JP2001010005A - Film pasting method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a film pasting method, in which a film main body can be precisely pasted to a substrate without polluting the substrate or without requiring time and labor of a worker, without cutting off of a multilayered film even if it is thin. SOLUTION: A plurality of substrates having intervals among them are conveyed on a conveying passage so as to paste a film main body, which is to be pasted to the substrate, by providing a base film and a cover film on both the sides of which a three-layered structure is formed to the surface of the substrate with pressure rolls 8A and 8B together with the base film under the state that the cover film is separated from the film main body and the film main body is directed to a substrate side. In addition, an ultrasonic wave is applied to a cutter, which works perforations, at the widthwise working of the perforations at the sites, which correspond to the intervals between a plurality of the substrates 1 which is conveyed to the film main body for pasting.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for attaching a film, and more particularly to a method for attaching a film such as a resist film to a substrate surface such as a semiconductor substrate or a printed wiring board.

[0002]

2. Description of the Related Art As a conventional method of this kind, a film body to be attached such as a base film or a resist film as a film (hereinafter referred to as a resist film),
Using a three-layer structure of the cover film (hereinafter abbreviated as a multilayer film), using a film roll wound so that the base film is on the outer peripheral side and the cover film is on the inner peripheral side, from the multilayer film drawn out from the film roll Peel off the cover film and cut the resist film and base film in two layers in the width direction according to the dimensions of each substrate conveyed on the conveyance path at regular intervals so that the resist film is on the substrate surface side There is a single-wafer method in which a pair of pressure rolls are passed through and affixed to each substrate.

In this single-wafer method, it is difficult to position the leading end of the film in the substrate transport direction at the leading end of the substrate, and it is easy to form bubbles at the time of alignment. There is a problem that the device is easily taken in and the device configuration becomes complicated due to the end processing.

Therefore, a continuous method has been proposed to simplify the device configuration. As the method, using a film roll in the same manner as the single-wafer method, after peeling the cover film from the multilayer film fed from the film roll, it corresponds to a substrate between a plurality of substrates that are transported at a constant interval on the transport path. A protective tape is provided on the resist film at the site. After processing between the substrates, the base film is attached to each substrate through a pair of pressure rolls so that the resist film is on the substrate surface side without cutting the base film. The first continuous method of peeling (see Japanese Patent Application Laid-Open No. Hei 6-73343), or the equivalent of a cover film from a multilayer film unwound from a film roll among a plurality of substrates conveyed at a constant interval on a conveyance path. The base film is cut in the width direction, leaving the base film. After leaving the lum, remove the cover film from the substrate and remove the cover film between the substrates. Then, without cutting the base film, make sure that the resist film is on the substrate surface side. There is a second continuous method of peeling a base film (see Japanese Patent Application Laid-Open No. 9-174797).

[0005] The inter-substrate processing in the continuous method is intended to prevent a resist film from sticking to the front and rear ends of the substrate.

[0006]

In the first continuous method, the resist film is not cut like the base film, and the resist film is highly elastic and highly stretchable, so that the base film is continuously peeled off. At this time, it is difficult to cut the resist film at the portion where the protective tape is attached, and the cut portion may not match the dimensions of the substrate.

Further, in the second continuous method, a cutting process is performed before bonding, and in the cutting process, dust is generated because a cutter cuts a film and scatters around, so that the exposed substrate before bonding is exposed. There is a problem of contaminating the surface.

In recent years, multilayer films have become thinner for higher definition (fineness), and it is difficult to cut the resist film but not the base film. The film may be cut, and the advantages of the continuous method as compared with the single-wafer method cannot be utilized.

Therefore, an object of the present invention is to provide a film sticking method capable of accurately sticking a film body to a substrate without worrying about the thickness of the multilayer film and without contaminating the substrate. .

[0010]

A feature of the present invention that achieves the above object is that a plurality of substrates are transported on a transport path at intervals, and a base film is provided on each side of the film body to be attached to each substrate. When the film body is attached to the substrate surface by a pressure roll together with the base film so that the film body is on the substrate side by peeling the cover film from the three-layer structure provided with It is to provide a perforation while applying ultrasonic waves to a cutter in a width direction of a portion corresponding to a space between a plurality of substrates conveyed to a film body.

[0011] The perforation is formed by rotating a roulette or a thin gear-shaped cutter in the width direction of the film body and rotating at that time, but by applying ultrasonic waves, cutting is performed only by bringing the blade edge into contact with each film. Therefore, almost no dust is generated during the formation of perforations.

