524748 A7 __B7 五、發明説明（彳） (產業上之利用領域） (請先閲讀背面之注意事項再填寫本頁) 本發明係有關薄膜張貼方法，特別與對半導體基片和 印刷電路基片’ L C D和P D P之玻璃基片等之基片表面 張貼光阻薄膜等薄膜張貼方法有關者。 (先行技術） 就已往類似此種之方法而言，有使用以底薄膜，和如 光阻薄膜等欲張貼之薄膜本體（以下，以光阻薄膜說明之 )，和面薄膜作成具三層構造之薄膜（以下，簡稱爲一體 化薄膜），且按底薄膜朝外周側，面薄膜朝內周側之形態 捲成之薄膜卷，再將從薄膜卷放出之一體化薄膜之面薄膜 剝離，並配合在搬送路上依所期望之規定間隔搬送而來之 各基片之尺寸，將一體化薄膜朝寬度方向裁剪，把因而成 爲兩層的光阻薄膜和底薄膜，使光阻薄膜呈對著基片表面 側之狀態通過一對壓接輥間，俾將其張貼於每一基片上之 每葉法。 / 經濟部智总財產局員工消費合作社印製 此種每葉法，因爲欲朝基片搬運方向使薄膜前端與基 片前端部對齊定位事具有困難，且於對準位置時容易形成 氣泡，又，薄膜後端部成爲自由端而易於拽進氣泡，故有 需要處理該端部致使裝置構成變爲複雜之.問題產生。 由是，爲簡化裝置之構成而有連續法之提案。 該方法係屬與每葉法同樣地使用薄膜卷，而有：將由 薄膜卷放出之一體化薄膜的面薄膜剝離之後，對相當於沿 搬送路上依所期望的規定間隔搬送而來之多數基片之基片 -4- 本紙張尺度適用中國國家梂準（CNS ) A4規格（210X297公釐） 524748 A7 _B7___ 五、發明説明（2 ) (請先閱讀背面之注意事項再填寫本頁) 間，及對不希望被張貼光阻薄膜之基片部分之部位（以下 ，簡稱基片間相當部位）上之光阻薄膜，施予貼設保護帶 之基片間處理，然後保持不剪斷底薄膜之狀態令光阻薄膜 成爲基片表面側，即令保護帶呈跨過被搬送之各基片前後 端部之形態通過一對壓接輥間，藉此張貼於各該基片之一 第一種連續法（參閱特開平6 - 7 3 3 4 3號公報）。 或是，就以對應相當於沿搬送路上依所期望之規定間 隔搬送而來之多數基片之基片間之部位的長度，將、從薄膜 卷放出之一體化薄膜的面薄膜朝寬度方向於前後兩處予以 剪斷，並實施基片間處理留存相當於基片間部位之面薄膜 和剝離欲張貼光阻薄膜之部位（以下簡稱相當基片部位） 之面薄膜後，以令光阻薄膜成爲基片表面側之形態，即讓 留存之面薄膜呈跨過正在搬送之各基片之前後端之形態， 通過一對壓接輥，藉以對各該基片張貼光阻薄膜之第二種 連續法（參閱特開平9 一 1 7 4 7 9 7號公報）。 (發明所欲解決之課題） 經濟部智慧財產笱員工消費合作社印製 於如上述已往技術中之連續法，其相當基片部位雖爲 底薄膜和光阻薄膜之2層，惟於基片間相當部位時爲底薄 膜和光阻薄膜和保護帶或者面薄膜之3層，而在兩部位之 境界因存有階段之故，靠近境界之相當基片部位的光阻薄 膜與基片間動輒就拽進微細的氣泡。 又，就貼設保護帶之情形言，由於對保護帶施加拉力 再張貼在光阻薄膜上，故於張貼後保護帶會收縮，致使光 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐) 一 524748 A7 B7 五、發明説明（3 ) 阻薄膜產生皺紋。產生此種氣泡和皺紋，對曝光處理皆有 不良影響。 —----ί------- (請先閱讀背面之注意事項再填寫本頁) 又，於如上述已往技術中之連續法，由於各基片在張 貼光阻薄膜之後，呈現藉由底薄膜和光阻薄膜以及基片間 相當部位之保護帶或面薄膜所連係之形狀，故爲實施後處 理，必須將其分離。 就作爲確實之分離法，在基片之搬送路徑中藉切刀將 在基片間之底薄膜和光阻薄膜以及光阻薄膜上之保護帶或 者面薄膜予以切斷者。按照此分離法時，該等被切斷之薄 膜端緣係自基片端緣突出，尤於後工序中爲作曝光處理而 進行基片之位置對準等時候，該突出之薄膜端.緣將構成妨 礙而成爲無法進行正確處理之問題。 經濟部智慧財產芍員工消費合作社印製 爲不讓薄膜端緣自基片端緣突出，於張貼光阻薄膜之 後，朝寬度方向以可達位於基片間相當部位處之保護帶或 者面薄膜之深度自底薄膜側切進穿通光阻薄膜之切縫，再 藉膠帶等朝寬度方向剝取面薄膜、光阻薄膜及保護帶，或 面薄膜之3層，俾分離相互間之基片亦可。但按此分離法 ，欲不傷及基片而從底薄膜側作出切縫頗爲困難。且若顧 慮到基片之損傷施以較淺之切縫時，卻難使基片相互間分 離之。 若基片屬於半導體基片等約略呈圓形者時，難從基片 之周緣朝內側張貼光阻薄膜，故大部分的時候，皆於張貼 之後沿基片外周用刀具和雷射切割之。 使用刀具的時候，由於將刃部碰觸基片’使刃部壽命 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） 524748 A7 ___B7 _ 五、發明説明（4 ) (請先閲讀背面之注意事項再填寫本頁) 減短，有必要經常更換刀刃。又，使用雷射切割時，由於 切斷部之光阻薄膜受雷射光之熱而引起變質，熔融之故， 往往會妨礙到底薄膜之剝離操作。 (用以解決課題之手段） 鑑於上述之情形，本發明以目的即在提供可在不產生 氣泡和皺紋之情形下將薄膜本體對準基片形狀張貼之薄膜 張貼方法者。 .；： 本發明之其他目的，在於提供以不損及基片之前提下 對各薄膜製設切縫，俾能簡單且確實完成基片相互間之分 離的薄膜張貼方法。 更且，本發明之再一其他目的，則在提供可在後續工 序中簡易地剝離底薄膜之薄膜張貼方法者。 經濟部智慧財產局員工消費合作社印製 爲能達成上述目的之本發明係與從具有在薄膜本體之 各側貼設底薄膜與面薄膜作成三層構造之一體化薄膜所捲 成之薄膜卷放出一體化薄膜，先將其中之面薄膜剝離，並 以薄膜本體面向基片側之形態搬送，再使其與該基片一起 通過壓接手段，俾在該基片上張貼薄膜本體之薄膜張貼方 法有關，其特徵爲：將相當於上述基片和薄膜本體間不希 望粘接之部分之部位及相當於不希望與上述壓接手段接觸 部分之部位之薄膜本體予以除去，使位於上述兩部位處之 底薄膜外露後，藉上述壓接手段將薄膜本體張貼在上述基 片表面上者。 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） 524748 A7 ____B7 _ _ 五、發明説明（5 ) (作用） . (請先閲讀背面之注意事項再填寫本頁) 按照本發明時，能夠於壓接之際，僅在基片上所期望 之部分，於毫無產生氣泡和皺紋之情形下將薄膜本體張貼 於基片。 (實施例） 茲據所附第1至4圖表示之一實施形態說明本發明方 法如下。 第1圖爲具體實現本發明方法所屬一實施形態之薄膜 張貼裝置槪略側視圖。 於第1圖中，1表示薄膜卷，係由底薄膜2，光阻薄 膜（薄膜本體）3及面薄膜4組成，乃於光阻薄膜3之各 側將底薄膜2和面薄膜4藉光阻薄膜3之粘接性連結成具 3層構造之一體化薄膜F，以底薄膜2朝外側之方式捲成 者。 / 經濟部智慧財產苟員工消費合作社印製 5係構成以所期望的間隔D將多數之基片6自圖之左 側朝右側搬送之搬走路用搬送滾筒。與一體化薄膜F之放 出方向或者基片之搬送方向直交之方向的長度（寬度尺寸 ，通常，作成較張貼光阻薄膜3之基片6之寬度（與基片 6之搬送方向直交之方向的長度）稍微狹窄者。 即，一體化薄膜F之寬度尺寸，係作成與欲在基片6 上張貼光阻薄膜3之部分的寬度尺寸相等。524748 A7 __B7 V. Description of the invention (彳) (Industrial fields of use) (Please read the precautions on the back before filling out this page) The present invention relates to the method of film placement, especially for semiconductor substrates and printed circuit substrates' LCD and PDP glass substrates and other substrates are placed on the surface of the film, such as a photoresist film on the film method. (Prior art) In the past, methods similar to this have used a base film and a film body (such as a photoresist film) to be posted (hereinafter, described with a photoresist film), and a three-layer structure made of a top film. Film (hereinafter, referred to as an integrated film), and a film roll rolled with the bottom film facing the outer peripheral side and the face film facing the inner peripheral side, and then peeling the top film of the integrated film released from the film roll, and According to the size of each substrate transported at the desired interval on the transport path, the integrated film is cut in the width direction, and the photoresist film and the bottom film thus formed into two layers are made to face the photoresist film. The state on the surface side of the sheet is passed between a pair of crimping rollers, and then it is put on each leaf of each substrate. / The Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs printed this per-leaf method, because it is difficult to align and position the front end of the film with the front end of the substrate in the direction of substrate transportation, and it is easy to form bubbles when the position is aligned. The rear end of the film becomes a free end and it is easy to pull in air bubbles, so it is necessary to deal with this end, which complicates the device configuration. Problems arise. Therefore, a continuous method has been proposed to simplify the structure of the device. This method uses a film roll in the same way as the per-leaf method, and after peeling off the top film of the integrated film released from the film roll, the majority of the substrates are transported at a predetermined interval along the transport path. The substrate -4- This paper size is applicable to China National Standard (CNS) A4 specification (210X297 mm) 524748 A7 _B7___ V. Description of the invention (2) (Please read the precautions on the back before filling this page), and For the photoresist film on the part of the substrate where the photoresist film is not intended to be affixed (hereinafter referred to as the equivalent part between the substrates), the photoresist film is treated with a protective tape, and then the bottom film is not cut. The state allows the photoresist film to be the substrate surface side, that is, the protective tape is passed across the front and rear ends of each substrate being transported through a pair of crimping rollers, thereby being posted on one of the substrates. Law (see JP 6- 7 3 3 4 3). Or, the length of the surface film of the integrated film released from the film roll in the width direction is equal to the length corresponding to the portion between the substrates corresponding to the majority of the substrates transported at the desired predetermined distance along the transport path. The front and back are cut off, and inter-substrate processing is performed to retain the surface film equivalent to the part between the substrates and to peel off the surface film at the part where the photoresist film is to be placed (hereinafter referred to as the equivalent substrate part) to make the photoresist film. The form of the substrate surface side, that is, the remaining surface film is in the form of crossing the front and rear ends of each substrate being conveyed, and a second type of photoresist film is pasted on each substrate through a pair of crimping rollers. Continuous method (see Japanese Unexamined Patent Publication No. 9-1 7 4 7 97). (Problems to be Solved by the Invention) The Intellectual Property of the Ministry of Economic Affairs / Employee Consumer Cooperative Co., Ltd. printed the continuous method in the previous technology as described above. Although its equivalent substrate portion is two layers of the base film and the photoresist film, it is equivalent between the substrate The part is the three layers of the bottom film, the photoresist film, the protective tape or the surface film. In the realm of the two parts, due to the existence of the stage, the