JP2006205659A - Apparatus for and method of manufacturing laminate-molded object - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To realize at least one of partial sharing of a laminate feeder and a laminated-molded product delivery device, lowering of work load applied on a worker, reduction in consumption of a film and reduction of the overall length of an apparatus, in a method of manufacturing the laminated-molded product comprising the steps of placing the laminate or a laminated-molded product on the film for placing the laminate or the laminated-molded product, transferring the film to feed the laminate into a space between an upper platen and a lower platen of a laminating-molding unit, heating and pressing the laminate through a film body or the film in a vacuum molding chamber and delivering the laminated/molded product from the apparatus for manufacturing the laminated/molded product and the apparatus. <P>SOLUTION: First, the laminate P1 is heated and pressed through the filmy bodies 18 and 22 or the films F1 and F2, and the film F1 on which the laminate P1 or the laminate-molded product is placed is transferred oppositely to the direction of feeding the lamination material P1. After that, the laminated-molded product P2 is delivered out of a feed/delivery opening 25 formed in one side of the laminating-molding unit 12. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a laminated molded product manufacturing apparatus and a laminated molded product manufacturing method for heating and pressing a laminated material through a film body or a film in a vacuum molding chamber.

  2. Description of the Related Art Conventionally, as a laminated molded product manufacturing apparatus that heats and pressurizes a laminate through a film body in a vacuum molding chamber, a device disclosed in Patent Document 1 is known. In Patent Document 1, a carrier film is supplied from an unwinding roll, inserted into a chamber of a lamination molding apparatus, and then wound around a winding roll. And the chuck | zipper apparatus which pulls a carrier film is provided in the conveyance exit side of the lamination molding apparatus so that a movement is possible. However, in the laminated molded article manufacturing apparatus of Patent Document 1, since the laminated material conveyance inlet side and the molded article conveyance outlet side are provided on the opposite side, in order to automate, the laminated material carrying-in apparatus and molded article carrying-out apparatus are provided. It was necessary to provide it separately. Further, when the worker carries in the laminated material and carries out the molded product without performing automation, the work flow line becomes long and it is inefficient. Furthermore, in the apparatus of Patent Document 1, the upper carrier film after being unloaded from the laminating apparatus due to the distance from the time when the upper carrier film is coated to being carried into the laminating apparatus and the moving space of the chuck device. The distance until the film is peeled off is long, and there is a problem that a length for wastefully feeding the carrier film is required. Moreover, there existed a problem that the full length of a laminated molded product manufacturing apparatus became long by them.

JP 2002-103439 A (Claim 1, 0008, FIG. 1)

  In the present invention, in view of the above problems, the laminated material is placed on the film on which the laminated material or the laminated molded product is placed, and the film is transferred to carry the laminated material between the upper board and the lower board of the laminated molding apparatus. When laminating material is heated / pressurized through a film or film in a vacuum forming chamber of a laminating apparatus, and then unloaded from the laminating apparatus, the laminating material carrying device and laminating product carrying device are shared, It is an object of the present invention to provide a laminated molded article manufacturing apparatus or a laminated molded article manufacturing method capable of realizing at least one of a reduction in a worker's workload, a reduction in film consumption, and a reduction in the overall length of the apparatus.

  In the laminated molded product manufacturing apparatus according to claim 1 of the present invention, at least one surface of the laminated material is heated and pressurized via a film body or film in a vacuum forming chamber formed between the upper and lower boards. In a laminated molded product manufacturing apparatus provided with a laminated molding apparatus and a transfer device for carrying a film on which a laminated material or a laminated molded product is loaded into and out of the laminated molding apparatus, heating and pressurization of the laminated material Thereafter, the film is transferred in a direction opposite to the transfer direction at the time of carrying in the laminated material, and the laminated molded product is carried out from a carry-in / out port provided on one side of the laminated molding apparatus.

