JP2004235394A - Method and equipment for separating chip components - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To separate green sheets in a state cut into chip shape in safety without causing any damage on the individual chip components while sustaining the separation rate. <P>SOLUTION: The green sheet 80 cut into chip shape is fed, at a feeding section 20, to an adhesive sheet 1 which is then carried to a separating edge section 51 and a stripping section 52 with the green sheet 80 being pasted to the adhesive sheet 1. The green sheet 80 cut into chip shape is separated at the separating edge section 51 into individual chip components and then stripped from the adhesive sheet 1 at the stripping section 52. The chip component is stripped from the adhesive sheet 1 at the stripping section 52 by lowering adhesion of the adhesive sheet 1. <P>COPYRIGHT: (C)2004,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a chip component separation method and apparatus for separating a green sheet (unfired ceramic sheet) cut into a chip shape into individual chip components.
[0002]
[Prior art]
Conventionally, in the applicant, a process of placing a green sheet on a laminate, cutting a green sheet into chip shapes with a chip cutting machine such as a push-cutting machine, and separating it into individual chip components with a chip separator. Was taking. In this case, there were the following problems.
[0003]
(1) In the current separation process, the separation rate is low, and one worker is working on one separation jig, which causes problems in labor saving, worker safety, work lead time, etc. Remaining.
[0004]
{Circle around (2)} The backing sheet of the green sheet in the cutting step is also used in the separation step, but does not necessarily have properties suitable for the separation step. In other words, the ventilation paper is used as the backing sheet in the cutting process, and the ventilation paper is thin and inelastic, but if the backing paper has little elasticity in the separation step, almost all the stress generated in the separation process is directly applied to the chip. Affects product.
[0005]
(3) As a property of the mount suitable for the cutting process, it is required that the mount has no tackiness in order to avoid deposits on the cutting blade. Bad, hinders automation.
[0006]
Further, when a push-cutting machine is used, there is a problem after chip cutting described below. BACKGROUND ART Conventionally, a binder is used for a green sheet of a laminate because the sheet must have a bonding property at the time of lamination. Due to the action of the binder, when cutting is performed by a chip cutting machine such as a so-called push-cutting machine (a type in which there is no gap between chips at the time of cutting), the joining of chips proceeds simultaneously with the progress of the cutting process. There is a problem that said. As a result, a state in which two or more chips that should have been cut at the time of completion of the cutting step are stuck together (abeck) occurs. This phenomenon becomes more significant as the chip size becomes smaller, and becomes an important problem.
[0007]
In order to solve this problem, the following Patent Documents 1 and 2 have been proposed as conventional techniques.
[0008]
[Patent Document 1] JP-A-8-330177 [Patent Document 2] JP-A-5-326321
The method of Patent Document 1 is a method in which a green sheet adhered to an adhesive sheet is cut and separated using a sharp edge and a blade (functioning as a scraper).
[0010]
The method of Patent Document 2 is a method in which a green sheet adhered to an adhesive sheet is cut, the sheet is wound inward to complete the cutting, then stored in a sheath and separated through a firing furnace.
[0011]
[Problems to be solved by the invention]
Problems with the method of Patent Document 1 are as follows.
(1) When cutting with the adhesive sheet adhered to the adhesive sheet, one side of the green sheet is completely fixed by the adhesive sheet. In this case, the cut shape is likely to collapse (especially in a very small chip part).
{Circle around (2)} When a blade blade or the like is used for peeling from the adhesive sheet, there is a high possibility that the chip component will be broken by the stress received there.
[0012]
Problems with the method of Patent Document 2 are as follows.
{Circle around (1)} Similar to the construction method of Patent Document 1, the tip shape is easily broken at the time of cutting.
{Circle around (2)} It is difficult to separate extremely small chips only by winding the sheet inward.
{Circle around (3)} The inner winding process, the sheath filling process, and the firing process are required, and the process becomes complicated (many manual operations).
[0013]
In the prior art, it is difficult to separate a micro chip component having a size of 0603 (0.6 mm × 0.3 mm × 0.3 mm) or less without breaking it and to increase the separation rate. In addition, in the case of a system that considers only separation, there are many elements that require human input, and it is difficult to save labor such as automation.
