KR20020025009A - A film adherence method - Google Patents

Abstract

PURPOSE: A film sticking method is to surely separate substrates from each other by sticking films on the substrates without causing bubbles and wrinkles and provide cutouts in the films without impairing the substrates. CONSTITUTION: A plurality of substrates are fed on a transfer route at specified intervals, an integrated film is delivered from a film roll formed by winding as the integrated film of a three-layer structure by installing base films and cover films on each sides of film bodies to be stuck on the substrates, the cover films are separated and fed with the film bodies facing the substrate side, and the film bodies together with the base films are stuck on the surfaces of the substrates by a pressing roll. The portions of the film bodies corresponding to the areas between the plurality of fed substrates and portions corresponding to the areas where the sticking of the substrates with the film bodies is not desired are removed in lateral direction crossing the feeding direction, and the film bodies together with the base films are stuck on the surfaces of the substrates by the pressing roll.

Description

Film Attachment Method {A FILM ADHERENCE METHOD}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a film attaching method, and more particularly to a method of attaching a film such as a resist film to a surface of a substrate such as a semiconductor substrate, a printed wiring board, a glass substrate of an LCD or a PDP.

In such a conventional method, a film body (hereinafter referred to as a resist film) to be attached as a film (hereinafter referred to as a resist film) and a cover film having a three-layer structure (hereinafter abbreviated as an integrated film) are used as a film. Each board | substrate which peels a cover film from the unified film pulled out from a film roll using the film roll wound so that a film may roll to the outer periphery side and a cover film inner periphery side, and each board | substrate which is conveyed on a conveyance path at a predetermined | prescribed fixed interval. There is a single sheet method in which a two-layer resist film and a base film are cut in the width direction so that the resist film is on the substrate surface side and attached to each substrate through a pair of compression rollers.

In this single sheeting method, it is difficult to position the film leading edge in the substrate transport direction at the leading edge of the substrate, and it is easy to form bubbles at the time of alignment, and the rear edge of the film becomes a free end, so that the air bubbles enter easily for the end processing. There was a problem that the device configuration is complicated.

Therefore, the continuous method has been proposed as a simplification of the device configuration.

As the method, like peeling-off method, after peeling a cover film from the unified film pulled out from a film roll using a film roll, between a board | substrate of several boards which are conveyed on a conveyance path with a predetermined | prescribed fixed interval, and adhesion of a board | substrate and a resist film The resist film is placed on the surface of the substrate without cutting the base film after the inter-substrate treatment in which a protective tape is provided on the resist film at a portion corresponding to an undesired portion (hereinafter, referred to as an inter-substrate equivalent). A first continuous method (see Japanese Patent Application Laid-Open No. Hei 6-73343) or a film roll attached to each substrate through a pair of pressing rollers so that the protective tape is applied to the front and rear ends of each substrate being conveyed. The board | substrate of the several board | substrate which is conveyed with a predetermined | prescribed fixed interval on the conveyance path about the integrated film which came out Cover film is cut at two lengths in front and back in the width direction to the length corresponding to the corresponding part, leaving the cover film between the parts between the substrates, and the cover film of the part where the resist film is to be attached to the substrate (hereinafter referred to as the substrate equivalent part). After the substrate-to-substrate treatment for peeling off the resist, the resist film is placed on the substrate surface side, that is, the remaining cover film is spread over the front and rear ends of each substrate being conveyed, and the resist is applied to each substrate through a pair of pressing rollers. And a second continuous method for attaching a film (see Japanese Patent Application Laid-Open No. 9-174797).

In the continuous method in the prior art, a substantial portion of the substrate is composed of two layers of a base film and a resist film, and a substantial portion between substrates is composed of three layers of a base film, a resist film, a protective tape or a cover film. Because of the step difference, minute bubbles easily enter between the substrate and the resist film of the substantial portion of the substrate near the boundary.

When the protective tape is provided, the protective tape is applied to the resist film by applying a tensile force to the protective tape, so that the protective tape shrinks after the adhesion and wrinkles occur in the resist film. Such bubbles and wrinkles are unsuitable for the exposure treatment.

In the continuous method in the prior art, after attaching the resist film, each substrate is formed of a type connected by a protective tape or a cover film of a substantial portion between the base film, the resist film and the substrate. You must do it.

