JP2000135739A - Laminator and laminate holding method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a laminator and a laminate molding method capable of certainly preventing air from remaining between a material to be laminated and a film-like laminating material. SOLUTION: A laminator 1 is equipped with platens 11, 12 forming a chamber by holding a frame member between the platens, heaters 14, 15 heating the laminate molding material S in the chamber, the film member 16 pressurizing the laminate molding material, a vacuum means reducing the pressure in the chamber, a temporary clamp means 17 for temporarily clamping a film-like laminating material Sb to the front end edge in a feed direction of the undersurface of a material Sa to be laminated before arranged in the chamber, a transfer means transferring the film-like laminating material Sb and a setting table 19 supporting the material Sa to be laminated so as to be capable of feeding the same in the support means 18.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laminator and a laminating method, and more particularly, to a laminating material comprising a material to be laminated and a film-like laminating material formed so as to extend in a conveying direction having adhesiveness. And a laminating method for laminating by heating and pressurizing under a vacuum atmosphere.

[0002]

2. Description of the Related Art Printed wiring boards can be cited as examples of laminated moldings laminated by a laminator. In the case of manufacturing a printed wiring board, there is a step of laminating and forming a dry film photoresist in order to protect a conductive layer laminated on the surface of a single-layer or multilayer substrate from etching, plating, soldering and the like. Examples of the substrate as a material to be laminated include a laminated substrate in which a thermosetting resin such as a phenol resin or an epoxy resin is impregnated into glass fibers, and a so-called flexible substrate having flexibility made of a thermoplastic resin such as polyimide. There are types. In addition, a dry film photoresist as a film-like laminated material generally has a photosensitive layer applied to a base film,
The protective film is stuck on the surface of the photosensitive layer. The dry film photoresist is laminated by applying pressure to the surface of the circuit board in a state where the photosensitive layer has adhesiveness by heating.

As a conventional technique for laminating a film-like laminated material on a material to be laminated as described above, there is disclosed a method for attaching a film sheet to a panel disclosed in Japanese Patent Application Laid-Open No. 1-146641, a laminator used therefor, and the like. A method for laminating a film on a substrate and a laminator disclosed in JP-A-5-154918 are known. Another conventional technique is disclosed in Japanese Unexamined Patent Publication No.
196633, JP-A-2-196635,
And a laminator disclosed in Japanese Patent Application Laid-Open No. 2-196656 and the like.

[0004] In these conventional techniques, a film-like laminated material is temporarily attached (temporarily fastened) to the tip end of a material to be laminated, and the laminated molded material is fed between a pair of heatable laminating rolls to perform lamination molding. Things.

By the way, voids are liable to be generated between the laminated substrate or the flexible laminated substrate and the dry film photoresist due to bubbles and air remaining due to volatile components and the like of these laminated moldings. The generated voids may expand during a high-temperature treatment in a post-process such as a molten solder bath, and may damage a laminated dry film photoresist, resulting in poor protection of a printed wiring board, poor insulation, and poor conduction. May cause

Therefore, when laminating a laminated molded material such as the above printed wiring board, it is necessary to prevent a void from being generated between the material to be laminated and the film-shaped laminated material.
Lamination molding has been conventionally performed by heating and pressing a laminated molding material in a vacuum atmosphere.

[0007] As a conventional technique for laminating and forming a laminated molding material in a vacuum atmosphere, a vacuum laminating apparatus and a vacuum laminating method disclosed in Japanese Patent Application Laid-Open No. 10-641 are known. In the vacuum laminating apparatus disclosed in Japanese Patent Application Laid-Open No. 10-641, an upper plate and a lower plate which are provided so as to be able to approach and retreat opposite to each other, and a facing surface of the upper plate and the lower plate, respectively. The provided film body, heating means provided to heat either the film body of the upper plate or the lower plate,
A frame forming a closed chamber for accommodating the molding material by being sandwiched between the film bodies of the upper plate and the lower plate,
Suction means for evacuating the inside of the chamber, and optionally, each film body is brought into close contact with the opposing surface of the upper plate and the lower plate provided, and is separated from the opposing surface of the upper plate and the lower plate provided. And pressurizing means for pressurizing the material to be molded. Further, in this vacuum lamination method, the molding materials are positioned facing each other, and the pressure between the molding materials is reduced to 1 atm or less without pressurizing the molding materials. It is described that the material to be molded is heated while the surrounding pressure is maintained, and the film is pressed by a film body for bonding.

