JP2020029002A - Vacuum lamination system and vacuum lamination method - Google Patents

Abstract

To provide a vacuum lamination system or a vacuum lamination method in which ease of taking out a laminated molded product is taken into consideration while preventing a decrease in a yield of the laminated molded product due to misalignment of the laminated molded product with respect to a transport film.SOLUTION: A vacuum lamination system 11 for transporting a laminated molded article M into a chamber C of a vacuum laminating apparatus 12 using a transport film F1 to perform lamination molding, is provided with movement inhibiting unit forming means 38 for forming a movement inhibiting unit F4 at a position where it abuts or is close to a mounting portion F3 on which the laminated molded article M of the transport film F1 is mounted.SELECTED DRAWING: Figure 1

Description

The present invention relates to a vacuum laminating system and a vacuum laminating method for transporting a laminated molded product into a chamber of a vacuum laminating apparatus by using a transport film and performing lamination molding.

As a vacuum laminating system for transporting a laminated molded product into a chamber of a vacuum laminating apparatus using a transport film and performing lamination molding, there is known a vacuum lamination system described in Patent Document 1. In Patent Document 1, a transport film called a carrier film plays a role of transporting a laminated material and a molded product (hereinafter, these are referred to as a laminated molded product) to a laminated molding device. The laminated molded product can be supplied from a narrow space between the upper plate and the lower plate of the laminated molding device to a molding position in a chamber where the molding is performed without using a manual operation by using a transport film. Alternatively, even if the molten resin or the like has a property of flowing from the laminated molded product at the time of laminating molding, the molten resin or the like is vacuum laminated by sandwiching the laminated molded product between transport films provided above and below. There is also an effect of preventing the adhesive from adhering to a diaphragm or the like of the device.

Further, in a vacuum laminating apparatus using a transport film, a device described in Patent Document 2 is known in which a semiconductor is mounted on a wafer ring with a dicing tape and is loaded and unloaded by a transport film. In Patent Literature 2, the laminating apparatus includes a diaphragm on the upper plate side.

JP-A-2002-103439 (Claim 1, 0008, FIG. 1) Japanese Patent Application Laid-Open No. 2015-5709 (Claim 1, 0020, FIG. 1)

However, even in the method of directly placing and transporting a laminated molded article on a transport film as in Patent Document 1, a transport jig in which a molded article such as a wafer is stuck on a transport film as in Patent Document 2 (These are also collectively referred to as a laminated molded product). Even when the method is used, the transported film is moved from the start of moving the laminated molded product together with the transported film to the stop at the molding position in the chamber of the vacuum laminating apparatus. However, there is a problem that the laminated molded product may be displaced. Since the frequency of occurrence of the positional deviation increases when the transport speed of the transport film is increased, it is necessary to reduce the transport speed of the transport film when the positional deviation occurs, which has led to an increase in the molding cycle time.

Furthermore, even if the laminated molded product can be accurately stopped at the molding position in the chamber by transferring the transport film, the laminated molded product may be displaced from the molding position when the chamber is closed and brought into a vacuum state. is there. This is mainly caused by the vibration of the transport film due to the air flow generated when vacuuming the air in the chamber. Furthermore, in a vacuum laminating apparatus of the type using a diaphragm, there is a possibility that the laminated molded product is displaced from the molding position due to the expansion of the diaphragm at the start of pressurization. If pressure is applied by a pressing means such as a diaphragm in a state in which the laminated molded product is displaced from the accurate molding position in the vacuum laminating apparatus for the above reasons, the molding is assumed to be performed at the center. Since molding cannot be performed at a portion where uniform pressing can be performed, defective products increase (the yield of laminated molded products decreases).

As a countermeasure to these problems, it is conceivable that the laminated molded product is bonded to the upper surface of the transport film with an adhesive so as not to cause displacement. However, when the laminated molded product is adhered to the upper surface of the transport film with an adhesive, when the laminated molded product on the transport film is removed at the removal position after the pressure molding by the vacuum laminating apparatus, the laminated molded product cannot be peeled off properly. It is conceivable that they may be damaged or a large-scale unloading device is required.

In view of the above problems, the present invention provides a vacuum laminating system or a vacuum laminating method that prevents a decrease in the yield of a laminated molded product due to a displacement of the laminated molded product with respect to a transport film and also takes into consideration the ease of taking out the laminated molded product. The purpose is to do.

The vacuum lamination system according to claim 1 of the present invention is a vacuum lamination system in which a laminated molded product is transported into a chamber of a vacuum laminating apparatus by using a transport film to perform lamination molding. A movement blocking portion forming means for forming a movement blocking portion at a position in contact with or close to the mounting portion to be mounted.

