JP3243598B2 - Vacuum laminating apparatus and vacuum laminating method - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a vacuum laminating apparatus and a vacuum laminating method for laminating a material to be formed by heating and pressing under a vacuum atmosphere.

[0002]

2. Description of the Related Art For example, when a printed wiring board is manufactured, a substrate made of a thermosetting resin such as a phenol resin or an epoxy resin or a flexible base film made of a thermoplastic resin such as a polyimide is used. There is a step of forming a circuit board by laminating a patterned or etched copper foil in a later step (hereinafter, the former is simply called a laminated board and the latter is called a flexible laminated board). In the case of molding the laminated substrate, a substrate made of a thermosetting resin and a copper foil are heated and pressurized in a vacuum atmosphere, and the substrate is plasticized by a chemical reaction of the thermosetting resin and adhered and laminated with the copper foil. Then, the substrate to which the copper foil is adhered is further cured by a chemical reaction. In the case of molding the flexible laminated substrate, a base film and a copper foil made of a thermoplastic resin are heated and pressed under a vacuum atmosphere, and the base film is adhered and laminated with the copper foil by plasticizing the thermoplastic resin. .

In order to protect the laminated copper foil from etching, plating, soldering, etc., a film-like photoresist forming layer composed of a support film and a photosensitive layer is provided on these laminated substrates and flexible laminated substrates. There is a step of thermocompression bonding to the surface of the substrate. The photoresist forming layer has tackiness when heated, and is pressed and laminated on the surface of the circuit board.

[0004] By the way, air bubbles such as volatile components of the material to be molded are present between the laminate of the laminated substrate or the flexible laminated substrate and the copper foil, and between the circuit board on which these are laminated and the film-like photoresist forming layer. The voids are liable to be generated due to the remaining. The generated voids may expand during a high-temperature treatment in a post-process, such as a molten solder bath, and may damage the laminated copper foil or the film-like photoresist forming layer. There is a risk of causing poor conductivity.

Therefore, like the above-mentioned printed wiring board,
2. Description of the Related Art When laminating various molding materials, molding has been conventionally performed by heating and pressurizing the molding materials in a vacuum atmosphere so as not to generate voids between the molding materials.

[0006] As a conventional method for laminating a plurality of plate-shaped, sheet-shaped or film-shaped materials as in the case of manufacturing such a printed wiring board, Japanese Patent Publication No. 55-13341 is disclosed. As disclosed in the publication, a photoresist forming layer adhered to a film support is adjacent to the surface of the circuit board, the area between the surface of the circuit board and the photoresist forming layer and the absolute The pressure is reduced to 1 atm or less, the photoresist forming layer is pressed onto the surface of the circuit board by pressing the film support serving as a pressure transmitting layer, and the photoresist forming layer is heated to be softened and laminated. Are known.

Further, as a conventional vacuum laminating apparatus, Japanese Patent Application Laid-Open Nos. 63-295218 and 63-29989
As disclosed in Japanese Patent Application Publication No. 5 (1993) -5, a cylindrical rubber is provided in a heating vessel, or a rubber sheet is stretched in a vacuum chamber that can be opened and closed, and a vacuum is applied in the cylindrical rubber or between the rubber sheets. One with a pump connected is known. In these vacuum laminating apparatuses, a material to be molded is placed in a cylindrical rubber or between rubber sheets, and the material to be molded is heated and pressurized by sealing the cylindrical rubber or the rubber sheet to create a vacuum. .

