JP4032316B1 - Thin film laminating apparatus and thin film laminating method - Google Patents

Abstract

Provided is a thin-film laminating apparatus that can apply a uniform pressure even when the surface of a printed circuit board is uneven, has a short laminating time, and has high productivity.
Vacuum processing for returning the outside of the laminated module to normal pressure after sucking gas from the inside of the laminated module that has been expanded by evacuating the outside of the laminated module in which the printed circuit board is sandwiched between upper and lower elastic films in a normal temperature range A step of moving the laminated module from a normal temperature region to a warming region while maintaining an internal vacuum, and injecting a vertical pressurizing fluid to the outside of the laminated module in the warming region to uniformly form the printed circuit board It was set as the structure of the lamination | stacking method by the thin film type laminating apparatus characterized by including the lamination process which applies a certain pressure.
[Selection] Figure 1

Description

  The present invention relates to a thin-film laminating apparatus that applies a pressure to a surface of a printed circuit board with a fluid through a resin elastic film having an appropriate elasticity in the lamination process of the printed circuit board.

  In manufacturing a printed circuit board, after forming a conductor pattern with copper foil or the like, when laminating a film or the like as a coverlay for insulation protection on the surface, or when laminating to integrate a plurality of printed circuit boards, Lamination processing equipment is required. Conventional lamination processing equipment for printed circuit boards includes multi-stage laminating presses, rapid laminating presses, and autoclaves.

  First, in the case of a multi-stage laminating press and a rapid laminating press, the pressure required for laminating and pressing applies a force such as a hydraulic cylinder to a printed circuit board through a flat hot plate. If the surface of the substrate is flat, the lamination pressure can be applied uniformly.

  FIG. 20 is a cross-sectional view of a conventional laminating apparatus. In the conventional laminating apparatus 21, an adhesive 21g is applied between the conductor 21d and the base film 21e, an adhesive 21g is applied between the conductor 21d and the cover film 21f, and the upper heating plate 21a and the lower heating plate 21b are interposed. Pinch.

  The upper heating plate 21a and the lower heating plate 21b melt the adhesive 21g by applying heat, apply the pressure to bond the conductor 21d, the base film 21e, and the cover film 21f, and laminate the printed circuit board 21c. To do.

  Since a pattern is formed on the printed circuit board 21c by the conductor 21d, the surface is uneven. When a flat hot plate is used, excessive pressure is applied to the convex portion 21h with the conductor 21d, and sufficient pressure is not applied to the concave portion 21i without the conductor 21d.

  When the pressure is insufficient, problems such as insufficient embedding of the laminating resin and remaining bubbles occur. If bubbles are present, the soldering process results in a high temperature environment of around 250 ° C., so that the bubbles expand rapidly and damage the substrate.

  In order to make the pressure uniform, various cushion materials such as a heat-resistant rubber sheet may be used. However, the printed circuit board 21c that has received pressure from above and below is pushed out in the lateral direction where no pressure is applied, and deforms. If deformation or displacement occurs during lamination, alignment between the layers becomes difficult.

  If the pressure is lowered to reduce the deformation amount of the printed circuit board 21c, the resin for laminating is insufficiently embedded or bubbles remain between the patterns of the conductor 21d. If the lamination pressure is increased so that no bubbles remain, the printed circuit board The deformation of 21c becomes large.

As described in Patent Document 1, an invention in which a coverlay film is heated and pressurized via a cushioning material including a polyethylene sheet and a polyethylene diffusion prevention sheet that suppresses diffusion of the polyethylene sheet is also disclosed.
Japanese Patent Laid-Open No. 08-032213

  In addition, in the opening 21j for connecting the cover film 21f and the like, when a laminating pressure is applied in a heated state, the adhesive 21g applied to the cover film 21f flows out to the opening 21j having a low pressure, and the printed circuit board 21c. Connection reliability will be impaired.

  Next, in the case of an autoclave, a large pressure vessel is used, the entire printed circuit board 21c to be laminated is placed on a support plate, covered with a plastic film, placed on a pedestal, and drawn into the vessel to be sealed. The inside of the plastic film is evacuated, and the container is filled with a gas that is a pressurized medium, and a lamination pressure is applied.

  The lamination pressure is applied between the plastic film and the support plate on which the printed circuit board 21c is placed. Since the upper surface of the printed circuit board 21c is pressurized with gas through a plastic film, even if it is not flat, the lamination pressure is uniformly applied. In addition, since pressure is applied to the side surfaces, deformation in the lateral direction is unlikely to occur.

  However, the autoclave has a large apparatus, a long laminating time, and low productivity. In order to compensate for the low productivity, when a plurality of printed circuit boards 21c are pressure-processed in a multi-layer format on a gantry, even if the uppermost printed circuit board 21c has irregularities on the surface, a uniform pressure is applied. The uniform pressure is not applied to the lower printed circuit board 21c.

  Therefore, an object of the present invention is to provide a thin-film laminating apparatus that can apply a uniform pressure even when the surface of a printed circuit board is uneven, has a short laminating time, and has high productivity. Is.