  According to a second aspect of the present invention, there is provided the laminated molded product manufacturing apparatus according to the first aspect, wherein the transfer device for transferring the film in contact with the laminated material or the upper surface of the laminated molded product into and out of the multilayer molding apparatus is arranged. The film contacting the upper surface of the laminated material or the laminated molded product is transferred in synchronization with the transfer of the film on which the laminated material or the laminated molded product is placed.

  The laminated molded product manufacturing apparatus according to claim 3 of the present invention is the laminated molded product manufacturing apparatus according to claim 2, wherein the laminated material or a film contacting the upper surface of the laminated molded product is placed in one of the laminated molding devices before the laminated material is carried in. A film operating device is provided which performs at least one of coating on the substrate and peeling off from the laminated molded product after the laminated molded product is carried out.

  According to a fourth aspect of the present invention, there is provided a method for manufacturing a laminated molded product comprising: placing a laminated material on a laminated material or a film on which the laminated molded product is placed; Laminate is carried in between, the upper and lower boards are brought into contact with each other and vacuum sucked to form a vacuum forming chamber. After heating and pressurizing the laminated material through a film or film, the vacuum forming chamber is opened. In the laminated molded product manufacturing method for carrying out the laminated molded product, after heating / pressurizing the laminated material, the film is transferred in the direction opposite to the transfer direction when the laminated material is carried in and provided on one side of the laminated molding apparatus. The laminated molded product is unloaded from the loading / unloading port.

  The method for producing a laminated molded product according to claim 5 of the present invention is the film according to claim 4, wherein the film contacts the upper surface of the laminated material or laminated molded product in synchronization with the transfer of the film on which the laminated material or laminated molded product is placed. The laminate is heated and pressurized through at least upper and lower films.

  In the laminated molded product manufacturing apparatus and the laminated molded product manufacturing method of the present invention, at least one surface of the laminated material is heated and pressurized via a film body or film in a vacuum molding chamber formed between an upper board and a lower board. Laminate molding apparatus provided with a laminate molding apparatus and a transfer device for carrying a film on which a laminate material or a laminate molded article is placed into and out of the laminate molding apparatus, or laminating using the manufacturing apparatus In the molded product manufacturing method, after heating and pressurizing the laminated material, the film is transferred in the direction opposite to the transfer direction when the laminated material is carried in, and laminated from the loading / unloading port provided on one side of the lamination molding apparatus. Since the molded product is carried out, the overall length of the apparatus can be shortened.

  An embodiment of the present invention will be described with reference to FIGS. FIG. 1 is a cross-sectional view showing a state in which a laminated material is placed on a film in the laminated molded product manufacturing apparatus of the present embodiment. FIG. 2 is a cross-sectional view showing a state in which the laminated material is covered with a film in the laminated molded product manufacturing apparatus of the present embodiment. FIG. 3 is a cross-sectional view showing a state in which the laminated material is carried between the upper board and the lower board of the laminated molding apparatus in the laminated molded product manufacturing apparatus of the present embodiment. FIG. 4 is a cross-sectional view showing a state in which the laminated material is heated and pressurized in the laminated molding apparatus in the laminated molded product manufacturing apparatus of the present embodiment. FIG. 5 is a cross-sectional view showing a state in which the laminated molded product heated and pressurized in the laminated molding apparatus is unloaded in the laminated molded product manufacturing apparatus of the present embodiment. FIG. 6 is a cross-sectional view showing a state where the film is peeled from the laminated molded product in the laminated molded product manufacturing apparatus of the present embodiment. FIG. 7 is a cross-sectional view showing a state in which a used film is being transferred in the laminated molded product manufacturing apparatus of the present embodiment. 1 to 7, the same reference numerals indicate the same or corresponding portions.

