JPH11320682A - Apparatus and method for vacuum laminating - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an apparatus and a method for vacuum laminating by eliminating bubbles or a wrinkle between an adhesive surface coating a film and a base plate. SOLUTION: The apparatus for vacuum laminating comprises a vacuum chamber 4 having opposed blocks 2, 3 approaching to and separating from one another, a heating means and a vacuum pressurizing means, a pair of guide rolls 5, 6 bridged over between a base material film 12 and a protective film 11, a sending unit for simultaneously sending the two films 11, 12 and a carrier film 15 for conveying a base plate 14, and a controller for controlling rotations of a base material roll 7 and a protective film roll 8 via the sending unit and controlling the heating means and the pressurizing means in such a manner that the two films are advanced together with the base plate while maintaining a separate point of the films 12 and 11 near an end of the plate 14, the film 11 is released from inside of the film 12 covering the plate 14 in the chamber 4, discharged out of the chamber 4, and the film 12 exposed at the adhesive surface and the plate 14 are heated and pressure bonded in the vacuum chamber.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a vacuum laminating apparatus and method for laminating a film on a substrate in a vacuum atmosphere by heating and pressurizing, and more particularly to a method for forming a photoresist on the surface of a printed wiring board. The present invention relates to a vacuum laminator apparatus and a method for laminating a film base material coated with a photosensitive resin adhesive on a substrate by applying heat and pressure to laminate layers.

[0002]

2. Description of the Related Art Conventionally, in order to integrate two stage materials, these stage materials are housed in a chamber, and then the chamber is evacuated by a vacuum source. There is a vacuum press device that heats and pressurizes a vacuum chamber by a platen. For example, in the case of manufacturing a printed wiring board, in order to protect an electric circuit on the board from etching, plating, soldering, etc., a film-like photoresist forming layer including a support film and a photosensitive layer is thermocompression-bonded to the substrate surface. There is a process.

[0003] The film used for this purpose is composed of an upper layer base film coated on one side with an adhesive surface of a photoresist forming layer, and a lower protective film for covering the adhesive surface. Therefore, in order to bond the film-like photoresist forming layer on the substrate using a vacuum press device, first, the protective film is separated from the film sent to the vacuum press device and the remaining film is formed on the remaining base film. The photoresist forming layer is exposed, and then the upper layer film is supplied into a vacuum press. In this manner, the photoresist forming layer has adhesiveness by being heated in a vacuum chamber, and is pressed and laminated on a circuit board.

Since the surface of such a circuit board on which the film-like photoresist forming layer is laminated has irregularities due to the circuit lines, the thickness of the photosensitive resin layer made of the photoresist is more than the thickness of the circuit lines. When the thickness is too small, a void in which bubbles and the like remain between the circuit board and the film-like photoresist formation layer is likely to be generated. The generated voids may expand during high-temperature processing in a later step, for example, in a molten solder bath or the like, and may damage the film-like photoresist forming layer, and may cause poor protection of the circuit configuration or poor insulation. There is.

Therefore, when laminating various films,
It is important that the film is placed on a substrate and laminated by heating and pressing under a vacuum atmosphere so as not to generate voids between the substrate and the film.

However, in a conventional vacuum laminating apparatus, for example, as disclosed in Japanese Patent Publication No. 55-13341, a film base material fed from a supply roll disposed outside the vacuum laminating apparatus is used in a vacuum chamber. Before being transported to the substrate, the cover sheet is peeled off and the surface of the photoresist forming layer is exposed to the outside air. Further, JP-A-63-295218 and JP-A-63-299
Similarly, in another conventional vacuum laminating apparatus disclosed in Japanese Patent Application Laid-Open No. 895-895, etc., similarly, the stage material corresponding to the photoresist layer is exposed to the outside, is under the influence of the surrounding environment, and dust and the like are adhered. I do.

[0007]

Further, in the conventional apparatus, since the volume to be evacuated is large and the degree of sealing in the vacuum chamber is low, the pressure cannot be reduced sufficiently. It is not possible to completely eliminate the defects that the substrate and the adhesive surface of the film are inadvertently partially contacted with each other, bubbles are mixed between them, and wrinkles are generated during lamination.

In view of such circumstances, the present invention provides a vacuum that stabilizes the state of lamination between an adhesive surface applied to a film and a substrate during lamination and prevents bubbles and wrinkles between the two. It is an object of the present invention to provide a laminating apparatus and a method therefor.

