JP4417525B2 - Grinding equipment - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a grinding apparatus, equipped with a work delivery mans capable of transferring a plate-like work, such as a ground semiconductor wafer without causing damages, such as cracking to it, when being delivered from a chuck table. SOLUTION: A grinding apparatus is equipped with a chuck table which holds a work, a grinding means which grinds the work held on the chuck table, and a work delivery means which delivers the ground plate-like work from the chuck table, where the work delivery means is equipped with a fluid levitating mechanism which levitates the work, jetting fluid onto the surface of the chuck table, an insertion support member inserted between the surface of the chuck table and the plate-like work to support it, and a transfer mechanism which actuates the insertion support member.

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a grinding apparatus for grinding the surface of a plate-like workpiece such as a semiconductor wafer.
[0002]
[Prior art]
As is well known to those skilled in the art, in the semiconductor device manufacturing process, the surface of the semiconductor wafer is ground in order to form a substantially disc-shaped semiconductor wafer to a predetermined thickness. Such a grinding apparatus for grinding the surface of a semiconductor wafer sucks and holds a semiconductor wafer as a plate-like workpiece on a chuck table, and grinds the surface of the semiconductor wafer sucked and held on the chuck table. Grind. The semiconductor wafer thus ground is unloaded from the chuck table by the workpiece unloading means. The workpiece unloading means includes a suction pad, and the semiconductor wafer ground by the suction pad is sucked and held from the chuck table.
[0003]
[Problems to be solved by the invention]
In recent years, cellular phones, personal computers, smart cards, etc. using semiconductor circuits are increasingly required to be lighter, smaller, and thinner, and there is a demand for semiconductor wafers with a thickness of, for example, about 100 μm. ing. However, a semiconductor wafer thinly ground to around 100 μm is easily broken, and there is a problem that it breaks when it is unloaded from the chuck table after the grinding process. That is, when the semiconductor wafer held on the chuck table is adsorbed to the suction pad of the workpiece carry-out means and carried out, the semiconductor wafer is subjected to the surface tension of the cutting water existing between the chuck table and the semiconductor wafer. Since a force opposite to the suction direction by the suction pad acts on the semiconductor wafer, cracks occur in the semiconductor wafer.
[0004]
In addition, some measures have been tried to prevent surface tension of cutting water from being generated by ejecting air and water from the surface of the chuck table when the semiconductor wafer is unloaded from the chuck table. However, when the water or the like is ejected in a biased manner, an unreasonable force acts on the semiconductor wafer to break the semiconductor wafer.
[0005]
The present invention has been made in view of the above-mentioned facts, and its main technical problem is that damage such as cracking occurs when a plate-like workpiece such as a semiconductor wafer that has been ground is carried out from the chuck table. An object of the present invention is to provide a grinding apparatus provided with a workpiece unloading means that can be conveyed without any problem.
[0006]
[Means for Solving the Problems]
In order to solve the above main technical problem, according to the present invention, a chuck table for holding a plate-like workpiece, a grinding means for grinding the plate-like workpiece held on the chuck table, and a grinding In a grinding apparatus comprising a workpiece unloading means for unloading a processed plate-shaped workpiece from the chuck table,
The workpiece unloading means is inserted between the surface of the chuck table and the plate-like workpiece, and a fluid levitation mechanism for ejecting fluid onto the surface of the chuck table to float the plate-like workpiece. And an insertion support member for placing and supporting the plate-like workpiece and a transport mechanism for operating the insertion support member.
A grinding device is provided.
[0007]
The support transport mechanism includes an insertion support member that is inserted between the surface of the chuck table and the plate-like workpiece and places the plate-like workpiece, and an operation mechanism that operates the insertion support member. It is constituted by.
[0008]
The workpiece unloading means includes a drop prevention mechanism that prevents the plate-like workpiece lifted from the surface of the chuck table by the fluid floating mechanism from dropping from the chuck table. The drop-off prevention mechanism includes a regulating member that bends the outside of the plate-like workpiece held on the chuck table and regulates the plate-like workpiece so that the plate-like workpiece can float, and the regulating member is attached to the surface of the chuck table. And an advancing / retreating mechanism that approaches or separates from the surface of the chuck table. To do. The restricting portion is composed of three fingers, and restricts the outer periphery of the plate-like workpiece by bringing the tips of the three fingers close to the surface of the chuck table.