According to the film sticking method of the present invention, the perforation cutter is not pressed against the film at the time of perforation processing, so that the speed of the cutter can be improved, and the direction of travel of the film and the thickness direction can be improved. Also, no force is applied in the width direction and the film does not meander. Therefore, there is almost no displacement between the substrate and the film, and the film can be attached accurately.

Further, even when a perforation is formed while moving the film in the advancing direction, the tension applied to the film in the advancing direction may fluctuate because the force for meandering the film in the width direction does not act as described above. In addition, the resist film can be stably stuck on the substrate even in the transport direction.

[0014]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The method of the present invention will be described below with reference to the embodiments shown in FIGS. FIG. 1 is a schematic view of a film sticking apparatus embodying an embodiment of the method of the present invention. In FIG. 1, 1 is a substrate, 2 is a transport roll forming a transport path, L1 is an interval between the substrates 1 transported on the transport roll 2, and F is a multilayer film. Multilayer film F
Has a three-layer structure in which a base film and a cover film are provided on each side of a film body to be attached to the substrate 1, here a resist film. 3 is a multilayer film F
Is a supply film supply roll for supplying the multi-layer film F, and 4 is a suction roll for holding the multilayer film F. 6 is a perforation processing unit for processing a perforation on the multilayer film F;
Reference numeral 7 denotes a protective tape unit for attaching a protective tape between perforations, and 8A and 8B denote pressure rolls for pressing the resist film to the substrate 1. Although a mechanism is provided for moving the pressure rolls 8A and 8B in the direction perpendicular to the transport direction of the substrate 1 when the resist film is pressed, the illustration is omitted because the drawing is complicated. Reference numeral 9 denotes a substrate separation unit that cuts and removes a resist film and a cover film corresponding to a portion between the substrates using a perforation processed into a multilayer film and a protective tape to separate each substrate.

FIG. 2 shows the relationship between the substrate 1 and the multilayer film F. In FIG. 2, M is a perforation processed by the perforation processing unit 6, L2 is a perforation interval, and the width thereof is larger than the above L1 of the substrate 1 on the transport roll 2. L3 is the inter-substrate processing length at the beginning of the substrate 1, and L4 is the substrate 1
This is the processing length between substrates at the end.

The perforation processing unit 6 forms the perforations M on the multilayer film F such that the distance L1 between the substrates 1 is located within the perforation distance L2. The width L2 forming the perforation M is set to a size that takes into account the processing lengths L3 and L4 between the front and rear end portions of each substrate 1 in addition to the distance L1 between the substrates. The inter-substrate processing length L3 and the inter-substrate processing length L4 may be the same or different. The protective tape (not shown) is stuck on the resist film from which the cover film in the perforation interval L2 has been peeled, over the entire surface of the multilayer film F in the width direction.

FIG. 3 is a detailed view of a perforation cutter for processing a perforation M into a multilayer film F. A pair of perforations are installed in the perforation processing unit 6. In FIG. 3, 1
Reference numeral 0 denotes a perforated cutter, 11 denotes a driven pulley that transmits rotational force to the perforated cutter 10, and 12 denotes an ultrasonic horn that transmits ultrasonic waves to the perforated cutter 10. The ultrasonic horn also serves to hold the perforated cutter 10. I have. The bearing between the perforated cutter 10 and the ultrasonic horn 12 has a function of transmitting ultrasonic waves and maintaining the rotation of the perforated cutter 10, and a sliding bearing that manages a clearance of the bearing to reduce dust due to wear. Is used. Although a low-dust-generating rolling bearing can be used, the transmission efficiency of ultrasonic waves is slightly reduced.

Reference numeral 13 denotes an ultrasonic unit having a built-in ultrasonic vibrator for generating ultrasonic waves, and 14 denotes a driven pulley 11
A drive pulley for transmitting power to the drive belt, 15 is a drive belt for moving the perforated cutter 10 in the width direction of the multilayer film F, 16 is a pinion, and the perforated cutter 10 is moved in the width direction of the multilayer film F. Since it rotates and transmits power to the drive pulley 14, no special power source for rotating the perforation cutter 10 is required. The number of rotations of the perforation cutter 10 is between the pinion 16 and the drive pulley 14, the drive pulley 1
Determined by the reduction ratio between 4 and driven pulley 11,
The speed at which the perforation cutter 10 moves in the width direction of the multilayer film F is determined so that the linear velocity of the cutting edge of the perforation cutter 10 matches.