In such a vacuum laminating apparatus and method,
When laminating the dry film photoresist on both sides of the substrate, form the dry film photoresist in a continuous strip shape, and upper platen (upper plate) and lower platen (lower plate)
The substrate is placed on the lower side of the dry film photoresist at a predetermined pitch so as to pass the band-shaped dry film photoresist between them, and the continuous band-shaped dry film photoresist is longitudinally arranged. The substrate is conveyed between the platens by moving in the direction, that is, the material to be laminated is carried in between the platens and carried out between the platens by moving the film-like laminated material in the carrying direction. When laminating a dry film photoresist on one side of the substrate, the substrate is placed and transported on a strip-shaped carrier film in place of the lower dry film photoresist.

[0009]

Some photosensitive layers directly laminated to a film-like laminated material, particularly a dry film photoresist substrate, have adhesive (tackiness) properties even in a normal state before heating. (Also called). When placing and transporting the material to be laminated on such a highly tacky film-like laminated material, the film-like laminated material is laminated before the pressure in the chamber formed close to both platens is reduced. It will inadvertently adhere to the material. This is particularly noticeable when the material to be laminated is a laminated substrate that is heavier than a flexible laminated substrate.
As a result, even if the pressure in the chamber is reduced, air remaining between the film-like laminated material and the material to be laminated is not removed,
When manufacturing a printed wiring board, there is a problem that voids are generated.

The present invention has been made in view of the above-mentioned problems, and has a simple structure. Even if the film-shaped laminated material has a high tackiness, the laminated material is not pressed until the film-shaped laminated material is pressed. It is intended to provide a laminator and a lamination molding method that can prevent a laminate material and a film-like laminate material from inadvertently adhering, thereby reliably preventing air from remaining between them. Aim.

[0011]

According to a first aspect of the present invention, there is provided a laminator comprising:
A chamber comprising a material to be laminated and a film-like laminated material having an adhesiveness formed to be narrower than the material to be laminated and to extend in the transport direction, and arranged to face each other and to be openable and closable; , A heating means for heating the laminated molded material disposed in the chamber, a flexible film provided on at least one of the opposing surfaces of the platen, and evacuation of the chamber A pressure reducing means, and a film body operating means for adsorbing the film body on the opposing surface of the platen provided and expanding the laminated body so as to pressurize the laminated body, and heating the laminated body under a vacuum atmosphere. A laminator for laminating and molding by pressing, and a temporary fixing means for temporarily fixing the film-like laminated material to the front edge in the transport direction of the lower surface of the material to be laminated before being disposed in the chamber, In the chamber, supporting means for supporting a portion of the side edge along the transport direction of the material to be laminated, which is outside the width of the film-shaped laminated material, and transport means for transporting the film-shaped laminated material in the transport direction. It is characterized by having.

According to a second aspect of the present invention, there is provided a laminator according to the first aspect of the invention.
The present invention is characterized in that a loading means is provided for supporting a portion of the material to be laminated outside the width of the film-like laminated material so as to be able to be loaded into the support means in the chamber.

According to a third aspect of the present invention, there is provided a laminator according to the second aspect, wherein:
While one platen was fixed, the other platen was movably supported so as to approach and separate from the one platen, and the support means was provided on one of the platens, and was supported by the carry-in means. In order to carry the material to be laminated into the supporting means, the apparatus further comprises a follow-up moving means for following the carrying-in means with the movement of the other platen.