photoresist film and the substrate near the real part of the realm are pulled in and out. Fine bubbles. In addition, in the case of attaching a protective tape, since the protective tape is stretched and then posted on the photoresist film, the protective tape will shrink after being posted, so that the paper size of the paper applies the Chinese National Standard (CNS) A4 specification (210X297). (Mm)-524748 A7 B7 5. Description of the invention (3) The resist film has wrinkles. The generation of such bubbles and wrinkles adversely affects the exposure processing. —---- ί ------- (Please read the precautions on the reverse side before filling out this page) Also, in the continuous method as in the above-mentioned prior art, since each substrate is presented with a photoresist film, it appears Due to the shape of the bottom film, the photoresist film, and the protective tape or surface film between the corresponding parts of the substrate, they must be separated for post-processing. As an exact separation method, the substrate film, the photoresist film, and the protective tape or the surface film on the photoresist film are cut by a cutter in the conveying path of the substrate. According to this separation method, the cut edge of the film protrudes from the edge of the substrate, especially when the position of the substrate is aligned in the subsequent process for exposure processing. The edge of the protruding film. This is a problem that prevents proper handling. Printed by the Intellectual Property of the Ministry of Economic Affairs and Employee Cooperatives so that the edge of the film does not protrude from the edge of the substrate. After the photoresist film is posted, the width direction can reach the depth of the protective tape or surface film located at a considerable part between the substrates. Cut through the slit of the photoresist film from the bottom film side, and then peel off the top film, photoresist film and protective tape, or the three layers of the top film by tape, etc., to separate the substrates from each other. However, according to this separation method, it is quite difficult to make a slit from the bottom film side without hurting the substrate. Moreover, if it is considered that the damage of the substrate is applied with a shallow slit, it is difficult to separate the substrates from each other. If the substrate is a semiconductor substrate with a roughly circular shape, it is difficult to post the photoresist film from the periphery of the substrate toward the inside. Therefore, most of the time, it is cut with a cutter and laser along the periphery of the substrate after being posted. When using a knife, the blade life will be affected by touching the blade to the substrate. This paper size is in accordance with Chinese National Standard (CNS) A4 (210X297 mm) 524748 A7 ___B7 _ V. Description of the invention (4) (Please read first Note on the back, please fill out this page again) Shortening, it is necessary to change the blade frequently. When laser cutting is used, the photoresist film at the cutting portion is deteriorated due to the heat of the laser light, and melting may hinder the peeling operation of the bottom film. (Means for Solving the Problems) In view of the above-mentioned circumstances, an object of the present invention is to provide a method for applying a film that can align a film body to a substrate shape without generating bubbles and wrinkles. .;: Another object of the present invention is to provide a method for attaching a film, which can easily and surely separate the substrates from each other by making slits for each film without lifting the substrate before it is damaged. Furthermore, it is another object of the present invention to provide a method for applying a film which can easily peel off a base film in a subsequent process. The present invention, printed by an employee consumer cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs to achieve the above-mentioned purpose, is a film roll rolled from an integrated film having a three-layer structure with a base film and a face film attached to each side of the film body. For the integrated film, first peel off the surface film and transport it with the film body facing the substrate side, and then make it together with the substrate by means of pressure bonding, and then put the film body on the substrate. It is characterized in that: the part corresponding to the part where the substrate and the film body are not desired to be bonded and the part corresponding to the part where the contact with the crimping means is not expected to be removed, so that the bottom of the two parts is located After the film is exposed, the film body is pasted on the surface of the substrate by the above-mentioned crimping means. This paper size applies to Chinese National Standard (CNS) A4 specification (210X297 mm) 524748 A7 ____B7 _ _ V. Description of the invention (5) (Function). (Please read the precautions on the back before filling this page) According to the invention In the case of crimping, the film body can be posted on the substrate only in the desired part of the substrate without generating bubbles and wrinkles. (Embodiment) The method of the present invention will be described below based on one embodiment shown in Figs. 1 to 4 attached. FIG. 1 is a schematic side view of a film sticking device according to an embodiment of the method according to the present invention. In the first figure, 1 represents a film roll, which is composed of a base film 2, a photoresist film (film body) 3, and a top film 4. The bottom film 2 and the top film 4 are borrowed from each side of the photoresist film The adhesiveness of the resist film 3 is connected to form an integrated film F with a three-layer structure, and the bottom film 2 is rolled so that it faces outward. / Printed by the Intellectual Property of the Ministry of Economic Affairs and the Consumers' Cooperative. The 5 series constitutes a transport roller for transporting a large number of substrates 6 at a desired interval D from the left side to the right side of the figure. The length in the direction orthogonal to the release direction of the integrated film F or the transport direction of the substrate (width dimension, usually, it is made wider than the width of the substrate 6 on which the photoresist film 3 is placed Length) is slightly narrower. That is, the width dimension of the integrated film F is made equal to the width dimension of the portion where the photoresist film 3 is to be placed on the substrate 6.
