separated from the plate. The inner peripheral portion 354 of the sponge 35 is kept in a state of filling the gap 334 in the sponge mounting groove 332 by the suction force transmitted to the sponge suction port 32 , and the upper surface of the plate sponge 35 is maintained on the holding surface 342 . Below (in this embodiment, it is flush with the holding surface 342), the state of being pulled down is maintained.

(5) Washing Step A case of using, for example, the washing brush 57 shown in FIGS. 3 and 10 in the washing step to be performed next will be described. Note that the holding surface 342 of the chuck table 39 may be cleaned using the cleaning sponge 50 shown in FIG.
For example, the chuck table 39 is moved in the +Y direction and positioned below the cleaning brush 57, and as shown in FIG. Lower to height. In addition, cleaning water is supplied from inside the cleaning brush 57 to the contact portion with the holding surface 342, or cleaning water is sprayed/supplied from a cleaning nozzle (not shown) toward the contact portion between the cleaning brush 57 and the holding surface 342. . While the holding surface 342 is in contact with the rotating cleaning brush 57, the chuck table 39 rotates at a predetermined rotational speed, so that the cleaning brush 57 cleans the entire holding surface 342 together with the cleaning water.

In the cleaning process, since the plate sponge 35 is pulled down to a position below the holding surface 342, the surroundings of the holding surface 342 are not surrounded by the plate sponge 35, and the grinding dust removed from the holding surface 342 is included. Since the washing water appropriately flows down from the holding surface 342 , it is possible to prevent grinding dust from remaining on the holding surface 342 . Then, the holding surface 342 is washed with the washing brush 57 and washing water for a predetermined time, and the washing of the holding surface 342 by the washing brush 57 is completed.

As described above, the chuck table 39 of Embodiment 2 according to the present invention, which has the holding surface 342 that sucks and holds the lower surface of the plate-like workpiece 9 whose outer periphery is warped more than the central portion 904, has an opening 350 in the center. The plate sponge 35 (elastic plate member 35) which is annular in plan view and has an opening 350 in the plate sponge 35 is aligned with the center of the holding surface 342, and the inner peripheral portion 354 of the plate sponge 35 is positioned above the holding surface 342. A sponge gripping portion 33 (elastic plate member gripping portion 33) that grips the outer peripheral portion 357 of the projecting plate sponge 35 below the holding surface 342, and a sponge gripping portion 33 (elastic plate member gripping portion 33) that is arranged outside the outer periphery of the holding surface 342 and protrudes above the holding surface 342. An annular sponge suction port 32 (elastic plate member suction port 32) for sucking the lower surface of the inner peripheral portion 354 of the plate sponge 35 is provided. By sucking the lower surface, the plate sponge 35 can be pulled down to a position below the holding surface 342, and the warped plate-like workpiece 9 can be sucked and held on the holding surface 342 without vacuum leak. It is possible to achieve a state in which no processing waste remains on the holding surface 342 after cleaning.
Also, after the plate sponge 35 is sucked by the sponge suction port 32 and the holding surface 342 is washed, the sponge suction port 32 is opened to the atmosphere, for example, the inner peripheral portion 354 of the plate sponge 35 is protruded from the holding surface 342, The sponge suction port 32 may be communicated with the second suction source 26 to discharge the water containing the processing waste entering the sponge mounting groove 362 from the sponge mounting groove 362 .