[0014]
In view of the above, the present invention provides a green sheet that has been cut into a chip shape safely without damaging individual chip components (including ultra-small chip components to chip components of a general shape). An object of the present invention is to provide a chip component separation method and apparatus which can be separated without lowering the separation rate (separation process yield) and are suitable for automation and labor saving.
[0015]
Other objects and novel features of the present invention will be clarified in embodiments described later.
[0016]
[Means for Solving the Problems]
In order to achieve the above object, a chip component separating method according to the invention of claim 1 of the present application supplies a green sheet cut into a chip shape to an adhesive sheet at a supply unit, and attaches the green sheet to the adhesive sheet. The adhesive sheet is conveyed to a separating section and a peeling section in a state where the adhesive sheet is adhered, the green sheet cut into the chip shape is separated into individual chip components at the separating section, and the adhesive sheet is separated at the peeling section. It is characterized in that it is peeled off from
[0017]
The chip component separating method according to the invention of claim 2 of the present application is characterized in that, in claim 1, the chip part is separated from the adhesive sheet by reducing the adhesive force of the adhesive sheet at the peeling portion.
[0018]
According to a third aspect of the present invention, there is provided a chip component separating method according to the first or second aspect, further comprising: providing a separation promoting section in a path for transporting the adhesive sheet having the green sheet attached thereto to the separating section. The green sheet is partially pressed sequentially by a roller of a portion to apply a shearing force to a cutting portion to promote separation of chip components.
[0019]
The chip component separation device according to the invention of claim 4 of the present application includes a conveyance mechanism for an adhesive sheet,
A supply unit that is provided on a conveyance path of the pressure-sensitive adhesive sheet by the conveyance mechanism and supplies the green sheet cut into the chip shape to the pressure-sensitive adhesive sheet,
A separation unit that is provided on a conveyance path of the adhesive sheet by the conveyance mechanism and separates the green sheet into individual chip components.
A separating unit configured to separate the chip component separated by the separating unit from the adhesive sheet.
[0020]
The chip component separation device according to the invention of claim 5 of the present application is characterized in that, in claim 4, the peeling portion is provided with an adhesive force reducing means for reducing the adhesive force of the adhesive sheet.
[0021]
The chip component separation device according to the invention of claim 6 of the present application is provided in claim 4 or 5, wherein the chip component separation device is provided on the front side of the separation unit in the conveyance path of the adhesive sheet, and partially presses the green sheet sequentially with a roller. And a separation promoting portion for applying a shearing force to the cutting portion.
[0022]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments of a chip component separating method and apparatus according to the present invention will be described with reference to the drawings.
[0023]
An embodiment of a chip component separating method and apparatus according to the present invention will be described with reference to FIGS. In these figures, 10 is a reel portion for feeding a long tape-shaped adhesive sheet, 11 is a take-up reel portion, and the adhesive sheet 1 fed from the reel portion 10 passes through a guide 12, a reversing guide 13 and the like. The take-up reel unit 11 takes up the work. In addition, a drive roll unit 14 is provided in the middle of the adhesive sheet conveyance path for intermittently feeding the adhesive sheet 1. The drive roll unit 14 includes a drive roll 15 that is intermittently driven to rotate by a motor or the like, and a pressure roll 16 that sandwiches the adhesive sheet 1 between the drive roll 15. The pressure-sensitive adhesive sheet 1 used here is provided with a pressure-sensitive adhesive layer only on one side, and the other side is non-adhesive on the substrate surface.
[0024]
As described above, the pressure-sensitive adhesive sheet 1 is conveyed from the pay-out reel unit 10 to the take-up reel unit 11, and the pressure-sensitive adhesive sheet 1 is conveyed from the pay-out reel unit 10 to the take-up reel unit 11. Is a supply unit 20 for supplying the laminated green sheet cut into a square chip shape to the adhesive layer side of the adhesive sheet 1, and a re-compression unit for ensuring that the grease sheet adheres to the adhesive sheet 1. 30, a separation accelerating portion 40 for partially pressing the green sheet sequentially with a pressing roller and applying a shearing force to a cutting portion to promote separation into chip components, and separating the green sheet into individual chip components 70 Separation / separation units 50 for separating the adhesive sheet 1 from the adhesive sheet 1 and dropping the chip into the chip receiving box 60 are sequentially provided.