Since the smaller the pressing pressure of the cutting edge against the multilayer film F, the less dust is generated, the pressing pressure is set to such an extent that the multilayer film F and the cutting edge come into contact. Even in this state, the perforations can be machined because of the amplitude of the ultrasonic waves. Further, since the sharpness of the film is good, the operating speed of the perforated cutter 10 in the width direction of the multilayer film F can be increased.

The most important problem in the laminating apparatus is suppression of fluctuation in the tension and meandering of the multilayer film. The variation in the tension of the multilayer film at the time of sticking appears as unevenness in the resist thickness on the substrate 1 after sticking, which makes the subsequent baking and exposure processes difficult and promotes the non-uniformity. Is a factor that reduces In addition, the meandering of the multilayer film causes a change in tension and directly affects the accuracy of the position to be attached to the substrate 1. With a cutter to which ultrasonic waves are applied, the sharpness is good, and the force for pressing the cutting edge against the multilayer film F can be reduced. Therefore, the influence on the width direction of the multilayer film F is small, and the multilayer film F meanders at the time of perforation processing. No, does not cause tension fluctuation.

FIG. 4 is a diagram showing the configuration of the perforation processing unit 6 and the protective tape unit 7. In FIG.
6A and 6B are perforated cutter units for processing perforations in the multilayer film F, 17 is a protective tape supply roll for supplying a protective tape, 18 is a suction holding table for holding the leading end of the protective tape, and 19 is a leading end of the protective tape. , A tape chuck for pulling out the protective film pulled out by the tape chuck 19 by vacuum suction and sticking it to the surface of the multilayer film F, and 21 for cutting the protective tape. It is a tape cutter.

The perforated cutter units 6A and 6B
Since the power required for the operation of the multilayer film F in the width direction is obtained from the same power source, the driving belt 16 (not shown in FIG. 4) needs to be arranged with the traveling direction of the multilayer film F as an axis. And move in the opposite direction during perforation.

Hereinafter, steps of a perforation processing and protection tape attaching mechanism according to an embodiment of the present invention will be described.
The above-described process includes the following five processes.

(1) Film holding step The perforation processing unit 6, the protective tape unit 7, and the suction table 5 are moved in the same direction as the multilayer film F to make the moving speed coincide with that of the multilayer film F, and a vacuum is generated in the suction table 5. By doing so, the multilayer film F is held on the surface of the suction table 5.

(2) Tape Preparation Step The tip of the protective tape held in vacuum on the suction holding table 18 is held by a tape chuck 19 and
Then, the vacuum is broken, the tape chuck 19 is moved in the width direction of the multilayer film F, and the protective tape is pulled out.
Is lowered until the lower surface of the suction bar 20 contacts the drawn-out protection tape, and a vacuum is generated in the suction bar 20 to hold the drawn-out protection tape. At the same time, a vacuum is also generated in the suction holding table 18 to hold the end of the protection tape. Then, after the protective tape is cut by the tape cutter 21, the tape chuck 19 is opened.

(3) Adhering step As shown in FIG. 5, the suction bar 20 is lowered, and the protective tape is applied to the surface of the film body (resist film) from which the cover film within the perforation L2 has been peeled off from the multilayer film F. And the protective tape is released from the suction bar 20 by breaking the vacuum of the suction bar.
Return 0 to the initial position.

(4) Perforation processing step The perforation cutter units 6A and 6B to which ultrasonic waves have been applied are moved in the width direction of the multilayer film F to process perforations in the multilayer film F.

(5) Returning process The multilayer film F is broken by breaking the vacuum of the suction table 5.
Is released, and the perforation processing unit 6, the protective tape unit 7, and the suction table 5 are returned to the initial positions.

As described above, the steps of the perforation processing and the protective tape attaching mechanism in the embodiment of the present invention are as follows.
The process starts with the film holding process and ends with the return process.

The tape attaching operation and the perforation operation need to be performed between the start of the film holding operation and the end of the return operation, but the tape preparing operation may be performed at any time before the tape attaching operation. You can go. Further, the tape attaching operation and the perforation operation are independent of each other, and the perforation operation may be performed first. Also, it may be performed at the same time.

Hereinafter, the attachment of the film to the substrate 1 will be described. First, the tip of the multilayer film F is fed out from the supply roll 3, the cover film is peeled off, and the tip is wound around the cover film take-up roll 4, and the resist film and the base film are attached to the suction table 5, the perforation processing unit 6, and the protection film. It is extended to the downstream side in the transport direction after passing between the tape unit 7 and the pressure rolls 8A and 8B.

