JP2004175050A - Film sticking apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a film sticking apparatus which enables the accurate cutting of a film, also enables the removal of chips, and prevents the chips from being captured when a film body is stuck on a substrate. <P>SOLUTION: This film sticking apparatus for sticking the film body on a desired area of each of the substrates by using the stickiness of the film body is provided with: a film cutting means 6 which is equipped with a cutter 7 for cutting the film body in a part corresponding to a part between the substrates of the film body 2c of the film 2 paid out from a film roll 1 and a part corresponding to a part where the substrate is not desired to be stuck on the film body, in the width direction of the film body, by moving the film body in the width direction of the film body; a holding means 5 which is located on the other side of the cutter by locating the film in a central position, so as to make a base film 2b attached by suction when the film body is cut with the cutter in the width direction of the film body; and a suction means which is located in the rear of the movement of the cutter 7 with respect to the film body so as to move with the cutter 7. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a film sticking apparatus, and particularly has a base film and a film main body unwound from a film roll on each of a plurality of substrates conveyed on a conveyance path such as a printed wiring board or a glass substrate for a liquid crystal or PDP display panel. The present invention relates to a film sticking apparatus for sticking a film main body to a desired region of each substrate due to the adhesiveness of the film main body in a multilayer structure film.
[0002]
[Prior art]
Conventionally, film sticking of a film sticking device is called a film roll, a multi-layer film consisting of a base film, a film body and a cover film wound into a roll over several hundred meters is set in the device, the cover film is peeled off, and the cover is removed. After the film is collected on a take-up roll, the leading edge of the two-layer film consisting of the base film and the film body is manually held, and the film is routed into the apparatus via several guide rolls and the like. The film main body is cut in the width direction by a disc cutter or a razor blade or the like at an arbitrary position in the route being routed. In cutting the film body, the film is held by a suction plate, grooves are formed in the suction plate in advance, and the film is cut by a cutter passing between the grooves.
[0003]
If chips generated during the cutting of the film fall onto the film main body or the substrate, the chips are involved when the film main body is attached to the substrate, which causes a product defect in the downstream exposure and development process. Therefore, a suction mechanism is incorporated in a groove of the suction plate through which the cutter passes, and chips generated when cutting the film are suctioned out by the suction mechanism (see the following document).
[0004]
[Patent Document 1]
Japanese Patent Publication No. 7-51347 (all pages)
[0005]
[Problems to be solved by the invention]
In the above prior art, the film suction mechanism and the chip suction mechanism in the suction plate are connected to the same vacuum system from the suction plate via a suction pipe. Therefore, as the film adsorbed on the suction plate is cut with a disk cutter or the like, the suction tube is opened to the atmosphere at the chip suction mechanism, and both the film suction force and the chip suction force are released. As a result, the film cannot be held accurately because the film cannot be held, and the chips cannot be removed.
[0006]
Therefore, an object of the present invention is to reliably hold the film while cutting the film, to cut the film accurately, to remove chips, and to remove chips when attaching the film body to the substrate. An object of the present invention is to provide a film sticking device that does not get involved.
[0007]
[Means for Solving the Problems]
The feature of the present invention that achieves the above object is that the adhesiveness of the film main body in a multi-layer structure film having a base film and a film main body unwound from a film roll on each of a plurality of substrates conveyed on a conveying path. In a film sticking apparatus for sticking the film main body to a desired area of each substrate, the film main body of the multilayer structure film unwound from the film roll corresponds to a portion corresponding to a portion between the substrates in the film main body and a portion in which the bonding of the substrate and the film main body is not desired. A film cutting means having a cutter for moving and cutting the film main body in the width direction of the film main body; and Holding means for adsorbing the base film when cutting in the width direction; Located behind the movement with respect to the film body of data in the provision of the, and suction means for moving together with the cutter.
[0008]
In the apparatus of the present invention, since the film suction system and the chip suction system are separated from each other, even if the film sucked on the suction plate is cut by a disc cutter or the like, the film suction force and the chip Does not decrease.
[0009]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, the device of the present invention will be described based on one embodiment shown in FIGS.
FIG. 1 is a schematic (longitudinal) cross-sectional view of a main part of a film sticking apparatus according to an embodiment of the present invention, in which a conveying direction of a substrate and a film can be understood. FIG. 2 is a schematic (horizontal) cross-sectional view showing a resist film cutting unit in the film sticking apparatus of FIG. 1 and showing an operation direction of the resist film cutting unit.
[0010]
In both figures, reference numeral 1 denotes a film roll formed by winding a film 2. The film 2 has a cover film 2a and a base film 2b located inside and outside, and a resist film 2c is located therebetween. The resist film 2c is a film main body to be attached to a desired position on a substrate described later. The resist film 2c has adhesiveness, and the adhesiveness forms a multilayer structure with the cover film 2a and the base film 2b. Reference numeral 3 denotes a peeling roll of the cover film 2a, and the cover film 2a peeled off by the roll 3 is collected by a winding roll (not shown).
