JP4006746B2 - Lamination method - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a method for continuously laminating a transfer layer to a substrate from a long laminated film in which a transfer layer and a cover film are sequentially formed on a base film.
[0002]
[Prior art]
Conventionally, various methods have been proposed for laminating a transfer layer formed on a base film on a substrate. For example, in Japanese Patent Laid-Open No. 3-205134, first, the leading end side of a laminated film to be laminated is cut perpendicularly to the supply direction of the laminated film, and the leading end portion of the laminated film is crimped to the leading end portion in the substrate carrying direction. After that, the laminate film is sequentially laminated on the substrate while supplying the laminated film. A method is disclosed in which the rear end of the laminated film is positioned and cut with respect to the rear end of the substrate in accordance with the length of the substrate, and then laminated while supporting the rear end of the laminated film. When a laminated film is laminated by this method, there is a problem that a transfer layer, an intermediate layer, and the like from the laminated film cut portion start to flow out by heat flow on the substrate and adhere to the substrate as dirt. In addition, since the laminated film is cut and bonded to the front and rear ends of the substrate, the tension variation of the laminated film occurs, and wrinkles and the like are generated due to uneven film thickness and deflection of the laminated film. In addition, since the temporary stop of the laminated film is used for lamination, a temporary stop is required during the laminating operation, making it difficult to increase the speed, and the substrate film after lamination needs to be peeled off in the next process. There is.
[0003]
As another method, there is a method disclosed in JP-A-5-338040. First, after the cover film is peeled off, a cut is made with a cutter at the interface between the transfer layer to be bonded and the transfer layer not to be bonded at the front end and rear end of the substrate, and this is aligned with the substrate and laminated. At this time, the laminating roller does not perform the pressure bonding operation at the distance between the front and rear ends of the substrate, which is an unnecessary portion of the lamination, and the substrate. After laminating such a laminating operation continuously and laminating the transfer layer on the substrate, the base film is continuously peeled from the substrate. At this time, the peeling of the base film is performed by leaving only a necessary transfer layer from the front end and rear end of the cut. In addition, a method is disclosed in which the photosensitive layer at the part between the substrates can be removed in advance.
[0004]
This method can prevent the transfer layer from adhering to the roll and becoming dirty between the substrates when the laminate is operated at a low speed of about 0.5 to 0.8 m / min. In the case of high-speed laminating operation (1 to 3 m / min) that frequently controls the ON / OFF of the pressure roll, the tension of the laminated film frequently occurs, and the positional accuracy of the laminate deteriorates due to the misalignment of the laminated film. Lamination is performed with the setting positions of the front and rear ends off. As a result, first off time of the substrate film peeling may become difficult to peel the transfer layer of the release surface takes the edge of the substrate, or peeling the transfer layer of the required substrate surface of crimping. Further, since the laminated film tension at the time of lamination fluctuates at the time of ON / OFF control of the pressure-bonding roll, there is a problem that wrinkles and film thickness unevenness are easily generated on the surface of the pressure-bonded substrate.
[0005]
[Problems to be solved by the invention]
The present invention improves such a problem and unevenly and rapidly laminates a transfer layer on a necessary portion of the substrate surface excluding the front end and rear end of the substrate, thereby accurately and rapidly laminating the production efficiency. It is an object of the present invention to provide a lamination method capable of improving the substrate and obtaining a substrate that does not protrude from a transfer layer or the like that causes generation of foreign matters on the substrate.
[0006]
[Means for Solving the Problems]
The laminating method of the present invention is based on a long laminated film in which a transfer layer and a cover film are sequentially formed on a base film with respect to a substrate which is continuously supplied with a predetermined interval. A method of continuously laminating a transfer layer, which corresponds to a step of continuously feeding a long laminated film, a distance between substrates to be continuously supplied, and a width of a non-laminated portion of a substrate edge. The process of separating the transfer layer by pressing the position from the cover film with a heating bar and irradiating the transfer layer in the area surrounded by the heating bar with ultraviolet rays to deteriorate the adhesion of the transfer layer. Step of peeling, Laminating a transfer layer on a substrate disposed at a predetermined interval continuously supplied by aligning the position of the non-laminated portion of the substrate end with the position of the transfer layer separated by a heating bar -To work , Base - characterized in that it comprises a step of continuously separating the scan film.
