537970 A7 B7 經濟部智慧財產局員工消費合作社印製 五、發明説明（1 ) 【發明所屬技術領域】 本發明係關於將薄膜予以粘貼之疊層片，特別是關於 能粘貼在半導體基板或印刷佈線基板、LCD或PDP之坡璃 基板等之基板表面形成抗蝕膜所需之多面薄膜之疊層片。 【習知技術】 習知之方法，乃有以薄膜使用由帶基薄膜、粘貼抗蝕 薄膜等之抗鈾薄膜（以下稱謂抗蝕薄膜）、覆蓋薄膜所成之三 層構造（以下略述爲一體化薄膜），且使該帶基薄膜位於外周 側及使該覆蓋薄膜位於內周側予以捲成之薄膜卷，而將自 薄膜卷紡出之一體化薄膜剝除其覆蓋薄膜，並對應搬運路 徑上以所盼之所定間隔搬運過來之各基板尺寸，使已呈兩 層之抗鈾薄膜與帶基薄膜沿寬幅方向加以切斷，復令抗蝕 薄膜位於基板表面通過一對壓接輥子間予以粘貼於各基板 之單片法。 該單片法，卻有困難將基板搬運方向之薄膜前端定位 於基板前端部，且定位時易產成氣泡，又，薄膜後端部成 爲自由端易取進氣泡，而爲其端部處理致裝置構成變爲複 雜等之問題。 於是，爲簡略化裝置構成則有連續法之提案。 該方法係有：如同單片法使用薄膜卷，將自薄膜卷紡 出之一體化薄膜剝除覆蓋薄膜後，對搬運路徑上以所盼之 所定間隔搬運過來之多數基板之基板間及相當於不希望基 板與抗蝕薄膜粘貼部分之部位（以下略稱爲基板間相當部位） -ϋϋ (請先閱讀背面之注意事項再填寫本頁) f 丁項再填办 n ! -線 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） -4- 537970 A7 B7 經濟部智慧財產局員工消費合作社印製 五、發明説明（2 ) 進行裝設保護帶之基板間處理，並以不切斷帶基薄膜而抗 蝕薄膜位於基板表面側之狀態，即保護帶跨越被搬運之各 基板前後端部之狀態予以通過一對壓接輥子間促使粘貼於 各基板之方法（請參照特開平6 - 73343號公報）、或就自薄 膜卷紡出之一體化薄膜以對應搬運路徑上以所盼之所定間 隔搬運過來之多數基板之基板間相當部位長度，將覆蓋薄 膜沿寬幅方向前後兩處予以切斷並留住基板間相當部位之 覆蓋薄膜，對欲將抗鈾薄膜粘貼於基板部位（以下略稱爲基 板相當部位）進行剝除覆蓋薄膜之基板間處理，且以抗蝕薄 膜位於基板表面側之狀態，即所留住覆蓋薄膜跨越被搬運 之各基板前後端部之狀態予以通過一對壓接輥子間促使抗 鈾薄膜粘貼於各基板之方法（請參照特開平9 - 1 74797號公 報）等。 【發明欲解決之課題】 上述習知之連續法，由於對一片基板粘貼以相當於該 基板長之抗蝕薄膜，致無法將多數相同圖案或各種不同圖 案之抗鈾膜形成於一片基板上。 本發明之目的即在提供一種可粘貼在一片基板形成相 同或各種抗蝕圖案所需之多數抗蝕薄膜之疊層片。 【課題之解決手段】 本發明係在自裝塡有依序層疊帶基薄膜、抗蝕薄膜及 覆蓋薄膜呈爲三層構造之一體化薄膜所捲成薄膜卷之薄膜 - ί I- ----ipf - - i - - -- ....................Ill . (請先閱讀背面之注意事項再填寫本頁) --訂 ml m —ϋ·— —ϋϋ · >線 本紙張尺度適用中國國家標準（CNS ) Α4規格（210Χ297公釐） -5- 537970 經濟部智慧財產局員工消費合作社印製 A7 B7 五、發明説明（3 ) 捲出部予以紡出上述一體化薄膜，且將剝除上述覆蓋薄膜 之上述抗蝕薄膜粘貼於隔著間隔搬運過來之基板的疊層 片、以具有：含將薄膜捲出機所紡出一體化薄膜之覆蓋薄 膜予以剝離後，可隔著間隔多張粘貼於一片基板上地予以 施加形成與薄膜搬運方向呈垂直方向之抗蝕圖案所需裂縫 之多數抗蝕膜切刀的抗蝕模切割部、與配置於抗蝕模切割 部下游側或相同位置，卻留著粘貼於一片基板之多數抗蝕 圖案之抗蝕薄膜，將其他抗蝕薄膜沿裂縫方向予以除去之 抗蝕薄膜除去部、與將抗飩薄膜除去部所處理之帶基薄膜 h多數抗蝕圖案之抗触薄膜多面粘貼於基板上之疊層滾 輪、與切斷基板間之帶基薄膜，將基板互相加以分離之基 板分離部爲特徵。 本發明之粘貼於一片基板之多數抗蝕圖案之抗蝕薄膜 係爲相同圖案爲特徵。 本發明之粘貼於一片基板之多數抗蝕圖案之抗蝕薄膜 係爲不同圖案爲特徵。 本發明之#薄膜捲出部與疊層滾輪之間設有薄膜張力控 制手段爲特徵。 依據本發明，藉在一片基板粘貼相同或各種抗蝕圖 案’經過曝光、顯像、蝕刻處理完妥後予以切割，而能同時 製作相同或各種佈線基板。 又’圖案相同時，可賦予量產效果，圖案不同時，肯g 不必更改步驟製作多種基板。 依據本發明，乃能在一片基板上同時製作相同或各種 本紙張尺度適用中國國家標準（CNs ) a4規格（210 X 297公釐）537970 A7 B7 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 5. Description of the Invention (1) [Technical Field of the Invention] The present invention relates to a laminated sheet with a thin film attached, and particularly to a semiconductor substrate or printed wiring Laminated sheets of multi-faceted films required for forming a resist film on the surface of a substrate, such as a glass substrate for LCD or PDP. [Known technology] A conventional method is a three-layer structure made of a thin film using a base film, an anti-uranium film (hereinafter referred to as a resist film) and a cover film (hereinafter referred to as a whole) A film roll with the base film on the outer peripheral side and the cover film on the inner peripheral side, and the integrated film spun from the film roll is stripped of the cover film and corresponds to the transport path The size of each substrate carried over at a predetermined interval is expected to cut the two layers of uranium-resistant film and the base film in a wide direction, so that the resist film is located on the substrate surface between a pair of crimping rollers. A one-piece method of attaching to each substrate. In the single-chip method, it is difficult to position the front end of the film in the substrate conveying direction at the front end of the substrate, and it is easy to generate bubbles during positioning. In addition, the rear end of the film becomes a free end and it is easy to take in air bubbles. The device configuration becomes complicated. Therefore, a continuous method has been proposed to simplify the device configuration. This method involves the use of a film roll as in the