JP3697600B2

JP3697600B2 - Vacuum lamination apparatus and vacuum lamination method

Info

Publication number: JP3697600B2
Application number: JP29972399A
Authority: JP
Inventors: 昭彦小川
Original assignee: 株式会社名機製作所
Priority date: 1999-10-21
Filing date: 1999-10-21
Publication date: 2005-09-21
Anticipated expiration: 2019-10-21
Also published as: JP2001113549A

Description

【０００１】
【発明の属する技術分野】
本発明は、真空積層装置および真空積層方法に関し、さらに詳しくは、凹部を有する被積層部材と、該被積層部材に対して加圧されると共に加熱されることにより貼着される積層部材と、からなる積層材を、真空雰囲気下において加圧・加熱することにより積層するための真空積層装置および真空積層方法に関するものである。
【０００２】
【従来の技術】
例えば、磁気ヘッドやＩＣチップなどの電子部品を製造する場合に、ウエハ（被積層部材）の表面にフィルム状のホトレジスト形成層（積層部材）を積層することが行われる。また、ディスプレイを製造する場合に、ガラス基板（被積層部材）に誘電体層あるいは保護層（積層部材）を積層することが行われる。
【０００３】
これらの被積層部材に積層部材を積層するための従来の技術としては、特開昭６３−２９５２１８号公報に開示されているように、内外に開口する２つの搬送口を有する加熱容器と、この加熱容器の内部に収容されかつ前記両搬送口の開口周縁に設けられその内部で２種のステージ材料を一体化する筒状のラバーとを備え、このラバーに管体を介して真空源を接続した成形プレスが知られている。そして、このものにおいては、筒状のラバーが積層材を直接加圧するよう構成されている。
【０００４】
また、別の従来の技術としては、特開昭６３−２９９８９５号公報に開示されているように、被成形物を移送する移送手段と、この移送手段の中間部に開閉駆動可能に配置され、上記被成形物をその移送過程で加熱・加圧して一体成形する真空チャンバーと、この真空チャンバーを開閉駆動するチャンバー開閉手段と、上記真空チャンバーを加熱する加熱機構とを備えた真空プレス装置が知られている。そして、このものにおいては、真空チャンバーを構成する可動側チャンバーと固定側チャンバーとの内部にそれぞれ耐熱性のラバーシートが張設されており、両ラバーシートの間で密閉された真空室が形成され、この真空室には真空ポンプで負圧が作用し、かつ、可動側チャンバーと固定側チャンバーが加熱機構で加熱されていることにより、ステージ材料が加熱・加圧され一体成形されるなどと記載されている。また、このものにおいても、上述した従来の技術と同様に、ラバーシートが積層材を直接加圧するよう構成されている。
【０００５】
上述した従来の技術に用いられている筒状のラバーあるいはラバーシートなど（膜体）は、一般に、その硬度や厚さが積層材を加圧するための所定の強度を確保することができるように設定されている。
【０００６】
ところで、積層材の被積層部材のなかには、例えば、上述した磁気ヘッドやＩＣチップなど、後にダイシングされる各電子部品の大きさにウエハを区分するように、凹部が形成されたものがある。図５は、トレーＴ上に形成された磁気ヘッドを製造するためのウエハＨ１を示したものであり、図６は、このウエハＨ１を拡大して示したものである。後にダイシングされて磁気ヘッドとなるウエハの一の区分は、例えば、一辺Ｗ１が１．００（ｍｍ）で他辺Ｗ２が１．２０（ｍｍ）の大きさに設定され、各区分の間には、幅が０．１８（ｍｍ）で深さ０．３０（ｍｍ）の溝状の凹部Ｈ１ａが形成されている。そして、このような被積層部材としてのウエハＨ１には、その凹部Ｈ１ａの側面および底面に沿って密着するように積層部材としてのホトレジスト形成層Ｈ２を埋め込み積層する必要がある（図８を参照）。
【０００７】
また、積層材のなかには、被積層部材として絶縁層の表面に回路パターンが形成された回路基板に、積層部材としてさらに絶縁層を介して導電層が積層される多層回路基板がある。この場合の被積層部材の表面は、回路基板に回路パターンが形成されていることにより凹凸となっている。そして、このような被積層部材としての回路基板も、ボイドを発生させないように、絶縁層を介して導電層を回路基板の表面に形成された回路パターンの凹凸に対して密着させるように埋め込み積層する必要がある。
【０００８】
【発明が解決しようとする課題】
しかしながら、上記従来の技術にあっては、いずれのものも、図６に示したような幅が０．１８（ｍｍ）と比較的狭い凹部Ｈ１ａに対してホトレジスト形成層Ｈ２を筒状のラバーまたはラバーシート（膜体４）によって直接加圧しようとすると、この膜体４が所定の強度を確保することができるように硬度や厚さが設定されているために、例えば図７に示すように、凹部Ｈ１ａの側面および底面に沿ってホトレジスト形成層Ｈ２を埋め込み積層するように弾性変形することができないという問題があった。このような問題は、凹部Ｈ１ａが比較的深い場合にも発生する。なお、図６に示されたウエハＨ１を上述したような寸法に形成した場合において、このウエハＨ１にホトレジスト形成層Ｈ２を膜体４によって実際に直接加圧して積層したところ、図７に示した例では、膜体４が凹部Ｈ１ａ内に突出するように弾性変形することによりホトレジスト形成層Ｈ２を埋め込むことができたのは、ウエハＨ１の表面からの深さが０．０５（ｍｍ）にすぎなかった。
【０００９】
本発明は、上記問題を解決するためになされたもので、簡単な構成で、被積層部材の凹部の幅が比較的狭いあるいは深さが深い場合であっても、かかる凹部に対しても積層部材を確実に埋め込み性よく積層することができる真空積層装置および真空積層方法を提供することを目的とする。
【００１０】
【課題を解決するための手段】
請求項１の真空積層装置に係る発明は、上記目的を達成するため、積層材が、凹部を有する被積層部材と、該被積層部材に対して加圧されると共に加熱されることにより貼着される積層部材とからなり、積層材が収容される密閉チャンバと、該密閉チャンバ内の少なくとも一面を構成し、被積層部材に対して積層部材を押圧する膜体と、密閉チャンバ内を真空引きする減圧手段と、真空引きされた密閉チャンバ内の積層材が加圧されないように膜体の膨出を阻止することと、膜体を膨出させてその表面により積層材を加圧させることと、を切り替え可能に操作する膜体操作手段と、積層材を加熱する加熱手段と、を備えた真空積層装置であって、被積層部材と膜体との間に介装され、膜体により積層部材を被積層部材に加圧したときに積層部材を介して被積層部材の凹部内に流入する流動性部材を設けたことを特徴とするものである。
【００１１】