[0009]
In addition, the drop-off prevention mechanism includes a regulating fluid ejection mechanism that ejects fluid in an annular shape to the outside of the plate-like workpiece held on the chuck table, and the plate-like workpiece is placed on the surface of the chuck table. The fluid is ejected in an annular shape outside the plate-like workpiece when it is levitated.
[0010]
DETAILED DESCRIPTION OF THE INVENTION
DESCRIPTION OF EMBODIMENTS Hereinafter, a preferred embodiment of a surface grinding apparatus configured according to the present invention will be described in detail with reference to the accompanying drawings.
[0011]
FIG. 1 is a perspective view of a surface grinding apparatus constructed according to the present invention.
The grinding device in the illustrated embodiment includes a device housing 2 having a substantially rectangular parallelepiped shape. A stationary support plate 4 is erected on the upper right end of the device housing 2 in FIG. Two pairs of guide rails 6, 6 and 8, 8 extending in the vertical direction are provided on the inner surface of the stationary support plate 4. A rough grinding unit 10 as rough grinding means is mounted on one of the guide rails 6 and 6 so as to be movable in the vertical direction. A finish grinding unit 12 as finish grinding means is vertically mounted on the other guide rails 8 and 8. It is mounted to move in the direction.
[0012]
The rough grinding unit 10 has a unit housing 101, a grinding wheel 102 rotatably attached to the lower end of the unit housing 101, and a grinding wheel 102 attached to the upper end of the unit housing 101 in a direction indicated by an arrow. A rotation drive mechanism 103 and a moving base 104 on which the unit housing 101 is mounted are provided. Guided rails 105, 105 are provided on the moving base 104, and the guided rails 105, 105 are movably fitted to the guide rails 6, 6 provided on the stationary support plate 4. The rough grinding unit 10 is supported so as to be movable in the vertical direction. The rough grinding unit 10 in the illustrated form includes a feed mechanism 11 that moves the moving base 104 along the guide rails 6 and 6 and adjusts the cutting depth of the grinding wheel 102. The feed mechanism 11 includes a male screw rod 111 that is disposed on the stationary support plate 4 in parallel with the guide rails 6 and 6 and is rotatably supported, and a pulse motor 112 that rotationally drives the male screw rod 111. , A female screw block (not shown) mounted on the moving base 104 and screwed with the male screw rod 111 is driven, and the male screw rod 111 is driven forward and reverse by a pulse motor 112 to move the rough grinding unit 10 in the vertical direction. Move to.
[0013]
The finish grinding unit 12 is also configured in the same manner as the rough grinding unit 10, and is equipped with a unit housing 121, a grinding wheel 122 rotatably attached to the lower end of the unit housing 121, and an upper end of the unit housing 121. A rotation drive mechanism 123 that rotates the grinding wheel 122 in the direction indicated by the arrow, and a moving base 124 on which the unit housing 121 is mounted are provided. Guided rails 125, 125 are provided on the moving base 124, and the guided rails 125, 125 are movably fitted to the guide rails 8, 8 provided on the stationary support plate 4. The finish grinding unit 12 is supported so as to be movable in the vertical direction. The finish grinding unit 12 in the illustrated form includes a feed mechanism 13 that moves the moving base 124 along the guide rails 8 and 8 and adjusts the cutting depth of the grinding wheel 123. The feed mechanism 13 has substantially the same configuration as the feed means 11. That is, the feed mechanism 13 includes a male screw rod 131 which is disposed on the stationary support plate 4 in the vertical direction in parallel with the guide rails 6 and 6 and is rotatably supported, and a pulse motor for driving the male screw rod 131 to rotate. 132 and a female screw block (not shown) that is mounted on the moving base 124 and is screwed with the male screw rod 131. By driving the male screw rod 121 forward and backward by the pulse motor 132, the finish grinding unit 12 is moved. Move it up and down.
