JP6920063B2 - How to hold a plate-shaped work - Google Patents

How to hold a plate-shaped work Download PDF

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Publication number
JP6920063B2
JP6920063B2 JP2017002553A JP2017002553A JP6920063B2 JP 6920063 B2 JP6920063 B2 JP 6920063B2 JP 2017002553 A JP2017002553 A JP 2017002553A JP 2017002553 A JP2017002553 A JP 2017002553A JP 6920063 B2 JP6920063 B2 JP 6920063B2
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plate
shaped work
chuck table
grinding
holding
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JP2018111159A (en
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俊洙 禹
俊洙 禹
佳祐 鈴木
佳祐 鈴木
宗幸 守屋
宗幸 守屋
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Disco Corp
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Disco Corp
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Priority to JP2017002553A priority Critical patent/JP6920063B2/en
Priority to TW106142369A priority patent/TWI758364B/en
Priority to CN201711442466.7A priority patent/CN108296935B/en
Priority to KR1020180000614A priority patent/KR102310075B1/en
Publication of JP2018111159A publication Critical patent/JP2018111159A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B19/00—Single-purpose machines or devices for particular grinding operations not covered by any other main group
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/02—Frames; Beds; Carriages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment

Description

本発明は、板状ワークの保持方法に関する。 The present invention relates to a method for holding a plate-shaped work.

板状ワークなどの被加工物を研削する研削装置は、板状ワークを吸引保持するチャックテーブルと、チャックテーブルに吸引保持された板状ワークを研削する研削手段と、板状ワークを仮置きする仮置きテーブルと、仮置きテーブルからチャックテーブルに板状ワークを搬入する搬入手段とを少なくとも備えている（例えば、下記の特許文献１を参照）。そして、板状ワークは、搬入手段によって仮置きテーブルからチャックテーブルに搬入され、チャックテーブルの保持面において吸引保持された後、研削手段によって所定の厚みに至るまで研削される。 The grinding device for grinding a workpiece such as a plate-shaped work temporarily places a chuck table that sucks and holds the plate-shaped work, a grinding means that grinds the plate-shaped work that is sucked and held on the chuck table, and a plate-shaped work. It is provided with at least a temporary storage table and a carry-in means for carrying the plate-shaped work from the temporary storage table to the chuck table (see, for example, Patent Document 1 below). Then, the plate-shaped work is carried from the temporary storage table to the chuck table by the carrying means, is sucked and held on the holding surface of the chuck table, and then ground to a predetermined thickness by the grinding means.

ところが、板状ワークの外周部に反りが発生していることがある（例えば、下記の特許文献２を参照）。このような板状ワークをチャックテーブルに搬入しても、外周部はチャックテーブルの保持面から離間する上方向に向けて反っているため、板状ワークを保持面で十分に吸引保持することができない。そのため、例えば、搬入手段によって、反った板状ワークをチャックテーブルに搬入する際に、搬入手段が保持面に向けて板状ワークの外周部を保持面に押し付けつつ、保持面と吸引源とを連通させて保持面において板状ワークを吸引保持している。また、例えば、下記の特許文献３においては、弾性パッドを介して板状ワークをチャックテーブルにおいて吸引保持する方法も提案されている。かかる方法においては、板状ワークをチャックテーブルの保持面で吸引すると、弾性パッドが収縮して板状ワークが弾性パッドに沈み込むため、板状ワークの外周部の反りを解消することができる。 However, the outer peripheral portion of the plate-shaped work may be warped (see, for example, Patent Document 2 below). Even if such a plate-shaped work is carried into the chuck table, the outer peripheral portion is warped in the upward direction away from the holding surface of the chuck table, so that the plate-shaped work can be sufficiently sucked and held by the holding surface. Can not. Therefore, for example, when the warped plate-shaped work is carried into the chuck table by the carrying-in means, the holding surface and the suction source are pressed while the carrying-in means presses the outer peripheral portion of the plate-shaped work against the holding surface. The plate-shaped work is sucked and held on the holding surface by communicating with each other. Further, for example, in Patent Document 3 below, a method of sucking and holding a plate-shaped work on a chuck table via an elastic pad is also proposed. In such a method, when the plate-shaped work is sucked by the holding surface of the chuck table, the elastic pad contracts and the plate-shaped work sinks into the elastic pad, so that the warp of the outer peripheral portion of the plate-shaped work can be eliminated.

特開２００１−３１３３２６号公報Japanese Unexamined Patent Publication No. 2001-313326 特開２００６−２６１４１５号公報Japanese Unexamined Patent Publication No. 2006-261415 特開２０１５−１９９１５３号公報Japanese Unexamined Patent Publication No. 2015-199153

しかし、上記のような方法を用いても、チャックテーブルの保持面と板状ワークの外周部との かな隙間から吸引力がリークして、板状ワークの外周部を保持面で吸引保持ができなくなることがある。この状態のまま、研削手段によって板状ワークの研削を開始すると、チャックテーブルから板状ワークが外れて加工ができなくなるという問題がある。 However, even if the above method is used, the suction force leaks from the gap between the holding surface of the chuck table and the outer peripheral portion of the plate-shaped work, and the outer peripheral portion of the plate-shaped work can be sucked and held by the holding surface. It may disappear. If grinding of the plate-shaped work is started by the grinding means in this state, there is a problem that the plate-shaped work comes off from the chuck table and cannot be processed.

本発明は、上記の事情に鑑みてなされたものであり、反りのある板状ワークであってもチャックテーブルの保持面において吸引保持できるようにすることを目的としている。 The present invention has been made in view of the above circumstances, and an object of the present invention is to enable suction and holding of a warped plate-shaped work on a holding surface of a chuck table.

本発明は、チャックテーブルが回転可能に装着された保持手段と、該チャックテーブルが吸引保持した板状ワークを研削する研削砥石を有する研削手段と、板状ワークを吸引保持する搬送パッドを備え該チャックテーブルに板状ワークを搬入する搬入手段とを備える研削装置の該チャックテーブルにおける板状ワークの保持方法であって、該チャックテーブルは、板状ワークを吸引保持する保持面を有するポーラス板と、該保持面を露出させ該ポーラス板を収容する凹部を備える枠体と、を備え、該枠体は、該凹部の底面に形成され吸引源と連通可能な吸引孔と、該枠体の該凹部に収容された該ポーラス板を囲繞する環状の上面において、該保持面に保持された板状ワークの外周より外側において開口して円状に配置されて形成され水供給源と連通可能な水供給孔とを備え、該搬入手段による板状ワークの該チャックテーブルへの搬入時、該搬送パッドが板状ワークから離間する前に該水供給孔から該枠体の上面に水を供給し板状ワークの外周部を水シールし、該保持面に板状ワークを吸引保持した後に該搬送パッドを退避させ、該水供給孔から水を供給し続け該水シールした状態で、板状ワークを吸引保持した該チャックテーブルを回転させ該研削手段で板状ワークを研削する。 The present invention includes a holding means on which a chuck table is rotatably mounted, a grinding means having a grinding wheel for grinding a plate-shaped work sucked and held by the chuck table, and a transport pad for sucking and holding the plate-shaped work. A method for holding a plate-shaped work in the chuck table of a grinding machine provided with a carrying-in means for carrying the plate-shaped work into the chuck table, wherein the chuck table is a porous plate having a holding surface for sucking and holding the plate-shaped work. A frame body provided with a recess for exposing the holding surface and accommodating the porous plate, the frame body includes a suction hole formed on the bottom surface of the recess and communicable with a suction source, and the frame body. On the annular upper surface surrounding the porous plate housed in the recess, water is formed by opening outside the outer periphery of the plate-shaped work held by the holding surface and arranged in a circular shape so as to be able to communicate with the water supply source. and a supply hole, when carried to the chuck table of the plate-shaped workpiece by該搬input means, conveying pad supplying water from the water supply hole before away from the plate workpiece on the upper surface of the frame plate the outer periphery of the Jo workpiece and water seal, retracts the conveying pad after suction-holding the plate workpiece on the holding surface, while the water seal continues to supply water from the water supply hole, the plate-shaped workpiece The chuck table held by suction is rotated, and the plate-shaped workpiece is ground by the grinding means.

