JP3220364U - Holding device - Google Patents

Abstract

An outer edge of a first holding object having a circular holding surface and a second holding object having a square holding surface having four sides having the same length as the diameter of the first holding object. To provide a holding device that can securely hold up to a part. A holding device EA includes a holding mechanism 10 having a holding portion HT having a square shape in plan view on a holding surface 12A capable of holding a holding object, and a holding force applying mechanism 20 that applies a holding force to the holding portion HT. The holding portion HT includes a first holding portion HT1 having a circular shape in plan view that is inscribed in all four sides of the holding portion HT, and a plurality of adjoining the first holding portions HT1 by the first partition wall WL1. The holding force application mechanism 20 is partitioned into a second holding unit HT2 and the first holding force applying mechanism 21 and the second holding unit 20 apply the holding force independently to the first holding unit HT1 and the second holding unit HT2, respectively. And a force applying mechanism 22. [Selection] Figure 1

Description

  The present invention relates to a holding device.

  2. Description of the Related Art Conventionally, a holding device having a holding surface capable of selectively holding objects to be held having different shapes of held surfaces is known (see, for example, Patent Document 1).

JP 2013-226607 A

  However, in the chuck table 1 (holding device) described in Patent Document 1, the shape of the suction portion 200 (holding portion) on the holding surface is circular along the outer edge of the circular held surface of the plate-like workpiece 32. Therefore, when the plate-like workpiece 32 is a first holding object, the second holding object has a square-shaped holding surface having four sides having the same length as the diameter of the first holding object. When an object is to be held by the holding surface, the corner portion of the held surface of the second holding object protrudes from the holding part, and the outer edge part of the second holding object cannot be reliably held. There is.

  An object of the present invention is to provide a first holding object having a circular holding surface and a second holding object having a square holding surface having four sides having the same length as the diameter of the first holding object. It is an object of the present invention to provide a holding device that can securely hold the outer edge to the outer edge.

  The present invention employs the structure described in the claims.

According to the present invention, the holding part is divided into a first holding part having a circular shape in plan view that is inscribed in all four sides constituting the holding part, and a plurality of second holding parts adjacent to the first holding part. Since the holding force can be independently applied to the first holding part and the plurality of second holding parts, the first holding object having the circular held surface and the first holding object It is possible to reliably hold the second holding object having the square holding surface having four sides having the same length as the diameter up to the outer edge portion.
Moreover, since the 1st holding | maintenance part is divided into the 3rd holding | maintenance part and the 4th holding | maintenance part adjacent to each other, a holding force can be independently provided to a 3rd holding | maintenance part and a 4th holding | maintenance part, respectively. Even if the first object to be held is divided into two, both of them can be reliably held to the outer edge.

Explanatory drawing of the holding | maintenance apparatus which concerns on one Embodiment of this invention.

Hereinafter, an embodiment of the present invention will be described with reference to the drawings.
In this embodiment, the X axis, the Y axis, and the Z axis are orthogonal to each other, the X axis and the Y axis are axes in a predetermined plane, and the Z axis is an axis that is orthogonal to the predetermined plane. To do. Furthermore, in the present embodiment, when viewed from the near side of FIG. 1 parallel to the Y axis, when indicating the direction, “up” is the arrow direction of the Z axis, “down” is the opposite direction, “ The “left” is the arrow direction of the X axis, “right” is the opposite direction, “front” is the front direction in FIG. 1 parallel to the Y axis, and “rear” is the opposite direction. Also, the plan view is a field of view looking down from above the Z axis.

  In FIG. 1, the holding device EA has a holding mechanism 10 having a holding portion HT having a square shape in plan view on a holding surface 12A capable of holding the holding object WK, and a holding device that applies a suction force as a holding force to the holding portion HT. The sheet applying device EA1 is formed by a pasting mechanism 30 that includes the force applying mechanism 20 and presses and adheres the adhesive sheet AS to the holding object WK held by the holding device EA.