A reliable separation method is to cut the base film, the resist film, and the cover film on the resist film between the substrates by a cutter in the conveyance path of the substrate. According to this separation method, these cut edges of the film protrude from the edges of the substrate, so that the edges of the protruding film interfere with the case where the substrate is aligned for exposure or the like in a later step, so that the precise processing cannot be performed. there is a problem.

In order to prevent the film edge from protruding from the substrate edge, after the resist film is attached, a cut line is inserted across the resist film from the base film side in the width direction so as to reach a protective tape or a cover film at a substantial portion between the substrates. The three layers of the film, the resist film, the protective tape or the cover film may be peeled off in the width direction with an adhesive tape or the like to separate the substrates from each other. However, in this separation method, it is difficult to insert a cutting line from the base film side without damaging the substrate. If the cutting line is shallow because of fear of damage to the substrate, separation of the substrates becomes difficult.

If the substrate is roughly circular, such as a semiconductor substrate, it is difficult to attach the resist film inward from the peripheral edge of the substrate. In many cases, the substrate is cut with a cutter or a laser along the outer circumference of the substrate after the adhesion.

In the case of using a cutter, the blade has a short life because the blade is held on the substrate, and the blade needs to be changed frequently. In the case of cutting with a laser, the resist film of the cut portion is deteriorated or melted by the heat of the laser light, which may cause a problem in peeling of the base film.

It is therefore an object of the present invention to provide a film attachment method capable of attaching a film main body to a shape of a substrate without generating bubbles or wrinkles.

It is another object of the present invention to provide a film attaching method which can cut the substrates simply and reliably by providing a cutting line on each film without damaging the substrate.

In addition, another object of the present invention is to provide a film attachment method that can easily peel the base film in a later step.

A feature of the present invention which achieves the above object is that the base film and the cover film are provided on each side of the film main body, and the unified film is released from the film roll wound around the unified film having a three-layer structure, and the cover film is peeled off. In the film attaching method, the film main body is transported so that the film main body is on the substrate side, and the film main body is attached to the substrate by passing through the pressing means together with the substrate. Removing the film body corresponding to the portion to be contacted with the pressing means and the portion not desired to be contacted with the pressing means, exposing the base film at both portions, and then attaching the film body to the substrate surface by the pressing means. Is in.

1 is a schematic side view of a film attachment device embodying an embodiment of the film attachment method of the present invention;

FIG. 2 is a view showing needle hole line forming means in the film attaching device of FIG. 1; FIG.

3 is a view showing a resist cutting line forming means in the film attaching apparatus of FIG. 1;

4 is a view showing a resist removing means in the film attaching apparatus of FIG. 1;

5 is a schematic side view of a film attachment device embodying a second embodiment of the film attachment method of the present invention;

6 is a schematic top view of a film attachment device embodying a third embodiment of the film attachment method of the present invention;

7 is a schematic side view of the film attaching apparatus of FIG. 6;

FIG. 8 is a perspective view illustrating a needle hole line cutter and a cutting line cutter in the film applying device of FIG. 6. FIG.

According to this invention, a film main body can be attached to a board | substrate, without foaming and wrinkles only in the desired part of a board | substrate at the time of crimping | bonding.

Hereinafter, the method of the present invention will be described based on one embodiment shown in FIGS. 1 to 4.

BRIEF DESCRIPTION OF THE DRAWINGS It is a schematic side view of the film sticking apparatus which implements one Embodiment of the method of this invention.

In Fig. 1, 1 is a film roll, which is composed of a base film 2, a resist film (film body) 3, and a cover film 4, and on each side of the resist film 3, a base film 2 ) And the cover film 4 are wound around the base film 2 so that the base film 2 is made to be the outer side by using the adhesive film of the resist film 3 as the integrated film F having a three-layer structure.

5 is a conveyance roller which comprises the accommodating path which conveys the several board | substrate 6 from the left side to the right side of a drawing at desired interval D. In FIG. The length (width dimension) of the direction orthogonal to the unwinding direction of the integrated film F or the conveyance direction of the board | substrate is the width | variety (the conveyance direction of the board | substrate 6) of the board | substrate 6 with which the resist film 3 is affixed normally. It is slightly narrower than the length of orthogonal direction).

That is, the width dimension of the integrated film F is made into the width dimension of the part to which the resist film 3 is to be attached to the board | substrate 6. As shown in FIG.