[0011]
Reference numeral 5 denotes a holding means (hereinafter, referred to as a suction plate) for sucking and holding the base film 2b, and reference numeral 6 denotes a film cutting means provided with a disk cutter 7. Cutting of the film will be described later in detail. Reference numeral 8 denotes a vacuum chamber, 9 denotes an outdoor transport roller which is located outside the vacuum chamber 8 and forms a transport path for sequentially transporting the substrate 10 to the vacuum chamber 8 at appropriate intervals, and 11 denotes a substrate 10 Is a chamber carrying roller for carrying the substrate 10 outside the room after the resist film 2c is attached to the substrate 10 by a pair of upper and lower pressure rollers 14 in the vacuum chamber 8, and 13 is a vacuum chamber. A tension roller for adjusting the length of the film 2 in the film 8, a film entrance 15 for carrying the film 2 into the vacuum chamber 8, and a substrate 16 for carrying the substrate 10 with the resist film 2 c stuck out of the vacuum chamber 8. It is a loading port.
[0012]
The film 2 is stripped of the cover film 3 by the cover film stripping roll 3 or the resist film 2c is partially cut and removed in the resist film cutting unit 6 to change its shape. If displayed, it may be confusing, so that it is generically referred to as film 2 even if the shape is changed.
[0013]
Reference numeral 17 denotes a resist film removing unit integrated with the resist film cutting unit 6 so that the film removing unit base 18 is moved in the width direction of the film 2 (the left and right direction in FIG. 2) by an actuator (not shown). Has become. 19 is an adhesive tape, 20 is an adhesive tape roll formed by winding the adhesive tape 19, 21 is an adhesive tape take-up roll for winding the adhesive tape 19, 22 is a resist film on the adhesive tape 19 wound around an adhesive tape pressing roller 23. The adhesive tape 19 peels off the resist film 2c from the base film 2b when the film removing unit base 18 moves.
[0014]
24 is a perforated cutter for forming a perforation on the base film 2b exposed by stripping the resist film 2c, 25 is a suction pipe for sucking and removing chips generated when the disk cutter 7 cuts the resist film 2c. Reference numeral 26 denotes a suction pipe for sucking and removing chips generated when the perforated cutter 24 forms perforations in the base film 2b.
[0015]
Hereinafter, the operation of the film sticking apparatus shown in FIG. 1 will be described.
The substrate 10 is transported at appropriate and desired intervals by the outdoor transport roller 9, and is transported by the indoor transport roller 12 to the heated pressure roll 14 in the vacuum chamber 8 through the substrate transport opening 11 which opens and closes one by one. . Before entering the vacuum chamber 8 through the film entrance 15, the cover film 2 is removed in advance by the cover film peeling roll 3 to form a two-layer structure of the base film 2 b and the resist film 2 c. The film 4 is partially cut in the thickness direction by the resist film cutting unit 6 and removed by the resist film removing unit 17. The portion of the base film 2b that has been partially cut and removed and exposed is sealed at the film entrance 15 to keep the vacuum chamber 8 airtight.
[0016]
The film carry-in port 15 has a structure in which a bag-shaped seal unit that expands flexibly by introducing compressed air is provided vertically, and a portion of the base film 2b exposed between the upper and lower bag-shaped seal units is sandwiched and sealed. Then, the compressed air is released to open the film carry-in port so that the film 2 can pass and be conveyed.
[0017]
The resist film 2c on the film 2 has a length that is desired to be stuck to a desired region of the substrate 10, and is the sum of the distance between the front and rear substrates and the length that the resist film 2c at each of the front and rear ends of the substrate 10 is not stuck. Cutting is performed by a pair of disk cutters 7 arranged in the transport direction.
[0018]
As shown in FIG. 2, when the film removing unit base 18 moves to the right, the disk cutter 7 cuts the resist film 2 c in the width direction, and then the cylinder 22 moves the adhesive tape 19 back and forth with the adhesive tape pressing roller 23. The adhesive tape 19 peels off the resist film 2c having the front and rear cuts from the film 2 by pressing the resist film 2c on the resist film 2c having the front cut and exposing the base film 2b.
[0019]
A perforation cutter 24 follows the adhesive tape pressing roller 23 to form a perforation on the exposed base film 2b. The perforation cutters 24 are provided in a pair in the transport direction of the film 2 similarly to the disk cutter 7, and form two rows of perforations in the width direction of the exposed base film 2b. At this time, the suction plate 5 sucks and holds the base film 2b. Chips generated when the disk cutter 7 cuts the resist film 2c and the perforated cutter 24 forms perforations in the base film 2b are the suction pipe 25 positioned immediately behind the disk cutter 7 and the perforated cutter 24, respectively. At 26, suction is removed.