Further, the invention of the laminating method according to claim 4 is as follows.
In order to achieve the above object, the laminated molding material is composed of a material to be laminated, and a film-like laminated material having an adhesiveness formed to be narrower than the material to be laminated and extend along the transport direction. The laminated molded material is arranged between platens that are openably and closably opposed to each other, and the laminated molded material is accommodated in a closed chamber by closing the platen, and the laminated molded material is placed in the chamber without pressurizing the laminated molded material. And pressurizing with a flexible film body to laminate and form the laminated molded material, wherein the lower surface of the material to be laminated is transported before being placed between the platens. The film-like laminated material is temporarily fastened to the front edge in the direction, and the material to be laminated is transported between the platens by transporting the film-like laminated material in the transport direction until the film is pressed by the flexible film body. The width of the film-like laminate at the side edge along the transport direction of the material to be laminated so that the film-like laminate does not contact a portion other than the portion temporarily fixed to the front edge of the lower surface of the material to be laminated in the transport direction. It is characterized in that it supports a portion outside of it.

According to the first aspect of the present invention, the film-like laminated material is temporarily fixed to the front edge in the transport direction of the lower surface of the material to be laminated before being disposed in the chamber by the temporary fixing means. Then, the film-like laminated material is transported in the transport direction by the transport means, and the material to be laminated is carried into the support means and supported. In the material to be laminated, a portion of the side edge along the transport direction, which is outside the width of the film-like laminated material, is supported by the support means. The film-shaped laminated material does not come into contact with portions other than the portion temporarily fixed to the material to be laminated. A chamber is formed by closing both platens, and the inside of the chamber is evacuated by the depressurizing means while the film body is not pressed by the pressurized film body operating means. Then, the laminated material is heated by the heating means, and the film body is operated and pressurized by the pressurized film body operating means to laminate and form the film-like laminated material into the material to be laminated.

According to a second aspect of the present invention, in the first aspect, the material to be laminated is carried into the supporting means by the carrying means. Since the carrying-in means supports the portion of the material to be laminated outside the width of the film-like laminated material, the film-like laminated material does not come into contact with portions other than the portion temporarily fixed to the material to be laminated.

According to a third aspect of the present invention, in accordance with the second aspect of the present invention, as the platen moves, the carrying-in means moves by the follow-up moving means to reliably transfer the material to be laminated to and from the support means. Be aligned so that you can.

According to the fourth aspect of the present invention, if the film-like laminated material is temporarily fixed to the front edge in the carrying direction of the lower surface of the material to be laminated before being arranged between the platens, the film-like laminated material is transferred in the carrying direction. The material to be laminated is transported between the platens. Thereafter, by closing both platens, a chamber accommodating the material to be laminated is formed, the inside of the chamber is depressurized without pressurizing the laminated molded material, the laminated molded material is heated, and the laminated molded material is heated by a flexible film body. The laminate is molded by pressing. The material to be laminated is supported by a portion of the side edge along the transport direction, which is outside the width of the film-like laminated material, so that the film-like laminated material is pressed until it is pressed by the flexible film body. The material does not come into contact with the part other than the temporarily fixed part.
Therefore, when the laminated molded material is heated and pressurized in a state where the pressure in the chamber is reduced, the laminated molded material is laminated without air remaining between the material to be laminated and the film-shaped laminated material.

[0019]

DESCRIPTION OF THE PREFERRED EMBODIMENTS First, an embodiment of a laminator according to the present invention will be described in detail with reference to FIGS. In the drawings, the same reference numerals denote the same parts or corresponding parts. The laminator 1 of the present invention is for laminating and molding a laminated molding material S by heating and pressurizing in a vacuum atmosphere, and in this embodiment, a laminating material such as a phenol resin or an epoxy resin is used. On the surface of a single-layer or multi-layer laminated substrate Sa in which a curable resin is impregnated into glass fiber, a width slightly smaller than the width Wa of the laminated substrate Sa, as a film-like laminated material formed in a continuous band shape A dry film photoresist Sb having high tackiness is laminated. The laminator 1 is opposed to each other and is openable and closable, and platens 11 and 12 forming a chamber by sandwiching a frame 13 therebetween, and a heating unit 1 for heating a laminated molded material S disposed in the chamber.
4, 15 and at least one of the platens 11,
12, a flexible film body 16 provided on the opposite surface of
Depressurizing means (described later) for evacuating the chamber, and film operating means (described later) for adsorbing the film body 16 on the opposing surface of the platen 12 provided with the film body and expanding the laminated molded material S to pressurize the same. A temporary fixing means 17 for temporarily fixing the dry film photoresist Sb to the front edge of the lower surface of the laminated substrate Sa in the transport direction before being placed in the chamber; and a side along the transport direction of the laminated substrate Sa in the chamber. Rim,
A supporting means 18 for supporting a portion of the dry film photoresist Sb outside the width Wb, a transfer means (described later) for transferring the dry film photoresist Sb in the transport direction, and a dry film photo on a side edge of the laminated substrate Sa. The portion outside the width Wb of the resist Sb is supported by the support means 1
8 is provided with a loading means 19 for supporting the loading means 8 and a follow-up moving means 20 for following-moving the loading means 19.

