JPH06210595A - Method of cutting laminated film - Google Patents

Abstract

PURPOSE:To prevent generation of chips in a laminate device for contact- bonding a laminated film composed of a continuous band-like substrate and a spreading material layer laid over the former, on a sheet substrate, by cutting the laminated film by a length corresponding to the length of the sheet substrate while heating the laminated film. CONSTITUTION:A laminated film 19 composed of a band-like substrate made of polyester or the like, a spreading material layer laid over the former and a protecting film 19c with which the upper surface of the spreading material layer is covered, is paid off from a roll thereof supported on a supply roll 2, is fed to a vacuum plate 6 by way of a tension bar 4 after the protecting film 19c is peeled off. Then, the film 19 is cut into file pieces having a predetermined length by a film keeper 9 and a disc-like cutter 20 in cooperation, and is then heated by a heater 17 and an infrared heater 18 before it is fed into a station for film-application. Further, in this station, the films 19' are heated and contact-bonded to the top and bottom surfaces of the sheet substrate 21 by means of a pair of upper and lower laminate rolls 10 through the intermediary of its spreading material surface.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for cutting a laminate film by using a laminating apparatus which press-bonds a spreading layer on a belt-like support onto a sheet substrate.

[0002]

2. Description of the Related Art Conventionally, various methods have been proposed for pressure-bonding a spreading layer on a belt-like support to a sheet substrate. For example, in Japanese Unexamined Patent Publication No. 2-95851, thin films are sequentially attached from the front end side in the supply direction from the thin film attachment surface at the front end in the attachment direction of the substrate to the thin film attachment surface at the rear end. There is a description of a thin film sticking device that cuts the continuous thin film into a dimension corresponding to the length of the substrate in the transport direction during sticking of the thin film. In this device,
First, the substrate transport mechanism transports the leading end of the substrate in the transport direction to the thin film sticking position and stops it. Next, the tip of the laminated body supplied from the thin film supply roller in the supply direction is vacuum-sucked to the thin film temporary attachment member, brought into contact with the front end of the substrate, and temporarily attached by thermocompression bonding with the thin film temporary attachment member. next,
The adsorption operation of the thin film temporary attachment member is stopped, the thin film temporary attachment member is moved away from the temporary attachment position, the thermocompression bonding roller is brought close to the temporary attachment position, and the temporary attachment portion of the laminated body is pressed to form the thermocompression bonding roller. Is rotated to sequentially thermocompress the laminate on the substrate surface. Next, the rear end of the substrate in the carrying direction is detected during thermocompression bonding of the laminate on the surface of the substrate, and the rear end of the strip-shaped laminate in the supply direction is cut. The cutting moves in a direction intersecting with the feeding direction of the laminated film while rotating the disc-shaped cutter in a state in which the cutting position of the laminated film is suction-held by the vacuum mechanism arranged in the feeding path of the laminated film. This is generally done by

[0003]

However, when the laminate film is cut by the above-mentioned method, the chips of the laminate scatter and adhere to the surface of the substrate before lamination and the surface of the laminate film. The attached chips are not preferable because they directly lead to defective products. Even taking a laminate of a photoresist film for a printed circuit board as an example, in recent years, the density has been increased and even a very small defect is not allowed. Therefore, a method has been developed in which a vacuum mechanism is provided around the traveling path of the disk-shaped cutter to suck the scattered chips, but this method is still insufficient. An object of the present invention is to provide a method for cutting a laminate film in a laminate film laminating apparatus, in which generation of chips at the time of cutting the laminate film is suppressed and a high yield can be obtained.

[0004]

SUMMARY OF THE INVENTION An object of the present invention is to provide a laminating apparatus in which a laminated film having a spreading layer provided on a continuous belt-shaped support is pressure-bonded to a sheet substrate while heating the laminated film. This has been achieved by a method for cutting a laminate film, which is characterized by cutting into a size corresponding to the length of the sheet substrate. In the cutting method of the present invention, the elastic modulus of the spreading layer of the laminate film is 1 × 10 ⁹ dyne /
It is preferable to heat to a temperature of not more than cm ² . Hereinafter, the present invention will be described in detail.

FIG. 1 is a schematic view of a laminating apparatus for a laminated film which carries out the cutting method of the present invention. Figure 2
The example of the layer structure of a laminated film is shown. A belt-shaped support 19A made of polyester or the like, a spreading layer 19B made of a photosensitive resist or the like,
The protective film 19C is made of polyethylene or the like. The width of the laminate film is not particularly limited, but a width of about 10 mm to 700 mm is usually used. The laminating apparatus continuously winds the roll-shaped laminated film 19 around the supply roller 2. The laminate film 19 is separated by the separate bar 3 into a laminate film 19 'including a protective film 19C, a spreading layer 19B having an exposed spreading surface, and a strip-shaped support 19A. The tip side of the separated laminated film 19 ′ in the supply direction is supplied to the vacuum plate 6 through the tension bar 4.