  An outline of the laminate molding apparatus 12 in the laminate molded product manufacturing apparatus 11 will be described with reference to FIGS. The laminating apparatus 12 is provided with an upper board 13 and a lower board 14 facing each other, and the lower board 14 is moved toward the upper board 13 by a lifting / lowering device (not shown) and is vacuum-sucked so as to be rectangular in plan view. The vacuum forming chamber 15 is formed. The upper board 13 will be described. A recess 16 is formed in the approximate center of the lower surface of the upper board 13, and a plate plate 17 having a heating means such as a heater on the back surface and a flat bottom surface is disposed in the recess 16. Has been. A film body 18 is attached to the lower surface of the upper board 13. The film body 18 is made of a material having elasticity, flexibility, elasticity, and heat resistance (silicon rubber as an example). An air flow path 19 is provided inside the upper board 13, and one of the air flow paths 19 is opened in the recess 16 and the other is connected to a vacuum device (not shown) via a valve or the like. The lower surface of the peripheral wall surface of the recess 16 is a contact surface with the lower board 14.

  Next, the lower plate 14 will be described. A recess 20 is formed in the approximate center of the lower plate 14 in a plan view, and a plate plate 21 having a heating means such as a heater on the back surface and a flat upper surface is disposed on the recess 20. It is installed. The lower plate 14 is provided with a film body 22 on the upper surface side of the plate plate 21 and the like. The film body 22 is made of a material having elasticity, flexibility, elasticity, and heat resistance (silicon rubber as an example). Further, the upper surface of the peripheral wall surface of the recess 20 of the lower board 14 is an abutting surface of the upper board 13 and comes into contact with the abutting surface of the lower board when the upper board 13 and the lower board 14 are in contact. The O-ring 23 is disposed so as to be sealed. In addition, an air flow path 24 is provided inside the lower plate 14, one of the air flow paths 24 is opened in the recess 20, and the other is connected to a vacuum device and a compressed air supply device (not shown) via a valve or the like. It is connected. In the laminated molding apparatus, the film body is swelled only from the upper board side or from both the upper and lower board sides using a compressed air supply device, and the laminated material is heated and pressurized. Also good. Further, at least one of the upper board and the lower board may be provided with a film body, and the laminated material may be heated and pressurized by expanding the film with compressed air. In that case, it may be possible to apply pressure through a film other than the lower carrier film F1. Further, the laminated material and the plate plate may be directly brought into contact with each other without providing the film body and the film on the upper board side. Furthermore, when heating and pressurizing the laminated material through the membrane or film, atmospheric pressure is used without using compressed air, and the membrane or film is expanded by the differential pressure in the vacuum forming chamber to heat the laminated material. -You may pressurize.

  The contact surface of the upper board 13 and the lower board 14 on one side of the lamination molding apparatus 12 is a belt-like carrier film on which a laminated material or a laminated molded product is placed when the upper board 13 and the lower board 14 are separated from each other. F1 (hereinafter abbreviated as the lower carrier film F1) and a belt-like carrier film F2 (hereinafter abbreviated as the upper carrier film F2) in contact with the upper surface of the laminated material or laminated molded product, the laminated material P1 or the laminated molded product P2, It is a loading / unloading port 25 for loading or unloading. Further, the contact surface of the upper board 13 and the lower board 14 on the other side of the laminate forming apparatus 12 is a film passage opening through which only the upper and lower carrier films F1 and F2 are transferred when the upper board 13 and the lower board 14 are separated. 26.