single-sheet method. After removing the cover film from the integrated film spun from the film roll, the majority of the substrates transported at a predetermined interval on the transport path are transferred between the substrates and the equivalent. Do not want the part where the substrate and the resist film are pasted (hereinafter referred to as the equivalent part between the substrates) -ϋϋ (Please read the precautions on the back before filling in this page) f Section D then fill in n! China National Standard (CNS) A4 specification (210X297 mm) -4- 537970 A7 B7 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 5. Description of the invention (2) The inter-substrate treatment of the protective tape shall be performed, and shall not be cut. In a state where the base film is broken and the resist film is located on the substrate surface side, that is, a state in which the protective tape crosses the front and rear ends of each substrate being transported, a method for promoting adhesion to each substrate through a pair of crimping rollers (see JP-A-6) -Publication No. 73343), or the length of the equivalent portion between substrates of most substrates that are transported at a predetermined interval on the conveying path corresponding to the integrated film spun from the film roll The cover film is cut at the front and back of the cover film in two directions and the corresponding cover film is kept between the substrates. The substrate to which the anti-uranium film is to be attached (hereinafter referred to as the equivalent part of the substrate) is to be removed. A method of promoting the adhesion of a uranium-resistant thin film to each substrate through a pair of crimping rollers in a state where the resist film is located on the surface side of the substrate, that is, the state where the cover film is retained across the front and rear ends of each substrate being transported. (Please refer to Japanese Patent Application Laid-Open No. 9-1 74797). [Problems to be Solved by the Invention] Since the conventional continuous method mentioned above is pasted to a substrate with a resist film corresponding to the length of the substrate, it is impossible to form a majority of the same pattern or various patterns of anti-uranium film on a substrate. An object of the present invention is to provide a laminated sheet which can be adhered to a substrate to form a plurality of resist films required for forming the same or various resist patterns. [Problem Solving Means] The present invention is a film rolled into a film roll in which a base film, a resist film, and a cover film are sequentially laminated in a three-layered integrated film.-Ί I- --- -ipf--i---............... Ill. (Please read the notes on the back before filling this page) --Order ml m — ϋ · ——— ϋϋ · > The paper size of the paper is applicable to the Chinese National Standard (CNS) A4 specification (210 × 297 mm) -5- 537970 Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 B7 V. Description of the invention (3) The exit section spins the integrated film, and pastes the resist film from which the cover film is stripped onto a laminated sheet of the substrate transported at intervals, so as to include: After the cover film of the film is peeled off, it can be applied to a substrate via a plurality of intervals and applied to form a resist mold cutting portion of most of the resist film cutters required to form a resist pattern perpendicular to the film conveying direction. It is located at the same position as the downstream side of the cutting part of the resist mold, but it is left attached