[0014]
The grinding apparatus in the illustrated embodiment includes a turntable 15 disposed so as to be substantially flush with the upper surface of the apparatus housing 2 on the front side of the stationary support plate 4. The turntable 15 is formed in a relatively large-diameter disk shape, and is appropriately rotated in a direction indicated by an arrow 15a by a rotation drive mechanism (not shown). In the illustrated embodiment, three chuck tables 20 are arranged on the turntable 15 so as to be rotatable in a horizontal plane with a phase angle of 120 degrees. As shown in FIG. 2, the chuck table 20 includes a disk-shaped base 21 and a disk-shaped suction holding chuck 22. The base 21 is made of an appropriate metal material, and a circular recess 211 having an open top is formed on the upper surface thereof. The recess 211 is connected to a suction source 25 such as a vacuum tank via a communication path 212 and a pipe 24 provided in the base 21. The pipe 24 is provided with an electromagnetic opening / closing valve 26 and is controlled to be opened and closed by a control means (not shown). The suction holding chuck 22 is formed of a porous ceramic board and is fitted in a recess 211 formed in the base 21. Accordingly, the workpiece W is placed on the suction holding chuck 22, the electromagnetic on-off valve 26 is opened, and the recess 211 is communicated with the suction source 25 via the communication path 212 and the pipe 24, whereby the workpiece W is It can be sucked and held on the suction holding chuck 22. Accordingly, the suction source 25 such as a vacuum tank, the pipe 24, the electromagnetic on-off valve 26, and the like constitute suction means for sucking the workpiece W onto the suction holding chuck 22. The chuck table 20 configured as described above is rotated in a direction indicated by an arrow by a rotation driving mechanism (not shown). The three chuck tables 20 arranged on the turntable 15 are provided with a workpiece loading / unloading area A, a rough grinding machining area B, a finish grinding machining area C, and a workpiece by appropriately rotating the turntable 15. It is sequentially moved to the loading / unloading area A.
[0015]
The illustrated grinding apparatus includes a first cassette 31 that is disposed on one side with respect to a workpiece loading / unloading area A and stocks a semiconductor wafer that is a workpiece before grinding, and a workpiece loading / unloading. A second cassette 32 that is disposed on the other side with respect to the area A and stocks the semiconductor wafer that is a workpiece after grinding, and between the first cassette 31 and the workpiece loading / unloading area A. The workpiece mounting portion 33 provided, the cleaning means 34 disposed between the workpiece loading / unloading area A and the second cassette 32, and the workpiece stored in the first cassette 31. A workpiece transport means 35 for transporting the semiconductor wafer, which is a workpiece, to the workpiece mounting portion 33 and transporting the semiconductor wafer cleaned by the cleaning means 34 to the second cassette 32, and the workpiece mounting portion. Semiconductor wafer placed on 33 is processed Workpiece carry-in means 36 for conveying onto the chuck table 20 positioned in the loading / unloading area A, and after grinding processing placed on the chuck table 20 positioned in the workpiece loading / unloading area A A workpiece unloading means 40 for conveying the semiconductor wafer to the cleaning means 34 is provided.
[0016]
Next, the processing operation of the above-described grinding apparatus will be briefly described.
The semiconductor wafer, which is a plate-like workpiece before grinding, accommodated in the first cassette 31 is conveyed by the vertical movement and forward / backward movement of the workpiece conveying means 35 and is placed on the workpiece placing portion 33. And centered by radial movement toward the center of the six pins 331. The semiconductor wafer placed on the workpiece placing portion 33 and centered is placed on the chuck table 20 positioned in the workpiece loading / unloading area A by the turning operation of the workpiece loading means 36. . The semiconductor wafer placed on the chuck table 20 is sucked and held on the suction holding chuck 22 of the chuck table 20 as described above. Then, the turntable 15 is rotated 120 degrees in the direction indicated by the arrow 15a by a rotation drive mechanism (not shown), and the chuck table 20 on which the semiconductor wafer is placed is positioned in the rough grinding region B.
[0017]
When the chuck table 20 on which the semiconductor wafer is placed is positioned in the rough grinding region B, the chuck table 20 is rotated in the direction indicated by the arrow by a rotation drive mechanism (not shown), while the grinding wheel 102 of the rough grinding unit 10 is moved in the direction indicated by the arrow. The semiconductor wafer on the chuck table 20 is roughly ground by being lowered by a predetermined amount by the feed mechanism 11 while being rotated. Meanwhile, on the next chuck table 20 positioned in the workpiece loading / unloading area A during this period, the semiconductor wafer before grinding is placed as described above. Next, the turntable 15 is rotated 120 degrees in the direction indicated by the arrow 15a, and the chuck table 20 on which the semiconductor wafer subjected to rough grinding is placed is positioned in the finish grinding region C. At this time, the next chuck table 20 on which the semiconductor wafer is placed in the workpiece loading / unloading area A is positioned in the rough grinding processing area B, and the next chuck table 20 is moved to the workpiece loading / unloading area. Positioned at A.