[0008]

However, when a thermosetting resin is laminated as in the case of the above-mentioned laminated substrate, the curing reaction occurs before the thermosetting resin is pressurized by heat conduction or radiant heat in the chamber. Has progressed, and there has been a problem that poor adhesion to a molding material such as a copper foil occurs. In the case of laminating a thermoplastic resin as in the case of the flexible laminated substrate, plasticization of the molding material proceeds too much before being pressurized by heat conduction or radiant heat in the chamber, causing wrinkles or the like. There has been a problem that the accuracy of positioning and the like is reduced. Further, even after the lamination is completed, the heat at the time of heating remains in the material to be molded, and there is a problem that wrinkles are generated due to uneven heat shrinkage due to a temperature drop of the material to be molded. Also, in the case where the film-like photoresist forming layer is thermocompression-bonded to the surface of the circuit board, wrinkling occurs due to excessive softening of the film-like photoresist forming layer, as in the case of laminating a thermoplastic resin. And a problem such as a decrease in the accuracy of alignment occurs.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problem, and it is an object of the present invention to appropriately stack a plurality of plate-like, sheet-like, or film-like materials according to the temperature conditions of the material. It is an object of the present invention to provide a vacuum laminating apparatus and a vacuum laminating method that can perform the above.

[0010]

SUMMARY OF THE INVENTION In order to achieve the above object, an aspect of the present invention is to provide an upper plate and a lower plate which are provided so as to be able to approach and retreat to each other, and the upper plate and the lower plate. A film body provided on each of the opposing surfaces of the plate, a heating unit provided to heat either the upper plate or the lower plate, and the other film body of the upper plate or the lower plate. A cooling means provided for cooling, a frame forming a closed chamber for accommodating the molding material by being sandwiched between the film bodies of the upper plate and the lower plate, and evacuation of the chamber The suction means and optionally each film body are brought into close contact with the opposing surfaces of the upper plate and the lower plate provided thereon, and are separated from the opposing surfaces of the upper plate and the lower plate provided thereon to apply the molding material. And a contact / pressing means for pressing.

A feature of the invention according to claim 2 is that the material to be formed faces each other between the film bodies provided on the opposing surfaces of the upper plate and the lower plate which are provided so as to be close to and retreat from each other. To form a closed chamber containing the molding material between the film bodies, and reduce the pressure in the chamber to 1 atm or less without pressurizing the molding material to the film body, and then maintain the reduced pressure in the chamber. The molding material is heated and bonded by heating means provided to heat the film material of either the upper plate or the lower plate while pressing the molding material therebetween by the film body, and thereafter, further, Cooling the molding material by cooling means provided so as to pressurize the molding material with the film body therebetween while maintaining the reduced pressure in the chamber and to cool the other film body, either the upper plate or the lower plate. It is in.

In the vacuum laminating apparatus according to the present invention, when a molding material is arranged between the upper and lower plates and the upper and lower plates are brought close to each other, the frame is sandwiched between the films. Thus, a closed chamber is formed. When the film body is brought into close contact with the upper plate and the lower plate by operating the contact / pressing means, and the inside of the chamber is evacuated by the suction means, the volume in the chamber is reduced, so that the molding material is not pressed. The pressure around the molding material is reduced. In this state, one of the upper plate and the lower plate is separated from the opposing surface by the close contact / pressurizing means, and the molding material is pressed between the other film and the heating means by the heating means. And stack. When the lamination of the material to be formed is completed, pressurization by either the upper plate or the lower plate is stopped by the close contact / pressurizing means, and the other film is separated from its opposing surface, and the one film is removed. The molded product laminated with the body is pressurized and cooled by cooling means. When the molded article is cooled, the heat generated by the heating means is cooled and stabilized. The suction means and the contact / pressurization means are stopped, the chamber is communicated with the atmosphere, the upper plate and the lower plate are separated from each other, and the molded product is taken out.

Further, in the vacuum lamination method of the present invention, the material to be formed is placed between the film bodies provided on the opposing surfaces of the upper plate and the lower plate, facing each other, and the material to be formed is accommodated between the film bodies. A closed chamber is formed, and the inside of the chamber is depressurized to 1 atm or less without pressurizing the molding material to the film body. From this state, when the molding material is pressurized and heated between the film bodies, The molding materials are laminated without generating voids.
When the lamination is completed, the material to be molded is pressurized between the film bodies and cooled by cooling means. The molded product is stabilized by cooling the heat during lamination.