to a Most of the resist patterns on the substrate are resist films, other resist films are removed in the direction of the cracks, and the resist film with the base film processed by the anti-knife film removal portion is used as the resist film. It is characterized by a substrate separating portion that separates substrates from each other by a lamination roller laminated on a substrate and a substrate-based film that cuts the substrate. The present invention is characterized in that a plurality of resist films adhered to a substrate have the same pattern. The resist film of the majority of the resist patterns affixed to a substrate of the present invention is characterized by different patterns. The present invention is characterized in that a film tension control means is provided between the #film unwinding portion and the lamination roller. According to the present invention, the same or various wiring substrates can be produced at the same time by pasting the same or various resist patterns on a substrate after cutting, exposing, developing, and etching. When the patterns are the same, mass production effects can be imparted. When the patterns are different, Ken does not have to change the steps to make multiple substrates. According to the present invention, the same or a variety of substrates can be produced at the same time on one substrate. The paper size is applicable to Chinese National Standards (CNs) a4 (210 X 297 mm).
In' ·>ϋ ......- ι_·ΐ - - a- - si- II— - - - - 1.^^1 ,-. (請先閱讀背面之注意事項再填寫本頁) -6- 537970 A7 __ B7 五、發明説明（4 ) 佈線基板。又，圖案相同時，可賦予量產效果，圖案不同 時，能不必更改步驟製作多種基板。 【圖示之簡單說明】 圖1爲本發明之具有可多面粘貼功能之疊層片槪略 圖、圖2爲將沿薄膜搬運方向排列之相同圖案予以雙面粘 貼之平面圖、圖3爲圖2之沿薄膜搬運方向予以雙面粘貼 之剖面圖、圖4爲將沿薄膜搬運方向排列之相同圖案予以 三面粘貼之平面圖、圖5爲圖4之沿薄膜搬運方向予以三 面粘貼之剖面圖、圖6爲抗鈾模切割部之抗鈾膜切刀側視 圖、圖7爲抗蝕薄膜除去部之側視圖、圖8爲顯示抗蝕膜 切刀之抗蝕膜切割工程與抗鈾薄膜除去部之抗鈾薄膜除去 工程之工程圖。 元件對照表 F 一體化薄膜 1 薄膜捲出部 2 薄膜卷 3 帶基薄膜 4 抗蝕薄膜 5 覆蓋薄膜 6 基板 7 搬運輥子 8 剝開輥子 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） (請先閱讀背面之注意事項再填· :寫本頁) 經濟部智慧財產局員工消費合作社印製 537970 A7 B7 經濟部智慧財產局員工消費合作社印製 五、發明説明（5 ) 10 抗蝕膜切割部 11 圓盤切刀 1 2，1 3 中間用抗鈾膜切刀 14 基板間抗蝕膜切刀 1 5 抗鈾膜除去部 1 5 a 缸體 16 粘著帶 1 7 A 彈簧 1 7 B 粘著帶壓接輥子 18 線形導件 1 9 A，1 9 B 承受台 2 〇 吸 引 滾 輪 2 1 電 磁 粉 末 離合器 2 2 馬 達 ( S Μ ) 2 3 張 力 檢 測 器 2 4 檢 測 輥 子 2 5 感 測 器 3 〇 層 疊 部 3 1 層 疊 滾 輪 4 〇 基 板 分 離 部 4 1 切 刀 〇 【發明之實施形狀】 茲說明本發明之實施形態。圖1爲本發明之具有可多 本纸張尺度適用中國國家標準（CNS ) Α4規格（210Χ 297公釐） (請先閱讀背面之注意事項 #1 ，項再填· 裝-- :寫本頁)In '· > ϋ ......- ι_ · ΐ--a--si- II—----1. ^^ 1,-. (Please read the notes on the back before filling this page) -6- 537970 A7 __ B7 V. Description of the invention (4) Wiring substrate. In addition, when the patterns are the same, mass production effects can be imparted. When the patterns are different, a variety of substrates can be produced without changing steps. [Brief description of the diagram] Figure 1 is a schematic view of a laminated sheet with a multi-sided pasting function according to the present invention, Figure 2 is a plan view of double-sided pasting of the same pattern arranged along the film conveying direction, and Figure 3 is a schematic view of Figure 2 Sectional view of double-sided pasting along the film conveying direction, FIG. 4 is a plan view of three-sided pasting of the same pattern arranged along the film conveying direction, FIG. 5 is a sectional view of three-sided pasting along the film conveying direction, and FIG. 6 is Side view of the uranium-resistant film cutter of the uranium-resistant die cutting section, FIG. 7 is a side view of the etch-resistant film removal section, and FIG. 8 shows the uranium-resistant film cutting process of the etch-resistant film cutter and uranium resistance of the