また、本発明に係る板状ワークの保持方法は、チャックテーブルが回転可能に装着された保持手段と、チャックテーブルが吸引保持した板状ワークを研削する研削砥石を有する研削手段と、チャックテーブルに板状ワークを搬入する搬入手段とを備える研削装置の該チャックテーブルにおける板状ワークの保持方法であって、該チャックテーブルは、板状ワークを吸引保持する保持面を有するポーラス板と、該保持面を露出させ該ポーラス板を収容する凹部を備える枠体と、を備え、該枠体は、該凹部の底面に形成され吸引源と連通可能な吸引孔と、該枠体の該凹部に収容された該ポーラス板を囲繞する環状の上面において、該保持面に保持された板状ワークの外周より外側において開口して円状に配置されて形成され水供給源と連通可能な水供給孔とを備え、該搬入手段による板状ワークの該チャックテーブルへの搬入時、該搬送パッドが板状ワークから離間する前に該水供給孔から該枠体の上面に水を供給し板状ワークの外周部を水シールし、該保持面に板状ワークを吸引保持した後に該搬送パッドを退避させ、該水供給孔から水を供給し続け該水シールした状態で、板状ワークを吸引保持した該チャックテーブルを回転させ該研削手段で板状ワークを研削するため、たとえ外周部に反りのある板状ワークであっても、チャックテーブルの保持面と板状ワークの外周部との間から吸引力がリークするのを防ぐことができる。したがって、研削中にチャックテーブルから板状ワークが外れるおそれを防止でき、チャックテーブルの保持面で確実に板状ワークを吸引保持して研削加工を実施することができる。 Further, the method for holding the plate-shaped work according to the present invention includes a holding means on which the chuck table is rotatably mounted, a grinding means having a grinding wheel for grinding the plate-shaped work sucked and held by the chuck table, and a chuck table. a plate-like workpiece holding method in the chuck table of a grinding apparatus Ru and a loading means for loading the plate workpiece, the chuck table, and a porous plate having a holding surface for sucking and holding a plate-shaped workpiece, the A frame body having a recess for exposing the holding surface and accommodating the porous plate is provided, and the frame body has a suction hole formed on the bottom surface of the recess and communicable with a suction source, and the recess in the frame. A water supply hole formed in an annular upper surface surrounding the housed porous plate so as to open outside the outer periphery of the plate-shaped work held by the holding surface and arranged in a circular shape so as to be able to communicate with the water supply source. When the plate-shaped work is carried into the chuck table by the carrying-in means, water is supplied from the water supply hole to the upper surface of the frame before the transport pad is separated from the plate-shaped work. The outer peripheral portion of the plate is water-sealed, the plate-shaped work is sucked and held on the holding surface, the transport pad is retracted, water is continuously supplied from the water supply hole, and the plate-shaped work is sucked and held in the water-sealed state. Since the plate-shaped work is ground by the grinding means by rotating the chuck table, even if the plate-shaped work has a warp on the outer peripheral portion, from between the holding surface of the chuck table and the outer peripheral portion of the plate-shaped work. It is possible to prevent the suction force from leaking. Therefore, it is possible to prevent the plate-shaped work from coming off from the chuck table during grinding, and it is possible to reliably suck and hold the plate-shaped work on the holding surface of the chuck table to perform the grinding process.

研削装置の一例の構成を示す斜視図である。It is a perspective view which shows the structure of an example of a grinding apparatus. チャックテーブル、保持手段及び搬入手段の構成を示す断面図である。It is sectional drawing which shows the structure of the chuck table, the holding means and the carrying-in means. チャックテーブルの構成を示す分解斜視図である。It is an exploded perspective view which shows the structure of a chuck table. チャックテーブルの構成を示す斜視図である。It is a perspective view which shows the structure of a chuck table. 搬入手段によって、仮置きテーブルに仮置きされた板状ワークを受け取る状 態を示す断面図である。It is sectional drawing which shows the state which receives the plate-shaped work temporarily placed on the temporary place table by the carrying-in means. 搬入手段によって、チャックテーブルに板状ワークを受け渡す状態を示す断 面図である。It is a top view showing a state in which a plate-shaped work is delivered to a chuck table by a carrying-in means. チャックテーブルに吸引保持された板状ワークの外周部を水シールしながら 板状ワークを研削する状態を示す断面図である。It is sectional drawing which shows the state which grinds a plate-shaped work while water-sealing the outer peripheral part of the plate-shaped work held by suction on a chuck table.

図１に示す研削装置１は、Ｙ軸方向に延在する装置基台２を有しており、装置基台２の−Ｙ方向側には、ステージ３ａ，３ｂが隣接して配設されている。ステージ３ａには研削前の板状ワークを収容するカセット４ａが載置され、ステージ３ｂには研削後の板状ワークを収容するカセット４ｂが載置されている。カセット４ａ及びカセット４ｂに対面する位置には、カセット４ａからの板状ワークの搬出を行うとともにカセット４ｂへの板状ワークの搬入を行う搬出入手段５が配設されている。搬出入手段５の可動範囲には、板状ワークを仮置きするための仮置きテーブル６と、研削後の板状ワークに付着した研削 を洗浄して除去する洗浄手段７が配設されている。 The grinding apparatus 1 shown in FIG. 1 has an apparatus base 2 extending in the Y-axis direction, and stages 3a and 3b are arranged adjacent to each other on the −Y direction side of the apparatus base 2. There is. A cassette 4a for accommodating the plate-shaped work before grinding is placed on the stage 3a, and a cassette 4b for accommodating the plate-shaped work after grinding is placed on the stage 3b. At a position facing the cassette 4a and the cassette 4b, a carry-in / out means 5 for carrying out the plate-shaped work from the cassette 4a and carrying in the plate-shaped work into the cassette 4b is arranged. In the movable range of the loading / unloading means 5, a temporary setting table 6 for temporarily placing the plate-shaped work and a cleaning means 7 for cleaning and removing the grinding adhering to the plate-shaped work after grinding are arranged. ..

