JP2007098619A - Film lamination method and lamination device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a film lamination method which can properly control the generation of wrinkles when the film is laminated on a thin material by roller rolling and a lamination device. <P>SOLUTION: An insulating substrate W is arranged on the upper surface of clean paper 22 which is permeable and has higher elasticity in the thickness direction than that of the substrate (thin material) W. The clean paper 22 is mounted on a flat surface after the arrangement of the substrate W, and evacuation is carried out from the back side of the substrate W arrangement surface of the clean paper 22. During the evacuation, the clean paper 22 and the substrate W are fixed to each other with adhesive tapes 41 and 42. After the fixing with the adhesive tapes 41 and 42, protective films 63 are laid on the upper surface of the substrate W to overlap each other, and the protective films 63 are roller-rolled and laminated on the substrate W. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a method for laminating a film on a thin material, and an apparatus for laminating the same.

  In recent years, in order to meet the demand for higher functionality of products, circuit boards mounted on products have been further multilayered and circuit patterns have been miniaturized. For example, Patent Document 1 describes a multilayer circuit board formed by laminating a plurality of resin films each having a circuit pattern made of copper foil or the like on one side.

The production of this multilayer circuit board is roughly divided into the following steps 1. -Step 6. Done through.
1. A conductor film such as a copper foil is attached to one surface of the thermoplastic resin film 100, and the conductor film is etched to form the circuit pattern 101 (FIG. 4A).
2. The protective film 102 is laminated on the back surface of the circuit pattern forming surface of the resin film 100 (FIG. 4B). The protective film 102 is formed of a resin such as PET (polyethylene terephthalate), and one surface thereof is coated with an ultraviolet curable adhesive. The protective film 102 is formed to be slightly larger than the resin film 100 so as to reliably cover the entire upper surface of the resin film 100 regardless of the displacement of the overlapping position.
3. The resin film 100 is irradiated with laser light from the protective film 102 side to form a via hole 103 that penetrates the resin film 100 and reaches the circuit pattern 101 (FIG. 4C).
4). A conductive paste 104 is filled into the formed via hole 103 (FIG. 4D). Thereby, the base material 105 which comprises each layer of a multilayer circuit board is formed. The conductive paste 104 is a paste obtained by adding an organic solvent to metal particles such as tin and silver and kneading them with a mixer.
5. Step 1 above. -Step 4. The protective film 102 is peeled from the resin film 100 after irradiating the surface on the protective film 102 side of the base material 105 formed through the ultraviolet ray to reduce the adhesive strength of the adhesive material (FIG. 4E) .
6). A plurality of base materials 105 from which the protective film 102 has been peeled are overlapped, and the upper surface side and the lower surface side are sandwiched between cover layers 106a and 106b made of a thermoplastic resin material, and then heated and pressurized by a vacuum heating press (FIG. 4). (F)). As a result, the base material 105 and the cover layers 106a and 106b are integrated by thermal fusion, and the conductive paste 104 in the via hole 103 is sintered and integrated into the conductive composition 107. A multilayer circuit board is formed in which the circuit pattern 101 is electrically interconnected by the conductive composition 107.

Generally, in the above step 2. Lamination of the protective film 102 to the resin film 100 is performed using a roller rolling apparatus as shown in FIG. This roller rolling device includes two rollers 110 and 111 pressed against each other, and is configured to press the protective film 102 against the resin film 100 by passing between them.
JP 2004-127970 A

  By the way, in recent years, due to the demands for multilayering and circuit pattern miniaturization as described above, the base material 105 constituting each layer of the multilayer circuit board has been further thinned, and the thickness of the substrate is extremely 50 μm or less. A multilayer circuit board using a thin base material 105 has come into practical use. However, with the thinning of the base material 105, the occurrence of wrinkles on the base material 105 during the following roller rolling has become a problem.

  As shown in FIG. 6, the load p acting on the base material 105 during the roller rolling has a biased distribution concentrated on both sides of the resin film 100 having a thickness difference. Therefore, a stress σ that compresses both side portions toward the center portion is generated in the cross section during rolling of the base material 105.