A film keeper (cutting film suction holding member) 8 is provided between the vacuum plate 6 and the film attachment position in the vicinity of the supply path of the laminated film 19 ', and a disk-shaped cutter 20 is provided on the side opposite to the film keeper. Is provided. The film keeper 8 is configured to hold the cutting position of the laminated film 19 ′ and to suck and hold the leading end of the newly formed next laminated film 19 ′ in the supply direction after cutting. Further, a groove is formed in the film keeper 8 in a direction intersecting with the supply direction of the laminated film 19 ', and the disc-shaped cutter 20 runs while rotating in the groove.

The film keeper 8 includes a laminated film 1
A heater 17 is set to heat 9 ′, and an infrared heater 18 is installed at a position facing the film keeper 8. Although not shown, a heater for heating the compressed air is installed in the middle of the pipe for supplying the compressed air to the air blow tube 16. These are for preventing the generation of chips when the film is cut, which is the aim of the present invention.

The laminating roll 10 is shown in the retracted position in FIG. 1. After the temporary attachment, the laminating roll 10 moves to the left, stops immediately below the vacuum plate 6, and pressure is applied to the upper and lower rolls to perform lamination.

The vacuum bar 9 is a laminating roll 1.
When the laminated film 19 ′ to be thermocompression-bonded at 0 is adsorbed and held on the rear end side in the supply direction, an appropriate tension is applied so that wrinkles and the like do not occur on the laminated film 19 ′.

Next, the automatic attaching process using the above-mentioned laminating apparatus will be briefly described with reference to FIG. First, the front end side in the supply direction of the laminated film 19 ′ that has been subjected to manual front end trimming is (A).
As shown in FIG. Next, when the sheet substrate 21 is transported by the substrate transport mechanism and the sensor PH1 (12) detects the substrate front end,
The panel support rod 15 moves in the substrate traveling direction.
Further, when the sensor PH2 (13) detects the front end of the substrate, the film keeper 8 moves backward as shown in (B), and the air from the air blow tube 16 causes the film to reach the front end of the seal bar (temporary film attaching member) 7. Wrap around.

Next, as shown in (C), the sheet substrate 2
1 is transported to the temporary attachment position and stopped, and the seal bar 7
When the vacuum plate 6 starts moving toward the substrate, the panel hold cylinder 14 fixes the sheet substrate 21.

Next, as shown in (D), the seal bar 7 temporarily attaches the laminate film to the front end of the substrate by thermocompression bonding for the time set by the timer. When the tacking is completed, the panel support rod 15 retracts.

Next, as shown in (E), the suction holding of the laminate film 19 'is released, and the vacuum plate 6 is released.
Also, the seal bar 7, which is the tip of the sheet, is attached to the sheet substrate 21.
Away from.

Next, as shown in (F), the film keeper 8 and the laminating roll 10 move toward the substrate, the laminating roll 10 clamps the sheet substrate 21 with an appropriate pressing force, and at the same time, the panel hold cylinder 14 causes the sheet to move. It separates from the substrate 21. Then, the sheet substrate 21 is conveyed by the rotational force of the laminating roll 10 and laminating is started. During the lamination, air from the air blow tube 16 continues to blow toward the laminate film 19 ′.

Next, as shown in (G), the sheet substrate 2
1 is laminated with a laminate film 19 ′ having a predetermined length, and when the sensor detects the rear end of the sheet substrate 21, the laminate film 19 ′ is adsorbed to the vacuum plate 6 and the film keeper 8. Then, the base plate 6 moves toward the substrate, and the film keeper 8 and the vacuum bar 9
In the meantime, the laminate film 19 'is looped, and the film cutter 20 is operated to cut the laminate film 19' according to the rear end of the substrate.

Next, as shown in (H), the vacuum bar 9 is sucked so that the rear end of the cut laminated film 19 ′ is laminated on the sheet substrate 21 by the laminating roll 10, and the laminating roll 10 is formed. It rotates synchronously and holds the rear end of the laminate film 19 '.

Next, as shown in (I), the sheet substrate 2
When the lamination is completed up to the rear end of 1, the air blow from the air blow tube 16 is stopped, the clamp of the laminate roll 10 is released, and the laminate roll 10 is retracted.
Then, the laminated sheet substrate 21 is carried out by the exit conveyor, and the lamination cycle is completed.