According to a second aspect of the present invention, in the vacuum laminating system according to the first aspect, the movement preventing portion forming means includes a projection forming means provided with a suction device for locally sucking the transport film or a transport film. It is a projection forming means provided with a pressurizing device for applying pressure.

In a vacuum lamination system according to a third aspect of the present invention, in the first aspect, the movement preventing portion forming means includes a protrusion attaching means for attaching another member to the transport film or an upper transport film and a lower transport film. It is a temporary sticking means for temporarily sticking.

In the vacuum laminating method according to claim 4 of the present invention, in the vacuum laminating method in which a laminated molded product is transported into a chamber of a vacuum laminating apparatus by using a transport film to perform lamination molding, the laminated molded product and the transport film are directly bonded. The method is characterized in that the laminated molded product is prevented from moving in the horizontal direction with respect to the transport film without moving, and the transport film is moved to carry the laminated molded product into the vacuum laminating apparatus.

The vacuum laminating method according to claim 5 of the present invention is a vacuum laminating method in which a laminated molded product is transported into a chamber using a transport film to perform lamination molding, or before placing the laminated molded product on the transport film or On a mounting stage for mounting the laminated molded product on the transport film, a movement preventing portion is formed at a position in contact with or close to a mounting portion where the laminated molded product layer product of the transport film is mounted. .

The vacuum laminating system of the present invention is a vacuum laminating system in which a laminated molded product is transported into a chamber of a vacuum laminating apparatus by using a transport film to perform lamination molding. Since the movement inhibiting portion forming means for forming the movement inhibiting portion is provided at the position of contact or proximity, it is possible to prevent the yield from lowering due to the displacement of the laminated molded product with respect to the transport film.

It is the schematic of the vacuum lamination system of this embodiment. It is a figure showing an important section of a vacuum lamination system of this embodiment. It is the schematic of the vacuum lamination system of 2nd Embodiment. It is the schematic of the vacuum lamination system of 3rd Embodiment. It is a schematic diagram of a vacuum lamination system of a fourth embodiment. It is the schematic of the vacuum lamination system of 5th Embodiment.

The vacuum lamination system 11 of the present embodiment will be described with reference to FIGS. The vacuum laminating system 11 of the present embodiment transports the laminated material and the material to be laminated constituting the laminated molded article M to the molding position in the chamber C of the vacuum laminating apparatus 12 using the transport films F1 and F2. The lamination molding is performed at 12 molding positions. In the vacuum laminating apparatus 12, a chamber C capable of vacuum suction is formed when the upper plate 13 and the lower plate 14 are closed, and the elastic film 15 (such as silicon rubber) provided on at least one of the plates 13 and 14 is provided. The diaphragm made of heat-resistant rubber is bulged toward the other boards 14 and 13 in the chamber C, and the laminated molded product M is pressed and laminated.

More specifically, the lower plate 14 is opposed to the upper plate 13 so as to be close to and separated from the upper plate 13, and has a predetermined volume that can be evacuated by the vacuum pump 16 when the upper plate 13 and the lower plate 14 are closed. Is formed. Heatable heat plates 17 and 18 are attached to the lower surface of the upper plate 13 and the center of the upper surface of the lower plate 14, respectively. A frame-like side wall 19 is attached to a peripheral portion of the upper surface of the lower panel 14. An elastic film 15 (diaphragm) is attached between the lower surface of the side wall 19 and the lower plate 14 so as to cover the upper surface of the hot plate 18. The molding position at the center of the chamber C can be pressurized by the elastic film body 15 at a uniform pressure, but the pressure at the end of the chamber C may not be uniform. Further, the end of the chamber C may protrude from the upper and lower transport films F1 and F2 in some cases.

A pipeline is connected to the hot plate 18 and the like below the elastic film body 15, and can be switched to both the vacuum pump 16 and the compressor 22 for pressurization by opening and closing valves 20, 21 provided in the pipeline. ing. Therefore, when the pipe on the back side of the elastic film body 15 is connected to the vacuum pump 16, the elastic film body 15 is in close contact with the hot plate 18, and when connected to the compressor 22, the elastic film body 15 is in the chamber C Bulge in. The elastic film 15 and the compressor 22 constitute a pressurizing unit of the vacuum laminating apparatus 12. A side wall portion 23 is provided at a position facing the side wall portion 19 around the lower surface of the upper panel 13. An elastic film 24 made of heat-resistant rubber such as a silicon rubber film is adhered to the hot plate 17 of the upper plate 13.