The length slightly shorter with respect to the length L1 of the conveyance direction of each board | substrate 6 on the upper surface of each board | substrate 6 which conveys the integrated film F from the film roll 1, and conveys it with the desired space | interval D. It is a function of this apparatus to attach the resist film 3 adjusted with (L2).

7 is a means for forming a needle hole line in the unified film F taken out from the film roll 1. The needle hole line forming means 7 has a pair of needle holes moving in the width direction of the integrated film F with a distance L4 before and after in the unwinding direction (transfer direction) of the integrated film F. The line cutter 8 is provided.

Each needle hole cutter 8 is a roulette shape used for sewing, as shown in FIG. 2. The linear guide 11 guides the pressing force from above to the integrated film F on the pedestal 9. It adjusts suitably with the spring 10, and moves to the width direction A of the integrated film F, rotating. The pedestal 9 may be vacuum-adsorbed the integrated film F when forming the needle hole line. Moreover, if the space | interval S of the blade edge | tip of the cutter 8 is provided in the upper surface of the pedestal 9, the needle hole line can be formed reliably by the rotational movement of the cutter 8. As shown in FIG. That is, as the cutter 8 rotates and moves, the blade penetrates into the integrated film F in a dotted line shape, and a needle hole line is formed. This needle hole line is formed in the base film 2 from the cover film 4 via the resist film 3. This space S may be replaced with an elastic material capable of absorbing the cutting edge digging of the cutter 8.

12, as the peeling roller of the cover film 4, the cover film 4 peeled from the integrated film F is collect | recovered by the winding roll 13. As shown in FIG.

Reference numeral 14 denotes a resist cutting line forming means provided downstream of the peeling roller 12. This resist cutting line forming means 14 is provided with a pair of disk cutters 15 arrange | positioned with distance L5 before and after the conveyance direction of the integrated film F. As shown in FIG.

As shown in Fig. 3, the disc cutter 15 is provided with a continuous cutting line in the width direction on the resist film 3 by the rotational movement in the B direction, and the base film 2 is placed in the thickness direction (Fig. 3). It may be slightly cut in the vertical direction), but the pressing force is adjusted by the spring 17 by using the pedestal 16 and the linear guide 18 as guides so as not to make a cutting line over the entire thickness.

What is necessary is just to relieve reaction force to the integrated film F which peeled the cover film 4 by installing the elastic material 19 in the pedestal 16.

The distance L5 between the pair of disk cutters 15 corresponds to a portion (the interval D in FIG. 1 in length) corresponding to the substrates of the plurality of substrates 6 being conveyed, the substrate 6 and the resist film. (Film main body) The length of the sum of the lengths of the portions of the resist film 3 corresponding to the portions where the film body 3 is not desired to be attached is referred to as a substantial portion between substrates or a resist removing portion. The area | region of the space | interval D is corresponded to the part which does not want the contact of the crimping means (compression roller) and the resist film 3 demonstrated later.

The distance L5 between the pair of disk cutters 15 is set to be wider than the distance L4 of the needle hole cutter 8 (L5 > L4), and the pair of disc cutters 15 in the conveying direction of the integrated film F. Among the cutting lines formed by the disc cutter 15, there is a cutting line formed by each disc cutter 15 on the outer side of the needle hole line formed by the pair of needle hole line cutters 8.

Denoted at 20 is a resist removing means provided downstream of the resist cutting line forming means 14, and is formed by the adhesive tape 21 having the same width as the distance L5 between the pair of disk cutters 15. The resist film 3 is removed in the width direction by the width of L5).

The space | interval which removes the substantial part between board | substrates in the resist film 3 by the adhesive tape 21 is set to the length L2 which wants to attach the resist film 3 to the board | substrate 6, and this length L2 ), A cutting line and a needle hole line are formed in the integrated film F.

That is, the integration film F becomes the shape which alternately existed the area | region of length L2 and the area | region of length L5 which has the length L4 in the conveyance direction.

FIG. 4 shows the resist removing means 20. The pressure-sensitive adhesive tape 21 released from the roll (not shown) is wound on a roller 23 pressurized downward by a cylinder 24 to press the resist film 3 to the roller. By moving in the right direction of the drawing of (23), the adhesive tape 21 becomes a shape that is relatively released from the place of the rotating roller 23, so that the resist film 3 is attached to the adhesive tape 21 in order to have a length. A substantial portion of the resist film 3 between the substrates having a width of (L5) is peeled off in the width direction of the integrated film (F). Therefore, in this part, only the base film 2 is used.