Now, returning to (G), the problem of cutting the laminate film 19 'will be described. The cutting of the laminated film is generally performed by rotating the disc-shaped cutter as described above, but chips are generated at the time of cutting, which are scattered and spread on the laminated film of the laminated film. It becomes a defect by adhering to the surface of 19B or the surface of the sheet substrate. For this reason, a chip suction means has been provided near the disk-shaped cutter traveling path, but this is not sufficient.

Therefore, in the present invention, the vicinity of the cut portion of the laminate film 19 'is heated during cutting. The chips are fragile in the spreading layer (generally photopolymerizable resist) of the laminate film,
This is because it was found that the weaker the adhesion to the support, the more likely it is to occur. The heating temperature is preferably room temperature or higher and the temperature at which the support is not thermally deformed and the spread layer is not deteriorated, for example, in the case of a photopolymerizable resist, thermal polymerization is not caused. It is preferable that the spreading layer has an elastic modulus of 1 × 10 ⁹ dyne / cm ² or less, and the upper limit is a temperature at which the support is not thermally deformed and the spreading layer does not deteriorate, for example, in the case of a photopolymerizable resist. It is a temperature at which thermal polymerization does not occur. Above room temperature, eg 40
Although the effect of reducing the chips can be seen only by heating to about 0 ° C., the reducing effect is remarkable when heated to a temperature at which the elastic modulus of the spreading layer becomes 1 × 10 ⁹ dyne / cm ² or less.

The elastic modulus of the spreading layer can be measured by using a viscoelasticity measuring device. Specific examples of the apparatus include Rheovibron manufactured by Orientec Co., Rheospectr manufactured by Rheology Co., and the like.

As a heating means, as shown at 20 in FIG. 1, a heater is attached to the film keeper 8 to heat the spreading layer 19B from the support side. Further, as shown by 18, an infrared heater is provided to radiatively heat from the surface.
Further, various methods such as heating the air blown from the air blow tube 16 in FIG. 3G can be used individually or in combination.

When the laminate film is heated at the time of cutting, the spreading layer is softened, and even if the spreading layer is torn by a cutter, the spreading layer does not break into pieces and is not scattered around. It is also considered that the softening of the spreading layer by heating improves the adhesion to the support, which also contributes to the prevention of chips.
The present invention has been described above, but the present invention is not limited to the above-mentioned embodiments. For example, although the disk-shaped cutter is used as the cutting means in the above-mentioned embodiment, it is naturally applicable to other cutting methods such as a rotary cutter. Further, when a laminated film having a width wider than that of the sheet substrate is used, it can be applied when cutting in the width direction.

[0023]

INDUSTRIAL APPLICABILITY According to the present invention, a laminate film is continuously laminated on a sheet substrate, and when the laminate film is cut into a dimension according to the length of the sheet substrate, the laminate film is cut while heating. Therefore, there is no generation of chips,
The defects associated therewith are significantly reduced.

[Brief description of drawings]

FIG. 1 is a schematic view of a laminate film laminating apparatus for carrying out the cutting method of the present invention.

FIG. 2 is a cross-sectional view showing an example of a layer structure of a laminate film.

FIG. 3 is an explanatory view of an automatic attaching process by a laminate film laminating apparatus for carrying out the laminating method and the cutting method of the present invention.

[Explanation of symbols] 1 Take-up roller 2 Supply roller 3 Separate bar 4 Tension bar 5 Guide bar 6 Vacuum plate 7 Seal bar 8 Film keeper 9 Vacuum bar 10 Laminating roll 11 Inlet conveyor 12 Sensor PH1 13 Sensor PH2 14 Panel hold cylinder 15 Panel support rod 16 Air blow tube 17 Heater 18 Infrared heater 19 Laminated film 19A Strip support 19B Spreading layer 19C Protective film 19 'Laminated film with protective film removed 20 Disc cutter 21 Sheet substrate

Claims (2)

[Claims] 1. A laminating apparatus in which a laminate film having a spreading layer provided on a continuous strip-shaped support is pressure-bonded to a sheet substrate, and a dimension corresponding to the length of the sheet substrate while heating the laminate film. A method for cutting a laminate film, which comprises cutting the film into pieces. 2. The elastic modulus of the spreading layer of the laminate film is 1
The method for cutting a laminate film according to claim 1, wherein the heating is carried out to a temperature of not more than × 10 ⁹ dyne / cm ² .