本裝置之功能，係將從薄膜卷1放出之一體化薄膜F 本紙張尺度適用中國國家標準（CNS )八4規格（210X297公釐） p 一 —ΓΛ ·* 524748 A7 B7 五、發明説明（6 ) (請先閲讀背面之注意事項再填寫本頁) ，對著依所期望之間隔D搬送之各基片6上面張貼將長度 經予調整爲較各基片6朝搬送方向之長度L 1稍短之長度 L2之光阻薄膜3者。 7係指在由薄膜卷1放出之一體化薄膜F上形成撕開 用騎縫刻痕之手段。而該形成撕開用騎縫刻痕手段7係具 備於一體化薄膜F之放出方向（搬送方向）中之前後處以 距離L 4可朝一體化薄膜F之寬度方向移動之一對騎縫刻 痕鏤刻齒輪8。 、」 經濟部智慧財產局員工消費合作社印¾ 各騎縫刻痕鏤刻齒輪8，乃如於第2圖所示屬狀如縫 紉用鏤刻齒輪者，而可對承載台9上之一體化薄膜F從其 上方藉由直線導件1 1之引導和彈簧1 0調整至適當推壓 力之方式，一面旋轉而朝一體化薄膜F之寬度方向A移動 。承載台9宜作成當欲形成撕開用騎縫刻痕之際，能以真 空吸住一體化薄膜F。又，預先在承載台9上面設可供騎 縫刻痕鏤刻齒輪8之鋒刃切入之程度的空間S，則能確實 地藉騎縫刻痕鏤刻齒輪8之旋轉移動形成撕開用騎縫刻痕 。即，藉騎縫刻痕鏤刻齒輪8之旋轉與移動，鋒刃部分以 虛線狀切入一體化薄膜F，而形成撕開用騎縫刻痕。該騎 縫刻痕係自面薄膜4通過光阻薄膜3而形成於底薄膜2者 。且該空間S亦可用能吸收騎縫刻痕鏤刻齒輪8之鋒刃切 入之彈性材替代之。 1 2爲面薄膜4之剝取滾筒，而從一體化薄膜F剝離 之面薄膜4則藉捲取滾筒13回收之。 14爲設於剝取滾筒12下游處之光阻薄膜切縫形成The function of this device is the integrated film F that will be released from film roll 1. The paper size is applicable to the Chinese National Standard (CNS) 8 4 specifications (210X297 mm) p a-ΓΛ · * 524748 A7 B7 V. Description of the invention (6 ) (Please read the precautions on the back before filling in this page), and post it on each substrate 6 that is transported at the desired interval D, and adjust the length to be slightly longer than the length L 1 of each substrate 6 in the transport direction. Photoresist film 3 with a short length L2. 7 refers to a method of forming a seam score on the integrated film F released from the film roll 1. The saddle scoring means 7 for tearing is provided with a pair of saddle scoring gears which can be moved in the width direction of the integrated film F in the release direction (conveying direction) of the integrated film F by a distance L 4. 8. "" Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs ¾ Each scoring engraved gear 8 is shaped like a engraved gear for sewing, as shown in Figure 2, and can be used to remove the integrated film F on the carrier 9 Above it, it is guided by the linear guide 11 and the spring 10 is adjusted to an appropriate pushing force, while rotating toward the width direction A of the integrated film F. The supporting platform 9 should be formed so that the integrated film F can be sucked in the vacuum when it is intended to form a tearing slit. In addition, a space S to which the edge of the scoring engraving gear 8 can be cut in advance is provided on the supporting platform 9 in advance, and the scoring scoring for tearing can be surely formed by the rotational movement of the scoring gear 8. That is, by the rotation and movement of the scoring engraving gear 8, the blade portion is cut into the integrated film F in a dotted line shape, thereby forming a scoring rip for tearing. This riding notch is formed on the bottom film 2 from the top film 4 through the photoresist film 3. Moreover, the space S can also be replaced by an elastic material capable of absorbing the cutting edge of the scoring gear 8 of the riding seam. 12 is the peeling roller of the top film 4, and the top film 4 peeled from the integrated film F is recovered by the take-up roller 13. 14 is a slit formed for the photoresist film located downstream of the stripping drum 12
本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） Q 524748 A7 ___B7 _ 五、發明説明（7 ) 手段。該光阻薄膜切縫形成手段1 4，備置朝一體化薄膜 F之搬送方向前後以跨距L 5配置之一對旋轉刀盤1 5。 (請先閱讀背面之注意事項再填寫本頁) 如於第3圖所示，旋轉刀盤1 5係藉著朝B方向之旋 轉移動在光阻薄膜3上該朝寬度方向之連續切縫者，雖可 將底薄膜2朝厚度方向（於第3圖中朝上下方向之長度） 稍微切斷，然而爲使其不沿全厚度作出切縫起見，以承載 台1 6和直線導件1 8作引導藉彈簧1 7調整推壓力。 另於承載台1 6上宜設彈性材1 9俾緩和剝離面薄膜 4後對一體化薄膜F之反力。 一對旋轉刀盤1 5間之距離L 5，係將相當於被搬送 而來之多數基片6之基片間部位（第1圖中之間隔D的長 度）及相當於不期望基片6和光阻薄膜（薄膜本體）3之 粘接部分之光阻薄膜3之部位的長度兩者相加之合計長度 ，此領域乃簡稱爲基片間相當部或光阻薄膜去除部。至於 間隔D之部位，則相當於將在後述之不期望壓接手段（壓 接輥）與光阻薄膜3之接觸的部位。 經濟部智慧財產苟8工消費合作社印製 一對旋轉刀盤1 5間之距離L 5乃設定爲較寬於騎縫 刻痕鏤刻齒輪8間之距離L 4 ( L 5 > L 4 )，即作成朝 一體化薄膜F之搬送方向由1對旋轉刀盤15形成之切縫 裡面有由一對騎縫刻痕鏤刻齒輪8所形成之撕開用騎縫刻 痕存在，換言之，使由各旋轉刀盤1 5所形成之切縫存在 一對騎縫刻痕鏤刻齒輪8形成之撕開用騎縫刻痕外側。This paper size applies to China National Standard (CNS) A4 specification (210X297 mm) Q 524748 A7 ___B7 _ V. Description of invention (7). This photoresist film slit forming means 14 is provided with a pair of rotary cutter heads 15 arranged at a distance L 5 in the forward and backward directions toward the transport direction of the integrated film F. (Please read the precautions on the back before filling this page.) As shown in Figure 3, the rotary cutter head 15 is a continuous slitter in the width direction on the photoresist film 3 by rotating in the direction of B Although the bottom film 2 can be slightly cut in the thickness direction (the length in the up and down direction in Figure 3), in order to prevent it from making a slit along the full thickness, the bearing platform 16 and the linear guide 1 are used. 8 for guidance by spring 1 7 to adjust the pushing force. In addition, an elastic material 19 should be provided on the supporting platform 16 to relieve the reaction force on the integrated film F after the surface film 4 is peeled off. The distance L 5 between a pair of rotary cutter heads 15 is equivalent to the portion between substrates (the length of the interval D in the first figure) corresponding to the majority of the substrates 6 being transported and corresponds to the undesired substrate 6 The total length added to the length of the portion of the photoresist film 3 at the bonding portion of the photoresist film (film body) 3, this field is simply referred to as the equivalent portion between substrates or the photoresist film removal portion. As for the portion of the interval D, it corresponds to a portion where the below-mentioned undesired crimping means (crimping roller) is brought into contact with the photoresist film 3. The distance L 5 between a pair of rotary cutter heads 15 printed by the Intellectual Property of the Ministry of Economic Affairs and the Industrial Cooperative Cooperative is set to be wider than the distance L 4 (L 5 > L 4) between the eight stitched engraved gears. The slit formed by a pair of rotary cutter heads 15 in the conveying direction of the integrated film F has a riding slit formed by a pair of riding slit scoring gears 8 in other words, in other words, each rotary cutter head The slit formed by 15 includes a pair of riding slits, and the outside of the riding slits formed by the gear 8 is used for tearing.
2 0爲設在光阻薄膜刀縫形成手段1 4下游處之光阻 薄膜去除手段，係藉具有與一對旋轉刀盤1 5間之距離L -10- 本紙張尺度適用中國國家揉準（CNS ) A4規格（210X297公釐） 524748 A7 B7 _ 五、發明説明（8 ) 5相同程度之寬度的膠帶2 1以距離L 5之寬度將光阻薄 膜3朝寬度方向去除。 藉膠帶2 1去除光阻薄膜3中之基片間相當部的間隔 ’係設定爲欲在基片6上張貼光阻薄膜3之長度L 2 ’且 以該長度L 2爲跨距形成一體化薄膜F上之切縫和撕開用 騎縫刻痕。 換言之，一體化薄膜F乃呈現使長度L 2之領域和內 存長度L 4之長度L 5的領域朝搬送方向交替存在之形態 者。 第4圖表示光阻薄膜去除手段2 0，係將由未圖示之 膠帶卷所放出之膠帶2 1捲繞於藉缸筒2 4朝下推壓之輥 2 3上，並壓住光阻薄膜3 ,再藉該輥2 3朝圖之右方向 的移動，使膠帶2 1呈相對地從旋轉之輥2 3處放出之狀 ，然後依序將光阻薄膜3張貼於膠帶2 1 ’把長L 5之寬 度的基片間相當部之光阻薄膜3朝一體化薄膜F之寬度方 向剝取。由是，此部分僅留存著底薄膜2。 又，2 5，係爲能使膠帶2 1與光阻薄膜3牢牢貼合 而設於一體化薄膜F之下方的承載台。 2 7係表示一體化薄膜F之方向變換輥。2 0 is a photoresist film removal method located downstream of the photoresist film slit forming means 14 and is based on a distance L 15 from a pair of rotating cutter discs 15 -10- This paper size applies to Chinese national standards ( CNS) A4 specification (210X297 mm) 524748 A7 B7 _ V. Description of the invention (8) 5 Tape of the same width 2 1 Remove the photoresist film 3 in the width direction with a width of L 5. By using the tape 21, the distance between the considerable portions of the photoresist film 3 between the substrates' is set to the length L 2 of the photoresist film 3 to be placed on the substrate 6 and the length L 2 is used as a span to form an integration. The slits and tears on the film F are scored by riding seams. In other words, the integrated film F has a form in which the area of the length L 2 and the area of the length L 5 of the memory length L 4 alternately exist in the conveying direction. Figure 4 shows the photoresist film removal means 20, which is to roll the tape 2 1 released from a tape roll (not shown) around the roller 23 pushed down by the cylinder 24 and press the photoresist film 3, and then use the roller 2 3 to move to the right of the figure, so that the tape 21 is relatively released from the rotating roller 23, and then the photoresist film 3 is sequentially posted on the tape 2 1 ' A considerable portion of the photoresist film 3 between the substrates with a width of L 5 is stripped in the width direction of the integrated film F. Therefore, only the base film 2 remains in this portion. The reference numerals 2 and 5 refer to a supporting table provided under the integrated film F so that the adhesive tape 21 and the photoresist film 3 can be firmly attached. 2 7 is the direction changing roller of the integrated film F.