An O-ring 25 is attached to the upper surface of the side wall portion 19 (the surface facing the upper plate 13) so as to surround the chamber C. A portion between one side portion of the side wall portion 23 of the upper plate 13 and one side portion of the side wall portion 19 of the lower plate 14 is a carry-in port through which the laminated molded product M is carried in together with the transport films F1 and F2. Further, a portion between the other side portion of the side wall portion 23 of the upper plate 13 and the other side portion of the side wall portion 19 of the lower plate 14 is transported in such a manner that the laminated molded product M which has been subjected to the pressure molding is carried out together with the transport films F1 and F2. Exit 27 is provided.

A chamber C formed between the upper plate 13 and the lower plate 14 when the lower plate 14 is raised (in FIG. 1, the lower plate 14 is described as a chamber C in a state where the lower plate 14 is lowered since FIG. The chamber C is formed closed) is connected to the vacuum pump 16 via a conduit 48 and an opening / closing valve 49. Note that the vacuum laminating apparatus 12 is not limited to the above as long as it can perform pressure molding of the laminated molded product M at a molding position in the chamber C capable of vacuum suction. As an example, a molded product may be laminated and formed by a pressurizing means using a combination of an elastic plate other than a diaphragm and a pressurizing cylinder in a chamber of a vacuum laminating apparatus. Alternatively, the laminated molded product M may be laminated and formed via the transport films F1 and F2 by a pressurizing unit using atmospheric pressure (including a relative pressure difference).

Next, a transfer device of the upper and lower transport films F1 and F2 and the laminated molded product M of the vacuum lamination system 11 will be described. The vacuum laminating system 11 includes a lower transport film F1 for carrying the laminated molded article M into the vacuum laminating apparatus 12 below one side of the vacuum laminating apparatus 12 (on the pre-process side and on the right side in FIG. 1). An unwinding roll 28 is provided. The unwinding roll 28 is driven and controlled by a servo motor (not shown). The transport direction of the lower transport film F1 unwound from the unwind roll 28 is changed by the driven roll 29 in the horizontal direction. A supply stage S1 for the laminated molded product M is provided at a portion where the lower transport film F1 is fed in the horizontal direction.

In the present embodiment, the stacked molded product M is placed on the placement portion F3 of the lower transport film F1 by the carry-in device 30 provided with a holding device such as a suction device at the supply stage S1. At this time, the laminated molded article M may be one in which a substrate or a semiconductor to be molded and a film as a laminated material are set from the beginning, or may be laminated at the supply stage S1. Alternatively, it may be one that is placed on a placement object such as a wafer ring as in Patent Document 2. In order to improve the accuracy of the mounting position of the laminated molded product M, it is also desirable to control the carry-in device 30 with a servomotor.

On one side of the vacuum laminating apparatus 12, above the portion between the vacuum laminating apparatus 12 and the supply stage S1, an unwinding roll 31 for the upper transport film F2 is provided. The unwinding roll 31 is also driven and controlled by a servo motor (not shown). The upper transport film F1 unwound from the unwind roll 31 is superimposed on the lower transport film F1 by the driven roll 32, and the transport direction is changed in the horizontal direction. The upper and lower transport films F1 and F2 are fed into the chamber C from the carry-in port 26 of the vacuum laminating apparatus 12 with the laminated molded product M interposed therebetween.

Above the other side of the vacuum laminating apparatus 12, a take-up roll 33 for the upper transport film F2 is provided. The take-up roll 33 is driven and controlled by a servo motor (not shown). Then, the upper transport film F2 coming out of the carry-out port 27 of the vacuum laminating apparatus 12 is separated from the lower transport film F1 by the driven roll 34, is transported upward, and is wound around the upper take-up roll 33. Taken. In the present invention, the upper transport film F2 is not indispensable, and a cover film larger than the laminated molded product M is put on each laminated molded product M on the laminated molded product M. Can achieve the purpose of preventing the adhesion.

Below the other side of the vacuum laminating apparatus 12, a take-up roll 35 for the lower transport film F1 is provided. The take-up roll 35 is driven and controlled by a servo motor (not shown). Then, the sheet passes through the carry-in port 26, the chamber C, and the carry-out port 27 of the vacuum laminating apparatus 12, and after the upper transport film F2 has been removed, the lower transport film F1 is transferred to the horizontal position. An unloading stage S2 for taking out the laminated molded product M to the outside is provided. Then, a carry-out device 36 having a suction tool is provided above the take-out stage S2, and the laminated molded product M is taken out to a subsequent process. Then, the direction of the lower transport film F1 is changed by the driven roll 37, and the lower transport film F1 is wound on the winding roll 35.