uranium-resistant film removal section Engineering drawing of film removal process. Component comparison table F Integrated film 1 Film roll-out section 2 Film roll 3 With base film 4 Resist film 5 Cover film 6 Substrate 7 Transport roller 8 Peel off roller This paper size applies the Chinese National Standard (CNS) A4 specification (210X297) (Please read the notes on the back before filling out:: Write this page) Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 537970 A7 B7 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs Etching film cutting part 11 Disk cutter 1 2, 1 3 Intermediate anti-uranium film cutter 14 Inter-substrate resist film cutter 1 5 Anti-uranium film removal part 1 5 a Cylinder block 16 Adhesive tape 1 7 A Spring 1 7 B Adhesive tape crimping roller 18 Linear guide 1 9 A, 1 9 B Bearing table 2 〇 Suction roller 2 1 Electromagnetic powder clutch 2 2 Motor (SM) 2 3 Tension detector 2 4 Detection roller 2 5 Sensing Applicator 3 〇Layer 3 1 Lamination Roller 4 〇Substrate Separation Section 4 1 Cutter 〇 [Embodiment of the Invention] An embodiment of the present invention will be described below. Figure 1 shows the paper size of the present invention applicable to the Chinese National Standard (CNS) Α4 specification (210 × 297 mm) (please read the note # 1 on the back first, and then fill and install ----- write this page )
、1T ▼線 -8- 537970 A7 B7 經濟部智慧財產局員工消費合作社印製 五、發明説明（6 ) 面粘貼功能之疊層片槪略圖。 疊層片係被構成爲自裝塡於薄膜捲出部1之薄膜卷2 紡出一體化薄膜F，且將經調整爲比基板6之沿搬運方向長 度若干短小之抗蝕薄膜4可多面予以粘貼於隔著間隔依序 搬運之各基板6上。 基板6上則可粘貼相同或多種抗鈾圖案。例如，可製 作將抗蝕膜沿薄膜搬運方向排列兩面以上之基板。圖2爲 將沿薄膜搬運方向排列之相同圖案予以雙面粘貼之平面 圖、圖3爲圖2之沿薄膜搬運方向予以雙面粘貼之剖面 圖、圖4爲將沿薄膜搬運方向排列之相同圖案予以三面粘 貼之平面圖、圖5爲圖4之沿薄膜搬運方向予以三面粘貼 之剖面圖。 圖2所示之兩面粘貼時，乃進行帶基薄膜3所裝載抗 蝕薄膜4與基板6之位置對準，沿薄膜搬運方向（粘貼方向） 藉抗蝕薄膜4將相同之抗蝕圖案予以粘貼於基板6。又，圖 4所示之三面粘貼時，亦與上述同樣將抗蝕薄膜4加以粘 貼。 薄膜卷2係由帶基薄膜3、抗蝕薄膜4及覆蓋薄膜5所 成，且將抗鈾薄膜4兩側利用抗蝕薄膜4之粘著性予以粘 貼帶基薄膜3及覆蓋薄膜5所成三層構造之一體化薄膜F， 以帶基薄膜3處於外側加以捲成。 基板6則藉構成搬運路徑之搬運輥子7隔著間隔依序 自圖示之左側被搬送至右側。一體化薄膜F之紡出方向或 與搬運方向直交之方向長度（寬幅），通常，卻被設成比粘貼 I-----.-----裝-- (請先閱讀背面之注意事項再填寫本頁)、 1T ▼ Line -8- 537970 A7 B7 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs. 5. Description of the invention (6) Outline drawing of the laminated sheet with surface adhesive function. The laminated sheet is composed of a film roll 2 mounted on the film roll-out part 1 and an integrated film F spun out, and the resist film 4 adjusted to be slightly shorter than the length of the substrate 6 in the transport direction can be applied on multiple sides. The substrates 6 are affixed to the substrates 6 which are sequentially conveyed with a gap therebetween. The same or multiple anti-uranium patterns can be pasted on the substrate 6. For example, it is possible to produce a substrate in which a resist film is arranged on two or more sides in a film transport direction. Fig. 2 is a plan view of double-sided pasting of the same pattern arranged along the film conveying direction, Fig. 3 is a cross-sectional view of double-sided pasting along the film conveying direction, and Fig. 4 is the same pattern arranged along the film conveying direction. A plan view of three-sided pasting, and FIG. 5 is a cross-sectional view of three-sided pasting along the film conveying direction of FIG. 4. When the two sides shown in FIG. 2 are pasted, the positions of the resist film 4 loaded on the base film 3 and the substrate 6 are aligned, and the same resist pattern is pasted by the resist film 4 along the film conveying direction (sticking direction).