  Next, the 1st transfer apparatus 27 which carries in and carries out the lower carrier film F1 in the lamination molding apparatus 12 in the lamination molded product manufacturing apparatus 11 is demonstrated. A first roll 29 around which an unused lower carrier film F1 is wound is disposed on one side (the right side in the figure) of the lamination molding apparatus 12. A second roll 30 around which the used lower carrier film F1 is wound is disposed on the other side (the left side in the figure) of the layer forming apparatus 12. And between the 1st roll 29 and the 2nd roll 30, the lower carrier film F1 is horizontally transferred between the upper board 13 and the lower board 14 of the lamination molding apparatus 12 via the guide rolls 31 and 32. It is stretched out like this. The first roll 29 and the second roll 30 are provided so that they can be driven forward and backward by a torque motor (not shown), respectively, and the torque exerted in the winding direction for winding the lower carrier film F1 around the roll, and the lower carrier film F1. The torque exerted in the winding direction is controlled to give tension to the film when the film is fed from the roll. Therefore, when the lower carrier film F1 is transferred, the lower carrier film F1 has a constant tension regardless of the amount (diameter) of the lower carrier film F1 wound around the roll.

  Next, the 2nd transfer apparatus 28 which carries in and carries out the upper carrier film F2 in the lamination molding apparatus 12 in the lamination molded product manufacturing apparatus 11 is demonstrated. A third roll 33 around which the unused upper carrier film F <b> 2 is wound is disposed above one of the lamination molding apparatuses 12. In addition, a fourth roll 34 around which the used upper carrier film F2 is wound is disposed above the other side of the layer forming apparatus 12. Between the third roll 33 and the fourth roll 34, the upper carrier film F2 is interposed between the upper board 13 and the lower board 14 via the film operating device 35 and the guide roll 36 on the fourth roll 34 side. It is stretched so as to be transferred horizontally between the two. Similarly to the first roll 29 and the second roll 30, the third roll 33 and the fourth roll 34 are provided so as to be able to be driven forward / reversely by a torque motor, and are wound to wind the upper carrier film F2 around the roll. The torque exerted in the take-up direction and the torque exerted in the take-up direction in order to give tension to the film when the upper carrier film F2 is fed from the roll are controlled.

  A film operating device 35 is disposed below the third roll 33 on one side of the lamination molding device 12. The film operating device 35 includes a guide roll 37, a first chuck device 38, a moving device (not shown), etc., and covers the upper carrier film F2 on the upper surface of the laminated material P1 before carrying in the laminated material P1 or laminates it after carrying it out. It has a function of peeling the upper carrier film F2 from the molded product P2 and a function of transferring and accurately positioning the laminated material P1 or the laminated molded product P2 with tension applied to the upper and lower carrier films F1, F2. The moving device of the film operating device 35 is guided by a guide member (not shown), and between the stack forming device 12 and the guide roll 31 by a driving means (not shown), the placement stage of the laminate P1 and the laminate molded product P2 The upper position of the mounting stage 39 that also serves as the carry-out stage can be moved in the horizontal direction. The guide roll 37 of the film operating device 35 is arranged such that three small diameter rolls are axially supported in a direction perpendicular to the film. Then, the upper carrier film F2 passes through the three guide rolls 37 alternately. Specifically, as shown in FIG. 1 and the like, the upper carrier film F2 transported in the horizontal direction passes from one side (right side) of the lowermost guide roll 37 to the other side (left side) of the intermediate guide roll 37. Further, it is provided so as to pass through one (right side) of the uppermost guide roll 37 to reach the third roll 33. Therefore, the upper carrier film F2 is configured such that the angle at which the film is fed by the lowermost guide roll 37 is changed acutely. The first chuck device 38 of the film operating device 35 is movably provided together with the guide roll 37. Then, the upper and lower chuck portions of the first chuck device 38 provided on both sides of the upper and lower carrier films F1 and F2 are moved by an actuator such as a cylinder so that the both side portions of the upper and lower carrier films F1 and F2 are overlapped. The upper and lower carrier films F1 and F2 can be gripped or opened.

  Second chuck devices 40 are also arranged on both sides of the upper and lower carrier films F1, F2 in the vicinity of the other of the film passage ports 26 of the lamination molding device 12. In the second chuck device 40, the upper and lower chuck portions are moved by an actuator such as a cylinder so that the upper and lower carrier films F1 and F2 are held on both sides, and the upper and lower carrier films F1 and F2 are opened. You can do that. In the present embodiment, since the second chuck device 40 is provided so as not to move, the second chuck device 40 does not move in synchronization with the transfer of the upper and lower carrier films F1, F2.