  On the other hand, the contact surface between the resin film 100 and the roller 110 is not close to the entire surface due to the unevenness of the circuit pattern 101, and the resin film 100 slides on the surface of the roller 110 relatively easily. Further, it is difficult for the thin base material 105 having a thickness of 50 μm or less as described above to hold itself flat against the compression due to the stress σ only by its own rigidity. Therefore, wrinkles as shown in FIG. 7 are relatively easily generated in the resin film 100 during the roller rolling due to the compression force, which is a major factor that causes a deterioration in yield.

  The occurrence of wrinkles at the time of roller rolling is not limited to the laminating process of the resin film 100 constituting the base material 105 of the multilayer circuit board as described above, but a material that is so thin that it cannot be held flat only by its own rigidity. When the film is laminated on the surface of the (thin material) by roller rolling, it can occur similarly.

  The present invention has been made in view of such circumstances, and an object of the present invention is to provide a film laminating method and a laminating method that can suitably suppress generation of wrinkles when laminating a film on a thin material by roller rolling. It is to provide a processing apparatus.

  In order to achieve such an object, in the invention described in claim 1, as a method of laminating a film on a thin material, the sheet has air permeability and has a higher elasticity in the thickness direction than the thin material. A step of disposing a thin material, a step of placing the sheet material after the disposition of the thin material on a flat surface, and a vacuum suction from the back side of the disposition surface of the thin material in the sheet material; , A step of fixing the sheet material and the thin material with an adhesive tape during the vacuum suction, and a step of rolling the film on the upper surface of the thin material after fixing the adhesive tape and then rolling them. And so on.

  According to such a method, since the thin material is disposed on the upper surface of the air-permeable sheet material, at the time of vacuum suction, the suction force also acts on the thin material through the sheet material. Both the sheet material and the thin material are adsorbed on the flat surface. At this time, even if the thin material has irregularities, the thin material and the sheet material are in close contact with each other due to the elasticity of the sheet material. Then, after the thin material and the sheet material are fixed by the adhesive tape in such a close contact state, the film is superposed on the upper surface of the thin material and is rolled. That is, the roller rolling is performed in a state where the adhesion between the sheet material and the rolling roller and the integrity of the thin material and the sheet material by the adhesive tape are both maintained. For this reason, even during roller rolling, the thin material can be held flat against the compressive force due to the uneven load distribution during roller rolling as described above, and when the film is laminated on the thin material by roller rolling. The generation of wrinkles can be suitably suppressed.

  Further, in the film laminating method according to claim 1, as in the invention according to claim 2, the adhesive tape is attached along two opposing sides of the thin material formed in a rectangular shape. If attached, the thin material can be securely fixed by the sheet material.

  Moreover, as a sticking direction of the said adhesive tape in the laminating method of the film of Claim 1 or Claim 2, as the invention of Claim 3, and the direction orthogonal to the supply direction of the said roller rolling, It is desirable to do. In this way, since it is possible to avoid an increase in the local thickness of the rolled section due to the thickness of the adhesive tape, it is possible to more suitably prevent the occurrence of wrinkles when laminating a film on a thin material. Will be able to.

As the sheet material, for example, clean paper can be used as in the invention described in claim 4.
On the other hand, the method for laminating a film according to any one of claims 1 to 4 has a circuit pattern formed on one surface thereof as described in claim 5 and an insulating group constituting one layer of the multilayer circuit board. By adopting the material for laminating, particularly remarkable effects can be obtained. That is, the insulating base material of such a multilayer circuit board is formed to be very thin in order to meet the recent demand for multilayering and miniaturization of circuit patterns. For this reason, it is very difficult to maintain flatness due to the rigidity of the insulating base material itself, and there is a very high probability that wrinkles will occur when a protective film is applied to the insulating base material. Can not be ignored. Therefore, if the above-described film laminating method is adopted, generation of wrinkles of the insulating base material and the protective film during roller rolling is suitably suppressed, and the effect is great. If clean paper is used as the sheet material as in the invention described in claim 4, protection of the circuit pattern formed on one side of the insulating substrate by the clean paper is also achieved. It becomes like this.