請求項２の真空積層方法に係る発明は、上記目的を達成するため、積層材が、凹部を有する被積層部材と、該被積層部材に対して加圧されると共に加熱されることにより貼着される積層部材とからなり、積層材を少なくとも一面が膜体によって形成されたチャンバに収容して密閉する工程と、積層材が加圧されないように膜体の膨出を阻止した状態で密閉されたチャンバ内を減圧する工程と、この減圧を維持しつつ膜体を膨出させてその表面により積層部材を被積層部材に対して加圧すると共に加熱手段により積層材を加熱する工程と、を含む真空積層方法であって、積層材をチャンバに収容する工程において、積層部材を介して被積層部材の凹部内に流入可能な流動性部材を、被積層部材と膜体との間に配置し、膜体の表面により積層部材を被積層部材に加圧する工程において、積層部材を介して被積層部材の凹部内に流動性部材を流入させることを特徴とするものである。
【００１２】
本発明の請求項１に係る真空積層装置では、積層材の被積層部材と膜体との間に流動性部材を介装した状態で、積層材を収容して密閉チャンバを形成し、膜体が膨出して積層材を不用意に加圧しないように、膜体操作手段により膜体をその設けられた対向面に密着させ、密閉チャンバ内を減圧する。その後、膜体操作手段により膜体をその設けられた対向面から離間させるようにして膨出させて、積層材を加圧する。このとき、流動性部材が膜体によって加圧される。その結果、積層部材が被積層部材に対して加圧され、加熱手段に加熱されて積層される。そして、被積層部材の凹部には、流動性部材が積層部材を介して流入することにより、積層部材が埋め込み積層されることとなる。
【００１３】
また、本発明の請求項２に係る真空積層方法では、積層材の被積層部材と膜体との間に流動性部材を介装配置し、この積層材を、少なくとも一面が膜体によって形成されたチャンバに収容して密閉し、積層材が加圧されないように膜体の膨出を阻止した状態で密閉されたチャンバ内を減圧し、この減圧を維持しつつ膜体を膨出させてその表面で積層材を加圧すると共に加熱手段により積層材を加熱する。膜体は、流動性部材を介して積層部材を被積層部材に対して加圧する。流動性部材が積層部材を介して被積層部材の凹部に流入して加圧するため、積層部材が被積層部材の凹部に埋め込み積層されることとなる。
【００１４】
【発明の実施の形態】
最初に、本発明の真空積層装置の実施の一形態を図１および図２に基づいて詳細に説明する。なお、図において同一符号は同一部分または相当部分とする。
【００１５】
この実施の形態において、本発明の真空積層装置により積層される積層材Ｈは、図５および図６に示したように、被積層部材Ｈ１としての、溝状の凹部Ｈ１ａにより後にダイシングされる各電子部品の大きさに区分されたウエハＨ１と、積層部材Ｈ２としての、ウエハＨ１の凹部Ｈ１ａの側面および底面に沿って密着するように埋め込み積層されるホトレジスト形成層Ｈ２とにより構成され、ホトレジスト形成層Ｈ２は、加熱されることにより粘着性を有するようになり、この状態で加圧されることにより、ウエハＨ１に対して貼着され積層されるものである。
【００１６】
この実施の形態における本発明の真空積層装置は、図１および図２に示すように、概略、相対向して相対的に近接遠退可能に設けられた上板１および下板２と、上板１と下板２とが相対的に近接移動されたときに互いの対向面の間で挟持されることによって積層材Ｈが収容された密閉されえたチャンバＣを形成する枠体３と、上板１または下板２の少なくとも一方の対向面に配設されて密閉されたチャンバＣの一面を構成し、その設けられた対向面から膨出することにより積層材Ｈを加圧する膜体４と、密閉されたチャンバ内を真空引きする減圧手段（後述する）と、真空引きされた密閉チャンバＣ内に収容された積層材Ｈが加圧されないように膜体４の膨出を阻止することと、膜体４を膨出させてその表面により積層材Ｈを加圧させることと、を切り替え可能に操作する膜体操作手段（後述する）と、積層材Ｈを加熱する加熱手段６と、を備え、さらに、被積層部材Ｈ１と膜体４との間に介装され、膜体４により積層部材Ｈ２を被積層部材Ｈ１に加圧したときに積層部材Ｈ２を介して被積層部材Ｈ１の凹部Ｈ１ａ内に流入することができるような流動性を有する流動性部材７を設けたものである。
【００１７】
上板１は、略矩形の平板状体からなるもので、この実施の形態の場合、支持台（図示を省略した）などにより所定の高さに固定保持されている。上板１の下面には収容部１０が形成されており、この収容部１０内には断熱材１１と、積層材Ｈを加熱する加熱手段としてのヒータ６と、上板１の対向面（すなわち、チャンバＣの一面）を構成する定盤１２と、が順次積重され収容されている。ヒータ６は、この実施の形態では、電流を供給することにより所定の温度に発熱する板状の電気ヒータが採用されているが、本発明ではこれに限定されることはない。断熱材１１、ヒータ６、および定盤１２の周側面と収容部１０の側壁面との間には、チャンバＣ内に開口するような間隙１３が形成されている。上板１のほぼ中央には、後述する減圧手段に接続されるポートを有する脱気通路１４が収容部１０に貫通するように穿設されている。断熱材１１の上板１と接する面には、間隙１３と脱気通路１４とを連通する溝１１ａが格子状に複数形成されている。なお、この溝１１ａに代えて、上板１の断熱材１１と接する面に溝を形成することもできる。また、図示は省略するが、上板１内に冷却水を循環供給するための流通路をなどの冷却手段を設けてもよい。
【００１８】
下板２は、上板１と略同じ大きさの矩形の平板状体からなるもので、この実施の形態の場合、所定の高さに固定保持された上板１に対して近接遠退可能に支持され、昇降駆動手段（図示を省略した）が接続されている。昇降駆動手段により下板２を上板１に対して近接させるよう上昇させると、枠体３が上板１と下板２との互いの対向面の間に挟持されて密閉されたチャンバＣが形成され、下板２を上板１から離間させるよう下降させると、チャンバＣが開放されることとなる。
【００１９】
下板２は、枠体３の内周開口と略同じ大きさの収容部２０が形成されている。そして、この実施の形態では、収容部２０内に断熱材２１が収容され、断熱材２１の上面にヒータ６と通気性部材２２が順次積重されている。また、下板２の略中央には、後述する膜体操作手段が接続される通路２４が収容部２０内に貫通するように穿設されている。さらにまた、断熱材２１とヒータ６には通路２４と整合するように孔２１ｂ，６ａがそれぞれ形成されている。通気性部材２２は、例えばパンチングメタルのように平板状の多孔板からなるもので、膜体４とヒータ６との間に配置され、下板２の対向面を構成する。さらに、少なくとも、断熱材２１およびヒータ６の周側面と収容部２０の側壁面との間には間隙２３が形成されており、断熱材２１の下板２と接する面には、間隙２３と通路２４とを連通する溝２１ａが格子状に複数形成されている。なお、溝２１ａに代えて下板２の断熱材２１と接する面に溝を形成することもでき、また、下板２内に冷却手段を設けることもできることは上板と同様である。また、ヒータ６は、上板１と同様に、電流を供給することにより所定の温度に発熱する板状の電気ヒータが採用されているが、本発明ではこれに限定されることはない。
【００２０】
枠体３は上板１の収容部１０とほぼ同じ大きさの開口を有するもので、チャンバＣの周囲を構成する。枠体３の一方の面には、その開口を全面にわたって気密に塞ぐように、チャンバＣの一面を構成する膜体４の外周縁が焼き付け加工等により固着されている。枠体３は、この実施の形態の場合、固着された膜体４の外周縁が下板２の上面に接すると共に中央部が下板２の収容部２０を気密に覆うように、下板２の上面に対してボルトなど（図示は省略する）により取付けられている。さらに、図示は省略するが、枠体３の上面にはＯリングなどのシール部材が設けられており、上板１と下板２とを相対的に近接移動させたときに、形成されたチャンバＣの気密性を確保することができるよう構成されている。枠体３の高さ（厚さ）を変更することにより、積層材Ｈの厚さに応じてチャンバＣの高さを変更することができる。