In order to solve the above problems, the present invention is laminated between an upper plate 7 with a thin elastic upper elastic membrane 7a and a lower plate 8 with a thin elastic lower elastic membrane 8a. After sandwiching the printed circuit board 12 between the laminated module 2 and the laminated module 12 between the upper and lower sealed containers 5 and 6, a space formed by the laminated module 12 elastic films 7 a and 8 a and the upper and lower sealed containers 5 and 6 is formed. After evacuating and expanding the laminated module 12 elastic membranes 7a, 8a by the differential pressure with the remaining air, the residual air in the laminated module 12 elastic membranes 7a, 8a is sucked to eliminate the differential pressure , The space formed by the laminated module 12 elastic membranes 7a and 8a and the upper and lower sealed containers 5 and 6 is returned to normal pressure, and the inside of the laminated module elastic membrane is brought into close contact with the differential pressure, thereby causing bubbles in the printed circuit board 12. The The stacked module 12 elastic film 7a without being a vacuum processing mechanism 3 for evacuating the inside 8a, the laminate module 12 as evacuated in the vacuum processing mechanism 3 while maintaining the vacuum state in the vertical processing vessel 14, 15 After being sandwiched, the upper and lower pressurizing fluids 16a and 17a are injected into the space formed by the laminated module 12 elastic membranes 7a and 8a and the upper and lower processing containers 14 and 15, and the printed circuit is passed through the upper and lower elastic membranes 7a and 8a. After applying a uniform pressure by a fluid to the uneven surface of the substrate 12, the printed circuit board 12 is heated 18 a by the heat sources 14 a and 15 a provided in the upper and lower processing containers 14 and 15. the printed circuit of a multilayer processing mechanism 4 for attaching a substrate 12, dividing the lamination mechanism 4 and the vacuum processing mechanism 3 while preventing the outflow, the The layers module 12 is evacuated at room temperature in the vacuum processing mechanism 3, that was transported to the lamination mechanism 4 while maintaining the vacuum state under pressure and heating, the printed circuit board 12 until completely evacuated In addition, a pressure difference 18b is provided between the upper pressurizing fluid 16a and the lower pressurizing fluid 17a, and the printed circuit board 12 is pressed against the heat sources 14a and 15a of the upper processing container 14 or the lower processing container 15. The thin-film laminating apparatus 1 is characterized in that the heating efficiency of the upper surface and the lower surface is changed, and the printed circuit board 12 is laminated by the thin-film laminating apparatus 1. It was.

  Since this invention is the above structure, the following effects are acquired. First, by removing the gas in advance by applying a vacuum treatment before heating and pressurization, no bubbles remain in the laminated printed circuit board, and the laminate quality can be improved. .

  Secondly, by sandwiching the printed circuit board between the two elastic films and applying pressure with fluid from the outside of the elastic film, the lamination pressure is evenly applied even if there are irregularities on the surface of the printed circuit board, Insufficient embedding of the resin for laminating due to insufficient local pressure by the method and lateral flow of adhesive due to excessive local pressure can be suppressed.

  Third, since the vacuum processing is performed on a single printed circuit board, the effect of the vacuum processing is great, the pressure required for lamination can be greatly reduced, and the damage on the printed circuit board is also greatly reduced. Productivity is very high.

  Fourth, since pressure is applied by a fluid through the elastic film, uniform pressure is applied to the printed circuit board from all directions, so that the dimensional change of the printed circuit board is minimized. Also, the pressure required for lamination can be low.

  Fifth, the heat load during lamination is only small because the elastic film and the printed circuit board have a small heat capacity, and the heating energy can be greatly reduced. The heating time is also short, which is very effective in reducing environmental impact.

  Sixth, since the printed circuit board is processed as a single unit instead of a plurality, it is easy to adjust the heating amount and the heating time, and the quality is stabilized. Since there is no buffer material or the like, the thermal conductivity is good, the weight is reduced, and it is not affected by pressure from other printed circuit boards.

  The present invention relates to a printed circuit board laminated process through a resin elastic film having an appropriate elasticity for the purpose of applying a uniform pressure even when the surface of the printed circuit board is uneven in the laminated process of the printed circuit board. This was realized by applying pressure to the substrate with fluid.

  Below, based on an accompanying drawing, the thin film type laminating apparatus which is this invention is demonstrated in detail.

  FIG. 1 is a perspective view showing the entire thin film laminating apparatus according to the present invention. The thin film laminating apparatus 1 includes a lamination module 2, a vacuum processing mechanism 3, a lamination processing mechanism 4, and the like.

  The thin film laminating apparatus 1 performs processing by the vacuum processing mechanism 3 and the lamination processing mechanism 4 on the laminated module 2 containing the printed circuit board 12 to perform coverlay processing or the like on the printed circuit board 12 after the conductor pattern is formed. It is a device to perform.

  The laminated module 2 is an instrument that sandwiches a printed circuit board 12 to be processed between thin elastic films 7a and 8a. The printed circuit board 12 is in a state where an adhesive 12d is applied to the conductor 12a on which the pattern is formed, and the films 12b and 12c are covered.

  The vacuum processing mechanism 3 is a device that evacuates the laminated module 2 using a vacuum pump 3a or the like so that air bubbles do not enter between the conductor 12a of the printed circuit board 12 and the films 12b and 12c.

  The lamination processing mechanism 4 is an apparatus for manufacturing the laminated printed circuit board 12. Heat and pressure are applied to the laminated module 2 to bond the conductor 12a of the printed circuit board 12 and the films 12b and 12c. The pressure is applied by sending fluid from the pressurizing tank 3e.

  FIG. 2 is a perspective view showing a state in which a laminated module of the thin film laminating apparatus according to the present invention is opened and a printed circuit board is set.

  The laminated module 2 is an open / close-type instrument in which the rear ends of the upper plate 7 and the lower plate 8 are connected to each other by a hinge 7g, and the upper plate 7 is lifted by lifting the grip portion 7f provided on the front side of the upper plate 7. 7 can be rotated.

  The upper plate 7 is a plate-like member in which a thin elastic upper elastic film 7a is stretched inside the frame-like upper frame 7b. An upper seal 7d for sealing is provided on the lower surface of the upper frame 7b so as to surround the upper elastic film 7a.