[0025]
As shown in FIGS. 2A and 2B, the supply unit 20 has a flat bed 21 and a flat receiving plate 22 opposed thereto, and at least one of the flat bed 21 and the receiving plate 22 is moved up and down. By doing so, there is a mechanism in which the opposing interval changes from a separated state to a narrow state. In the illustrated case, the receiving plate 22 is fixed, and the flat bed 21 is driven up and down by lifting means 23 such as the air cylinder shown in FIG. Then, as shown in FIG. 2A, the green sheet 80 placed on the mount 81 and cut in advance into a square chip shape (processed by a chip cutting machine such as a push-off cutting machine) is placed on the flat bed 21 together with the mount 81. The grease sheet 80 is placed on the adhesive sheet 1 with the adhesive layer facing downward so that the gap between the flat bed 21 and the receiving plate 22 is reduced when the adhesive sheet 1 is stopped, and the grease sheet 80 is placed on the adhesive layer of the adhesive sheet 1. Press As a result, the green sheet 80 is supplied to the adhesive sheet 1 as shown in FIG. 2B, and thereafter the green sheet 80 is conveyed while being attached to the adhesive layer of the adhesive sheet 1. The mount 81 is an underlay sheet used for cutting the green sheet 80, and comes off the green sheet 80 at this time. The base material 81 is a material that can be used as an underlay sheet for cutting a green sheet, and any material can be used as long as the green sheet 80 can be transferred (transferred) to the adhesive sheet 1. For example, it is a sheet of clean paper or the like that has no adhesive force.
[0026]
The re-pressing portion 30 has a set of a receiving roller 31 for fixing the position and a pressing roller 32 for pressing, and the pressing roller 32 is urged by an urging means 33 such as an air cylinder in a direction in which the pressing roller 32 is pressed against the receiving roller 31. Then, the pressure-sensitive adhesive sheet 1 to which the grease sheet 80 is adhered is sandwiched between the receiving roller 31 and the pressure-sensitive adhesive sheet 1 and re-pressed. As a result, the green sheet 80 transferred to the adhesive sheet 1 is pressed down from the green sheet surface by a predetermined pressure, and the adhesion to the adhesive sheet 1 is promoted.
[0027]
The separation promoting section 40 has a fixed plate 41 and a pressing roller 42 urged by an urging means 43 such as an air cylinder in a direction in which the fixed plate 41 is reciprocally movable in a lateral direction and is pressed against the plate 41. The adhesive sheet 1 is in an inverted state by the inversion guide 13, and as shown in FIG. 3, the base material 2 of the adhesive sheet 1 is on the lower side, the adhesive layer 3 is on the upper side, and the grease sheet 80 is attached on the upper side. And passes over the fixing plate 41. Then, the pressing roller 42 moves in the horizontal direction along the adhesive sheet conveyance direction with respect to the grease sheet 80 on the adhesive sheet 1 stopped on the fixing plate 41, so that the green sheet 80 transferred to the adhesive sheet 1 is moved. From the green sheet surface with a predetermined pressure to promote separation. That is, since the adhesive of the adhesive layer 3 sinks into the area of the adhesive sheet 1 pressed by the roller 42, the cut chip 70A of the grease sheet 80 (the part that becomes the chip component 70) is located at the boundary with the area not pressed. 2), a pressing force indicated by an arrow F is applied, and a shearing force acts in a thickness direction on a cutting portion C at a boundary with an adjacent chip, so that chip separation can be promoted. The surface material of the roller 42 is preferably a material that does not easily adhere to the adhesive sheet 1.
[0028]
As shown in FIG. 4, the separation / peeling section 50 includes a separation edge section 51 that allows the adhesive sheet 1 to travel with a small radius of curvature Ra as a separation section, and has a curved surface with a radius of curvature Rb (Rb> Ra). 1 has a tackiness reducing means for performing processes such as heating, cooling, and irradiation of light (including ultraviolet rays and infrared rays) to reduce the adhesive strength of the adhesive sheet 1 while turning the grease sheet 80 side downward. A part 52.