The holding mechanism 10 includes a table 12 that is supported by a slider 11A of a linear motor 11 as a driving device, and whose upper surface is a holding surface 12A.
The holding portion HT provided on the holding surface 12A is divided into a first holding portion HT1 having a circular shape in a plan view inscribed in all four sides constituting the holding portion HT and the first holding portion HT1 by the first partition wall WL1. It is partitioned into a plurality of adjacent second holding portions HT2. The first holding part HT1 is composed of a third holding part HT1A and a fourth holding part that are adjacent to each other by a second partition wall WL2 having one end and the other end at two locations on the circumferential part of the first holding part HT1. It is partitioned into HT1B.
The holding unit HT configured by the second, third, and fourth holding units HT2, HT1A, and HT1B has the same shape as the held surface of the square substrate WK1 as the holding object WK. The holding portion HT configured by the holding portions HT1A and HT1B has the same shape as the holding surface of a circular semiconductor wafer (hereinafter simply referred to as “wafer”) WK2 as the holding object WK, and the third holding portion. The holding portion HT portion constituted by HT1A has the same shape as a held surface of a wafer with an orientation flat (not shown) as a holding object WK having an orientation flat.
The circumferential portion of the held surface of wafer WK2 or the wafer with orientation flat (not shown) has a circular shape or an arc shape inscribed in all four sides constituting the held surface of substrate WK1. The second, third, and fourth holding portions HT2, HT1A, and HT1B are each composed of a porous body, and are disposed in the recesses defined by the first and second partition walls WL1 and WL2. Furthermore, the sectional view of the table 12 shown in FIG. 1 is a BB-BB section CC arrow view of the table 12 in the diagram indicated by the reference AA in FIG.

The holding force application mechanism 20 includes a first holding force application mechanism 21 and a second holding force application mechanism 22 that apply a holding force independently to the first holding unit HT1 and the plurality of second holding units HT2, respectively. Yes.
The first holding force applying mechanism 21 includes a third holding force applying mechanism 21A and a fourth holding force applying mechanism 21B that apply a holding force independently to the third holding unit HT1A and the fourth holding unit HT1B, respectively. Yes.
In addition, the 2nd, 3rd, 4th holding force provision mechanism 22, 21A, 21B can illustrate a decompression pump, a vacuum ejector, etc.

  The affixing mechanism 30 includes a support roller 31 for supporting the original fabric RS having the adhesive sheet AS temporarily attached to one surface of the release sheet RL, a guide roller 32 for guiding the original fabric RS, and a release edge 33A. And a release plate 33 as a peeling means for peeling the adhesive sheet AS from the release sheet RL, and a pressing roller 34 as a pressing means for pressing and sticking the adhesive sheet AS to the holding object WK held by the holding device EA. Supported by an output shaft (not shown) of a rotation motor 35A as a drive device, and supported by an output shaft of a drive device (not shown) and a drive roller 35 sandwiching the release sheet RL with a pinch roller 35B. During the automatic operation, a predetermined tension is always applied to the release sheet RL existing between the pinch roller 35B and the release sheet RL. And a recovery roller 36 serving as recovery means for recovering.

Operation | movement of the sheet sticking apparatus EA1 provided with the above holding | maintenance apparatus EA is demonstrated.
First, with respect to the sheet sticking device EA1 in which each member is arranged at an initial position indicated by a solid line in FIG. 1, a user of the sheet sticking device EA1 (hereinafter, simply referred to as “user”) shows the raw fabric RS After setting as shown, an automatic operation start signal is input via an operation device (not shown) such as an operation panel or a personal computer. Then, the sticking mechanism 30 drives the rotation motor 35A to feed out the original fabric RS, and the leading end of the leading adhesive sheet AS in the feeding direction is a predetermined length at the peeling edge 33A of the peeling plate 33 as shown by the solid line in FIG. When peeled off, the drive of the rotation motor 35A is stopped.