【００２１】
膜体４は、伸縮性、可撓性、弾性、耐熱性等を有する、例えばシリコンゴムやフッ素ゴム等の素材が用いられている。膜体４の厚さや硬度などの諸条件は、積層材Ｈを加圧するために必要な強度などに応じて設定することができる。
【００２２】
減圧手段は、この実施の形態の場合、上板１に形成された脱気通路１４と接続される真空ポンプ（図示は省略する）を備えている。上板１と下板２を相対的に近接移動させて互いの対向面の間で枠体３を挟持し、密閉されたチャンバＣを形成した状態で減圧手段を駆動すると、積層材Ｈを収容したチャンバＣ内の空気が断熱材１１、ヒータ６、および定盤１２の周側面と収容部１０の側壁面との間の間隙１３および断熱材１１の溝１１ａを通って、脱気通路１４から吸引されて、チャンバＣ内が確実に真空引きされることとなる。
【００２３】
膜体操作手段は、この実施の形態では作動流体として空気が用いられ、上述したように減圧手段を駆動して積層材Ｈを収容したチャンバＣ内を真空引きしたときであって、積層材Ｈを加圧しないときに、膜体４が不用意にチャンバＣ内に膨出しないように、膜体４と下板２の収容部２０との間の空間の空気を吸引して膜体４を通気性部材２２に密着させ、また、真空引きされたチャンバＣ内の積層材Ｈを加圧するときに、膜体４と下板２の収容部２０との間の空間を大気に連通させてチャンバＣ内の真空引きにより膜体４をチャンバＣ内に膨出させ、または必要に応じて膜体４と下板２の収容部との間の空間に圧縮空気を供給するもので、下板２に形成された通路２４と切り替え可能に接続される真空ポンプおよび必要に応じてエアコンプレッサ（図示は省略する）を備えている。積層材Ｈを加圧しないときには、真空ポンプを駆動することにより、膜体４と下板２の収容部２０との間の空間の空気は、膜体４に接するように設けられた通気性部材２２から断熱材２１およびヒータ６の周側面と収容部２０の側壁面との間の間隙２３と断熱材２１の溝２１ａとを通って、また、通気性部材２２から断熱材２１およびヒータ６に形成された孔６ａ，２１ｂを通って、通路２４から吸引されるため、膜体４は確実に通気性部材２２の全面にわたって密着されることとなる。一方、積層材Ｈを加圧するときには、大気または圧縮空気は、通路２４から断熱材２１の溝２１ａと断熱材２１およびヒータ６の周側面と収容部２０の側壁面との間の間隙とを通って、また、断熱材２１およびヒータ６に形成された孔６ａ，２１ｂを通って通気性部材２２から膜体４の裏面全面にわたって確実に供給されて、膜体４をチャンバＣ内に膨出させることとなる。
【００２４】
流動性部材７は、この実施の形態においては、例えば、ＪＩＳ−Ａ硬度１程度のゲル状のもので、後述するように膜体４によって積層材Ｈを加圧したときにホトレジスト形成層Ｈ２を介してウエハＨ１の凹部Ｈ１ａに流入し得るような流動性を有する材質からなるものである。この実施の形態の場合、膜体４上に流動性部材７が載置され、この流動性部材７上にホトレジスト形成層Ｈ２が接するような配置で積層材Ｈが載置され、積層材Ｈと共にチャンバＣ内に収容される。そして、後述するように、膜体４を通気性部材２２に密着させた状態で密閉されたチャンバＣ内を真空引きし、次いで、膜体４をチャンバＣ内に膨出させると共にヒータ６，６を発熱させて加熱して、膜体４が流動性部材７を介して積層材Ｈを定盤１２（この実施の形態の場合）に対して押圧する。このとき、ゲル状の流動性部材７は積層材Ｈと共に加熱されており、図２および図８に示すように、ウエハＨ１の凹部Ｈ１ａ内にホトレジスト形成層Ｈ２を埋め込むようにして流入し加圧する。そして、ホトレジスト形成層Ｈ２は、流動性部材７と共に膜体４によって定盤１２との間で包まれるように周囲が密閉された状態で加圧されるため、ホトレジスト形成層Ｈ２がウエハＨ１からはみ出るように流動することがない。
【００２５】
次に、本発明の真空積層装置の第２の実施の形態を図３に基づいて説明する。なお、上述した実施の形態と同様または相当する部分については、同じ符号を付してその説明を省略する。
【００２６】
この実施の形態においては、膜体４および枠体３や、膜体操作手段の通路２４が上板１に設けられている。また、定盤１２や減圧手段の脱気通路１４が下板２に設けられている。そして、定盤１２上にウエハＨ１が接するように積層材Ｈを載置し、積層材Ｈ上にゲル状の流動性部材７を載置するものである。なお、この実施の形態においては、図８に参照されるように、トレーＴ上にウエハＨ１を形成し支持した状態で定盤１２上に載置することもできる。
【００２７】
ここで、上述した第１および第２の実施の形態では、ウエハＨ１の一方の面に凹部Ｈ１ａが形成され、その凹部Ｈ１ａが形成された一方の面のみにホトレジスト形成層Ｈ２を積層する場合を説明した。しかしながら、本発明の真空積層装置は上述した実施の形態に限定されることなく、ウエハＨ１の両方の面に凹部Ｈ１ａが形成され、その凹部Ｈ１ａが形成された両方の面にホトレジスト形成層Ｈ２を積層する場合にも適用することができる。以下に、かかる場合を第３の実施の形態として、図４に基づいて説明する。なお、上述した実施の形態と同様または相当する部分については、同じ符号を付してその説明を省略する。
【００２８】
この実施の形態においては、上板１および下板２の双方に膜体４および枠体３や、膜体操作手段の通路２４が設けられている。また、減圧手段の脱気通路１４は、枠体３の内外に連通するように形成されている。そして、積層材Ｈは、ウエハの凹部Ｈ１ａが形成された両方の面にホトレジスト形成層Ｈ２が接するように配置され、さらに、ホトレジスト形成層Ｈ２は流動性部材７，７によって挟まれるように配置された状態でチャンバＣ内に収容される。
【００２９】
次に、本発明の真空積層方法の実施の一形態を、主に、図７に示したように従来の膜体により積層材を直接加圧した場合と、図８に示したように本発明の膜体４と積層材Ｈとに間に流動性部材７を介在させて加圧した場合とで比較しながら、上述した真空積層装置を使用した場合により説明する。なお、この実施の形態においては、図３に示したように、第２の実施の形態における真空積層装置を用いて、ウエハＨ１の凹部Ｈ１ａが形成された一方の面にホトレジスト形成層Ｈ２を積層する場合で説明する。
【００３０】
本発明の真空積層方法は、概略、流動性部材７を積層部材Ｈ２と膜体４との間に配置する工程と、この流動性部材７が配置された状態の積層材ＨをチャンバＣ内に配置して上板１と下板２とを相対的に近接移動させることにより、積層材Ｈが収容された密閉されたチャンバＣを形成する工程と、積層材Ｈが加圧されないように膜体４の膨出を阻止した状態で密閉されたチャンバＣ内を減圧する工程と、この減圧を維持しつつ膜体４を膨出させてその表面により積層部材Ｈ２を被積層部材Ｈ１に対して加圧して、積層部材Ｈ２を介して被積層部材Ｈ１の凹部Ｈ１ａ内に流動性部材７を流入させると共に加熱手段６により積層材Ｈを加熱する工程と、を含むものである。
【００３１】
積層材Ｈを積層するにあたっては、最初に、流動性部材７が積層部材としてのホトレジスト形成層Ｈ２と膜体４との間に位置するようにして、積層材Ｈを流動性部材７と共にチャンバＣの一面を構成する定盤１２上に配置させる。このとき、先にホトレジスト形成層Ｈ２を上にして被積層部材としてのウエハＨ１を下にした状態の積層材Ｈを定盤１２上に載置してから、この積層材Ｈ上に流動性部材７を載置してもよく、また、ホトレジスト形成層Ｈ２に接するように流動性部材７を載置した状態で、積層材Ｈを定盤１２上に載置することもできる。