[0018]
In this way, the semiconductor wafer before the rough grinding process placed on the chuck table 20 positioned in the rough grinding process area B is subjected to the rough grinding process by the rough grinding unit 10, so that the finish grinding process area C can be finished. The semiconductor wafer placed on the positioned chuck table 20 and subjected to rough grinding is subjected to finish grinding by the finish grinding unit 12. Next, the turntable 15 is rotated 120 degrees in the direction indicated by the arrow 15a, and the chuck table 20 on which the semiconductor wafer subjected to finish grinding is placed is positioned in the workpiece loading / unloading area A. The chuck table 20 on which the semiconductor wafer subjected to rough grinding in the rough grinding area B is placed in the finish grinding area C, and the semiconductor wafer before grinding is placed in the work carry-in / out area A. The chuck table 20 is moved to the rough grinding area B, respectively.
[0019]
The chuck table 20 that has returned to the workpiece loading / unloading zone A via the rough grinding zone B and the finish grinding zone C releases the suction holding of the semiconductor wafer that has been finish-grinded here. Then, the finish-ground semiconductor wafer on the chuck table 20 positioned in the workpiece carry-in / carry-out area A is transferred to the cleaning means 34 by the workpiece carry-out means 40 and cleaned there. The semiconductor wafer cleaned by the cleaning means 34 is stored in a predetermined position of the second cassette 32 by the workpiece transfer means 35.
[0020]
Next, the workpiece unloading means 40 will be described with reference to FIGS.
The workpiece unloading means 40 in the illustrated embodiment includes a fluid levitation mechanism 50 that ejects fluid onto the surface of the chuck table 20 to float a plate-shaped workpiece W such as a semiconductor wafer, as shown in FIG. As shown in FIG. 3 and FIG. 4, there is provided a support transport mechanism 60 that is inserted between the surface of the chuck table 20 and the workpiece W and places and supports the workpiece W. As shown in FIG. 2, the fluid levitation mechanism 50 is provided in a water supply source 51 such as an accumulator, a pipe 52a connecting the water supply source 51 and the pipe 24 constituting the suction means, and the pipe 52a. An electromagnetic on-off valve 53 that is controlled to open and close by control means (not shown) is provided. The fluid levitation mechanism 50 in the illustrated embodiment includes a compressed air supply source 54 such as an air tank, a pipe 52b in which the compressed air supply source 54 and the pipe 52a are connected by a pipe joint 55, and the pipe 52b. An electromagnetic opening / closing valve 56 is provided and is controlled to be opened and closed by a control means (not shown). The fluid levitation mechanism 50 in the illustrated embodiment is configured as described above. By closing the electromagnetic on-off valve 26 and opening the electromagnetic on-off valve 53, the pipe 52a, the pipe 24, and the chuck table 20 from the water supply source 51 are opened. Water is supplied to the recess 211 through the communication passage 212 formed in the base 21 that constitutes. As a result, the suction holding chuck 22 fitted in the concave portion 211 is formed of a porous ceramic board, so that the water supplied to the concave portion 211 is jetted onto the surface of the suction holding chuck 22 to float the workpiece W. . At this time, the surface tension of the fluid can be weakened by opening the electromagnetic opening / closing valve 56 and mixing the compressed air of the compressed air supply source 54 into the water via the pipe 52b.
[0021]
Next, the support conveyance mechanism 60 which comprises the workpiece unloading means 40 is demonstrated with reference to FIG. 3 and FIG.