  Since the upper frame 7b has a thickness and the upper elastic film 7a is stretched near the lower surface of the upper plate 7, an upper recess 7c exists above the upper elastic film 7a. Since the upper surface of the upper frame 7b is depressed by the upper recess 7c, a hollow space is created by closing the upper side.

  The lower plate 8 is a plate-like member in which a thin elastic lower elastic film 8a is stretched inside a frame-like lower frame 8b. A lower seal 8d for sealing is provided on the upper surface of the lower frame 8b so as to surround the lower elastic film 8a.

  Since the lower frame 8b has a thickness and the lower elastic film 8a is stretched near the upper surface of the lower plate 8, a lower recess 8c exists below the lower elastic film 8a. Since the lower surface of the lower frame 8b is depressed by the lower recess 8c, a hollow space is created by closing the lower side.

  The upper plate 7 is opened, the printed circuit board 12 is placed on the lower elastic film 8a, and the upper plate 7 is closed. The printed circuit board 12 is sandwiched between the upper elastic film 7a and the lower elastic film 8a, and is sealed by the upper seal 7d and the lower seal 8d.

  A thin-film intake hole 7e that connects the thin-film inner space 11a sandwiched between the upper elastic film 7a and the lower elastic film 8a and the outside is formed on the side surface of the upper frame 7b, and the thin-film intake air for sucking gas is formed. The nozzle 11 is connected. The in-film intake nozzle 11 is connected to the vacuum pump 3a.

  In the laminated module 2, the printed circuit board 12 to be laminated is sandwiched between elastic films 7a and 8a made of resin having appropriate elasticity and heat resistance, and necessary pressure is applied to the printed circuit board 12 through the elastic films 7a and 8a. .

  Pressure is applied with an irregular fluid rather than a fixed-shaped hot plate. Since the pressurized fluid is equal in pressure at any part, it is possible to apply a uniform pressure by the flexible elastic films 7a and 8a regardless of the unevenness of the surface of the printed circuit board 12.

  As a result, the deformation of the printed circuit board 12 due to uneven local pressure can be minimized, and problems such as insufficient embedding of the adhesive 12d between the conductors 12a patterns and remaining bubbles can be minimized.

  FIG. 3 is a front perspective view showing a scene in which the laminated module is introduced into the vacuum processing mechanism of the thin film laminating apparatus according to the present invention. FIG. 4 is a perspective view showing a scene where vacuum processing is performed in the vacuum processing mechanism of the thin film laminating apparatus according to the present invention.

  The laminated module 2 is subjected to a vacuum process in order to improve the quality of the bubble remaining problem of the printed circuit board 12 to be laminated. The vacuum processing is performed by sucking gas with the vacuum pump 3a.

  In the lamination of the printed circuit board 12, after the adhesive 12d is heated to a temperature higher than the glass transition point and softened, pressure is applied to the viscous adhesive 12d so that the adhesive 12d is placed on the printed circuit board 12. It flows into the space between the circuits formed by the conductor 12a, and an adhesive effect is produced.

  Conventionally, the temperature required for bonding varies depending on the resin used as the adhesive 12d, but is usually 150 ° C. or higher. After the lamination, it is necessary to cool the printed circuit board 12 to a normal temperature state by cooling from a high temperature state.

  In a conventional multi-stage laminating press, it is necessary to apply a 40 to 50 kilogram weight per square centimeter as a lamination pressure, and a hot plate made of steel having a thickness of 30 mm or more is used. The temperature required for the lamination process is heating a steel hot plate having a large heat capacity. For this reason, both the temperature raising time and the cooling time are required about 30 minutes, and the required time per one time is one and a half hours or more, and the productivity per hour is low.

  Therefore, a plurality of printed circuit boards 12 are stacked between a set of heat plates, and a metal plate such as stainless steel is inserted between the printed circuit boards 12 to prevent interference between the printed circuit boards 12. However, since the weight is added to the printed circuit board 12 located in the lower part, even if vacuum processing is performed, there is a high possibility that a partial air accumulation will occur.

  In addition, when a large number of printed circuit boards 12 and the like exist between the hot plates, there is a variation in the amount and time of heat transfer between a portion close to the hot plate and a portion far from the hot plate, and the printed circuit board 12 having the same quality is manufactured. Have difficulty.

  When the processing is performed one by one at a high temperature in a short time without a cooling cycle as in a high-speed laminating press, the printed circuit board 12 having a small heat capacity becomes a high temperature state in a short time. Since the adhesive 12d rapidly softens and becomes sticky, air bubbles may be trapped between the conductors 12a and between the conductor 12a and the adhesive 12d. Even if the vacuum treatment is performed in this state, it is difficult to remove the residual gas.

  As for the autoclave, the apparatus is large in size, has a large heat capacity, and the time required for lamination is at least about 2 hours, and the productivity per hour is low. Since the printed circuit board 12 is set in an overlapping manner, there is a possibility that the vacuum effect of the printed circuit board 12 positioned below is hindered. The vacuum pump 3a also needs a large capacity.

  The vacuum processing mechanism 3 of the present invention includes an upper sealed container 5 and a lower sealed container 6. The upper sealed container 5 is opened and closed, and the stacking module 2 is sandwiched between the upper sealed container 5 and the lower sealed container 6, and stacked. Vacuum processing is performed on the module 2.

  The upper airtight container 5 has an open / close plate 3b connected to the upper surface, and opens and closes in conjunction with the operation of the open / close plate 3b. The upper convex part 5a protrudes in the center part of the lower surface, and can be fitted to the upper concave part 7c of the laminated module 2.