【００３２】
次いで、上板１と下板２とを相対的に近接移動させると、上板１と下板２との互いの対向面の間に枠体３が挟持されて定盤１２および膜体４と枠体３により囲まれ、被積層材Ｈが収容された、密閉されたチャンバＣが形成される。
【００３３】
続いて、膜体操作手段により膜体４を上板１の通気性部材２２に密着させ、この状態で、減圧手段を駆動して密閉されたチャンバＣ内の空気を脱気して真空引きを行う。したがって、チャンバＣ内の真空引きにより、膜体４がチャンバＣ内に膨出することが阻止された状態となるため、この時点で積層材Ｈが膜体４によって加圧されることがない。
【００３４】
密閉されたチャンバＣ内が充分減圧されると、膜体４の通気性部材２２に対する密着を解除して、膜体４と下板２の収容部２０との間の空間を大気に連通させ、あるいは、必要に応じて膜体４と下板２の収容部２０との間の空間に圧縮空気を供給して、膜体４を膨出させてチャンバＣの容積を収縮させるように膜体操作手段を切り替え、流動性部材７を介して積層材Ｈが全面にわたって定盤１２に対して均等に押圧されるように加圧する。また、このときにはヒータ６，６にそれぞれ電流が供給されて発熱している。そのため、ホトレジスト形成層Ｈ２が粘着性を有するようになり、流動性部材７を介して膜体４によって加圧されることにより、ホトレジスト形成層Ｈ２がウエハＨ１に積層されることとなる。
【００３５】
ホトレジスト形成層Ｈ２がウエハＨ１に積層されるときには、図８に示すように、流動性部材７を介して膜体４が加圧することにより、ウエハＨ１の凹部Ｈ１ａ内にホトレジスト形成層Ｈ２を介して流動性部材７が流入するため、ホトレジスト形成層Ｈ２はウエハＨ１の凹部Ｈ１ａの底面および側面に密着するように押圧されて埋め込まれることとなる。
【００３６】
一方、図７に示すように、膜体４によって積層材Ｈを直接加圧した場合には、上述したように、膜体４が所定の強度を確保することができるように硬度や厚さが設定されているために、ウエハＨ１の凹部Ｈ１ａの側面および底面に沿ってホトレジスト形成層を埋め込み積層するように弾性変形することができない。
【００３７】
また、既述したように、積層部材Ｈ１として表面に所定のパターンで導電層が形成された回路基板に対して、積層部材Ｈ２としての絶縁層を介して導電層をさらに積層するような場合にも、表面に形成された回路パターンによる凹凸（凹部Ｈ１ａ）に絶縁層および導電層Ｈ２を介して流動性部材７が流入するため、回路基板Ｈ１の回路パターンＨ１ａに絶縁層および導電層Ｈ２が密着するように押圧されて埋め込まれることとなる。
【００３８】
さらに、本発明は、上述した実施の形態に限定されることなく、ディスプレーを構成するガラス基板Ｈ１に誘電体層あるいは保護層Ｈ２を積層する場合など、他の目的に使用される積層品を積層する場合にも適用することができる。
【００３９】
被積層材Ｈの積層成形が完了したら、膜体４と下板２の収容部２０との間の空間に圧縮空気を供給している場合にはその供給を停止し、必要に応じて膜体４と下板２の収容部２０との間の空間の空気を吸引して膜体４を通気性部材２２に密着させ、減圧手段の駆動を停止して密閉されたチャンバＣ内に大気を導入し、上板１と下板２とを相対的に離間移動させてチャンバＣを解放し積層品を取り出す。
【００４０】
【発明の効果】
請求項１の発明によれば、被積層部材と膜体との間に介装され、膜体により積層部材を被積層部材に加圧したときに積層部材を介して被積層部材の凹部内に流入する流動性部材を設けたという簡単な構成で、被積層部材の凹部の幅が比較的狭いあるいは深さが深い場合であっても、かかる凹部に対しても積層部材を確実に埋め込み性よく積層することができる真空積層装置を提供することができる。
【００４１】
請求項２の発明によれば、積層部材を介して被積層部材の凹部内に流入可能な流動性部材を被積層部材と膜体との間に配置し、膜体の表面により積層部材を被積層部材に加圧する工程において、積層部材を介して被積層部材の凹部内に流動性部材を流入させるという簡単な構成で、被積層部材の凹部の幅が比較的狭いあるいは深さが深い場合であっても、かかる凹部に対しても積層部材を確実に埋め込み性よく積層することができる真空積層方法を提供することができる。
【図面の簡単な説明】
【図１】本発明の真空積層装置の実施の一形態を示す縦断面図である。
【図２】図１に示した真空積層装置において、チャンバ内に収容された被積層材を加熱・加圧する状態を示す縦断面図である。
【図３】本発明の真空積層装置の第２の実施の形態を示す縦断面図である。
【図４】本発明の真空積層装置の第３の実施の形態を示す縦断面図である。
【図５】本発明が適用される積層材としてトレー上に支持され形成されたウエハを示す平面図である。
【図６】後にダイシングされる各電子部品の大きさに区分するように、凹部が形成されたウエハの、部分拡大平面図である。
【図７】従来の技術により、膜体が直接積層材を加圧する様子を説明するための部分拡大縦断面図である。
【図８】本発明により、流動性部材を介して膜体が積層材を加圧する様子を説明するための部分拡大縦断面図である。
【符号の説明】
Ｈ積層材
Ｈ１ウエハ（被積層部材）
Ｈ１ａ凹部
Ｈ２ホトレジスト形成層（積層部材）
Ｃチャンバ
１上板
２下板
３枠体
４膜体
６ヒータ（加熱手段）
７流動性部材[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a vacuum laminating apparatus and a vacuum laminating method, and more specifically, a laminated member having a recess, a laminated member that is bonded to the laminated member by being pressurized and heated, The present invention relates to a vacuum laminating apparatus and a vacuum laminating method for laminating a laminated material made by pressurizing and heating in a vacuum atmosphere.
[0002]
[Prior art]
For example, when an electronic component such as a magnetic head or an IC chip is manufactured, a film-like photoresist forming layer (laminated member) is laminated on the surface of a wafer (laminated member). In manufacturing a display, a dielectric layer or a protective layer (laminated member) is laminated on a glass substrate (laminated member).