  Next, a laminated molded product manufacturing method using the laminated molded product manufacturing apparatus 11 of the present embodiment will be described in the order of FIGS. 1 to 7. As an example of the laminated material P1 to be laminated, there is a combination of a circuit board on which a circuit is formed with a copper foil and a resin film such as polyimide. First, as shown in FIG. 1, a laminated material P <b> 1 that is stacked in the order of a circuit board on the upper side and a resin film on the lower side is placed on the lower carrier film F <b> 1 on the placement stage 39.

  Next, as shown in FIG. 2, the film operating device 35 is moved toward one side (right side). And the upper carrier film F2 is coat | covered on the lower carrier film F1 and the laminated material P1 with the guide roll 37 of the film operation apparatus 35. FIG. At that time, the chuck portion of the first chuck device 38 disposed in the film operating device 35 is opened, and the chuck portion is gripped in the second chuck device 40 disposed on the other side of the lamination molding device 12, and the upper and lower carrier films F1 and F2 are fixed so as not to return in one direction. The torque motor of the third roll 33 is controlled so that a slight torque is applied in the winding direction (forward rotation direction) in order to apply tension to the upper carrier film F2. Therefore, from the third roll 33, the upper carrier film F2 in which the distance between the film operating device 35 and the third roll 33 is increased in addition to the film operating device 35 moving to one side and covering the laminated material P1. Is sent out. At the same time, the torque motor of the first roll 29 is given a slight torque in the winding direction (forward rotation direction) to apply tension to the lower carrier film F1.

  Next, as shown in FIG. 3, the upper and lower carrier films F <b> 1 and F <b> 2 are gripped by the chuck portion of the first chuck device 38 of the laminated molded product manufacturing apparatus 11, and the chuck portion of the second chuck device 40 is opened. Then, when the torque motor of the second roll 30 is driven forward, the lower carrier film F1 is wound around the second roll 30, and the lower carrier film F1 is sent from the first roll 29 toward the other. At the same time, the upper carrier film F2 is wound around the fourth roll 34 by driving the torque motor of the fourth roll 34 in the normal direction, and the chuck device 38 of the film operating device 35 is moved to the other side. Therefore, with the movement of the first chuck device 38, the upper and lower carrier films F1, F2 are synchronously transferred toward the other. As a result, the laminated material P1 sandwiched between the upper and lower carrier films F1 and F2 is transferred in the transfer direction A in FIG. 3 and is placed between the upper board 13 and the lower board 14 of the lamination molding apparatus 12 from the mounting stage 39. It is brought in. At that time, since both sides of the upper and lower carrier films F1 and F2 are held by the first chuck device 38, the laminate P1 is laminated and molded in a state in which the film is kept stretched in the direction orthogonal to the transport direction. 12, and the laminated material P <b> 1 can be easily positioned at the molding position by stopping the first chuck device 38. At this time, the distance between the guide roll 37 and the third roll 33 of the film operating device 35 is shortened by moving the film operating device 35 to the other side, but the torque motor of the second roll 30 is in the winding direction. The upper carrier film F2 is rewound so as not to sag. At that time, the torque motor of the first roll 29 is also given a slight torque in the winding direction.