  The open / close plate 3b is pivotally fixed at the back side, and arms 3c are vertically suspended at both lower ends in order to lift the near side. The arm 3c expands and contracts by moving the piston up and down in the cylinder.

  Even when the upper sealed container 5 and the laminated module 2 are brought into close contact with each other, the upper pressure space 9a exists between the upper convex portion 5a and the upper elastic membrane 7a. The upper pressure space intake hole 5b is connected, and the upper pressure space intake nozzle 9 is connected. The upper pressure space intake nozzle 9 is connected to the vacuum pump 3a.

  The lower sealed container 6 is held horizontally. A lower convex portion 6a protrudes from the central portion of the upper surface, and can be fitted into the lower concave portion 8c of the laminated module 2. The stacking module 2 slides on the rail 3 d and moves between the vacuum processing mechanism 3 and the stacking processing mechanism 4. In the vacuum processing mechanism 3, the stacking module 2 is placed on the lower sealed container 6.

  Even when the lower sealed container 6 and the laminated module 2 are brought into close contact with each other, the lower pressure space 10a exists between the lower convex portion 6a and the lower elastic film 8a. The lower pressure space intake hole 6b is connected, and the lower pressure space intake nozzle 10 is connected. The lower pressure space intake nozzle 10 is connected to the vacuum pump 3a.

  By closing the upper airtight container 5 and placing it on the upper plate 7, the laminated module 2 is sandwiched between the upper airtight container 5 and the lower airtight container 6, and gas is sucked by the vacuum pump 3 a, so that the inside of the laminated module 2 To a vacuum.

  FIG. 5 is a cross-sectional view of the vacuum processing mechanism of the thin film laminating apparatus according to the present invention. FIG. 6 is an exploded sectional view of the vacuum processing mechanism of the thin film laminating apparatus according to the present invention.

  In order to exhaust the gas in the thin film inner space 11a sandwiched between the upper and lower elastic films 7a and 8a in which the printed circuit board 12 is housed, it is necessary to provide an exhaust pipe line on the upper plate 7 or the lower plate 8. In the present invention, the upper plate 7 is provided with an in-film intake hole 7e.

  However, when the gas is directly sucked from the thin film inner space 11a, the portion close to the thin film intake hole 7e first becomes negative pressure, and the upper and lower elastic films 7a and 8a are pressed and brought into close contact with the atmospheric pressure 13b. The discharge of the gas at the center of the inner space 11a will be hindered.

  In addition, if air is sucked by placing a fibrous material such as paper or cloth from the air intake hole 7e in the thin film and exhausting through the gap between the fibers, the space in the thin film internal space 11a is evacuated. It is possible to do.

  In the present invention, the upper pressure space 9a and the lower elastic film 8a are placed between the upper elastic film 7a and the upper sealed container 5 so that the atmospheric pressure 13b does not directly act on the outer sides of the upper and lower elastic films 7a and 8a in a normal temperature environment. A lower pressure space 10 a is provided between the lower sealed container 6.

  The upper pressure space 9a is sealed by fitting the upper concave portion 7c of the upper plate 7 and the upper convex portion 5a of the upper sealed container 5, and the upper pressure space 5 of the upper sealed container 5 to which the intake nozzle 9 for the upper pressure space is connected. Ventilation with the outside is possible only from the air intake hole 5b.

  The lower pressure space 10a is sealed by fitting the lower concave portion 8c of the lower plate 8 and the lower convex portion 6a of the lower sealed container 6, and the lower pressure space 6 of the lower sealed container 6 to which the lower pressure space intake nozzle 10 is connected. Ventilation with the outside is possible only from the air intake hole 6b.

  FIG. 7 is a cross-sectional view showing a state in which primary exhaust is started with respect to the pressure space of the vacuum processing mechanism of the thin film laminating apparatus according to the present invention.

  As the primary exhaust 13, the vacuum pump 3 a sucks the gas in the upper pressure space 9 a from the upper pressure space intake hole 5 b and similarly sucks the gas in the lower pressure space 10 a from the lower pressure space intake hole 6 b to The space 9a and the lower pressure space 10a are evacuated.

  When the primary exhaust 13 is performed, since the upper and lower pressure spaces 9a and 10a are in a vacuum and the atmosphere exists in the thin film inner space 11a, the upper elastic film 7a is pulled upward and the lower elastic film 8a is pulled downward by the differential pressure. As a result, the dimension of the thin film inner space 11a increases. As a result, a free space to which no stress other than gravity is applied is formed in the printed circuit board 12.

  FIG. 8 is a cross-sectional view showing a state in which secondary exhaust is started with respect to the space in the thin film in the laminated module in addition to the primary exhaust of the thin film laminating apparatus according to the present invention.

  When the differential pressure is generated in the upper and lower pressure spaces 9a, 10a and the thin film inner space 11a by the primary exhaust 13, the secondary exhaust 13a is started while continuing the primary exhaust 13. Since the upper and lower sealed containers 5 and 6 are free spaces free from interference due to atmospheric pressure, the upper and lower elastic films 7a and 8a are not in close contact with each other, and the gas can be exhausted completely.

  In the secondary exhaust 13a, the gas in the thin film internal space 11a is sucked from the thin film intake hole 7e by the vacuum pump 3a, and the thin film internal space 11a is evacuated. Since the upper and lower pressure spaces 9a and 10a and the thin film inner space 11a are both evacuated to eliminate the differential pressure, the thin film inner space 11a is not expanded, and the positions of the upper and lower elastic films 7a and 8a are also restored.

  FIG. 9 is a cross-sectional view showing a state where the primary exhaust of the thin film laminating apparatus according to the present invention is stopped and only the secondary exhaust is performed.