[0003]
As a conventional technique for laminating a laminated member on these laminated members, as disclosed in JP-A-63-295218, a heating container having two conveying openings opened inside and outside, and this A cylindrical rubber that is housed inside the heating container and is provided at the periphery of the opening of both the transfer ports, and in which two kinds of stage materials are integrated, and a vacuum source is connected to this rubber via a tube There are known molding presses. And in this thing, a cylindrical rubber is comprised so that a laminated material may be pressurized directly.
[0004]
Further, as another conventional technique, as disclosed in Japanese Patent Laid-Open No. 63-299895, a transfer means for transferring a molding object and an intermediate portion of the transfer means are arranged to be openable and closable, A vacuum press apparatus having a vacuum chamber for integrally forming the object to be molded by heating and pressurizing in the transfer process, chamber opening / closing means for opening / closing the vacuum chamber, and a heating mechanism for heating the vacuum chamber is known. It has been. In this case, a heat-resistant rubber sheet is stretched inside each of the movable side chamber and the fixed side chamber constituting the vacuum chamber, and a sealed vacuum chamber is formed between the two rubber sheets. In this vacuum chamber, a negative pressure is applied by a vacuum pump, and the movable side chamber and the fixed side chamber are heated by a heating mechanism, so that the stage material is heated and pressurized to be integrally formed. Has been. Also in this case, the rubber sheet is configured to pressurize the laminated material directly as in the conventional technique described above.
[0005]
In general, the cylindrical rubber or rubber sheet (film body) used in the above-described conventional technology can ensure a predetermined strength for pressing the laminated material by its hardness and thickness. Is set.
[0006]
By the way, among the members to be laminated, for example, there are those in which concave portions are formed so as to divide the wafer into sizes of electronic components to be diced later, such as the above-described magnetic head and IC chip. FIG. 5 shows a wafer H1 for manufacturing the magnetic head formed on the tray T, and FIG. 6 shows the wafer H1 in an enlarged manner. For example, one section of the wafer to be diced later to become a magnetic head is set such that one side W1 is 1.00 (mm) and the other side W2 is 1.20 (mm). A groove-like recess H1a having a width of 0.18 (mm) and a depth of 0.30 (mm) is formed. Then, it is necessary to bury and laminate a photoresist forming layer H2 as a laminated member on the wafer H1 as such a member to be laminated so as to closely adhere along the side surface and the bottom surface of the concave portion H1a (see FIG. 8). .
[0007]
Further, among the laminated materials, there is a multilayer circuit board in which a conductive layer is laminated as a laminated member on a circuit board in which a circuit pattern is formed on the surface of an insulating layer as a laminated member. In this case, the surface of the member to be laminated is uneven due to the circuit pattern being formed on the circuit board. In addition, the circuit board as the laminated member is also embedded and laminated so that the conductive layer is in close contact with the unevenness of the circuit pattern formed on the surface of the circuit board through the insulating layer so as not to generate voids. There is a need to.
[0008]
[Problems to be solved by the invention]
However, in each of the above prior arts, the photoresist forming layer H2 is formed into a cylindrical rubber or a concave portion H1a having a width of 0.18 (mm) as shown in FIG. When direct pressure is applied by the rubber sheet (film body 4), the hardness and thickness are set so that the film body 4 can ensure a predetermined strength. For example, as shown in FIG. There is a problem that the photoresist formation layer H2 cannot be elastically deformed so as to be embedded and laminated along the side surface and the bottom surface of the recess H1a. Such a problem also occurs when the recess H1a is relatively deep. In the case where the wafer H1 shown in FIG. 6 is formed in the dimensions as described above, a photoresist forming layer H2 is actually directly pressed by the film body 4 on the wafer H1 and laminated, as shown in FIG. In the example, the photoresist formation layer H2 can be embedded by elastically deforming the film body 4 so as to protrude into the recess H1a because the depth from the surface of the wafer H1 is only 0.05 (mm). There wasn't.
[0009]
The present invention has been made in order to solve the above-described problems. Even when the width of the concave portion of the member to be laminated is relatively narrow or deep, the present invention is laminated even on the concave portion. It is an object of the present invention to provide a vacuum laminating apparatus and a vacuum laminating method capable of reliably laminating members with good embedding properties.
[0010]
[Means for Solving the Problems]
In order to achieve the above object, the invention relating to the vacuum laminating apparatus according to claim 1 is performed by laminating a laminated member having a concave portion, and pressing and heating against the laminated member. A laminated chamber that contains the laminated material, and forms a film body that forms at least one surface of the sealed chamber, presses the laminated member against the laminated member, and evacuates the sealed chamber. Depressurizing means, true Do not pressurize the laminate in the evacuated sealed chamber Preventing the swelling of the membrane body, The membrane is swelled and the laminate is pressed by the surface. Can be switched between A vacuum laminating apparatus comprising a film body operating means for operating and a heating means for heating a laminated material, wherein the laminated body is interposed between the laminated member and the film body, and the laminated member is laminated by the film body A fluid member that flows into the concave portion of the member to be laminated through the laminated member when pressed is provided.
[0011]
In order to achieve the above object, the invention according to the vacuum lamination method of claim 2 is performed by laminating a laminated member having a recess, and applying pressure to the laminated member and heating the laminated member. The laminated material is sealed in a state in which the laminated material is accommodated in a chamber having at least one surface formed of the film body and sealed, and the film material is prevented from being bulged so that the laminated material is not pressurized. A step of reducing the pressure inside the chamber, and a step of expanding the film body while maintaining the reduced pressure, pressurizing the laminated member against the laminated member by the surface, and heating the laminated material by the heating means. In the vacuum laminating method, in the step of accommodating the laminated material in the chamber, a fluid member that can flow into the concave portion of the laminated member via the laminated member is disposed between the laminated member and the film body, Laminated member depending on the surface of the film body In the step of pressurizing the the stacked member, it is characterized in that flowing a flowable member in the recess of the stacked member through the lamination member.
[0012]
In the vacuum laminating apparatus according to claim 1 of the present invention, in the state where the fluid member is interposed between the laminated member of the laminated material and the film body, the laminated material is accommodated to form a sealed chamber, and the film body In order to prevent the laminated material from being inadvertently pressurized, the film body operating means brings the film body into close contact with the opposing surface, and the inside of the sealed chamber is depressurized. Thereafter, the film body is swelled by the film body operating means so as to be separated from the provided facing surface, and the laminated material is pressurized. At this time, the fluid member is pressurized by the film body. As a result, the laminated member is pressurized against the member to be laminated, and is heated and laminated by the heating means. Then, the flowable member flows into the concave portion of the laminated member through the laminated member, so that the laminated member is embedded and laminated.
[0013]
In the vacuum laminating method according to claim 2 of the present invention, a fluid member is interposed between the laminated member and the film body of the laminated material, and at least one surface of the laminated material is formed by the film body. The inside of the sealed chamber is depressurized in a state in which the expansion of the film body is prevented so that the laminated material is not pressurized, and the film body is expanded while maintaining this reduced pressure. The laminate material is pressurized on the surface and the laminate material is heated by a heating means. The film body pressurizes the laminated member against the laminated member via the fluid member. Since the fluid member flows into the concave portion of the laminated member through the laminated member and pressurizes, the laminated member is embedded and laminated in the concave portion of the laminated member.