[0009]

In order to achieve the above object, the present invention provides a method for transporting a film supplied from a substrate roll in accordance with the direction of movement of a substrate on a substrate supply line, and removing the protective film from the film. Is a vacuum laminator device that heat-presses the substrate film and the substrate in a vacuum chamber where the adhesive surface is exposed, and is disposed so as to be able to face and close to each other in the middle of the substrate supply line, And a pair of blocks for forming an inlet and an outlet on the line, a heating means for heating the inside of the room, and a pressing means for depressurizing the inside of the room and holding the substrate and the film to apply a pressing force. A vacuum chamber equipped with a vacuum pressurizing means, disposed before the vacuum chamber and adjacent to the substrate supply line, one of which is overlaid with a film from the substrate roll, and the other is a protective film A pair of film guides for wrapping a protective film wound around the base film, and a feeder for advancing the base film and sequentially transporting a substrate placed on another film in accordance with the advancing operation. The device and the two films are moved forward with the substrate while maintaining the separation point between the base film and the protection film near the tip of the substrate, and the protection film is peeled from the inside of the base film covering the substrate in a vacuum chamber. And a control device for controlling the rotation of the substrate roll and the protective film roll together with the delivery device, and for controlling the heating means and the vacuum pressurizing means of the vacuum chamber. It is characterized by having.

In the vacuum laminating method of the present invention, when the mold of the vacuum chamber is opened, the film and a protective film separated from the film and wound on a protective roll film are passed over a pair of film guides. Another film for transporting the substrate and the base film, the step of connecting to a delivery device disposed on the exit side of the substrate supply line while passing through the vacuum chamber, in accordance with the transport of the substrate into the vacuum chamber, The base roll and the protective film roll are rotated together through the delivery device, and the separation point between the base film and the protective film is maintained near the front end of the substrate.
A step of advancing two films in the direction of movement of the substrate, and closing the mold in the vacuum chamber from a state in which the protective film is folded over the inside of the base film and the substrate in the vacuum chamber is covered with the base film and the protective film. A step of discharging the internal air from the suction port of the vacuum chamber after the mold is closed; and, during the evacuation step, only the protective film roll is reversely driven to protect the substrate covered with the base film from the substrate. The method is characterized in that the film is discharged to the outside of the vacuum chamber, and the bonding surface of the base film is heat-pressed on the substrate in the vacuum chamber.

According to the present invention, in the present invention, the protective film is folded between the substrate film and the substrate in the vacuum chamber, and when the mold is closed, the films are brought into close contact with each other at the entrance and exit of the substrate. Since they are combined, the protective film is completely covered with the base film and the substrate.

As a result, the protective film is peeled off and separated in the vacuum chamber and in the closed space between the base film and the substrate, and the bonding surface of the base film bonded to the substrate is exposed. Therefore, there is no external influence,
The base film from which the protective film has been separated is adhered on the substrate by an even pressing force in a vacuum chamber and laminated.

[0013]

Embodiments of the present invention will be described with reference to the drawings. FIG. 1 shows a vacuum laminator device 1 according to the present invention, in which a vacuum chamber 4 surrounded by upper and lower block bodies 2 and 3 facing and separated from each other is provided with a substrate supply line A.
Placed on top.

Film 10 for supply to vacuum chamber 4
Consists of an upper substrate film 11 on which an adhesive surface of a photoresist layer is applied, and a lower protective film 12 for protecting the photoresist layer. The film 10 is unwound from the substrate roll 5 and is wound over one roll 6 of a pair of film guides 6 and 7 provided in the preceding stage of the vacuum chamber 4. The protective film 12 separated at the separation point P between the film guides 6 and 7 is wound around the other film guide 7 and wound on the protective film roll 8. As shown in FIG. 1, the film guide is usually composed of adjacent rollers. However, the film guide may be of any type as long as it guides the film.

The film from which the protective film 12 has been peeled is
The substrate film 11 with the adhesive (photoresist forming layer) adhered thereto, passed through the vacuum chamber, extended along the substrate supply line A, discharged from the outlet of the vacuum chamber 4, and disposed behind the vacuum chamber 4. The leading end of the base film 11 is gripped by a known sending means (not shown). Further, a carrier film 15 for transporting the substrate 14 sequentially supplied into the vacuum chamber passes through the vacuum chamber, and
Is wound around a feed roll 16 and a take-up roll 17 of the carrier film 15 which are respectively arranged in front and rear of the carrier film 15. Each of these rolls is driven in one of the rotation directions by one or a plurality of driving means (not shown). These two rolls and drive means constitute a transport means. It is also possible to configure the transporting means and the sending means as one sending device, and these means are connected to a control device (not shown) for controlling the operation of the entire apparatus.