[0007]
DETAILED DESCRIPTION OF THE INVENTION
An embodiment of the present invention will be described below with reference to the drawings.
FIG. 1 shows a laminating apparatus for carrying out a laminating method of a dry film resist as a transfer layer. The laminating apparatus includes a substrate transport unit, a substrate preheating unit, a laminating unit, a film inter-substrate processing unit, a film unwinding unit, a base film continuous peeling unit, and a cover film continuous peeling unit.
[0008]
A series of laminating steps will be described with reference to the drawings.
The film to be laminated is a long laminated film 1 in which a transfer layer and a cover film are sequentially formed on a base film, unwound from the film unwinding section 2, and subjected to inter-substrate processing with the cover film attached. Guided to part 3. Details of the inter-substrate processing section are shown in FIG. The inter-substrate processing unit is functionally composed of two parts. One is a portion for smoothing the end face of the resist. The other is that the resist to be laminated to the substrate is laminated inward from the predetermined substrate end, and the resist in the region corresponding to the substrate end and the region corresponding to the distance between the substrate and the substrate is the substrate. And a portion that exposes the resist so as not to adhere to a region that does not require transfer of the resist, such as a laminating roller. In the portion where the end face of the resist is smoothed, the heating bar 21 is arranged in accordance with the interval between the substrates, and this interval coincides with the interval between the continuously loaded substrates and the substrate and the width of the unlaminated portion of the substrate end. .
[0009]
In the resist end face smoothing process, as shown in FIG. 3, a heating bar (heated metallic thin plate with a sharp tip) 21 is pressed from the cover film of the film 1 with the cover film. At this time, the tip shape of the heating bar 21 is rounded to such an extent that the cover film and the base film are not cut or damaged. Although the temperature of a heating bar changes also with the materials of a base film, a transfer layer, and a cover film, generally 80 to 120 degreeC is desirable. The resist layer is melted and separated with the heating bar as a boundary by pressurization for about 1 to 10 seconds, and the separated resist interface (end face) becomes smooth. At this time, the cover film and the base film excluding the resist layer are not damaged so as to cause trouble in continuous winding. Simultaneously with the resist end face smoothing process, exposure is performed on the resist surface in the region surrounded by the heating bar. Exposure is performed with respect to a resist layer through a cover film as shown in FIG. 4, and an ultraviolet ray (it changes with resists, but an ultraviolet wavelength band is 250-450 nm) is irradiated. The resist after irradiation undergoes a curing reaction due to the photopolymerization action, and the adhesion of the resist is significantly impaired. As a result, the exposed resist film surface is wound in a state where it remains attached to the base film after lamination without adhering to the substrate and the laminate roll. When the base film is wound and peeled off, the resist is separated into the base film side and the substrate side, respectively, but the separated interface (resist end face) is a surface that has been previously melted and separated by a heating bar. Appears to be smooth.
[0010]
The film that has passed through the inter-substrate treatment step is continuously wound up by the cover winder 4. 5 is a stopper, and 6 is a tension roll.
The film is continuously fed to the laminating roll unit. On the other hand, the substrate onto which the resist is transferred is sent to a substrate preheating portion and heated to a desired temperature (generally 40 to 100 ° C. depending on the type of resist) by a preheating heater (far infrared heater or the like) 7. The substrate is heated uniformly with respect to the upper and lower surfaces by heating and sent to the laminating unit. The position of the substrate is always controlled by the tip position control sensor 8 or the like, and the substrate is laminated so that the substrate exactly coincides with the portion of the film 1 subjected to the inter-substrate processing as shown in FIG. At the time of lamination, tension control is given by the tension roll 9 so that a constant film tension is always applied regardless of the presence or absence of the substrate. Thereby, the embedding property to the unevenness | corrugation of a film becomes uniform in a surface.