装置基台２の中央部には、回転可能なターンテーブル８が配設されている。ターンテーブル８の上には、板状ワークを吸引保持するチャックテーブル１０が回転可能に装着された保持手段１３を例えば３つ備えている。ターンテーブル８が回転することにより、保持手段１３を公転させ、保持手段１３を、チャックテーブル１０に対して板状ワークの着脱が行われる着脱領域Ｐ１と板状ワークが粗研削・仕上げ研削される研削領域Ｐ２との間で移動させることができる。 A rotatable turntable 8 is arranged at the center of the device base 2. On the turntable 8, for example, three holding means 13 on which a chuck table 10 for sucking and holding the plate-shaped work is rotatably mounted are provided. The rotation of the turntable 8 causes the holding means 13 to revolve, and the holding means 13 is roughly and finish-ground the attachment / detachment region P1 at which the plate-shaped work is attached / detached to / from the chuck table 10 and the plate-shaped work. It can be moved to and from the grinding area P2.

装置基台２の＋Ｙ方向側の端部には、Ｚ軸方向に延在するコラム２８が立設されている。コラム２８の前方側において研削送り手段３０Ａを介して研削手段２０Ａが配設されている。研削手段２０Ａは、Ｚ軸方向の軸心を有するスピンドル２１と、スピンドル２１の一端に接続されたモータ２２と、スピンドル２１が回転可能に囲繞して支持されたスピンドルハウジング２３と、スピンドルハウジング２３を保持するホルダ２４と、スピンドル２１の下端においてマウント２５を介して着脱自在に装着された研削ホイール２６ａと、研削ホイール２６ａの下部において円環状に固着された粗研削用の研削砥石２７ａとを備えている。そして、モータ２２が駆動されてスピンドル２１が回転することにより、研削ホイール２６ａを所定の回転速度で回転させることができる。 A column 28 extending in the Z-axis direction is erected at the end of the device base 2 on the + Y direction side. A grinding means 20A is arranged on the front side of the column 28 via a grinding feeding means 30A. The grinding means 20A includes a spindle 21 having an axial center in the Z-axis direction, a motor 22 connected to one end of the spindle 21, a spindle housing 23 in which the spindle 21 is rotatably surrounded and supported, and a spindle housing 23. A holder 24 for holding, a grinding wheel 26a detachably attached at the lower end of the spindle 21 via a mount 25, and a grinding wheel 27a for rough grinding fixed in an annular shape at the lower portion of the grinding wheel 26a. There is. Then, the motor 22 is driven to rotate the spindle 21, so that the grinding wheel 26a can be rotated at a predetermined rotation speed.

研削送り手段３０Ａは、Ｚ軸方向に延在するボールネジ３１と、ボールネジ３１の一端に接続されたモータ３２と、ボールネジ３１と平行に延在しコラム２８に配設された一対のガイドレール３３と、一方の面がホルダ２４に連結された昇降板３４とを備えている。昇降板３４の他方の面に一対のガイドレール３３が 接し、昇降板３４の中央部に形成されたナットにはボールネジ３１が螺合している。モータ３２によってボールネジ３１が回動することにより、一対のガイドレール３３に沿って昇降板３４とともに研削手段２０ＡをＺ軸方向に研削送りすることができる。 The grinding feed means 30A includes a ball screw 31 extending in the Z-axis direction, a motor 32 connected to one end of the ball screw 31, and a pair of guide rails 33 extending parallel to the ball screw 31 and arranged on the column 28. , One surface of which is provided with an elevating plate 34 connected to the holder 24. A pair of guide rails 33 are in contact with the other surface of the elevating plate 34, and a ball screw 31 is screwed into a nut formed at the center of the elevating plate 34. By rotating the ball screw 31 by the motor 32, the grinding means 20A can be grounded and fed in the Z-axis direction together with the elevating plate 34 along the pair of guide rails 33.

装置基台２の＋Ｙ方向側の端部には、コラム２８との間に所定の間隔を設けてコラム２９が立設されている。コラム２９の前方側において研削送り手段３０Ｂを介して研削手段２０Ｂが配設されている。研削手段２０Ｂは、スピンドル２１の下端においてマウント２５を介して着脱自在に装着された研削ホイール２６ｂと、研削ホイール２６ｂの下部において円環状に固着された仕上げ研削用の研削砥石２７ｂとを備え、これら以外は、研削手段２０Ａと同様の構成となっている。研削手段２０Ｂでは、モータ２２が駆動されてスピンドル２１が回転することにより、研削ホイール２６ｂを所定の回転速度で回転させることができる。 A column 29 is erected at the end of the device base 2 on the + Y direction side with a predetermined distance from the column 28. The grinding means 20B is arranged on the front side of the column 29 via the grinding feed means 30B. The grinding means 20B includes a grinding wheel 26b detachably attached at the lower end of the spindle 21 via a mount 25, and a grinding wheel 27b for finish grinding fixed in an annular shape at the lower portion of the grinding wheel 26b. Other than that, it has the same configuration as the grinding means 20A. In the grinding means 20B, the grinding wheel 26b can be rotated at a predetermined rotation speed by driving the motor 22 and rotating the spindle 21.

研削送り手段３０Ｂについても、研削送り手段３０Ａと同様の構成となっている。すなわち、研削送り手段３０Ｂは、ボールネジ３１と、ボールネジ３１の一端に接続されたモータ３２と、ボールネジ３１と平行に延在しコラム２９に配設された一対のガイドレール３３と、一方の面がホルダ２４に連結された昇降板３４とを備え、モータ３２によってボールネジ３１が回動することにより、一対のガイドレール３３に沿って昇降板３４とともに研削手段２０ＢをＺ軸方向に研削送りすることができる。 The grinding feed means 30B has the same configuration as the grinding feed means 30A. That is, the grinding feed means 30B has a ball screw 31, a motor 32 connected to one end of the ball screw 31, a pair of guide rails 33 extending in parallel with the ball screw 31 and arranged on the column 29, and one surface thereof. A lifting plate 34 connected to the holder 24 is provided, and the ball screw 31 is rotated by the motor 32 to grind and feed the grinding means 20B together with the lifting plate 34 in the Z-axis direction along the pair of guide rails 33. can.

研削手段２０Ａ及び研削手段２０Ｂの下方側には、板状ワークの厚みを測定する厚み測定手段４０がそれぞれ配設されている。厚み測定手段４０は、接触式の第１のゲージ４１と第２のゲージ４２とを備えている。厚み測定手段４０では、第１のゲージ４１でチャックテーブル１０に保持された板状ワークの高さを測定するとともに、第２のゲージ４２でチャックテーブル１０の高さを測定して、それぞれの測定値の差を板状ワークの厚みとして算出することができる。 Below the grinding means 20A and the grinding means 20B, thickness measuring means 40 for measuring the thickness of the plate-shaped work are respectively arranged. The thickness measuring means 40 includes a contact-type first gauge 41 and a second gauge 42. In the thickness measuring means 40, the height of the plate-shaped workpiece held on the chuck table 10 is measured by the first gauge 41, and the height of the chuck table 10 is measured by the second gauge 42, and each measurement is performed. The difference between the values can be calculated as the thickness of the plate-shaped work.