In FIG. 2, the configuration of the vacuum chamber 4 is divided into two block bodies 2 and 3, and one upper block body 2 is placed inside an upper frame 21 in order from the outside and an upper surface plate. 2
2, a heater 23, two layers of heat insulating materials 24, 24 are laminated, and a suction port 25 is opened at the center of the upper frame 21. The heat insulating material 24 has a plurality of grooves formed in the upper and lower layers of the heat insulating material, each of which extends in the vertical direction or the horizontal direction.
6 are formed. There is a gap between the heat insulating material 24 and the inner surface of the upper frame 21 to form an air passage. Further, the air inside the vacuum chamber is exhausted through the suction port 25 through the opening hole provided in the heater 23 and the lattice groove 26 of the heat insulating material 24. The upper surface plate 22 is tightly fixed to the upper frame 21 via an intermediate member such as a heater and a heat insulating material.

The other lower mold block 3 has a structure in which a membrane 32, a perforated plate 33, a lower platen 34, a heater 35, and a heat insulating material 36 are sequentially laminated from the outside inside a movable lower frame 31, A suction port 37 is opened at the center of the lower frame 31. Further, the heater 35 transmits heat to the lower platen 34, the perforated plate 33, and the membrane 32. Normally, the film 32 made of rubber is for pressing the substrate 14 from below by a negative pressure generated by the pressure difference between the suction ports 25 and 37.
Is sandwiched between a lower plate 38 of the divided lower frame 31 and a frame body 39 fixed thereon.

Here, the film body 32 is made of, for example, silicon rubber having at least heat resistance and elasticity and a rubber hardness Hs.
Are used. However, the membrane 3
Since 2 may be any material having a property rich in flexibility and elasticity, a film made of a synthetic resin can be used in addition to the rubber material.

The two block bodies 2 and 3 can be moved up and down relatively by known lifting means (not shown). As the block body, for example, the lower mold block body 3 may be fixed, and only the upper mold block body 2 may be moved up and down. The heaters 23 and 35 as heating means transmit heat to the upper stool 22 or the lower stool 34, respectively, and block the transfer of heat to the upper frame 21 and the lower frame 31 by the heat insulating materials 24 and 36. Further, the suction ports 25 and 37 are connected to suction / pressurizing means such as a vacuum pump (not shown) via hoses, and air is discharged when the vacuum chamber is evacuated.

With such a configuration, the upper block 2
The lower block body 3 and the lower block body 3 form a vacuum chamber 4 in which both or one of them is approached or separated from the other by the elevating means, and the chamber is opened and closed. Here, the number of the suction ports 25 and 37 is one at the center, but a plurality of suction ports may be arranged at predetermined positions.

As described above, the film 10 to be laminated on the substrate 14 is supplied from the base roll 5 and is separated at the separation point P through a pair of guide rolls (film guides) 6 and 7. 11 and protective film 12
The base film 11 is pressed down by the upper surface of the upper frame and descends by closing the molds of the blocks 2 and 3, so that the protective film 12 enters the vacuum chamber 4 near the separation point P. The substrate 14 can approach or be in close contact with the tip of the substrate 14.

The base film 11 having an adhesive surface
Passes through the vacuum chamber covering the substrate 14, extends along the substrate supply line A, and is sent out from the outlet of the vacuum chamber 4 together with the carrier film 15 for transporting the substrate.

The feeding of the base film 11 is performed by sending means having a chuck portion (not shown). The substrate roll 5 and the carrier film roll 16 arranged on the input side are provided with brakes, respectively, when the substrate product to be sequentially formed is pulled by the sending means or the carrier film take-up roll 17 on the output side. To
The tension between the base film 11 and the carrier film 15 is maintained. The base film 11 has an adhesive surface coated with an adhesive opposed to the upper surface of the substrate, is separated from the upper surface plate 22, and is stretched in a state of floating from the substrate 14.

In this embodiment, the photoresist forming layer is applied only to one of the base film surfaces 11a (see FIG. 2). In addition to the base film 11, the lower carrier film 15 can be coated with a photoresist forming layer with a protective film. In this case, another pair of guide rolls similar to the pair of guide rolls 6 and 7 provided on the side of the upper mold block 2 are arranged on the side of the lower mold block 3 instead of the feeding roll 16.