25 is a pedestal provided below the integrated film F in order to ensure the adhesion of the adhesive tape 21 and the resist film 3 to it.

27 is a direction change roller of the integrated film F. As shown in FIG.

28 is a pair of pressing rollers installed above and below the accommodating passages constituted by the conveying rollers 5, while the substrate 6 and the integrated film F are moved to the right, and the integrated film ( It is a crimping means which heat-presses and attaches the resist film 3 of the board | substrate equivalency which has the length L2 in F). Rotation of the pressing roller 28 imparts tension to the unified film F released from the film roll 1. Alignment of the equivalent portions of the substrate in the substrate 6 and the resist film 3 is performed by looking at the output of the position sensor, not shown. However, since the technique is well known, the description thereof is omitted.

Numeral 29 denotes a base film removing means, and the base film 2 between the substrates is cut by the adhesive tape 30 having a width about the length L4 at the needle hole line to separate the substrates from each other.

Since the structure of the base film removing means 29 is the same as that of the resist removing means 20 shown in FIG. 4, description is abbreviate | omitted. In addition, 31 is a base for securing the pressing force at the time of attaching the adhesive tape 30 to the base film 2 of a substantial part between board | substrates.

When peeling the base film 2 of the substantial part between board | substrates with the adhesive tape 30, since the needle hole line is already formed, it is not necessary to provide a cutting line in the integrated film F at this time, but it is the adhesive tape 30 ) Is attached to the base film 2 of the substantial portion between the substrates and tensioned, so that the integrated film F can be easily cut at the place of the needle hole line. Accordingly, the substrate 6 is not damaged in the separation of the substrates. Moreover, since the integrated film F does not protrude from the edge part of the board | substrate 6, it does not interfere in a later process.

According to the method of the present invention, at the point just before the attachment of the substrate 6, the integrated film F is removed from the resist film 3 such as a substantial portion between the substrates, and the base film 2 is exposed. . Therefore, since the resist film 3 at the boundary between the substantial portion of the substrate and the substantial portion between the substrates has no step, no bubbles enter, and since no protective tape is used, no wrinkles are generated and no adverse effects are caused in the subsequent exposure processing. . In addition, the contact roller 28 does not become dirty even when the contact roller 28 is in contact with each other when passing between the compression rollers 28. Since the base film 2 or the resist film 3 is not cut after attaching the resist film 3 slightly inward from the circumferential edge of the substrate 6, the resist film 3 due to the life of the cutting blade or the heat is cut off. ), There is no need to worry about deterioration or melting.

In addition, according to the method of the present invention, the order of needle hole linearization, cover film peeling, formation of cutting lines to the resist film, and removal of a significant portion of the resist film between the substrates is not limited. F) The substantial part of the resist film 3 between board | substrates is removed, and the base film 2 of the removed part forms the needle-hole line for mutual separation of board | substrates.

The film sticking apparatus which embodies 2nd Embodiment which causes such a situation is shown in FIG.

In FIG. 5, the same code | symbol is attached | subjected to the thing equivalent to what is shown in FIGS.

In the film sticking apparatus of FIG. 5, the cover film 4 is continuously peeled off first. Subsequently, a cut line is formed in the width direction L5 in the resist film 3 with the disc cutter 14 in the width direction, and the adhesive film 21 in the resist removing means 20 corresponds to a substantial portion of the resist film 3 between the substrates. ).

The needle hole line is provided by the needle hole line cutter 8 in the base film 2 shown by the removal of the resist film 3. Since the following is the same as that of Fig. 1, the description is omitted.

In this embodiment, when the needle hole line is provided, the blade tip of the needle hole line cutter 8 does not contact the resist film 3, and the adhesive component of the resist film 3 is formed from the base film 2 from the formed needle hole line. Since it does not come out of the outside of the), the pedestal (9), the turning roller (27), the pressing roller (28) does not dirty.

In the case of forming a cutting line for a resist film for removing a substantial portion between substrates by adjusting the cutting edge position of the cutter, the cutting edge position adjusting material becomes a resist film when the cutting edge position adjusting material is brought into contact with the integrated film F before peeling off the cover film 4. (3) A cutting line can be provided smoothly from the top of the cover film 4, without sticking to it.