  When the space 11a in the thin film is completely evacuated, the primary exhaust 13 is stopped and the negative pressure in the upper and lower pressure spaces 9a and 10a is released. The thin film inner space 11a in which the upper and lower elastic films 7a and 8a are pressed inward by the differential pressure between the vacuum thin film inner space 11a and the upper and lower pressure spaces 9a and 10a returned to the atmospheric pressure 13b, and the printed circuit board 12 is accommodated. The vacuum state can be maintained continuously.

  In the present invention, there is no hydraulic cylinder or hot plate in the space that needs to be exhausted as in the conventional multi-stage laminating press, and the space that needs to be exhausted can be minimized. Is small enough to handle. Moreover, since it becomes free space, the location where insufficient exhaust_gas | exhaustion is not locally produced in the printed circuit board 12 does not arise.

  Furthermore, since the vacuum treatment is performed in a room temperature environment, the adhesive 12d is not softened and does not cause viscosity. Since it is completely evacuated, bubbles do not remain on the printed circuit board 12 even when the lamination pressure is lowered, and it becomes possible to produce a printed circuit board 12 of sufficient quality.

  FIG. 10 is a perspective view showing transfer from the vacuum processing mechanism to the lamination processing mechanism of the thin film laminating apparatus according to the present invention. FIG. 11 is a cross-sectional view showing the state of the laminated module during transfer of the thin film laminating apparatus according to the present invention.

  From the viewpoint of productivity and thermal energy saving, the vacuum processing mechanism 3 which is a normal temperature region and the laminated processing mechanism 4 which is a warming region are separated, and vacuum processing is performed in the normal temperature region, and the heating region is maintained while maintaining the vacuum state. Heat and pressurize with

  If the printed circuit board 12 sandwiched between the upper and lower elastic films 7a and 8a is evacuated in a room temperature region and evacuation from the space 11a in the thin film is continued, the elastic films 7a and 8a are applied to the printed circuit board 12 by the external atmospheric pressure 13b. It is held in close contact.

  The laminated module 2 is moved along the rail 3d to the laminated processing mechanism 4 while maintaining the vacuum state. Even during movement, the elastic films 7a and 8a are in close contact with the printed circuit board 12 by the atmospheric pressure 13b, so that they can be transferred without affecting the quality of the printed circuit board 12 in the laminated module 2.

  Note that only the printed circuit board 12, the upper elastic film 7a, and the lower elastic film 8a are subject to heating and cooling during the lamination process. Since the heat capacity is very small, it is possible to minimize the heat energy required during lamination. That is, the energy saving effect can be maximized, and the energy cost can be greatly reduced.

  The movement from the heating area to the room temperature area is performed in the same manner, but even when the heated printed circuit board 12 is transferred, no deformation occurs regardless of the state of the adhesive 12d. Can be transported.

  FIG. 12 is a rear perspective view showing a scene in which the laminated module is introduced into the lamination processing mechanism of the thin film laminating apparatus according to the present invention. FIG. 13 is a sectional view of the lamination processing mechanism of the thin film laminating apparatus according to the present invention.

  The lamination processing mechanism 4 includes an upper processing container 14, a lower processing container 15, an upper heat source 14a, a lower heat source 15a, and the like. The stacking module 2 transferred to the stacking processing mechanism 4 is sandwiched between the upper processing container 14 from the upper side and the lower processing container 15 from the lower side.

  The upper processing container 14 is fitted to the upper surface of the laminated module 2 in the same manner as the upper sealed container 5. An upper processing space 16 exists between the upper processing container 14 and the upper elastic film 7 a, and an upper injection hole 14 b communicating from the upper processing space 16 to the outside is also opened in the upper processing container 14.

  The upper heat source 14 a is a device that supplies heat into the upper processing space 16 from the outside via the upper processing container 14. A plurality of upper heat sources 14a can be connected to the upper processing container 14, and the amount of heat can be adjusted.

  The lower processing container 15 is fitted to the lower surface of the laminated module 2 in the same manner as the lower sealed container 6. A lower processing space 17 exists between the lower processing container 15 and the lower elastic film 8 a, and a lower injection hole 15 b communicating from the lower processing space 17 to the outside is also opened in the lower processing container 15.

  The lower heat source 15 a is a device that supplies heat into the lower processing space 17 from the outside via the lower processing container 15. A plurality of lower heat sources 15a can be connected to the lower processing container 15, and the amount of heat can also be adjusted.

  FIG. 14 is a cross-sectional view showing a state in which a pressurizing fluid is injected into the processing space of the lamination processing mechanism of the thin film laminating apparatus according to the present invention. FIG. 15 is an enlarged cross-sectional view showing a state in which lamination processing is performed on the printed circuit board of the thin film laminating apparatus according to the present invention.

  In order to apply pressure to the upper and lower elastic membranes 7a and 8a, fluid injection 18 is performed. In the fluid injection 18, the upper pressurizing fluid 16a is injected into the upper processing space 16 from the upper injection hole 14b connected to the pressurizing tank 3e, and into the lower processing space 17 from the lower injection hole 15b connected to the pressurizing tank 3e. The lower pressurizing fluid 17a is injected.

  The upper pressurizing fluid 16a and the lower pressurizing fluid 17a may be gas or liquid. Since the applied pressure is transmitted equally in any part, even if the printed circuit board 12 has irregularities, the flexible upper and lower elastic films 7a, 8a adhere to each other along the irregularities.

  Heating 18 a is also performed by the upper heat source 14 a of the upper processing container 14 and the lower heat source 15 a of the lower processing container 15. By the heating 18a, the adhesive 12d of the printed circuit board 12 is melted and flows into the gaps of the conductors 12a.