As shown in FIG. 1, in a concave portion 30 formed on the lower surface of the upper platen 11, a heat insulating material 31, a heater 14 as a heating means, and an upper platen 32 formed smoothly are sequentially arranged. Is provided. The recess 30 has a connection port 33 to which a pipe of the suction means is connected. Thermal insulation 31,
A gap 34 is formed between the heater 14 and the side of the upper platen 32 and the recess 30 so as to communicate with the connection port 33 and open into the chamber. A connection port 33 and an interval 34 are provided between the upper platen 11 and the heat insulating material 31.
Are formed in a lattice pattern.

On the other hand, on the upper surface of the lower platen 12, a heat insulating material 41, a heater 15 as a heating means, and a lower platen 42 are sequentially provided. The lower platen 12 is provided with a connection port 43 to which a pipe of the membrane operating means is connected. A passage 41 a is formed between the lower platen 12 and the heat insulating material 41 so as to communicate between the side surface thereof and the connection port 43, and a hole is formed in the heat insulation material 41 and the heater 15 so as to be continuous with the connection port 43. 41b and 15b are respectively formed,
Further, the lower platen 42 is formed of a member having air permeability such as, for example, punching metal.

Heat insulating material 41, heater 15, and lower platen 4
A frame 13 formed so as to be able to form a chamber for accommodating the laminated molded material S higher than these heights around the periphery of the frame 13
Is installed. A sealing material 50 such as an O-ring is provided on a surface of the frame body 13 that comes into contact with the upper platen 11. In this embodiment, the lower platen 12 is supported by a cylinder or the like (not shown), and is moved up and down so as to approach / retreat from the upper platen 11. When the lower platen 12 is moved upward so as to approach the upper platen 11, the frame 13 is sandwiched between the upper platen 11 and the lower platen 12, thereby forming an airtight chamber.

In the case of this embodiment, the film body 16 is provided only on the lower platen 12, and its peripheral edge is formed over the entire circumference so that airtightness with the lower platen 12 is maintained. 13 is fixed. The present invention is not limited to this embodiment, and only the upper platen 11 or both the upper platen 11 and the lower platen 12
6 can also be provided.

As shown in FIG. 2, the upper platen 11 has
In the case of this embodiment, a support means 18 having a cross section formed in a substantially hook shape for supporting a side edge in the width direction with respect to the transport direction of the laminated substrate Sa is provided on the side edge of the upper surface plate 32 in the longitudinal direction. Is provided so as to extend along both side edges of the dry film photoresist Sb conveyed. Supporting means 1
Numeral 8 is set so as to be accommodated inside the frame 13 when the chamber is formed and not to interfere with the film 13 on the surface of the lower stool 42. The distance Wc between the two support means 18 having a hook-like cross section is wider than the width Wb of the dry film photoresist Sb and the width W of the laminated substrate Sa.
It is set to be narrower than a. The carry-in side and the carry-out side of the support means 18 are formed to be inclined so that the laminated substrate Sa can be smoothly transported.