After the multilayer film F is fed from the supply roll 3 and all the cover films are peeled off, the perforation M is formed and the protective tape is attached by the perforation processing unit 6 and the protective tape unit 7 as described above.

The moving speed of the multilayer film F and the conveying speed of the substrate 1 are aligned, and the perforations M are positioned L3 inward from the front end of the substrate 1 as shown in FIG. The rolls 8A and 8B are moved in the direction of the substrate 1 and pressurized to apply a resist film to the upper main surface of the substrate 1. When the rear end of the substrate 1 comes to the position of the pressure rolls 8A and 8B, the pressure rolls 8A and 8B are moved in a direction away from the substrate 1 to complete the attachment to one substrate 1. When the next substrate 1 is conveyed, the press rolls 8A and 8B are again moved to the substrate 1 side, and the next multilayer film F is attached. The bonded substrate 1 is clamped by the substrate separating unit 9 with the cover film and the protective tape on the resist film between the substrates, and cut and removed along the perforations M to separate the substrates.

The resist film between the substrates cannot be stretched because of the perforations and is sandwiched between the base film and the protective tape, so that these three layers can be cut and removed at once.

In the above embodiment, since the perforation M processing is performed by fusing by applying ultrasonic waves to the perforation cutter, there is almost no generation of dust during the perforation M processing. In addition, since the sharpness is improved by the application of ultrasonic waves, the operation speed of the perforation cutter 10 can be increased,
Further, since no force is applied to the multilayer film F, there is no meandering or tension fluctuation of the multilayer film F.

Since the perforation processing and the attachment of the protective tape can be performed simultaneously, the relative positional accuracy between the perforation M and the protective tape is improved. Since the perforations M may be formed not only on the resist film but also on the base film, there is no need to consider the thinness of the multilayer film F. Since the multilayer film F is continuous, there is no generation of air bubbles at the ends as in the single-wafer type.

Since the protective tape is merely attached to the processing section between the substrates, the consumption amount is small and the operator does not have to work for replacement and replenishment. Since the film has been continuously peeled off in advance and a protective tape is provided over the entire width of the resist film at a portion corresponding to between the substrates, the edge of the substrate is used when the resist film is pressed against the surface of the substrate. The part is not dirty.

FIG. 6 shows a second embodiment of the perforated cutter unit. In FIG. 6, reference numeral 24 denotes a perforation cutter unit, and d denotes the vertical movement width of the ultrasonic vibrator, the ultrasonic horn 23, and the perforation cutter 22.
The vertical movement width d refers to when the perforation cutter 22 moves in the width direction of the multilayer film F intermittently to form a perforation and when the cutting edge bites into the multilayer film F to form the perforation. It is set to be larger than the amplitude of the ultrasonic wave by the deviation at the time. The perforation cutter unit 24 forms a perforation M by vibrating with the vertical movement width d while moving in the width direction of the multilayer film F by the drive belt 15.

In this embodiment, the pitch of the perforations M can be changed without changing the cutter blade by adjusting the moving speed of the perforated cutter unit 24 in the width direction of the multilayer film F and the operation cycle of the vertical operation width d. There is an advantage that you can.

FIG. 7 shows the first embodiment according to the second embodiment.
A pair of perforated cutter units 24 (24A, 24B)
And the configurations of the protective tape unit 7 and the suction table 5 are shown.

FIGS. 8 and 9 show third and fourth embodiments of the perforated cutter unit.

8 and 9, the perforation cutter unit includes a perforation cutter 25 and an ultrasonic horn 2.
6.

In order to process perforations M into a multilayer film F having a width of 1 m or more, a plurality of perforation cutters 25 each having an ultrasonic horn 26 as shown in FIG.
May be arranged such that the cutting edge is straight, or may be a single perforated cutter 25 in which a plurality of ultrasonic horns 26 are arranged as shown in FIG.

In this case, it is desirable that the ultrasonic waves applied from the plural ultrasonic horns 25 have the same period and amplitude.

Regardless of the embodiment described above, the present invention may be implemented as follows. (1) The perforation M may be processed before the cover film is peeled off. (2) The perforation cutter 10 may form the perforation M from below the multilayer film F, that is, from the base film side. (3) The mechanisms may be arranged symmetrically with respect to the transport path, and a resist film may be attached to both surfaces of the substrate. (4) Further, these operations may be performed inside a vacuum chamber that can be opened and closed in accordance with the transfer of the substrate 1.