2 8係由搬送滾筒5所構成之搬走路上下所設之一對 壓接輥，爲一面旋轉一面使基片6和一體化薄膜F往右方 移動，在基片6之上面對具有於一體化薄膜F之長度L 2 之基片相當部光阻薄膜3予以加熱加壓而張貼之壓接手段 。壓接輥2 8之旋轉，使從薄膜卷1放出之一體化薄膜F 本紙伕尺度適用中國國家標準(CNS ) A4規格（210X297公釐） ~ΓΓ i- nn ϋϋ ϋϋ· mi- ϋϋ —ill m (請先閲讀背面之注意事項再填寫本頁) 訂 經濟部智慧財產局員工消費合作社印^ 524748 A7 B7 五、發明説明（9 ) 獲得張力。於基片6和光阻薄膜3之基片相當部之位置的 對準，乃觀察未圖示之位置感測器的輸出來實施者，由於 該技術可採公知技術即已足夠，故將其說明省略之。 2 9表示底薄膜去除手段，係藉由具備長度爲L 4程 度之寬度的膠帶3 0將基片間相當部之底薄膜2從撕開用 騎縫刻痕處切斷，使基片互相分離。 由於底薄膜去除手段29，可用如於第4圖所示光阻 薄膜去除手段2 0同樣者，故省略其說明。又，3. .1係用 以確保使膠帶3 0張貼於基片間相當部之底薄膜2之際的 推壓力之承載台。 當藉膠帶3 0欲剝離在基片間相當部之底薄膜2時， 因已形成撕開用騎縫刻痕，此時在一體化薄膜F上無構設 撕開用騎縫刻痕之必要，故祇要將膠帶3 0張貼於基片間 相當部之底薄膜2再予拉扯，一體化薄膜F即從撕開用騎 縫刻痕處簡單地切斷。因而，於基片相互間之分離時，不 會損傷基片6。又，因一體化薄膜F並未從基片6之端緣 突出，故未妨礙到爾後之工序。 按照本發明之方法，即能夠於對基片6實施張貼前之 時點，已去除一體化薄膜F之基片間相當部等上的光阻薄 膜3而露出底薄膜2者。所以，因基片相當部和基片間相 當部之境界的光阻薄膜3不具階差，故不會拽入氣泡，且 因未使用保護帶而不會產生皺紋，不致殘留弊端至後工序 之曝光處理。更於通過壓接輥2 8間之際，雖接觸到壓接 輥2 8，亦不致沾污壓接輥2 8。當欲對較基片6之周緣 本紙浪尺度適用中國國家標準（CNS ) A4規格（210X 297公釐） b --= - ...... 1 1-·- f i tru_11 I (請先閲讀背面之注意事項再填寫本頁) 、^1 經濟部智慧財產局員工消費合作社印災 -12 - 524748 A7 ____ B7 _ 五、發明説明（10) (請先閲讀背面之注意事項再填寫本頁) 稍靠內側處張貼光阻薄膜3時，由於張貼後再再切斷底薄 膜2和光阻薄膜3，故無須介意刀刃之壽命和起因於熱之 光阻薄膜3的變質和熔融。 又，按照本發明的方法時，形成撕開用騎縫刻痕，剝 離面薄膜，對光阻薄膜形成切縫，基片間相當部之光阻薄 膜去除之順序並未被限定，而是說於對基片6施以張貼前 之時點已去除一體化薄膜F之基片間相當部上的光阻薄膜 3，並在該去除處所之底薄膜2上形成使基片相互之分離 用撕開騎縫刻痕者。 第5圖表示可實現能造成這樣狀況的第2種實施形態 之薄膜張貼裝置。 於第5圖中，對與第1〜4圖中所示者相同物或相當 物附以同一圖號表示之。 於第5圖所示之薄膜張貼裝置裡，首先，連續地將面 薄膜4剝離。爾後，使用旋轉刀盤15以L5之寬度一對 光阻薄膜3之寬度方向設切縫，並藉光阻薄膜去除手段 2 0中之膠帶2 1去除基片間相當部之光阻薄膜3。 經濟部智慧財產芍g(工消費合作社印製 在去除光阻薄膜3而出現之底薄膜2上藉騎縫刻痕鏤 刻齒輪8構設撕開用騎縫刻痕。由於後續者皆與第1圖相 同，故省略其說明。 按此實施形態於構設撕開用騎縫刻痕之時候，騎縫刻 痕鏤刻齒輪8之刃鋒並不接觸光阻薄膜3，所形成之撕開 用騎縫刻痕處不會有光阻薄膜3之粘接成分滲出底薄膜2 外側，故不致於污染承載台9，方向變換輥2 7 ’壓接輥 -13- 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） 524748 A7 _ B7___ 五、發明説明（H) 2 8等。 藉調整刀具刃鋒之位置，爲形成去除基片間相當部之 光阻薄膜用切縫的時候，若使刃鋒位置調整材接觸到剝離 面薄膜4前之一體化薄膜，刃鋒位置調整材將不黏接到光 阻薄膜3，能夠從面薄膜4上圓滑地構設切縫。 在這時候，設有切縫之部分則可朝寬度方向設置膠帶 ，以該膠帶連接切斷的面薄膜後剝離之，則雖形成切縫而 朝寬度方向被切斷的面薄膜4亦能連續的予以剝離:.。 上述之第一，第二種實施形態，也可藉下述之形態予 以賓施。 1 .撕開用騎縫刻痕，亦可自底薄膜側形成之。 2.於搬走路徑下方設置同類之薄膜張貼裝置，在基片之 兩側張貼薄膜本體（光阻薄膜）亦屬可行。 3 .於藉旋轉刀盤在光阻薄膜上設切縫之時候，不僅採用 使朝寬度方向之移動速度與旋轉周速度一致之壓切方 向，亦可採用令移動速度與旋轉周速度不同或使旋轉 刀盤停止旋轉祇朝寬度方向移動來對光阻薄膜設切縫 之方法。 4 .當停止一體化薄膜F之搬送而進行形成撕開用騎縫刻 痕等操作之時候，爲能在不停止基片搬送之情形下進 行連續的張貼工作，需準備在方向變換輥與壓接輥之 間完成基片間處理，換言之，在此部分具2〜4處完 成光阻薄膜去除和形成撕開用騎縫刻痕之一體化薄膜 F的長度調整領域。 (請先閱讀背面之注意事項再填寫本頁)2 8 is a pair of crimping rollers set up and down by the conveying roller 5. It rotates while moving the substrate 6 and the integrated film F to the right. A pressure bonding means in which a considerable portion of the photoresist film 3 on the substrate of the integrated film F having a length L 2 is heated and pressed. The rotation of the crimping roller 2 8 makes the integrated film F released from the film roll 1 the paper size of the paper applies the Chinese National Standard (CNS) A4 specification (210X297 mm) ~ Γ i-nn ϋϋ ϋϋ · mi- ϋϋ —ill m (Please read the precautions on the back before filling out this page.) Ordered by the Intellectual Property Bureau of the Ministry of Economic Affairs, Consumer Cooperative Cooperatives ^ 524748 A7 B7 V. Description of Invention (9) Gain tension. The alignment of the positions of the corresponding parts of the substrate 6 and the photoresist film 3 is implemented by observing the output of a position sensor (not shown). Since this technique can be a well-known technique, it will be explained. Omit it. 2 9 indicates a means for removing the base film, and the base film 2 corresponding to the space between the substrates is cut from the slits for tearing by using an adhesive tape 30 having a length of L 4 degrees to separate the substrates from each other. Since the bottom film removing means 29 can be the same as the photoresist film removing means 20 shown in FIG. 4, the description thereof is omitted. In addition, 3. .1 is a supporting table for ensuring the pressing force when the adhesive tape 30 is placed on the base film 2 in a considerable portion between the substrates. When the bottom film 2 on a considerable portion between the substrates is to be peeled off by the adhesive tape 30, a tear seam nick is formed, and at this time, there is no need to configure a tear seam nick on the integrated film F, so As long as the adhesive tape 30 is put on the bottom film 2 in a considerable part between the substrates and then pulled, the integrated film F is simply cut from the nick for tearing. Therefore, the substrate 6 is not damaged when the substrates are separated from each other. In addition, since the integrated film F does not protrude from the edge of the substrate 6, it does not hinder subsequent processes. According to the method of the present invention, the photoresist film 3 on the equivalent portion between the substrates of the integrated film F can be removed and the base film 2 can be exposed before the substrate 6 is attached. Therefore, since the photoresist film 3 at the boundary between a considerable portion of the substrate and a considerable portion between the substrates does not have a step difference, bubbles will not be drawn in, and no wrinkles will be generated because the protective tape is not used, and no residual disadvantages will be caused to the subsequent process. Exposure processing. Even when the crimping roller 28 is passed between the crimping rollers 28, the crimping rollers 28 are not contaminated even though they come into contact with the crimping rollers 28. When you want to apply the Chinese National Standard (CNS) A4 specification (210X 297 mm) to the paper scale of the peripheral edge of substrate 6, b-=-...... 1 1- ·-fi tru_11 I (Please read first (Notes on the back, please fill in this page) ^ 1 Printing of Disaster Cooperatives for Employees' Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs -12-524748 A7 ____ B7 _ V. Description of Invention (10) (Please read the notes on the back before filling this page) When the photoresist film 3 is placed slightly inside, since the bottom film 2 and the photoresist film 3 are cut again after being posted, there is no need to mind the life of the blade and the deterioration and melting of the photoresist film 3 due to heat. In addition, according to the method of the present invention, the riding slit for tearing is formed, the surface film is peeled off, and the photoresist film is cut. The order of removing the photoresist film between the substrates is not limited, but it is said that The photoresist film 3 on the corresponding portion between the substrates of the integrated film F was removed from the substrate 6 at the time before posting, and a tear seam for separating the substrates from each other was formed on the bottom film 2 of the removed space. Scotch. Fig. 5 shows a film sticking device according to a second embodiment which can cause such a situation. In Fig. 5, the same or equivalent parts as those shown in Figs. 1 to 4 are denoted by the same drawing numbers. In the film application device shown in Fig. 5, first, the surface film 4 is continuously peeled. Thereafter, a slit is formed in the widthwise direction of the pair of photoresist films 3 with a width of L5 by using a rotary cutter head 15, and the photoresist film 3 corresponding to the space between the substrates is removed by using the photoresist film removing means 20 in the tape 2 1. Intellectual property of the Ministry of Economic Affairs 芍 g (Industrial and Consumer Cooperative) printed on the bottom film 2 which appeared after removing the photoresist film 3 by using a riding slit scoring gear 8 to construct a riding slit for tear. Therefore, when the riding slit for tearing is configured according to this embodiment, the blade edge of the riding slit engraving gear 8 does not contact the photoresist film 3, and the formed slit for tearing does not There will be the adhesive component of the photoresist film 3 leaking out of the bottom film 2, so it will not pollute the bearing platform 9, the direction change roller 2 7 'crimping roller-13- This paper size applies to Chinese National Standard (CNS) A4 specifications (210X297 (Mm) 524748 A7 _ B7___ 5. Description of the invention (H) 2 8 etc. By adjusting the position of the blade edge of the knife, in order to form a slit for removing the photoresist film between the substrates, if the position of the blade edge is adjusted, The material is in front of the integrated film before peeling the surface film 4. The cutting edge position adjustment material will not stick to the photoresist film 3, and a slit can be smoothly formed from the surface film 4. At this time, a slit Some parts can be provided with tape in the width direction. After the cut surface film is connected and peeled off, the surface film 4 cut in the width direction can be continuously peeled even though a slit is formed .. The first and second embodiments described above can also be borrowed. The form described is given by Binsch. 1. Riding nicks for tearing can also be formed from the bottom film side. 2. A similar film posting device is set under the removal path, and the film body is placed on both sides of the substrate (light (Resistive film) is also feasible. 3. When a slit is provided on the photoresist film by a rotary cutter head, not only the cutting direction that makes the moving speed in the width direction consistent with the rotating peripheral speed, but also the moving speed that can be used It is different from the rotation speed or the rotary cutter disc stops rotating and only moves in the width direction to set a slit for the photoresist film. 4. When stopping the transport of the integrated film F and performing operations such as forming a riding slit for tearing At this time, in order to perform continuous posting work without stopping the substrate transfer, it is necessary to prepare to complete the inter-substrate processing between the direction changing roller and the crimping roller, in other words, to complete the photoresist at 2 to 4 places Film removal And the length adjustment area of the integrated film F that forms the nicks for tearing (please read the precautions on the back before filling this page)