[0011]
Lamination is performed by a pair of laminate rolls 10 and 11. Reference numeral 12 denotes a transport roll. After lamination, the base film is peeled off immediately from the substrate. At this time, the base film is peeled off from the substrate while the temperature of the substrate is substantially close to the roll temperature. The closer to the roll temperature, the better the peelability. For example, a resist film having a structure as described in JP-A-8-212222 is desirable for continuous peeling. The base film can be peeled by a method of winding directly from the laminating roll 10 as shown in FIG. 1 or a method of peeling via a peeling guide after lamination. However, it is desirable that the peeling angle when peeling is at least 30 ° with respect to the substrate surface. Further, the roll that winds the peeled base film is driven in the winding direction so that the tension is always constant, and the winding is driven in the winding direction.
[0012]
The wound base film is wound with the resist of the inter-substrate processing part remaining without being transferred to the substrate side. Further, the resist is internally attached so that the resist comes to the inside of the substrate at the boundary of the interface melted and separated by the heating bar in the inter-substrate processing. Since the resist exposed by the substrate processing is not transferred onto the substrate but remains on the base film side, the end portion of the resist comes to the inside of the film. Since the interface portion is melted and separated by a heating bar, the interface portion is smooth and does not generate scattering such as resist cutting waste. In addition, since it is not necessary to half cut the resist and cover film on the base film, continuous lamination is possible even when the transfer layer and / or the cover film of the resist is thin and difficult to cut half. Become.
The base film is a polyethylene terephthalate film or the like with a thickness of 30 to 100 μm, the transfer layer is a photosensitive material or the like with a thickness of 0.1 to 50 μm, and the cover film is stretched polyethylene or the like with a thickness of 5 to 50 μm. Can be used.
In the case of a long laminated film in which a transfer layer and a cover film are sequentially formed on a base flume, the base film / transfer layer / cover film may be formed in this order, and other layers may be interposed between them. For example, a cushion layer or the like may be appropriately formed between the base film / transfer layer.
[0013]
The above laminating method can be applied to the field of laminating a transfer layer such as a dry film such as a printed circuit board and a color filter.
[0014]
【The invention's effect】
By the laminating method of the present invention, a transfer layer such as a resist can be laminated on the substrate with high positional accuracy, without unevenness in the thickness of the transfer layer, and continuously at a high speed.
[Brief description of the drawings]
FIG. 1 is a schematic diagram illustrating a laminating apparatus according to the present invention.
FIG. 2 is a side view showing details of an inter-substrate processing unit used in the laminating apparatus of the present invention.
FIG. 3 is a cross-sectional view showing a state of a resist end face smoothing process.
FIG. 4 is a sectional view showing a state of resist selective curing.
FIG. 5 is a cross-sectional view showing a state of a film laminated to a substrate.
[Explanation of symbols]
1. 1. Long laminated film 2. Film unwinding section 4. Inter-substrate processing unit Stopper
6). 6. Tension roll Preheater heater8. 8. Tip position control sensor Tension roll 10. Laminate roll 11. Laminate roll 12. Transport roll 13. Scattering roll 21. Heating bar 22. Cover winder

Claims (1)

Laminating a transfer layer continuously from a long laminated film in which a transfer layer and a cover film are sequentially formed on a base film with respect to a substrate arranged continuously with a predetermined interval. A way to
A process of continuously feeding a long laminated film,
The position corresponding to the distance between the substrates to be continuously supplied and the substrate and the width of the non-laminated portion at the edge of the substrate is pressed on the cover film with a heating bar, and ultraviolet rays are applied to the transfer layer in the area surrounded by the heating bar. A step of irradiating to impair the adhesion of the transfer layer and separating the transfer layer;
A step of continuously peeling the cover film;
A step of laminating a transfer layer on a substrate that is continuously supplied with a predetermined interval and aligning the position of the non-laminated portion of the substrate end with the position of the transfer layer separated by a heating bar. ,
A laminating method comprising a step of continuously peeling a base film.

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