  Further, in the invention according to claim 6, as a device for laminating a film on a thin material, a sheet material supply that supplies a flat surface with a sheet material having air permeability and higher elasticity in the thickness direction than the thin material. Means, thin material disposing means for disposing the thin material on the upper surface of the sheet material supplied to the flat surface, and the thin material disposed on the upper surface of the sheet material on the flat surface, Vacuum means for vacuum suction from the back side of the thin material arrangement surface, tape application means for attaching the sheet material and the thin material to the flat surface by attaching an adhesive tape, and application of the adhesive tape A film supply means for supplying the film so as to be superposed on an upper surface of the thin material, and a rolling roller for supplying the thin material on which the film is superimposed and rolling the film.

  According to such a configuration as the laminating apparatus, a sheet material having air permeability is supplied to the flat surface by the sheet material supply means, and a thin material is disposed on the upper surface of the sheet material. For this reason, at the time of vacuum suction by the suction means, the suction force also acts on the thin material through the sheet material, and both the sheet material and the thin material are adsorbed on the flat surface. At this time, even if the thin material has irregularities, the thin material and the sheet material are in close contact with each other due to the elasticity of the sheet material. Then, after the thin material and the sheet material are fixed by the adhesive tape through the tape applying means in such a close contact state, the film is supplied by the film supply means so as to be superimposed on the upper surface of the thin material. The superposed thin material is rolled by a rolling roller. That is, the roller rolling is performed in a state where the adhesion between the sheet material and the rolling roller and the integrity of the thin material and the sheet material by the adhesive tape are both maintained. For this reason, even during roller rolling, the thin material can be held flat against the compressive force due to the uneven load distribution during roller rolling as described above, and when the film is laminated on the thin material by roller rolling. The generation of wrinkles can be suitably suppressed.

  Further, in the laminating apparatus according to claim 6, as in the invention according to claim 7, the tape sticking means is arranged to adhere the adhesive along two opposing sides of the thin material formed in a rectangular shape. If it is the structure which affixes a tape, based on the implementation of the film laminating method of the said Claim 2, a thin material can be reliably fixed now with a sheet | seat material.

  Further, in the laminating apparatus according to claim 6 or claim 7, as in the invention according to claim 8, the tape sticking means is arranged such that the direction of stretching of the stuck adhesive tape is that of the thin material. It is also effective to perform the pasting so as to be in a direction orthogonal to the supply direction to the rolling roller. According to such a configuration, generation of wrinkles during laminating of a film on a thin material can be more suitably prevented under the implementation of the film laminating method according to claim 3. Become.

  In addition, as the sheet material supplied by the sheet material supply means in the laminating apparatus according to any one of claims 6 to 8, for example, according to the invention according to claim 9, clean paper can be used. .

  A laminating apparatus according to any one of claims 6 to 9, wherein a circuit pattern is provided on one surface as in claim 10 and a film is laminated on an insulating base material constituting one layer of a multilayer circuit board. By adopting it for processing, a particularly remarkable effect can be obtained. As described above, when a protective film is affixed to the insulating base material of such a multilayer circuit board, the probability of wrinkles occurring on the insulating base material and the protective film is very high. Therefore, if the protective film is laminated on the insulating base material using the laminating apparatus, generation of wrinkles on the insulating base material and the protective film during roller rolling can be suitably suppressed. Further, as described in the ninth aspect of the invention, if clean paper is used as the sheet material supplied by the sheet material supply means, the circuit pattern formed on one surface of the insulating base material by the clean paper is used. Protection is also planned.