仮置きテーブル６の近傍には、仮置きテーブル６に仮置きされた研削前の板状ワークを着脱領域Ｐ１に位置づけられたチャックテーブル１０に搬入する搬入手段９が配設されている。また、洗浄手段７の近傍には、着脱領域Ｐ１に位置づけられたチャックテーブル１０に吸引保持された研削後の板状ワークを洗浄手段７に搬入する搬入手段９ａが配設されている。 In the vicinity of the temporary placement table 6, a carry-in means 9 for carrying the plate-shaped work before grinding temporarily placed on the temporary placement table 6 into the chuck table 10 located in the attachment / detachment region P1 is arranged. Further, in the vicinity of the cleaning means 7, a carry-in means 9a for carrying the ground plate-shaped work sucked and held by the chuck table 10 located in the attachment / detachment region P1 into the cleaning means 7 is arranged.

搬入手段９，９ａは、図２に示すように、板状ワークを吸引保持する吸引面９０ａを有する搬送パッド９０と、一端が搬送パッド９０に連結されたアーム部９１と、アーム部９１の他端に接続され回転及び昇降可能な軸部９２と、軸部９２に接続されたモータ９３とを備えている。搬送パッド９０には、吸引源９４が接続されており、吸引源９４の吸引力を吸引面９０ａに作用させて板状ワークを吸引保持することが可能となっている。搬入手段９では、モータ９３が駆動されて軸部９２が回転することで、アーム部９１が水平方向に旋回し、図１に示した仮置きテーブル６と着脱領域Ｐ１に位置づけられたチャックテーブル１０との間で搬送パッド９０を移動させることができる。また、搬入手段９ａでは、モータ９３が駆動されて軸部９２が回転すると、アーム部９１が水平方向に旋回し、着脱領域Ｐ１に位置づけられたチャックテーブル１０と洗浄手段７との間で搬送パッド９０を移動させることができる。さらに、搬入手段９，９ａでは、軸部９２が昇降すると、アーム部９１が上下方向（Ｚ軸方向）に昇降し、搬送パッド９０を昇降させることができる。 As shown in FIG. 2, the carrying-in means 9, 9a includes a transport pad 90 having a suction surface 90a for sucking and holding the plate-shaped work, an arm portion 91 having one end connected to the transport pad 90, and the arm portion 91. It includes a shaft portion 92 connected to an end and capable of rotating and raising and lowering, and a motor 93 connected to the shaft portion 92. A suction source 94 is connected to the transport pad 90, and the suction force of the suction source 94 can be applied to the suction surface 90a to suck and hold the plate-shaped work. In the carry-in means 9, the motor 93 is driven to rotate the shaft portion 92, so that the arm portion 91 rotates in the horizontal direction, and the temporary storage table 6 shown in FIG. 1 and the chuck table 10 positioned in the attachment / detachment region P1 are located. The transport pad 90 can be moved between and. Further, in the carrying-in means 9a, when the motor 93 is driven and the shaft portion 92 rotates, the arm portion 91 rotates in the horizontal direction, and the conveying pad is provided between the chuck table 10 positioned in the attachment / detachment region P1 and the cleaning means 7. 90 can be moved. Further, in the carrying-in means 9, 9a, when the shaft portion 92 moves up and down, the arm portion 91 moves up and down in the vertical direction (Z-axis direction), and the transport pad 90 can be moved up and down.

図２に示すように、チャックテーブル１０は、板状ワークを吸引保持する保持面１１ａを有するポーラス板１１と、保持面１１ａを露出させポーラス板１１を収容する凹部１２０を備える枠体１２とを備えている。枠体１２は、保持手段１３を構成するベース１３０に装着される。ベース１３０の下端には、ロータリージョイント１５が連結されている。枠体１２及びロータリージョイント１５には、吸引力の通り道となる吸引路１６が形成されており、吸引路１６には吸引バルブ１７ａを介して吸引源１７が接続されている。また、枠体１２及びロータリージョイント１５には、水の流路となる水路１８が形成されており、水路１８には給水バルブ１９ａを介して水供給源１９が接続されている。ロータリージョイント１５には、ベース１３０に装着されたチャックテーブル１０を回転させる回転手段１４が接続されている。 As shown in FIG. 2, the chuck table 10 includes a porous plate 11 having a holding surface 11a for sucking and holding a plate-shaped work, and a frame body 12 having a recess 120 for exposing the holding surface 11a and accommodating the porous plate 11. I have. The frame body 12 is attached to the base 130 constituting the holding means 13. A rotary joint 15 is connected to the lower end of the base 130. A suction path 16 serving as a passage for suction force is formed in the frame body 12 and the rotary joint 15, and a suction source 17 is connected to the suction path 16 via a suction valve 17a. Further, a water channel 18 serving as a water flow path is formed in the frame body 12 and the rotary joint 15, and a water supply source 19 is connected to the water channel 18 via a water supply valve 19a. A rotating means 14 for rotating the chuck table 10 mounted on the base 130 is connected to the rotary joint 15.

図３は、ポーラス板１１が枠体１２に収容される前の状態を示している。ポーラス板１１は、例えば円盤状に形成され、ポーラスセラミックス等の多孔質部材によって構成されている。本実施形態に示すポーラス板１１の保持面１１ａは、板状ワークと相似形に形成され、かつ、板状ワークと略同一の面積を有している。枠体１２には、リング状の凸部１２３が形成されており、この凸部１２３の内側の領域がポーラス板１１の形状に応じて形成された凹部１２０となっている。つまり、枠体１２の凹部１２０の内径は、ポーラス板１１の外径よりも かに大きく形成され、凹部１２０にポーラス板１１を嵌め込むことが可能となっている。 FIG. 3 shows a state before the porous plate 11 is housed in the frame body 12. The porous plate 11 is formed in a disk shape, for example, and is made of a porous member such as porous ceramics. The holding surface 11a of the porous plate 11 shown in the present embodiment is formed in a shape similar to the plate-shaped work and has substantially the same area as the plate-shaped work. A ring-shaped convex portion 123 is formed in the frame body 12, and the region inside the convex portion 123 is a concave portion 120 formed according to the shape of the porous plate 11. That is, the inner diameter of the recess 120 of the frame body 12 is formed to be larger than the outer diameter of the porous plate 11, and the porous plate 11 can be fitted into the recess 120.

凹部１２０の底面１２０ａは、ポーラス板１１の下面１１ｂを水平に固定するために、平坦面に形成されている。凹部１２０の底面１２０ａの中央には、図２に示す吸引路１６を通じて吸引源１７に連通可能な吸引孔１２１が形成されている。また、凹部１２０の底面１２０ａには、底面１２０ａよりも低い位置に吸引溝１２２が形成されている。吸引孔１２１を通じて吸引溝１２２に負圧を発生させることで、凹部１２０に嵌合されたポーラス板１１に吸引力を伝達し保持面１１ａにおいて吸引作用を発揮させることができる。なお、図示の例では、吸引孔１２１は、凹部１２０の底面１２０ａの中央に１つのみ形成されているが、吸引孔１２１の数や位置は限られない。したがって、吸引孔１２１の数を２つ以上に増やして、底面１２０ａの所望の位置にそれぞれ形成してもよい。 The bottom surface 120a of the recess 120 is formed on a flat surface in order to horizontally fix the bottom surface 11b of the porous plate 11. A suction hole 121 that can communicate with the suction source 17 through the suction path 16 shown in FIG. 2 is formed in the center of the bottom surface 120a of the recess 120. Further, a suction groove 122 is formed on the bottom surface 120a of the recess 120 at a position lower than the bottom surface 120a. By generating a negative pressure in the suction groove 122 through the suction hole 121, the suction force can be transmitted to the porous plate 11 fitted in the recess 120, and the suction action can be exerted on the holding surface 11a. In the illustrated example, only one suction hole 121 is formed in the center of the bottom surface 120a of the recess 120, but the number and position of the suction holes 121 are not limited. Therefore, the number of suction holes 121 may be increased to two or more, and the suction holes 121 may be formed at desired positions on the bottom surface 120a.