于 Substrate 6. In the case of three-sided bonding shown in Fig. 4, the resist film 4 is also bonded in the same manner as described above. The film roll 2 is made of a base film 3, a resist film 4, and a cover film 5, and the two sides of the uranium-resistant film 4 are bonded to the base film 3 and the cover film 5 by using the adhesiveness of the resist film 4. The three-layered integrated film F is rolled with the base film 3 on the outside. The substrate 6 is sequentially conveyed from the left side to the right side of the drawing by the conveyance rollers 7 constituting the conveyance path at intervals. The length (wide width) of the integrated film F in the spinning direction or in the direction orthogonal to the conveying direction is usually set to be longer than the I -----.----- install-(Please read the back (Please fill in this page again)
、1T ▼線 本紙張尺度適用中國國家標準（CNS ) A4規格（2丨0、〆297公釐） -9- 537970 A7 B7 經濟部智慧財產局員工消費合作社印製 五、發明説明（7 ) 抗触薄膜4之基板6幅度（直交於基板6搬運方向之方向長 度）稍爲狹窄。 覆蓋薄膜5乃藉剝開輥子8自一體化薄膜F被予以剝 離，並由捲取輥子9回收之。 該剝開輥子8下游係沿薄膜搬運路徑配設有多數抗鈾 膜切割部10。抗鈾膜切割部10具有在一體化薄膜F之搬運 方向前後以所定距離加以配置之多數成對之圓盤切刀11。 本實施例卻呈自一體化薄膜F搬運方向上游側依序配置有 中間用抗蝕膜切刀12與13，及基板間用抗蝕膜切刀14之 構成。中間用抗蝕膜切刀1 2與1 3之間，中間用抗蝕模切 刀1 3與基板間用抗鈾膜切刀14之間之距離則被設成呈隨 著粘貼圖案可加以適當變更之構成。又，基板間用抗蝕膜 切刀14與層疊滾輪3 1之間距亦被設成隨著基板之長度可 加以變更。 圖6爲抗蝕膜切刀之側視圖。圓盤切刀11乃藉與一體 化薄膜F搬運方向呈直交方向之旋轉移動對抗蝕薄膜4施 加寬幅方向之連續裂縫。該裂縫雖可將帶基薄膜3沿幅度 方向予以稍微切割，惟爲避免造成裂縫深達全厚度，卻被 設成藉承受台19A與彈簧17A、線形導件18可調整按壓 力。該承受台19A亦可予以設成利用彈性材料以緩和被剝 離覆蓋薄膜5之對於一體化薄膜F之反力。 中間用抗蝕膜切刀12與13，其成對之圓盤切刀11間 之距離係相當於對一片基板6進行粘貼多面抗蝕圖案時之 不希望粘貼抗蝕薄膜之部位。另，基板間用抗蝕膜切刀 (請先閱讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） -10- 537970 A7 B7 經濟部智慧財產局員工消費合作社印製 五、發明説明（8 ) 14 ’其成對之圓盤切刀11間之距離卻相當於所搬運多數基 板6之基板間部位及基板6與抗蝕薄膜4之不希望粘貼抗 蝕薄膜之部位的合計長度。且將中間用抗蝕膜切刀1 2與 13 ’及基板間用抗蝕膜切刀14之成對圓盤切刀11間之抗 鈾膜予以去除。因此，便宜上將該等領域稱爲”抗鈾膜除去 部位”。 抗蝕膜除去部15乃被配置於各抗鈾膜切刀12、13、14 下游側或相同位置，並藉具與一對圓盤切刀11間距相同程 度幅度之粘著帶16將抗蝕薄膜4沿寬幅方向予以除去。抗 蝕薄膜4之藉粘著帶1 6予以除去之抗鈾薄膜除去間隔，卻 被設定爲欲粘貼於基板6之長度，而以該長度在一體化薄 膜F予以形成裂縫。 圖7爲抗蝕膜除去部15之側視圖。該抗蝕膜除去部15 係由將由未圖示滾輪所挺出粘著帶1 6加以捲繞之粘著帶壓 接輥子17B，與將該粘著帶壓接輥子17B向下按壓，把粘 著帶16推向抗蝕薄膜4之缸體15a，與將搬運到抗蝕膜除 去部位之帶基薄膜3予以吸住之承受台19B所構成。 粘著帶16即捲繞於粘著帶壓接輥子17B並被推向於抗 蝕薄膜4，促使抗蝕膜除去部1 5旋轉移動至圖示之左向。 粘著帶16則在旋轉之粘著帶壓接輥子17B處呈相對性挺出 形態，依序粘貼於位在抗蝕膜除去部15之抗蝕薄膜4，且 沿一體化薄膜F之寬幅方向被剝除。 茲說明自抗蝕膜切割至抗鈾膜除去之工程。圖8爲圖1 一組蝕膜切割部10之一對圓盤切刀11與抗蝕膜除去部15 (請先閲讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） -11 - 537970 A7 B7 五、發明説明（9 ) (請先閱讀背面之注意事項再填寫本頁) 之工程說明圖。將經過剝離覆蓋薄膜5之薄膜搬運至抗蝕 膜除去部1 5時，乃將圓盤切刀11予以移動至與薄膜搬蓮 方向呈直交之方向（薄膜之寬幅方向），以圓盤切刀i丨僅切 割抗鈾薄膜4(圖8(a))。其次將一體化薄膜F搬運至抗蝕膜 除去部1 5，促使按壓缸體1 5a作動，將粘著帶1 6粘貼於基 板6上之不希望粘貼部位之抗触薄膜4上（圖8(b))，而抗鈾 膜除去部1 5卻移動於與薄膜搬運方向呈直交之方向剝取不 希望粘貼部位之抗蝕薄膜4(圖8(c))。 吸引滾輪20係與吸引裝置（未圖示）連接，將一體化薄 膜F予以吸住進行方向轉換。該吸引滾輪20卻介電磁粉末 離合器21由馬達（SM)22加以轉動。 張力檢測器23則被配置於吸引滾輪20與後述層疊滾 輪3 1之間，由帶基薄膜3背面被抵住所定推壓力而轉動之 檢測輥子24，與能將對應於一體化薄膜F張力變化之檢測 輥子24移動（變位）以電氣信號加以取出之感測器25所構 成。 經濟部智慧財產局員工消費合作社印製 即，由張力檢測器23檢出吸引滾輪20與層疊滾輪3 1 間之一體化薄膜F張力，根據其信號予以控制馬達（SM)22 之轉動，藉電磁粉末離合器21之滑移扭矩進行適當之張力 調整。 層疊部30乃由將抗蝕薄膜4按壓於基板6上之層疊滾 輪3 1加以構成，且成對被配置於基板6之搬運路徑上下， 而進行轉動促使基板6與一體化薄膜F移向右方，將一體 化薄膜F之基板相當部加熱加壓予以粘貼於基板6上面。 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） -12- 537970 A7 B7 經濟部智慧財產局員工消費合作社印製 五、發明説明（10) 基板6與抗蝕薄膜4之基板相當部之定位卻由未圖示之位 置感測器之輸出加以進行，惟其技術由眾知者可充擔之， 故在此省略其說明。 基板分離部40係被配置於層疊部30下游側，藉切刀 41切斷基板6間之帶基薄膜3，使基板互相分離。基板6 本身則透過抗蝕薄膜4經過曝光處理等所需處理後，由未 圖示之切刀將未粘貼抗蝕薄膜4之部分沿寬幅方向予以切 割，製成所盼基板大小使用之。 依據本實施例，一體化薄膜F乃在粘貼於基板6直前 之時分被除去不希望粘貼抗蝕薄膜4之部分或基板間相當 部之抗鈾薄膜4。又，按壓時可僅在基板之所盼部分粘貼抗 鈾薄膜，致能省略基板互相分離時之除去位於圖案間之多 餘抗蝕薄膜的工程。又，依據本實施例，卻能統括處理較 大基板，予以分割爲小基板，實現多面效果。 覆蓋薄膜之剝離，對抗蝕薄膜4之形成裂縫，不希望 粘貼抗蝕薄膜4之部分或基板間相當部之除去抗蝕薄膜之 順序，則不限定於本實施例。 本發明亦可由下述形態加以實施。 可在搬運路徑底側裝設同種之薄膜粘貼裝置，對基板 兩側面進行粘貼抗蝕薄膜。 以圓盤切刀在抗蝕薄膜形成裂縫時，不僅能進行寬幅 方向之移動速度與旋轉周邊速度一致之推壓切割，亦可使 移動速度與旋轉周邊速度相異或圓盤切刀不旋轉移動於寬 幅方向在抗蝕薄膜予以形成裂縫，或替代圓盤切刀，而使 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐) 一 (請先閲讀背面之注意事項再填寫本頁) •裝· 訂 >線· -13- 537970 A7 _________B7 五、發明説明（11) 用剃刀或雷射刀。 爲避免停止一體化薄膜F與基板之搬運，以進行對於 基板之粘貼’卻可將對抗蝕薄膜設置裂縫之抗鈾膜切刀， 抗鈾薄膜除去機’切斷帶基薄膜俾使基板互相分離之基板 分離機等，對應基板搬運予以往復移動而進行所需之動 作。 (請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 本紙張尺度適用中國國家標準（CNS ) A4規格（210x297公釐） -14-、 1T ▼ The size of the paper is applicable to the Chinese National Standard (CNS) A4 specification (2 丨 0, 〆297mm) -9- 537970 A7 B7 Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 5. Description of invention (7) The width of the substrate 6 that touches the film 4 (length in a direction orthogonal to the conveying direction of the substrate 6) is slightly narrow. The cover film 5 is peeled from the integrated film F by a peeling roller 8 and is recovered by a take-up roller 9. A plurality of uranium-resistant film cutting sections 10 are arranged downstream of the peeling roller 8 along the film conveying path. The uranium-resistant film cutting portion 10 includes a plurality of paired disk cutters 11 arranged at a predetermined distance in the forward and backward direction of the integrated film F in the conveying direction. In this embodiment, the intermediate film resist cutters 12 and 13 and the inter-substrate resist film cutter 14 are arranged in this order from the upstream side in the transport direction of the integrated film F. The distance between the intermediate resist film cutters 12 and 13 and the intermediate resist die cutter 13 and the substrate anti-uranium film cutter 14 are set to be appropriate according to the paste pattern. The composition of the change. In addition, the distance between the substrate-use resist film cutter 14 and the lamination roller 31 is set to be variable in accordance with the length of the substrate. FIG. 6 is a side view of a resist film cutter. The disc cutter 11 applies a continuous crack to the resist film 4 in a wide direction by a rotational movement orthogonal to the conveying direction of the integrated film F. Although this crack can slightly cut the base film 3 in the width direction, in order to avoid causing the crack to reach the full thickness, it is set to adjust the pressing force by using the receiving table 19A, the spring 17A, and the linear guide 18. The receiving table 19A may also be provided by using an elastic material to reduce the reaction force of the peeled cover film 5 against the integrated film F. The intermediate resist cutters 12 and 13 have a distance between the pair of disc cutters 11 corresponding to a portion where a resist film is not intended to be applied when a multi-sided resist pattern is applied to a single substrate 6. In addition, a resist film cutter between substrates (please read the precautions on the back before filling out this page) This paper size is applicable to China National Standard (CNS) A4 specification (210X297 mm) -10- 537970 A7 B7 Intellectual Property of Ministry of Economic Affairs Printed by the Bureau ’s Consumer Cooperatives. 5. Description of the invention (8) 14 'The distance between the pair of disc cutters 11 is equivalent to the undesired position between the substrate 6 and the substrate 6 and the resist film 4. The total length of the area where the resist film is applied. And the uranium-resistant film between the pair of disc cutters 11 of the pair of resist cutters 12 and 13 'for the middle and the resist cutter 14 for the substrate is removed. Therefore, these areas are cheaply referred to as "uranium-resistant film removal sites". The resist removal section 15 is arranged at the same downstream position of each of the uranium-resistant film cutters 12, 13, and 14, and resists the resist by means of an adhesive tape 16 having the same pitch as the pair of disk cutters 11. The film 4 is removed in a