[0014]
DETAILED DESCRIPTION OF THE INVENTION
First, one embodiment of the vacuum laminating apparatus of the present invention will be described in detail based on FIG. 1 and FIG. In the drawings, the same reference numerals denote the same or corresponding parts.
[0015]
In this embodiment, as shown in FIG. 5 and FIG. 6, the laminated material H laminated by the vacuum laminating apparatus of the present invention is diced later by the groove-shaped recess H1a as the laminated member H1. The wafer H1 divided into the size of the electronic component and the photoresist forming layer H2 embedded and laminated so as to adhere closely to the side surface and the bottom surface of the recess H1a of the wafer H1 as the laminated member H2 are formed. The layer H2 has adhesiveness when heated, and is pressed and laminated on the wafer H1 by being pressed in this state.
[0016]
As shown in FIG. 1 and FIG. 2, the vacuum laminating apparatus of the present invention in this embodiment is roughly composed of an upper plate 1 and a lower plate 2 that are opposed to each other and are relatively close to each other. A frame 3 that forms a sealed chamber C in which the laminated material H is accommodated by being sandwiched between opposing surfaces when the plate 1 and the lower plate 2 are moved relatively close to each other; A film body 4 configured to form one surface of a sealed chamber C disposed on at least one facing surface of the plate 1 or the lower plate 2 and pressurizing the laminated material H by bulging from the provided facing surface; Decompression means (described later) for evacuating the sealed chamber; true The laminated material H accommodated in the evacuated sealed chamber C is not pressurized. Preventing the bulging of the membrane body 4; The film body 4 is bulged and the laminated material H is pressed by the surface. Can be switched between A film body operating means (to be described later) for operating, and a heating means 6 for heating the laminated material H. The film body 4 is interposed between the laminated member H1 and the film body 4, and is laminated by the film body 4 A fluid member 7 having fluidity is provided so that it can flow into the recessed portion H1a of the laminated member H1 through the laminated member H2 when H2 is pressed against the laminated member H1.
[0017]
The upper plate 1 is composed of a substantially rectangular flat plate. In the case of this embodiment, the upper plate 1 is fixed and held at a predetermined height by a support base (not shown). A housing portion 10 is formed on the lower surface of the upper plate 1, and in the housing portion 10, a heat insulating material 11, a heater 6 as a heating means for heating the laminated material H, and an opposing surface of the upper plate 1 (that is, , One surface of the chamber C) and the surface plate 12 are sequentially stacked and accommodated. In this embodiment, the heater 6 is a plate-like electric heater that generates heat to a predetermined temperature by supplying a current. However, the present invention is not limited to this. A gap 13 that opens into the chamber C is formed between the heat insulating material 11, the heater 6, and the peripheral side surfaces of the surface plate 12 and the side wall surface of the accommodating portion 10. A deaeration passage 14 having a port connected to a pressure reducing means, which will be described later, is bored so as to penetrate through the accommodating portion 10 at the approximate center of the upper plate 1. On the surface in contact with the upper plate 1 of the heat insulating material 11, a plurality of grooves 11a communicating the gap 13 and the deaeration passage 14 are formed in a lattice shape. In addition, it can replace with this groove | channel 11a and a groove | channel can also be formed in the surface which contact | connects the heat insulating material 11 of the upper board 1. FIG. Although not shown, cooling means such as a flow passage for circulatingly supplying cooling water in the upper plate 1 may be provided.
[0018]
The lower plate 2 is formed of a rectangular flat plate having substantially the same size as the upper plate 1. In this embodiment, the lower plate 2 can be moved back and forth with respect to the upper plate 1 fixed and held at a predetermined height. The elevator drive means (not shown) is connected. When the lower plate 2 is raised so as to be close to the upper plate 1 by the raising / lowering driving means, the chamber C in which the frame 3 is sandwiched between the opposed surfaces of the upper plate 1 and the lower plate 2 and sealed is formed. When the lower plate 2 is lowered so as to be separated from the upper plate 1, the chamber C is opened.
[0019]
The lower plate 2 is formed with an accommodating portion 20 having the same size as the inner peripheral opening of the frame 3. In this embodiment, the heat insulating material 21 is housed in the housing portion 20, and the heater 6 and the air-permeable member 22 are sequentially stacked on the upper surface of the heat insulating material 21. In addition, a passage 24 to which a film body operating means, which will be described later, is connected is formed so as to penetrate into the accommodating portion 20 at the approximate center of the lower plate 2. Furthermore, holes 21 b and 6 a are respectively formed in the heat insulating material 21 and the heater 6 so as to be aligned with the passage 24. The air-permeable member 22 is made of a flat perforated plate such as punching metal, for example, and is disposed between the film body 4 and the heater 6 and constitutes an opposing surface of the lower plate 2. Further, a gap 23 is formed at least between the peripheral side surfaces of the heat insulating material 21 and the heater 6 and the side wall surface of the housing portion 20, and the gap 23 and the passage are formed on the surface in contact with the lower plate 2 of the heat insulating material 21. A plurality of grooves 21 a that communicate with 24 are formed in a lattice shape. In addition, it can replace with the groove | channel 21a, a groove | channel can also be formed in the surface which contact | connects the heat insulating material 21 of the lower board 2, and a cooling means can also be provided in the lower board 2 similarly to the upper board. The heater 6 employs a plate-like electric heater that generates heat to a predetermined temperature by supplying a current as in the case of the upper plate 1, but is not limited to this in the present invention.
[0020]
The frame 3 has an opening that is substantially the same size as the accommodating portion 10 of the upper plate 1 and constitutes the periphery of the chamber C. The outer peripheral edge of the film body 4 constituting one surface of the chamber C is fixed to one surface of the frame body 3 by baking or the like so as to hermetically close the opening over the entire surface. In the case of this embodiment, the frame 3 is formed such that the outer peripheral edge of the fixed film body 4 is in contact with the upper surface of the lower plate 2, and the central portion covers the accommodating portion 20 of the lower plate 2 in an airtight manner. It is attached to the upper surface of this by a bolt or the like (not shown). Further, although not shown, a sealing member such as an O-ring is provided on the upper surface of the frame body 3, and the chamber formed when the upper plate 1 and the lower plate 2 are moved relatively close to each other. It is comprised so that the airtightness of C can be ensured. By changing the height (thickness) of the frame 3, the height of the chamber C can be changed according to the thickness of the laminated material H.
[0021]
The film body 4 is made of a material having elasticity, flexibility, elasticity, heat resistance, etc., such as silicon rubber or fluorine rubber. Various conditions such as the thickness and hardness of the film body 4 can be set according to the strength necessary to pressurize the laminated material H.
[0022]
In this embodiment, the decompression means includes a vacuum pump (not shown) connected to the deaeration passage 14 formed in the upper plate 1. When the upper plate 1 and the lower plate 2 are moved relatively close to each other and the frame 3 is sandwiched between the opposing surfaces, and the decompression means is driven in a state where the sealed chamber C is formed, the laminated material H is accommodated. The air in the chamber C passes from the deaeration passage 14 through the heat insulating material 11, the heater 6, the gap 13 between the peripheral side surface of the surface plate 12 and the side wall surface of the housing 10 and the groove 11 a of the heat insulating material 11. By being sucked, the inside of the chamber C is surely evacuated.