、1T 經濟部智慧財產场員工消費合作社印製 本紙張尺度適用中國國家標準（CNS ) Α4規格（210Χ297公釐） -14 - 524748 A7 _B7 _ 五、發明説明（12) 5.爲能不停止一體化薄膜F和基片之搬送而形成撕開用 騎縫刻痕俾進行對基片之連續張貼操作，將騎縫刻痕 形成手段，和光阻薄膜切縫形成手段，光阻薄膜去除 手段，然後是底薄膜去除手段等配合基片之搬送使其 作往復運動進行該等手段所需之動作。 如上所說明，按本薄膜張貼方法時，在不會產生氣泡 和皺紋之情形下，可將薄膜本體張貼在基片上，更且，在 不損傷基片之情形下，可對各薄膜設切縫，並確實完成基 片相互間之分離者。 繼之，再就本發明之第三之實施形態，佐以所附第6 與了圖說明如次。 第6圖係將本發明方法予以具體化之薄膜張貼裝置 1 0 0之俯視圖，而第7圖爲於第6圖中所示薄膜張貼裝 置1 0 0之側面槪略視圖。 於兩圖中，F表不乾薄膜（一體化薄膜），係按底薄 膜1 0 2、光阻薄膜（薄膜本體）103及面薄膜104 之順序具3層構成。乾薄膜F之寬度尺寸係與後述之晶圓 W f的直徑的略相同或稍大。 1 0 1，爲放出乾薄膜F用之薄膜卷。 乾薄膜F之面薄膜1 〇 4，於經剝離輥1 〇 5處被剝 離，爾後，藉捲取輥1 0 6回收。由於剝離面薄膜1 〇 4 ，使光阻薄膜1 0 3外露。於第6圖中，乾薄膜F係使其 底薄膜1 0 2面向圖中之上側者。 C 1表示切縫形成裝置。該裝置C 1，位於乾薄膜之 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公董） (請先閲讀背面之注意事項再填寫本頁) 訂 經濟部智慧財產局員工消費合作社印製 -15- 524748 A7 __B7 五、發明説明（13) (請先閲讀背面之注意事項再填寫本頁} 光阻薄膜1 0 3側處，並具有藉由馬達1 0 7呈圓形旋轉 之臂桿1 0 8及可在其前端部旋轉方式設置之盤狀刀具 1 0 9及位於底薄膜1 0 2側處之承載台1 1 〇。盤狀刀 具1 0 9係藉臂桿1 0 8之旋轉用來對光阻薄膜1 〇 3形 成深達底薄膜1 0 2之圓形切縫者。於是，圓形成裝置C 1類以之構成，惟其中尙有若干不同之處，故包含其相異 點再加以說明之如下。 該裝置C 3，係位於乾薄膜F之光阻薄膜1 〇、,.3側處 ，具有可藉馬達1 2 0呈圓形旋轉之臂桿1 2 1，和在其 前端部以可自由旋轉之方式所設狀如縫紉用鏤刻齒輪或馬 鞋後跟所裝刺馬釘之騎縫刻痕鏤刻齒輪1 2 2以及位於底 薄膜1 0 2側處之承載台1 2 3。 騎縫刻痕鏤刻齒輪1 2 2，係藉臂桿1 2 1之旋轉， 從光阻薄膜1 0 3側對底薄膜1 0 2形成圓形狀之騎縫刻 痕。該騎縫刻痕之宜徑d 2雖較形成於光阻薄膜1 0 3之 切縫直徑d 1稍大，惟較將於後述之晶圓W f之直徑d 3 稍小者。 經濟部智慧財產局員工消费合作社印製 由是，騎縫刻痕之輪廓，即較大於在光阻薄膜1 0 3 上藉切切縫內側之光阻薄膜（薄膜本體）1 〇 3成爲欲予 張貼之部分，而圓形切縫外側即成爲不需要之剩餘部分。 1 1 1爲視必要可適當設置之直線刀具，係朝寬度方 向將光阻薄膜1 0 3予以切斷者。設置直線刀具1 1 1之 必要性，將容後述。 C 2，剩餘光阻薄膜剝離裝置。該裝置C 2具備膠帶 -16- 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） 524748 A7 B7 五、發明説明（14) 115之放出輥116與剩餘光阻薄膜之剝離輥117以 及剩餘光阻薄膜之回收輥1 1 8。 剩餘光阻薄膜裝置C 2係就經藉直線刀具1 1 1朝寬 度方向切斷之光阻薄膜1 0 3，對其藉盤狀刀具1 〇 9所 形成圓形切縫外側之剩餘光阻薄膜1 0 3進行剝離。 C 3，爲騎縫刻痕形成裝置。該裝置C 3，雖具與切 縫形縫刀具1 〇 9所形成之切縫輪廓，惟較晶圓W f之輪 廓爲小。 、二 第8圖例示適用於本發明之實施例的騎縫刻痕鏤刻齒 輪及切縫刀具。 第8圖中所示者（a )爲壓切型之騎縫刻痕鏤刻齒輪 1 2 2 A、（ b )爲旋轉型之騎縫刻痕鏤刻齒輪1 2 2 B ，（c)爲旋轉型切縫刀具109之透視圖。 C 4，爲薄膜張貼裝置。1 2 5表示晶圓W f之吸附 承載台，且於第6圖中係沿導軌1 2 6作上下之移動。 薄膜張貼裝置C 4 :於張貼薄膜之際，藉由未圖示之 機械手臂等將晶圓W f放置於吸附承載台1 2 5上，藉真 空吸附等固定在所期望的位置後，將吸附承載台1 2 5移 動至光阻薄膜1 0 3下方。於底薄膜1 0 2上’設有如於 第6圖中可朝左右方向移動之加熱壓接輥1 2 7 ’并藉未 圖示之驅動手段使加熱壓接輥1 2 7 —面旋轉一面移動之 方式，在晶圓W f上主要張貼光阻薄膜1 0 3 °吸附承載 台1 2 5亦可內藏加熱器。、 1T Printed on the paper by the Consumers ’Cooperative of the Intellectual Property Field of the Ministry of Economic Affairs. The paper size is applicable to the Chinese National Standard (CNS) A4 specification (210 × 297 mm) -14-524748 A7 _B7 _ V. Description of the invention (12) The film F and the substrate are conveyed to form a tear. Riding seam nicks are used to carry out continuous post operation on the substrate. The formation method of the riding seam nicks, the slit forming method of the photoresist film, the photoresist film removal method, and then the bottom. The film removal means and the like are carried out in accordance with the substrate's conveyance to make it reciprocate to perform the actions required by these means. As described above, according to this film posting method, the film body can be posted on the substrate without generating bubbles and wrinkles, and the film can be slit without damaging the substrate. , And indeed complete the separation between the substrates. Then, the third embodiment of the present invention will be described below with reference to the attached sixth and the drawings. Fig. 6 is a plan view of a film sticking device 100 embodying the method of the present invention, and Fig. 7 is a schematic side view of the film sticking device 100 shown in Fig. 6. In the two figures, F indicates a non-drying film (integrated film), which has a three-layer structure in the order of the bottom film 102, the photoresist film (film body) 103, and the surface film 104. The width dimension of the dry film F is slightly the same as or slightly larger than the diameter of the wafer W f described later. 1 0 1 is a film roll for releasing the dry film F. The surface film 104 of the dry film F is peeled off at 105 by the peeling roller, and then recovered by the take-up roller 106. The photoresist film 103 was exposed due to the release surface film 104. In Fig. 6, the dry film F is such that its bottom film 102 faces the upper side in the figure. C 1 represents a slit formation device. The device C1, the paper size of the dry film is applicable to the Chinese National Standard (CNS) A4 specifications (210X297 public directors) (please read the precautions on the back before filling in this page) Order printed by the Intellectual Property Bureau of the Ministry of Economic Affairs and the Consumer Cooperative -15- 524748 A7 __B7 V. Description of the invention (13) (Please read the precautions on the back before filling out this page} Photoresist film 1 0 3 side, and an arm rotating circularly by the motor 10 7 1 0 8 and a disk-shaped cutter 1 0 9 which can be rotated at its front end and a bearing table 1 1 0 located at the side of the bottom film 102. The disk-shaped cutter 1 0 9 is rotated by the arm 1 0 8 Those used to form the circular slits of the photoresist film 1 0 3 as deep as the bottom film 102. Therefore, the circle forming device C 1 is composed of the same, but there are some differences among them, so they include their differences. The explanation is as follows: The device C 3 is located on the photoresist film 1 0, .. 3 side of the dry film F, and has an arm 1 2 1 that can be rotated in a circle by the motor 1 2 0, and Its front end is set in a freely rotatable manner, such as a engraved gear for sewing or a horseback riding on a horseshoe. The notch engraved gear 1 2 2 and the bearing platform 1 2 3 at the side of the bottom film 102. The rider notch engraved gear 1 2 2 is rotated by the arm 1 2 1 from the photoresist film 1 0 3 side The bottom film 1 0 2 forms a circular riding slit. Although the appropriate diameter d 2 of the riding slit is larger than the slit diameter d 1 formed on the photoresist film 103, it is larger than the wafer to be described later. The diameter d 3 of W f is slightly smaller. It is printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. The outline of the notch is larger than that of the photoresist film (film) on the inside of the photoresist film by cutting the slit. The main body) 1 〇3 becomes the part to be posted, and the outside of the circular slit becomes the remaining part that is not needed. 1 1 1 is a linear cutter that can be appropriately set if necessary, and the photoresist film is 1 3 in the width direction. Those who cut it. The necessity of installing a linear cutter 1 1 1 will be described later. C 2. Residual photoresist film peeling device. The device C 2 is equipped with tape -16- This paper size applies Chinese National Standard (CNS) A4 specifications. (210X297 mm) 524748 A7 B7 V. Description of the invention (14) The release roller 116 of the 115 and the remaining light The resist film peeling roller 117 and the remaining photoresist film recovery roller 1 1 8. The remaining photoresist film device C 2 is a photoresist film 1 0 3 cut in the width direction by a linear cutter 1 1 1 The remaining photoresist film 10 on the outer side of the circular slit formed by the disc-shaped cutter 1 009 is peeled off. C 3 is a device for forming a notch in the riding seam. The device C 3, although having the same shape as the slit-shaped cutter 1 009 The formed slit profile is smaller than the profile of the wafer W f. Fig. 8 illustrates a saddle scoring gear and a cutting tool suitable for the embodiment of the present invention. The one shown in Figure 8 (a) is a press-cut type scoring engraving gear 1 2 2 A, (b) is a rotary type scoring scoring gear 1 2 2 B, and (c) is a rotary sipe Perspective view of the cutter 109. C 4 is a film posting device. 1 2 5 represents the suction stage of the wafer W f, and it moves up and down along the guide rail 1 2 6 in FIG. 6. Film sticking device C 4: At the time of film sticking, the wafer W f is placed on the suction stage 1 2 5 by a robot arm or the like not shown, and fixed to a desired position by vacuum suction or the like, and then the suction is performed. The stage 1 2 5 moves below the photoresist film 103. On the bottom film 10, 'the heating and crimping roller 1 2 7' which can be moved in the left-right direction as shown in FIG. 6 is provided, and the heating and crimping roller 1 2 7 is rotated by the driving means (not shown). In this way, a photoresist film 103 on the wafer W f is mainly attached to the suction stage 1 2 5 and a heater may be built in.