  Since the portion where the adhesive 12d flows without the conductor 12a is recessed, the surface is uneven. However, since the upper and lower pressurizing fluids 16a and 17a apply pressure evenly through the upper and lower elastic films 7a and 8a, the cover film 12c is also formed. Stick along the unevenness.

  In the portion where the opening 12e is provided in the cover film 12c at the exposed portion of the conductor 12a, the upper elastic film 7a extends along the opening 12e so that the peripheral adhesive 12d does not flow into and cover the conductor 12a. It adheres and prevents the adhesive 12d from flowing out.

  Since it is evacuated in a normal temperature environment in advance, air bubbles are not confined when the adhesive 12d flows, and are pressurized 12f uniformly by the upper and lower pressurizing fluids 16a and 17a, and the cover film 12c and the conductor 12a Is stuck with an adhesive 12d having increased tackiness.

  Since the printed circuit boards 12 are processed individually one by one, there is a low possibility that damage such as cracking or disconnection of the conductor 12a due to excessive pressure will occur. In addition, since the pressure is applied uniformly as a whole, the dimensional change is minimized without extending in the lateral direction due to the pressure from above and below.

  Since the upper processing space 16 and the lower processing space 17 are independent from each other, the pressure applied to the upper processing space 16 and the pressure applied to the lower processing space 17 can be set individually. Even if the front and back surfaces are different, the pressure can be adjusted to an appropriate level.

  Further, the upper pressurizing fluid 16a to be injected into the upper processing space 16 and the lower pressurizing fluid 17a to be injected into the lower processing space 17 may be made of different types of materials, or the upper elastic film 7a and the lower elastic film 8a may be of different types. It is also possible to adjust by using the material.

  For example, when the base film 12b and the conductor 12a are bonded in advance and the lower adhesive 12d is solidified, the cover film 12c may be adjusted so that a large pressure is applied.

  In addition, there are various application examples, such as a case where an adhesive is attached to the film itself as an intermediate treatment, or a case where the printed circuit board 12 is attached and stacked instead of covering the cover film 12c.

  FIG. 16 is a cross-sectional view showing a case where a differential pressure is provided to the pressurizing fluid in the lamination processing mechanism of the thin film laminating apparatus according to the present invention.

  By changing the pressure of the upper pressurizing fluid 16a and the pressure of the lower pressurizing fluid 17a and providing the differential pressure 18b, the positions of the upper and lower elastic films 7a and 8a containing the printed circuit board 12 can be changed. .

  For example, by making the pressure of the lower pressurizing fluid 17a larger than the upper pressurizing fluid 16a, the upper and lower elastic films 7a and 8a are moved upward and pressed against the upper heat source 14a of the upper processing container 14 to thereby generate a printed circuit. The upper surface of the substrate 12 can be heated more efficiently.

  The upper and lower heat sources 14a and 15a may heat the upper and lower processing containers 14 and 15 with an electric heater or steam, or may be heated by installing a heating element in the upper and lower processing spaces 16 and 17. Alternatively, the temperature of the upper and lower pressurizing fluids 16a and 17a may be increased and heated.

  In the present invention, only the elastic films 7a and 8a are provided on the upper and lower sides of the printed circuit board 12, and it is not necessary to sandwich various auxiliary materials such as a stainless steel plate, a heat resistant rubber with glass cloth, and kraft paper as a buffer during lamination. The rate is very good.

  Further, since the printed circuit boards 12 are processed one by one and the plurality of printed circuit boards 12 are not overlapped, the heating 18a and the pressure 12f are not uneven, and the quality is stabilized. Since the thermal efficiency is good, the processing time per sheet is short.

  In a multi-stage laminating press or autoclave, the energy required for heating and cooling the entire apparatus is large and the process takes about 2 hours. In the present invention, only the upper and lower elastic films 7a and 8a and the printed circuit board 12 are heated and heated. Since it cools, the time required for each time is about 2 or 3 minutes.

  The cycle of heating and cooling is also shortened, and even if a plurality of sheets are repeatedly processed, it can be completed in a short time. According to the present invention, the heat transfer efficiency is greatly improved and the loss of energy as a whole is minimized, so that the productivity is remarkably improved as compared with the prior art.

  FIG. 17 is a cross-sectional view showing a case where a mechanism for adjusting the differential pressure of the pressurizing fluid with an air cylinder is provided in the lamination processing mechanism of the thin film laminating apparatus according to the present invention.

  When gas is used as the pressurizing fluids 16a and 17a when the differential pressure 18b is provided, the volume of the gas changes due to the pressure, and it takes some time to increase the pressure in the upper processing space 16 or the lower processing space 17. To do. Further, if the pressure in the upper processing space 16 or the lower processing space 17 is suddenly reduced, a plosive sound is generated due to volume expansion, so that the pressure needs to be gradually reduced.

  If it takes time to provide the differential pressure 18b, the overall efficiency may be reduced. In the present invention, the air cylinder 18c is installed to adjust the pressure in the upper processing space 16 and the lower processing space 17 in a short time.

  By connecting one of the air cylinders 18 c to the upper processing space 16 and the other to the lower processing space 17, the differential pressure 18 b can be provided in a short time by interlocking the upper and lower pressures.

  If the pressure in the upper processing space 16 is increased, the pressure in the lower processing space 17 is lowered, and the upper and lower elastic films 7a and 8a can be displaced downward. Conversely, if the pressure in the upper processing space 16 is lowered, the pressure in the lower processing space 17 is increased, and the upper and lower elastic films 7a and 8a are displaced upward.

  FIG. 18 is a process diagram showing a laminating method using the thin film laminating apparatus according to the present invention. The laminating method 20 using the thin film laminating apparatus includes a vacuum processing step 20a, a transfer step 20b, and a laminating step 20c.