In this case, the part where the cutting line is installed may be continuously peeled off even if the cover film 4 is cut in the width direction by forming the cutting line when peeling the cover film after the adhesive tape is installed in the width direction and connected to the tape. Can be.

The above first and second embodiments can also be implemented in the following forms.

1. The needle hole line may be formed from the base film side.

2. A film attaching device of the same type may be provided below the accommodating path, and film bodies (resist films) may be attached to both sides of the substrate.

3. When the cutting line is installed on the resist film with disc cutter, not only the pressure cutting in which the movement speed and rotational circumferential match in the width direction, but also the movement speed and rotation circumferential speed are not different or do not rotate the disc cutter. The cutting line may be provided in the resist film by moving in the width direction.

4. In the case where the conveyance of the integrated film F is stopped and the needle hole line is formed, the inter-substrate processing is completed between the direction change roller and the compression roller, i.e., the portion is continuously attached without stopping the conveyance of the substrate. The length adjustment area | region of the integrated film F in which 2-4 pieces of the place where the resist film was removed and the needle hole line was provided is prepared.

5. Needle hole forming means, resist cutting line forming means, resist removing means, and base film in order to form a needle hole line or the like without stopping the conveyance of the integrated film F and the substrate to continuously attach to the substrate. The removal means and the like are reciprocated along with the transfer of the substrate to cause the required operations to be performed on these means.

As described above, according to the method for attaching the film, the film body can be attached to the substrate without bubbles or wrinkles, and a cut line is provided on each film without damaging the substrate to reliably separate the substrates from each other. can do.

Next, a third embodiment of the present invention will be described with reference to FIGS. 6 and 7.

FIG. 6 is a top view of the film attachment device 100 embodying the method of the present invention, and FIG. 7 is a schematic side view of the film attachment device 100 shown in FIG.

In both drawings, F is a dry film (integrated film) and has a three-layer structure in order of the base film 102, the resist film (film body) 103, and the cover film 104. The width dimension of the dry film F is approximately equal to or slightly larger than the diameter of the wafer Wf described later.

101 is a film roll for unwinding the dry film (F).

The cover film 104 of the dry film F is peeled off at the place through the peeling roller 105, and is collect | recovered by the reel roll 106 after that. The resist film 103 is exposed by peeling off the cover film 104. In FIG. 6, the base film 102 of the dry film F is upward in the drawing.

C1 is a cutting line forming unit. The unit C1 is located on the side of the resist film 103 of the dry film F, and the arm cutter 108 rotates in a circle by the motor 107, and the disc cutter 109 and the base which are rotated at the distal end thereof. The pedestal 110 is placed on the film 102 side. The disc cutter 109 forms a circular cut line on the resist film 103 that reaches the base film 102 by the rotation of the arm 108. It becomes a part to which the resist film (film main body) 103 inside of a circular cut line attaches, and the outer side of a circular cut line is an unnecessary excess part.

111 is a linear cutter suitably provided as needed, and the resist film 103 is cut | disconnected in the width direction. The need to install the straight cutter 111 will be described later.

C2 is an excess resist film peeling unit. This unit C2 has the release roll 116 of the adhesive tape 115, the peeling roller 117 of the excess resist film, and the recovery roll 118 of the excess resist film.

In the excess resist film peeling unit C2, the excess resist film 103 outside the circular cut line provided with the disc cutter 109 is peeled off with respect to the resist film 103 cut | disconnected in the width direction by the straight cutter 111. do.

C3 is a needle hole line forming unit. Since this unit C3 has a configuration similar to that of the cutting line forming unit C1, but slightly different, it will be described below including the differences.

The unit C3 is located on the side of the resist film 103 of the dry film F and is rotated in a circle by the motor 120, and a roulette or nose used in sewing installed to rotate at its tip portion. It has a needle hole cutter 122, such as a spur, attached to the hem of the boot, and a pedestal 123 positioned on the base film 102 side.

The needle hole line cutter 122 forms a circular needle hole line in the base film 102 from the resist film 103 side by rotating the arm 121. The diameter d2 of the needle hole is slightly larger than the diameter d1 of the cut line formed in the resist film 103, but is slightly smaller than the diameter d3 of the wafer Wf described later.

Therefore, the contour of the needle hole is larger than the contour of the cutter provided with the cutting line cutter 109 in the resist film 103 and smaller than the contour of the wafer Wf.