Next, the film used in the vacuum laminator 1 of the present invention will be described. The film 10
With a configuration in which an adhesive containing a photosensitive resin is sandwiched between two-layer films, that is, a base film 11 (PET) and a protective film 12 (PET), the protective film 12 can be easily peeled off. . The photoresist forming layer of the photosensitive resin applied to the base film 11 is usually formed by removing the unexposed or exposed portions of the resist layer after pattern exposure by UV irradiation, thereby forming a photoresist pattern. Having a layer, and in the vacuum chamber 4,
The substrate film 11 is attached to the upper surface of the substrate by being heated and pressurized by heating means by heaters 23 and 35 and suction means by a vacuum pump, facing the substrate surface.

The photoresist layer usually has a laminated structure in which one surface is covered with a support film such as polyester and the other surface is desirably covered with a protective film such as a PET film. And protective film 1
2 is peeled and separated. In particular, the reason why the PET film is used as the protective film is that it has low elongation and good slippage. When the mold of the vacuum chamber is closed, the protective film 12 is folded over the substrate through the entrance of the vacuum chamber. Ideal for extracting. Further, the photoresist layer is made of a photocurable material acting as a negative film, or a photo-soluble or photo-desensitizing material acting as a positive film, and any of these photosensitive materials can be employed. .

The present invention is not limited to laminating a film-like photoresist forming layer on the substrate 14, but may include other film-like materials such as thermoplastic or thermosetting resin films. Alternatively, the present invention can be applied to bonding these films to a substrate, for example, a sheet made of a wood plate, a metal plate, an organic material, an inorganic material, or a composite material. As described above, lamination to a substrate can be performed on one side or both sides.

As shown in FIGS. 3 (a) and 3 (b), an inlet 41 of the vacuum chamber 4 through which such a film passes is provided.
The upper block 2 is provided with a concave portion 43 having a cutting depth H, the width of the concave portion being the maximum length within the dimensions of the side of the vacuum chamber, and the cutting depth H is determined by the base film 11 and the protective film. 12 is supplied into the vacuum chamber, and the blocks 2, 3
The depth is determined so that only the protective film can be easily taken out when the mold is closed. Therefore, this depth H
Is the distance S from the bottom surface of the upper frame 21 to the surface of the upper surface plate 22.
The dimensions are about 1 mm and the film thickness is about +0.5 mm.

An O-ring 45 is fitted around the upper surface 3a of the lower block 3 to enhance the sealing of the vacuum chamber 4. This ring material is protective film 1
In order to reduce the resistance at the time of extracting 2, a single-cell sponge is preferable, and when heat resistance is taken into consideration, silicon or fluorine rubber is used. When a large display panel or a thick plate is laminated, the upper surface 3a of the lower block 3 is used.
Is set to the same level as the surface of the film body 32 in the lower frame 31 to prevent the plate from fluttering.

Next, a procedure for laminating a film on a substrate surface using the vacuum laminator of the present invention will be described. 4 and 5 show the respective steps excluding the vacuum chamber 4 arranged on the substrate supply line A.

First, in a state where the vacuum chamber 4 is open, the film 10 including the photoresist forming layer is unwound from the substrate roll 5 and is hung over the guide roll 6, and the separation point P between the guide roll 7 and the adjacent guide roll 7 is set. In the protective film 12
Are peeled and separated, and only the substrate film 11 is
The leading end of the base film 11 is gripped by the delivery means (not shown) on the outlet side through the inside. This base film 11
Is coated with a photoresist forming layer (adhesive) on one side, and when the protective film 12 is peeled off, the photoresist layer is exposed on the lower surface of the remaining base film 11. The peeled protective film 12 is wound around another guide roll 7 and wound around the protective film roll 8.

In addition, a carrier film 15 for transporting the substrate 14 separately is stretched between rolls 16 and 17 for the carrier film disposed in front and rear of the vacuum chamber 4 to be placed on the substrate supply line. Extending along. The carrier film 15 is provided such that substrates 14 as workpieces are placed thereon at predetermined intervals and can be sequentially conveyed into a vacuum chamber. In this state, the base film 11 and the carrier film 15 extend in parallel at a predetermined distance apart from each other.
It is in a state of floating from the upper surface of the. Then, the blocks 2 and 3 are brought close to each other from the mold opening state to temporarily close the mold of the vacuum chamber 4. The process so far is the preparation stage.