  Next, when the user or a transfer mechanism (not shown) such as an articulated robot or a belt conveyor places the wafer WK2 on the third and fourth holding portions HT1A and HT1B as shown by the solid line in FIG. The applying mechanism 20 drives the third and fourth holding force applying mechanisms 21A and 21B, and starts sucking and holding the wafer WK2 by the third and fourth holding portions HT1A and HT1B. Note that when the user or a transport mechanism (not shown) places the substrate WK1 on the second, third, and fourth holding portions HT2, HT1A, and HT1B, as shown by a two-dot chain line in FIG. 20 drives the second, third, and fourth holding force applying mechanisms 22, 21A, and 21B, and starts holding the substrate WK1 by suction with the second, third, and fourth holding portions HT2, HT1A, and HT1B. When the user or a transport mechanism (not shown) places a wafer with an orientation flat (not shown) on the third holding unit HT1A, the holding force applying mechanism 20 drives the third holding force applying mechanism 21A, and the third holding unit The suction holding of the wafer with orientation flat (not shown) at HT1A is started.

  Thereafter, the holding mechanism 10 drives the linear motor 11 to move the table 12 to the left, and when the table 12 reaches a predetermined position, the sticking mechanism 30 drives the rotation motor 35A, and the moving speed of the table 12 is increased. Together with the raw fabric RS. As a result, the adhesive sheet AS is peeled off from the release sheet RL at the release edge 33A of the release plate 33, and is pressed and stuck to the wafer WK2 by the pressing roller. When the substrate WK1 or the wafer with orientation flat (not shown) is held on the holding surface 12A, the adhesive sheet AS is pressed and pasted to the substrate WK1 or the wafer with orientation flat (not shown). Next, when the leading end in the feeding direction of the next adhesive sheet AS next to the first adhesive sheet AS is peeled for a predetermined length by the peeling edge 33A of the peeling plate 33, the sticking mechanism 30 stops driving the rotation motor 35A. .

  When the adhesion of the adhesive sheet AS to the wafer WK2 is completed and the table 12 reaches a predetermined position, the holding mechanism 10 stops driving the linear motor 11, and then the holding force applying mechanism 20 has the third and fourth holding forces. The driving of the applying mechanisms 21A and 21B is stopped, and the suction holding of the wafer WK2 by the third and fourth holding portions HT1A and HT1B is released. When the substrate WK1 is held on the holding surface 12A, after the holding mechanism 10 stops driving the linear motor 11, the holding force applying mechanism 20 is operated by the second, third, and fourth holding force applying mechanisms 22, 21A. , 21B are stopped, and the suction and holding of the substrate WK1 by the second, third, and fourth holding portions HT2, HT1A, and HT1B is released. When the orientation flat wafer (not shown) is held on the holding surface 12A, the holding mechanism 10 stops driving the linear motor 11, and then the holding force applying mechanism 20 stops driving the third holding force applying mechanism 21A. Then, the suction holding of the wafer with orientation flat (not shown) in the third holding unit HT1A is released. When the user or a transport mechanism (not shown) transports the wafer WK2 to which the adhesive sheet AS is attached to the next process, the holding mechanism 10 drives the linear motor 11 to return the table 12 to the initial position. Is repeated.

  According to the embodiment as described above, the holding part HT includes a first holding part HT1 having a circular shape in plan view that is inscribed in all four sides constituting the holding part HT, and a plurality of the holding parts HT adjacent to the first holding part HT1. Since the first holding unit HT1 and the plurality of second holding units HT2 can be independently applied with holding force, the wafer WK2 having a circular holding surface can be provided. In addition, the substrate WK1 having a square held surface having four sides having the same length as the diameter of the wafer WK2 can be reliably held to the outer edge.

  As described above, the best configuration, method and the like for carrying out the present invention are disclosed in the above description, but the present invention is not limited to this. That is, although the present invention has been illustrated and described with particular reference to particular embodiments, it will be understood that the present invention is not limited to the above-described embodiments without departing from the scope of the technical idea and purpose of the present invention. Various modifications can be made by those skilled in the art in terms of material, quantity, and other detailed configurations. In addition, the description limited to the shape, material, etc. disclosed above is an example for easy understanding of the present invention, and does not limit the present invention. The description by the name of the member which remove | excluded the limitation of some or all of such limitation is included in this invention.