[0014]

DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of a vacuum laminating apparatus according to the present invention will be described in detail with reference to FIGS. 1 to 4, but the invention is not limited to this embodiment. In addition,
In the drawings, the same reference numerals denote the same or corresponding parts.

As shown in FIG. 1, the vacuum laminating apparatus according to the present invention comprises an upper plate 1 and a lower plate 2 which are provided so as to be able to approach and retreat from each other. Film members 3 and 4 respectively provided on the opposed surfaces of the above, heating means 5 for heating the material to be molded, cooling means 6 for cooling the material to be molded, and films of the upper plate 1 and the lower plate 2 A frame 8 forming a closed chamber 7 for accommodating a molding material by being sandwiched between the bodies 3 and 4; a suction means (not shown) for evacuating the chamber 7; Each film body 3, 4
Is in close contact with the opposing surfaces of the upper plate 1 and the lower plate 2 provided thereon, and is separated from the opposing surfaces of the upper plate 1 and the lower plate 2 provided thereon, and pressurizes the molding material. (Not shown). In this embodiment, the upper plate 1 is fixed, the lower plate 2 is supported by elevating means (not shown), and the lower plate 2 is
Are configured to move close and far.

A heating means 5 for heating the material to be formed is provided on the lower surface of the upper plate 1 via a heat insulating material 11, and an upper surface plate 12 forming a smooth opposing surface is provided on the lower surface of the heating means 5. Is provided. Further, on the lower surface of the upper plate 1, a film body 3 is provided by a pressing member 13 so as to be able to contact and separate from the smooth lower surface of the upper stool 12. In this embodiment, an electric heater is used as the heating means 5 so as to heat the material to be formed via the upper platen 12 and the film body 3. However, the heating means 5 is not limited to this. A flow path for circulating a heating fluid such as water or steam may be formed.

The upper plate 1 is formed of a substantially rectangular flat plate, and a passage 15 having a port connected to a contact / pressurizing means is penetrated substantially in the center thereof. A plurality of grooves 16 are formed on the surface in contact with the upper plate 1 of the heat insulating material 11 so as to open to the peripheral side surface of the heat insulating material 11 in a lattice pattern and communicate with the passage 15. The film body 3 is made of a material having elasticity, flexibility, heat resistance and the like, for example, a material such as silicon rubber or fluorine rubber (rubber hardness Hs (JIS A): about 40 to 60). The holding member 13 is a frame that can surround the heat insulating material 11, the heating means 5, and the upper surface plate 12. The holding member 13 is attached to the lower surface of the upper plate 1 by bolts 17, and raises the peripheral edge of the film body 3. It is sandwiched and fixed between the plate 1. Thus, the film body 3 houses the heat insulating material 11, the heating means 5, and the upper stool 12 in a sealed state between the upper plate 1 and the film body 3. The thickness of the holding member 13 is set to be substantially the same as the total thickness of the heat insulating material 11, the heating means 5, the upper platen 12, and the film body 3 so as to form the same surface as the film body 3. The contact / pressurizing means in this embodiment is composed of an air suction device and an air compression device, and sucks air in a closed space between the upper plate 1 and the film body 3. The film body 3 is brought into close contact with the upper stool 12, or the compressed air is supplied to a sealed space between the upper plate 1 and the film body 3 to expand the film body 3 and separate from the upper stool 12. Then, the molding material is pressed between the film body 4 and the molding material.

With these configurations, when the contact / pressurizing means connected to the port is operated, the suction / pressurizing action is performed from the peripheral side surface of the heat insulating material 11 through the passage 15 and the groove 16.
It will extend to the whole. In this embodiment, the groove 16 is formed on the surface of the heat insulating material 11 which is in contact with the upper plate 1, but may be formed on the surface of the upper plate 1 which is in contact with the heat insulating material 11. Further, the contacting / pressing means is not limited to the air suction device and the air compression device, and the
If it can be closely attached to and separated from
For example, other methods can be used, such as using an attraction / repulsion force based on the polarity of the magnetic force.