The dry film photoresist Sb is obtained by applying a photosensitive layer to a base film formed so as to be continuous in a band shape (not shown), and the surface of the photosensitive layer is formed in a band shape like the base film. The protective film Sf formed so as to be continuous is adhered and wound in a roll shape. In this embodiment, a dry film photoresist Sb from which the protective film Sf has been peeled off is formed on both upper and lower surfaces of the laminated substrate Sa. On the unloading side (the left side in FIG. 1) of the laminator 1, as a transfer means for transporting the dry film photoresist Sb, which has been formed by lamination on the laminated substrate Sa, in the longitudinal direction thereof by grasping and moving both side edges thereof. A chuck (not shown) is provided. On the other hand, laminator 1
On the loading side (right side in FIG. 1), the chuck is rotatably supported so that the dry film photoresist Sb can be pulled out when the chuck grips the side edge of the dry film photoresist and moves. A roll of dry film photoresist Sb is provided. Also,
On the roll of the dry film photoresist Sb, rolls for winding the protective film Sf peeled off from the dry film photoresist Sb are respectively arranged so as to rotate following the roll rotation of the dry film photoresist Sb. I have. The upper dry film photoresist Sb is arranged so as to be stretched with a predetermined tension between the upper surface plate 32 and the laminated substrate Sa supported by the support means 18 via the intermediate rollers 51 and 52. Also, the lower dry film photoresist Sb
Are connected to the film body 16 and the like via the intermediate roller 53
It is arranged so as to be stretched with a predetermined tension between the substrate and the laminated substrate Sa supported by the substrate.

Between the loading side of the laminator 1 and the intermediate roller 53 of the lower dry film photoresist Sb,
Before being placed in the chamber, the laminated substrate Sa can be loaded into the temporary fixing means 17 for temporarily fixing the dry film photoresist Sb to the front side edge of the lower surface of the laminated substrate Sa and the support means 18 provided on the upper platen 11. The setting table 19 as a carrying-in means for supporting the laminated substrate Sa is provided.

As shown in FIG. 3, the setting table 19 stores the dry film photoresist Sb to be transported.
The supporting members 55 extend along both side edges of the supporting substrate 55. Each supporting member 55 is formed with a step 55a that supports a side edge in the width direction with respect to the transport direction of the laminated substrate Sa. The rear (right side in FIG. 1) of the setting table 19 is pivotally supported by a pivot 56, and the free end in front of the setting table 19 (left side in FIG. 1) is a step formed on the frame 13 of the lower platen 12. 13a. The setting table 19 can be lowered about the pivot 56 as the lower platen 12 moves up and down. The lowermost position of the free end of the setting table 19 is set to be equal to or higher than the height of the intermediate roller 53 around which the lower dry film photoresist Sb is wound.

The temporary fastening means 17 includes a pressing member 60 for pressing the lower dry film photoresist Sb against the laminated substrate Sa, and a laminated substrate on which the lower dry film photoresist Sb is pressed by the pressing member 60. Sa
And a receiving member 61 for receiving the light. The pressing member 60 and the receiving member 61 are connected to the setting table 1.
9 so as to be aligned with the front edge of the laminated substrate Sa placed on the substrate 9. The pressing member 60 is supported by a driving means (not shown) such as an air cylinder so as to approach / retreat from the receiving member 61. The pressing member 60 increases the tackiness by heating the dry film photoresist Sb when the tackiness of the dry film photoresist Sb is relatively low and the pressing member 60 cannot be temporarily fixed to the laminated substrate Sa only by pressing. (Not shown).

The present invention is not limited to this embodiment. For example, the film body 16 and the frame body 13 may be provided on the upper platen 11, and the support means 18 may be provided on the lower platen 12. In this case, the supporting means 18 can form a step similar to the supporting member 55 provided on the setting table 19. Further, the support member 55 provided on the setting table 19 may be formed so that a cross section similar to that of the support means 18 has a hook shape instead of the step portion 55a. In this embodiment, the laminated substrate S
a, the dry film photoresist Sb is laminated and formed on both sides.
The dry film photoresist Sb can be laminated and formed only on the lower surface of the substrate. Furthermore, the laminated molding material S is not limited to the case where the laminated substrate Sa and the dry film photoresist Sb are laminated and molded, but may be applied to the case where another laminated material and a film-shaped laminated material are laminated. it can.