For example, the holding mechanism 10 may not include the linear motor 13.
The holding surface 12A may be a polygon such as a circle, an ellipse, a triangle, or a pentagon in plan view as long as the holding surface HT has a size including the holding portion HT.
The second, third, and fourth holding portions HT2, HT1A, and HT1B are not limited to those formed of a porous body, and for example, a plate-like member provided with one or a plurality of suction holes may be used.
The second partition wall WL2 may have a V shape, a U shape, a rectangular shape, a curved shape, a wave shape, or the like in plan view, or may not be provided when the first holding portion HT1 is not required to be partitioned. .

  The holding force applying mechanism 20 may apply a holding force by a Coulomb force, an adhesive, an adhesive, a magnetic force, Bernoulli adsorption, etc., and an electrode is bonded to the second, third, and fourth holding portions HT2, HT1A, and HT1B. An agent, an adhesive, a magnet, a suction hole, or the like may be provided, or a holding force may be independently applied to each of the second, third, and fourth holding portions HT2, HT1A, and HT1 by a switching valve.

  The sticking mechanism 30 is formed by forming a notch in a closed loop shape or in the entire short width direction in a belt-like adhesive sheet base material (a belt-like base material sheet and a belt-like adhesive layer) temporarily attached to the release sheet RL. The raw material in which the predetermined area partitioned by the incision is the adhesive sheet AS may be fed out, or the raw material in which the belt-like adhesive sheet base material is temporarily attached to the release sheet RL is adopted. A cut in the closed loop shape or the entire short width direction is formed in the base material by a cutting mechanism, and a predetermined area partitioned by the cut may be used as the adhesive sheet AS, or the adhesive sheet AS is peeled from the release sheet RL. At this time, the torque of the rotation motor 35A may be controlled so that a predetermined tension is applied to the original fabric RS, or a plate-like member, a shaft member, etc., instead of each roller such as the support roller 31 and the guide roller 32 Raw material RS and release sheet RL It may be supported or guided, and may be supported, for example, by fanfold folding without winding the original fabric RS, and the recovery means may be, for example, fanfold without winding the release sheet RL. The release sheet RL may be collected by being folded or chopped with a shredder or the like, or simply collected without being wound or fanfold folded, or the release sheet RL may be recovered. It does not have to be.

  In addition to the sheet sticking device EA1, the holding device EA is employed, for example, in a sheet peeling device that peels the adhesive sheet AS stuck on the holding object WK from the holding object WK, a positioning device that positions the holding object WK, and the like. May be.

  The material, type, shape, etc. of the adhesive sheet AS and the holding object WK are not particularly limited. For example, the adhesive sheet AS may be a circle, an ellipse, a polygon such as a triangle or a quadrangle, or other shapes, or may be of an adhesive form such as pressure sensitive adhesive or heat sensitive adhesive, When the heat-sensitive adhesive sheet AS is employed, it may be bonded by an appropriate method such as providing an appropriate coil heater for heating the adhesive sheet AS or a heating mechanism such as a heating side such as a heat pipe. Such an adhesive sheet AS is, for example, a single layer having only an adhesive layer, an intermediate layer between the base sheet and the adhesive layer, a cover layer on the upper surface of the base sheet, etc. Three or more layers, or a so-called double-sided adhesive sheet that can peel the base sheet from the adhesive layer may be used. The double-sided adhesive sheet comprises a single-layer or multi-layer intermediate layer. It may be a single layer or a multilayer having no intermediate layer. Examples of the holding object WK include foods, resin containers, semiconductor wafers such as silicon semiconductor wafers and compound semiconductor wafers, information recording substrates such as circuit boards and optical disks, glass plates, steel plates, ceramics, wood plates, or resin plates. Any form of member or article can also be targeted. In addition, the adhesive sheet AS is replaced with a functional and intended reading, for example, any information label, decorative label, protective sheet, dicing tape, die attach film, die bonding tape, recording layer forming resin sheet, etc. Any sheet, film, tape, or the like having a shape can be attached to any holding object WK as described above.