The support transport mechanism 60 in the illustrated embodiment includes an insertion support member 61 that is inserted between the surface of the suction holding chuck 22 constituting the chuck table 20 and the workpiece W and places and supports the workpiece W. An operation mechanism 62 for operating the insertion support member 61 between the workpiece take-out position shown in FIG. 4 and the cleaning means 34 is provided. The insertion support member 61 is formed in a fork shape by a thin plate material, and is attached to a slider 65 described later of the operation mechanism 62. A suction holding hole 611 communicating with a passage (not shown) formed inside is formed on the surface of the insertion support member 61, and the suction holding hole 611 is connected to suction means (not shown) via the passage. The actuating mechanism 62 includes an actuating arm 64 having a guide function configured to be swingable around a support shaft 63 disposed vertically, and the insertion support member fitted to the actuating arm 64 so as to be slidable. 61, and an air cylinder 66 that slides the slider 65 along the longitudinal direction of the operating arm 64. The piston rod 661 of the air cylinder 66 is connected to the slider 65 by a connecting member 662. It is connected.
[0022]
Further, the workpiece unloading means 40 in the illustrated embodiment causes the workpiece W to fall off the chuck table 20 when the workpiece W placed on the chuck table 20 is levitated by the fluid levitation mechanism 50. A drop-off prevention mechanism 70 is provided to prevent this. As shown in FIG. 1, the drop-off prevention mechanism 70 in the illustrated embodiment includes an L-shaped support arm 71 disposed on one side edge of the apparatus housing 2, and a forward / backward movement disposed on the distal end portion of the support arm 71. An air cylinder 72 as a mechanism and a regulating member 73 attached to a piston rod 721 of the air cylinder 72 are included. The L-shaped support arm 71 has a tip extending in the workpiece loading / unloading area A to a position immediately above. The air cylinder 72 as an advancing / retreating mechanism positions the regulating member 73 at an operating position (FIG. 4) that approaches the surface of the chuck table 20 and a retracted position (FIGS. 1 and 3) that is separated from the surface of the chuck table 20. In the illustrated embodiment, the restricting member 73 is configured by three fingers 731, 731, and 731 arranged at an angle of 120 degrees with respect to each other. When these three fingers 731, 731, and 731 are positioned at the operation positions shown in FIG. 4, the three fingers 731, 731, and 731 surround the outside of the workpiece W and restrict the horizontal movement of the workpiece W.
[0023]
The workpiece unloading means 40 in the illustrated embodiment is configured as described above, and the workpiece unloading operation will be described below.
As described above, the chuck table 20 which has returned to the work carry-in / carry-out area A via the rough grinding area B and the finish grinding area C is a semiconductor wafer which is the work piece W subjected to finish grinding. Release the adsorption hold. That is, the electromagnetic on-off valve 26 of the suction means shown in FIG. 2 is closed, and the recess 211 of the base 21 constituting the chuck table 20 is blocked from communicating with the suction source 25, so that the workpiece on the suction holding chuck 22 is processed. The suction holding of the object W is released. In this way, if the workpiece W placed on the chuck table 20 is lifted, if the workpiece W is released from being held by suction, the workpiece W may fall off the chuck table 20 when the workpiece W is lifted. In order to prevent this, the drop prevention mechanism 70 is operated. That is, the air cylinder 72 is actuated to bring the regulating member 73 closer to the surface of the chuck table 20 and the three fingers 731, 731, 731 are positioned at the operation positions shown in FIG.
[0024]
Then, the fluid floating mechanism 50 is actuated to lift the workpiece W from the surface of the suction holding chuck 22. That is, the electromagnetic on-off valve 53 shown in FIG. 2 is opened, and the recess 211 formed in the base 21 constituting the chuck table 20 is communicated with the water supply source 51, whereby water is supplied to the recess 211. As a result, the suction holding chuck 22 fitted in the concave portion 211 is formed of a porous ceramic board, so that the water supplied to the concave portion 211 is jetted onto the surface of the suction holding chuck 22 to float the workpiece W. . At this time, the three fingers 731, 731, 731 of the drop-off prevention mechanism 70 regulate the movement of the workpiece W floating on the chuck table 20 in the horizontal direction. When the workpiece W is lifted, the surface tension of the fluid can be weakened by opening the electromagnetic on-off valve 57 and mixing the compressed air of the compressed air supply source 54 into the water via the pipe 56. .