wide direction. The uranium-resistant film removal interval of the anti-corrosion film 4 removed by the adhesive tape 16 is set to a length to be adhered to the substrate 6, and a crack is formed in the integrated film F at this length. FIG. 7 is a side view of the resist removal section 15. The resist removing portion 15 is an adhesive tape crimping roller 17B that winds an adhesive tape 16 that is pushed out by a roller (not shown), and presses the adhesive tape crimping roller 17B downward to press the adhesive. The belt 16 which pushes the belt 16 toward the resist film 4 is constituted by a receiving table 19B that sucks the base film 3 carried to the resist removal portion. That is, the adhesive tape 16 is wound around the adhesive tape crimping roller 17B, and is pushed toward the anticorrosive film 4, so that the resist removing section 15 is caused to rotate to the left in the figure. The adhesive tape 16 is relatively pushed out at the rotating adhesive tape crimping roller 17B, and is sequentially pasted on the resist film 4 located in the resist removal section 15 and follows the width of the integrated film F. Direction is stripped. The process from cutting the resist film to removing the anti-uranium film is explained. Fig. 8 is a pair of disc cutters 11 and resist removal sections 15 of one group of etching film cutting sections 10 of Fig. 1 (please read the precautions on the back before filling this page) The paper size is applicable to Chinese National Standards (CNS) A4 specifications (210X297 mm) -11-537970 A7 B7 V. Description of the invention (9) (Please read the precautions on the back before filling in this page) Engineering drawing. When the film having the peeled cover film 5 is transferred to the resist removing section 15, the disk cutter 11 is moved to a direction orthogonal to the film moving direction (the width direction of the film), and cut with a disk. The knife i only cuts the uranium-resistant film 4 (FIG. 8 (a)). Next, the integrated film F is transported to the resist removal section 15 and the pressing cylinder 15a is pushed to move the adhesive tape 16 to the anti-contact film 4 at an undesired position on the substrate 6 (FIG. 8 ( b)), while the anti-uranium film removing portion 15 is moved in a direction orthogonal to the film conveyance direction to peel off the resist film 4 at an undesired position (FIG. 8 (c)). The suction roller 20 is connected to a suction device (not shown), and sucks the integrated film F to change its direction. The suction roller 20 is rotated by a motor (SM) 22 via an electromagnetic powder clutch 21. The tension detector 23 is disposed between the suction roller 20 and a lamination roller 31 described later. The detection roller 24 is rotated by the back surface of the base film 3 against a predetermined pressing force, and can change the tension corresponding to the integrated film F. The detection roller 24 is moved (displaced) by a sensor 25 which is taken out by an electric signal. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs, that is, the tension detector 23 detects the integrated film F tension between the suction roller 20 and the laminated roller 3 1, and controls the rotation of the motor (SM) 22 based on its signal. The slip torque of the powder clutch 21 is appropriately adjusted for tension. The lamination section 30 is constituted by a lamination roller 31 that presses the resist film 4 on the substrate 6 and is arranged in pairs on the conveying path of the substrate 6 to rotate to cause the substrate 6 and the integrated film F to move to the right. On the other hand, a