At the time of closing the mold, at the entrance 41 and the exit 42 of the vacuum chamber 4, the upper substrate film 11 from which the adhesive surface is exposed is provided.
Since the base film 11 and the lower carrier film 15 are aligned with each other, the adhesive surface of the base film 11 floating from the upper surface of the substrate adheres to the surface of the carrier film 15 in a substantially contact state or securely in close contact. For this reason, at the entrance side when the mold is closed, the guide rolls 6 and 7 are moved from the state where the base film 11 and the carrier film 15 are separated and parallel as shown in FIG.
Each of the upper films 11 and 12 is pulled downward, and after the mold is opened, the protective film 12 is just attached to the tip of the substrate located therebelow, as shown in FIG. It becomes a form that can be placed on the substrate in close proximity.

From this mold open state, the control device activates the delivery device (conveying means and delivery means) to advance the base film 11 and the carrier film 15 simultaneously. As a result, the state shifts to the transfer state shown in FIG. 4B, and the substrate 14 is transferred into the vacuum chamber by the carrier film 15, and the substrate roll 5 and the protective film roll 8 are shared in synchronization with the transfer of the substrate. By the rotation, the base film 11 and the protective film 12 advance. In this step, the protective film 12 moves in the forward direction of the film together with the substrate 14 entering the vacuum chamber along with the base film 11, so that the base film 11 and the protective film 12 are separated during the transport of the film. The point P moves together with the substrate 14 while being maintained near the tip of the substrate 14.

In the present embodiment, as the sending device, the sending means and the conveying means are provided behind the outlet side of the vacuum chamber, but the sending device is not limited to this, and the two films 12 and 1 are provided.
Any means may be used as long as it is a means for advancing the carrier film 1 and the carrier film, and may be configured as a drive device for rotating each roll itself in order to pay out these films.

Then, as shown in FIG. 5 (a), when the entire substrate has moved to a predetermined position in the vacuum chamber, the operation of the sending device is stopped by the control device, and the transfer is completed. When the transfer is completed, the protective film 12 is folded inside the base film 11. After the completion of the transfer, a mold closing operation of the vacuum chamber 4 is started, and a vacuum pump (not shown) is operated to evacuate the vacuum chamber. In this vacuum step, air is discharged from both suction ports 25 and 37 of the two block bodies in a vacuum chamber heated by a heater in advance. Then, under a pressure reduced to a predetermined degree of vacuum, only the protective film roll 8 is reversed by the control device.

As a result, the protective film 12 is
As shown in (b), in the space surrounded by the substrate 14 and the substrate film 11, the substrate 14 is separated from the inside of the substrate film 11 covering the substrate while being separated, and is approached to the inlet side of the vacuum chamber 4, The protection film 12 is discharged from the vacuum chamber to the outside, and is wound around the protection film roll 8. Further, when the protective film 12 is completely discharged to the outside, the rotation of the protective film roll 8 is stopped by the control device.

In the step of winding the protective film,
The substrate 14 is completely covered by the upper substrate film 11 and the lower carrier film 15 and
Since the two films are combined at the position of the entrance and the exit of 4, the entrapment of air bubbles between the film and the substrate can be prevented even with a highly adhesive film. In addition, the substrate and the base film are kept parallel in the vacuum chamber by a predetermined vacuum pressure, and a space is maintained between the base film and the substrate, so that the exposed adhesive surface is partially formed on the substrate. Without touching, generation of wrinkles during thermocompression bonding can be prevented.

Next, the molding process is started, and the suction port 25 is formed.
Continues suction, while the suction port 37 draws in air or pressurized air to expand the film body 32 upward, and presses the substrate 14 against the upper surface plate 22 with a uniform pressure, thereby forming a vacuum chamber. The adhesive surface of the base film 11 is thermocompression-bonded on the substrate, and the base film 11 is stuck to and adhered to the substrate 14 to complete the laminating process.

Thus, a series of steps, ie,
The substrate 14 can be continuously laminated by repeating the steps of opening the mold, starting the transfer, completing the transfer, closing the mold, evacuating, winding the protective film, and forming.

[0041]

As is apparent from the above description,
According to the present invention, both the base film and the protective film are sent into a vacuum chamber, and in this vacuum chamber, under a predetermined pressure at which the adhesive surface does not adhere to the substrate, inside the base film covering the substrate. Since the protective film can be peeled off and discharged to the outside of the vacuum chamber, no bubbles are trapped between the film and the substrate, and wrinkles can be prevented.