[0029]
The separation edge portion 51 as the separation portion changes the direction of the adhesive sheet 1 using a sharp edge (small radius of curvature Ra) in order to further separate and confirm the separation state (note that the radius Ra is fixed or rotated). It is also possible to perform the same function as a sharp edge by using a shaft body.) At this time, a certain tension is applied to the pressure-sensitive adhesive sheet 1, and the chips 70A are separated from each other, so that the separation is completed. In addition, after the separation edge portion 51 is processed, the peeling portion 52 having a radius of curvature Rb capable of forming a gap so that the chips do not re-attach to each other from the grease sheet 80 using a process of reducing the adhesive force of the adhesive sheet 1. The component 70 is peeled off from the pressure-sensitive adhesive sheet 1 in a state where it is securely separated. For example, if the pressure-sensitive adhesive sheet 1 is a heat-foamable pressure-sensitive adhesive sheet whose adhesive strength is reduced by heating, heating is performed at the peeling section 52, and if the pressure-sensitive adhesive sheet 1 is reduced in pressure-sensitive adhesive strength, cooling is performed at the peeling section 52. If the pressure-sensitive adhesive sheet 1 has a reduced adhesive strength due to irradiation with light such as ultraviolet rays or infrared rays, light irradiation treatment is performed.
[0030]
The overall operation in this embodiment will be described.
[0031]
The pressure-sensitive adhesive sheet 1 is unwound from the unwinding reel unit 10, conveyed intermittently by the driving roll unit 14, and wound up by the winding reel unit 11, and is supplied onto the mount 81 by the supply unit 20. The green sheet 80 placed and cut into a square chip shape by a chip cutting machine such as a push-off cutting machine is supplied to the adhesive layer 3 side when the adhesive sheet 1 is stopped. Attach to 1 and transfer to it.
[0032]
With the intermittent running of the pressure-sensitive adhesive sheet 1, the green sheet 80 passes through the re-pressing portion 30, where the green sheet 80 is pressed against the pressure-sensitive adhesive sheet 1 on the side of the pressure-sensitive adhesive layer 3 to promote close contact with the pressure-sensitive adhesive sheet 1.
[0033]
The adhesive sheet 1 and the grease sheet 80 adhered to the adhesive sheet 1 pass through the re-compression unit 30, are then inverted by the inversion guide 13, and run while the grease sheet 80 is on the upper side of the adhesive sheet 1, and are separated. The separation of each chip is promoted by sequentially applying a predetermined pressure from the green sheet surface by the lateral movement of the pressing roller 42 (the shearing force in the thickness direction with respect to the chip cutting point C in FIG. 3). Added.)
[0034]
Then, the pressure-sensitive adhesive sheet 1 and the grease sheet 80 that have reached the separation / peeling section 50 are further separated by first turning and passing through the sharp edge (small radius of curvature Ra) of the separation edge section 51, and thereafter, A process of reducing the adhesive force of the adhesive sheet 1 is performed while traveling along the peeling portion 52 having a radius of curvature Rb that can form a gap such that the chips do not re-adhere, so that the individual chip components 70 are separated and adhered. It peels off from the sheet 1 and falls into the chip receiving box 60.
[0035]
As shown in this embodiment, the step of separating the green sheet 80 after the cutting process into the individual chip components 70, which has not been automated conventionally, is performed in-line from the supply of the green sheet after the cutting to the separation / peeling. Therefore, the following effects can be obtained.
[0036]
(1) An auxiliary step (a step by the re-pressing section 20, the separation promoting section 40, and the like) which has not been conventionally performed can be added.
[0037]
(2) It is possible to continuously supply the green sheet 80 after the cutting process into the chip shape, and it is possible to shorten the lead time.
[0038]
(3) Labor saving can be achieved.
[0039]
(4) The safety of the worker is improved as compared with the conventional jig work.