枠体１２の凸部１２３の上面１２３ａは、図２に示すように、ポーラス板１１が凹部１２０に嵌合されたときの保持面１１ａと同じ高さ位置に設定され基準面となっている。そして、板状ワークの研削時には、上記の第２のゲージ４２が上面１２３ａに接触してチャックテーブル１０の高さが測定される。 As shown in FIG. 2, the upper surface 123a of the convex portion 123 of the frame body 12 is set at the same height position as the holding surface 11a when the porous plate 11 is fitted into the concave portion 120 and serves as a reference surface. Then, when grinding the plate-shaped work, the second gauge 42 comes into contact with the upper surface 123a, and the height of the chuck table 10 is measured.

凸部１２３の上面１２３ａには、水路１８を通じて水供給源１９に連通可能な水供給孔１２４が複数形成されている。水供給孔１２４は、凸部１２３の上面１２３ａにおいて開口しており、上面１２３ａの上方に向けて水を噴出させることができる。本実施形態に示す水供給孔１２４は、図３に示すように、ポーラス板１１の外周の外側に沿った位置に所定の間隔を設けて複数形成されており、全体としてリング状となっている。また、図示の例では、水供給孔１２４の形状は、円形状の開口部としたが、例えばリング状の一連の開口部として形成してもよい。 A plurality of water supply holes 124 that can communicate with the water supply source 19 through the water channel 18 are formed on the upper surface 123a of the convex portion 123. The water supply hole 124 is opened at the upper surface 123a of the convex portion 123, and water can be ejected toward the upper surface 123a. As shown in FIG. 3, a plurality of water supply holes 124 shown in the present embodiment are formed at positions along the outer periphery of the outer periphery of the porous plate 11 at predetermined intervals, and are formed in a ring shape as a whole. .. Further, in the illustrated example, the shape of the water supply hole 124 is a circular opening, but it may be formed as a series of ring-shaped openings, for example.

ポーラス板１１を枠体１２に収容する場合は、凹部１２０の底面１２０ａに例えば接着材を塗布してから、ポーラス板１１を凹部１２０に嵌め込んで、底面１２０ａにおいてポーラス板１１の下面１１ｂを接着固定させる。これにより、図４に示すように、ポーラス板１１と枠体１２とが一体となったチャックテーブル１０が形成される。複数の水供給孔１２４は、ポーラス板１１の外周を囲むようにして位置づけられている。このように構成されるチャックテーブル１０の保持面１１ａで板状ワークを吸引保持すると、複数の水供給孔１２４によって板状ワークの外周部が囲まれた状態となる。かかる状態において、複数の水供給孔１２４から水を噴出させることにより、板状ワークの外周部の外側に水層を形成して、板状ワークの外周部を水層によって水シールしながら保持面１１ａにおいて板状ワークを吸引保持することができる。このように、本発明に係るチャックテーブル１０では、チャックテーブル１０で保持しようとする板状ワークの外周部に反りがあっても、板状ワークの外周部を水層によって水シールするため、外周部と保持面１１ａとの間から吸引力がリークするのを防ぎ、確実に保持面１１ａで板状ワークを吸引保持することが可能となる。 When the porous plate 11 is housed in the frame body 12, for example, an adhesive is applied to the bottom surface 120a of the recess 120, the porous plate 11 is fitted into the recess 120, and the bottom surface 11b of the porous plate 11 is adhered to the bottom surface 120a. Fix it. As a result, as shown in FIG. 4, a chuck table 10 in which the porous plate 11 and the frame body 12 are integrated is formed. The plurality of water supply holes 124 are positioned so as to surround the outer periphery of the porous plate 11. When the plate-shaped work is sucked and held by the holding surface 11a of the chuck table 10 configured in this way, the outer peripheral portion of the plate-shaped work is surrounded by the plurality of water supply holes 124. In such a state, water is ejected from the plurality of water supply holes 124 to form a water layer on the outside of the outer peripheral portion of the plate-shaped work, and the outer peripheral portion of the plate-shaped work is water-sealed by the water layer while holding the holding surface. The plate-shaped work can be sucked and held at 11a. As described above, in the chuck table 10 according to the present invention, even if the outer peripheral portion of the plate-shaped work to be held by the chuck table 10 is warped, the outer peripheral portion of the plate-shaped work is water-sealed by the water layer. It is possible to prevent the suction force from leaking from between the portion and the holding surface 11a, and to reliably suck and hold the plate-shaped work on the holding surface 11a.

次に、研削装置１の動作例について説明する。図５（ａ）に示す板状ワークＷは、円形板状の被加工物の一例であって、図１に示したカセット４ａに複数収容されている。まず、搬出入手段５は、カセット４ａから研削前の板状ワークＷを１枚取り出し、図５（ａ）に示すように、仮置きテーブル６に板状ワークＷを仮置きする。ここで、板状ワークＷの外周部Ｗｃは、デバイスチップを封止樹脂で封止する際に生じる熱の影響等によって、例えば仮置きテーブル６の上面から離間する上方向に反りが発生している。搬入手段９は、図５（ｂ）に示すように、アーム部９１とともに搬送パッド９０を降下させることにより、搬送パッド９０の吸引面９０ａを仮置きテーブル６において反った状態で仮置きされた板状ワークＷの上面に接触させ、搬送パッド９０で下方に押し付ける。搬入手段９は、吸引源９４の吸引力を吸引面９０ａに作用させて板状ワークＷを吸引保持する。このようにして、搬入手段９が板状ワークＷを受け取る。 Next, an operation example of the grinding device 1 will be described. The plate-shaped work W shown in FIG. 5A is an example of a circular plate-shaped workpiece, and is housed in a plurality of cassettes 4a shown in FIG. First, the loading / unloading means 5 takes out one plate-shaped work W before grinding from the cassette 4a, and temporarily places the plate-shaped work W on the temporary placing table 6 as shown in FIG. 5 (a). Here, the outer peripheral portion Wc of the plate-shaped work W is warped upward, for example, away from the upper surface of the temporary placement table 6 due to the influence of heat generated when the device chip is sealed with the sealing resin. There is. As shown in FIG. 5B, the carrying-in means 9 is a plate in which the suction surface 90a of the transport pad 90 is temporarily placed in a warped state on the temporary placement table 6 by lowering the transport pad 90 together with the arm portion 91. It is brought into contact with the upper surface of the work W and pressed downward by the transport pad 90. The carry-in means 9 applies the suction force of the suction source 94 to the suction surface 90a to suck and hold the plate-shaped work W. In this way, the carry-in means 9 receives the plate-shaped work W.