[0020]
The suction plate 5 and the suction pipes 25 and 26 are independently connected to a vacuum source via open / close valves (not shown), and the suction force of the suction plate 5 does not decrease. Therefore, the disc cutter 7 cuts the resist film 2c accurately, and the perforation cutter 24 forms a perforation on the base film 2b accurately.
[0021]
The resist film is cut by the resist film cutting unit 6, and the resist film of a desired length is removed by the resist film removing unit 17 to remove unnecessary portions of the resist film between the substrates and portions before and after the substrate that are not desired to be attached to the substrate 10. When each head position of the film 2c and the position to be bonded of the substrate 10 match, the inside of the vacuum chamber 8 is decompressed, and the substrate 10 and the film 2 are sandwiched from above and below by the pressure roller 14 to rotate the substrate 10 on the downstream side. And affixes the resist film 2 c to the substrate 10. The substrate 10 after affixing is sequentially sent to a further downstream process by a downstream outdoor transfer roll (not shown) from the substrate unloading port 16 at the time of loading of a new substrate from the substrate unloading port 11.
[0022]
The tension roller 13 depressurizes the vacuum chamber 8 and reduces the length of the film 2 in the vacuum chamber 8 which is shortened by attaching the resist film 2c to the substrate 10 when the film 2 cannot be carried in from the outside in the direction of the arrow. The tension of the film 2 is adjusted while moving to adjust.
[0023]
The suction pipes 25 and 26 located immediately behind the disc cutter 7 and the perforated cutter 24 are larger than the tooth thickness of the disc cutter 7 and the perforated cutter 24 in order to increase the chip suction effect. It is preferable to adopt an arrangement configuration having a diameter and a center of the thickness of the teeth and a center of the diameter of the suction pipe substantially coincide with each other.
[0024]
In the above embodiment, the film 2 is attached in the vacuum chamber 8, but may be applied to a film attaching device of a type implemented in the atmosphere.
[0025]
Removal of the resist film at a portion corresponding to between the substrates of the resist film 2c cut by the cutter 7 and at a portion corresponding to a portion where the bonding of the resist film 2c to the substrate 10 is not desired is performed by attaching the resist film 2c to the substrate 10. May be carried out afterwards.
[0026]
【The invention's effect】
As described above, according to the film sticking apparatus of the present invention, it is possible to reliably hold the film during the cutting of the film, cut the film accurately, remove chips, and attach the film body to the substrate. No chips are involved when pasting.
[Brief description of the drawings]
FIG. 1 is a schematic sectional view of a main part showing a film sticking apparatus according to an embodiment of the present invention.
FIG. 2 is a schematic sectional view showing a resist film cutting unit in the film sticking apparatus of FIG.
[Explanation of symbols]
1 Film roll 2 Film 2a Cover film 2b Base film 2c Resist film 3 Cover film peeling roll 5 Suction plate 6 Resist film cutting unit 7 Disk cutter 8 Vacuum chamber 9 Outdoor transport roller 10 ‥ Substrate 11 ‥ Substrate carry-in 12 ‥ Indoor transfer roller 13 ‥ Tension roller 14 ‥ Crimping roller 15 ‥ Film carry-in 16 ‥ Substrate carry-out 17 ‥ Resist film removing unit 18 ‥ Film removing unit base 19 ‥ Adhesive tape 20 ‥ Adhesive tape Roll 21 ‥ Adhesive tape take-up roll 22 ‥ Cylinder 23 ‥ Adhesive tape pressing roller 24 押 し Perforated cutter 25, 26 ‥ Suction pipe

Claims (2)

Film sticking to attach a film body to a desired area of each substrate by the adhesiveness of the film body in a multi-layered film having a base film and a film body fed from a film roll to each of a plurality of substrates conveyed on a conveyance path. In the device,
The film main body of the portion corresponding to the portion between the substrates and the portion corresponding to the portion where the bonding of the substrate and the film main body is not desired in the film main body of the multilayer constituent film unwound from the film roll is moved in the width direction of the film main body and cut. Film cutting means with a cutter,
Holding means for adsorbing the base film when the cutter cuts the film main body in the width direction, the cutter being located on the side opposite to the cutter with the multilayer constituent film as a center,
Suction means located behind the movement of the cutter relative to the film body and moving with the cutter;
A film sticking device characterized by having a. The above-mentioned claim 1, further comprising a means for removing the film main body at a portion corresponding to a portion between the substrates and a portion corresponding to a portion where bonding of the substrate and the film main body is not desired in the film main body cut by the cutter. A film sticking device characterized by the above-mentioned.

Images