[Brief description of the drawings]

FIG. 1 is a schematic diagram showing a vacuum laminator device according to the present invention.

FIG. 2 is an enlarged sectional view showing the structure of the vacuum chamber of the apparatus of FIG. 1 in an enlarged manner.

FIG. 3 shows an inlet portion of a vacuum chamber according to the present invention;
(a) is a sectional view showing a cut depth of an inlet portion in a vacuum chamber, and (b) is a perspective view showing an outer shape thereof.

FIG. 4 is a schematic view showing each step for explaining a vacuum laminating method according to the present invention, in which FIG. 3 (a) shows each state during mold opening and 3 (b) shows each state during transport.

FIG. 5 shows a step subsequent to FIG. 4; 4 (a) indicates the completion of conveyance, mold closing, in vacuum; 4 (b) indicates winding of the protective film;
(c) is a schematic diagram showing when molding and opening the mold.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Vacuum laminator apparatus 2, 3 Block body 4 Vacuum chamber 5 Base roll 6, 7 Guide roll (film guide) 8 Protective film roll 10 Film 11 Base film 12 Protective film 14 Substrate 15 Carrier film 17, 18 Roll 23, 35 heater 25, 37 suction port

Claims (5)

[Claims] A film supplied from a substrate roll is transported in accordance with a moving direction of a substrate on a substrate supply line, a protective film is separated from the film, and the substrate film and an adhesive surface are exposed. A vacuum laminator device that heat-presses in a vacuum chamber, comprising a pair of block bodies that are arranged in the middle of the substrate supply line so as to be able to approach and separate from each other and that form an inlet and an outlet on the line. A vacuum chamber having heating means for heating the chamber, vacuum means for reducing the pressure in the chamber, and holding the substrate and the film to apply a pressing force; Is disposed adjacent to the substrate supply line, one is over the film from the substrate roll, the other, over the protective film wound around the protective film roll. A pair of film guides, advancing the base film, and a delivery device that sequentially conveys a substrate placed on another film in accordance with the advancing operation, and the base film near the front end of the substrate. The substrate roll for advancing the two films together with the substrate while maintaining the separation point of the protective film, peeling the protective film from the inside of the substrate film covering the substrate in the vacuum chamber, and discharging the protective film outside the vacuum chamber. And a controller for controlling the rotation of the protective film roll together with the delivery device and for controlling the heating means and the vacuum pressurizing means of the vacuum chamber. A feeder for feeding a film on which a substrate is placed along a substrate supply line; and a feeder for gripping one end of the base film and covering a part or the whole of the substrate. 2. A vacuum laminator apparatus according to claim 1, further comprising a delivery means moving along a line. 3. The control device drives the delivery device to transfer the substrate roll and the protective film roll during the transfer of the substrate, and stops the drive of the delivery device when the mold of the vacuum chamber is closed. 3. The vacuum laminator according to claim 1, wherein only the protective film roll is driven in reverse. 4. A film of a transporting means for transporting a substrate includes an adhesive between a base film and a protective film, like the film supplied on the upper surface of the substrate, and both surfaces of the substrate can be laminated. Claims 1 to 3
The vacuum laminator device according to any one of the above. 5. A substrate film, which is fed from a substrate roll in accordance with a moving direction of a substrate on a substrate supply line, separates a protective film from the film, and exposes an adhesive surface between the substrate film and the substrate. And vacuum lamination by heating and pressing in a vacuum chamber, wherein when the mold of the vacuum chamber is opened, the film and a protective film separated from the film and wound on a protective film roll are hung on a pair of film guides. Passing, another film for transporting the substrate and the substrate film, passing the substrate film into a vacuum chamber and connecting the substrate film to a delivery device arranged on an exit side of the substrate supply line; and transporting the substrate into the vacuum chamber. At the same time, the substrate roll and the protective film roll are rotated together via the delivery device, and the separation point between the substrate film and the protective film is maintained near the front end of the substrate. While, the step of advancing the two films in the direction of movement of the substrate, the protective film folding on the inside of the base film,
A step of closing the mold of the vacuum chamber from a state in which the substrate film and the protective film cover the substrate in the vacuum chamber; a step of discharging the internal air from a suction port of the vacuum chamber after closing the mold; During the drawing step, a step of driving only the protective film roll in the reverse direction to discharge the protective film from the substrate covered with the base film to the outside of the vacuum chamber, and heating the adhesive surface of the base film on the substrate in the vacuum chamber A method comprising crimping.