[0025]
In this way, when the workpiece W is lifted from the surface of the suction holding chuck 22, the support conveyance mechanism 60 is operated to support the workpiece W and convey it to the cleaning means 34. That is, the air cylinder 66 of the operation mechanism 62 constituting the support conveyance mechanism 60 is operated to insert the insertion support member 61 between the surface of the suction holding chuck 22 and the workpiece W, and the electromagnetic of the fluid levitation mechanism 50. The on-off valve 53 is closed and the supply of water and compressed air to the recess 211 formed in the base 21 constituting the chuck table 20 is shut off. As a result, the workpiece W floated as described above is lowered and placed on the insertion support member 61. Then, a suction means (not shown) communicating with the suction holding hole 611 formed on the surface of the insertion support member 61 is operated to suck and support the workpiece W above the insertion support member 61. When the workpiece W is placed and supported on the insertion support member 61 in this way, the operating mechanism 62 is operated to swing the operating arm 64 about the support shaft 63, and the workpiece W is cleaned by the cleaning means 34. Transport to.
[0026]
As described above, the workpiece carry-out means 40 in the illustrated embodiment chucks the workpiece W when the plate-like workpiece W such as a ground semiconductor wafer is carried out from the chuck table 20. Since the insertion support member 61 is inserted between the surface of the chuck table 20 and the workpiece W and the workpiece W is placed and supported on the insertion support member 61, the workpiece W is levitated from the surface of the table 20. The workpiece W can be supported without being affected by the surface tension of water. Therefore, even when the semiconductor wafer is ground to a thickness of about 100 μm, it is possible to prevent the occurrence of cracks that occur when the wafer is unloaded from the chuck table 20.
[0027]
Next, another embodiment of a dropout prevention mechanism constituting the workpiece unloading means 40 will be described with reference to FIG. In addition, the same code | symbol is attached | subjected to the same member as embodiment shown in FIG. 2, and the description is abbreviate | omitted.
The dropout prevention mechanism 70a in the embodiment shown in FIG. 5 includes a regulating fluid ejection mechanism 80 that ejects fluid in an annular shape to the outside of the workpiece W held on the chuck table 20. The regulating fluid ejection mechanism 80 includes an annular recess 81 formed in the base 21 that constitutes the chuck table 20. The annular recess 81 is formed outside the recess 211 into which the suction holding chuck 22 described above is fitted, and an annular ejection member 82 made of porous ceramic is fitted into the annular recess 81. The annular recess 81 fitted with the ejection member 82 communicates with a water supply source 85 such as an accumulator through a communication path 83 and a pipe 84a provided in the base 21. The pipe 84a is provided with an electromagnetic on-off valve 86 that is controlled to be opened and closed by a control means (not shown). Further, the regulated fluid ejection mechanism 80 in the illustrated embodiment includes a compressed air supply source 87 such as an air tank, a pipe 84b in which the compressed air supply source 87 is connected to the pipe 84a by a pipe joint 88, and the pipe 84b. An electromagnetic on-off valve 89 that is disposed and controlled to open and close by control means (not shown) is provided.
[0028]
The restricting fluid ejection mechanism 80 in the embodiment shown in FIG. 5 is configured as described above. By opening the electromagnetic on-off valve 86 when the fluid levitation mechanism 50 described above is operated, the pipe 84a and the communication path are connected from the water supply source 85. Water is supplied to the annular recess 81 through 83. As a result, water is ejected onto the surface of the annular ejection member 82 made of porous ceramics fitted into the annular recess 81. Thus, by ejecting the fluid in a ring shape outside the workpiece W, the workpiece W lifted above the suction holding chuck 22 by the fluid floating mechanism 50 is restricted from moving in the horizontal direction. At this time, by opening the electromagnetic on-off valve 89 and mixing the compressed air of the compressed air supply source 87 into the water via the pipe 84b, the fluid jet output can be increased.
[0029]
【The invention's effect】
The grinding device according to the present invention is configured as described above, and has the following effects.
[0030]
That is, according to the present invention, when the plate-like workpiece after grinding is carried out from the chuck table, the workpiece is levitated from the surface of the chuck table by the fluid levitation mechanism, and the surface of the chuck table and the workpiece are separated. Since an insertion support member is inserted between the workpiece and the workpiece is placed and supported on the insertion support member, the workpiece can be supported without being affected by the surface tension of the cutting water. it can. Therefore, even if the wafer is extremely thin and ground like a semiconductor wafer, it is possible to prevent the occurrence of cracks that occur when the wafer is unloaded from the chuck table.