  Next, as shown in FIG. 4, the lower board 14 of the layer forming apparatus 12 is raised toward the upper board 13, the contact surfaces of the upper board 13 and the lower board 14 are brought into contact with each other, and sealed by an O-ring 23. Thus, a sealed chamber is formed by the recess 16 of the upper board 13 and the recess 20 of the lower board 14. Then, the air in the chamber is vacuumed and decompressed by a vacuum device (not shown) to form a vacuum forming chamber 15. At this time, the plate plates 17 and 21 disposed on the upper board 13 and the lower board 14 are heated by a heater. Then, compressed air is supplied from a compressed air supply device (not shown) via the air flow path 24 below the film body 22 disposed on the lower plate 14, and the film body 22 is expanded in the vacuum forming chamber 15, so that the film The lower surface of the laminated material P1 is heated and pressurized through the body 22 and the lower carrier film F1. At substantially the same time, the upper surface of the laminated material P1 is pressed against the plate plate 17 of the upper board 13 through the upper carrier film F2 and the film body 18 by pressurization by the film body 22. In this state, heating and pressurization are continued for a predetermined time, so that even if the lower surface or the upper surface of the circuit board or the like of the laminated material P1 has irregularities, it is pasted without generating voids between the surface and the resin film. Can be combined. Further, when the laminated material P1 is heated and pressurized, even if the resin is eluted, it adheres to the upper and lower carrier films F1 and F2, so that the film bodies 18 and 22 are not soiled. Thereafter, the compressed air below the film body 22 is released, and the atmosphere is introduced into the vacuum forming chamber 15 above the film body 22. Then, the lower plate 14 is lowered to open the vacuum forming chamber 15.

  Next, as shown in FIG. 5, the laminated product P <b> 2 that has undergone the lamination molding is carried out from one loading / unloading port 25 of the lamination molding apparatus 12 to the side on which the film operating device 35 or the mounting stage 39 is located. Is done. That is, the laminated molded product P2 is carried out together with the upper and lower carrier films F1 and F2 that are transferred in synchronization with the transfer direction B opposite to the transfer direction A when the laminated material P1 is carried in. At that time, the upper and lower carrier films F1, F2 are gripped by the chuck portion of the first chuck device 38, and the film operating device 35 is moved toward one side while the chuck portion of the second chuck device 40 is opened. . At the same time, the torque motor of the first roll 29 is driven to rotate forward, and the lower carrier film F1 is wound around the first roll 29. At that time, torque is slightly applied to the torque motors of the second roll 30 and the fourth roll 34 in the winding direction. As a result, the laminated molded product P2 is laminated while being sandwiched between the upper and lower carrier films F1, F2 in a state where tension is applied by the first chuck device 38, the second roll 30, and the fourth roll 34. It is carried out from the apparatus 12 to the mounting stage 39. When the first chuck device 38 is stopped, the upper and lower carrier films F1, F2 are stopped, and the laminated molded product P2 is positioned on the mounting stage 39. At the same time, the driving of the torque motor of the first roll 29 is also stopped. At this time, since the distance between the guide roll 37 and the third roll 33 of the film operating device 35 is increased by moving the film operating device 35 to one side, the upper carrier film F2 is sent from the third roll 33. The

  Next, as shown in FIG. 6, the upper and lower carrier films F <b> 1 and F <b> 2 are opened by the chuck portion of the first chuck device 38, and the upper and lower carrier films F <b> 1 and F <b> 2 are gripped by the chuck portion of the second chuck device 40. Then, torque is applied to the first roll 29 in the winding direction by the torque motor of the first roll 29, and the film operating device 35 is moved toward the other while the lower carrier film F1 is fixed. At that time, the torque motor of the third roll 33 is configured so that the length of the upper carrier film F2 peeled off from the laminated molded product P2 and the surplus of the upper carrier film F2 due to the distance between the third roll 33 and the guide roll 37 being reduced. Driven to the take-up side to eliminate sagging of minutes. In the present embodiment, as described above, since the upper carrier film F2 is peeled off at the portion where the angle of the upper carrier film F2 is changed acutely by the lowermost small-diameter guide roll 37, the laminated molded product P2 and Even if the upper carrier film F2 is in close contact with the eluted resin or the like, it is easily peeled off. When the laminated molded product P2 is exposed and placed on the lower carrier film F1 on the mounting stage 39, the laminated molded product P2 is placed outside the laminated molded product manufacturing apparatus 11 by an unillustrated unloader or operator. It is carried out to.