Hereinafter, an embodiment in which the present invention is embodied as a method and apparatus for laminating a protective film on an insulating base material constituting one layer of the multilayer circuit board will be described.
The laminating apparatus according to the present embodiment is incorporated in a multilayer circuit board production line, receives supply of an insulating base material manufactured in a previous process, and laminates a protective film on the insulating base material by roller rolling. Then, processing is performed until the insulating base material on which the protective film is laminated is cut every predetermined length. In the next step, the insulating substrate with the protective film thus cut is irradiated with laser light from the protective film side to form the aforementioned via hole. Then, after the via hole is filled with the conductive paste, the protective film is peeled off from the insulating base material. Hereinafter, a side sectional view of such a laminating apparatus is shown in FIG. 1, and the configuration thereof will be described in detail with reference to FIG. In this embodiment, the insulating base material W, which is a thin material to be laminated, has a rectangular shape, and its thickness is as thin as 50 μm including the thickness of the circuit pattern. It has become.

  As shown in FIG. 1, the laminating apparatus includes a box-like base portion 20 that is supported at both ends by support legs 10 and 11 so that the upper and lower surfaces thereof are horizontal with respect to the floor surface. Configured. A vacuum surface plate 31 is provided on the upper portion of the base portion 20 to perform the fixing operation of the insulating base material W to the clean paper 22 that is a sheet material. The upper surface 31a of the vacuum surface plate 31 is a flat surface horizontal to the floor surface. In addition, on such a base part 20, the insulating base material W is carried in from the left side in the figure (hereinafter referred to as “base material carry-in side”), and after laminating and cutting, the right side in the figure (hereinafter, (Described as “base material unloading side”).

  In such a base portion 20, a material roll 23 around which a clean paper 22 is wound is disposed in a state of being rotatably supported on the base plate loading side of the vacuum surface plate 31. Further, a tension roller 24 for applying tension to the material roll 23 is disposed below the material roll 23 on the side of the base material carry-out side so as to be rotatable and movable in the vertical direction. Further, a fixed roller 25 is disposed on the upper surface portion of the base portion 20 above the tension roller 24. The fixed roller 25 is fixed at a position where its upper end is at the same height as the upper surface 31 a of the vacuum surface plate 31 in a state where it is rotatably supported. An opening 21 a having a width larger than the width of the clean paper 22 is formed on the upper surface of the base portion 20 on the base material carry-in side of the fixed roller 25. The clean paper 22 unwound from the material roll 23 is wound around the tension roller 24 and the fixed roller 25 in this order, and then led out from the opening 21a to the upper surface 31a of the vacuum surface plate 31. Yes.

  The clean paper 22 is a highly dustproof paper used in a clean room or the like, has air permeability, and has some elasticity in the thickness direction. In the present embodiment, since the insulating base W is very thin as 50 μm including the thickness of the circuit pattern as described above, the elasticity of the clean paper 22 in the thickness direction is the same as that of the insulating base W. It is higher than elasticity. Specifically, in the present embodiment, the clean paper 22 having a thickness of 100 μm and a width larger than the width of the insulating substrate W is used.

  In addition, the conveyance apparatus 54 which carries in the insulating base material W manufactured at the front process is arrange | positioned at the base material carrying-in side of the vacuum surface plate 31. FIG. The conveying device 54 carries the insulating base material W into the laminating apparatus and is led out from the opening 21a with the carried insulating base materials W one by one with the circuit pattern forming surface side down. It is disposed on the upper surface of the clean paper 22.

  A plurality of suction grooves 33 and 34 are formed on the upper surface 31 a of the vacuum surface plate 31. These suction grooves 33, 34 are extended in the width direction of the insulating base material W placed on the clean paper 22, and the length thereof is approximately the same as the width of the insulating base material W. Yes. The bottom surfaces of the suction groove 33 and the suction groove 34 are connected to a vacuum pump 36 disposed below the vacuum surface plate 31 through a pipe 35.

  Above the vacuum surface plate 31, a tape attaching device 40 for attaching the adhesive tapes 41 and 42 to the clean paper 22 and the insulating substrate W is disposed. As the adhesive tapes 41 and 42 attached by the tape attaching device 40, one surface of a clean paper tape coated with an adhesive is used. Note that the adhesive coated on the adhesive tapes 41 and 42 has a sufficiently lower adhesiveness to the insulating substrate W than that applied to the protective film 63 described later. Since the adhesive tapes 41 and 42 are used for temporarily fixing the clean paper 22 and the insulating substrate W for a short time during the laminating process, even an adhesive having a low adhesiveness should be used without any problem. Can do.