8 shows examples of a needle hole cutter and a cutting line cutter suitable for use in the embodiment of the present invention.

Fig. 8A is a perspective view showing a small needle-hole cutter 122A, Fig. 8B is a rotary needle-hole cutter 122B, and Fig. 8C is a rotary cutting-line cutter 109. to be.

C4 is a film attachment unit. 125 is an adsorption mount of the wafer Wf, and moves up and down the guide rail 126 in FIG.

In the film attaching unit C4, the wafer Wf is placed on the adsorption mount 125 by a robot hand or the like (not shown) at the time of attaching the film, and fixed to a desired position by vacuum suction or the like, and then down the resist film 103. The adsorption mount 125 is moved. On the base film 102, there is a heating compression roller 127 which moves in the left and right direction in FIG. 6, and the resist is placed on the main upper surface of the wafer Wf by moving while the heating compression roller 127 rotates by a driving means (not shown). The film 103 is attached. The suction mounting table 125 may incorporate a heater.

C5 is a base film cutting unit. 130 is a holding roll of the base film 102 provided on the upstream side of the dry film F, and moves up and down to sandwich the base film 102 from the up and down direction. 131 moves up and down the guide rail 132 as a pedestal of the wafer Wf. When the pedestal 131 is moved and positioned below the wafer Wf, the film press body 133 on the base film 102 is lowered to allow the wafer Wf and the base film 102 to be placed on the pedestal 131. It is supposed to be fitted.

134 is a cutting roll of the base film 102. As shown in FIG. 7, the base film 102 is lifted as indicated by the dotted line from the bottom to the top. 135 is an adjustment roll for adjusting the tension of the base film 102 to move to the right of Figure 7 in conjunction with the cutting roll 134 moves upward. 140 is a roll-up roll of the base film 102.

In FIG. 6 and FIG. 7, the intervals of the units C1 to C5 are appropriately shown for the convenience of the paper, but the intervals between the units are separately before and after the surplus resist film peeling unit C2 in terms of improving work efficiency. That is, each unit C1 to C5 performs the desired operation in parallel with the movement of the dry film, with the same interval between the units C1 to C3, between units C3 to C4, and between units C4 to C5. To do it.

Next, the operation of attaching the resist film 103 to the wafer Wf in a desired shape will be described.

The dry film F released from the film roll 101 is such that its width d0 is slightly larger than or equal to the diameter d3 of the wafer Wf.

The released dry film F moves intermittently from the right side to the left side of both drawings to peel off the cover film 104 of the dry film F with the peeling roller 105 to expose the resist film 103. An arm 108 is rounded around the resist film 103 at the cut line forming unit C1, and a circular cut line having a diameter d1 indicated by a dotted line in FIG. 6 is provided by the disc cutter 109. As shown in FIG. During this cutting line formation, the dry film F stops the intermittent movement.

Although this cutting line may cut | disconnect the base film 102 slightly, it is enough to cut | disconnect with respect to the full thickness of the resist film 103 instead of cutting over the whole thickness. Since the cutter 109 does not come into contact with the wafer Wf, it does not cause the blade to fall out, so that there is no fear of cutter replacement. In addition, there is no need to deteriorate the resist film 103 or the wafer Wf.

The region where the cut line of the dry film F is formed by the following intermittent movement goes to the place of the needle hole line forming unit C3. During this movement, the resist film 103 outside the cut line in the excess resist film peeling unit C2 is removed with the adhesive tape 115. When the adhesive tape 115 adheres to the preceding point of the resist film 103 outside the cut line so that the resist film 103 inside the cut line is not removed at the time of removal, the peeling roller 117 is lowered slightly to dry the film. In accordance with the left movement of (F), the resist film 103 outside the cut line is peeled off, and the recovery roll 118 is rolled up.

The needle hole line of diameter d2 indicated by the dotted line in FIG. 6 by the needle hole cutter 122 on the base film 102 exposed in the needle hole line forming unit C3 is concentric with the cutting line of the diameter d1. To form. The diameter d2 is slightly larger than the diameter d1. Until the formation of the needle hole line is completed, the wafer Wf is placed at a desired position of the suction mount table 125, and the circular resist film 103 in the dry film F is guided by the guide rail 126. Place it under the intermittent movement.