搬入手段９は、アーム部９１とともに搬送パッド９０を上昇させるとともに、図６（ａ）に示すように、モータ９３が駆動されて軸部９２を矢印Ａ方向に回転することにより、アーム部９１を水平方向に旋回させ、チャックテーブル１０の上方側に搬送パッド９０を移動させる。続いて、搬入手段９は、アーム部９１とともに搬送パッド９０を降下させ、チャックテーブル１０の保持面１１ａに板状ワークＷを載置する。 The carry-in means 9 raises the transport pad 90 together with the arm portion 91, and as shown in FIG. 6A, the motor 93 is driven to rotate the shaft portion 92 in the direction of the arrow A, thereby causing the arm portion 91 to move. The transfer pad 90 is moved to the upper side of the chuck table 10 by turning in the horizontal direction. Subsequently, the carrying-in means 9 lowers the transport pad 90 together with the arm portion 91, and places the plate-shaped work W on the holding surface 11a of the chuck table 10.

図６（ｂ）に示すように、吸引路１６に配設された吸引バルブ１７ａを開き、吸引源１７と吸引路１６とを通じてチャックテーブル１０の保持面１１ａに吸引作用を発揮させ、板状ワークＷを保持面１１ａで吸引保持する。搬入手段９は、吸引面９０ａの吸引力を開放させアーム部９１とともに搬送パッド９０を上昇させる。搬送パッド９０が板状ワークＷから離間する前に、水路１８に配設された給水バルブ１９ａを開き、水供給源１９から水路１８に所定量の水の供給を開始し、水供給孔１２４から上方側へ水を噴出させる。水供給孔１２４から水を噴出し続けて板状ワークＷの外周部Ｗｃを囲繞する水層１００を形成し、水層１００によって板状ワークＷの外周部Ｗｃを水シールする。そして、搬送パッド９０を板状ワークＷから退避させる。このようにして、搬入手段９からチャックテーブル１０へと板状ワークＷを受け渡す。 As shown in FIG. 6B, the suction valve 17a arranged in the suction path 16 is opened, and the holding surface 11a of the chuck table 10 exerts a suction action through the suction source 17 and the suction path 16 to exert a suction action on the plate-shaped work. W is sucked and held by the holding surface 11a. The carry-in means 9 releases the suction force of the suction surface 90a and raises the transport pad 90 together with the arm portion 91. Before the transport pad 90 is separated from the plate-shaped work W, the water supply valve 19a arranged in the water channel 18 is opened, a predetermined amount of water is started to be supplied from the water supply source 19 to the water channel 18, and the water supply hole 124 is used. Water is ejected upward. Water is continuously ejected from the water supply hole 124 to form a water layer 100 surrounding the outer peripheral portion Wc of the plate-shaped work W, and the outer peripheral portion Wc of the plate-shaped work W is water-sealed by the water layer 100. Then, the transport pad 90 is retracted from the plate-shaped work W. In this way, the plate-shaped work W is delivered from the carrying-in means 9 to the chuck table 10.

次いで、図１に示したターンテーブル８が回転することにより、板状ワークＷを吸引保持したチャックテーブル１０を、研削手段２０Ａの下方に移動させる。図７に示すように、回転手段１４によってチャックテーブル１０を例えば矢印Ａ方向に回転させるとともに、研削手段２０Ａは、スピンドル２１を回転させ研削砥石２７ａを所定の回転速度で矢印Ａ方向に回転させつつ、図１に示した研削送り手段３０Ａによって研削手段２０Ａを例えば−Ｚ方向に下降させて研削砥石２７ａで板状ワークＷの上面全面を押圧しながら粗研削する。 Next, as the turntable 8 shown in FIG. 1 rotates, the chuck table 10 that sucks and holds the plate-shaped work W is moved below the grinding means 20A. As shown in FIG. 7, the rotating means 14 rotates the chuck table 10 in the direction of arrow A, for example, and the grinding means 20A rotates the spindle 21 to rotate the grinding wheel 27a in the direction of arrow A at a predetermined rotation speed. , The grinding means 20A is lowered in the −Z direction by the grinding feed means 30A shown in FIG. 1, and rough grinding is performed while pressing the entire upper surface of the plate-shaped work W with the grinding wheel 27a.

粗研削中は、水供給源１９から水路１８に水を供給し続けて、水供給孔１２４から水を噴出させ板状ワークＷの外周部Ｗｃを水層１００によって常に水シールする。そのため、外周部Ｗｃの反りによって保持面１１ａと外周部Ｗｃとの間に かな隙間が生じたとしても、水層１００により保持面１１ａから吸引力がリークするのを防ぐことができる。このように、水層１００により板状ワークＷの外周部Ｗｃを水シールしながら、回転する研削砥石２７ａで板状ワークＷの上面全面を所定の厚みに至るまで粗研削する。板状ワークＷの粗研削中は、図１に示した厚み測定手段４０を用いて、常に板状ワークＷの厚みを測定して所定の厚みに達した時点で粗研削を終了する。 During rough grinding, water is continuously supplied from the water supply source 19 to the water channel 18, water is ejected from the water supply hole 124, and the outer peripheral portion Wc of the plate-shaped work W is always water-sealed by the water layer 100. Therefore, even if a gap is generated between the holding surface 11a and the outer peripheral portion Wc due to the warp of the outer peripheral portion Wc, it is possible to prevent the suction force from leaking from the holding surface 11a by the water layer 100. In this way, while the outer peripheral portion Wc of the plate-shaped work W is water-sealed by the water layer 100, the entire upper surface of the plate-shaped work W is roughly ground to a predetermined thickness with the rotating grinding wheel 27a. During rough grinding of the plate-shaped work W, the thickness measuring means 40 shown in FIG. 1 is used to constantly measure the thickness of the plate-shaped work W, and the rough grinding is terminated when a predetermined thickness is reached.

上記のように、板状ワークＷの粗研削が終了するまで外周部Ｗｃを水シールしてもよいが、板状ワークＷがある程度薄化されると外周部Ｗｃの反りが解消されることから、この場合は、水供給源１９から水路１８への水の供給を停止してもよい。つまり、粗研削中は、板状ワークＷの外周部Ｗｃの反りが解消されるまで、外周部Ｗｃを水シールしながらチャックテーブル１０で板状ワークＷを吸引保持すればよい。 As described above, the outer peripheral portion Wc may be water-sealed until the rough grinding of the plate-shaped work W is completed, but when the plate-shaped workpiece W is thinned to some extent, the warp of the outer peripheral portion Wc is eliminated. In this case, the supply of water from the water supply source 19 to the water channel 18 may be stopped. That is, during rough grinding, the plate-shaped work W may be sucked and held by the chuck table 10 while the outer peripheral portion Wc is water-sealed until the warp of the outer peripheral portion Wc of the plate-shaped work W is eliminated.