On the upper surface of the lower plate 2, there is provided a lower platen 20 which forms a smooth opposing surface, and the film body 4 is provided by a frame 8 so as to be able to contact and separate from the smooth upper surface of the lower platen 20. ing. Further, a cooling means 6 for cooling the material to be molded is provided inside the lower plate 2. The film body 4 is made of a material having the same elasticity, flexibility, elasticity, and heat resistance as the film body 3 of the upper plate 1.

The lower plate 2, like the upper plate 1, is formed of a substantially rectangular flat plate, and has a passage 2 having a port substantially in the center.
2 is penetrated so as to penetrate therethrough. A port of this passage 22 is connected to the same close-contact / pressing means as the upper plate 1. The surface of the lower platen 20 in contact with the lower plate 2 has an upper plate 1
A plurality of grooves 23 similar to the heat insulating material 11 of the lower platen 2
The lower surface plate 20 is formed with a plurality of passages 24 that are open to the peripheral side surface of the lower surface 0 and communicate with the passages 22.

The frame 8 is composed of the upper plate 1 surrounding the lower platen 20.
The fixing member 13 has substantially the same size as the holding member 13 and is attached to the upper surface of the lower plate 2 by bolts 25, and the peripheral portion of the film body 4 is fixed between the lower plate 2 and the lower surface. This allows
The film body 4 accommodates the lower platen 20 in a state of being sealed between the lower platen 2 and the lower plate 2.

With this configuration, when the contact / pressurizing means is operated, the suction / pressurizing action is applied to the entire film body 4 from the peripheral side surface and the entire upper surface of the lower platen 20 via the passage 22, the groove 23 and the passage 24. And sucking air in a closed space between the lower plate 2 and the film body 4 or supplying compressed air to a closed space between the lower plate 2 and the film body 4 4 is securely brought into close contact with and separated from the upper surface of the lower platen 20. In this embodiment, the grooves 23
Was formed on the surface in contact with the lower plate 2 of the lower platen 20.
May be formed on the surface in contact with the lower platen 20.

The height (thickness) of the frame 8 is such that the lower plate 2 is
When the frame 8 is sandwiched between the upper plate 1 and the lower plate 2, an appropriate chamber 7 for accommodating the molding material is formed between the film bodies 3 and 4. Is set to be able to. A groove 30 is formed on the upper surface of the frame body 8 over the entire circumference thereof. In the groove, when the lower plate 2 is moved closer to the upper plate 1 to form the chamber 7, In order to maintain airtightness, a cushion / seal material 31 which is in contact with the pressing member 13 of the upper plate 1 is held. The cushion / sealing material 31 is an annular member formed in a rod having a circular cross section. The width of the groove 30 is slightly smaller than the diameter of the cushion / sealing material 31 and the width of the bottom is smaller than the width of the opening. Are also slightly larger.

Cooling means is provided inside the lower plate 2 to prevent the material to be molded from being carelessly heated via the lower platen 20 and the film body 4 and to stabilize the laminated molded products. As 6, cooling water circulation supply passages are formed.
The cooling fluid supplied to the cooling water circulation supply path 6 is not limited to water, and other cooling fluids such as air and gas can be used.

The suction means for evacuating the chamber 7 includes:
It is connected to a passage 32 formed in the holding member 13 of the upper plate 1. The passage 32 communicates with the chamber 7 formed when the lower plate 2 is moved closer to the upper plate 1 and the frame 8 is sandwiched between the upper plate 1 and the lower plate 2. A deaeration port 33 is formed which opens inward from a position where the cushion / seal member 31 provided on the frame 8 of the lower plate 2 abuts.

Next, an embodiment of the vacuum laminating method according to the present invention using the vacuum laminating apparatus configured as described above will be described with reference to FIGS.