  A sensor 55 that detects the presence or absence of the insulating base material W on the vacuum surface plate 31 is also provided above the vacuum surface plate 31. The reference roller 51, the vacuum pump 36, and the tape applicator 40, which will be described later, are operated based on the detection signal of the sensor 55.

  Further, a reference roller 51 and a sticking roller 52 for laminating the insulating base material W by roller rolling are disposed on the base material carry-out side of the vacuum surface plate 31. The upper end of the reference roller 51 is disposed at the same height as the upper surface of the vacuum surface plate 31, and is rotated at a constant speed (for example, 630 mm / min) by a power source such as a motor. . On the other hand, the sticking roller 52 is disposed above the reference roller 51 so as to be rotatable and pivotally supported so as to be movable in the vertical direction on the upper surface of the vacuum surface plate 31. In this embodiment, the sticking roller 52 is a rubber roller having a roller surface made of rubber having a rubber hardness of 50. The clean paper 22 led out from the opening 21a is passed between the reference roller 51 and the sticking roller 52.

  On the other hand, above the sticking roller 52, a backup roller 53 is rotatably supported and pivotally supported so as to be movable in the vertical direction on the upper surface of the vacuum surface plate 31. The backup roller 53 is biased toward the sticking roller 52 by a spring or the like, thereby pressing the sticking roller 52 toward the reference roller 51.

  On the other hand, above the sticking roller 52, a backup roller 53 for preventing deformation of the rubber on the surface of the sticking roller 52 due to excessive roller surface pressure is rotatable and movable in the vertical direction on the upper surface of the vacuum surface plate 31. It is arranged in a supported state.

  Further, a cutter 80 for cutting the clean paper 22 and the like after the roller rolling is disposed on the upper surface of the base portion 20 on the substrate carry-out side of the reference roller 51 and the sticking roller 52. The cutter 80 is disposed so as to be able to reciprocate in the vertical direction, and a sharp blade is formed at the lower end thereof.

  Above the cutter 80, a supply roll 62 around which a material sheet 61 is wound in a roll shape is rotatably supported. The material sheet 61 is obtained by bonding a release paper 64 to the adhesive surface of the protective film 63 laminated on the insulating substrate W. The protective film 63 is formed wider than the insulating substrate W, and the adhesive surface is coated with an ultraviolet curable adhesive. Incidentally, in the present embodiment, a film made of PET (polyethylene terephthalate) having a thickness of 13 μm is used as the protective film.

  A tension for applying tension to the material sheet 61 in a state of being pivotally supported so as to be rotatable and movable in the vertical direction below the base material carry-in side of the supply roll 62 around which the material sheet 61 is wound. A roller 65 is provided, and a material sheet 61 unwound from the supply roll 62 is wound around. Above the tension roller 65 on the substrate carrying side, a fixed roller 66 is rotatably supported and a material sheet 61 led out from the tension roller 65 is wound thereon.

  The material sheet 61 after passing through the fixed roller 66 is separated into a protective film 63 and a release paper 64. Then, the protective film 63 is supplied between the reference roller 51 and the sticking roller 52, and the release paper 64 is transferred to a release paper peeling roller 67 that is rotatably supported below the substrate carrying side of the fixed roller 66. It is wrapped around.

  A fixed roller 68 is rotatably supported above the release paper peeling roller 67 on the base material carry-in side. A release paper tension roller 69 for applying tension to the release paper 64 is provided below the fixed roller 68 on the side of the substrate carrying-in side so as to be rotatably supported and movable in the vertical direction. A release paper roll 70 that is rotationally driven by a power source such as a motor is disposed above the substrate carry-in side of the release paper tension roller 69. The release paper 64 led out from the release paper peeling roller 67 is wound around the fixed roller 68 and the release paper tension roller 69 and then taken up by the release paper roll 70.