  The vacuum processing step 20a is a step of evacuating the laminated module 2 with the primary exhaust 13 and the secondary exhaust 13a in the normal temperature range. That is, the air that causes bubbles is removed from the printed circuit board 12 sandwiched between the upper and lower elastic films 7a and 8a.

  The primary exhaust 13 evacuates the outside of the laminated module 2 so that the laminated module 2 is not affected by the atmospheric pressure 13b.

  The secondary exhaust 13a sucks the gas in the laminated module 2 and evacuates it while maintaining the effect of the primary exhaust 13. When completely evacuated, the secondary exhaust 13a continues and the primary exhaust 13 is released.

  The laminated module 2 whose inside is evacuated is affected by the atmospheric pressure 13 b from the outside, and the upper and lower elastic films 7 a and 8 a are in close contact with the printed circuit board 12. That is, it is sealed so that gas does not enter the laminated module 2.

  The transfer process 20b is a process of moving from the normal temperature region to the warming region while maintaining the vacuum in the stacked module 2. The possibility of bubbles remaining is eliminated by evacuating in the normal temperature range and then heating and pressurizing in the warm range.

  The lamination processing step 20c is a step of laminating the printed circuit board 12 in the lamination module 2 by the fluid injection 18 and the heating 18a in the heating region. The printed circuit board 12 is processed in units of one sheet.

  The fluid injection 18 fills the outside of the laminated module 2 with a fluid and applies an equal pressure to the printed circuit board 12 through the upper and lower elastic films 7a and 8a. The films 12b and 12c that maintain the shape of the printed circuit board 12 can be attached.

  The heating 18a heats the printed circuit board 12, melts the adhesive 12d, and affixes the laminated conductor 12a and the films 12b and 12c using the fluid pressure 12f. In addition, the heating 18a condition can also be adjusted by providing the fluid with the differential pressure 18b.

  According to the present invention, bubbles do not remain at low pressure, the adhesive 12d does not flow out to the exposed portion of the conductor 12a, the conductor 12a is not damaged, the size of the printed circuit board 12 is minimally deformed, and heat energy is lost. In addition, it is possible to efficiently manufacture a high-quality printed circuit board 12 that is extremely few in a short time.

  FIG. 19 is a table comparing the effects of the present invention and the prior art. As shown in Table 19, with respect to the conventional multi-stage laminating press, rapid laminating press and autoclave, and the thin film laminating press (thin film laminating apparatus 1) according to the present invention, a printed circuit board 12 in which no bubbles remain is manufactured. The lamination pressure required to do this was compared.

  A multi-stage laminating press without a vacuum processing mechanism requires a pressure of 40 to 50 kilograms per square centimeter, and a multi-stage laminating press with a vacuum processing mechanism requires a pressure of 15 to 25 kilograms per square centimeter. is necessary.

  A high-speed laminating press without a vacuum processing mechanism requires a pressure of 40 to 50 kilograms per square centimeter, and a multi-stage laminating press with a vacuum processing mechanism requires a pressure of about 20 kilograms per square centimeter. is there.

  In an autoclave having a vacuum processing mechanism, a pressure of 15 kg per square centimeter is required.

  On the other hand, in the thin film laminate press having a vacuum processing mechanism, the printed circuit board 12 in which no bubbles remain can be produced at a pressure of 5 to 10 kilograms per square centimeter.

  In the present invention, a significant reduction in heating energy can also be expected. In the experiment, a heat plate electric capacity of 1.8 kilowatts was used with a small energy of 3.6 kilowatts in total on two sides, but more than 50% of the heat energy was used. Can be reduced.

  As described above, the thin film laminating apparatus according to the present invention does not leave bubbles in the laminated printed circuit board by applying a vacuum treatment and preliminarily removing the gas before heating and pressurizing. Thus, the laminate quality can be improved.

  By sandwiching the printed circuit board between the two elastic films and applying pressure from the outside of the elastic film with a fluid, the laminating pressure is evenly applied to the openings of the cover film, and the adhesive can be prevented from flowing out.

  Since vacuum processing is performed on a single printed circuit board, the effect of vacuum processing is great, the pressure required for lamination can be greatly reduced, damage to the printed circuit board is greatly reduced, and overall productivity is extremely high. To be high.

  Since pressure is applied by the fluid through the elastic film, uniform pressure is applied to the printed circuit board from all directions, so that the dimensional change of the printed circuit board is minimized. Also, the pressure required for lamination can be low.

  The heat load at the time of lamination is only small because the elastic film and the printed circuit board have a small heat capacity, so that the heating energy can be greatly reduced. The heating time is also short, which is very effective in reducing environmental impact.

  Since the printed circuit board is processed as a single unit instead of a plurality, it is easy to adjust the heating amount and the heating time, and the quality is stable. Since there is no buffer material or the like, the thermal conductivity is good, the weight is reduced, and it is not affected by pressure from other printed circuit boards.