9: plate-like work 9: substrate 92: resin 920: upper surface of resin (upper surface of plate-like work)
902: Lower surface of plate-shaped workpiece 905: Peripheral portion 1: Grinding device (processing device) 10: Device base 11: Column 16: Grinding unit 164: Grinding wheel 17: Grinding feed unit 170: Ball screw 172: Elevating motor 3: Embodiment 1 chuck table 34: porous portion 342: holding surface 31: table frame 311: housing portion 313: suction groove 35: plate sponge (elastic plate member) 350: opening of plate sponge 351: upper surface of plate sponge 354: plate sponge lower surface 36: sponge gripping portion (elastic plate member gripping portion) 360: clamp fitting groove
362: sponge placement groove 364: fixed clamp 32: sponge suction port (elastic plate member suction port)
18: Cover 180: Accordion cover 21: Holding surface suction path 210: Internal suction path 214: Suction pipe 219: Holding surface suction valve 29: First suction source 24: Sponge suction path (elastic plate member suction path) 240: Internal suction Path 244: Suction pipe 247: Sponge suction valve 26: Second suction source 4: Conveying unit 40: Elevating mechanism 41: Arm part 44: Holding pad 443: Suction surface 449: Conveying suction source 109: Portal column 5: Washing mechanism 54: Lifting unit 50: Cleaning sponge 56: Support unit 560: Shaft 561: Arm 57: Cleaning brush 573: Brush plate 578: Water ejection port 39: Chuck table 33 of Embodiment 2: Sponge gripping portion (elastic plate member gripping portion) part)
37: Sponge gripping portion 375: Sponge placement groove 3755: Groove bottom protrusion

Claims (4)

A chuck table having a holding surface for sucking and holding a lower surface of a plate-shaped work having an outer circumference warped higher than a central portion,
An elastic plate member that is annular in plan view and has an opening in the center, and an outer peripheral portion of the elastic plate member is protruded above the holding surface by aligning the center of the opening of the elastic plate member with the center of the holding surface. an elastic plate member gripping portion that grips an inner peripheral portion of the elastic plate member below the holding surface; and an outer peripheral portion of the elastic plate member that is arranged outside the outer periphery of the holding surface and protrudes above the holding surface. an annular elastic plate member suction port for sucking the lower surface of the
A chuck table in which the elastic plate member suction port can suck the lower surface of the elastic plate member to lower the elastic plate member to a position below the holding surface. A chuck table having a holding surface for sucking and holding a lower surface of a plate-shaped work having an outer circumference warped higher than a central portion,
An elastic plate member that is annular in plan view and has an opening in the center, and an inner peripheral portion of the elastic plate member protrudes above the holding surface by aligning the center of the opening of the elastic plate member with the center of the holding surface. an elastic plate member gripping portion for gripping the outer peripheral portion of the elastic plate member below the holding surface; and an inner periphery of the elastic plate member disposed outside the outer periphery of the holding surface and protruding above the holding surface. an annular elastic plate member suction port for sucking the lower surface of the part,
A chuck table in which the elastic plate member suction port can suck the lower surface of the elastic plate member to lower the elastic plate member to a position below the holding surface. A processing apparatus for processing a plate-shaped work by sucking and holding it on the holding surface of the chuck table according to claim 1 or claim 2,
a cleaning mechanism for cleaning the holding surface; a holding surface suction path for communicating the holding surface with a first suction source; and an elastic plate member suction path for communicating the elastic plate member suction port with a second suction source. ,
A processing apparatus in which the cleaning mechanism cleans the holding surface in a state in which the elastic plate member suction port sucks the lower surface of the elastic plate member to lower the elastic plate member to a position below the holding surface. A method for processing a plate-shaped work using the processing apparatus according to claim 3,
a holding step in which the holding surface communicates with the first suction source without communicating the elastic plate member suction port with the second suction source, and the holding surface sucks and holds the plate-like workpiece;
a processing step of processing the held plate-shaped work after the holding step;
a separating step of separating the processed plate-shaped work from the holding surface;
an elastic plate member suction step of sucking and holding the elastic plate member by connecting the elastic plate member suction port to the second suction source before separating the plate-shaped work from the holding surface;
After separating the plate-like work from the holding surface, the lower surface of the elastic plate member is sucked and held by the elastic plate member suction port, and the elastic plate member is pulled down to a position below the holding surface, and a cleaning step of cleaning the holding surface.

Images