  In the laminating apparatus according to the present embodiment configured as described above, the reference roller 51, the vacuum pump 36, and the tape applicator 40 operate in conjunction with each other based on the detection signal of the sensor 55 as described above. Then, the clean paper 22 and the insulating substrate W are fixed on the vacuum surface plate 31 by the adhesive tapes 41 and 42. Hereinafter, a series of flow from when the insulating base material W is supplied together with the clean paper 22 to when the clean paper 22 and the insulating base material W are fixed by the adhesive tapes 41 and 42 will be described.

  First, the insulating substrate W disposed on the clean paper 22 is conveyed to the substrate unloading side together with the clean paper 22 by the rotation of the reference roller 51, and the insulating substrate W is positioned on the vacuum surface plate 31. When detected through the sensor, the conveyance of the clean paper 22 is stopped by temporarily stopping the rotation of the reference roller 51. As a result, the insulating substrate W is placed on the upper surface 31 a of the vacuum surface plate 31 via the clean paper 22.

  Thereafter, the vacuum pump 36 is operated. When the vacuum pump 36 is thus operated, the suction grooves 33 and 34 are negatively pressurized, and the clean paper 22 is vacuum-sucked from the rear surface side of the surface on which the insulating base material W is disposed. Adheres to the upper surface 31a. At this time, since the clean paper 22 has air permeability, the suction force by the vacuum suction also acts on the circuit pattern forming surface of the insulating substrate W through the clean paper 22. Therefore, the insulating base material W is planarly adsorbed on the upper surface 31 a of the vacuum surface plate 31 together with the clean paper 22. At this time, since the upper surface of the clean paper 22 is deformed by the elasticity of the circuit pattern formed on the insulating substrate W, the insulating substrate W and the clean paper 22 are in close contact with each other without any gap. Become.

  Thereafter, with the vacuum suction maintained, the tape applicator 40 operates to fix the insulating substrate W and the clean paper 22 with the adhesive tapes 41 and 42. The sticking of the adhesive tapes 41 and 42 at this time is performed in a mode shown in FIG. That is, the adhesive tapes 41 and 42 are in the insulating base material W formed in a rectangular shape, and are attached along the two opposing sides on the side orthogonal to the roller rolling supply direction. As a result, the four corners of the insulating base material W are fixed on the clean paper 22, and the integrity of the insulating base material W and the clean paper 22 is ensured.

  When the application of the adhesive tapes 41 and 42 by the tape application device 40 is completed, the vacuum pump 36 stops its operation and releases the vacuum suction of the insulating base material W and the clean paper 22. Further, the reference roller 51 resumes its rotation, and the clean paper 22 having the insulating base W fixed on the upper surface by the adhesive tapes 41 and 42 is drawn between the reference roller 51 and the application roller 52. The reference roller 51 and the sticking roller 52 roll the clean paper 22 with the insulating base W fixed on the upper surface together with the protective film 63 drawn in the same manner, and laminate the protective film 63 on the insulating base W. .

  Thereafter, the insulating base material W and the clean paper 22 on which the protective film 63 is laminated are sent out by a predetermined length from the reference roller 51 to the base material unloading side by the rotation of the reference roller 51, and the insulating base material W is cut by the cutter 80. It is cut every time.

  The cutting by the cutter 80 at this time is performed along cutting lines CT1 and CT2 indicated by a one-dot chain line in FIG. That is, the clean paper 22 and the protective film 63 are cut along two opposing sides of the insulating base material W to which the adhesive tapes 41 and 42 are attached. When cut in this way, the protective film 63 is formed on the side of the package formed by cutting the insulating substrate W and the clean paper 22 laminated with the protective film 63 for each insulating substrate W. As a result, a region not attached to the clean paper 22 is formed. In this region, since the adhesive tapes 41 and 42 are only attached to the upper surface of the insulating base material W with an adhesive having low adhesiveness as described above, the protective film 63 is later removed from the insulating base material W. When peeling, it can be used as a peeling ear that facilitates the peeling.