The unwind rolls 28, 31 and the take-up rolls 33, 35 of the transfer device are not limited to those driven by a servomotor, and may use other electric motors. A servomotor may be used only for driving the winding rolls 33, 35, and torque motors or the like may be used for the unwinding rolls 28, 31 for applying tension in the reverse direction. Further, the transfer device may be configured to accurately perform horizontal movement for one pitch by a device such as the chuck 7 of Patent Document 1, and in that case, the winding rolls 33 and 35 may not use a servomotor. .

Further, in the present embodiment, below the transport film F1 of the supply stage S1, a kind of protrusion forming means 38, which is a kind of movement preventing part forming means for forming a movement preventing part, is arranged. The protrusion forming means 38 prevents movement of the lower transport film F1 to a contact position around the mounting portion F3 on which the laminated molded product M is placed or to a nearby position where the movement of the laminated molded product alone can be restricted. The protrusion F4 is formed. As shown in FIG. 2, the projection forming means 38 includes a suction device 39 for locally sucking the lower transport film F1. The protruding portion forming plate 40 of the protruding portion forming means 38 has a flat surface portion 41 formed on the upper surface thereof, which is in contact with the lower transport film F1, and is provided at a position where the protruding portion F4 is provided around the end portion M1 of the laminated molded product M. Correspondingly, a plurality of circular concave portions 42 are formed. At the center of the bottom surface 43 of the concave portion 42, a needle-like or conical protrusion forming portion 44 is formed at a slightly lower height than the flat portion 41. A negative pressure suction hole 45 is provided on the bottom surface 43 of the concave portion 42 around the protrusion forming portion 44.

A plurality of positions where the concave portions 42 and the protrusion forming portions 44 are provided on the protrusion forming plate 40 are provided around the laminated molded product M according to the shape thereof. In the present embodiment, four points are provided for the laminated molded article M formed of one circular wafer for semiconductor. However, three to eight points may be provided. The present invention is preferably used because a semiconductor wafer needs to be uniformly pressurized and is light in weight and easily shifts during vacuum suction. In the case of simultaneously transferring 4 to 16 wafers or the like and laminating them, when the mounting position on the lower transport film F1 is moved, the pressure balance is different, or in the worst case, the wafers are overlapped. Therefore, the present invention is preferably used. When the laminated molded product M is a quadrangle, at least four, and preferably eight, projections F4 are provided. Further, the protrusion forming portion 44 may be a pyramid, or may be a protrusion having a long side and a short side. In the case of forming a projection, which is a type of projection, the shape of the recess 42 is naturally formed in a groove shape. In the case of forming a ridge on the lower transport film F1, the number may be smaller in many cases as compared with the case of forming a conical or pyramid-shaped protrusion, and in the case of surrounding the entire periphery, one ridge is provided. May be.

The protrusion forming plate 40 can be detachably fitted into a box-shaped suction box 46 in which an O-ring (not shown) is fitted on the inner periphery. The opening on the back surface side of the negative pressure suction hole 45 of the projection forming plate 40 is connected to the internal space of the suction box 46. A communication hole 47 is provided at a bottom portion of the internal space of the suction box 46, and the communication hole 47 is connected to the vacuum pump 16 via a conduit 50. An opening / closing valve 51 for turning on / off the vacuum suction, a vacuum regulator (not shown) for controlling the suction degree, and the like are arranged in the conduit 50.

A plurality of these protrusion forming plates 40 are prepared in accordance with the laminated molded product M to be molded, and one of them is used by fitting one of them into the suction box 46. Further, in the present embodiment, by providing the projection forming means 38 provided with the suction device 39 below the lower transport film F1, the upper portion of the transport film F1 of the supply stage S1 is opened for the loading device 30. And there is no interference between the two. Note that a means for heating the lower transport film F1 may be provided in the projection forming means 38, such as providing a heater on the projection forming plate 40, so that the transport film F1 can be easily deformed. Alternatively, the suction device 39 may be provided above the lower transport film F1, and the transport film F1 may be sucked from the hole to form the protrusion F4 upward.

Next, a vacuum lamination method of the vacuum lamination system 11 of the present embodiment will be described with reference to FIGS. First, at the supply stage S1, a projection F4, which is a movement preventing portion, is formed on the lower transport film F1 by using the suction device 39 of the projection forming means 38. At this time, first, the servo motor of the unwinding roll 28 is controlled to reduce the tension of the lower transport film F1. When the open / close valve 51 of the suction device 39 is opened and suction is performed, the transport film F1 is stuck to the flat surface portion 41 and a part thereof is sucked into the concave portion 42. However, as shown in FIG. 2, since the protrusion forming portion 44 is provided upright at the center of the concave portion 42, the sucked transport film F1 is in the state of FIG. 2A. At this time, as shown in FIG. 2A, when trying to form a sharp projection F4, a hole is often opened at the center of the tip. However, it is also possible to prevent the holes from being formed in the transport film F1 by reducing the height of the projection forming portion 44, making the top portion curved, or using the above-described heating means, and is appropriately selected.