Next, the laminating method of the present invention will be described in detail by using the laminator 1 configured as described above. According to the lamination molding method of the present invention, a dry film photoresist Sb formed so as to be continuous in a band shape is disposed between platens 11 and 12 which are arranged to be openable and closable in opposition to each other.
b, only the front edge of the laminated substrate Sa in the transport direction is temporarily fixed,
The dry film photoresist Sb is transferred to the lower surface of the laminated substrate Sa until the laminated substrate Sa is carried between the platens 11 and 12 and pressed by the flexible film body 16. In order not to contact a portion other than the portion temporarily fixed to the front end of the laminated substrate Sa, a portion of the side edge along the transport direction of the laminated substrate Sa outside the width Wb of the dry film photoresist Sb is supported, and the platen 11 is supported. , 12 are closed to accommodate the laminated substrate Sa on which the dry film photoresist Sb is temporarily fixed in a closed chamber, and the inside of the chamber is depressurized without pressurizing the laminated molded material S. S is heated and pressurized by the flexible film body 16 to laminate and form the laminated material S.

First, the lower platen 12 is connected to the upper platen 11
From both platens 11, 1
The dry film photoresist Sb formed so as to be continuous in a band shape between the two is at a predetermined tension,
It is arranged to be stretched. The upper dry film photoresist Sb is stretched so as not to loosen so as not to come in contact with the laminated substrate Sa supported by the support means 18, and the lower dry film photoresist Sb is supported by the support means 18 and the setting table 1.
The laminated substrates Sa supported by the nine supporting members 55 are stretched with enough tension so that they do not come into contact with each other. Such a desired tension can be obtained by adjusting the rotational resistance of the roll when both dry film photoresists Sb are gripped and transferred by a chuck (not shown).

In a state where the lower platen 12 is lowered most away from the upper platen 11, the free end of the setting table 19 is connected to the lower dry film photoresist S.
approaching b. When the pressing member 60 is raised in this state, the lower dry film photoresist Sb comes into contact with the front edge of the lower surface of the laminated substrate Sa and the receiving member 6
1 and is temporarily fixed.

Next, the pressing member 60 is lowered, and the lower platen 12 is moved up with respect to the upper platen 11. Following this movement, the setting table 19
The height position of the free end of the support means 18 is different from the height position of the support means 18 so that the laminated substrate Sa on which the lower dry film photoresist Sb is temporarily fixed can be transferred to the support means 18. The lower platen 12 is moved up until it is aligned. At this time, the height of the intermediate roller 53 around which the lower dry film photoresist Sb is wound is lower than the lowest position of the free end of the setting table 19, and the lower side temporarily fixed to the laminated substrate Sa. Since the dry film photoresist Sb is stretched with a tension that causes slack, the lower dry film photoresist Sb does not come into contact with a portion other than the temporarily fixed portion of the laminated substrate Sa.

In this state, the side edges of both dry film photoresists Sb are gripped and moved by a chuck (not shown) to transport both dry film photoresists Sb in the longitudinal direction. Since the distance Wd between the support member 18 and the support member 55 of the setting table 19 is set to be smaller than the width Wa of the laminated substrate Sa and wider than the width Wb of the lower dry film photoresist Sb, the lower dry film The side edge of the laminated substrate Sa on which the photoresist Sb is temporarily fixed is supported by the support member 55 or the support means 18 of the setting table 19, and the lower dry film photoresist Sb is supported by the support member 55.
Thus, the laminated substrate Sa on which the lower dry film photoresist Sb has been temporarily fastened is transported from the support member 55 of the setting table 19 to the support means 18. The Rukoto. At the same time, a laminated substrate Sa on which a dry film photoresist Sb has already been laminated is formed.
Is carried out between the platens 11 and 12. The pitch of the laminated substrate Sa temporarily fixed to the lower dry film photoresist Sb is set such that the laminated substrate Sa is moved from the supporting member 55 of the setting table 19 to the supporting means 18 by one movement of a chuck (not shown).
So that the laminated substrate Sa on which the dry film photoresist Sb is laminated and formed can be reliably carried out from between the platens 11 and 12. It is set based on the movement stroke of the chuck that is not performed, the size of the frame 13, and the like.