[0023]
In this embodiment, the film body operating means uses air as the working fluid, and when the pressure reducing means is driven to evacuate the chamber C containing the laminated material H as described above, When the pressure is not applied, air in the space between the film body 4 and the housing portion 20 of the lower plate 2 is sucked so that the film body 4 does not inadvertently bulge into the chamber C. When pressurizing the laminated material H in the chamber C that is brought into close contact with the air-permeable member 22 and is evacuated, the space between the film body 4 and the accommodating portion 20 of the lower plate 2 is communicated with the atmosphere to the chamber. The film body 4 is expanded into the chamber C by evacuation in C, or compressed air is supplied to the space between the film body 4 and the accommodating portion of the lower plate 2 as required. A vacuum pump switchably connected to the passage 24 formed in the air conditioner and, if necessary, an air conditioner And a support (not shown). When the laminated material H is not pressurized, the film body is driven by driving a vacuum pump. 4 and below The air in the space between the housing portion 20 of the plate 2 is from the air-permeable member 22 provided so as to be in contact with the film body 4 between the heat insulating material 21 and the peripheral side surface of the heater 6 and the side wall surface of the housing portion 20. The film body 4 is sucked from the passage 24 through the gap 23 and the groove 21a of the heat insulating material 21 and from the air-permeable member 22 through the holes 6a and 21b formed in the heat insulating material 21 and the heater 6. Is securely adhered over the entire surface of the air-permeable member 22. On the other hand, when pressurizing the laminated material H, air or compressed air passes from the passage 24 through the groove 21 a of the heat insulating material 21 and the gap between the heat insulating material 21 and the peripheral side surface of the heater 6 and the side wall surface of the housing portion 20. In addition, the film body 4 is surely supplied from the breathable member 22 over the entire back surface of the film body 4 through the holes 6a and 21b formed in the heat insulating material 21 and the heater 6, and the film body 4 is expanded into the chamber C. It will be.
[0024]
In this embodiment, the fluid member 7 is For example, it is a gel having a JIS-A hardness of about 1, and a photoresist when the laminated material H is pressed by the film body 4 as will be described later. It can flow into the recess H1a of the wafer H1 through the formation layer H2. Flow It is made of a material having mobility. In this embodiment, on the film body 4 Flow The movable member 7 is placed, and the laminated material H is placed on the fluid member 7 so as to be in contact with the photoresist forming layer H2. The laminated material H is accommodated in the chamber C together with the laminated material H. Then, as will be described later, the sealed chamber C is evacuated while the film body 4 is in close contact with the air-permeable member 22, and then the film body 4 is expanded into the chamber C and the heaters 6, 6. Heat to heat do it The film body 4 presses the laminated material H against the surface plate 12 (in the case of this embodiment) through the fluid member 7. At this time, Gel-like The fluid member 7 is heated together with the laminate H. And As shown in FIGS. 2 and 8, the photoresist formation layer H2 is embedded and pressed in the recess H1a of the wafer H1. The photoresist forming layer H2 is pressed in a state where the periphery is sealed so as to be wrapped between the surface plate 12 by the film body 4 together with the fluid member 7, so that the photoresist forming layer H2 protrudes from the wafer H1. So that it does not flow.
[0025]
Next, a second embodiment of the vacuum lamination apparatus of the present invention will be described with reference to FIG. Note that portions that are the same as or correspond to those in the above-described embodiment are assigned the same reference numerals, and descriptions thereof are omitted.
[0026]
In this embodiment, the film body 4 and the frame body 3 and the passage 24 of the film body operating means are provided in the upper plate 1. In addition, the lower plate 2 is provided with a surface plate 12 and a degassing passage 14 for decompression means. Then, the laminated material H is placed on the surface plate 12 so that the wafer H1 is in contact therewith, and the laminated material H is placed on the laminated material H. Gel The fluid member 7 is placed. In this embodiment, as shown in FIG. 8, the wafer H1 can be formed on the tray T and supported on the surface plate 12 in a supported state.
[0027]
Here, in the first and second embodiments described above, the concave portion H1a is formed on one surface of the wafer H1, and the photoresist forming layer H2 is stacked only on one surface where the concave portion H1a is formed. explained. However, the vacuum laminating apparatus of the present invention is not limited to the above-described embodiment, and the recess H1a is formed on both surfaces of the wafer H1, and the photoresist forming layer H2 is formed on both surfaces where the recess H1a is formed. The present invention can also be applied when stacking. Such a case will be described below as a third embodiment with reference to FIG. Note that portions that are the same as or correspond to those in the above-described embodiment are assigned the same reference numerals, and descriptions thereof are omitted.
[0028]
In this embodiment, both the upper plate 1 and the lower plate 2 are provided with the film body 4 and the frame body 3 and the passage 24 for the film body operating means. Further, the deaeration passage 14 of the decompression means is formed so as to communicate with the inside and outside of the frame body 3. The laminated material H is disposed so that the photoresist forming layer H2 is in contact with both surfaces of the wafer where the recesses H1a are formed. Further, the photoresist forming layer H2 is disposed so as to be sandwiched between the fluid members 7 and 7. In the state of being stored in the chamber C.
[0029]
Next, one embodiment of the vacuum laminating method of the present invention is mainly described in the case where the laminated material is directly pressed by a conventional film body as shown in FIG. 7 and the present invention as shown in FIG. The case where the above-described vacuum laminating apparatus is used will be described while comparing with the case where the fluid member 7 is interposed between the film body 4 and the laminated material H and pressurized. In this embodiment, as shown in FIG. 3, a photoresist forming layer H2 is stacked on one surface of the wafer H1 on which the recess H1a is formed, using the vacuum stacking apparatus in the second embodiment. The case will be described.
[0030]
The vacuum laminating method of the present invention generally includes a step of disposing the fluid member 7 between the laminate member H2 and the film body 4, and the laminate H in a state where the fluid member 7 is disposed in the chamber C. A process of forming a sealed chamber C in which the laminated material H is accommodated by arranging and moving the upper plate 1 and the lower plate 2 relatively close to each other, and a film body so that the laminated material H is not pressurized. The process of depressurizing the inside of the sealed chamber C in a state where the bulge 4 is prevented, and the film member 4 bulges while maintaining the depressurization, and the laminated member H2 is added to the laminated member H1 by the surface thereof. Pressing the fluid member 7 into the recess H1a of the member to be laminated H1 via the laminated member H2 and heating the laminated material H by the heating means 6.
[0031]
When laminating the laminated material H, first The flow The laminated material H is disposed on the surface plate 12 constituting one surface of the chamber C together with the fluid member 7 so that the movable member 7 is positioned between the photoresist forming layer H2 as the laminated member and the film body 4. . At this time, the layered material H with the photoresist forming layer H2 facing up and the wafer H1 as the layered member facing down is placed on the surface plate 12, and then the fluid member is placed on the layered material H. 7 may be placed, and the laminated material H may be placed on the surface plate 12 in a state where the fluid member 7 is placed so as to be in contact with the photoresist forming layer H2.
[0032]
Next, when the upper plate 1 and the lower plate 2 are moved relatively close to each other, the frame body 3 is sandwiched between the opposing surfaces of the upper plate 1 and the lower plate 2, and the surface plate 12 and the film body 4 A sealed chamber C is formed which is surrounded by the frame 3 and contains the material to be laminated H.