considerable portion of the substrate of the integrated film F is heated and pressurized and adhered to the upper surface of the substrate 6. This paper size applies Chinese National Standard (CNS) A4 specification (210X297 mm) -12- 537970 A7 B7 Printed by the Consumer Cooperative of Intellectual Property Bureau of the Ministry of Economic Affairs 5. Description of the invention (10) Substrate 6 is equivalent to the substrate of resist film 4 The positioning of the part is performed by the output of a position sensor, which is not shown in the figure, but its technology can be carried by a well-known person, so its description is omitted here. The substrate separation portion 40 is disposed downstream of the lamination portion 30, and the base film 3 between the substrates 6 is cut by a cutter 41 to separate the substrates from each other. The substrate 6 itself passes through the resist film 4 and undergoes necessary processing such as exposure processing, and then the portion to which the resist film 4 is not attached is cut by a cutter (not shown) in a wide direction to be used in a desired substrate size. According to this embodiment, the integrated film F is the uranium-resistant film 4 from which the portion where the resist film 4 is not desired to be adhered or the equivalent portion between the substrates is removed before being affixed to the substrate 6. In addition, the uranium-resistant film can be pasted only on the desired portion of the substrate when pressed, so that the process of removing the excess resist film located between the patterns when the substrates are separated from each other can be omitted. In addition, according to this embodiment, it is possible to collectively process a larger substrate and divide it into small substrates to achieve a multi-faceted effect. The order of removing the cover film and forming a crack in the resist film 4 is not limited to the embodiment in which the order of removing the resist film from the portion to which the resist film 4 is attached or the equivalent portion between the substrates is not desired. The present invention can be implemented in the following forms. The same type of film sticking device can be installed on the bottom side of the conveying path to apply a resist film to both sides of the substrate. When a disk cutter is used to form a crack in the resist film, not only can the pushing cutting with the moving speed in the wide direction be consistent with the rotating peripheral speed, but also the moving speed is different from the rotating peripheral speed or the disk cutting blade does not rotate. Move in a wide direction to form a crack in the resist film, or replace the disc cutter, so that this paper size applies the Chinese National Standard (CNS) A4 specification (210X297 mm). (Please read the precautions on the back before filling (This page) • Binding & Binding> -13- 537970 A7 _________B7 5. Description of the invention (11) Use a razor or laser knife. In order to avoid stopping the transportation of the integrated film F and the substrate for the purpose of attaching the substrate, the uranium-resistant film cutter that can set a crack on the resist film, and the uranium-resistant film remover 'cuts the base film and separates the substrates from each other. The substrate separator and the like are reciprocated in accordance with the substrate transportation to perform a desired operation. (Please read the notes on the back before filling out this page) Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs This paper is sized to the Chinese National Standard (CNS) A4 (210x297 mm) -14-