Next, the tension of the lower transport film F1 is increased by controlling the servo motor of the unwinding roll 28 (see the arrow in FIG. 2B). Then, the concave portion of the lower transport film F1 is pulled to be substantially flat, and a conical projection F4 projecting upward as shown in FIG. 2B is formed. At this time, there is no problem even if a portion depressed from the flat surface remains around the projection F4.

Next, a circular wafer, which is a laminated molded product M, is placed by the loading device 30 on the placement portion F3 inside the projection F4 formed at four points of the lower transport film F1. At this time, it is needless to say that the mounting portion F3 of the transport film F1 and the laminated molded product M do not adhere to each other, but this is described just in case. In the present embodiment, for the sake of convenience, an example is described in which only one wafer is formed. However, when a plurality of laminated molded articles M are molded at the same time, each laminated molded article M on the lower transport film F1 is placed. A protrusion F4 is formed at a contact position or a proximity position around the placement position. In the present embodiment, the projection F4 is formed around the mounting portion F3 on the supply stage S1. First, the wafer, which is the multilayer molded product M, is mounted on the mounting portion F3, The projection F4 may be formed on the lower transport film F1. Alternatively, the placing of the transport film F1 on the lower side of the laminated molded product M on the placement portion F3 and the formation of the projection F4 on the transport film F1 may be performed substantially simultaneously.

In the vacuum laminating apparatus 12, during the formation of the protrusions F4 on the transport film F1 and the like, the laminated molded product M sent in advance is subjected to pressure molding. When the pressure molding is completed, the lower plate 14 is lowered and the chamber C is opened. Next, the servo motor of the take-up roll 35 of the lower transport film F1 is driven, and the lower transport film F1 on which the laminated molded product M is mounted on the supply stage S1 is moved to the chamber C of the vacuum laminating apparatus 12 on the other side. It is transferred to. At this time, the take-up roll 33 servo motor is also driven on the upper transport film F2. Then, from the portion of the driven roll 32, the upper transport film F2 is superimposed on the laminated molded product M on the lower transport film F1, and the upper and lower transport films F1 and F2 are loaded at the same speed at the entrance of the vacuum laminating apparatus 12. It is transferred to 26. At this time, the unwinding roll 28 of the lower transporting film F1 and the unwinding roll 31 of the upper transporting film F2 apply a torque in the direction of winding the rolls 28, 31 by a servomotor, and the upper and lower transporting films F1, F2 It is desirable to apply tension to

Then, when the upper and lower transport films F1 and F2 are moved by a predetermined distance and the laminated molded product M reaches the molding position of the chamber C of the vacuum laminating apparatus 12, the feeding of the upper and lower transport films F1 and F2 is stopped. Even when a force to move the laminated film M forward due to the inertial force acts when the lower conveying film F1 is stopped, a protrusion F4 is formed around the laminated film M on the conveying film F1. Is formed, the laminated molded article M abuts on the wall surface of the projection F4, and is prevented from moving. Further, the protrusion F4 also prevents the laminated molded product M from moving laterally or rearward due to a shock when the movement of the lower transport film F1 is stopped.

When the laminated molded product M is set at the molding position, the lower plate 14 is raised to form a chamber C between the lower plate 14 and the upper plate 13. The chamber C is sucked by the vacuum pump 16 and depressurized to a predetermined pressure (evacuated). Is done. At this time, as described in the section of “Problems to be Solved by the Invention”, the laminated molded article M may be displaced from the molding position due to the air current generated in the chamber C and the accompanying vibration of the transport films F1 and F2. However, in the present invention, the positional deviation is prevented by the projection F4 formed on the lower transport film F1. Similarly, displacement of the laminated molded product M due to swelling of the elastic film body 15 during pressurization is also prevented. In these cases, when the end M1 of the laminated molded product M and the end of the projection F4 are not in contact with each other at the beginning and are in a close position, the end M1 of the laminated molded product M contacts the end of the projection F4. Although it may move a small distance until it comes into contact, it is a movement of the distance within the mounting portion F3 that does not hinder the molding, and the state in which the multilayer molded product M is prevented from moving in the horizontal direction (the problematic position). (No deviation).

Then, when pressure molding is performed in the vacuum laminating apparatus 12 for a predetermined time, vacuum breaking in the chamber C is performed next, and then the lower plate is lowered and the chamber C is opened. The upper and lower transport films F1 and F2 are driven by the winding rolls 33 and 35 of the upper and lower transport films F1 and F2, and the laminated molded product M, which has been formed, is sent to the other side from the outlet 27 of the vacuum laminating apparatus 12. Then, the upper transport film F2 is peeled off at the portion of the driven roll 34, and the lower transport film F1 and the laminated molded article M are sent to the take-out stage S2 and stopped. Then, the laminate molding M is taken out by the carrying-out device 36.