The mechanism and process in the present invention are not limited in any way as long as the operation, function, or process described with respect to the mechanism and process can be performed. Furthermore, the structure and process of only one embodiment shown in the above embodiment are not limited. The process is not limited at all. For example, the holding force applying mechanism applies a holding force to the holding unit, and includes a first holding force applying mechanism that independently applies a holding force to the first holding unit and the plurality of second holding units. As long as it has a second holding force imparting mechanism, there is no limitation as long as it is within the technical scope in light of the common general technical knowledge at the time of filing (other means and processes are the same). .
The drive device in the embodiment includes an electric device such as a rotation motor, a linear motion motor, a linear motor, a single axis robot, an articulated robot, an actuator such as an air cylinder, a hydraulic cylinder, a rodless cylinder, and a rotary cylinder. In addition to these, a combination of them directly or indirectly may be employed (some of them overlap with those exemplified in the embodiment).
In the above-described embodiment, when rollers are employed, a drive device that rotationally drives each roller may be provided, or the surface of each roller may be configured with a member capable of elastic deformation such as rubber or resin. Each roller may be constituted by a member that does not elastically deform, or when a sticking mechanism or a pressing member such as a pressing roller or a pressing head is employed, instead of or in combination with those exemplified above, a roller A pressing member made of a round bar, blade material, rubber, resin, sponge, or the like may be employed, or a structure may be employed that is pressed by blowing air such as air or gas. The part may be composed of a member that can be elastically deformed, such as rubber or resin, or may be composed of a member that is not elastically deformed, and when a peeling mechanism or a peeling member is employed, a plate-like member, Consists of round bars, rollers, etc. Alternatively, when a structure that supports or holds a supported member such as a support (holding) mechanism or a support (holding) member is adopted, a gripping mechanism such as a mechanical chuck or a chuck cylinder, coulomb force, adhesion A structure that supports (holds) the supported member with an agent, adhesive, magnetic force, Bernoulli adsorption, drive device, etc. may be adopted, and when a cutting mechanism or cutting blade is adopted, a cutter blade, a laser cutter, A cutting member such as ion beam, thermal power, heat, water pressure, heating wire, spraying of gas or liquid, etc. is adopted, or the cutting member is moved with a combination of appropriate driving equipment to cut. Also good.

EA ... holding device 10 ... holding mechanism 12A ... holding surface 20 ... holding force applying mechanism 21 ... first holding force applying mechanism 21A ... third holding force applying mechanism 21B ... fourth holding force applying mechanism 22 ... second holding force applying mechanism HT ... Holding unit HT1 ... First holding unit HT1A ... Third holding unit HT1B ... Fourth holding unit HT2 ... Second holding unit WK ... Holding object WK1 ... Substrate WK2 ... Wafer WL1 ... First partition WL2 ... Second partition

Claims (2)

A holding mechanism having a holding portion having a square shape in plan view on a holding surface capable of holding a holding object;
A holding force applying mechanism for applying a holding force to the holding unit,
The holding part is divided into a first holding part having a circular shape in plan view inscribed in all four sides constituting the holding part and a plurality of second holding parts adjacent to the first holding part by the first partition. And
The holding force applying mechanism includes a first holding force applying mechanism and a second holding force applying mechanism that independently apply holding force to the first holding unit and the plurality of second holding units. A holding device. The first holding portion is divided into a third holding portion and a fourth holding portion adjacent to each other by a second partition wall having one end and the other end at two locations on the circumferential portion constituting the first holding portion. And
The first holding force applying mechanism includes a third holding force applying mechanism and a fourth holding force applying mechanism for independently applying a holding force to the third holding unit and the fourth holding unit, respectively. The holding device according to claim 1.

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