粗研削終了後、図１に示したターンテーブル８がさらに回転し、粗研削後の板状ワークＷを吸引保持したチャックテーブル１０を研削手段２０Ｂの下方に移動させる。仕上げ研削は、粗研削と同様の動作によって行われる。すなわち、チャックテーブル１０を回転させるとともに、研削手段２０Ｂは、スピンドル２１を回転させ研削砥石２７ｂを所定の回転速度で回転させる。研削送り手段３０Ａによって研削手段２０Ｂを例えば−Ｚ方向に下降させて研削砥石２７ｂで板状ワークＷの上面全面を押圧しながら仕上げ研削する。仕上げ研削を行う際に、板状ワークＷの外周部Ｗｃの反りが解消されていなければ、粗研削と同様に、水供給孔１２４から水を噴出させ板状ワークＷの外周部Ｗｃを水層１００によって常に水シールしながら保持面１１ａで板状ワークＷを吸引保持するとよい。仕上げ削中は、厚み測定手段４０を用いて常に板状ワークＷの厚みを測定して、所定の仕上げ厚みに達した時点で仕上げ研削を終了する。 After the rough grinding is completed, the turntable 8 shown in FIG. 1 further rotates, and the chuck table 10 that sucks and holds the plate-shaped work W after the rough grinding is moved below the grinding means 20B. Finish grinding is performed by the same operation as rough grinding. That is, while rotating the chuck table 10, the grinding means 20B rotates the spindle 21 to rotate the grinding wheel 27b at a predetermined rotation speed. The grinding means 20B is lowered in the −Z direction by the grinding feed means 30A, and finish grinding is performed while pressing the entire upper surface of the plate-shaped work W with the grinding wheel 27b. When the finish grinding is performed, if the warp of the outer peripheral portion Wc of the plate-shaped work W is not eliminated, water is ejected from the water supply hole 124 and the outer peripheral portion Wc of the plate-shaped work W is water-layered as in the rough grinding. It is preferable to suck and hold the plate-shaped work W on the holding surface 11a while always water-sealing with 100. During the finish cutting, the thickness of the plate-shaped work W is always measured by using the thickness measuring means 40, and the finish grinding is finished when a predetermined finish thickness is reached.

仕上げ研削終了後、ターンテーブル８が回転し、チャックテーブル１０を着脱領域Ｐ１に位置づけ、搬入手段９ａにより研削済みの板状ワークＷをチャックテーブル１０から洗浄手段７に搬送する。そして、洗浄手段７で板状ワークＷを洗浄した後、搬出入手段５によってカセット４ｂに板状ワークＷを収容する。 After the finish grinding is completed, the turntable 8 rotates, the chuck table 10 is positioned in the attachment / detachment region P1, and the plate-shaped work W that has been ground by the carry-in means 9a is conveyed from the chuck table 10 to the cleaning means 7. Then, after the plate-shaped work W is washed by the cleaning means 7, the plate-shaped work W is housed in the cassette 4b by the loading / unloading means 5.

このように、本発明に係る研削装置１は、チャックテーブル１０が回転可能に装着された保持手段１３と、チャックテーブル１０が吸引保持した板状ワークＷを研削する研削手段２０Ａ，２０Ｂと、チャックテーブル１０に板状ワークＷを搬入する搬入手段９とを備え、搬入手段９によって板状ワークＷをチャックテーブル１０に搬入しチャックテーブル１０が板状ワークＷを吸引保持した後、水供給孔１２４から枠体１２の上面１２３ａに水を供給して水層１００を形成し、水層１００によって板状ワークＷの外周部Ｗｃを水シールしながらチャックテーブル１０を回転させ研削手段２０Ａ，２０Ｂで板状ワークＷを研削するように構成したため、たとえ外周部Ｗｃに反りのある板状ワークＷであっても、チャックテーブル１０の保持面１１ａと板状ワークＷの外周部Ｗｃとの間から吸引力がリークするのを防ぐことができる。したがって、研削中にチャックテーブル１０から板状ワークＷが外れるおそれを防止でき、チャックテーブル１０の保持面１１ａで確実に板状ワークＷを吸引保持して研削加工を実施することができる。 As described above, the grinding apparatus 1 according to the present invention includes the holding means 13 to which the chuck table 10 is rotatably mounted, the grinding means 20A and 20B for grinding the plate-shaped work W sucked and held by the chuck table 10, and the chuck. The table 10 is provided with a carry-in means 9 for carrying the plate-shaped work W, and the plate-shaped work W is carried into the chuck table 10 by the carry-in means 9, and after the chuck table 10 sucks and holds the plate-shaped work W, the water supply hole 124 is provided. Water is supplied to the upper surface 123a of the frame body 12 to form the water layer 100, and the chuck table 10 is rotated while the outer peripheral portion Wc of the plate-shaped work W is water-sealed by the water layer 100, and the plates are used by the grinding means 20A and 20B. Since the shaped work W is configured to be ground, even if the plate-shaped work W has a warp on the outer peripheral portion Wc, a suction force is applied from between the holding surface 11a of the chuck table 10 and the outer peripheral portion Wc of the plate-shaped work W. Can be prevented from leaking. Therefore, it is possible to prevent the plate-shaped work W from coming off from the chuck table 10 during grinding, and the plate-shaped work W can be reliably sucked and held by the holding surface 11a of the chuck table 10 to perform the grinding process.

上記実施形態に示したチャックテーブル１０では、ポーラス板１１の保持面１１ａが板状ワークＷと略同一の面積を有しているが、チャックテーブル１０の保持面１１ａの面積は例えば板状ワークＷよりも かに小さい面積であってもよい。また、チャックテーブル１０の保持面１１ａの面積は板状ワークＷよりも かに大きい面積であってもよい。この場合においても、本発明によれば、複数の水供給孔１２４から水を噴出させて板状ワークＷの外周部Ｗｃを水シールすることができるため、チャックテーブル１０の保持面１１ａと板状ワークＷの外周部Ｗｃとの間から吸引力がリークするのを防ぎ、保持面１１ａで板状ワークを確実に吸引保持することができる。 In the chuck table 10 shown in the above embodiment, the holding surface 11a of the porous plate 11 has substantially the same area as the plate-shaped work W, but the area of the holding surface 11a of the chuck table 10 is, for example, the plate-shaped work W. It may be a much smaller area. Further, the area of the holding surface 11a of the chuck table 10 may be much larger than that of the plate-shaped work W. Even in this case, according to the present invention, water can be ejected from the plurality of water supply holes 124 to water-seal the outer peripheral portion Wc of the plate-shaped work W, so that the holding surface 11a of the chuck table 10 and the plate-shaped work W can be sealed. It is possible to prevent the suction force from leaking from the outer peripheral portion Wc of the work W, and to reliably suck and hold the plate-shaped work on the holding surface 11a.