C 5，爲底薄膜切斷裝置。1 3 0係設置在乾薄膜F 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） _ · (請先閱讀背面之注意事項再填寫本頁)C 5, is the bottom film cutting device. 1 3 0 is set on dry film F. The paper size is applicable to Chinese National Standard (CNS) A4 (210X297 mm) _ · (Please read the precautions on the back before filling this page)
、1T 經濟部智慧財產：1ΪΓ8工消費合作社印製 524748 A7 B7 五、發明説明（15) 之上游側的底薄膜1 0 2保持輥，可上下移動而將底薄膜 1 0 2從其上下方向夾住。1 3 1爲晶圓Wf之承載台， 可沿導軌1 3 2朝第6圖之上下方向移動。當該承載台 1 3 1移動並位於晶圓Wf之下方處時，底薄膜1 0 2上 之薄膜壓件1 3 3下降，在其與承載台1 3 1之間夾住晶 圓Wf及底薄膜1 0 2。 1 3 4爲底薄膜1 0 2切斷輥，如於第7圖所示，可 將底薄膜1 0 2從下方頂往上方如圖中以虛線所示.然。 1 3 5爲當切斷輥1 3 4往上方移動時與之連動而朝第7 圖中之右方移動，俾調整底薄膜1 0 2之張力用的調整輥 。140爲底薄膜102之捲取輥。 於第6圖，第7圖由於紙面之關係將各裝置C 1 一 C 5之間隔適宜地表示者，惟基於提升作業效率之觀點各裝 置間之間隔，除剩餘光阻薄膜剝離裝置C 2之前後以外， 即，裝置Cl — C3間 '裝置C3 — C4間、裝置C4 一 C 5間之間隔均設爲相等，隨伴乾薄膜之移動，使各裝置 C 1 — C 5同時進行所期望之動作。 繼而，就薄膜張貼裝置1 〇 〇，以所期望之形狀將光 阻薄膜1 0 3張貼在晶圓W f上之動作，說明之如次。 從薄膜卷1 0 1放出之乾薄膜F，其寬度d 〇係較晶 圓Wf之直徑D3稍大或相同。 放出之乾薄膜F乃從兩圖之右往左作間歇性移動，以 剝離輥1 0 5將乾薄膜F之面薄膜1 〇 4剝取，露出光阻 薄膜1 0 3。於切縫形成裝置C 1處，對光阻薄膜1 〇 3 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） (請先閱讀背面之注意事項再填寫本頁) 訂 經濟部智慧財產局員工消費合作社印焚 -18- 524748 A7 _ _B7 五、發明説明（16) (請先閲讀背面之注意事項再填寫本頁) 藉臂桿1 0 8之轉動一周以盤狀刀具10 9形成如第6圖 中以虛線所示直徑d 1之圓形切縫。在形成該切縫期間’ 乾薄膜F將停止間歇性移動。 該切縫容許稍微切到底薄膜1 〇 2 ’但並非切斷全部 厚度，而是僅就光阻薄膜1 〇 3之全厚切斷即已足夠。由 於刀具1 0 9不觸及晶圓w f ’故不會損及刃鋒，無須擔 心刀具換新問題。另，也不必擔心光阻薄膜1 0 3和晶圓 W f變質之事。 靠隨後之間歇性移動’形成乾薄膜F之切縫的領域即 被搬送至騎縫刻痕形成裝置C 3處。於該移動進行之間於 剩餘光阻薄膜剝離裝置C 2 ’即將切縫外側之光阻薄膜 1 0 3藉膠帶1 1 5予以去除。當去除之際，爲防止切縫 內部之光阻薄膜1 0 3被倂除’於膠帶1 1 5張貼到切縫 外側光阻薄膜1 0 3先行之處所後，使剝離輥1 1 7稍許 下降，隨乾薄膜F之左行將切縫外側之光阻薄膜1 0 3剝 離，並以回收輥118之卷取。 經濟部智慧財產局員工消費合作社印製 於騎縫刻痕形成裝置C 3中，對露出之底薄膜1 0 2 藉騎縫刻痕鏤刻齒輪1 2 2形成與直徑d 1之切縫同芯而 如於第6圖中以虛線所示直徑d 2之騎縫刻痕。直徑d 2 較直徑d 1稍大。於形成該騎縫刻痕完結之間，設置晶圓 Wf於吸附承載台1 2 5之所期位置，並且藉導軌1 2 6 定位於隨乾薄膜F間歇移動而來之圓形光阻薄膜1 0 3之 下方。 當藉間歇運動使圓形之光阻薄膜1 0 3抵達在薄膜張 -19- 本紙張尺度適用中國國家標準（CNS )八4規格（210X297公釐） 524748 A7 B7 五、發明説明（17) (請先閲讀背面之注意事項再填寫本頁) 貼裝置C 4等待之晶圓w f上方位置時，加熱壓接輥 1 2 7即往左方移動，使圓形光阻薄膜1 〇 3熱壓接於晶 圓W f之上面。欲將加熱壓接輥1 2 7朝右方復原之際， 可再度施以熱壓接，使之更具確實性。於第6圖中，對應 於形成在乾薄膜F之切縫和騎縫刻痕，以一點鏈線表示晶 圓W f之輪廓。 當欲將圓形之光阻薄膜1 0 3張貼於晶圓W f之際， 由於光阻薄膜1 0 3周圍之底薄P 1 0 2係外露者：故作 爲壓接手段之吸附承載台1 2 5不會被沾污。且圓形光阻 薄膜1 0 3之周緣沒有保護帶，故於張貼時，亦不會產生 氣泡和皺紋。 於底薄膜切斷裝置C 5中之承載台1 3 1，則在藉後 續之間歇運動移動而來之晶圓W f下方等待。 經濟部智慧財產局員工消費合作社印製 乾薄膜F則以光阻薄膜1 0 3之黏接性保持晶圓W f 之狀態下，朝底薄膜切斷裝置C 5作間歇性移動。在此， 保持輥1 3 0將乾薄膜F之上游側從其上下夾住，直徑d 4之薄膜壓頭1 3 3下降，並與承載台1 3 1夾住騎縫刻 痕之內部的底薄膜1 0 2與晶圓W f。其後，切斷輥1 3 4上昇如第7圖所示，同時調整輥1 3 5朝右移動，並如 以虛線所示，藉抬高底薄膜1 〇 2之方法，使底薄膜1 〇 2從撕開用騎縫刻痕處切斷。 就是說，將使底薄膜1 0 2依照若薄膜壓頭1 3 3於 騎縫刻痕處藉衝壓床下料的輪廓形態，殘留於晶圓W f上 -20- 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） 524748 A7 B7 五、發明説明（18) (請先閱讀背面之注意事項再填寫本頁) 沿騎縫刻痕切斷底薄膜1 0 2後，切斷輥1 3 4下降 而調整輥1 3 5往左方移動，並對乾薄膜F賦與適宜之張 力。又，向上提昇薄膜壓頭133，而如於第6圖藉一點 鏈線所示，將呈圓形之同芯狀張貼有光阻薄膜1 〇 3和其 上的底薄膜1 0 2之晶圓W f藉承載台1 3 1由乾薄膜F 下方取出，並直接轉送至曝光工序等之次工序。於是，對 晶圓W f不須再作任何有關光阻薄膜1 〇 3和底薄膜 1 0 2之後續處理。另，吸附承載台1 2 5亦返回Μ以實 線所示之位置，準備對後續之晶圓實施薄膜之張貼。 切斷騎縫刻痕之內部而成爲無用之底薄膜1 0 2，隨 之藉捲取輥140回收。 經濟部智慧財產局員工消費合作社印製 至於前述之直線刀具1 1 1，乃於間歇性移動之停止 中藉將光阻薄膜1 0 3朝寬度方向切斷之舉，在剩餘光阻 薄膜剝離裝置C 2中對·每一片晶圓W f去除其切縫外側之 剩餘部分。遇到乾薄膜F之寬度d 0靠近騎縫刻痕之直徑 d 2至其極限之時候，從切縫至薄膜端部之長度微小，當 去除外側之剩餘部分時若在該部分撕破，去除工作即無法 順利完成，故將光阻薄膜1 0 3朝寬度方向切斷使其不受 過分的拉力，確實予以去除。 另，不拘泥於以上說明之實施形態，亦可按以下之形 態實施之。 於第6圖中，切縫形成用之盤狀刀具1 0 9和形成騎 縫刻痕用刀具1 2 2係分別藉臂桿1 0 8和1 2 1作一次 迴轉者，惟作成各臂桿之長度大於切縫和騎縫刻痕之直徑 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐) 〇1 - 524748 A7 __B7_ _ 五、發明説明（19) (請先閲讀背面之注意事項再填寫本頁) 、於圓周上之兩側配置各刀具，當臂桿迴轉一半時能形成 含蓋全周之切縫和騎縫刻痕者，或於直徑d 1、d 2之圓 筒端部設刃口之刀具亦屬可行也。 於上述實施形態中，因將晶圓W f作爲薄膜張貼之對 象物，故設於光阻薄膜1 0 3之切縫直徑d 1係作成小於 晶圓W f者，惟若非屬晶圓時，則形成與作爲薄膜張貼對 象物之基片相同輪廓之切縫者亦無妨。在此情形下，其乾 薄膜方面，則使用底薄膜寬度大於欲張貼薄膜之基.片主面 輪廓，且在該面全體設光阻薄膜者即可。 .又，雖然騎縫刻痕之直徑d 2大於切縫直徑d 1時較 容易形成，惟屬同一尺寸時亦無妨。 以熱板往垂直方向加壓，以替代加熱壓接輥1 2 7進 行熱壓接亦可。 於切縫形成裝置C 1和騎縫刻痕形成裝置C 2中當形 成切縫和騎縫刻痕之際，爲不使所產生之切屑粘附基片， 藉空氣流產手段將切屑排除亦屬可行。 經濟部智慧財產局8工消費合作社印災 以減壓用機殼包圍薄膜張貼裝置C 4，俾進行減壓張 貼亦屬可行之方法。 爲作晶圓W f之搬送處理，採用吸附承載台1 2 5和 承載台1 3 1，惟該等配件尙可藉適宜之手段代用。 從事自薄膜張貼裝置C 4至底薄膜切斷裝置C 5之晶 圓W f搬運，亦可利用具備吸附機能之機械手臂等進行之 。更詳細的說，準備能鑽進保持輥1 3 0之間並於薄膜張 貼裝置C 4和底薄膜切斷裝置C 5間來回，在其手的部分 本紙張尺度適用中國國家標準TcNS )八4規格（210X297公釐） 一 524748 A7 B7 五、發明説明（2〇) (請先閱讀背面之注意事項再填寫本頁) 具靜電吸附或吸引吸附手段之機械手臂，將在張貼裝置C 4中完成張貼薄膜之晶圓W f經介底薄膜1 0 2予以吸附 ，使之伴隨底薄膜1 0 2之間歇移動朝底薄膜切斷裝置C 5移動即可。 基片方面，屬於方形狀角型之基片亦可。這時候，刀 具1 0 9，1 2 2則使其作直線狀之移動。各刀具1 0 9 、1 2 2則準備並置在沿基片之各邊設切縫和騎縫刻痕之 位置的一對刀具，使其朝乾薄膜F之寬度方向和較義方向 分別作一次移動，俾按井字形形成切縫和騎縫刻痕時，當 能減少處理之時間。又，薄膜壓頭1 3 3亦可作成方形狀 角型者。至於基片並不侷限於半導體而屬印刷基板等任何 者亦屬可行。 (發明之效果） 如上所說明按照本實施形態時，即可不需頻繁地交換 切斷手段在基片之主面將粘接性薄膜以與該基片主面之輪 廓相同或稍小之大小張貼。 經濟部智慧財產局員工消費合作社印¾¾. 又，按本實施形態時可在不使薄膜和基片變質之情形 下於基片之主面張貼粘接性薄膜。 更按本實施形態時可在不須後處理工序之情形下於基 片之主面張貼粘接性薄膜。 (圖面之簡單說明） 第1圖爲具體實現本發明薄膜張貼方法所屬一實施形 ^氏張尺度適用中國國家標準（CNS ) A4規格（210X 297公釐） 7Γ 524748 A7 B7 五、發明説明（21) 態之薄膜張貼裝置槪略側視圖。 (請先閲讀背面之注意事項再填寫本頁) 第2圖係表示於第1圖之薄膜張貼裝置中之撕開用騎 縫刻痕形成手段之圖。 第3圖係表示於第1圖之薄膜張貼裝置中之光阻薄膜 切縫形成手段之圖。 第4圖係表示於第1圖之薄膜張貼裝置中之光阻薄膜 去除手段之圖。 第5圖係具體實現本發明薄皞張貼方法所屬第..2種實 施形態之薄膜張貼裝置槪略側視圖。 第6圖係具體實現本發明薄膜張貼方法所屬第3種實 施形態之薄膜張貼裝置槪略側視圖。 第7圖表示第6圖中薄膜張貼裝置之槪略側視圖。 第8圖係表示於第6圖之薄膜張貼裝置中所用騎縫刻 痕鏤刻齒輪及切縫用刀具之透視圖。 主要元件對照 / 1，101 薄膜卷 經濟部智慧財產局員工消費合作社印製 2.102 底薄膜 3.103 光阻薄膜（薄膜本體） 4.104 面薄膜 5 搬送滾筒 6 基片 7 撕開用騎縫刻痕形成手段 8 騎縫刻痕鏤刻齒輪 -24- 本紙張尺度適用中國國家標準（CNS ) A4規格（210 X297公釐） 524748 A7 B7 五、發明説明（22) 經濟部智慧財產局員工消费合作社印製 9,16,25 承載台 10,17 彈簧 11,18 直線導軌 12 剝取輥 13 捲取輥 14 光阻薄膜切縫形成手段 15 旋轉刀盤 19 彈性材 20 光阻薄膜去除手段 2 1,30 膠帶 23 輥 24 缸筒 27 方向變換輥 28 壓接輥 29 底薄膜去除手段 105 剝離輥 / 106 、 140 捲取輥 107,120 馬達 108,121 臂桿 109 盤狀刀具 110,123 承載台 111 直線刀具 115 膠帶 1 16 放出輥 (請先閱讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） -25- 524748 A7 B7 五、發明説明（23) 經濟部智慧財產局員工消費合作社印製 1 17 剩餘光阻薄膜剝離輥 118 剩餘光阻薄膜回收輥 122 騎縫刻痕刀具 125 吸附承載台 126,132 導軌 127 加熱壓接輥 130 保持輥 13 1 晶圓承載台 133 薄膜壓頭 134 切斷輥 135 調整輥 C1 切縫形成裝置 C2 剩餘光阻薄膜剝離裝置 C3 騎縫刻痕形成裝置 C4 薄膜張貼裝置 C5 底薄膜切斷裝置 (請先閲讀背面之注意事項再填寫本頁) 本紙浪尺度適用中國國家標準（CNS ) A4規格（210X297公釐） -26-1T Intellectual Property of the Ministry of Economic Affairs: Printed by 1Ϊ8 Industrial and Consumer Cooperatives 524748 A7 B7 V. Description of the Invention (15) The bottom film 1 0 2 holding roller can be moved up and down to clamp the bottom film 1 2 from its up and down direction live. 1 3 1 is a stage for wafer Wf, which can be moved up and down along the guide rail 1 3 2 in FIG. 6. When the stage 1 3 1 moves and is located below the wafer Wf, the film pressing member 1 3 3 on the bottom film 10 2 descends, and sandwiches the wafer Wf and the bottom between the stage 13 and the stage 1 31. Film 1 0 2. 1 3 4 is the bottom film 102 cutting roller. As shown in Fig. 7, the bottom film 102 can be moved from the bottom to the top as shown by the dotted line in the figure. 1 3 5 is the cutting roller 1 3 4 which moves in the same direction as the cutting roller 1 4 and moves to the right in FIG. 7. 俾 An adjustment roller for adjusting the tension of the bottom film 10 2. 