When the circular resist film 103 is positioned on the wafer Wf waiting in the film attaching unit C4 due to the intermittent movement, the heating compression roller 127 is moved to the left to move the circular resist film 103 to the wafer Wf. Heat-press on the upper surface of). When the hot pressing roller 127 is returned to the right side, it may be thermally pressed again to have certainty. In FIG. 6, the wafer Wf is shown by the dashed-dotted line with respect to the cutting line | wire and needle hole line | wire formed in the dry film F. In FIG.

When the circular resist film 103 is attached to the wafer Wf, the base film 102 around the resist film 103 is exposed, so that the adsorption mount 125 as the crimping means is not dirty. Since there is no protective tape on the circumferential edge of the circular resist film 103, bubbles or wrinkles do not occur in adhesion.

The pedestal 131 in the base film cutting unit C5 is waiting for the wafer Wf to move in a continuous intermittent movement.

The dry film F intermittently moves to the base film cutting unit C5 while maintaining the wafer Wf as the adhesiveness of the resist film 103. Here, the retaining roll 130 sandwiches the upstream side of the dry film F from up and down, and the film press body 133 of the diameter d4 descends, and the base film 102 and the wafer inside the needle hole line are moved to the pedestal 131. Insert (Wf). Thereafter, the cutting roll 134 is raised as shown in FIG. 7, and the adjustment roll 135 is moved to the right to lift the base film 102 as indicated by the dotted line, whereby the base film ( 102 is cut.

That is, the base film 102 is left on the wafer Wf in a form in which the film press body 133 is punched by a press in the place of the needle hole.

After cutting the base film 102 along the needle hole line, the cutting roll 134 is lowered and the adjustment roll 135 is moved to the left to apply an appropriate tension to the dry film (F). As shown in FIG. 6, the film pressing body 133 is raised to form a pedestal 131 with the wafer Wf having the resist film 103 and the base film 102 attached concentrically thereon. It removes from the bottom of the furnace dry film F, and returns to next process, such as an exposure process. Therefore, post-treatment of the resist film 103 or the base film 102 with respect to the wafer Wf is unnecessary. In addition, the adsorption mounting table 125 is also returned to the position indicated by the solid line to prepare the film for the next wafer.

The base film 102, which is not necessary by cutting the inside of the needle hole line, is collected in the take-up roll 140.

By cutting the resist film 103 in the width direction during the stop of the linear cutter 11 or intermittent movement, the excess portion outside the cut line is removed for each wafer Wf in the excess resist film peeling unit C2. can do. If the width d0 of the dry film F is close to the diameter d2 of the needle hole line, the length from the cut line to the end of the film is slightly removed at this portion during removal of the outer portion. Therefore, since the resist film 103 is cut in the width direction, removal is assured so as not to apply excessive tensile force.

Regardless of the embodiment described above, it may be implemented in the following form.

In Fig. 6, the disc cutter 109 for cutting line formation and the cutter hole forming cutter 122 are rotated by one arm 108 or 121, respectively, but each arm has a length equal to or greater than the diameter of the cutting line or needle hole line. Each cutter on both sides of the circumference to form a cutting line or a needle hole line for one week at the place where the arm is rotated halfway, or a blade at the end of the cylinder of diameters d1 and d2. You may use a cutter.

In the above embodiment, since the wafer Wf is a film attaching object, the diameter d1 of the cutting line provided on the resist film 103 is smaller than that of the wafer Wf. You may form a cutting line in the In this case, as the dry film, the width of the base film is larger than the outline of the main surface to which the film of the substrate is attached.

The diameter d2 of the needle hole line is easier to form than the diameter d1 of the cutting line, but may be the same size.

Instead of the hot pressing roller 127, it may be pressurized in a vertical direction with a hot plate for thermocompression bonding.

In the cutting line forming unit C1 or the needle hole forming unit C2, the cutting residues may be dropped by the air flow generating means so that the cutting residues generated at the time of forming the cutting lines or the needle hole lines are not attached to the substrate. good.

The film attachment unit C4 may be surrounded by a pressure reducing housing and subjected to pressure reduction bonding.

Although the adsorption mount 125 or the base 131 was used for the conveyance process of the wafer Wf, these can be substituted by a suitable means.