  Next, as shown in FIG. 7, the first chuck device 38 and the second chuck device 40 are opened, and the torque motors of the second roll 30 and the fourth roll 34 are driven to rotate in the winding direction. At that time, torque that is weaker than that of the torque motors of the second roll 30 and the fourth roll 34 is applied to the torque motors of the first roll 29 and the third roll 33 in the winding direction. Therefore, the upper and lower carrier films F1 and F2 that are soiled or thermally deformed by the resin eluted when the laminated molded product P2 is laminated are sent to the other in synchronization with tension. And if the lower carrier film F1 of the part of the mounting stage 39 becomes an unused film, the transfer of the upper and lower carrier films F1, F2 is stopped. More specifically, in the present embodiment, the upper and lower carrier films F1 and F2 are added by an amount corresponding to at least one sheet of the laminated material P1 and a slight portion where the resin around the laminated material P1 may elute and adhere. If transferred, the next laminated material P1 can be placed on the placement stage 39. Therefore, this embodiment has a longer distance from the time when the upper carrier film is coated to the laminate molding apparatus as in the prior art, and a longer distance from the laminate molding apparatus to the take-out position. Thus, the consumption of the carrier film can be reduced. And in the type which supplies an expensive strip | belt-shaped photoresist film with a carrier film continuously to a lamination molding apparatus, product cost can be reduced significantly by reduction of film consumption. Moreover, in this embodiment, since the mounting stage of the laminated material P1 and the unloading stage of the laminated molded product P2 can be used together, the overall length can be shortened as compared with the conventional laminated molded product manufacturing apparatus.

  In the present invention, after the laminated material is heated and pressurized, the film is transferred in the direction opposite to the transfer direction when the laminated material is carried in, and the laminated molding is performed from the loading / unloading port provided on one side of the laminated molding apparatus. The transfer device and the transfer method can be appropriately changed as long as the main purpose is to carry out the product and the product meets the main purpose. For example, when the upper surface of the laminated material may be brought into direct contact with the plate plate or the film body in the laminating apparatus, the second transfer device including the third roll and the fourth roll is not essential. Further, the first chuck device and the second chuck device are not essential, and the film can be transported only by rotational driving in the winding direction (forward rotation direction) of each roll, and the object can be achieved. . Furthermore, the first chuck device may be moved back and forth twice or more to carry the laminated material or laminated molded product into and out of the laminated molding device. Furthermore, it is also possible to use the first roll and the third roll that are not provided with a driving motor by moving the film in one direction only by the first chuck device. Also, in the case of providing a film operating device, only one of covering the laminated material before carrying in the laminated material or peeling from the laminated molded product after carrying out the laminated molded product may be performed.

  In addition, the laminated material used for this invention is not limited above, The combination of the plate-shaped body and film which consist of glass, a ceramic, a metal, resin, etc. is possible suitably, About the number of laminated materials and films laminated | stacked There is no limitation, and a large number of sheets may be laminated. Further, the film on which the laminated material or the laminated molded product is placed or the film that contacts the upper surface of the laminated material or the laminated molded product may also be a film in which the film laminated on the photoresist layer or the like is overlapped with the carrier film for conveyance. Moreover, the film laminated | stacked on a photoresist layer etc. may be conveyed in a lamination molding apparatus from the roll different from the roll of a carrier film.

  Further, the present invention is not enumerated one by one, but is not limited to the above-described embodiment, and it goes without saying that the present invention can be applied to those modified by a person skilled in the art based on the gist of the present invention. It is.