１：研削装置 ２：装置基台 ３ａ，３ｂ：ステージ
４ａ，４ｂ：カセット ５：搬出入手段 ６：仮置きテーブル
７：洗浄手段 ８：：ターンテーブル
９，９ａ：搬入手段 ９０：搬送パッド ９１：アーム部 ９２：軸部
９３：モータ ９４：吸引源
１０：チャックテーブル １１：ポーラス板 １１ａ：保持面
１２：枠体 １２０：凹部 １２０ａ：底面 １２１：吸引孔 １２２：吸引溝
１２３：凸部 １２３ａ：上面 １２４：水供給孔
１３：保持手段 １３０：ベース １４：回転手段 １５：ロータリージョイント
１６：吸引路 １７：吸引源 １７ａ：吸引バルブ １８：水路 １９：水供給源
１９ａ：給水バルブ ２０Ａ，２０Ｂ：研削手段 ２１：スピンドル ２２：モータ
２３：スピンドルハウジング ２４：ホルダ ２５：マウント
２６ａ，２６ｂ：研削ホイール ２７ａ，２７ｂ：研削砥石 ２８，２９：コラム
３０Ａ，３０Ｂ：研削送り手段 ３１：ボールネジ ３２：モータ
３３：ガイドレール ３４：昇降板
４０：厚み測定手段 ４１：第１のゲージ ４１：第２のゲージ
１００：水層 1: Grinding device 2: Equipment base 3a, 3b: Stage 4a, 4b: Cassette 5: Carrying in / out means 6: Temporary storage table 7: Cleaning means 8 :: Turntable 9, 9a: Carrying means 90: Conveying pad 91: Arm part 92: Shaft part 93: Motor 94: Suction source 10: Chuck table 11: Porous plate 11a: Holding surface 12: Frame body 120: Recessed portion 120a: Bottom surface 121: Suction hole 122: Suction groove 123: Convex part 123a: Top surface 124: Water supply hole 13: Holding means 130: Base 14: Rotating means 15: Rotary joint 16: Suction path 17: Suction source 17a: Suction valve 18: Water channel 19: Water supply source 19a: Water supply valve 20A, 20B: Grinding means 21: Spindle 22: Motor 23: Spindle housing 24: Holder 25: Mount 26a, 26b: Grinding wheel 27a, 27b: Grinding grindstone 28, 29: Columns 30A, 30B: Grinding feed means 31: Ball screw 32: Motor 33: Guide rail 34: Lifting plate 40: Thickness measuring means 41: First gauge 41: Second gauge 100: Water layer

Claims (1)

チャックテーブルが回転可能に装着された保持手段と、該チャックテーブルが吸引保持した板状ワークを研削する研削砥石を有する研削手段と、板状ワークを吸引保持する搬送パッドを備え該チャックテーブルに板状ワークを搬入する搬入手段とを備える研削装置の該チャックテーブルにおける板状ワークの保持方法であって、
該チャックテーブルは、
板状ワークを吸引保持する保持面を有するポーラス板と、
該保持面を露出させ該ポーラス板を収容する凹部を備える枠体と、を備え、
該枠体は、該凹部の底面に形成され吸引源と連通可能な吸引孔と、
該枠体の該凹部に収容された該ポーラス板を囲繞する環状の上面において、該保持面に
保持された板状ワークの外周より外側において開口して円状に配置されて形成され水供給
源と連通可能な水供給孔とを備え、
該搬入手段による板状ワークの該チャックテーブルへの搬入時、該搬送パッドが板状ワ
ークから離間する前に該水供給孔から該枠体の上面に水を供給し板状ワークの外周部
を水シールし、該保持面に板状ワークを吸引保持した後に該搬送パッドを退避させ、
該水供給孔から水を供給し続け該水シールした状態で、板状ワークを吸引保持した該チ
ャックテーブルを回転させ該研削手段で板状ワークを研削する
板状ワークの保持方法。 The chuck table is provided with a holding means on which the chuck table is rotatably mounted, a grinding means having a grinding wheel for grinding the plate-shaped work sucked and held by the chuck table, and a transport pad for sucking and holding the plate-shaped work. A method for holding a plate-shaped work on the chuck table of a grinding device including a carrying-in means for carrying in the shaped work.
The chuck table is
A porous plate with a holding surface that sucks and holds the plate-shaped work,
A frame body having a recess for exposing the holding surface and accommodating the porous plate is provided.
The frame has a suction hole formed on the bottom surface of the recess and can communicate with the suction source.
On the annular upper surface surrounding the porous plate housed in the recess of the frame, on the holding surface.
Water supply is formed by opening outside the outer circumference of the held plate-shaped work and arranging it in a circular shape.
Equipped with a water supply hole that can communicate with the source
When carried to the chuck table of the plate-shaped workpiece by該搬guide means, the outer peripheral portion of the supplying water to the upper surface of the frame body from the water supply hole plate workpiece before conveying pad is separated from the plate workpiece and water sealing, retracts the conveying pad after suction-holding the plate workpiece on the holding surface,
A method for holding a plate-shaped work, in which water is continuously supplied from the water supply hole and the chuck table that sucks and holds the plate-shaped work is rotated in a state where the water is sealed, and the plate-shaped work is ground by the grinding means.
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JP7358222B2 (en) * 2019-12-06 2023-10-10 株式会社ディスコ Plate-shaped object holder
CN111113205A (en) * 2019-12-25 2020-05-08 昆山昌利达精密机械有限公司 Polishing platform for hardware fitting machining
US11652080B2 (en) * 2021-05-27 2023-05-16 Intel Corporation Thermal compression bonder nozzle with vacuum relief features
CN113770913B (en) * 2021-10-28 2022-11-04 华海清科股份有限公司 Sucking disc revolving stage and system of processing
CN115302644B (en) * 2022-10-11 2023-01-31 南京宏泰晶智能装备科技有限公司 Vertical punching device for monocrystalline silicon wafer
CN115383389B (en) * 2022-10-28 2023-03-17 镇江华舟电器有限公司 Cubical switchboard curb plate welded fastening device

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6094842U (en) * 1983-12-05 1985-06-28 九州日本電気株式会社 Grinding equipment for semiconductor substrates
JPH10135316A (en) * 1996-10-28 1998-05-22 Sony Corp Vacuum chucking method for thin substrate and vacuum chuck table apparatus therefor
JP4417525B2 (en) 2000-04-28 2010-02-17 株式会社ディスコ Grinding equipment
US6475067B1 (en) * 2001-12-11 2002-11-05 Budget Maintenance Concrete Services, Inc. Dry method of concrete floor restoration
JP4732736B2 (en) * 2004-11-08 2011-07-27 株式会社岡本工作機械製作所 Device wafer vacuum chuck system and method for polishing back surface of device wafer using the same
JP2006261415A (en) 2005-03-17 2006-09-28 Denso Corp Manufacturing method for semiconductor device
JP5406676B2 (en) * 2009-11-10 2014-02-05 株式会社ディスコ Wafer processing equipment
JP5944724B2 (en) * 2012-04-12 2016-07-05 株式会社ディスコ Chuck table
JP5999972B2 (en) * 2012-05-10 2016-09-28 株式会社ディスコ Holding table
JP6132547B2 (en) * 2012-12-25 2017-05-24 株式会社ディスコ Negative pressure generator
JP2015199153A (en) 2014-04-07 2015-11-12 株式会社ディスコ Holding table, and grinding method and cutting method using the same
JP6312554B2 (en) * 2014-08-13 2018-04-18 株式会社ディスコ Processing method of package substrate
JP2016047561A (en) * 2014-08-27 2016-04-07 株式会社ディスコ Grinding device
JP2016078147A (en) * 2014-10-14 2016-05-16 株式会社ディスコ Grinding device

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