The lower dry film photoresist Sb
Is transported to the supporting means 18, the lower platen 12 is further moved upward to move the frame 13.
Is sandwiched between the platen 11 and the upper platen 11 to form an airtight chamber containing the laminated substrate Sa in a state where the lower dry film photoresist Sb is temporarily fixed. Subsequently, the membrane operating means is operated to reduce the pressure through the connection port 43. A passage 41a communicating between the side surface of the heat insulating material 41 and the connection port 43 is formed, and holes 41b and 15b are formed in the heat insulating material 41 and the heater 15 so as to be continuous with the connection port 43, respectively. Since the lower platen 42 is made of a member having air permeability, decompression by the film body operating means acts to bring the film body 16 into close contact with the entire surface of the lower platen 42. In this state, the suction means is operated to reduce the pressure in the chamber through the connection port 33. A gap 34 is formed between the side of the heat insulating material 31, the heater 14, and the upper platen 32 and the recess 30 so as to communicate with the connection port 33 and open into the chamber. Reduced pressure acts to evacuate the entire chamber. At this time, since the film body 16 is in close contact with the lower platen 42 by the film body operating means, when the inside of the chamber is depressurized, the film body 16 inadvertently expands in the chamber and pressurizes the laminated molded material S. Is prevented.

When the pressure in the chamber is reduced, each platen 1
The dry film photoresist Sb is heated by the heaters 14 and 15 provided in the heaters 1 and 12, and the decompression of the film operating means is stopped and the film 16 is expanded by the decompression in the chamber by the suction means, or ,
By stopping the decompression by the film body operating means and supplying a working fluid such as compressed air through the connection port 43 to expand the film body 16, the laminated molded material Sa is pressed against the upper surface plate 32. Apply pressure. Connection port 43 by the membrane operating means
In the case where the working fluid is supplied through the same, the working fluid acts on the entire film body 16 to expand uniformly, similarly to the pressure reducing action.

Since the portions outside the width Wb of the dry film photoresist Sb on both side edges of the laminated substrate Sa are supported by the support means 18, the pressure in the chamber is reduced until the pressure is applied by the film body 16. In addition, the dry film photoresist Sb does not come into contact with a portion other than the portion temporarily fixed to the front edge of the lower surface of the laminated substrate Sa. for that reason,
Even if the dry film photoresist Sb has a high tackiness, it is prevented from inadvertently adhering to the laminated substrate Sa, and the inside of the chamber is depressurized to reduce the space between the laminated substrate Sa and the dry film photoresist Sb. Air does not remain, so that the generation of voids can be reliably prevented, and the production efficiency of the printed wiring board can be increased.

[0038]

According to the first aspect of the present invention, the temporary fixing means for temporarily fixing the film-like laminated material to the front edge in the transport direction of the lower surface of the material to be laminated before being placed in the chamber; By providing support means for supporting a portion outside the width of the film-shaped laminated material on the side edge along the transport direction of the material to be laminated, and transport means for transporting the film-shaped laminated material in the transport direction, Until the laminated material is pressed by the film body with a simple configuration, even if the film-like laminated material has a high tackiness, the material to be laminated and the film-like laminated material are not inadvertently adhered. Therefore, it is possible to provide a laminator that can reliably prevent air from remaining between the two.

According to the second aspect of the present invention, in the first aspect of the present invention, the loading means for supporting the portion of the material to be laminated outside the width of the film-like laminated material so as to be able to be loaded into the supporting means in the chamber. By providing the laminator, it is possible to provide a laminator that can reliably transfer the material to be laminated into the chamber without inadvertently attaching the material to be laminated to the film-like laminated material.

According to the third aspect of the present invention, in the second aspect, one of the platens is fixed and the other platen is movably supported so as to be close to and away from the one platen. Is, when the support means is provided on any one of the platens, so that the material to be laminated supported by the carry-in means can be carried into the support means,
By providing a follow-up moving means for moving the carrying-in means in accordance with the movement of the other platen, the carrying-in means can be surely aligned with the supporting means by the movement of the other platen. It is possible to provide a laminator that can more reliably transfer the material into the chamber.

According to the fourth aspect of the present invention, the film-like laminated material is temporarily fixed to the front edge in the carrying direction of the lower surface of the material to be laminated before being disposed between the platens, and the film-like laminated material is transported in the carrying direction. Until the material to be laminated is conveyed between the platens and pressed by the flexible film body, the portion other than the portion where the film-like laminated material is temporarily fastened to the front edge in the conveyance direction of the lower surface of the material to be laminated With a simple configuration that supports the outer edge of the width of the film-like laminated material on the side edge along the transport direction of the material to be laminated so that it does not touch the laminated material, until the laminated molded material is pressed by the film body Can prevent the material to be laminated and the film-like laminated material from inadvertently adhering even when the film-like laminated material has high tackiness, so that air remains between them. Sure It is possible to provide a laminator which can be prevented.