[0046]

As described above, according to the method of the present invention, even if the multilayer film is thin, the film main body can be accurately adhered to the substrate without cutting the substrate without polluting the substrate.

[Brief description of the drawings]

FIG. 1 is a schematic view of a film sticking apparatus embodying an embodiment of the film sticking method of the present invention.

FIG. 2 is a view showing a relationship between a substrate and a film attached by the film attaching apparatus shown in FIG.

FIG. 3 is a view showing details of a perforation cutter used in the film sticking apparatus shown in FIG. 1;

FIG. 4 is a diagram showing a configuration of a perforated cutter unit and a protective tape unit used in the film sticking apparatus shown in FIG.

FIG. 5 is an explanatory view of a step of attaching a protective tape to the surface of the multilayer film F by the film attaching apparatus shown in FIG.

FIG. 6 is a view showing a second embodiment of a perforated cutter used in the film sticking apparatus shown in FIG. 1;

FIG. 7 is a diagram showing a configuration of a perforated cutter unit and a protective tape unit shown in FIG. 6;

FIG. 8 is a view showing a third embodiment of a perforation cutter used in the film sticking apparatus shown in FIG.

FIG. 9 is a view showing a fourth embodiment of a perforation cutter used in the film sticking apparatus shown in FIG.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Substrate 2 Transport roll 3 Supply roll 4 Cover film take-up roll 5 Suction table 6 Perforation processing unit 6A Perforation cutter unit 6B Perforation cutter unit 7 Protective tape unit 8A Crimping roll 8B Crimping roll 9 Substrate separation unit 10 Perforation cutter 11 Driven Pulley 12 Ultrasonic Horn 13 Ultrasonic Unit 14 Drive Pulley 15 Drive Belt 16 Pinion 17 Protective Tape Supply Roll 18 Suction Holder 19 Tape Chuck 20 Suction Bar 21 Tape Cutter 22 Perforated Cutter 23 Ultrasonic Horn 24 Perforated Cutter Unit 24A Perforated cutter unit 24B Perforated cutter unit 25 Perforated cutter 26 Ultrasonic horn F Multi-layer film M Perforated L1 Board spacing L2 Shin-th interval L3 substrate between the processing length L4 substrate between the processing length d vertical movement width

──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) B29L 9:00 (72) Inventor Takehiko Hayashi 794 Higashi-Toyoi, Kudamatsu-shi, Yamaguchi Prefecture Hitachi Techno Engineering Co., Ltd. Kasado Works F-term (reference) 4F100 AT00A AT00B AT00C BA03 BA07 EJ322 EJ332 EJ462 EJ512 GB43 JB14B 4F211 AA00 AG01 AG03 TA13 TC02 TJ23 TQ03 4J040 JB09 NA20 PA17 5E314 AA27 CC15 EE03 FF01 GG24

Claims (3)

[Claims] A plurality of substrates are transported on a transport path at intervals, and a base film and a cover film are provided on each side of a film body to be attached to each substrate, and the cover film is peeled from a three-layer structure. And bonding the film body to the surface of the substrate by a pressure roll together with the base film such that the film body is on the substrate side. At least a plurality of substrates conveyed to the film body to be bonded In the width direction of the part corresponding to between the substrates,
A film sticking method, wherein perforations are provided while applying ultrasonic waves to a cutter. 2. A plurality of substrates are transported on a transport path at intervals, and a base film and a cover film are provided on each side of a film body to be attached to each substrate, and the cover film is peeled off from a multilayer film. A step of attaching the film main body to the surface of the substrate by a pressure roll together with the base film so that the film main body is on the substrate side, wherein the step of holding the multilayer film on the surface of a suction base; Pull out and hold the tip of the protective tape held in vacuum at the same time, hold the end of the protective tape at the same time
Then, a step of cutting the protective tape with a tape cutter, a step of attaching the protective tape to the film body surface of the multilayer film from which the cover film has been peeled off, and a step of applying a perforated cutter unit to which the ultrasonic wave has been applied to the multilayer film. A step of processing perforations in the multilayer film by moving the multilayer film in the width direction, and a step of opening the multilayer film by breaking the vacuum of the suction table. 3. The method according to claim 1, wherein
The film attaching method according to claim 1, wherein the perforation is formed by moving a roulette or a thin gear-shaped cutter or the like in the width direction of the film body by ultrasonic waves and rotating at that time.