The vacuum laminating method in this embodiment is as follows.
Generally, a molding material is arranged between the film bodies 3 and 4, and the frame 8 is moved closer to the upper plate 1 by moving the lower plate 2 close to the upper plate 1.
A closed chamber 7 is formed by being sandwiched between the lower plate 2 and the lower plate 2. The film bodies 3 and 4 are brought into close contact with the upper platen 12 and the lower platen 20 by means of close contact and pressurization. The pressure of the chamber 7 is reduced, and the film body 4 is inflated by a contact / pressurizing means so as to be separated from the lower platen 20.
Heating and pressurizing the material to be formed, and inflating the film body 3 so as to be separated from the upper surface plate 12 by means of close contact and pressurization to cool and pressurize the material to and from the film body 4. It is.

The material to be molded H may be formed into a plurality of plates, sheets, or films as in the case of laminating a film-like photoresist forming layer comprising a support film and a photosensitive layer on a laminated substrate or a flexible laminated substrate. It is made of a material, for bonding thermoplastic or thermosetting resin films to each other, or the film-like material and a base material, for example, a wood plate, a metal plate, an organic material, an inorganic material or a composite material sheet. Needless to say, this can also be applied. Here, the above-mentioned film-like materials may be laminated in two or more layers of the same or different kind, and the film-like material may be laminated on the substrate only on one side or on both sides. May be. In the case of this embodiment, the molding material H is supported by a continuous film (not shown) and is supplied and arranged between the film bodies 3 and 4 in a state of being close to or separated from each other or in a state of being in contact with each other. You. When the lower plate 2 is moved closer to the upper plate 1, as shown in FIG. 2, the cushion / sealant 31 of the frame 8 sandwiches the film supporting the molding material H in the upper plate 1. Abuts against the holding member 13 to form a closed chamber 7.

Next, the contact / pressing means is operated to operate the upper plate 1.
By sucking air in the space between the film body 3 and the space between the lower plate 2 and the film body 4, the film bodies 3 and 4
2 and the lower platen 20. When the air in the chamber 7 is sucked by operating the suction means in this state, the surroundings of the molding material H are depressurized without being pressed by the film bodies 3 and 4. In addition, the suction force of the space between the upper plate 1 and the film body 3 and the space between the lower plate 2 and the film body 4 due to the contact / pressing means causes the film bodies 3 and 4 to be depressurized in the chamber 7. It is desirable that the setting is made so as not to be separated from the upper stool 12 and the lower stool 20.

When the pressure reduction in the chamber 7 is completed, as shown in FIG. 3, the suction between the lower plate 2 and the film body 4 by the contact / pressurizing means is stopped, and compressed air is supplied. The body 4 is expanded so as to be separated from the lower surface plate 20, and the molding material H is pressed between the body H and the film body 3. At this time, the heat of the heating means 5 is transmitted to the film body 3 via the upper surface plate 12, and the respective molding materials H are heated and laminated with the pressurization.

When the lamination of the molding material H is completed, the suction of the air in the space between the upper plate 1 and the film body 3 is stopped by the contacting / pressing means to supply compressed air, The supply of compressed air to the space between the plate 2 and the film body 4 is stopped to suck air, and the film body 3 is expanded so as to be separated from the upper surface plate 12 as shown in FIG. The material H is pressurized with the film body 4. At this time, the cooling heat from the cooling means 6 is transmitted to the film body 4 via the lower surface plate 20, and the laminated molded product is cooled together with the pressurization, so that unnecessary heating is prevented and the laminated molded product is stabilized. State.

When the cooling of the molded article is completed, the compressed air is sucked into the space between the lower plate 2 and the film body 4 by the close contact / pressurizing means, and the space between the upper plate 1 and the film body 3 is drawn into the space. Then, the supply of the compressed air is stopped, the pressure in the chamber 7 is released by communicating with the atmosphere through the passage 32, the lower plate 2 is lowered so as to be separated from the upper plate 1, and the molded product is taken out.

Next, another embodiment of the vacuum laminating apparatus according to the present invention will be described with reference to FIG. In the description of this embodiment, parts that are the same as or correspond to those in the above-described embodiment are given the same reference numerals, and descriptions thereof are omitted.