[0040]
(5) Since the green sheet 80 cut into a chip shape can be conveyed by the reel-type adhesive sheet 1, the process from the cutting process of the green sheet to the separation / peeling process of separating and peeling into individual chip components can be connected in-line. It is possible and suitable for automation. In particular, extremely small chip parts, for example, 1005 (1.0 mm × 0.5 mm × 0.5 mm) size, 0603 (0.6 mm × 0.3 mm × 0.3 mm) size, 0402 (0.4 mm × 0.2 mm × 0. Suitable for processing 2mm) size chip parts.
[0041]
The mount such as clean paper used for cutting the green sheet is in the form of an individual piece, that is, a single sheet, in the embodiment. However, depending on the use form of the green sheet cutting machine in the previous step, the mount may be in the form of a tape (reel). A mount for (to reel) may be used.
[0042]
Although the embodiments of the present invention have been described above, it will be obvious to those skilled in the art that the present invention is not limited to the embodiments and various modifications and changes can be made within the scope of the claims.
[0043]
【The invention's effect】
As described above, according to the present invention, a green sheet cut into a chip shape can be safely separated without damaging individual chip components, and the separation rate, that is, the separation / separation step yield can be reduced. Separation without separation, and automation and labor saving can be achieved. Especially, when applied to the processing of very small chip parts, which has been difficult to improve the yield of the separation / separation process in the conventional technology, the effect is great. It is.
[Brief description of the drawings]
FIG. 1 is an overall configuration diagram showing an embodiment of a chip component separation method and apparatus according to the present invention.
FIG. 2 is a perspective view illustrating an operation of a supply unit according to the embodiment.
FIG. 3 is an explanatory diagram of a separation promoting unit in the embodiment.
FIG. 4 is an explanatory diagram of a separation / separation unit in the embodiment.
[Explanation of symbols]
REFERENCE SIGNS LIST 1 adhesive sheet 2 base material 3 adhesive layer 10 feeding roll 11 take-up roll 13 reversing guide 14 drive roll unit 20 supply unit 21 flat bed 22 receiving plate 30 re-pressing unit 31 receiving rollers 32, 42 pressing roller 40 separation promoting unit 41 Fixing plate 50 Separation / peeling part 51 Separation edge part 52 Peeling part 60 Chip receiving box 70 Chip component 80 Green sheet 81 Mount

Claims (6)

The green sheet cut into a chip shape is supplied to the pressure-sensitive adhesive sheet at a supply unit, and the pressure-sensitive adhesive sheet is transported to a separation unit and a peeling unit in a state where the green sheet is adhered to the pressure-sensitive adhesive sheet. Wherein the green sheet cut into the chip shape is separated into individual chip parts and separated from the pressure-sensitive adhesive sheet at the separation part. The chip component separation method according to claim 1, wherein the peeling unit reduces the adhesive force of the pressure-sensitive adhesive sheet to peel the chip component from the pressure-sensitive adhesive sheet. A separation promoting unit is provided in a path for transporting the pressure-sensitive adhesive sheet having the green sheet attached thereto to the separating unit, and the rollers of the separation promoting unit sequentially partially press the green sheet to apply a shearing force to a cutting position. The chip component separation method according to claim 1 or 2, wherein the separation of the chip components is promoted. An adhesive sheet transport mechanism,
A supply unit that is provided on a conveyance path of the pressure-sensitive adhesive sheet by the conveyance mechanism and supplies the green sheet cut into the chip shape to the pressure-sensitive adhesive sheet,
A separation unit that is provided on a conveyance path of the adhesive sheet by the conveyance mechanism and separates the green sheet into individual chip components.
A chip part separating device, comprising: a separating part that separates the chip part separated by the separating part from the adhesive sheet. The chip component separation device according to claim 4, wherein the peeling unit is provided with an adhesive force reducing unit that reduces the adhesive force of the adhesive sheet. The separation accelerating part which is provided in front of a separation part in the conveyance course of the adhesion sheet, and which presses the green sheet one by one partially with a roller, and applies a shearing force to a cutting part, The separation promotion part according to claim 4 or 5. Chip parts separation equipment.

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