In the laminated molded product manufacturing apparatus of this embodiment, it is sectional drawing which shows the state in which the laminated material was mounted on the film. In the laminated molded product manufacturing apparatus of this embodiment, it is sectional drawing which shows the state by which the film was coat | covered with the laminated material. In the laminated molded product manufacturing apparatus of this embodiment, it is sectional drawing which shows the state in which the laminated material was carried in between the upper board | substrate and lower board | substrate of a laminated molding apparatus. In the laminated molded product manufacturing apparatus of this embodiment, it is sectional drawing which shows the state in which the laminated material is heated and pressurized in the laminated molding apparatus. It is sectional drawing which shows the state in which the laminated molded product heated and pressurized in the laminated molding apparatus was carried out in the laminated molded product manufacturing apparatus of this embodiment. In the laminated molded product manufacturing apparatus of this embodiment, it is sectional drawing which shows the state from which the film was peeled from the laminated molded product. In the laminated molded product manufacturing apparatus of this embodiment, it is sectional drawing which shows the state in which the used film is transferred.

Explanation of symbols

DESCRIPTION OF SYMBOLS 11 Laminated molding manufacturing apparatus 12 Laminated molding apparatus 13 Upper board 14 Lower board 15 Vacuum forming chamber 16, 20 Recessed part 17, 21 Plate board 18, 22 Film body 19, 24 Air flow path 23 O-ring 25 Loading / unloading outlet 26 Film Passage port 27 First transfer device 28 Second transfer device 29 First roll 30 Second roll 33 Third roll 34 Fourth roll 35 Film operating device 31, 32, 36, 37 Guide roll 38 First chuck device 39 Mounting stage 40 Second chuck device F1 Lower carrier film (film on which laminated material or laminated molded product is placed)
F2 Upper carrier film (laminate or film in contact with the upper surface of the laminated molded product)
P1 Laminated material P2 Laminated molded product A, B Transfer direction

Claims (5)

Laminating apparatus in which at least one surface of the laminated material is heated / pressurized via a film body or film in a vacuum forming chamber formed between the upper board and the lower board, and a film for placing the laminated material or the laminated molded product In a laminated molded product manufacturing apparatus provided with a transfer device that carries in and out of the laminated molding apparatus,
After heating / pressurizing the laminated material, the film is transferred in the direction opposite to the transfer direction at the time of loading the laminated material, and the laminated molded product is carried out from a loading / unloading port provided on one side of the lamination molding apparatus. An apparatus for manufacturing a laminated molded product. A transfer device is provided for carrying the film in contact with the upper surface of the laminated material or the laminated molded product into and out of the laminated molding device,
The laminated molded product manufacturing apparatus according to claim 1, wherein a film contacting the upper surface of the laminated material or the laminated molded product is transferred in synchronization with the transfer of the film on which the laminated material or the laminated molded product is placed. .   One of the laminate molding apparatuses may be configured to cover the laminate material or a film contacting the upper surface of the laminate molded product on the laminate material before carrying in the laminate material, or to peel from the laminate molded product after carrying out the laminate molded product. The apparatus for manufacturing a laminated molded product according to claim 2, wherein a film operating device for performing at least one of them is provided. The laminated material is placed on the film on which the laminated material or the laminated molded product is placed, the film is transferred, the laminated material is carried between the upper and lower boards of the laminated molding apparatus, and the upper and lower boards are brought into contact with each other. In a laminated molded product manufacturing method in which a vacuum forming chamber is formed by contact and vacuum suction, the laminated material is heated and pressurized via a film body or a film, and then the vacuum molded chamber is opened to carry out the laminated molded product.
After heating and pressurizing the laminated material, the film is transferred in the direction opposite to the transfer direction at the time of loading the laminated material, and the laminated molded product is carried out from a loading / unloading port provided on one side of the lamination molding apparatus. A method for producing a laminated molded product characterized by   Synchronously with the transfer of the film on which the laminated material or laminated molded product is transferred, the film contacting the upper surface of the laminated material or laminated molded product is transferred, and the laminated material is heated and pressurized via the upper and lower films. The method for producing a laminated molded product according to claim 4, wherein

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