Next, a vacuum lamination system 61 according to a second embodiment will be described with reference to FIG. In the second embodiment, the position and the structure of the projection forming means 62 are different from those of the embodiment of FIG. 1, but the other configurations are the same as those of the embodiment of FIG. Is omitted. In the second embodiment, a projection forming stage S0 is provided in a process before the supply stage S1. The projection forming means 62, which is a kind of the movement preventing part forming means, is composed of a pressing device for locally pressing the transport film F1. Specifically, the projection for forming a projection is formed from a conical rod having a curved surface, and the projection for forming a projection is formed from below the lower transport film F1 by pressing and pressing the lower transport film F1 upward from the back side. Is processed so that the projection F4 is formed toward the substrate. In the example of FIG. 3, the lifting board 66 is guided up and down by a guide rod 67 mounted on the base 64 by the operation of an actuator such as a cylinder 65 mounted on the base 64. The lifting plate 66 is provided with a plurality of protrusion forming portions 63 at a plurality of positions. When the laminated molded product M to be subjected to the lamination molding is changed, the entire lifting board 66 to which the projection forming section 63 is attached is changed, or the position of the projection forming section 63 on the lifting board 66 is changed.

A pressing plate 68 is disposed above the transport film F1 below the projection forming stage S0. The holding plate 68 has a hole 69 having a slightly larger cross-sectional area than the cross-sectional area of the protrusion forming portion 63 at a portion corresponding to the protrusion forming portion 63. Therefore, when the protrusion forming portion 63 is protruded upward by the operation of the cylinder 65 and the like, only the portion of the transport film F1 which is pressed by the protrusion forming portion 63, not the whole, is lifted upward. Has become. Note that the pressing plate 68 is not indispensable when the protrusion forming means 62 includes a heating means. In addition, as a modification of the example of FIG. 3, the upper transport film F2 is stacked, and then the protrusion forming portion 63 is projected upward from below the lower transport film F1, or downward from above the upper transport film F2. The projecting portion forming portion 63 may be protruded toward the projecting portion to form a projecting portion F4 which is a movement inhibiting portion. In any case, the projecting portion F4 is formed from the side where the laminated molded product M of the transport films F1 and F2 is not present to the side where the laminated molded article M is present.

Next, a vacuum lamination system 71 according to a third embodiment will be described with reference to FIG. In the third embodiment, the position and structure of the projection forming means 72 are different from those of the embodiment of FIG. 1, but the other configuration is the same as that of the embodiment of FIG. A description thereof will be omitted. In the third embodiment, a projection forming stage S0 is provided in a process before the supply stage S1. The protrusion forming means 72 is a pressing device for locally pressing the lower transport film F1, and a roll 74 provided with a protrusion forming portion 73 is provided below the lower transport film F1 with a servo motor (not shown). And the like. The position where the protrusion forming portion 73 on the outer periphery of the roll 74 is formed corresponds to the position where the protrusion F4 on the outer periphery of the mounting portion F3 of the laminated molded article M mounted on the transport film F1 is formed. . A roll 75 having an elastic body such as rubber or sponge wound around the roll 74 is also disposed above the roll 74 with the transport film F1 interposed therebetween. Note that a motor is not essential for the upper roll 75, and the upper roll 75 itself is not essential when the projection forming means 72 includes a heating means. During lamination molding, the roll 74 is rotated by the servomotor in synchronization with the lower transport film F1 being fed, and the protrusion forming portion 73 of the roll 74 bites the lower transport film F1 and the upper roll 75 To form a protrusion F4 from the lower side to the upper side. In the example of FIG. 4 as well, when the laminated molded article M is changed, the roll is changed to a roll corresponding to the outer peripheral position of the laminated molded article M.

Next, a vacuum lamination system 81 according to a fourth embodiment will be described with reference to FIG. In the fourth embodiment, the structure of the movement preventing portion forming means is different from that of the embodiment of FIG. 1, but the other configuration is the same as that of the embodiment of FIG. Description is omitted. In the fourth embodiment, the movement preventing portion forming means is the protrusion attaching means 82 for attaching another member to the lower transport film F1. Here, at least a plurality of nozzles 83 for supplying another member for the protruding portion are arranged around the suction cup 30a of the loading device 30 for the laminated molded product. An open / close valve (not shown) is provided in a pipeline 84 connected from the nozzle 83 to a tank (not shown). Alternatively, an extruding cylinder may be used depending on the type of the supplied separate member. The arrangement position of the nozzle 83 and the arrangement position of the suction cup 30a can be adjusted according to the shape of the laminated molded product M, or the entire arrangement of the projection attaching means 82 in which the nozzle 83 is fixedly provided can be replaced. ing. Note that the loading device 30 and the projection attaching means 82 may be separate devices.