[Brief description of the drawings]

FIG. 1 is a front view showing one embodiment of a laminator of the present invention.

FIG. 2 is a sectional view taken along line AA of FIG.

FIG. 3 is a sectional view taken along line BB of FIG. 1;

[Explanation of symbols]

S Laminated Molding Material Sa Laminated Substrate (Laminated Material) Sb Dry Film Photoresist (Film Laminated Material) Wa Laminated Substrate Width Wb Dry Film Photoresist Width 1 Laminator 11 Upper Platen 12 Lower Platen 13 Frame 14, 15 Heater (Heating means) 16 Membrane 17 Temporary fastening means 18 Supporting means 19 Setting table (Loading means) 20 Following moving means

Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat II (reference) B29L 9:00 F term (reference) 4F100 AG00 AK01B AK33 AK53 AT00A BA02 BA03 BA06 BA10B BA13 DB01 DH02 EC182 EJ202 EJ242 EJ422 EJ911 EJ931 EK03 EK06 GB43 JK15 JL02 JL05 JL13B 4F211 AD08 AD20 AH36 AM26 AM28 TA03 TC02 TD11 TJ11 TJ22 TJ30 TN07 TN67 TQ08 TQ13 5E339 CC01 CC10 CD01 CE16 EE04 EE10 GG01 GG02

Claims (4)

[Claims] The laminated molded material comprises a material to be laminated, and a film-like laminated material having an adhesiveness formed to be narrower than the material to be laminated and to extend along the transport direction, A platen that is arranged to be openable and closable opposing to each other to form a chamber; a heating unit that heats the laminated molded material arranged in the chamber; and a flexible member provided on at least one of the opposing surfaces of the platen. A film body, a pressure reducing means for evacuating the chamber, and a film body operating means for adsorbing the film body on an opposing surface of a platen provided thereon and expanding the laminated molded material so as to pressurize the laminated body. A laminator that heats and presses a material in a vacuum atmosphere to form a laminate. The laminator is placed on the front edge of the lower surface of the material to be laminated in the transport direction before being placed in the chamber. A temporary fixing means for temporarily fixing the film-like laminated material; a supporting means for supporting a portion of a side edge along a conveying direction of the material to be laminated outside the width of the film-like laminated material in the chamber; Transfer means for transferring in the direction;
A laminator characterized by comprising: 2. The apparatus according to claim 1, further comprising a loading means for supporting a portion of the material to be laminated outside a width of the film-like laminated material so as to be able to be loaded into the supporting means in the chamber. Laminator. 3. One of the platens is fixed, and the other platen is movably supported so as to approach and separate from the one platen, and a supporting means is provided on one of the platens. 3. The laminator according to claim 2, further comprising a follow-up moving unit that moves the carry-in unit with the movement of the other platen so that the material to be laminated supported by the unit can be carried into the support unit. . 4. A laminated molded material comprises a material to be laminated, and a film-like laminated material having an adhesiveness formed to be narrower than the material to be laminated and to extend along the transport direction, The laminated molding is placed between the platens arranged to be openable and closable opposing each other, and the platen is closed to accommodate the laminated molding in a closed chamber and depressurize the inside of the chamber without pressurizing the laminated molding. A method of laminating and molding the laminated material by heating and pressing the laminated material with a flexible film body, wherein the front end in the transport direction of the lower surface of the material to be laminated is disposed before being placed between the platens. The film-like laminated material is temporarily fastened to the edge, the material to be laminated is transported between the platens by transporting the film-like laminated material in the transport direction, and the material is pressed until it is pressed by the flexible film. The width of the film-like laminated material at the side edges along the transport direction of the material to be laminated so that the laminated material does not contact any part other than the part temporarily fixed to the front edge of the material to be laminated on the lower surface of the material to be laminated. A laminate forming method, wherein the outer part is also supported.