140 is a take-up roll of the base film 102. In FIG. 6 and FIG. 7, due to the relationship of the paper surface, the intervals between the devices C 1 to C 5 are appropriately represented. However, the interval between the devices is based on the viewpoint of improving the work efficiency, except for the remaining photoresist film peeling device C 2. Except before and after, that is, the intervals between the devices C1-C3 ', the devices C3-C4, and the devices C4-C5 are set to be equal. With the movement of the dry film, the devices C1-C5 are simultaneously performed as desired. action. Next, the operation of attaching the photoresist film 103 to the wafer W f in a desired shape with respect to the film attaching device 100 is described as follows. The width D0 of the dry film F released from the film roll 101 is slightly larger or the same as the diameter D3 of the wafer circle Wf. The released dry film F is intermittently moved from the right to the left of the two figures, and the top film 104 of the dry film F is peeled off with a peeling roller 105 to expose the photoresist film 103. At the slit forming device C1, for the photoresist film 1 〇 This paper size applies the Chinese National Standard (CNS) A4 specification (210X297 mm) (Please read the precautions on the back before filling this page) Order the wisdom of the Ministry of Economic Affairs Property Bureau employee consumer cooperatives India 18-18 524748 A7 _ _B7 V. Description of the invention (16) (Please read the precautions on the back before filling out this page) Borrowed from the rotation of the arm 1 0 8 for a week to form a disc cutter 10 9 A circular slit with a diameter d 1 as shown by the dotted line in FIG. 6. During the formation of this slit, the dry film F will stop moving intermittently. This slit allows a slight cut to the bottom film 102 'but not the entire thickness, but it is sufficient to cut only the full thickness of the photoresist film 103. Since the tool 10 does not touch the wafer w f ′, it does not damage the cutting edge, so there is no need to worry about the problem of tool replacement. In addition, there is no need to worry about the deterioration of the photoresist film 103 and the wafer W f. The area where the slits of the dry film F are formed by the subsequent intermittent movement 'is transported to the riding slit formation device C3. During the movement, the remaining photoresist film peeling device C 2 ′ is to remove the photoresist film 1 0 3 outside the slit by the adhesive tape 1 1 5. When removing, in order to prevent the photoresist film 1 0 3 inside the slit from being wiped off, put it on the adhesive tape 1 1 5 and place it on the outside of the slit 1 before the photoresist film 1 0 3, then lower the peeling roller 1 1 7 slightly. With the left line of the dry film F, the photoresist film 103 on the outside of the slit is peeled off and taken up by the recovery roller 118. The Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs printed the riding seam scoring device C 3 and formed the same core with the d1 diameter of the exposed bottom film 1 2 by the riding seam scoring gear 1 2 2 Riding nicks of diameter d 2 shown by dotted lines in FIG. 6. The diameter d 2 is slightly larger than the diameter d 1. Between the formation of the riding slit, the wafer Wf is set at the desired position of the suction stage 1 2 5 and is positioned on the circular photoresist film 1 0 by the intermittent movement of the dry film F by the guide rail 1 2 6. 3 below. When the circular photoresist film 1 0 3 arrives at the film sheet by intermittent motion -19- This paper size applies the Chinese National Standard (CNS) 8 4 specifications (210X297 mm) 524748 A7 B7 V. Description of the invention (17) ( Please read the precautions on the back before filling this page.) When the wafer C is waiting for the device C4, the pressure roller 1 2 7 is moved to the left, so that the circular photoresist film 1 03 is thermally crimped. On the wafer W f. When you want to restore the heat and pressure roller 1 2 7 to the right, you can apply heat and pressure again to make it more reliable. In Fig. 6, the contour of the crystal circle W f is represented by a one-dot chain line corresponding to the cut and riding slits formed in the dry film F. When the circular photoresist film 1 0 3 is to be posted on the wafer W f, since the bottom of the photoresist film 1 0 3 around the thin P 1 0 2 is exposed: it is an adsorption carrier 1 as a crimping means. 2 5 will not be stained. In addition, there is no protective tape on the periphery of the circular photoresist film 103, so there will be no bubbles and wrinkles when it is posted. The supporting table 1 3 1 in the bottom film cutting device C 5 waits under the wafer W f which is moved by subsequent intermittent movements. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs, the dry film F is intermittently moved toward the bottom film cutting device C 5 while maintaining the wafer W f with the adhesiveness of the photoresist film 103. Here, the holding roller 1 3 0 clamps the upstream side of the dry film F from above and below, and the film indenter 1 3 3 with a diameter d 4 descends, and clamps the bottom film inside the nick of the saddle with the supporting table 1 3 1 1 0 2 and wafer W f. Thereafter, the cutting roller 1 3 4 rises as shown in FIG. 7, while the adjustment roller 1 35 moves to the right, and as shown by the dotted line, the bottom film 1 〇 is raised to make the bottom film 1 〇 2 Cut off from the nicks for tearing. That is to say, the bottom film 1 0 2 will be left on the wafer W f according to the contour shape of the film indenter 1 3 3 by the punching bed at the nick of the riding seam. -20- This paper applies the Chinese national standard (CNS ) A4 size (210X297mm) 524748 A7 B7 V. Description of the invention (18) (Please read the precautions on the back before filling in this page) Cut the bottom film 1 0 2 along the notch, and then cut the roller 1 3 4 The adjustment roller 1 3 5 is moved downward to the left, and a suitable tension is applied to the dry film F. In addition, the film indenter 133 is lifted up, and as shown in FIG. 6 by a little chain line, a wafer with a photoresist film 1 03 and a bottom film 10 2 thereon is placed in the same concentric shape. W f is taken out from under the dry film F by the stage 1 3 1 and is directly transferred to the next process such as the exposure process. Therefore, it is not necessary to perform any subsequent processing on the photoresist film 103 and the bottom film 102 on the wafer W f. In addition, the suction stage 1 2 5 also returns to the position indicated by the solid line in M, and is ready to post a thin film on the subsequent wafer. The inside of the nick of the riding seam is cut to become a useless bottom film 102, which is recovered by the take-up roll 140. The Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs printed the above-mentioned linear cutter 1 1 1 by cutting the photoresist film 103 in the width direction during the stop of intermittent movement, and stripping the remaining photoresist film In C 2, each wafer W f has the remainder outside the slit. When the width d 0 of the dry film F is close to the diameter d 2 of the notch of the riding seam to its limit, the length from the slit to the end of the film is small. If the remaining part on the outer side is torn, the removal work That is, it cannot be completed successfully, so the photoresist film 103 is cut in the width direction so as not to be excessively pulled, and is indeed removed. It should be noted that the present invention is not limited to the embodiments described above, and may be implemented in the following forms. In Fig. 6, the disc-shaped cutter 1 0 9 for forming a slit and the cutter 1 2 for forming a nick for a seam are respectively made by a boom 1 0 8 and 1 2 1 to make a turn. The length is larger than the diameter of the cut and riding nicks. The paper size applies to the Chinese National Standard (CNS) A4 (210X297 mm). 