When the projection M2 is formed on the lower transport film F1, the nozzle 83 of the projection attaching means 82 is moved from several millimeters to several tens of millimeters above the projection formation position around the laminated molded product M. By operating an open / close valve (not shown) or the like, another member is supplied onto the transport film F1 to form the protrusion M2 by adhesion. It is desirable that the separate member forming the protrusion M2 has a certain degree of viscosity or more and does not cause stringing from the nozzle 83. Further, it is desirable that the separate member be quick-drying or fast-curing in relation to the molding cycle. As an example, another member may use a thermoplastic resin in a molten state, or may be a material containing an ultraviolet curing agent and subjected to ultraviolet curing after supply. Although not limited to this, it is generally preferable to first supply another member from the nozzle 83 of the protrusion attaching means 82, wait for the curing of the protrusion F4, and then supply the laminated molded product M by the loading device 30. . As a modified example of the projection attaching means 82, a solid (having an adhesive layer on the lower surface side) may be attached to the lower transport film F1 to form the projection (movement inhibiting portion).

Next, a vacuum laminating system 91 according to a fifth embodiment will be described with reference to FIG. The fifth embodiment differs from the embodiment of FIG. 1 in that the movement preventing portion forming means is a temporary sticking means 92 and is not provided with a projection forming means, but other configurations are the same as those of the present embodiment of FIG. Therefore, the same reference numerals are used and the description thereof is omitted. In the fifth embodiment, the movement preventing portion forming means is temporary attaching means 92 for temporarily attaching the upper transport film F2 and the lower transport film F1. The temporary attaching means 92 is provided on an attaching stage S3 provided between the supply stage S1 and the vacuum laminating apparatus 12. Here, the temporary bonding means 92 includes a thermocompression bonding pin 93 having a built-in heater. The thermocompression bonding pins 93 are provided so as to be able to move up and down by a lifting device (not shown) from above toward the upper transport film F2. A receiving stand 94 is provided below the lower transport film F1, and the receiving stand may be heated by a heater. Then, when the laminated molded product M is placed on the mounting portion F3 of the lower transport film F1 and is sent to the attaching stage S3 in a state where the upper transport film F2 is overlaid and stopped, the thermocompression pins 93 are pressed. Is lowered, and the upper transport film F2 and the lower transport film of the peripheral portion of the laminated molded product M are melted and temporarily pasted (bonded) to the receiving stand 94. Note that the temporary attaching means 92 may be a laser irradiation device or the like.

Alternatively, an adhesive substance is arranged around the laminated molded product M of the lower transport film F1 in the previous step, and the upper and lower transport films F1 and F2 are heated, pressed, What adhere | attaches by ultraviolet rays etc. may be used. Due to the formation of the movement preventing portion M3 by the temporary bonding, the laminated molded product M is not directly bonded to the upper and lower transport films F1 and F2, but does not cause a positional shift. However, when the temporary bonding of the upper transport film F2 and the lower transport film F2 is too strong, the upper transport film F2 cannot be peeled off properly after lamination molding. Adhere slightly so as not to displace. In the examples of FIGS. 5 and 6, since no holes are formed in the transport film F1 or the like, there is no fear that the molten resin during lamination molding flows out of the holes into the chamber.

In all of the embodiments shown in FIGS. 1, 3, 4, and 5, the positions at which the protrusion forming means are provided are the positions of the stage before the supply stage S1, the supply stage S1, and the stage between the supply stage and the vacuum laminating apparatus 12. Either may be used. However, providing a projection forming means other than the supply stage S1 increases the total length of the vacuum lamination system. Therefore, it is desirable to provide a projection forming means on the supply stage S1 in terms of shortening the overall length of the apparatus.

The vacuum laminating system 11 and the like of each of the embodiments may be provided with another pressurizing device in a post process of the vacuum laminating device 12 and the like. The pressurizing device may be the same device as the vacuum laminating device 12 or the like, or may be a press device. In this case, with the movement of the lower transport film F1, the laminated molded product M sent to the pressurizing device is also prevented from being displaced by the projections F4, M2, etc., which are the movement inhibiting portions.