  In this embodiment, the material roll 23, the tension roller 24, the fixed roller 25, the reference roller 51, the sticking roller 52, the backup roller 53, and the like constitute the above-described sheet material supply means. The conveying device 54 is configured so that the thin material disposing means corresponds to the vacuum pump 36, the suction grooves 33 and 34, and the pipe 35 to the sucking means, and the tape applying device 40 corresponds to the tape applying means. Further, the supply roller 62, the tension roller 65, the fixed roller 66 and the like constitute a film supply means, and the reference roller 51, the sticking roller 52, and the backup roller 53 constitute a rolling roller. Further, the upper surface 31a of the vacuum surface plate 31 has a configuration corresponding to the flat surface on which the sheet material (clean paper 22) after the thin material (insulating base material W) is disposed.

As described above, according to the film laminating method and laminating apparatus according to the present embodiment, the following effects can be obtained.
(1) The insulating base material W is disposed on the upper surface of the clean paper 22 which has air permeability and has higher elasticity in the thickness direction than the insulating base material W, and these insulating base materials are disposed on the upper surface 31a of the vacuum surface plate 31. Vacuum suction was performed with W and clean paper 22 placed. For this reason, at the time of vacuum suction, the suction force also acts on the insulating substrate W through the clean paper 22, and the clean paper 22 and the insulating substrate W are both adsorbed on the upper surface 31a. At this time, the unevenness due to the circuit pattern formed on the insulating substrate W is absorbed and deformed by the elasticity of the clean paper 22, so that the insulating substrate W and the clean paper 22 are in close contact with each other without any gap. Then, the insulating base W and the clean paper 22 are fixed by the adhesive tapes 41 and 42 in the state of being adsorbed on the upper surface 31a in this way, and the insulation fixed to the clean paper 22 by the adhesive tapes 41 and 42. The protective film 63 was superposed on the base material W and rolled. For this reason, the roller rolling is performed in a state where the adhesion between the clean paper 22 and the reference roller 51 and the integrity of the insulating base material W and the clean paper 22 by the adhesive tapes 41 and 42 are both maintained. The insulating base material W can be held flat against the compressive force due to the uneven load distribution inside. Therefore, generation | occurrence | production of the wrinkle at the time of the lamination process of the protective film 63 to the insulating base material W by roller rolling can be suppressed now suitably.

  (2) Since the region where the adhesive tapes 41 and 42 are attached to the insulating base material W can be used as a peeling ear when the protective film 63 is peeled off from the insulating base material W later, the peeling work of the protective film 63 is easy. It can be.

  (3) When the insulating base material W and the clean paper 22 are adsorbed on the upper surface 31a of the vacuum surface plate 31 by vacuum suction, along the two opposite sides of the insulating base material W, and supply of roller rolling Adhesive tapes 41 and 42 were attached in a direction orthogonal to the direction to fix the insulating substrate W and the clean paper 22. For this reason, while being able to fix the insulation base material W to the clean paper 22 reliably, the increase in the local thickness of the rolling cross section by the thickness of the adhesive tapes 41 and 42 can be avoided, Generation | occurrence | production of the wrinkle at the time of the lamination process of the protective film 63 to the insulating base material W can be prevented more suitably.

  The film laminating method and laminating apparatus according to the present invention are not limited to the above-described embodiments, and can be implemented as, for example, the following forms obtained by appropriately changing the embodiments.

  The sticking direction and the number of sticking of the adhesive tapes 41 and 42 to be stuck to fix the insulating substrate W and the clean paper 22 can be arbitrarily selected. For example, the adhesive tapes 41 and 42 may be attached along the supply direction of the insulating substrate W or the clean paper 22, or the adhesive tapes 41 and 42 are attached at a predetermined angle with respect to the supply direction. You may do it. Further, the insulating base material W and the clean paper 22 may be fixed by dispersing the adhesive tape and attaching it to several places instead of two places as in the above embodiment. In short, the sticking direction and the number of sticking of the adhesive tape are not limited as long as the integrity of the insulating base W and the clean paper 22 is ensured during roller rolling.

The sheet material is not limited to the clean paper 22 and may be a material having air permeability and higher elasticity in the thickness direction than the insulating base material W.
In the above embodiment, as the thin material, a circuit pattern is formed on one surface, and the insulating base material W constituting one layer of the multilayer circuit board is assumed. However, the thin material that is the subject of the present invention is not limited to such an insulating base W, and can be appropriately applied to a thin material that cannot hold itself flat only by its own rigidity.