The upper plate 1 in this embodiment has a concave portion 40 for accommodating the heat insulating material 11, the heating means 5, and the upper stool 12 on the lower surface thereof. The recess 40 is provided on the upper surface plate 12.
Is formed so as to form the same plane as the peripheral surface of the concave portion 40, and to have a gap 41 between the heat insulating material 11, the heating means 5, and the peripheral side surface of the upper surface plate 12. .
The periphery of the film body 3 is fixed to the side surface of the upper plate 1 by bolts 42. Film body 3 in the case of this embodiment
The reinforcement of the heat-resistant cloth and the like in order to prevent elongation when pressurized compared to the above-mentioned embodiment and to prevent the peripheral edge from being dropped by its own weight by being fixed to the side surface of the upper plate. It is desirable to have a material.

The passage 32 to which the suction means is connected is formed in the frame 8 attached to the lower plate 2.
Is moved close to the upper plate 1 to move the frame 8 to the upper plate 1 and the lower plate 2.
The air vent 33 of the passage 32 is formed in the groove 30 for holding the cushion / seal material 31 of the frame 8 so that the chamber 7 can be evacuated by communicating with the inside of the chamber 7 formed by being sandwiched therebetween. It is formed so as to open inward.

[0036]

According to the present invention, when laminating a molding material made of a thermosetting resin, the curing reaction does not proceed before pressing the molding material, and the thermoplastic resin is laminated. In this case, the plasticization of the molding material does not proceed excessively before the pressure is applied, so that wrinkling does not occur and the accuracy of positioning or the like does not decrease. Furthermore, even after lamination is completed, heat during heating does not remain in the molding material or is not affected by radiant heat in the chamber, and a laminated product stably bonded according to the molding material can be obtained. it can.

[Brief description of the drawings]

FIG. 1 is a sectional view showing one embodiment of a vacuum laminating apparatus according to the present invention.

FIG. 2 is a partially enlarged view showing a state in which a molding material is accommodated in a chamber in the vacuum laminating apparatus shown in FIG.

FIG. 3 is a partially enlarged view showing a state where a molding material is heated and pressed from the state of FIG.

FIG. 4 is a partially enlarged view showing a state in which a molding material is cooled and pressed from the state of FIG.

FIG. 5 is a cross-sectional view showing another embodiment of the vacuum laminating apparatus according to the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Upper plate 2 Lower plate 3, 4 Film body 5 Heating means 7 Cooling means 8 Frame

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification code FI // B29K 105: 06 B29K 105: 06 B29L 31:34 B29L 31:34

Claims (2)

(57) [Claims] 1. An upper plate and a lower plate which are opposed to each other so as to be able to approach and retreat, a film body provided on each of opposing surfaces of the upper plate and the lower plate, and one of the upper plate and the lower plate. A heating means provided to heat one of the film bodies, a cooling means provided to cool the other one of the upper plate and the lower plate, and sandwiched between the film bodies of the upper plate and the lower plate A frame forming a closed chamber for accommodating the material to be molded, suction means for evacuating the chamber,
Adhering / pressing to press the material to be formed by arbitrarily bringing each film body into close contact with the opposing surface of the upper plate and the lower plate provided thereon, and separating the film body from the opposing surface of the provided upper plate and the lower plate. Vacuum laminating apparatus comprising: 2. A device which is provided so as to be able to approach and retreat in opposition to each other.
The material to be molded is placed between the film bodies provided on the facing surfaces of the plate and the lower plate, facing each other, and the material to be molded is housed between the film bodies.
A closed chamber is formed, and the molding material is added to the film.
The pressure inside the chamber is reduced to 1 atm or less without pressure, and then the pressure is reduced by the film while maintaining the reduced pressure in the chamber.
Between the upper plate and lower plate
Heating means provided to heat one of the film bodies.
Bonded by heating the molding material I, then, further Ji
A film is formed between the chambers while maintaining the reduced pressure in the chamber.
Press the section and press either the upper or lower plate
The coating is formed by cooling means provided to cool the membrane.
A vacuum lamination method characterized by cooling a profile .