The transport films F1 and F2 used in the embodiments of FIGS. 1 to 6 are carrier films called PTH25. PTH25 is a 25 μm thick film made of polyethylene terephthalate, and its surface is subjected to mud treatment (rough surface processing). However, the present invention is applicable to all carrier films except PTH25. The present invention can also be applied to a device using a dry film in which an adhesive film is applied to a transport film. Further, the transport films F1 and F2 may be different types of transport films, and the lower transport film F1 may be a film of a material that easily forms the protrusion F4.

Since the position of the projection F4 on the transport film F1 below the end M1 of the laminated molded product M is different depending on the type of the laminated molded product M and the accuracy of the apparatus, it cannot be said unconditionally. That is, it is desirable to provide the projection F4 at a position where it comes into contact with the end M1 of the laminated molded product M (the end of the mounting portion F3) at the time of transfer, but the projection forming means and the loading device 30 for the laminated molded product M In addition, it is necessary to use a high-precision film transfer device. Alternatively, the possibility of a placement error of the laminated molded product M or a formation error of the projection F4 increases. Further, in the case where the end portion M1 of the laminated molded product M is in a molten state at the time of vacuum lamination molding, if a hole is opened in the projection F4 of the lower transport film F1, the molten resin enters through the hole and the diaphragm is stained. Is also conceivable. The opposite is true when the protrusion F4 is located close to the end M1 of the laminated molded product M but there is a distance between them.

When the laminated molded product M has, for example, a donut shape and a space in the center or a concave portion on the back side, the position where the projection F4 is provided on the transport film F1 is determined by the mounting portion F3 on which the laminated molded product M is placed. May be a position in contact with or close to the space on the central portion side or the end of the concave portion. This includes a case where a mounting jig such as a wafer ring described in Patent Document 2 is used and a projection F4 is provided at a position in contact with or close to the inner periphery thereof. Also in these cases, it corresponds to forming the projection F4 at a position where the movement of the laminated molded product alone can be restricted.

In the present invention, the heights of the projections F4 and M2 cannot be specified unconditionally because they differ depending on the laminated molded product M. However, for example, the height is preferably 0.1 mm or more and the plate thickness of the laminated molded product M or less. As shown in FIG. 2, the projections F4 and M2 are arranged such that, when viewed in cross section, the inclination angle of the wall F5 on the side of the laminated molded article M is set to the wall F6 on the side not facing the transport film F1 and the laminated molded article M. It is desirable to make it larger than the inclination angle. Alternatively, it is desirable to increase the inclination angles of all the side surfaces so as to be as close to vertical as possible. That is, when the inclination angle of the wall portion F5 is increased so as to approach the vertical, the ability to lock the laminated molded product M is increased, and it is possible to prevent the laminated molded product M from moving over the protrusions F4 and M2. .

The present invention will not be enumerated one by one, but the present invention is not limited to the above-described embodiment, and is modified by a person skilled in the art based on the gist of the present invention, and the respective parts of the above-described embodiment are combined. It goes without saying that the same applies to things.

11, 61, 71, 81, 91 Vacuum laminating system 12 Vacuum laminating device 38 62, 72 Projection forming means 39 Suction device 44, 63, 73 Projection forming part 82 Projection attaching means 92 Temporary sticking means C Chamber F1 Lower side Conveying film F2 Upper conveying film F3 Placement portions F4, M2 Projection M Laminated molded product

Claims (5)

In a vacuum laminating system in which a laminated molded product is transported into a chamber of a vacuum laminating apparatus using a transport film to perform lamination molding,
A vacuum laminating system, comprising: a movement inhibiting portion forming means for forming a movement inhibiting portion at a position abutting on or near a mounting portion of the transport film on which a laminated molded product is mounted. The movement preventing part forming means is a protrusion forming means provided with a suction device for locally sucking the transport film or a protrusion forming means provided with a pressing device for locally pressing the transport film. The vacuum lamination system according to claim 1. The said movement prevention part formation means is a protrusion attaching means which attaches another member to a conveyance film, or a temporary sticking means which temporarily sticks an upper conveyance film and a lower conveyance film, The Claim 1 characterized by the above-mentioned. Vacuum lamination system. In a vacuum laminating method of performing lamination molding by transporting a laminated molded product into a chamber of a vacuum laminating apparatus using a transport film,
Without directly bonding the laminated molded product and the transport film, the laminated molded product is prevented from moving in the horizontal direction with respect to the transport film,
A vacuum laminating method, wherein the transport film is moved to carry the laminated molded article into a vacuum laminating apparatus. In a vacuum laminating method in which a laminated molded product is transported into a chamber using a transport film and laminated and molded,
Before placing the laminated molded product on the transport film or on the mounting stage where the laminated molded product is placed on the transport film, abutting or approaching the mounting portion where the laminated molded product layer product of the transport film is placed. A vacuum laminating method comprising forming a movement preventing portion at a position.