[Brief description of the drawings]
FIG. 1 is a perspective view of a surface grinding apparatus constructed according to the present invention.
2 is a schematic configuration diagram showing a chuck table and a fluid levitation mechanism provided in the surface grinding apparatus shown in FIG.
3 is a perspective view of a main part of a transport mechanism and a drop-off prevention mechanism of a workpiece carry-out means provided in the surface grinding apparatus shown in FIG.
4 is a perspective view of a principal part showing an operating state of a conveyance mechanism and a drop-off prevention mechanism of the workpiece unloading means shown in FIG. 4;
FIG. 5 is a schematic configuration diagram showing another embodiment of a drop-off prevention mechanism equipped in the surface grinding apparatus shown in FIG. 1;
[Explanation of symbols]
2: Device housing
4: Stationary support plate 4
6: Guide rail
8: Guide rail
10: Rough grinding unit
101: Unit housing
102: Grinding wheel
103: Rotation drive mechanism
104: Mobile base
105: Guided rail
11: Feed mechanism
111: Male thread rod
112: Pulse motor
12: Finish grinding unit
121: Unit housing
122: Grinding wheel
123: Rotation drive mechanism
124: Moving base
125: Guided rail
13: Feed mechanism
131: Male thread rod
132: Pulse motor
15: Turntable
20: Chuck table
21: Chuck table base
22: Chuck table suction holding chuck
25: Suction source
26: Electromagnetic on-off valve
31: First cassette
32: Second cassette
33: Workpiece placement section
34: Cleaning means
35: Workpiece conveying means
36: Workpiece carrying means
40: Workpiece unloading means
50: Fluid levitation mechanism
51: Water supply source
53: Solenoid valve
54: Compressed air supply source
56: Electromagnetic on-off valve
60: Support conveyance mechanism
61: Insertion support member
62: Actuation mechanism
64: Actuating arm
65: Slider
66: Air cylinder
70: Drop-off prevention mechanism
70a: Drop-off prevention mechanism
71: Support arm
72: Air cylinder
73: Restriction member
80: Controlled fluid ejection mechanism
82: Ejecting member
85: Water supply source
86: Solenoid valve
87: Compressed air supply source
89: Electromagnetic on-off valve

Claims (6)

A chuck table for holding a plate-like workpiece, a grinding means for grinding the plate-like workpiece held on the chuck table, and a plate-like workpiece after grinding from the chuck table In a grinding apparatus comprising a workpiece unloading means for unloading,
The workpiece unloading means is inserted between the surface of the chuck table and the plate-like workpiece, and a fluid levitation mechanism for ejecting fluid onto the surface of the chuck table to float the plate-like workpiece. And a support transport mechanism that transports the plate-like workpiece by placing it thereon,
A grinding apparatus characterized by that. The support transport mechanism includes an insertion support member that is inserted between the surface of the chuck table and the plate-like workpiece and places the plate-like workpiece, and an operation mechanism that operates the insertion support member. The grinding apparatus according to claim 1, comprising: The workpiece unloading means includes a drop prevention mechanism for preventing the plate-like workpiece lifted from the surface of the chuck table by the fluid floating mechanism from falling off the chuck table. The grinding apparatus as described. The drop-off prevention mechanism includes a regulating member that surrounds the outside of the plate-like workpiece held on the chuck table and regulates the plate-like workpiece so that the plate-like workpiece can float, and the regulating member is attached to the chuck table. An advancing and retreating mechanism that approaches or separates from the surface of the chuck table, and when the plate-like workpiece is levitated from the surface of the chuck table, the restricting portion is brought close to the surface of the chuck table and The grinding apparatus according to claim 3, wherein the workpiece is regulated so as to float. The grinding apparatus according to claim 4, wherein the restricting portion includes three fingers, and restricts the outer periphery of the plate-like workpiece by bringing the tips of the three fingers close to the surface of the chuck table. . The drop-off prevention mechanism includes a regulating fluid ejection mechanism that ejects fluid in a ring shape to the outside of the plate-like workpiece held on the chuck table, and the plate-like workpiece is removed from the surface of the chuck table. The grinding apparatus according to claim 3, wherein the fluid is ejected in an annular shape to the outside of the plate-shaped workpiece when the workpiece is floated.

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