〇1-524748 A7 __B7_ _ V. Description of the invention (19) (Please read the precautions on the back first (Fill in this page). Each tool is arranged on both sides of the circumference. When the boom is turned halfway, it can form cuts and scoring marks covering the entire circumference, or at the end of the cylinder with diameters d 1 and d 2. Cutting tools are also available. In the above-mentioned embodiment, since the wafer W f is used as an object for film attachment, the slit diameter d 1 provided in the photoresist film 103 is made smaller than the wafer W f, but if it is not a wafer, It is also possible to form a slit having the same contour as that of the substrate to be applied to the film. In this case, as for the dry film, the width of the bottom film is larger than the outline of the main surface of the substrate to be pasted, and a photoresist film is provided on the entire surface. Also, although the diameter d 2 of the nick of the riding seam is easier to form when it is larger than the diameter d 1 of the slit, it is not a problem if it is the same size. Press the hot plate in the vertical direction instead of the heat crimping roller 1 2 7 for hot crimping. In order to prevent the generated chips from adhering to the substrate when the slits and the riding seam notches are formed in the slit forming device C 1 and the riding seam notch forming device C 2, it is also feasible to exclude the chips by air abortion. The Ministry of Economic Affairs, Intellectual Property Bureau, 8th Industrial Cooperative Cooperative, printed the disaster. It is also a feasible method to surround the film posting device C 4 with a decompression casing, and carry out decompression. For the wafer W f transfer processing, the suction stage 1 2 5 and the stage 1 3 1 are used, but these accessories may be substituted by appropriate means. The wafer W f can be transported from the film sticking device C 4 to the bottom film cutting device C 5. It can also be carried out using a robot arm with an adsorption function. In more detail, it is planned to be able to drill between the holding rollers 130 and back and forth between the film sticking device C 4 and the bottom film cutting device C 5. In the part of the hand, the paper standard applies the Chinese national standard TcNS) 8 4 Specifications (210X297 mm) One 524748 A7 B7 V. Description of the invention (20) (Please read the precautions on the back before filling this page) A mechanical arm with electrostatic adsorption or suction adsorption means will be completed in the posting device C 4 The wafer W f on which the film is pasted is adsorbed through the bottom film 102, and can be moved toward the bottom film cutting device C 5 with the intermittent movement of the bottom film 102. As for the substrate, a rectangular substrate having a square shape may be used. At this time, the tools 10 9 and 1 2 2 make them move linearly. Each of the cutters 10 9 and 1 2 prepares a pair of cutters juxtaposed at the positions where the slits and riding slits are set along the sides of the substrate, so that they are moved once in the width direction and the more sense direction of the dry film F. When the cut seam and riding seam nicks are formed according to the square shape, the processing time can be reduced. Further, the film indenter 1 3 3 may be formed into a square shape and an angular shape. It is also possible that the substrate is not limited to a semiconductor but is a printed substrate. (Effects of the Invention) As described above, according to this embodiment, the adhesive film can be placed on the main surface of the substrate with the same size or a smaller size than the outline of the main surface of the substrate without frequent exchange of cutting means. . Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. In addition, according to this embodiment, an adhesive film can be placed on the main surface of the substrate without deteriorating the film and the substrate. According to this embodiment, an adhesive film can be placed on the main surface of the substrate without the need for a post-treatment process. (Simplified description of the drawing) Figure 1 is an embodiment of the method for realizing the film posting method according to the present invention. The dimensional scale is applicable to the Chinese National Standard (CNS) A4 specification (210X 297 mm) 7Γ 524748 A7 B7 21) The side view of the thin film posting device. (Please read the precautions on the reverse side before filling out this page.) Figure 2 is a diagram showing the method for forming the nicks for tearing in the film posting device of Figure 1. Fig. 3 is a view showing a slit forming method of the photoresist film in the film sticking device of Fig. 1. Fig. 4 is a view showing a photoresist film removing means in the film sticking device of Fig. 1; Fig. 5 is a schematic side view of a film sticking device for implementing the thin film sticking method of the present invention, which belongs to the second embodiment. Fig. 6 is a schematic side view of a film sticking device which implements the third embodiment of the film sticking method according to the present invention. Fig. 7 shows a schematic side view of the film sticking device of Fig. 6. Fig. 8 is a perspective view showing a saddle scoring gear and a cutting tool used in the film posting device of Fig. 6; Comparison of main components / 1,101 Film roll Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 2.102 Bottom film 3.103 Photoresistive film (film body) 4.104 Surface film 5 Transport roller 6 Substrate 7 Rip seam nick formation method 8 Ride seam Scoring and engraving gear-24- This paper size applies to Chinese National Standard (CNS) A4 specification (210 X297 mm) 524748 A7 B7 V. Description of invention (22) Printed by the Consumer Cooperative of Intellectual Property Bureau of the Ministry of Economic Affairs 9,16,25 Carrying table 10, 17 Spring 11, 18 Linear guide 12 Stripping roller 13 Winding roller 14 Photoresist film slit forming means 15 Rotary cutter head 19 Elastic material 20 Photoresist film removing means 2 1,30 Tape 23 Roller 24 Cylinder 27 Direction changing roller 28 Crimping roller 29 Bottom film removing means 105 Peeling roller / 106, 140 Winding roller 107, 120 Motor 108, 121 Arm 109 Disk cutter 110, 123 Bearing table 111 Linear cutter 115 Tape 1 16 Release roller (please read the back Please fill in this page for the matters needing attention) This paper size is applicable to China National Standard (CNS) A4 specification (210X297mm) -25- 524748 A7 B7 V. Invention Description (23) Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 1 17 Residual photoresist film peeling roller 118 Residual photoresist film recovery roller 122 Riding scoring cutter 125 Adsorption carrier 126, 132 Guide rail 127 Heating and crimping roller 130 Holding roller 13 1 Wafer stage 133 Film indenter 134 Cutting roller 135 Adjustment roller C1 Slit formation device C2 Residual photoresist film peeling device C3 Riding slit formation device C4 Film placement device C5 Bottom film cutting device (Please read the note on the back first Please fill in this page for more details.) This paper applies the Chinese National Standard (CNS) A4 specification (210X297 mm) -26-