It is a perspective view which shows the whole apparatus of the thin film type laminating apparatus which is this invention. It is a perspective view which shows the state which opened the lamination | stacking module of the thin film type laminating apparatus which is this invention, and set the printed circuit board. It is a front perspective view which shows the scene which introduced the lamination | stacking module to the vacuum processing mechanism of the thin film type laminating apparatus which is this invention. It is a perspective view which shows the scene which is vacuum-processing in the vacuum processing mechanism of the thin film type laminating apparatus which is this invention. It is sectional drawing of the vacuum processing mechanism of the thin film type laminating apparatus which is this invention. It is sectional drawing which decomposed | disassembled the vacuum processing mechanism of the thin film type laminating apparatus which is this invention. It is sectional drawing which shows the condition which started the primary exhaust with respect to the pressure space of the vacuum processing mechanism of the thin film type laminating apparatus which is this invention. It is sectional drawing which shows the condition which started secondary exhaust with respect to the space in the thin film in a lamination | stacking module in addition to the primary exhaust of the thin film type laminating apparatus which is this invention. It is sectional drawing which shows the condition which stopped the primary exhaust_gas | exhaustion of the thin film type laminating apparatus which is this invention, and is performing only the secondary exhaust. It is a perspective view which shows transfer from the vacuum processing mechanism of the thin film type laminating apparatus which is this invention to a lamination | stacking processing mechanism. It is sectional drawing which shows the state of the lamination | stacking module at the time of transfer of the thin film type laminating apparatus which is this invention. It is a back perspective view showing the scene where the lamination module was introduced into the lamination processing mechanism of the thin film type laminating apparatus which is the present invention. It is sectional drawing of the lamination process mechanism of the thin film type laminating apparatus which is this invention. It is sectional drawing which shows the condition which has injected the fluid for pressurization with respect to the process space of the lamination | stacking processing mechanism of the thin film type laminating apparatus which is this invention. It is an expanded sectional view showing the situation where lamination processing is given to the printed circuit board of the thin film type laminating apparatus which is the present invention. It is sectional drawing which shows the case where a differential pressure is provided to the fluid for pressurization in the lamination | stacking processing mechanism of the thin film type laminating apparatus which is this invention. It is sectional drawing which shows the case where the mechanism which adjusts the differential pressure | voltage of the fluid for pressurization with an air cylinder is provided in the lamination process mechanism of the thin film type laminating apparatus which is this invention. It is process drawing which shows the lamination method by the thin film type laminating apparatus which is this invention. It is the table | surface which compared the effect of this invention and the prior art. It is sectional drawing of the conventional laminating apparatus.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Thin film type laminating apparatus 2 Laminating module 3 Vacuum processing mechanism 3a Vacuum pump 3b Opening and closing plate 3c Arm 3d Rail 3e Pressurizing tank 4 Lamination processing mechanism 5 Upper airtight container 5a Upper convex part 5b Upper pressure space intake hole 6 Lower airtight container 6a Lower convex portion 6b Lower pressure space intake hole 7 Upper plate 7a Upper elastic membrane 7b Upper frame 7c Upper concave portion 7d Upper seal 7e Thin film intake hole 7f Holding portion 7g Hinge 8 Lower plate 8a Lower elastic membrane 8b Lower frame 8c Lower concave portion 8d Lower seal 9 Upper pressure space intake nozzle 9a Upper pressure space 10 Lower pressure space intake nozzle 10a Lower pressure space 11 Thin film intake nozzle 11a Thin film inner space 12 Printed circuit board 12a Conductor 12b Base film 12c Cover film 12d Adhesive 12e Opening Part 12f Pressurization 13 Primary exhaust 13a Secondary exhaust 13b Air 14 Upper processing container 14a Upper heat source 14b Upper injection hole 15 Lower processing container 15a Lower heat source 15b Lower injection hole 16 Upper processing space 16a Upper pressurizing fluid 17 Lower processing space 17a Lower pressurizing fluid 18 Fluid injection 18a Heating 18b Differential pressure 18c Air Cylinder 19 Table 20 Laminating method by thin film type laminating apparatus 20a Vacuum treatment process 20b Transfer process 20c Lamination process 21 Laminating apparatus 21a Upper heating plate 21b Lower heating plate 21c Printed circuit board 21d Conductor 21e Base film 21f Cover film 21g Adhesive 21h Convex Part 21i recess 21j opening

Claims (3)

A laminated module in which a laminated printed circuit board is sandwiched between an upper plate with a thin elastic upper elastic membrane and a lower plate with a thin elastic lower elastic membrane ;
After sandwiching the laminated module in an upper and lower sealed container at room temperature ,
The space formed by the laminated module elastic membrane and the upper and lower sealed containers is evacuated,
After expanding the laminated module elastic membrane by the differential pressure with the remaining atmosphere,
After removing the differential pressure by sucking the residual air in the laminated module elastic membrane,
Return the space formed by the laminated module elastic membrane and the upper and lower sealed containers to normal pressure,
By closely contacting the inside of the laminated module elastic membrane by differential pressure ,
A vacuum processing mechanism for evacuating the laminated module elastic membrane without leaving bubbles in the printed circuit board;
After sandwiching the laminated module evacuated in the vacuum processing mechanism between the upper and lower processing containers while maintaining a vacuum state ,
Injecting fluid for up and down pressurization into the space formed by the laminated module elastic membrane and the upper and lower processing container,
After applying a uniform pressure by the fluid to the uneven surface of the printed circuit board through the upper and lower elastic films,
By heating the printed circuit board with a heat source provided in the upper and lower processing containers,
It consists of a laminating mechanism that affixes the printed circuit board while preventing the adhesive from flowing out,
The vacuum processing mechanism and the lamination processing mechanism are separated, the inside of the lamination module is evacuated at room temperature in the vacuum processing mechanism, and is transferred to the lamination processing mechanism while maintaining a vacuum state, and is pressurized and heated. A thin film laminating apparatus characterized in that heat is not applied to the printed circuit board until it is evacuated .   The heating efficiency of the upper surface and the lower surface is changed by providing a differential pressure between the upper pressurizing fluid and the lower pressurizing fluid and pressing the printed circuit board against a heat source of the upper processing container or the lower processing container. The thin film laminating apparatus according to 1.   A thin film type laminating method comprising laminating a printed circuit board by the thin film type laminating apparatus according to claim 1.

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