Sectional drawing which shows the side surface cross-section about one Embodiment of the laminating apparatus concerning this invention. The schematic diagram which shows the sticking aspect of the adhesive tape to the insulation base material and clean paper in the same embodiment. The schematic diagram which shows the cutting | disconnection aspect of the insulation base material and the clean paper which were laminated | stacked on the protective film in the embodiment. (A)-(g) is a schematic diagram which shows the manufacturing process of a multilayer circuit board. The schematic diagram which shows the roller rolling process by the conventional laminating apparatus. The enlarged view of a roller rolling part among the conventional laminating apparatuses. The schematic diagram which shows the surface state of the insulating base material and protective film after roller rolling by the conventional laminating apparatus.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 10, 11 ... Support foot, 20 ... Base part, 21a ... Opening part, 22 ... Clean paper, 23 ... Material roll, 24, 65 ... Tension roller, 25, 66, 68 ... Fixed roller, 31 ... Vacuum surface plate, 31a ... Upper surface, 33, 34 ... Suction groove, 35 ... Piping, 36 ... Vacuum pump, 40 ... Tape applicator, 41, 42 ... Adhesive tape, 51 ... Reference roller, 52 ... Adhesion roller, 53 ... Backup roller, 54 ... Conveyance Device: 55 ... sensor, 61 ... material sheet, 62 ... feed roll, 63 ... protective film, 64 ... release paper, 67 ... release paper peeling roller, 69 ... release paper tension roller, 70 ... release paper roll, 80 ... cutter.

Claims (10)

A method of laminating a film on a thin material,
Disposing the thin material on the upper surface of the sheet material having air permeability and higher elasticity in the thickness direction than the thin material; and
Placing the sheet material after placement of the thin material on a flat surface, and vacuum suction from the back side of the placement surface of the thin material in the sheet material;
Fixing the sheet material and the thin material with an adhesive tape during the vacuum suction;
A process of rolling the films on the upper surface of the thin material after fixing the adhesive tape, and rolling them;
A method for laminating a film, comprising: The method for laminating a film according to claim 1, wherein the adhesive tape is attached along two opposing sides of the thin material formed in a rectangular shape. The method for laminating a film according to claim 1 or 2, wherein a direction in which the adhesive tape is attached is a direction orthogonal to a supply direction of the roller rolling. The method for laminating a film according to claim 1, wherein clean paper is used as the sheet material. The method for laminating a film according to any one of claims 1 to 4, wherein the thin material is an insulating base material having a circuit pattern formed on one surface thereof and constituting one layer of a multilayer circuit board. An apparatus for laminating a film on a thin material,
Sheet material supply means for supplying a flat surface with a sheet material having air permeability and higher elasticity in the thickness direction than the thin material;
Thin material disposing means for disposing the thin material on the upper surface of the sheet material supplied to the flat surface;
With the thin material disposed on the upper surface of the sheet material on the flat surface, suction means for vacuum suction from the back surface side of the thin material disposed surface;
A tape attaching means for attaching and fixing the sheet material and the thin material on the flat surface;
Film supply means for supplying the film so as to overlap the upper surface of the thin material to which the adhesive tape is attached;
A rolling roller for feeding and rolling the thin material on which the film is superimposed;
An apparatus for laminating a film, comprising: The film laminating apparatus according to claim 6, wherein the tape affixing unit affixes the adhesive tape along two opposing sides of the thin material formed in a rectangular shape. The said tape sticking means performs the said sticking so that the extending | stretching direction of the stuck adhesive tape may become a direction orthogonal to the supply direction to the said rolling roller of the said thin material. Film laminating equipment. The film laminating apparatus according to any one of claims 6 to 8, wherein the sheet material is clean paper. The film laminating apparatus according to any one of claims 6 to 9, wherein a circuit pattern is provided on one surface and an insulating base material constituting one layer of the multilayer circuit board is laminated as the thin material.

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