[0033]
Subsequently, the membrane body 4 is brought into close contact with the air-permeable member 22 of the upper plate 1 by the membrane body operating means, and in this state, the decompression means is driven to evacuate the air in the sealed chamber C and evacuate it. Do. Therefore, since the film body 4 is prevented from bulging into the chamber C by evacuation in the chamber C, the laminated material H is not pressurized by the film body 4 at this time.
[0034]
When the inside of the sealed chamber C is sufficiently depressurized, the adhesion of the film body 4 to the air-permeable member 22 is released, and the space between the film body 4 and the accommodating portion 20 of the lower plate 2 is communicated with the atmosphere. Alternatively, the film body operation is performed so that compressed air is supplied to the space between the film body 4 and the accommodating portion 20 of the lower plate 2 as necessary, and the film body 4 is expanded to contract the volume of the chamber C. The means is switched, and pressure is applied so that the laminated material H is evenly pressed against the surface plate 12 over the entire surface via the fluid member 7. At this time, current is supplied to the heaters 6 and 6 to generate heat. Therefore, the photoresist forming layer H2 has adhesiveness, and the photoresist forming layer H2 is laminated on the wafer H1 by being pressed by the film body 4 through the fluid member 7.
[0035]
When the photoresist formation layer H2 is laminated on the wafer H1, as shown in FIG. 8, the film body 4 is pressurized via the fluid member 7, so that the recess H1a of the wafer H1 is interposed through the photoresist formation layer H2. Since the fluid member 7 flows in, the photoresist forming layer H2 is pressed and embedded so as to be in close contact with the bottom surface and the side surface of the recess H1a of the wafer H1.
[0036]
On the other hand, as shown in FIG. 7, when the laminated material H is directly pressed by the film body 4, as described above, the hardness and thickness are set so that the film body 4 can ensure a predetermined strength. Therefore, it cannot be elastically deformed so as to embed and laminate the photoresist forming layer along the side surface and the bottom surface of the recess H1a of the wafer H1.
[0037]
In addition, as described above, in the case where a conductive layer is further laminated via an insulating layer as the laminated member H2 on the circuit board having the conductive layer formed in a predetermined pattern on the surface as the laminated member H1. However, since the fluid member 7 flows into the irregularities (recesses H1a) formed by the circuit pattern formed on the surface via the insulating layer and the conductive layer H2, the insulating layer and the conductive layer H2 are in close contact with the circuit pattern H1a of the circuit board H1. It will be pressed and embedded.
[0038]
Further, the present invention is not limited to the above-described embodiment, and a laminated product used for other purposes such as a case where a dielectric layer or a protective layer H2 is laminated on a glass substrate H1 constituting a display is laminated. It can also be applied to.
[0039]
When the laminated molding of the material to be laminated H is completed, when compressed air is supplied to the space between the film body 4 and the accommodating portion 20 of the lower plate 2, the supply is stopped, and the film body is used as necessary. 4 and the housing portion 20 of the lower plate 2 are sucked to bring the film body 4 into close contact with the air-permeable member 22, and the drive of the decompression means is stopped to introduce the atmosphere into the sealed chamber C. Then, the upper plate 1 and the lower plate 2 are moved relatively apart to release the chamber C and take out the laminated product.
[0040]
【The invention's effect】
According to invention of Claim 1, it is interposed between a to-be-laminated member and a film body, and when a laminated member is pressurized to a to-be-laminated member with a film body, it is in a recessed part of a to-be-laminated member via a laminated member. Even if the width of the concave portion of the laminated member is relatively narrow or deep, the laminated member can be reliably embedded in the concave portion with a simple configuration in which a fluid member that flows in is provided. A vacuum laminating apparatus capable of laminating can be provided.
[0041]
According to the invention of claim 2, the fluid member that can flow into the concave portion of the laminated member via the laminated member is disposed between the laminated member and the film body, and the laminated member is covered by the surface of the film body. In the process of pressurizing the laminated member, the flowable member is allowed to flow into the concave portion of the laminated member through the laminated member, and the concave portion of the laminated member is relatively narrow or deep. Even if it exists, the vacuum lamination method which can laminate | stack a lamination | stacking member reliably with sufficient embedding | flushing property also to this recessed part can be provided.
[Brief description of the drawings]
FIG. 1 is a longitudinal sectional view showing an embodiment of a vacuum lamination apparatus of the present invention.
2 is a longitudinal sectional view showing a state in which a material to be laminated housed in a chamber is heated and pressurized in the vacuum laminating apparatus shown in FIG.
FIG. 3 is a longitudinal sectional view showing a second embodiment of the vacuum lamination apparatus of the present invention.
FIG. 4 is a longitudinal sectional view showing a third embodiment of the vacuum lamination apparatus of the present invention.
FIG. 5 is a plan view showing a wafer supported and formed on a tray as a laminated material to which the present invention is applied.
FIG. 6 is a partially enlarged plan view of a wafer in which a recess is formed so as to be divided into sizes of electronic components to be diced later.
FIG. 7 is a partially enlarged longitudinal sectional view for explaining a state in which a film body directly pressurizes a laminated material by a conventional technique.
FIG. 8 is a partially enlarged longitudinal sectional view for explaining a state in which the film body presses the laminated material through the fluid member according to the present invention.
[Explanation of symbols]
H Laminate
H1 wafer (stacked member)
H1a recess
H2 photoresist formation layer (laminated member)
C chamber
1 Upper plate
2 Lower plate
3 Frame
4 Membrane
6 Heater (heating means)
7 Flowable members

Claims

The laminated material is composed of a laminated member having a recess, and a laminated member that is adhered to the laminated member by being pressurized and heated.
A sealed chamber in which the laminate is accommodated;
A film body that constitutes at least one surface in the sealed chamber and presses the laminated member against the laminated member;
Decompression means for evacuating the inside of the sealed chamber;
Switching and the laminate of the vacuum evacuation has been sealed chamber prevents bulging of the film body so as not pressurized, and Rukoto was pressurized to laminate the surface thereof is bulged the membrane body, the Membrane operation means that can be operated,
Heating means for heating the laminated material;
A vacuum laminating apparatus comprising:
Provided is a fluid member that is interposed between the laminated member and the film body and flows into the concave portion of the laminated member through the laminated member when the laminated member is pressed against the laminated member by the film body. A vacuum lamination apparatus characterized by the above.

The laminated material is composed of a laminated member having a recess, and a laminated member that is adhered to the laminated member by being pressurized and heated.
Accommodating and sealing the laminated material in a chamber having at least one surface formed by a film body;
Depressurizing the inside of the sealed chamber in a state where the swelling of the film body is prevented so that the laminated material is not pressurized;
A step of expanding the film body while maintaining the reduced pressure and pressurizing the laminated member against the laminated member by the surface and heating the laminated material by a heating means;
A vacuum lamination method comprising:
In the step of accommodating the laminated material in the chamber, a fluid member that can flow into the concave portion of the laminated member via the laminated member is disposed between the laminated member and the film body,
A vacuum laminating method characterized in that, in the step of pressurizing the laminated member to the laminated member by the surface of the film body, the fluid member is caused to flow into the recess of the laminated member through the laminated member.