You may use the robot hand etc. which have a suction function for conveyance of the wafer Wf from the film attachment unit C4 to the base film cutting unit C5. That is, by scraping the space between the holding roll 130 and the reciprocating between the film attachment unit (C4) and the base film cutting unit (C5) to prepare a robot hand having an electrostatic adsorption or suction adsorption means in the hand portion attachment unit In (C4), the wafer Wf having finished film attachment may be adsorbed through the base film 102 and moved to the base film cutting unit C5 in accordance with the intermittent movement of the base film 102.

As a board | substrate, a square-shaped board | substrate may be sufficient. In that case, the cutters 109 and 122 move in a straight line. Each cutter 109, 122 prepares a pair of cutters juxtaposed at the position of the cutting line | wire or needle hole line | wire provided along each side of a board | substrate, and the width direction and the longitudinal direction of the dry film F are prepared. The treatment time can be reduced by moving each one time to form a cutting line or a needle hole line in a well shape. Moreover, what is necessary is just to make the film press body 133 square shape. The substrate is not limited to a semiconductor but may be any printed substrate or the like.

As described above, according to this embodiment, an adhesive film can be attached to the main surface of a board | substrate with the outline equivalent to or slightly smaller than the outline of the said board | substrate main surface, without changing cutting means frequently.

Moreover, according to this embodiment, an adhesive film can be attached to the main surface of a board | substrate without altering a film or a board | substrate.

Moreover, according to this embodiment, an adhesive film can be attached to the main surface of a board | substrate without requiring the process of a post-process.

Claims (9)

The base film and the cover film are provided on each side of the film main body, and the unified film is released from the film roll formed by winding the integrated film having a three-layer structure, and the cover film is peeled off so that the film main body is on the substrate side. In the film attaching method of passing a film main body to a board | substrate by passing between a crimping means with the board | substrate, After exposing the base film in both parts by removing the film body corresponding to the part which does not want the adhesion of the said board | substrate and a film main body, and the part which corresponds to the part which does not want to contact with the said crimping means, And attaching a film body to the surface of the substrate by the crimping means. The method of claim 1, The board | substrate is conveyed on a conveyance path with a desired space | interval, and the said width | variety of the width direction of the width direction orthogonal to the conveyance direction of each said board | substrate of the said integrated film is the said width | variety of the part which wants attachment of the film main body in each said board | substrate. The dimensions in the conveying direction of the film main body portions which are substantially coincident with the dimensions of the direction and are removed corresponding to the portions which do not want contact with the crimping means are substantially coincident with the desired dimensions of the respective substrates. How to attach film. The method of claim 1, After the needle hole line is formed in the width direction orthogonal to the conveyance direction of each said board | substrate in the site | part of the said base film which removes the film main body of the site | part corresponded to the part which does not want the contact with the said crimping means, the said crimping means And attaching a film main body to the surface of the substrate, and then cutting the base film along the needle hole line to separate each substrate. The method of claim 1, Removing the film body at the portion corresponding to the portion where the substrate and the film body are not desired to be attached and at the portion corresponding to the portion not to be contacted with the pressing means, peels off the cover film of the integrated film released from the film roll. The film sticking method characterized by the above-mentioned. The method of claim 3, wherein The needle hole line is provided while the cover film of the unified film released from the film roll is not peeled off, or the portion corresponding to the portion where the substrate and the film body are not attached, and the crimping means. The film sticking method characterized by performing after removing the film main body of the site | part corresponded to the part which does not want to contact. The method of claim 1, And the pressing means is a pair of pressing rolls. The method of claim 1, The integrated film has a width dimension that is greater than or equal to the outline of the substrate and is provided with a cut line reaching the base film from the film main body side with an outline equal to or slightly smaller than the outline of the substrate, Removing the film main body located outside, and attaching the film main body on the base film located inside the cutting line to the substrate. The method of claim 7, wherein After peeling the said film main body located in the outer side of the said cutting line, and providing the needle-hole line of the outline larger than the outline of the cutting line provided in the said film main body, and smaller than the outline of the one main surface of the said board | substrate, the said cutting Attaching the film body on the base film positioned inside the line to the substrate, cutting the base film along the needle hole line provided on the base film, and cutting the base film on the substrate inside the needle hole line. The film sticking method, characterized in that it remains attached. The method of claim 7, wherein The substrate is a circular substrate conveyed at appropriate intervals, wherein the film main body is a film of a resist which is peeled off from the film roll together with the base film and the cover film is peeled off. Heat-pressurizing with a lamination plate and performing under pressure.